JP2023084143A - Dc-dc converter unit - Google Patents

Abstract

To provide a DC-DC converter unit in which an increase in height can be suppressed.SOLUTION: A DC-DC converter unit includes a DC-DC converter substrate 32, a converter switching element 31a mounted on the DC-DC converter substrate 32, and a lid portion 53 to which the DC-DC converter substrate 32 is attached. The lid portion 53 is attached to a base portion 50 so as to cover a groove provided in the base portion 50 to which an inverter part is attached, the inverter part converting power and supplying the converted power to a load.SELECTED DRAWING: Figure 4

Description

The present invention relates to a DC-DC converter device.

2. Description of the Related Art Conventionally, a power conversion device including a DC-DC converter section is known (see Patent Document 1, for example).

The aforementioned Patent Document 1 discloses a vehicle including an inverter device, a DC-DC converter (a DC-DC converter section), and a flow path forming body. The inverter device includes, for example, a semiconductor module forming an upper arm and a lower arm. DC-DC converters include MOSFETs, high-voltage circuit boards on which MOSFETs are mounted, and the like. The flow path forming body has a flat plate shape with a stepped upper surface. In Patent Document 1, the semiconductor module is mounted on the upper surface of the flow path forming body. A high-voltage circuit board of the DC-DC converter is attached to the side wall of the channel forming body.

WO2015/163143

In Patent Document 1, the high-voltage circuit board of the DC-DC converter is attached to the side wall of the flow path forming body. That is, the high-voltage circuit board is attached so as to be orthogonal to the upper surface of the flat plate-shaped flow path forming body. For this reason, the high-voltage circuit board is arranged so as to protrude from the upper and lower surfaces of the flow path forming body. Therefore, there is a problem that the height of the device including the inverter device and the DC-DC converter is increased.

The present invention has been made to solve the above problems, and one object of the present invention is to provide a DC-DC converter device capable of suppressing an increase in height. be.

In order to achieve the above object, a DC-DC converter device according to one aspect of the present invention includes a DC-DC converter substrate, switching elements mounted on the DC-DC converter substrate, and a flat member to which the DC-DC converter substrate is attached. , and the flat plate-like member is attached to the base so as to cover a groove provided in the base to which the power converter that converts electric power and supplies it to the load is attached.

In the DC-DC converter device according to the above aspect, preferably the switching element is arranged between the DC-DC converter substrate and the flat member.

The DC-DC converter device according to the above aspect preferably further includes a transformer, a resonant reactor, and a smoothing reactor mounted on the DC-DC converter board, wherein the transformer, the resonant reactor, and the smoothing reactor are mounted on the DC-DC converter board. is provided to pass through the

In this case, preferably, the flat member forms a cooling channel by being attached to the base so as to cover the groove provided in the base, and the transformer, the resonance reactor, and the smooth reactor are provided for cooling. It is cooled by a channel, and along the cooling channel, a resonant reactor, a transformer, and a smoothing reactor are arranged in that order.

In the DC-DC converter device according to the above aspect, preferably, the DC-DC converter board is arranged on the input side of the power conversion unit, and the boost converter unit boosts the DC power input from the DC power supply and supplies it to the power conversion unit. It is attached to the flat plate-like member so as to be adjacent to the reactor provided in.

The DC-DC converter device according to the above aspect preferably further includes a shielding cover that reduces heat interference from the outside.

1 is a circuit diagram of a power converter according to one embodiment; FIG. 1 is a perspective view of a power converter according to one embodiment; FIG. 1 is a side view of a power converter according to one embodiment; FIG. 1 is an exploded perspective view of a power conversion device according to an embodiment, viewed from above; FIG. 1 is an exploded perspective view of a power conversion device according to one embodiment, viewed from below; FIG. It is a top view of the base part of the power converter according to one embodiment. It is a bottom view of the base part of the power converter by one Embodiment. It is a side sectional view of the base part of the power converter by one embodiment.

Embodiments embodying the present invention will be described below with reference to the drawings.

A configuration of a power converter 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 8. FIG. Power conversion device 100 is mounted on a vehicle, for example.

First, the circuit configuration of the power converter 100 will be described with reference to FIG. The power conversion device 100 includes an inverter section 10 . Inverter unit 10 converts DC power input from DC power supply 200 into AC power and supplies the AC power to load 210 . Load 210 is, for example, a motor. A switch 201 is provided between the power converter 100 and the DC power supply 200 .

