CN116604537A - Industrial robot manipulator and industrial robot - Google Patents
Industrial robot manipulator and industrial robot Download PDFInfo
- Publication number
- CN116604537A CN116604537A CN202310134694.7A CN202310134694A CN116604537A CN 116604537 A CN116604537 A CN 116604537A CN 202310134694 A CN202310134694 A CN 202310134694A CN 116604537 A CN116604537 A CN 116604537A
- Authority
- CN
- China
- Prior art keywords
- robot
- base
- manipulator
- rotation shaft
- pressing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 claims abstract description 59
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 21
- 230000035515 penetration Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 description 15
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0095—Gripping heads and other end effectors with an external support, i.e. a support which does not belong to the manipulator or the object to be gripped, e.g. for maintaining the gripping head in an accurate position, guiding it or preventing vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0009—Constructional details, e.g. manipulator supports, bases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a manipulator of an industrial robot, comprising: a carrying part for carrying the conveying object; a robot base portion that forms a base end side portion of the robot and fixes a base end side of the mounting portion; and a holding mechanism for holding the transport object mounted on the mounting portion at a fixed position in the horizontal direction, wherein the amount of wear of the sealing member for preventing the penetration of the liquid into the interior of the robot base can be reduced as compared with the conventional one. A pressing member (17) having a pressing portion (16) that contacts an end surface of a conveyance object (2) and presses the end surface of the conveyance object (2) against an abutment surface of an end surface abutment member in a robot arm (3) includes: a rotation shaft which becomes the rotation center of the pressing member (17); and a first rod portion (23) extending from the rotation shaft toward the radial outside of the rotation shaft. In the manipulator (3), a pressing part (16) is connected with the front end part of a first rod part (23) arranged outside a manipulator base part (12).
Description
Technical Field
The present invention relates to a manipulator of an industrial robot used for transporting an object to be transported. The present invention also relates to an industrial robot including the manipulator.
Background
Conventionally, a horizontal articulated industrial robot for conveying a semiconductor wafer is known (for example, see patent document 1). The industrial robot described in patent document 1 includes: a robot for mounting a semiconductor wafer; a robot arm rotatably connecting the robot arm to the front end side; and a main body portion rotatably connecting the base end side of the robot arm. The manipulator includes: a mounting unit for mounting a semiconductor wafer; a robot base constituting a base end side portion of the robot; and a holding mechanism for holding the semiconductor wafer mounted on the mounting portion at a predetermined position in the horizontal direction. The base end side of the mounting portion is fixed to the robot base. The robot base is rotatably coupled to the front end side of the robot arm.
In the industrial robot described in patent document 1, the holding mechanism includes: an end surface contact member having an contact surface that contacts an end surface of the semiconductor wafer; a pressing member that contacts an end surface of the semiconductor wafer and presses the end surface of the semiconductor wafer against an abutment surface of the end surface abutment member; and an air cylinder that linearly moves the pressing member. The cylinder is accommodated in the hollow manipulator base. The base end of the pressing member is coupled to the cylinder and is housed inside the robot base. The front end side portion of the pressing member is disposed outside the robot base, and the front end of the pressing member can be brought into contact with the end face of the semiconductor wafer. An opening through which the pressing member is inserted is formed in the robot base.
[ Prior Art literature ]
[ patent literature ]
Patent document 1: japanese patent application laid-open No. 2015-36186
Disclosure of Invention
In the industrial robot described in patent document 1, for example, when a semiconductor wafer subjected to a predetermined process using a liquid is transported, the liquid remaining on the semiconductor wafer may be immersed into the interior of the robot base through the opening of the robot base. In addition, if the liquid is immersed in the inside of the robot base, there is a possibility that the cylinder or the like housed in the inside of the robot base may be corroded. In order to prevent the liquid from entering the inside of the robot base, a seal member may be disposed in the opening of the robot base, and the inner peripheral surface of the seal member may be brought into close contact with the outer peripheral surface of the linearly movable pressing member.
