JP2023124644A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device which can be manufactured at low cost.SOLUTION: A light-emitting device 1 includes a substrate 10, at least one LED die 11 mounted on the substrate 10, a plurality of first frame resins 12 which extend in a first direction and are arranged so as to sandwich the LED die, a plurality of second frame resins 13 which extend in a second direction different from the first direction, and are arranged so as to surround the LED die together with the plurality of first frame resins, and sealing resins 14 and 15 which are arranged in a region surrounded by the plurality of first frame resins 12 and the plurality of second frame resins 13, and seal the LED die 11, wherein respective ends of the plurality of first frame resins 12 project from second frame resins 13a and 13e arranged at the outermost side out of the plurality of second frame resins 13, and are separated from the outer edge of the substrate 10, and ends of the second frame resins 13 project from first frame resins 12a and 12e arranged at the outermost side out of the plurality of first frame resins 12, and are separated from the outer edge of the substrate 10.SELECTED DRAWING: Figure 1

Description

The present invention relates to light emitting devices.

A light-emitting device is known in which a package LED, also called a chip size package (CSP), is mounted on a substrate. For example, Patent Document 1 describes a plurality of CSPs mounted in an array on a substrate, an annular dam material surrounding the plurality of CSPs, and a white resin filled inside the dam material up to the upper surface of the CSPs. is described. In the light-emitting device described in Patent Document 1, by filling white resin between a plurality of CSPs, the light emitted in the horizontal direction from the LED dies of the CSPs is reflected by the white resin and emitted to the outside. , the stray light generated around the CSP is reduced and the luminous efficiency is improved.

JP 2014-225600 A

However, in the light-emitting device described in Patent Document 1, in addition to the step of mounting the CSP on the substrate, there is a step of arranging the fluorescent layer on the LED die to manufacture the CSP, which may increase the manufacturing cost. be.

An object of the present invention is to solve such problems, and to provide a light-emitting device that can be manufactured at low cost.

A light emitting device according to the present invention comprises a substrate, at least one LED die mounted on the substrate, a plurality of first frame resins extending in a first direction and arranged to sandwich the LED die, a first A plurality of second frame resins extending in a second direction different from the direction and arranged to surround the LED die together with the plurality of first frame resins, and surrounded by the plurality of first frame resins and the plurality of second frame resins and a sealing resin that seals the LED die, and each end of the plurality of first frame resins is arranged in the outermost second frame resin among the plurality of second frame resins. Projecting from the frame resin and separated from the outer edge of the substrate, each end of the plurality of second frame resins projects from the first frame resin disposed outermost among the plurality of first frame resins, and , away from the outer edge of the substrate.

Further, in the light-emitting device according to the present invention, the height of the end portions of the plurality of first frame resins and the plurality of second frame resins is the same as the height of the plurality of first frame resins and the plurality of second frame resins forming sides surrounding the LED die. It is preferably lower than the height of the frame resin.

Further, in the light-emitting device according to the present invention, the height of the intersection where each of the plurality of first frame resins and each of the plurality of second frame resins intersect is equal to the height of each of the plurality of first frame resins forming the sides surrounding the LED die. It is preferably equal to the height of the frame resin and the plurality of second frame resins.

Furthermore, in the light emitting device according to the present invention, the second direction is a direction orthogonal to the first direction, and the LED dies are preferably arranged along at least one of the first direction and the second direction.

Further, the light-emitting device according to the present invention includes: a frame member arranged to surround the plurality of first frame resins and the plurality of second frame resins; an LED die supported by the frame member; the plurality of first frame resins; It is preferable to further include a diffusion plate arranged to cover the plurality of second frame resins and the sealing resin.

Further, the light-emitting device according to the present invention further includes a connection portion connected to an adjacent light-emitting device, the substrate has a rectangular planar shape with long sides extending along the first direction, and the frame member preferably has a frame-like planar shape with long sides extending along the first direction and short sides in contact with the short sides of the substrate, and the connecting portions are preferably arranged at ends of the substrate in the longitudinal direction. .

Further, in the light-emitting device according to the present invention, the LED dies are spaced apart, and the plurality of first frame resins and the plurality of second frame resins are the plurality of the pair of first frame resins and the pair of second frame resins. Preferably, each of the plurality of pairs of first frame resins and second pair of frame resins is arranged to surround one or more LED dies.

Furthermore, it is preferable that the light-emitting device according to the present invention further includes an electronic component mounted on the substrate together with the light-emitting element.

A light-emitting device according to the present invention can be manufactured at low cost.