The inverter section 10 includes switching element modules 11 . The switching element module 11 converts DC power into AC power. Switching element module 11 includes semiconductor switching elements Q1, Q2 and Q3 forming an upper arm, and semiconductor switching elements Q4, Q5 and Q6 forming a lower arm.

The inverter section 10 includes a first inverter section 10a and a second inverter section 10b. The switching element module 11 includes a first switching element module 11a included in the first inverter section 10a and a second switching element module 11b included in the second inverter section 10b. Also, the load 210 includes a first load 210a and a second load 210b. The first inverter unit 10a converts the DC power input from the DC power supply 200 into AC power and supplies the AC power to the first load 210a. The second inverter unit 10b converts the DC power input from the DC power supply 200 into AC power and supplies the AC power to the second load 210b.

The power conversion device 100 includes a boost converter section 20 . Boost converter section 20 is arranged on the input side of inverter section 10 . Boost converter section 20 boosts the DC power input from DC power supply 200 and supplies it to inverter section 10 . Boost converter section 20 includes boost switching element module 21 and reactor 22 . Boosting switching element module 21 includes boosting switching elements Q11 and Q12. Boosting switching elements Q11 and Q12 form an upper arm and a lower arm, respectively. Further, boost converter section 20 includes a capacitor C1. Reactor 22 is provided between the positive side of DC power supply 200 and a connection point between boost switching element Q11 and boost switching element Q12. The capacitor C1 is provided in parallel with the boost switching element Q12.

The power conversion device 100 includes a capacitor C2 and a resistor R. Capacitor C<b>2 and resistor R are provided between boost converter section 20 and inverter section 10 . Capacitor C2 and resistor R are provided in parallel with each other.

The power conversion device 100 includes a DCDC converter section 30 . Note that the DCDC converter unit 30 converts the voltage of the DC power into different voltages. Specifically, the DCDC converter section 30 steps down the voltage of the DC power input from the DC power supply 200 via the connector 1 . Also, the DCDC converter section 30 supplies the stepped-down voltage to the output terminal 2 .

Next, the structure of the power conversion device 100 will be described.

In this embodiment, as shown in FIGS. 2 and 4, the DCDC converter section 30 includes a DC-DC converter element 31 and a DC-DC converter board 32 on which the DC-DC converter element 31 is mounted. The DC-DC converter board 32 has a flat plate shape. The DC-DC converter element 31 mounted on the DC-DC converter board 32 includes a converter switching element 31a, a transformer 31b, a resonance reactor 31c and a smoothing reactor 31d. The converter switching element 31a is provided on the back side (Z2 side) of the DC/DC converter board 32. As shown in FIG. Transformer 31 b , resonant reactor 31 c and smoothing reactor 31 d are provided so as to pass through DC-DC converter board 32 .

As shown in FIG. 5, the switching element module 11 accommodates therein semiconductor switching elements Q1 to Q6 (see FIG. 1). The semiconductor switching elements Q1 to Q6 are covered with a housing made of resin or the like. As shown in FIG. 4, the lid portion 12 is arranged on the side of the base portion 50 (Z1 side) of the switching element module 11, which will be described later. Lid portion 12 is made of, for example, metal with relatively high thermal conductivity such as aluminum. The lid portion 12 includes a flat plate-like body portion 12 a and a plurality of pillar portions 12 b projecting toward the base portion 50 . Column portion 12 b is formed to protrude into cooling channel 51 . Column portion 12b has, for example, a prismatic shape. The switching element module 11 has a rectangular shape when viewed in a direction perpendicular to the surface of the switching element module 11 .

As shown in FIGS. 2 to 5, the power conversion device 100 includes a base section 50. As shown in FIG. The base portion 50 has a flat plate shape. The inverter unit 10 and the DCDC converter unit 30 are arranged on the base unit 50 . Also, the base portion 50 is made of a metal having relatively high thermal conductivity, such as aluminum. The base portion 50 has a rectangular shape when viewed from a direction perpendicular to a front surface 50a (front surface (Z1 side surface)) and a back surface 50b (back surface (Z2 side surface)) of the base portion 50. .

