JP2023089814A - Electronic device and method for manufacturing electronic device - Google Patents

Abstract

To provide an electronic device capable of holding a metal piece with a simple structure, and a method for manufacturing the same.SOLUTION: An electronic device includes: a substrate 20 having a plurality of through holes 44 penetrating between a front surface 20a and a back surface 20b, the substrate provided with a conductive portion 43 having an insertion hole 45 on a wall surface 44a of the through hole; a plurality of conductive terminals 30 that are inserted through the insertion holes from the front surface to the rear surface and are sandwiched between the insertion holes so as to be electrically conductive with the conductive portion; and a covering 40 having at least one of a surface cover 41 extending over surface openings 45a of the plurality of insertion holes to cover the surface, and a back surface covering 42 extending over back surface openings 45b of the plurality of insertion holes to cover the back surface.SELECTED DRAWING: Figure 2

Description

The disclosure described herein relates to electronic devices with conductive terminals and methods of making the same.

Patent Document 1 describes an electronic control device that includes a circuit board having a plurality of through holes formed with a conductor film, and a plurality of pin terminals that are inserted into the through holes and held in the through holes. . The coating material is coated so as to cover the contact portion with the through hole at the tip portion of the pin terminal.

JP-A-2005-93228

It was difficult to hold the metal piece generated from the pin terminal or the conductor film with a simple structure.

SUMMARY OF THE INVENTION An object of the present disclosure is to provide an electronic device capable of holding a metal piece with a simple structure, and a manufacturing method thereof.

An electronic device according to one aspect of the present disclosure includes:
A conductive substrate (20) having a plurality of through holes (44) penetrating between a front surface (20a) and a back surface (20b), and having through holes (45) in wall surfaces (44a) of the through holes (44a). a substrate provided with an electrically conductive portion (43);
a plurality of conductive terminals (30) that are inserted through the insertion holes from the front surface to the rear surface and are sandwiched between the insertion holes so as to be electrically conductive with the conductive portion;
A surface covering (41) covering the surface by extending over the surface openings (45a) of the plurality of insertion holes, and a back surface covering extending over the rear surface openings (45b) of the plurality of insertion holes to cover the back surface. a covering (40) having at least one of (42).

According to this, it became possible to hold the metal piece (100) with a simple structure.

A method of manufacturing an electronic device according to one aspect of the present disclosure includes:
a substrate (20) in which conductive portions (43) having insertion holes (45) are provided in a plurality of through holes (44);
a conductive terminal (30);
providing a covering (40);
providing a cover on the surface so as to cover the surface openings (45a) formed in the surface (20a);
Piercing the cover provided on the surface with a conductive terminal toward the back surface,
inserting the conductive terminal through the insertion hole to electrically connect the conductive terminal and the conductive portion;
The cover captures metal pieces (100) generated when the conductive portion and the conductive terminal are inserted.

According to this, it became possible to hold the metal piece (100) by a simple method.

It should be noted that the reference numbers in parentheses above merely indicate the correspondence with the configurations described in the embodiments described later, and do not limit the technical scope in any way.

1 is a schematic diagram of an electronic device; FIG. FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1; 1 is a top view of an electronic device without a housing; FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3; FIG. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method of an electronic device. It is sectional drawing explaining the manufacturing method in other embodiment. FIG. 4 is a cross-sectional view of an electronic device according to another embodiment; FIG. 4 is a cross-sectional view of an electronic device according to another embodiment;

A plurality of modes for carrying out the present disclosure will be described below with reference to the drawings. In each form, the same reference numerals may be given to the parts corresponding to the matters described in the preceding form, and overlapping explanations may be omitted. When only a part of the configuration is described in each form, the previously described other forms can be applied to other parts of the configuration.

In addition, not only combinations of parts that are explicitly stated that combinations are possible in each embodiment, but also embodiments, embodiments and modifications, even if not explicitly stated, as long as there is no particular problem with the combination. And it is also possible to partially combine the modifications.

