JP2023085572A - Touch panel and electric conductive film - Google Patents

Abstract

To provide a touch panel and an electric conductive film which maintain operation stability of a touch sensor and have a narrow trim.SOLUTION: The present invention is directed to a touch panel having an electric conductive film disposed on a display surface side of an image display part. The electric conductive film has a detection part extended in one direction on a transparent, flexible member, and a lead-out wiring part having a lead-out wire electrically connected to each of ends of the detection part. The lead-out wire is electrically connected to an end of the detection part and an external connection terminal. Three bending regions surrounding sides of the image display part, formed by bending the flexible member toward the rear surface side of the image display part at two bending lines provided along peripheries of the detection part and facing each other with the detection part therebetween and a bending line crossing the two bending lines forms, together with the rear side, overlapped regions where the same surfaces of the electric conductive film are overlapped with one another. The external connection terminal is disposed on a rear surface side, and the lead-out wire is provided at an opposing bending region so as to be prevented from being overlapped with the overlapped region or to be provided at one side of the two surfaces of the electric conduct film on the overlapped region.SELECTED DRAWING: Figure 1

Description

TECHNICAL FIELD The present invention relates to a touch panel that functions as a touch sensor and includes a folded conductive film and a conductive film disposed on an image display section, and in particular, maintains the operational stability of the touch sensor and has a narrow frame. The present invention relates to a touch panel and a conductive film used for the touch panel.

Currently, touch panels are used in combination with display devices such as liquid crystal display devices in various electronic devices, including mobile information devices such as tablet computers and smartphones, and perform input operations to electronic devices by touching the screen. There is A touch panel has a touch sensor that includes detection electrodes that detect a touch and lead lines that are electrically connected to the detection electrodes.
The take-out line takes out an electric signal from the detection electrode, runs around the detection electrode, and is arranged up to a position where it is connected to an FPC (flexible printed circuit board). The FPC and the extraction line are electrically connected at the connecting portion with the FPC, and connected to an IC (integrated circuit) that controls the touch sensor through the FPC. This enables the touch sensor to be driven.

Further, in recent years, the frame of the touch panel is becoming narrower. By narrowing the frame of the touch panel, the area occupied by the screen display of the touch panel is increased, the practical screen size is increased, and the design is highly aesthetic. For this reason, there is currently an increasing demand for a narrower frame of the display device, and various ideas have been made for routing wiring around the periphery of the screen, arranging flexible printed wiring boards, and the like.

For example, Patent Document 1 discloses a transparent and flexible substrate, a plurality of transparent first electrode units arranged in a first direction in a detection region on the substrate, and a transparent electrode unit. a plurality of second electrode portions having light properties and arranged in a second direction intersecting the first direction in a detection region on the substrate; and conducting with each of the plurality of first electrode portions and the plurality of second electrode portions and a plurality of lead wires extending from the detection area on the base material to a peripheral area outside the detection area, the peripheral area of the base material is provided with a bent portion, and the lead wire extends above the bent portion. An input device is described that has a flexible laminate provided on a flexure and a covering provided to cover at least a portion of the flexible laminate provided over a bend. In Patent Literature 1, it is possible to bend the base material by providing a bent portion.

In Patent Document 2, one substrate having a plurality of regions and including at least a plane region and a side region continuous with the plane region and bent with respect to the plane region; A touch sensor is described that has a touch sensor portion provided and an antenna provided in another area different from the planar area of the substrate. The substrate is composed of a flexible transparent substrate, the touch sensor section includes a detection section and a peripheral wiring section, and at least the detection section is composed of fine metal wires. In Patent Document 2, a flexible substrate is used to bend sensing electrodes or wiring portions.

WO2017/195451 WO2016/158085

As described above, in Patent Literature 1, for example, a bent portion is provided on one side of the base material and bent to narrow the frame.
In addition, in the touch sensor of Patent Document 2, side areas are provided on four sides of a flexible rectangular substrate, and the side areas are bent to narrow the frame. In Patent Document 2, the side areas of the four sides are separated from each other, and the side areas are bent. The side regions are configured so as not to overlap each other.

Here, assuming that one substrate that is not separated from each other is folded over three or more sides, there is an area where the folded substrates overlap each other, that is, an area where the wiring overlaps. A capacitor is formed in the area where the wiring overlaps. Since the touch sensor operates by detecting the capacitance, normal operation is difficult because the capacitance changes when there is an area where the wiring overlaps.
For this reason, at present, when narrowing the frame, it is often the case that the opposite sides of the rectangular substrate are bent in the same direction and the two opposite sides are bent.
In addition, in the configuration of Patent Document 2 in which four side areas are provided and bent to narrow the frame, it is necessary to form bonding pads on each of the four side areas and attach a flexible printed circuit board (FPC). In this case, the configuration in which four-side FPCs are attached increases the occupied area and leads to a large increase in cost, so it is not practically implemented.

SUMMARY OF THE INVENTION An object of the present invention is to provide a touch panel and a conductive film having a narrow frame while solving the above-mentioned problems based on the prior art, maintaining the operational stability of the touch sensor.

A first aspect of the present invention is a touch panel having an image display portion and a conductive film, wherein the conductive film is disposed on the display surface side of the image display portion, wherein the conductive film is transparent and flexible. a detection part extending in one direction and formed of a conductive layer on at least one surface of the flexible base material; One end of the extraction line of the extraction wiring part is electrically connected to the end of the detection part, and the other end is electrically connected to an external connection terminal. The display of the image display unit is made up of two bending lines provided on the surface along the periphery of the detecting unit and facing each other across the detecting unit in one direction, and a bending line intersecting the two bending lines. On the back side of the image display section opposite to the surface side, there are three folding regions formed by folding a flexible base material, surrounding the side surfaces of the image display section, and a conductive film on the back side of the image display section. The same surface of the peripheral edge of the image display unit has a superimposed area, the external connection terminal is arranged on the back side of the image display part, the lead-out line is provided at least in the opposite folded area, and avoids the overlapping area The present invention provides a touch panel that is arranged on either one of the two surfaces of the conductive film that is folded over in the overlap region.

A second aspect of the present invention is a touch panel having an image display portion and a conductive film, wherein the conductive film is disposed on the display surface side of the image display portion, wherein the conductive film is transparent and flexible. a detection part formed of a conductive layer on at least one surface of the base material; The wire has one end electrically connected to the end of the detection section and the other end electrically connected to an external connection terminal. is provided along the edge of the detection part and is formed by folding the flexible base material on the back side of the image display part opposite to the display surface side of the image display part at two intersecting folding lines. and an overlap region in which the same surface of the peripheral portion of the conductive film is folded on the back surface of the image display portion, and the external connection terminals are on the back surface of the image display portion. The lead-out line is provided at least in the folding area and is arranged to avoid the overlapping area, or in the overlapping area, either one of the two surfaces of the conductive film that overlaps. A touch panel is provided on the surface.

It is preferable that the extraction wiring extending along the bending line and extending in the length direction of the bending area provided in the bending area is provided in a region separated from the bending line by a distance of 10 μm or more.
It is preferable that the extraction wiring extending along the bending line and extending in the length direction of the bending area provided in the bending area is provided in an area separated from the bending line by a distance of 100 μm or more.
The bending area is composed of a curved surface, and the ratio of the length along the bending of the curved surface of the bending area to the thickness of the image display portion is preferably 2.0 or less.
The bending area is composed of a curved surface, and the ratio of the length along the bending of the curved surface of the bending area to the thickness of the image display portion is preferably 1.2 or less.

The flexible base material has a rectangular shape, the detection section is arranged in a rectangular shape and is aligned with the sides of the flexible base material, and the extraction wiring section is provided along the periphery of the side of the flexible base material. A bending line is provided in parallel to a total of three sides including two sides facing each other across the detection part of the detection part in one direction, and the flexible base material has four sides: It is preferable that the three sides provided with the folding lines are folded so as to be arranged on the back side of the image display section.
The flexible base material has a rectangular shape, the detection section is arranged in a rectangular shape and is aligned with the sides of the flexible base material, and the extraction wiring section is provided along the periphery of the side of the flexible base material. A first side along one end of the detection part and a second side orthogonal to the first side are provided with bending lines parallel to each other, and the flexible base material is: Of the four sides, it is preferable that the two sides provided with the folding lines are bent so as to be arranged on the back side of the image display section.
It is preferable that the take-out line is composed of a fine metal wire.
It is preferable that the lead-out line of the lead-out wiring portion has at least one portion bent at an angle larger than 90° on the surface of the flexible base material.

According to a third aspect of the present invention, a detection section formed of a conductive layer extending in one direction and each end of the detection section are electrically connected to at least one surface of a transparent flexible base material. The extraction wiring part is provided in a peripheral edge part surrounding the circumference of the detection part in a continuous strip shape, and one end of the extraction line of the extraction wiring part is electrically connected to the end of the detection part. the other end of which is electrically connected to an external connection terminal; and the surface of the flexible base material on which the detection section is provided is provided along the periphery of the detection section. External connection is provided on the back side of the image display section opposite to the display surface side of the image display section by two bending lines facing each other across the two in one direction and a bending line intersecting the two bending lines. When the flexible base material is folded so as to arrange the terminals, three folded areas surrounding the side surfaces of the image display section and an overlapping area where the same surface of the peripheral portion is folded on the back surface of the image display section are formed. and the lead-out lines are provided at least in the facing bending regions and are arranged so as to avoid the overlapping region, or are arranged on either one of the two surfaces of the conductive film that is folded in the overlapping region. It is intended to provide a conductive film.

A fourth aspect of the present invention comprises a detection section made of a conductive layer on at least one surface of a transparent flexible base material, and lead-out lines electrically connected to ends of the detection section. a lead-out wiring part, the lead-out wiring part is provided in a peripheral edge part surrounding the periphery of the detection part in a continuous strip shape, one end of the lead-out line of the lead-out wiring part is electrically connected to an end of the detection part, The other end is electrically connected to an external connection terminal, and on the surface of the flexible base material provided with the detection section, at least one is provided along the edge of the detection section. When the flexible base material is bent along the bending lines so that the external connection terminals are arranged on the back side of the image display section opposite to the display surface side of the image display section, the side surface of the image display section is bent. Two surrounding folding areas and an overlapping area in which the same surface of the peripheral part is folded on the back surface of the image display part are formed, and the lead-out line is provided at least in the folding area and is arranged avoiding the overlapping area. Alternatively, in the overlap region, the conductive film is arranged on either one of the two sides of the conductive film that is folded over.

It is preferable that the extraction wiring extending along the bending line and extending in the length direction of the bending area provided in the bending area is provided in a region separated from the bending line by 10 μm or more.
It is preferable that the extraction wiring extending in the length direction of the intended bending area provided in the intended bending area along the bending line is provided in an area separated from the bending line by 100 μm or more.
It is preferable that the ratio of the length of the region to be folded provided along the folding line in the width direction perpendicular to the folding line to the thickness of the image display section is 2.0 or less.
It is preferable that the ratio of the length of the region to be folded provided along the folding line in the width direction perpendicular to the folding line to the thickness of the image display section is 1.2 or less.

The flexible base material has a rectangular shape, the detection section is arranged in a rectangular shape and aligned with the sides of the flexible base material, and the extraction wiring section is provided along the periphery of the side of the flexible base material. A bending line is provided in parallel to a total of three sides including two sides facing each other across the detection part of the detection part in one direction, and the flexible base material has four sides: It is preferable that the three sides provided with the folding lines have areas to be folded in the same direction.
The flexible base material has a rectangular shape, the detection section is arranged in a rectangular shape and aligned with the sides of the flexible base material, and the extraction wiring section is provided along the periphery of the side of the flexible base material. A first side along one end of the detection part and a second side perpendicular to the first side are provided with bending lines parallel to each other, and the flexible base material is: Of the four sides, it is preferable that the two sides provided with the folding lines have regions to be folded in the same direction.
It is preferable that the take-out line is composed of a fine metal wire.
It is preferable that the lead-out line of the lead-out wiring portion has at least one portion bent at an angle larger than 90° on the surface of the flexible base material.

ADVANTAGE OF THE INVENTION According to this invention, the operation stability of a touch sensor is maintained, and the touchscreen and conductive film with a narrow frame can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is typical sectional drawing which shows an example of the touch panel of embodiment of this invention. It is a schematic diagram showing the first example of the conductive film of the touch panel of the embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing a first example of the configuration of a detection portion of a conductive film of the touch panel according to the embodiment of the present invention; FIG. 4 is a schematic cross-sectional view showing an example of a conductive film overlapping region of the touch panel according to the embodiment of the present invention. FIG. 4 is a schematic diagram for explaining the relationship between the length along the bending of the curved surface of the bending region of the conductive film of the touch panel of the embodiment of the present invention and the thickness of the image display portion. FIG. 4 is a schematic diagram showing a modification of the first example of the configuration of the detection section of the conductive film of the touch panel of the embodiment of the present invention. FIG. 4 is a schematic diagram showing a second example of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 4 is a schematic diagram showing a third example of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 5 is a schematic diagram showing a fourth example of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 5 is a schematic diagram showing a fifth example of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 10 is a schematic diagram showing a sixth example of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 3 is a schematic diagram showing the electrode configuration of the detection section of the conductive film of the touch panel according to the embodiment of the present invention; FIG. 4 is a schematic diagram showing an example of the shape of the mesh pattern of the detection portion of the conductive film of the touch panel according to the embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing an example of the configuration of a detection portion of a conductive film of the touch panel according to the embodiment of the present invention; It is a schematic diagram which expands and shows an example of the electrically conductive wire of the detection part of embodiment of this invention. 4 is a schematic diagram showing the pattern of the conductive film of the touch panel of Comparative Example 1. FIG.

BEST MODE FOR CARRYING OUT THE INVENTION The touch panel and conductive film of the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings.
It should be noted that the drawings described below are examples for explaining the present invention, and the present invention is not limited to the drawings shown below.
In the following, "~" indicating a numerical range includes the numerical values described on both sides. _For example, when ε _a is numerical value β ₁ to numerical value β ₂ , the range of ε _a is the range including the numerical value _{β 1} and the numerical value _{β 2} .
Angles such as "parallel" and "perpendicular" include error ranges generally accepted in the relevant technical field unless otherwise specified. In addition, "identical" includes the margin of error that is generally allowed in the relevant technical field.

Also, light means actinic rays or radiation. Unless otherwise specified, "exposure" in the present specification means not only exposure by far ultraviolet rays represented by mercury lamps and excimer lasers, X-rays, EUV light, etc., but also drawing by particle beams such as electron beams and ion beams. is also included in the exposure.
Moreover, "(meth)acrylate" represents both or either of acrylate and methacrylate, and "(meth)acryl" represents both or either of acrylic and methacrylic. Moreover, "(meth)acryloyl" represents both or either of acryloyl and methacryloyl.
Unless otherwise specified, the term "transparent" means that the light transmittance is 40% or more, preferably 80% or more, and more preferably 90% or more in the visible light wavelength range of 380 to 780 nm. is.
The light transmittance is measured using “Plastics—Determination of Total Light Transmittance and Total Light Reflectance” defined in JIS (Japanese Industrial Standards) K 7375:2008.

(touch panel)
FIG. 1 is a schematic cross-sectional view showing one example of a touch panel according to an embodiment of the invention, and FIG. 2 is a schematic view showing a first example of a conductive film of the touch panel according to an embodiment of the invention. FIG. 3 is a schematic cross-sectional view showing a first example of a configuration of a detection portion of a conductive film of a touch panel according to an embodiment of the present invention.
A touch panel 10 of the first example shown in FIG. The touch panel 10 includes an image display portion 14, a first transparent insulating layer 15, a conductive film 12, a second transparent insulating layer 17, and a cover portion 16, which are laminated in this order in the lamination direction Dt. A conductive film 12 is arranged on the display surface 14 a side of the image display section 14 .

In the touch panel 10 , the conductive film 12 and the image display section 14 are laminated with the first transparent insulating layer 15 interposed therebetween. The conductive film 12 and the cover portion 16 are laminated with a second transparent insulating layer 17 interposed therebetween.
The first transparent insulating layer 15 is provided over the entire display surface 14 a of the image display section 14 . For example, the first transparent insulating layer 15 and the second transparent insulating layer 17 have the same region. Therefore, when viewed from the surface 16a side of the cover portion 16, the first transparent insulating layer 15 and the second transparent insulating layer 17 have the same size.
In the touch panel 10, the first transparent insulating layer 15, the conductive The protective film 12, the second transparent insulating layer 17 and the cover portion 16 are all preferably transparent.

The touch panel 10 has a housing 40 surrounding the image display section 14 and the conductive film 12 . The image display unit 14 and the conductive film 12 are accommodated in the interior 40 a of the housing 40 . The housing 40 has a bottom plate 41 similar in shape to the cover portion 16 and side plates 42 surrounding the outer edge of the bottom plate 41 . In the interior 40 a of the housing 40 , for example, cushioning materials 44 are provided at corners between the bottom plate 41 and the side plate 42 and corners between the side plate 42 and the cover portion 16 . A side plate 42 of the housing 40 is attached to the rear surface 16 b of the cover portion 16 .
The cushioning material 44 protects the image display section 14 and the conductive film 12 from external shocks and the like. The cushioning material 44 can be constructed using ethylene-propylene sponge, chloroprene sponge, styrene-butadiene sponge, nitrile rubber sponge, or the like.

In the touch panel 10, the surface 16a of the cover portion 16 is the touch surface of the touch panel 10 and serves as an operation surface. Input operation is performed on the touch panel 10 using the surface 16a of the cover portion 16 as an operation surface. Note that the touch surface is a surface that detects contact with a finger, a stylus pen, or the like. A surface 16 a of the cover portion 16 serves as a viewing surface of a display object (not shown) displayed on the display surface 14 a of the image display portion 14 .
A controller 13 is provided on the rear surface 14 b of the image display section 14 . The conductive film 12 is folded so as to surround the side surface 14c of the image display section 14, and the external connection terminals 26 are arranged on the back surface 14b side of the image display section 14. As shown in FIG. The external connection terminals 26 of the conductive film 12 and the controller 13 are electrically connected by a flexible wiring member such as a flexible circuit board 19, for example.

A decorative layer 18 having a light shielding function is provided on the rear surface 16b of the cover portion 16. As shown in FIG. The decorative layer 18 is provided, for example, along the outer edge of the cover portion 16 when viewed from the surface 16a side of the cover portion 16 . The region where the decorative layer 18 is provided is the frame portion Df. The decorative layer 18 of the frame portion Df prevents the underlying components from being visually recognized. A narrow frame means that the width of the frame portion Df is narrow. Narrowing the width of the frame portion Df is referred to as frame narrowing.

As will be described in detail later, the conductive film 12 protrudes from the first transparent insulating layer 15 and the second transparent insulating layer 17, has a bent portion 27 that is bent, and is arranged in a direction Dw perpendicular to the stacking direction Dt. A side surface 17 c of the second transparent insulating layer 17 and the bent portion 27 of the conductive film 12 are covered with a protective film 36 . The protective film 36 may reach the surface of the decorative layer 18 of the cover portion 16 at the end portion 36a.
Moreover, it is preferable that the end 36c of the protective film 36 is in contact with the surface of the cover portion 16 and the image display portion 14 opposite to the display surface 14a, that is, in contact with the rear surface 14b. Thereby, sulfuration of the conductive layer by the protective film 36 can be further suppressed. Here, as shown in FIG. 2, the flexible circuit board 19 is narrower than the flexible base material 25 . The protective film 36 covers the flexible circuit board 19 and is provided in contact with the rear surface 14 b of the image display section 14 .

The controller 13 is composed of a known one used for touch sensor detection. When the touch panel 10 is of the capacitance type, the controller 13 detects the position where the capacitance changes due to the touch of the finger or the like on the surface 16a of the cover portion 16, which is the touch surface. The capacitive touch panel includes a mutual capacitive touch panel and a self-capacitance touch panel, but is not particularly limited.

The cover part 16 protects the conductive film 12 . The configuration of the cover portion 16 is not particularly limited. The cover portion 16 is preferably transparent so that a display (not shown) displayed on the display surface 14a of the image display portion 14 can be visually recognized. For example, a plastic film, a plastic plate, a glass plate, or the like is used for the cover portion 16 . It is preferable to appropriately select the thickness of the cover portion 16 according to each application.
Examples of raw materials for the above-mentioned plastic films and plastic plates include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyethylene (PE), polypropylene (PP), polystyrene, EVA (vinyl acetate copolymer polyethylene ) and other polyolefins; vinyl resin; other polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC), cycloolefin resin (COP), polyvinylidene fluoride (PVDF), polyarylate (PAR ), polyether sulfone (PES), polymer acrylic resin, fluorene derivatives, crystalline COP, and the like can be used.
A polarizing plate, a circularly polarizing plate, or the like may be used as the cover portion 16 .
Since the surface 16a of the cover portion 16 serves as the touch surface as described above, a hard coat layer may be provided on the surface 16a as necessary. The thickness of the cover portion 16 is, for example, 0.1 to 1.3 mm, preferably 0.1 to 0.7 mm.

If the first transparent insulating layer 15 is transparent and has electrical insulation and can stably fix the conductive film 12 and the image display section 14, the configuration thereof is particularly limited. not to be As the first transparent insulating layer 15, for example, an optically transparent adhesive (OCA, Optical Clear Adhesive) and an optically transparent resin (OCR, Optical Clear Resin) such as a UV (Ultra Violet) curable resin are used. can be used. Also, the first transparent insulating layer 15 may be partially hollow.
In addition, if the second transparent insulating layer 17 is transparent and has electrical insulating properties and can stably fix the conductive film 12 and the cover portion 16, its configuration is particularly It is not limited. The same material as the first transparent insulating layer 15 can be used for the second transparent insulating layer 17 .

