JP2023066003A - Liquid discharge head and method for manufacturing the same - Google Patents

Abstract

To surely seal an electric connection part, and suppress sealing defects.SOLUTION: A liquid discharge head has: a recording element substrate 3 for discharging a liquid; an electric wiring board 4 which is electrically connected to the recording element substrate 3; a support member 5 for supporting the recording element substrate 3 and the electric wiring board 4; and a sealing agent 6 for sealing an electric connection part between the recording element substrate 3 and the electric wiring board 4. The support member 5 has a recess 7 where the recording element substrate 3 is stored, and a gap 71 in which a space between the inner wall of the recess 7 and a side wall 3a of the recording element substrate 3 is sealed with a sealing agent 6, and a groove part 8 is provided on its bottom surface. The groove part 8 has a first groove part 81 extending in a first direction from an end 8a, a second groove part 82 extending along the side wall 3a of the recording element substrate 3 and extending in a second direction different from the first direction, and a bent part 8c for connecting the first groove part 81 and the second groove part 82. The groove part 8 has a downward average gradient toward a central part 8b from the end 8a, and the gradient of the bent part 8c is smaller than the average gradient.SELECTED DRAWING: Figure 3

Description

The present invention relates to a liquid ejection head that ejects liquid such as ink, and a manufacturing method thereof.

Japanese Unexamined Patent Application Publication No. 2004-100001 describes an ink jet print head that ejects ink from ejection ports formed in a recording element substrate according to signals transmitted from an electric wiring substrate. This print head has a support substrate that supports the recording element substrate and the electric wiring substrate. The support substrate has a recess for accommodating the recording element substrate, and a gap is formed between the inner wall of the recess and the side wall of the recording element substrate. An electrical connection portion between the recording element substrate and the electric wiring substrate is formed across the gap. A groove is provided at the bottom of the gap. The groove portion extends along the outer edge of the recording element substrate provided with the electrical connection portion, and includes a bent portion in the middle. The electrical connections are sealed by filling the gaps with the encapsulant and then covering the electrical connections with the encapsulant.

JP 2013-49227 A

In the above-described print head, since the groove is flat throughout, when the sealant is injected from the end of the groove, the liquid flow of the sealant stays at the bent portion, and the portion beyond the bent portion There is a possibility that it will not flow into
Also, bubbles are generated when the liquid flow of the sealant stays at the bent portion. For this reason, air bubbles may remain in the sealed portion of the electrical connection, resulting in a sealing defect.

SUMMARY OF THE INVENTION An object of the present invention is to reliably seal electrical connections and suppress sealing defects.

A liquid ejection head according to an aspect of the present invention comprises: a recording element substrate for ejecting liquid; an electric wiring substrate electrically connected to the recording element substrate; and a support for supporting the recording element substrate and the electric wiring substrate. and a sealant for sealing an electrical connection portion between the recording element substrate and the electric wiring substrate. The support member has a recess for accommodating the recording element substrate, and a gap filled with the sealant and having a groove on the bottom is formed between the inner wall of the recess and the side wall of the recording element substrate. ing. The groove portion includes a first groove portion extending in a first direction from an end portion in the extending direction, and a side wall of the recording element substrate provided with the electrical connection portion and extending in the first direction. and a bent portion connecting the first groove and the second groove, wherein the groove extends from the end to the second has an average slope downward toward the central portion in the extending direction of the groove, and the slope of the bent portion is smaller than the average slope.

According to the present invention, it is possible to reliably seal the electrical connections and suppress sealing defects.