1 is a diagram for explaining a light emitting device according to an embodiment, (a) is a plan view of a light emitting device according to a comparative example, (b) is a cross-sectional view along line AA in (a), (c) is a plan view of the light emitting device according to the embodiment, and (d) is a cross-sectional view taken along line BB in (c). 1 is a plan view of a light emitting device according to a first embodiment; FIG. 3 is a circuit diagram of the light emitting device shown in FIG. 2; FIG. (a) is an enlarged plan view of a portion indicated by a dashed line C in FIG. 2, and (b) is a partial side view as seen from the direction of arrow D in FIG. 3 is a plan view showing an LED die mounting step in the method of manufacturing the light emitting device shown in FIG. 2; FIG. 3 is a plan view showing a step of placing a first frame resin in the method of manufacturing the light emitting device shown in FIG. 2; FIG. 3 is a plan view showing a step of placing a second frame resin in the method of manufacturing the light emitting device shown in FIG. 2; FIG. 3 is a plan view showing a first encapsulating resin placement step in the method of manufacturing the light emitting device shown in FIG. 2; FIG. It is a top view of the light-emitting device which concerns on 2nd Embodiment. FIG. 10 is a partial side view seen from the direction of arrow E in FIG. 9; FIG. 10 is a plan view showing a step of placing a first frame resin in the method of manufacturing the light emitting device shown in FIG. 9; (a) is a perspective view of a light emitting device according to a first modification, and (b) is a perspective view of a light emitting device according to a second modification. (a) is a perspective view of a light emitting device according to a third modification, and (b) is a perspective view of a light emitting device according to a fourth modification. (a) is a perspective view of a light emitting device according to a fifth modification, and (b) is a cross-sectional view taken along line FF shown in (a).

A light emitting device according to the present invention will be described below with reference to the drawings. However, it should be noted that the technical scope of the present disclosure is not limited to those embodiments, but extends to the invention described in the claims and equivalents thereof.

(Overview of Light Emitting Device According to Embodiment)
FIG. 1 is a diagram for explaining a light emitting device according to an embodiment. FIG. 1(a) is a plan view of a light emitting device according to a comparative example, FIG. 1(b) is a cross-sectional view along line AA of FIG. 1(a), and FIG. 1(c) is an embodiment. FIG. 1(d) is a plan view of such a light emitting device, and FIG. 1(d) is a cross-sectional view taken along line BB of FIG. 1(c).

A light emitting device 200 according to the comparative example has a substrate 201 , a plurality of LED dies 202 , a plurality of first frame resins 203 , a plurality of second frame resins 204 , and a sealing resin 205 . The substrate 201 is made of a metal such as aluminum or a material with high thermal conductivity such as ceramics. The LED dies 202 are arranged on the substrate in a matrix in a first direction and in a second direction orthogonal to the first direction. The multiple first frame resins 203 extend parallel to the first direction and are arranged to sandwich the multiple LED dies 202 . Each of the plurality of first frame resins 203 is formed one by one by discharging the raw material of the first frame resin 203 from the discharge port of the dispenser. The plurality of second frame resins 204 extend parallel to the second direction and are arranged to surround each of the plurality of LED dies 202 together with the plurality of first frame resins 203 . Like the first frame resin 203, each of the plurality of second frame resins 204 is formed one by one by discharging the raw material of the second frame resin 204 from the discharge port of the dispenser. The encapsulating resin 205 is arranged in a region surrounded by the first frame resin 203 and the second frame resin 204 to seal the plurality of LED dies 202 .

One end 231 and the other end 232 of the plurality of first frame resins 203 overlap the second frame resin 204 arranged on the outermost side among the plurality of second frame resins 204 . Also, the one end 241 and the other end 242 of the plurality of second frame resins 204 overlap the first frame resin 203 arranged on the outermost side among the plurality of first frame resins 203 .

The height of one end 231 and the other end 232 of the plurality of first frame resins 203 is lower than the height of the crossing portion 233 where the first frame resin 203 crosses the second frame resin 204 . When forming each of the plurality of first frame resins 203, the raw material of the first frame resin 203 is not discharged from the discharge port of the dispenser in a predetermined amount from the beginning, and gradually increases to a predetermined amount. The amount of resin before solidification discharged to one end 231 of the frame resin 203 is less than a predetermined amount. In addition, when the arrangement of the resin before the first frame resin 203 is solidified is finished, the raw material of the first frame resin 203 is discharged from the discharge port of the dispenser in a gradually decreasing amount from the predetermined amount. The amount of resin before solidification discharged to the other end 232 of 203 is less than the predetermined amount. The amount of pre-solidified resin arranged at the one end 231 and the other end 232 of the plurality of first frame resins 203 is smaller than the amount of the pre-solidified resin arranged other than the one end 231 including the intersection 233 and the other end 232. Therefore, the heights of the one end 231 and the other end 232 are lower than the height of the intersection 233 . Similarly, the height of one end 241 and the other end 242 of the plurality of second frame resins 204 is lower than the height of the intersection 233 .