The image display unit 14 has a display surface 14a for displaying a display object such as an image, and is, for example, a liquid crystal display device. The image display unit 14 is not limited to a liquid crystal display device, and may be an organic EL (organic electro luminescence) display device. The image display unit 14 can be a cathode ray tube (CRT) display, a vacuum fluorescent display (VFD), a plasma display panel (PDP), a surface field display (SED), a field emission display (FED), and an electronic Paper or the like can be used.
The image display unit 14 is appropriately used depending on its application, but is preferably in the form of a panel such as a liquid crystal display panel or an organic EL panel in order to reduce the thickness of the touch panel 10 .

The decorative layer 18 has a light shielding function as described above. Components such as 20 and the extraction wiring portion 22 are made invisible.
The decoration layer 18 is not particularly limited in its configuration as long as it can make the components such as the detection section 20 and the extraction wiring section 22 invisible, and a known decoration layer can be used. Various printing methods such as screen printing, gravure printing and offset printing, transfer methods, and vapor deposition methods can be used to form the decorative layer. The decorative layer 18 is formed on the rear surface 16b of the cover portion 16, but is not limited to this, and may be formed directly on the components such as the detection portion 20 and the extraction wiring portion 22. FIG.
Note that the term "invisible" means that the component under the decorative layer 18 cannot be visually recognized.

(First example of conductive film)
A first example of the conductive film 12 will be described.
The conductive film 12 shown in FIG. 2 functions as a touch sensor in the touch panel 10. As shown in FIG. The configuration of the conductive film 12 is not particularly limited as long as it functions as a touch sensor.
For example, the conductive film 12 is electrically connected to at least one surface of a transparent flexible base material 25, a detection unit 20 extending in one direction and formed of a conductive layer, and each end of the detection unit 20. and an extraction wiring portion 22 having an extraction line 23 connected thereto. The detecting section 20 is provided with extraction wiring sections 22 at both ends and is extracted from two directions. The flexible substrate 25 has a rectangular shape when viewed from the surface 25a.
The extraction wiring portion 22 is provided in a peripheral edge portion 21 that surrounds the periphery of the detection portion 20 in a continuous strip shape. That is, the extraction wiring part 22 is provided in a continuous region around the detection part 20 of the flexible base material 25. There is a region where the folding occurs.
In the conductive film 12, the detection section 20 and the extraction wiring section 22 are provided on the front surface 25a and the back surface 25b of the flexible base material 25, respectively.

The conductive film 12 having the flexible substrate 25 is flexible and can be folded. When the conductive film 12 has a rectangular shape, at least three sides of the four sides of the conductive film 12 that share the corners are the set folding lines, which are opposite to the display surface 14 a side of the image display section 14 . It is folded toward the rear surface 14b of the image display section 14, and has an overlap region Dε (see FIG. 4) in which the same surface of the peripheral portion 21 of the conductive film 12 is folded.
When the conductive film 12 is bent on three sides, two overlapping regions Dε are formed, and when the conductive film 12 is bent on four sides, four overlapping regions Dε are formed.
In the touch panel 10, it is most preferable that the lead-out lines 23 are not provided in each overlapping region Dε so as not to increase the parasitic capacitance. In this case, the lead-out lines 23 are arranged to avoid the overlapping region Dε. However, in the overlapping region Dε, the lead-out line 23 is provided on either one of the two surfaces of the conductive film 12 that is folded, that is, on one of the peripheral edge portions 21 that are folded and overlapped. there is As will be described later, when the lead-out line 23 is provided in the superimposed region Dε, any one of them can suppress an increase in parasitic capacitance.

The detection unit 20 is an input area _E1 in which a user can perform an input operation. The detection unit 20 has, for example, a rectangular shape when viewed from the surface 25a of the flexible base material 25, and is arranged in alignment with the sides of the flexible base material 25. As shown in FIG. The extraction wiring portion ₂₂ is arranged in the outer region E2 located outside the input region _E1 . The input area _E1 of the detector 20 is called an active area.

In the touch panel 10, the conductive film 12 is bent at a bending position determined by the design specifications or the like, and the external connection terminals 26 of the extraction wiring portion 22 are arranged on the back surface 14b side of the image display portion 14 as described above. be. A bending position is a position where a bending line is provided. Bending positions and bending lines will be described later.
A flexible wiring member such as the flexible circuit board 19 is electrically connected to the external connection terminal 26, for example.

In the case of the conductive film 12 alone, that is, in the state before the conductive film 12 is incorporated into the touch panel 10, the above-described bending position of the conductive film 12 is bent at the flexible base material 25. This is the position where the line is provided. The flexible substrate 25 is folded along the folding lines. The bending position of the conductive film 12 described above and the bending position of the flexible base material 25 described above depend on whether the conductive film 12 is incorporated in the touch panel 10 or the conductive film 12 is a single unit. The difference is the same position.

The conductive film 12 has a flexible substrate 25 with, for example, a first bending position Bf ₁ , a second bending position Bf ₂ and a third bending position Bf ₃ as shown in FIG. is provided. The conductive film 12 is configured to be folded on three sides. The first bending position _Bf1 is the position where the first bending line _L1 is provided, and the second bending position _Bf2 is the position where the second bending line _L2 is provided. The third bending position _Bf3 is the position where the third bending line _L3 is provided.
The first bending position Bf ₁ , the second bending position Bf ₂ , and the third bending position Bf ₃ are not particularly limited. 20 , and a first folding line L ₁ , a second folding line L ₂ , and a third folding line L ₃ are provided along the edge of the detection section 20 . Also, the first folding line L ₁ , the second folding line L ₂ , and the third folding line L ₃ are provided parallel to the three sides of the flexible base material 25. .
For example, the first bending position _Bf1 is set at one end of the second detection electrode 32 in the X direction, and the second bending position _Bf2 is set at the other end of the second detection electrode 32 in the X direction. set at the end. The third bending position _Bf3 is set at one end of the first detection electrode 30 in the Y direction.
That is, the first bending line _L1 and the second bending line _L2 are bending lines that are provided along the periphery of the detection unit 20 and face each other with the detection unit 20 sandwiched in one direction. . The third fold line _L3 is the fold line that intersects two fold lines, namely the first fold line _L1 and the second fold line _L2 . The flexible substrate 25 is folded along a first folding line _L1 , a second folding line _L2 , and a third folding line _L3 .
The first bending line L ₁ , the second bending line L ₂ , and the third bending line L ₃ all extend in the Y direction of the first detection electrodes 30 of the detection unit 20 from the viewpoint of narrowing the frame. and the other end of the second detection electrode 32 in the X direction.

A region having a predetermined width provided along the first bending line _L1 of the flexible base material 25 is a first intended bending region _BE1 . The flexible base material 25 is folded along the first folding line _L1 to form a first folding region (not shown) surrounding the side surface 14c of the image display section 14. As shown in FIG.
A region having a predetermined width provided along the second bending line _L2 of the flexible base material 25 is the second intended bending region _BE2 . The flexible base material 25 is folded along the second folding line _L2 to form a second folding region (not shown) surrounding the side surface 14c of the image display section 14. As shown in FIG.
A region having a predetermined width provided along the third bending line _L3 of the flexible base material 25 is the third intended bending region _BE3 . The flexible base material 25 is folded along the third folding line _L3 to form a third folding region (not shown) surrounding the side surface 14c of the image display section 14. As shown in FIG. All of the above-described first folding area, second folding area, and third folding area are arranged on the side surface 14c of the image display section 14 as described above.

The first intended bending area BE ₁ (see FIG. 2), the second intended bending area BE ₂ (see FIG. 2), and the third intended bending area BE ₃ (see FIG. 2) are all oriented in the same direction. , forming three folding regions surrounding each side surface 14c of a total of three sides of the image display unit 14. As shown in FIG.
The first intended bending area BE ₁ (see FIG. 2), the second intended bending area BE ₂ (see FIG. 2), and the third intended bending area BE ₃ (see FIG. 2) are oriented in the same direction. For example, when the flexible base material 25 is bent so that the external connection terminals 26 are arranged on the back surface 14b side of the image display section 14, the bent regions are each bent like a bent portion 27 (see FIG. 1). has a curved surface. In this way, the flexible base material 25 is folded so that three of the four sides provided with the folding lines are arranged on the back surface 14b side of the image display section 14 to form a folding area. Three are formed.
The width of the first intended bending area BE ₁ (see FIG. 2), the width of the second intended bending area BE ₂ (see FIG. 2), and the width of the third intended bending area BE ₃ (see FIG. 2) Both widths are determined by the thickness of the image display section 14 . If the thickness of the image display section 14 is reduced, the width of the first intended bending area BE ₁ (see FIG. 2), the width of the second intended bending area BE _{2 (see FIG. 2), and the width of the third folding area BE 2} (see FIG. 2) The width of the intended bending area BE ₃ (see FIG. 2) is narrowed. As the thickness of the image display section 14 increases, the width of the first intended bending area BE ₁ (see FIG. 2), the width of the second intended bending area BE ₂ (see FIG. 2), and the width of the third folding area BE 2 (see FIG. 2) The width of the intended bending area BE ₃ (see FIG. 2) is widened.

In addition, the conductive film 12 shown in FIG. 2 may further have a fourth bending position (not shown). Four fold lines are provided. A predetermined width area provided along the fourth folding line is the fourth intended folding area. The flexible substrate 25 is folded at the fourth folding position to form a fourth folding region. The conductive film 12 shown in FIG. 2 can be configured to be folded at maximum four sides. Also in this case, all the sides are bent in the same direction, for example, toward the back surface 14b of the image display unit 14 . Bending in the same direction means that the bending directions such as the back surface 14b side of the image display section 14 are the same as described above.

The detection unit 20 has, for example, a plurality of first detection electrodes 30 and a plurality of second detection electrodes 32, as shown in FIG. The plurality of first detection electrodes 30 are strip-shaped electrodes extending parallel to each other in the Y direction, and can be electrically insulated from each other in the X direction at intervals 31 in the X direction perpendicular to the Y direction. It is provided on the surface 25a (see FIG. 3) of the flexible base material 25. As shown in FIG. The plurality of second detection electrodes 32 are strip-shaped electrodes extending parallel to each other in the X direction, are spaced apart from each other by an interval 31 in the Y direction, and are electrically insulated from each other in the Y direction. is provided on the rear surface 25b (see FIG. 2) of the . The plurality of first detection electrodes 30 and the plurality of second detection electrodes 32 are provided orthogonally, but are electrically insulated from each other by the flexible base material 25 .
A space 31 between the first detection electrode 30 and the second detection electrode 32 is a region separated from the first detection electrode 30 or the second detection electrode 32 and not electrically connected. Therefore, as described above, the plurality of first detection electrodes 30 are electrically insulated from each other in the X direction, and the plurality of second detection electrodes 32 are electrically insulated from each other in the Y direction. be.

As shown in FIG. 2, the detection unit 20 is provided with nine first detection electrodes 30 and six second detection electrodes 32, but the number is not particularly limited, and a plurality of electrodes may be provided.
The first detection electrode 30 and the second detection electrode 32 are composed of, for example, thin metal wires 33 (see FIG. 3). As shown in FIG. 3, the thin metal wires 33 of the first detection electrodes 30 are covered with the second transparent insulating layer 17, and the thin metal wires 33 of the second detection electrodes 32 are covered with the first transparent insulating layer 15. ing.
The fine metal wires 33 are arranged, for example, in a mesh pattern. The pattern of the fine metal wires 33 will be described later in detail. Both the first detection electrode 30 and the second detection electrode 32 correspond to conductive layers.

The extraction wiring part 22 is a member that plays a role of applying voltage to the first detection electrode 30 and the second detection electrode 32 . One end of the extraction wiring portion 22 is electrically connected to the end of the first detection electrode 30 or the second detection electrode 32 . An external connection terminal 26 is provided at the terminal portion 22b, which is the other end. Note that the extraction wiring portion 22 may be configured by a conductive layer.
The extraction wiring portion 22 is composed of a plurality of extraction lines 23 . One end of each lead-out line 23 is electrically connected to the end of the first detection electrode 30 or the end of the second detection electrode 32 described above. The other ends of the plurality of lead-out lines 23 are collectively electrically connected to one external connection terminal 26 . The other end of the plurality of lead wires 23 is the termination portion 22 b of the lead wire portion 22 . In addition, each lead-out line 23 is wired from the end of the detection unit 20 to the external connection terminal 26 with a plurality of bends depending on the area in which it is arranged. The angle is 90°.
The number of extraction lines 23 of the extraction wiring portion 22 is the same as the number of electrically connected detection electrodes.

Here, the conductive film 12, that is, the flexible base material 25 is divided into the above-mentioned first bending area _BE1 , second bending area _BE2 , and third bending area BE. ₃ , the corner 25e of the flexible base material 25 and the region 25f sandwiching the third bending region _BE3 with respect to the corner 25e, or the first bending with respect to the corner 25e. There is a possibility that the regions 25g sandwiching the intended bending region _BE1 will face each other. Therefore, the corner portion 25e of the conductive film 12 and the region 25f or the region 25g form an overlapping region Dε. Therefore, in the conductive film 12, the corner portion 25e and the region 25f or the region 25g are the planned overlapping regions.

Regarding the lead-out wiring portion 22, the lead-out lines 23 connected to the first detection electrodes 30 are not all arranged in the bending area, but are located in the outer edge 25c, the first bending area _BE1 , and the second bending area. Lead-out lines 23 are arranged in a range surrounded by the intended bending area _BE2 and the third intended bending area _BE3 .
The lead-out lines 23 connected to the second detection electrodes 32 are all arranged within the bent region and extend in the length direction of the bent region. The extraction line 23 passes through the region 25g on the way to the external connection terminal 26. As shown in FIG.
In the conductive film 12 shown in FIG. 2, the lead-out line 23 does not exist in the corner 25e and the region 25f, but the lead-out line 23 exists in the region 25g.

In the first detection electrode 30, the lead-out wiring portion 22 is provided at one end in the Y direction on the surface 25a of the flexible base material 25, and lead out from one direction by the lead-out line 23 of the lead-out wiring portion 22. is
In the second detection electrode 32, the extraction wiring portions 22 are provided on the back surface 25b of the flexible base material 25 at both ends in the X direction, respectively, and are extracted from two directions by the extraction lines 23 of the extraction wiring portions 22. are electrically connected together to one external connection terminal 26 . Therefore, the extraction wiring portions 22 extracted from two directions are not arranged independently of each other. In addition, by combining them into one external connection terminal 26, only one flexible circuit board 19 can be connected, thereby reducing costs and space.

The extraction line 23 is bent from the second detection electrode 32 to the external connection terminal 26. For example, it is bent at a right angle, such as at 90°. That is, the lead-out line 23 of the lead-out wiring portion 22 is bent at 90° on the rear surface 25b of the flexible base material 25 and wired.
In addition, none of the extraction lines 23 electrically connected to the ends of the first detection electrodes 30 are arranged in the third bending area _BE3 .
In addition, although the lead-out line 23 is bent from the second detection electrode 32 to the external connection terminal 26, all of them are bent at a right angle.
The extraction line 23 of the extraction wiring portion 22 may have at least one portion bent at an angle larger than 90° on the surface 25 a of the flexible base material 25 .
Here, the bending of the lead-out line 23 means that the lead-out line 23 bends from the Y direction to the X direction. The bent angle is the angle θ (see FIG. 2) of bending from the Y direction to the X direction.
For example, the extraction line 23 of the first detection electrode 30 shown in FIG. 2 is bent at the second planned bending region _BE2 , and the bending angle θ is 90°. The right angle bending mentioned above means that the angle θ is 90°. By setting the bending angle θ of the lead-out line 23 to be greater than 90°, the generation of cracks due to bending of the lead-out line 23 when the flexible base material 25 is folded so that the same surface of the peripheral portion 21 is folded is suppressed. be done.

In the touch panel 10 shown in FIG. 2, the lead-out wiring portions 22 are electrically connected to the ends of the first detection electrodes 30 in the Y direction, and the lead-out wiring portions 22 are connected to both ends of the second detection electrodes 32 in the X direction. They are electrically connected, and the extraction wiring section 22 is routed from three directions to the first detection electrode 30 and the second detection electrode 32 .
In addition, it is preferable that the detection unit 20 and the extraction wiring unit 22 are integrated. In this case, the detection section 20 and the extraction wiring section 22 are formed by a method described later.
The conductive film 12 is provided with an insulating film 37 covering the extraction wiring portion 22 at the peripheral portion 21 where the extraction wiring portion 22 is provided. The insulating film 37 is provided so as to surround the detection section 20 . The insulating film 37 protects the electrical insulation of the extraction wiring portion 22 . A protruding portion 38 is formed by the extraction wiring portion 22 and the insulating film 37 .

(superimposed area)
FIG. 4 is a schematic cross-sectional view showing an example of a conductive film overlapping region of the touch panel according to the embodiment of the present invention. 4, the same components as those of the conductive film 12 shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.
For example, for the conductive film 12 shown in FIG. 2, after bending the flexible base material 25 at the first bending position Bf ₁ and the second bending position Bf ₂ , the external connection terminals 26 are connected to the image display portion. When the flexible base material 25 is bent at the third bending position _Bf3 so as to be arranged on the back surface 14b side of the flexible base material 25, the corner 25e of the flexible base material 25 overlaps the region 25f, As shown in FIG. 4, an overlapping area Dε is formed. The overlapping region Dε is a region where the same surface of the peripheral portion 21 of the flexible base material 25 of the conductive film 12 is folded. In the overlapping region Dε, it is more preferable that none of the two surfaces of the conductive film 12 (peripheral edge portion 21) that is folded over has the lead-out line 23, but one of the two surfaces has the lead-out line. may have been

In the configuration of the conductive film 12 shown in FIG. 2 , the lead-out lines 23 are arranged avoiding the superimposed region Dε, so the external connection terminals 26 are flexible so as to be arranged on the back surface 14 b side of the image display section 14 . When the base material 25 is folded to overlap the corner portion 25e and the area 25f, the lead-out line 23 does not exist in the overlapping area Dε shown in FIG.
In the overlapping region Dε, if the lead-out line 23 and the second transparent insulating layer 17, and the second transparent insulating layer 17 and the lead-out line 23 overlap, a capacitor is formed to generate parasitic capacitance. changes the capacitance of Since the touch sensor operates by detecting capacitance, when the capacitance increases due to parasitic capacitance, the time constant increases, the response speed of touch detection slows down, and normal operation of the touch sensor becomes difficult. That is, the operational stability of the touch sensor deteriorates.
However, by adopting a wiring pattern in which the lead-out lines 23 are arranged along the bent region, overlapping of the lead-out lines 23 in the overlapping region Dε is suppressed. Therefore, an increase in parasitic capacitance can be suppressed, and an increase in capacitance of the touch sensor can be reduced. As a result, it is possible to suppress a decrease in touch detection response speed and maintain the operational stability of the touch sensor. Moreover, since the conductive film 12 is bent at the edge of the detection section 20 as described above, the frame can be narrowed. In this way, it is possible to obtain the touch panel 10 that maintains the operational stability of the touch sensor and has a narrow frame.

Although not shown, after bending the flexible base material 25 at the third bending position _Bf3 so that the external connection terminals 26 are arranged on the back surface 14b side of the image display unit 14, the first When the bending position Bf ₁ and the second bending position Bf ₂ are bent, the corner 25e of the flexible base material 25 overlaps the area 25g, and in the overlapping area Dε, the lead-out line 23 of the area 25g is exist. Even in this case, the lead-out lines 23 do not overlap each other in the overlapping region Dε, and as described above, it is possible to suppress an increase in parasitic capacitance, maintain the operational stability of the touch sensor, and obtain the touch panel 10 with a narrow frame. can be done.
In addition, in the conductive film 12, by arranging the lead-out line 23 in the folded region, the facing lead-out line 23 does not exist in the overlapping region Dε. As a result, no capacitance can be generated in principle. For this reason, in the conductive film 12, it is more preferable to set the wiring pattern of the lead-out lines 23 so that the lead-out lines 23 facing each other do not occur. For this reason, it is more preferable that the lead-out line 23 is not arranged in the corner 25e and the area 25f and the area 25g, which may overlap.

FIG. 5 is a schematic diagram for explaining the relationship between the length along the bending of the curved surface of the bending region of the conductive film of the touch panel of the embodiment of the present invention and the thickness of the image display portion. 5, the same components as those of the touch panel 10 shown in FIG. 1 and the conductive film 12 shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof will be omitted. Regarding the relationship between the length along the bending of the curved surface of the conductive film 12 and the thickness of the image display portion, the first bending region, the second bending region and the third bending region They will be collectively described simply as the bending regions BE.
The conductive film 12 is folded at each folding position as described above. At this time, as shown in FIG. 5, the conductive film 12 is folded so as to surround the side surface 14c of the image display section 14. Then, as shown in FIG. The bending area BE of the conductive film 12 is configured with a curved surface. If the ratio γ between the length Lp along the bending of the curved surface of the bending region BE of the conductive film 12 and the thickness tp of the image display portion 14 is large, the conductive film 12 in the bending region BE becomes long, and the above-mentioned When the ratio γ of is small, the length of the conductive film 12 in the bending area BE is shortened. The smaller the above ratio γ, the closer the bending area BE is to the side surface 14c of the image display unit 14 .
Hereinafter, the ratio γ between the length Lp along the bending of the curved surface of the bending region BE of the conductive film 12 in the bending region BE and the thickness tp of the image display section 14 will be simply referred to as the ratio γ.

The ratio γ is preferably 2.0 or less, more preferably 1.2 or less. When the ratio γ is 2.0 or less, the lead-out lines 23 facing each other in the thickness direction of the image display section 14 are farther apart on the curved surface Sc of the folded conductive film 12, and the parasitic capacitance is reduced. As a result, it is possible to suppress a decrease in touch detection response speed and maintain the operational stability of the touch sensor. Therefore, when the ratio γ is 1.2 or less, the distance between the lead lines 23 facing the thickness direction of the image display section 14 on the curved surface Sc of the folded conductive film 12 is further increased, which is more preferable.
It should be noted that the bending region and the intended bending region are different before and after bending, and are the same region in the conductive film 12 . For this reason, the ratio of the length of the region to be folded provided along the folding line in the width direction perpendicular to the folding line to the thickness of the image display portion is also preferably 2.0 or less. , the ratio γ is more preferably 1.2 or less.