However, if the sealing member is disposed in the opening of the robot base and brought into close contact with the outer peripheral surface of the pressing member, the pressing member moves linearly by the stroke amount of the pressing member in a state where the outer peripheral surface of the pressing member is in contact with the inner peripheral surface of the sealing member with a high contact pressure every time the holding mechanism holds the semiconductor wafer and every time the semiconductor wafer held by the holding mechanism is released, and therefore there is a possibility that the wear of the sealing member increases and the lifetime of the sealing member becomes shorter.
Accordingly, an object of the present invention is to provide a manipulator for an industrial robot, comprising: a carrying part for carrying the conveying object; a robot base portion that forms a base end side portion of the robot and fixes a base end side of the mounting portion; and a holding mechanism for holding the transport object mounted on the mounting portion at a fixed position in the horizontal direction, wherein the amount of wear of the sealing member for preventing the penetration of the liquid into the interior of the robot base can be reduced as compared with the conventional one. The present invention also provides an industrial robot including the manipulator.
In order to solve the above problems, the present invention provides an industrial robot hand for transporting 5 objects to be transported, comprising: a carrying part for carrying the conveying object; a robot base that forms a base end side portion of the robot and fixes a base end side of the mounting portion; and a holding mechanism for holding the conveying object mounted on the mounting part at a certain position in the horizontal direction, wherein the holding mechanism comprises: an end surface contact member having a contact surface that contacts an end surface of the conveyance object and mounted on a front end side of the mounting portion; a pressing member that has a pressing portion that contacts an end surface of the conveyance object and presses the end surface of the conveyance object against the contact surface, and is held by the robot base; a drive source which is housed inside the robot base and rotates the pressing member with respect to the robot base in an up-down direction as an axial direction of rotation; a bearing rotatably supporting the pressing member; and a sealing member for preventing liquid from being immersed into the interior of the manipulator base, the pressing member including: a rotation shaft serving as a rotation center of the pressing member; and a first lever portion extending from the rotation shaft toward a radial outside of the rotation shaft, the first lever portion being disposed outside of the robot base portion, the pressing portion being connected to a tip end portion of the first lever portion, the bearing rotatably supporting the rotation shaft, the sealing member being disposed on an outer peripheral side of the rotation shaft and in close contact with an outer peripheral surface of the rotation shaft.
In the manipulator of the industrial robot according to the present invention, the pressing member having the pressing portion that contacts the end surface of the object to be conveyed and presses the end surface of the object to be conveyed against the contact surface of the end surface contact member includes: a rotation shaft serving as a rotation center of the pressing member; and a first lever portion extending from the rotation shaft toward a radial outside of the rotation shaft. In the present invention, the pressing portion is connected to the distal end portion of the first lever portion disposed outside the robot base.
Therefore, in the present invention, even if the rotation angle of the rotation shaft is reduced, the movement amount of the pressing portion for holding the conveyance object by the holding mechanism or releasing the conveyance object held by the holding mechanism can be ensured. Therefore, in the present invention, the amount of movement of the pressing portion for holding the conveyance object by the holding mechanism or releasing the conveyance object held by the holding mechanism can be ensured, and the rotation angle of the rotation shaft that rotates in a state where the outer peripheral surface of the rotation shaft is in contact with the inner peripheral surface of the sealing member with high contact pressure can be reduced. As a result, in the present invention, the amount of wear of the seal member can be reduced as compared with the conventional one.
In the present invention, for example, the pressing portion is a roller rotatably held on the first lever portion. In the present invention, for example, the pressing member includes a second lever portion extending from the rotation shaft toward the radial outside of the rotation shaft, the second lever portion is disposed inside the robot base portion, and the tip end portion of the second lever portion is coupled to the drive source. In this case, for example, the shape of the pressing member when viewed from the up-down direction is an L shape.