In the light-emitting device 200, the heights of the one ends 231 and 241 and the other ends 232 and 242 are lower than the intersection 233. Therefore, when the height from directly above the LED die to the sealing resin is uniform, they are arranged along the outer periphery. The filling amount of the sealing resin 205p surrounded by the crossing portions 233 is smaller than the filling amount of the sealing resin 205i surrounded by the intersections 233 on all sides. In the sealing resin 205i, the height of the intersections 233 arranged at the four corners is high. The filling amount of the stopping resin 205i increases. On the other hand, in the sealing resin 205p, the heights of the ends 231 and 241 and the other ends 232 and 242 are lower than the height of the intersection 233, so the amount of resin creeping up due to surface tension is less than that of the sealing resin 205i. The filling amount of 205p is less than the filling amount of the sealing resin 205i. In the light emitting device 200, the filling amount of the sealing resin 205p arranged along the outer periphery is smaller than the filling amount of the sealing resin 205i surrounded by the intersections 233 on all sides. different from the emission characteristics of

A light emitting device 100 according to the embodiment has a substrate 101 , a plurality of LED dies 102 , a plurality of first frame resins 103 , a plurality of second frame resins 104 , and a sealing resin 105 . The substrate 101 and the LED dies 102 have the same arrangement as the substrate 201 and the LED dies 202, so a detailed description is omitted here.

The plurality of first frame resins 103 extend parallel to the first direction and are arranged so as to sandwich each of the plurality of LED dies 102 . Each of the plurality of first frame resins 103 is formed one by one by discharging the raw material of the first frame resin 103 from the discharge port of the dispenser.

One end 131 and the other end 132 of the plurality of first frame resins 103 protrude from the second frame resin 104 arranged on the outermost side among the second frame resins 104 and are separated from the outer edge of the substrate 101 . In addition, one end 141 and the other end 142 of the plurality of second frame resins 104 protrude from the first frame resin 103 arranged on the outermost side among the plurality of first frame resins 103 and are separated from the outer edge of the substrate 101. do. One end 131 and the other end 132 of the plurality of first frame resins 103 and one end 141 and the other end 142 of the plurality of second frame resins 104 do not stand upright from the surface of the substrate 10 but are curved in a curved shape such as an arc shape. It is even better if they are arranged so that the height increases gradually.

In the light emitting device 100, the ends 131 and 141 and the other ends 132 and 142 protrude from the outermost first frame resin 103 and the second frame resin 104. And the second frame resin 104 has an intersection portion 133 disposed thereon. In the light-emitting device 100, since the intersections 133 are arranged in both the first frame resin 103 and the second frame resin 104, the filling amount of the sealing resin 105p arranged along the outer periphery is is the same as the filling amount of the inner sealing resin 105i surrounded by . In the light-emitting device 100, the filling amount of the sealing resin 105p arranged along the outer periphery is equal to the filling amount of the sealing resin 105i surrounded by the intersections 133 on all sides. Equal to the emission characteristics.

The light emitting device 100 emits light with uniform light emission characteristics by protruding one end 131 and 141 and the other end 132 and 142 from the outermost first frame resin 103 and second frame resin 104. can be done.

(Structure and Function of Light Emitting Device According to First Embodiment)
2 is a plan view of the light emitting device according to the first embodiment, and FIG. 3 is a circuit diagram of the light emitting device shown in FIG.

The light emitting device 1 includes a substrate 10, an LED die 11, a first frame resin 12, a second frame resin 13, a first sealing resin 14, a second sealing resin 15, a first capacitor 16, It has a second capacitor 17 , a first Zener diode 18 and a second Zener diode 19 . The light emitting device 1 is supplied with power from an external power source to the LED die 11 and emits light emitted from the LED die 11 .

The substrate 10 is made of a metal such as aluminum and a material with high thermal conductivity such as ceramics, has a rectangular planar shape, and has a surface 20 on which a plurality of LED dies 11 are mounted. The substrate 10 has a first anode electrode 21 , a first cathode electrode 22 , a second anode electrode 23 and a second cathode electrode 24 . Each of the first anode electrode 21 to the second cathode electrode 24 is connected to the LED die 11, the first capacitor 16, the second capacitor 17, the first Zener diode 18 and the second Zener diode 19 mounted on the substrate 10 (not shown). They are connected via wiring patterns.

The first anode electrode 21 and the first cathode electrode 22 are electrically connected to half of the LED die 11 , and the second anode electrode 23 and the second cathode electrode 24 are electrically connected to the other half of the LED die 11 . .

The LED die 11 is mounted on the substrate 10, and a forward voltage is applied between the first anode electrode 21 and the first cathode electrode 22 or between the second anode electrode 23 and the second cathode electrode 24. It is a blue LED die that emits blue light in response to , and has a rectangular planar shape. The dominant wavelength of blue light emitted from the LED die 11 is in the range between 445 nm and 495 nm, and in one example is 450 nm. The LED die 11 is a face-down type LED die formed by laminating a PN junction layer formed of a gallium nitride (GaN) layer on a sapphire substrate, which is a transparent substrate, and flipped to a wiring pattern (not shown). Chip connected.

The LED dies 11 are arranged on the substrate in a matrix of four in each of a first direction and a second direction orthogonal to the first direction. The LED dies 11 have, for example, a square planar shape with a side length of 1 mm, and are arranged at a pitch of 2 mm.

