JP2023104376A - Resin composition, prepreg, laminate, resin film, printed wiring board, semiconductor package, method for producing resin composition and resin - Google Patents

Abstract

To provide a resin composition having excellent dielectric properties and low thermal expansion properties, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for producing the resin composition and a resin.SOLUTION: There are provided: a resin composition comprising (A) a resin containing a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound and (B) a thermoplastic resin; a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition; a method for producing the resin composition; and a resin.SELECTED DRAWING: None

Description

The present embodiment relates to a resin composition, a prepreg, a laminate, a resin film, a printed wiring board, a semiconductor package, a method for producing a resin composition, and a resin.

2. Description of the Related Art Mobile communication devices such as mobile phones, network infrastructure devices such as base stations, servers and routers, and electronic devices such as large computers use signals with higher speeds and larger capacities year by year. Along with this, substrate materials for printed wiring boards mounted in these electronic devices have dielectric properties capable of reducing transmission loss of high frequency signals [hereinafter sometimes referred to as "high frequency properties". ], that is, a low dielectric constant and a low dielectric loss tangent are required.
In recent years, in addition to the above-mentioned electronic devices, in the field of ITS (Intelligent Transport Systems) such as those related to automobiles and traffic systems, and in the field of indoor short-distance communication, new systems that handle high-frequency wireless signals have been put to practical use or planned for practical use. there is Therefore, it is expected that there will be an increasing need for substrate materials with excellent high-frequency characteristics for printed wiring boards used in these fields in the future.

Printed wiring boards are required to have heat resistance and low thermal expansion that can withstand the environment in which they are used. Therefore, resins having excellent mechanical properties, such as maleimide resins, have been used for printed wiring boards. However, since many of these resins having excellent mechanical properties contain polar groups, there is room for improvement in high-frequency properties.
Therefore, printed wiring boards that require a high degree of low transmission loss use resins that contribute to low dielectric loss tangents, such as polyphenylene ether, polybutadiene, and styrene-ethylene-butylene-styrene block copolymer (SEBS). It has been done (for example, see Patent Document 1).

JP 2021-077786 A

However, it has been difficult to achieve further improvements in dielectric properties and low thermal expansion properties with these resins alone.

In view of the current situation, the present embodiment provides a resin composition having excellent dielectric properties and low thermal expansion, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, and a resin composition. An object of the present invention is to provide a manufacturing method and a resin.

The inventors of the present invention conducted studies to solve the above problems, and found that the problems can be solved by the following embodiments [1] to [15].
[1] (A) a resin containing a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound;
(B) a thermoplastic resin;
A resin composition containing
[2] The resin composition according to [1] above, wherein the aromatic vinyl compound is α-methylstyrene dimer.
[3] The resin composition according to [1] or [2] above, wherein the (B) thermoplastic resin contains (B1) a polyphenylene ether-based resin.
[4] The resin composition according to any one of [1] to [3] above, wherein the (B) thermoplastic resin contains (B2) a styrene-based elastomer.
[5] The resin composition according to any one of [1] to [4] above, further comprising (C) a cross-linking agent having two or more ethylenically unsaturated bonds.
[6] A prepreg containing the resin composition according to any one of [1] to [5] above or a semi-cured product of the resin composition.
[7] A laminate comprising a cured product of the resin composition according to any one of [1] to [5] or a cured product of the prepreg according to [6], and a metal foil.
[8] A resin film containing the resin composition according to any one of [1] to [5] above or a semi-cured product of the resin composition.
[9] From the group consisting of the cured product of the resin composition according to any one of [1] to [5] above, the cured product of the prepreg according to [6] above, and the laminate according to [7] above A printed wiring board having one or more selected.
[10] A semiconductor package comprising the printed wiring board according to [9] above and a semiconductor element.
[11] A method for producing a resin composition, comprising blending a maleimide resin having one or more N-substituted maleimide groups, an aromatic vinyl compound and a thermoplastic resin.
[12] The above-described [11], wherein the thermoplastic resin is blended with a reaction product obtained by blending and reacting the maleimide resin having one or more N-substituted maleimide groups and the aromatic vinyl compound. A method for producing a resin composition.
[13] The method for producing a resin composition according to [12] above, wherein the aromatic vinyl compound is α-methylstyrene dimer.
[14] A resin containing a structural unit derived from a maleimide resin having at least one N-substituted maleimide group and a structural unit derived from an aromatic vinyl compound.
[15] The resin according to [14] above, wherein the aromatic vinyl compound is α-methylstyrene dimer.

According to the present embodiment, a resin composition having excellent dielectric properties and low thermal expansion, a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition, a method for producing a resin composition, and a resin can be provided.

In this specification, a numerical range indicated using "to" indicates a range including the numerical values before and after "to" as the minimum and maximum values, respectively.
For example, the notation of a numerical range “X to Y” (X and Y are real numbers) means a numerical range that is greater than or equal to X and less than or equal to Y. And the description "X or more" in this specification means X and a numerical value exceeding X. In addition, the description “Y or less” in this specification means Y and a numerical value less than Y.
The lower and upper limits of any numerical range recited herein are optionally combined with the lower or upper limits of other numerical ranges, respectively.
In the numerical ranges described herein, the lower or upper limit of the numerical range may be replaced with the values shown in the examples.

Each component and material exemplified in this specification may be used singly or in combination of two or more unless otherwise specified.
In the present specification, the content of each component in the resin composition refers to the content of the plurality of substances present in the resin composition when there are multiple substances corresponding to each component in the resin composition, unless otherwise specified. means the total amount of

As used herein, "solid content" means non-volatile content excluding volatile substances such as solvents. That is, the "solid content" is a component that remains without volatilization when the resin composition is dried, and includes those that are liquid at room temperature, starch syrup, and wax. Here, in this specification, room temperature means 25°C.

As used herein, "(meth)acrylate" means "acrylate" and its corresponding "methacrylate". Similarly, "(meth)acrylic" means "acrylic" and corresponding "methacrylic", and "(meth)acryloyl" means "acryloyl" and corresponding "methacryloyl".

The number average molecular weight (Mn) in this specification means the value measured by gel permeation chromatography (GPC; Gel Permeation Chromatography) in terms of polystyrene. Specifically, the number average molecular weight (Mn) in this specification can be measured by the method described in Examples.

The term "semi-cured product" used herein is synonymous with a resin composition in the state of B-stage according to JIS K 6800 (1985), and the term "cured product" means C- It is synonymous with the resin composition in a stage state.

The mechanism of action described in this specification is speculation, and does not limit the mechanism of the effect of this embodiment.

Aspects in which the items described in this specification are arbitrarily combined are also included in this embodiment.

[Resin composition and resin]
The resin composition of the present embodiment is
(A) a resin containing a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound [hereinafter sometimes referred to as "(A) modified maleimide resin" . ]and,
(B) a thermoplastic resin;
It is a resin composition containing

Further, the resin of the present embodiment corresponds to the above-mentioned (A) modified maleimide resin, and includes a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound. is a resin containing

In this specification, each component may be abbreviated as (A) component, (B) component, etc., and other components may be abbreviated in the same manner.
Each component contained in the resin composition of the present embodiment will be described below. The resin of the present embodiment will be described as (A) modified maleimide resin.

<(A) Modified maleimide resin>
(A) Modified maleimide resin is a maleimide resin having one or more N-substituted maleimide groups [hereinafter sometimes simply referred to as “maleimide resin”. ] and a structural unit derived from an aromatic vinyl compound.
By containing (A) the modified maleimide resin, the resin composition of the present embodiment has excellent dielectric properties and low thermal expansion. Although the cause of this is not clear, the structural unit derived from the aromatic vinyl compound contained in the (A) modified maleimide resin has low polarity, and the introduction of a highly linear chain composed of the structural unit derived from the aromatic vinyl compound leads to It is presumed that the increase in the free volume of the cured product contributes to the improvement of the dielectric properties. Furthermore, it is presumed that the low thermal expansion property is improved by π-π stacking (intermolecular interaction) between aromatic rings contained in structural units derived from aromatic vinyl compounds.
(A) Modified maleimide resin may be used alone or in combination of two or more.

(Structural Unit Derived from Maleimide Resin Having One or More N-Substituted Maleimide Groups)
(A) The structural unit derived from the maleimide resin contained in the modified maleimide resin is not particularly limited as long as it is a structural unit derived from the maleimide resin.
(A) The maleimide resin-derived structural unit possessed by the modified maleimide resin may be of one kind alone, or may be of two or more kinds.

The structural unit derived from the maleimide resin is preferably a structural unit formed by addition reaction of one or more N-substituted maleimide groups possessed by the maleimide resin. In other words, the structural unit derived from the maleimide resin includes a group other than one or more N-substituted maleimide groups possessed by the maleimide resin and a group formed by an addition reaction of the N-substituted maleimide groups. Yes, and may contain unreacted N-substituted maleimide groups that have not undergone addition reaction.
A group formed by an addition reaction of an N-substituted maleimide group is represented by the following formula.

(In the formula, * ^A1 is a site for bonding to a group other than the N-substituted maleimide group subjected to the addition reaction from the maleimide resin. * ^A2 and * ^A3 are sites for bonding to other atoms. .)