The manipulator of the present invention can be used for an industrial robot including a manipulator coupled to the manipulator and a body coupled to the manipulator. In this industrial robot, the amount of wear of the seal member for preventing the penetration of the liquid into the interior of the manipulator base can be reduced as compared with the conventional one.
As described above, in the present invention, in the robot arm of the industrial robot including the mounting portion for mounting the transport object, the robot arm base portion that forms the base end side portion of the robot arm and fixes the base end side of the mounting portion, the holding mechanism for holding the transport object mounted on the mounting portion at a predetermined position in the horizontal direction, the amount of wear of the seal member for preventing the liquid from entering into the inside of the robot arm base portion can be reduced as compared with the conventional one.
Drawings
Fig. 1 is a plan view of an industrial robot according to an embodiment of the present invention.
Fig. 2 is an enlarged view for explaining the structure of the E section in fig. 1.
Fig. 3 is a sectional view for explaining the structure of the F-F section of fig. 2.
(symbol description)
1 robot (Industrial robot)
2 wafer (semiconductor wafer, object to be transported)
3 mechanical arm
4 mechanical arm
5 main body part
11 mounting part
12 manipulator base
13 holding mechanism
15 end face abutting part
15a contact surface
16 roller (pressing part)
17 pressing member
19 air cylinder (Driving source)
20 bearing
21 seal member
22 rotation shaft
23 first shaft portion
24 second shaft portion
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(outline structure of Industrial robot)
Fig. 1 is a plan view of an industrial robot 1 according to an embodiment of the present invention.
The industrial robot 1 (hereinafter referred to as "robot 1") according to the present embodiment is a horizontal articulated robot for conveying a semiconductor wafer 2 (hereinafter referred to as "wafer 2") as a conveying target. The wafer 2 is formed in a disk shape. The robot 1 is assembled into a semiconductor manufacturing system for use. In the present embodiment, a predetermined process using a liquid is performed on the wafer 2, and the robot 1 conveys the processed wafer 2.
The robot 1 includes: a robot arm 3 for mounting the wafer 2; a robot arm 4, wherein the robot arm 3 is rotatably coupled to a distal end side of the robot arm 4, and the robot arm 4 moves in a horizontal direction; and a main body 5, wherein the base end side of the robot arm 4 is rotatably coupled to the main body 5. The robot arm 4 includes an arm portion 7 whose base end side is rotatably coupled to the main body portion 5, an arm portion 8 whose base end side is rotatably coupled to a tip end side of the arm portion 7, and an arm portion 9 whose base end side is rotatably coupled to a tip end side of the arm portion 8.
The arm portions 7 to 9 are rotated in the vertical direction as the axial direction of rotation. The body 5 includes a columnar member rotatably coupled to the base end side of the arm 7, and a lifting mechanism for lifting and lowering the columnar member together with the robot arm 4. The base end side of the arm portion 7 is rotatably coupled to the upper end portion of the columnar member. The body 5, the arm 7, the arm 8, and the arm 9 are arranged in this order from the lower side in the up-down direction. The robot 1 further includes: an arm driving mechanism for rotating the arms 7 and 8 to extend and retract a part of the robot arm 4 composed of the arms 7 and 8; an arm driving mechanism for rotating the arm 9; and a robot driving mechanism for rotating the robot 3.
The robot 3 is formed in a substantially Y-shape when viewed from the up-down direction, and the front end side of the robot 3 is divided into two. The robot arm 3 is rotatably coupled to the distal end side of the arm 9. The robot arm 3 is disposed above the arm 9. The robot 3 rotates in the vertical direction as the axial direction of rotation. The robot arm 3 includes: a mounting unit 11 for mounting the wafer 2; a robot base 12 constituting a base end side portion of the robot 3; and a holding mechanism 13 for holding the wafer 2 mounted on the mounting portion 11 at a predetermined position in the horizontal direction.