As shown in FIG. 8, the base portion 50 has a front-side channel 51a arranged on the front side through which the cooling liquid flows, and a back-side channel 51b arranged on the back side connected to the front-side channel 51a. A cooling channel 51 is included.

In addition, the cooling channel 51 has a connection channel 51c that connects the front-side channel 51a and the back-side channel 51b in the base portion 50 .

In this embodiment, the switching element module 11 of the inverter section 10 is attached to the base section 50 along the front surface 50a or the back surface 50b of the flat base section 50 . Further, the DC-DC converter board 32 on which the DC-DC converter element 31 is mounted is attached to the base 50 along the front surface 50a or the back surface 50b of the flat base 50 .

Specifically, in the present embodiment, the switching element module 11 is attached to the base portion 50 along the rear surface 50b of the flat base portion 50 . Further, the DC-DC converter substrate 32 on which the DC-DC converter element 31 is mounted is attached to the base portion 50 along the surface 50a of the flat base portion 50 .

In this embodiment, the first switching element module 11a and the second switching element module 11b are attached to the base portion 50 along the rear surface 50b of the base portion 50 having a flat plate shape. Specifically, the first switching element module 11a and the second switching element module 11b are arranged adjacent to each other along the long side direction (X direction) of the first switching element module 11a and the second switching element module 11b. are placed. By arranging in this way, the width of the base portion 50 in the Y direction can be shortened, so that the size of the power conversion device 100 can be reduced.

Each of the first switching element module 11a and the second switching element module 11b has an inverter output terminal for outputting electric power to the load 210 on its longitudinal side. The inverter output terminals are arranged on at least one side of the longitudinal ends of the base portion 50 .

In the present embodiment, boost converter section 20 is attached to base section 50 along a front surface 50 a or a rear surface 50 b of flat base section 50 . Specifically, boost converter section 20 is attached to surface 50 a of base section 50 . Further, the boost converter section 20 is arranged so as to be adjacent to the DCDC converter section 30 along the longitudinal direction (X direction) of the plate-shaped base section 50 .

In this embodiment, the boost converter section 20 includes a boost switching element module 21 and a reactor 22 . The step-up switching element module 21 and the reactor 22 are attached to the base portion 50 along the front surface 50a or the back surface 50b of the base portion 50 having a flat plate shape. Specifically, the DC-DC converter board 32, the reactor 22, and the step-up switching element module 21 are arranged along the surface 50a of the flat base 50 and adjacent to each other. 50 is installed. Note that the DC/DC converter board 32, the reactor 22, and the step-up switching element module 21 are attached to the surface 50a of the base portion 50 in this order.

As shown in FIG. 5, the lid portion 21a is arranged on the base portion 50 side (Z2 side) of the switching element module 21 for boosting. Lid portion 21a is made of metal having relatively high thermal conductivity, such as aluminum or copper. The lid portion 21 a includes a flat plate-like body portion 21 b and a plurality of pillar portions 21 c that protrude toward the base portion 50 . Column portion 21 c is formed to protrude into cooling channel 51 . Column portion 21c has, for example, a cylindrical shape. The boosting switching element module 21 has a square shape when viewed from a direction perpendicular to the surface of the boosting switching element module 21 . The lid portion 21a may be provided integrally with the switching element module 21 for boosting. Note that the column portion 21c may have the function (shape) of a fin.

A lid portion 22a is arranged on the base portion 50 side (Z2 side) of the reactor 22 . Lid portion 22a is made of metal having relatively high thermal conductivity, such as aluminum. The lid portion 22a includes a body portion 22b and a plurality of fins 22c protruding toward the base portion 50. As shown in FIG. Fin 22 c is formed to protrude into cooling channel 51 . Fin 22 c is formed to extend along cooling flow path 51 .

