JP2023098468A - Method of manufacturing mold component - Google Patents

Abstract

To provide a method and an apparatus for manufacturing a mold component, which enable a reduction in apparatus cost and the shortening of manufacturing time.SOLUTION: A method of manufacturing a mold component includes: a diffusion joining step of diffusion-joining first and second mold component materials 31 and 32 by making the first and second mold component materials 31 and 32 pressure-adhere to each other within a container 5 of a diffusion joining furnace 1 so as to increase a temperature; and a quenching step of rapidly cooling the first and second mold component materials 31 and 32, in a high-temperature state after the diffusion joining step, within the container 5.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present disclosure relates to a manufacturing method and manufacturing apparatus for mold parts such as cores and shunts.

BACKGROUND ART A method of performing a quenching step after a diffusion bonding step in the manufacture of molding die parts such as inserts and shunts is known (for example, Patent Document 1). In the diffusion bonding step, the first mold part material and the second mold part material are pressure-bonded in a vacuum heating furnace, and the temperature is raised to diffusion-bond them. In the quenching step, the first and second mold component materials that have been diffusion-bonded and slowly cooled are taken out from the vacuum heating furnace, placed in a heat treatment furnace, heated, then quenched and quenched.

Japanese Patent No. 5113549

The above-described conventional manufacturing method requires a vacuum heating furnace for performing the diffusion bonding process and a heat treatment furnace for performing the hardening process, resulting in an increase in equipment cost. In addition, the diffusion-bonded first and second mold part materials are slowly cooled in the vacuum heating furnace, then taken out from the vacuum heating furnace and placed in the heat treatment furnace for quenching. A cooling time for slowly cooling the mold part material of 2 in a vacuum heating furnace and a heating time for heating the first and second mold part materials in a heat treatment furnace for quenching are required. increases.

Therefore, an object of the present disclosure is to provide a manufacturing method and a manufacturing apparatus for molding die parts that can reduce the apparatus cost and shorten the manufacturing time.

In order to achieve the above object, a method for manufacturing a molding die part according to the first aspect of the present disclosure includes pressure-sealing a first die part material and a second die part material in a vessel of a diffusion bonding furnace. a diffusion bonding step in which the first mold part material and the second mold part material are diffusion-bonded, and the first and second mold part materials in a high temperature state after the diffusion bonding step. and a quenching step of quenching in a container.

In the above method, the diffusion bonding process and the quenching process are performed in the vessel of the diffusion bonding furnace, so there is no need to separately provide a heat treatment furnace for performing the quenching process, and the equipment cost can be reduced. Further, the diffusion-bonded first and second mold part materials are not slowly cooled in the diffusion bonding furnace, and the first and second mold part materials in a high temperature state are rapidly cooled in the diffusion bonding furnace and quenched. Therefore, the time for slowly cooling the diffusion-bonded first and second mold component materials and the time for reheating for quenching can be omitted, and the manufacturing time can be shortened.

A manufacturing method according to a second aspect of the present disclosure is the manufacturing method according to the first aspect, wherein the container includes a suction port for sucking and discharging the gas in the container, and an inert gas as a cooling gas in the container. A cooling gas supply port is provided to supply to. In the diffusion bonding step, the gas inside the container is discharged from the suction port to evacuate the inside of the container while the supply of the inert gas into the container from the cooling gas supply port is stopped. In the quenching step, the inert gas is supplied into the container from the cooling gas supply port while the gas in the container is continuously discharged from the suction port, thereby rapidly cooling the first and second mold component materials.

In the above method, in the quenching step, the inert gas is circulated in the container by continuing to suck the gas from the suction port. Equipment costs can be reduced. Further, since an inert gas is used as the cooling gas for cooling the first and second mold component materials, oxidation of the first and second mold component materials can be suppressed.

The molding die part manufacturing apparatus of the present disclosure includes: a container; holding means for pressing and holding a first mold part material and a second mold part material in the container; a diffusion bonding furnace having heating means for heating the first and second mold component materials thus obtained, and a suction port for sucking and discharging the gas in the container; and a cooling gas supply port for supplying the cooling gas into the container as a gas. The suction port and the cooling gas supply port face each other with the first and second mold component materials interposed therebetween.

A manufacturing method according to a third aspect of the present disclosure is the manufacturing method according to the second aspect, in which the suction port and the cooling gas supply port face each other with the first and second mold component materials sandwiched therebetween.

In the apparatus and method described above, the suction port and the cooling gas supply port face each other across the first and second mold component blanks, and are arranged so as to pass over the outer surfaces of the first and second mold component blanks. Since the active gas flows from the cooling gas supply port to the suction port, the first and second mold component materials can be efficiently cooled by the inert gas.