The robot base 12 is rotatably coupled to the distal end side of the arm 9. The base end side of the mounting portion 11 is fixed to the robot base 12. The mounting portion 11 is formed in a flat plate shape. The mounting portion 11 is disposed such that the thickness direction of the mounting portion 11 coincides with the up-down direction. The robot base 12 is formed in a flat block shape having a relatively small thickness in the up-down direction. The robot base 12 is formed in a hollow shape. The holding mechanism 13 is an edge-grip type holding mechanism that contacts the end surface (outer peripheral surface) of the wafer 2 mounted on the mounting portion 11 from three directions to hold the wafer 2 mounted on the mounting portion 11 at a fixed position in the horizontal direction. The structure of the holding mechanism 13 will be described below.
(Structure of holding mechanism)
Fig. 2 is an enlarged view for explaining the structure of the E section in fig. 1. Fig. 3 is a sectional view for explaining the structure of the F-F section of fig. 2.
The holding mechanism 13 includes: an end surface contact member 15 having an contact surface 15a that contacts the end surface of the wafer 2; and a pressing member 17 having a roller 16 as a pressing portion, the roller 16 being in contact with the end surface of the wafer 2 to press the end surface of the wafer 2 against the contact surface 15a of the end surface contact member 15. The end surface contact member 15 is attached to the front end side of the mounting portion 11. Specifically, the end surface contact member 15 is fixed to two portions of the front end portion of the manipulator 3 having a substantially Y shape. The end surface contact member 15 is fixed to the upper surface of the mounting portion 11. Two wafer mounting members 18 for mounting the wafer 2 are fixed to the upper surface of the base end side of the mounting portion 11, and the wafer 2 is mounted on the end surface contact member 15 and the wafer mounting member 18.
The pressing member 17 is rotatably held on the manipulator base 12. Specifically, the pressing member 17 is rotatably held by the hand base 12 in an axial direction that is rotatable in the up-down direction with respect to the hand base 12. The holding mechanism 13 further includes: a cylinder 19 as a driving source for rotating the pressing member 17 with respect to the robot base 12 in an axial direction in which the vertical direction is a rotation; a bearing 20 rotatably supporting the pressing member 17; and a seal member 21 for preventing liquid from entering the inside of the robot base 12.
The pressing member 17 includes: a rotation shaft 22 serving as a rotation center of the pressing member 17; a first rod portion 23 and a second rod portion 24 extending from the rotation shaft 22 toward the radial outside of the rotation shaft 22. The rotation shaft 22 is disposed such that the axial direction of the rotation shaft 22 coincides with the up-down direction. The rotation shaft 22 is inserted into an insertion hole 12a formed in the upper surface side of the front end portion of the robot base 12.
The first and second lever portions 23 and 24 are formed in a flat plate shape having an elongated oblong shape when viewed from the vertical direction. The base end portion of the first lever portion 23 is connected to the upper end of the rotation shaft 22. The base end portion of the second lever portion 24 is connected to the lower end of the rotation shaft 22. The first lever portion 23 and the second lever portion 24 extend from the rotation shaft 22 in mutually different directions when viewed from the up-down direction, and the pressing member 17 has an L-shape when viewed from the up-down direction.
The first lever portion 23 is disposed outside the robot base 12. The roller 16 is connected to the front end portion of the first lever portion 23. The roller 16 is rotatably held by the first lever portion 23. Specifically, the roller 16 is rotatably held on a fixed shaft 25 fixed to the front end portion of the first lever portion 23, and is rotatably held on the first lever portion 23 by the fixed shaft 25. The fixed shaft 25 is disposed such that the axial direction of the fixed shaft 25 coincides with the up-down direction. The roller 16 is rotatable in an axial direction in which the first lever portion 23 rotates in the up-down direction.
The second lever 24 is disposed inside the robot base 12. That is, the second lever 24 is housed inside the robot base 12. The cylinder 19 is housed inside the robot base 12. The tip end of the second rod 24 is coupled to the cylinder 19. Specifically, the distal end portion of the second rod portion 24 is rotatably coupled to a coupling member 26 fixed to the distal end of the rod of the cylinder 19. The distal end portion of the second lever portion 24 is rotatable with respect to the coupling member 26 in an axial direction that is a vertical direction. The main body of the cylinder 19 is rotatably attached to the robot base 12 in an axial direction that is a vertical direction with respect to the robot base 12.
