JP2023085583A - Electric circuits for power supply of integrated circuits, capacitors and electric circuits with integrated circuits - Google Patents

Abstract

An object of the present invention is to reduce the number of capacitors. An electric circuit (101) for powering an integrated circuit (41) comprises an electric circuit (30) and at least one predetermined capacitor (11). The electric line 30 supplies DC power from the power supply PS1 to the integrated circuit 41 . A given capacitor 11 has a given characteristic. A predetermined capacitor 11 is electrically connected to the electric line 30 and the ground. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less. [Selection drawing] Fig. 1

Description

TECHNICAL FIELD This disclosure relates generally to electrical circuits for powering integrated circuits, capacitors and electrical circuits with integrated circuits, and more particularly to electrical circuits for powering integrated circuits comprising capacitors, capacitors used in such electrical circuits, and , relates to an electric circuit with an integrated circuit comprising this electric circuit.

The digital signal processing board described in Patent Document 1 includes an LSI to which a clock operation element is connected, a power supply input line for supplying power to the LSI, and a decoupling capacitor connected between the power supply input line and ground. and As the decoupling capacitor, a surface-mount solid electrolytic capacitor having an ESR of 25 mΩ (100 kHz) or less and an ESL of 800 pH (500 MHz) or less is used.

JP 2006-352059 A

However, in recent years, the specifications required for integrated circuits such as LSIs have become more sophisticated. For example, in a wider frequency band, it is required to suppress the impedance of the power supply line seen from the integrated circuit. Therefore, there was a problem that more capacitors were required.

An object of the present disclosure is to provide an electric circuit for supplying power to an integrated circuit, a capacitor, and an electric circuit with an integrated circuit that can reduce the number of capacitors.

An electrical circuit for powering an integrated circuit according to one aspect of the present disclosure comprises an electrical path and at least one predetermined capacitor. The electrical path provides DC power from a power supply to the integrated circuit. The predetermined capacitor has predetermined characteristics. The predetermined capacitor is electrically connected to the electric line and ground. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less.

A capacitor according to an aspect of the present disclosure is used as the predetermined capacitor in an electric circuit for power supply of the integrated circuit.

An electric circuit with an integrated circuit according to one aspect of the present disclosure includes an electric circuit for supplying power to the integrated circuit, and the integrated circuit.

The present disclosure has the advantage that the number of capacitors can be reduced.

FIG. 1 is a circuit diagram of an electrical circuit with an integrated circuit according to one embodiment. FIG. 2 is a schematic diagram of a main part of the electric circuit with an integrated circuit of the same. FIG. 3 is a schematic diagram of a main part of an electric circuit with an integrated circuit according to a comparative example. FIG. 4 is a characteristic diagram of a capacitor according to one embodiment. FIG. 5 is a characteristic diagram of a capacitor according to a comparative example. FIG. 6 is a characteristic diagram of a parallel circuit of a plurality of capacitors according to a comparative example. FIG. 7 is a schematic cross-sectional view of a capacitor according to one embodiment. FIG. 8 is a schematic cross-sectional view of a capacitor element of the same capacitor. FIG. 9 is a schematic diagram of a main part of an electric circuit with an integrated circuit according to Modification 1. As shown in FIG.

(embodiment)
An electric circuit for supplying power to an integrated circuit, a capacitor, and an electric circuit with an integrated circuit according to embodiments will be described below with reference to the drawings. However, the embodiment described below is but one of the various embodiments of the present disclosure. The embodiments described below can be modified in various ways according to design and the like as long as the objects of the present disclosure can be achieved. Each drawing described in the following embodiments is a schematic drawing, and the ratio of the size and thickness of each component in the drawing does not necessarily reflect the actual dimensional ratio. .

(1) Outline As shown in FIG. 1, an electric circuit 101 for power supply of an integrated circuit 41 of the present embodiment includes an electric circuit 30 and at least one predetermined capacitor 11. As shown in FIG. The electric line 30 supplies DC power from the power supply PS1 to the integrated circuit 41 . A given capacitor 11 has a given characteristic. A predetermined capacitor 11 is electrically connected to the electric line 30 and the ground. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less.

According to this embodiment, the number of capacitors used in the electric circuit 101 can be reduced. In other words, it is possible to reduce the number of capacitors required for suppressing voltage fluctuations in the electric circuit 30, which is the power supply line to the integrated circuit 41. FIG.

The predetermined characteristic of the predetermined capacitor 11 is more preferably a characteristic that the impedance is 10 [mΩ] or less at a frequency of 100 [kHz] or more and 10 [MHz] or less.

The self-resonant frequency of the predetermined capacitor 11 is preferably 300 [kHz] or more and 1 [GHz] or less. Further, it is preferable that the driving voltage of the predetermined capacitor 11 is 3.3 [V] or less.

The capacitor 11 is used as the predetermined capacitor 11 in the electric circuit 101 for power supply of the integrated circuit 41 . Capacitor 11 may be provided independently of the components of electrical circuit 101 other than capacitor 11 .

The integrated circuit-equipped electric circuit 100 also includes an electric circuit 101 for supplying power to the integrated circuit 41 and the integrated circuit 41 .

(2) Details The integrated circuit 41 is, for example, a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). Integrated circuit 41 is provided in, for example, a personal computer, a server computer, or a microcontroller.

The electric circuit 101 is, for example, a printed wiring board circuit. As shown in FIG. 1 , an electric circuit 101 for supplying power to an integrated circuit 41 (hereinafter simply referred to as “electric circuit 101 ”) includes a first electric line 31 and a second electric line 32 as electric lines 30 . The electric circuit 101 also includes capacitors 42 and 45 in addition to the capacitor 11 . Each capacitor 11, 42, 45 is an electrolytic capacitor. The electric circuit 101 also includes a DC/DC converter 43 and an inductor 44 .

The electric circuit 101 is electrically connected to the power supply PS1. A first end of the first electric line 31 is electrically connected to the power supply PS1. A second end of the first electric line 31 is electrically connected to the DC/DC converter 43 . The power supply PS1 is a DC power supply. The power supply PS1 is, for example, a battery. Power supply PS1 supplies DC power to DC/DC converter 43 .

Electrical circuit 101 is electrically connected to integrated circuit 41 . A first end of the second electric circuit 32 is electrically connected to the DC/DC converter 43 . A second end of the second electrical path 32 is electrically connected to the integrated circuit 41 . The capacitor 11 is electrically connected between the second electric line 32 and ground. More specifically, the first end of capacitor 11 is electrically connected to second electrical path 32, and the second end is electrically connected to ground.

That is, the DC/DC converter 43 is electrically connected between the power supply PS1 and the capacitor 11 (predetermined capacitor). DC/DC converter 43 converts the DC power input from power supply PS1 into DC power of a predetermined voltage, and outputs the DC power to second electric circuit 32 . The DC power output from the DC/DC converter 43 is input to (the power supply pin of) the integrated circuit 41 via the second electrical path 32 .

The switching frequency of the DC/DC converter 43 is 200 [kHz] or more and 10 [MHz] or less.

A capacitor 42 is electrically connected between the first electric line 31 and the ground. A capacitor 45 is electrically connected between the second electric line 32 and the ground. That is, a capacitor 42 is provided at the input stage of the DC/DC converter 43, and a capacitor 45 is provided at the output stage. Capacitor 42 smoothes the input voltage of DC/DC converter 43 . A capacitor 45 smoothes the output voltage of the DC/DC converter 43 .

An inductor 44 is electrically connected to the second electric line 32 . More specifically, inductor 44 is electrically connected between DC/DC converter 43 and capacitor 45 . Inductor 44 forms a low-pass filter together with capacitor 45 .

A capacitor 11 is electrically connected between the second electric line 32 and the ground. A connection point between the capacitor 11 and the second electrical path 32 is located between the capacitor 45 and the integrated circuit 41 .

FIG. 1 also shows a parasitic resistance 46 and a parasitic inductance 47 of the second electric circuit 32 . The wiring impedance of the second electric path 32 is determined by the parasitic resistance 46 and the parasitic inductance 47 . Here, the cable length between the capacitor 11 and the integrated circuit 41 is shorter than the cable length between the DC/DC converter 43 and the integrated circuit 41 . The wiring impedance between the capacitor 11 (predetermined capacitor) and the integrated circuit 41 is smaller than the wiring impedance between the DC/DC converter 43 and the integrated circuit 41 .

FIG. 2 is a schematic diagram showing an example of the spatial arrangement of a part of the electric circuit with integrated circuit 100. As shown in FIG. In FIG. 2 , conductor patterns 321 and 322 are provided as part of the second electric circuit 32 . The conductor pattern 321 is electrically connected to the DC/DC converter 43 (see FIG. 1) and the first end of the inductor 44 . Conductive pattern 322 is electrically connected to the second end of inductor 44 and integrated circuit 41 .

Also, the conductor pattern 322 has a first pattern N1, a second pattern N2, and a third pattern P1. The potentials of the first pattern N1 and the second pattern N2 are ground potentials. The potential of the third pattern P1 is different from the ground potential. A second end of the inductor 44 is electrically connected to the third pattern P1.

The capacitor 11 has four external electrodes. More specifically, capacitor 11 comprises a first external electrode 21 , a second external electrode 22 and two third external electrodes 23 . The first external electrode 21 and the second external electrode 22 are anode terminals. The first external electrode 21 and the second external electrode 22 are electrically connected to the third pattern P1. The two third external electrodes 23 are cathode terminals. One of the two third external electrodes 23 is electrically connected to the first pattern N1, and the other is electrically connected to the second pattern N2. The integrated circuit 41 is electrically connected to the third pattern P1. Also, the integrated circuit 41 is electrically connected to a ground pattern (first pattern N1 or second pattern N2).

