JP2023085391A - Ic tag, ic tag manufacturing method, and method of manufacturing ic holding part - Google Patents

Abstract

To provide an IC tag, an IC tag manufacturing method, or a method of manufacturing an IC holding part which lowers manufacturing costs, facilitates removal of a part including an IC chip, or improves performance by impedance matching or the like or which has some other advantage.SOLUTION: The present invention is directed to provision of an IC tag having an IC holding part having a first substrate, an IC chip, and a first conductor, a second conductor holding part having a second substrate and a second conductor fixed to the second substrate, and an adhesive or an adhesive material at least a part of which is disposed between the IC holding part and the second conductor holding part, and arranged such that positional relationship among the IC chip, the first conductor, and the second conductor in a plane viewed from a laminated layer direction is seen as if a path starting from the IC chip to the IC chip is formed by using the first conductor and the second conductor.SELECTED DRAWING: Figure 2

Description

TECHNICAL FIELD The present invention relates to an IC tag used for arbitrary purposes such as product management, a method for manufacturing an IC tag, and a method for manufacturing an IC holding part.

In recent years, IC tags have been widely used. In one example, an IC tag equipped with an IC (integrated circuit) chip that stores information about a product, article, etc. is attached to the product, article, etc., and a reader device is used to read the tag. It is used in a mode of managing products, articles, etc. by reading information without contact.

The mainstream method for manufacturing IC tags is to form an antenna on a base material by chemical etching or the like, and then bond the IC chip by heating and press-bonding it. reduction is desired. There is also an IC tag from which the part containing the IC chip can be easily removed when the part containing the IC chip of the IC tag that is no longer needed after the purchase of the product with the IC tag attached is removed and discarded. Desired. In addition, it is desired to improve the performance of IC tags by impedance matching and the like.

International Publication No. 2010/082413 (Patent No. 5041077) International Publication No. 2012/032974 (Patent No. 5062372) Japanese Patent Application Laid-Open No. 2018-200632 JP 2018-200635 A JP 2018-207387 A JP 2019-3354 A JP 2019-8553 A

In view of the above, the present invention provides an IC tag that achieves either lower manufacturing costs, easier removal of the part containing the IC chip, or improved performance by impedance matching or the like, or has some other advantage. , an IC tag manufacturing method, or an IC holding part manufacturing method.

In order to achieve the above object, the present invention provides an IC holding portion including a first base material, an IC chip, and a first conductor, a second base material, and an IC device fixed to the second base material. a second conductor holding portion having a second conductor; The positional relationship between the IC chip, the first conductor, and the second conductor in a plane viewed from the direction is such that a path starting from the IC chip and reaching the IC chip uses the first conductor and the second conductor. To provide an IC tag having a positional relationship that looks as if it were formed by

In one example of the above IC tag, the IC chip is fixed to the first substrate in the IC holding portion, and at least part of the first conductor is electrically connected to at least one terminal portion of the IC chip. The second conductor may be fixed to the first conductor by an adhesive or adhesive.

An example of the IC tag may have a laminated structure in which a second base material, a second conductor, an adhesive or pressure-sensitive adhesive, an IC holding portion, and peelable paper are laminated in order.

In one example of the IC tag, the first conductor is fixed to the first substrate in the IC holding portion, and at least one terminal portion of the IC chip is electrically connected to at least a part of the first conductor. The first base material or the IC chip may be fixed to the second conductor with an adhesive or adhesive.

Examples of the IC tag include a cover, a cover-side adhesive or adhesive, an IC holding portion, an adhesive or adhesive, a second conductor, a second base material, a peelable paper-side adhesive or adhesive, a peelable It may have a laminated structure in which paper sheets are sequentially laminated.

An example of the IC tag may be one in which a loop-shaped matching circuit is formed by at least partially overlapping the first conductor and the second conductor when viewed in the stacking direction.

In one example of the above IC tag, the first conductor and the second conductor are formed as conductors having sheet resistance (surface resistivity) values different from each other, and the sheet resistance of the second conductor is the same as that of the first conductor. It may be ten times or more the sheet resistance of the body.

In one example of the above IC tag, the second conductor is formed as a conductor having a sheet resistance value of 0.1Ω/square (Ω/sq., ohms per square) or more and 1000Ω/square or less. you can

In one example of the IC tag, the first conductor or the second conductor may be formed using a metal material using any one of etching, foil stamping, and printing.

In one example of the IC tag, the first conductor or the second conductor may be made of a material containing metal particles, carbon particles, or carbon nanotubes, and further containing resin. .

In one example of the above IC tag, the area that appears to be surrounded by the IC chip and the path in the plane viewed in the stacking direction may have a portion that becomes wider with increasing distance from the IC chip side within the area.

Further, the present invention provides an IC holding portion including a first base material, a first conductor, and an IC chip, a second base material, and a second conductor fixed to the second base material. , an adhesive or adhesive material disposed at least partially between the IC holding portion and the second conductor holding portion, and a second conductor holding portion arranged to cover the IC holding portion. and a peelable paper, wherein the IC holding portion is not directly fixed to the peelable paper, and the second conductor holding portion and the adhesive or pressure-sensitive adhesive have, in a plane viewed from the stacking direction, To provide an IC tag having a cut at least partially along a line surrounding an IC holding part.

In one example of the above IC tag, the positional relationship between the IC chip, the first conductor, and the second conductor in a plane viewed from the stacking direction is such that the path starting from the IC chip and reaching the IC chip is the first conductor. and the second conductor.