(A) The content of the structural unit derived from the maleimide resin in the modified maleimide resin is not particularly limited, but from the viewpoint of dielectric properties, low thermal expansion and heat resistance, it is preferably 30 to 99% by mass, more preferably 40 to 99% by mass. 96% by mass, more preferably 50 to 93% by mass.

The maleimide resin is not particularly limited as long as it has one or more N-substituted maleimide groups.
The maleimide resin is preferably an aromatic maleimide resin having two or more N-substituted maleimide groups from the viewpoint of conductor adhesion and heat resistance, and is an aromatic bismaleimide resin having two N-substituted maleimide groups. is more preferable.

As used herein, the term "aromatic maleimide resin" means a compound having an N-substituted maleimide group directly bonded to an aromatic ring. Further, the term "aromatic bismaleimide resin" as used herein means a compound having two N-substituted maleimide groups directly bonded to an aromatic ring. Further, the term "aromatic polymaleimide resin" as used herein means a compound having 3 or more N-substituted maleimide groups directly bonded to an aromatic ring. Further, the term "aliphatic maleimide resin" as used herein means a compound having an N-substituted maleimide group directly bonded to an aliphatic hydrocarbon.

As the maleimide resin, a maleimide resin represented by the following general formula (A-1) is preferable.

(In the formula, X ^A1 is a divalent organic group.)

X ^A1 in general formula (A-1) above is a divalent organic group.
Examples of the divalent organic group represented by X ^A1 in general formula (A-1) include a divalent organic group represented by general formula (A-2) below, and general formula (A-3) below. a divalent organic group represented by the following general formula (A-4), a divalent organic group represented by the following general formula (A-5), the following general formula ( Examples include a divalent organic group represented by A-6) and a divalent organic group represented by the following general formula (A-7).

(In the formula, R ^A1 is an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. n ^A1 is an integer of 0 to 4. * represents a bonding site.)

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A1 in the general formula (A-2) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group and isobutyl t-butyl group, n-pentyl group, and other alkyl groups having 1 to 5 carbon atoms; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group.
Halogen atoms include, for example, fluorine, chlorine, bromine, and iodine atoms.
n ^A1 in the general formula (A-2) is an integer of 0 to 4, preferably an integer of 0 to 2, more preferably 0 or 1, still more preferably 0, from the viewpoint of availability.
When n ^A1 is an integer of 2 or more, the plurality of R ^A1 may be the same or different.

(wherein R ^A2 and R ^A3 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^A2 is an alkylene group having 1 to 5 carbon atoms; an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a divalent organic group represented by the following general formula (A-3-1): n ^A2 and n ^A3 are each independently an integer of 0 to 4. * represents a binding site.)

The aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A2 and R ^A3 in the general formula (A-3) includes, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl alkyl groups having 1 to 5 carbon atoms such as isobutyl group, t-butyl group and n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group or an ethyl group.
Halogen atoms include, for example, fluorine, chlorine, bromine, and iodine atoms.

Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^A2 in the general formula (A-3) include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group and a 1,4-tetramethylene group. group, 1,5-pentamethylene group, and the like. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and still more preferably a methylene group.

The alkylidene group having 2 to 5 carbon atoms represented by X ^A2 in the general formula (A-3) includes, for example, an ethylidene group, a propylidene group, an isopropylidene group, a butylidene group, an isobutylidene group, a pentylidene group, and an isopentylidene group. etc. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

n ^A2 and n ^A3 in the general formula (A-3) are each independently an integer of 0 to 4.
When n ^A2 or n ^A3 is an integer of 2 or more, the plurality of ^RA2s or the plurality of ^RA3s may be the same or different.

The divalent organic group represented by general formula (A-3-1) represented by X ^A2 in general formula (A-3) is as follows.

(wherein R ^A4 and R ^A5 are each independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; X ^A3 is an alkylene group having 1 to 5 carbon atoms; an alkylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond, ^nA4 and ^nA5 are each independently an integer of 0 to 4. * represents a binding site. )

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A4 and R ^A5 in the general formula (A-3-1) include, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n C1-5 alkyl groups such as -butyl group, isobutyl group, t-butyl group and n-pentyl group; C2-5 alkenyl groups; and C2-5 alkynyl groups. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched. The aliphatic hydrocarbon group having 1 to 5 carbon atoms is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group.
Halogen atoms include, for example, fluorine, chlorine, bromine, and iodine atoms.

Examples of the alkylene group having 1 to 5 carbon atoms represented by X ^A3 in the general formula (A-3-1) include methylene group, 1,2-dimethylene group, 1,3-trimethylene group, 1,4- A tetramethylene group, a 1,5-pentamethylene group and the like can be mentioned. The alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and still more preferably a methylene group.

The alkylidene group having 2 to 5 carbon atoms represented by X ^A3 in the general formula (A-3-1) includes, for example, ethylidene group, propylidene group, isopropylidene group, butylidene group, isobutylidene group, pentylidene group, isopentyl A lidene group and the like can be mentioned. Among these, an alkylidene group having 2 to 4 carbon atoms is preferred, an alkylidene group having 2 or 3 carbon atoms is more preferred, and an isopropylidene group is even more preferred.

Among the above options, X ^A3 in the general formula (A-3-1) is preferably an alkylidene group having 2 to 5 carbon atoms, more preferably an alkylidene group having 2 to 4 carbon atoms, and further an isopropylidene group. preferable.

n ^A4 and n ^A5 in the general formula (A-3-1) are each independently an integer of 0 to 4, and from the viewpoint of availability, both are preferably integers of 0 to 2, and more It is preferably 0 or 1, more preferably 0.
When n ^A4 or n ^A5 is an integer of 2 or more, the plurality of R ^A4 or the plurality of R ^A5 may be the same or different.

As X ^A2 in the general formula (A-3), among the above options, an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, and the above general formula (A-3-1) is preferred, an alkylene group having 1 to 5 carbon atoms is more preferred, and a methylene group is even more preferred.

(Wherein, n ^A6 is an integer of 0 to 10. * represents a binding site.)

n ^A6 in the general formula (A-4) is preferably an integer of 0 to 5, more preferably an integer of 0 to 4, and still more preferably an integer of 0 to 3, from the viewpoint of availability.

(Wherein, n ^A7 is a number from 0 to 5. * represents a binding site.)

(In the formula, R ^A6 and R ^A7 are each independently a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms. n ^A8 is an integer of 1 to 8. * represents a bonding site. )

Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms represented by R ^A6 and R ^A7 in the general formula (A-6) include methyl group, ethyl group, n-propyl group, isopropyl group and n-butyl. alkyl groups having 1 to 5 carbon atoms such as isobutyl group, t-butyl group and n-pentyl group; alkenyl groups having 2 to 5 carbon atoms; and alkynyl groups having 2 to 5 carbon atoms. The aliphatic hydrocarbon group having 1 to 5 carbon atoms may be linear or branched.
n ^A8 in the general formula (A-6) is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and still more preferably 1. When n ^A8 is an integer of 2 or more, the plurality of R ^A6 or the plurality of R ^A7 may be the same or different.

(wherein R ^A8 is an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, aryloxy group, arylthio group having 6 to 10 carbon atoms, cycloalkyl group having 3 to 10 carbon atoms, halogen atom, hydroxyl group or mercapto group, and n ^A9 is an integer of 0 to 3. R ^A9 to R ^A11 each independently represents an alkyl group having 1 to 10 carbon atoms, and R ^A12 each independently represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkyl group having 1 to 10 carbon atoms, alkylthio group, aryl group having 6 to 10 carbon atoms, aryloxy group having 6 to 10 carbon atoms, arylthio group having 6 to 10 carbon atoms, cycloalkyl group having 3 to 10 carbon atoms, halogen atom, nitro group, hydroxyl group or mercapto group, n ^A10 is each independently an integer of 0 to 4, n ^A11 is a numerical value of 0.95 to 10.0, * represents a binding site.)

Examples of the alkyl group having 1 to 10 carbon atoms represented by R ^A8 in the general formula (A-7) include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, An octyl group, a decyl group, and the like can be mentioned. These alkyl groups may be linear or branched.
Examples of the alkyl group included in the alkyloxy group having 1 to 10 carbon atoms and the alkylthio group having 1 to 10 carbon atoms represented by R ^A8 include the same alkyl groups having 1 to 10 carbon atoms as described above.
Examples of the aryl group having 6 to 10 carbon atoms represented by R ^A8 include a phenyl group and a naphthyl group.
Examples of the aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by R ^A8 include the same aryl groups having 6 to 10 carbon atoms as described above.
Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by R ^A8 include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group and a cyclodecyl group.
When n ^A9 in the general formula (A-7) is an integer of 1 to 3, R ^A8 is an alkyl group having 1 to 4 carbon atoms and 3 to 6 carbon atoms from the viewpoint of solvent solubility and reactivity. and an aryl group having 6 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms.

