JP2023054579A - Mounting device, mounting system, and electronic component mounting method - Google Patents

Abstract

To provide a compact mounting device with a simple structure.SOLUTION: The mounting device 6 includes a transport line 3 that transports a substrate 101 in a first direction X in plan view of the substrate 101, and a plurality of heads 12 holding a plurality of electronic components 103 and mounting the electronic components 103 on the substrate 101 transported in the first direction X by the transport line 3. The plurality of heads 12 are arranged along a second direction Y orthogonal to the first direction X when the substrate 101 is viewed from above. It is possible to move each of the electronic components 103 in the second direction Y while not moving the electronic component 103 in the first direction X. The transport line 3 sequentially moves the substrate 101 in the first direction X according to the movement of each of the plurality of heads 12 toward or away from the substrate 101 in the third direction Z of the plurality of heads 12 orthogonal to both the first direction X and the second direction Y.SELECTED DRAWING: Figure 4

Description

The present invention relates to a mounting apparatus, a mounting system using the mounting apparatus, and an electronic component mounting method.

A mounting apparatus is also called a surface mounter or a chip mounter, for example, and mounts electronic components on a substrate coated with silver paste, solder, or the like. The mounting apparatus has a head that can move horizontally in both the X-axis direction and the Y-axis direction while holding the chip (see, for example, Patent Document 1).

JP 2019-54298 A

As shown in FIG. 1 of Patent Document 1, a conventional moving mechanism for moving the head along two axes of XY includes a pair of X-axis tables arranged parallel to each other along the conveyor on both sides of the conveyor. and a Y-axis table that spans between a pair of X-axis tables and is arranged perpendicular to the conveyer in a plan view.

Further, the conventional moving mechanism includes a moving stage moving mechanism (X-axis motor) that moves a moving stage to which a transfer head is attached along an X-axis table, and a Y motor to which the moving stage is attached via the X-axis table. A Y-axis slider moving mechanism (Y-axis motor) for moving the axis slider along the Y-axis table and drive motors are provided for each of the two axes.

In such a mounting apparatus, three tables (guide rails) and a plurality of drive motors occupy a large space in the housing, making it difficult to reduce the size of the housing. An object of the present invention is to provide a mounting apparatus, a mounting system, and an electronic component mounting method that can realize a compact and simple structure.

A mounting apparatus according to an aspect of the present invention includes a transport line that transports a board in a first direction in plan view of the board, and a plurality of electronic components that are held on the board transported in the first direction by the transport line. a plurality of heads on which electronic components are mounted; The plurality of heads are arranged along a second direction orthogonal to the first direction in a plan view of the substrate, and do not move the respective electronic components in the first direction, while moving the respective electronic components in the second direction. It can be moved. The transport line moves the substrate in the first direction according to the movement of each of the plurality of heads toward or away from the substrate in a third direction orthogonal to both the first direction and the second direction. Move sequentially.

An electronic component mounting method according to another aspect of the present invention includes a transport line that transports a substrate in a first direction in a plan view of the substrate, and an electronic component that holds the electronic component and is transported in the first direction by the transport line. and a mounting apparatus having a plurality of heads for mounting a plurality of electronic components on a printed circuit board. A method for mounting an electronic component comprises: a plurality of heads arranged along a second direction perpendicular to the first direction; a transfer line conveying a substrate in the first direction; holding an electronic component; moving each electronic component in a second direction while the plurality of heads does not move each electronic component in a first direction in plan view of the substrate; The transfer line sequentially moves the substrate in the first direction in response to each of the plurality of heads approaching or separating from the substrate in a third direction orthogonal to both of the directions; , mounting electronic components on the board.

According to these aspects, since the table and motor for moving the head in the first direction can be omitted, the size of the mounting apparatus can be reduced. The movement in the first axis direction, in which the mounting apparatus cannot transport the electronic component, can be substituted by transporting the board using the transport line.

The above aspect may further include at least one feeder that supplies electronic components to the plurality of heads, wherein the at least one feeder conveys the electronic components in the first direction and supplies the electronic components to each of the plurality of heads. good.

According to this aspect, since the longitudinal direction of the feeder is parallel to the conveying line, the occupied area of the mounting apparatus can be made smaller than the conventional mounting apparatus in which the longitudinal direction of the feeder is perpendicular to the conveying line.

The above aspect may be configured as a mounting system further including a loader that supplies the substrates to the transfer line and an off-loader that recovers the substrates from the transfer line. All processes including the transfer line, the loader, at least one feeder, the plurality of heads, and the off-loader may be accommodated in one housing.

