JP2023118688A - curved wafer stage - Google Patents

Abstract

To provide an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target.SOLUTION: In an apparatus 1, a wafer chuck includes a rotationally mounted curved shell 122 on which the arrangement of semiconductor dies 2A are arranged. A wafer stage further includes a first motor for rotating the curved shell around a rotational axis. The curved configuration allows for an improved throughput of the wafer stage. A film frame carrier 3 to be used with the wafer stage includes a ring-shaped body with an asymmetric bending stiffness. The asymmetric bending stiffness allows the ring-shaped body to be bent such that the mounting surface of the ring-shaped body changes from a first shape to a second more concave shape, and prevents or limits the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape.SELECTED DRAWING: Figure 1A

Description

Aspects of the present disclosure relate to apparatus for transferring semiconductor dies from an array of semiconductor dies to a target. A further aspect of the present disclosure relates to wafer stages used in such apparatus.

Apparatuses for transferring semiconductor die from a diced semiconductor wafer to a target are known in the art. For example, U.S. Pat. No. 6,200,009 discloses an apparatus that includes a wafer stage having a wafer chuck on which a diced semiconductor wafer can be placed, and a target stage having a target chuck on which a target can be placed. Both the wafer stage and the target stage include one or more motors for changing the mutual position between the diced semiconductor wafer on the wafer chuck and the target on the target chuck. The apparatus further includes a release unit in the form of a needle for releasing the semiconductor die from the diced semiconductor wafer. The release unit, wafer stage and target stage are controlled using a controller.

In known systems, a diced semiconductor wafer is brought close to a target, which may be a printed circuit board, for example. When the semiconductor die on the semiconductor wafer is aligned with its intended location on the target, the needle is aligned with the semiconductor die. The needle then pushes the semiconductor die away from the semiconductor wafer for transfer onto the target.

The above die transfer is called direct die transfer. More specifically, the die is transferred from the diced semiconductor wafer onto the target without being placed or supported between releasing the die and placing the die on the target.

An important figure of merit for devices of the type described above is the number of semiconductor dies that can be transferred per unit of time. This time is often limited by positioning the semiconductor wafer relative to the target.

US Patent Application Publication No. 2017-140959

One aspect of the present disclosure relates to providing an apparatus for transferring semiconductor dies from an array of semiconductor dies to a target using different methods by which the array of semiconductor dies is positioned relative to the target. According to one aspect of the present disclosure, this different method of positioning may allow achieving a reduction in the time required to transfer the semiconductor die onto the target.

According to one aspect of the present disclosure, a wafer chuck of an apparatus includes a curved shell in which an array of semiconductor dies is positioned and rotatably mounted. Additionally, the wafer stage includes a first motor for rotating the curved shell about the axis of rotation.

The apparatus disclosed in U.S. Pat. No. 5,800,002 includes a linear XY stage that uses linear motors configured to displace a semiconductor wafer in the x and y directions. The acceleration obtainable by such wafer stages is limited by motor topology and power consumption. To improve the performance of these wafer stages, eg, increase positioning speed, a moving coil topology is required. However, this presents the associated problem of cooling the moving coil to improve power consumption capability.

According to one aspect of the present disclosure, the acceleration limited problem with linear motors is mitigated using a rotatably mounted curved shell in which an array of semiconductor dies can be placed. The shell is part of the wafer stage and is actuated using a first motor configured to rotate the curved shell about an axis of rotation.

Motors for providing rotary motion provide higher force or torque per unit heat dissipated and/or higher force/torque per unit power and per unit weight of the magnets used. This means that for a given mass and power level, higher accelerations can be achieved than linear magnet motors.

The apparatus is preferably configured to directly transfer a semiconductor die from an array of semiconductor dies onto a target. The release unit may be configured to release the semiconductor die from the array of semiconductor dies and drop them onto the target. In this case, the release unit is not engaged with the semiconductor die at the moment the semiconductor die reaches the desired position on the target. In other embodiments, an auxiliary unit may be used to guide the released semiconductor die to the target. For example, a jet of compressed air may be used to push the released semiconductor die toward the target. In such cases, the semiconductor die may be displaced toward the target against the earth's gravity.

A wafer chuck may be configured to support a carrier carrying an array of semiconductor dies. For example, the carrier can be tape, film or foil. Additionally, the carrier may be part of a film frame carrier.

The array of semiconductor dies may consist of a diced semiconductor wafer or a structured semiconductor wafer. A structured semiconductor wafer may include a plurality of semiconductor dies arranged in a pattern different from the pattern arranged prior to dicing the semiconductor wafer from which the dies originate. Alternatively, a structured semiconductor wafer may include multiple semiconductor dies from different semiconductor wafers. In such cases, the semiconductor dies are individually placed on a carrier such as a film, foil or tape.

The axis of rotation preferably extends at least substantially parallel to the target chuck. In this way, assuming that the next semiconductor die needs to be released at the same position as the previous semiconductor die, the position of the release unit will change when the curved shell is rotated to align the next semiconductor die with the release unit. can be kept constant. Note that the target is typically moved when the next semiconductor die is released. Furthermore, the axis of rotation may coincide with the axis of longitudinal symmetry of the curved shell.

The wafer stage may further include a second motor for translating the curved shell back and forth along directions that are preferably parallel and/or coincident with the axis of rotation. The wafer stage may further include another second motor for vertically translating the curved shell relative to the direction imparted by the second motor. For example, the second motor and the another second motor can cooperate to translate the curved shell in the same XY plane as the target table of the target stage is translated.

The wafer stage may further include an auxiliary second motor for translating the curved shell back and forth along a direction perpendicular to the axis of rotation, preferably perpendicular to the target chuck. For example, an auxiliary second motor may be configured to vertically displace the curved shell to ensure or maintain a particular vertical spacing between the released semiconductor die and the target. If such spacing is too small, the target and semiconductor die may contact during movement of the target and/or curved shell. If the spacing becomes too large, variations in the position and/or orientation of the semiconductor die on the target may become unacceptable.