In the present embodiment, as shown in FIGS. 4 and 5, the base portion 50 includes a cooling portion body portion 52 made of metal in which the cooling passages 51 are formed, and the cooling portion body portion 52 and the cooling passages 51. and lids 12, 21a, 22a, 53 made of metal to form. Also, the inverter section 10 and the DCDC converter section 30 are attached to lid sections 12 and 53 arranged on the front side and the back side of the base section 50 . Specifically, the DC-DC converter board 32 is attached to the lid portion 53 . Specifically, the cooling channels 51 are provided on both the front surface 50a and the rear surface 50b of the base portion 50 (see FIGS. 6 and 7). The lid portion 53 covers the cooling channel 51 provided on the surface 50 a of the base portion 50 . The lid portion 53 has a rectangular shape and a flat plate shape. The DC-DC converter board 32 is arranged along the surface 53 b of the lid portion 53 . The DC/DC converter board 32 is attached to a pillar portion 53c provided on the lid portion 53 by screws, for example. The lid portion 53 is attached to the cooling portion main body portion 52 by screws, for example. As a result, the DC-DC converter board 32 and the DC-DC converter element 31 can be easily replaced simply by removing the screws. The column portion 53c is provided so as not to overlap the cooling flow path 51 when viewed from the Z1 side in FIG. By doing so, an improvement in vibration resistance of the DC-DC converter substrate 32 can be expected. Alternatively, by providing the column portion 53c so as to overlap the cooling flow path 51, a heat radiation path from the DC-DC converter substrate 32 is formed, and thus an improvement in heat radiation can be expected.

Lid portion 53 is made of, for example, metal with relatively high thermal conductivity such as aluminum. The lid portion 53 is provided with fins 53 d that protrude into the cooling channel 51 . Fins 53 d are formed to extend along cooling flow path 51 .

Also, the lid portion 12 covers the cooling flow path 51 provided on the back surface 50 b of the base portion 50 . Two lid portions 12 are provided. The lid portion 12 has a rectangular shape and a flat plate shape. The first switching element module 11a and the second switching element module 11b are provided integrally with the lid portion 12, respectively. Note that the lid portion 12 may be prepared separately from the first switching element module 11a and the second switching element module 11b, and the lid portion 12 may be attached to the first switching element module 11a and the second switching element module 11b.

Also, the lid portion 21 a covers the cooling flow path 51 provided on the surface 50 a of the base portion 50 . The lid portion 21a has a rectangular shape and a flat plate shape. The boosting switching element module 21 is provided integrally with the lid portion 21a. Note that the lid portion 21 a may be prepared separately from the boost switching element module 21 and the lid portion 21 a may be attached to the boost switching element module 21 .

In this embodiment, as shown in FIG. 4, the DC-DC converter element 31 includes a converter switching element 31a. The converter switching element 31 a is attached to the surface of the DC/DC converter substrate 32 on the lid portion 53 side (the Z2 side surface) so as to be in contact with the lid portion 53 via the heat conducting member 33 . That is, the lid portion 53, the heat conducting member 33, and the converter switching element 31a are laminated in this order. Heat generated from converter switching element 31 a is radiated to lid portion 53 via heat conducting member 33 . The heat conducting member 33 is made of, for example, a ceramic sheet.

The DCDC converter section 30 has a capacitor C1 connection terminal connected to the capacitor C1. The capacitor C1 connection terminal is arranged on the other side opposite to at least one of the longitudinal ends of the base section 50 where the inverter output terminals of the first switching element module 11a and the second switching element module 11b are arranged. be. In FIG. 2, the capacitors C1 and C2 are arranged from the left on the front side of the Y-direction paper surface below the base unit 50 (Z2 side), and the DCDC converter unit 30 and the capacitor C1 are connected on the left side of the X-direction paper surface. It is shown. By arranging the terminals in this way, there is no need to worry about the inverter output terminals of the first switching element module 11a and the second switching element module 11b when arranging the capacitor C1. becomes easier. As a result, the size of the power conversion device 100 can be reduced.

Further, the lid portion 53 is provided with a hole portion 53a. Reactor 22 is arranged to cover hole 53 a of lid 53 . That is, the reactor 22 is arranged so as to cover the cooling flow path 51 . Heat generated from the reactor 22 is radiated to the cooling liquid flowing through the cooling flow path 51 . Reactor 22 is attached to lid portion 53 by screws, for example.

