JP2018047573A - Manufacturing method of liquid discharge head, and the liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve reliability of sealing of an electric connection part while suppressing deformation of a recording element substrate.SOLUTION: An assembly is produced by fixing a recording element substrate 2 having a discharge port for discharging a liquid on a recessed part arranged on a first surface 41 of a support member 4, fixing an electric wiring substrate 3, with an electric connection part 5 formed between the recording element substrate 2 and it, on the first surface 41 of the support member 4, and forming a first space 45, with the electric connection part 5 formed above, on a part between the recording element 2 and a side surface of the recessed part. A first sealing material S1 is supplied from a supply nozzle 7 and the first space 45 is filled with the first sealing material S1. The supply nozzle 7 is adjacent to at least a part of a side surface of the electric wiring substrate 3 positioned between the supply nozzle 7 and the first space 45 through a gap G, and a meniscus M of the first sealing material S1 is formed on at least a part of the gap G.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for manufacturing a liquid discharge head, and more particularly to a method for filling a sealing material.

A liquid discharge head used in a liquid discharge apparatus such as an ink jet recording apparatus includes a recording element substrate on which an ejection port for discharging a liquid is formed, a support member that supports the recording element substrate, an electric wiring substrate having a lead terminal group, It has. The recording element substrate is fixed to the support member via an adhesive. The connection terminal group provided on the recording element substrate is connected to a lead terminal group provided so as to protrude from the electric wiring substrate. As a result, an electrical connection is formed between the recording element substrate and the electrical wiring substrate.
The outer peripheral portion and the electrical connection portion of the recording element substrate are sealed with a sealing material to prevent connection failure such as corrosion due to liquid or disconnection due to external force. In the vicinity of the electrical connection portion, for example, a sealing material is applied to the outer peripheral portion of the recording element substrate, the lower space of the electrical connection portion is sealed with the sealing material, and then the electrical connection portion is covered with the sealing material. .

For the support member, a resin material is generally used because it can be manufactured at low cost, while the recording element substrate is mainly formed of a silicon material. For this reason, the coefficients of thermal expansion of the two are different from each other. The liquid discharge head is heated after passing through the sealing step, and the recording element substrate is fixed to the support member by the cured sealing material. However, when the liquid discharge head returns to room temperature, the recording element substrate is restrained by the support member via the sealing material due to the difference in thermal expansion between the recording element substrate and the support member. As a result, the internal stress of the recording element substrate increases, and the recording element substrate is likely to be deformed or cracked. In a liquid discharge head in which the recording element substrate is deformed or cracked, the landing position of the discharged liquid may be shifted, and the recording quality may be deteriorated.
Patent Document 1 discloses a liquid ejection head in which the encapsulating material is filled so that a part of the side surface of the recording element substrate on which the electrical connection portion is not provided is exposed, and the binding force of the encapsulating material is reduced. A manufacturing method is described.

JP 2012-187805 A

Liquid ejecting apparatuses are required to be provided at lower costs while maintaining high recording quality. In order to meet this requirement, it is desired to reduce the size of the most expensive recording element substrate among the liquid discharge heads and increase the number of recording element substrates that can be produced from one wafer. However, if the size of the recording element substrate is reduced, the wall portion around the ejection port inevitably becomes thin, and the rigidity of the recording element substrate is reduced. As a result, the recording element substrate is likely to be deformed or cracked by a slight force.
For this reason, just by exposing a part of the side surface of the recording element substrate as in Patent Document 1, the restraining force of the sealing material cannot be reduced, and the recording element substrate may be deformed. Although it is conceivable to reduce the application amount of the sealing material in order to reduce the binding force of the sealing material, in that case, a sufficient amount of the sealing material cannot be filled in the lower space of the electrical connection portion. This is because it is difficult to guide the sealing material to the lower space of the electrical connecting portion due to the fluidity of the sealing material. As a result, sealing of the electrical connection portion located on the sealing material becomes insufficient, and connection failure due to corrosion tends to occur.

  An object of the present invention is to provide a method of manufacturing a liquid discharge head in which deformation of a recording element substrate is suppressed and reliability of sealing of an electrical connection portion is improved.