The first frame resin 12 includes five first frame resins 12a-12e, and the second frame resin 13 includes five first frame resins 12a-12e. Each of the first frame resins 12a to 12e and the second frame resins 13a to 13e is formed by containing white particles such as titanium oxide (TiO ₂ ) in transparent resin such as silicone resin. It is a reflective material having a rod-like shape with a width of . The first frame resins 12a to 12e extend parallel to each other in the first direction and are arranged so as to sandwich the LED die 11 therebetween. The second frame resins 13a-13e extend parallel to each other in a second direction orthogonal to the second direction, and are arranged to surround the LED die 11 together with the first frame resins 12a-12e.

Both ends of each of the first frame resins 12a to 12e protrude from the outermost second frame resins 13a and 13e among the second frame resins 13a to 13e and are separated from the outer edge 10a of the substrate . The outer edge 10a of the substrate 10 includes four corners and four sides when the substrate 10 is viewed from above. Both ends of the second frame resins 13a to 13e protrude from the outermost first frame resins 12a and 12e among the first frame resins 12a to 12e and are separated from the outer edge 10a of the substrate 10. do. Both ends of the first frame resins 12a to 12e and the second frame resins 13a to 13e do not stand upright from the surface of the substrate 10, but are curved in a curved shape such as an arc so that the height gradually increases. Even better when placed.

4(a) is an enlarged plan view of the portion indicated by broken line C in FIG. 2, and FIG. 4(b) is a partial side view as seen in the direction of arrow D in FIG.

The heights 12aE and 13aE of the ends of the first frame resin 12a and the second frame resin 13a are lower than the heights of the first frame resin 12a and the second frame resin 13a that form sides surrounding the LED die 11 . Also, the widths of the ends 12aE and 13aE of the first frame resin 12a and the second frame resin 13a are narrower than the widths of the first frame resin 12a and the second frame resin 13a that form the sides surrounding the LED die 11 .

The heights of the ends of the first frame resins 12b to 12e and the second frame resins 13b to 13e are the same as those of the first frame resin 12a and the second frame resin 13a. It is lower than the height of the resins 12b-12e and the second frame resins 13b-13e. The widths of the ends of the first frame resins 12b to 12e and the second frame resins 13b to 13e are the same as those of the first frame resin 12a and the second frame resin 13a. It is narrower than the width of the frame resins 12b-12e and the second frame resins 13b-13e.

The first sealing resin 14 and the second sealing resin 15 are made of transparent light-transmitting resin such as silicone resin, contain phosphors, and are surrounded by the first frame resin 12 and the second frame resin 13 . , and encapsulate each of the LED dies 11 .

The phosphor contained in the first sealing resin 14 converts the blue light emitted from the LED die 11 to emit yellow light having a wavelength different from that of the blue light emitted from the LED die 11. . The phosphor contained in the first sealing resin 14 includes, for example, a yellow phosphor such as Yttrium Aluminum Garnet (YAG) phosphor, and a red phosphor such as CASN or SCASN phosphor. . The light emitted through the first sealing resin 14 in response to the light emitted from the LED die 11 is cold light with a color temperature of 6500K, for example.

The phosphor contained in the second sealing resin 15 converts the blue light emitted from the LED die 11 to emit yellow light having a wavelength different from that of the blue light emitted from the LED die 11. . The phosphor contained in the second sealing resin 15 includes a yellow phosphor, a green phosphor and a red phosphor. The yellow phosphor is in one example Yttrium Aluminum Garnet (YAG) phosphor, the green phosphor is in one example β-sialon phosphor, and the red phosphor is in one example CASN or SCASN phosphor. The light emitted through the second sealing resin 15 in response to the light emitted from the LED die 11 is warm light with a color temperature of 2700K, for example.

A first capacitor 16 is connected in parallel with the LED die 11 and the first Zener diode 18 between the first anode electrode 21 and the first cathode electrode 22 . A second capacitor 17 is connected in parallel to the LED die 11 and the second Zener diode 19 between the second anode electrode 23 and the second cathode electrode 24 . In addition, in the light emitting device according to the embodiment, electronic components other than capacitors such as jumper capacitors may be mounted together with the LED die 11 instead of the first capacitor 16 and the second capacitor 17 .

A first capacitor 16 is connected in parallel with the LED die 11 and the first Zener diode 18 between the first anode electrode 21 and the first cathode electrode 22 . A second capacitor 17 is connected in parallel to the LED die 11 and the second Zener diode 19 between the second anode electrode 23 and the second cathode electrode 24 . In the light emitting device according to the embodiment, instead of the first capacitor 16 and the second capacitor 17, electronic components other than capacitors such as jumper resistors and connectors may be mounted together with the LED die 11. FIG. Also, in the light emitting device according to the embodiment, the first capacitor 16 and the second capacitor 17 may be omitted.