(First embodiment)
As shown in FIGS. 1-4, the electronic device 10 includes a substrate 20, a plurality of conductive terminals 30, a cover 40, and a housing 90. As shown in FIG. An assembly 11 in which the board 20 and these various components are assembled is housed in a housing 90 . 3 and 4 show the top surface and cross section of the electronic device 10 with the housing 90 removed from the electronic device 10. FIG. In the following description, the thickness direction of the substrate 20 is indicated as the z direction. Two directions perpendicular to the thickness direction are shown as the x direction and the y direction.

<Substrate>
The electronic device 10 has a substrate 20 . The substrate 20 is an insulating base material on which electronic components and patterns are mounted. The substrate 20 includes a plurality of semiconductor elements 61 and 71, substrate wiring 46, etc. as electronic components.

The substrate 20 has a flat shape with a thin thickness in the z direction. The substrate 20 comprises a front surface 20a and a back surface 20b spaced apart in the z-direction. Each of the front surface 20a and back surface 20b extends along the xy plane perpendicular to the z direction.

A plurality of through holes 44 are formed in the substrate 20 . A plurality of through holes 44 form openings in the front surface 20a and the back surface 20b. The plurality of through-holes 44 are arranged in rows in the x-direction and the y-direction. The substrate 20 includes, in addition to the electronic components described above, a conductive portion 43 containing a metal material. A conductive portion 43 is provided on a wall surface 44 a of each through hole 44 . The conductive portion 43 has a cylindrical shape with a central axis in the z direction. Conductive portion 43 provides an annular wall centered in the z-direction. The conductive portion 43 is plated.

The conductive portion 43 includes an inner surface 43a, an outer surface 43b, a front-side conductive surface 43c, and a back-side conductive surface 43d. The inner surface 43a and the outer surface 43b are spaced apart in a direction orthogonal to the z-direction. The inner surface 43a and the outer surface 43b are connected via a surface-side conductive surface 43c on the surface 20a side. The inner surface 43a and the outer surface 43b are connected via a back-side conductive surface 43d on the back surface 20b side.

A surface opening 45a surrounded by a surface-side conductive surface 43c is formed on the surface 20a side. A rear opening 45b surrounded by a rear conductive surface 43d is formed on the rear surface 20b side. The insertion hole 45 is configured by the front opening 45a, the rear opening 45b, and the hollow space surrounded by the inner surface 43a. The insertion hole 45 is a hole through which the conductive terminal 30 is inserted. The through hole 45 is common with the through hole 44 . The through-holes 45 are also arranged in rows in the x-direction and the y-direction.

As shown in FIG. 4, the surface-side conductive surface 43c and the surface 20a are flush with each other. The back-side conductive surface 43d and the back surface 20b are flush with each other. Note that the surface-side conductive surface 43c does not have to be flush with the surface 20a. The back-side conductive surface 43d may not be flush with the back surface 20b.

A cover 40 and a first semiconductor element 61 are provided on the surface 20a. Hereinafter, the covering 40 provided on the surface 20a will be referred to as a surface covering 41. As shown in FIG. On the surface 20a, the area where the surface covering 41 is provided is different from the area where the first semiconductor element 61 is provided. A surface covering 41 is provided on the surface 20a so as to cover the plurality of surface openings 45a. A surface covering 41 is provided on the surface 20a over a plurality of surface openings 45a.

The first semiconductor element 61 is joined to the surface 20a via the first solder 60 in a region different from the region where the surface covering 41 is provided. Further, the first solder 60 and the surface-side conductive surface 43c are electrically connected via the substrate wiring 46. As shown in FIG. Note that the first semiconductor element 61 only needs to be bonded to the surface 20 a , and the bonding member is not limited to the first solder 60 .

A cover 40 and a second semiconductor element 71 are provided on the back surface 20b. The cover 40 provided on the back surface 20b is hereinafter referred to as a back cover 42 . On the back surface 20b, the area where the back cover 42 is provided and the area where the second semiconductor element 71 is provided are different. A back surface cover 42 is provided on the back surface 20b so as to cover the plurality of back surface openings 45b. A back surface cover 42 is provided on the back surface 20b over the plurality of back surface openings 45b.

