JP2023125764A - Electronic component testing device - Google Patents

Abstract

To provide an electronic component testing device capable of appropriately conducting testing of an electronic component while preventing an excessive increase in temperature of the electronic component causing self-heating, and capable of coping with low costs and a compact device configuration also with respect to testing of multiple electronic components.SOLUTION: An electronic component testing device 10 applies electric voltage to an electronic component W causing self-heating, at a test temperature higher than normal temperature. A control unit 13 of the electronic component testing device 10 adjusts an electric voltage applied to the electronic component W by controlling a voltage application unit 11 according to a measurement result related to leakage current of a current measuring unit 12, referring to a correlation relationship between leakage current in the electronic component W and temperature of the electronic component W.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to an electronic component testing apparatus that tests an electronic component that generates self-heating by applying a voltage to the electronic component at a test temperature higher than room temperature.

Electronic component manufacturers inspect the electrical characteristics of electronic components to be shipped, eliminate defective products, and ship only non-defective products. Particularly in recent years, in various technical fields including automobiles, it has become necessary to guarantee the characteristics of electronic components with higher reliability, and it has become necessary to guarantee the characteristics of electronic components under high-temperature conditions close to the actual usage environment. The need for test assurance is increasing. Furthermore, testing under high temperature conditions is suitable for applying a load that accelerates the deterioration of the life of electronic components, and is also useful as a screening means for exposing initial defects.

However, when testing the electrical characteristics of electronic components under high-temperature conditions, the temperature of the electronic components may rise excessively due to self-heating. That is, when the temperature of the electronic component increases, the current consumption of the electronic component increases. When the current consumption of the electronic components increases, the amount of heat generated by the electronic components increases, the temperature of the electronic components further increases, and as a result, the current consumption of the electronic components further increases, resulting in a vicious cycle. Due to such a vicious cycle, electronic components that were originally classified as good products suffer thermal damage and become defective products, resulting in a decrease in yield.

The test device disclosed in Patent Document 1 feeds back the temperature of an electronic component detected by a temperature sensor to the control of a heater that heats the electronic component, so that the temperature of the self-heating electronic component is adjusted and the temperature of the electronic component is adjusted. heat damage is suppressed.

Patent No. 5987977

However, in the heater feedback control performed in the test device of Patent Document 1, it is not always possible to sufficiently suppress the amount of self-heating of electronic components, so it may not be possible to appropriately suppress the temperature rise of electronic components that generate a large degree of self-heating. be.

Furthermore, when testing a large number of electronic components simultaneously, non-negligible differences in the degree of self-heating may be observed among the electronic components due to individual differences among the electronic components. In order to deal with such a situation in the test apparatus of Patent Document 1, a set of temperature sensors, heaters, and feedback control equipment necessary for temperature control of each electronic component is required to individually control the temperature of each electronic component. , are required for each electronic component to be tested. For example, when testing 1000 electronic components simultaneously using the test apparatus of Patent Document 1, 1000 sets of independent control systems (temperature sensors, heaters, and control devices) are required.

Furthermore, in the test apparatus of Patent Document 1, if there is thermal interaction between the electronic components to be tested, feedback temperature control regarding the individual electronic components will not be established. Therefore, in the test device of Patent Document 1, multiple electronic components to be tested cannot be crowded together, and appropriate spacing is provided between the electronic components to prevent thermal interaction between them. There is a need. Therefore, in the test apparatus of Patent Document 1, as the number of electronic components to be tested simultaneously increases, the required installation area becomes significantly larger.

As described above, in the test device of Patent Document 1, as the number of electronic components to be tested simultaneously increases, the device configuration becomes complicated and large, and the device cost increases, resulting in poor economic efficiency and area productivity. We may not be able to meet your needs in some respects.

The present disclosure has been made in view of the above-mentioned circumstances, and is an electronic component testing device that can appropriately test electronic components while preventing excessive temperature rise in electronic components that generate self-heating. To provide an electronic component testing device capable of testing electronic components at low cost and with a compact device configuration.

