JP2023046223A - Radiator and electron device - Google Patents

Abstract

To provide a radiator capable of radiating heat in more efficient arrangement, and an electron device.SOLUTION: A radiator (1) comprises: a heat receiving unit (11) in contact with a heat radiation object (20); a radiation unit (12) that radiates heat into the air; and a heat pipe (13) that transfers heat from the heat receiving unit (11) to the heat radiation unit (12). The heat pipe (13) has a bent part (131) that bends away from the heat radiation object (20). The heat receiving unit (11) has a portion that follows at least a part of the bent part (131) and is in contact with the bent part (131).SELECTED DRAWING: Figure 2

Description

The present invention relates to a heat dissipation device and an electronic device.

Various electronic components that operate in electronic equipment generate heat as they operate, but may also be adversely affected by temperature changes. Therefore, there is a heat dissipation device that quickly dissipates the generated heat from the electronic component. In Patent Document 1, by twisting and folding back a flat heat pipe that connects a heat receiving part in contact with an electronic device and a heat radiating fin that efficiently dissipates heat, space can be saved without lowering the efficiency of heat transport. A technique for doing so is disclosed.

JP-A-2001-251079

However, in the prior art, there is a problem that the heat dissipation device inevitably occupies the volume of the bent portion of the heat pipe by bringing the heat receiving part and the heat pipe into complete contact.

SUMMARY OF THE INVENTION An object of the present invention is to provide a heat dissipation device and an electronic device that can dissipate heat in a more efficient arrangement.

In order to achieve the above object, the present invention
a heat-receiving part in contact with a heat-dissipating target;
a heat radiating part that dissipates heat into the air;
a heat pipe that conducts heat from the heat receiving portion to the heat radiating portion;
with
The heat pipe has a bent portion that bends in a direction away from the target of heat dissipation,
The heat-receiving section is a heat dissipation device having a portion that follows at least a portion of the bent section and is in contact with the bent section.

ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that heat can be heat-dissipated by more efficient arrangement.

It is a figure which shows the electronic device containing the thermal radiation device of 1st Embodiment. It is a figure which shows the structure of the heat sink of 1st Embodiment. It is a side view of the heat dissipation device of the second and third embodiments. It is a figure explaining the heat sink of 4th, 5th embodiment. It is a figure explaining the example of the cross section of a thermal radiation device.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing an electronic device 100 including a heat dissipation device 1 of the first embodiment.
As shown in the external perspective view of FIG. 1A, the electronic device 100 is, for example, a projection device that emits light from an output lens 41 and projects an image. In the electronic device 100, each component is arranged on a support plate 102 (see FIG. 1B) and covered with a cover member 101 attached to the support plate 102. FIG. The cover member 101 has lattice windows 101a for air intake and exhaust.

FIG. 1B shows a perspective view of the inside with the cover member 101 removed. Here, the electronic device 100 shown in FIG. 1A is rotated by 180 degrees within the mounting surface and is viewed obliquely from the rear side with respect to the emission direction of the emission lens 41. As shown in FIG.
An optical system 40 including the output lens 41, a control circuit 50, and a blower section 60 are arranged on the support plate 102. As shown in FIG. In addition, heat dissipation devices 1 and 2 for dissipating heat generated/obtained mainly in the control circuit 50 and the heat generating portion of the optical system 40 (mainly light emitting elements, movable mirrors (Digital Micromirror Device; DMD), etc.) There is The heat dissipation device 2 is large and has a large amount of heat dissipation. The heat dissipation device 1 is small and has a relatively small amount of heat dissipation compared to the heat dissipation device 2 .

The optical system 40 includes a light emitting unit, lenses and mirrors for converging and guiding light, and a switching element (such as the DMD described above) for switching between output and non-output of the converged light for each pixel. The light-emitting part is, for example, an LED or an LD (laser diode), and the LD in particular tends to generate more heat than other parts. In addition, as the DMD operates, the light that is not output is scattered and absorbed in the optical system 40, so that this light turns into heat and the optical system 40 is heated. Therefore, the optical system 40 is the main target of heat dissipation by the heat dissipation devices 1 and 2 described above.