Here, in the image display section 14, the center line passing through the half position in the thickness direction of the image display section 14 is defined as fc. Let fc be a point on the curved surface Sc of the conductive film 12 through which the center line fc passes. A contact point of the conductive film 12 with the rear surface 14b of the image display portion 14 is fe. Let Lm be a line passing through the point fc and the contact fe, and let Pp be a line extending from the rear surface 14b of the image display unit 14 . In this case, when the angle between the line Lm and the line Pp is θ, the angle α varies depending on the ratio γ described above. For example, when the ratio γ is 2.9, the angle α is 20°, when the ratio γ is 2.0, the angle α is 30°, and when the ratio γ is 1.2, the angle α is 60°. and the angle α is 90° when the ratio γ is 1.0.

In addition, the lead-out line 23 extending in the length direction of the bending region BE provided in the bending region BE along the bending line is provided in a region at a distance of 10 μm or more from the bending line. preferable. If all lead-out lines 23 are provided within the bending area BE, they are preferably provided in areas separated by 10 μm or more from both ends in the width direction of the bending area BE.
It is more preferable that the lead-out line 23 extending in the length direction of the bending area BE is provided in an area with a distance of 100 μm or more from the bending line. When all lead-out lines 23 are provided within the bending area BE, they are preferably provided in areas separated by 100 μm or more from both ends in the width direction of the bending area BE.
By collectively arranging the plurality of lead-out lines 23 in the central portion in the width direction of the bending region BE of the conductive film 12, that is, in the vicinity of the central portion of the curved surface Sc of the conductive film 12, the decrease in response speed of touch detection can be prevented. can be suppressed and the operation stability of the touch sensor can be maintained.
Note that the widthwise end of the bending region BE, that is, the end of the planned bending region is the end on the detection unit 20 side, and corresponds to the first bending position Bf ₁ and the second bending position Bf 1 shown in FIG. A bending position Bf ₂ and a third bending position Bf ₃ . Both ends are the end on the side of the detection unit 20 described above and the end on the opposite side of the detection unit 20 . The width direction perpendicular to the folding line in the planned folding area varies depending on the position of the folding line. If the folding line is parallel to the X direction, it is the Y direction, and the folding line is parallel to the Y direction. If so, it is in the X direction.

In the intended bending area provided along the bending line, the extraction wiring is preferably provided in an area separated from the bending line by a distance of 10 μm or more, and is provided in an area with a distance of 100 μm or more. more preferably.
By setting the lead-out line 23 at a distance of 10 μm or more or 100 μm or more from the bending line as described above and providing it inside the end of the bending region, the lead-out line 23 in the bending region and the flexible Electrical interference with the first detection electrodes 30 provided on the front surface 25a of the flexible base material 25 or the extraction wiring portion 22 bent on the back surface 25b of the flexible base material 25 can be avoided.

In the conductive film 12 shown in FIG. 2, as shown in FIG. 6, the flexible base material 25 may have a strip-like projecting portion 29 . The extraction wiring portion 22 is provided on the projecting portion 29 , and the termination portion 22 b of the extraction wiring portion 22 is provided on the projecting portion 29 . The flexible circuit board 19 is electrically connected to the external connection terminals 26 provided on the terminal portion 22b. An insulating film 37 (see FIG. 1) is formed on the projecting portion 29 . The projecting portion 29 can be formed by punching or partially cutting the flexible base material 25 .
In the conductive film 12 shown in FIG. 6, the position of the projecting portion 29 is the center in the X direction, but it is not limited to this. The position of the protruding portion 29 is appropriately determined according to the layout of the detecting portion 20 and the extraction wiring portion 22 and the like.
Moreover, depending on the size of the detection unit 20, a plurality of portions connected to the flexible circuit board 19 may be provided. If a plurality of connecting portions are provided as described above, the area occupied increases.

Here, in the touch panel 10, the thickness of the image display portion 14 is not particularly limited, but is preferably 0.5 mm or more and 4.0 mm or less, more preferably 1.0 mm or more and 3.0 mm or less. By setting the thickness of the image display portion 14 within this range, the conductive film 12 can be easily bent, and the conductive film 12 can be bent due to the bending, the lead-out line 23 can be cracked, and the film can be peeled off from the substrate. can be suppressed. If the thickness of the image display section 14 is large, bending occurs in the overlapping area when two adjacent sides are folded back, making handling very difficult. On the other hand, if the thickness of the image display portion 14 is thin, the bent diameter at the time of bending becomes an acute angle, and cracks may occur in the conductive layer. A liquid crystal display device has a thickness of about 3.0 mm, and some have a thickness of about 1 mm. Since the space of the side surface 14c is determined by the thickness of the image display unit 14, when the external connection terminals 26 are arranged on the side surface 14c, the arrangement space is limited. Therefore, in the touch panel 10 , the external connection terminals 26 are arranged on the rear surface 14 b side of the image display section 14 .
The conductive film 12 is arranged on the display surface 14a side of the image display section 14, and the flexible base material 25 is arranged so that the external connection terminals 26 are arranged on the back surface 14b side of the image display section 14 as described above. , the above-described first bending area BE ₁ , second bending area BE ₂ , and third bending area BE ₃ are bent to form a superimposed area Dε, the image display unit If the thickness of 14 is thin, electrical interference between the bent extraction wiring portions 22 can be avoided.

(Second example of conductive film)
Next, a second example of the conductive film 12 is described.
FIG. 7 is a schematic diagram showing a second example of the conductive film of the touch panel according to the embodiment of the present invention. In the conductive film 12 shown in FIG. 7, the same components as those of the conductive film 12 shown in FIG.

The conductive film 12 shown in FIG. 7 differs from the conductive film 12 shown in FIG. 2 in the pattern of the lead-out lines 23 of the second detection electrodes 32 . In the conductive film 12 shown in FIG. 7, all the lead-out lines 23 extending in the X direction and electrically connected to the ends of the second detection electrodes 32 are at the first bending position _Bf1 . It passes across the region _BE1 in the X direction. The lead-out line 23 is not provided along the Y direction in the first bending area _BE1 . The extraction line 23 is arranged along the length direction of the first intended bending area _BE1 , that is, along the Y direction, between the first intended bending area _BE1 and the outer edge 25c.
In addition, all of the extraction lines 23 extending in the X direction and electrically connected to the ends of the second detection electrodes ₃₂ cross the second bending area BE2 at the second bending position _Bf2 in the X direction. are passing through. The lead-out line 23 is not provided along the Y direction within the second bending area _BE2 . The extraction line 23 is arranged along the length direction of the second intended bending area _BE2 , that is, along the Y direction, between the second intended bending area _BE2 and the outer edge 25c. The extraction line 23 connected to the second detection electrode 32 is arranged to avoid the area 25g that may face the corner 25e. In this way, the lead-out line 23 exists in the region 25f, but the lead-out line 23 does not exist in the corner portion 25e and the region 25g.

In the conductive film 12 _shown in FIG. 7, for example, the flexible substrate 25 is bent in the first bending area BE1 at the first bending position _Bf1 , and is bent at the second bending position _Bf2 . 2 is bent, the flexible base material 25 is bent at the third bending position Bf ₃ so that the external connection terminals ₂₆ are arranged on the back surface 14b side of the image display unit 14 . When the bending area BE ₃ of 3 is bent, the lead-out line 23 is not arranged at the corner 25e. Therefore, in the overlapping region Dε, the lead-out lines 23 exist in the region 25f, but the lead-out lines 23 do not overlap each other. Thereby, the conductive film 12 shown in FIG. 7 can obtain the same effects as the conductive film 12 shown in FIG.
In addition, for example, the flexible base material 25 is bent at the third bending position _Bf3 so that the external connection terminal 26 is arranged on the back surface 14b side of the image display unit ₁₄ . After bending, the flexible base material 25 is bent in the first bending area BE1 _at the first bending position _Bf1 , and in the second bending area _BE2 at the second bending position _Bf2. is bent, the lead-out lines 23 do not exist in the superimposed region Dε, and the lead-out lines 23 do not overlap each other in the superimposed region Dε.

(Third example of conductive film)
Next, a third example of the conductive film 12 will be described.
FIG. 8 is a schematic diagram showing a third example of the conductive film of the touch panel according to the embodiment of the present invention. In the conductive film 12 shown in FIG. 8, the same components as those of the conductive film 12 shown in FIG. 2 are denoted by the same reference numerals, and detailed description thereof is omitted.
The conductive film 12 shown in FIG. 8 differs from the conductive film 12 shown in FIG. 2 in the pattern of the extraction lines 23 of the second detection electrodes 32 . In the conductive film 12 shown in FIG. 8, all the extraction lines 23 electrically connected to the ends of the second detection electrodes 32 are located in the first bending area _BE1 at the first bending position _Bf1 . However, in the region closer to the outer edge 25c than the third intended bending region _BE3 , between the first intended bending region _BE1 and the second intended bending region _BE2 It is a pattern through the area.
In addition, all of the extraction lines 23 electrically connected to the ends of the second detection electrodes 32 are arranged along the second bending area _BE2 at the second bending position _Bf2 , In the area closer to the outer edge 25c than the third bending area _BE3 , the pattern passes through the area between the first bending area _BE1 and the second bending area _BE2 . The lead-out line 23 does not exist in the corner portion 25e and the region 25f, but the lead-out line 23 exists in the region 25g.

In the conductive film 12 shown in FIG. 8, for example, the flexible base material 25 is bent in the first bending area _BE1 at the first bending position _Bf1 , and is bent at the second bending position _Bf2 . 2 is bent, the flexible base material 25 is bent at the third bending position Bf ₃ so that the external connection terminals ₂₆ are arranged on the back surface 14b side of the image display unit 14 . When the bending area BE ₃ of 3 is bent, the lead-out line 23 is not arranged at the corner 25e. Therefore, in the overlapping region Dε, the extraction lines 23 do not exist, and the extraction lines 23 do not overlap each other. Therefore, the conductive film 12 shown in FIG. 8 can obtain the same effect as the conductive film 12 shown in FIG.
In addition, for example, the flexible base material 25 is bent at the third bending position _Bf3 so that the external connection terminal 26 is arranged on the back surface 14b side of the image display unit ₁₄ . After bending, the flexible base material 25 is bent in the first bending area BE1 _at the first bending position _Bf1 , and in the second bending area _BE2 at the second bending position _Bf2. is bent, the lead-out lines 23 exist in the region 25g, but the lead-out lines 23 do not overlap each other in the overlapping region Dε.

(Fourth example of conductive film)
Next, a fourth example of the conductive film 12 will be described.
FIG. 9 is a schematic diagram showing a fourth example of the conductive film of the touch panel according to the embodiment of the invention. In the conductive film 12 shown in FIG. 9, the same components as those of the conductive film 12 shown in FIG.
The conductive film 12 shown in FIG. 9 differs from the conductive film 12 shown in FIG. is the same as the conductive film 12 shown in FIG. 2, so detailed description thereof will be omitted.
The conductive film 12 shown in FIG. 9 is obtained by changing the orientation of the conductive film 12 shown in FIG. 2, and the first detection electrode 30 of the conductive film 12 shown in FIG. The second detection electrode 32 is used as the first detection electrode 30 .
The lead-out lines 23 of the second detection electrodes 32 closest to the external connection terminals 26 are arranged in the first intended bending area _BE1 and the second intended bending area _BE2 . The other lead-out lines 23 of the second detection electrodes 32 are not arranged in the first intended bending area _BE1 and the second intended bending area _BE2 , and are not arranged in the first intended bending area BE2. ₁ are electrically connected to external connection terminals 26 . The extraction line 23 connected to the second detection electrode 32 is arranged to avoid the area 25g that may face the corner 25e. Thus, the lead-out line 23 exists in the region 25f, but the lead-out line 23 does not exist in the region 25g.

In the conductive film 12 shown in FIG. 9, for example, the flexible base material 25 is bent in the first bending area _BE1 at the first bending position _Bf1 , and is bent at the second bending position _Bf2 . 2 is bent, the flexible base material 25 is bent at the third bending position Bf ₃ so that the external connection terminals ₂₆ are arranged on the back surface 14 b side of the image display section 14 . When the bending area BE ₃ of 3 is bent, the lead-out line 23 is not arranged at the corner 25e. Therefore, in the overlapping region Dε, the lead-out lines 23 are present in the region 25f, but the lead-out lines 23 do not overlap each other. Thereby, the conductive film 12 shown in FIG. 9 can obtain the same effect as the conductive film 12 shown in FIG.
For example, the flexible base material 25 is bent at the third bending position _Bf3 so that the external connection terminals 26 are arranged on the back surface 14b side of the image display unit ₁₄ . After bending, the flexible base material 25 is bent in the first bending area BE1 _at the first bending position _Bf1 , and in the second bending area _BE2 at the second bending position _Bf2. is bent, the lead-out lines 23 do not exist in the superimposed region Dε, and the lead-out lines 23 do not overlap each other in the superimposed region Dε.

(Fifth example of conductive film)
Next, a fifth example of the conductive film 12 will be described.
FIG. 10 is a schematic diagram showing a fifth example of the conductive film of the touch panel according to the embodiment of the present invention. In the conductive film 12 shown in FIG. 10, the same components as those of the conductive film 12 shown in FIG.
The conductive film 12 shown in FIG. 10 differs from the conductive film 12 shown in FIG. 2 in the pattern of the extraction lines 23 of the second detection electrodes 32 . In the conductive film 12 shown in FIG. 10, all the lead-out lines 23 extending in the X direction and electrically connected to the ends of the second detection electrodes 32 are at the first bending position _Bf1 . It traverses the region _BE1 in the X direction. The lead-out line 23 is not provided along the inside of the first intended bending area _BE1 . A lead-out line 23 is arranged along the length direction of the first intended bending area _BE1 , that is, the Y direction, between the first intended bending area _BE1 and the outer edge 25c.
In addition, all of the extraction lines 23 extending in the X direction and electrically connected to the ends of the second detection electrodes ₃₂ cross the second bending area BE2 at the second bending position _Bf2 in the X direction. ing. The lead-out line 23 is not provided along the inside of the second planned bending area _BE2 . Between the second bending area _BE2 and the outer edge 25c, the extraction line 23 is arranged along the length direction of the second bending area _BE2 , that is, along the Y direction.
In addition, all the lead-out lines 23 electrically connected to the ends of the second detection electrodes 32 are located in the first bending area BE in the area closer to the outer edge 25c than the third bending area _BE3 . ₁ and the second bending area _BE2 . Although the lead-out lines 23 are present in the regions 25f and 25g, the lead-out lines 23 are not present in the corner portion 25e.

In the conductive film 12 shown in FIG. 10, for example, the flexible substrate 25 is bent in the first bending area _BE1 at the first bending position _Bf1 , and is bent at the second bending position _Bf2 . 2 is bent, the flexible base material 25 is bent at the third bending position Bf ₃ so that the external connection terminals ₂₆ are arranged on the back surface 14 b side of the image display section 14 . When the bending area BE ₃ of 3 is bent, the lead-out line 23 is not arranged at the corner 25e. Therefore, in the overlapping region Dε, the lead-out lines 23 are present in the region 25f, but the lead-out lines 23 do not overlap each other. Thereby, the conductive film 12 shown in FIG. 10 can obtain the same effect as the conductive film 12 shown in FIG.
For example, the flexible base material 25 is bent at the third bending position _Bf3 so that the external connection terminals 26 are arranged on the back surface 14b side of the image display unit ₁₄ . After bending, the flexible base material 25 is bent in the first bending area BE1 _at the first bending position _Bf1 , and in the second bending area _BE2 at the second bending position _Bf2. is bent, the lead-out lines 23 are present in the superimposed region Dε, but the lead-out lines 23 do not overlap each other in the superimposed region Dε.

(Sixth example of conductive film)
Next, a sixth example of the conductive film 12 will be described.
FIG. 11 is a schematic diagram showing a sixth example of the conductive film of the touch panel according to the embodiment of the present invention. In the conductive film 12 shown in FIG. 11, the same components as those of the conductive film 12 shown in FIG.
The conductive film 12 shown in FIG. 11 differs from the conductive film 12 shown in FIG. 10 in the arrangement pattern of the extraction lines 23 of the first detection electrodes 30 and the arrangement pattern of the extraction lines 23 of the second detection electrodes 32. .
In the conductive film 12 shown in FIG. 11, all of the extraction lines 23 extending in the X direction and electrically connected to the ends of the first detection electrodes 30 are arranged in the third bending area _BE3 . Therefore, all of the extraction lines 23 connected to the first detection electrodes 30 are arranged on the side surface of the image display section 14 .
The lead-out line 23 connected to the second detection electrode 32 passes through the first bending planned area _BE1 and the second bending planned area _BE2 adjacent to the corner 25e in the X direction, and crosses the area 25g. have passed. In this way, the lead-out lines 23 exist in the regions 25f and 25g, but the lead-out lines 23 do not exist in the corner portion 25e.
In the conductive film 12 shown in FIG. 11, the lead-out lines 23 exist in the regions 25f and 25g as described above, but the lead-out lines 23 do not exist in the corners 25e. Therefore, in the overlapping region Dε, the lead-out lines 23 are arranged on one of the two faces of the conductive film that is folded over, but the lead-out lines 23 do not overlap each other in the overlapping region Dε. Thereby, the conductive film 12 shown in FIG. 11 can obtain the same effects as the conductive film 12 shown in FIG.

In any of the above examples, the first _planned bending region BE1 is bent at the first bending position _Bf1 of the flexible base material 25, and the second planned bending region is bent at the second bending position _Bf2 . After bending the region _BE2 , the flexible base material 25 is scheduled to be thirdly bent at the third bending position _Bf3 so that the external connection terminals 26 are arranged on the back surface 14b side of the image display unit 14. Although bending the region _BE3 is taken as an example, it is not limited to this. As a touch panel, for example, two intersecting bending lines provided along the edge of the detection unit 20 are flexible to the back surface 14b side of the image display unit 14 opposite to the display surface 14a side of the image display unit 14. Two bending regions surrounding the side surface 14c of the image display unit 14 formed by bending the flexible base material 25 and the peripheral edge of the conductive film 12 (flexible base material 25) at the back surface 14b of the image display unit 14 The same face of the portion 21 has an overlapping region Dε to be folded over. Further, the external connection terminals 26 are arranged on the display surface 14a side of the image display unit 14, the extraction lines 23 are provided at least in the bending area, and the extraction lines 23 are arranged avoiding the overlapping area Dε, Alternatively, in the overlapping region Dε, a configuration in which one of the two surfaces of the conductive film 12 that is folded over is provided with a lead-out line may be employed. This configuration can also suppress an increase in parasitic capacitance in the overlapping region Dε.
Further, for example, the flexible base material 25 has a rectangular shape, the plurality of detection units 20 are arranged in a rectangular shape with the sides of the flexible base material 25 aligned, and the extraction wiring part 22 has a flexible It is provided on the periphery of the side of the base material 25 . A first side along one end of the detection section 20 and a second side orthogonal to the first side are provided with parallel bending lines. The above-mentioned respective parallel folding lines are, for example, the above-mentioned first folding position _Bf1 and third folding position _Bf3 . Of the four sides of the flexible base material 25 , the two sides provided with the folding lines may be bent so as to be arranged on the back surface 14 b side of the image display section 14 .

(Structure of conductive film)
Each member constituting the conductive film will be described below.
<Electrode configuration, etc.>
FIG. 12 is a schematic diagram showing the electrode configuration of the detection portion of the conductive film of the touch panel of the embodiment of the present invention, and FIG. 13 is the shape of the mesh pattern of the detection portion of the conductive film of the touch panel of the embodiment of the present invention. It is a schematic diagram which shows an example.
The first detection electrode 30 and the second detection electrode 32 of the detection section 20 are composed of the thin metal wires 33 as described above. The first detection electrode 30 and the second detection electrode 32 have, for example, a mesh pattern in which a plurality of thin metal wires 33 intersect, as shown in FIG.
The extraction line 23 can also have the same configuration as the first detection electrode 30 and the second detection electrode 32 , and can be composed of the thin metal wire 33 . The extraction line 23 may have a mesh pattern in which a plurality of thin metal wires 33 intersect.

When the first detection electrode 30, the second detection electrode 32, and the lead-out line 23 are configured to have a mesh pattern, the pattern of the mesh pattern is not particularly limited. , Squares such as rectangles, rhombuses, parallelograms, trapezoids, (regular) n-gons such as (regular) hexagons and (regular) octagons, circles, ellipses, stars, etc. preferable.
By the mesh of the mesh pattern is intended a shape containing a plurality of openings 35 constituted by intersecting thin metal wires 33, as shown in FIG. In FIG. 13, the openings 35 have a rhombus shape, but may have other shapes. For example, polygonal shapes (eg, triangles, squares, hexagons, and random polygons) may be used. In addition, the shape of one side may be curved, or arc-shaped, instead of being linear. In the case of an arc shape, for example, two opposing sides may be arcuately convex outward, and the other two opposing sides may be arcuately convex inward. Further, the shape of each side may be a wavy line shape in which an outwardly convex circular arc and an inwardly convex circular arc are continuous. Of course, the shape of each side may be a sine curve.

The opening 35 is an open area surrounded by the fine metal wires 33 . The upper limit of the length W of one side of the opening 35 is preferably 800 μm or less, more preferably 600 μm or less, even more preferably 400 μm or less, and the lower limit is preferably 5 μm or more, more preferably 30 μm or more, and even more preferably 80 μm or more. When the length W of one side of the opening 35 is within the range described above, it is possible to maintain good transparency, and the conductive film 12 (see FIG. 1) is attached to the image display section 14 (see FIG. 1). ), the display can be visually recognized without a sense of incompatibility.
From the viewpoint of visible light transmittance, the open area ratio of the mesh pattern is preferably 85% or more, more preferably 90% or more, and even more preferably 95% or more. The aperture ratio corresponds to the ratio of the transparent portion excluding the thin metal wires in the region provided with the conductive layer, that is, the ratio of the openings to the entire region provided with the conductive layer.