(Manufacturing Method of Light Emitting Device According to First Embodiment)
5 is a plan view showing the LED die mounting process, FIG. 6 is a plan view showing the first frame resin placement process, FIG. 7 is a plan view showing the second frame resin placement process, and FIG. It is a top view which shows 1 sealing resin arrangement|positioning process.

First, in a substrate preparation step, the substrate 10 on which the first capacitor 16, the second capacitor 17, the first Zener diode 18 and the second Zener diode 19 are mounted is prepared. Then, in the LED die mounting process, the LED die 11 is mounted on the electrodes on the surface of the substrate 10 by soldering.

Next, in the first frame resin placement step, the first frame resin 12 before solidification is placed on the substrate 10 . The resin before solidification of the first frame resin 12 is discharged one by one along the first direction from the discharge port of the dispenser. Next, in the second frame resin placing step, the resin of the second frame resin 13 before solidification is placed on the substrate 10 . The resin before solidification of the second frame resin 13 is discharged one by one along the second direction from the discharge port of the dispenser. Next, in the frame resin curing step, the substrate 10 is heated to solidify the first frame resin 12 and the second frame resin 13 before solidification, thereby forming the first frame resin 12 and the second frame resin 13. be.

Next, in the first sealing resin placing step, the resin of the first sealing resin 14 before solidification is filled in the region surrounded by the first frame resin 12 and the second frame resin 13 . The resin before solidification of the first sealing resin 14 is filled in eight regions positioned in a checkered flag shape among the 16 regions surrounded by the first frame resin 12 and the second frame resin 13 . . Next, in the second encapsulating resin disposing step, the area surrounded by the first frame resin 12 and the second frame resin 13 is filled with the pre-hardened second encapsulating resin 15 . The resin before hardening of the second sealing resin 15 is filled with the resin before hardening of the first sealing resin 14 in the 16 regions surrounded by the first frame resin 12 and the second frame resin 13 . The 8 regions that are not filled are filled. Then, in the sealing resin curing step, the substrate 10 is heated to solidify the resins before solidification of the first sealing resin 14 and the second sealing resin 15, thereby The resin 15 is formed, and the manufacturing process of the light emitting device 1 is finished.

(Action and effect of the light emitting device according to the first embodiment)
In the light emitting device 1, the LED die 11 is mounted on the substrate 10 without manufacturing the CSP, and the periphery of the LED die 11 is surrounded by the first frame resin 12 and the second frame resin 13. Therefore, the step of manufacturing the CSP is omitted. can do. By omitting the step of manufacturing the CSP, the light-emitting device 1 can be manufactured at a lower cost than a light-emitting device in which the CSP is mounted on a substrate.

In the light emitting device 1, both ends of the first frame resin 12 and the second frame resin 13 protrude from the second frame resins 13a and 13e and the first frame resins 12a and 12e. Intersections 123 are formed in 12e and second frame resins 13a and 13e. In the light-emitting device 1 , since the intersections 123 where the first frame resin 12 and the second frame resin 13 intersect are arranged in all the first frame resins 12 and the second frame resins 13 , the first sealing resin 14 And the filling amount of the second sealing resin 15 is constant regardless of the filling position. Since the filling amounts of the first sealing resin 14 and the second sealing resin 15 are constant regardless of the filling positions, the light emitting device 1 can emit light having uniform light emission characteristics.

Also, in the light-emitting device 1, both ends of the first frame resin 12 and the second frame resin 13 are separated from the outer edge of the substrate 10, so the light-emitting device 1 can be compared with a light-emitting device in which the frame resin reaches the edge of the substrate. As a result, the amounts of the first frame resin 12 and the second frame resin 13 can be reduced.

Further, since the light-emitting device 1 uses the LED die 11, which is lighter than CSP, as a light-emitting element, the self-alignment property when soldering the LED die, which is a light-emitting element, is higher than that of a light-emitting device using CSP as a light-emitting element. . Since the light-emitting device 1 has a high self-alignment property, it is possible to manufacture a light-emitting device having desired light emission characteristics by arranging the LED die 11 at a predetermined position.

(Structure and Function of Light Emitting Device According to Second Embodiment)
9 is a plan view of the light emitting device according to the second embodiment, and FIG. 10 is a partial side view of FIG. 9 as seen in the direction of arrow E. As shown in FIG.

The light emitting device 2 differs from the light emitting device 1 in that it has a first frame resin 32 and a second frame resin 33 instead of the first frame resin 12 and the second frame resin 13 . The configurations and functions of the constituent elements of the light emitting device 2 other than the first frame resin 32 and the second frame resin 33 are the same as the configurations and functions of the constituent elements of the light emitting device 1 to which the same reference numerals are assigned, and therefore a detailed description thereof will be given here. are omitted.