The control circuit 50 has a control IC and associated electronic components, and controls the operation of the optical system 40 (DMD) according to the projected image. Since the control IC and the like also generate heat as they operate, they can be the heat dissipation target of the heat dissipation device 1 and the like.

The air blowing unit 60 is, for example, a fan here, sucks the air in the vicinity of the heat radiating portion of the nearest heat radiating device 2, and blows the cover member 101 through the lattice window 101a located in the immediate vicinity on the opposite side of the heat radiating device 2. Send outside. Part of the air that flows in from the outside of the cover member 101 in response to the air that is sent to the outside of the cover member 101 by the air blower 60 flows in from other lattice windows 101a and flows around the heat dissipation portion of the heat dissipation device 1. It passes through and goes to the air blowing part 60. - 特許庁For this reason, the positional relationship between the parts (that is, the gap that serves as the passage of air) may be appropriately determined.

As described above, it can be seen that the volumes of the heat dissipation devices 1 and 2 are so large that they cannot be ignored compared to the size of the electronic device 100 . On the other hand, it is not preferable to increase the size of the electronic device 100 indefinitely. Therefore, it is desired that the heat dissipation devices 1 and 2 be arranged as efficiently as possible and miniaturized while ensuring their effectiveness.

FIG. 2 is a diagram showing the structure of the heat dissipation device 1 of the first embodiment. FIG. 2(a) is a perspective view, and FIG. 2(b) is a side view seen from the side.
As shown in FIG. 2( a ), the heat dissipation device 1 includes a heat receiving part 11 in contact with a heat dissipating target 20 , a heat dissipating part 12 dissipating the heat into the air, and a heat transmitting part 12 from the heat receiving part 11 to the heat dissipating part 12 . A pipe 13, a support plate 15, and the like are provided.

The heat receiving portion 11 includes a base member and a joint member 114 . Here, the base member has, for example, a plate-shaped heat transfer portion 111 and a protruding portion 112 protruding from the heat transfer portion 111. The surface of the protruding portion 112 opposite to the heat transfer portion 111 is 112 s of protruding surfaces are contact surfaces that come into contact with the heat dissipating target 20 .
The base member and the support plate 15 are each made of a conductive metal having a high thermal conductivity, such as aluminum or copper having a thermal conductivity exceeding 100 W/(m·K). The base member is, for example, aluminum die-casting, in which molten metal such as an aluminum alloy is pressed into a mold and molded instantly, or heat-melted resin is extruded from the mold, cooled, solidified, and continuously molded. It is formed by extrusion molding, cutting along the outer shape, or the like. As a result, the base member has a substantially rigid structure in which the amount of deformation is sufficiently small compared to the basic shape and can be almost ignored. A heat-dissipating target 20 and a heat pipe 13 are in contact with the heat-receiving part 11 , and the heat generated by the heat-dissipating target 20 is transferred to the heat pipe 13 via the heat-receiving part 11 .

The radiator 12 radiates (radiates) the heat received from the heat pipe 13 into the air. The heat dissipation part 12 has a plurality of conductor plates (heat dissipation fins), and the heat dissipation plates are arranged in parallel on the support plate 15 to increase the contact area with the air, thereby efficiently dissipating heat. Although only one heat pipe 13 is shown here, a plurality of heat pipes 13 may be provided. In this case, each heat pipe 13 may be connected to a different heat radiating section 12 or may be connected to a common heat radiating section 12 . The heat radiating portion 12 is a conductive metal with high thermal conductivity, such as an aluminum material or a copper material. The material of the heat radiating portion 12 may be the same as or different from that of the base member of the heat receiving portion 11 .