1 is a perspective view of a liquid ejection head according to an embodiment of the invention; FIG. 2 is a plan view around a recording element substrate of the liquid ejection head shown in FIG. 1; FIG. FIG. 2 is a plan view showing the vicinity of an end of a recording element substrate and grooves; 4 is an enlarged view of the vicinity of a groove shown in FIG. 3; FIG. FIG. 4 is a diagram for explaining the slope of the groove shown in FIG. 3; FIG. 4 is a diagram for explaining a cross-sectional shape of a groove shown in FIG. 3; FIG. FIG. 4 is a schematic diagram showing a state in which grooves are filled with an uncured first sealant. It is a figure for demonstrating the state of the unhardened 1st sealing agent with which the groove part was filled. FIG. 2 is a perspective view showing an example of a sealing resin coating device for coating a first sealing agent; FIG. 4 is a schematic diagram showing the flow of an uncured first sealant injected into the groove; FIG. 11 is a perspective view showing an example of a sealing resin coating device for coating a second sealing agent; FIG. 11 is a plan view showing a state in which an uncured second sealant is applied to the electrical connection; It is a figure for demonstrating the filling state of the unhardened 1st sealing agent and the unhardened 2nd sealing agent.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the components described in the embodiments are merely examples, and are not intended to limit the scope of the present invention.
A liquid ejection head according to the present invention is applied to an image forming apparatus such as an inkjet apparatus. The liquid ejection head of the present invention can be applied to apparatuses such as printers, copiers, multi-function machines, and facsimiles as image forming apparatuses. Further, the liquid ejection head of the present invention may be installed in an apparatus such as a printer as a cartridge integrally formed with a tank that supplies liquid to the liquid ejection head.

FIG. 1 is a perspective view of a liquid ejection head according to one embodiment of the invention. The liquid ejection head 100 includes a recording element substrate 3 for ejecting liquid such as ink, an electric wiring substrate 4 electrically connected to the recording element substrate 3 , and a support for supporting the recording element substrate 3 and the electric wiring substrate 4 . a member 5; The recording element substrate 3 is electrically connected to the main body of the recording apparatus via the electric wiring substrate 4 .
Although not shown, the recording element substrate 3 has a plurality of ejection ports, a plurality of pressure chambers communicating with the ejection ports, and a plurality of flow paths communicating with the pressure chambers. An energy generating element is provided adjacent to each pressure chamber to generate energy for ejecting liquid. As the energy generating element, for example, a heating element (electrothermal transducer), a piezoelectric element, or the like can be used.
The support member 5 has a liquid supply path for supplying liquid to the recording element substrate 3 . The support member 5 is formed, for example, by resin molding (for example, injection molding). A protective tape 1 is attached to the surface of the recording element substrate 3 on which the ejection ports are formed, and a tag tape 2 is joined to the protective tape 1 for grasping when the protective tape 1 is peeled off. The protective tape 1 protects the ejection openings of the recording element substrate 3 .

FIG. 2 is a plan view around the recording element substrate 3 of the liquid ejection head 100 shown in FIG. The support member 5 has a recess 7 that accommodates the recording element substrate 3 . The electric wiring board 4 has an opening of a size corresponding to the recess 7, and is fixed to the support member 5 so that the recording element substrate 3 is exposed through this opening. The recording element substrate 3 has a rectangular shape, and a plurality of terminals to which the electric wiring substrate 4 is electrically connected are provided at both ends in the longitudinal direction. The electric wiring board 4 is electrically connected to terminals provided at both ends of the recording element board 3 via a plurality of leads. The electrical connection portion 9 between the recording element substrate 3 and the electrical wiring substrate 4 will be described later in detail.

A sealant 6 seals the electrical connections 9 . The sealant 6 consists of a first sealant 6a and a second sealant 6b. The first sealant 6a and the second sealant 6b seal the electrical connection portion 9 from above and below. The first sealant 6a and the second sealant 6b are made of, for example, thermosetting epoxy resin. The temperature conditions for curing the first sealant 6a and the temperature conditions for curing the second sealant 6b are preferably the same.
Between the inner wall of the concave portion 7 and the end portion of the recording element substrate 3 where the electric wiring substrate 4 is provided, a gap 71 is formed which is filled with the sealant 6 and has a groove portion on the bottom surface. The groove can store the first sealant 6a before hardening. The configuration of this groove will be described in detail with reference to FIGS. 3 to 6. FIG.