The second semiconductor element 71 is joined to the back surface 20b via the second solder 70 in a region different from the region where the back cover 42 is provided. Further, the second solder 70 and the back-side conductive surface 43d are electrically connected through the board wiring 46. As shown in FIG. In addition, the second semiconductor element 71 only has to be bonded to the back surface 20 b , and the bonding member is not limited to the second solder 70 .

<Conductive terminal>
The conductive terminal 30 is a terminal formed from a conductive material including metal. The conductive terminals 30 are plated. The conductive terminal 30 is a terminal having a structure capable of standing by itself with respect to the substrate 20 by a restoring force generated by elastic deformation. Conductive terminals 30 are also called press-fit terminals. The conductive terminal 30 may be called, for example, a needle eye shape. The shape of the conductive terminal 30 is not limited to the needle eye shape. The conductive terminal 30 may have a cross-sectional shape of a tip portion 32, which will be described later, in a U-shape, an H-shape, an M-shape, or the like.

As shown in FIGS. 2 and 4 , the conductive terminal 30 has an extension portion 31 , a tip portion 32 and a holding portion 33 . The extending portion 31 extends along the z-direction. A tip portion 32 is connected to one end of the extending portion 31 in the extending direction. The tip portion 32 has, for example, an annular shape that can be elastically deformed in the x direction.

Note that the tip portion 32 does not have to be elastic in the x direction. The tip portion 32 may be elastically deformable in a direction orthogonal to the z-direction. The tip portion 32 need not have an annular shape as long as it can be elastically deformed in a direction orthogonal to the z-direction.

The tip portion 32 is inserted through the insertion hole 45 . More specifically, a portion of the distal end portion 32 is provided in the insertion hole 45 . The remainder of the tip portion 32 is exposed from the surface opening 45a to the surface 20a side. The rest of the tip portion 32 is exposed from the rear surface opening 45b to the rear surface 20b side.

As shown in FIG. 2, the size W1 of the through hole 47 in the surface covering 41 through which the conductive terminal 30 passes is smaller than the size W2 of the insertion hole 45. As shown in FIG. More strictly speaking, the size W1 of the through hole 47 in the surface covering 41 through which the tip portion 32 passes is smaller than the size W2 of the insertion hole 45 .

A portion of the distal end portion 32 is elastically deformed inside the insertion hole 45 . A restoring force is applied from the distal end portion 32 to the inner surface 43 a of the insertion hole 45 . Accordingly, the tip portion 32 is held by the inner surface 43a. The conductive terminal 30 can stand on its own with respect to the substrate 20 .

Further, a holding portion 33 is connected to a location a predetermined distance away from one end of the extending portion 31 in the extending direction. The predetermined distance is a distance corresponding to the film thickness of the surface covering 41 . The holding portion 33 extends in the x direction away from the extending portion 31 . As shown in FIG. 2 , the holding portion 33 is pressed against the surface covering 41 while the distal end portion 32 is inserted through the insertion hole 45 . According to this, the surface covering 41 is sandwiched between the holding portion 33 and the substrate 20 . The holding part 33 plays a role of holding the surface covering 41 in cooperation with the substrate 20 . Note that the holding portion 33 does not have to extend in the x direction away from the extending portion 31 . It is sufficient that the holding portion 33 extends away from the extending portion 31 .

<Cover>
The cover 40 is a member having a function of capturing and holding the metal piece 100 generated from the conductive terminal 30 and the conductive portion 43 . The surface covering 41 and the back covering 42 are, for example, sheets of silicone rubber or the like having a degree of viscoelasticity capable of holding the metal piece 100 . An adhesive is provided on the surface of the surface covering 41 facing the surface 20a. The surface covering 41 and the substrate 20 are adhered via an adhesive. An adhesive is provided on the surface of the back cover 42 facing the back surface 20b. The back cover 42 and the substrate 20 are adhered via an adhesive.