Examples of alkyl groups having 1 to 10 carbon atoms represented by R ^A9 to R ^A11 include methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group and decyl group. mentioned. These alkyl groups may be linear or branched. Among these, R ^A9 to R ^A11 are preferably alkyl groups having 1 to 4 carbon atoms, more preferably methyl groups and ethyl groups, and still more preferably methyl groups.
n ^A9 in the general formula (A-7) is an integer of 0 to 3, and when n ^A9 is 2 or 3, the plurality of R ^A8 may be the same or different. good too.

Among the above, the divalent organic group represented by the general formula (A-7) is compatible with other resins, solvent solubility, dielectric properties, adhesiveness with conductors, and ease of production Therefore, it is preferably a divalent organic group in which n ^A9 is 0 and R ^A9 to R ^A11 are methyl groups.

In the general formula (A-7), the plurality of R ^A8 , the plurality of R ^A12 , the plurality of n ^A9 , and the plurality of n ^A10 may be the same or different. good. Further, when n ^A11 exceeds 1, the plurality of ^RA9s , the plurality of ^RA10s , and the plurality of ^RA11s may be the same or different.

Alkyl groups having 1 to 10 carbon atoms, alkyloxy groups having 1 to 10 carbon atoms, alkylthio groups having 1 to 10 carbon atoms, and aryl groups having 6 to 10 carbon atoms represented by R ^A12 in the above general formula (A-7) , an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, and a cycloalkyl group having 3 to 10 carbon atoms are described above for the alkyl group having 1 to 10 carbon atoms represented by ^A8 , 1 to 10 alkyloxy group, 1 to 10 carbon atom alkylthio group, 6 to 10 carbon atom aryl group, 6 to 10 carbon atom aryloxy group, 6 to 10 carbon atom arylthio group, 3 to 10 carbon atom is the same as the explanation for the cycloalkyl group of
Among these, R ^A12 is an alkyl group having 1 to 4 carbon atoms, a A cycloalkyl group having 6 carbon atoms and an aryl group having 6 to 10 carbon atoms are preferred, and an alkyl group having 1 to 3 carbon atoms are more preferred.
n ^A10 in the general formula (A-7) is an integer of 0 to 4, and from the viewpoint of compatibility with other resins, solvent solubility, dielectric properties, adhesion to conductors, and ease of manufacture , preferably an integer from 0 to 3, more preferably 0 or 2.
When n ^A10 is 1 or more, the benzene ring and the N-substituted maleimide group have a twisted conformation, and intermolecular stacking is suppressed, which tends to further improve solvent solubility. From the same viewpoint, when n ^A10 is 1 or more, the substitution position of R ^A12 is preferably ortho to the N-substituted maleimide group.
n ^A11 in the general formula (A-7) is, from the viewpoint of compatibility with other resins, solvent solubility, melt viscosity, handleability and heat resistance, preferably 0.98 to 8.0, more It is preferably 1.0 to 7.0, more preferably 1.1 to 6.0.

The divalent organic group represented by the general formula (A-7) is a divalent organic group represented by the following general formula (A-7-1), the following general formula (A-7-2) A divalent organic group represented by the following general formula (A-7-3), a divalent organic group represented by the following general formula (A-7-4), etc. It is preferably mentioned.

(Wherein, n ^A11 is the same as in the above general formula (A-7). * represents a binding site.)

Examples of maleimide resins include aromatic bismaleimide resins, aromatic polymaleimide resins, and aliphatic maleimide resins. Among these, aromatic bismaleimide resins are preferred.
Specific examples of maleimide resins include N,N'-ethylenebismaleimide, N,N'-hexamethylenebismaleimide, N,N'-(1,3-phenylene)bismaleimide, N,N'-[1, 3-(2-methylphenylene)]bismaleimide, N,N'-[1,3-(4-methylphenylene)]bismaleimide, N,N'-(1,4-phenylene)bismaleimide, bis(4 -maleimidophenyl)methane, bis(3-methyl-4-maleimidophenyl)methane, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethanebismaleimide, bis(4-maleimidophenyl)ether , bis(4-maleimidophenyl)sulfone, bis(4-maleimidophenyl)sulfide, bis(4-maleimidophenyl)ketone, bis(4-maleimidocyclohexyl)methane, 1,4-bis(4-maleimidophenyl)cyclohexane, 1,4-bis(maleimidomethyl)cyclohexane, 1,4-bis(maleimidomethyl)benzene, 1,3-bis(4-maleimidophenoxy)benzene, 1,3-bis(3-maleimidophenoxy)benzene, bis[ 4-(3-maleimidophenoxy)phenyl]methane, bis[4-(4-maleimidophenoxy)phenyl]methane, 1,1-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,1-bis[ 4-(4-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidophenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidophenoxy)phenyl]ethane, 2, 2-bis[4-(3-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidophenoxy)phenyl] Butane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexa Fluoropropane, 2,2-bis[4-(4-maleimidophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidophenoxy)biphenyl, 4 , 4-bis(4-maleimidophenoxy)biphenyl, bis[4-(3-maleimidophenoxy)phenyl]ketone, bis[4-(4-maleimidophenoxy)phenyl]ketone, bis(4-maleimidophenyl)disulfide, bis [4-(3-maleimidophenoxy)phenyl]sulfide, bis[4-(4-maleimidophenoxy)phenyl]sulfide, bis[4-(3-maleimidophenoxy)phenyl]sulfoxide, bis[4-(4-maleimidophenoxy) ) phenyl]sulfoxide, bis[4-(3-maleimidophenoxy)phenyl]sulfone, bis[4-(4-maleimidophenoxy)phenyl]sulfone, bis[4-(3-maleimidophenoxy)phenyl]ether, bis[4 -(4-maleimidophenoxy)phenyl]ether, 1,4-bis[4-(4-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimidophenoxy)- α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidophenoxy)-α, α-dimethylbenzyl]benzene, 1,4-bis[4-(4-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(4-maleimidophenoxy) )-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3 -Bis[4-(3-maleimidophenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethane maleimide, aromatic bismaleimide resin having an indane skeleton, biphenylaralkyl type maleimide resin, and the like. be done. Among these, biphenylaralkyl-type maleimide resins are preferred.

(Structural unit derived from aromatic vinyl compound)
(A) The aromatic vinyl compound-derived structural unit possessed by the modified maleimide resin may be of one type alone, or may be of two or more types.

The structural unit derived from the aromatic vinyl compound is preferably a structural unit formed by addition reaction of the vinyl group of the aromatic vinyl compound. In other words, the structural unit derived from the aromatic vinyl compound contains at least a group other than the vinyl group of the aromatic vinyl compound and a group formed by an addition reaction of the vinyl group.

(A) The content of the aromatic vinyl compound-derived structural unit in the modified maleimide resin is not particularly limited, but from the viewpoint of dielectric properties, low thermal expansion and heat resistance, it is preferably 1 to 70% by mass, more preferably 4 to 60% by mass, more preferably 7 to 50% by mass.

An aromatic vinyl compound is a compound having a vinyl group bonded to an aromatic ring.
Examples of the aromatic ring to which the vinyl group is bonded include a benzene ring, a naphthalene ring, an anthracene ring and the like, and a benzene ring is preferred.
From the viewpoint of suppressing gelation, the number of vinyl groups bonded to the aromatic ring is preferably 1 to 3, more preferably 1 or 2, and even more preferably 1.
Examples of aromatic vinyl compounds include styrene, α-methylstyrene, α-methylstyrene dimer, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 4-propylstyrene, 4-t-butylstyrene, 4 -cyclohexylstyrene, 4-dodecylstyrene, 2,4-dimethylstyrene, 2,4-diisopropylstyrene, 2,4,6-trimethylstyrene, 2-ethyl-4-benzylstyrene, 4-(phenylbutyl)styrene, 4 -Styrenic compounds such as methoxystyrene, N,N-diethyl-4-aminoethylstyrene, monochlorostyrene and dichlorostyrene; 1-vinylnaphthalene, 2-vinylnaphthalene, vinylanthracene, vinylpyridine and divinylbenzene.
Among these, styrenic compounds are preferred, and α-methylstyrene dimer is more preferred. Since α-methylstyrene dimer is an aromatic vinyl compound and acts as a cleavage-type chain transfer agent for addition polymerization reaction, (A) modified maleimide resin using α-methylstyrene dimer as an aromatic vinyl compound is Good molecular weight tends to be easily obtained.

(Number average molecular weight (Mn) of (A) modified maleimide resin)
(A) The number average molecular weight (Mn) of the modified maleimide resin is not particularly limited, but from the viewpoint of handleability and moldability, it is preferably 400 to 5,000, more preferably 500 to 3,000, and still more preferably 700. ~2,000.

((A) Method for producing modified maleimide resin)
(A) A modified maleimide resin can be produced, for example, by subjecting a maleimide resin and an aromatic vinyl compound to an addition polymerization reaction in an organic solvent.
If necessary, a polymerization initiator may be used in the addition polymerization reaction between the maleimide resin and the aromatic vinyl compound.
Examples of polymerization initiators include dicumyl peroxide, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butyl organic peroxides such as peroxy)hexane, t-butylperoxyisopropylmonocarbonate, α,α'-bis(t-butylperoxy)diisopropylbenzene; These may be used individually by 1 type, or may be used in combination of 2 or more type.
The amount of the polymerization initiator used is not particularly limited, but from the viewpoint of reaction rate and reaction uniformity, it is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the total amount of the maleimide resin and the aromatic vinyl compound. More preferably 0.3 to 3 parts by mass, still more preferably 0.5 to 1.5 parts by mass.