  According to one aspect of the present invention, a method for manufacturing a liquid discharge head includes: a recording element substrate having a discharge port for discharging a liquid fixed to a recess provided on a first surface of a support member; An electrical wiring board having an electrical connection portion formed between the recording element substrate and the side surface of the concave portion is fixed upward on the first surface of the support member. Creating an assembly in which the first space is formed; supplying the first sealing material from the supply nozzle; filling the first space with the first sealing material; and Supplying a second sealing material on the stopper and sealing the electrical connection portion with the second sealing material. The supply nozzle is adjacent to at least a part of a side surface of the electrical wiring board located between the supply nozzle and the first space via a gap, and the first sealing material is at least part of the gap. A meniscus is formed.

  The first sealing material is held by a meniscus formed between the supply nozzle and the side surface of the electric wiring board. Since the supply nozzle is adjacent to at least a part of the side surface of the electrical wiring board located between the supply nozzle and the first space via a gap, the meniscus is formed on the first space side of the supply nozzle. Is done. For this reason, the first sealing material easily flows to the first space side, and the first sealing material is efficiently filled into the first space, while the electrical connection portion is not formed above. Inflow of the first sealing material into the is suppressed. As a result, the second sealing material is stably formed on the first sealing material, and the electrical connection portion is more reliably sealed. In addition, the recording element substrate is less likely to be restrained by the support member depending on the first sealing material filled in the space where the electrical connection portion is not formed above.

  As described above, according to the present invention, it is possible to provide a method for manufacturing a liquid discharge head in which deformation of the recording element substrate is suppressed and the reliability of sealing of the electrical connection portion is improved.

It is a schematic perspective view which shows an example of the liquid discharge head to which this invention is applied. FIG. 2 is a schematic perspective view of a recording element substrate of the liquid discharge head shown in FIG. It is a schematic diagram which shows a part of liquid discharge head in preparation. It is a schematic diagram which shows a part of support substrate. It is an enlarged view which shows the vicinity of the supply nozzle of a 1st sealing material. It is a schematic diagram which shows the modification of 1st Embodiment. It is a schematic diagram which shows 2nd Embodiment. It is a schematic diagram which shows 3rd Embodiment. It is a schematic diagram which shows a comparative example.

  Hereinafter, several embodiments of a method of manufacturing a liquid discharge head according to the present invention will be described with reference to the drawings. The liquid discharge head 1 of the present invention can be suitably applied to an ink jet head that discharges ink, but is not limited thereto, and can also be applied to various industrial liquid discharge heads that discharge liquids other than ink. The liquid discharge head 1 of the present embodiment discharges one type of ink, but may discharge a plurality of types of ink.

(First embodiment)
FIG. 1 is a schematic perspective view of a liquid discharge head 1 according to this embodiment. FIG. 1A is an exploded perspective view of the liquid discharge head, and FIG. 1B is a perspective view when assembled. The liquid ejection head 1 is mainly composed of a recording element substrate 2, an electric wiring substrate 3, and a support member 4. The support member 4 holds an ink tank (not shown) and supports the recording element substrate 2 and the electric wiring substrate 3.

  FIG. 2A is a schematic perspective view of the recording element substrate 2, and FIG. 2B is a cross-sectional view of the liquid ejection head along the line AA in FIG. 2A. The recording element substrate 2 is formed of a silicon substrate 21 having a thickness of 0.6 to 0.8 mm and an ejection port forming member 22. The discharge port forming member 22 has a discharge port surface 24 having a discharge port 23 for discharging ink. The substrate 21 has an outer surface 25 to which the discharge port forming member 22 is fixed, a back surface 26 of the outer surface 25, and four side surfaces 27a and 27b. On the recording element substrate 2, a plurality of energy generating elements 28 and electric wiring (not shown) for supplying driving power and driving signals to each energy generating element 28 are formed by a film forming technique. The energy generating element 28 is an electrothermal conversion element that generates thermal energy used for discharging ink, but may be a piezoelectric element that discharges ink by vibration of a wall surface due to the piezoelectric effect. On the discharge port surface 24, a plurality of discharge ports 23 corresponding to the energy generating elements 28 are formed by a photolithography technique. An ink supply port 29 that supplies ink to the plurality of ejection ports 23 is provided through the recording element substrate 2, and opens on the outer surface 25 and the back surface 26 of the recording element substrate 2.