A hole portion 52 a is provided in the cooling portion main body portion 52 . The boosting switching element module 21 is arranged so as to cover the hole 52 a of the cooling unit main body 52 . That is, the boosting switching element module 21 is arranged so as to cover the cooling flow path 51 . The heat generated from the boost switching element module 21 is radiated to the cooling liquid flowing through the cooling flow path 51 . The boosting switching element module 21 is attached to the cooling unit main body 52 with screws, for example. The boosting switching element module 21 has a capacitor C2 connection terminal connected to the capacitor C2. The capacitor C2 connection terminal is arranged on the other side opposite to at least one of the longitudinal ends of the base section 50 where the inverter output terminals of the first switching element module 11a and the second switching element module 11b are arranged. be. In FIG. 2, the capacitors C1 and C2 are arranged from the left on the front side of the Y-direction paper surface below the base portion 50 (Z2 side), and the boosting switching element module 21 and the capacitor C1 are connected on the right side of the X-direction paper surface. state is indicated. By arranging the terminals in this way, there is no need to worry about the inverter output terminals of the first switching element module 11a and the second switching element module 11b when arranging the capacitor C1. becomes easier. As a result, the size of the power conversion device 100 can be reduced. More desirably, the capacitor C1 connection terminal and the capacitor C2 connection terminal are arranged on the same side of the longitudinal end of the base portion 50 .

As shown in FIG. 5, the cooling unit main body 52 is provided with a pair of holes 52b. The first switching element module 11a and the second switching element module 11b are each arranged to cover the hole 52b. That is, the first switching element module 11 a and the second switching element module 11 b are arranged so as to cover the cooling flow path 51 . The heat generated from the switching element module 11 is radiated to the cooling liquid flowing through the cooling channel 51 .

As shown in FIG. 3 , the cooling flow path 51 has a front side flow path 51 a and a back side flow path 51 b that are alternately connected, and the cooling liquid alternately passes through the front side surface and the back side surface of the base portion 50 . is formed as Specifically, the cooling flow path 51 is arranged on the front side (surface 50a side), and cooling flow paths 511, 515, and 519 as the front side flow path 51a are arranged on the back side (back surface 50b side). It includes cooling channels 513 and 517 as 51b and cooling channels 512, 514, 516 and 518 as connecting channels 51c. The cooling flow path 51 is formed such that the cooling fluid flows in from one end side in the longitudinal direction (X direction) of the base portion 50 and the cooling fluid flows out from the other end side.

In the cooling channel 51, cooling channels 511, 512, 513, 514, 515, 516, 517, 518 and 519 are connected in this order from upstream to downstream. That is, as shown in FIGS. 3, 6, and 7, the cooling flow path 51 receives the cooling liquid from the cooling flow path 511 of the front side flow path 51a, the cooling flow path 512 of the connection flow path 51c, and the back side flow. Cooling channel 513 of channel 51b, cooling channel 514 of connecting channel 51c, cooling channel 515 of front side channel 51a, cooling channel 516 of connecting channel 51c, cooling channel 517 of back side channel 51b, connecting channel The cooling liquid flows out through the cooling channel 518 of the path 51c and the cooling channel 519 of the front side channel 51a. The inlet into which the cooling liquid of the cooling channel 51 flows and the outlet from which the cooling liquid flows out may be arranged at the center of the base portion 50 in the width direction. By arranging in this way, in the power conversion device 100 shown in FIG. 2 , the surface on which the DCDC converter section 30 is arranged is arranged either on the upper surface or on the lower surface when it is accommodated in the customer device. Also, since the positions of the inlet for the inflow of the cooling liquid and the outlet for the outflow of the cooling liquid remain unchanged, it is not necessary for the customer to change the piping layout of the cooling liquid.

Further, the cooling liquid that has flowed out of the cooling channel 51 is radiated and cooled by the heat radiating portion 60 . The cooling liquid cooled by the heat radiating section 60 is sent by the pump 61 and flows into the cooling flow path 51 again. The radiator 60 includes a heat exchanger and is cooled by outside air. Heat dissipation unit 60 is, for example, a radiator. Alternatively, the pump 61 may be arranged between the outlet of the cooling channel 51 and the heat radiating section 60 so that the cooling liquid before being radiated by the heat radiating section 60 may be sent by the pump 61 . Also, the cooling liquid is, for example, liquid such as water or antifreeze.

Further, as shown in FIG. 3, the inverter section 10 is arranged on the back side of the base section 50 and cooled by the cooling liquid flowing through the back side flow path 51b. Specifically, the first switching element module 11a and the second switching element module 11b are arranged on the back side of the base section 50 and cooled by the cooling liquid flowing through the back side channel 51b.