The bearing 20 is a rolling bearing such as a ball bearing. The bearing 20 is disposed in the insertion hole 12a of the robot base 12. The bearing 20 rotatably supports a rotation shaft 22. An outer ring of the bearing 20 is fixed to an inner peripheral side of the insertion hole 12a, and an inner ring of the bearing 20 is fixed to an outer peripheral surface of the rotation shaft 22. The bearing 20 may be a sliding bearing.
The seal member 21 is formed in an annular shape. The seal member 21 is disposed in the insertion hole 12a of the robot base 12. The seal member 21 is disposed above the bearing 20. The seal member 21 is disposed on the outer peripheral side of the rotation shaft 22. That is, the rotation shaft 22 is disposed on the inner peripheral side of the seal member 21. The seal member 21 is in close contact with the outer peripheral surface of the rotation shaft 22. Specifically, the inner peripheral surface of the seal member 21 is in close contact with the outer peripheral surface of the rotating shaft 22.
In the holding mechanism 13 configured as described above, the air cylinder 19 rotates the pressing member 17 about the rotation shaft 22 between a wafer holding position (a position shown by a two-dot chain line in fig. 2) in which the roller 16 contacts the end surface of the wafer 2 and presses the end surface of the wafer 2 against the contact surface 15a of the end surface contact member 15, and a retracted position (a position shown by a solid line in fig. 2) in which the roller 16 is retracted so as to be away from the end surface of the wafer 2.
(main effects of the present embodiment)
As described above, in the present embodiment, the pressing member 17 having the roller 16 that contacts the end surface of the wafer 2 and presses the end surface of the wafer 2 against the contact surface 15a of the end surface contact member 15 includes: a rotation shaft 22 serving as a rotation center of the pressing member 17, and a first lever portion 23 extending from the rotation shaft 22 toward the radial outside of the rotation shaft 22. In the present embodiment, the roller 16 is connected to the tip end portion of the first lever portion 23 disposed outside the robot base 12. Therefore, in the present embodiment, even if the rotation angle of the rotation shaft 22 is reduced, the movement amount of the roller 16 for holding the wafer 2 by the holding mechanism 13 or releasing the wafer 2 held by the holding mechanism 13 can be ensured.
That is, in the present embodiment, since the roller 16 is connected to the tip end portion of the first lever portion 23 that rotates around the rotation shaft 22, even if the rotation angle of the rotation shaft 22 is reduced, the roller 16 can be moved between the position shown by the two-dot chain line in fig. 2 and the position shown by the solid line in fig. 2. Therefore, in the present embodiment, the movement amount of the roller 16 for holding the wafer 2 by the holding mechanism 13 or releasing the wafer 2 held by the holding mechanism 13 can be ensured, and the rotation angle of the rotation shaft 22 that rotates in a state where the outer peripheral surface of the rotation shaft 22 is in contact with the inner peripheral surface of the sealing member 21 with high contact pressure can be reduced. As a result, in the present embodiment, the amount of wear of the seal member 21 can be reduced.
(other embodiments)
The above-described embodiments are examples of preferred embodiments of the present invention, but the present invention is not limited thereto, and various modifications and changes can be made without changing the gist of the present invention.
In the above embodiment, the holding mechanism 13 may be provided with a driving source such as a motor for rotating the pressing member 17 with respect to the hand base 12, instead of the cylinder 19. In the case where the holding mechanism 13 includes a motor as a driving source, the motor may directly rotate the rotation shaft 22, for example. In this case, the pressing member 17 may not include the second lever portion 24. In the above embodiment, the roller 16 may not rotate with respect to the first lever portion 23. In the above embodiment, the pressing member 17 may be provided with a pressing portion other than the roller 16.