According to this aspect, it is possible to reduce the occupied area of the mounting system including the mounting apparatus, compared to the conventional system in which the housings are separated for each function.

According to the present invention, it is possible to provide a compact mounting device with a simple structure.

1 is a plan view showing a schematic configuration of an example of a mounting system provided with a mounting apparatus according to one embodiment of the present invention; FIG. FIG. 2 is a perspective view of the head shown in FIG. 1 as seen from the upstream side of a transfer line; 2 is a perspective view of the mounting apparatus shown in FIG. 1 as seen from the downstream side of a transfer line; FIG. FIG. 4 is a perspective view of the conveying line with the feeder shown in FIG. 3 removed; It is a flowchart explaining an example of the mounting method using the mounting apparatus of one Embodiment of this invention.

Preferred embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that, in each figure, the same reference numerals have the same or similar configurations. The mounting apparatus 6 of this embodiment is also called a surface mounter or a chip mounter, and mounts electronic components 103 such as capacitors, ICs, transistors, and resistors on the surface of a substrate 101 such as a lead frame or printed circuit board. The mounting mode of the mounting apparatus 6 of this embodiment is not limited to surface mounting, and may be insertion mounting.

In the mounting apparatus 6 of this embodiment, a plurality of heads 12 holding a plurality of electronic components 103 are arranged along the second direction Y. As shown in FIG. The second direction Y intersects the first direction X, which is the direction in which the transfer line 3 extends, when the substrate 101 is viewed from above.

One of the characteristics is that the plurality of heads 12 move in the second direction Y in the horizontal direction, but do not move in the first direction X orthogonal to the second direction Y. As shown in FIG. The relative positions of the substrate 101 and the electronic component 103 in the first direction X in which the heads do not move can be adjusted by sequentially moving the substrate 101 with the transport line 3 . In other words, the complex two-axis head moving mechanism provided in the conventional mounting apparatus is replaced by the Y-axis table 22 of the mounting apparatus 6 that can move in the second direction Y and the transfer apparatus 3 that can move in the first direction X. It is divided into an X-axis stage 9 and a simple structure.

According to this embodiment, the table and the drive motor for moving the plurality of heads 12 in the first direction X can be omitted, so the number of components of the mounting device 6 can be reduced and the cost can be reduced. Since the structure is simple, the mounting device 6 can be configured compactly. Hereinafter, each configuration will be described in detail with reference to FIGS. 1 to 4. FIG.

FIG. 1 is a plan view showing a schematic configuration of an example of a mounting system 1 having a mounting device 6 according to one embodiment of the present invention. The illustrated example includes a loader 4, a dispenser 5, a mounting device 6, an appearance inspection device 7, an off-loader 8, and a transfer line 3 arranged across them. One of the features of this embodiment is that such a mounting system 1 is housed in a single housing 2 .

The transport line 3 transports the substrate 101 in the first direction X. As shown in FIG. In the following description, the direction intersecting the first direction X (X-axis direction) in plan view of the substrate 101 is defined as the second direction Y (Y-axis direction), and the XY plane including the first and second directions X, Y The intersecting direction is defined as a third direction Z (Z-axis direction).

In the illustrated example, the first to third directions X, Y, Z are orthogonal to each other. Note that the first to third directions X, Y, and Z may intersect at an angle other than a right angle. In the illustrated example, the XY plane is the horizontal plane, and the third direction Z is the vertical direction. The XY plane may be slightly inclined from the horizontal plane, and the third direction Z may be slightly inclined from the vertical direction.

The transfer line 3 is, for example, a linear conveyor module composed of a linear motor, an X-axis stage (slider) 9, a controller, and the like. It is possible to move the substrate 101 at high speed and with high precision by controlling the speed, stop position, and the like. The transport line 3 is not limited to a linear conveyor module, and may be a belt conveyor, a roller conveyor, a chucking feed mechanism capable of inching, or the like.

The loader 4 supplies substrates 101 to the transfer line 3 . The offloader 8 recovers the board 101 with the electronic component 103 mounted thereon from the transfer line 3 . The dispenser 5 applies a conductive adhesive 102 such as silver paste to the surface of the substrate 101 . Mounting apparatus 6 mounts electronic component 103 on substrate 101 coated with conductive adhesive 102 .