The present invention also includes fixing the IC chip to the IC chip fixing position of the first base material, and includes fixing the IC chip after forming the first adhesive or adhesive material at the IC chip fixing position. or, fixing including fixing the IC chip to the IC chip fixing position of the first substrate having a layer containing the first adhesive or adhesive formed on at least the surface including the IC chip fixing position; forming the first conductor so that at least a portion of the first conductor is electrically connected to at least one terminal portion provided on a surface of the IC chip on a side different from the IC chip fixing position side; when fixing the IC chip to the IC chip fixing position, the height of the first base material in the plane of the IC chip fixing position side and around the IC chip fixing position, and the height of the terminal part of the IC chip The first base material is deformed so that the difference between the thickness and the thickness of the IC chip is less than half the thickness of the IC chip, and the first conductor is formed while the first base material is compressed. provide a way.

The present invention also provides the following steps: manufacturing an IC holding portion by the method described above; forming a second conductor on a second substrate; forming an adhesive material or an adhesive material on the second conductor; and disposing an IC holding portion on an adhesive or adhesive material, wherein the positional relationship between the IC chip, the first conductor, and the second conductor within a plane viewed from the stacking direction is different from the IC chip. To provide an IC tag manufacturing method for arranging an IC holding part so as to have a positional relationship such that a path leading to an IC chip appears to be formed using a first conductor and a second conductor. do.

According to the present invention, in one example, the portion including the IC chip is reduced in size and commonized to increase the effect of mass production, thereby reducing the manufacturing cost, or the portion including the IC chip is provided with a cut at least partially. or improved performance due to the positional relationship between the IC chip and the first conductor and the second conductor in the plane viewed from the stacking direction, or some other advantages. , an IC tag manufacturing method, or an IC holding part manufacturing method are achieved.

1 is an external perspective view of an IC tag according to a first embodiment of the present invention; FIG. FIG. 1B is a view for explaining the laminated structure by showing the constituent elements included in the IC tag of FIG. 1A; FIG. 2 is a perspective plan view of IC tags (in a state in which a plurality of them are connected) according to the first embodiment of the present invention, viewed from the stacking direction; A first terminal portion (first connection electrode) and a second terminal portion (second connection electrode) of the IC chip are connected to one conductor portion and the other conductor portion of the first conductor, respectively. The figure which shows a state. FIG. 2 is a plan view of an IC strap portion (a plurality of connected state), which is an example of an IC holding portion according to the first embodiment of the present invention; FIG. 1B is a cross-sectional view of the IC tag shown in FIG. 1A taken along line A-A′ in FIG. 1A and cut along the stacking direction (the stacking direction is shown upside down from FIG. 1B). FIG. 1B is a conceptual equivalent circuit diagram for explaining the function of the IC tag shown in FIGS. 1A, 1B, etc. FIG. FIG. 4 is a diagram for explaining an example of a method for manufacturing an IC strap portion used in the IC tag according to the first embodiment of the present invention; FIG. 5 is a diagram for explaining preferable conditions when fixing the IC chip to the IC chip fixing position on the first base material, and is shown as a cross-sectional view similar to FIG. 4 ; FIG. 4 is a diagram for explaining an example of the IC tag manufacturing method according to the first embodiment of the present invention; FIG. 8 is a diagram for explaining the placement of the IC strap portion during the manufacturing method explained with reference to FIG. 7; FIG. 1B is a cross-sectional view of the IC tag according to the second embodiment of the present invention, taken along the stacking direction, corresponding to the A-A′ line cross section in FIG. 1A. A first terminal portion (first connection electrode) and a second terminal portion (second connection electrode) of the IC chip are connected to one conductor portion and the other conductor portion of the first conductor, respectively. The figure which shows a state (cross-sectional view similar to FIG. 9A). FIG. 9B is a cross-sectional view of a modification of the IC tag according to the second embodiment of the present invention, in which the IC strap portion is arranged upside down in the stacking direction in the configuration of FIG. 9A; 1 is a perspective plan view of an IC tag according to an embodiment of the present invention, viewed from a stacking direction; FIG. FIG. 11B is a plan perspective view of the IC tag according to the embodiment of the present invention, viewed from the stacking direction when the mode of the first conductor is changed from the mode of FIG. 11A. 11B is a plan perspective view of the IC tag according to the embodiment of the present invention, viewed from the stacking direction when the mode of the first conductor is changed from the mode of FIGS. 11A and 11B. FIG. FIG. 11 is a view for explaining placement of the IC strap portion on the second conductor holding portion; FIG. 11 is a plan perspective view of the IC tag according to the embodiment of the present invention, viewed from the stacking direction when the mode of the second conductor is changed from the mode of FIGS. 11A, 11B, and 11C. FIG. 4 is a diagram for explaining an example of a method for measuring sheet resistance of a conductor used as a first conductor or a conductor used as a second conductor; The third embodiment of the present invention shows IC tags (in a plurality of connected states) provided with a cut along a line surrounding the IC strap portion as a plan perspective view as seen from the stacking direction. FIG. 10 is a diagram showing a state in which an IC strap portion and its peripheral portion are separated from other portions along a cut line in two IC tags; FIG. 11 is a perspective plan view showing a configuration in which the cut is partial (at least a part of which is provided with an “uncut”) as a modified example of the IC tag according to the third embodiment of the present invention; FIG. 1B is a cross-sectional view of the IC tag provided with cuts, taken along the stacking direction corresponding to the cross-section taken along the line AA' in FIG. ). FIG. 11 is a diagram for explaining an example of a method for manufacturing an IC tag according to a third embodiment of the present invention;