Note that the surface covering 41 does not have to be provided with an adhesive. The surface covering 41 may be in close contact with the surface 20 a by pressing the surface covering 41 against the substrate 20 by the holding portion 33 . Similarly, the back cover 42 may not be provided with an adhesive. The back cover 42 may be pressed against the substrate 20 by a base 91, which will be described later, so that the back cover 42 is in close contact with the back surface 20b.

Note that the cover 40 is not limited to a silicone rubber sheet. The covering 40 may be composed of a liquid material such as silicone. Alternatively, the covering 40 may be a foam such as a foam insulator. The coating 40 may be made of any material that allows film thickness control to be performed with high precision and ease. Furthermore, the form of the cover 40 is not limited as long as it has the function of holding the metal piece 100 . The form applied to the surface covering 41 and the form applied to the back covering 42 may be the same or different.

<Case>
As described above, housing 90 is for housing assembly 11 . As shown in FIG. 2, housing 90 has base 91 and cover 92 . The board 20 is connected to the base 91 via a fixing mechanism such as a screw.

The cover 92 has a side portion 93 and a facing portion 94 . The side portion 93 extends circumferentially around the z-direction to annularly surround the substrate 20 . A facing portion 94 that faces the substrate 20 is connected to an end portion of the side portion 93 that is spaced from the substrate 20 . The facing portion 94 has a facing surface 94a facing the substrate 20 and a facing outer surface 94b on the back side thereof.

The facing portion 94 is provided with cover through holes 95 penetrating through the facing surface 94 a and the facing outer surface 94 b at portions facing the plurality of conductive terminals 30 . The cover through holes 95 are through holes for exposing the plurality of conductive terminals 30 to the outside. A connector portion 96 extending away from the opposing outer surface 94b is formed integrally with the peripheral edge of the opening of the opposing outer surface 94b that communicates with the cover through hole 95 . The facing portion 94 and the connector portion 96 are continuous.

The connector portion 96 extends annularly along the periphery of the opposing outer surface 94b. An external female connector can pass through the opening of the connector portion 96 . A plurality of conductive terminals 30 are electrically connectable to an external female connector.

Moreover, the plurality of conductive terminals 30 face the connector portion 96 in the circumferential direction. The connector portion 96 is, so to speak, a housing for the plurality of conductive terminals 30 . Unlike the case where the conductive terminals 30 and the connector portion 96 are integrally molded, there is no need to change the shape of the connector portion 96 according to the number of the conductive terminals 30 . In the space surrounded by the connector portion 96, a member for filling the gap may be appropriately provided in a region where the conductive terminal 30 is not provided.

The base 91 has a main portion 97 and a fixed portion 98 . The base 91 is provided so as to face the rear surface 20 b of the substrate 20 . The main portion 97 has an opposing main surface 97a that faces the back surface 20b. A fixing portion 98 extending away from itself is formed on the opposing main surface 97a. The main portion 97 and the fixed portion 98 may be integrated or separated.

The fixed portion 98 has a fixed main surface 98a facing the back surface 20b. The fixed main surface 98a is spaced apart from the back surface 20b in the z-direction. A back surface covering 42 is provided between the back surface 20b and the fixed main surface 98a. The substrate 20 is pressed against the fixing portion 98 with the back cover 42 provided between the back surface 20b and the fixed main surface 98a. According to this, the back cover 42 is sandwiched between the fixing portion 98 and the substrate 20 . A portion of the distal end portion 32 exposed from the back surface opening 45 b to the back surface 20 b side is covered with the back surface cover 42 .

<Metal fragments generated during insertion>
As shown in FIGS. 2 and 4, the tip portion 32 of the conductive terminal 30 is inserted through the insertion hole 45 . When the distal end portion 32 is inserted through the insertion hole 45 , it is inserted through the insertion hole 45 from the surface opening 45 a toward the rear surface opening 45 b while being in contact with the conductive portion 43 . Therefore, the plating applied to the tip portion 32 and the conductive portion 43 may peel off in this step. If the peeled plating moves to the front surface 20 a or the back surface 20 b of the substrate 20 , there is a risk that it will come into contact with the semiconductor elements 61 and 71 and the substrate wiring 46 . Inconvenience such as short-circuiting may occur due to peeled plating.