In addition, although it is desirable that the heat radiation unit 12 is positioned on the path of the air flow by the blower unit 60 as described above, the heat radiation device 1 itself includes the blower unit, and the blower unit is heated near the heat radiation unit 12. It may also create a wind that moves the air.

As shown in FIG. 2B, here, the heat transfer portion 111 and the support plate 15 are positioned at right angles, and the lower portion of the support plate 15 is in contact with the heat receiving portion 11 (heat transfer portion 111). , but not limited to these. A heat pipe 13 connects the heat receiving portion 11 , the heat radiating portion 12 and the support plate 15 .

Here, the heat receiving portion 11 has a pair of rail-shaped projections 1111 (guide portions) on an upper surface 111s (first surface), which is the surface opposite to the side of the heat transfer portion 111 on which the projecting portion 112 is provided. , and the heat pipe 13 extends between the protrusions 1111 . A joint member 114 joins the side surface of the projection 1111 and the upper surface 111 s between the protrusions 1111 and the heat pipe 13 . The height of the protrusion 1111 may be approximately the same as the height of the heat pipe 13, but may be higher or lower than this. As a result, the side surfaces of the protrusions 1111 cover both side surfaces of the heat pipe 13 (including the case where the protrusions 1111 that are lower than the heat pipe 13 imperfectly cover the heat pipes 13 as described above), thereby increasing the heat transfer area. , the area of the heat pipe 13 in direct contact with the air is reduced. Also, the heat transfer portion 111 may have a groove on the upper surface 111s instead of the pair of projections 1111 as a guide portion. Also, the shape of the upper surface 111 s between the protrusions 1111 and the shape of the inside of the groove may match the cross-sectional shape of the heat pipe 13 . The joining member 114 may be embedded in part or all of the gap between the heat pipe 13 and the heat transfer section 111 .

The joining member 114 is a member having a high thermal conductivity (a thermally conductive joining member). As a result, heat is quickly transferred from the heat receiving portion 11 to the heat pipe 13 . Such a joining member 114 contains a conductive metal or the like in an electrically conductive manner, and has a thermal conductivity of at least about 10 W/(m·K) or more, such as solder. Alternatively, the joining member 114 may be a brazing material having thermal conductivity similar to that of solder, or a conductive adhesive containing a metal filler (such as silver).

The heat pipe 13 has a pipe made of a material with high thermal conductivity, such as copper, which has a capillary structure inside the hollow structure, and a volatile working fluid enclosed in the hollow structure portion of the pipe. This working fluid evaporates on the heat source side, absorbs latent heat, quickly moves along the capillary tube to the heat sink side, and then condenses to release the latent heat, thereby promoting heat transfer. The cross-sectional shape of the pipe is circular or wide and flat. With this structure, the heat pipe 13 has a significantly higher heat transfer efficiency (for example, 1 to 2 orders of magnitude or more, 10000 W / (m K) or more, etc.) compared to the heat receiving portion 11 and the heat radiating portion 12 having high thermal conductivity. ). Therefore, the heat pipe 13 can quickly release the heat received by the heat receiving section 11 from the heat radiating target 20 to the heat radiating section 12 from the heat receiving section 11 . The heat pipe 13 has a bent portion 131, a straight portion 132 connected to one end thereof, and a straight portion 133 connected to an end opposite to the one end. 11 (located on the upper surface 111 s), heat is transmitted from the heat receiving portion 11 to the heat pipe 13 . Further, the straight portion 133 is in contact with the heat radiating portion 12 , and heat is transferred from the heat pipe 13 to the heat radiating portion 12 . In this portion, a minimum length (reference minimum value) is normally required so that heat can be sufficiently transferred between the linear portions 132 and 133 (working fluid) and the heat receiving portion 11 and heat radiating portion 12. be.