Further, the DCDC converter section 30 is arranged on the front side of the base section 50 and is cooled by the cooling liquid flowing through the front side flow path 51a. Specifically, the converter switching element 31a, the transformer 31b, the resonant reactor 31c, the smoothing reactor 31d, the step-up switching element module 21, and the reactor 22 are arranged on the front side of the base portion 50, and It is cooled by the cooling liquid flowing through the flow path 51a.

In the DCDC converter section 30 , the DC-DC converter element 31 may be arranged on the DC-DC converter substrate 32 in consideration of the influence of heat interference from the reactor 22 . Specifically, among the converter switching element 31a, the transformer 31b, the resonant reactor 31c, and the smoothing reactor 31d, parts with low heat resistance are avoided from being arranged on the side closer to the reactor.

In addition to the DC-DC converter element 31, the DCDC converter section 30 is mounted with components such as a fuse, a capacitor, and a Hall sensor element. heat is dissipated.

At least a portion of the DCDC converter section 30 on the reactor 22 side may be covered with a shielding cover in order to reduce thermal interference from the reactor 22 .

In addition, as shown in FIG. 8, the connecting channel 51c has chamfered corners. Specifically, a chamfered portion 510 is provided at a portion of the connection channel 51c that connects to the front side channel 51a and a portion that connects to the back side channel 51b. With such a configuration, the pressure loss of the cooling liquid flowing back and forth between the front-side channel 51a and the back-side channel 51b is suppressed. Further, by providing a channel adjusting member having a recessed portion or a convex portion in the front side channel 51a in the vicinity of the connection portion with the connection channel 51c, the flow of the cooling liquid can be controlled from the back side channel 51b through the connection channel 51c to the front side flow. The pressure loss of the cooling liquid is suppressed when proceeding to the path 51a.

The cooling flow path 51 includes a first switching element module 11a, a second switching element module 11b, a converter switching element 31a, a transformer 31b, a resonance reactor 31c, a smoothing reactor 31d, a boost switching element module 21, and a reactor 22. Among them, the cooling liquid is formed to flow so that the components with higher priority based on heat resistance are cooled first. Specifically, the cooling flow path 51 is formed so as to cool the boost switching element module 21 and the reactor 22, which have relatively low heat resistance, on the upstream side. Alternatively, the cooling flow path 51 includes a first switching element module 11a, a second switching element module 11b, a converter switching element 31a, a transformer 31b, a resonance reactor 31c, a smoothing reactor 31d, a boost switching element module 21, and a reactor 22. Among them, components having a high priority for cooling based on the amount of heat generated are arranged on the upstream side.

The cooling flow path 51 includes a boost switching element module 21, a second switching element module 11b, a reactor 22, a converter switching element 31a, a resonance reactor 31c, a transformer 31b, a first switching element module 11a, and a smoothing reactor 31d. The cooling liquid is formed to flow so as to cool in the order of .

As shown in FIGS. 3 , 6 and 7 , the boost switching element module 21 is cooled by the cooling liquid flowing through the cooling flow path 511 . Also, the second switching element module 11 b is cooled by the cooling liquid flowing through the cooling flow path 513 . Also, the resonant reactor 31 c , the converter switching element 31 a , and the transformer 31 b are cooled by the cooling liquid flowing through the cooling flow path 515 . Also, the first switching element module 11 a is cooled by the cooling liquid flowing through the cooling channel 517 . Also, the smoothing reactor 31 d is cooled by the cooling liquid flowing through the cooling flow path 519 .

[Effect of this embodiment]
The following effects can be obtained in this embodiment.

In the present embodiment, as described above, the DC-DC converter substrate 32 on which the DC-DC converter element 31 is mounted is attached to the base portion 50 along the front surface 50a or the back surface 50b of the flat base portion 50. It is As a result, the DC-DC converter board 32 is attached to the base 50 along the front surface 50 a or the back surface 50 b of the flat plate-shaped base 50 , so that the DC-DC converter board 32 is attached to the surface of the base 50 . Unlike the case where it is attached along the direction perpendicular to 50a or back surface 50b, it is possible to suppress the height of power conversion device 100 from increasing.