The configuration of the detection unit 20 is limited to the configuration in which the first detection electrodes 30 are provided on the surface 25a of the flexible base material 25 and the second detection electrodes 32 are provided on the back surface 25b, as shown in FIG. isn't it. For example, the structure which provided the 1st detection electrode 30 and the 2nd detection electrode 32 on a separate flexible base material, respectively, and laminated|stacked may be sufficient. Specifically, the flexible base material 25 provided with the first detection electrode 30 and the flexible base material 25 provided with the second detection electrode 32 are separated from each other by a transparent and electrically insulating insulator. A configuration in which layers are laminated may be used.
The configuration is not limited to the configuration in which the detection units 20 are provided on the front surface 25a and the back surface 25b of the flexible base material 25, respectively. As shown in FIG. 14, the configuration may be such that the detection electrodes 34 are provided only on one surface of the flexible base material 25, for example, only on the surface 25a. A detection electrode 34 shown in FIG. 14 functions as the detection unit 20 . The detection electrode 34 is composed of a plurality of fine metal wires 33 in the same manner as the first detection electrode 30 (see FIG. 3), and the fine metal wires 33 are provided on the surface 25a.
Note that FIG. 13 is a schematic cross-sectional view showing an example of the configuration of the detection portion of the conductive film of the touch panel according to the embodiment of the present invention.
As a configuration other than the thin metal wire, the first detection electrode 30 and the second detection electrode 32 of the detection unit 20 are formed of conductive fibers such as silver nanowires, carbon nanotubes (CNT), carbon nanobuds (CNB), etc. or a combination thereof.

<Flexible base material>
A flexible base material means that it can be bent, and specifically, it means that it does not crack even if it is bent with a radius of curvature of 1 mm.
The flexible base material supports the detection section and the extraction wiring section, and is a flexible support. The flexible substrate has, for example, a rectangular shape when viewed from the surface.
The type of the flexible substrate is not limited as long as it can support the detection section and the extraction wiring section and has flexibility, and is preferably a transparent support, particularly A plastic sheet is preferred.
Specific examples of materials constituting the flexible substrate include PET (polyethylene terephthalate) (258°C), polycycloolefin (134°C), polycarbonate (250°C), (meth)acrylic resin (128°C), and PEN. (polyethylene naphthalate) (269°C), PE (polyethylene) (135°C), PP (polypropylene) (163°C), polystyrene (230°C), polyvinyl chloride (180°C), polyvinylidene chloride (212°C), Poly PVDF (vinylidene fluoride) (177°C), PAR (polyarylate) (250°C), PES (polyethersulfone) (225°C), polymer acrylic resin, fluorene derivative (140°C), crystalline COP ( 165° C.), or a plastic film having a melting point of about 290° C. or less such as TAC (triacetyl cellulose) (290° C.), and more preferably (meth)acrylic resin, PET, polycycloolefin, or polycarbonate. PET is more preferable because it has good adhesion to the detection section and the extraction wiring section. The numerical values in parentheses above are melting points or glass transition temperatures.
The total light transmittance of the flexible substrate is preferably 85-100%.
Although the thickness of the flexible base material is not particularly limited, it can be arbitrarily selected from the range of 25 to 500 μm in terms of application to touch panels. In addition, in the case where the function of the flexible base material and the function of the touch surface are also provided, it is possible to design with a thickness exceeding 500 μm.

One preferred embodiment of the flexible substrate is a treated support that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By applying the above treatment, a hydrophilic group such as an OH group is introduced to the surface of the treated support, and the adhesion of the conductive wire is further improved.

Another preferred embodiment of the flexible base material may be a structure having an undercoat layer containing a polymer on its surface. By forming the detection section and the extraction wiring section on the undercoat layer, the adhesion between the detection section and the extraction wiring section is further improved.
The method for forming the undercoat layer is not particularly limited, but examples include a method in which an undercoat layer-forming composition containing a polymer is applied onto a flexible substrate, and heat treatment is performed as necessary. The undercoat layer-forming composition may contain a solvent, if necessary. The type of solvent is not particularly limited, and known solvents are exemplified. Further, as the undercoat layer-forming composition containing a polymer, a latex containing fine particles of a polymer may be used.
Although the thickness of the undercoat layer is not particularly limited, it is preferably 0.02 to 0.3 μm, more preferably 0.03 to 0.2 μm, in terms of better adhesion between the detection section and the extraction wiring section.

<Detection part, extraction wiring part>
Although the line width of the thin metal wire constituting the detection portion and the extraction wiring portion is not particularly limited, the upper limit is preferably 30 μm or less, more preferably 15 μm or less, even more preferably 10 μm or less, particularly preferably 9 μm or less, and most preferably 7 μm or less. , the lower limit is preferably 0.5 μm or more, more preferably 1.0 μm or more. Within the above range, a low-resistance electrode can be formed relatively easily.
When the thin metal wire is applied as the lead wire of the lead wire portion, the wire width of the thin metal wire is preferably 500 μm or less, more preferably 50 μm or less, and even more preferably 30 μm or less. If it is the above-mentioned range, a low resistance touch-panel electrode can be formed comparatively easily.

The thickness of the fine metal wire is not particularly limited, but is preferably 0.01 to 200 μm, more preferably 30 μm or less, even more preferably 20 μm or less, particularly preferably 0.01 to 9 μm, and 0.01 to 9 μm. Most preferably it is between 05 and 5 μm. Within the above range, a low-resistance electrode with excellent durability can be formed relatively easily.

Examples of materials for the fine metal wires include metals or alloys such as gold (Au), silver (Ag), molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al) and tungsten (W). mentioned. Among them, silver is preferable because the fine metal wire has excellent electrical conductivity.
The fine metal wires preferably contain a binder from the viewpoint of adhesion between the fine metal wires and the flexible substrate.
As the binder, a resin is preferable because the adhesion between the thin metal wire and the flexible substrate is more excellent. More specifically, (meth)acrylic resin, styrene resin, vinyl resin, and polyolefin resin. , at least one resin selected from the group consisting of polyester resins, polyurethane resins, polyamide resins, polycarbonate resins, polydiene resins, epoxy resins, silicone resins, cellulose polymers and chitosan polymers, Alternatively, copolymers made of monomers constituting these resins may be used.
The fine metal wire containing the binder will be described later in detail.

A method for producing the thin metal wire is not particularly limited, and a known method can be adopted. For example, a method of exposing and developing a photoresist film on a metal foil formed on the surface of a flexible base material to form a resist pattern and etching the metal foil exposed from the resist pattern can be used. Alternatively, a method of printing a paste containing metal fine particles or metal nanowires on both main surfaces of a flexible base material and plating the paste with metal is also available. Another example is a method in which a patterned groove structure is previously formed on the surface of a flexible substrate, and a paste containing metal fine particles or metal nanowires is embedded in the grooves by screen printing. Moreover, the method of pattern-printing the ink containing a metal microparticle or a metal nanowire on the surface of a flexible base material by an inkjet system, and forming a metal fine wire is mentioned.
In addition to the methods described above, methods using silver halide can also be mentioned. More specifically, the methods described in paragraphs 0056 to 0114 of JP-A-2014-209332 can be mentioned. A method using silver halide will be described later in detail.

A preferred form of the detection part includes a form including a mesh pattern made of silver fine wires, and the first detection electrode is arranged on the front surface of the flexible base material, and the second detection electrode is arranged on the rear surface thereof. preferable.

[Other examples of fine metal wires]
The first detection electrode 30 and the second detection electrode 32 of the detection unit 20, and the lead-out line 23 of the lead-out wiring part 22 are not limited to being composed of thin metal wires, and are made of a binder and dispersed in the binder. It can also be composed of a conductive wire containing a metal portion.
In the conductive wire, the binder described above contains a first polymer and a second polymer having a lower glass transition temperature than the first polymer. In addition, in this specification, the glass transition temperature of a polymer means the glass transition temperature measured by the differential scanning calorimetry (DSC) method. The glass transition temperature is measured using the "plastic transition temperature measuring method" specified in JIS K7121 (2012).

Examples of the first polymer and the second polymer include hydrophobic polymers (hydrophobic resins), and more specifically, acrylic resins, styrene resins, vinyl resins, polyolefin resins, polyesters. at least one resin selected from the group consisting of based resins, polyurethane-based resins, polyamide-based resins, polycarbonate-based resins, polydiene-based resins, epoxy-based resins, silicone-based resins, cellulose-based polymers and chitosan-based polymers, or , copolymers composed of monomers constituting these resins, and the like.
In addition, the polymer preferably contains a reactive group that reacts with a cross-linking agent, which will be described later.

The polymer preferably has at least one unit selected from the group consisting of formulas A, B, C and D below.
Among them, the first polymer is preferably a polymer composed of one type of unit selected from the group consisting of formulas A, B, C, and D from the viewpoint of easily controlling the glass transition temperature to a lower level.
A polymer comprising at least one unit selected from the group consisting of B, C and D is more preferred, and a polymer comprising a unit represented by formula D is even more preferred.

R ¹ represents a methyl group or a halogen atom, preferably a methyl group, a chlorine atom or a bromine atom. p represents an integer of 0 to 2, preferably 0 or 1, more preferably 0;

R ² represents a methyl group or an ethyl group, preferably a methyl group.
R ³ represents a hydrogen atom or a methyl group, preferably a hydrogen atom. L represents a divalent linking group, preferably a group represented by the following general formula (β).
general formula (β): -(CO-X ¹ )r-X ² -
In the formula, X ¹ represents an oxygen atom or -NR ³⁰ -. Here, R ³⁰ represents a hydrogen atom, an alkyl group, an aryl group, or an acyl group, each of which may have a substituent (eg, halogen atom, nitro group, hydroxyl group, etc.). R ³⁰ is preferably a hydrogen atom, an alkyl group having 1 to 10 carbon atoms (eg, methyl group, ethyl group, n-butyl group, n-octyl group, etc.), acyl group (eg, acetyl group, benzoyl group, etc.). is. X ¹ is particularly preferably an oxygen atom or NH-.
X ² represents an alkylene group, an arylene group, an alkylenearylene group, an arylenealkylene group, or an alkylenearylenealkylene group, and these groups include -O-, -S-, -OCO-, -CO-, -COO -, -NH-, -SO ₂ -, -N(R ³¹ )-, -N(R ³¹ )SO ₂ -, etc. may be inserted in the middle. Here, R ³¹ represents a linear or branched alkyl group having 1 to 6 carbon atoms, such as methyl group, ethyl group and isopropyl group. Preferred examples of X ² include dimethylene, trimethylene, tetramethylene, o-phenylene, m-phenylene, p-phenylene, —CH ₂ CH ₂ OCOCH ₂ CH ₂ — and —CH ₂ CH ₂ OCO(C ₆ H ₄ )— and the like.
r represents 0 or 1;
q represents 0 or 1, with 0 being preferred.

R ⁴ represents an alkyl group, an alkenyl group, or an alkynyl group having 1 to 80 carbon atoms, and the first polymer is preferably an alkyl group having 1 to 5 carbon atoms, and the second polymer preferably has a carbon number of An alkyl group having 5 to 50 carbon atoms is preferred, an alkyl group having 5 to 30 carbon atoms is more preferred, and an alkyl group having 5 to 20 carbon atoms is even more preferred.
R ⁵ represents a hydrogen atom, a methyl group, an ethyl group, a halogen atom, or —CH ₂ COOR ⁶ , preferably a hydrogen atom, a methyl group, a halogen atom, or —CH ₂ COOR ⁶ , a hydrogen atom, a methyl group; , or --CH ₂ COOR ⁶ is more preferred, and a hydrogen atom is particularly preferred.
R ⁶ represents a hydrogen atom or an alkyl group having 1 to 80 carbon atoms and may be the same as or different from R ⁴ . R ⁶ preferably has 1 to 70 carbon atoms, more preferably 1 to 60 carbon atoms.

Another preferred form of the first polymer and second polymer is a polymer (copolymer) represented by the following general formula (1), since it can further prevent the infiltration of moisture.
General formula (1): -(A) _x -(B) _y -(C) _z -(D) _w -
In general formula (1), A, B, C, and D each represent the above-described repeating unit.

In general formula (1), x, y, z, and w represent the molar ratio of each repeating unit.
x is 3 to 60 mol %, preferably 3 to 50 mol %, more preferably 3 to 40 mol %.
y is 30 to 96 mol %, preferably 35 to 95 mol %, more preferably 40 to 90 mol %.
z is 0.5 to 25 mol %, preferably 0.5 to 20 mol %, more preferably 1 to 20 mol %.
w is 0.5 to 40 mol %, preferably 0.5 to 30 mol %.
In general formula (1), it is particularly preferred that x is 3 to 40 mol%, y is 40 to 90 mol%, z is 0.5 to 20 mol%, and w is 0.5 to 10 mol%.

As the polymer represented by the general formula (1), polymers represented by the following general formulas (2) and (3) are preferable.

In general formula (2), x, y, z and w are as defined above.

In the above formula, a1, b1, c1, d1, and e1 represent the molar ratio of each monomer unit, a1 is 3 to 60 (mol%), b1 is 30 to 95 (mol%), and c1 is 0.5. ~25 (mol%), d1 represents 0.5 to 40 (mol%), and e1 represents 1 to 10 (mol%).
The preferred range of a1 is the same as the preferred range of x above, the preferred range of b1 is the same as the preferred range of y above, the preferred range of c1 is the same as the preferred range of z above, and d1 The preferred range is the same as the preferred range of w above.
e1 is 1 to 10 mol %, preferably 2 to 9 mol %, more preferably 2 to 8 mol %.

The weight average molecular weight of the polymer represented by formula (1) is preferably 1,000 to 1,000,000, more preferably 2,000 to 750,000, and still more preferably 30,000 to 500,000.
The polymer represented by general formula (1) can be synthesized with reference to, for example, Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

The glass transition temperatures of the first polymer and the second polymer are not particularly limited, but the glass transition temperature of the first polymer is preferably 0° C. or higher, more preferably 25° C. or higher. More preferably above 40°C. Although the upper limit is not particularly limited, generally 120° C. or less is preferable.
The glass transition temperature of the second polymer is not particularly limited, but is preferably 40°C or lower, more preferably 25°C or lower, still more preferably lower than 25°C, particularly preferably 0°C or lower, and 0°C. Less than is most preferred. Although the lower limit is not particularly limited, -50°C or higher is generally preferred.
Although the difference (absolute value) between the glass transition temperature of the first polymer and the glass transition temperature of the second polymer is not particularly limited, it is generally preferably 20 to 100°C.

The metal portion of the conductive wire is a portion that ensures the conductive properties of the conductive wire, and the metal portion is made of metal. As metals constituting the metal part, the group consisting of gold (metallic gold), silver (metallic silver), copper (metallic copper), nickel (metallic nickel), and palladium (metallic palladium) is preferred because of its excellent conductive properties. At least one more selected metal is preferred.
15 is an enlarged view of the conductive wire 50. FIG. FIG. 15 shows a form in which the metal part 54 is dispersed in the conductive wire 50 in the form of particles. not shown) and dispersed in the conductive wire 50 .
A conductive wire 50 shown in FIG. 15 includes a binder 52 containing a first polymer and a second polymer, and a plurality of metal parts 54 dispersed in the binder 52 . The metal portion 54 is particulate as described above.

The conductive wire may contain materials other than those mentioned above. Materials other than those described above include, for example, nonmetallic fine particles. Examples of non-metal fine particles include resin particles and metal oxide particles, with metal oxide particles being preferred.
Examples of metal oxide particles include silicon oxide particles and titanium oxide particles.

The average particle diameter of the nonmetallic fine particles is not particularly limited, but the equivalent spherical diameter is preferably 1 to 1000 nm, more preferably 10 to 500 nm, and even more preferably 20 to 200 nm. Within the above range, the detection section tends to have superior transparency and conductivity.
The equivalent sphere diameter of the non-metallic fine particles is obtained by calculating the equivalent sphere diameters for 50 arbitrary particles using a transmission electron microscope and taking the arithmetic mean thereof.

<Metal stabilizer>
Moreover, the conductive wire preferably has a metal stabilizer on the surface or inside of the metal part or in the binder for the purpose of stabilizing the metal part. As the metal stabilizer, the following materials can be used singly or in combination.

Corrosion inhibitors described in JP-T-2009-505358, paragraphs 0075 to 0086.
Metal ion trapping agents described in paragraphs 0077 to 0092 of JP-A-2009-188360.
Nitrogen-containing heterocyclic compounds having a mercapto group described in paragraphs 0044 to 0047 of JP-A-2012-146548.
Compositions for forming a silver ion diffusion suppression layer described in JP-A-2013-224397, paragraphs 0018 to 0049.
JP-A-2014-075115, paragraphs 0030 to 0066 Compounds for forming a silver ion diffusion suppression layer.
Rust inhibitors described in paragraphs 0050 to 0057 of JP-A-2018-024784.
Mercaptobenzothiazoles described in JP-A-2019-016488, paragraphs 0050 to 0057.

Moreover, the below-mentioned specific compound can be used preferably as a metal stabilizer.
As the metal stabilizer, the following compounds or salts thereof are preferred.
2-mercaptobenzothiazole, 2-mercaptobenzimidazole, 5-mercap-1-phenyl-1H-tetrazole, 1-(4-carboxyphenyl)-5-mercapto-1H-tetrazole, 3-mercapto-1,2,4- triazole, 1-(m-sulfophenyl)-5-mercapto-1H-tetrazole sodium, 2-mercaptobenzoxazole, 1,2,3-benzotriazole, 1-(3-acetamidophenyl)-5-mercaptotetrazole, 5 -amino-2-mercaptobenzimidazole, 6-amino-2-mercaptobenzothiazole, thiocyanuric acid, 6-(dibutylamino)-1,3,5-triazine-2,4-dithiol, 2-mercaptothiazoline, diethyldithiocarbamine diethylammonium acid, (2-benzothiazolylthio)acetic acid, 3-(2-benzothiazolylthio)propionic acid, 6-(dibutylamino)-1,3,5-triazine-2,4-dithiol, 2- amino-5-mercapto-1,3,4-thiadiazole, 2-mercapto-5-methylthio-1,3,4-thiadiazole, 2-mercapto-5-ethylthio-1,3,4-thiadiazole, 2-5- dimercapto-1,3,4-thiadiazole, 2-thioacetic acid-5-mercapto-1,3,4-thiadiazole, 2-aminopyrimidine, 5,6-dimethylbenzimidazole, 2-mercaptopyrimidine.
Among them, a compound having a mercaptothiazole skeleton or a mercaptothiadiazole skeleton, or a compound selected from salts thereof, is most preferable as the metal stabilizer because it is particularly effective in improving resistance to sulfurization. Specific examples of the most preferred compounds include 2-mercaptobenzothiazole, 5-methyl-2-mercaptobenzothiazole, 2-amino-5-mercapto-1,3,4-thiadiazole, 2-mercapto-5-methylthio-1 ,3,4-thiadiazole, 2-mercapto-5-ethylthio-1,3,4-thiadiazole, 2-5-dimercapto-1,3,4-thiadiazole and derivatives or salts thereof.

The introduction of a metal stabilizer is useful for improving the durability of the metal material in the bent and unfolded portions, and is effective and preferable for suppressing migration and sulfurization, especially when silver is used in the metal portion. As a method of introducing the metal stabilizer, a method of contacting the conductive film with a solution containing the metal stabilizers by coating or immersion during or after the formation of the conductive wire, or fumigation of these metal stabilizers. A method of depositing on a conductive film by vapor phase reaction, etc., can be preferably used. Moreover, it is also preferable to include the metal stabilizer in the above-described transparent insulating layer. In particular, by preliminarily incorporating the metal stabilizer into the transparent insulating layer, contact between the conductive wire and the solvent necessary for dissolving the metal stabilizer is eliminated, and damage to the conductive wire or binder by the solvent is avoided. It is possible and preferable. Therefore, at least one of the first transparent insulating layer and the second transparent insulating layer preferably contains a metal stabilizer.
Moreover, the resistance change over time in the active area, which is the input area _E1 of the detection unit 20 of the touch panel 10, may occur even in a touch panel having no bent portion. However, since at least one of the first transparent insulating layer and the second transparent insulating layer contains a metal stabilizer, it is possible to suppress the resistance change even in the above-described touch panel having no bent portion. .

The amount of these metal stabilizers to be used is not limited, but at least one of the transparent insulating layer and the conductive film may contain 1 mg/m ² to 10 g/m ² per conductive layer. More preferably, the content is in the range of 10 mg/m ² to 1 g/m ² .

<Manufacturing Method of Detection Unit>
A method for manufacturing the detection portion will be described by taking as an example a case where the metal portion of the conductive wire contains silver (metallic silver). A method having the following steps is preferable in that more excellent productivity can be obtained.

・Process A:
Simultaneously coating a silver halide-containing coating liquid containing at least silver halide and a first polymer and a composition-adjusted coating liquid containing at least a second polymer in multiple layers on a flexible substrate, forming a silver halide photosensitive layer;
・Process B:
A step of exposing the silver halide photosensitive layer and then developing it to form a conductive line containing metallic silver.
Below, each process is explained in full detail.

<Process A>
In step A, a silver halide-containing coating liquid containing at least silver halide and a first polymer and a composition-adjusted coating liquid containing at least a second polymer are simultaneously laminated on a flexible substrate. This is a step of coating to form a silver halide photosensitive layer.
Note that the order of lamination of each coating liquid in the case of simultaneous multi-layer coating is not particularly limited. The silver halide-containing coating liquid and the composition-adjusting coating liquid may be laminated in this order from the flexible substrate side. Conversely, the composition-adjusting coating liquid and the silver halide-containing coating liquid may be laminated in this order from the flexible substrate side. Further, the composition-adjusting coating liquid, the silver halide-containing coating liquid, and the composition-adjusting coating liquid may be laminated in this order.