Hereinafter, an IC tag, an IC tag manufacturing method, and an IC holding portion manufacturing method, which are exemplary embodiments of the present invention, will be described with reference to the drawings. However, it should be noted that the IC tag, the method for manufacturing the IC tag, and the method for manufacturing the IC holding part according to the present invention are not limited to the specific embodiments described below, and can be appropriately changed within the scope of the present invention. do. For example, hereinafter, as an example of the IC chip holding portion, an IC chip holding portion (sometimes referred to as an “IC strap portion”) in which the first conductor has a string-like shape when viewed from the stacking direction. However, the shape of the first conductor in the IC chip holding portion is not limited to such a shape and may be arbitrary. It is also not essential that the first conductor consist of two conductor portions as in the embodiments described later. The first conductor may be a single integrated conductor or may include any two or more conductor portions. The IC chip may be of a type that does not include bumps. The shape, size, material, etc. of other constituent elements are also arbitrary. The IC tag may be any type of IC tag, such as passive type, active type, semi-active type. In addition, in the following embodiments, the IC tag will mainly be described as including peelable paper, but a tag that does not include peelable paper may also be referred to as an IC tag. In the following embodiments as well, there are cases in which an IC tag that does not include peelable paper is referred to as an IC tag, and in which an IC tag that includes peelable paper is referred to as an IC tag. Any releasable material may be used in place of the releasable paper, or the element corresponding to the releasable paper may be omitted. Within the scope of the present invention, any component among the components included in the IC tag and IC chip holder described in the embodiments may be deleted or changed, or another component may be added. However, within the scope of the present invention, any of the components included in the IC tag manufacturing method and the IC holding portion manufacturing method described in the embodiments may be deleted, changed, or otherwise configured. You can add elements. In this specification, an example of "adhesion" is "adhesive", and an example of "adhesive" is "adhesive". Any “adhesion” or “adhesive” other than “adhesive” may be used. Note that the scale and aspect ratio of each drawing are not necessarily constant.

(First embodiment)
Structure of IC tag
FIG. 1A is an external perspective view of the IC tag according to the first embodiment of the present invention, and FIG. 1B is a diagram showing constituent elements included in the IC tag of FIG. 1A and explaining a laminated structure. The IC tag 1 includes a peelable paper 2, a first base material 3, an IC chip 4, a first conductor 5 (consisting of one conductor portion 5a and the other conductor portion 5b), adhesive material, etc. An IC holding portion (IC strap portion) including a material 6, a second conductor 7, a second base material 8, and including a first base material 3, an IC chip 4, and a first conductor 5, a second conductor 7, A second conductor holding portion including a second base material 8 is adhered (adhered) by an adhesive 6, and a peelable paper 2 is adhered to the adhesive 6 such as an adhesive from the IC strap portion side. structure (see FIG. 1B). For convenience of explanation, the IC chip 4 and the first conductor 5 are connected to each other in FIG. 1B, and the first base material 3 is shown separately. It should be noted that in the example of the IC strap portion manufacturing method, the first conductor 5 is formed after the IC chip 4 is fixed to the first base material 3 (the work order can be changed as appropriate). Also, when the first conductor 3 is compressed and deformed as shown in FIG. 3A and the like which will be described later, the IC tag 1 is placed at a position corresponding to the IC chip 4 in the plane of the peelable paper 2 in FIG. 1B. It may have some swelling.

FIG. 2 is a plan perspective view of IC tags (a state in which a plurality of IC tags are connected) according to the first embodiment of the present invention, viewed from the stacking direction. 1A and 1B, the second base material 8 is formed in a rectangular shape with four rounded ends, and a plurality of IC tags 1 are made of the same peelable paper. 2 (same peelable paper 2 is attached to a plurality of IC tags 1 that do not contain peelable paper 2). The positional relationship between the IC chip 4, the first conductor 5 (consisting of one conductor portion 5a and the other conductor portion 5b), and the second conductor 7 in the plane viewed from the stacking direction is determined by the IC chip. 4 to the IC chip 4 (broken-line path in FIG. 2) appears to be formed using the first conductor 5 and the second conductor 7. FIG. As will be described later, in the present embodiment, the first conductor 5 and the second conductor 7 have such a positional relationship to form a loop-shaped impedance matching circuit (second and third conductors to be described later). Also in the embodiment, the first conductor 5 and the second conductor 7 can have such a positional relationship.).

The IC chip 4 is configured using a semiconductor chip having a memory, a control circuit, etc., and one conductor portion 5a of the first conductor 5 is electrically connected to the first connection electrode 4a of the IC chip 4. The other conductor portion 5b of the first conductor 5 is electrically connected to the second connection electrode 4b of the IC chip 4 (see FIG. 3A). As will be described later, the IC chip 4 is coated, for example, on the surface of the first base material 3 with an adhesive (e.g., thermoplastic resin, thermosetting resin, solvent-drying type (vinyl acetate, nitrile rubber), water-soluble (glue )), etc. are formed, the IC chip 4 is fixed on the surface, and pressure is applied to deform (bend, etc.) the first base material 3, compressing the first base material 3, It is mounted on the first base material 3 . However, it is possible to deform the first base material 3 and fix the IC chip 4 simply by pressing the IC chip 4 without using an adhesive such as an adhesive. The first conductor 5 is composed of two conductor portions (one conductor portion 5a and the other conductor portion 5b) as shown in FIGS. 2 and 3A. function as an antenna on the side of the IC chip 4 in wireless communication. The first conductor 5 is formed by printing conductive ink such as silver paste on the surface of the first base material 3 with a screen printer or the like while the first base material 3 is deformed and compressed as described above. , a foil stamping tape made of metal such as aluminum is transferred to the surface of the first base material 3 by a foil stamping machine or the like, or a metal deposition film such as aluminum is formed on the surface of the first base material 3. , can be formed by molding by etching (see paragraph [0024] in Patent Document 3, paragraph [0021] in Patent Document 5, etc.). Alternatively, using ACP (Anisotropic Conductive Paste), the first connection electrode 4a (bump) and one conductor portion 5a, and the second connection electrode 4b (bump) and the other conductor portion 5b. may be electrically connected to each other. The first base material 3 and the second base material 8 may be base materials made of arbitrary materials such as cloth, nonwoven fabric, paper, ceramics, resin, etc., and the material of the first base material 3 and the second base material 8 may be the same as or different from each other. The adhesive material 6 is an adhesive material in one example, and may be an acrylic, rubber, or silicone adhesive. The second conductor 7 can be formed on the surface of the second substrate 8 by printing, foil stamping, etching, or the like in the same manner as the first conductor 5 . As materials for the first conductor 5 and the second conductor 7, metal particles, carbon particles, carbon nanotubes, or other arbitrary materials can be used. It can also be used (for example, it is formed by a method such as adding carbon particles to a binder and printing). The material of the first conductor 5 and the material of the second conductor 7 may be the same or different, but in one example, the first conductor 5 is made of metal and the second conductor 7 is made of , resin-containing metal particles, carbon particles, carbon nanotubes, or any other conductive particles.