Additionally or alternatively, the apparatus further includes a fixed frame and a first carriage, wherein the second motor and/or the auxiliary second motor translates the first carriage relative to the fixed frame. and the first motor is configured to rotate the curved shell relative to the first carriage. In this case the rotation and translation of the curved shell are stacked. In other embodiments, the second and/or auxiliary motors are configured to translate the curved shell relative to the fixed frame and the first motor rotates the curved shell relative to the fixed frame. configured as In this case, rotation and translation are performed independently of each other with respect to the fixed frame.

The curved shell may be at least partially translucent to light having the first wavelength. In this case the release unit may comprise a light source such as a laser for outputting a beam of light having said wavelength. An array of semiconductor dies can be attached to a tape, foil, or film using a light absorbing agent such as a photosensitive adhesive. The light absorber may be configured to at least locally release adhesion to the array of semiconductor dies when illuminated by light having the wavelength described above. For example, the light absorber may be configured to release its attachment at least locally as a result of absorbing light, by photoablation and/or by subjecting the light absorber to a chemical reaction. The light source may be configured to illuminate a given semiconductor die of an array of semiconductor dies distinct from semiconductor dies adjacent to the given semiconductor die. For example, the light source may be configured to illuminate one semiconductor die of the array of semiconductor dies at a time. However, the release unit may also comprise a beam splitter configured to receive the beam of light from the light source and split said received beam into a plurality of further beams, each further beam having a respective given It is configured to illuminate a semiconductor die.

The light source may be configured to emit light towards the curved shell, preferably substantially perpendicular. The light sources are then preferably arranged inside and/or above or below the curved shell. Alternatively, the light source can be configured to emit light in a direction substantially parallel to the axis of rotation. In this case, the release unit may further include a light guide unit. The light source may be configured to emit light towards the light guide unit, preferably substantially parallel to the axis of rotation, the light guide unit directing light from the light source towards the curved shell, preferably substantially perpendicular. can be configured to guide In this case, the light sources may be arranged outside the curved shell and/or next to the curved shell.

The light directing unit may include one or more mirrors and/or one or more prisms. Furthermore, the light directing unit may comprise one or more actuators, preferably controllable by the controller, one or more actuators directing the light from the light source to the curved shell at different angles. It is configured to redirect one or more mirrors and/or one or more prisms with respect to incident light. In this way, the location at which light from the light source strikes the curved shell can be changed without the curved shell changing its position along its axis of longitudinal symmetry. The light guiding unit may be MEMS-based, for example. For example, MEMS-based mirrors are relatively lightweight and allow fast switching between adjacent dies being transferred.

Instead of using light, the release unit engages an engagement element, such as a needle, to engage and disengage the array of semiconductor dies to release the semiconductor dies from the array of semiconductor dies. and an actuator for moving the element. The engagement element is typically arranged inside and/or above or below the curved shell.

As described above, in order to completely deplete the array of semiconductor dies, it is necessary to change the position at which the release unit releases the semiconductor dies from the array of semiconductor dies. To this end, the release unit may include a second carriage fitted with a light source or actuator and needle combination, and a third motor for moving the second carriage relative to the curved shell. good. In this case, movement of the second carriage and movement of the curved shell are superimposed. Furthermore, typically the third motor only displaces the second carriage relative to the curved shell along and/or parallel to the longitudinal axis of symmetry of the curved shell. Alternatively, the release unit may include a second carriage on which a light source or actuator and needle combination is mounted and a third motor for moving the second carriage relative to the fixed frame. Therefore, in this case the movement of the second carriage and the movement of the curved shell are independent of each other. In both cases, the second carriage may be configured to translate inside and/or above or below the curved shell. Further, when the release unit includes the light source and light guide unit described above, the light source may be fixed to the fixed frame and the light guide unit may be attached to the second carriage.

The target stage preferably has a fourth motor and/or a fifth motor for translating the target chuck in a plane parallel to the axis of rotation and/or the target chuck in a direction perpendicular to the axis of rotation. may further include an auxiliary fourth motor for translating back and forth along a direction perpendicular to the target chuck. A fourth motor and/or a fifth motor may be arranged to translate the target chuck relative to the fixed frame. Alternatively, movements in two mutually orthogonal directions can be stacked. For example, a fourth motor may displace the third carriage relative to the fixed frame, and a fifth motor may displace the target chuck relative to the third carriage.

The curved shell may be provided with a bonding unit for enabling the array of semiconductor dies to be bonded to the curved shell. For example, the curved shell may be provided with multiple openings. In this case, the apparatus may further include a vacuum unit for generating a suction force applied to the array of semiconductor dies through the plurality of openings. Alternatively or additionally, the curved shell may be provided with a mechanical coupling unit for mechanically coupling the array of semiconductor dies. The array of semiconductor dies is preferably carried by a film frame carrier. In this case the mechanical coupling unit preferably comprises a clamping unit for clamping the film frame carrier onto the curved shell.

The curved shell can be a cylindrical shell, such as a drum, or a partially cylindrical shell. For example, the shell can be a 1/n cylindrical shell. When n=2, the shell corresponds to a semi-cylindrical shell. When n=1, the shell corresponds to a cylindrical shell such as a drum. However, aspects of the present disclosure equally relate to curved shells whose cross-sections perpendicular to the axis of rotation and/or longitudinal symmetry are not circular or partially circular. In these cases, it is preferable to translate the curved shell and target relative to each other to maintain a substantially constant spacing between the target and the next released semiconductor die.