  Both the substrate 21 and the discharge port forming member 22 have a rectangular planar shape, and the long side length of the substrate 21 is longer than the long side length of the discharge port forming member 22. For this reason, the outer surface 25 of the substrate 21 is exposed on both sides in the long side direction without being covered by the discharge port forming member 22. A connection terminal group 5 a is formed on the exposed portion of the outer side surface 25. The connection terminal group 5a is formed along at least one side of the substrate 21, in this embodiment, two short sides. The connection terminal group 5a is electrically connected to the above-described electrical wiring connected to the energy generation element 28 and the lead terminal group 5b made of flying leads of the electrical wiring board 3, and the energy generation element 28 is driven with a drive signal and drive. Supply power. The lead terminal group 5b and the connection terminal group 5a are electrically connected by a TAB mounting technique. The connection terminal group 5a and the lead terminal group 5b are collectively referred to as an electrical connection portion 5. In other embodiments, the lead terminal group and the connection terminal group may be connected by wire bonding. In that case, the electrical connection portion 5 includes a lead terminal group, a connection terminal group, and a conductive member such as a wire connecting them. The electrical connection portion 5 is formed between the recording element substrate 2 and the electrical wiring substrate 3.

  3A is a plan view of the support member 4 to which the recording element substrate and the electric wiring substrate are fixed, and FIG. 3B is a cross-sectional view taken along the line AA in FIG. FIG. 3C shows a cross-sectional view along the line BB in FIG. 4A is a plan view of a region of the support member to which the recording element substrate is bonded, and FIG. 4B is a cross-sectional view taken along the line AA in FIG. 4A. . FIG. 5 is a partially enlarged view of FIG. 3A, and shows an enlarged view of the vicinity of the notch and the supply nozzle.

The support member 4 has a first surface 41 facing in the same direction as the outer surface 25 of the substrate 21 and the discharge port surface 24 of the discharge port forming member 22. A recess 42 is provided in the center of the first surface 41 of the support member 4. The support member 4 can be formed of a resin material or a ceramic material such as Al ₂ O ₃ . In the present embodiment, a modified PPE (polyphenylene ether) resin containing about 35% glass filler is used for the purpose of improving the rigidity of the support member 4.

  The substrate 21 of the recording element substrate 2 is fixed to the recess 42 with an adhesive in a direction in which the discharge port surface 24 is exposed, that is, the discharge port surface 24 facing outward. The side surface of the substrate 21 includes two first side surfaces 27a and two second side surfaces 27b. The first side surface 27 a is adjacent to the outer surface 25 of the substrate 21 through the side where the electrical connection portion 5 of the substrate 21 is provided, and extends along the short side of the substrate 21. The second side surface 27 b is adjacent to the outer surface 25 of the substrate 21 through a side where the electrical connection portion 5 of the substrate 21 is not provided, and extends along the long side of the substrate 21.

  The bottom surface 43 of the concave portion 42 has a main plane 43a to which the substrate 21 of the recording element substrate 2 is fixed via an adhesive, and a groove portion that is dug down from the main plane 43a and extends between the main plane 43a and the side surface 44 of the concave portion 42. 43b. The main plane 43 a is provided with an opening of an ink flow path 48 that communicates with the ink supply port 29 and supplies ink to the recording element substrate 2. The groove 43b is provided along the long side of the recording element substrate 2, and is not provided along the short side. The function of the groove 43b will be described later.