FIG. 3B is a plan view of an IC strap portion (a plurality of connected states), which is an example of an IC holding portion according to the first embodiment of the present invention (the first connection electrode 4a and one conductor portion 5a are connected). The electrical connection and the electrical connection between the second connection electrode 4b and the other conductor portion 5b are not drawn in detail. 4. The representation is simplified as if the other conductor portion 5b is connected to the right end of 4. In other drawings such as FIGS. 2 and 8, the representation is appropriately simplified.). As shown in FIG. 3B, if a plurality of IC strap portions having the same configuration are manufactured together, and later separated one by one and combined with the second conductor holding portion on the auxiliary antenna side, it is expected that the manufacturing cost will be reduced due to the effect of mass production. can. Also, as will be described later, the combination of the IC strap portion and the second conductor holding portion is adjusted, and the shape of the first conductor 5 in the IC strap portion and the shape of the second conductor 7 in the second conductor holding portion are adjusted. By doing so, the impedance can be matched between the IC chip 4, the antenna (first conductor 5), and the auxiliary antenna (second conductor 7) (second and third embodiments described later). The same applies to form.).

FIG. 4 is a cross-sectional view of the IC tag shown in FIG. 1A taken along the line AA' in FIG. 1A and cut along the stacking direction (the stacking direction is shown upside down from FIG. 1B. ). In order from the top in FIG. 4, a second base material 8, a second conductor 7, an adhesive material 6 such as an adhesive material, a first conductor 5 (one conductor portion 5a, the other conductor portion 5b), and an IC A chip 4, a first substrate 3 and a peelable paper 2 are arranged. The adhesive used for fixing the IC chip 4 on the first base material 3 and other adhesives (if used) are omitted as appropriate. 9A and 10, which will be described later, the IC strap portion may be arranged in the upside down direction with respect to the stacking direction from the direction in FIG.

FIG. 5 is a conceptual equivalent circuit diagram for explaining the function of the IC tag shown in FIGS. 1A, 1B, etc. FIG. The electrical resistance R1 represents the resistance of one conductor portion 5a of the first conductor 5, the electrical resistance R2 represents the resistance of the other conductor portion 5b of the first conductor 5, and the electrical resistance R3 represents the resistance of the second conductor. 7 resistance. The electric capacity (electrostatic capacity) C1 represents the capacity generated by the presence of the adhesive 6 between the one conductor portion 5a and the second conductor 7, and the electric capacity (electrostatic capacity) C2 is It represents the capacitance generated by the presence of the adhesive 6 between the other conductor portion 5b and the second conductor 7. FIG. As shown in FIG. 2, the inductance L corresponds to the appearance of a loop-shaped path formed by the IC chip 4, the first conductor 5, and the second conductor 7 when viewed from the stacking direction. represents the generated inductance. Antennas A1 and A2 are conceptual representations of antenna functions realized by the first conductor 5 and the second conductor 7 . In one example of the case where the IC tag is a passive tag, the IC tag receives an electromagnetic wave (inquiry signal) such as a radio wave emitted from a reader device with an antenna, and the IC tag operates using the electromagnetic wave as an energy source. The information stored in the memory is transmitted as electromagnetic waves from the antenna of the IC tag, and the reader device acquires the information by receiving the electromagnetic waves from the IC tag with its own antenna. The circuit shown in FIG. 5 can function as an impedance matching circuit. The size of the overlapped portion when viewed from the direction, the size of the overlapped portion of the other conductor portion 5b and the second conductor 7 when viewed from the stacking direction can be changed, or By changing the size of the area (see FIG. 2) that appears to be surrounded by the IC chip 4, the first conductor 5, and the second conductor 7, the impedance is adjusted to It is possible to match the impedance between the parts (the same applies to the second and third embodiments described later).

IC Tag Manufacturing Method FIGS. 6A and 6B are diagrams for explaining the manufacturing method of the IC strap portion used in the IC tag according to the first embodiment of the present invention, and FIG. It is a figure for demonstrating an example of the method of manufacturing the IC tag which concerns on 1st Embodiment of this invention using. In FIGS. 6A and 7, each process is illustrated so as to proceed to the right along the time series.

As shown in FIG. 6A, first, an adhesive such as an adhesive or a sticky material is formed on the IC chip fixing position on the first substrate 3, or an adhesive such as an adhesive is applied to at least the surface including the IC chip fixing position. Alternatively, a layer containing an adhesive material (adhesive functional layer) is formed, and then the IC chip 4 is fixed to the IC chip fixing position. At the time of this fixation, by pressing the IC chip 4 with a press machine or the like in the direction indicated by the arrow in FIG. ) (In order to facilitate compression and deformation, the first base material 3 may be soaked in water in advance to soften it.). In one example, when fixing the IC chip 4 to the IC chip fixing position, the height of the first substrate 3 in the plane on the IC chip fixing position side and around the IC chip fixing position and the terminal portion of the IC chip The first base material 3 is deformed so that the difference between the height and the height of the IC chip is less than half the thickness of the IC chip, and the first base material 3 is in a compressed state (for d and h in FIG. 2h is established (d is twice or more than h)), it is preferable to form the first conductor 5 later (in the embodiment described later, the IC chip 4 is formed on the first base material 3). The same applies when fixing.). If the first conductor 5 is formed in such a state, the first conductor 5 can be formed on a surface with relatively small irregularities, and the performance of the first conductor 5 as an antenna is considered to be stable. be. Of course, depending on the thickness of the first base material 3, the IC chip 4 may be completely embedded in the first base material 3 so that h=0 if possible. The formation of the first conductor 5 is performed by a method such as printing, foil stamping, or etching, as already described, and as shown in FIG. It is electrically connected to one conductor portion 5a of the conductor 5, and the second terminal portion (second connection electrode 4b) of the IC chip 4 is electrically connected to the other conductor portion 5b of the first conductor 5. Connected. The fixing of the IC chip 4 with an adhesive or adhesive (including compression and deformation of the first base material 3) and the formation of the first conductors 5 are performed multiple times on the first base material 3 at intervals. As a result, as shown in FIG. 3B, a plurality of IC strap portions are manufactured in a connected state. Electrical connection between the IC chip 4 and the first conductor 5 often requires high-precision work, so if a plurality of IC strap portions are manufactured collectively in this way, the work can be standardized. Efficiency can be expected by

