JP2023119658A - Hand of industrial robot and industrial robot - Google Patents

Hand of industrial robot and industrial robot Download PDF

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Publication number
JP2023119658A
JP2023119658A JP2022022631A JP2022022631A JP2023119658A JP 2023119658 A JP2023119658 A JP 2023119658A JP 2022022631 A JP2022022631 A JP 2022022631A JP 2022022631 A JP2022022631 A JP 2022022631A JP 2023119658 A JP2023119658 A JP 2023119658A
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Prior art keywords
hand
base
pressing member
pressing
rotating shaft
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Japanese (ja)
Inventor
保 栗林
Tamotsu Kuribayashi
雅裕 青木
Masahiro Aoki
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Nidec Instruments Corp
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Nidec Instruments Corp
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Priority to JP2022022631A priority Critical patent/JP2023119658A/en
Priority to KR1020230001555A priority patent/KR20230123874A/en
Priority to CN202310134694.7A priority patent/CN116604537A/en
Publication of JP2023119658A publication Critical patent/JP2023119658A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0009—Constructional details, e.g. manipulator supports, bases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

To provide a hand of an industrial robot which includes a loading part on which a conveyed object is loaded and a hand base part which structures a base end side part of the hand and to which a base end side of the loading part is fixed, and a holding mechanism which holds the conveyed object loaded on the loading part in a fixed position in a horizontal direction, and can reduce an abrasion loss of a seal member which prevents immersion of liquid into an inside of a hand base part as compared with a conventional device.SOLUTION: A pressing member 17 of a hand 3 which has a pressing part 16 for pressing an end surface of a conveyed object 2 to an abutment surface of an end surface abutting member by contacting with the end surface of the conveyed object 2 includes a rotary shaft as a rotation center of the pressing member 17 and a first lever part 23 which extends from the rotary shaft to an outer side of the rotary shaft in a radial direction. In the hand 3, the pressing part 16 is connected to a tip end part of the first lever part 23 arranged outside the hand base part 12.SELECTED DRAWING: Figure 2

Description

本発明は、搬送対象物を搬送する産業用ロボットで使用される産業用ロボットのハンドに関する。また、本発明は、かかるハンドを備える産業用ロボットに関する。 TECHNICAL FIELD The present invention relates to an industrial robot hand used in an industrial robot for transporting an object to be transported. The present invention also relates to an industrial robot equipped with such a hand.

従来、半導体ウエハを搬送するための水平多関節型の産業用ロボットが知られている（たとえば、特許文献１参照）。特許文献１に記載の産業用ロボットは、半導体ウエハが搭載されるハンドと、ハンドが先端側に回動可能に連結されるアームと、アームの基端側が回動可能に連結される本体部とを備えている。ハンドは、半導体ウエハが搭載される搭載部と、ハンドの基端側部分を構成するハンド基部と、搭載部に搭載される半導体ウエハを水平方向の一定位置で保持するための保持機構とを備えている。搭載部の基端側は、ハンド基部に固定されている。ハンド基部は、アームの先端側に回動可能に連結されている。 2. Description of the Related Art Conventionally, a horizontal articulated industrial robot for transporting semiconductor wafers is known (see Patent Document 1, for example). The industrial robot described in Patent Document 1 includes a hand on which a semiconductor wafer is mounted, an arm to which the hand is rotatably connected to the distal end, and a main body to which the base end of the arm is rotatably connected. It has The hand includes a mounting portion on which a semiconductor wafer is mounted, a hand base portion that constitutes the base end portion of the hand, and a holding mechanism for holding the semiconductor wafer mounted on the mounting portion at a fixed position in the horizontal direction. ing. The base end side of the mounting portion is fixed to the hand base portion. The hand base is rotatably connected to the distal end side of the arm.

特許文献１に記載の産業用ロボットでは、保持機構は、半導体ウエハの端面が当接する当接面を有する端面当接部材と、半導体ウエハの端面に接触して端面当接部材の当接面に半導体ウエハの端面を押し付ける押付部材と、押付部材を直線的に移動させるエアシリンダとを備えている。エアシリンダは、中空状に形成されるハンド基部の内部に収容されている。押付部材の基端部は、エアシリンダに連結されており、ハンド基部の内部に収容されている。押付部材の先端側部分は、ハンド基部の外部に配置されており、押付部材の先端が半導体ウエハの端面に接触可能となっている。ハンド基部には、押付部材が挿通される開口部が形成されている。 In the industrial robot described in Patent Document 1, the holding mechanism includes an end surface contact member having a contact surface with which the end surface of the semiconductor wafer contacts, and an end surface contact member that contacts the end surface of the semiconductor wafer and contacts the contact surface of the end surface contact member. A pressing member that presses the end surface of the semiconductor wafer and an air cylinder that linearly moves the pressing member are provided. The air cylinder is housed inside a hollow hand base. The base end of the pressing member is connected to the air cylinder and housed inside the hand base. The tip side portion of the pressing member is arranged outside the hand base so that the tip of the pressing member can come into contact with the end surface of the semiconductor wafer. The hand base has an opening through which the pressing member is inserted.