Having a curved shell in which the array of dies is arranged provides the possibility of mounting the inspection system close to the location where the semiconductor dies are released. For example, the apparatus may include a first inspection system arranged to inspect semiconductor dies from the array of semiconductor dies prior to placement on the target. A first inspection system may be arranged to determine a position and/or orientation of the semiconductor die of the array of semiconductor dies, the controller controlling the wafer stage, target stage, and/or orientation in response to the determined position and/or orientation. and/or configured to control the release unit. When bonding an array of semiconductor dies to a curved shell, the position and/or orientation of the semiconductor dies may be altered, for example, by wrinkling or other distortion of the carrier in which the semiconductor dies are placed. The first inspection system may record the position and/or orientation of the semiconductor die, preferably with respect to the curved shell and/or with respect to the ideal position and/or orientation of the semiconductor die. This recorded position can then be used to perform corrections before releasing the die. For example, if the die is shifted along the axis of rotation relative to its ideal position, the curved shell may be translated slightly in other directions before the release unit releases the semiconductor die. In this case, there is no need to change the position of the release unit. In other embodiments, the target is displaced with the release unit while keeping the curved shell in the same position. In a still further embodiment, the release unit, target and curved shell are all moved.

The first inspection system may additionally or alternatively be arranged to determine whether a semiconductor die of the array of semiconductor dies is damaged. In this case, the controller is configured to control the wafer stage, the target stage and/or the release unit to prevent the semiconductor die from being placed on the target if it is determined that the semiconductor die is damaged. obtain. In this way, damaged semiconductor dies can be skipped.

The apparatus may further include a second inspection system arranged to determine whether the semiconductor die has been released from the array of semiconductor dies. And the controller may be configured to control a wafer stage, a target stage and/or a release unit to release the semiconductor die if it is determined that the semiconductor die has not been released. In this way, the release unit may attempt to release the semiconductor die again.

Alternatively or additionally, the apparatus may further include a third inspection system arranged to check whether the semiconductor die is properly placed on the target. In this case, the controller may be configured to store the position of the semiconductor die and/or the intended position of the semiconductor die on the target. At a later stage, the semiconductor die can be removed from the target at this location.

The first, second and/or third inspection systems may include cameras, and the same camera is preferably used for two or more of the first, second and third inspection systems. The cameras of the first, second and/or third inspection system may be movably mounted with respect to the fixed frame. For example, the camera can be configured to move along the longitudinal axis of symmetry of the curved shell.

The release unit may be configured to release the semiconductor die arranged in the release position with respect to the fixed frame from the array of semiconductor dies. The array of semiconductor dies may include a plurality of semiconductor dies arranged in a matrix of rows and columns, with the rows extending at least substantially parallel to the axis of rotation.

The target may include adjacently arranged columns or rows of placement locations on which respective semiconductor dies from the array of semiconductor dies are placed, the adjacently arranged columns or rows of placement locations each comprising: It extends at least approximately perpendicular or parallel to the axis of rotation. An example of such a target can be a carrier tape containing multiple cavities in which semiconductor dies are arranged. In this case, the controller controls the wafer stage to intermittently or continuously rotate the curved shell to place the semiconductor dies in the same row of the array of semiconductor dies on the respective placement positions of the target, and After exhausting a row of the semiconductor die array of dies, the curved shell may be configured to translate and shift to an adjacent row of semiconductor dies of the semiconductor die array. Further, the controller may be configured to maintain a release position relative to the fixed frame during translation of the curved shell to shift to an adjacent row of semiconductor dies of the array of semiconductor dies. For example, the release unit may be fixed with respect to the fixed frame while the curved shell rotates and translates.

Further to the above, the target may include a plurality of said adjacently arranged rows of placement locations upon which respective semiconductor dies from the array of semiconductor dies are placed. In this case, the controller controls the wafer stage and/or the target stage after all placement positions in the same row on the target have been provided with semiconductor dies from the semiconductor die array. may be configured to cause mutual translational motion between. In this case, the controller may be configured to maintain a release position with respect to the fixed frame during mutual translational movement between said target and curved shell. Alternatively, the controller maintains the position of the rows on the target in a direction parallel to the axis of rotation with respect to the fixed frame, and places semiconductor dies from the array of semiconductor dies at all placement positions within the same row on the target. is provided, the release position may be changed to shift to the next row on the target.

The apparatus may include a plurality of the release units described above for substantially simultaneously releasing semiconductor dies from an array of semiconductor dies at different row placement positions on the target. Each release unit can be independently controlled by a controller.

According to a further aspect of the present disclosure, a wafer stage is provided having a wafer chuck having an array of semiconductor dies disposed thereon, the wafer chuck having an array of semiconductor dies disposed thereon and including a rotatably mounted curved shell. , the wafer stage further includes a first motor for rotating the curved shell about the axis of rotation. This wafer stage may further be configured as the wafer stage of the apparatus described above.

According to a further aspect of the disclosure there is provided a film frame carrier configured to be attached to the curved shell of the apparatus described above. Film frame carriers are also called tape frames.

A film frame carrier includes an annular body having a mounting surface configured to be bonded to a support surface of a flexible carrier film, foil or tape on which an array of semiconductor dies is disposed. The toroid may have, but is not limited to, a circular, rectangular or square shape.

The toroid has an asymmetric bending stiffness that allows the toroid to bend such that the mounting surface of the toroid changes from a first shape to a more concave second shape, and the mounting Prevents or limits bending of the annulus such that the shape of the face is more convex than the first shape. Asymmetric bending stiffness allows the toroid to be gripped on both sides to move the toroid without losing stiffness. This allows automatic transfer of the film frame carrier onto the curved shell and/or allows dicing of the wafer while still attached to the flexible carrier film which is then bonded to the toroid. Become. The first shape may correspond to the most convex shape that the mounting surface can achieve.

The asymmetric bending stiffness can be configured to allow bending of the toroid to reversibly change the mounting surface of the toroid from a first shape to a more concave second shape. Alternatively, bending may result in plastic deformation of the toroid.

The first shape may correspond to an essentially flat shape. Additionally or alternatively, the curvature of the mounting surface when having the first shape may be less than 0.2 m ⁻¹ and the curvature of the mounting surface when having the second shape is 3.3 m −1 ^. can be greater than ^one .