On the other hand, as shown in FIG. 7, a second conductor 7 is printed as an auxiliary antenna on a second base material 8 (here, paper) (for example, a second conductor having a shape as shown in FIG. 2). 7 are printed in multiples at intervals as also shown in FIG. Further, an adhesive material 6 such as an adhesive material is applied to the surface on which the second conductors 7 are printed, and the IC strap portion 9a is placed on the adhesive material 6 so that the first conductor 5 side faces the adhesive material 6 side. By fixing with , the IC strap portion 9a is mounted (the IC strap portion 9a in a connected state as shown in FIG. 3B is mounted at a position corresponding to each of the plurality of printed second conductors 7. They are mounted after being separated one by one (see FIG. 8). Next, the peelable paper 2 is attached from the first substrate 3 side of the IC strap portion 9a. As shown in FIG. 7, the peelable paper 2 adheres to the adhesive material 6 present in the space between the IC strap portions 9a. It is not necessary to apply an adhesive material or the like to the opposite surface. After that, as shown in FIG. 7, the layers of the second base material 8 and the adhesive material 6 are cut (cut) so as to separate the IC tags one by one. In FIG. 2, the second base material 8 and the adhesive 6 are partially removed by scraping, resulting in a shape smaller than the releasable paper 2 (a rectangular shape with four rounded ends). ) is performed, and then wound into a roll shape.

(Second embodiment)
Structure of IC tag
FIG. 9A is a cross-sectional view of the IC tag according to the second embodiment of the present invention, taken along the stacking direction, corresponding to the AA′ line cross section in FIG. 1A. From the top in FIG. 9A, the cover 10, the first adhesive layer 11 made of adhesive or adhesive, the IC chip 4, the first conductor 5 (one conductor part 5a, the other conductor part 5b), the first A substrate 3, a second adhesive layer 12 made of adhesive or adhesive, a second conductor 7, a second substrate 8, a third adhesive layer 13 made of adhesive or adhesive, and peelable paper 2 are arranged. . In addition, an adhesive or the like used when forming the first conductor 5 on the first base material 3 (unnecessary when forming by printing) is used when fixing the IC chip 4 on the first conductor 5. Adhesives, etc., and other adhesives, etc. (if used) are omitted as appropriate. Also, descriptions of elements and configurations that may be the same as in the first embodiment are omitted.

As shown in FIG. 9A, although the layer structure of the IC tag according to the second embodiment is different from the layer structure of the IC tag according to the first embodiment (FIG. 4), the plan perspective view seen from the stacking direction is shown in FIG. (Adjustable as described later with reference to FIGS. 11A to 11D and FIG. 12. In the first embodiment and the third embodiment described later, the configuration shown in FIG. 2 can also be used.) 11A to 11D and FIG. 12), the second embodiment, and the IC tag according to the third embodiment described later also use FIG. can function as an impedance matching circuit as described above. Electrical connection between the first connection electrode 4a of the IC chip 4 and one conductor portion 5a of the first conductor 5, the second connection electrode 4b of the IC chip 4 and the other conductor portion 5b of the first conductor 5 is as shown in FIG. 9B, for example.

FIG. 10 is a cross-sectional view of a modification of the IC tag according to the second embodiment of the present invention, in which the IC strap portion is arranged upside down in the stacking direction in the configuration of FIG. 9A. In order from the top in FIG. 10, the cover 10, the first adhesive layer 11 made of adhesive or adhesive material, the first base material 3, the first conductor 5 (one conductor portion 5a, the other conductor portion 5b), An IC chip 4, a second adhesive layer 12 made of adhesive or adhesive, a second conductor 7, a second base material 8, a third adhesive layer 13 made of adhesive or adhesive, and peelable paper 2 are arranged. . As in FIG. 9A, the IC chip 4 is fixed on the first conductor 5 with an adhesive or the like (unnecessary when forming by printing) used when forming the first conductor 5 on the first base material 3. Adhesives and other adhesives (if used) are omitted as appropriate. Also, descriptions of elements and configurations that may be the same as in the first embodiment are omitted. The IC tag 1 having the layer structure shown in FIG. 10 can function in substantially the same way as the IC tag 1 having the layer structure shown in FIG. 9A. Performance may change.

Here, how the first conductor 5 and the second conductor 7 overlap when viewed from the stacking direction (how the one conductor portion 5a and the second conductor 7 overlap, and how the other conductor portion 5b overlaps). The manner of overlapping with the second conductor 7), the positional relationship, the size, etc. are not limited to the mode shown in FIG. 2 and can be changed. Examples of different overlapping methods, positional relationships, sizes, etc. from those in FIG. 2 are shown as plan perspective views in FIGS. 11A to 11C. As shown in these figures, by appropriately adjusting the overlapping manner and the like, the capacitance related to the overlapping of the one conductor portion 5a and the second conductor 7 viewed from the stacking direction and the capacitance of the other conductor portion 5b , and the second conductor 7, the capacitance related to the overlap when viewed from the stacking direction, the above-described inductance, etc. can be appropriately adjusted. For example, when mounting the IC strap portion on the second conductor holding portion as shown in FIG. By increasing or decreasing the area that seems to be surrounded by the two conductors 7, the above-mentioned inductance can be changed, and the amount of overlap between the conductor portion 5a and the second conductor 7 when viewed in the stacking direction can be changed. By increasing or decreasing the size of the overlap between the conductor portion 5b and the second conductor 7 when viewed in the stacking direction, the capacitance caused by the overlap can be changed.

