JP2023104217A - Processing device - Google Patents

Abstract

To prevent breakage of a rotary joint in a processing device.SOLUTION: The present invention relates to a grinding device 1 comprising: a mechanism 35 for rotating a table 3 on which a wafer is sucked and held; and a rotary joint 40 connected to a rotary shaft 350 of the table rotation mechanism 35. The table 3 includes: a center sucking plate 30 which sucks a center of the wafer; an outer periphery sucking plate 32 which encloses the center sucking plate 30 and sucks an outer peripheral portion of the wafer; an annular partition part 34 disposed between the center sucking plate 30 and the outer periphery sucking plate 32; and a frame body 31 in which the center sucking plate 30, the partition part 34 and the outer periphery sucking plate 32 are stored. The frame body 31 includes: a center suction path 37 which communicates a suction source 42 to the center sucking plate 30 and passes the rotary joint 40; and an outer periphery suction path 39 communicating with the outer periphery sucking plate 32. The grinding device comprises a ring member 50 which surrounds the frame body 31 with a clearance 500 outside the frame body and does not rotate, and a communication path 51 which is formed in the ring member 50 and communicates a suction source 52 with the outer periphery suction path 39 with no contact via the clearance 500.SELECTED DRAWING: Figure 1

Description

The present invention relates to a processing apparatus for processing workpieces such as semiconductor wafers.

For example, in a grinding apparatus that grinds a wafer with a grindstone, the wafer is held on the holding surface of a chuck table, the chuck table is rotated, an annular grindstone passing through the center of the wafer is rotated, and the grindstone grinds from the outer periphery toward the center of the wafer. , and grinds the wafer at the radius of the wafer.

For example, as disclosed in Patent Document 1, a wafer having a warping element on the outer peripheral portion is subjected to grinding by holding the central portion of the wafer by suction to reduce the warping element, and then grinding the outer peripheral portion of the wafer. It is also sucked and held and ground to a predetermined thickness. Therefore, the holding surface of the chuck table is composed of a central holding surface for sucking and holding the central portion of the wafer and an annular holding surface for sucking and holding the outer peripheral portion of the wafer.

JP 2021-065991 A

Since the annular holding surface sucks grinding waste liquid including grinding dust during grinding, a sealing member is interposed between the rotary joint and the spindle, which are arranged in a communication passage that communicates between the annular holding surface and the suction source. Grinding waste liquid enters. Since the chuck table is rotated in this state, the grinding waste becomes an abrasive material between the spindle and the seal member, damaging the seal member. In other words, there is a problem that the grinding waste liquid sucked by the annular holding surface damages the sealing member, making it impossible to suck and hold the wafer on the annular holding surface.

Therefore, the processing apparatus that processes the wafer by sucking and holding the wafer on the holding surface of the chuck table has a problem of preventing damage to the rotary joint.

The present invention for solving the above problems comprises a chuck table for sucking and holding a wafer on a holding surface, a table rotation mechanism for rotating the chuck table, a processing mechanism for processing the wafer held on the holding surface, and the a rotary joint connected to a rotating shaft that constitutes a table rotating mechanism, wherein the chuck table includes a central suction plate that suction-holds the central portion of the wafer; An outer peripheral suction plate for sucking and holding the outer peripheral portion of the formed wafer, an annular partition disposed between the central suction plate and the outer peripheral suction plate, the central suction plate, the partition and the outer peripheral suction a frame body having a recess for accommodating a plate, the frame body having a central suction passage that passes through the rotary joint and communicates a suction source with the central suction plate; and a peripheral suction passage that communicates with the peripheral suction plate. a non-rotating ring member disposed so as to surround the frame with a gap outside the frame; and a non-rotating ring member formed in the ring member and communicating the suction source with the outer peripheral suction path through the gap in a non-contact manner. and a communication passage for allowing the outer peripheral suction plate to communicate with the suction source through the ring member, the gap, and the outer peripheral suction passage.