In the present embodiment, as described above, the switching element module 11 is attached to the base portion 50 along the back surface 50b of the flat base portion 50, and the DC/DC converter element 31 is mounted thereon. The DC-DC converter board 32 is attached to the base portion 50 along the surface 50a of the flat base portion 50 . As a result, the switching element module 11 and the DC/DC converter element 31 are mounted on different surfaces, so unlike the case where the switching element module 11 and the DC/DC converter element 31 are mounted on the same surface, the surface 50a of the base portion 50 is Also, it is possible to suppress an increase in the size of the back surface 50b. That is, it is possible to suppress an increase in the size of the power converter 100 in the horizontal direction (direction along the XY plane).

In the present embodiment, as described above, the first switching element module 11a and the second switching element module 11b are attached to the base portion 50 along the front surface 50a or the back surface 50b of the flat base portion 50. there is Accordingly, since the first switching element module 11a and the second switching element module 11b are attached to the base 50 along the front surface 50a or the back surface 50b of the base 50, two inverter units 10 are provided. Even when the height of the power conversion device 100 is increased, it is possible to prevent the height of the power conversion device 100 from increasing.

In the present embodiment, as described above, boost converter section 20 is attached to base section 50 along front surface 50a or rear surface 50b of flat base section 50 . As a result, the boost converter section 20 is also attached to the base section 50 along the front surface 50a or the back surface 50b of the base section 50. Therefore, even when the boost converter section 20 is provided, the power conversion device 100 increase in height can be suppressed.

In this embodiment, as described above, the step-up switching element module 21 and the reactor 22 are attached to the base portion 50 along the front surface 50a or the back surface 50b of the base portion 50 having a flat plate shape. As a result, the step-up switching element module 21 and the reactor 22 are attached to the base portion 50 along the front surface 50a or the rear surface 50b of the flat plate-shaped base portion 50, so that the step-up switching element module 21 and the reactor 22 are stacked in the height direction of the power conversion device 100, it is possible to prevent the height of the power conversion device 100 from increasing.

In the present embodiment, as described above, the switching element module 11 is attached to the base portion 50 along the back surface 50b of the flat plate-shaped base portion 50, and includes the DC/DC converter board 32, the reactor 22, and the The boosting switching element modules 21 are attached to the base portion 50 along the surface 50a of the flat base portion 50 and adjacent to each other. As a result, the switching element module 11, the DC-DC converter board 32, the reactor 22, and the step-up switching element module 21 are mounted on different surfaces. Unlike the case where all the switching element modules 21 are mounted on the same surface, it is possible to suppress the size of the front surface 50a or the rear surface 50b of the base portion 50 from increasing.

In the present embodiment, as described above, the base portion 50 includes the cooling portion body portion 52 made of metal in which the cooling passages 51 are formed, and the lid made of metal that covers the cooling passages 51 of the cooling portion body portion 52. The DC-DC converter board 32 is attached to the lid portion 53 . As a result, the DC-DC converter board 32 can be easily cooled by the cooling liquid flowing through the cooling channel 51 via the lid portion 53 .

In the present embodiment, as described above, the DC-DC converter element 31 includes the converter switching element 31a, and the converter switching element 31a is mounted on the surface of the DC-DC converter substrate 32 on the lid portion 53 side. It is attached so as to come into contact with the lid portion 53 via the . As a result, the converter switching element 31 a can be easily cooled by the cooling liquid flowing through the cooling flow path 51 . Further, when the converter switching element 31a is attached to the lid portion 53 with a screw, it is necessary to form the portion of the lid portion 53 into which the screw is screwed so as to protrude into the cooling passage 51 of the cooling portion main body portion 52. The pressure loss of the cooling liquid flowing through the passage 51 increases. Therefore, by attaching the converter switching element 31 a to the surface of the DC/DC converter substrate 32 on the lid portion 53 side so as to contact the lid portion 53 via the heat conducting member 33 , the cooling current flowing through the cooling channel 51 is reduced. It is possible to suppress the pressure loss of the liquid from increasing.

In this embodiment, as described above, the DC-DC converter element 31 mounted on the DC-DC converter board 32 includes the converter switching element 31a, the transformer 31b, the resonance reactor 31c, and the smoothing reactor 31d. As a result, the converter switching element 31a, the transformer 31b, the resonance reactor 31c, and the smoothing reactor 31d are all arranged along the front surface 50a or the rear surface 50b of the flat base portion 50, so that the converter switching element 31a, An increase in the height of the power conversion device 100 including the transformer 31b, the resonance reactor 31c and the smoothing reactor 31d can be suppressed.