In the above embodiment, the robot 1 may include two manipulators 3 rotatably coupled to the distal end side of the manipulator 4. In the above embodiment, the robot arm 4 may be constituted by two arm portions or four or more arm portions. In the above embodiment, the object to be transported by the robot 1 may be an object other than the wafer 2. In this case, for example, the conveyance object may be formed in a square or rectangular flat plate shape.
The industrial robot to which the present invention is applied may be a robot other than a horizontal articulated industrial robot. For example, the industrial robot to which the present invention is applied may be an industrial robot including a robot arm in which the robot arm 3 is coupled so that the robot arm 3 can reciprocate linearly, a main body portion in which the robot arm is coupled so as to be rotatable, and a linear driving portion in which the robot arm 3 reciprocates linearly with respect to the robot arm.
Claims (5)
1. A manipulator for an industrial robot for transporting an object to be transported, characterized in that,
comprising the following steps: a mounting unit for mounting the conveyance object; a robot base that constitutes a base end side portion of the robot and fixes a base end side of the mounting portion; and a holding mechanism for holding the transport object mounted on the mounting portion at a fixed position in a horizontal direction,
the holding mechanism includes: an end surface contact member having a contact surface that contacts an end surface of the conveyance object, and mounted on a front end side of the mounting portion; a pressing member that has a pressing portion that contacts an end surface of the conveyance object and presses the end surface of the conveyance object against the contact surface, and is held by the robot base; a drive source which is housed inside the manipulator base and rotates the pressing member with respect to the manipulator base in an up-down direction as an axial direction of rotation; a bearing rotatably supporting the pressing member; and a sealing member for preventing liquid from being immersed into the manipulator base,
the pressing member includes: a rotation shaft serving as a rotation center of the pressing member; and a first lever portion extending from the rotation shaft toward a radially outer side of the rotation shaft,
the first lever portion is disposed outside the robot base portion,
the pressing part is connected with the front end part of the first rod part,
the bearing rotatably supports the rotation shaft,
the seal member is disposed on the outer peripheral side of the rotating shaft and is in close contact with the outer peripheral surface of the rotating shaft.
2. The manipulator according to claim 1, wherein the manipulator comprises a manipulator arm,
the pressing portion is a roller rotatably held on the first lever portion.
3. The manipulator according to claim 1 or 2, wherein,
the pressing member includes a second lever portion extending from the rotation shaft toward a radially outer side of the rotation shaft,
the second lever portion is disposed inside the robot base portion,
the distal end portion of the second lever portion is coupled to the driving source.
4. The manipulator according to claim 3, wherein,
the pressing member has an L-shape when viewed from the vertical direction.
5. An industrial robot, comprising:
the manipulator of any one of claims 1 to 4;
a robot arm connected to the robot arm; and
and a main body connected to the robot arm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022022631A JP2023119658A (en) | 2022-02-17 | 2022-02-17 | Hand of industrial robot and industrial robot |
| JP2022-022631 | 2022-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116604537A true CN116604537A (en) | 2023-08-18 |
Family
ID=87684242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310134694.7A Pending CN116604537A (en) | 2022-02-17 | 2023-02-17 | Industrial robot manipulator and industrial robot |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2023119658A (en) |
| KR (1) | KR20230123874A (en) |
| CN (1) | CN116604537A (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6374156B2 (en) | 2013-08-09 | 2018-08-15 | 日本電産サンキョー株式会社 | Horizontal articulated robot and method of manufacturing horizontal articulated robot |
-
2022
- 2022-02-17 JP JP2022022631A patent/JP2023119658A/en active Pending
-
2023
- 2023-01-05 KR KR1020230001555A patent/KR20230123874A/en not_active Application Discontinuation
- 2023-02-17 CN CN202310134694.7A patent/CN116604537A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023119658A (en) | 2023-08-29 |
| KR20230123874A (en) | 2023-08-24 |
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