Advantageous Effects of Invention According to the present disclosure, it is possible to provide a manufacturing method and a manufacturing apparatus for molding die parts that can reduce the apparatus cost and shorten the manufacturing time.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view schematically showing the schematic configuration of a molding die component manufacturing apparatus according to an embodiment of the present invention; It is a II-II arrow directional cross-sectional view of FIG. FIG. 2 is a cross-sectional view taken along line III-III of FIG. 1; It is a figure which shows typically the relationship of the temperature and time in the manufacturing method of this embodiment. It is a figure which shows typically the relationship of the temperature and time in the conventional manufacturing method.

An embodiment of the present invention will be described below with reference to the drawings.

Molding die parts of this embodiment are parts such as inserts and shunts that constitute an aluminum die-casting die, for example. As shown in FIGS. is manufactured by diffusion bonding the mold part material 32 of In addition, the molding die part may be any part that constitutes a molding die that rapidly cools in the mold after molding the molten raw material in the mold, for example, die casting molds other than aluminum die casting Any part that constitutes a resin molding die, a gravity casting die, or the like can be subject to the manufacturing method of the present embodiment.

The first mold component material 31 is, for example, hot work tool steel, and is formed in a columnar shape having a bottomed tapered hole 33 . The second mold part material 32 is, for example, oxygen-free copper, is formed in a tapered shaft shape, and is inserted into the tapered hole 33 of the first mold part material 31 under pressure. The first and second mold part blanks 31 and 32 are in a state in which the tapered hole 33 of the first mold part blank 31 opens upward and the second mold part blank 32 is inserted into the tapered hole 33. and installed in a diffusion bonding furnace 2 to be described later. The materials and shapes of the first and second mold component materials 31 and 32 are not limited to those described above, and can be set arbitrarily.

A mold component manufacturing apparatus 1 includes a diffusion bonding furnace 2 , a vacuum pump 3 , and an inert gas supply device 4 .

The diffusion bonding furnace 2 is composed of a vacuum heating furnace, and holds a container (vacuum container) 5 and a first mold part material 31 and a second mold part material 32 in pressure contact with each other in the container 5. a holding mechanism (holding means) 6, a heating element (heating means) 7 such as a heater for heating the first and second mold component materials 31 and 32 held by the holding mechanism 6, and the gas in the container 5 and a suction port 8 for sucking and discharging the The container 5 partitions the inside (the inside of the container 5) of a columnar space that is laid down substantially horizontally, and seals the inside of the container 5 so that it can be opened.

The holding mechanism 6 includes a disk-shaped upper support plate 11 placed on the upper surfaces of the first and second mold part blanks 31 and 32, and a lower surface of the first mold part blank 31 placed thereon. A disk-shaped lower support plate 12 , a pedestal 13 supporting the lower support plate 12 from below, a pressure rod 14 extending from the upper surface of the upper support plate 11 to the upper outside of the container 5 , and fixed to the container 5 . and a female threaded portion 15 . The female threaded portion 15 is screwed with the male threaded portion 16 formed on the upper portion of the pressure rod 14 . The first and second mold part blanks 31 and 32 are held in a state of being sandwiched from above and below between the upper support plate 11 and the lower support plate 12 (in a pressurized contact state). By rotating the upper end of the pressure rod 14 outside the container 5, the upper support plate 11 moves up and down, and the pressing force against the first and second mold part blanks 31 and 32 increases or decreases. Note that the holding mechanism 6 is not limited to the configuration described above, and may have another configuration.

The heating element 7 is provided inside the container 5 so as to surround the outer peripheries of the first and second mold component materials 31 and 32 held by the holding mechanism 6 . The suction port 8 is provided in the upper portion of the container 5 and communicates the inside and the outside of the container 5 . A vacuum pump 3 is connected to the suction port 8 via a suction pipe 17 . A temperature sensor (not shown) for detecting the temperature inside the container 5 and the temperatures of the first and second mold component materials 31 and 32 is provided inside the container 5 .

The inert gas supply device 4 includes a storage tank (not shown) that stores an inert gas (eg, nitrogen gas), a gas supply pipe 18 connected to the storage tank, and a downstream end of the gas supply pipe 18. and a gas supply nozzle 19 extending into the interior of the container 5 . A downstream end of the gas supply nozzle 19 is provided inside the container 5 and constitutes a cooling gas supply port 20 for supplying an inert gas as a cooling gas into the container 5 . The gas supply pipe 18 is provided with an opening/closing valve 21 that allows the supply of the inert gas into the container 5 to be stopped.