In this embodiment, the surface covering 41 is provided on the surface 20a as described above. The surface covering 41 has viscoelasticity to the extent that it can capture the peeled plating. Similarly, the back surface covering 42 has viscoelasticity to the extent that it can capture the peeled plating. The peeled plating is captured by the surface covering 41 and kept in a held state. Similarly, the peeled plating is captured by the back cover 42 and is kept in a held state.

In addition, the surface covering 41 and the back covering 42 can capture whiskers, which are needle-like crystals generated from plating. The trapped whiskers are also trapped by the surface coating 41 and the back surface coating 42 and are kept in a held state.

<Method for manufacturing electronic device>
Next, a method for manufacturing the electronic device 10 will be described. A substrate 20 is provided as shown in FIG. The substrate 20 is arranged such that the front surface 20a is lower than the back surface 20b in the gravitational direction. Note that the direction of gravity corresponds to the z direction. A second solder 70 is printed on the back surface 20b. Next, as shown in FIG. 6, a second semiconductor element 71 is provided on the second solder 70 . In this state, the substrate 20 is placed in a reflow furnace to bond the second semiconductor element 71 to the back surface 20b.

Next, as shown in FIG. 7, the substrate 20 is placed so that the back surface 20b is lower than the front surface 20a in the gravitational direction. A first solder 60 is printed on the surface 20a. Next, as shown in FIG. 8, a surface covering 41 is provided on the surface 20a. More specifically, the surface covering 41 is provided on the surface 20a so as to cover the plurality of surface openings 45a.

Next, as shown in FIGS. 9 and 10, the tip portion 32 is inserted through the insertion hole 45 while piercing the surface covering 41 . More specifically, the front end portion 32 is pierced through the surface covering 41 toward the rear surface 20 b and the front end portion 32 is inserted through the insertion hole 45 . When the tip portion 32 is fully inserted into the insertion hole 45 , the conductive terminal 30 stands on its own with respect to the substrate 20 while the holding portion 33 is pressed against the surface covering 41 . When the tip portion 32 is inserted through the insertion hole 45 , the tip portion 32 rubs against the inner surface 43 a of the conductive portion 43 . A metal piece 100 derived from plating or the like caused by rubbing is captured by the surface covering 41 .

When the surface covering 41 is a liquid or the like, the process shown in FIG. 8 and the process shown in FIG. 9 may be reversed. The surface covering 41 may be provided on the surface 20 a after the distal end portion 32 is inserted through the insertion hole 45 .

Next, as shown in FIG. 11, a first semiconductor element 61 is provided on the first solder 60 . In this state, the substrate 20 is placed in a reflow furnace to bond the first semiconductor element 61 to the surface 20a.

Next, as shown in FIG. 12, a base 91 is prepared. A back surface covering 42 is provided on a fixing main surface 98 a of a fixing portion 98 provided on the base 91 . The back cover 42 may be provided over a plurality of planes including the opposing main surface 97a, or may be provided only on the opposing main surface 97a. The plurality of planes refer to connecting surfaces that connect the fixed main surface 98a and the opposing main surface 97a.

Next, as shown in FIG. 13, the assembly 11 is mounted on the base 91 so that the tip portion 32 is covered with the back cover 42 . It should be noted that the back cover 42 is included in the assembly 11 when the back cover 42 is adhered to the back surface 20b.

Next, the cover 92 is connected to the base 91 . The cover 92 is connected to the base 91 so that the conductive terminal 30 is housed in the space surrounded by the connector portion 96 . Thus, the electronic device 10 shown in FIGS. 1 and 2 is manufactured.

<Effect>
A surface covering 41 is provided on the surface 20a over a plurality of surface openings 45a. According to this, it is possible to provide the electronic device 10 capable of holding the metal piece 100 with a simple structure as compared with the case where the surface covering 41 is locally provided on the surface 20 a so as to surround each insertion hole 45 . Note that the metal piece 100 indicates a plating peeled off due to rubbing between the tip portion 32 and the conductive portion 43 during insertion, or a whisker, which is a needle-like crystal generated from the plating.