One aspect of the present disclosure is an electronic component testing device that applies a voltage to an electronic component that generates self-heating at a test temperature higher than room temperature, the device comprising: a voltage application section that applies a voltage to the electronic component; a current measurement unit that measures the voltage, and a voltage application unit that controls the voltage application unit in accordance with the measurement result regarding the leakage current of the current measurement unit in light of the correlation between the leakage current in the electronic component and the temperature of the electronic component obtained in advance. This invention relates to an electronic component testing apparatus that includes a control unit that adjusts a voltage applied to an electronic component.

The control unit adjusts the voltage applied to the electronic component to lower the temperature of the electronic component when the measured value of the leakage current of the current measurement unit exceeds a thermal runaway determination threshold determined according to the correlation. A return process may be started for the voltage application section.

The control unit may end the steady state return process for the voltage application unit when the measured value of the leakage current of the current measurement unit is less than the steady state determination threshold determined according to the correlation.

The control section may control the voltage application section so as to adjust the energization time during which the voltage application section applies the voltage to the electronic component in the steady state return process.

The control section may control the voltage application section so as to adjust the magnitude of the voltage applied by the voltage application section to the electronic component in the steady state return process.

The voltage application section applies a voltage to the plurality of electronic components, the current measurement section measures the current in the plurality of electronic components, and the correlation is determined between the leakage current in each of the plurality of electronic components and each of the plurality of electronic components. In light of the correlation, the control unit controls the voltage application unit according to the leakage current measurement result of the current measurement unit, thereby applying voltage to multiple electronic components. The voltage applied may be adjusted.

According to the present disclosure, it is possible to properly test an electronic component while preventing an excessive temperature rise in the electronic component that causes self-heating, and the device configuration is low cost and compact even for testing multiple electronic components. It is possible to deal with this.

FIG. 1 is a diagram showing an example of the correlation between current consumption of a multilayer ceramic capacitor and workpiece temperature. FIG. 2 is a diagram showing an example of the correlation between leakage current and workpiece temperature in the example shown in FIG. FIG. 3 is a diagram showing an example of the configuration of the electronic component testing apparatus according to the first embodiment. FIG. 4 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the measured current (vertical axis) of each current measurement unit according to the electronic component testing method of the first embodiment. FIG. 5 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the voltage applied to each electronic component (vertical axis) according to the electronic component testing method of the first embodiment. FIG. 6 is a diagram showing an example of the configuration of an electronic component testing apparatus according to the second embodiment. FIG. 7 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the measured current (vertical axis) of each current measurement unit according to the electronic component testing method of the second embodiment. FIG. 8 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the voltage applied to each electronic component (vertical axis) in the electronic component testing method of the second embodiment.

FIG. 1 is a diagram showing an example of the correlation between current consumption of a multilayer ceramic capacitor (MLCC) and workpiece temperature. The horizontal axis in FIG. 1 indicates time (elapsed time (seconds)) and indicates current consumption in the MLCC to be measured.

FIG. 1 depicts correlation curves for MLCC temperatures (ie, "work temperatures") of 40°C, 70°C, 100°C, 130°C, 160°C, and 190°C.

FIG. 2 is a diagram showing an example of the correlation between leakage current and workpiece temperature in the example shown in FIG. The horizontal axis in FIG. 2 shows leakage current, and the vertical axis shows workpiece temperature.

The inventor of the present invention applied a voltage of 125 V to a sample of MLCC having a capacitance of 10 μF (farad), a rated voltage of 50 V (volts), and a temperature characteristic of X5R (Electronic Industries Alliance (EIA)). , measured the current consumption in the sample (see Figure 1)

In FIG. 1, "P1" indicates the initial power-on state. This initial power-on state indicates a state in which charging progresses and electricity (charge) is gradually stored in the MLCC sample. On the other hand, "P2" in FIG. 1 indicates a steady state. The steady state here refers to a state where the electronic components are fully charged. When a voltage is applied to the MLCC sample in a steady state after charging is completed, current leaks from the MLCC sample, and the leakage current is measured as current consumption (see the vertical axis in FIG. 1).