特開２０１５－３６１８６号公報JP 2015-36186 A

特許文献１に記載の産業用ロボットが、たとえば、液体を使う所定の処理が行われた後の半導体ウエハを搬送する場合には、半導体ウエハ上に残っている液体がハンド基部の開口部からハンド基部の内部に浸入するおそれがある。また、ハンド基部の内部に液体が浸入すると、ハンド基部の内部に収容されるエアシリンダ等が腐食するおそれが生じる。ハンド基部の内部への液体の浸入を防止するためには、ハンド基部の開口部にシール部材を配置して、直線的に移動する押付部材の外周面にシール部材の内周面を密着させれば良い。 For example, when the industrial robot described in Patent Document 1 transports a semiconductor wafer that has been subjected to a predetermined process using liquid, the liquid remaining on the semiconductor wafer flows from the opening of the hand base into the hand. There is a risk of penetration inside the base. In addition, if the liquid enters the inside of the hand base, there is a risk that the air cylinder or the like accommodated inside the hand base will corrode. In order to prevent liquid from entering the inside of the base of the hand, a sealing member is placed in the opening of the base of the hand, and the inner peripheral surface of the sealing member is brought into close contact with the outer peripheral surface of the pressing member that moves linearly. Good luck.

しかしながら、ハンド基部の開口部にシール部材を配置して押付部材の外周面に密着させると、保持機構が半導体ウエハを保持するたび、および、保持機構が保持していた半導体ウエハを解放するたびに、シール部材の内周面に押付部材の外周面が高い接触圧で接触している状態で押付部材のストローク分、押付部材が直線的に移動するため、シール部材の摩耗が激しくなって、シール部材の寿命が短くなるおそれがある。 However, when the sealing member is placed in the opening of the hand base and brought into close contact with the outer peripheral surface of the pressing member, the holding mechanism holds the semiconductor wafer and releases the semiconductor wafer held by the holding mechanism. Since the pressing member moves linearly for the stroke of the pressing member in a state where the outer peripheral surface of the pressing member is in contact with the inner peripheral surface of the sealing member with high contact pressure, the wear of the sealing member becomes severe, The service life of the parts may be shortened.

そこで、本発明の課題は、搬送対象物が搭載される搭載部と、ハンドの基端側部分を構成するとともに搭載部の基端側が固定されるハンド基部と、搭載部に搭載される搬送対象物を水平方向の一定位置で保持するための保持機構とを備える産業用ロボットのハンドにおいて、ハンド基部の内部への液体の浸入を防止するためのシール部材の摩耗量を従来よりも低減することが可能なハンドを提供することにある。また、本発明の課題は、かかるハンドを備える産業用ロボットを提供することにある。 Accordingly, an object of the present invention is to provide a mounting portion on which an object to be conveyed is mounted, a hand base portion that constitutes a base end side portion of a hand and to which the base end side of the mounting portion is fixed, and an object to be conveyed that is mounted on the mounting portion. To reduce the amount of wear of a seal member for preventing liquid from entering the inside of the base of an industrial robot hand provided with a holding mechanism for holding an object at a fixed position in the horizontal direction. It is to provide a hand that is possible. Another object of the present invention is to provide an industrial robot having such a hand.

上記の課題を解決するため、本発明の産業用ロボットのハンドは、搬送対象物を搬送する産業用ロボットのハンドにおいて、搬送対象物が搭載される搭載部と、ハンドの基端側部分を構成するとともに搭載部の基端側が固定されるハンド基部と、搭載部に搭載される搬送対象物を水平方向の一定位置で保持するための保持機構とを備え、保持機構は、搬送対象物の端面が当接する当接面を有し搭載部の先端側に取り付けられる端面当接部材と、搬送対象物の端面に接触して当接面に搬送対象物の端面を押し付ける押付部を有しハンド基部に保持される押付部材と、ハンド基部の内部に収容されるとともに上下方向を回動の軸方向としてハンド基部に対して押付部材を回動させる駆動源と、押付部材を回動可能に支持する軸受と、ハンド基部の内部への液体の浸入を防止するためのシール部材とを備え、押付部材は、押付部材の回動中心になる回動軸と、回動軸の径方向の外側に向かって回動軸から伸びる第１レバー部とを備え、第１レバー部は、ハンド基部の外部に配置され、第１レバー部の先端部には、押付部が繋がり、軸受は、回動軸を回動可能に支持し、シール部材は、回動軸の外周側に配置されるとともに回動軸の外周面に密着していることを特徴とする。 In order to solve the above-described problems, an industrial robot hand of the present invention is an industrial robot hand that transports an object to be transported. and a hand base to which the base end side of the mounting portion is fixed, and a holding mechanism for holding the object to be conveyed mounted on the mounting portion at a fixed position in the horizontal direction. and a hand base having an end surface contact member attached to the tip side of the mounting portion and having a contact surface with which the object to be conveyed abuts, and a pressing portion that contacts the end surface of the conveyed object and presses the end surface of the conveyed object against the contact surface. a driving source that is housed inside the hand base and rotates the pressing member with respect to the hand base with the vertical direction being the axial direction of rotation; and rotatably supporting the pressing member. Equipped with a bearing and a seal member for preventing liquid from entering the inside of the base of the hand, the pressing member has a rotating shaft serving as the center of rotation of the pressing member and a radially outward direction of the rotating shaft. and a first lever portion extending from the rotation shaft, the first lever portion being arranged outside the hand base portion, the pressing portion being connected to the tip portion of the first lever portion, and the bearing supporting the rotation shaft. The seal member is rotatably supported, and the sealing member is arranged on the outer peripheral side of the rotating shaft and is in close contact with the outer peripheral surface of the rotating shaft.