A chain transfer agent may be used as necessary when the maleimide resin and the aromatic vinyl compound are reacted.
Examples of chain transfer agents include thiol-based chain transfer agents such as 2-mercaptoethanol, butanethiol, octanethiol, decanethiol, dodecanethiol, hexadecanethiol, and thiophenol; carbon tetrachloride; These may be used individually by 1 type, or may be used in combination of 2 or more type.

As the organic solvent used for the reaction between the maleimide resin and the aromatic vinyl compound, the organic solvent described later can be used. Among these, toluene is preferable from the viewpoint of solubility.

The reaction temperature for the addition polymerization reaction is preferably 50 to 160° C., more preferably 60 to 150° C., still more preferably 70 to 140° C., from the viewpoints of workability such as reaction rate and suppression of gelation of the product during the reaction. °C.
The reaction time of the addition polymerization reaction is preferably 0.2 to 5 hours, more preferably 0.5 to 4 hours, still more preferably 1 to 3 hours, from the viewpoint of productivity and sufficient progress of the reaction.
However, these reaction conditions are not particularly limited and can be appropriately adjusted depending on the type of raw material used.

(Content of (A) modified maleimide resin)
The content of (A) the modified maleimide resin in the resin composition of the present embodiment is not particularly limited, but is preferably 10% with respect to the total amount (100% by mass) of the resin components in the resin composition of the present embodiment. ~90% by mass, more preferably 20 to 70% by mass, still more preferably 40 to 60% by mass.
(A) When the content of the modified maleimide resin is at least the above lower limit, heat resistance, moldability, workability and conductor adhesion tend to be better. Further, when the content of (A) the modified maleimide resin is equal to or less than the above upper limit, the dielectric properties tend to be more favorable.

As used herein, the term "resin component" means a resin and a compound that forms a resin through a curing reaction.
For example, in the resin composition of this embodiment, the (A) component and the (B) component correspond to the resin component.
When the resin composition of the present embodiment contains, as optional components, a resin or a compound that forms a resin by a curing reaction in addition to the above components, these optional components are also included in the resin component. Examples of the optional component corresponding to the resin component include component (C), which will be described later.
On the other hand, the (D) component and the (E) component are not included in the resin component.

The total content of the resin components in the resin composition of the present embodiment is not particularly limited, but from the viewpoint of low thermal expansion, heat resistance, flame retardancy and conductor adhesion, the solid content of the resin composition of the present embodiment It is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and still more preferably 40 to 60% by mass relative to the total amount (100% by mass).

<(B) Thermoplastic resin>
(B) Thermoplastic resins include, for example, polyphenylene ether-based resins, styrene-based elastomers, polyolefin-based resins (excluding component (C) described later), silicone-based resins, epoxy resins, polyurethane-based resins, and polyester-based resins. , polyamide resins, polyacrylic resins, and the like.
Among these, from the viewpoint of compatibility with component (A), dielectric properties and conductor adhesion, (B) thermoplastic resin is selected from the group consisting of (B1) polyphenylene ether resin and (B2) styrene elastomer. It is preferable to contain one or more selected types.
(B) The thermoplastic resin may be used alone or in combination of two or more.

((B1) polyphenylene ether resin)
(B) The thermoplastic resin preferably contains (B1) a polyphenylene ether-based resin.
(B1) Polyphenylene ether-based resins include, for example, one or more selected from the group consisting of polyphenylene ethers and polyphenylene ether derivatives.
(B1) Polyphenylene ether-based resin preferably has a structural unit represented by the following general formula (B-1).

(In the formula, each R ^B1 is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. n ^B1 is an integer of 0 to 4.)

Each R ^{1 B1} in general formula (B-1) above is independently an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom. Examples of the aliphatic hydrocarbon group include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, t-butyl group, n-pentyl group and the like. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms, more preferably a methyl group. Further, the halogen atom includes, for example, a fluorine atom, a chlorine atom, a bromine atom, an iodine atom and the like.
Among the above, R ^{1 B1} is preferably an aliphatic hydrocarbon group having 1 to 5 carbon atoms.
n ^B1 is an integer of 0 to 4, may be an integer of 1 or 2, or may be 2; When n ^B1 is 1 or 2, R ^B1 may be substituted at the ortho position (based on the substitution position of the oxygen atom) on the benzene ring. Also, when n ^B1 is 2 or more, the plurality of R ^B1 may be the same or different.
Specifically, the structural unit represented by the above general formula (B-1) is preferably a structural unit represented by the following general formula (B-1′).

(B1) The number average molecular weight (Mn) of the polyphenylene ether resin is not particularly limited, but is preferably 1,000 to 25,000, more preferably 2,000 to 20,000, and still more preferably 3,000 to 10. , 000.
When the number average molecular weight (Mn) of the (B1) polyphenylene ether resin is at least the above lower limit, the dielectric properties tend to be even better. Further, when the number average molecular weight (Mn) of the (B1) polyphenylene ether-based resin is equal to or less than the above upper limit, the compatibility of the resin composition tends to be improved.

(B1) The polyphenylene ether-based resin is preferably a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group.
As used herein, the term "ethylenically unsaturated bond" means a carbon-carbon double bond capable of an addition reaction, and does not include a double bond of an aromatic ring. Moreover, in this specification, the "ethylenically unsaturated bond-containing group" means a substituent containing the above ethylenically unsaturated bond.

In the polyphenylene ether derivative having an ethylenically unsaturated bond-containing group, the position of the ethylenically unsaturated bond-containing group is not particularly limited, for example, it may be at one end or at both ends good.
(B1) As the polyphenylene ether-based resin, when it contains a polyphenylene ether derivative having an ethylenically unsaturated bond-containing group at one end, the (B1) polyphenylene ether-based resin has an ethylenically unsaturated bond-containing group at one end The content of the polyphenylene ether derivative is not particularly limited, but may be 30% by mass or more, 45% by mass or more, 55% by mass or more, or 70% by mass or more. may be 90% by mass or more, or may be substantially 100% by mass.

Examples of ethylenically unsaturated bond-containing groups include unsaturated aliphatic hydrocarbon groups such as vinyl group, isopropenyl group, allyl group, 1-methylallyl group, and 3-butenyl group; maleimide group, (meth)acryloyl group, and the like. and a substituent containing a heteroatom. Among these, from the viewpoint of dielectric properties, an unsaturated aliphatic hydrocarbon group or a maleimide group is preferred, an allyl group or a maleimide group is more preferred, and an allyl group is even more preferred.
In the present specification, a maleimide group, a (meth)acryloyl group, etc., partially having an unsaturated aliphatic hydrocarbon group, but when viewed as a whole group, the unsaturated aliphatic hydrocarbon group A group that cannot be said to be a hydrogen group is not included in the above-mentioned "unsaturated aliphatic hydrocarbon group".

(B1) The number of ethylenically unsaturated bond-containing groups that the polyphenylene ether-based resin has in one molecule is not particularly limited, but from the viewpoint of dielectric properties, it is preferably 2 or more, more preferably 4 or more, Also, the number may be eight or less, or may be six or less.
Furthermore, the number of ethylenically unsaturated bond-containing groups that the (B1) polyphenylene ether-based resin has at one end is preferably 2 or more, more preferably 4 or more, from the viewpoint of dielectric properties. The number may be one or less, or six or less.

(B1) The polyphenylene ether-based resin preferably contains a structure represented by the following general formula (B-2) from the viewpoint of dielectric properties.

(wherein R ^B2 is each independently an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms; n ^B2 is 1 or 2; n ^B3 is 0 or 1; represents.)

In the above general formula (B-2), the unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms represented by R ^{2 B2} includes, for example, a vinyl group, an isopropenyl group, an allyl group, a 1-methylallyl group, and 3-butenyl. and the like. Among these, from the viewpoint of dielectric properties, an unsaturated aliphatic hydrocarbon group having 2 to 5 carbon atoms is preferred, and an allyl group is more preferred.

From the viewpoint of dielectric properties, the (B1) polyphenylene ether-based resin preferably includes a structure represented by the following general formula (B-3).

(In the formula, R ^B3 and R ^B4 are each independently an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. * represents a bonding site.)

In general formula (B-3) above, the unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms represented by R ^{3 B3} and R ^{4 B4} is the same as R ^{2 B2} in general formula (B-2) above. , preferably the same.

(B1) The polyphenylene ether-based resin more preferably contains a structure represented by any one of the following general formulas (B-4) to (B-6) from the viewpoint of dielectric properties, and the following general formula (B- It is further preferable to include the structure represented by 6).

(In the formula, R ^B5 is an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. * represents a bonding site.)

(wherein R ^B6 and R ^B7 are each independently an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms; X ^B1 is a divalent aliphatic hydrocarbon group having 1 to 6 carbon atoms; * represents the binding site.)