The shape of not only the first conductor 5 but also the second conductor 7 can be changed as appropriate. For example, as shown in FIG. and the IC chip 4 (in FIG. 12, the area surrounded by the broken line path and the IC chip 4) becomes wider as the distance from the IC chip side increases in the area. The shape of the second conductor 7 may be modified so as to have portions. By adopting such a shape of the second conductor 7, even if the mounting position of the IC strap portion is slightly displaced in the vertical direction, the displacement of the inductance due to the displacement can be made relatively small.

As already described, as the material of the first conductor 5 and the material of the second conductor 7, for example, metal, metal particles containing resin, carbon particles, carbon nanotubes, etc. can be used. and the material of the second conductor 7 may be the same or different, but in one example, the first conductor 5 is made of metal and the second conductor 7 is made of resin. It is formed of conductive particles such as metal particles, carbon particles, carbon nanotubes, or the like. Considering the electrical connectivity with the terminal portion of the IC chip 4, the material of the first conductor 5 is preferably a metal with particularly high conductivity. This is because it is considered that relatively good performance can be obtained even if a material with low conductivity compared to metal is used (for example, it has a sheet resistance of about 30 Ω/□ (Ω/sq.) Even if the material is used, it is considered that approximately 80% of the communication performance (communication distance) can be obtained compared to the case of using metal.). By combining the first conductor 5 as an antenna and the second conductor 7 as an auxiliary antenna, the communicable distance of the IC tag can be extended as compared with the case without the auxiliary antenna.

In one example, the first conductor 5 and the second conductor 7 are formed as conductors having different sheet resistance (surface resistivity) values, and the sheet resistance of the second conductor 7 is the same as that of the first conductor. It can be ten times or more the sheet resistance of the body 5 . For example, when an antenna is made with conductive ink, the resistance becomes high, and the sheet resistance may be ten times or more that of ordinary aluminum foil. By combining the second conductor 7 with the first conductor 5 such as a highly conductive metal, it is possible to function as an antenna for the IC tag. Such a set of the first conductor 5 and the second conductor 7 includes, for example, a metal (first conductor 5) that is a good conductor of electricity, such as aluminum, silver, and copper, and nanoparticles (gold, silver, Metal nanoparticles such as copper, aluminum, nickel, or powder of carbon, graphite, etc.) dispersed in a vehicle (binder) (second conductor 7) can be used. As an example of the second conductor 7, black conductive ink using carbon or graphite also exists as a product. Epoxy resin is generally used as the vehicle (binder), but urethane, silicone, acrylic, polyimide, other thermosetting resins, and thermoplastic resins can also be used depending on the required properties and the location of use. Further, the specific sheet resistance values of the first conductor and the second conductor may be arbitrary. ) above, it may be formed as a conductor having a sheet resistance value of 1000Ω/□ or less. In one example, the sheet resistance of the second conductor 7 can be adjusted by, for example, adjusting the concentration of carbon particles in the second conductor 7, thereby adjusting the sheet resistance of the first conductor 5 (such as silver). can also be adjusted. The ratio between the sheet resistance value of the first conductor 5 and the sheet resistance value of the second conductor 7, and the specific sheet resistance values of the first conductor 5 and the second conductor 7 are respectively The same may be applied to the first and third embodiments.

In one example, the measurement of the sheet resistance of each of the first conductor 5 and the second conductor 7 is performed by A second sheet having the same material and the same thickness as the second conductor 7 formed in 1 is prepared in advance, and the sheet resistance of each of the first and second sheets is measured by, for example, a four-probe method. It can be done by measuring in the method. The measured value of the sheet resistance of the first sheet at this time may be taken as the sheet resistance value of the first conductor 5 , and the measured value of the sheet resistance of the second sheet may be taken as the sheet resistance value of the second conductor 7 .

Any method can be used to measure the sheet resistance. For example, the measurement configuration shown in FIG. 13 can be used. In the configuration of FIG. 13, the first sheet is cut into a rectangular (rectangular) shape with a vertical width of 1 mm and a horizontal width of 10 mm (not cut in the thickness direction), and both ends of the cut first sheet with a width of 10 mm are cut. The electrical resistance (= DC voltage/DC current) of the cut first sheet is measured by applying a DC voltage between value can be used as the sheet resistance value (Ω/□, or Ω/sq.) of the first conductor 5 . Similarly, for the sheet resistance value of the second conductor 7, the second sheet is cut into a rectangular (rectangular) shape having a vertical width of 1 mm and a horizontal width of 10 mm (not cut in the thickness direction). The electrical resistance (= DC voltage/DC current) of the cut second sheet is measured by applying a DC voltage between both ends of the two sheets with a width of 10 mm and measuring the DC current, and the resistance obtained by the measurement A value that is one tenth of the value can be used as the sheet resistance value (Ω/□ or Ω/sq.) of the second conductor 7 .