The inventor of the present invention changed the work temperature (that is, changed the work temperature to 40° C., 70° C., 100° C., 130° C., 160° C., and 190° C.) and measured the current consumption described above for each work temperature.

As a result, as shown in FIG. 2, it was confirmed that there was a linear relationship (proportional relationship) between the magnitude of the leakage current and the workpiece temperature. The inventor of the present invention measured the above-mentioned current consumption while changing various conditions (e.g. capacitance, rated voltage, applied voltage, etc.), but in all measurements there was a difference between the magnitude of leakage current and the workpiece temperature. A linear relationship (proportional relationship) was observed.

In light of the correlation (linear relationship) between the magnitude of the leakage current and the workpiece temperature, the workpiece temperature can be estimated and understood from the leakage current.

Each embodiment of an electronic component testing device and an electronic component testing method described below is based on such a correlation (linear relationship) between leakage current and workpiece temperature. In each of the following embodiments, a plurality of electronic components are tested simultaneously, and in light of the correlation between the leakage current in each of the plurality of electronic components and the temperature of each of the plurality of electronic components, Control of each voltage application unit and adjustment of the voltage applied to each electronic component are performed.

[First embodiment]
FIG. 3 is a diagram showing a configuration example of the electronic component testing apparatus 10 according to the first embodiment.

The electronic component testing apparatus 10 shown in FIG. 3 simultaneously applies voltage to a plurality of self-heating electronic components W (for example, 200 to 1000 electronic components W), and tests each electronic component at a test temperature higher than room temperature. Test the electronic component W. During the test, the temperature of each electronic component W increases due to self-heating, and for example, even if the desired test temperature is 150 ° C., the temperature of each electronic component W may fluctuate in the temperature range of 100 ° C. to 170 ° C. .

The specific test contents performed by the electronic component testing apparatus 10 are not limited. For example, a test may be performed in which an electrical load is applied while a thermal load is applied to each electronic component W, or an electrical measurement is performed while a thermal load and an electrical load are applied to each electronic component W. Tests may also be conducted. More specifically, electrical tests such as a screening test such as burn-in, a withstand voltage test, a capacitance test, an insulation resistance test, or a leakage current test can be performed by the electronic component testing apparatus 10.

In this example, an MLCC (multilayer ceramic capacitor) is used as the electronic component W, but the electronic component W that can be tested by the electronic component testing apparatus 10 is not limited. For example, a semiconductor element such as a negative characteristic thermistor, a diode, or a transistor, or a part of a capacitor other than a ceramic capacitor can be used as the electronic component W, and even if any other electronic device is used as the electronic component W. good.

Each electronic component W has an electronic component body, and a first external electrode and a second external electrode attached to the electronic component body.

The electronic component testing apparatus 10 includes a power supply unit 20, a plurality of first probes 21 connected to the power supply unit 20 via first wiring 31, and a plurality of first probes 21 connected to the power supply unit 20 via second wiring 32. A second probe 22 is provided.

The power supply section 20 of this example is constituted by a DC power supply device, and can provide each electronic component W with a voltage larger than the rated voltage (for example, a DC voltage 2.5 times the rated voltage). Note that the configuration of the power supply section 20 is not limited. The power supply unit 20 may be configured by, for example, an AC power supply device, or a power supply device capable of selectively applying direct current (DC current and DC voltage) and alternating current (AC current and AC voltage) to each electronic component W. It may be configured by

The plurality of first probes 21 are supported by a single first probe holder 23 and connected to the respective first external electrodes of the plurality of electronic components W. The plurality of second probes 22 are supported by a single second probe holder 24, and are connected to the second external electrodes of each of the plurality of electronic components W. In this way, the first probe 21 and the second probe 22 mutually function as paired electrodes (pin-shaped conductors), and the first probe 21 and the second probe 22 have the same number as the number of electronic components W that can be tested simultaneously. A pair of two probes 22 is provided.