In addition, "coating on a flexible substrate" means the case of applying directly on the surface of the flexible substrate, and the case of applying on a layer separately arranged on the flexible substrate. also include
In this process, since the silver halide-containing coating liquid containing silver halide and the composition-adjusted coating liquid not containing silver halide are simultaneously coated in multiple layers, a two-layer coating film is formed from both coating liquids. Diffusion of components proceeds at the interface of More specifically, a coating film formed from a composition-adjusted coating solution selected from a coating film formed from a silver halide-containing coating solution placed on a flexible substrate (hereinafter also referred to as coating film A). Diffusion of part of the silver halide and the first polymer proceeds in (hereinafter also referred to as coating film B). As a result, the region of the coating film A side in the coating film B contains silver halide and the first polymer, and the content thereof is the silver halide in the coating film A and the first polymer less than the content of
A region of the coating film B on the side of the coating film A (hereinafter also referred to as “region w”) contains silver halide that has migrated from the coating film A. Therefore, after the step B described later, this region w will form the top region of the conductive line. At this time, in the region w of the conductive wire, the content mass ratio of the content of the second polymer to the total content of the content of the first polymer and the content of the second polymer is greater than that of the intermediate region. Cheap.

The silver halide-containing coating liquid should contain at least the silver halide and the first polymer, and may further contain the second polymer. In this case, the mass ratio of the content of the second polymer to the content of the first polymer and the content of the second polymer in the silver halide-containing coating liquid is the content of the first polymer in the composition-adjusted coating liquid. and is smaller than the content mass ratio of the second polymer to the content of the second polymer.

Moreover, the composition-adjusted coating liquid may contain at least the second polymer, and may further contain silver halide and/or the first polymer. When the composition-adjusted coating solution further contains silver halide, the content is not particularly limited, but the content of silver halide in the composition-adjusted coating solution is It is preferable that the content of silver halide is smaller. By doing so, it is easy to obtain a detection unit with less external light reflection.
When the composition-adjusted coating liquid further contains a first polymer, the content mass ratio of the first polymer to the content of the first polymer and the content of the second polymer in the composition-adjusted coating liquid is the silver halide It is preferably smaller than the content mass ratio of the first polymer to the content of the first polymer and the content of the second polymer in the coating liquid.

The silver halide contained in the silver halide-containing coating solution is not particularly limited, and known silver halides can be used. The halogen element contained in the silver halide may be chlorine, bromine, iodine or fluorine, or a combination thereof. For example, a silver halide mainly composed of silver chloride, silver bromide or silver iodide is preferably used, and a silver halide mainly composed of silver bromide or silver chloride is more preferably used. Silver chlorobromide, silver iodochlorobromide, or silver iodobromide is also preferably used. Silver chlorobromide, silver bromide, silver iodochlorobromide, or silver iodobromide is more preferred, and silver chlorobromide containing 50 mol % or more of silver chloride or iodochloride is most preferred. Silver bromide is used.
Here, "silver halide composed mainly of silver bromide" refers to silver halide in which the molar fraction of bromide ions in the silver halide composition is 50% or more. The silver halide grains composed mainly of silver bromide may contain iodide ions and chloride ions in addition to bromide ions.

The silver halide is in the form of solid particles, and the average particle size of the silver halide is preferably 0.1 to 1000 nm (1 μm), more preferably 0.1 to 300 nm, in terms of equivalent sphere diameter. More preferably ~200 nm.
The equivalent sphere diameter of a silver halide grain is the diameter of a spherical grain having the same volume.

The shape of the silver halide grains is not particularly limited, and may be spherical, cubic, tabular (hexagonal tabular, triangular tabular, quadrangular tabular, etc.), octahedral, or tetradecahedral. can be of any shape.
In addition, regarding the use of metal compounds belonging to Group VIII and Group VIIB such as rhodium compounds and iridium compounds, and palladium compounds used for stabilizing or increasing the sensitivity of silver halide, see paragraph 0039 of JP-A-2009-188360. to paragraph 0042 can be referred to. Further, with regard to chemical sensitization, the technical description in paragraph 0043 of JP-A-2009-188360 can be referred to.

A first polymer that is contained in the silver halide-containing coating liquid and may be contained in the composition-adjusted coating liquid, and a first polymer that is contained in the composition-adjusted coating liquid and may be contained in the silver halide-containing coating liquid 2 Since the form of the polymer has already been explained, the explanation is omitted.
The silver halide-containing coating liquid and the composition-adjusted coating liquid may contain components other than the silver halide, the first polymer, and the second polymer, and those components are the silver halide-containing coating liquid. It is common to the liquid and the composition-adjusted coating liquid, and is as described below.

The silver halide-containing coating liquid and the composition-adjusting coating liquid may further contain gelatin.
The type of gelatin is not particularly limited. For example, in addition to lime-processed gelatin, acid-processed gelatin may be used. Gelatin (phthalated gelatin, acetylated gelatin) can also be used.

The silver halide-containing coating liquid and the composition-adjusting coating liquid may further contain a solvent. Examples of the solvent to be used include water, organic solvents (e.g., alcohols such as methanol, ketones such as acetone, amides such as formamide, sulfoxides such as dimethylsulfoxide, esters such as ethyl acetate, and ethers. etc.), ionic liquids, and mixed solvents thereof.

The silver halide-containing coating liquid and the composition-adjusting coating liquid may contain materials other than those mentioned above, if necessary. For example, it preferably includes a cross-linking agent used to cross-link the first polymer and second polymer described above. The inclusion of a cross-linking agent promotes cross-linking between polymers, and even when gelatin is decomposed and removed in the process described later, the linkage between metallic silver particles is maintained, resulting in more excellent conductive properties.

The method for simultaneous multilayer coating of the silver halide-containing coating liquid and the composition-adjusted coating liquid is not particularly limited, and known methods can be employed. For example, the die coating method is preferably used. The die coating method includes a slide coating method, an extrusion coating method, and a curtain coating method, but the slide coating method or the extrusion coating method is preferable, and the extrusion coating method, which is highly suitable for thin layer coating, is most preferable.

In the simultaneous multi-layer coating described above, the film (surface film) formed when coated on a predetermined substrate is easy to obtain the form of the first embodiment of the conductive film for touch panel described above. It is preferable to use a composition-adjusted coating liquid containing the second polymer having a composition such that the dry thickness of the coating is 300 nm or more.

Moreover, after carrying out the simultaneous multi-layer coating, the obtained coating film may be subjected to a drying treatment, if necessary. By carrying out the drying treatment, the solvent contained in the coating film obtained from the silver halide-containing coating liquid and the coating film obtained from the composition-adjusted coating liquid can be easily removed.

The processing described above can form a photosensitive layer containing silver halide on a flexible substrate. In this specification, the above-mentioned "photosensitive layer containing silver halide" may be referred to as "silver halide photosensitive layer" or simply "photosensitive layer".

<Process B>
Step B is a step of exposing the silver halide photosensitive layer and then developing it to form a conductive line containing metallic silver.
This step reduces the silver halide to form a conductive line containing metallic silver. Incidentally, the exposure treatment is usually carried out in a pattern, and a conductive line containing metallic silver is formed in the exposed portion. On the other hand, in the non-exposed areas, silver halide is eluted by the development treatment described later. A non-conductive line is formed comprising the gelatin described above and the polymer described above. A non-conductive line is substantially free of metallic silver, and by non-conductive line is intended an area that exhibits no electrical conductivity.
Below, the exposure processing and development processing performed in this step will be described in detail.

The exposure process is a process of exposing the photosensitive layer. By subjecting the photosensitive layer to patterned exposure, the silver halide in the photosensitive layer in the exposed areas forms a latent image. A region where the latent image is formed forms a conductive line by a development process to be described later. On the other hand, in the unexposed areas where no exposure has been made, the silver halide dissolves and flows out from the photosensitive layer during the later-described development processing, thereby obtaining a transparent film (non-conductive line).
The light source used for exposure is not particularly limited, and includes light such as visible light and ultraviolet rays, and radiation such as X-rays.
The pattern exposure method is not particularly limited. For example, surface exposure using a photomask or scanning exposure using a laser beam may be used. In addition, the shape of the pattern is not particularly limited, and is appropriately adjusted according to the pattern of the conductive line to be formed.

The method of development processing is not particularly limited, but, for example, common development processing techniques used for silver salt photographic films, photographic papers, films for printing plates, emulsion masks for photomasks, etc. can be used. can.
The type of developer used in the development processing is not particularly limited, but examples include PQ (phenidone hydroquinone) developer, MQ (Metol hydroquinone) developer, and MAA (methol ascorbic acid) developer. A liquid or the like can also be used.
The development process can include a fixing process which is carried out for the purpose of removing and stabilizing the silver salt in the unexposed areas. For the fixing process, a fixing process technique used for silver halide photographic films, photographic papers, films for printing plates, emulsion masks for photomasks, and the like can be used.
The fixing temperature in the fixing step is preferably about 20°C to about 50°C, more preferably 25°C to 45°C. The fixing time is preferably 5 seconds to 1 minute, more preferably 7 seconds to 50 seconds.
The photosensitive layer that has been developed and fixed is preferably washed with water and stabilized.

Other processes than the above-described process A and process B may be included.
Other processes include, for example,
After step B, step F of fusing the metallic silver of the conductive wire to each other;
After step A and before step B, the silver halide photosensitive layer is brought into contact with a compound having a metal-adsorbing substituent or metal-adsorbing structure (hereinafter also referred to as "specific compound"). Step C1 of causing;
Step C2 of contacting the conductive wire with the specific compound after step B and before step F;
after step B and before step F, further step D of consolidating the conductive line;
When at least one selected from the group consisting of a silver halide-containing coating solution and a composition-adjusting coating solution contains gelatin, after step B and before step D, step E of removing gelatin;
etc. Moreover, as another process, the easy-adhesion layer formation process etc. which are mentioned later are mentioned. Other steps will be described below.

(Process F)
Step F is a step, after step B, of fusing the metallic silver (contained in the conductive wire) of the conductive wire to each other. In this step, the metallic silver particles are fused to each other, and as a result, a detection portion having a conductive wire having superior conductivity can be obtained.

A heating method is not particularly limited, but includes a treatment of contacting a flexible substrate having conductive wires with superheated steam.
The superheated steam is not particularly limited, and may be superheated steam or a mixture of superheated steam and other gas.
The superheated steam is preferably brought into contact with the conductive wire for a supply time ranging from 10 to 300 seconds. When the supply time is 10 seconds or more, the conductivity is greatly improved. Further, when the time is 300 seconds or less, the electrical conductivity is sufficiently improved, which is more preferable from the economic point of view.
Also, the superheated steam is preferably brought into contact with the conductive wire in a supply amount of 500 to 600 g/m ³ , and the temperature of the superheated steam is preferably controlled to 100 to 160° C. at 1 atmospheric pressure.

Another method of heat treatment includes heat treatment at 80 to 150°C.
Although the heating time is not particularly limited, it is preferably 0.1 to 5.0 hours, more preferably 0.5 to 1.0 hours, in that the above effects are more excellent.

(Step C1)
Step C1 is performed after Step A and before Step B, and is a step of bringing the silver halide photosensitive layer into contact with a specific compound. This step makes it more difficult for the metallic silver particles generated in the subsequent step B to fuse together. In this step, since the specific compound is brought into contact with the silver halide photosensitive layer, it has the effect of making it difficult for metallic silver particles to fuse together in a region (interface region) closer to the surface of the silver halide photosensitive layer. . Therefore, particularly in the conductive wire obtained by the subsequent steps, the fusion between the metallic silver particles is more likely to be inhibited in the interface region. Moreover, even in this case, it is considered that the metallic silver is sufficiently fused in the intermediate region of the conductive wire, and a detection portion having excellent conductivity can be obtained.

The method for manufacturing the detection unit preferably includes step C1 or step C2 described later, and may include step C1 and step C2.

The method of bringing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but typically a solution in which the specific compound is dissolved and/or dispersed and the silver halide photosensitive layer are combined. A method of contacting is mentioned. Alternatively, a method of bringing a gas containing a specific compound into contact with the silver halide photosensitive layer may be used.

The method of bringing the solution containing the specific compound into contact with the silver halide photosensitive layer is not particularly limited, but the method of immersing the silver halide photosensitive layer in the solution and the method of contacting the silver halide photosensitive layer. A method of applying a solution to the layer is more preferred, and a method of immersing the silver halide photosensitive layer in the solution is more preferable. The method of immersing the silver halide photosensitive layer in the solution is preferable because it can be carried out more stably with a simpler apparatus, and excess solution can be more easily removed by washing after the immersion.

The method of contacting the silver halide photosensitive layer with a gas and/or solution containing a compound having a metal-adsorptive site is a method in which the silver halide is the above-mentioned compound on the surface of the silver halide photosensitive layer. It also has the characteristic of being easily adsorbed to. As a result, fusion of metallic silver to each other on the surface of the conductive wire is more likely to be hindered.

The specific compound is a compound having a metal-adsorbing substituent or a metal-adsorbing structure (hereinafter collectively referred to as "metal-adsorbing site").

The metal-adsorbing substituent is not particularly limited, but examples of the metal-adsorbing substituent include a carboxyl group or a salt thereof, an acid amide group, an amino group, an imidazole group, a pyrazole group, a thiol group, a thioether group, and at least one selected from the group consisting of disulfide groups.

The metal-adsorbing structure is not particularly limited, but is preferably a nitrogen-containing heterocycle, preferably a 5- or 6-membered ring azole, more preferably a 5-membered ring azole.
Nitrogen-containing heterocycles include, for example, tetrazole ring, triazole ring, imidazole ring, thiadiazole ring, oxadiazole ring, selenadiazole ring, oxazole ring, thiazole ring, benzoxazole ring, benzthiazole ring, benzimidazole ring, pyrimidine ring, triazaindene ring, tetraazaindene ring, benzoindazole ring, benzotriazole ring, benzoxazole ring, benzothiazole ring, pyridine ring, quinoline ring, piperidine ring, piperazine ring, quinoxaline ring, morpholine ring, and pentaaza An indene ring and the like are included.
These rings may have a substituent, which may be a nitro group, a halogen atom (e.g., chlorine atom and bromine atom), a cyano group, a substituted or unsubstituted alkyl group (e.g., methyl group, ethyl group, propyl group, t-butyl group, and cyanoethyl group), aryl group (e.g., phenyl group, 4-methanesulfonamidophenyl group, 4-methylphenyl group, 3,4-dichloro phenyl group and naphthyl group), alkenyl group (e.g., allyl group), aralkyl group (e.g., benzyl group, 4-methylbenzyl group, and phenethyl group), sulfonyl group (e.g., methane sulfonyl group, ethanesulfonyl group, and p-toluenesulfonyl group), carbamoyl group (e.g., unsubstituted carbamoyl group, methylcarbamoyl group, and phenylcarbamoyl group), sulfamoyl group (e.g., unsubstituted sulfamoyl group, methylsulfamoyl group, and phenylsulfamoyl group), carbonamide group (e.g., acetamide group and benzamide group), sulfonamide group (e.g., methanesulfonamide group, benzenesulfonamide group and p-toluenesulfonamide group), acyloxy group (e.g. acetyloxy group and benzoyloxy group), sulfonyloxy group (e.g. methanesulfonyloxy group), ureido groups (e.g., unsubstituted ureido groups, methylureido groups, ethylureido groups, and phenylureido groups), acyl groups (e.g., acetyl groups and benzoyl groups), oxycarbonyl groups (e.g., methoxycarbonyl group and phenoxycarbonyl group), hydroxyl group and the like. Multiple substituents may be substituted on one ring.

As the above-mentioned compounds, compounds having a nitrogen-containing 6-membered ring (nitrogen-containing 6-membered ring compounds) are preferable. , or a compound having a pyrazine ring is preferable, and a compound having a triazine ring or a pyrimidine ring is more preferable. These nitrogen-containing 6-membered ring compounds may have a substituent, and the substituents include an alkyl group having 1 to 6 carbon atoms (preferably 1 to 3), an alkyl group having 1 to 6 carbon atoms (preferably 1 to 3) alkoxy group, hydroxyl group, carboxyl group, mercapto group, alkoxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3), and hydroxyalkyl group having 1 to 6 carbon atoms (preferably 1 to 3) mentioned.
Specific examples of nitrogen-containing 6-membered ring compounds include triazine, methyltriazine, dimethyltriazine, hydroxyethyltriazine, pyrimidine, 4-methylpyrimidine, pyridine and pyrroline.

The above-mentioned compound may have one type of metal-adsorbing site alone or may have two or more types, but the above-mentioned compound has two or more types of metal-adsorbing sites. is preferred.

(Step C2)
Step C2 is a step that is performed after step B and before step F to bring the conductive wire into contact with the specific compound. This step makes it more difficult for the metal silver particles of the conductive wire (contained in the conductive wire) to fuse together. In this step, since the specific compound is brought into contact with the conductive wire, there is an effect that metallic silver particles are less likely to fuse together in a region (interface region) closer to the surface of the conductive wire. Therefore, fusion bonding between metallic silver particles is more likely to be hindered in the interface region of the conductive wire. Moreover, even in this case, it is considered that the metallic silver is sufficiently fused in the intermediate region of the conductive wire, and a detection portion having excellent conductivity can be obtained.

In this step, the method of bringing the conductive wire into contact with the specific compound, the form of the specific compound, and the like are the same as those in Step C1 already described, and thus description thereof is omitted.

(Process D)
Step D is the step of consolidating the conductive lines after step B and before step F described above. By this step, the conductivity of the conductive wire is further improved, and the adhesion of the conductive wire to the flexible substrate is more likely to be improved.

Although the method for consolidating the conductive wires is not particularly limited, for example, a calendering step in which the flexible substrate having the conductive wires is passed between at least a pair of rolls under pressure is preferred. The consolidation treatment using calender rolls is hereinafter referred to as calendering.

Rolls used for calendering include plastic rolls and metal rolls. A plastic roll is preferable from the point of wrinkle prevention. The pressure between rolls is not particularly limited. The pressure between the rolls can be measured using Prescale (for high pressure) manufactured by FUJIFILM Corporation.
The surface roughness Ra of the roll used for calendering is preferably from 0 to 2.0 μm, more preferably from 0.3 to 1.0 μm, in that the resulting conductive wire is less visible.

The temperature of the consolidation treatment is not particularly limited, but is preferably 10° C. (no temperature control) to 100° C., and varies depending on the image line density, shape, and binder type of the conductive line pattern, but is 10° C. ( No temperature control) to 50°C is more preferable.

(Process E)
When at least one selected from the group consisting of silver halide-containing coating liquids and composition-adjusting coating liquids contains gelatin, step E is performed after step B and before step D. This is the step of removing the gelatin from the conductive line (contained in the conductive line). Removal of the gelatin results in a conductive line with better electrical conductivity due to the relatively high content of metallic silver in the conductive line.
Step E may be a step of removing all of the gelatin or a step of removing a portion of the gelatin. Also, in step E, in addition to the conductive lines, the gelatin may be removed from portions other than the conductive lines (eg, non-conductive lines) on the flexible substrate.

The method for removing gelatin is not particularly limited, but examples thereof include a method of decomposing and removing using a protease and a method of decomposing and removing using a predetermined oxidizing agent.
As a method for decomposing and removing gelatin using a proteolytic enzyme, for example, the method described in paragraphs 0084 to 0077 of JP-A-2014-209332 can be employed.
As a method for decomposing and removing gelatin using an oxidizing agent, for example, the method described in paragraphs 0064 to 0066 of JP-A-2014-112512 can be employed.

(Easy adhesion layer forming step)
In the easy-adhesion layer forming step, before step A, an easy-adhesion layer (hereinafter also referred to as an "undercoat layer") is formed on the flexible substrate, and a flexible substrate with an easy-adhesion layer (undercoat layer) is formed. This is the process of obtaining the material. The method for forming the undercoat layer on the flexible substrate is not particularly limited, but examples thereof include a method of applying an undercoat layer-forming composition onto the flexible substrate. In the undercoat layer forming step, the absolute value of the refractive index difference between the formed undercoat layer and other adjacent layers (flexible substrate, non-conductive wire, etc.) is smaller. preferably adjusted. The method for adjusting the difference in refractive index between the undercoat layer and other adjacent layers is not particularly limited, but the type of each component contained in the composition used to form each layer is adjusted. method.

The method for forming the easy-adhesion layer is not particularly limited, but includes a method of applying the composition for forming an easy-adhesion layer onto a flexible base material and, if necessary, heat-treating it. The easily adhesive layer-forming composition may contain a solvent. The type of solvent is not particularly limited, and is as already described as the solvent that may be contained in the silver halide-containing coating liquid.
Although the thickness of the easy-adhesion layer is not particularly limited, it is 0.02 to 0.3 μm in terms of further improving the adhesion between the flexible substrate, the silver halide photosensitive layer and the conductive wire. preferable.
The easy-adhesion layer is not particularly limited, and for example, suitable application examples of the first adhesion layer described in Japanese Patent Laid-Open No. 2008-208310 can be suitably used.

<Another manufacturing method of the detection part>
The method of manufacturing the fine metal wires that constitute the detection section and the extraction wiring section is not particularly limited to the above-described methods, and for example, plating, vapor deposition, printing, and the like can be used as appropriate.

A method for forming thin metal wires by plating will be described. For example, the fine metal wire can be composed of a metal plating film formed on the underlying layer by electroless plating on the underlying layer. In this case, after patterning a catalyst ink containing at least metal fine particles on a base material, the base material is immersed in an electroless plating bath to form a metal plating film. More specifically, the method for producing a metal coated base material described in JP-A-2014-159620 can be used. Also, after forming a pattern of a resin composition having a functional group capable of interacting with at least a metal catalyst precursor on a substrate, a catalyst or catalyst precursor is applied, and the substrate is immersed in an electroless plating bath. , are formed by forming a metal plating film. More specifically, the method for producing a metal coating substrate described in JP-A-2012-144761 can be applied.