1 and 2, the number of capacitors 11 is one. Thus, the number of capacitors 11 (predetermined capacitors) electrically connected to the electric circuit 30 may be one. Alternatively, the number of capacitors 11 (predetermined capacitors) electrically connected to the electric circuit 30 may be plural. It is preferable to reduce the cost and mounting area by reducing the number of capacitors 11 as much as possible within the range in which the load line impedance of the integrated circuit 41 is equal to or less than the desired value required for the integrated circuit 41 . Here, the load line impedance of the integrated circuit 41 is the total impedance of the entire power supply line viewed from the integrated circuit 41 . That is, the load line impedance of the integrated circuit 41 is calculated from the impedance of the DC/DC converter 43, the wiring impedance of the electric line 30, and the impedance of each element such as the capacitor 11 electrically connected to the electric line 30.

The load line impedance of the integrated circuit 41 is, for example, 10 [mΩ] or less at frequencies of 10 [MHz] or less.

As an example, in the frequency band in which the integrated circuit 41 is used, the load line impedance is 1.0 [mΩ] or less when the current consumption of the integrated circuit 41 is 200 [A].

As another example, in the frequency band in which the integrated circuit 41 is used, the load line impedance is 0.9 [mΩ] or less when the current consumption of the integrated circuit 41 is 226 [A].

As another example, in the frequency band in which the integrated circuit 41 is used, the load line impedance is 0.85 [mΩ] or less when the current consumption of the integrated circuit 41 is 117 [A].

As another example, in the frequency band in which the integrated circuit 41 is used, the load line impedance is 0.6 [mΩ] or less when the current consumption of the integrated circuit 41 is 392 [A].

As another example, in the frequency band in which the integrated circuit 41 is used, the load line impedance is 0.5 [mΩ] or less when the current consumption of the integrated circuit 41 is 490 [A] or more and 520 [A] or less. .

The capacitor 11 has an alternate lamination structure in which a first capacitor element 10a (see FIG. 7) facing in one direction and a second capacitor element 10b (see FIG. 7) facing in the opposite direction are alternately laminated. have. By having the alternately laminated structure, the capacitor 11 has the predetermined characteristics described above. Such a capacitor is called an alternately laminated capacitor. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less.

Also, the ESR (equivalent series resistance) of the capacitor 11 at the self-resonant frequency of the capacitor 11 is 2 [mΩ] or less. The ESL (equivalent series inductance) of the capacitor 11 at 500 [MHz] is 100 [pH] or less.

The voltage of the electric circuit 30 fluctuates due to the switching operation of the DC/DC converter 43, the fluctuation of the load current in the integrated circuit 41, and the like. By providing the capacitor 11 , the voltage fluctuation range can be kept within the range required for the integrated circuit 41 . Also, since the capacitor 11 has the above-described predetermined characteristics, the number of required capacitors can be reduced. That is, since the capacitor 11 has low impedance in a relatively wide frequency band, the number of capacitors 11 can be reduced. A second capacitor that does not have a predetermined characteristic may be electrically connected to the electric circuit 30 in parallel with the capacitor 11 (first capacitor). The number of capacitors can be reduced. Moreover, the mounting area of the capacitor 11 and the second capacitor can be reduced in some cases.

FIG. 3 is a schematic diagram showing an example of the spatial arrangement of a part of the electric circuit with integrated circuit 100P according to the comparative example. As shown in FIG. 3, when a capacitor 11P having a larger impedance than the capacitor 11 is used instead of the capacitor 11, a parallel circuit in which a plurality of such capacitors 11P (six in FIG. 3P) are connected in parallel , a characteristic equivalent to that of a single capacitor 11 can be obtained, but a larger number of capacitors 11P are required. Here, as an example, the capacitor 11P is assumed to be a ceramic capacitor.

FIG. 4 shows the characteristics of the capacitor 11 (alternating multilayer capacitor) of this embodiment. FIG. 5 shows the characteristics of the capacitor 11P of the comparative example. The capacitance of the capacitor 11P is 100 [μF]. FIG. 6 shows the characteristics of a parallel circuit in which six capacitors 11P of the comparative example are connected in parallel. 4 to 6, the horizontal axis represents frequency (unit: [MHz]), and the vertical axis represents impedance (unit: [Ω]). Since the impedance of the capacitors 11 and 11P is dominated by the capacitive component in the frequency band lower than the self-resonant frequency _f0 , the higher the frequency, the smaller the impedance. At the self-resonant frequency _f0 , only impedance corresponding to ESR (equivalent series resistance) appears. Since ESL (equivalent series inductance) is dominant in a frequency band higher than the self-resonant frequency _f0 , the higher the frequency, the higher the impedance.

From FIG. 4, capacitor 11 has the predetermined characteristics described above. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less. Here, focusing on impedance in a wider frequency band, the following characteristics are defined as predetermined characteristics. The predetermined characteristic is that the impedance is 10 [mΩ] or less at a frequency of 100 [kHz] or more and 10 [MHz] or less. From FIG. 5, the capacitor 11P does not have a predetermined characteristic, and from FIG. 6, a parallel circuit of six capacitors 11P has a predetermined characteristic. That is, in this embodiment, the parallel circuit of the six capacitors 11P of the comparative example can be replaced with one capacitor 11, so the number of capacitors can be reduced. By using the capacitor 11, the load line impedance of the integrated circuit 41 can be reduced while reducing the number of components.

Further, from FIG. 4, the self-resonant frequency _f0 of the capacitor 11 is 300 [kHz] or more and 1 [GHz] or less.

By adopting an alternately laminated capacitor as the capacitor 11, it is possible to reduce characteristic changes due to temperature, applied voltage, etc., compared to the case of adopting a ceramic capacitor. Also, compared to the case where a ceramic capacitor is used as the capacitor 11, the change in the capacitance of the capacitor 11 (AC bias characteristic) due to the AC component superimposed on the DC supplied to the capacitor 11 is very small.

Next, the structure of the capacitor 11 (hereinafter also referred to as the electrolytic capacitor 11) of this embodiment will be described with reference to FIGS. 7 and 8. FIG.

[Electrolytic capacitor]
An electrolytic capacitor 11 according to an embodiment of the present disclosure includes an element laminate in which a plurality of capacitor elements 10 are laminated, an exterior body 14 that seals the element laminate, a first external electrode 21, and a second An external electrode 22 and a third external electrode 23 are provided.

Each of the plurality of capacitor elements 10 includes an anode body 3 having a porous portion 5 on its surface, a dielectric layer formed on at least a portion of the surface of the porous portion 5, and covering at least a portion of the dielectric layer. and a cathode portion 6 . The plurality of capacitor elements 10 has a first end portion 1a where the anode body 3 is exposed and a second end portion 2a where the anode body 3 is covered with the cathode portion 6. At least the end face of the first end portion 1a is covered It is exposed from the body 14.

The plurality of capacitor elements 10 have a first end 1a facing a first surface 14a of the exterior body 14 and a second surface 14b having the first end 1a different from the first surface 14a of the exterior body 14. There is something to turn to. Among them, the first capacitor element 10a has the first end 1a facing the first surface 14a of the package 14, and the second capacitor element 10a has the first end 1a different from the first surface 14a of the package 14. The one facing the surface 14b is called the second capacitor element 10b. A first end 1 a of the first capacitor element 10 a is electrically connected to the first external electrode 21 . A first end 1 a of the second capacitor element 10 b is electrically connected to the second external electrode 22 .

According to this configuration, the direction in which the current flows in the element differs between the first capacitor element 10a and the second capacitor element 10b. Therefore, since the direction of the magnetic field generated by the current is different, the magnetic flux generated in the element stack is reduced. Therefore, ESL is reduced. Preferably, the first surface 14a and the second surface 14b may be surfaces of the exterior body 14 facing each other. Furthermore, when the first capacitor elements 10a and the second capacitor elements 10b are alternately stacked, the magnetic flux generated within the element stack can be effectively reduced. Therefore, ESL can be effectively reduced.

The number of first capacitor elements 10a and the number of second capacitor elements 10b may be the same. When the number of first capacitor elements 10a and the number of second capacitor elements 10b are the same, the magnetic field generated by the current flowing in the first capacitor element 10a and the magnetic field generated by the current flowing in the second capacitor element 10b cancel each other just enough, and the magnetic flux generated in the element laminate is reduced. Therefore, it is easy to reduce ESL.

Furthermore, the electrical connection between the element laminate and the external electrodes is such that the end surface of the first end portion 1a exposed from the exterior body 14 of each capacitor element 10 is connected to the external electrode (first external electrode 21 or second external electrode). It can be done by making an electrical connection with the electrode 22). Electrical connection between the end surface of the first end portion 1a and the external electrode is achieved, for example, by using an external electrode formed along the first surface 14a or the second surface 14b, or by using an external electrode formed along the first surface 14a or the This can be done by electrically connecting an intermediate electrode (corresponding to an anode electrode layer 16 described later) formed along the second surface 14b to an external electrode. In this case, since it is not necessary to interpose another member for connecting the first end portion 1a and the external electrode (the first external electrode 21 or the second external electrode 22) in the exterior body 14, It is easy to increase the capacity of the electrolytic capacitor 11 . In addition, in the current path from the portion of the anode body 3 where the cathode portion 6 is not formed (anode lead-out portion) to the first external electrode 21 or the second external electrode 22, the current path that flows parallel to the stacking surface of the element stack. is approximately equal to the length of the anode lead-out portion and can be easily shortened. Therefore, it is possible to further reduce the ESL caused by the current path flowing parallel to the stacking surface of the element stack.