The annular body may include and/or be at least partially formed by a leaf spring. Furthermore, the surface of the leaf spring may form the mounting surface or be part of the mounting surface. The annular body may further include restricting means connected to the leaf springs for preventing or restricting bending of the annular body such that the shape of the mounting surface is more convex than the first shape. A limiting means may be coupled to the leaf spring at a surface directed away from the mounting surface. Additionally or alternatively, the restricting means may comprise a plurality of segments connected to the leaf springs, wherein when the mounting surface is in the first shape, adjacent segments abut each other so that the mounting surface to prevent or limit bending of the leaf spring such that the shape of the first shape is more convex than the first shape, and the segments are configured to move away from the abutment when the leaf spring is bent and move the mounting surface away from the first shape. Convert to a more concave shape.

Alternatively, the toroid may comprise multiple segments, the segments being hingedly connected to each other. For example, respective pairs of adjacently arranged segments of the plurality of segments may be configured to pivot relative to each other about respective axes of rotation. Further, the axes of rotation representing the pivotal motion of all pairs of adjacently arranged segments of the plurality of segments may be parallel to each other.

For at least one pair of adjacently disposed segments of the plurality of segments, one segment may include a first coupling structure disposed at a first end of the one segment and the other A segment may include a second coupling structure located at a second end of said other segment. The first coupling structure and the second coupling structure may be hinged together to allow the one segment and the other segment to pivot relative to each other about an axis of rotation. The one segment may include the second coupling structure located on a second side of the one segment opposite the first side of the one segment. The other segment may include the first coupling structure positioned on a first side of the other segment opposite the second side of the other segment.

The first coupling structure may include a first opening and the second coupling structure may include a projecting element rotatably received in said first opening and defining an axis of rotation. This projecting element can be a pin, rod or shaft.

Alternatively, the first coupling structure may include the first opening, the second coupling structure includes the second opening, and the film frame carrier comprises at least one of the first and second openings. It includes a shaft rotatably received therewith and defining an axis of rotation.

For each pair of adjacently arranged segments of said plurality of segments, one segment may include a first abutment surface and the other segment may comprise a second abutment surface. may contain. The first abutment surface and the second abutment surface are configured to prevent bending of the annular body such that the mounting surface is more convex than the first shape when the mounting surface has the first shape. , may be shaped and positioned with respect to the axis of rotation so as to abut each other.

The segments may be manufactured from materials selected from the group consisting of steel, aluminum, titanium, polymers or combinations thereof.

According to a further aspect of the disclosure there is provided an assembly comprising a film frame carrier as defined above and a carrier film, foil or tape having a support surface on which an array of dies is arranged, the assembly comprising the array of dies A carrier film, foil or tape is bonded at its support surface to the mounting surface of the film frame carrier.

The carrier film, foil or tape may be provided with an attachment layer that attaches the array of semiconductor dies to the support surface and bonds the carrier film, foil or tape to the mounting surface of the film frame carrier. The attachment layer may comprise a light-absorbing agent, such as a photosensitive adhesive, that releases at least locally from attachment to the array of semiconductor dies when illuminated by light having the wavelength described above. Configured. The light absorber may be configured to release its attachment at least locally as a result of absorbing light, by photoablation and/or by subjecting the light absorber to a chemical reaction. More specifically, the energy absorbed by the light absorbing layer is used not only to release the semiconductor die, but also to provide some motive force to drive the semiconductor die toward the target. obtain.

The array of semiconductor dies consists of a diced semiconductor wafer or a structured semiconductor wafer.

In order that the features of the present disclosure may be understood in detail, a more specific description will be given with reference to embodiments, some of which are illustrated in the accompanying drawings. It is noted, however, that the accompanying drawings depict only typical embodiments and are therefore not to be considered limiting of the scope of the disclosure. The drawings are intended to facilitate understanding of the present disclosure and, as such, are not necessarily drawn to scale. The advantages of the claimed subject matter will become apparent to those skilled in the art upon reading this description in conjunction with the accompanying drawings, in which like reference numbers are used to denote like elements.
1 illustrates a portion of one embodiment of an apparatus for placing a semiconductor die on a target from an array of semiconductor dies, according to one aspect of the present disclosure; Fig. 4 is a corresponding schematic diagram; 1B is a schematic cross-sectional view corresponding to the device of FIG. 1A; FIG. FIG. 4 illustrates a further embodiment and diagram of an apparatus for placing a semiconductor die onto a target from an array of semiconductor dies, according to one aspect of the present disclosure; FIG. 4 illustrates a further embodiment and diagram of an apparatus for placing a semiconductor die onto a target from an array of semiconductor dies, according to one aspect of the present disclosure; FIG. 4 illustrates a further embodiment and diagram of an apparatus for placing a semiconductor die onto a target from an array of semiconductor dies, according to one aspect of the present disclosure; FIG. 4 illustrates a further embodiment and diagram of an apparatus for placing a semiconductor die onto a target from an array of semiconductor dies, according to one aspect of the present disclosure; FIG. 4 illustrates a further embodiment and diagram of an apparatus for placing a semiconductor die onto a target from an array of semiconductor dies, according to one aspect of the present disclosure; 1 illustrates a first embodiment of a flexible film frame carrier, according to an aspect of the present invention; 1 shows an annular body for a flexible film frame carrier, according to one aspect of the present invention;

In the following, embodiments are presented in which semiconductor dies from a diced semiconductor wafer are placed on the target. However, the present invention is not limited to placing semiconductor dies from a diced semiconductor wafer. In general, the semiconductor die can be placed from an array of dies, including but not limited to diced semiconductor wafers and structured wafers.

FIG. 1A shows a portion of one embodiment of an apparatus 1 for placing semiconductor die 2A from a diced semiconductor wafer 2 onto a target 113, according to one aspect of the present disclosure. Here the diced semiconductor wafer 2 is placed on a carrier film 4 attached to a flexible film frame carrier FFFC3. Typically, wafers are supplied to apparatus 1 from cassettes 5, trays, or the like. This can be done in an automated way.

FFFC 3, a cross-section of which is shown in FIG. Here, the flexible carrier film 4 comprises a backing/support layer 42 typically made of polyvinyl chloride covered by an adhesion layer 41 . Using this latter layer, a diced semiconductor wafer 2 containing a plurality of semiconductor dies 2A is attached to backing layer 42 .