FIG. 3 is a plan view showing the vicinity of the edge of the recording element substrate 3 and the groove. 4 is an enlarged view of the vicinity of the groove shown in FIG. 3. FIG. Note that FIG. 3 shows a state before the recording element substrate 3 and the electric wiring substrate 4 are joined together and before the uncured sealant 6 is applied. Also, in FIG. 4, the recording element substrate 3 is indicated by a dashed line for convenience.
As shown in FIGS. 3 and 4, the recess 7 of the support member 5 has a support surface 5a that supports the recording element substrate 3. As shown in FIG. The support surface 5 a constitutes the bottom surface of the recess 7 . The recording element substrate 3 is fixed to the support surface 5a of the support member 5 with an adhesive or the like. The recording element substrate 3 fixed to the support surface 5a is surrounded by the inner wall 7a of the recess 7. As shown in FIG. A gap 71 is formed between the inner wall 7a of the recess 7 and the side wall 3a of the recording element substrate 3 to which the electric wiring board 4 is connected. A groove 8 is provided in a part of the bottom of the gap 71 . In the portion along the edge portion 3a of the recording element substrate 3, the groove portion 8 is provided only in part of the gap width.

The groove portion 8 has a first groove portion 81 , a second groove portion 82 , and a bent portion 8 c connecting the first groove portion 81 and the second groove portion 82 . The first groove portion 81 extends in the first direction y from the end portion 8a in the extending direction. The second groove portion 82 extends along the side wall 3a of the recording element substrate 3 provided with the electrical connection portion 9 and extends in a second direction x different from the first direction y. Here, the first direction y and the second direction x are orthogonal. The groove portion 8 has an average downward slope from the end portion 8a toward the central portion 8b in the extending direction of the second groove portion 82, and the slope of the bent portion 8c is smaller than the average slope. The groove portion 8 has a symmetrical structure centering on the central portion 8b. The widths of the grooves at both ends 8a of the groove 8 are different, but this is because the widths of the grooves at both ends 8a are the same because they match the form of the electrical connection between the recording element substrate and the electric wiring board. There may be.

In FIG. 3, reference numeral 10 designates a region adjacent to the end 8a of the groove 8 of the support surface 5a. Reference numeral 11 indicates the center position of the first groove portion 81 . Reference numeral 12 indicates the center position of the bent portion 8c of the groove portion 8. As shown in FIG. Reference numeral 13 indicates the central position of the second groove portion 82 . The positions indicated by symbols 10 to 13 are indicated by "x".
FIG. 5 is a diagram showing the relationship between the support surface 5a and the groove portion from the end portion 8a to the central portion 8b of the groove portion 8 and the height thereof. FIG. 5 shows changes in the height of the path through which the first sealant 6a passes, including the positions indicated by reference numerals 10 to 13 in FIG.
FIG. 6 is a diagram for explaining the cross-sectional shape of the groove portion 8 of the support member 5. As shown in FIG. FIG. 6(a) is a cross-sectional view of the support member 5 taken along the line aa in FIG. FIG. 6(b) is a cross-sectional view of the support member 5 taken along line bb or cc of FIG. FIG. 6(c) is a cross-sectional view of the support member 5 taken along line dd in FIG. FIG. 6(d) is a cross-sectional view of the support member 5 taken along line ee in FIG.