The appearance inspection device 7 inspects the front and back of the substrate 101 to confirm that the electronic component 103 is conductively joined to the substrate 101 . Note that the dispenser 5 may be configured to apply solder instead of the silver paste. In that case, a reflow device for melting solder may be added between the mounting device 6 and the visual inspection device 7 . It may be provided after the appearance inspection device 7 .

2 is a perspective view of the head 12 shown in FIG. 1 as seen from the upstream side of the transfer line 3. FIG. As shown in FIG. 2, the mounting apparatus 6 includes a plurality of head units 10 having heads 12 for holding electronic components 103 and mounting them on a substrate 101, and moving the plurality of head units 10 parallel to the surface of the substrate 101. and at least a feeder 30 for supplying electronic components 103 to each head 12 .

In the illustrated example, six head units 10 are provided in the mounting device 6 and arranged in a row along the second direction Y. As shown in FIG. Each head unit 10 includes a body 11 attached to a Y-axis stage 22 of a head moving mechanism 20 to be described later, and a head 12 that can move up and down from the body 11 toward the transfer line 3 . The body portion 11 is provided with a Z-axis motor that moves each head 12 up and down along the third direction Z, an R-axis motor that rotates each head 12 around the Z-axis, and the like. The Z-axis motor and R-axis motor are, for example, small servomotors. Each head 12 is provided with a suction nozzle or the like for sucking the electronic component 103 .

The head moving mechanism 20 includes a Y-axis table 21 (guide rail) extending along the second direction Y so as to cross the transfer line 3 and a Y-axis table 21 (guide rail) movable in the second direction Y along the Y-axis table 21 . An axis stage 22 and a Y-axis motor 23 that drives the Y-axis stage 22 are provided. The Y-axis table 21 is fixed to a frame 50 (shown in FIG. 3) forming part of the housing 2 and does not move in the X-axis direction.

The feeder 30 includes, for example, a holder 31 extending along the longitudinal direction L, a reel 32 (shown in FIG. 1) holding the holder 31, and a tape 33 wound around the reel 32 (shown in FIG. 1). , is configured as a tape feeder. Such a feeder 30 rewinds the tape 33 by rotating the reel 32 with a motor incorporated in the holder 31 and supplies the electronic components 103 held on the tape 33 to the head 12 .

The configuration of the feeder 30 is not limited to a tape feeder, and may be a tray feeder that supplies electronic components 103 held on a tray, or a stick feeder that supplies electronic components 103 held on a stick. However, other types of feeders may be used.

A plurality of feeders 30 may be configured to supply the electronic components 103 to a plurality of heads 12 in order to speed up component supply, or a single feeder may be configured to save the space inside the housing 2 . 30 may be configured to supply electronic components 103 to multiple heads 12 . In the illustrated example, six feeders 30 are provided in the mounting device 6 corresponding to the six heads 12, and these feeders 30 are stacked in the second direction Y. As shown in FIG.

In each feeder 30, the size of the holder 31 in the longitudinal direction L is larger than the size of the holder 31 in the lateral direction and the thickness direction. As described in Patent Document 1 and the like, in the conventional mounting apparatus, the longitudinal direction L of the feeder 30 is arranged so as to be orthogonal to the first direction X, which is the extending direction of the transfer line. One of the features of this embodiment is that each feeder 30 is arranged such that its longitudinal direction L is parallel to the first direction X, as shown in FIG.

In the illustrated example, the mounting apparatus 6 further includes various cameras such as a board position recognition camera 41, a component position recognition camera 42, a feeder position recognition camera 43, and a disposal box 44 for collecting defective electronic components when they are misplaced. I have. The substrate position recognition camera 41 is provided on the transport line 3, and captures the substrate 101 transported directly under the head 12 from above when the head 12 is not there, and monitors the substrate 101 for each process of mounting electronic components on the substrate. Acquire the position information of each pilot pin hole. The component position recognition camera 42 is provided in the middle of the Y-axis movement of the head 12 and acquires the position information of the electronic component 103 by imaging the electronic component 103 sucked by the head 12 from below.

The feeder position recognition camera 43 is provided on the Y-axis stage 22 and acquires the position information of the feeder 30 by imaging the position of the pocket of the feeder 30 . In the illustrated example, the feeder position recognition camera 43 is arranged parallel to the head unit 10 extending in the third direction Z, and arranged in a line in the second direction Y together with the plurality of head units 12 . Image data captured by the various cameras 41, 42, and 43 is acquired by a control unit that controls the movement of the mounting device 6, the head moving mechanism 20 adjusts the positions of the feeder 30 and the head 12, and the transport line 3 is adjusted. It is used for error correction when adjusting the positions of the substrate 101 and the head 12 .