The annulus 30 has an asymmetric bending stiffness that causes the mounting surface 31 to move from a first shape, as shown in the top view of FIG. Allows bending of the annulus 30 so that it is changed to a concave second shape. At the same time, the asymmetric stiffness prevents bending of the annulus 30 such that the shape of the mounting surface 31 is more convex than the first shape.

Annulus 30 includes a leaf spring 32 and a plurality of segments 34 each connected to leaf spring 32 using respective connections 33 . In the first shape, adjacent segments 34, more specifically surface 35A of one segment 34A and surface 35B of an adjacent segment 34B abut one another. As a result, the annular body 30 cannot be bent by moving the left and right ends upward with respect to the central portion of the annular body 30 shown in FIG. However, the opposite is also possible, where the mounting surface 31 presents a more concave shape. This is shown in the middle diagram of FIG. Here, segments 34A and 34B are not abutting. By using leaf springs 32, the shape deformation of annular body 30 can be reversible. However, embodiments are equally possible in which the bending from the first shape to the second shape involves plastic deformation. In such embodiments, the toroid 30 may be discarded after use.

Another embodiment of an annular body 30 for FFFC with asymmetric bending stiffness is shown in FIG. In this embodiment, the toroid 30 includes a plurality of hinged segments 34 . For example, FIG. 4 shows segment 34A and segment 34B. These segments include openings 36A and 36B, respectively, in which is disposed a shaft 37 to which segments 34A and 34B are hingedly connected to each other. This is shown in more detail in the cross-sectional views corresponding to lines L1 and L2. A shaft 37 may be fixedly connected to one of the segments 34A and 34B and rotated in the openings 36A and 36B of the other. Alternatively, shaft 37 can rotate through both openings 36A and 36B.

In FIG. 4, the mounting surface 31 of the annular body 30 is shown in a first shape which is an essentially flat shape. Similar to the embodiment shown in FIG. 5, mounting surface 31 may be bonded to support surface 43 of carrier film 4 . Segments 34A and 34B include abutting surfaces 35A and 35B, respectively. The positioning of surfaces 35A and 35B relative to shaft 37 determines that annular body 30 cannot be bent such that mounting surface 31 is more convex. However, it is possible to bend the annulus 30 so that the mounting surface 31 is more concave. Note that surfaces 35A and 35B may be positioned at different locations. For example, they may be at different longitudinal positions or substantially collinear with the shaft 37 .

Referring again to FIG. 1A, FFFC 3, embodied as shown in FIG. 5 and having diced semiconductor wafer 2 disposed thereon, is rotatably mounted, capable of rotating about axis of rotation 122A. It can be attached to curved shell 122 . For this purpose, the curved shell 122 may be provided with a large number of small openings through which suction forces can be applied to the FFFC3. Alternatively, FFFC 3 may be attached to curved shell 122 by mechanical attachments such as clamps.

It should be noted that FIG. 1A does not show the annulus 30 for the semiconductor wafer 2 located on the curved shell 122 for purposes of illustration. Further, FIG. 1A shows that segments 34 having longitudinal axes of symmetry parallel to axis of rotation 122A are generally elongated.

By rotating and translating the curved shell 122, the diced semiconductor wafer 2 can be positioned with respect to the target 113 on which the semiconductor die 2A are arranged. Target 113 is placed on support surface 112 A of target chuck 112 . Once properly positioned, a release unit (not shown in FIG. 1A) is used to release the semiconductor die 2A from the diced semiconductor wafer 2, thereby allowing the semiconductor die 2A to reach the intended position on the target 113. Allows you to place it in the specified position.

FIG. 1B schematically shows the apparatus of FIG. 1A. As shown, apparatus 1 includes controller 100 that controls target stage 110 , wafer stage 120 and release unit 130 based on data received from inspection system 140 . The controller 100 further controls a dispensing device 150 configured to dispense small droplets of conductive adhesive 151 , solder, or the like onto the target 113 .

Target stage 110 includes one or more motors for controlling the position of target chuck 112 on which target 113 is positioned. For example, the target stage 110 includes a motor MT0 for translating the target chuck 112 along the x-direction parallel to the axis of rotation 122A and a z-direction perpendicular to the support surface 112A of the target chuck 112. and a motor MT1 for translating the target chuck 112 along a y-direction perpendicular to the x- and z-directions.

Wafer stage 120 includes one or more motors for controlling the position of curved shell 122 on which semiconductor wafer 2 is placed. For example, the wafer stage 120 includes a motor MW0 for translating the curved shell 122 along the x-direction, a motor MW2 for translating the curved shell 122 along the z-direction, and a motor MW2 for translating the curved shell 122 along the rotation axis 122A. and a motor MW3 for rotating the .

The release unit 130 may include a motor MR0 for translating the light source 132 in the x-direction.

Note that the present disclosure is not limited to the motor combinations described above. Target stage 110, wafer stage 120 and release unit 130 may include more or fewer motors and/or motors for translation in different directions.

Inspection system 150 may include one or more optical cameras for recording images of semiconductor wafer 2 and/or semiconductor die 2A disposed therein and/or target 113 . Based on these recorded images, which may be still or moving images, the controller 100 controls the target 113 to ensure that each deposited semiconductor die 2A is placed at the intended location on the target 113. Control stage 110 , wafer stage 120 and/or release unit 130 . This placement process will now be described in detail with reference to FIG.

FIG. 2 is a schematic cross-sectional view corresponding to the device of FIG. 1A. Here a target 113, eg a printed circuit board, is shown. Target 113 includes a plurality of intended placement locations where semiconductor die 2A from diced semiconductor wafer 2 need to be placed. Prior to placing the semiconductor die 2A, a droplet 151 of conductive adhesive, solder, or the like is provided, eg, dispensed onto the target 113 by the dispensing device 150 .