Manufacturing Method of IC Tag Unlike the layer structure shown in FIG. 4, in the IC strap portion of the IC tag 1 having the layer structure shown in FIG. Then, the IC chip 4 is arranged on the first conductor 5 (FIG. 9B. However, the adhesive etc. are omitted). Therefore, unlike the method of manufacturing the IC strap portion described with reference to FIG. 6A, in manufacturing the IC strap shown in FIG. 9A or FIG. A first conductor 5 (one conductor portion 5a and the other conductor portion 5b) is formed by a method, and then the IC chip 4 is fixed on the first conductor 5 using an adhesive such as an adhesive. (As shown in FIG. 9B, the first terminal portion (first connection electrode 4a) of the IC chip 4 is electrically connected to one conductor portion 5a of the first conductor 5, and the second terminal portion of the IC chip 4 is electrically connected. The terminal portion (second connection electrode 4b) is electrically connected to the other conductor portion 5b of the first conductor 5).

On the other hand, the manufacturing method of the second conductor holding portion may be the same as the manufacturing method described using FIG. 7, and the second conductor 7 is formed on the second base material 8 by printing or the like. A second adhesive layer 12 is formed with an adhesive on the second conductor 7 side of the second conductor holding portion, and the IC strap portion is arranged on the second adhesive layer 12 (in the layer structure of FIG. 9A, the IC strap portion 10 is arranged so that the first base material 3 faces the second conductor 7 side, and in the layer structure of FIG. Furthermore, a first adhesive layer 11 is formed using an adhesive on the surface of the IC strap portion (the IC chip side in the layer structure of FIG. 9A, the first base material 3 side in the layer structure of FIG. 10), and the cover 10 is attached, a third adhesive layer 13 is formed on the surface on the side of the second conductor holding portion (on the side of the second base material 8) using an adhesive such as an adhesive, and the peelable paper 2 is attached. .

(Third embodiment)
Structure of IC tag
FIG. 14 shows, as a plan perspective view, viewed from the stacking direction, IC tags (a state in which a plurality of them are connected) provided with a cut along a path surrounding the IC strap portion according to the third embodiment of the present invention. FIG. 10 is a diagram showing a state in which an IC strap portion and its peripheral portion are separated from other portions along a cut in one of the IC tags. FIG. 15 is a perspective plan view showing a configuration in which the cut is partial (at least part of which is provided with an "uncut") as a modified example of the IC tag according to the third embodiment of the present invention. If a part of the IC tag 1 is cut along a cut or an uncut (having an uncut portion) cut 15, the IC chip 4, which may become an obstacle for disposal, or the first conductor containing metal in one example. 5 can be separated.

FIG. 16 is a cross-sectional view of an IC tag provided with cuts, taken along the stacking direction, corresponding to the cross-section taken along the line A-A' in FIG. 1A. In order from the top in FIG. 16, the second substrate 8, the second conductor 7, the adhesive 6 such as an adhesive material, the IC chip 4, the first conductor 5 (one conductor portion 5a, the other conductor portion 5b), a first substrate 3 and a releasable paper 2 are arranged. Note that the adhesive used when fixing the IC chip 4 on the first conductor 5 and other adhesives (if used) are omitted as appropriate. An adhesive such as an adhesive material is not formed between the IC strap portion and the peelable paper 2, and the IC strap portion is not directly fixed to the peelable paper 2 (the peelable paper 2 is attached to the second conductor holding portion with an adhesive 6 such as an adhesive, and the IC strap portion is a paper that can be separated from the second conductor holding portion on which the adhesive 6 such as an adhesive is formed. sandwiched between 2). Further, as shown in FIG. 16, the second base material 8, the second conductor 7, and the adhesive material 6 such as an adhesive material are provided with cuts or uncut cuts 15 described with reference to FIGS. A portion surrounded by a cut or an uncut cut 15 (see FIGS. 14 and 15) is cut along the cut or the uncut cut 15 from the side of the second base material 8 in the stacking direction. Thus, the IC strap portion can be separated as already described (since the IC strap portion is adhered to the adhesive material 6 such as adhesive material in the portion to be cut off, the IC strap is also removed together with the portion to be cut off). As shown in FIG. 4, the structure of the IC strap may be such that the IC chip 4 is first fixed on the first substrate and the first conductor 5 is formed thereon. 4 and 16, the IC strap may be placed upside down in the stacking direction as described with reference to FIGS. 9A and 10. . The manner of connection between the first connection electrode 4a of the IC chip 4 and one conductor portion 5a of the first conductor 5, and the manner of connection between the second connection electrode 4b of the IC chip 4 and the other conductor portion 5b are also shown in FIG. 3A, FIG. 9B, etc., may be the same. In one example of use, a product seller peels off the detachable paper 2 from the IC tag 1, attaches the part other than the paper 2 to the package of the product from the side of the adhesive 6 such as an adhesive material, and uses it for product management. (assuming that the management information is stored in the memory of the IC chip), and sells the product. The consumer who has purchased the product separates the IC strap part by cutting off part of the IC tag 1 from the cut or the cut with uncut 15 and discards it, leaving the remaining part of the IC tag 1 attached. packaging separately.

IC Tag Manufacturing Method FIG. 17 is a diagram for explaining an example of an IC tag manufacturing method according to the third embodiment of the present invention. In FIG. 17, each process is illustrated so as to proceed to the right along the time series. The method of manufacturing the IC strap portion 9a may be the same as the method in the already described embodiments. A second conductor 7 is printed on a second base material 8 as an auxiliary antenna, and an adhesive 6 such as an adhesive is applied to the surface on which the second conductor 7 is printed. By fixing the portion 9a in such a direction that the IC chip 4 side faces the adhesive 6 side, the IC strap portion 9a is mounted (corresponding to each of the plurality of printed second conductors 7). 14 and 15, the connected IC strap portions 9a are cut off one by one and then mounted.). Next, the peelable paper 2 is attached from the first substrate 3 side of the IC strap portion 9a. As shown in FIG. 17, the releasable paper 2 adheres to the adhesive material 6 existing in the spaced area between the IC strap portions 9a. It is not necessary to apply an adhesive material or the like to the opposite surface. After that, as shown in FIG. 17, the layers of the second base material 8 and the adhesive material 6 are cut (cut) so as to separate the IC tags one by one, and scraps are removed. After making the cut described using or the cut with uncut 15 (in FIGS. 14 and 15, the cut is provided at least partially along the line indicated by the reference sign (number) "15"), It is wound into a roll shape.