本発明の産業用ロボットのハンドでは、搬送対象物の端面に接触して端面当接部材の当接面に搬送対象物の端面を押し付ける押付部を有する押付部材は、押付部材の回動中心になる回動軸と、回動軸の径方向の外側に向かって回動軸から伸びる第１レバー部とを備えている。また、本発明では、ハンド基部の外部に配置される第１レバー部の先端部に押付部が繋がっている。 In the industrial robot hand of the present invention, the pressing member having the pressing portion that contacts the end surface of the object to be transported and presses the end surface of the object to be transported against the contact surface of the end surface contacting member is positioned at the center of rotation of the pressing member. and a first lever portion extending from the rotating shaft toward the radially outer side of the rotating shaft. Further, in the present invention, the pressing portion is connected to the tip portion of the first lever portion arranged outside the hand base portion.

そのため、本発明では、回動軸の回動角度を小さくしても、保持機構が搬送対象物を保持したり、保持機構が保持していた搬送対象物を解放したりするための押付部の移動量を確保することが可能になる。したがって、本発明では、保持機構が搬送対象物を保持したり、保持機構が保持していた搬送対象物を解放したりするための押付部の移動量を確保しつつ、シール部材の内周面に回動軸の外周面が高い接触圧で接触している状態で回動する回動軸の回動角度を小さくすることが可能になる。その結果、本発明では、シール部材の摩耗量を従来よりも低減することが可能になる。 Therefore, in the present invention, even if the rotation angle of the rotation shaft is made small, the pressing portion for holding the object to be conveyed by the holding mechanism or for releasing the object to be conveyed held by the holding mechanism is provided. It becomes possible to secure the amount of movement. Therefore, according to the present invention, the inner peripheral surface of the seal member is secured while securing the amount of movement of the pressing portion for the holding mechanism to hold the conveyed object or to release the conveyed object held by the holding mechanism. It is possible to reduce the rotation angle of the rotating shaft that rotates in a state in which the outer peripheral surface of the rotating shaft is in contact with the outer peripheral surface of the rotating shaft with a high contact pressure. As a result, in the present invention, it becomes possible to reduce the amount of wear of the seal member compared to the conventional art.

本発明において、たとえば、押付部は、第１レバー部に回転可能に保持されるローラである。また、本発明において、たとえば、押付部材は、回動軸の径方向の外側に向かって回動軸から伸びる第２レバー部を備え、第２レバー部は、ハンド基部の内部に配置され、第２レバー部の先端部は、駆動源に連結されている。この場合には、たとえば、上下方向から見たときの押付部材の形状は、Ｌ形状となっている。 In the present invention, for example, the pressing section is a roller rotatably held by the first lever section. Further, in the present invention, for example, the pressing member includes a second lever portion extending radially outwardly of the rotation shaft from the rotation shaft. The tip of the two levers is connected to a drive source. In this case, for example, the pressing member has an L shape when viewed from above and below.

本発明のハンドは、ハンドが連結されるアームと、アームが連結される本体部とを備える産業用ロボットに用いることができる。この産業用ロボットでは、ハンド基部の内部への液体の浸入を防止するためのシール部材の摩耗量を従来よりも低減することが可能になる。 The hand of the present invention can be used in an industrial robot that includes an arm to which the hand is connected and a main body to which the arm is connected. In this industrial robot, it is possible to reduce the amount of wear of the seal member for preventing liquid from entering the inside of the hand base.

以上のように、本発明では、搬送対象物が搭載される搭載部と、ハンドの基端側部分を構成するとともに搭載部の基端側が固定されるハンド基部と、搭載部に搭載される搬送対象物を水平方向の一定位置で保持するための保持機構とを備える産業用ロボットのハンドにおいて、ハンド基部の内部への液体の浸入を防止するためのシール部材の摩耗量を従来よりも低減することが可能になる。 As described above, in the present invention, there are provided a mounting portion on which an object to be conveyed is mounted, a hand base portion constituting a proximal side portion of the hand and to which the base end side of the mounting portion is fixed, and a carrying portion mounted on the mounting portion. To reduce the amount of wear of a seal member for preventing liquid from entering the inside of the base of an industrial robot hand provided with a holding mechanism for holding an object at a fixed position in the horizontal direction. becomes possible.

本発明の実施の形態にかかる産業用ロボットの平面図である。1 is a plan view of an industrial robot according to an embodiment of the invention; FIG. 図１のＥ部の構成を説明するための拡大図である。2 is an enlarged view for explaining the configuration of an E section in FIG. 1; FIG. 図２のＦ－Ｆ断面の構成を説明するための断面図である。FIG. 3 is a cross-sectional view for explaining the configuration of the FF cross section of FIG. 2;

以下、図面を参照しながら、本発明の実施の形態を説明する。 BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.

（産業用ロボットの概略構成）
図１は、本発明の実施の形態にかかる産業用ロボット１の平面図である。 (Schematic configuration of industrial robot)
FIG. 1 is a plan view of an industrial robot 1 according to an embodiment of the invention.