As shown in insert I, the target 113 may be provided with a plurality of droplets 151 arranged in rows R and columns C. FIG. Similarly, the semiconductor dies 2A may be arranged on the semiconductor wafer 2 in a matrix of rows r and columns c. Here, row c on the diced semiconductor wafer 2 and row C on the target 113 are assumed to extend perpendicular to the axis of longitudinal symmetry and/or the axis of rotation 122A of the curved shell 122, respectively.

After depositing or otherwise placing droplet 151 on target 113 , target 113 is moved under curved shell 122 to receive semiconductor die 2 A released from diced semiconductor wafer 2 . For that purpose the release unit 130 is used.

Curved shell 122 has, at least for the most part, a constant cross-section along axis of rotation 122A. Curved shell 122 may be a partially circular or cylindrical shell. Various examples of cross-sections of curved shell 122 are shown in FIG. 1A. Here example A corresponds to a partially cylindrical shell, example B to a cylindrical shell and example C to a further partially cylindrical shell, i.e. a semi-cylindrical shell. .

With continued reference to FIG. 2, release unit 130 includes a laser source 132 that emits a beam of light 133 through curved shell 122 onto semiconductor die 2A released from carrier film 4 . As such, curved shell 122 is at least partially translucent to light coming from at least laser source 132 . Curved shell 122 may be made entirely of a translucent material, or certain areas of curved shell 122 may be translucent while other areas are not. For example, curved shell 122 may be made of glass, quartz, or fused silica.

The adhesion layer 41 contains a light absorbing agent such as a photosensitive adhesive. When the adhesion layer 41 is irradiated with light from the laser source 132, the adhesion with the semiconductor die 2A is released. For example, the absorption of light causes a chemical reaction of the light absorber, resulting in reduced adhesive properties of the adhesion layer 41 . Additionally or alternatively, the absorption of light can cause a sudden and localized temperature increase. This may even lead to localized ablation and/or generation of gaseous constituents that can propel the released semiconductor die 2A towards the target 113 .

After releasing the attachment, the semiconductor die 2A falls to its intended placement position on the target 113. FIG. The curved shell 122 is then rotated by the motor M3 to align another semiconductor die 2A with the laser source 132. FIG. In addition, the curved shell 122 and the target 113 are translated relative to each other to the next intended placement position in the correct position with respect to the curved shell 122 .

Various inspection systems may be installed as shown in FIG. The inspection system may be used to inspect semiconductor die 2 A from diced semiconductor wafer 2 before they are placed on target 113 . Such inspection may include determining the position and orientation of semiconductor die 2A. This makes it possible, for example, to perform a final correction by translating the curved shell 122, the target 113 and/or the laser source 132 before releasing the semiconductor die 2A. Note that each semiconductor die 2A may deviate slightly from its ideal position and/or orientation. Such deviations can occur during dicing and/or mounting the FFFC 3 onto the curved shell 122 . Such deviations can be recorded by one or more cameras 141 of inspection system 140 . The camera 141 can also be placed inside the curved shell 122 because the curved shell 122 is at least locally translucent.

Another or the same camera may be used to check whether the semiconductor die 2A is damaged before releasing the die. If semiconductor die 2A is determined to be damaged, controller 100 of apparatus 1 may decide to skip that semiconductor die.

Another or the same camera can also be used to check whether the semiconductor die 2A has been released. If it is determined that this semiconductor die has not been released, a new release attempt can be made.

Inspection system 140 may also use camera 142 to check that droplet 151 is properly placed on target 113 and/or monitor or check the position and/or orientation of target 113 . .

Note that the curvature of the curved shell 122 allows the camera of the inspection system 140 to be placed in close proximity to the semiconductor die 2A that needs to be inspected.

3A-3E illustrate a further embodiment of an apparatus for placing semiconductor die directly onto a target from a diced semiconductor wafer, according to one aspect of the present disclosure.

Each of the embodiments shown in Figures 3A-3E includes a stationary frame 160 that serves as a reference for various movements within the device.

In FIG. 3A, motor MT0 is used to translate carriage 111 relative to frame 160 in the x-direction. A motor MT1 is used to translate the target chuck 112 relative to the carriage 111 in the y-direction. Additionally, motor MW3 is used to rotate curved shell 122 relative to frame 160 .

The laser source 132 is mounted on a carriage 131 that translates in the x-direction with respect to the frame 160 using motor MR0.

The apparatus of FIG. 3A can be used to place a plurality of semiconductor dies 2A on target 113 in a plurality of spaced rows extending perpendicular to axis of rotation 122A.

For example, the targets 113 can be translated in the y-direction while the curved shell 122 is rotated to place the semiconductor dies 2A arranged in the same row on the semiconductor wafer 2 . When a row on semiconductor wafer 2 is exhausted, move laser source 132 and target chuck 112 in the x-direction so that both target chuck 112 and laser source 132 are aligned with the next row of semiconductor dies 2A on semiconductor wafer 2. parallel to When a complete row on target 113 is filled, target chuck 112 is moved in the x-direction to position a new row to be filled under curved shell 122 .

In the embodiment shown in FIG. 3B, target chuck 112 can only be translated in the y-direction using motor MT1. Curved shell 122 can be rotated relative to carriage 121 using motor MW3. Carriage 121 can then be translated in the x-direction using motor MW0. A laser source 132 mounted on a carriage 131 can be translated in the x-direction using motor MR0 relative to a frame 160 partially omitted for illustration. Motor MR0 may include, for example, a ball screw, lead screw, belt drive, or linear motor to translate carriage 131 .

The apparatus shown in FIG. 3C differs from the embodiment shown in FIG. 3B in that motor MR 0 translates carriage 131 relative to carriage 121 instead of frame 160 .

3D and 3E are cross-sectional views corresponding to the device shown in FIG. 3A. More specifically, target chuck 112 can translate in the x and y directions, and curved shell 122 can only rotate relative to frame 160 . Laser source 132 can only be translated in the x-direction with respect to frame 160 using motor MR0.