In the processing apparatus according to the present invention, the chuck table includes an outer peripheral suction path that communicates with the outer peripheral suction plate as a vacuum line separate from the central suction path that passes through the rotary joint and communicates the suction source with the central suction plate. A non-rotating ring member disposed so as to surround the outside of the body with a gap, and a communicating passage formed in the ring member and communicating the suction source with the outer peripheral suction passage through the gap in a non-contact manner, the ring member comprising: Since the outer peripheral suction plate communicates with the suction source through the gap and the outer peripheral suction path, even if the outer peripheral suction plate sucks grinding waste liquid containing grinding waste during grinding, the rotary joint can be prevented from being damaged. It becomes possible.

1 is an overall perspective view showing an example of a grinding device; FIG. 4 is a cross-sectional view illustrating a grinding mechanism, a chuck table, a table rotation mechanism, a rotary joint, a central suction path, an outer peripheral suction path, a ring member, and a communication path; FIG. FIG. 10 is a perspective view illustrating the chuck table in a state in which the central suction plate, the partition portion, and the outer peripheral suction plate are accommodated in the concave portion of the frame; It is a perspective view explaining the frame of a chuck table.

The processing device 1 shown in FIG. 1 is a device (hereinafter referred to as a grinding device 1) that grinds a wafer 90 held on a chuck table 3 by suction using a processing mechanism 16 (hereinafter referred to as a grinding mechanism 16). The front side (−Y direction side) of the device base 10 with the Y-axis direction of the device 1 as its longitudinal direction is a loading/unloading area in which the wafer 90 is loaded onto and detached from the chuck table 3, and the rear side of the device base 10 ( +Y direction side) is a grinding area where the grinding mechanism 16 grinds the wafer 90 sucked and held on the chuck table 3 . It should be noted that the processing apparatus according to the present invention is not limited to a single-axis type grinding mechanism 16 like the grinding apparatus 1, but includes a rough grinding mechanism and a finish grinding mechanism, and roughly grinds the wafer 90 on a rotating turntable. It may be of the two-axis type that can be positioned below the mechanism, or the finish grinding mechanism. Also, the processing apparatus may be a polishing apparatus that polishes the wafer 90 with a polishing pad.

The wafer 90 shown in FIG. 1 is, for example, a circular semiconductor wafer made of a silicon base material or the like. A plurality of devices are formed on the surface 900 of the wafer 90 facing downward in FIG. is affixed and protected. A back surface 903 of the wafer 90 facing upward is a surface to be ground. The wafer 90 may be made of gallium arsenide, sapphire, gallium nitride, resin, ceramics, silicon carbide, or the like other than silicon, or may be a package substrate or the like.

The horizontal movement unit 13 for moving the chuck table 3 toward the grinding mechanism 16 in the Y-axis direction shown in FIG. A rail 131 , a motor 132 connected to one end of the ball screw 130 to rotate the ball screw 130 , and a movable plate 133 having an internal nut screwed onto the ball screw 130 and a bottom part slidably contacting the guide rail 131 . When the motor 132 rotates the ball screw 130, the movable plate 133 is guided by the guide rail 131 and linearly moves in the Y-axis direction. , and the table rotation mechanism 35, etc., to move the chuck table 3 in the Y-axis direction. Note that the horizontal movement unit 13 may be a turntable.

As shown in FIG. 1, a column 11 is erected in the grinding processing area. A mechanism 17 is provided. The grinding feed mechanism 17 includes a ball screw 170 whose axial direction is the Z-axis direction, a pair of guide rails 171 arranged parallel to the ball screw 170, and an elevating motor 172 connected to the upper end of the ball screw 170 and rotating the ball screw 170. and an elevating plate 173 whose inner nut is screwed onto the ball screw 170 and whose side portion is in sliding contact with the guide rail 171. When the elevating motor 172 rotates the ball screw 170, the elevating plate 173 is accordingly guided Guided by the rail 171, it reciprocates in the Z-axis direction, and the grinding mechanism 16 fixed to the lifting plate 173 is fed for grinding in the Z-axis direction.

The grinding mechanism 16 that grinds the wafer 90 held on the holding surface 33 of the chuck table 3 includes a rotating shaft 160 whose axial direction is the Z-axis direction, a housing 161 that rotatably supports the rotating shaft 160, and a rotating shaft 160. an annular mount 163 connected to the lower end of the rotating shaft 160; a grinding wheel 164 detachably attached to the lower surface of the mount 163; and a holder 165 fixed to the lifting plate 173 . The grinding wheel 164 includes a wheel base 166 and a grinding wheel 167 annularly arranged on the bottom surface of the wheel base 166 .