Third external electrode 23 is electrically connected to cathode portion 6 of capacitor element 10 . The third external electrode 23 is electrically connected to the cathode section 6 in, for example, the outermost layer (that is, the bottom layer or the top layer) of the element laminate. This allows the cathode terminal to be provided on the bottom surface of the electrolytic capacitor 11 . On the other hand, the anode terminal can be provided on the bottom surface of the electrolytic capacitor 11 by extending the first external electrode 21 or the second external electrode 22 to the bottom surface of the electrolytic capacitor 11 . In this case, the current flowing through the extending portion of the first external electrode 21 or the second external electrode 22 flows in the opposite direction to the current flowing through the anode lead-out portion. Therefore, the magnetic field generated by the current flowing through the anode extraction portion is canceled by the magnetic field generated by the current flowing through the extended portion of the first external electrode 21 or the second external electrode 22, further reducing the ESL of the electrolytic capacitor 11. . As a result, the extended portion can shorten the separation distance between the cathode terminal and the first and/or second external electrodes, thereby improving the ESL. These synergistic effects significantly reduce the ESL.

The first end 1 a may be electrically connected to the first external electrode 21 or the second external electrode 22 via the contact layer 15 . The contact layer 15 can be selectively formed, for example, on the end surfaces of the first ends 1a of the plurality of capacitor elements 10 . The contact layer 15 serves as an intermediate electrode (anode electrode layer 16) or an external electrode formed to cover each of the first ends 1a of the plurality of capacitor elements 10 and the first surface 14a or the second surface 14b. can be connected between By interposing the contact layer 15, electrical connection between the first end portion 1a and the external electrode can be ensured. Therefore, the reliability of the electrolytic capacitor 11 can be improved.

The first external electrode 21 and the second external electrode 22 may be opposed to each other in the longitudinal direction of the anode body 3 or may be opposed to each other in the lateral direction. For example, the first external electrode 21 and the second external electrode 22 may each be arranged at an end portion along the short direction of one surface (for example, the bottom surface) of the exterior body 14, or may be arranged along the longitudinal direction. It may be arranged at the end. In terms of reducing ESL, the first external electrode 21 and the second external electrode 22 may be opposed to each other in the lateral direction of the anode body 3 . On the other hand, when the first external electrode 21 and the second external electrode 22 are opposed to each other in the longitudinal direction of the anode body 3, the first external electrode 21 or the second external electrode 22 at the bottom surface of the electrolytic capacitor 11 It is easy to lengthen the extension distance, easy to control the separation distance between the cathode terminal and the anode terminal, and easy to control the ESL to a desired value.

FIG. 7 is a cross-sectional view schematically showing the structure of an electrolytic capacitor 11 according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view showing the structure of capacitor element 10 constituting electrolytic capacitor 11 of FIG. However, the electrolytic capacitor 11 according to the present disclosure is not limited to these.

As shown in FIGS. 7 and 8, electrolytic capacitor 11 includes a plurality of capacitor elements 10 (10a, 10b). Capacitor element 10 includes anode body 3 and cathode portion 6 . The anode body 3 is, for example, foil (anode foil). Anode body 3 has porous portion 5 on its surface, and a dielectric layer (not shown) is formed on the surface of at least part of porous portion 5 . Cathode part 6 covers at least part of the dielectric layer.

Capacitor element 10 has anode body 3 exposed at one end (first end) 1a without being covered with cathode part 6, while anode at the other end (second end) 2a. Body 3 is covered with cathode part 6 . Hereinafter, the portion of anode body 3 not covered with cathode portion 6 is referred to as first portion 1 , and the portion of anode body 3 covered with cathode portion 6 is referred to as second portion 2 . The end of the first portion 1 is the first end 1a, and the end of the second portion 2 is the second end 2a. A dielectric layer is formed at least on the surface of the porous portion 5 formed in the second portion 2 . Note that the first portion 1 of the anode body 3 is also called an anode lead-out portion. The second part 2 of the anode body 3 is also called a cathode forming part.

More specifically, the second portion 2 has a core portion 4 and a porous portion (porous body) 5 formed on the surface of the core portion 4 by roughening (such as etching). On the other hand, the first portion 1 may or may not have the porous portion 5 on its surface. A dielectric layer is formed along the surface of the porous portion 5 . At least part of the dielectric layer covers the inner wall surfaces of the pores of the porous portion 5 and is formed along the inner wall surfaces.

The cathode section 6 includes a solid electrolyte layer 7 that covers at least part of the dielectric layer, and a cathode extraction layer that covers at least part of the solid electrolyte layer 7 . The surface of the dielectric layer has an uneven shape corresponding to the shape of the surface of anode body 3 . The solid electrolyte layer 7 can be formed so as to fill such unevenness of the dielectric layer. The cathode extraction layer includes, for example, a carbon layer 8 covering at least part of the solid electrolyte layer 7 and a silver paste layer 9 covering the carbon layer 8 .

The second portion 2 is the portion of the anode body 3 where the solid electrolyte layer 7 is formed on the anode body 3 with the dielectric layer (porous portion 5) interposed therebetween. A first portion 1 is a portion of anode body 3 where solid electrolyte layer 7 is not formed via porous portion 5).

Insulating separation layer (or insulating member) 12 may be formed so as to cover the surface of anode body 3 in at least the portion adjacent to cathode part 6 in the region of anode body 3 not facing cathode part 6 . This restricts contact between cathode portion 6 and the exposed portion (first portion 1 ) of anode body 3 . The separation layer 12 is, for example, an insulating resin layer.

In the example of FIG. 7, four capacitor elements 10 (10a, 10b) are stacked such that the cathode portions 6 (second portions 2) are overlapped. However, there are two types of capacitor elements 10 having different orientations of the first portion 1 in the anode body 3 . In FIG. 7, in the first capacitor element 10a, the first portion 1 of the anode body 3 faces in one direction (to the right in the drawing) with respect to the second portion 2. As shown in FIG. On the other hand, in the second capacitor element 10b, the first portion 1 of the anode body 3 faces the second portion 2 in the direction opposite to the direction in which the first portion 1 of the first capacitor element 10a faces (as shown in the figure). facing left). The first capacitor elements 10a and the second capacitor elements 10b are alternately stacked to form an element laminate. In a plurality of capacitor elements 10 (10a, 10b), cathode portions 6 adjacent to each other in the stacking direction are electrically connected via adhesive layers 13 having conductivity. A conductive adhesive, for example, is used to form the adhesive layer 13 . The adhesion layer 13 contains silver, for example.

The electrolytic capacitor 11 includes the above-described element laminate in which a plurality of capacitor elements 10 (10a, 10b) are laminated, an exterior body 14 that seals the element laminate, a first external electrode 21, and a second external electrode. An electrode 22 and a third external electrode 23 are provided. In the element laminate, the end face of the first end portion 1a is exposed from the outer package 14. As shown in FIG.

The exterior body 14 has a substantially rectangular parallelepiped outer shape, and the electrolytic capacitor 11 also has a substantially rectangular parallelepiped outer shape. The exterior body 14 has a first surface 14a and a second surface 14b opposite to the first surface 14a. In the element laminate, the first end 1a of the first capacitor element 10a faces the first surface 14a (that is, the first end 1a is closer to the first surface 14a than the second end 2a). ), the first end 1a of the second capacitor element 10b faces the second surface 14b (that is, the first end 1a is closer to the second surface 14b than the second end 2a) .

In electrolytic capacitor 11, each of the plurality of first end portions 1a (first portion 1) exposed from package 14 is connected to first external electrode 21 extending along first surface 14a or second surface. It is electrically connected to a second external electrode 22 extending along 14b. In this case, it is not necessary to bundle the plurality of first portions 1 to form the anode of the electrolytic capacitor 11, and it is not necessary to secure a length for bundling the plurality of first portions 1. FIG. Therefore, compared to the case where a plurality of first portions 1 are bundled, the ratio of the first portions 1 to the anode body 3 can be made smaller and the capacity can be increased. Also, the contribution of the ESL by the first portion 1 is reduced. Moreover, since the distance between the third external electrode 23 and the first external electrode 21 and/or the second external electrode 22 can be shortened, the ESL is improved.

In electrolytic capacitor 11 , each of the end surfaces of first end portions 1 a exposed from package 14 is covered with contact layer 15 . Anode electrode layer 16 covers first surface 14 a and second surface 14 b of contact layer 15 and package 14 . A first external electrode 21 and a second external electrode 22 cover the anode electrode layer 16, whereby the plurality of first ends 1a (first portions 1) are connected to the first external electrode 21 or the second external electrode 22. It is electrically connected to the external electrode 22 . Specifically, the anode electrode layer 16 covering the first surface 14a of the exterior body 14 is interposed between the contact layer 15 and the first external electrode 21, and the contact layer 15 and the second external electrode 22 are interposed. An anode electrode layer 16 covering the second surface 14b of the exterior body 14 is interposed therebetween.