In order that the heat receiving portion 11 and the heat radiating portion 12 do not interfere with the movement of the working fluid in the heat pipe 13, the bent portion 131 has a curve shape (not a bend) with a curvature radius R (reference minimum diameter) greater than or equal to the necessary minimum. For example, the reference minimum diameter is three times the outer diameter of a cylindrical heat pipe or the thickness of a flat tube. Here, the bent portion 131 is bent (bending angle) by 90 degrees from the direction along the upper surface 111s of the linear portion 132, and is separated from the upper surface 111s (here, the reference surface of the upper surface 111s (the uneven portion such as the protrusion 1111). ) and the protruding surface 112s of the protruding portion 112 are parallel to each other, that is, in a direction away from the heat dissipating target 20), and connected to a straight portion 133 directed in a direction perpendicular to the upper surface 111s. , the heat is transferred from the heat receiving portion 11 to the heat radiating portion 12 . The bent portion 131 is positioned floating from the surface of the heat transfer portion 111, and in the heat dissipation device 1, the joint member 114 is positioned between the heat transfer portion 111 and the bent portion 131 to join them. As a result, the heat receiving portion 11 follows the bending of the bending portion 131 and comes into contact with the heat pipe 13 and the heat receiving portion 11 physically and thermally. The follow-up here means that the distance between each position of the bottom surface of the bent portion 131 (in the case of a cylindrical shape, the line forming the bottom) and the heat receiving portion 11 is continuous or intermittent in at least a part of the range. Specifically, it means that the distance is below a reference distance which is sufficiently smaller than the radius of curvature R (for example, 10% or less, more preferably 2-3% or less). At least a part of the following portion is in contact, that is, the distance is zero (physically connected), so that heat can be quickly transmitted from the heat receiving portion 11 to the bending portion 131 (thermally connected). ).

At this time, when the heat transfer portion 111 is viewed from above (on the opposite side of the heat dissipation target 20 of the heat dissipation device 1, here, in a direction perpendicular to the projecting surface 112s in contact with the heat dissipation target 20), the bent portion Since the protrusions 1111 extend below the position of 131, it is possible to limit the joint member 114 between the protrusions 1111 and make it difficult to protrude outward. The height of the protrusion 1111 at this portion may be the same as the height of the protrusion 1111 at the portion in contact with the straight portion 132, or it may be higher or lower than this.

In this way, since the bent portion 131 and the heat receiving portion 11 are in direct contact with each other to enable heat conduction (thermally connected), the length of the straight portion 132 is shorter than the conventional (standard minimum value). good too. For example, the length of the heat pipe 13 connected to the heat transfer portion 111, that is, the total length of the linear portion 132 and the bent portion 131 (the length in plan view may be acceptable) is equal to or greater than the reference minimum value. All you have to do is When the reference minimum diameter is a size that cannot be ignored compared to the size of the heat-dissipating target 20 or the heat-receiving part 11, by configuring the bent part 131 as well as the contact part with the heat-receiving part 11 in this way, the heat is dissipated. This prevents the plan view size of the device 1 from increasing by the bending portion 131 .

Here, a groove extends through the support plate 15 and the heat pipe 13 extends through the groove. The depth of the groove is approximately the thickness of the heat pipe 13 (for example, the diameter of the circular outer cross section), and here, the heat pipe 13 and each heat radiating fin of the heat radiating section 12 are in contact with each other. Alternatively, the heat pipe 13 penetrates through the plate surface of each heat dissipating fin according to the direction of the plate surface (the penetration here is not limited to the case of a closed area surrounded entirely by the plate surface, but also partially may be in the form of a notch that is open across the border of the plate). Also, the cross-sectional shape of the bottom surface of the groove perpendicular to the direction along the groove may match the outer shape of the heat pipe 13 (that is, may be semicircular). Alternatively, the gap between the wall surface of the groove and the heat pipe 13 in the groove may be filled with a bonding member 114 (which may be the same as the thermally conductive bonding member described above). In these cases, the support plate 15 itself may also function as a part of the heat radiating section 12 , and part of the heat is transmitted to the heat radiating fins of the heat radiating section 12 via the support plate 15 .