The suction port 8 and the cooling gas supply port 20 are arranged at positions facing each other with the first and second mold component blanks 31 and 32 held by the holding mechanism 6 therebetween. The first and second mold part blanks 31, 32 facing each other are three imaginary planes that pass through the first and second mold part blanks 31, 32 and are perpendicular to each other. , means that the suction port 8 and the cooling gas supply port 20 are located in mutually different spaces with respect to any of the three dividing planes, each of which divides the inside of the container 5 into two spaces. In this embodiment, the suction port 8 is located in one space (upper space in FIG. The cooling gas supply ports 20 are located in the other space (lower space in FIG. 2), and are located on a first vertical plane (second dividing plane) passing through the first and second mold component blanks 31 and 32. ) 23, the suction port 8 is located in one space (lower space in FIG. 3), and the cooling gas supply port 20 is located in the other space (upper space in FIG. 3). The suction port 8 is located in one space (left side in FIG. 3), and the cooling gas supply port 20 is located in the other space (the space on the right side in FIG. 3).

Next, a method for manufacturing the molding die component will be described.

The manufacturing method of this embodiment includes a material processing step, a diffusion bonding preparation step, a diffusion bonding step (bonding step), a heat treatment step, and a product processing step. The heat treatment process includes a hardening process and a tempering process.

In the material processing step, the first mold part material 31 is formed into a cylindrical body having a bottomed tapered hole 33 by cutting or the like, and the second mold part material 32 is pressed into the tapered hole 33. formed into a tapered shaft shape.

In the diffusion bonding preparation step, heating by the heating element 7 is not started, the vacuum pump 3 is stopped, and the opening/closing valve 21 of the gas supply pipe 18 is closed. And the second mold part materials 31 and 32 are placed in the container 5 and held in pressure contact by the holding mechanism 6 . The first and second mold part blanks 31 and 32 are in a state in which the tapered hole 33 of the first mold part blank 31 opens upward and the second mold part blank 32 is inserted into the tapered hole 33. is held in

In the diffusion bonding step, the vacuum pump 3 is driven with the opening/closing valve 21 of the gas supply pipe 18 closed (the supply of the inert gas into the container 5 is stopped), and the gas in the container 5 is sucked out. 8 is sucked and discharged, and the inside of the container 5 is decompressed (evacuated). In this embodiment, the vacuum pump 3 is continuously driven without being stopped during the diffusion bonding process. Further, heating by the heating element 7 is started, and after the inside of the container 5 (and/or the first or second mold component materials 31, 32) reaches the target temperature (for example, 950° C.), the pressure and temperature are changed. Diffusion bonding is caused by maintaining for a predetermined time (for example, 2 hours), and heating by the heating element 7 is terminated after the predetermined time (indicated by a solid line in FIG. 4). In order to reduce residual oxygen in the container 5, after the vacuum pump 3 is driven and before heating is started, the on-off valve 21 may be temporarily opened to allow the supply of inert gas. Also, the pressing force of the holding mechanism 6 on the first and second mold parts may be changed during the diffusion bonding process. Moreover, the temperature and time required for diffusion bonding are not limited to the above, and can be set arbitrarily.

In the quenching process, the first and second mold component materials 31 and 32 after the diffusion bonding process are placed in the container 5, and the opening/closing valve 21 of the gas supply pipe 18 is opened while the vacuum pump 3 continues to be driven. do. That is, while the gas (including the inert gas supplied from the cooling gas supply port 20) in the container 5 is continuously discharged from the suction port 8, the inert gas is supplied into the container 5 from the cooling gas supply port 20. (inert gas is sucked into the container 5 from the cooling gas supply port 20 by the negative pressure in the container 5). By supplying the inert gas, the first and second mold component blanks 31, 32 are rapidly cooled (indicated by broken lines in FIG. 4). In the quenching process, the pressing force of the holding mechanism 6 against the first and second mold component materials 31 and 32 may be changed (for example, reduced or released) from that in the diffusion bonding process.

In the tempering process, the opening/closing valve 21 of the gas supply pipe 18 is closed while the first and second mold component materials 31 and 32 after the quenching process are placed in the container 5, and heating by the heating element 7 is started. , after the inside of the container 5 (and/or the first or second mold component materials 31, 32) reaches the target temperature (target temperature lower than the diffusion bonding step), the pressure and temperature are maintained for a predetermined time (diffusion bonding After the predetermined time has passed, heating by the heating element 7 is terminated (indicated by the dashed line in FIG. 4).