本形態の産業用ロボット１（以下、「ロボット１」とする。）は、搬送対象物である半導体ウエハ２（以下、「ウエハ２」とする。）を搬送するための水平多関節型のロボットである。ウエハ２は、円板状に形成されている。ロボット１は、半導体製造システムに組み込まれて使用される。本形態では、ウエハ２に対して液体を使う所定の処理が行われ、ロボット１は、処理後のウエハ２を搬送する。 An industrial robot 1 (hereinafter referred to as "robot 1") of the present embodiment is a horizontal articulated robot for transporting a semiconductor wafer 2 (hereinafter referred to as "wafer 2") which is an object to be transported. is. The wafer 2 is formed in a disc shape. The robot 1 is used by being incorporated in a semiconductor manufacturing system. In this embodiment, the wafer 2 is subjected to a predetermined process using a liquid, and the robot 1 transports the processed wafer 2 .

ロボット１は、ウエハ２が搭載されるハンド３と、ハンド３が先端側に回動可能に連結されるとともに水平方向に動作するアーム４と、アーム４の基端側が回動可能に連結される本体部５とを備えている。アーム４は、基端側が本体部５に回動可能に連結されるアーム部７と、アーム部７の先端側に基端側が回動可能に連結されるアーム部８と、アーム部８の先端側に基端側が回動可能に連結されるアーム部９とから構成されている。 The robot 1 includes a hand 3 on which a wafer 2 is mounted, an arm 4 to which the hand 3 is rotatably connected to the distal end thereof and which moves horizontally, and a proximal end of the arm 4 to be rotatably connected. A body portion 5 is provided. The arm 4 includes an arm portion 7 whose base end side is rotatably connected to the main body portion 5 , an arm portion 8 whose base end side is rotatably connected to the tip side of the arm portion 7 , and the tip of the arm portion 8 . and an arm portion 9 to which the base end side is rotatably connected.

アーム部７～９は、上下方向を回動の軸方向として回動する。本体部５は、アーム部７の基端側が回動可能に連結される柱状部材と、アーム４と一緒に柱状部材を昇降させる昇降機構とを備えている。アーム部７の基端側は、柱状部材の上端部に回動可能に連結されている。本体部５とアーム部７とアーム部８とアーム部９とは、上下方向において、下側からこの順番で配置されている。また、ロボット１は、アーム部７、８を回動させてアーム部７とアーム部８とからなるアーム４の一部を伸縮させるアーム部駆動機構と、アーム部９を回動させるアーム部駆動機構と、ハンド３を回動させるハンド駆動機構とを備えている。 The arm portions 7 to 9 rotate with the vertical direction as the axial direction of rotation. The body portion 5 includes a columnar member to which the base end side of the arm portion 7 is rotatably connected, and an elevating mechanism for elevating the columnar member together with the arm 4 . The base end side of the arm portion 7 is rotatably connected to the upper end portion of the columnar member. The body portion 5, the arm portion 7, the arm portion 8, and the arm portion 9 are arranged in this order from the bottom in the vertical direction. The robot 1 also includes an arm drive mechanism that rotates the arm sections 7 and 8 to expand and contract a part of the arm 4 composed of the arm sections 7 and 8, and an arm drive mechanism that rotates the arm section 9. mechanism and a hand drive mechanism for rotating the hand 3 .

ハンド３は、上下方向から見たときの形状が略Ｙ形状となるように形成されており、ハンド３の先端側は、二股状に分かれている。ハンド３は、アーム部９の先端側に回動可能に連結されている。また、ハンド３は、アーム部９の上側に配置されている。ハンド３は、上下方向を回動の軸方向として回動する。ハンド３は、ウエハ２が搭載される搭載部１１と、ハンド３の基端側部分を構成するハンド基部１２と、搭載部１１に搭載されるウエハ２を水平方向の一定位置で保持するための保持機構１３とを備えている。 The hand 3 is formed to have a substantially Y shape when viewed from above, and the tip side of the hand 3 is bifurcated. The hand 3 is rotatably connected to the tip side of the arm portion 9 . Also, the hand 3 is arranged above the arm portion 9 . The hand 3 rotates with the vertical direction as the axial direction of rotation. The hand 3 includes a mounting portion 11 on which the wafer 2 is mounted, a hand base portion 12 forming a base end portion of the hand 3, and a holder for holding the wafer 2 mounted on the mounting portion 11 at a fixed position in the horizontal direction. A holding mechanism 13 is provided.

ハンド基部１２は、アーム部９の先端側に回動可能に連結されている。ハンド基部１２には、搭載部１１の基端側が固定されている。搭載部１１は、平板状に形成されている。搭載部１１は、搭載部１１の厚さ方向と上下方向とが一致するように配置されている。ハンド基部１２は、上下方向の厚さが薄い扁平なブロック状に形成されている。ハンド基部１２は、中空状に形成されている。保持機構１３は、搭載部１１に搭載されるウエハ２の端面（外周面）に３方向から接触して搭載部１１に搭載されるウエハ２を水平方向において一定位置で保持するエッジグリップ型の保持機構である。以下、保持機構１３の構成について説明する。 The hand base portion 12 is rotatably connected to the distal end side of the arm portion 9 . The base end side of the mounting portion 11 is fixed to the hand base portion 12 . The mounting portion 11 is formed in a flat plate shape. The mounting portion 11 is arranged such that the thickness direction of the mounting portion 11 is aligned with the vertical direction. The hand base 12 is formed in a flat block shape with a thin thickness in the vertical direction. The hand base 12 is hollow. The holding mechanism 13 is an edge-grip type holding mechanism that contacts the end surface (peripheral surface) of the wafer 2 mounted on the mounting portion 11 from three directions and holds the wafer 2 mounted on the mounting portion 11 at a fixed position in the horizontal direction. mechanism. The configuration of the holding mechanism 13 will be described below.