  The electric wiring board 3 is fixed to the first surface 41 of the support member 4, that is, the region surrounding the recess 42 of the support member 4 with an adhesive. The electric wiring board 3 is a flexible wiring member such as a flexible wiring board that has a wiring layer provided therein and has flexibility. The electric wiring board 3 supplies driving power and a driving signal to the energy generating element 28 of the recording element board 2 via the electric connecting portion 5. The electrical wiring substrate 3 has a device hole 31 for avoiding interference with the recording element substrate 2, and the recording element substrate 2 is located inside the device hole 31. Lead terminal groups 5 b corresponding to the connection terminal groups 5 a of the recording element substrate 2 are formed on two sides of the device hole 31. As a result, the electrical connection portion 5 was formed upward between a part between the side surface of the recording element substrate 2 and the side surface of the concave portion 42, specifically, between the first side surface 27 a and the side surface of the concave portion 42. A first space 45 is formed. Between the second side surface 27 b of the recording element substrate 2 and the side surface 44 of the recess 42, a second space 46 is formed in which the electrical connection portion 5 is not formed upward. The groove 43 b extends in the second space 46 along the long side of the recording element substrate 2. As shown in FIG. 1, the electric wiring board 3 further has an external signal input terminal 37 for receiving a drive signal and drive power from the ink jet recording apparatus. As shown in FIG. 2B, the first space 45 is filled with the first sealing material S1, and the electrical connection portion 5 located above the first space 45 is sealed with the second sealing material S2. Yes.

Next, a method for manufacturing the liquid discharge head 1 will be described.
First, the recording element substrate 2 and the electric wiring substrate 3 are positioned so that the connection terminal group 5a of the recording element substrate 2 and the lead terminal group 5b of the electric wiring substrate 3 can be connected, and these terminal groups are arranged by TAB mounting technology. Connect electrically. As a result, the electrical connection portion 5 including the connection terminal group 5 a of the recording element substrate 2 and the lead terminal group 5 b of the electrical wiring substrate 3 is formed.

  Subsequently, an adhesive 49 is applied on the main plane 43 a of the support member 4 along the periphery of the opening of the ink flow path 48, and the recording element substrate 2 is bonded to the support member 4. The ink flow path 48 of the support member 4 communicates with the ink supply port 29 of the recording element substrate 2. The adhesive 49 applied around the opening of the ink flow path 48 generates a meniscus at the boundary between the main plane 43a and the groove 43b, thereby preventing the adhesive 49 from flowing out of the main plane 43a. Therefore, it is possible to apply the adhesive 49 thickly and stably by providing the groove 43b. The adhesive 49 generates a meniscus at the boundary between the main plane 43 a and the ink flow path 48, and the adhesive 49 is prevented from flowing into the ink flow path 48. In the present embodiment, the groove 43 b is installed only in the second space 46, but it may be installed in the entire region along the outer periphery of the substrate 21. It is preferable that after the adhesive 49 is applied, the adhesive 49 is pressed against the back surface 26 of the recording element substrate 2 so that the application height of the adhesive 49 does not vary greatly. The adhesive 49 is crushed and protrudes around the entire side surface of the recording element substrate 2. Thereby, leakage of ink from between the support member 4 and the recording element substrate 2 is prevented. Thereafter, the electrical wiring board 3 is bonded to the first surface 41 of the support member 4 using an adhesive (not shown). The adhesive used in these joining steps preferably has good ink resistance. For example, a thermosetting adhesive mainly composed of an epoxy resin can be used.

  As described above, the recording element substrate 2 and the electrical wiring substrate 3 are fixed to the support member 4, and the assembly 11 in which the electrical connection portion 5 is formed between the recording element substrate 2 and the electrical wiring substrate 3 is created. As described above, between the recording element substrate 2 and the side surface 44 of the recess 42, the first space 45 in which the electrical connection portion 5 is formed upward and the second space in which the electrical connection portion 5 is not formed upward. 46 is formed. The electrical wiring board 3 protrudes from the support member 4 on the side of the first space 45. An injection portion 47 into which the first sealing material S is injected is formed between the projecting portion 34 of the electrical wiring board 3 and the support member 4 and on the second space 46 side. The injection portion 47 is a space provided outside the second space 46 and communicates with the first space 45 and the second space 46. The injecting portion 47 is provided on both sides of the first space 45, but may be provided on only one of them. The position of the injection portion 47 is not particularly limited, but is preferably as close to the first space 45 as possible.