Each first probe 21 and each second probe 22 has a probe element that is scheduled to come into direct contact with the electronic component W. This probe element has any form capable of establishing a good electrical connection to the electronic component W, and may be composed of, for example, a band-shaped conductor (for example, a metal body such as Cu, Fe, or Al), Conductor plating (for example, metal plating such as Au, Ag, Ni, or Sn) may be applied.

The first probe holder 23 and the second probe holder 24 are made of a non-conductive material (for example, a material such as machinable ceramics). At least one of the first probe holder 23 and the second probe holder 24 is provided movably under the control of the control unit 13. The plurality of first probes 21 and/or the plurality of second probes 22 move together with their corresponding holders to a test position where they contact a plurality of electronic components W to be tested, and a plurality of electronic components to be tested. It can be placed in a retracted position away from W.

The first probe holder 23 and the second probe holder 24 are provided with a first heater 25 and a second heater 26 (for example, a rubber heater), respectively. The first heater 25 and the second heater 26 adjust the temperature of the electronic component W to be tested (test temperature). That is, the thermal energy from the first heater 25 and the second heater 26 is transmitted to each electronic component W via each first probe 21 and each second probe 22, thereby heating each electronic component W and performing a desired test. Adjusted to temperature. The first heater 25 and the second heater 26 may be driven under the control of the control unit 13 or may be driven independently of the control unit 13 (for example, manually).

The driving temperatures of the first heater 25 and the second heater 26 may be the same, or may be different. In particular, one of the first heater 25 and the second heater 26 generates heat so as to adjust the temperature of the electronic component W to a higher temperature (for example, 153 °C) than the desired test temperature (for example, 150 °C), and the other However, heat may be generated so as to adjust the temperature of the electronic component W to a temperature lower than the desired test temperature (for example, 147° C.). In this case, the first probe 21, the second probe 22, and the electronic component W are placed in a state where heat transfer occurs from one probe to the electronic component W and from the electronic component W to the other probe. Therefore, the test can be performed in a state where the first probe 21, the electronic component W, and the second probe 22 have high thermal responsiveness.

As an example, the heat generation of the first heater 25 and the second heater 26 may be controlled so that the temperature difference between the first probe 21 and the second probe 22 is 5° C. to 15° C. When the temperature difference between the first probe 21 and the second probe 22 is smaller than 5° C., heat dissipation from the electronic component W may not be performed appropriately. On the other hand, if the temperature difference between the first probe 21 and the second probe 22 is greater than 15° C., it may become difficult to control the temperature of the electronic component W.

A voltage application section 11 and a current measurement section 12 are provided in the second wiring 32 extending between each second probe 22 and the power supply section 20, and each voltage application section 11 and each current measurement section 12 are connected to the control section 13. be done.

Each current measurement unit 12 repeatedly measures the current flowing through the corresponding second wiring 32 (and thus the current in the corresponding electronic component W), and transmits the measurement results to the control unit 13. The measurement frequency by each current measuring section 12 is not limited, and each current measuring section 12 may measure the current and transmit the measurement result to the control section 13, for example, every 100 ms. Each voltage application section 11 applies a voltage to the corresponding electronic component W. Under the control of the control unit 13, the voltage application unit 11 of the present embodiment turns on (energizes) and turns off (cuts off current) the current in the corresponding second wiring 32 based on the measurement result of the corresponding current measurement unit 12. It is configured as a switching element that performs.