(In the formula, R ^B8 to R ^B11 are each independently an unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms. X ^B2 is a divalent organic group. * represents a bonding site.)

The unsaturated aliphatic hydrocarbon group having 2 to 10 carbon atoms represented by R ^B5 to R ^B11 in the general formulas (B-4) to (B-6) includes R in the general formula (B-2). The same as for ^B2 can be mentioned, and the preferred ones are also the same.
Examples of the divalent aliphatic hydrocarbon group having 1 to 6 carbon atoms represented by X ^B1 in the general formula (B-5) include alkylene having 1 to 6 carbon atoms such as methylene group, ethylene group and trimethylene group. group; an alkylidene group having 2 to 6 carbon atoms such as an isopropylidene group; Among these, a methylene group and an isopropylidene group are preferred, and an isopropylidene group is more preferred.
The divalent organic group represented by X ^B2 in the general formula (B-6) includes, for example, an aliphatic hydrocarbon group which may partially contain a heteroatom, a an alicyclic hydrocarbon group which may contain a heteroatom, an aromatic hydrocarbon group which may partially contain a heteroatom, a group consisting of any combination thereof, and the like. Examples of the heteroatom include an oxygen atom, a nitrogen atom, a sulfur atom, and the like. The divalent organic group represented by X ^B2 is preferably a heteroatom-free group, such as a heteroatom-free aliphatic hydrocarbon group, a heteroatom-free alicyclic carbonized A hydrogen group is more preferred, and a group consisting of a combination of a heteroatom-free aliphatic hydrocarbon group and a heteroatom-free alicyclic hydrocarbon group is even more preferred.

For the structures represented by the general formulas (B-4), (B-5) or (B-6), more preferred embodiments are, from the viewpoint of dielectric properties, the following formulas (B-4′) and (B-6), respectively. -5′) or (B-6′). Among these, from the viewpoint of dielectric properties, a structure represented by the following formula (B-5') or (B-6') is more preferable, and a structure represented by the following formula (B-6') is more preferable. .

(In the formula, X ^B2 is the same as X ^B2 in general formula (B-6) above. * represents a binding site.)

(B1) The polyphenylene ether-based resin may contain a polyphenylene ether derivative represented by any one of the following general formulas (B-7) to (B-9), particularly the following general formula (B-8 ) or (B-9), more preferably a polyphenylene ether derivative represented by the following general formula (B-9).

(In the formula, X ^B2 is the same as X ^B2 in the general formula (B-6). n ^B4 to n ^B6 are each independently an integer of 1 to 200.)

In the above general formulas (B-7) to (B-9), n ^B4 to n ^B6 are each independently an integer of 1 to 200, and from the viewpoint of dielectric properties and the compatibility of the resin composition , may be an integer of 1 or more, an integer of 10 or more, an integer of 20 or more, or an integer of 25 or more. From the same point of view, n ^B4 to n ^B6 may each independently be an integer of 150 or less, an integer of 120 or less, or an integer of 100 or less.
Any of the general formulas (B-7) to (B-9) may be a mixture of polyphenylene ether derivatives having different values of n ^B4 to n ^B6 , and usually tends to be a mixture.

(B1) Polyphenylene ether-based resin can be prepared, for example, by subjecting a raw material polyphenylene ether and a phenolic compound to a redistribution reaction.
In the above redistribution reaction, for example, a phenol compound is mixed with a raw material polyphenylene ether that has already been polymerized and produced in an organic solvent, and if necessary, a reaction catalyst is added so that the oxy radicals of the phenol compound are , is a reaction in which the carbon atoms to which the oxygen atoms in the raw material polyphenylene ether are bonded are attacked, and the OC bond is cut there to reduce the molecular weight. At that time, the oxy radical of the attacked phenolic compound bonds with the carbon atom where the bond is broken and is incorporated into the structure of the polyphenylene ether. A known method can be used and applied for the redistribution reaction.
As the raw material polyphenylene ether, for example, polyphenylene ether having a number average molecular weight (Mn) of 3,000 to 30,000 can be used.

When preparing the (B1) polyphenylene ether derivative having an ethylenically unsaturated bond-containing group, the phenol compound includes an unsaturated aliphatic hydrocarbon group-containing phenol compound, specifically, for example, the general formula (B- It is preferable to use a phenol compound containing a structure represented by any one of 2) to (B-6).

When the resin composition of the present embodiment contains (B1) polyphenylene ether-based resin, the content of (B1) polyphenylene ether-based resin is not particularly limited, but the total amount of resin components in the resin composition of the present embodiment (100% by mass), preferably 1 to 30% by mass, more preferably 2 to 20% by mass, still more preferably 3 to 10% by mass.
(B1) When the content of the polyphenylene ether-based resin is at least the above lower limit, the dielectric properties tend to be more favorable. Moreover, when the content of the polyphenylene ether-based resin (B1) is equal to or less than the above upper limit, the heat resistance and flame retardancy tend to be improved.

((B2) Styrene Elastomer>
(B) The thermoplastic resin preferably contains (B2) a styrene elastomer.
(B2) The styrene-based elastomer is not particularly limited as long as it has a structural unit derived from a styrene-based compound.
The resin composition of the present embodiment tends to easily obtain better dielectric properties by containing (B2) the styrene-based elastomer.
The term "elastomer" as used herein means a polymer having a glass transition temperature of 25°C or less as measured by differential scanning calorimetry according to JIS K 6240:2011.
(B2) The styrene-based elastomer may be used alone or in combination of two or more.

(B2) As the styrene-based elastomer, one having a structural unit derived from a styrene-based compound represented by the following general formula (B-10) is preferable.

(In the formula, R ^B12 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R ^B13 is an alkyl group having 1 to 5 carbon atoms, and ^{n B7} is an integer of 0 to 5.)

Examples of alkyl groups having 1 to 5 carbon atoms represented by R ^{1 B12} and R ^{1 B13} in general formula (B-10) include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group and isobutyl group, t-butyl group, n-pentyl group and the like. The alkyl group having 1 to 5 carbon atoms may be linear or branched. Among these, an alkyl group having 1 to 3 carbon atoms is preferred, an alkyl group having 1 or 2 carbon atoms is more preferred, and a methyl group is even more preferred.
n ^B7 in the general formula (B-10) is an integer of 0 to 5, preferably an integer of 0 to 2, more preferably 0 or 1, still more preferably 0.

(B2) The styrene-based elastomer may contain structural units other than structural units derived from styrene-based compounds.
(B2) Structural units other than styrene compound-derived structural units that may be contained in the styrene elastomer include, for example, butadiene-derived structural units, isoprene-derived structural units, maleic acid-derived structural units, and maleic anhydride. Structural units derived from acids and the like can be mentioned.
The butadiene-derived structural unit and the isoprene-derived structural unit may be hydrogenated. When hydrogenated, structural units derived from butadiene become structural units in which ethylene units and butylene units are mixed, and structural units derived from isoprene become structural units in which ethylene units and propylene units are mixed.

Examples of (B2) styrene elastomers include hydrogenated styrene-butadiene-styrene block copolymers, hydrogenated styrene-isoprene-styrene block copolymers, and styrene-maleic anhydride copolymers. be done.
Hydrogenated products of styrene-butadiene-styrene block copolymers are SEBS obtained by completely hydrogenating the carbon-carbon double bonds in the butadiene block, and SBBS obtained by partially hydrogenating a heavy bond can be mentioned. In addition, complete hydrogenation in SEBS usually means that the hydrogenation rate of the entire carbon-carbon double bond is 90% or more, may be 95% or more, or may be 99% or more. It may be 100%. Also, the partial hydrogenation rate in SBBS is, for example, 60 to 85% with respect to the entire carbon-carbon double bond. A hydrogenated styrene-isoprene-styrene block copolymer is obtained as SEPS by hydrogenating the polyisoprene portion.
Among these, SEBS and SEPS are preferred, and SEBS is more preferred, from the viewpoint of dielectric properties, conductor adhesion, heat resistance, glass transition temperature and low thermal expansion.

In the above SEBS, the content of structural units derived from styrene compounds [hereinafter sometimes referred to as "styrene content". ] is not particularly limited, but is preferably 5 to 60% by mass, more preferably 10 to 50% by mass, and still more preferably 20 to 40% by mass.

(B2) Examples of commercially available styrene-based elastomers include Tuftec (registered trademark) H series and M series manufactured by Asahi Kasei Corporation, Septon (registered trademark) series manufactured by Kuraray Co., Ltd., and Kraton manufactured by Kraton Polymer Japan Co., Ltd. (registered trademark) G polymer series and the like.

(B2) The number average molecular weight (Mn) of the styrene-based elastomer is not particularly limited, but is preferably 10,000 to 500,000, more preferably 30,000 to 300,000, still more preferably 50,000 to 200, 000.

When the resin composition of the present embodiment contains (B2) a styrene elastomer, the content of (B2) the styrene elastomer is not particularly limited, but the total amount of resin components in the resin composition of the present embodiment (100 % by mass), preferably 5 to 60 mass %, more preferably 10 to 50 mass %, still more preferably 20 to 40 mass %.
(B2) When the content of the styrene-based elastomer is at least the above lower limit, the dielectric properties tend to be better. Moreover, when the content of the (B2) styrene-based elastomer is equal to or less than the above upper limit, heat resistance and flame retardancy tend to be more favorable.