As shown in FIG. 2, inside the rotating shaft 160, a flow path 169 that communicates with a grinding water supply source 168 and serves as a path for grinding water is provided through the rotating shaft 160 in the axial direction. The path 169 further branches radially at the mount 163 and opens at the bottom surface of the wheel base 166 so that grinding water can be jetted toward the grinding wheel 167 .

As shown in FIG. 1, for example, at a position adjacent to the grinding mechanism 16 lowered to the grinding position, a thickness measuring section 104 for measuring the thickness of the wafer 90 by contact is arranged. The thickness measurement unit 104 measures the height position of the holding surface 33 serving as the reference surface, that is, the upper surface of the frame body 31 (annular wall 312), the second linear gauge measures the height position of the back surface 903 of the wafer 90 to be ground, and the calculating unit calculates the difference between the measured values of both linear gauges. , the thickness of the wafer 90 can be measured sequentially during grinding.
Note that the thickness measuring unit 104 may be of a non-contact type.

As shown in FIG. 2, the grinding apparatus 1 includes a chuck table 3 that sucks and holds a wafer 90 on a holding surface 33, a table rotation mechanism 35 that rotates the chuck table 3, and a rotation shaft 350 that constitutes the table rotation mechanism 35. and a connected rotary joint 40 .

The chuck table 3 shown in FIGS. 1, 2, and 3 has a circular shape in plan view and includes a central suction plate 30 for sucking and holding the central portion of the wafer 90, and an annular shape surrounding the central suction plate 30 to support the outer peripheral portion of the wafer 90. A peripheral suction plate 32 for suction and holding, an annular partition part 34 arranged between the central suction plate 30 and the peripheral suction plate 32, and the central suction plate 30, the partition part 34 and the peripheral suction plate 32 are accommodated. and a frame 31 having a recess 310 .

The central suction plate 30 having a circular shape in a plan view is made of a porous member such as porous ceramics, porous silicon, or porous silicon carbide, and its upper exposed surface serves as a central suction surface 300 . The annular partition portion 34 abutting on the outer surface of the central suction plate 30 is, for example, an annular wall made of non-breathable hard material.

The outer peripheral suction plate 32, which is annular in plan view, is a porous member similar to the central suction plate 30, and is formed to have an inner diameter that fits into the partition portion 34 and an outer diameter that fits into the circular concave portion 310. ing. The upper surface, which is the exposed surface of the outer peripheral suction plate 32 , serves as the outer peripheral suction surface 320 . The porous member forming the outer peripheral suction plate 32 may have finer pores than the central suction plate 30 to make it more difficult to suck in grinding dust.

The frame 31 is made of, for example, a dense body such as ceramics. and an annular wall 312 provided. The upper surface of the annular wall 312 is the upper surface of the frame 31 that is flush with the central suction surface 300 , the upper surface of the partition section 34 , and the outer peripheral suction surface 320 .

The area inside the annular wall 312 shown in FIG. 4 forms a recess 310 in which the central suction plate 30 is accommodated. Then, as shown in FIG. 3, the central suction plate 30, the partition portion 34, and the outer peripheral suction plate 32 are integrally fitted into the recess 310, and the outer surface of the outer peripheral suction plate 32 is surrounded by the annular wall 312. . A holding surface 33 of the chuck table 3 is formed by the central suction surface 300 of the central suction plate 30 , the upper surface of the partition portion 34 , and the outer peripheral suction surface 320 of the outer peripheral suction plate 32 . It should be noted that the holding surface 33 is formed in an extremely gentle conical slope whose apex is at the center of the central suction surface 300 and cannot be seen with the naked eye. Grinding water can be properly discharged.