Also, a method for forming thin metal wires by vapor deposition will be described. First, a thin metal wire can be formed by forming a copper foil layer by vapor deposition and forming copper wiring from the copper foil layer by photolithography. As for the copper foil layer, electrolytic copper foil can be used in addition to vapor-deposited copper foil. More specifically, the process of forming a copper wiring described in JP-A-2014-29614 can be used.
Also, a method for forming thin metal wires by printing will be described. First, a conductive paste containing conductive powder is applied to a substrate in the same pattern as the fine metal wires, and then heat treatment is performed to form the fine metal wires. Pattern formation using a conductive paste is performed by, for example, an inkjet method or a screen printing method. As the conductive paste, more specifically, the conductive paste described in JP-A-2011-28985 can be used.
Furthermore, a nanoimprint method can also be used to form metal fine wires. In this case, silver thin wires are formed by nanoimprinting, for example, as the metal thin wires.
Alternatively, a fine metal wire can be formed by combining screen printing and etching using a laser.

<First Transparent Insulating Layer and Second Transparent Insulating Layer>
The first transparent insulating layer and the second transparent insulating layer are optically transparent resins (OCR, Optical Clear Resin).
The first transparent insulating layer and the second transparent insulating layer preferably have a gas permeability of 10 ⁻² g/m ² /day or less to sulfur gas (hydrogen sulfide gas) using a gas chromatography method. In the present invention, a GC-FPD (Gas Chromatograph-Flame Photometric Detector) method is used as the gas chromatography method.
The first transparent insulating layer and the second transparent insulating layer are formed on the front and back surfaces of the flexible base material so as to cover the area without the detection section and the lead-out wiring section and the detection section and the lead-out wiring section. can be placed in In this case, the first transparent insulating layer and the second transparent insulating layer are transparent and electrically insulating, and have the function of protecting the detection section and the extraction wiring section. The first transparent insulating layer and the second transparent insulating layer have sufficiently low conductivity. The first transparent insulating layer and the second transparent insulating layer make the detection section and the extraction wiring section sufficiently low in conductivity between the thin metal wires and in conductivity with other members. Also, electrical connection with other members is suppressed, and short circuits and the like are prevented.
Even if the first transparent insulating layer and the second transparent insulating layer are arranged so that a part of the detection part and the extraction wiring part is exposed, that is, a part of the detection part and the extraction wiring part is not covered. good. The first transparent insulating layer and the second transparent insulating layer can use an optically transparent adhesive and an optically transparent resin as described above, but are not limited thereto. can be used. Hereinafter, the first transparent insulating layer and the second transparent insulating layer are collectively referred to simply as a transparent insulating layer.
Note that the same transparent insulating layer is preferably arranged in both the input area _E1 and the outer area _E2 , since the transparent insulating layer can be formed by a single coating process.

As the transparent insulating layer, a transparent insulating layer into which a crosslinked structure is introduced and whose indentation hardness is adjusted within a predetermined range can be used.
It is presumed that the cracks and disconnections of the fine metal wires are caused by the stress associated with the bending of the conductive film, including the storage environmental conditions. Therefore, by laying a transparent insulating layer on the surface of the fine metal wire, which has a function of relieving the stress and reinforcing the strength of the fine metal wire, cracking and disconnection of the fine metal wire can be prevented. Specifically, in order to provide the transparent insulating layer with a function of reinforcing strength, a crosslinked structure is introduced into the transparent insulating layer to maintain the superior rigidity of the transparent insulating layer. In addition, the indentation hardness of the transparent insulating layer is adjusted within a predetermined range so that the thin metal wire does not break due to cracks in the transparent insulating layer caused by bending.

The indentation hardness of the transparent insulating layer is 200 MPa or less, preferably 150 MPa or less, and more preferably 130 MPa or less. Although the lower limit is not particularly limited, it is preferably 10 MPa or more. When the indentation hardness is 200 MPa or less, the desired effects are likely to be obtained.
The indentation hardness of the transparent insulating layer can be measured with a microhardness tester (Picodenter).
In order for the transparent insulating layer to exhibit the indentation hardness described above, it is preferable that the main chain structure of the resin constituting the transparent insulating layer is a soft structure, or that the distance between cross-linking points is long.

The elastic modulus of the transparent insulating layer at 50 to 90° C. is preferably 1×10 ⁵ Pa or more, more preferably 1×10 ⁶ to 1×10 ¹⁰ MPa. When the flexible base material thermally expands, the thin metal wire formed on the flexible base material and having a lower coefficient of expansion than the flexible base material also extends, which may cause disconnection of the thin metal wire. On the other hand, if the elastic modulus of the transparent insulating layer at 50 to 90° C. is within the above range, the transparent insulating layer can be hard and stretched even when the conductive film is used in a folded state in a high-temperature and high-humidity environment. It is hard to crack and disconnect the fine metal wire.
In addition, the elastic modulus of the transparent insulating layer at a temperature of 85° C. and a relative humidity of 85% is preferably 1×10 ⁵ Pa or more, more preferably 1×10 ⁶ Pa or more, and 1.5×10 It is more preferably ⁶ Pa or more. Although the upper limit is not particularly limited, it is often 1×10 ¹⁰ MPa or less. If the elastic modulus is within the above range, even if the conductive film is used in a folded state in a high-temperature and high-humidity environment, cracking and disconnection of the fine metal wires are less likely to occur.
The elastic modulus of the transparent insulating layer can be measured with a microhardness tester (Picodenter) under a predetermined measurement environment, for example, a temperature of 85° C. and a relative humidity of 85%.

Although the coefficient of linear expansion of the transparent insulating layer is not particularly limited, it is preferably 1 to 500 ppm/°C, more preferably 5 to 200 ppm/°C, and even more preferably 5 to 150 ppm/°C. If the coefficient of linear expansion of the transparent insulating layer is within the above range, even if the conductive film is used in a bent state in a high-temperature and high-humidity environment, cracking and disconnection of the fine metal wires are less likely to occur.
The coefficient of linear expansion of the transparent insulating layer can be calculated from the following two equations by measuring the curl value (radius of curvature of curl) when a measurement sample made of the transparent insulating layer is heated.
Formula 1: (linear expansion coefficient of transparent insulating layer - linear expansion coefficient of flexible substrate) x temperature difference = strain of measurement sample Formula 2: strain of measurement sample = {(elastic modulus of flexible substrate x ( Thickness of flexible substrate) ² }/{3×(1−Poisson’s ratio of flexible substrate)×modulus of elasticity of transparent insulating layer×curvature radius of curl}
Note that the difference between the coefficient of linear expansion of the transparent insulating layer and the coefficient of linear expansion of the flexible substrate is preferably small in order to further suppress disconnection of the thin metal wires, and the upper limit is a difference of 300 ppm/° C. or less. It is preferably 150 ppm/°C or less, more preferably 150 ppm/°C or less. Although the lower limit is not particularly limited, it may be 0 ppm/°C.

The thickness of the transparent insulating layer is not particularly limited, but if the thickness is too large, the transparent insulating layer is likely to crack when bent. It is preferably 1 to 20 μm, more preferably 5 to 15 μm, from the viewpoints of suppressing cracks, providing better adhesion between the detecting portion and the extraction wiring portion, and better film strength.

The transparent insulating layer has the property of transmitting light as described above.
The total light transmittance of the conductive film including the transparent insulating layer is preferably 85% or more, more preferably 90% or more, in the visible light region (wavelength: 400 to 700 nm).
The total light transmittance described above is measured by a spectrophotometer CM-3600A (manufactured by Konica Minolta, Inc.).
The total light transmittance of the transparent insulating layer itself is preferably adjusted so that the conductive film exhibits the above-mentioned total light transmittance, and is preferably at least 85% or more.

The transparent insulating layer preferably has excellent adhesion to the detection section and the extraction wiring section. Specifically, it is more preferred that there is no peeling in a tape adhesion strength evaluation test by 3M "610".
In addition, since the transparent insulating layer is in contact with not only the detection section and the extraction wiring section but also the area of the flexible base material (or the undercoat layer or the binder layer) where the detection section and the extraction wiring section are not formed, it is flexible. It is preferable that the adhesiveness to the adhesive substrate (or undercoat layer or binder layer) is excellent. The binder layer is a layer made of a binder and placed between the fine metal wires on the flexible substrate, and is often formed when the fine metal wires are produced by the silver halide method.
As described above, when the adhesion between the transparent insulating layer, the flexible base material, the detection section, and the extraction wiring section is high, cracking and disconnection of the thin metal wires can be further suppressed.

From the viewpoint of suppressing surface reflection of the conductive film, it is preferable that the refractive index difference between the transparent insulating layer and the flexible substrate is as small as possible.
Further, when a binder component is contained in the fine metal wires of the detection section and the extraction wiring section, the smaller the difference in refractive index between the refractive index of the transparent insulating layer and the refractive index of the binder component described above, the better. More preferably, the resin component forming the layer and the binder component described above are the same material.
The resin component forming the transparent insulating layer and the binder component described above are the same material, which means that both the binder component and the resin component forming the transparent insulating layer may be a (meth)acrylic resin. As an example.

Furthermore, when a touch panel is configured using a conductive film as described above, an optically transparent adhesive sheet or adhesive layer may be attached to the transparent insulating layer of the conductive film. In order to suppress light scattering at the interface between the transparent insulating layer and the optically transparent adhesive sheet or adhesive layer, the refractive index of the transparent insulating layer and the refractive index of the optically transparent adhesive sheet or the refractive index of the adhesive layer The smaller the difference in refractive index from the index, the better.

The transparent insulating layer includes a crosslinked structure. Since the crosslinked structure is included, even when the conductive film is used in a folded state in a high-temperature and high-humidity environment, disconnection of the thin metal wire is less likely to occur.
In order to form a crosslinked structure, it is preferable to form a transparent insulating layer using a polyfunctional compound, as described later.

Materials constituting the transparent insulating layer are not particularly limited as long as a layer exhibiting the properties described above can be obtained.
Among them, a layer formed using a composition for forming a transparent insulating layer containing a polymerizable compound having a polymerizable group is preferable because the properties of the transparent insulating layer can be easily controlled.
Below, the aspect using the composition for transparent insulating layer formation is explained in full detail.

(Method for forming transparent insulating layer)
A method for forming a transparent insulating layer using the composition for forming a transparent insulating layer is not particularly limited. For example, a method of forming a transparent insulating layer by applying a composition for forming a transparent insulating layer onto a flexible base material, a detecting portion, and a lead-out wiring portion, and subjecting the coating film to a curing treatment as necessary (coating method ), or a method (transfer method) of forming a transparent insulating layer on a temporary substrate and transferring it to the surface of the detection section and the lead-out wiring section. Among them, the coating method is preferable from the viewpoint of easy control of the thickness.

In the case of the coating method, the method of coating the transparent insulating layer-forming composition on the flexible base material, the detection section and the extraction wiring section is not particularly limited, and known methods (e.g., gravure coater, comma coater, bar A coating method such as a coater, a knife coater, a die coater or a roll coater, an inkjet method, or a screen printing method, etc.) can be used.

From the viewpoint of ease of handling and production efficiency, the composition for forming a transparent insulating layer is applied onto the flexible base material, the detection section, and the lead-out wiring section, and dried as necessary to remove the remaining solvent. Therefore, it is preferable to form a coating film.
Although the conditions for the drying treatment are not particularly limited, it is preferable to carry out the drying treatment at room temperature to 220° C. (preferably 50 to 120° C.) for 1 to 30 minutes (preferably 1 to 10 minutes) in terms of better productivity. .
From the viewpoint of productivity, it is preferable that the composition for forming a transparent insulating layer does not contain a solvent component and does not require a drying step.

In the case of the coating method, the curing treatment may be either photocuring treatment or heat curing treatment. Among these, photocuring treatment is preferable from the viewpoint of reducing damage to the flexible substrate and shortening the tact time.
Although the method of exposure is not particularly limited, examples thereof include a method of irradiating actinic rays or radiation. As the irradiation with actinic rays, a UV (ultraviolet) lamp, light irradiation with visible light, or the like is used. Examples of light sources include mercury lamps, metal halide lamps, xenon lamps, chemical lamps, and carbon arc lamps. Examples of radiation include electron beams, X-rays, ion beams, and far infrared rays.
By exposing the coating film to light, the polymerizable groups contained in the compounds in the coating film are activated, cross-linking occurs between the compounds, and curing of the layer proceeds. The exposure energy is about 10 to 8000 mJ/cm ² , preferably 50 to 3000 mJ/cm ² .

The composition for forming a transparent insulating layer contains a polymerizable compound having a polymerizable group. The number of polymerizable groups contained in the polymerizable compound is not particularly limited, and may be one or more. Among them, it is preferable to use a polymerizable compound having two or more polymerizable groups in that a crosslinked structure can be formed in the transparent insulating layer.
The type of the polymerizable group is not particularly limited, and examples thereof include radically polymerizable groups such as (meth)acryloyl groups, vinyl groups and allyl groups, and cationic polymerizable groups such as epoxy groups and oxetane groups. Among them, from the viewpoint of reactivity, a radically polymerizable group is preferred, and a (meth)acryloyl group is more preferred.
The polymerizable compound may be in any form selected from monomers, oligomers and polymers. That is, the polymerizable compound may be an oligomer having a polymerizable group or a polymer having a polymerizable group.
A compound having a molecular weight of less than 1,000 is preferable as the monomer.
Oligomers and polymers are polymers in which a finite number (generally 5 to 100) of monomers are linked together. An oligomer is a compound having a weight average molecular weight of 3000 or less, and a polymer is a compound having a weight average molecular weight of more than 3000.
The polymerizable compound may be used singly or in combination.

Preferred aspects of the composition for forming a transparent insulating layer include a polymerizable compound (polyfunctional compound) having two or more polymerizable groups, and at least one of a urethane (meth)acrylate compound and an epoxy (meth)acrylate compound. aspects.
A urethane (meth)acrylate compound having two or more polymerizable groups corresponds to the urethane (meth)acrylate compound described above and is not included in the polyfunctional compound. An epoxy (meth)acrylate compound having two or more polymerizable groups corresponds to the epoxy (meth)acrylate compound described above and is not included in the polyfunctional compound.

The polyfunctional compound may have two or more polymerizable groups, preferably a compound having two or more (meth)acryloyl groups.
Specifically, bifunctional (meth)acrylates include, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, glycerin di(meth)acrylate, neopentyl glycol di(meth)acrylate acrylates, 3-methyl-1,5-pentanediol di(meth)acrylate, 2-butyl-2-ethyl-1,3-propane di(meth)acrylate, dimethyloltricyclodecane di(meth)acrylate, propylene glycol di(meth)acrylate ) acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, tetrapropylene glycol di(meth)acrylate, neopentyl glycol hydroxypivalate di(meth)acrylate, 1,3-butanediol di(meth)acrylate ) acrylate, dimethyloldicyclopentane diacrylate, hexamethylene glycol diacrylate, hexaethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, 2,2'-bis(4-acryloxydiethoxyphenyl)propane, bisphenol A tetraethylene glycol diacrylate, and the like.

Trifunctional (meth)acrylates include, for example, trimethylolpropane tri(meth)acrylate, ethylene oxide-modified trimethylolpropane tri(meth)acrylate, propylene oxide-modified trimethylolpropane tri(meth)acrylate, tris(acryloxyethyl ) isocyanurate, caprolactone-modified tris(acryloxyethyl) isocyanurate, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, alkyl-modified dipentaerythritol tri(meth)acrylate, tetramethylolmethane tri(meth) acrylates, ethylene oxide-modified glycerol triacrylate, propylene oxide-modified glycerol triacrylate, ε-caprolactone-modified trimethylolpropane triacrylate, and pentaerythritol triacrylate.

Tetrafunctional (meth)acrylates include, for example, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol ethoxytetra(meth)acrylate, and pentaerythritol tetra(meth)acrylate.

Penta- or higher-functional (meth)acrylate compounds include, for example, dipentaerythritol penta(meth)acrylate, alkyl-modified dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, caprolactone-modified dipentaerythritol hexa( meth)acrylates, polypentaerythritol polyacrylates, and the like.

The content of the polyfunctional compound in the composition for forming a transparent insulating layer is not particularly limited, but from the point of view that the effect of the present invention is more excellent, it is 0 to 50 with respect to the total solid content in the composition for forming a transparent insulating layer. % by mass is preferable, and 20 to 45% by mass is more preferable.

More specifically, the urethane (meth)acrylate compound contains two or more photopolymerizable groups selected from the group consisting of an acryloyloxy group, an acryloyl group, a methacryloyloxy group, and a methacryloyl group in one molecule, and a urethane bond is preferably a compound containing one or more in one molecule. Such compounds can be produced, for example, by a urethanization reaction between an isocyanate and a hydroxy group-containing (meth)acrylate compound. The urethane (meth)acrylate compound may be a so-called oligomer or polymer.
The above photopolymerizable groups are radically polymerizable groups. A polyfunctional urethane (meth)acrylate compound containing two or more photopolymerizable groups in one molecule is useful for forming a highly rigid transparent insulating layer.
The number of photopolymerizable groups contained in one molecule of the urethane (meth)acrylate compound is preferably at least 2, more preferably 2 to 10, and even more preferably 2 to 6. Two or more photopolymerizable groups contained in the urethane (meth)acrylate compound may be the same or different.
As the photopolymerizable group, an acryloyloxy group or a methacryloyloxy group is preferred.

The number of urethane bonds contained in one molecule of the urethane (meth)acrylate compound may be 1 or more, and is preferably 2 or more, for example, 2, in that the hardness of the transparent insulating layer to be formed becomes higher. ~5 is more preferred.
In addition, in the urethane (meth)acrylate compound containing two urethane bonds in one molecule, the photopolymerizable group may be bonded only to one urethane bond directly or via a linking group. Each may be bonded directly or via a linking group.
In one aspect, it is preferable that one or more photopolymerizable groups are bonded to each of two urethane bonds bonded via a linking group.

As described above, in the urethane (meth)acrylate compound, the urethane bond and the photopolymerizable group may be directly bonded, or a linking group may be present between the urethane bond and the photopolymerizable group. . The linking group is not particularly limited, and examples thereof include linear or branched saturated or unsaturated hydrocarbon groups, cyclic groups, groups consisting of two or more of these groups, and the like. The number of carbon atoms in the above hydrocarbon group is, for example, about 2 to 20, but is not particularly limited. Examples of the cyclic structure included in the cyclic group include an aliphatic ring (cyclohexane ring, etc.), an aromatic ring (benzene ring, naphthalene ring, etc.), and the like. The above groups may be unsubstituted or substituted.
In this specification, unless otherwise specified, the groups described may have a substituent or may be unsubstituted. When a certain group has a substituent, the substituent may be an alkyl group (eg, an alkyl group having 1 to 6 carbon atoms), a hydroxy group, an alkoxyl group (eg, an alkoxyl group having 1 to 6 carbon atoms), a halogen atom ( For example, a fluorine atom, a chlorine atom, a bromine atom), a cyano group, an amino group, a nitro group, an acyl group, a carboxyl group, and the like can be mentioned.

The urethane (meth)acrylate compound described above can be synthesized by a known method. Moreover, it is also possible to obtain as a commercial item.
An example of the synthesis method includes, for example, a method of reacting an alcohol, a polyol, and/or a hydroxyl group-containing compound such as a hydroxyl group-containing (meth)acrylate with an isocyanate. Moreover, the method of esterifying the urethane compound obtained by the above-mentioned reaction with (meth)acrylic acid can be mentioned as needed. In addition, (meth)acrylic acid shall be used in the meaning including acrylic acid and methacrylic acid.

Examples of the above-mentioned isocyanates include aromatic, aliphatic, and alicyclic polyisocyanates such as tolylene diisocyanate, diphenylmethane diisocyanate, hydrogenated diphenylmethane diisocyanate, polyphenylmethane polyisocyanate, modified diphenylmethane diisocyanate, hydrogenated xylylene diisocyanate, xylylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, tetramethylxylylene diisocyanate, isophorone diisocyanate, norbornene diisocyanate, 1,3-bis(isocyanatomethyl)cyclohexane, phenylene diisocyanate, lysine diisocyanate, lysine triisocyanate, naphthalene diisocyanate, and the like. These may be used alone or in combination of two or more.

Examples of the above-mentioned hydroxy group-containing (meth)acrylates include 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-hydroxybutyl acrylate, 4-hydroxybutyl acrylate, 2-hydroxyethyl acryloyl phosphate, 2-acryloyloxy Ethyl-2-hydroxypropyl phthalate, glycerin diacrylate, 2-hydroxy-3-acryloyloxypropyl acrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, caprolactone-modified 2-hydroxyethyl acrylate, and cyclohexanedimethanol monoacrylate etc. These may be used alone or in combination of two or more.

Examples of commercially available urethane (meth)acrylate compounds include, but are not limited to the following, UA-306H, UA-306I, UA-306T, UA-510H, UF-8001G manufactured by Kyoeisha Chemical Co., Ltd., UA-101I, UA-101T, AT-600, AH-600, AI-600, Shin-Nakamura Chemical U-4HA, U-6HA, U-6LPA, UA-32P, U-15HA, UA-1100H, Japan Synthetic Chemical Industry Co., Ltd. Shiko UV-1400B, UV-1700B, UV-6300B, UV-7550B, UV-7600B, UV-7605B, UV-7610B, UV-7620EA, UV-7630B, Same UV-7640B, Same UV-6630B, Same UV-7000B, Same UV-7510B, Same UV-7461TE, Same UV-3000B, Same UV-3200B, Same UV-3210EA, Same UV-3310EA, Same UV-3310B, The same UV-3500BA, the same UV-3520TL, the same UV-3700B, the same UV-6100B, the same UV-6640B, the same UV-2000B, the same UV-2010B, and the same UV-2250EA can be mentioned. In addition, Shiko UV-2750B manufactured by Nippon Synthetic Chemical Industry Co., Ltd., UL-503LN manufactured by Kyoeisha Chemical Co., Ltd., Unidic 17-806, 17-813, V-4030, V-4000BA manufactured by Dainippon Ink and Chemicals, Daicel EB-1290K manufactured by UCB, Hi-Corp AU-2010 and AU-2020 manufactured by Tokushiki are also included.
Hexafunctional or higher urethane (meth)acrylate compounds include, for example, Artresin UN-3320HA, Artresin UN-3320HC, Artresin UN-3320HS, Artresin UN-904, Nippon Synthetic Chemical ( Ltd. manufactured by Shikou UV-1700B, Shikou UV-7605B, Shikoh UV-7610B, Shikoh UV-7630B, Shikou UV-7640B, Shin-Nakamura Chemical Co., Ltd. NK Oligo U-6PA, NK Oligo U-10HA, NK oligo U-10PA, NK oligo U-1100H, NK oligo U-15HA, NK oligo U-53H, NK oligo U-33H, Daicel Cytec Co., Ltd. KRM8452, EBECRYL1290, KRM8200, EBECRYL5129, KRM8904, Nippon Kayaku UX-5000 manufactured by Yaku Co., Ltd. and the like can be mentioned.
Examples of di- or tri-functional urethane (meth)acrylate compounds include Natoco UV Self-Healing manufactured by Nagase Co., Ltd., EXP DX-40 manufactured by DIC Corporation, and the like.

