JP2023124546A - 研磨装置および研磨装置における研磨終点検出方法 - Google Patents

研磨装置および研磨装置における研磨終点検出方法 Download PDF

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Publication number
JP2023124546A
JP2023124546A JP2022028362A JP2022028362A JP2023124546A JP 2023124546 A JP2023124546 A JP 2023124546A JP 2022028362 A JP2022028362 A JP 2022028362A JP 2022028362 A JP2022028362 A JP 2022028362A JP 2023124546 A JP2023124546 A JP 2023124546A
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JP
Japan
Prior art keywords
polishing
motor
end point
polished
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022028362A
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English (en)
Japanese (ja)
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JP2023124546A5 (https=
Inventor
大 吉成
Dai Yoshinari
都章 山口
Kuniaki Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2022028362A priority Critical patent/JP2023124546A/ja
Priority to PCT/JP2023/000030 priority patent/WO2023162478A1/ja
Priority to US18/840,195 priority patent/US20250178152A1/en
Publication of JP2023124546A publication Critical patent/JP2023124546A/ja
Publication of JP2023124546A5 publication Critical patent/JP2023124546A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2022028362A 2022-02-25 2022-02-25 研磨装置および研磨装置における研磨終点検出方法 Pending JP2023124546A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022028362A JP2023124546A (ja) 2022-02-25 2022-02-25 研磨装置および研磨装置における研磨終点検出方法
PCT/JP2023/000030 WO2023162478A1 (ja) 2022-02-25 2023-01-05 研磨装置および研磨装置における研磨終点検出方法
US18/840,195 US20250178152A1 (en) 2022-02-25 2023-01-05 Polishing device and method for detecting polishing end point in polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022028362A JP2023124546A (ja) 2022-02-25 2022-02-25 研磨装置および研磨装置における研磨終点検出方法

Publications (2)

Publication Number Publication Date
JP2023124546A true JP2023124546A (ja) 2023-09-06
JP2023124546A5 JP2023124546A5 (https=) 2025-01-10

Family

ID=87765342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022028362A Pending JP2023124546A (ja) 2022-02-25 2022-02-25 研磨装置および研磨装置における研磨終点検出方法

Country Status (3)

Country Link
US (1) US20250178152A1 (https=)
JP (1) JP2023124546A (https=)
WO (1) WO2023162478A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019081243A (ja) * 2017-10-31 2019-05-30 株式会社荏原製作所 研磨装置、及び研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9308618B2 (en) * 2012-04-26 2016-04-12 Applied Materials, Inc. Linear prediction for filtering of data during in-situ monitoring of polishing
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
WO2019177842A1 (en) * 2018-03-12 2019-09-19 Applied Materials, Inc. Filtering during in-situ monitoring of polishing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019081243A (ja) * 2017-10-31 2019-05-30 株式会社荏原製作所 研磨装置、及び研磨方法

Also Published As

Publication number Publication date
US20250178152A1 (en) 2025-06-05
WO2023162478A1 (ja) 2023-08-31

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