The total content of (B) the thermoplastic resin in the resin composition of the present embodiment is not particularly limited, but is preferably 10 to 65% by mass, more preferably 15 to 55% by mass, still more preferably 25 to 45% by mass.
(B) If the total content of the thermoplastic resin is at least the above lower limit, the dielectric properties tend to be better. Moreover, when the total content of the (B) thermoplastic resin is equal to or less than the above upper limit, heat resistance and flame retardancy tend to be improved.

<(C) Crosslinking agent having two or more ethylenically unsaturated bonds>
The resin composition of the present embodiment tends to be particularly excellent in heat resistance and dielectric properties by containing (C) a cross-linking agent having two or more ethylenically unsaturated bonds.

The ethylenically unsaturated bond that the component (C) has is, for example, a vinyl group, an isopropenyl group, an allyl group, a 1-methylallyl group, an unsaturated aliphatic hydrocarbon group such as a 3-butenyl group; a maleimide group, a (meth) It is an unsaturated bond contained in a substituent containing a hetero atom such as an acryloyl group. Among these, from the viewpoint of dielectric properties, the component (C) preferably has an ethylenically unsaturated bond as the unsaturated aliphatic hydrocarbon group, more preferably a vinyl group.

The number of ethylenically unsaturated bonds that component (C) has in one molecule is preferably 3 or more, more preferably 5 or more, and still more preferably 10 or more, from the viewpoint of obtaining excellent heat resistance. .

Component (C) includes, for example, 1,2,4-trivinylcyclohexane, 1,4-butanediol divinyl ether, nonanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether, and triethylene glycol divinyl ether. , trimethylolpropane trivinyl ether, pentaerythritol tetravinyl ether, divinylbenzene, divinylbiphenyl, 1,3-bis(vinyloxy)adamantane, 1,3,5-tris(vinyloxy)adamantane, vinylcyclohexene, 1,2-vinyl group Polybutadiene having two or more, butadiene-styrene copolymer having two or more 1,2-vinyl groups, monomers or polymers having two or more ethylenically unsaturated bonds as vinyl groups; diallyl phthalate, triallyltri Melitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, trimethylolpropane triallyl ether, pentaerythritol triallyl ether, pentaerythritol tetraallyl ether, triallyl cyanurate, triallyl isocyanurate, diallyl monobenzyl isocyanurate, bisphenol diallyl ether of S, 1,3-bis(allyloxy)adamantane, 1,3,5-tris(allyloxy)adamantane, diallyl ether, bisphenol A diallyl ether, 2,5-diallylphenol allyl ether, allyl ether of novolacphenol, Monomers or polymers having two or more ethylenically unsaturated bonds as allyl groups such as allylated polyphenylene oxide; compounds having a saturated bond as a diisopropenyl group; diene compounds having two or more ethylenically unsaturated bonds such as 1,5-hexadiene, 1,9-decadiene and dicyclopentadiene;
Among these, from the viewpoint of compatibility with other resins, dielectric properties, low thermal expansion and heat resistance, polymers having two or more ethylenically unsaturated bonds as vinyl groups are preferable, and 1,2-vinyl groups and more preferably a butadiene-styrene copolymer having two or more 1,2-vinyl groups, and more preferably a polybutadiene having two or more 1,2-vinyl groups.
In this specification, the term "polybutadiene" simply means a butadiene homopolymer. That is, as component (C), a butadiene homopolymer having two or more 1,2-vinyl groups is preferred.
(C) Component may be used individually by 1 type, and may be used in combination of 2 or more type.

When the component (C) is a polybutadiene having two or more 1,2-vinyl groups, the content of structural units having a 1,2-vinyl group with respect to all butadiene-derived structural units constituting the polybutadiene [hereinafter , may be abbreviated as "vinyl group content". ] is not particularly limited, but is preferably 40 to 97% by mass, more preferably 50 to 96% by mass, and still more preferably 60 to 95% by mass.

((C) Content of cross-linking agent having two or more ethylenically unsaturated bonds)
When the resin composition of the present embodiment contains the component (C), the content of the component (C) is not particularly limited. The amount is preferably 1 to 50% by mass, more preferably 5 to 40% by mass, and still more preferably 10 to 30% by mass.
If the content of component (C) is at least the above lower limit, the dielectric properties tend to be better. Moreover, when the content of the component (C) is equal to or less than the above upper limit, heat resistance and flame retardancy tend to be better.

<(D) Inorganic filler>
From the viewpoint of low thermal expansion, elastic modulus, heat resistance and flame retardancy, the resin composition of the present embodiment preferably further contains (D) an inorganic filler.
(D) An inorganic filler may be used individually by 1 type, or may be used in combination of 2 or more type.

(D) Examples of inorganic fillers include silica, alumina, titanium oxide, mica, beryllia, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, silicon aluminum oxide, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, clay, talc, aluminum borate, silicon carbide and the like. Among these, silica, alumina, mica, and talc are preferred, silica and alumina are more preferred, and silica is even more preferred, from the viewpoints of low thermal expansion, elastic modulus, heat resistance, and flame retardancy.
Silica includes, for example, precipitated silica produced by a wet method and having a high moisture content, and dry-process silica produced by a dry method and containing almost no bound water. Dry process silica may also include crushed silica, fumed silica, fused silica, etc., depending on the production method.

(D) The average particle size of the inorganic filler is not particularly limited, but is preferably 0.01 to 20 μm, more preferably 0.1 to 10 μm, still more preferably 0.2 to 1 μm, particularly preferably 0.3 to 0.8 μm.
Here, (D) the average particle size of the inorganic filler is the particle size at the point corresponding to 50% volume when the cumulative frequency distribution curve by particle size is obtained with the total volume of the particles being 100%. . (D) The particle size of the inorganic filler can be measured with a particle size distribution analyzer using a laser diffraction scattering method.
The shape of the inorganic filler (D) may be spherical, pulverized, etc., preferably spherical.

When the resin composition of the present embodiment contains (D) an inorganic filler, a coupling agent may be used for the purpose of improving the dispersibility of the (D) inorganic filler and adhesion to the organic component. . Examples of coupling agents include silane coupling agents and titanate coupling agents.

((D) content of inorganic filler)
When the resin composition of the present embodiment contains (D) an inorganic filler, the content of the (D) inorganic filler is not particularly limited, but from the viewpoint of low thermal expansion, elastic modulus, heat resistance and flame retardancy Therefore, it is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and still more preferably 40 to 60% by mass based on the total solid content (100% by mass) of the resin composition of the present embodiment.

<(E) Curing accelerator>
From the viewpoint of improving curability, the resin composition of the present embodiment preferably further contains (E) a curing accelerator.
(E) Curing accelerators may be used alone or in combination of two or more.

(E) curing accelerators include, for example, acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine and tributylamine; imidazole compounds such as methylimidazole and phenylimidazole; hexamethylene diisocyanate resin and 2-ethyl - isocyanate mask imidazole compounds such as adducts of 4-methylimidazole; tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; dicumyl peroxide, 2,5-dimethyl-2, 5-bis(t-butylperoxy)hexyne-3, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, t-butylperoxyisopropyl monocarbonate, α,α'-bis( organic peroxides such as t-butylperoxy)diisopropylbenzene; carboxylates such as manganese, cobalt and zinc;
Among these, isocyanate masked imidazole compounds and organic peroxides are preferred from the viewpoint of heat resistance, glass transition temperature and storage stability.

(Content of (E) curing accelerator)
When the resin composition of the present embodiment contains (E) a curing accelerator, the content of (E) the curing accelerator is not particularly limited, but the total sum of the resin components in the resin composition of the present embodiment is 100 mass. parts by weight, preferably 0.1 to 10 parts by weight, more preferably 1 to 8 parts by weight, and even more preferably 2 to 6 parts by weight.
(E) When the content of the curing accelerator is at least the above lower limit, dielectric properties, heat resistance, adhesion to conductors, elastic modulus and glass transition temperature tend to be better. Moreover, when the content of (E) the curing accelerator is equal to or less than the above upper limit, the storage stability tends to be better.

<Other ingredients>
The resin composition of the present embodiment further contains resin materials other than the above components, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, pigments, colorants, lubricants, flame retardants and these, if necessary. It may contain one or more selected from the group consisting of additives other than. Each of these may be used alone or in combination of two or more. Moreover, the amount of these to be used is not particularly limited, and may be used as necessary within a range that does not impair the effects of the present embodiment.

(Organic solvent)
The resin composition of the present embodiment may contain an organic solvent from the viewpoint of facilitating handling and facilitating production of a prepreg to be described later.
An organic solvent may be used individually by 1 type, and may be used in combination of 2 or more type.
In addition, the resin composition containing the organic solvent may be called a resin varnish in this specification.