In the example of FIG. 7, the element stack is supported by substrate 17 . The substrate 17 is, for example, a laminated substrate having conductive wiring patterns formed on its front and back surfaces, and the wiring patterns on the front surface and the wiring patterns on the back surface are electrically connected by through holes. The wiring pattern on the front surface is electrically connected to the cathode portion 6 of the capacitor element 10 laminated in the bottom layer, and the wiring pattern on the back surface is electrically connected to the third external electrode 23 . Therefore, electrical connection is established between the third external electrode 23 and the cathode portion 6 of each capacitor element 10 of the element stack through the substrate 17 . In this case, it is possible to arbitrarily set the number, shape and arrangement of the third external electrodes 23 depending on the wiring pattern on the back surface. The third external electrode 23 is formed on the substrate 17 by plating, for example, and the substrate 17 having the third external electrode 23 formed thereon can be handled as one member.

At least part of the third external electrode 23 is exposed at the bottom surface of the electrolytic capacitor 11 . The exposed portion of the bottom surface of the third external electrode 23 constitutes the cathode terminal of the electrolytic capacitor 11 . In the example of FIG. 7, two third external electrodes 23 are spaced apart, and the third external electrodes 23 are exposed in a plurality of regions.

A portion of first external electrode 21 is bent along the bottom surface of package 14 and exposed at the bottom surface of electrolytic capacitor 11 . Similarly, a portion of second external electrode 22 is bent along the bottom surface of exterior body 14 so as to face the bent portion of first external electrode 21 and is exposed at the bottom surface of electrolytic capacitor 11 . The exposed portions of the bottom surfaces of the first external electrode 21 and the second external electrode 22 form anode terminals of the electrolytic capacitor 11 . That is, in this embodiment, the electrolytic capacitor 11 has two spaced apart anode terminals. There may be a cathode terminal sandwiched between two spaced apart anode terminals.

The ESL of the electrolytic capacitor 11 is defined by the separation distance L ₁ between the first external electrode 21 and the third external electrode 23 on the bottom surface and the separation distance between the second external electrode 22 and the third external electrode 23 on the bottom surface. depends on _L2 . The shorter the separation distances _L1 and _L2 , the easier it is for the ESL to become smaller. In order to reduce ESL, a plurality of third external electrodes 23 may be arranged on the bottom surface. In this case, one of the plurality of third external electrodes 23 is arranged close to the first external electrode 21, and the other one of the plurality of third external electrodes 23 is arranged close to the second external electrode 22. can be placed as This can effectively reduce the ESL. The separation distances L ₁ and L ₂ may be, for example, 0.4 mm to 1.1 mm. Note that "having a plurality of third external electrodes 23" means that the third external electrodes 23 are exposed in a plurality of spaced regions, and the plurality of third external electrodes 23 are spaced apart. is not limited to Two or more of the plurality of third external electrodes 23 may be continuously formed within the exterior body 14 and electrically connected. The plurality of third external electrodes 23 may be provided on different surfaces of the exterior body 14 such that one is provided on the top surface and the other is provided on the bottom surface.

In electrolytic capacitor 11, the direction of current flowing through first capacitor element 10a is opposite to the direction of current flowing through second capacitor element 10b. Therefore, the magnetic field generated by the current flowing through the first capacitor element 10a cancels out the magnetic field generated by the current flowing through the second capacitor element 10b, and the magnetic flux generated in the electrolytic capacitor 11 is reduced. As a result, ESL is reduced.

On the other hand, in the first portion 1 and the second portion 2 where the capacitor elements 10 do not overlap each other (in FIG. 7, the portion not covered with the cathode extraction layer), the magnetic field canceling effect does not occur. In the electrolytic capacitor 11 of this embodiment, it is easy to shorten the length of the first portion 1 . Thus, the contribution of ESL caused by this portion is reduced. Furthermore, since the first external electrode 21 and the second external electrode 22 extend along the bottom surface of the exterior body 14, the contribution of ESL caused by this portion can be further reduced. These effects can significantly improve the ESL of electrolytic capacitor 11 .

The constituent elements of the electrolytic capacitor 11 according to the above embodiment will be described in more detail below.

(Anode body 3)
Anode body 3 can contain a valve action metal, an alloy containing a valve action metal, a compound (such as an intermetallic compound) containing a valve action metal, or the like. These materials can be used singly or in combination of two or more. Aluminum, tantalum, niobium, titanium, etc. can be used as the valve metal. The anode body 3 may be a foil of a valve action metal, an alloy containing a valve action metal, or a compound containing a valve action metal. It may be a porous sintered body.

When a metal foil is used for anode body 3, porous portion 5 is usually formed on the surface of at least second portion 2 of the anode foil in order to increase the surface area. The second portion 2 has a core portion 4 and a porous portion 5 formed on the surface of the core portion 4 . The porous portion 5 may be formed by roughening the surface of at least the second portion 2 of the anode foil by etching or the like. After arranging a predetermined masking member on the surface of the first portion 1, it is also possible to perform surface roughening treatment such as etching treatment. On the other hand, it is also possible to roughen the entire surface of the anode foil by etching or the like. In the former case, an anode foil having no porous portion 5 on the surface of the first portion 1 and having the porous portion 5 on the surface of the second portion 2 is obtained. In the latter case, the porous portion 5 is also formed on the surface of the first portion 1 in addition to the surface of the second portion 2 . As the etching treatment, a known method may be used, for example, electrolytic etching. The masking member is not particularly limited, but is preferably an insulator such as resin. The masking member, which is removed before forming the solid electrolyte layer 7, may be a conductor containing a conductive material.

When the entire surface of the anode foil is roughened, the first portion 1 has a porous portion 5 on its surface. Therefore, the adhesion between the porous portion 5 and the exterior body 14 is insufficient, and air (specifically, oxygen and moisture) enters the inside of the electrolytic capacitor 11 through the contact portion between the porous portion 5 and the exterior body 14. sometimes. In order to suppress this, the porous first portion 1 may be compressed in advance to crush the pores of the porous portion 5 . As a result, air can be prevented from entering inside electrolytic capacitor 11 through porous portion 5 from first end portion 1a exposed from exterior body 14, and deterioration of reliability of electrolytic capacitor 11 due to the air entering can be suppressed.

(dielectric layer)
The dielectric layer is formed, for example, by anodizing the valve action metal on the surface of at least the second portion 2 of the anode body 3 by chemical conversion treatment or the like. The dielectric layer contains an oxide of a valve metal. For example, the dielectric layer contains aluminum oxide when aluminum is used as the valve metal. The dielectric layer is formed along at least the surface of the second portion 2 where the porous portion 5 is formed (including the inner wall surfaces of the pores of the porous portion 5). Note that the method of forming the dielectric layer is not limited to this, and any method may be used as long as an insulating layer that functions as a dielectric can be formed on the surface of the second portion 2 . The dielectric layer may also be formed on the surface of the first portion 1 (for example, on the porous portion 5 of the surface of the first portion 1).

(Cathode part 6)
The cathode section 6 includes a solid electrolyte layer 7 that covers at least part of the dielectric layer, and a cathode extraction layer that covers at least part of the solid electrolyte layer 7 .

(Solid electrolyte layer 7)
The solid electrolyte layer 7 contains, for example, a conductive polymer. Examples of conductive polymers that can be used include polypyrrole, polythiophene, polyaniline, and derivatives thereof. The solid electrolyte layer 7 can be formed, for example, by chemically and/or electrolytically polymerizing raw material monomers on the dielectric layer. Alternatively, it can be formed by applying a solution in which a conductive polymer is dissolved or a dispersion in which a conductive polymer is dispersed to the dielectric layer. The solid electrolyte layer 7 may contain a manganese compound.

(Cathode extraction layer)
The cathode extraction layer includes, for example, carbon layer 8 and silver paste layer 9 . The carbon layer 8 only has to be conductive, and can be made of a conductive carbon material such as graphite, for example. The carbon layer 8 is formed by applying carbon paste to at least a portion of the surface of the solid electrolyte layer 7, for example. For the silver paste layer 9, for example, a composition containing silver powder and a binder resin (such as an epoxy resin) can be used. The silver paste layer 9 is formed by applying silver paste to the surface of the carbon layer 8, for example. The configuration of the cathode extraction layer is not limited to this, and may be any configuration having a current collecting function.

(separation layer 12)
An insulating separation layer 12 may be provided to electrically separate the first portion 1 and the cathode portion 6 . Separation layer 12 may be provided in proximity to cathode section 6 so as to cover at least part of the surface of first portion 1 . Separation layer 12 is preferably in close contact with first portion 1 and exterior body 14 . As a result, the intrusion of air into the inside of the electrolytic capacitor 11 can be suppressed. The separation layer 12 may be arranged on the first portion 1 via a dielectric layer.

The separation layer 12 may contain, for example, a resin, and may be one exemplified for the exterior body 14 to be described later. The dielectric layer formed on the porous portion 5 of the first portion 1 may be compressed and densified to provide insulation.

Separation layer 12 in close contact with first portion 1 can be obtained, for example, by attaching a sheet-like insulating member (resin tape or the like) to first portion 1 . When using an anode foil having a porous portion 5 on its surface, the insulating member may be brought into close contact with the first portion 1 after the porous portion 5 of the first portion 1 is compressed and flattened. It is preferable that the sheet-shaped insulating member has an adhesive layer on the surface thereof to be attached to the first portion 1 .

Alternatively, the first portion 1 may be coated with or impregnated with a liquid resin to form an insulating member that is in close contact with the first portion 1 . In the method using liquid resin, the insulating member is formed so as to fill the irregularities on the surface of the porous portion 5 of the first portion 1 . The liquid resin can easily enter the recesses on the surface of the porous portion 5, and the insulating member can be easily formed in the recesses. As the liquid resin, a curable resin composition exemplified in the fourth step described later can be used.

(Exterior body 14)
The exterior body 14 preferably contains, for example, a cured product of a curable resin composition, and may contain a thermoplastic resin or a composition containing the same.