The features described in the first, second, and third embodiments can be arbitrarily combined with each other.

INDUSTRIAL APPLICABILITY The present invention can be used in all industries, including management of products, parts, etc. in the manufacturing industry and product management in the retail industry.

1 IC tag 2 Peelable paper 3 First substrate 3a Adhesive (adhesive etc.)
4 IC chip 4a first connection electrode (bump)
4b Second connection electrode (bump)
5 First conductor 5a Conductor part 5b on one side Conductor part 6 on the other side Adhesive material (adhesive material, etc.)
7 second conductor 8 second base material 9a IC strap (IC holder)
9b Second conductor holding portion 10 Cover 11 First adhesive layer 12 Second adhesive layer 13 Third adhesive layer 14 First conductor or second conductor (for sheet resistance measurement)
15 Cuts or cuts with uncut R1 to R4 Electric resistance C1 to C2 Electric capacity (capacitance)
L Inductance A1-A2 Antenna

Claims (15)

an IC holder comprising a first base material, an IC chip, and a first conductor;
a second conductor holder comprising a second base material and a second conductor fixed to the second base material;
an adhesive material or adhesive material at least partially disposed between the IC holding portion and the second conductor holding portion;
with
The positional relationship between the IC chip, the first conductor, and the second conductor in a plane viewed from the stacking direction is such that a path starting from the IC chip and reaching the IC chip is the first conductor. A positional relationship that appears to be formed using the second conductor,
IC tag. In the IC holding portion, the IC chip is fixed to the first substrate, and at least a portion of the first conductor is electrically connected to at least one terminal portion of the IC chip,
The second conductor is fixed to the first conductor by the adhesive or adhesive material,
The IC tag according to claim 1. Having a laminated structure in which the second base material, the second conductor, the adhesive or adhesive material, the IC holding portion, and peelable paper are sequentially laminated,
The IC tag according to claim 2. In the IC holding portion, the first conductor is fixed to the first base material, and at least one terminal portion of the IC chip is electrically connected to at least a portion of the first conductor. cage,
The first base material or the IC chip is fixed to the second conductor by the adhesive or adhesive material,
The IC tag according to claim 1. Cover, cover-side adhesive or adhesive, IC holding portion, adhesive or adhesive, second conductor, second base material, peelable paper-side adhesive or adhesive, and peelable paper in this order. having a laminated laminated structure,
The IC tag according to claim 4. A loop-shaped matching circuit is formed by at least partially overlapping the first conductor and the second conductor when viewed in the stacking direction.
The IC tag according to any one of claims 1 to 5. The first conductor and the second conductor are each formed as conductors having different sheet resistance (surface resistivity) values, the sheet resistance of the second conductor being the sheet resistance of the first conductor. 7. The IC tag according to any one of claims 1 to 6, which is 10 times or more the resistance value. 8. The IC tag according to any one of claims 1 to 7, wherein said second conductor is formed as a conductor having a sheet resistance value of 0.1Ω/□ or more and 1000Ω/□ or less. 9. The IC according to any one of claims 1 to 8, wherein said first conductor or said second conductor is formed using a metallic material using a process of etching, hot stamping or printing. tag. 10. The first conductor or the second conductor according to any one of claims 1 to 9, made of a material containing metal particles, carbon particles, or carbon nanotubes, and further containing resin. The IC tag described in the paragraph. 11. The area of claim 1, wherein an area that appears to be surrounded by the IC chip and the path in the plane viewed from the stacking direction has a portion that widens in the area as the distance from the IC chip side increases. The IC tag according to any one of items. an IC holder comprising a first base material, a first conductor, and an IC chip;
a second conductor holder comprising a second base material and a second conductor fixed to the second base material;
an adhesive material or adhesive material at least partially disposed between the IC holding portion and the second conductor holding portion;
a peelable paper arranged to cover the IC holder;
with
The IC holding portion is not directly fixed to the peelable paper, and the IC holding portion is attached to the second conductor holding portion and the adhesive or sticky material within a plane viewed from the lamination direction. cut at least partially along the encircling line,
IC tag. The positional relationship between the IC chip, the first conductor, and the second conductor in a plane viewed from the stacking direction is such that a path starting from the IC chip and reaching the IC chip is the first conductor. A positional relationship that appears to be formed using the second conductor,
The IC tag according to claim 12. fixing the IC chip to the IC chip fixing position of the first substrate, comprising fixing the IC chip after forming a first adhesive or adhesive material at the IC chip fixing position; or fixing the IC chip to the IC chip fixing position of the first substrate having a layer containing the first adhesive or adhesive formed on at least a surface including the IC chip fixing position; and
A first conductor is formed so that at least a part of the first conductor is electrically connected to at least one terminal portion provided on a surface of the IC chip on a side different from the IC chip fixing position side. and
including
When the IC chip is fixed to the IC chip fixing position, the height of the first base material in the plane of the IC chip fixing position side and around the IC chip fixing position, and the terminal of the IC chip The first base material is deformed so that the difference between the height of the part and the height of the part is less than half the thickness of the IC chip, and the first conductor is formed in a state in which the first base material is compressed. I do,
A method for manufacturing an IC holding portion. manufacturing the IC holder by the method of claim 14;
forming a second electrical conductor on a second substrate;
forming an adhesive or sticky material on the second conductor;
disposing the IC holding portion on the adhesive or adhesive;
including
The positional relationship between the IC chip, the first conductor, and the second conductor in a plane viewed from the stacking direction is such that a path starting from the IC chip and reaching the IC chip is the first conductor. arranging the IC holding portion so as to have a positional relationship that appears to be formed using the second conductor;
A method for manufacturing an IC tag.

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