The control unit 13 takes action according to the measurement result regarding the leakage current of the current measurement unit 12 in light of the correlation between the leakage current in the electronic component W and the temperature of the electronic component W (workpiece temperature) that has been obtained in advance. The voltage applied to the electronic component W is adjusted by controlling the voltage application section 11 of the electronic component W.

The control unit 13 of this embodiment includes a digital circuit capable of performing PWM control (pulse width modulation control), and adjusts the voltage applied to the electronic component W based on the PWM control. That is, the control unit 13 controls the corresponding electronic component W so that the corresponding voltage application unit 11 adjusts the energization time for applying voltage to the corresponding electronic component W based on the measured value of the leakage current acquired by the current measurement unit 12. Controls the voltage application section 11. Note that a specific example of PWM control will be described later (see FIG. 5).

Next, an example of an electronic component testing method performed by the electronic component testing apparatus 10 having the above-described configuration will be described.

FIG. 4 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the measured current (vertical axis) of each current measuring section 12 according to the electronic component testing method of the first embodiment. FIG. 5 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the voltage applied to each electronic component W (vertical axis) according to the electronic component testing method of the first embodiment.

Electricity is applied to the plurality of electronic components W to be tested through the corresponding first probe 21 and second probe 22 while in contact with the corresponding first probe 21 and second probe 22, respectively. . At this time, the plurality of electronic components W to be tested are heated by thermal energy from the first heater 25 and the second heater 26, and the temperature (test temperature) of these electronic components W is adjusted to 150° C., for example.

Specifically, each voltage application unit 11 is adjusted to the ON state under the control of the control unit 13, and power is supplied from the power supply unit 20 to each electronic component W (“initial power-on” in FIG. 4). reference). As a result, charging of each electronic component W progresses, and the measured current value acquired by each current measuring section 12 gradually becomes smaller.

Then, each electronic component W completes charging and reaches a steady state (see "steady state" in FIG. 4).

By continuing to apply voltage to each electronic component W in a steady state, a leakage current is generated in each electronic component W. The leakage current is acquired as a measurement current by the corresponding current measurement section 12.

When a voltage is continuously applied to the electronic component W that generates self-heating in a steady state, the electronic component W generates heat and the temperature increases, which may cause so-called thermal runaway (see "initial thermal runaway" in FIG. 4). In particular, when an MLCC is used as an electronic component W, charging with a high current is often performed to shorten the charging time of the MLCC. Heat runaway is likely to occur. The temperature of the electronic component W that has caused thermal runaway increases at an accelerated rate over time, and if it exceeds the allowable temperature limit, it will be destroyed (see "Thermal Destruction" in FIG. 4).

Therefore, when the control unit 13 of this embodiment detects that the measurement result of the current measurement unit 12 has reached the thermal runaway determination threshold T1, it individually starts steady state return processing for the corresponding electronic component W (FIG. 4 (See “Thermal Runaway Detection” in Figure 5). That is, when the measured value of the leakage current of the current measuring section 12 exceeds the thermal runaway determination threshold T1 determined according to the above-mentioned correlation, the control section 13 controls the electronic component W to lower the temperature of the corresponding electronic component W. A steady state return process for adjusting the voltage applied to W is started for the corresponding voltage application section 11.

As shown in FIG. 2 described above, there is a strong positive correlation between the leakage current of the electronic component W and the workpiece temperature. In light of this correlation, by determining whether the leakage current of the electronic component W (that is, the measurement result of the current measurement unit 12) has reached the thermal runaway determination threshold T1, it is possible to determine whether the electronic component W has caused "thermal runaway." It is essentially determined whether or not the determination threshold temperature, which is the reference temperature for determining whether or not the vehicle is present, has been reached. Therefore, the "thermal runaway determination threshold T1 regarding the measured current" used as the determination criterion here corresponds to the "determination threshold temperature regarding the temperature of the electronic component W."