The exterior body 14 can be formed using a molding technique such as injection molding, for example. The exterior body 14 can be formed, for example, by filling a curable resin composition or a thermoplastic resin (composition) using a predetermined mold into predetermined locations so as to cover the capacitor element 10 .

The curable resin composition may contain fillers, curing agents, polymerization initiators, and/or catalysts in addition to the curable resin. A thermosetting resin is exemplified as the curable resin. Curing agents, polymerization initiators, catalysts and the like are appropriately selected according to the type of curable resin.

As the curable resin composition and the thermoplastic resin (composition), those exemplified in the third step described later can be used.

From the viewpoint of adhesion between the separation layer 12 and the exterior body 14, it is preferable that the insulating member and the exterior body 14 each contain a resin. The exterior body 14 is more likely to adhere to the insulating member containing resin than the first portion 1 containing the valve metal and the dielectric layer containing the oxide of the valve metal.

More preferably, the separation layer 12 and the exterior body 14 contain the same resin. In this case, the adhesion between separation layer 12 and exterior body 14 is further improved, thereby further suppressing the entry of air into electrolytic capacitor 11 . Examples of the same resin contained in the separation layer 12 and the exterior body 14 include epoxy resin.

From the viewpoint of enhancing the strength of the exterior body 14, the exterior body 14 preferably contains a filler. On the other hand, the separation layer 12 preferably contains a filler with a smaller particle size than the outer casing 14, and more preferably does not contain a filler. When the separation layer 12 is formed by impregnating the first portion 1 with a liquid resin, the liquid resin preferably contains a filler with a smaller particle size than the exterior body 14, and more preferably does not contain a filler. In this case, the liquid resin is easily impregnated into the deep recesses on the surface of the porous portion 5 of the first portion 1, and the separation layer 12 is easily formed. In addition, it is easy to form a thin separation layer 12 so that a plurality of capacitor elements 10 can be stacked.

(Contact layer 15)
Contact layer 15 may be formed to cover the end surface of first end portion 1 a of anode body 3 . Preferably, the contact layer 15 may be formed to cover only the surface of the first end portion 1a exposed from the exterior body 14 without covering the surface of the exterior body 14 (and the separation layer 12) made of resin material as much as possible. .

Contact layer 15 may contain a metal having a lower ionization tendency than the metal forming anode body 3 . For example, when anode body 3 is an aluminum (Al) foil, contact layer 15 can be made of a material containing Zn, Ni, Sn, Cu, or Ag, for example. In this case, since the formation of a strong oxide film on the surface of contact layer 15 is suppressed, the electrical connection can be made easier than when the exposed portion of anode body 3 at first end portion 1a is directly connected to the external electrode. can be certain.

An alloy layer may be formed at the interface between contact layer 15 and anode body 3 . For example, when the anode body 3 is an aluminum (Al) foil, the interatomic distance between Cu, Zn, or Ag is close to that of Al, so an alloy layer can be formed at the interface by intermetallic bonding with Al. Thereby, the bonding strength with anode body 3 can be increased. The contact layer 15 may be composed of a single element metal of the above elements, may be composed of an alloy such as bronze or brass, or may be composed of a plurality of laminated metal layers of different single elements (for example, A laminate structure of a Cu layer and an Ag layer) may be used.

When the contact layer 15 is formed, the exterior body 14 preferably does not contain a filler, or when the exterior body 14 contains a filler, the Young's modulus of the filler is preferably smaller than the Young's modulus of the contact layer 15 . Thereby, formation of the contact layer 15 on the surface of the exterior body 14 is suppressed, and the contact layer 15 can be selectively formed on the end surface of the first end portion 1a.

The contact layer 15 can be formed by, for example, a cold spray method, thermal spraying, plating, vapor deposition, or the like. In the cold spray method, for example, solid state metal particles are collided with the surface (first surface 14a and / or second surface 14b) of the exterior body 14 including the exposed surface of the first end 1a, The metal particles are fixed to the surface by plastic deformation to form the contact layer 15 containing the metal constituting the metal particles on the end face of the first end portion 1a. In this case, if the Young's modulus of the metal particles is greater than the Young's modulus of the component (for example, filler) of the exterior body 14, the metal particles that collide with the surface of the exterior body 14 are plastically deformed on the surface of the exterior body 14. is suppressed, and sticking to the surface of the exterior body 14 can be suppressed. At least part of the energy from the collision is used to destroy the exterior body 14, and part of the resin is scraped off. As a result, the contact layer 15 is selectively formed on the end surface of the first end portion 1a of the anode body 3, and the surface of the exterior body 14 (first surface 14a and/or second surface 14b) is roughened. can be

(Anode electrode layer 16)
An anode electrode layer 16 may be interposed between the contact layer 15 and the external electrode (first external electrode 21 or second external electrode 22). The anode electrode layer 16 covers the first surface 14a or the second surface 14b of the package 14 and, if necessary, the first ends 1a of the (plurality) capacitor elements 10 via the contact layer 15. can be electrically connected.

The anode electrode layer 16 may include a conductive resin layer mixed with conductive particles. The conductive resin layer can be formed by applying a conductive paste containing conductive particles and a resin material to the first surface 14a or the second surface 14b of the exterior body 14 and drying it. The resin material is suitable for bonding with the material forming outer casing 14 and anode body 3 (contact layer 15), and can increase the bonding strength by chemical bonding (for example, hydrogen bonding). As the conductive particles, for example, metal particles such as silver and copper, and particles of a conductive inorganic material such as carbon can be used.

The anode electrode layer 16 may be a metal layer. In that case, the anode electrode layer 16 may be formed using an electrolytic plating method, an electroless plating method, a sputtering method, a vacuum deposition method, a chemical vapor deposition (CVD) method, a cold spray method, or a thermal spraying method.

The anode electrode layer 16 may cover part of the surface (for example, the top surface or the bottom surface) perpendicular to the first surface 14a and the second surface 14b of the exterior body 14 .

The surface roughness Ra of the exterior body 14 covered with the anode electrode layer 16 may be 5 micrometers or more. In this case, the contact area between the anode electrode layer 16 and the exterior body 14 is increased, and the adhesion between the anode electrode layer 16 and the exterior body 14 is improved due to the anchor effect, so that the reliability can be further enhanced.

(external electrode)
The first to third external electrodes 21 to 23 are preferably metal layers. The metal layer is, for example, a plated layer. The metal layer contains, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), zinc (Zn), tin (Sn), silver (Ag), and gold (Au). For forming the first to third electrode layers, for example, film formation techniques such as electrolytic plating, electroless plating, sputtering, vacuum deposition, chemical vapor deposition (CVD), cold spraying, and thermal spraying are used. may

The first to third external electrodes 21 to 23 may have, for example, a laminated structure of Ni layers and tin layers. At least the outer surfaces of the first to third external electrodes 21 to 23 may be made of a metal having excellent wettability with solder. Examples of such metals include Sn, Au, Ag, Pd, and the like.

As for the first external electrode 21 and the second external electrode 22 , the external electrodes may be formed by bonding a Cu cap on which a Sn film is formed in advance to the anode electrode layer 16 .

The first external electrode 21 and the second external electrode 22 together constitute an anode terminal of the electrolytic capacitor 11 . When mounting electrolytic capacitor 11 on substrate 17 , both first external electrode 21 and second external electrode 22 must be connected to the electrodes on substrate 17 . However, the first external electrode 21 and the second external electrode 22 may be electrically connected via a surface of the exterior body 14 other than the first surface 14a and the second surface 14b. . In this case, when mounting the electrolytic capacitor 11 on the substrate 17, either the first external electrode 21 or the second external electrode 22 may be connected to the electrode on the substrate.

[Manufacturing method of electrolytic capacitor 11]
An electrolytic capacitor 11 according to an embodiment of the present disclosure includes, for example, a first step of preparing an anode body 3, a second step of obtaining a plurality of capacitor elements 10, and an element laminate in which a plurality of capacitor elements 10 are laminated. a fourth step of covering the element laminate with the exterior body 14; a fifth step of forming the end face of the first portion 1 and exposing it from the exterior body 14; and a sixth step of electrically connecting to the . The manufacturing method may further include a step of disposing separation layer 12 (insulating member) on a portion of anode body 3 (separation layer disposing step). Each step of the method for manufacturing the electrolytic capacitor 11 will be described below.

(First step)
In the first step, anode body 3 having a dielectric layer formed on its surface is prepared. More specifically, it comprises a first portion 1 including one end and a second portion 2 including the other end opposite to the one end, and at least a surface of the second portion 2 is coated with a dielectric. A layered anode body 3 is provided. The first step includes, for example, a step of forming porous portion 5 on the surface of anode body 3 and a step of forming a dielectric layer on the surface of porous portion 5 . More specifically, the anode body 3 used in the first step includes the first portion 1 including the end to be removed (the one end) and the second end 2a (the other end). a second portion 2; It is preferable to form the porous portion 5 on at least the surface of the second portion 2 .

When forming the porous portion 5 on the surface of the anode body 3, it is sufficient to form unevenness on the surface of the anode body 3. For example, the surface of the anode foil may be roughened by etching (eg, electrolytic etching). can be done by

The dielectric layer may be formed by subjecting anode body 3 to chemical conversion treatment. In the chemical conversion treatment, for example, the surface of the anode body 3 is impregnated with the chemical conversion liquid by immersing the anode body 3 in the chemical conversion liquid, and a voltage is applied between the anode body 3 and the cathode immersed in the chemical conversion liquid, using the anode body 3 as the anode. can be performed by applying When the surface of anode body 3 has porous portion 5 , the dielectric layer is formed along the irregularities on the surface of porous portion 5 .