  Next, the first sealing material S <b> 1 is filled into the first space 45 between the first side surface 27 a of the recording element substrate 2 and the side surface 44 of the recess 42. As the first sealing material S1, a thermosetting resin that is relatively easy to handle in the manufacturing process is used. Specifically, the supply nozzle 7 is positioned along the notch 33 formed in the edge portion 32 of the electric wiring board 3 as shown in FIGS. The supply nozzle 7 has a cylindrical needle shape. The notch 33 has a shape obtained by cutting a part of a circle with a straight line, and the diameter of the circle is slightly larger than the outer diameter of the supply nozzle 7. In the present embodiment, the notch 33 has a generally semicircular shape. The notch 33 of the electrical wiring board 3 is provided above the injection part 47. Next, the first sealing material S <b> 1 is discharged from the supply nozzle 7. The first sealing material S1 is first filled in the injection portion 47, and further spreads into the first space 45 and the second space 46 as the first sealing material S1 is supplied. Due to the viscosity of the first sealing material S <b> 1, the first sealing material S <b> 1 is formed highest in the injection portion 47 and comes into contact with the bottom surface of the protruding portion 34 of the electrical wiring substrate 3. When the first sealing material S1 reaches the edge 33a of the notch 33, a meniscus M is formed between the supply nozzle 7 and the edge 33a of the notch 33, that is, between the supply nozzle 7 and the side surface of the electrical wiring board 3. Is done. As a result, the first sealing material S1 is stably held in the injection portion 47.

  A part of the side surface of the electrical wiring board 3, that is, the edge 33 a of the notch 33 is located between the supply nozzle 7 and the first space 45, and the supply nozzle 7 is notched via the gap G. It is adjacent to the edge 33a of 33. The gap G is formed so small that the meniscus M of the first sealing material S1 is formed. In order to form the meniscus M, the smaller the gap G, the better. However, when the supply nozzle 7 contacts the side surface of the electrical wiring board 3, not only the meniscus M is formed, but also the electrical wiring board 3 is damaged. there is a possibility. For this reason, it is preferable to set the size of the gap G as small as possible within the range where the supply nozzle 7 does not contact the electric wiring board 3 in consideration of the positioning accuracy of the supply nozzle 7.

  The meniscus M is continuously formed along the entire length of the edge 33 a of the semicircular cutout 33. In order to form such a meniscus M, the center of the supply nozzle 7 is the center of the notch 33 so that the size of the gap G is constant over the entire length of the edge 33a of the notch 33. Are arranged to match. However, due to restrictions on the positioning accuracy of the supply nozzle 7, even if the center of the supply nozzle 7 does not coincide with the center of the notch 33, at least a part between the supply nozzle 7 and the side surface of the electrical wiring board 3 is used. A continuous gap G that causes the meniscus M may be formed. Regardless of the positioning accuracy of the supply nozzle 7, it is possible to intentionally shift the center of the supply nozzle 7 from the center of the notch 33. In that case, the supply nozzle is arranged so that the gap G becomes small at a portion close to the first space 45, that is, the center of the supply nozzle 7 is displaced toward the first space 45 with respect to the center of the notch 33. 7 is preferably positioned.

  In the present embodiment, since the edge 33a of the notch 33 is located between the supply nozzle 7 and the first space 45, the first sealing material S1 is efficiently moved toward the first space 45. Retained. Since the meniscus M is formed between the portion of the supply nozzle 7 that faces the first space 45 and the side surface of the electrical wiring board 3, the first sealing material S 1 is the first space 45 of the injection portion 47. The side part is efficiently filled. The first sealing material S <b> 1 filled in the portion of the injection portion 47 on the first space 45 side flows into the first space 45. The first sealing material S1 further supplied from the supply nozzle 7 so as to supplement the first sealing material S1 flowing into the first space 45 also flows into the first space 45 side held by the meniscus M. To do. Since the side surface of the electrical wiring board 3 does not exist on the second space 46 side of the injection portion 47, the meniscus M is not formed. For this reason, the 1st sealing material S1 is not fully filled into the 2nd space 46 side of the injection | pouring part 47. FIG. As a result, the first space 45 is efficiently filled with the first sealing material S1, and the first sealing material S1 does not easily flow into the second space 46. That is, by setting the positional relationship between the supply nozzle 7 and the notch 33 of the electric wiring board 3 so that the meniscus M is formed on the first space 45 side, the first space of the first sealing material S1 is set. A flow toward 45 can be created. The edge 33a or the gap G of the notch 33 is generally formed at a position where the first space 45 can be directly viewed, but is not limited thereto, and may be located on the first space 45 side of the supply nozzle 7. .