In this way, it is possible to determine whether the temperature of each electronic component W has reached the "determination threshold temperature for determining whether thermal runaway is occurring" without directly measuring the temperature of each electronic component W. Therefore, it can be determined whether or not thermal runaway has occurred in each electronic component W.

The above-mentioned steady state return processing performed on the electronic component W that has caused thermal runaway is continued until the corresponding electronic component W returns to the steady state, and ends when the corresponding electronic component W returns to the steady state. Specifically, when the measured value of the leakage current of the current measurement unit 12 is less than the steady state determination threshold T2 determined according to the above-mentioned correlation, the control unit 13 performs a steady state return process for the corresponding voltage application unit 11. (See "Return to steady state" in FIGS. 4 and 5). The "steady state determination threshold T2 regarding the measured current" used as the determination criterion here corresponds to the "determination threshold temperature that is the determination reference temperature for whether or not the electronic component W is placed in a normal state."

In this embodiment, the above-described steady state return process is performed based on PWM control. That is, the control unit 13 controls the on/off drive of the corresponding voltage application unit 11 in the steady state return process, and determines the time period during which the voltage is applied to the corresponding electronic component W (on time) and the time during which the voltage is applied to the corresponding electronic component W. Adjust the off time (off time). In this way, the control unit 13 controls the corresponding voltage application unit 11 in the steady state return process, and adjusts the energization time during which the voltage application unit 11 applies voltage to the electronic component W, thereby controlling the electronic component W. Lower the temperature. As a result, thermal runaway of each electronic component W is suppressed, and thermal destruction of each electronic component W can be avoided.

Note that the specific control method of PWM control here is not limited. As an example, as shown in FIG. 5, the control section 13 treats a predetermined time interval (for example, 100 ms) as 100%, and according to the rate of change (change speed) of the current measured by the current measurement section 12 (i.e., the corresponding electronic The corresponding voltage application section 11 may be controlled so as to adjust the repetition frequency of turning on and off voltage application to the corresponding electronic component W (according to the rate of temperature change of the component W).

In this way, even if the electronic component W undergoes thermal runaway and rises in temperature, the electronic component W returns to the above-mentioned steady state before thermal breakdown occurs (that is, before the workpiece temperature (leakage current) that can cause thermal breakdown is reached). The temperature is lowered by the return process (PWM control) and returns to a steady state.

While the test is continuously performed, voltage continues to be applied to each electronic component W. Therefore, even if each electronic component W once returns to a steady state, thermal runaway may occur again thereafter.

However, according to the present embodiment, the control unit 13 continues to monitor the temperature of each electronic component W based on the measurement results of each current measurement unit 12, and the control unit 13 continuously monitors the temperature of each electronic component W based on the measurement results of each current measurement unit 12, and The above-described steady state return process (PWM control) is repeatedly applied to the electronic component W exceeding the determination threshold value T1. Thereby, a large number of electronic components W can be tested simultaneously while preventing thermal runaway of each electronic component W over time.

As explained above, according to the electronic component testing apparatus 10 and the electronic component testing method of the present embodiment, it is possible to appropriately test the electronic component W while preventing the excessive temperature rise of the electronic component W that self-heats. can.

In particular, the temperature of each electronic component W can be estimated based on the measured value of the leakage current in light of the correlation between the leakage current of each electronic component W and the workpiece temperature. There is no need to measure accurately. Therefore, a control system (a temperature sensor, a heater, and a control device) for measuring and controlling the temperature of each electronic component W is unnecessary, and the device configuration of the electronic component testing apparatus 10 can be simplified.

Moreover, according to the electronic component testing method of this embodiment, even if thermal interaction occurs between electronic components, the test can be effectively performed while preventing thermal runaway of each electronic component W. Therefore, when testing a large number of electronic components W at the same time, it is possible to perform the test with a large number of electronic components W lined up in a limited space. In this manner, the present embodiment can suitably test a plurality of electronic components W at the same time using the electronic component testing apparatus 10 having a low cost and compact configuration, and is excellent in economical efficiency and area productivity.