As shown in FIGS. 5 and 6, the height of the bottom surface of the groove portion 8 is highest at the end portions 8a and lowest at the central portion 8b. Note that the central portion 8b may include a flat surface. The height of the end portion 8a is the same as the height of the support surface 5a.
The first groove portion 81 has a downward slope from the end portion 8a toward the bent portion 8c. The second groove portion 82 has a downward slope from the bent portion 8c toward the central portion 8b. Here, the downward slope indicates a slope downward from the support surface 5a of the support member 5 when the support surface 5a is arranged upward. The average downward slope P indicates the average of the downward slopes of the portion composed of the first groove portion 81 , the bent portion 8 c and the second groove portion 82 . The bottom surface of the bent portion 8c is a surface along the support surface 5a. Here, the bottom surface of the bent portion 8c is a flat plane parallel to the support surface 5a. The gradient is defined along the widthwise center line of the groove 8 . As for the bent portion 8c, the center line of the groove portion 8 is defined by a curved line connecting points equidistant from the inner corner portion 8d of the bent portion 8c and the outer peripheral portion 8e.

FIG. 7 is a schematic diagram showing a state in which the recording element substrate 3 shown in FIG. 3 is joined to the electric wiring substrate 4, and the grooves 8 and the gaps 71 are filled with the uncured first sealant 6a. FIG. 8 is a diagram for explaining the state of the uncured first sealant 6a filled in the groove 8 and the gap 71. As shown in FIG. FIG. 8(a) is a cross-sectional view of the support member 5 taken along the line aa in FIG. FIG. 8(b) is a sectional view of the support member 5 taken along line bb or cc of FIG. FIG. 8(c) is a cross-sectional view of the support member 5 taken along line dd in FIG. FIG. 8(d) is a cross-sectional view of the support member 5 taken along line ee in FIG.

As shown in FIGS. 7 and 8, the end portion 3a of the recording element substrate 3 is provided with a plurality of terminals, and each terminal is electrically connected to the electric wiring substrate 4 via lead wires 4a. ing. These terminal portions and the lead wires 4a form an electrical connection portion 9 between the recording element substrate 3 and the electrical wiring substrate 4. As shown in FIG. Each lead wire 4 a is provided so as to cross the second groove portion 82 .
An uncured first sealant 6a is injected from the end 8a of the groove 8 in order to seal the electrical connection 9 from below. Specifically, a pair of needles 101a, which will be described later, are arranged at both end portions 8a of the groove portion 8, and the uncured first sealant 6a is injected from the pair of needles 101a into both end portions 8a. Injecting the first sealant 6a from both ends 8a prevents the first sealant 6a from interfering with the lead wires 4a, and ensures that the first sealant 6a does not interfere with the lead wires 4a. This is to allow the water to flow into the lower space. The uncured first sealant 6 a injected into the groove 8 overflows the groove 8 , fills the gap 71 , and spreads to the edge 3 a of the recording element substrate 3 . The upper surface of the sealing portion made of the uncured first sealing agent 6a reaches the lead wire 4a.

The process of filling the grooves 8 with the uncured first sealant 6a will be described in detail below.
FIG. 9 is a perspective view of a sealing resin coating device for filling the groove portion 8 with the uncured first sealing agent 6a. The encapsulating resin application device has a discharge device 102 having a syringe 101 filled with an uncured first encapsulant 6a. The syringe 101 is movable along each of the X-, Y-, and Z-axes. A pair of needles 101a capable of ejecting the uncured first sealant 6a is attached to the tip of the syringe 101 . Here, the Y-axis direction and the X-axis direction correspond to the first direction y and the second direction x shown in FIGS. 3 and 7, respectively. The Z-axis direction corresponds to the direction perpendicular to the support surface 5 a of the support member 5 .

A liquid ejection head 100, which is an object to be coated, is arranged below the pair of needles 101a so that the support surface 5a of the support member 5 faces upward. Here, the liquid ejection head 100 is in a state in which the recording element substrate 3 shown in FIG. ). A pair of needles 101a are arranged at injection positions on both ends 8a of the groove 8, respectively. The tip width of each needle of the pair of needles 101a is the same. The groove width of the groove portion 8 is wider than the width of the tip of each needle of the pair of needles 101a. The distance between the bottom surface of the groove 8 and the tips of the pair of needles 101a is, for example, approximately 0.2 mm to 0.3 mm. The tips of the pair of needles 101a can be inserted into the groove 8 within this distance range.