The surface covering 41 has enough viscoelasticity to hold the metal piece 100 . According to this, the metal piece 100 can be captured and held by the surface covering 41 . Accordingly, it is possible to suppress the occurrence of a short circuit between the constituent elements provided on the substrate 20 via the metal piece 100 .

The surface covering 41 is a sheet having viscoelasticity sufficient to hold the metal piece 100 . According to this, the film thickness of the surface covering 41 does not change before and after manufacturing and is always constant. Therefore, the catching force and holding force of the metal piece 100 are suppressed from varying from place to place.

Even if the surface covering 41 is provided on the surface 20a, the inter-terminal pitch of the plurality of conductive terminals 30 is not affected because there is no physical change in the direction orthogonal to the z-direction. A decrease in mounting density of the conductive terminals 30 on the substrate 20 can be suppressed.

The surface covering 41 is sandwiched between the holding portion 33 and the substrate 20 . This increases the adhesion between the surface covering 41 and the surface 20a. Accordingly, the movement of the metal piece 100 along the surface 20a is easily suppressed.

The tip portion 32 is inserted through the insertion hole 45 . The size W1 of the through hole 47 in the surface covering 41 through which the tip portion 32 passes is smaller than the size W2 of the insertion hole 45 . This prevents the metal piece 100 from moving toward the surface 20a.

A back cover 42 is provided on the back 20b over a plurality of back openings 45b. A back cover 42 is provided on the back 20b over a plurality of back openings 45b. A portion of the distal end portion 32 exposed from the back surface opening 45 b to the back surface 20 b is covered with the back surface cover 42 . This prevents the metal piece 100 from falling in the direction of gravity.

A back cover 42 is sandwiched between the fixed portion 98 and the substrate 20 . According to this, the adhesion between the back surface cover 42 and the back surface 20b is improved. Accordingly, the movement of the metal piece 100 along the back surface 20b is easily suppressed.

Regarding the manufacturing method, the front end portion 32 is inserted into the insertion hole 45 while the surface covering 41 is being perforated. This eliminates the need to form the through hole 47 for inserting the tip portion 32 in the surface covering 41 in advance. For this reason, for example, the step of connecting the through hole 47 and the insertion hole 45 can be omitted. This makes it possible to easily provide the surface covering 41 on the surface 20a.

When the front end portion 32 is inserted through the insertion hole 45 while the surface covering 41 is being pierced, the surface covering 41 may unintentionally crack from the edge of the through hole 47 . However, in this embodiment, when the distal end portion 32 is fully inserted into the insertion hole 45 , the holding portion 33 presses against the surface covering 41 . According to this, even if a crack occurs, the metal piece 100 is less likely to protrude from the crack.

A surface covering 41 is provided on the surface 20a so as to cover the plurality of surface openings 45a. According to this, the surface covering 41 can be easily provided on the surface 20a as compared with the case where the surface covering 41 is locally provided on the surface 20a so as to surround each insertion hole 45 .

(Second embodiment)
In the first embodiment, the form in which the through holes 47 are not formed in advance in the surface covering 41 has been described. In the second embodiment, through holes 47 may be formed in advance in the surface covering 41 . In that case, as shown in FIG. 14, the through hole 47 and the insertion hole 45 are arranged in a manner to communicate in the z direction. The tip portion 32 may be inserted through a communication hole in which the through hole 47 and the insertion hole 45 communicate with each other.

Also, the size W1 of the through hole 47 is smaller than the size W2 of the insertion hole 45 . Note that the size of the through hole 47 varies depending on how the distal end portion 32 is inserted. However, in any case, the dimension W1 of the through hole 47 is smaller than the dimension W2 of the insertion hole 45. FIG. This prevents the metal piece 100 from moving toward the surface 20a.