Examples of organic solvents include alcohol solvents such as ethanol, propanol, butanol, methyl cellosolve, butyl cellosolve, and propylene glycol monomethyl ether; ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ether solvents such as tetrahydrofuran; aromatic hydrocarbon solvents such as toluene, xylene and mesitylene; nitrogen atom-containing solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone; sulfur atom-containing solvents such as dimethylsulfoxide; ester solvents such as γ-butyrolactone, etc. mentioned.
Among these, from the viewpoint of solubility, alcohol solvents, ketone solvents, nitrogen atom-containing solvents, and aromatic hydrocarbon solvents are preferred, aromatic hydrocarbon solvents are more preferred, and toluene is even more preferred.

<Dielectric constant (Dk) of cured product>
The dielectric constant (Dk) of the cured product of the resin composition of the present embodiment at 10 GHz is not particularly limited, but is preferably 3.5 or less, more preferably 3.3 or less, and still more preferably 3.0 or less. . The dielectric constant (Dk) is preferably as small as possible, and the lower limit thereof is not particularly limited. There may be.
The dielectric constant (Dk) above is a value based on the cavity resonator perturbation method, more specifically, a value measured by the method described in the Examples.

<Dielectric loss tangent (Df) of cured product>
Although the dielectric loss tangent (Df) at 10 GHz of the cured product of the resin composition of the present embodiment is not particularly limited, it is preferably 0.0050 or less, more preferably 0.0040 or less, and still more preferably 0.0030 or less. The dielectric loss tangent (Df) is preferably as small as possible, and the lower limit thereof is not particularly limited. may
The above dielectric loss tangent (Df) is a value based on the cavity resonator perturbation method, more specifically, a value measured by the method described in Examples.

[Method for producing resin composition]
The method for producing a resin composition of the present embodiment is a method for producing a resin composition by blending a maleimide resin having one or more N-substituted maleimide groups, an aromatic vinyl compound and a thermoplastic resin.
The description of the maleimide resin having one or more N-substituted maleimide groups and the aromatic vinyl compound, which are used in the method for producing the resin composition of the present embodiment, refers to the production of the component (A) contained in the resin composition of the present embodiment. is the same as the description for the maleimide resin and the aromatic vinyl compound having one or more N-substituted maleimide groups used in .
The description regarding the thermoplastic resin used in the method for producing the resin composition of the present embodiment is the same as the description regarding the thermoplastic resin described as the component (B) contained in the resin composition of the present embodiment.

In the method for producing a resin composition of the present embodiment, the order of mixing each component is not particularly limited, but a reactant obtained by mixing and reacting a maleimide resin having one or more N-substituted maleimide groups and an aromatic vinyl compound and , the thermoplastic resin, and the order of blending is preferred. By adopting this mixing order, it is possible to satisfactorily prepare the (A) modified maleimide resin contained in the resin composition of the present embodiment. Suitable reaction conditions for the maleimide resin having one or more N-substituted maleimide groups and the aromatic vinyl compound are as described above.
However, in the method for producing the resin composition of the present embodiment, for example, the maleimide resin having one or more N-substituted maleimide groups, the aromatic vinyl compound, and the thermoplastic resin are blended in a state in which they are not reacted. good. Also in this case, the maleimide resin having one or more N-substituted maleimide groups and the aromatic vinyl compound react with each other during subsequent heat curing, and a structure corresponding to (A) the modified maleimide resin is formed during the curing process. and the same effect as the resin composition of the present embodiment can be obtained.
In the method for producing the resin composition of the present embodiment, components (B) to (E) and other components that may be contained in the resin composition of the present embodiment may be blended. Preferred aspects of these components are as described in the description of the resin composition of the present embodiment.

[Prepreg]
The prepreg of the present embodiment is a prepreg containing the resin composition of the present embodiment or a semi-cured material of the resin composition.
The prepreg of the present embodiment contains, for example, the resin composition of the present embodiment or a semi-cured product of the resin composition and a sheet-like fiber base material.

As the sheet-like fiber base material contained in the prepreg of the present embodiment, for example, known sheet-like fiber base materials used for various laminates for electrical insulating materials can be used.
Examples of materials for the sheet-like fiber substrate include inorganic fibers such as E-glass, D-glass, S-glass and Q-glass; organic fibers such as polyimide, polyester and tetrafluoroethylene; and mixtures thereof. These sheet-like fiber base materials have shapes such as woven fabrics, non-woven fabrics, robinks, chopped strand mats, surfacing mats, and the like.

The prepreg of the present embodiment can be produced, for example, by impregnating or applying the resin composition of the present embodiment to a sheet-like fiber base material, and then B-stages it by heating and drying.
The temperature and time of heat drying are not particularly limited, but from the viewpoint of productivity and moderate B-stage of the resin composition of the present embodiment, for example, 50 to 200 ° C., 1 to 30 minutes. can.

The concentration of solids derived from the resin composition in the prepreg of the present embodiment is not particularly limited. More preferably 25 to 80 mass %, still more preferably 30 to 75 mass %.

[Resin film]
The resin film of the present embodiment is a resin film containing the resin composition of the present embodiment or a semi-cured product of the resin composition.
The resin film of the present embodiment can be produced, for example, by applying the resin composition of the present embodiment containing an organic solvent, ie, a resin varnish, to a support, followed by heating and drying.
Examples of the support include plastic films, metal foils, release papers and the like.
The temperature and time of heat drying are not particularly limited, but from the viewpoint of productivity and moderate B-stage of the resin composition of the present embodiment, it can be 50 to 200 ° C. and 1 to 30 minutes.

The resin film of the present embodiment is preferably used for forming an insulating layer when manufacturing a printed wiring board.

[Laminate]
The laminate of this embodiment is a laminate comprising a cured product of the resin composition of this embodiment or a cured product of a prepreg and a metal foil.
A laminate having metal foil is sometimes referred to as a metal-clad laminate.

The metal of the metal foil is not particularly limited, and examples thereof include copper, gold, silver, nickel, platinum, molybdenum, ruthenium, aluminum, tungsten, iron, titanium, chromium, and alloys containing one or more of these metal elements. are mentioned.

The laminate of the present embodiment can be produced, for example, by placing a metal foil on one side or both sides of the prepreg of the present embodiment, followed by heating and pressure molding.
Normally, the laminate of the present embodiment is obtained by curing the B-staged prepreg by this heat and pressure molding.
In the heat and pressure molding, only one prepreg may be used, or two or more prepregs may be laminated.
For heat-press molding, for example, a multi-stage press, a multi-stage vacuum press, continuous molding, an autoclave molding machine, etc. can be used.
The conditions for the heat and pressure molding are not particularly limited, but can be, for example, a temperature of 100 to 300° C., a time of 10 to 300 minutes, and a pressure of 1.5 to 5 MPa.

[Printed wiring board]
The printed wiring board of the present embodiment includes at least one selected from the group consisting of a cured product of the resin composition of the present embodiment, a cured product of the prepreg of the present embodiment, and a laminate of the present embodiment. is a board.
For the printed wiring board of the present embodiment, for example, one or more selected from the group consisting of the cured prepreg of the present embodiment, the cured resin film of the present embodiment, and the laminate by a known method. , can be manufactured by carrying out conductor circuit formation. Moreover, a multilayer printed wiring board can also be manufactured by applying a multilayer adhesion process, if necessary. The conductor circuit can be formed by appropriately performing, for example, drilling, metal plating, etching of metal foil, or the like.

[Semiconductor package]
The semiconductor package of this embodiment is a semiconductor package having the printed wiring board of this embodiment and a semiconductor element.
The semiconductor package of this embodiment can be manufactured, for example, by mounting a semiconductor element, a memory, etc. on the printed wiring board of this embodiment by a known method.

EXAMPLES The present embodiment will be specifically described below with reference to Examples. However, this embodiment is not limited to the following examples.

In each example, the number average molecular weight (Mn) was measured by the following procedure.
(Method for measuring number average molecular weight (Mn))
Number average molecular weight (Mn) was calculated by gel permeation chromatography (GPC) from a calibration curve using standard polystyrene. Calibration curve, standard polystyrene: TSK standard POLYSTYRENE (Type; A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) [manufactured by Tosoh Corporation, product name] and approximated by a cubic equation. GPC measurement conditions are shown below.
Apparatus: High-speed GPC apparatus HLC-8320GPC
Detector: UV absorption detector UV-8320 [manufactured by Tosoh Corporation]
Column: Guard column; TSK Guardcolumn SuperHZ-L + column; TSKgel SuperHZM-N + TSKgel SuperHZM-M + TSKgel SuperH-RC (all manufactured by Tosoh Corporation, trade name)
Column size: 4.6 x 20 mm (guard column), 4.6 x 150 mm (column), 6.0 x 150 mm (reference column)
Eluent: Tetrahydrofuran Sample concentration: 10 mg/5 mL
Injection volume: 25 μL
Flow rate: 1.00 mL/min Measurement temperature: 40°C

[Production of modified maleimide resin]
Production Examples 1-4
Each component shown in Table 1 was blended according to the blending amount shown in Table 1 in a 2 L glass flask container equipped with a thermometer, a reflux condenser and a stirrer and capable of being heated and cooled. The mixture was stirred at 100° C. for 2 hours to obtain a modified maleimide resin solution having a solid concentration of 50% by mass. Table 1 shows the number average molecular weight (Mn) of the modified maleimide resin.