The molecular weight (weight average molecular weight Mw) of the urethane (meth)acrylate compound described above is preferably in the range of 300 to 10,000. If the molecular weight is within this range, a transparent insulating layer with excellent flexibility and surface hardness can be obtained.

Further, the epoxy (meth)acrylate compound refers to those obtained by an addition reaction between polyglycidyl ether and (meth)acrylic acid, and often has at least two (meth)acryloyl groups in the molecule. .

The total content of the urethane (meth)acrylate compound and the epoxy (meth)acrylate compound in the composition for forming a transparent insulating layer is not particularly limited, but the effect of the present invention is more excellent. 10 to 70% by mass, more preferably 30 to 65% by mass, based on the total solid content.

The composition for forming a transparent insulating layer may further contain a monofunctional monomer, and preferably contains a monofunctional (meth)acrylate. A monofunctional monomer functions as a diluent monomer for controlling the crosslink density in the transparent insulating layer.
Monofunctional (meth)acrylates include, for example, butyl (meth)acrylate, amyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, nonyl (meth)acrylate, dodecyl (meth)acrylate, lauryl Long-chain alkyl (meth)acrylates such as (meth)acrylate, hexadecyl (meth)acrylate, octadecyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxyethyl (meth)acrylate ) acrylate, tetrahydrofurfuryl (meth)acrylate, nonylphenoxyethyl tetrahydrofurfuryl (meth)acrylate, caprolactone-modified tetrafurfuryl (meth)acrylate, isobornyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (Meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, ethylene oxide-modified nonylphenol (meth) acrylate, propylene oxide-modified nonylphenol (meth) acrylate, 2-ethylhexylcarbitol (meth) acrylate, etc. having a cyclic structure ( meth)acrylate, glycidyl (meth)acrylate, methoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-chloro-2-hydroxypropyl (Meth)acrylate, dimethylaminoethyl (meth)acrylate, 2-(meth)acryloyloxyethyl acid phosphate, and diethylaminoethyl (meth)acrylate, isomyristyl (meth)acrylate, isostearyl (meth)acrylate , 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, isobornyl (meth)acrylate, and esters of (meth)acrylic acid and polyhydric alcohols.

Although the content of the monofunctional monomer in the composition for forming a transparent insulating layer is not particularly limited, it is 0 to 40 based on the total solid content in the composition for forming a transparent insulating layer, in that the effect of the present invention is more excellent. % by mass is preferred, and 0 to 20% by mass is more preferred.

The composition for forming a transparent insulating layer may further contain a polymerization initiator. The polymerization initiator may be either a photopolymerization initiator or a thermal polymerization initiator, but is preferably a photopolymerization initiator.
The type of photopolymerization initiator is not particularly limited, and known photopolymerization initiators (radical photopolymerization initiator, cationic photopolymerization initiator) can be used. For example, acetophenone, 2,2-diethoxyacetophenone, p-dimethylacetophenone, p-dimethylaminopropiophenone, benzophenone, 2-chlorobenzophenone, benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, 2, 2-dimethoxy-1,2-diphenylethan-1-one, 1-cyclohexylphenylketone, 1-hydroxy-cyclohexyl-phenylketone, 2-hydroxy-2-methyl-1-phenyl-propan-1-one, 1- [4-(2-hydroxyethoxy)-phenyl]-2-hydroxy-2-methyl-1-propan-1-one, oligo(2-hydroxy-2-methyl-1-(4-(1-methylvinyl) phenyl)propanone), 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methyl-propan-1-one, 2-methyl-1 -[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, bis(2,4,6 -trimethylbenzoyl)-phenylphosphine oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, ethyl-(2, 4,6-trimethylbenzoyl)phenylphosphinate, 1,2-octanedione, 1-[4-(phenylthio)-,2-(O-benzoyloxime)], methylbenzoylformate, 4-methylbenzophenone, 4 -phenylbenzophenone, 2,4,6-trimethylbenzophenone, 4-benzoyl-4'-methyldiphenylsulfide, 1-[4-(4-benzoylphenylsulfanyl)phenyl]-2-methyl-2-(4- carbonyl compounds such as methylphenylsulfonyl)propan-1-one; and sulfur compounds such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone and tetramethylthiuram disulfide. A polymerization initiator can be used individually by 1 type or in combination of 2 or more types.

The content of the polymerization initiator in the composition for forming a transparent insulating layer is not particularly limited, but from the viewpoint of curability, it is 0.1 to 10% by mass based on the total solid content in the composition for forming a transparent insulating layer. and more preferably 2 to 5% by mass. When two or more polymerization initiators are used, the total content of the polymerization initiators is preferably within the above range.

In addition to the above, the composition for forming a transparent insulating layer may contain the above-mentioned metal stabilizer, leveling agent, surface lubricant, antioxidant, corrosion inhibitor, light stabilizer, ultraviolet absorber, polymerization inhibitor, silane Various conventionally known additives such as coupling agents, inorganic or organic fillers, metal powders, powders such as pigments, particulates, or foils can be appropriately added depending on the application. . For details thereof, for example, paragraphs 0032 to 0034 of JP-A-2012-229412 can be referred to. However, not limited to these, various additives generally used in photopolymerizable compositions can be used. Moreover, the amount of additive added to the composition for forming a transparent insulating layer may be appropriately adjusted, and is not particularly limited.
As the leveling agent, any known leveling agent can be used as long as it has an effect of imparting wettability to an object to which the composition for forming a transparent insulating layer is applied and an effect of lowering surface tension. Examples include silicone-modified resins, fluorine-modified resins, and alkyl-modified resins.

Although the composition for forming a transparent insulating layer may contain a solvent from the viewpoint of handling, it should be solvent-free from the viewpoint of suppressing VOCs (volatile organic compounds) and reducing the tact time. is preferred.
In addition, when the composition for forming a transparent insulating layer contains a solvent, the solvent that can be used is not particularly limited, and examples thereof include water and organic solvents.

The conductive film may be used in the form of a laminate having a conductive film, an adhesive sheet, and a release sheet in this order during handling and transportation. The release sheet functions as a protective sheet for preventing the conductive film from being damaged during transportation of the touch panel laminate. In such a mode, when using the conductive film, the release sheet can be peeled off and the conductive film can be used by sticking it to a predetermined position.
Also, the conductive film may be handled in the form of a composite having, for example, a conductive film, an adhesive sheet, and a protective layer in this order. Even in such a mode, it is possible to prevent the conductive film from being scratched or the like.

<Insulating film>
It is preferable to have an insulating film covering at least a part of the extraction wiring portion of the conductive film.
The insulating film is not particularly limited, but is preferably a UV (Ultra Violet) curable insulating resin applied and cured by UV light, or a thermosetting insulating resin applied and cured by heat, particularly UV curable. Preferably, an insulating resin is applied and cured by UV light. The width of the insulating film is preferably a width sufficient to cover the extraction wiring portion 22 . Although the upper limit is not particularly limited, it is preferably 1 cm or less, more preferably 6 mm or less. The thickness of the insulating film is preferably 3 to 30 μm, more preferably 5 to 20 μm, even more preferably 7 to 15 μm.

<Protrusion>
The projecting portion is composed of the extraction wiring portion and the insulating film as described above.
The width of the protruding portion is the same as the width of the insulating film, and is preferably a width that sufficiently covers the extraction wiring portion 22. Although the upper limit is not particularly limited, it is, for example, 1 cm or less, and more preferably 6 mm or less. preferable.
The thickness of the protrusion is preferably 3 to 30 μm, more preferably 5 to 20 μm, even more preferably 7 to 15 μm.

<Protective film>
The protective film is not particularly limited as long as it is an electrically insulating material. As with the first transparent insulating layer and the second transparent insulating layer, the protective film has a gas permeability of sulfur gas (hydrogen sulfide gas) of 10 ⁻² g/m ² /day using a gas chromatography method. It is preferable to use the following materials. In this case, the protective film can suppress sulfurization of the conductive layer of the conductive film. The protective film 36 suppresses sulfurization in the input region _E1 of the detection unit 20, that is, sulfurization in the active area, and suppresses resistance change over time in the active area.
For example, the protective film is composed of an electrically insulating adhesive tape.
The protective film is preferably composed of epoxy-modified acrylic resin, polyimide, silicone, Al ₂ O ₃ , SiON, or urethane resin.
Moreover, the thickness of the protective film is preferably 30 nm or more and 200 μm or less. If the thickness of the protective film is 30 nm or less, it is difficult to obtain the above-described effect of suppressing sulfurization. On the other hand, when the thickness of the protective film exceeds 200 μm, the protective film becomes too thick, and it takes a long time to form the protective film, and when pasted, the followability to the bent portion is poor, and the protective film is fragile. In the case of materials, cracks may occur.
The method of forming the protective film is not particularly limited as long as it is a method capable of forming the protective film on the entire surface of the bent portion. and dispenser method, etc. can be used. The attaching method is a method of forming a protective film by attaching an electrically insulating tape such as a polyimide tape.
Note that the insulating film described above may have the same structure as the protective film described above.

(Manufacturing method of touch panel)
In the method for manufacturing the touch panel 10 shown in FIG. 1, for example, the image display portion 14 shown in FIG. are stacked in this order in the stacking direction Dt. At this time, the conductive film 12 is separated from the first transparent insulating layer 15 and the second transparent insulating layer 17 into the first lead-out wiring region B ₁ (see FIG. 2) and the second lead-out wiring region B ₂ (see FIG. 2). 2) and the third extraction wiring region B ₃ (see FIG. 2) protrude. The first lead-out wiring region B ₁ (see FIG. 2), the second lead-out wiring region B ₂ (see FIG. 2), and the third lead-out wiring region B ₃ (see FIG. 2) are bent to form a bent portion 27 . becomes.
In addition, a state in which the first transparent insulating layer 15, the conductive film 12, the second transparent insulating layer 17, and the cover portion 16 are laminated is called a touch panel laminate.
Next, the conductive film 12, that is, the flexible base material 25 is bent at a first bending position Bf ₁ , a second bending position Bf ₂ and a third bending position Bf ₃ to form a first bending position. , a second extraction wiring region B ₂ (see FIG _{. 2), and a third extraction wiring region B 3 (} see FIG. 2) are arranged on the rear surface 14b side of the image display unit 14. By bending, the flexible circuit board 19 is electrically connected to the external connection terminals 26 of the extraction wiring section 22 arranged on the back surface 14 b side of the image display section 14 . At this time, the extraction lines 23 formed on the same surface of the peripheral portion 21 of the flexible base material 25 do not face each other in the overlapping region Dε.

Next, a protective film 36 is formed on the bent portion 27 of the conductive film 12 and the side surface 17c of the second transparent insulating layer 17 for the touch panel laminate. The end portion 36a of the protective film 36 may reach the surface of the decorative layer 18 of the cover portion 16 as described above. The end 36c of the protective film 36 is preferably in contact with the rear surface 14b of the image display section 14 as described above.

Then, the flexible circuit board 19 and the controller 13 (see FIG. 1) are electrically connected, and the controller 13 is arranged on the rear surface 14b of the image display section 14. FIG.
Note that the controller 13 may be arranged on the rear surface 14b of the image display section 14 before the protective film 36 is formed.
Next, prepare a housing 40 in which a cushioning material 44 is arranged in the interior 40a,
Next, the side plate 42 of the housing 40 is attached to the rear surface 16b of the cover portion 16 of the laminate for touch panel on which the protective film 36 is formed. Thereby, the touch panel 10 shown in FIG. 1 can be obtained. The lamination method is not particularly limited, and for example, lamination can be performed using an adhesive.

As described above, the protective film 36 is formed by attaching an adhesive tape having electrical insulation to the bent portion 27 and the side surface 17c of the second transparent insulating layer 17, as described above. It is formed by the affixing method.
In addition, for the touch panel laminate, a substance having electrical insulation is applied to the bent portion 27 and the side surface 17c of the second transparent insulating layer 17 using, for example, a spray coating method or a dispenser method. Alternatively, the protective film 36 may be formed by forming a coating film.
In addition, a substance having electrical insulation is deposited on the side surface 17c of the bent portion 27 and the second transparent insulating layer 17 by, for example, a sputtering method or a vapor deposition method with respect to the touch panel laminate. , a protective film 36 can also be formed.
The width of the frame portion Df of the touch panel 10 can be set to a width of 1.5 mm or less, depending on the thickness of each layer and the substrate used in the laminate for touch panel. The width of the frame portion Df of the touch panel 10 is preferably 0.5 mm or more and 1.5 mm or less.

The present invention is basically configured as described above. Although the touch panel and the conductive film of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements and modifications may be made without departing from the gist of the present invention. Of course, the touch panel may be configured without a bent portion.

The features of the present invention will be described more specifically with reference to examples below. Materials, reagents, amounts and ratios of substances, operations, etc. shown in the following examples can be changed as appropriate without departing from the gist of the present invention. Accordingly, the scope of the invention is not limited to the following examples.
In the first example, the touch panels of Examples 1 to 17 and Comparative Example 1 were produced. For each touch panel, the time constant shown below was measured to evaluate the response speed. The results are shown in Table 1 below.

〔evaluation〕
(response speed)
Regarding the response speed, the time constant (response speed) of the conductive film to voltage application was measured in a touch panel in which the conductive film and the housing were bonded together.
Since the time constant (response speed) is determined by τ=R (resistance)×C (capacitance value), an increase in the capacitance in the circuit increases the time constant and slows down the response speed.
Regarding the time constant, the current generated by applying a rectangular wave of 5 V to the conductive film before and after bending was measured with an oscilloscope, and the time required for the rectangular wave to rise from 0 to 100% was obtained. time constant.
Based on the obtained time constant, the response speed was evaluated according to the evaluation criteria shown below. The evaluation results are shown in Table 1 below.
(Evaluation criteria)
Assuming that the time constant τb in the state before bending is 1, the evaluation was performed by the ratio (τa/τb) to the time constant τa in the bent state.
A: When the time constant in the state before bending is 1 and the time constant in the bent state is less than 1.2, that is, τa/τb < 1.2
B: When the time constant in the state before bending is 1 and the time constant in the bent state is 1.2 to 1.5, that is, 1.2 ≤ τa / τb ≤ 1.5
C: When the time constant in the state before bending is 1 and the time constant in the bent state is more than 1.5 and 1.8 or less, that is, 1.5 < τa / τb ≤ 1.8
D: When the time constant in the state before bending is 1 and the time constant in the bent state is greater than 1.8, that is, 1.8 < τa / τb

Examples 1 to 17 and Comparative Example 1 are described below.
[Example 1]
<Preparation of laminate for touch panel>
(Preparation of silver halide emulsion)
To liquid 1 below maintained at 38° C. and pH 4.5, 90% of each of liquids 2 and 3 below was added simultaneously with stirring over 20 minutes to form core particles of 0.16 μm. Subsequently, Liquids 4 and 5 below were added over 8 minutes, and the remaining 10% of Liquids 2 and 3 below were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete grain formation.

Liquid 1:
750 ml of water
8.6g gelatin
3 g of sodium chloride
1,3-dimethylimidazolidine-2-thione 20 mg
Sodium benzenethiosulfonate 10mg
0.7 g of citric acid
Two liquids:
300ml water
150g of silver nitrate
3 fluids:
300ml water
38g sodium chloride
Potassium bromide 32g
Potassium hexachloroiridate (III) (0.005% KCl 20% aqueous solution) 5 ml
Ammonium hexachlororhodate
(0.001% NaCl 20% aqueous solution) 7 ml
4 fluids:
100ml water
50g silver nitrate
5 fluids:
100ml water
13 g sodium chloride
Potassium bromide 11g
yellow blood salt 5mg

After that, it was washed with water by a flocculation method in accordance with a conventional method. Specifically, the temperature was lowered to 35° C. and the pH was lowered with sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6±0.2). Next, about 3 liters of the supernatant was removed (first water wash). An additional 3 liters of distilled water was added, followed by sulfuric acid until the silver halide precipitated. Again, 3 liters of the supernatant was removed (second water washing). The same operation as the second washing was repeated once more (third washing) to complete the washing and desalting process. After washing and desalting, the emulsion was adjusted to pH 6.4 and pAg 7.5, and 2.5 g of gelatin, 10 mg of sodium benzenethiosulfonate, 3 mg of sodium benzenethiosulfinate, 15 mg of sodium thiosulfate and 10 mg of chloroauric acid were added. 100 mg of 1,3,3a,7-tetraazaindene as a stabilizer and 100 mg of Proxel (trade name, manufactured by ICI Co., Ltd.) as a preservative were added. rice field. The finally obtained emulsion contained 0.08 mol % of silver iodide, the ratio of silver chlorobromide was 70 mol % of silver chloride and 30 mol % of silver bromide, the average grain size was 0.22 µm, and the variation was It was a silver iodochlorobromide cubic grain emulsion with a modulus of 9%.

(Preparation of composition for forming photosensitive layer)
1.2×10 ^-4 mol/mol Ag of 1,3,3a,7-tetraazaindene, 1.2×10 ^-2 mol/mol Ag of hydroquinone, 3.0×10 ^-4 mol of citric acid were added to the above emulsion. /mole Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g/mole Ag, a trace amount of hardening agent was added, and the pH of the coating solution was adjusted to 5.0 using citric acid. adjusted to 6.
A polymer latex containing a dispersant composed of a polymer represented by the following formula (P-1) and a dialkylphenyl PEO sulfate (dispersant/polymer mass ratio: 2 .0/100=0.02) was added so that the polymer/gelatin (mass ratio) was 0.5/1.
Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a cross-linking agent. The amount of the cross-linking agent added was adjusted so that the amount of the cross-linking agent in the silver halide-containing photosensitive layer described later was 0.09 g/m ² .
A composition for forming a photosensitive layer was prepared as described above.
The polymer represented by formula (P-1) below was synthesized with reference to Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

(Photosensitive layer forming step)
Both sides of a 40 μm thick polyethylene terephthalate (PET) film were coated with the above polymer latex to provide a 0.05 μm thick undercoat layer.
Next, the silver halide-free layer-forming composition obtained by mixing the polymer latex and gelatin described above was coated on the undercoat layer to form a silver halide-free layer having a thickness of 1.0 μm. The mixing mass ratio of polymer and gelatin (polymer/gelatin) was 2/1, and the polymer content was 0.65 g/m ² .
Next, the above composition for forming a photosensitive layer was applied onto the silver halide-free layer to form a silver halide-containing photosensitive layer having a thickness of 2.5 μm. The mixing mass ratio (polymer/gelatin) of the polymer and gelatin in the silver halide-containing photosensitive layer was 0.5/1, and the polymer content was 0.22 g/m ² .
Next, a protective layer having a thickness of 0.15 μm was formed on the silver halide-containing photosensitive layer by applying the composition for forming a protective layer in which the above polymer latex and gelatin were mixed. The mixing mass ratio of polymer and gelatin (polymer/gelatin) was 0.1/1, and the polymer content was 0.015 g/m ² .

(Exposure processing and development processing)
A pattern in which the first detection electrode 30 and its extraction wiring portion 22 shown in FIG. It was exposed to parallel light from a high-pressure mercury lamp as a light source through a photomask having a pattern in which the lead-out wiring portion 22 was arranged.
Formed on each surface of the polyethylene terephthalate film so that the direction in which the mesh-shaped first detection electrode extends and the direction in which the second detection electrode extends are orthogonal on both sides, and the lead-out wiring portions taken out from the respective detection electrodes are taken out. The lines were formed to be placed in the peripheral area. Since the first detection electrode 30 is taken out from one end, there are 50 take-out lines 23, and the second detection electrode 32 is taken out from two places at both ends, so there are 100 take-out lines 23 (50×2). The configuration of the first detection electrodes and the configuration of the second detection electrodes will be described later. After exposure, the film was developed with the following developer, further developed with a fixer (trade name: N3X-R for CN16X: manufactured by Fuji Film Co., Ltd.), rinsed with pure water, and then dried.

Composition of developer:
The following compounds are contained in 1 liter (L) of developer.
Hydroquinone 0.037mol/L
N-methylaminophenol 0.016mol/L
Sodium metaborate 0.140mol/L
Sodium hydroxide 0.360mol/L
Sodium bromide 0.031mol/L
Potassium metabisulfite 0.187mol/L

(Heat treatment)
Further, heat treatment was performed by standing in a superheated steam bath at 120° C. for 130 seconds.

(Gelatin decomposition treatment)
Furthermore, it was immersed for 120 seconds in a gelatin decomposition solution (40° C.) prepared as follows, and then washed by being immersed in warm water (liquid temperature: 50° C.) for 120 seconds.

Preparation of gelatin decomposition solution:
Triethanolamine and sulfuric acid were added to an aqueous solution (concentration of protease: 0.5% by mass) of protease (Bioplase 30 L manufactured by Nagase Chemtex Co., Ltd.) to adjust the pH to 8.5.