In FIG. 3D, laser source 132 emits beam of light 133 through translucent curved shell 122 onto the attachment layer where semiconductor die 2A attaches to the carrier film. Alternatively, release unit 130 may include a needle and a needle actuator for engaging and disengaging the needle with the underlying semiconductor die. In this case, both the needle actuator and the needle are placed inside the curved shell 122 and both are translated in the x-direction.

In FIG. 3E, laser source 132 is mounted outside curved shell 122 . A laser source 132 emits a beam of light 133 towards a mirror unit 134 . Mirror unit 134 deflects light to and through curved shell 122 . Mirror unit 134 may include one or more mirrors and one or more mirror actuators to allow the deflection angle to be changed. The mirror unit 134 can be translated in the x-direction using a motor MR0, which can be embodied, for example, as a linear motor.

The present invention has been described above using detailed embodiments thereof. However, the invention is not limited to these embodiments. Instead, various modifications are possible without departing from the scope of the invention, which is defined by the appended claims and their equivalents.

Particular and preferred aspects of the invention are set out in the accompanying independent claims. Combinations of features from dependent and/or independent claims are not limited to what is stated in the claims and may be combined as appropriate.

To the scope of the present disclosure, any expressly or implicitly disclosed, whether or not it relates to the claimed invention or alleviates any or all of the problems addressed by the invention. Any novel feature or combination of features or any generalization thereof is included. Applicants hereby give notice that new claims may be formulated to such features during prosecution of this application or any such further application derived therefrom. In particular, with reference to the appended claims, features of the dependent claims may be combined with features of the independent claims, and features of each independent claim may be combined only in the specific combinations recited in the claims. may be combined in any suitable manner.

Features that are described in the context of separate embodiments may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment may also be provided separately or in any suitable subcombination.

The term "comprising" does not exclude other elements or steps, and the terms "a" or "an" do not exclude a plurality. Any reference signs in the claims shall not be construed as limiting the scope of the claims.

1 Device 2 Semiconductor Wafer 2A Semiconductor Die 3 Film Frame Carrier 4 Carrier Film 5 Cassette 30 Annular Body 31 Mounting Surface 32 Leaf Spring 33 Connecting Portions 34, 34A, 34B Segments 35A, 35B Abutting Surfaces 36A, 36B Opening 37 Shaft 41 Attachment layer 42 backing layer 43 support surface 100 controller 110 target stage 111 carriage target stage 112 target chuck 113 target 120 wafer stage 121 carrier wafer stage 122 curved shell 122A rotating shaft 130 release unit 131 carrier release unit 132 laser source 133 beam of light 134 mirror Unit 140 Inspection System 141, 142 Camera 150 Dispenser 151 Glue/Solder Droplet 160 Fixed Frame M0 X Direction Motor M1 Y Direction Motor M2 Z Direction Motor M3 Motor Rotation

Claims (15)