（保持機構の構成）
図２は、図１のＥ部の構成を説明するための拡大図である。図３は、図２のＦ－Ｆ断面の構成を説明するための断面図である。 (Configuration of holding mechanism)
FIG. 2 is an enlarged view for explaining the configuration of the E section in FIG. FIG. 3 is a cross-sectional view for explaining the structure of the FF cross section of FIG.

保持機構１３は、ウエハ２の端面が当接する当接面１５ａを有する端面当接部材１５と、ウエハ２の端面に接触して端面当接部材１５の当接面１５ａにウエハ２の端面を押し付ける押付部としてのローラ１６を有する押付部材１７とを備えている。端面当接部材１５は、搭載部１１の先端側に取り付けられている。具体的には、端面当接部材１５は、略Ｙ形状をなすハンド３の先端部の２箇所に固定されている。また、端面当接部材１５は、搭載部１１の上面に固定されている。また、搭載部１１の基端側の上面には、ウエハ２が載置される２個のウエハ載置部材１８が固定されており、ウエハ２は、端面当接部材１５とウエハ載置部材１８とに搭載される。 The holding mechanism 13 includes an end face contact member 15 having a contact surface 15a with which the end face of the wafer 2 contacts, and the end face contact member 15 contacts the end face of the wafer 2 and presses the end face of the wafer 2 against the contact face 15a of the end face contact member 15. and a pressing member 17 having a roller 16 as a pressing portion. The end face contact member 15 is attached to the tip side of the mounting portion 11 . Specifically, the end face contact members 15 are fixed at two points on the tip of the hand 3 which is substantially Y-shaped. Also, the end surface contact member 15 is fixed to the upper surface of the mounting portion 11 . Two wafer mounting members 18 on which the wafer 2 is mounted are fixed to the upper surface of the mounting portion 11 on the base end side. and installed in

押付部材１７は、ハンド基部１２に回動可能に保持されている。具体的には、押付部材１７は、ハンド基部１２に対して上下方向を回動の軸方向とする回動が可能となるようにハンド基部１２に保持されている。また、保持機構１３は、上下方向を回動の軸方向としてハンド基部１２に対して押付部材１７を回動させる駆動源としてのエアシリンダ１９と、押付部材１７を回動可能に支持する軸受２０と、ハンド基部１２の内部への液体の浸入を防止するためのシール部材２１とを備えている。 The pressing member 17 is rotatably held by the hand base 12 . Specifically, the pressing member 17 is held by the hand base 12 so as to be rotatable with respect to the hand base 12 with the vertical direction being the axial direction of rotation. In addition, the holding mechanism 13 includes an air cylinder 19 as a driving source for rotating the pressing member 17 with respect to the hand base 12 with the vertical direction as the axial direction of rotation, and a bearing 20 that rotatably supports the pressing member 17. and a sealing member 21 for preventing liquid from entering the inside of the hand base 12 .

押付部材１７は、押付部材１７の回動中心になる回動軸２２と、回動軸２２の径方向の外側に向かって回動軸２２から伸びる第１レバー部２３および第２レバー部２４とを備えている。回動軸２２は、回動軸２２の軸方向と上下方向とが一致するように配置されている。回動軸２２は、ハンド基部１２の先端部の上面側に形成される挿通穴１２ａに挿通されている。 The pressing member 17 has a rotating shaft 22 serving as the center of rotation of the pressing member 17, and a first lever portion 23 and a second lever portion 24 extending from the rotating shaft 22 radially outwardly of the rotating shaft 22. It has The rotating shaft 22 is arranged such that the axial direction of the rotating shaft 22 is aligned with the vertical direction. The rotating shaft 22 is inserted through an insertion hole 12 a formed on the upper surface side of the distal end portion of the hand base portion 12 .

第１レバー部２３および第２レバー部２４は、上下方向から見たときの形状が細長い長円形状となる平板状に形成されている。第１レバー部２３の基端部は、回動軸２２の上端に繋がっている。第２レバー部２４の基端部は、回動軸２２の下端に繋がっている。上下方向から見たときに、第１レバー部２３と第２レバー部２４とは、回動軸２２から互いに異なる方向に伸びており、上下方向から見たときの押付部材１７の形状は、Ｌ形状となっている。 The first lever portion 23 and the second lever portion 24 are formed in a flat plate shape having an elongated oval shape when viewed from above and below. A base end portion of the first lever portion 23 is connected to the upper end of the rotating shaft 22 . A base end portion of the second lever portion 24 is connected to the lower end of the rotating shaft 22 . When viewed in the vertical direction, the first lever portion 23 and the second lever portion 24 extend in different directions from the rotation shaft 22, and the shape of the pressing member 17 when viewed in the vertical direction is L. It has a shape.