Since the side surface of the heat transfer section 111 and the lower end portion of the support plate 15 are in contact with each other, at least a part of the end portion of the heat pipe 13 is in contact with the boundary position of the heat transfer section 111 in plan view (boundary). line or inside the boundary). That is, since the heat pipe 13 does not protrude greatly from the planar view range of the heat transfer section 111 (heat receiving section 11), it is possible to arrange the heat pipe 13 more compactly than before. Furthermore, the proportion of the heat pipe 13 in contact with the heat transfer portion 111, the support plate 15, or the heat dissipation portion 12 is high, and the area directly exposed to the air is small. In particular, since there is no part protruding from the heat receiving part 11 in plan view (smaller than in the conventional case), the heat pipe 13 is less likely to directly face the flow of air (wind) to the air blowing part 60 . As a result, in this heat dissipation device 1, the amount of heat that is directly radiated from the heat pipe 13 into the air is smaller than in the conventional case. In the heat pipe 13, heat is transported more efficiently as the temperature gradient between the heat receiving portion 11 (the portion in contact with the heat transfer portion 111) and the heat radiating portion 12 increases. If the amount of heat released is large, this temperature gradient will be disturbed and the heat transport efficiency will decrease. Therefore, the heat dissipation device 1 has a structure that facilitates obtaining a higher heat dissipation efficiency than the conventional one.

FIG. 3 is (a) a side view of the heat dissipation device 1a of the second embodiment, and (b) a side view of the heat dissipation device 1b of the third embodiment.
In the heat dissipation device 1a shown in FIG. 3(a), the upper surface 111s of the heat receiving portion 11a is curved along the bent portion 131, and is in direct contact with the bent portion 131 or via a layer of a thin bonding member. physically and thermally connected by In this way, the heat transfer portion 111a (base member) itself has (follows) a curved portion (curved portion) matching the shape along the extending direction of the heat pipe 13 including the bent portion 131. , the heat receiving portion 11 and the heat pipe 13 are easily joined as usual, and the heat is reliably and quickly transmitted to the heat pipe 13 at the bent portion 131 . In this case, the portion of the upper surface 111s corresponding to the bent portion 131 in the horizontal direction of FIG. A part including the range along the heat pipe 13 , for example, only the projection 1111 and the range therebetween may protrude from the plane and may be curved (following) along the heat pipe 13 .

In the heat dissipation device 1b shown in FIG. 3B, the heat transfer portion 111b of the heat receiving portion 11b does not have a groove, and the heat transfer portion 111b is positioned along the curved heat transfer portion 111b along (following) the bent portion 131. The pipe 13 may be in contact with the heat transfer section 111b either directly or via the joint member 114. As shown in FIG.

FIG. 4 is (a) a perspective view showing a heat receiving portion 11c and a heat pipe 13c in a heat dissipation device 1c of the fourth embodiment, and (b) a side view of a heat dissipation device 1d of the fifth embodiment.
As shown in FIG. 4A, the heat pipe 13c of the heat dissipation device 1c has a U-shape bent 180 degrees. The heat transfer portion 111c of the heat receiving portion 11c has two rows of protrusions 1111c along the U-shape and a groove portion in which the heat pipe 13c is sandwiched between the protrusions 1111c (having a shape to follow and contact). In this case, the heat pipe 13c receives and absorbs heat from the heat transfer portion 111c near the center from the bottom of the U shape to the bent portions on both ends in the groove between the two rows of protrusions 1111c. Heat may flow through each of the bent portions and be radiated to the support plate 15c and the heat radiating portion 12c. That is, the heat radiating portion 12c may be positioned in common across both ends (both supporting plates 15c) of the heat pipe 13c, as indicated by the dashed line, or may be positioned at both ends (both supporting plates 15c) of the heat pipe 13c. 15c) may have a plurality of each contacting separately. In this shape, the length of the heat pipe 13c in contact with the heat receiving portion 11c is longer than in the conventional case compared to the area of the heat receiving portion 11c in plan view. As a result, heat is more efficiently transferred to the heat radiating portion 12c. Moreover, since the heat pipe 13c is exposed to air only on the inner surface side of the bend, it is particularly difficult to be exposed to the wind, and heat is more efficiently transferred from the heat receiving portion 11c to the heat radiating portion 12c.