FIG. 10 is a schematic diagram showing the flow of the uncured first sealant 6a injected into the groove 8. As shown in FIG. 10(a) to 10(f), the upper figures are plan views, and the lower figures are cross-sectional views taken along line dd in the upper figures.
As shown in FIG. 10A, an uncured first sealant 6a is injected into both end portions 8a of the groove portion 8 from a pair of needles 101a. The uncured first sealant 6a flows along the downward slope of the first groove portion 81 from the end portion 8a toward the bent portion 8c.

Next, as shown in FIG. 10(b), the uncured first sealant 6a reaches the bent portion 8c. When the liquid flow of the uncured first sealant 6a reaches the inner corner 8d of the bent portion 8c, if the flow velocity of the uncured first sealant 6a is high, the uncured first sealant 6a A vapor phase portion is generated when the sealant 6a passes through the inner corner portion 8d. Due to this gas phase, bubbles 20 are generated in the uncured first sealant 6a. In this embodiment, the bent portion 8c is configured to reduce the downward slope of the first groove portion 81 (here, the bent portion 8c is a flat surface), so that the uncured first sealant The flow velocity of 6a decreases. By slowing down the flow rate of the uncured first sealant 6a at the bent portion 8c in this way, the uncured first sealant 6a can prevent the generation of the gas phase portion while allowing the inner corners to flow. It flows along the wall surface around the portion 8d and is pushed out toward the central portion 8b. If bubbles 20 are generated in the uncured first sealant 6a, the bubbles 20 are pushed out toward the central portion 8b.

Next, as shown in FIGS. 10(c) and 10(d), the uncured first sealant 6a is spread along the downward slope of the second groove portion 82 from the bent portion 8c toward the central portion 8b. flow. If air bubbles 20 are contained in the uncured first sealant 6 a , the bubbles 20 will be removed from the uncured first sealant 6 a when the uncured first sealant 6 a flows through the second grooves 82 . is entangled in the liquid flow of the sealant 6a and defoamed. In addition, when many bubbles 20 are generated at the inner corner portion 8d, the bubbles 20 may remain even when the first sealant 6a reaches the central portion 8b. In the present embodiment, the curved portion 8c slows down the flow velocity of the uncured first sealant 6a, thereby suppressing the generation of air bubbles 20. Therefore, the first sealant reaching the central portion 8b Air bubbles 20 are prevented from remaining in 6a.
Next, as shown in FIG. 10(e), the uncured first sealant 6a flows through the second groove portion 82 and reaches the central portion 8b. After that, as shown in FIG. 10F, the uncured first sealant 6a fills the groove 8 and then overflows the groove 8 to fill the gap on the side of the edge 3a of the recording element substrate 3. 71 and a pair of needles 101a. The uncured first sealant 6a is injected up to a height where it contacts the lead wires 4a.

After the uncured first sealant 6a is filled, the uncured second sealant 6b is applied so as to cover the electrical connection portion 9 between the recording element substrate 3 and the electrical wiring substrate 4. FIG. The process of applying the uncured second sealant 6b to the electrical connection portion 9 will be described in detail below.
FIG. 11 is a perspective view of a sealing resin coating device for coating the uncured second sealing agent 6b. The encapsulating resin applicator is the same as the encapsulating resin applicator shown in FIG. 9, except that instead of the pair of needles 101a, it has a single needle 101b capable of ejecting the uncured second encapsulant 6b. It is a thing. The syringe 101 is filled with the uncured second sealant 6b.

FIG. 12 is a plan view schematically showing a state in which the uncured second sealant 6b is applied to the electrical connection portion 9 filled with the uncured first sealant 6a shown in FIG. be. FIG. 13 is a diagram for explaining the filling state of the uncured first sealant 6a and the uncured second sealant 6b. FIG. 13(a) is a cross-sectional view of the support member 5 taken along line aa in FIG. FIG. 13(b) is a cross-sectional view of the support member 5 taken along line bb or cc of FIG. FIG. 13(c) is a cross-sectional view of the support member 5 taken along line dd in FIG. FIG. 13(d) is a cross-sectional view of the support member 5 taken along line ee in FIG.