  The supply nozzle 7 is disposed such that the tip or supply port 71 is positioned at a height between the first surface 41 and the main plane 43 a of the recess 42. When the supply port 71 of the supply nozzle 7 is above the first surface 41, the first sealing material S <b> 1 spreads on the electric wiring substrate 3, and a sufficient amount of the first sealing material is provided in the injection portion 47. S1 may not be supplied. The height position of the supply port 71 of the supply nozzle 7 is preferably closer to the first surface 41 than the main plane 43 a of the recess 42, and particularly preferably substantially coincides with the first surface 41. The first sealing material S1 tends to be discharged from the supply nozzle 7 while spreading. For this reason, since the supply port 71 of the supply nozzle 7 coincides with the first surface 41, the first sealant immediately after being discharged from the supply port 71 of the supply nozzle 7 comes into contact with the electrical wiring substrate 3. , Meniscus M is easily formed.

The first sealing material S1 flowing into the second space 46 flows into the groove 43b. As described above, since the amount of the first sealing material S1 flowing into the second space 46 is limited, the possibility that the first sealing material S1 covers the side surface of the recording element substrate 2 is low. Even if the side surface of the recording element substrate 2 is covered with the first sealing material S1, the range is limited. Preferably, the entire surface of the second side surface 27b of the recording element substrate 2 is exposed without being covered with the sealing material. As a result, the binding force of the support member 4 to the recording element substrate 2 generated after the first sealing material S1 is cured and contracted is reduced, and the internal stress generated in the recording element substrate 2 can be suppressed. The volume of the groove 43b is determined by the amount of the first sealing material S1 flowing into the second space 46, and is 5.58 mm ³ (15.5 mm × 1.2 mm × 0.3 mm) in this embodiment. . In addition, it is preferable that at least the side corners 43c on the bottom surface of the groove 43b are covered with the first sealing material S1 so that cleaning water does not remain in the groove 43b in a cleaning process described later.

  When the first sealing material S1 is filled into the first space 45 by a predetermined amount or when the first sealing material S1 is filled into the first space 45 by a predetermined amount, the first amount of the first sealing material S1 is necessary. When the sealing material S1 is supplied from the supply nozzle 7, the supply of the first sealing material S1 is completed. Thereafter, the supply nozzle 7 is lifted. Although the meniscus M is lost, the state in which the first sealing material S1 is filled in the first space 45 is maintained by the viscosity of the first sealing material S1. Next, the second sealing material S2 is supplied onto the first sealing material S1, and the electrical connection portion 5 is sealed with the second sealing material S2. Specifically, the second sealing material S2 is applied from above the connection terminal group 5a of the recording element substrate 2 and the lead terminal group 5b of the electric wiring board 3, and the connection terminal group 5a and the lead terminal group 5b are connected to the first terminal. 2 with a sealing material S2. As the second sealing material S2, a thermosetting resin that is relatively easy to handle in the manufacturing process is used. Next, the liquid discharge head 1 is heated to heat and cure the first sealing material S1 and the second sealing material S2. The electrical connection portion 5 is sealed with the cured second sealing material S2, and the injection portion 47 is filled with the cured first sealing material S1. Thereafter, a print inspection of the liquid discharge head 1 is performed. Finally, the discharge port surface 24 of the recording element substrate 2 is washed, dried, and sealed with tape.