Alternatively, as shown in FIG. 4(b), the heat pipe 13d of the heat dissipation device 1d of the fifth embodiment is bent 90 degrees at each of the bent portions 131 and 134 with the straight portion 132 interposed therebetween for a total of 180 degrees. good too. The heat transfer portion 111d has a U-shaped upper surface that matches (follows) the shape of the heat pipe 13d, and is in contact with the bent portions 131 and 134 directly or via a joining member. As a result, the length of the heat pipe 13d in contact with the heat receiving portion 11d increases compared to the area of the heat receiving portion 11d in plan view. The heat pipe 13d has a J-shape with one end connected to a straight portion 133 that extends upward. The linear portion 133 is fixed to the support plate 15 and conducts heat to the heat radiating portion 12 . In this case, the working fluid does not monotonously rise and fall when heat is transported and returned.

5A to 5D are diagrams showing examples of cross sections (a) to (d) taken along the section line AA in FIG. 4(b) and examples of a cross section (e) taken along the section line AA in FIG. 3(b).
For example, as shown in FIG. 5A, the bent portion 131 of the heat pipe 13d may be entirely in contact with the heat transfer portion 111d via the joining member 114 within the groove. Also, as shown in FIG. 5B, even if a part of the heat pipe 13d, for example, the bottom surface is in contact with the heat transfer section 114 via the joining member 114, and the side surface of the heat pipe 13d is in direct contact with the heat transfer section 114, good. On the contrary, as shown in FIG. 5C, the heat transfer portion 111d and the heat pipe 13d (bent portion 131) are in direct contact with each other on the bottom surface of the groove, and the heat transfer portion 111d and the heat pipe 13d (bent portion 131) are in direct contact with each other on the side surface of the groove. ) may be in contact with each other via the joining member 114 .

Alternatively, as shown in FIG. 5D, the joining member 114 may be in contact with the upper surface side of the heat pipe 13d (outside the groove, ie, other than the position between the heat transfer portion 111d and the heat pipe 13d). Furthermore, as shown in FIG. 5E, when there is no protrusion of the heat transfer portion 111b along the side surface of the heat pipe 13, the bottom surface of the heat pipe 13 is in direct contact with the heat transfer portion 111c, and the heat pipe 13 may be joined to the joining member 114 which rises on the heat transfer part 111c.

As described above, the heat dissipation device 1 of the above embodiment includes the heat receiving part 11 that contacts the heat dissipation target 20, the heat dissipation part 12 that dissipates heat into the air, the heat pipe 13 that transfers heat from the heat receiving part 11 to the heat dissipation part 12, Prepare. The heat pipe 13 has a bent portion 131 that bends away from the heat radiating target 20 , and the heat receiving portion 11 has a portion that follows at least a portion of the bent portion 131 and contacts the bent portion 131 .
As described above, in the heat dissipation device 1, heat can be transferred from the heat receiving part 11 to the bent part 131 bent in the direction away from the heat dissipating target 20. Even if the length of the portion 132 is shortened, the heat corresponding to the heat transfer capability of the heat pipe 13 can be transferred from the heat receiving portion 11 to the heat pipe 13 and the heat can be efficiently radiated. In addition, this eliminates the need for the bent portion 131 to protrude greatly outside the heat receiving portion 11 in a plan view. can be improved. Furthermore, since the heat pipe 13 does not protrude greatly outside the heat receiving portion 11 in this manner, the area exposed to the air is reduced, and the temperature gradient between the heat receiving portion 11 and the heat radiating portion 12 of the heat pipe 13 is reduced. Since it becomes easy to maintain appropriately, heat transport is performed more efficiently.