The first frame resin 32 includes five first frame resins 32a-32e, and the second frame resin 33 includes five first frame resins 33a-33e. In the first frame resin 32 and the second frame resin 33, the height of the intersecting portion 323 is equal to the height of each of the first frame resins 32a to 32e and the second frame resins 33a to 33e forming sides surrounding the LED die 11. This is the difference between the first frame resin 12 and the second frame resin 13 . The height of the intersection 323 is equal to the height of the side surrounding the LED die 11 when it is 95% or more and 105% or less of the height of the side surrounding the LED die 11 . The configurations and functions of the first frame resin 32 and the second frame resin 33 are the same as those of the first frame resin 12 and the second frame except that the height of the intersection portion 323 is equal to the height of the portion forming the side surrounding the LED die 11 . Since the structure and function are the same as those of the resin 13, detailed description is omitted here.

(Method for Manufacturing Light Emitting Device According to Second Embodiment)
FIG. 11 is a plan view showing the step of arranging the first frame resin.

The manufacturing method of the light emitting device 2 differs from the manufacturing method of the light emitting device 1 in the first frame resin placement step and the second frame resin placement step. The manufacturing method of the light emitting device 2 other than the first frame resin arranging step and the second frame resin arranging step is the same as the manufacturing method of the light emitting device 1, so detailed description thereof will be omitted here.

In the first frame resin placement step, the first frame resin 32 before solidification is placed on the substrate 10 . The resin before solidification of the first frame resin 32 is discharged one by one along the first direction from the discharge port of the dispenser. The resin before solidification of the first frame resin 32 reduces the amount of resin discharged from the dispenser at the position corresponding to the intersection 323 . The discharge amount of the resin discharged from the dispenser may be decreased by decreasing the discharge speed of the dispenser, or may be decreased by increasing the moving speed of the dispenser.

Next, in the second frame resin placement step, the resin of the second frame resin 33 before solidification is placed on the substrate 10 . The resin before solidification of the second frame resin 33 is discharged one by one along the second direction from the discharge port of the dispenser. The resin before solidification of the second frame resin 33 reduces the amount of resin discharged from the dispenser at the position corresponding to the intersection 323 . Next, in the frame resin curing step, the substrate 10 is heated to solidify the resins of the first frame resin 32 and the second frame resin 33 before solidification, thereby forming the first frame resin 32 and the second frame resin 33. be.

(Action and effect of the light emitting device according to the second embodiment)
In the light emitting device 2 , the height of the intersecting portion 323 in the first frame resin 32 and the second frame resin 33 should be equal to the height of the first frame resin 32 and the second frame resin 33 forming the sides surrounding the LED die 11 . Therefore, light with higher uniformity than that of the light emitting device 1 can be emitted.

(Modification of Light Emitting Device According to Embodiment)
In the light emitting devices 1 and 2, the LED dies 11 are mounted in a matrix of 4 rows and 4 columns, but in the light emitting device according to the embodiment, the LED dies 11 may be mounted in a matrix other than 4 rows and 4 columns. . In the light emitting device according to the embodiment, the LED die 11 may be arranged along at least one of the first direction and the second direction. Moreover, in the light emitting device according to the embodiment, the first frame resin and the second frame resin may be arranged so as to surround at least one LED die 11 . In the light emitting devices 1 and 2, a single LED die 11 is arranged in the region surrounded by the pair of first frame resins and the pair of second frame resins. Two or more LED dies 11 may be arranged in a region surrounded by the first frame resin and the pair of second frame resins.

FIG. 12(a) is a perspective view of a light emitting device according to a first modification, and FIG. 12(b) is a perspective view of a light emitting device according to a second modification. 12(a) and 12(b), the first capacitor 16, the second capacitor 17, the first Zener diode 18 and the second Zener diode 19 are omitted.

The light emitting device 3 differs from the light emitting device 1 in that it has a substrate 40 instead of the substrate 10 . The substrate 40 differs from the substrate 10 in planar shape. The configurations and functions of the components of the light-emitting device 3 other than the planar shape of the substrate 40 are the same as the configurations and functions of the components of the light-emitting device 1 denoted by the same reference numerals, so detailed descriptions thereof are omitted here.

The substrate 40 has a rectangular planar shape in which the first direction is the longitudinal direction and the second direction is the lateral direction. In the light emitting device 3, ten LED dies 11 are arranged at a uniform pitch along the first direction. The light emitting device 3 is used as a linear light emitting device that can be used as a backlight source. Also, the first sealing resin 14 and the second sealing resin 15 are alternately arranged along the first direction so as to cover the LED die 11 .

The light emitting device 4 differs from the light emitting device 1 in that it has a substrate 50 instead of the substrate 10 . Moreover, the light-emitting device 4 differs from the light-emitting device 1 in that it has a connector 51 . The configurations and functions of the components of the light-emitting device 4 other than the substrate 50 and the connector 51 are the same as the configurations and functions of the components of the light-emitting device 1 denoted by the same reference numerals, so detailed description thereof will be omitted here.