As shown in FIG. 4, in the area corresponding to the central suction plate 30 shown in FIG. and a linear suction groove 317 extending radially from the center of the frame base 311 and communicating with the central suction groove 316 are formed. The upper end of the central suction passage 37 is opened at the bottom of the linear suction groove 317 . Note that the upper ends of the central suction groove 316 , the linear suction groove 317 , and the central suction path 37 are located inside the partition 34 when the partition 34 is accommodated in the recess 310 . Note that the central suction plate 30, the partition portion 34, and the outer peripheral suction plate 32 are adhered and fixed to the bottom surface of the recess 310 with an adhesive or the like.

In this embodiment, the table rotating mechanism 35 shown in FIG. 2 is a pulley mechanism, and includes a rotating shaft 350 connected to the lower surface of the chuck table 3 via a table base 358 and extending perpendicularly to the chuck table 3. ing. A drive pulley 353 is attached to the shaft of a motor 352 that serves as a drive source for rotating the rotating shaft 350 , and an endless belt 354 is wound around the drive pulley 353 . A driven pulley 355 is attached to the lower end side of the rotating shaft 350 , and the endless belt 354 is also wound around this driven pulley 355 . When the motor 352 rotates the driving pulley 353 , the endless belt 354 rotates with the rotation of the driving pulley 353 , and the rotation of the endless belt 354 causes the driven pulley 355 and the rotating shaft 350 to rotate.

As shown in FIG. 2 , the rotary joint 40 is connected to the lower end side of the rotating shaft 350 . The rotary joint 40 has, for example, a casing whose overall shape is cylindrical. A slight gap is formed between the outer surface of 350 . Further, inside the rotary joint 40, a mechanical seal (not shown) is arranged to prevent leakage of fluid from the central suction passage 37 passing through the inside of the rotating shaft 350. As shown in FIG. The mechanical seal is composed of, for example, a rotary seal ring that is moved by a spring or the like and a fixed seal ring. It is possible to prevent fluid from leaking from inside the central suction passage 37 that opens on the outer surface of the rotating shaft 350, for example, while preventing the fluid from leaking. In addition, when the central suction passage 37 is opened at the lower end surface of the rotating shaft 350, the rotary joint 40 is not of the type in which the rotating shaft 350 is inserted as described above. It may be of a connecting type.

For example, the chuck table 3 can adjust the inclination of the holding surface 33, which is an extremely gentle conical slope, with respect to the grinding surface of the grinding wheel 167 by means of the inclination adjusting unit 36 shown in FIGS. The tilt adjustment unit 36 includes, for example, a cylindrical support case 360 , which is arranged below the cover 55 shown in FIG. 1 and surrounds the rotating shaft 350 . As shown in FIG. 2, a bearing 361 is arranged on the inner peripheral side of the support case 360, and the support case 360 rotatably supports the rotary shaft 350 via the bearing 361. As shown in FIG.

On the lower surface side of the support case 360, two elevating members 362 constituting the tilt adjustment unit 36 and a support column (not shown) for fixing the support case 360 are arranged at intervals of, for example, 120 degrees in the circumferential direction. The two lifting members 362 arranged on the movable plate 133 of the horizontal movement unit 13 shown in FIG. 1 are, for example, electric cylinders or air cylinders. By vertically moving the piston rods of the two elevating members 362 , the inclination of the holding surface 33 can be adjusted by adjusting the inclination of the rotating shaft 350 via the support case 360 . Note that the lifting member 362 may be a piezoelectric element or the like that can expand and contract in the Z-axis direction.

As shown in FIGS. 2 and 4, the frame 31 includes a central suction passage 37 that communicates the suction source 42 with the central suction plate 30 shown in FIG. A suction path 39 is provided.
The upper end of the central suction path 37 opens into the linear suction groove 317 shown in FIG. 4, and the central suction path 37, as shown in FIG. 358 , further passes through the rotating shaft 350 and the rotary joint 40 , and communicates with an external pipe 420 connected to the rotary joint 40 . The external pipe 420 communicates with a suction source 42 such as an ejector mechanism or a vacuum generator. The rotary joint 40 completely transfers the suction force generated by the suction source 42 to the rotating shaft 350 side. Whether or not the chuck table 3 sucks and holds the wafer 90 on the holding surface 33 without vacuum leak can be confirmed by the pressure value indicated by the pressure gauge 421 arranged in the external pipe 420 shown in FIG. .