[Modification]
It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of claims rather than the description of the above-described embodiments, and includes all modifications (modifications) within the scope and meaning equivalent to the scope of claims.

Although the switching element module 11 is attached to the back surface 50b of the base portion 50 and the DC/DC converter board 32 is attached to the front surface 50a of the base portion 50 in the above embodiment, the present invention is not limited to this. Not limited. For example, the switching element module 11 may be attached to the front surface 50 a of the base portion 50 and the DC/DC converter board 32 may be attached to the back surface 50 b of the base portion 50 . Also, both the switching element module 11 and the DC/DC converter board 32 may be attached to the surface 50 a of the base portion 50 . Also, both the switching element module 11 and the DC/DC converter board 32 may be attached to the rear surface 50 b of the base portion 50 .

Although the first switching element module 11a and the second switching element module 11b are both attached to the rear surface 50b of the base 50 in the above embodiment, the present invention is not limited to this. For example, the first switching element module 11 a and the second switching element module 11 b may be attached to different surfaces of the base portion 50 .

In the above embodiment, an example in which the boost converter section 20 is attached to the surface 50a of the base section 50 is shown, but the present invention is not limited to this. For example, boost converter section 20 may be attached to back surface 50 b of base section 50 .

In the above-described embodiment, an example is shown in which the boost switching element module 21 and the reactor 22 are both attached to the surface 50a of the base portion 50, but the present invention is not limited to this. For example, the boost switching element module 21 and the reactor 22 may both be attached to the back surface 50 b of the base portion 50 . Also, the boosting switching element module 21 and the reactor 22 may be attached to different surfaces of the base portion 50 .

Although the base portion 50 is separated into the cooling portion body portion 52 and the lid portion 53 in the above embodiment, the present invention is not limited to this. For example, the base portion 50 may be integrally configured without the cooling portion body portion 52 and the lid portion 53 being separated.

In the above embodiment, the DC-DC converter element 31 mounted on the DC-DC converter board 32 includes the converter switching element 31a, the transformer 31b, the resonance reactor 31c and the smoothing reactor 31d. Not limited. For example, the DC-DC converter element 31 mounted on the DC-DC converter board 32 may include elements other than these elements.

10 inverter section 10a first inverter section 10b second inverter section 11 switching element module 11a first switching element module 11b second switching element module 20 boost converter section 21 boost switching element module 22 reactor 30 DCDC converter section 31 DC/DC converter element 31a Switching element for converter 31b Transformer 31c Resonance reactor 31d Smoothing reactor 33 Heat transfer member 50 Base 50a Front surface 50b Back surface 51 Cooling channel 52 Cooling unit body 53 Lid 100 Power converter 200 DC power supply 210 Load

Claims (6)

a DC-DC converter board;
a switching element mounted on the DC-DC converter board;
A flat plate-shaped member to which the DC-DC converter board is attached,
The flat plate-shaped member is attached to the base so as to cover a groove provided in the base to which the power conversion unit that converts electric power and supplies it to the load is attached. 2. The DC-DC converter device according to claim 1, wherein said switching element is arranged between said DC-DC converter board and said flat member. Further comprising a transformer, a resonant reactor, and a smoothing reactor mounted on the DC-DC converter board,
3. The DC-DC converter device according to claim 1, wherein said transformer, said resonance reactor, and said smoothing reactor are provided so as to pass through said DC-DC converter substrate. The flat plate-shaped member forms a cooling channel by being attached to the base so as to cover the groove provided in the base,
The transformer, the resonance reactor, and the smoothing reactor are cooled by the cooling flow path, and the resonance reactor, the transformer, and the smoothing reactor are arranged in this order along the cooling flow path. 4. The DC-DC converter device according to 3. The DC-DC converter board is arranged on the input side of the power conversion unit so as to be adjacent to a reactor provided in a boost converter unit that boosts DC power input from a DC power supply and supplies it to the power conversion unit. 5. The DC-DC converter device according to claim 4, wherein said DC-DC converter device is attached to said plate-shaped member. 3. The DC-DC converter device according to claim 1, further comprising a shielding cover for reducing heat interference from the outside.

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