  FIG. 6 shows a modification of the present embodiment. The notch 33 of the supply nozzle 7 has a shape smaller than a semicircle, and the total length of the gap G (see FIG. 5) between the supply nozzle 7 and the side surface of the electrical wiring board 3 is larger than that of the embodiment shown in FIG. It is getting smaller. Accordingly, the length of the meniscus M formed in the gap G is reduced accordingly, and it is difficult to hold the first sealing material S1, so that the amount of the first sealing material S1 flowing in the groove 43b is increased. Although not shown, the notch 33 of the supply nozzle 7 has a shape larger than a semicircle, and by increasing the overall length of the gap G, the holding force of the first sealing material S1 is increased, and the first flowing through the groove 43b is increased. It is also possible to reduce the amount of the sealing material S1. Even if the shape of the notch 33 is the same (for example, semicircular), the same effect can be achieved by changing the radius of the notch 33 and the supply nozzle 7. FIG. 9 shows a comparative example in which the gap G is not formed. In the comparative example, since the flow of the first sealing material S1 cannot be controlled, a large amount of the first sealing material S1 flows into the second space 46. As described above, in the present embodiment, the flow of the first sealing material S1 can be controlled by providing the notch 33, and the notch 33 is not enlarged and the length of the gap G is adjusted. Thus, the flow of the first sealing material S1 can be controlled more finely. In the form shown in FIG. 3, the protruding length P of the supply nozzle 7 from the edge 32 of the electric wiring board 3 is 400 μm.

(Second Embodiment)
FIG. 7 is a view similar to FIG. 3A, illustrating a method for manufacturing the liquid discharge head 1 according to the second embodiment of the present invention. In the present embodiment, the notch 33 of the electrical wiring board 3 is formed in the corner portion 35 of the electrical wiring board 3. The notch 33 has a fan shape with a diameter slightly larger than the outer diameter of the supply nozzle 7, and the center of the fan shape coincides with the center of the supply nozzle 7. Compared to the first embodiment, the supply nozzle 7 can be arranged close to the recording element substrate 2 or the first space 45. For this reason, the first sealing material S1 can easily enter the first space 45, and the liquid discharge head 1 can be manufactured with a faster production tact.

(Third embodiment)
FIG. 8 is a view similar to FIG. 3A showing a method of manufacturing the liquid discharge head 1 according to the third embodiment of the present invention. A hole 36 is formed in the electrical wiring board 3, and the supply nozzle 7 is inserted into the hole 36. The hole 36 is formed above the injection part 47. The diameter of the hole 36 is slightly larger than the outer diameter of the supply nozzle 7. Since the meniscus M is formed along the entire circumference of the hole 36, the holding force of the first sealing material S1 is increased. Therefore, the first sealing material S1 having a low viscosity can be used favorably. The center of the supply nozzle 7 may be displaced from the center of the hole 36 toward the first space 45 so that the first sealing material S1 can easily flow toward the first space 45.

  In each of the embodiments described above, the supply nozzle 7 has a cylindrical shape, and the shape of the notch 33 is a circle or a part of the circle accordingly. However, the supply nozzle 7 may be oval and the shape of the notch 33 may be oval or part of the oval accordingly. The supply nozzle 7 may be a polygon such as a triangle, a quadrangle, or a hexagon. In this case, the shape of the notch 33 may be a polygon or a part of the polygon correspondingly, but the notch 33 may be omitted. That is, the supply nozzle 7 is installed so that one of the polygonal sides is parallel to the linear edge of the electrical wiring board 3, so that it is continuous between the edge 32 of the electrical wiring board 3 and the supply nozzle 7. Gap G and meniscus M can be formed.

2 Recording element substrate 3 Electric wiring substrate 4 Support member 7 Supply nozzle 45 First space 46 Second space S1 First sealing material S2 Second sealing material M Meniscus

Claims (11)