* "MIR-3000" means biphenyl aralkyl-type maleimide (manufactured by Nippon Kayaku Co., Ltd., trade name "MIR-3000").

[Production of polyphenylene ether derivative]
Production example 5
Toluene, raw material polyphenylene ether "Zylon (registered trademark) S203A" (trade name, manufactured by Asahi Kasei Corporation, number-average Molecular weight (Mn): 12,000) and an allyl group-containing compound represented by the following general formula (B-11) were added and dissolved with stirring at 90 to 100°C. The compounding amount of the allyl group-containing compound was such that the hydroxyl group equivalent derived from the allyl group-containing compound was 6 (equivalent ratio) with respect to the hydroxyl group equivalent of the raw material polyphenylene ether. The amount of toluene used was such that the reaction concentration was 35% by mass.

(In the formula, X ^B2 is a divalent organic group and is explained in the same manner as X ^B2 in the general formula (B-6) above.)

After visually confirming that the allyl group-containing compound has dissolved, 2 parts by mass of t-butylperoxyisopropyl monocarbonate per 100 parts by mass of the starting polyphenylene ether, and manganese octylate per 100 parts by mass of the starting polyphenylene ether. 0.11 part by mass was added, and the redistribution reaction was carried out at a solution temperature of 90 to 100° C. for 6 hours, followed by cooling to 40° C. to obtain a polyphenylene ether derivative having an allyl group at the molecular end. When a small amount of this reaction solution was taken out and subjected to GPC measurement, the double peak derived from the allyl group-containing compound became a single peak, and the number average molecular weight (Mn) of the polyphenylene ether derivative was 4,200.

[Production of resin composition]
Examples 1 to 4, Comparative Example 1
Each component shown in Table 2 is blended with toluene according to the blending amount shown in Table 2, stirred and mixed while heating at 25 ° C. or 50 to 80 ° C., and the solid content concentration is about 50% by mass. A composition was prepared. In Table 2, the unit of the compounding amount of each component is parts by mass, and in the case of solutions, it means parts by mass in terms of solid content. In addition, component (A) is directly blended with the reaction solution obtained in each production example, and the blending amounts shown in Table 2 are the maleimide resin having one or more N-substituted maleimide groups used in each production example and It was taken as the total amount of the aromatic vinyl compound.

[Production of resin film and resin plate with double-sided copper foil]
The resin composition obtained in each example was applied to a PET film having a thickness of 38 μm (manufactured by Teijin Limited, product name: G2-38) and then dried by heating at 170° C. for 5 minutes to obtain a B-stage resin. A film was produced. After the resin film was peeled off from the PET film, it was pulverized into a B-stage resin powder, which was put into a Teflon (registered trademark) sheet punched into a size of 1 mm thick×50 mm long×35 mm wide. Next, 18 μm-thick low-profile copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., trade name: 3EC-VLP-18) is placed above and below the Teflon (registered trademark) sheet containing the resin powder, and heated and pressed. A pre-molded laminate was obtained. The low-profile copper foil was arranged with the M side facing the resin powder. Subsequently, the laminate is subjected to heat and pressure molding under conditions of a temperature of 230° C., a pressure of 2.0 MPa, and a time of 120 minutes, and the resin powder is molded into a resin plate and cured to produce a resin plate with copper foil on both sides. bottom. The thickness of the resin plate portion of the obtained resin plate with copper foil on both sides was 1 mm.

[Evaluation method and measurement method]
Using the resin plates with copper foils on both sides obtained in the above examples and comparative examples, each measurement and evaluation were performed according to the following methods. Table 2 shows the results.

(Method for measuring dielectric constant and dielectric loss tangent)
The resin plate with copper foil on both sides obtained in each example was immersed in a 10% by mass solution of ammonium persulfate (Mitsubishi Gas Chemical Co., Ltd.), which is a copper etchant, to remove the copper foil on both sides, and a test piece of 2 mm × 50 mm was obtained. was made. Then, according to the cavity resonator perturbation method, the dielectric constant (Dk) and dielectric loss tangent (Df) of the test piece were measured at an ambient temperature of 25° C. and in a 10 GHz band.

(Method for measuring coefficient of thermal expansion and glass transition temperature)
The copper foil on both sides of the resin plate with copper foil on both sides obtained in each example was removed by etching to prepare a test piece of 5 mm square. Then, using a thermomechanical measurement device (TMA) (manufactured by TA Instruments Japan Co., Ltd., product name: Q400), in accordance with the IPC (The Institute for Interconnecting and Packaging Electronic Circuits) standards, the above The coefficient of thermal expansion and glass transition temperature of the specimen were measured. The coefficient of thermal expansion is the coefficient of thermal expansion in the thickness direction of the resin plate, and was taken as the average coefficient of thermal expansion in the temperature range of 30 to 120°C.

(Measurement of copper foil peel strength)
A test piece was obtained by etching the copper foil of the resin plate with copper foil on both sides obtained in each example into a straight line shape with a width of 3 mm. The formed straight line-shaped copper foil is attached to a small desktop tester (manufactured by Shimadzu Corporation, trade name "EZ-TEST"), and is subjected to JIS C 6481: 90 at room temperature (25 ° C.) in accordance with 1996. The copper foil peel strength was measured by peeling it off in the ° direction. The pulling speed for peeling off the copper foil was 50 mm/min.

In addition, each material in Table 2 is as follows.
[(A) component]
- Modified maleimide resins 1 to 4: Modified maleimide resins produced in Production Examples 1 to 4

[(A') Component]
- Unmodified maleimide resin: biphenyl aralkyl type maleimide (manufactured by Nippon Kayaku Co., Ltd., trade name "MIR-3000")

[(B1) component]
- Polyphenylene ether derivative: Polyphenylene ether derivative produced in Production Example 5

[(B2) component]
・ SEBS: Hydrogenated styrene thermoplastic elastomer (SEBS), manufactured by Kraton Polymer Japan Co., Ltd., trade name “Kraton (registered trademark) G1726”, styrene content: 30% by mass

[(C) Component]
・Butadiene/styrene copolymer having 1,2-vinyl group: butadiene-styrene copolymer, manufactured by CRAY VALLEY, trade name “Ricon 257”, styrene/butadiene content ratio = 35/65 (by mass), derived from butadiene The ratio of structural units having a 1,2-vinyl group in all structural units is 70% by mass

[(E) Component]
・ Isocyanate mask imidazole: manufactured by Daiichi Kogyo Seiyaku Co., Ltd., trade name "G-8009L"

As is clear from the results shown in Table 2, the cured products of the resin compositions obtained in Examples 1 to 4 of the present embodiment are excellent in dielectric properties and low thermal expansion properties. On the other hand, the cured product of the resin composition of Comparative Example 1 was inferior in dielectric properties and low thermal expansion properties.

Since the cured product produced from the resin composition of the present embodiment is excellent in dielectric properties and low thermal expansion properties, prepregs, laminates, printed wiring boards, semiconductor packages, etc. obtained using the resin composition are particularly suitable for high-frequency Suitable for use in electronic components that handle signals.

Claims (15)

(A) a resin containing a structural unit derived from a maleimide resin having one or more N-substituted maleimide groups and a structural unit derived from an aromatic vinyl compound;
(B) a thermoplastic resin;
A resin composition containing The resin composition according to claim 1, wherein the aromatic vinyl compound is α-methylstyrene dimer. The resin composition according to claim 1 or 2, wherein the (B) thermoplastic resin contains (B1) a polyphenylene ether-based resin. The resin composition according to any one of claims 1 to 3, wherein the (B) thermoplastic resin contains (B2) a styrene elastomer. 5. The resin composition according to any one of claims 1 to 4, further comprising (C) a cross-linking agent having two or more ethylenically unsaturated bonds. A prepreg containing the resin composition according to any one of claims 1 to 5 or a semi-cured product of the resin composition. A laminate comprising a cured product of the resin composition according to any one of claims 1 to 5 or a cured product of the prepreg according to claim 6, and a metal foil. A resin film containing the resin composition according to any one of claims 1 to 5 or a semi-cured product of the resin composition. One or more selected from the group consisting of the cured product of the resin composition according to any one of claims 1 to 5, the cured product of the prepreg according to claim 6, and the laminate according to claim 7. printed wiring board. A semiconductor package comprising the printed wiring board according to claim 9 and a semiconductor element. A method for producing a resin composition comprising blending a maleimide resin having at least one N-substituted maleimide group, an aromatic vinyl compound and a thermoplastic resin. The resin composition according to claim 11, wherein the thermoplastic resin is blended with a reactant obtained by blending and reacting the maleimide resin having one or more N-substituted maleimide groups and the aromatic vinyl compound. Production method. The method for producing a resin composition according to claim 11 or 12, wherein the aromatic vinyl compound is α-methylstyrene dimer. A resin comprising a structural unit derived from a maleimide resin having at least one N-substituted maleimide group and a structural unit derived from an aromatic vinyl compound. The resin of claim 14, wherein said aromatic vinyl compound is α-methylstyrene dimer.