3 is a perspective view of the mounting apparatus 6 shown in FIG. 1 as seen from the downstream side of the transfer line 3. FIG. FIG. 4 is a perspective view of the conveying line 3 with the feeder 30 shown in FIG. 3 removed. As shown in FIGS. 3 and 4, one of the features of this embodiment is that the X-axis table and its drive source, which are present in the head moving mechanism of the conventional mounting apparatus, are omitted.

The transport line 3 is arranged according to the movement of each of the plurality of heads 12 toward or away from the substrate 101 in the third direction Z orthogonal to both the first direction X and the second direction Y. , the substrate 101 is moved in the first direction X sequentially.

As described above, the transport line 3 has a motor that can move the substrate 101 accurately. Therefore, when the substrate 101 is sequentially moved in the first direction X, the relative position between each head 12 and the substrate 101 can be reliably adjusted.

FIG. 5 is a flow chart illustrating an example of a mounting method using the mounting apparatus of one embodiment of the present invention. In this mounting method, first, the transport line 3 transports the substrate 101 coated with the conductive adhesive 102 in the first direction X to place the substrate 101 in the mounting device 6 (step S1). The substrate 101 coated with the conductive adhesive 102 can be obtained by supplying the substrate 101 from the loader 4 and coating the substrate 101 with the conductive adhesive from the dispenser 5 .

Next, the Y-axis stage 12 to which the plurality of head units 10 are attached moves in the second direction Y to make the heads 12 face the feeder 30 . Each of the plurality of heads 12 holds the electronic component 103 received from the feeder 30 in a suction nozzle or the like (step S2). For example, by obtaining the relative position of each head 12 and feeder 30 using the feeder position recognition camera 43, they can be accurately aligned. Note that step S2 may be performed after step S1, or step S1 may be performed after step S2. Step S1 and step S2 may be performed simultaneously.

In this embodiment, each head 12 holding an electronic component 103 does not move each electronic component 103 in the first direction X when the substrate 101 is viewed from above. On the other hand, by moving the Y-axis stage 12 to which the plurality of head units 10 are attached in the second direction Y, each electronic component 103 is moved in the second direction Y (step S3).

Specifically, each electronic component 103 is moved in the second direction Y so that only its relative position in the second direction Y is aligned with a predetermined position on the substrate 101 . The predetermined position of the substrate 101 is, for example, a position where a conductive adhesive or solder is applied, a position of a through hole (pilot pin hole) into which the lead terminal of the electronic component 103 is inserted, and the like.

In this embodiment, not moving the electronic component 103 in the first direction X means that in a series of mounting processes for the electronic component 103 in which the head 12 moves up and down in the third direction Z, the conventional mounting apparatus In the present embodiment, it is specified that the head 12 is fixed in the first direction X, whereas the head 12 is movable. In other words, even a configuration in which the electronic component 103 is movable in the first direction in a process other than the mounting process in which the head 12 moves up and down is included in the present embodiment. For example, the electronic component 103 may be movable in the first direction in a process such as maintenance that is not related to the gist of the invention.

As described above, each head 12 can move up and down in the third direction Z to approach or separate from the substrate 101 . The transport line 3 sequentially moves the substrate 101 in the first direction X according to the motion of each head 12 approaching or separating from the substrate 101, and the relative position in the first direction X with respect to a predetermined position of the substrate 101. are aligned (step S4).

More specifically, the transport line 3 capable of transporting the substrate 101 in the first direction X advances and retreats the substrate 101 in the mounting device 6 by a very small distance in synchronization with the up-and-down motion of the head 12, thereby moving the substrate 101 forward and backward. Align the substrate 101 with the fixed head 12 in the direction X; The position of the head 12 can be aligned with respect to all predetermined positions on the substrate 101 by sequentially performing such alignment (minute movement). Note that step S4 may be performed after step S3, or step S3 may be performed after step S4. Step S3 and step S4 may be performed simultaneously.