A recording element substrate having a discharge port for discharging a liquid is fixed to a recess provided on a first surface of a support member, and an electrical wiring substrate having an electrical connection portion formed between the recording element substrate and the recording element substrate An assembly which is fixed to the first surface of the support member and has a first space in which the electrical connection portion is formed upward in a part between the recording element substrate and the side surface of the recess. Creating,
Supplying a first sealing material from a supply nozzle, and filling the first space with the first sealing material;
Supplying a second sealing material on the first sealing material, and sealing the electrical connection portion with the second sealing material,
The supply nozzle is adjacent to at least a part of a side surface of the electrical wiring board located between the supply nozzle and the first space via a gap, and the first nozzle is adjacent to at least a part of the gap. A method for manufacturing a liquid discharge head, wherein a meniscus of one sealing material is formed. A recording element substrate having a discharge port for discharging a liquid is fixed to a recess provided on a first surface of a support member, and an electrical wiring substrate having an electrical connection portion formed between the recording element substrate and the recording element substrate An assembly which is fixed to the first surface of the support member and has a first space in which the electrical connection portion is formed upward in a part between the recording element substrate and the side surface of the recess. Creating,
Supplying a first sealing material from a supply nozzle, and filling the first space with the first sealing material;
Supplying a second sealing material on the first sealing material, and sealing the electrical connection portion with the second sealing material,
The supply nozzle has a continuous gap that generates a meniscus of the first sealing material in at least a part between a portion of the supply nozzle facing the first space and a side surface of the electrical wiring board. A method of manufacturing a liquid discharge head, which is arranged so as to be formed.   3. The method of manufacturing a liquid ejection head according to claim 1, wherein the supply nozzle is disposed such that a supply port of the supply nozzle is positioned at a height between the first surface and a bottom surface of the recess. .   3. The method of manufacturing a liquid ejection head according to claim 1, wherein the supply nozzle is disposed such that a supply port of the supply nozzle is positioned at a height of the first surface.   The said supply nozzle is circular, The said supply nozzle is arrange | positioned along the notch of the shape which cut off a part of circle | round | yen, and was formed in the said electrical wiring board. A manufacturing method of a liquid discharge head given in the paragraph.   5. The method of manufacturing a liquid ejection head according to claim 1, wherein the supply nozzle is disposed along a notch formed in a corner portion of the electric wiring board. 6.   5. The method of manufacturing a liquid ejection head according to claim 1, wherein the supply nozzle is disposed in a hole formed in the electric wiring board.   Between the recording element substrate and the side surface of the recess, a second space is formed in which the electrical connection portion is not formed upward, and the bottom surface of the recess has a main plane on which the recording element substrate is fixed, and A groove extending along the side surface of the recording element substrate, and after the first space is filled with the first sealing material, the entire side surface of the recording element substrate is The method of manufacturing a liquid ejection head according to claim 1, wherein the liquid ejection head is exposed and at least a part of the groove is filled with the first sealing material. A recording element substrate having a discharge port for discharging a liquid is fixed to a recess provided on a first surface of a support member, and an electrical wiring substrate having an electrical connection portion formed between the recording element substrate and the recording element substrate An assembly which is fixed to the first surface of the support member and has a first space in which the electrical connection portion is formed upward in a part between the recording element substrate and the side surface of the recess. Creating,
Supplying a first sealing material from a supply nozzle, and filling the first space with the first sealing material,
The supply nozzle is adjacent to at least a part of a side surface of the electrical wiring board located between the supply nozzle and the first space via a gap, and the first nozzle is adjacent to at least a part of the gap. A method for manufacturing a liquid discharge head, wherein a meniscus of one sealing material is formed. A recording element substrate having a discharge port for discharging a liquid;
An electrical wiring board in which an electrical connection is formed with the recording element substrate;
A first surface provided with a recess, and a support member in which the recording element substrate is fixed to the recess.
The electric wiring board is fixed to the first surface of the support member, and a first space in which the electric connection portion is formed above is formed in a part between the recording element substrate and the side surface of the recess. Formed,
The first space is filled with a first sealing material;
The electrical connection portion is sealed with a second sealing material formed on the first sealing material;
The electrical wiring board has a region protruding from the recess, a notch is provided at an edge of the region, and a portion of the recess between the notch and the first space is the first space. A liquid discharge head filled with a sealing material. A recording element substrate having a discharge port for discharging a liquid;
An electrical wiring board in which an electrical connection is formed with the recording element substrate;
A first surface provided with a recess, and a support member in which the recording element substrate is fixed to the recess.
The electric wiring board is fixed to the first surface of the support member, and a first space in which the electric connection portion is formed above is formed in a part between the recording element substrate and the side surface of the recess. Formed,
The first space is filled with a first sealing material;
The electrical wiring board has a region protruding from the recess, a notch is provided at an edge of the region, and a portion of the recess between the notch and the first space is the first space. A liquid discharge head filled with a sealing material.

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