[Second embodiment]
In this embodiment, elements that are the same as or correspond to those in the first embodiment described above are given the same reference numerals, and detailed description thereof will be omitted.

FIG. 6 is a diagram showing a configuration example of the electronic component testing apparatus 10 according to the second embodiment.

In the first embodiment described above, the voltage applied to the electronic component W is controlled by PWM control (digital circuit), but the control unit 13 of this embodiment includes an analog circuit capable of executing regulator control, and the voltage applied to the electronic component W is controlled by PWM control (digital circuit). The magnitude of the voltage applied to the electronic component W is adjusted.

That is, in this embodiment, each voltage application section 11 that applies a voltage to the corresponding electronic component W applies a voltage to the corresponding electronic component W based on the measurement result of the corresponding current measurement section 12 under the control of the control section 13. It is configured as an element that can change the magnitude of the applied voltage.

The control unit 13 adjusts the magnitude of the voltage applied to the electronic component W by the corresponding voltage application unit 11 based on the leakage current from each electronic component W, which is the measurement result of each current measurement unit 12. The corresponding voltage application section 11 is controlled. Note that a specific example of regulator control will be described later (see FIG. 8).

The other configurations are the same as the electronic component testing apparatus 10 (see FIG. 3) of the first embodiment described above.

Next, an example of an electronic component testing method performed by the electronic component testing apparatus 10 having the above-described configuration will be described.

FIG. 7 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the measured current (vertical axis) of each current measuring section 12 according to the electronic component testing method of the second embodiment. FIG. 8 is a diagram showing an example of the relationship between the elapsed time (horizontal axis) and the voltage applied to each electronic component W (vertical axis) according to the electronic component testing method of the second embodiment.

The electronic component testing method of this embodiment is also basically performed in the same manner as the electronic component testing method of the first embodiment described above.

That is, the plurality of electronic components W to be tested are adjusted to a desired test temperature and are tested by applying electricity to them while being in contact with the corresponding first probe 21 and second probe 22.

As a result, charging of each electronic component W progresses, and the measured current value acquired by each current measurement unit 12 gradually becomes smaller, and the electronic component W reaches a steady state (see "steady state" in FIG. 7). Then, by continuing to apply a voltage to each electronic component W in a steady state, a leakage current flows through each electronic component W, and the leakage current is acquired as a measurement current by the corresponding current measuring section 12. The control unit 13 monitors the temperature of each electronic component W based on the measurement result of the leakage current of each electronic component W obtained in this way.

Then, when the control unit 13 detects an electronic component W whose leakage current has reached the thermal runaway determination threshold T1 based on the measurement result of the current measurement unit 12 (see “thermal runaway detection” in FIGS. 7 and 8), the Steady state return processing is started for each electronic component W individually. That is, in the steady state return process, the control unit 13 controls the corresponding voltage application unit 11 to adjust the magnitude of the voltage applied to the electronic component W, and adjusts the temperature of the corresponding electronic component W. The voltage applied to the electronic component W is adjusted so that the voltage decreases.

In this way, in this embodiment, the above-mentioned steady state return processing is performed based on regulator control, and the corresponding voltage application section 11 is driven in an analog manner under the control of the control section 13, thereby causing thermal runaway. The magnitude of the voltage applied to the electronic component W is adjusted.

The specific control method of regulator control here is not limited. As an example, as shown in FIG. 8, the temperature of the corresponding electronic component W may be lowered by proportionally and continuously decreasing the voltage applied to the electronic component W over time. However, regulator control is not limited to this control method. For example, the voltage applied to the corresponding electronic component W may be exponentially reduced in accordance with the current measurement value acquired by the corresponding current measuring section 12 (that is, the leakage current of the corresponding electronic component W). Alternatively, the voltage applied to the corresponding electronic component W may be reduced stepwise in accordance with the current measurement value acquired by the corresponding current measuring section 12.