The head 12 approaching the surface of the substrate 101 is aligned with the substrate 101 and the head 12 in the second direction Y by the Y-axis stage 12 of the mounting device 6 , and is moved in the first direction X by the X-axis stage 32 of the transport device 3 . With the substrate 101 and the head 12 aligned, the electronic component 103 is mounted at a predetermined position on the substrate 101 (step S5). Thereafter, steps 3 and 4 are repeated until electronic components 103 are mounted on all predetermined positions of substrate 101 (step 6). If the head 12 does not hold the electronic component 103 to be mounted at a predetermined position on the substrate 101, the process returns to step 2 to supply the electronic component 103 from the feeder 30 to the head 12 (step 7).

The mounting apparatus 6 of the present embodiment configured as described above has a moving mechanism for moving the head 12 only in the second direction Y and a moving mechanism for moving the head 12 only in the second direction Y, unlike the two-axis XY head moving mechanism of the conventional mounting apparatus. A moving mechanism for moving the head 12 only in one direction X and a two-axis moving mechanism are separately mounted on the mounting device 6 and the transport device 3 .

Therefore, according to the mounting apparatus 6 of the present embodiment, the mounting system 1 using the mounting apparatus 6, and the mounting method using the mounting apparatus 6, the head moving mechanism 20 of the mounting apparatus 6 is simplified by reducing the number of parts. structure. By omitting the mechanism for moving the head 12 in the first direction X, the space occupied by the calibration can be reduced. Cost can be reduced and a compact mounting device 6 can be provided.

Furthermore, according to the present embodiment, the longitudinal direction L of the feeder 30 and the transfer line 3 are arranged in parallel to reduce the space corresponding to the projection of the feeder 30 in the second direction Y, thereby making the mounting apparatus 6 more compact. can be provided. Since all processes from the loader 4 to the off-loader 8 are housed in one housing 2, the area occupied by the mounting system 1 including the mounting device 6 can be reduced.

The embodiments described above are for facilitating understanding of the present invention, and are not intended to limit and interpret the present invention. Each element included in the embodiment and its arrangement, materials, conditions, shape, size, etc. are not limited to those illustrated and can be changed as appropriate. Also, it is possible to partially replace or combine the configurations shown in different embodiments.

DESCRIPTION OF SYMBOLS 1... Mounting system, 2... Housing, 3... Transfer line, 4... Loader, 5... Dispenser, 6... Mounting apparatus, 7... Appearance inspection apparatus, 8... Off-loader, 9... X-axis stage, 10... Head unit, 11 Body 12 Head 20 Head moving mechanism 21 Y-axis table 22 Y-axis stage 23 Y-axis motor 30 Feeder 31 Holder 32 Reel 33 Tape 41 Substrate position recognition camera 42 Component position recognition camera 43 Feeder position recognition camera 44 Waste box 50 Frame 101 Substrate 102 Conductive adhesive 103 Electronic component L Longitudinal direction S1 ˜S2: mounting method, X: first direction, Y: second direction, Z: third direction.

Claims (4)

a transport line for transporting the substrate in a first direction in plan view of the substrate;
a plurality of heads that hold electronic components and mount a plurality of electronic components on the substrate transported in the first direction by the transport line;
The plurality of heads are arranged along a second direction orthogonal to the first direction in a plan view of the substrate, and do not move each electronic component in the first direction, while moving each electronic component to the above-mentioned direction. capable of moving in a second direction;
The transport line is adapted to move the plurality of heads toward or away from the substrate in a third direction orthogonal to both the first direction and the second direction. sequentially moving in the first direction;
mounting equipment. further comprising at least one feeder that supplies electronic components to the plurality of heads;
the at least one feeder transports electronic components in the first direction and supplies the electronic components to each of the plurality of heads;
The mounting apparatus according to claim 1. In addition to the mounting device according to claim 2,
further comprising a loader that supplies substrates to the transfer line and an offloader that recovers the substrates from the transfer line;
All processes of the transfer line, the loader, the at least one feeder, the plurality of heads, and the off-loader are housed in one housing,
implementation system. a transport line for transporting the substrate in a first direction in plan view of the substrate;
a plurality of heads holding electronic components and mounting the plurality of electronic components on the substrate transported in the first direction by the transport line;
wherein the plurality of heads are arranged along a second direction orthogonal to the first direction,
the transport line transporting the substrate in the first direction;
each of the plurality of heads holding an electronic component;
the plurality of heads moving each electronic component in the second direction while not moving each electronic component in the first direction in plan view of the substrate;
The transfer line sequentially moves the substrate in the first direction according to the movement of each of the plurality of heads toward or away from the substrate in a third direction perpendicular to both the first direction and the second direction. and
each of the plurality of heads mounting an electronic component on a substrate;
Mounting method of electronic components.

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