The external pipe 420 has a suction open/close valve 423 and a suction flow control valve 424 that switch between a state in which the central suction passage 37 communicates with the suction source 42 and a state in which the central suction passage 37 does not communicate with the suction source 42 in order from the suction source 42 toward the central suction passage 37 side. are arranged.

One end of the air supply pipe 431 shown in FIG. 2 communicates with the central suction passage 37 via a three-way pipe and an external pipe 420 (not shown), and the other end communicates with an air supply source 43 such as a compressor. . Further, the air supply pipe 431 is provided with an air supply opening/closing valve 432 for switching between a state in which the central suction passage 37 communicates with the air supply source 43 and a state in which the central suction passage 37 does not communicate in order from the air supply source 43 toward the external pipe 420 . An air flow control valve 433 is provided.

One end of the water pipe 441 shown in FIG. 2 communicates with the central suction passage 37 via a three-way pipe (not shown) and an external pipe 420, and the other end communicates with the water supply source 44 such as a pump. there is Further, the water pipe 441 is provided with a water supply opening/closing valve 444 for switching between a state in which the central suction passage 37 communicates with the water supply source 44 and a state in which the central suction passage 37 does not communicate in order from the water supply source 44 toward the external pipe 420, and a water A flow control valve 445 is provided.

The outer peripheral suction paths 39 shown in FIGS. 2 and 4 are formed in a plurality of frames 31 at equal intervals in the circumferential direction of the chuck table 3, for example. One end side of each outer peripheral suction path 39 is open to the inner surface of the annular wall 312 of the frame 31 and communicates with the outer peripheral suction plate 32 . For example, one outer surface suction groove 315 is formed in the outer surface of the frame 31 , and the other end side of each outer peripheral suction path 39 opens into the outer surface suction groove 315 . A suction force can be transmitted from the plurality of communicating passages 51 of the ring member 50 to the entire circumference of the outer suction groove 315 , and the suction force is transmitted from the outer suction groove 315 to each outer peripheral suction passage 39 . Note that the plurality of outer peripheral suction paths 39 may be connected inside the frame 31 .

The grinding apparatus 1 includes a ring member 50 which is annular in plan view and does not rotate with respect to the rotating chuck table 3. The ring member 50 is arranged so as to surround the frame 31 shown in FIGS. A communication path 51 is formed in the member 50 and communicates the suction source 52 with the outer peripheral suction path 39 in a non-contact manner via a gap 500 .

As shown in FIG. 2, for example, a plurality of communication paths 51 are formed in the ring member 50 at equal intervals in the circumferential direction. One end of the communicating passage 51 is open on the inner surface of the ring member 50 and faces the outer surface suction groove 315 of the frame 31 . The communicating path 51 bends downward within the ring member 50 and the other end opens to the lower surface of the ring member 50 . An opening serving as the other end of the communication passage 51 communicates with the suction source 52 via an external pipe 511 and an external suction valve 512 . Note that the plurality of communication paths 51 may be connected inside the ring member 50 .

As shown in FIG. 1, the chuck table 3 is surrounded by a cover 55 having a circular opening that exposes the chuck table 3. The cover 55 is connected to a bellows cover 550 that expands and contracts in the Y-axis direction. ing. On both sides of the bellows cover 550 in the X-axis direction, drainage ports are formed that lead to a water case (not shown) that stores the grinding waste liquid. The ring member 50 in this embodiment is fixed to the upper surface of the cover 55, for example.

The operation of each component of the grinding apparatus 1 and each grinding process when the wafer 90 is ground using the grinding apparatus 1 shown in FIG. 1 will be described below.
First, the wafer 90 is placed on the holding surface 33 with the rear surface 903 facing upward so that the center of the holding surface 33 of the chuck table 3 positioned in the loading/unloading area coincides with the center of the wafer 90 . In this embodiment, as shown in FIG. 2 , the central suction surface 300 and the top surface of the partition 34 are covered with the wafer 90 , the outer peripheral suction surface 320 is partially covered with the wafer 90 , and the outer peripheral suction surface 320 is covered with the wafer 90 . is exposed, the wafer 90 may cover the entire outer peripheral suction surface 320 . Alternatively, the wafer 90 may cover the entire outer peripheral suction surface 320 and be placed on the annular wall 312 of the frame 31 .