An apparatus for transferring a semiconductor die from an array of semiconductor dies to a target, comprising:
a wafer stage having a wafer chuck on which the array of semiconductor dies is arranged;
a target stage having a target chuck on which is positioned a target on which a semiconductor die from the array of semiconductor dies is placed;
a release unit for releasing a semiconductor die from the array of semiconductor dies;
a controller for controlling the release unit, the wafer stage and the target stage;
The wafer chuck includes a curved shell on which the array of semiconductor dies is arranged and rotatably mounted, and the wafer stage further includes a first motor for rotating the curved shell about an axis of rotation. ,
The device, wherein said curved shell is optionally a cylindrical shell, such as a drum, or a partially cylindrical shell. The apparatus is configured to directly transfer the semiconductor die from the array of semiconductor dies onto the target and/or the release unit releases the semiconductor die from the array of semiconductor dies to the target. 11. The device of claim 1, configured to drop upwards. The wafer chuck is configured to support a carrier carrying the array of semiconductor dies, the carrier optionally being tape, film or foil, the carrier optionally being part of a film frame carrier. 3. A device according to claim 1 or 2, wherein the array of semiconductor dies comprises a diced semiconductor wafer or a structured semiconductor wafer; and/or
the axis of rotation extends at least substantially parallel to the target chuck; and/or
A device according to any preceding claim, wherein the axis of rotation coincides with the axis of longitudinal symmetry of the curved shell. The wafer stage further comprises a second motor for translating the curved shell back and forth, preferably along a direction parallel to and/or coinciding with the axis of rotation, and/or the wafer stage comprises the further comprising an auxiliary second motor for translating the curved shell back and forth in a direction perpendicular to said axis of rotation, preferably along a direction perpendicular to said target chuck;
The apparatus optionally further comprises a fixed frame and a first carriage, wherein the second motor and/or auxiliary second motor is adapted to translate the first carriage relative to the fixed frame. wherein the first motor is configured to rotate the curved shell relative to the first carriage; or
The apparatus optionally further comprises a stationary frame, wherein the second motor and/or an auxiliary second motor are configured to translate the curved shell with respect to the stationary frame; is configured to rotate the curved shell with respect to the fixed frame. The curved shell is at least partially translucent to light having a first wavelength, the release unit comprises a light source such as a laser for outputting a beam of light having the wavelength, the semiconductor The array of dies is attached to a tape, foil or film using a light absorbing agent, such as a photosensitive adhesive, which absorbs the array of semiconductor dies when illuminated by light having the wavelength. configured to at least locally release attachment with
the light absorber is optionally configured to release its attachment at least locally as a result of absorbing the light, by photoablation and/or by subjecting the light absorber to a chemical reaction; and/or the light source is optionally configured to illuminate the given semiconductor die of the array of semiconductor dies distinct from semiconductor dies adjacent to the given semiconductor die, the release unit comprising: optionally comprising a beam splitter configured to receive the beam of light from the light source and to split the received beam into a plurality of further beams, each further beam targeting a respective given semiconductor die. configured to irradiate,
A device according to any preceding claim, wherein the light source is optionally configured to emit light towards the curved shell, preferably substantially perpendicularly. The release unit further comprises a light guide unit, the light source is configured to emit light towards the light guide unit, preferably substantially parallel to the axis of rotation, the light guide unit comprising the light source. towards said curved shell, preferably substantially vertically, said light guiding unit optionally comprising one or more mirrors and/or one or more prisms, said light guiding unit The unit optionally includes one or more actuators, preferably controllable by said controller, said one or more actuators for directing light from said light source to said curved shell at different angles. 7. The apparatus of claim 6, configured to redirect one or more mirrors and/or one or more prisms with respect to incident light from. said release unit comprising a second carriage on which said light source or actuator and needle combination is mounted; a third motor for moving said second carriage relative to said curved shell; 2 carriages are optionally configured to translate inside and/or above or below the curved shell, and as far as depending on claims 7 and 5, the light sources are optionally arranged on the fixed frame and the light guide unit is attached to the second carriage, or
As far as dependent on claim 5, the release unit comprises a second carriage on which the light source or actuator and needle combination is mounted and a second carriage for moving the second carriage relative to the fixed frame. 3 motors, and the second carriage is optionally configured to translate inside and/or above or below the curved shell, and insofar as dependent on claims 7 and 5, the 8. Apparatus according to claim 6 or 7, wherein the light source is optionally fixed to the fixed frame and the light guiding unit is mounted on the second carriage. The target stage preferably includes a fourth motor and/or a fifth motor for translating the target chuck in a plane parallel to the axis of rotation and/or the target chuck perpendicular to the axis of rotation. an auxiliary fourth motor for translating back and forth along a direction, preferably perpendicular to said target chuck;
As far as dependent on claim 5, the fourth motor and/or the fifth motor are optionally arranged to translate the target chuck with respect to the fixed frame,
As far as dependent on claim 5, the fourth motor is optionally arranged to displace a third carriage relative to the fixed frame, and the fifth motor is adapted to displace the third carriage. Apparatus according to any preceding claim, arranged to displace the target chuck relative to. the curved shell is provided with a bonding unit for enabling the array of semiconductor dies to be bonded to the curved shell;
the curved shell is optionally provided with a plurality of openings, the apparatus further comprising a vacuum unit for generating a suction force applied to the diced semiconductor wafer through the plurality of openings; and / or
The curved shell is optionally provided with a mechanical coupling unit for mechanically coupling the array of semiconductor dies, the array of semiconductor dies being preferably carried by a film frame carrier and the Apparatus according to any of the preceding claims, wherein the coupling unit preferably comprises a clamping unit for clamping the film frame carrier onto the curved shell. further comprising a first inspection system arranged to inspect semiconductor dies from the array of semiconductor dies prior to placement on the target;
The first inspection system is optionally arranged to determine a position and/or orientation of a semiconductor die of the array of semiconductor dies, the controller, in response to the determined position and/or orientation, configured to control the wafer stage, the target stage and/or the release unit; and/or
The first inspection system is optionally arranged to determine whether a semiconductor die of the semiconductor die array is damaged, and the controller determines if the semiconductor die is damaged. , configured to control the wafer stage, the target stage and/or the release unit to prevent the semiconductor die from being placed on the target; and/or
The apparatus further includes a second inspection system arranged to determine whether a semiconductor die has been released from the array of semiconductor dies, the controller preferably determining whether the semiconductor die has not been released. and/or the apparatus is configured to control the wafer stage, the target stage and/or the release unit to release the semiconductor die when it is determined that the semiconductor die is on the target. Further comprising a third inspection system arranged to check for proper placement, the controller preferably controls the position of the semiconductor die and/or the intended position of the semiconductor die on the target. configured to store the position of the
The first inspection system, the second inspection system or the third inspection system optionally comprise a camera, the same camera preferably being used by the first inspection system, the second inspection system and the third inspection system. Apparatus according to any preceding claim for use in two or more of said third inspection systems. The release unit is configured to release a semiconductor die placed in a release position with respect to the fixed frame from the arrangement of the semiconductor dies,
The array of semiconductor dies optionally comprises a plurality of semiconductor dies arranged in a matrix of rows and columns, the rows extending at least approximately parallel to the axis of rotation. A device according to any of the preceding claims. The target includes columns or rows of adjacently arranged placement locations on which respective semiconductor dies from the array of semiconductor dies are placed, wherein the columns or rows of adjacently arranged placement locations are each: , extending at least approximately perpendicular or parallel to the axis of rotation, and the controller controls the wafer stage to place the semiconductor dies in the same row of the array of semiconductor dies on respective placement positions of the target. After intermittently or continuously rotating the curved shell for depositing and depleting the row of the array of semiconductor dies of the deposited die, the curved shell is translated to rotate the semiconductor dies of the array of semiconductor dies. configured to shift to adjacent columns of
As far as dependent on claim 5, the controller optionally maintains the release position relative to the fixed frame during translational movement of the curved shell to move adjacent rows of semiconductor dies of the array of semiconductor dies. 13. The device of claim 12, configured to shift to . The target includes a plurality of adjacently arranged rows of placement locations on which respective semiconductor dies from the array of semiconductor dies are placed, and the controller controls all placement locations within the same row on the target. 6. adapted to control said wafer stage and/or target stage to induce mutual translational movement between said target and said curved shell after a semiconductor die from said array of semiconductor dies has been provided; The controller is optionally configured to maintain the release position with respect to the fixed frame during mutual translational movement between the target and the curved shell, or claim 5, the controller optionally maintains the position of the row on the target in a direction parallel to the axis of rotation with respect to the fixed frame, and maintains the position of all rows in the same row on the target with respect to the fixed frame. configured to change the release position to shift to the next row on the target after a semiconductor die from the array of semiconductor dies has been placed in the placement position;
14. The apparatus of claim 13, optionally comprising a plurality of said release units for substantially simultaneously releasing semiconductor dies from said array of semiconductor dies in different row placement positions on said target. A wafer stage configured for use in the apparatus of any of claims 1-14 and having a wafer chuck on which an array of semiconductor dies is positioned,
The wafer chuck includes a curved shell on which the array of semiconductor dies is arranged and rotatably mounted, and the wafer stage further includes a first motor for rotating the curved shell about an axis of rotation. , wafer stage.

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