Like the substrate 10, the substrate 50 is made of metal such as aluminum or a material with high thermal conductivity such as ceramics, has a rectangular planar shape, and has a plurality of LED dies 11 mounted thereon. The connector 51 is connected to each of the plurality of LED dies 11 via a wiring pattern (not shown), and is connected to one end of a cable connectable to an external power supply, thereby supplying power to each of the plurality of LED dies 11. do. The first sealing resin 14 is arranged so as to cover each of the plurality of LED dies 11 .

In the light-emitting device 4 , the LED dies 11 are spaced apart, and each of the five sets of the pair of first frame resins 12 and the pair of second frame resins 13 is one LED die 11 spaced apart. arranged to surround each other. The light emitting device 4 can be used as a light source such as a lighting device. In the light emitting device 4, the first frame resin 12 and the second frame resin 13 are arranged so as to surround each LED die 11, but in the light emitting device according to the embodiment, the first frame resin 12 and the second frame resin 13 The second frame resin 13 may be arranged to surround two or more LED dies 11 . In the light emitting device according to the embodiment, each of the plurality of sets of the pair of first frame resins 12 and the pair of second frame resins 13 may be arranged so as to surround two or more LED dies 11 .

Further, in the light-emitting devices 1 to 4, the first sealing resin 14 and the second sealing resin 15 do not contain a diffusion material, but in the light-emitting device according to the embodiment, the first sealing resin and the second sealing resin may contain a filler made of silicon dioxide (SiO ₂ ) or the like as a diffusion material. Further, the light emitting device according to the embodiment may have a diffusion plate arranged above the first sealing resin and the second sealing resin.

FIG. 13(a) is a perspective view of a light emitting device according to a third modification, and FIG. 13(b) is a perspective view of a light emitting device according to a fourth modification. 13(a) and 13(b), the first capacitor 16, the second capacitor 17, the first Zener diode 18 and the second Zener diode 19 are omitted.

The light emitting device 5 differs from the light emitting device 1 in that it has a substrate 60 instead of the substrate 10 . Further, the light emitting device 5 differs from the light emitting device 1 in that it has a frame member 61 and a diffusion plate 62 . The configurations and functions of the components of the light-emitting device 5 other than the substrate 60, the frame member 61, and the diffusion plate 62 are the same as those of the components of the light-emitting device 1 denoted by the same reference numerals. omitted.

The substrate 60 differs from the substrate 10 in the arrangement of the first anode electrode 21, the first cathode electrode 22, the second anode electrode 23, and the second cathode electrode 24, and also differs from the substrate 10 in the shape of the wiring pattern (not shown). . The configuration and functions of the substrate 60 are the same as those of the substrate 10, except for the arrangement of the first anode electrode 21, the first cathode electrode 22, the second anode electrode 23, and the second cathode electrode 24, and the shape of the wiring pattern. Detailed description is omitted here.

The frame member 61 is a frame-shaped member made of a synthetic resin such as polyamide, which is different from the first frame resin 12 and the second frame resin 13 . are arranged to surround the The diffusion plate 62 is a sheet containing diffusion particles, a light-transmitting resin, coated microparticle powder, a prism, or the like, and preferably has a large amount of forward scattering and little backward scattering. The diffusion plate 62 is arranged above the LED die 11 , the first sealing resin 14 , and the second sealing resin 15 by supporting the outer edge of the diffusion plate 62 with the frame member 61 . Light output through the first sealing resin 14 and the second sealing resin 15 when the LED die 11 emits light is diffused by the diffusion plate 62 . The frame member 61 may be formed by containing white particles such as titanium oxide (TiO ₂ ) in transparent resin such as silicone resin, and is the same member as the first frame resin 12 and the second frame resin 13 . can be

The light emitting device 6 differs from the light emitting device 3 in that it has a frame member 71 and a diffusion plate 72 . The configurations and functions of the constituent elements of the light emitting device 6 other than the frame member 71 and the diffuser plate 72 are the same as those of the constituent elements of the light emitting device 3 denoted by the same reference numerals, and therefore detailed descriptions thereof are omitted here.

The frame member 71 is a frame-shaped member made of a synthetic resin such as polyamide, which is different from the first frame resin 12 and the second frame resin 13 . are arranged to surround the The frame members 71 are arranged so as to be in contact with the ends of the substrate 40 in the longitudinal direction. The diffusion plate 72 is a sheet containing diffusion particles, a translucent resin, coated microparticle powder, a prism, or the like, and preferably has a large amount of forward scattering and a small amount of backward scattering. The diffusion plate 72 diffuses the light output through the first sealing resin 14 and the second sealing resin 15 when the LED die 11 emits light. The frame member 71 may be formed by containing white particles such as titanium oxide (TiO ₂ ) in transparent resin such as silicone resin, and is the same member as the first frame resin 12 and the second frame resin 13 . can be

Also, although the light-emitting devices 1 to 6 are formed from a single substrate, the light-emitting device according to the embodiment may include multiple substrates connected via a connection portion.