(Separation layer placement step)
When manufacturing electrolytic capacitor 11 having separation layer 12 (insulating member), the step of disposing separation layer 12 (insulating member) may be performed after the first step and before the second step. In this step, an insulating member is placed on a portion of anode body 3 . More specifically, in this step, an insulating member is placed on first portion 1 of anode body 3 with a dielectric layer interposed therebetween. The insulating member is arranged so as to separate the first portion 1 from the cathode portion 6 formed in a later step.

In the separation layer placement step, a sheet-like insulating member (resin tape or the like) may be attached to a portion of anode body 3 (eg, first portion 1). Even when anode body 3 having porous portion 5 formed on its surface is used, the insulating member can be firmly adhered to first portion 1 by compressing and flattening the uneven surface of first portion 1 . . It is preferable that the sheet-shaped insulating member has an adhesive layer on the surface thereof to be attached to the first portion 1 .

In addition to the above, the insulating member may be formed by coating or impregnating a portion of the anode body 3 (for example, the first portion 1) with a liquid resin in the separation layer placement step. For example, a liquid resin may be applied or impregnated and then cured. In this case, the insulating member can be easily formed in close contact with the first portion 1 . As the liquid resin, a curable resin composition exemplified in the fourth step (formation of the exterior body 14), a resin solution obtained by dissolving a resin in a solvent, or the like can be used.

When the porous portion 5 is formed on the surface of the anode body 3, a part of the surface of the porous portion 5 of the anode body 3 (for example, the surface of the first portion 1) may be coated or impregnated with a liquid resin. preferable. In this case, the insulating member can be easily formed so as to fill the irregularities on the surface of the porous portion 5 of the first portion 1 . The liquid resin can easily enter the recesses on the surface of the porous portion 5, and the insulating member can be easily formed in the recesses. As a result, the porous portion 5 on the surface of the anode body 3 is protected by the insulating member. collapse is suppressed. Since the surface of porous portion 5 of anode body 3 and the insulating member are in close contact with each other, when anode body 3 is partially removed together with package body 14 in the fourth step, the insulating member does not adhere to anode body 3 . Peeling from the surface of the porous portion 5 is suppressed.

(Second step)
In the second step, cathode portion 6 is formed on anode body 3 to obtain capacitor element 10 . When the insulating member is provided in the sixth step, the cathode portion 6 is formed in the portion of the anode body 3 where the insulating member is not arranged in the second step to obtain the capacitor element 10 . More specifically, in the second step, at least part of the dielectric layer formed on the surface of second portion 2 of anode body 3 is covered with cathode portion 6 .

The step of forming the cathode section 6 includes, for example, a step of forming a solid electrolyte that covers at least a portion of the dielectric and a step of forming a cathode extraction layer that covers at least a portion of the solid electrolyte layer 7 .

The solid electrolyte layer 7 can be formed, for example, by chemically and/or electrolytically polymerizing raw material monomers on the dielectric layer. Alternatively, the solid electrolyte layer 7 may be formed by applying a treatment liquid containing a conductive polymer and then drying it. The treatment liquid may further contain other components such as dopants. Poly(3,4-ethylenedioxythiophene) (PEDOT), for example, is used as the conductive polymer. Polystyrene sulfonic acid (PSS), for example, is used as the dopant. The treatment liquid is a dispersion or solution of a conductive polymer. Dispersion media (solvents) include, for example, water, organic solvents, and mixtures thereof.

The cathode extraction layer can be formed, for example, by sequentially laminating the carbon layer 8 and the silver paste layer 9 on the solid electrolyte layer.

(Third step)
In the third step, a plurality of capacitor elements 10 are laminated to obtain an element laminate. In this step, for example, a plurality of capacitor elements 10 are alternately attached to each other by a conductive adhesive so that the first portions 1 of adjacent capacitor elements 10 face opposite sides. to obtain an element laminate.

After that, the element laminate is placed on a laminate substrate (substrate 17) having wiring patterns formed on the front and back surfaces via a conductive adhesive. A third external electrode 23 is formed in advance on the side of the laminated substrate opposite to the side on which the element laminate is mounted. By mounting, the third external electrode 23 is connected to the capacitor element constituting the element laminate via the wiring pattern formed on the multilayer substrate and the through hole connecting the wiring pattern on the front surface and the wiring pattern on the back surface. 10 is electrically connected to the cathode portion 6 .

In addition, for example, a plate-like third external electrode 23 processed into a predetermined shape is pasted on the surface of the cathode portion 6 exposed in the lowermost layer or uppermost layer of the element laminate via a conductive paste or the like. Thus, electrical connection between the element stack and the third external electrode 23 may be established.

Electroplating, electroless plating, physical vapor deposition, chemical vapor deposition, cold spraying, and/or thermal spraying may be used to form the third external electrode 23 .

(Fourth step)
In the fourth step, the element laminate is covered with the exterior body 14 . At this time, all of the third external electrodes 23 are not covered with the exterior body 14, and at least a portion of the third external electrodes 23 is exposed. The exterior body 14 can be formed using injection molding or the like. The exterior body 14 can be formed, for example, by filling a curable resin composition or a thermoplastic resin (composition) using a predetermined mold into predetermined locations so as to cover the element laminate.

The curable resin composition may contain fillers, curing agents, polymerization initiators, and/or catalysts in addition to the curable resin. Curable resins include epoxy resins, phenolic resins, urea resins, polyimides, polyamideimides, polyurethanes, diallyl phthalates, unsaturated polyesters, and the like. Examples of thermoplastic resins include polyphenylene sulfide (PPS) and polybutylene terephthalate (PBT). A thermoplastic resin composition containing a thermoplastic resin and a filler may be used.

Preferred fillers are, for example, insulating particles and/or fibers. Examples of the insulating material that constitutes the filler include insulating compounds (oxides, etc.) such as silica and alumina, glass, mineral materials (talc, mica, clay, etc.), and the like. The exterior body 14 may contain one type of these fillers, or may contain two or more types in combination.

(Fifth step)
In the fifth step, after the fourth step, the end surface of the first portion 1 is formed and exposed from the exterior body 14 . More specifically, at least the anode body 3 is partially removed together with the exterior body 14 at both end portions of the element laminate, and at least the first end 1a (specifically, the first end) of the anode body 3 is removed. The end surface of the portion 1a) is exposed from the exterior body 14 on both the first surface 14a and the second surface 14b. As a method for exposing the first end portion 1a from the exterior body 14, for example, after covering the capacitor element 10 with the exterior body 14, the surface of the exterior body 14 is exposed so that the first end portion 1a is exposed from the exterior body 14. and cutting off a part of the exterior body 14. Also, part of the first portion 1 may be cut off together with part of the exterior body 14 . In this case, the first end portion 1a, which does not include the porous portion 5 and has a surface on which the natural oxide film is not formed, can be easily exposed from the exterior body 14, and the first portion 1 and the external electrode can be easily exposed. A connection state with low resistance and high reliability can be obtained between Dicing is preferable as a method for cutting the outer package 14 . As a result, the exposed end surface of the first end portion 1a of the first portion 1 appears on the cut surface. In addition, since the element laminate has two types of capacitor elements 10 in which the orientation of the first portion 1 is different, when part of the first portion 1 is cut off together with part of the exterior body 14, it is necessary to cut at two locations. be. One of the two cut surfaces becomes the first surface 14a and the other becomes the second surface 14b.

In the fifth step, the anode body 3 and the insulating member are partially removed together with the outer package 14 at both end portions of the element stack to expose the end surface of the first end 1a and the end surface of the insulating member from the outer package 14. You may let In this case, anode body 3 and insulating member are each formed with flush end surfaces exposed from package 14 . Thereby, the end face of anode body 3 and the end face of the insulating member, which are flush with the surface of package 14 , can be easily exposed from package 14 .

By the fifth step, the end face of anode body 3 (first end portion 1a) on which no natural oxide film is formed can be easily exposed from package 14, and anode body 3 (more specifically, the A connection state with low resistance and high reliability can be obtained between the portion 1) and the external electrode.

(6th step)
In the sixth step, the end surface of anode body 3 (first end portion 1a) exposed from exterior body 14 is electrically connected to an external electrode. In this step, for example, the first external electrode 21 is formed so as to cover the first surface 14a of the exterior body 14, the second external electrode 22 is formed so as to cover the second surface 14b, Each external electrode is electrically connected to the end surface of the first end portion 1a. The electrical connection between the end face of the first end portion 1a and the external electrode may be performed by joining or the like, or by an electrolytic plating method, an electroless plating method, a physical vapor deposition method, a chemical vapor deposition method, a cold spray method, and/or A thermal spray method may also be used.

Prior to forming the first external electrode 21 and the second external electrode 22, a step of forming the contact layer 15 on the surface, which is the end face of the first end portion 1a, and/or the first A step of forming the anode electrode layer 16 covering the surface 14a or the second surface 14b may be performed. When forming the anode electrode layer 16 , the first external electrode 21 and the second external electrode 22 are formed so as to cover the anode electrode layer 16 .

(Step of forming contact layer 15)
The contact layer 15 can be formed by, for example, a cold spray method, thermal spraying, plating, vapor deposition, or the like. The contact layer 15 may be formed so as not to cover the first surface 14a and the second surface 14b of the exterior body 14 as much as possible, but to selectively cover the end surface of the first end portion 1a.