The heat receiving section 11 also includes a base member including the heat transfer section 111 and the projecting section 112 and a joining member 114 . The joining member 114 may be in contact with at least part of the bent portion 131 . Thus, in the heat dissipation device 1a, heat can be reliably and directly transferred from the relatively fixed heat receiving portion 11 to the bent portion 131. As shown in FIG. In addition, since the transfer of heat from the heat receiving portion 11 to the heat pipe 13 is not limited to the linear portion 132, efficient heat transfer is possible without using the curved portion 131 with the radius of curvature R as a wasteful space.

In addition, the base member (heat transfer section 111) has a curved surface portion that at least partially follows the at least a portion of the bent portion 131, and at least a portion of the curved surface portion is connected to the heat pipe 13 (directly and /or through a layer of thin bonding member 114). By matching the shape of the heat transfer portion 111 itself to the bent shape of the bent portion 131 in this way, the heat can be transferred from the heat receiving portion 11 directly or to a short distance to the heat pipe 13 with high thermal conductivity even at this portion. , the heat transport by the heat pipe 13 can be made more compact in plan view size.

Also, the joining member 114 may be positioned in a gap between at least a portion of the bent portion 131 and the base member (heat transfer portion 111 ), and may be in contact with the bent portion 131 and the heat transfer portion 111 . At least part of them are connected by a joint member 114 having a high thermal conductivity (rate). When the diameter of the heat pipe 13 is small and accordingly the radius of curvature R of the bent portion 131 is not so large, by filling the gap with the joining member 114, the bent portion 131 and the heat transfer portion can be easily connected. 111 can be physically and thermally connected. As a result, heat can be transmitted and received between the heat receiving portion 11 and the bent portion 131 even if the upper surface 111s of the heat receiving portion 11 has a simple flat surface or a guide portion. Even if the radiator 1 is miniaturized, the heat transport efficiency is not lowered.

Also, the joining member 114 is solder, brazing material, or conductive adhesive. By using the conventionally used bonding member 114 having high thermal conductivity as described above, the heat receiving portion 11 can easily follow the bending portion 131 at low cost, and the bending portion 131 and the heat receiving portion 11 are physically and can be thermally connected.

The heat pipe 13 also has a straight portion 132 connected to one end of the bent portion 131 , and the straight portion 132 is positioned on the heat transfer portion 111 . In the heat dissipation device 1, even if the linear portion 132 is shortened while maintaining such a conventional positional relationship, it is possible to perform sufficient heat transport in a more compact manner as described above.

Further, the heat receiving portion 11 (heat transfer portion 111) may have projections 1111 covering both side surfaces of the heat pipe 13 along the extending direction of the heat pipe 13. As shown in FIG. As a result, heat can be transferred to the heat pipe 13 not only from the bottom side of the heat pipe 13 but also from three directions, thereby improving the transportation efficiency. On the other hand, since the exposed area of the heat pipe 13 to the outside (air) can be reduced, unnecessary heat radiation other than the heat radiation portion 12 can be suppressed. As a result, the temperature gradient between the heat receiving portion 11 side and the heat radiating portion 12 side of the heat pipe 13 is appropriately maintained, and heat is transported more efficiently. In addition, since it is possible to prevent the joint member 114 from protruding from between the projections 1111, the consumption amount of the joint member 114 can be kept within an appropriate range.