Next, with the suction opening/closing valve 423 shown in FIG. 300. In addition, with the external suction valve 512 open, the suction force generated by the suction source 52 is applied to the external pipe 511, the communication passage 51 of the ring member 50, the gap 500, the outer surface suction groove 315 of the frame 31, and the outer peripheral suction. It is transmitted to the outer suction surface 320 through the path 39 and the outer suction plate 32 . As a result, the wafer 90 is held by suction on the holding surface 33 of the chuck table 3 .

Further, the rear surface 903 of the wafer 90 that is sucked and held along the holding surface 33 that is a gentle conical slope that cannot be seen with the naked eye is parallel to the grinding surface (lower surface) of the grinding wheel 167 of the grinding mechanism 16 . Then, the tilt of the chuck table 3 is adjusted by the tilt adjusting unit 36 shown in FIGS.

The chuck table 3 holding the wafer 90 moves in the +Y direction to below the grinding mechanism 16 . The rotation locus of the grinding wheel 167 is positioned so as to pass through the center of rotation of the wafer 90 . Grinding is performed by lowering the grinding mechanism 16 and bringing the rotating grindstone 167 into contact with the back surface 903 of the wafer 90 . During grinding, the chuck table 3 rotates and the wafer 90 sucked and held on the central suction surface 300 and the outer peripheral suction surface 320 via the protective tape 91 also rotates. Grinding process.

Also, the grinding water sent from the grinding water supply source 168 and passed through the flow path 169 is supplied to the contact portion between the grinding wheel 167 and the wafer 90 to cool and wash the contact portion. The grinding water supplied to the contact portion receives the centrifugal force of the rotating chuck table 3 and flows to the outer peripheral side of the wafer 90, whereupon the upper surface of the frame 31, the upper surface of the ring member 50, the cover 55 shown in FIG. Then, the water flows through the bellows cover 550 and is drained to the water case in the device base 10 through a drain port (not shown).

Even when the suction force generated by the suction source 42 during grinding is transmitted from the rotary joint 40 to the central suction path 37, it does not leak due to a mechanical seal (not shown). does not reduce the suction power of the In addition, when the suction force generated by the suction source 52 is transmitted from the communication passage 51 of the ring member 50 through the gap 500 to the outer side suction groove 315 of the frame 31, it leaks from the upper end of the gap 500. is prevented by a water seal. That is, the grinding water flowing radially outward from the upper surface of the frame 31 toward the upper surface of the ring member 50 acts as a water seal to block the upper end of the gap 500 .
In this embodiment, the cross section of the gap 500 is formed linearly in the Z-axis direction as shown in FIG. 2, but it may be formed in an L shape. Further, for example, an annular projection may be formed on the inner surface of the ring member 50, and an annular recess may be formed on the outer surface of the frame body 31 corresponding to the projection. A labyrinth seal may then be formed.
Also, the outer surface suction groove 315 may be formed on the inner surface of the ring member 50 instead of the frame 31 .

In the present embodiment, a portion of the outside of the outer peripheral suction surface 320 is exposed from the wafer 90, but there is almost no vacuum leak from the outer peripheral suction surface 320 due to the water seal of the grinding water. However, the outer peripheral edge of the wafer 90 sucked and held by the outer peripheral suction surface 320 of the chuck table 3 is likely to float or flutter slightly. It may be sucked from the suction surface 320 .

However, in the grinding apparatus 1 according to the present invention, the outer peripheral suction path communicates with the outer peripheral suction plate 32 as a vacuum line separate from the central suction path 37 that passes through the rotary joint 40 and communicates the suction source 42 with the central suction plate 30. 39, a non-rotating ring member 50 arranged to surround a frame 31 with a gap 500 therebetween, and a suction source 52 formed in the ring member 50 and connected to an outer peripheral suction path 39 in a non-contact manner through the gap 500. , and the outer suction plate 32 communicates with the suction source 52 through the ring member 50, the gap 500, and the outer suction passage 39, so that the outer suction plate 32 can collect the grinding waste during grinding. It is possible to prevent damage to the rotary joint 40 even if the grinding waste liquid containing is sucked.