When using the cold spray method, the contact layer 15 is formed by colliding metal particles against the end face of the first end portion 1a at high speed. The metal particles may be particles of a metal having a lower ionization tendency than the metal forming the anode body 3 . For example, when the anode body 3 is an Al foil, such metal particles include Cu particles. In this case, the Cu particles that collide with the end face of the first end portion 1a at high speed break through the natural oxide film (Al oxide film) formed on the end face, forming a metallic bond between Al and Cu. As a result, an alloy layer of Al and Cu can be formed at the interface between the contact layer 15 and the first end portion 1a. On the other hand, the surface of the contact layer 15 is covered with a Cu layer, which is a non-valve metal. Since Cu has a lower ionization tendency than Al, the surface of the contact layer 15 is less likely to be oxidized, and electrical connection with the external electrode (or the anode electrode layer 16) can be ensured.

The cold spray method uses a compressed gas such as air, nitrogen, or helium to accelerate metal particles with a size of several μm to several tens of μm from subsonic to supersonic speeds and deposit them on the substrate in a solid state. It is a technique of forming a metal film by colliding. Although some parts of the adhesion mechanism of metal particles in the cold spray method have not been elucidated, in general, the impact energy of the metal particles plastically deforms the metal particles or the metal substrate, exposing a new surface on the metal surface. It is believed to be activated by

In the cold spray method, the metal particles can also collide with the first surface 14a and the second surface 14b of the exterior body 14 made of a nonmetallic material and the end surfaces of the separation layer 12 (insulating member). When the base material with which the metal particles collide is a resin base material, the bonding between the metal particles and the resin base material is mainly mechanical due to the plastically deformed metal particles fitting into the unevenness of the surface of the resin base material. It is considered to be a good junction. Therefore, in order to form a metal film on the surface of the resin base material, (ia) the resin base material must have sufficient hardness so that the collision energy can be efficiently used for plastic deformation of the metal particles, (iia) the metal particles and (iiia) the resin base material should not be easily destroyed by the energy of the collision.

Conversely, when the metal particles are not fixed to the resin base material, (ib) the resin base material should be elastic to prevent the collision energy from being converted into plastic deformation energy, and (iib) the end surface of the first end portion 1a. and (iiib) reducing the strength of the resin base material and destroying the base material with less than the impact that causes plastic deformation. The basic condition is to let

In general, when the Young's modulus of the metal particles is smaller than the Young's modulus of the member (for example, filler) that constitutes the resin base material, plastic deformation at the time of collision of the metal particles tends to be promoted. Plastic deformation at the time of collision tends to be suppressed. In the latter case, the collision energy of the metal particles causes brittle fracture of the resin base material, scraping off the surface of the resin base material.

Therefore, by making the Young's modulus of the metal particles (which may be called the contact layer 15) larger than the Young's modulus of the filler contained in the resin base material, it is possible to create a state in which the metal particles are difficult to adhere to the resin base material. can. As a result, the contact layer 15 is prevented from being formed on the first surface 14a and the second surface 14b of the exterior body 14 and the end surface of the separation layer 12 (insulating member). It becomes possible to selectively form it on the end surface of the portion 1a. Also, by colliding the metal particles against the first surface 14a and the second surface 14b of the exterior body 14, the effect of roughening the first surface 14a and the second surface 14b can be obtained.

For example, when the sheath 14 is filled with silica having a Young's modulus of 94 GPa, Cu particles and Ni particles can be used as metal particles that have a higher Young's modulus than this and are easily bonded to Al. . However, the fixed state changes depending on the shape, size, and temperature of the metal particles, and the size and filling rate of the silica filled in the resin material, so that the present invention is not limited to this.

(Step of forming anode electrode layer 16)
The anode electrode layer 16 covers the end surface of the first end portion 1a or the contact layer 15, the first surface 14a and the second surface 14b of the outer package 14, and the separation layer 12 (insulating layer 12) when the separation layer 12 is provided. member).

Anode electrode layer 16 may be formed by applying a conductive paste containing conductive particles and a resin material. Specifically, a conductive paste (for example, silver paste) is applied to each end surface by a dipping method, a transfer method, a printing method, a dispensing method, or the like, and then cured at a high temperature to form the anode electrode layer 16 . do.

Alternatively, the anode electrode layer 16, which is a metal layer, may be formed by an electrolytic plating method, an electroless plating method, a sputtering method, a vacuum deposition method, a chemical vapor deposition (CVD) method, a cold spray method, or a thermal spraying method.

(Modification 1)
An electric circuit 100A with an integrated circuit and an electric circuit 101A according to Modification 1 of the embodiment will be described below with reference to FIG. Configurations similar to those of the embodiment are denoted by the same reference numerals, and descriptions thereof are omitted.

In Modification 1, a case will be described in which a feedthrough capacitor is employed in order to realize a predetermined capacitor having predetermined characteristics. That is, the capacitor 11A (predetermined capacitor) of Modification 1 is a feedthrough capacitor.

The capacitor 11A includes a housing 24, two anode terminals 25 and 26, a through portion 27, and at least one cathode terminal 28 (four in FIG. 9). The two anode terminals 25 and 26 are exposed outside the housing 24 . The two anode terminals 25 , 26 are electrically connected to the electric line 30 . The through portion 27 is arranged inside the housing 24 . The through portion 27 electrically connects the two anode terminals 25 and 26 . The cathode terminal 28 is exposed outside the housing 24 . The cathode terminal 28 is electrically connected to the ground (that is, the ground potential conductor pattern N3).

The shape of the housing 24 is a rectangular parallelepiped. The two anode terminals 25 and 26 are provided on two surfaces of the housing 24 facing each other. Each of the plurality of cathode terminals 28 is provided on a surface of the housing 24 other than the two surfaces (surface facing the conductor pattern N3).

The shape of the penetrating portion 27 is, for example, sheet-like or wire-like. A first end of the penetrating portion 27 is electrically connected to the anode terminal 25 . A second end of the penetrating portion 27 is electrically connected to the anode terminal 26 .

Capacitor 11A further comprises at least one internal ground electrode. The internal ground electrode is arranged inside the housing 24 . The internal ground electrode is electrically connected to at least one cathode terminal 28 . The internal ground electrode faces the penetrating portion 27 with a gap therebetween.

In FIG. 9, a conductor pattern 321 and conductor patterns P2 and P3 are provided as part of the second electric circuit 32 . The conductor pattern 321 is electrically connected to the DC/DC converter 43 (see FIG. 1) and the first end of the inductor 44 . Conductive pattern P2 is electrically connected to the second end of inductor 44 and anode terminal 25 . Conductive pattern P3 is electrically connected to anode terminal 26 and integrated circuit 41 . The integrated circuit 41 is also electrically connected to the ground pattern (conductor pattern N3).

The through portion 27 electrically connects the conductor patterns P2 and P3. In other words, the through portion 27 also serves as part of the electric circuit 30 (second electric circuit 32). The electric circuit with integrated circuit 100A has such a configuration, but the equivalent circuit of the electric circuit with integrated circuit 100A is the same as the electric circuit with integrated circuit 100 of the embodiment (see FIG. 1).

(Modification 2)
Modification 2 of the embodiment will be described below.

In order to achieve a capacitor 11 with predetermined characteristics, capacitor 11 may have at least one of the configurations listed below.

Capacitor 11 may be of LW inversion type structure. The LW inversion type capacitor has a rectangular shape when viewed from the direction facing the mounting surface, and external electrodes (first external electrode 21 and second external electrode 22) are provided on two sides along the longitudinal direction. have a structure.

Also, the capacitor 11 may have an LW inversion type structure and may be an alternately laminated capacitor as in the embodiment.

Also, the capacitor 11 may be a multi-terminal capacitor having three or more external electrodes. Moreover, when connecting a plurality of multi-terminal capacitors in parallel, the polarities of adjacent multi-terminal capacitors may be opposite to each other. In other words, even if the direction of the multi-terminal capacitor when the polarity is in the positive direction is placed alternately with the multi-terminal capacitor facing the positive direction and the multi-terminal capacitor facing the opposite direction to the positive direction. good. This can effectively reduce the magnetic flux generated in the multi-terminal capacitor and effectively reduce the ESL.

In the alternately laminated capacitor of the embodiment, the number of sets of the first capacitor element 10a and the second capacitor element 10b is not limited to two sets, and may be one set or three sets or more. Further, the first capacitor elements 10a and the second capacitor elements 10b are not limited to being alternately stacked, and a first stacked structure including a plurality of first capacitor elements 10a and a plurality of second capacitor elements 10a. The second laminated structure including the capacitor element 10b may be alternately laminated.

(Other modifications of the embodiment)
Other modifications of the embodiment are listed below. The following modified examples may be implemented in combination as appropriate. Moreover, the following modifications may be realized by appropriately combining with the above-described modification 1 or 2.

The capacitor 11 may be electrically connected between the first electrical path 31 and the ground. Also, a parallel circuit of a plurality of capacitors 11 may be electrically connected between the first electric line 31 and the ground. A parallel circuit of a plurality of capacitors 11 may be electrically connected between the second electric line 32 and the ground.

In the embodiment, the capacitor 11 is arranged outside the package containing the integrated circuit 41, but it may be built in the package.

Integrated circuit 41 may be used in a quantum computer.

As the power supply PS1, an AC power supply and an AC/DC converter that converts AC power input from the AC power supply into DC power and outputs the DC power may be used.

(summary)
The following aspects are disclosed from the embodiments and the like described above.