In the product processing process, the first and second mold component materials 31 and 32 after the tempering process are formed into desired shapes by cutting or the like.

According to this embodiment, the diffusion bonding process, the quenching process, and the tempering process are performed in the container 5 of the diffusion bonding furnace 2, so there is no need to separately provide a heat treatment furnace for performing the quenching process and the tempering process, and the equipment cost is reduced. can be reduced.

The diffusion-bonded first and second mold part materials 31, 32 are not slowly cooled in the diffusion bonding furnace 2, and the first and second mold part materials 31, 32 in a high temperature state are transferred to the diffusion bonding furnace 2. Since quenching is performed by quenching in the furnace, the first and second mold component materials after diffusion bonding are slowly cooled in the diffusion bonding furnace and the first and second mold parts are placed in the heat treatment furnace as in the conventional method. Compared to the case where the component materials are quenched and tempered (see FIG. 5), the time for slowly cooling the first and second mold component materials after diffusion bonding in the diffusion bonding furnace, And the time for removing the second mold part material from the diffusion bonding furnace and placing it in the heat treatment furnace, and the time for reheating the first and second mold part materials in the heat treatment furnace for quenching are omitted. can reduce manufacturing time.

In the quenching process, the inert gas is circulated in the container 5 by continuing to suck the gas from the suction port 8, so there is no need to separately provide a means for circulating the inert gas in the container 5. Equipment costs can be reduced. In addition, since the inert gas is used as the cooling gas for cooling the first and second mold component materials 31, 32, oxidation of the first and second mold component materials 31, 32 can be suppressed.

In addition, since the suction port 8 and the cooling gas supply port 20 face each other with the first and second mold component materials 31 and 32 interposed therebetween, the inert gas flowing from the cooling gas supply port 20 toward the suction port 8 is At least part of it passes over the outer surfaces of the first and second mold part blanks 31,32. Therefore, the first and second mold part blanks 31, 32 can be efficiently cooled by the inert gas.

Although the present invention has been described above based on the above embodiments, the present invention is not limited to the contents of the above embodiments, and can be appropriately modified without departing from the scope of the present invention. In other words, all other embodiments, examples, operation techniques, etc. made by those skilled in the art based on this embodiment are naturally included in the scope of the present invention.

For example, in the above embodiment, the tempering process is performed in the diffusion bonding furnace 2, but after the quenching process, the first and second mold component materials 31, 32 are removed from the diffusion bonding furnace 2 and placed in another heating furnace. You may perform a tempering process at.

INDUSTRIAL APPLICABILITY The present invention can be widely applied to manufacturing methods and manufacturing apparatuses for mold parts.

1: Manufacturing Equipment 2: Diffusion Bonding Furnace 3: Vacuum Pump 4: Inert Gas Supply Device 5: Container 6: Holding Mechanism (Holding Means)
7: heating element (heating means)
8: Suction port 17: Suction pipe 18: Gas supply pipe 19: Gas supply nozzle 20: Cooling gas supply port 31: First mold part material 32: Second mold part material

Claims (4)

The first mold part material and the second mold part material are brought into pressure contact with each other in a container of a diffusion bonding furnace, and the temperature is raised to increase the temperature of the first mold part material and the second mold part material. A diffusion bonding step of diffusion bonding the
and a quenching step of rapidly cooling the first and second mold part materials in a high temperature state after the diffusion bonding step in the container. The manufacturing method according to claim 1,
The container is provided with a suction port for sucking and discharging the gas in the container, and a cooling gas supply port for supplying an inert gas as a cooling gas into the container,
In the diffusion bonding step, in a state in which the supply of inert gas from the cooling gas supply port to the inside of the container is stopped, the gas in the container is discharged from the suction port to evacuate the inside of the container,
In the quenching step, the inert gas is supplied into the container from the cooling gas supply port while continuously discharging the gas in the container from the suction port, thereby removing the first and second molds. A method of manufacturing a molding die part characterized by quenching a material for the part. The manufacturing method according to claim 2,
A method of manufacturing a molding die part, wherein the suction port and the cooling gas supply port face each other with the first and second die part materials sandwiched therebetween. a container; holding means for holding the first mold part material and the second mold part material in pressure contact with each other in the container; and the first and second metals held by the holding means. a diffusion bonding furnace having heating means for heating a mold part material and a suction port for sucking and discharging gas in the container;
a cooling gas supply port provided in the container for supplying an inert gas as a cooling gas into the container;
An apparatus for manufacturing molding die parts, wherein the suction port and the cooling gas supply port are opposed to each other with the first and second die part materials sandwiched therebetween.

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