While measuring the thickness of the wafer 90 by the thickness measuring unit 104 shown in FIG. The chuck table 3 moves in the -Y direction and is positioned in the attachment/detachment area. For example, when the wafer 90 sucked and held by the chuck table 3 is separated from the holding surface 33 , the suction force is transmitted from the suction source 42 to the central suction plate 30 and the suction from the suction source 52 is applied to the outer peripheral suction plate 32 . The transmission of force is cut off and the air supply opening/closing valve 432 shown in FIG. Eliminate force.

For example, when cleaning the holding surface 33 in which the wafer 90 is not held by suction, the air supply source 43 is compressed while the suction opening/closing valve 423 is closed and the air supply opening/closing valve 432 is opened. The air thus obtained is supplied to the air supply pipe 431 . In parallel, the water supply source 44 supplies water (for example, pure water) to the water pipe 441 while the water supply opening/closing valve 444 is open. The water is mixed with the air to form a mixed fluid and reaches the central suction plate 30 of the chuck table 3 through the central suction passage 37 . Further, the entire surface of the holding surface 33 is washed with the two fluids, which pass through the inside of the central suction plate 30 and are jetted upward from the holding surface 33 to discharge the grinding dust and the like inside the central suction plate 30 . .

It should be noted that the grinding apparatus 1 according to the present invention is not limited to the above-described embodiment, and the process of grinding the wafer 90 is not limited to the above-described mode, and can be changed as appropriate within the range in which the effects of the present invention can be exhibited. is.

1: Grinding device (processing device) 10: Device base 11: Column 104: Thickness measuring unit 13: Horizontal movement unit 130: Ball screw 132: Motor 16: Grinding mechanism 160: Rotating shaft 164: Grinding wheel 168: Grinding water supply source 169 : Flow path 17 : Grinding feed mechanism 3 : Chuck table 30 : Central suction plate 300 : Central suction surface 31 : Frame 310 : Recess 311 : Base of frame 312 : Annular wall 315 : Outer suction groove 316 : Central suction groove 317 : Linear suction groove 32 : Peripheral suction plate 320 : Peripheral suction surface 33 : Holding surface of chuck table 34 : Partition 35 : Table rotation mechanism 350 : Rotating shaft 352 : Motor 353 : Drive pulley 354 : Endless belt 355 : Driven pulley 358 : Table base 36: Tilt adjustment unit 360: Support case 361: Bearing 362: Elevating member 37: Central suction path 39: Peripheral suction path 40: Rotary joint 42: Suction source 420: External pipe 421: Pressure gauge 423: Suction on/off valve 424: Suction flow control valve 43: Air supply source 431: Air supply pipe 432: Air supply on/off valve 433: Air flow control valve 44: Water supply source 441: Water pipe 444: Water supply on/off valve 445: Water flow control valve 50 : Ring member 51: Communication path 511: External pipe 512: External suction valve 52: Suction source 55: Cover 550: Accordion cover

Claims (1)

A chuck table that sucks and holds a wafer on a holding surface, a table rotation mechanism that rotates the chuck table, a processing mechanism that processes the wafer held on the holding surface, and a rotating shaft that constitutes the table rotation mechanism. A processing device comprising a rotary joint,
The chuck table includes a central suction plate for sucking and holding the central portion of the wafer, an outer peripheral suction plate surrounding the central suction plate and formed in an annular shape for sucking and holding the outer peripheral portion of the wafer, the central suction plate and the outer peripheral suction plate. and a frame body having a concave portion for accommodating the central suction plate, the partition portion, and the outer peripheral suction plate,
The frame includes a central suction passage that passes through the rotary joint and communicates a suction source with the central suction plate, and an outer peripheral suction passage that communicates with the outer peripheral suction plate,
a non-rotating ring member disposed so as to surround the outside of the frame with a gap therebetween; a communicating passage formed in the ring member and communicating the suction source with the outer peripheral suction passage through the gap in a non-contact manner; with
A processing device in which the outer peripheral suction plate communicates with a suction source through the ring member, the gap, and the outer peripheral suction path.

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