第１レバー部２３は、ハンド基部１２の外部に配置されている。第１レバー部２３の先端部には、ローラ１６が繋がっている。ローラ１６は、第１レバー部２３に回転可能に保持されている。具体的には、ローラ１６は、第１レバー部２３の先端部に固定される固定軸２５に回動可能に保持されており、固定軸２５を介して第１レバー部２３に回転可能に保持されている。固定軸２５は、固定軸２５の軸方向と上下方向とが一致するように配置されている。ローラ１６は、第１レバー部２３に対して上下方向を回転の軸方向とする回転が可能になっている。 The first lever portion 23 is arranged outside the hand base portion 12 . A roller 16 is connected to the tip of the first lever portion 23 . The roller 16 is rotatably held by the first lever portion 23 . Specifically, the roller 16 is rotatably held by a fixed shaft 25 fixed to the tip of the first lever portion 23 , and rotatably held by the first lever portion 23 via the fixed shaft 25 . It is The fixed shaft 25 is arranged so that the axial direction of the fixed shaft 25 is aligned with the vertical direction. The roller 16 is rotatable with respect to the first lever portion 23 with the vertical direction being the axial direction of rotation.

第２レバー部２４は、ハンド基部１２の内部に配置されている。すなわち、第２レバー部２４は、ハンド基部１２の内部に収容されている。エアシリンダ１９は、ハンド基部１２の内部に収容されている。第２レバー部２４の先端部は、エアシリンダ１９に連結されている。具体的には、第２レバー部２４の先端部は、エアシリンダ１９のロッドの先端に固定される連結部材２６に回動可能に連結されている。第２レバー部２４の先端部は、連結部材２６に対して上下方向を回動の軸方向とする回動が可能になっている。また、エアシリンダ１９の本体部は、ハンド基部１２に対して上下方向を回動の軸方向とする回動が可能になるようにハンド基部１２に取り付けられている。 The second lever portion 24 is arranged inside the hand base portion 12 . That is, the second lever portion 24 is housed inside the hand base portion 12 . The air cylinder 19 is housed inside the hand base 12 . A tip portion of the second lever portion 24 is connected to the air cylinder 19 . Specifically, the distal end of the second lever portion 24 is rotatably connected to a connecting member 26 fixed to the distal end of the rod of the air cylinder 19 . The distal end portion of the second lever portion 24 is rotatable with respect to the connecting member 26 with the vertical direction as the axial direction of rotation. Further, the main body of the air cylinder 19 is attached to the hand base 12 so as to be rotatable with respect to the hand base 12 with the vertical direction being the axial direction of rotation.

軸受２０は、たとえば、玉軸受等の転がり軸受である。軸受２０は、ハンド基部１２の挿通穴１２ａの中に配置されている。軸受２０は、回動軸２２を回動可能に支持している。軸受２０の外輪は、挿通穴１２ａの内周側に固定され、軸受２０の内輪は、回動軸２２の外周面に固定されている。なお、軸受２０は、滑り軸受であっても良い。 Bearing 20 is, for example, a rolling bearing such as a ball bearing. The bearing 20 is arranged in the insertion hole 12 a of the hand base 12 . The bearing 20 rotatably supports the rotating shaft 22 . The outer ring of bearing 20 is fixed to the inner peripheral side of insertion hole 12 a , and the inner ring of bearing 20 is fixed to the outer peripheral surface of rotating shaft 22 . Note that the bearing 20 may be a slide bearing.

シール部材２１は、円環状に形成されている。シール部材２１は、ハンド基部１２の挿通穴１２ａの中に配置されている。また、シール部材２１は、軸受２０の上側に配置されている。シール部材２１は、回動軸２２の外周側に配置されている。すなわち、回動軸２２は、シール部材２１の内周側に配置されている。シール部材２１は、回動軸２２の外周面に密着している。具体的には、シール部材２１の内周面が回動軸２２の外周面に密着している。 The seal member 21 is formed in an annular shape. The seal member 21 is arranged in the insertion hole 12 a of the hand base 12 . Also, the seal member 21 is arranged above the bearing 20 . The seal member 21 is arranged on the outer peripheral side of the rotary shaft 22 . That is, the rotating shaft 22 is arranged on the inner peripheral side of the seal member 21 . The seal member 21 is in close contact with the outer peripheral surface of the rotating shaft 22 . Specifically, the inner peripheral surface of the seal member 21 is in close contact with the outer peripheral surface of the rotary shaft 22 .

以上のように構成された保持機構１３では、エアシリンダ１９は、ローラ１６がウエハ２の端面に接触して端面当接部材１５の当接面１５ａにウエハ２の端面を押し付けるウエハ保持位置（図２の二点鎖線で示す位置）と、ローラ１６がウエハ２の端面から離れるように退避する退避位置（図２の実線で示す位置）との間で回動軸２２を回動中心にして押付部材１７を回動させる。 In the holding mechanism 13 constructed as described above, the air cylinder 19 is positioned at the wafer holding position (see FIG. 1) where the roller 16 contacts the end surface of the wafer 2 and presses the end surface of the wafer 2 against the contact surface 15a of the end surface contact member 15. 2) and the retracted position (position indicated by the solid line in FIG. 2) where the roller 16 is retracted away from the end surface of the wafer 2, and the rotating shaft 22 is the center of rotation. The member 17 is rotated.