An electric circuit (101, 101A) for power supply of an integrated circuit (41) according to the first aspect comprises an electric circuit (30) and at least one predetermined capacitor (11, 11A). The line (30) supplies DC power from the power supply (PS1) to the integrated circuit (41). A given capacitor (11, 11A) has a given characteristic. Predetermined capacitors (11, 11A) are electrically connected to the electric line (30) and ground. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] or more and 10 [MHz] or less.

According to the above configuration, it is possible to reduce the number of capacitors used in the electric circuit (101, 101A).

In the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the second aspect, in the first aspect, the predetermined characteristic is that the frequency is 100 [kHz] or more and 10 [MHz] or less. , the impedance is 10 [mΩ] or less.

According to the above configuration, it is possible to reduce the number of capacitors used in the electric circuit (101, 101A).

Moreover, the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the third aspect further comprises a DC/DC converter (43) in the first or second aspect. The DC/DC converter (43) is electrically connected between the power supply (PS1) and predetermined capacitors (11, 11A).

According to the above configuration, a desired voltage can be supplied to the integrated circuit (41).

In the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the fourth aspect, in the third aspect, the switching frequency of the DC/DC converter (43) is 200 [kHz] or more. It is 10 [MHz] or less.

According to the above configuration, it is possible to limit the AC component of the input voltage of the integrated circuit (41).

Further, in the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the fifth aspect, in the third or fourth aspect, the predetermined capacitors (11, 11A) and the integrated circuit (41) The wiring impedance between is smaller than the wiring impedance between the DC/DC converter (43) and the integrated circuit (41).

According to the above configuration, the harmonic components of the output voltage of the DC/DC converter (43) can be reduced by the predetermined capacitors (11, 11A).

Further, in the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the sixth aspect, in any one of the first to fifth aspects, the predetermined capacitor (11, 11A) self- The resonance frequency (f0) is 300 [kHz] or more and 10 [GHz] or less.

According to the above configuration, the impedance of the predetermined capacitors (11, 11A) can be suppressed in the frequency band around the self-resonant frequency (f0).

Further, in the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the seventh aspect, in any one of the first to sixth aspects, the predetermined capacitor (11, 11A) is driven The voltage is 3.3 [V] or less.

According to the above configuration, a given capacitor (11, 11A) is suitable for use in an electrical line (30) electrically connected to an integrated circuit (41).

Further, in the electric circuit (101) for power supply of the integrated circuit (41) according to the eighth aspect, in any one of the first to seventh aspects, the predetermined capacitor (11) is an electrolytic capacitor . A predetermined capacitor (11) includes an element laminate in which a plurality of capacitor elements (10) are laminated, an outer package (14) for sealing the element laminate, a first external electrode (21), a second and a third external electrode (23). Each of the plurality of capacitor elements (10) has an anode body (3), a dielectric layer, a cathode portion (6), a first end (1a) and a second end (2a). . The anode body (3) has a porous portion (5) on its surface. A dielectric layer is formed on the surface of at least a portion of the porous portion (5). A cathode portion (6) covers at least part of the dielectric layer. At the first end (1a) the anode body (3) is exposed. At the second end (2a) the anode body (3) is covered with the cathode part (6). At least the end surface of the first end portion (1a) is exposed from the exterior body (14). The plurality of capacitor elements (10) has a first capacitor element (10a) and a second capacitor element (10b). In the first capacitor element (10a), the first end (1a) faces the first surface (14a) of the exterior body (14). In the second capacitor element (10b), the first end (1a) faces a second surface (14b) different from the first surface (14a) of the outer casing (14). In the element stack, the first capacitor elements (10a) and the second capacitor elements (10b) are alternately stacked. A first end (1a) of the first capacitor element (10a) is electrically connected to a first external electrode (21). A first end (1a) of the second capacitor element (10b) is electrically connected to a second external electrode (22). The third external electrode (23) is electrically connected to the cathode (6) of the capacitor element (10).

According to the above configuration, it is possible to provide a predetermined capacitor (11) with low ESL and high capacity.

Further, in the electric circuit (101A) for power supply of the integrated circuit (41) according to the ninth aspect, in any one of the first to seventh aspects, the predetermined capacitor (11A) is a feedthrough capacitor. . A given capacitor (11A) comprises a housing (24), two anode terminals (25, 26), a feedthrough (27) and a cathode terminal (28). The two anode terminals (25, 26) are exposed outside the housing (24). The two anode terminals (25, 26) are electrically connected to the electrical path (30). The through portion (27) is arranged inside the housing (24). A feedthrough (27) electrically connects the two anode terminals (25, 26). The cathode terminal (28) is exposed outside the housing (24). The cathode terminal (28) is electrically connected to ground.

According to the above configuration, it is possible to provide a predetermined capacitor (11A) with low ESL and high capacity.

Further, in the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to the tenth aspect, in any one of the first to ninth aspects, the The number of predetermined capacitors (11, 11A) is one.

According to the above configuration, the number of capacitors (11, 11A) can be reduced.

Configurations other than the first mode are not essential configurations for the electric circuits (101, 101A) for power supply of the integrated circuit (41), and can be omitted as appropriate.

Further, the capacitor (11, 11A) according to the eleventh aspect is provided in the electric circuit (101, 101A) for power supply of the integrated circuit (41) according to any one of the first to tenth aspects. Used as a capacitor (11, 11A).

According to the above configuration, it is possible to reduce the number of capacitors used in the electric circuit (101, 101A).

An electric circuit with an integrated circuit (100, 100A) according to a twelfth aspect is an electric circuit (101, 101A) for supplying power to the integrated circuit (41) according to any one of the first to tenth aspects. and an integrated circuit (41).

According to the above configuration, it is possible to reduce the number of capacitors used in the electric circuit (101, 101A).

1a First end 2a Second end 3 Anode body 5 Porous part 6 Cathode part 10 Capacitor element 10a First capacitor element 10b Second capacitor elements 11, 11A Capacitor 14 Exterior body 14a First surface 14b Second surface 21 first external electrode 22 second external electrode 23 third external electrode 24 housings 25, 26 anode terminal 27 through-hole 28 cathode terminal 30 electric circuit 41 integrated circuit 43 DC/DC converters 100, 100A with integrated circuit Electric circuit 101, 101A Electric circuit f0 Self-resonant frequency PS1 Power supply

Claims (12)

An electrical circuit for powering an integrated circuit, comprising:
an electric line that supplies DC power from a power supply to the integrated circuit;
at least one predetermined capacitor having predetermined characteristics and electrically connected to the electrical path and ground;
The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at least at a frequency of 5 [MHz] to 10 [MHz].
An electrical circuit for powering integrated circuits. The predetermined characteristic is a characteristic that the impedance is 10 [mΩ] or less at a frequency of 100 [kHz] or more and 10 [MHz] or less.
2. An electrical circuit for powering an integrated circuit as claimed in claim 1. further comprising a DC/DC converter electrically connected between the power supply and the predetermined capacitor;
3. An electrical circuit for powering an integrated circuit as claimed in claim 1 or 2. The switching frequency of the DC/DC converter is 200 [kHz] or more and 10 [MHz] or less,
4. An electrical circuit for powering an integrated circuit as claimed in claim 3. wiring impedance between the predetermined capacitor and the integrated circuit is smaller than wiring impedance between the DC/DC converter and the integrated circuit;
5. An electrical circuit for powering an integrated circuit as claimed in claim 3 or 4. The self-resonant frequency of the predetermined capacitor is 300 [kHz] or more and 1 [GHz] or less,
An electrical circuit for powering an integrated circuit as claimed in any one of claims 1 to 5. The driving voltage of the predetermined capacitor is 3.3 [V] or less,
An electrical circuit for powering an integrated circuit as claimed in any one of claims 1 to 6. The predetermined capacitor is an electrolytic capacitor,
The predetermined capacitor is
an element laminate in which a plurality of capacitor elements are laminated;
an exterior body that seals the element laminate;
a first external electrode;
a second external electrode;
a third external electrode;
each of the plurality of capacitor elements,
an anode body having a porous portion on its surface;
a dielectric layer formed on the surface of at least part of the porous portion;
a cathode portion covering at least a portion of the dielectric layer;
a first end where the anode body is exposed;
a second end of the anode body covered by the cathode portion;
At least an end surface of the first end is exposed from the exterior body,
The plurality of capacitor elements includes: a first capacitor element having the first end facing the first surface of the exterior body; and a second capacitor element having the first end different from the first surface of the exterior body. a second capacitor element facing the face of
In the element laminate, the first capacitor element and the second capacitor element are alternately stacked,
the first end of the first capacitor element is electrically connected to the first external electrode;
the first end of the second capacitor element is electrically connected to the second external electrode;
the third external electrode is electrically connected to the cathode portion of the capacitor element;
An electrical circuit for powering an integrated circuit as claimed in any one of claims 1 to 7. The predetermined capacitor is a feedthrough capacitor,
The predetermined capacitor is
a housing;
two anode terminals exposed to the outside of the housing and electrically connected to the electric circuit;
a penetrating portion disposed inside the housing and electrically connecting the two anode terminals;
a cathode terminal exposed to the outside of the housing and electrically connected to the ground;
An electrical circuit for powering an integrated circuit as claimed in any one of claims 1 to 7. The number of the predetermined capacitors electrically connected to the electric circuit is one,
An electrical circuit for powering an integrated circuit as claimed in any one of claims 1 to 9. Used as the predetermined capacitor in the electric circuit for power supply of the integrated circuit according to any one of claims 1 to 10,
capacitor. An electric circuit for power supply of the integrated circuit according to any one of claims 1 to 10, and the integrated circuit,
An electric circuit with an integrated circuit.

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