As shown in FIGS. 12 and 13, the uncured first sealant 6a seals the electrical connection portion 9 between the recording element substrate 3 and the electrical wiring board 4 from below, and the uncured second sealant 6a seals from below. The sealing agent 6b is applied so as to cover the electrical connection portion 9 from above. A single needle 101b is placed at one end of the electrical connection 9, as shown in FIG. Here, one end of the electrical connection portion is one of the ends in the width direction (second direction x) of the recording element substrate 3 . The distance between the tip of the single needle 101b and the electrical connection portion 9 is, for example, about 0.1 mm to 0.3 mm. The single needle 101b is moved in the direction of the arrow A while discharging the uncured second sealant 6b from the single needle 101b. The single needle 101b moves from one end of the electrical connection 9 to the other end. The electrical connection 9 is completely covered with the uncured second sealant 6b discharged from the single needle 101b. In this manner, the sealant 6 composed of the uncured first sealant 6a and the uncured second sealant 6b covers the electrical connection portion 9 from above and below without gaps.

After the uncured first sealant 6a and the uncured second sealant 6b are filled, the first sealant 6a and the second sealant 6b are heated and cured. A constant temperature bath can be used to heat the first sealant 6a and the second sealant 6b. By making the temperature conditions for curing the first sealant 6a and the second sealant 6b the same, the number of steps for heating and curing can be reduced.

According to the liquid ejection head 100 of the present embodiment described above, the first sealant 6a can be sufficiently filled in the entire groove 8, and the electrical connection portion between the recording element substrate 3 and the electric wiring substrate 4 can be fully filled. 9 sealing defects can be suppressed. In particular, the liquid ejection head 100 of the present embodiment is particularly effective when using a high-viscosity sealing agent, since gas phase portions (bubbles) are likely to occur.

Moreover, both the first groove portion 81 and the second groove portion 82 of the groove portion 8 have downward slopes. Due to the downward slope of the first groove portion 81, the first sealant 6a can be easily supplied from the end portion 8a toward the bent portion 8c. Further, the downward slope of the second groove portion 82 allows the first sealant 6a to be easily supplied from the bent portion 8c toward the central portion 8b.
The slope of the bottom surface of the first groove portion 81 is preferably greater than or equal to the slope of the bottom surface of the second groove portion 82 . As a result, if the groove width of the groove portion 8 is constant, the first sealant 6a can be reliably supplied from the end portion 8a to the central portion 8b without interruption, and the air flow at the inner corner portion 8d can be ensured. It is possible to more reliably suppress the occurrence of phase portions. The slope of the bottom surface of the first groove portion 81 is, for example, within the range of 5° to 10°. The slope of the bottom surface of the second groove portion 82 is, for example, within the range of 2° to 5°.

From the viewpoint of slowing down the flow velocity of the first sealant 6a, the inclination of the bottom surface of the bent portion 8c is 0° or more and smaller than the inclination of the bottom surfaces of the first groove portion 81 and the second groove portion 82. is preferred. When the bottom surface of the bent portion 8c is inclined, the bottom surface of the first groove portion 81 or the second groove portion 82 is inclined in the groove width direction. It is preferable that the inclination in the groove width direction is small. For this reason, it is preferable that the bottom surface of the bent portion 8c be a flat surface without a slope. If the inclination is within the error range of resin molding accuracy, the bottom surface of the bent portion 8c is regarded as a flat surface without any inclination.
Further, in the support member 5, the slope of the groove portion 8 is formed using the support surface 5a as a reference surface. In this case, the inclination in the groove width direction can be reduced by forming the bottom surface of the bent portion 8c along the support surface 5a (for example, a surface parallel to the support surface 5a).