（本形態の主な効果）
以上説明したように、本形態では、ウエハ２の端面に接触して端面当接部材１５の当接面１５ａにウエハ２の端面を押し付けるローラ１６を有する押付部材１７は、押付部材１７の回動中心になる回動軸２２と、回動軸２２の径方向の外側に向かって回動軸２２から伸びる第１レバー部２３を備えている。また、本形態では、ハンド基部１２の外部に配置される第１レバー部２３の先端部にローラ１６が繋がっている。そのため、本形態では、回動軸２２の回動角度を小さくしても、保持機構１３がウエハ２を保持したり、保持機構１３が保持していたウエハ２を解放したりするためのローラ１６の移動量を確保することが可能になる。 (Main effects of this form)
As described above, in this embodiment, the pressing member 17 having the roller 16 that contacts the edge surface of the wafer 2 and presses the edge surface of the wafer 2 against the contact surface 15 a of the edge contact member 15 is rotated. It is provided with a central rotating shaft 22 and a first lever portion 23 extending from the rotating shaft 22 toward the radially outer side of the rotating shaft 22 . Further, in this embodiment, the roller 16 is connected to the tip of the first lever portion 23 arranged outside the hand base portion 12 . Therefore, in this embodiment, even if the rotation angle of the rotation shaft 22 is small, the rollers 16 for holding the wafer 2 by the holding mechanism 13 and for releasing the wafer 2 held by the holding mechanism 13 are provided. movement amount can be secured.

すなわち、本形態では、回動軸２２を回動中心にして回動する第１レバー部２３の先端部にローラ１６が繋がっているため、回動軸２２の回動角度を小さくしても、図２の二点鎖線で示す位置と図２の実線で示す位置との間でローラ１６を移動させることが可能になる。したがって、本形態では、保持機構１３がウエハ２を保持したり、保持機構１３が保持していたウエハ２を解放したりするためのローラ１６の移動量を確保しつつ、シール部材２１の内周面に回動軸２２の外周面が高い接触圧で接触している状態で回動する回動軸２２の回動角度を小さくすることが可能になる。その結果、本形態では、シール部材２１の摩耗量を低減することが可能になる。 That is, in this embodiment, since the roller 16 is connected to the tip of the first lever portion 23 that rotates around the rotation shaft 22, even if the rotation angle of the rotation shaft 22 is reduced, It is possible to move the roller 16 between the position indicated by the two-dot chain line in FIG. 2 and the position indicated by the solid line in FIG. Therefore, in this embodiment, the inner circumference of the seal member 21 is secured while the movement amount of the roller 16 for holding the wafer 2 by the holding mechanism 13 and releasing the wafer 2 held by the holding mechanism 13 is secured. It is possible to reduce the rotation angle of the rotating shaft 22 that rotates in a state where the outer peripheral surface of the rotating shaft 22 is in contact with the surface with a high contact pressure. As a result, in this embodiment, the amount of wear of the seal member 21 can be reduced.

（他の実施の形態）
上述した形態は、本発明の好適な形態の一例ではあるが、これに限定されるものではなく本発明の要旨を変更しない範囲において種々変形実施が可能である。 (Other embodiments)
The embodiment described above is an example of the preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

上述した形態において、保持機構１３は、エアシリンダ１９に代えて、ハンド基部１２に対して押付部材１７を回動させるモータ等の駆動源を備えていても良い。保持機構１３が駆動源としてモータを備えている場合には、たとえば、モータが回動軸２２を直接回動させても良い。この場合には、押付部材１７は第２レバー部２４を備えていなくても良い。また、上述した形態において、ローラ１６は、第１レバー部２３に対して回転可能になっていなくても良い。また、上述した形態において、押付部材１７は、ローラ１６以外の押付部を備えていても良い。 In the embodiment described above, the holding mechanism 13 may include a driving source such as a motor for rotating the pressing member 17 with respect to the hand base 12 instead of the air cylinder 19 . If the holding mechanism 13 includes a motor as a drive source, the motor may directly rotate the rotating shaft 22, for example. In this case, the pressing member 17 may not have the second lever portion 24 . Further, in the embodiment described above, the roller 16 does not have to be rotatable with respect to the first lever portion 23 . Moreover, in the form mentioned above, the pressing member 17 may be provided with a pressing portion other than the roller 16 .

上述した形態において、ロボット１は、アーム４の先端側に回動可能に連結される２個のハンド３を備えていても良い。また、上述した形態において、アーム４は、２個のアーム部によって構成されていても良いし、４個以上のアーム部によって構成されていても良い。また、上述した形態において、ロボット１によって搬送される搬送対象物は、ウエハ２以外のものであっても良い。この場合には、たとえば、搬送対象物は、正方形または長方形の平板状に形成されていても良い。 In the embodiment described above, the robot 1 may include two hands 3 that are rotatably connected to the tip side of the arm 4 . Moreover, in the above-described embodiment, the arm 4 may be composed of two arm portions, or may be composed of four or more arm portions. Moreover, in the above-described embodiment, the object to be transferred by the robot 1 may be something other than the wafer 2 . In this case, for example, the object to be conveyed may be formed in the shape of a square or rectangular flat plate.

本発明が適用される産業用ロボットは、水平多関節型の産業用ロボット以外のロボットであっても良い。たとえば、本発明が適用される産業用ロボットは、ハンド３の直線的な往復移動が可能となるようにハンド３が連結されるアームと、アームが回動可能に連結される本体部と、アームに対してハンド３を直線的に往復移動させるリニア駆動部とを備える産業用ロボットであっても良い。 Industrial robots to which the present invention is applied may be robots other than horizontal articulated industrial robots. For example, an industrial robot to which the present invention is applied includes an arm to which the hand 3 is connected so that the hand 3 can reciprocate linearly, a main body to which the arm is rotatably connected, and an arm It may be an industrial robot provided with a linear driving unit that linearly reciprocates the hand 3 with respect to the .