(Polymer cross-linking treatment)
Further, it was immersed in a 1% aqueous solution of Carbodilite V-02-L2 (trade name: manufactured by Nisshinbo Co., Ltd.) for 30 seconds, removed from the aqueous solution, immersed in pure water (room temperature) for 60 seconds, and washed.
Thus, a film A was obtained in which the detection electrodes and the lead-out wiring portions were formed on both sides of the PET film as shown in FIG.
In film A, the first detection electrodes were 50 first detection electrodes of 255 mm×6.2 mm arranged in parallel at intervals of 100 μm. As for the second detection electrodes, 50 second detection electrodes of 315 mm×5 mm were arranged in parallel at intervals of 100 μm.
Each of the first detection electrode and the second detection electrode was a mesh-like layer of a unit square lattice composed of conductive thin wires as shown in FIG. 13 . The line width of the conductive fine wire was 4.0 μm, the thickness of the conductive fine wire was 1.0 μm, and the thickness of the conductive fine wire layer was 2.0 μm.
The number of lead-out lines of the lead-out wiring portion finally obtained was 50 because the lead-out lines connected to the first detection electrodes were connected to one end of the first detection electrodes. The number of extraction lines connected to the second detection electrodes was 100 because they were connected to both ends of the second detection electrodes. All of the lead lines had a line width of 20 μm, and the minimum interval between the routed lead lines was 20 μm. The bending positions were set at the end of the first detection electrode and the end of the second detection electrode.
In Table 1, the number of lead wires connected to the first detection electrodes is referred to as the number of upper wires, and the number of lead wires connected to the second detection electrodes is referred to as the number of lower wires.

(Insulating layer forming step)
An insulating film was formed on the film A to cover the extraction wiring portion 22 and surround the detection portion 20 using UVF30T, a UV (Ultra Violet) curable resin manufactured by Asahi Kagaku Kenkyusho Co., Ltd. As a result, a protruding portion 38 composed of the extraction wiring portion 22 and the insulating film 37 was formed. The thickness of the projecting portion 38 is set to 9 to 10 μm. A protrusion 38 was formed at the end of the flexible substrate 25 along the outer edge 25 c of the flexible substrate 25 . The insulating film 37 of the projecting portion 38 was formed by applying UVF30T by screen printing and then exposing to UV exposure (metal halide lamp, 1000 mJ/cm ² ). As a result, a conductive film for a touch panel corresponding to the conductive film was obtained.
Here, the touch panel conductive film has a flexible substrate 25 , a detection section 20 (the first detection electrode 30 and the second detection electrode 32 ), an extraction wiring section 22 , and a projecting section 38 .

Subsequently, the obtained conductive film for touch panel, a liquid crystal display module with a thickness of 2.0 mm which is an image display part, a first transparent insulating layer (manufactured by 3M, 8146-3 (product number)), a conductive film for touch panel, a second transparent insulating layer (manufactured by 3M Co., Ltd. 8146-3 (product number)). The conductive film for touch panel was placed so that the surface on which the second detection electrodes were formed faced the liquid crystal display module, and the contour of the liquid crystal display module was aligned with the bending position of the conductive film for touch panel. The thickness of the first transparent insulating layer and the thickness of the second transparent insulating layer were both 75 μm. Subsequently, three sides of the lead-out wiring region of the touch panel conductive film were bent toward the back surface of the image display section 14 so that the external connection terminals 26 were arranged on the back surface 14 b side of the image display section 14 . In this case, the first bending position Bf ₁ and the second bending position Bf ₂ of the conductive film for touch panel are first bent toward the back side of the liquid crystal display module, and then the third bending position Bf ₃ is bent. It was bent to the back side of the liquid crystal display module. As a result, a laminate for a touch panel in which the external connection terminals were arranged on the display surface side of the image display portion was obtained.
After that, it was bonded with an FPC (flexible printed circuit board). After that, the housing (see FIG. 1) in which the cushioning material was arranged and the laminate for touch panel were bonded together to obtain a touch panel. Ethylene-propylene sponge was used as the cushioning material.
Moreover, in Example 1, the length of the curved surface of the conductive film/the thickness of the panel was set to 2.9. In this case, the angle α (see FIG. 5) was 20°. The length of the curved surface of the conductive film/panel thickness is the ratio γ It's about.
In addition, in Example 1, the extraction wiring of the second detection electrode 32 is arranged in the first planned bending area BE ₁ (see FIG. 2) and the second planned bending area BE ₂ (see FIG. 2). , and the lead-out lines 23 of the first detection electrodes 30 are not arranged along the third planned bending region _BE3 (see FIG. 2). For this reason, one side of the wiring pattern in the overlapping region in Table 1 is set along the bent region.

[Example 2]
Example 2 is different from Example 1 in the following points, and the rest of the configuration is the same as Example 1. In Example 2, the length of the curved surface of the conductive film/the thickness of the panel was set to 2.0. In this case, the angle α (see FIG. 5) was 30°.
[Example 3]
Example 3 is different from Example 1 in the following points, and has the same configuration as Example 1 otherwise. In Example 3, the length of the curved surface of the conductive film/the thickness of the panel was set to 1.2. In this case, the angle α was 60°.
[Example 4]
Example 4 is different from Example 1 in the following points, and has the same configuration as Example 1 otherwise. In Example 4, the length of the curved surface of the conductive film/the thickness of the panel was set to 1.0. In this case, the angle α was 90°.

[Example 5]
Example 5 is different from Example 1 in the following points, and the rest of the configuration is the same as Example 1. In Example 5, the distance from the edge of the bent region to the wiring was set to 10 μm for the formation position of the take-out line. That is, a lead-out line was formed at a position 10 μm from the inner side of the edge. The width of the folded area was 1.98 mm. As for the number of lead-out wirings, the number of upper wirings was 49, and the number of lower wirings was 98. Note that the line width and interval of the lead-out wiring were set to 20 μm as in the first embodiment.

[Example 6]
Example 6 is different from Example 5 in the following points, and the rest of the configuration is the same as Example 5. In Example 6, the length of the curved surface of the conductive film/the thickness of the panel was set to 2.0. In this case, the angle α was 30°.
[Example 7]
Example 7 is different from Example 5 in the following points, and the rest of the configuration is the same as Example 5. In Example 7, the length of the curved surface of the conductive film/the thickness of the panel was 1.2. In this case, the angle α was 60°.
[Example 8]
Example 8 is different from Example 5 in the following points, and the rest of the configuration is the same as Example 5. In Example 8, the length of the curved surface of the conductive film/the thickness of the panel was set to 1.0. In this case, the angle α was 90°.

[Example 9]
Example 9 is different from Example 5 in the following points, and the rest of the configuration is the same as Example 5. In Example 9, the line width of the extraction wiring was set to 15 μm, and the interval was set to 24 μm. As for the number of lead wires, the number of upper wires was 50, and the number of lower wires was 100.

[Example 10]
Example 10 is different from Example 1 in the following points, and the rest of the configuration is the same as Example 1. In Example 10, the distance (μm) from the edge of the bent region to the wiring was set to 100 μm. That is, a lead-out line was formed at a position 100 μm from the inner side of the edge. The width of the folded area was 1.8 mm. As for the number of lead-out wirings, the number of upper wirings was 90 and the number of lower wirings was 45. Note that the line width and interval of the lead-out wiring were set to 20 μm as in the first embodiment.

[Example 11]
Example 11 is different from Example 10 in the following points, and the rest of the configuration is the same as Example 10. In Example 11, the length of the curved surface of the conductive film/the thickness of the panel was set to 2.0. In this case, the angle α was 30°.
[Example 12]
Example 12 is different from Example 10 in the following points, and the rest of the configuration is the same as Example 10. In Example 12, the length of the curved surface of the conductive film/the thickness of the panel was 1.2. In this case, the angle α was 60°.
[Example 13]
Example 13 is different from Example 10 in the following points, and the rest of the configuration is the same as Example 10. In Example 13, the length of the curved surface of the conductive film/panel thickness was set to 1.0. In this case, the angle α was 90°.
[Example 14]
Example 14 is different from Example 10 in the following points, and the rest of the configuration is the same as Example 10. In Example 14, the line width of the extraction wiring was set to 16 μm, and the interval was set to 20 μm. As for the number of lead-out wirings, the number of upper wirings was set to 50, and the number of lower wirings was set to 100.

[Example 15]
Example 15 is different from Example 1 in the following points, and has the same configuration as Example 1 otherwise. In Example 15, the pattern of the conductive film 12 shown in FIG. 7 was used. As for the number of lead-out wirings, the number of upper wirings was set to 50, and the number of lower wirings was set to 100. In Example 15, as shown in FIG. 7, the wiring pattern is such that the lead-out line 23 is not formed in the region 25g.
Note that the line width and interval of the lead-out wiring were set to 20 μm as in the first embodiment.
[Example 16]
Example 16 is different from Example 1 in the following points, and has the same configuration as Example 1 otherwise. In Example 16, the pattern of the conductive film 12 shown in FIG. 8 was used. As for the number of lead-out wirings, the number of upper wirings was set to 50, and the number of lower wirings was set to 100. In the sixteenth embodiment, the extraction wirings of the second detection electrodes 32 are arranged in the first intended bending area BE ₁ (see FIG. 2) and the second intended bending area BE ₂ (see FIG. 2). The extraction line 23 of the 1 detection electrode 30 was arranged along the third planned bending area BE ₃ (see FIG. 2). For this reason, two sides of the wiring pattern in the overlapping region in Table 1 are set along the bent region.
Incidentally, in Example 16, the line width and interval of the extraction wiring were set to 20 μm as in Example 1. FIG.
[Example 17]
Example 17 is different from Example 1 in the following points, and has the same configuration as Example 1 otherwise. In Example 17, the pattern of the conductive film 12 shown in FIG. 9 was used. As for the number of lead-out wirings, the number of upper wirings was set to 50, and the number of lower wirings was set to 100. In the 17th embodiment and the 16th embodiment, the extraction wiring of the second detection electrode 32 is arranged in the first planned bending area BE ₁ (see FIG. 2) and the second planned bending area BE ₂ (see FIG. 2). , and the lead-out line 23 of the first detection electrode 30 is arranged along the third planned bending region BE ₃ (see FIG. 2). For this reason, two sides of the wiring pattern in the overlapping region in Table 1 are set along the bent region.
Incidentally, in Example 16, the line width and interval of the extraction wiring were set to 20 μm as in Example 1. FIG.

[Comparative Example 1]
Comparative Example 1 is different from Example 1 in the following points, and has the same configuration as that of Example 1 otherwise. For Comparative Example 1, the pattern 100 shown in FIG. 16 was used.
In the pattern 100 shown in FIG. 16, the same components as those of the conductive film 12 shown in FIG.
The pattern 100 showing the conductive film of Comparative Example 1 is a pattern in which the lead-out lines 23 are arranged at the corners 25e, and the lead-out lines 23 overlap each other in the overlapping region Dε, as compared with the pattern of Example 1. . Regarding the number of lead-out wirings in Comparative Example 1, the number of upper wirings was set to 50, and the number of lower wirings was set to 100.
In Comparative Example 1, 4 of the first bending position Bf ₁ , the second bending position Bf ₂ , the third bending position Bf ₃ and the fourth bending position Bf ₄ of the conductive film of Example 1 The sides were bent to the back side of the liquid crystal display module and bonded to the FPC. The order of bending is to bend the first bending position _Bf1 and the second bending position _Bf2 facing each other, and then bend the third bending position _Bf3 and the fourth bending position _Bf4 facing each other. . For this reason, Comparative Example 1 is marked with "-" in the columns of "wiring pattern in overlapping area" and "distance (μm) from edge of bent area to wiring" in Table 1.

As shown in Table 1, in Examples 1 to 17, better results than in Comparative Example 1 were obtained in terms of response speed.
Since the touch sensor operates by detecting the capacitance, when the capacitance increases due to parasitic capacitance, the time constant increases, the response speed of touch detection slows down, and normal operation of the touch sensor becomes difficult. That is, the operational stability of the touch sensor deteriorates. However, by providing the wiring pattern along the bent region, the parasitic capacitance in the overlapping region can be suppressed, and the increase in the capacitance of the touch sensor can be suppressed. As a result, it was possible to suppress a decrease in touch detection response speed, and to maintain the operational stability of the touch sensor.
From Examples 1 to 4, when the length of the curved surface of the conductive film/panel thickness, that is, the ratio γ is 2.0 or less, the response speed is improved, and when the ratio γ is 1.2 or less, the response Speed is even better.
From Example 1, Example 5, Example 10 and Example 15, the response speed was better when the distance from the end of the bending region to the wiring was 10 μm than when the distance from the edge of the bending region to the wiring was 0 μm. The response speed was even better.

REFERENCE SIGNS LIST 10 touch panel 12 conductive film 13 controller 14 image display unit 14a display surface 14b rear surface 14c side surface 15 first transparent insulating layer 16 cover portion 16a front surface 16b rear surface 17 second transparent insulating layer 18 decoration layer 19 flexible circuit board 20 detection Part 21 Peripheral edge 22 Extraction wiring part 22b Terminal part 23 Extraction line 25 Flexible base material 25a Front surface 25b Back surface 25c Outer edge 26 External connection terminal 27 Bent part 29 Protruding part 30 First detection electrode 31 Spacing 32 Second detection electrode 33 Thin metal wire 34 Detection electrode 35 Opening 36 Protective film 36a End 36c End 37 Insulating film 38 Protruding portion 50 Conductive wire 52 Binder 54 Metal portion 100 Pattern BE Bending region B ₁ First extraction wiring region B ₂ Second extraction Wiring area B ₃ Third extraction wiring area BE ₁ First planned bending area BE ₂ Second planned bending area BE ₃ Third planned bending area Bf ₁ First bending position Bf ₂ Second Bending position Bf _3rd bending position Df Frame part Dt Lamination direction Dw Direction perpendicular to the lamination direction E ₁ Input area E ₂ Outer area fc Center line fe Contact point L ₁ First bending line L ₂ Second Bending line L ₃ Third bending line Lm, Pp Line Sc Curved surface α Angle

Claims (20)

A touch panel having an image display portion and a conductive film, wherein the conductive film is arranged on the display surface side of the image display portion,
The conductive film includes, on at least one surface of a transparent flexible base material, a detection unit extending in one direction and configured by a conductive layer, and a take-out unit electrically connected to each end of the detection unit. and an extraction wiring portion including a wire,
The extraction line of the extraction wiring section has one end electrically connected to the end of the detection section and the other end electrically connected to an external connection terminal,
Further, two bending lines provided along the periphery of the detection part on the surface of the flexible base material on which the detection part is provided and opposed to each other with the detection part sandwiched in the one direction; The flexible base material is formed by bending the back surface side of the image display section opposite to the display surface side of the image display section at the two bending lines and the intersecting bending line. , three folding regions surrounding the side surface of the image display portion, and an overlapping region in which the same surface of the peripheral portion of the conductive film is folded on the back surface of the image display portion,
The external connection terminals are arranged on the back side of the image display unit,
The lead-out lines are provided at least in the facing bending regions and are arranged so as to avoid the overlapping region, or any of the two surfaces of the conductive film that overlap in the overlapping region. A touch panel on one side. A touch panel having an image display portion and a conductive film, wherein the conductive film is arranged on the display surface side of the image display portion,
The conductive film includes a detection section formed of a conductive layer on at least one surface of a transparent flexible base material, and a lead-out wiring having lead-out lines electrically connected to ends of the detection section, respectively. and
The extraction line of the extraction wiring section has one end electrically connected to the end of the detection section and the other end electrically connected to an external connection terminal,
Furthermore, on the surface of the flexible base material on which the detection section is provided, two intersecting folding lines, at least one of which is provided along the edge of the detection section, form the image display section. On the back side of the image display section, which is opposite to the display surface side, there are two folding areas formed by folding the flexible base material, surrounding the side surfaces of the image display section, and the image display section. and an overlapping region in which the same surface of the peripheral portion of the conductive film is folded on the back surface,
The external connection terminals are arranged on the back side of the image display unit,
The lead-out line is provided at least in the bending region and is arranged to avoid the overlapping region, or is located on either one of the two surfaces of the conductive film that are folded in the overlapping region. A touch panel placed on the surface. The extraction wiring extending in the length direction of the bending region provided in the bending region along the bending line is provided in a region at a distance of 10 μm or more from the bending line. The touch panel according to claim 1 or 2. The extraction wiring extending in the length direction of the bending region provided in the bending region along the bending line is provided in a region at a distance of 100 μm or more from the bending line. The touch panel according to any one of claims 1 to 3. The bending area is composed of a curved surface,
The touch panel according to any one of claims 1 to 4, wherein a ratio of the length of the bent region along the curved surface and the thickness of the image display section is 2.0 or less. The bending area is composed of a curved surface,
The touch panel according to any one of claims 1 to 5, wherein a ratio of the length of the bent region along the curved surface and the thickness of the image display section is 1.2 or less. The flexible base material has a rectangular shape, the plurality of detection units are arranged in a rectangular shape so that the sides of the flexible base material are aligned, and the extraction wiring part is formed on the flexible base material. It is provided on the periphery of the side,
The bending line is provided parallel to a total of three sides including two sides facing each other across the detection part of the detection part in the one direction,
2. The flexible base material is bent such that three of four sides provided with the folding lines are arranged on the back surface side of the image display section. and the touch panel according to any one of 3 to 6. The flexible base material has a rectangular shape, the plurality of detection units are arranged in a rectangular shape so that the sides of the flexible base material are aligned, and the extraction wiring part is formed on the flexible base material. It is provided on the periphery of the side,
The bending lines are provided parallel to each of a first side along one of the ends of the detection section and a second side perpendicular to the first side,
Claims 2 to 4, wherein the flexible base material is bent such that two of four sides provided with the bending lines are arranged on the back surface side of the image display unit. 7. The touch panel according to any one of 6. The touch panel according to any one of claims 1 to 8, wherein said take-out line is composed of a thin metal wire. The touch panel according to any one of claims 1 to 9, wherein the extraction line of the extraction wiring portion has at least one portion bent at an angle larger than 90° on the surface of the flexible base material. . A lead-out wiring part comprising a detection part formed of a conductive layer and extending in one direction on at least one surface of a transparent flexible base material, and a lead-out line electrically connected to each end of the detection part. and
The extraction wiring portion is provided in a peripheral edge portion surrounding the detection portion in a continuous band shape,
The extraction line of the extraction wiring section has one end electrically connected to the end of the detection section and the other end electrically connected to an external connection terminal,
Further, two bending lines provided along the periphery of the detection part on the surface of the flexible base material on which the detection part is provided and opposed to each other with the detection part sandwiched in the one direction; The flexible structure is arranged such that the external connection terminals are arranged on the back surface side of the image display section opposite to the display surface side of the image display section between the two bending lines and the intersecting bending line. When the flexible base material is folded, three folding regions surrounding the side surface of the image display portion and an overlapping region where the same surface of the peripheral portion is folded on the back surface of the image display portion are formed,
The lead-out lines are provided at least in the facing bending regions and are arranged so as to avoid the overlapping region, or in the overlapping region, either one of the two surfaces of the conductive film that overlaps. A conductive film placed on a surface. a detecting portion made of a conductive layer on at least one surface of a transparent flexible base material;
The extraction wiring portion is provided in a peripheral edge portion surrounding the detection portion in a continuous band shape,
The extraction line of the extraction wiring section has one end electrically connected to the end of the detection section and the other end electrically connected to an external connection terminal,
Furthermore, on the surface of the flexible base material on which the detection section is provided, two intersecting folding lines, at least one of which is provided along the edge of the detection section, form the image display section. When the flexible base material is bent so that the external connection terminals are arranged on the rear surface side of the image display section opposite to the display surface side, two folds surrounding the side surfaces of the image display section are formed. an area and an overlapping area in which the same surface of the peripheral portion is folded on the back surface of the image display unit;
The lead-out line is provided at least in the bending region and is arranged to avoid the overlapping region, or is located on either one of the two surfaces of the conductive film that is folded in the overlapping region. A conductive film in place. The extraction wiring extending along the bending line and extending in the length direction of the bending area provided in the bending area is provided in an area separated from the bending line by a distance of 10 μm or more. The conductive film according to claim 11 or 12, wherein The extraction wiring extending along the bending line and extending in the length direction of the bending area provided in the bending area is provided in a region separated from the bending line by 100 μm or more. The conductive film according to any one of claims 11 to 13. Claims 11 to 11, wherein the ratio of the width direction length orthogonal to the bending line of the region to be bent provided along the bending line to the thickness of the image display portion is 2.0 or less. 15. The conductive film according to any one of 14. Claims 11 to 11, wherein the ratio of the length of the region to be folded provided along the folding line in the width direction orthogonal to the folding line to the thickness of the image display section is 1.2 or less. 16. The conductive film according to any one of 15. The flexible base material has a rectangular shape, the plurality of detection units are arranged in a rectangular shape so that the sides of the flexible base material are aligned, and the extraction wiring part is formed on the flexible base material. It is provided on the periphery of the side,
The bending line is provided parallel to a total of three sides including two sides facing each other across the detection part of the detection part in the one direction,
17. Any one of claims 11 and 13 to 16, wherein the flexible base has folding planned regions to be folded in the same direction on three of the four sides where the folding lines are provided. The conductive film according to item. The flexible base material has a rectangular shape, the plurality of detection units are arranged in a rectangular shape so that the sides of the flexible base material are aligned, and the extraction wiring part is formed on the flexible base material. It is provided on the periphery of the side,
The bending lines are provided parallel to each of a first side along one of the ends of the detection section and a second side perpendicular to the first side,
17. The flexible base according to any one of claims 12 to 16, wherein, of the four sides, two sides provided with the folding lines have a folding planned region in which the two sides are folded in the same direction. conductive film. The conductive film according to any one of claims 11 to 18, wherein the take-out line is composed of a thin metal wire. The conductor according to any one of claims 11 to 19, wherein the lead-out line of the lead-out wiring portion has at least one portion bent at an angle larger than 90° on the surface of the flexible base material. sex film.

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