(Third embodiment)
In the first embodiment, the configuration in which the back cover 42 is sandwiched between the fixing portion 98 and the substrate 20 has been described. In the third embodiment, the back cover 42 may not be provided. The base 91 may not have the fixing portion 98 . In this case, as shown in FIG. 15, the substrate 20 and the main portion 97 need only be spaced apart from each other to such an extent that even if the metal piece 100 falls in the direction of gravity, the assembly 11 will not be affected. This prevents the assembly 11 from malfunctioning due to the metal piece 100 falling in the direction of gravity.

(Fourth embodiment)
In the first embodiment, the configuration in which the back cover 42 is sandwiched between the fixing portion 98 and the substrate 20 has been described. In the fourth embodiment, the back cover 42 does not have to be sandwiched between the fixing portion 98 and the substrate 20 . As shown in FIG. 16, the back cover 42 may be adhered to the back surface 20b with an adhesive or the like.

(Other embodiments)
Alternatively, the substrate 20 may be provided with only the back cover 42 without the front cover 41 .

Although the present disclosure has been described with reference to embodiments, it is understood that the present disclosure is not limited to such embodiments or structures. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, while various combinations and configurations are shown in this disclosure, other combinations and configurations, including only one element, more, or less, are within the scope and spirit of this disclosure. is to enter.

DESCRIPTION OF SYMBOLS 20... Substrate, 20a... Front surface, 20b... Back surface, 30... Conductive terminal, 33... Holding part, 40... Cover, 41... Surface cover, 42... Back cover, 43... Conductive part, 44... Through hole, 44a... Wall surface 45... Insertion hole 45a... Front opening 45b... Back opening 47... Through hole 90... Housing 91... Base 94... Opposing part 96... Connector part 98... Fixed part 100... Metal piece, W1... size of through hole, W2... size of insertion hole

Claims (10)

A substrate (20) having a plurality of through holes (44) penetrating between a front surface (20a) and a rear surface (20b), and having through holes (45) on wall surfaces (44a) of the through holes. said substrate provided with an electrically conductive portion (43);
a plurality of conductive terminals (30) that are inserted through the insertion holes from the front surface toward the rear surface and that are sandwiched between the insertion holes so as to be electrically conductive with the conductive portion;
A surface covering (41) that extends over the surface openings (45a) of the plurality of insertion holes to cover the surface, and a surface covering (41) that extends over the rear surface openings (45b) of the plurality of insertion holes to cover the back surface. an electronic device, comprising: a cover (40) having at least one of the back cover (42) that: 2. The electronic device according to claim 1, wherein the covering has viscoelasticity to the extent that it holds a metal piece (100) generated from the conductive portion or the conductive terminal. The covering is a sheet,
3. The electronic device according to claim 1, wherein said cover is adhered to said front surface or said back surface. comprising the surface covering,
The electronic device according to any one of claims 1 to 3, wherein the conductive terminal comprises a holding portion (33) that cooperates with the substrate to hold the surface covering. The size (W1) of the through hole (47) in the cover through which the conductive terminal passes is smaller than the size (W2) of the insertion hole according to any one of claims 1 to 4. electronic device. comprising the back surface covering,
The electronic device according to any one of claims 1 to 5, wherein the back cover covers the plurality of conductive terminals. 7. The electronic device of claim 6, further comprising a base (91) having a fixing portion (98) that cooperates with the substrate to hold the backcover. further comprising a facing portion (94) facing the base, and a connector portion (96) surrounding the plurality of conductive terminals in a partially exposed manner,
8. The electronic device according to claim 7, wherein said facing portion and said connector portion are continuously integrated. a substrate (20) in which conductive portions (43) having insertion holes (45) are provided in a plurality of through holes (44);
a conductive terminal (30);
providing a covering (40);
providing the covering on the surface so as to cover the surface opening (45a) formed in the surface (20a);
piercing the cover provided on the surface with the conductive terminal toward the back surface;
inserting the conductive terminal through the insertion hole to electrically connect the conductive terminal and the conductive portion;
A method of manufacturing an electronic device, wherein a metal piece (100) generated when the conductive portion and the conductive terminal are inserted is captured by the covering. 10. The method of manufacturing an electronic device according to claim 9, wherein the covering is provided on the surface over a plurality of the surface openings (45a).

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