１ ロボット（産業用ロボット）
２ ウエハ（半導体ウエハ、搬送対象物）
３ ハンド
４ アーム
５ 本体部
１１ 搭載部
１２ ハンド基部
１３ 保持機構
１５ 端面当接部材
１５ａ 当接面
１６ ローラ（押付部）
１７ 押付部材
１９ エアシリンダ（駆動源）
２０ 軸受
２１ シール部材
２２ 回動軸
２３ 第１レバー部
２４ 第２レバー部 1 Robot (industrial robot)
2 Wafer (semiconductor wafer, object to be transported)
3 Hand 4 Arm 5 Main Body 11 Mounting Part 12 Hand Base 13 Holding Mechanism 15 End Face Abutting Member 15a Abutting Surface 16 Roller (Pressing Part)
17 pressing member 19 air cylinder (driving source)
20 bearing 21 sealing member 22 rotating shaft 23 first lever portion 24 second lever portion

Claims (5)

搬送対象物を搬送する産業用ロボットのハンドにおいて、
前記搬送対象物が搭載される搭載部と、前記ハンドの基端側部分を構成するとともに前記搭載部の基端側が固定されるハンド基部と、前記搭載部に搭載される前記搬送対象物を水平方向の一定位置で保持するための保持機構とを備え、
前記保持機構は、前記搬送対象物の端面が当接する当接面を有し前記搭載部の先端側に取り付けられる端面当接部材と、前記搬送対象物の端面に接触して前記当接面に前記搬送対象物の端面を押し付ける押付部を有し前記ハンド基部に保持される押付部材と、前記ハンド基部の内部に収容されるとともに上下方向を回動の軸方向として前記ハンド基部に対して前記押付部材を回動させる駆動源と、前記押付部材を回動可能に支持する軸受と、前記ハンド基部の内部への液体の浸入を防止するためのシール部材とを備え、
前記押付部材は、前記押付部材の回動中心になる回動軸と、前記回動軸の径方向の外側に向かって前記回動軸から伸びる第１レバー部を備え、
前記第１レバー部は、前記ハンド基部の外部に配置され、
前記第１レバー部の先端部には、前記押付部が繋がり、
前記軸受は、前記回動軸を回動可能に支持し、
前記シール部材は、前記回動軸の外周側に配置されるとともに前記回動軸の外周面に密着していることを特徴とするハンド。 In the hand of an industrial robot that transports objects to be transported,
A mounting portion on which the object to be conveyed is mounted, a hand base portion that constitutes a proximal side portion of the hand and to which the base end side of the mounting portion is fixed, and the object to be conveyed that is mounted on the mounting portion are arranged horizontally. A holding mechanism for holding at a fixed position in the direction,
The holding mechanism includes an end face abutting member having a contact surface with which the end face of the object to be conveyed abuts and attached to the front end side of the mounting portion, and a pressing member that has a pressing portion that presses the end surface of the object to be conveyed and is held by the hand base; a driving source that rotates the pressing member; a bearing that rotatably supports the pressing member; and a sealing member that prevents liquid from entering the base of the hand;
The pressing member includes a rotation shaft serving as a rotation center of the pressing member, and a first lever portion extending radially outward of the rotation shaft from the rotation shaft,
The first lever portion is arranged outside the hand base portion,
The pressing portion is connected to the tip portion of the first lever portion,
The bearing rotatably supports the rotating shaft,
The hand according to claim 1, wherein the seal member is arranged on the outer peripheral side of the rotating shaft and is in close contact with the outer peripheral surface of the rotating shaft. 前記押付部は、前記第１レバー部に回転可能に保持されるローラであることを特徴とする請求項１記載のハンド。 2. A hand according to claim 1, wherein said pressing portion is a roller rotatably held by said first lever portion. 前記押付部材は、前記回動軸の径方向の外側に向かって前記回動軸から伸びる第２レバー部を備え、
前記第２レバー部は、前記ハンド基部の内部に配置され、
前記第２レバー部の先端部は、前記駆動源に連結されていることを特徴とする請求項１または２記載のハンド。 The pressing member includes a second lever portion extending radially outwardly of the rotating shaft from the rotating shaft,
The second lever portion is arranged inside the hand base,
3. The hand according to claim 1, wherein the tip of said second lever is connected to said drive source. 上下方向から見たときの前記押付部材の形状は、Ｌ形状となっていることを特徴とする請求項３記載のハンド。 4. The hand according to claim 3, wherein the shape of said pressing member when viewed from above and below is L-shaped. 請求項１から４のいずれかに記載のハンドと、前記ハンドが連結されるアームと、前記アームが連結される本体部とを備えることを特徴とする産業用ロボット。 An industrial robot comprising: the hand according to any one of claims 1 to 4; an arm to which the hand is connected; and a main body to which the arm is connected.
JP2022022631A 2022-02-17 2022-02-17 Hand of industrial robot and industrial robot Pending JP2023119658A (en)

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JP2022022631A JP2023119658A (en) 2022-02-17 2022-02-17 Hand of industrial robot and industrial robot
KR1020230001555A KR20230123874A (en) 2022-02-17 2023-01-05 Hand of industrial robot and industrial robot
CN202310134694.7A CN116604537A (en) 2022-02-17 2023-02-17 Industrial robot manipulator and industrial robot

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JP6607661B2 (en) 2013-08-09 2019-11-20 日本電産サンキョー株式会社 Horizontal articulated robot

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