The manufacturing method of the liquid ejection head 100 of this embodiment includes the following procedures. A gap 71 is formed between the inner wall 7 a of the recess 7 and the side wall 3 a of the recording element substrate 3 , and the recording element substrate is fixed to the recess 7 so that the groove 8 is exposed at the bottom surface of the gap 71 . Next, an electrical connection portion 9 between the recording element substrate 3 and the electrical wiring substrate 4 is provided. Next, the gap 71 is filled with the first sealant 6a. After filling the first sealant 6a, the second sealant 6b covering the electrical connection portion 9 is applied. According to this manufacturing method, the electrical connection portion 9 between the recording element substrate 3 and the electrical wiring substrate 4 can be reliably sealed from above and below without sealing defects.

3 recording element substrate 4 electric wiring substrate 5 support member 6 sealant 7 concave portion 8 groove portion

Claims (9)

a recording element substrate for ejecting liquid;
an electric wiring board electrically connected to the recording element substrate;
a support member that supports the recording element substrate and the electric wiring substrate;
a sealant for sealing an electrical connection between the recording element substrate and the electrical wiring substrate;
The support member has a recess for accommodating the recording element substrate, and a gap filled with the sealant and having a groove on the bottom is formed between the inner wall of the recess and the side wall of the recording element substrate. ,
The groove portion includes a first groove portion extending in a first direction from an end portion in the extending direction, and a side wall of the recording element substrate provided with the electrical connection portion and extending in the first direction. and a bent portion connecting the first groove and the second groove, wherein the groove extends from the end to the second A liquid ejection head, characterized in that the groove has an average slope downward toward the center in the extending direction of the groove, and the slope of the bent portion is smaller than the average slope. The first groove portion has a downward slope from the end portion toward the bent portion, and the second groove portion has a downward slope from the bent portion toward the central portion. 1. The liquid ejection head according to 1. 3. The liquid ejection head according to claim 2, wherein the slope of the bottom surface of the first groove is greater than or equal to the slope of the bottom surface of the second groove. 4. The liquid ejection head according to claim 2, wherein the slope of the bottom surface of the bent portion is smaller than the slope of the bottom surface of each of the first groove portion and the second groove portion. 5. The liquid ejection head according to any one of claims 1 to 4, wherein the bottom surface of said bent portion is a flat surface without a slope. 6. The support member according to any one of claims 1 to 5, wherein the support member has a support surface for supporting the recording element substrate, and the bottom surface of the bent portion is formed along the support surface. 3. The liquid ejection head according to . 7. The liquid ejection head according to claim 1, wherein the groove has a downward slope from both ends toward the central portion. 8. The liquid ejection head according to claim 1, wherein a width of said groove is wider than a width of a needle for injecting said sealant. a recording element substrate that ejects liquid; an electric wiring board that is electrically connected to the recording element substrate; a supporting member that supports the recording element substrate and the electric wiring substrate; A method for manufacturing a liquid ejection head comprising: a sealant for sealing an electrical connection with a substrate;
the support member has a recess for accommodating the recording element substrate, and a groove is formed in the bottom surface of the recess;
fixing the recording element substrate to the recess such that a gap is formed between the inner wall of the recess and the side wall of the recording element substrate, and the groove is exposed at the bottom surface of the gap;
providing the electrical connection;
filling the gap with a first encapsulant;
applying a second sealant covering the electrical connection after filling with the first sealant;
The groove portion includes a first groove portion extending in a first direction from an end portion in the extending direction, and a side wall of the recording element substrate provided with the electrical connection portion and extending in the first direction. and a bent portion connecting the first groove and the second groove, wherein the groove extends from the end to the second A method of manufacturing a liquid ejection head, wherein the groove has an average slope downward toward the center in the extending direction of the groove, and the slope of the bent portion is smaller than the average slope.

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