FIG. 14(a) is a perspective view of a light emitting device according to a fifth modification, and FIG. 14(b) is a cross-sectional view taken along line FF shown in FIG. 14(a). 14(a) and 14(b), the first capacitor 16, the second capacitor 17, the first Zener diode 18 and the second Zener diode 19 are omitted.

The light-emitting device 7 has a pair of light-emitting devices 6 that are connected at their ends in the longitudinal direction. The pair of light emitting devices 6 included in the light emitting device 7 are connected via an adhesive member such as an adhesive agent at connecting portions 80 arranged at the ends in the longitudinal direction.

The light-emitting device 7 is formed by connecting a pair of light-emitting devices 6 each having a frame member 71 arranged so as to be in contact with the longitudinal ends of the substrate 40 via connecting portions 80 arranged at the longitudinal ends. , the light can be emitted from the diffusion plate 72 in the vicinity of the connection portion 80 . The light emitting device 7 emits light from the diffuser plate 72 near the connecting portion 80 , thereby emitting light from the entire linear light emitting device including the vicinity of the connecting portion 80 connecting the pair of light emitting devices 6 . be able to. Since the light emitting device 7 can emit light from the vicinity of the connecting portion 80 that connects the pair of light emitting devices 6, a linear light emitting device that is longer than the light emitting device 6 and has uniform light emission characteristics is realized. be able to.

In the light emitting devices 1 to 7, the first direction in which the first frame resin extends is orthogonal to the second direction in which the second frame resin extends. It should be different from

Further, in the light emitting devices 1 to 7, the first sealing resin and the second sealing resin contain a phosphor, but in the light emitting device according to the embodiment, the sealing resin for sealing the LED die contains a phosphor. may not contain For example, the light-emitting device according to the embodiment has an LED die that emits red, green, and blue light instead of an LED die that emits blue light, and the LED die is sealed with a sealing resin containing no phosphor. You can stop.

In addition, the LED dies 11, 102 and 202 are not only surface-mounted LED dies in which the electrodes of the light emitting devices 1 to 7 are located on the bottom surface, but also wire-bonding connection type LED dies in which the electrodes are located on the top surface. may be surface mount and wirebonded LED dies, with .

1 to 7 light emitting device 10, 40, 50, 60, 70, 101, 201 substrate 11, 102, 202 LED die 12, 32, 103, 203 first frame resin 13, 33, 104, 204 second frame resin 14 1 sealing resin 15 second sealing resin 61, 71 frame member 62, 72 diffusion plate 105, 205 sealing resin

Claims (8)

a substrate;
at least one LED die mounted on the substrate;
a plurality of first frame resins extending in a first direction and arranged to sandwich the LED die;
a plurality of second frame resins extending in a second direction different from the first direction and arranged to surround the LED die together with the plurality of first frame resins;
a sealing resin that is disposed in a region surrounded by the plurality of first frame resins and the plurality of second frame resins and that seals the LED die;
an end portion of each of the plurality of first frame resins protruding from a second frame resin arranged on the outermost side among the plurality of second frame resins and separated from an outer edge of the substrate;
each end of the plurality of second frame resins protrudes from a first frame resin arranged on the outermost side among the plurality of first frame resins and is separated from the outer edge of the substrate;
A light-emitting device characterized by: The heights of the end portions of the plurality of first frame resins and the plurality of second frame resins are higher than the heights of the plurality of first frame resins and the plurality of second frame resins forming sides surrounding the LED die. 2. The light-emitting device of claim 1, wherein the light-emitting device is also low. The height of the intersection where each of the plurality of first frame resins and each of the plurality of second frame resins intersect is the height of each of the plurality of first frame resins and the plurality of the plurality of the first frame resins forming sides surrounding the LED die. 3. A light emitting device according to claim 1 or 2, equal to the height of each of the second frame resins. The second direction is a direction perpendicular to the first direction,
The light emitting device according to any one of claims 1 to 3, wherein said LED dies are arranged along at least one of said first direction and said second direction. a frame member arranged to surround the plurality of first frame resins and the plurality of second frame resins;
a diffusion plate supported by the frame material and arranged to cover the LED die, the plurality of first frame resins, the plurality of second frame resins, and the sealing resin;
The light-emitting device according to any one of claims 1 to 4, further comprising: further comprising a connecting portion connected to an adjacent light emitting device;
The substrate has a rectangular planar shape with long sides extending along the first direction,
the frame member has a frame-like planar shape with long sides extending along the first direction and short sides in contact with the short sides of the substrate;
6. The light-emitting device according to claim 5, wherein said connection portion is arranged at a longitudinal end portion of said substrate. the LED dies are spaced apart;
The plurality of first frame resins and the plurality of second frame resins include a plurality of sets of a pair of first frame resins and a pair of second frame resins,
Each of the plurality of sets of the pair of first frame resins and the pair of second frame resins is arranged to surround one or more of the LED dies. The light-emitting device according to . 8. The light-emitting device according to claim 1, further comprising an electronic component mounted on said substrate together with said light-emitting element.

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