The above-mentioned steady state return process is continued until the electronic component W that has caused thermal runaway returns to the steady state, and ends when the electronic component W returns to the steady state. Specifically, when the control unit 13 detects that the measurement result of the current measurement unit 12 has reached the steady state determination threshold T2, it ends the steady state return process (see "Steady state return" in FIGS. 7 and 8). ).

Then, the control unit 13 continues to monitor the temperature of each electronic component W based on the measurement results of each current measurement unit 12, and monitors the temperature of each electronic component W causing thermal runaway (i.e., the electronic component W whose leakage current exceeds the thermal runaway determination threshold T1). The above steady state return process (regulator control) is repeatedly applied to component W). Thereby, a large number of electronic components W can be tested simultaneously while preventing thermal runaway of each electronic component W.

As explained above, in this embodiment as well, it is possible to properly test the electronic component W while preventing the excessive temperature rise of the electronic component W that causes self-heating, and it is possible to properly test the electronic component W while preventing the excessive temperature rise of the electronic component W that causes self-heating. can also be handled with a low cost and compact device configuration.

It should be noted that the embodiments and modifications disclosed in this specification are merely illustrative in all respects and should not be construed as limiting. The embodiments and modifications described above can be omitted, replaced, and changed in various forms without departing from the scope and spirit of the appended claims. Further, the technical category that embodies the above-mentioned technical idea is not limited. For example, the above technical idea may be embodied by a computer program for causing a computer to execute one or more procedures (steps) included in the above electronic component testing method. Further, the above-mentioned technical idea may be embodied by a computer-readable non-transitory recording medium on which such a computer program is recorded.

10 Electronic component testing device 11 Voltage application section 12 Current measurement section 13 Control section 20 Power supply section 21 First probe 22 Second probe 23 First probe holder 24 Second probe holder 25 First heater 26 Second heater 31 First wiring 32 Second wiring P1 Power-on initial state P2 Steady state T1 Thermal runaway determination threshold T2 Steady state determination threshold W Electronic component

Claims (6)

An electronic component testing device that applies voltage to electronic components that generate self-heating at a test temperature higher than room temperature,
a voltage application unit that applies voltage to the electronic component;
a current measuring unit that measures the current in the electronic component;
By controlling the voltage application section according to the measurement result regarding the leakage current of the current measurement section in light of the correlation between the leakage current in the electronic component and the temperature of the electronic component obtained in advance, An electronic component testing device comprising: a control unit that adjusts a voltage applied to an electronic component. The control unit controls a voltage applied to the electronic component to lower the temperature of the electronic component when the measured value of the leakage current of the current measurement unit exceeds a thermal runaway determination threshold determined according to the correlation. The electronic component testing apparatus according to claim 1, wherein a steady state return process for adjusting the voltage application unit is started for the voltage application unit. 3. The control unit terminates the steady state return process for the voltage application unit when the measured value of the leakage current of the current measurement unit is less than a steady state determination threshold determined according to the correlation. Electronic component testing equipment described. The electronic device according to claim 2 or 3, wherein the control unit controls the voltage application unit so as to adjust the energization time during which the voltage application unit applies the voltage to the electronic component in the steady state return process. Parts testing equipment. The electronic device according to claim 2 or 3, wherein the control unit controls the voltage application unit so as to adjust the magnitude of the voltage that the voltage application unit applies to the electronic component in the steady state return process. Parts testing equipment. The voltage application unit applies voltage to a plurality of electronic components,
The current measurement unit measures the current in the plurality of electronic components,
The correlation is a correlation between the leakage current in each of the plurality of electronic components and the temperature of each of the plurality of electronic components,
The control unit adjusts the voltage applied to the plurality of electronic components by controlling the voltage application unit according to a measurement result regarding leakage current of the current measurement unit in light of the correlation. The electronic component testing device according to any one of Items 1 to 5.