In addition, at least part of the bent portion 131 is within the range of the heat receiving portion 11 in a plan view of the heat dissipating target 20 viewed from above (the side of the heat dissipation device 1), and at least part of the bent portion 131 is at least part of the bent portion 131. is in contact with the heat receiving portion 11 .
In this way, by including the bent portion 131 as much as possible in the range of the heat receiving portion 11 in plan view, the heat dissipation device 1 that is more compact than the conventional one can be realized while suppressing a decrease in the efficiency of heat transport from the heat receiving portion 11 to the heat dissipating portion 12. Obtainable.

Also, the bent portion 131 may have a bending angle of 90 degrees. As a result, the heat radiating part 12 can be arranged directly above the heat receiving part 11 without protruding greatly from the range of the heat receiving part 11 in plan view, so that the space can be efficiently used to effectively transport and radiate heat. can be done.

One end of the bent portion 131 of the heat pipe 13 faces in a direction perpendicular to the upper surface 111s, and at least a part of this one end extends from the upper surface 111s (heat receiving portion 11) when viewed from above. located on or inside the boundary of In this way, since the bent portion 131, that is, the heat pipe 13 is kept within a range that does not protrude outwardly from the range of the heat receiving portion 11 in a plan view, the heat dissipation device 1 can maintain the amount of heat transported while saving space. compact shape.

Further, the electronic device 100 of the present embodiment includes the heat dissipation device 1 described above and a heat dissipation target 20 (here, the optical system 40 and the control circuit 50) in contact with the heat receiving portion 11 of the heat dissipation device 1. By dissipating heat from the electronic device 100 using the compact heat dissipation device 1, it is possible to prevent the electronic device 100 from overheating while appropriately suppressing an increase in the overall size of the electronic device 100 and generation of unnecessary internal space. can.

It should be noted that the present invention is not limited to the above embodiments, and various modifications are possible.
For example, in the above embodiments, the heat pipes 13 are in contact with the upper surfaces 111s of the heat receiving portions 11, 11a to 11d and are positioned between the protrusions 1111 extending on the upper surfaces 111s (or within grooves). The pipe 13 may penetrate inside the heat receiving portion 11 . In this case, the bent portion 131 may be completely buried, or if a portion of the heat receiving portion 11 is protruding, the protruding portion may be joined to the upper surface 111s by the joining member 114. good.

Further, in the above-described embodiment, the heat receiving portion 11 follows the entire bending portion 131 and is joined to the upper surface 111s, but the present invention is not limited to this. It may be joined to the upper surface 111 s so that the heat receiving portion 11 follows only a part of the bent portion 131 . Further, the portion of the heat-receiving portion 11 that follows and contacts the bent portion 131 may not be continuous, and may be divided into a plurality of portions. That is, since at least a part of the bent portion 131 is connected to the heat receiving portion 11, heat can be efficiently transferred from the heat receiving portion 11 to the heat pipe 13 in a more compact range than in the past.
In addition, the heat receiving portion 11 is not flat or curved, but has a bent shape (for example, a concave structure in which a plurality of surfaces are arranged so as to approach the bent portion 131 and follow the bent portion 131, or a concave structure in which each corner , and may be in contact with the bent portion 131 at intervals. Also, part or all of the portion not in direct contact may be embedded with the bonding member 114 to increase the contact area.

Also, the joining member 114 may be other than solder, brazing material, or conductive adhesive. As long as the material has a high thermal conductivity, it is not necessary to consider the electrical conductivity here, and an appropriate material may be selected.
Alternatively, the joining member 114 may join only the straight portion 132 and the heat receiving portion 11 and may simply contact the bent portion 131 and the heat transfer portion 111 without being joined. In this case, the structure may be such that the bent portion 131 and the heat transfer portion 111 are pressed against each other so that they are not separated from each other due to vibration, distortion over time, or the like.

In the above embodiment, the straight portion 132 is in contact with the upper surface 111s of the heat receiving portion 11 as in the conventional case. It may meander in any direction, such as in a plane along the top surface 111s or in a plane perpendicular to the top surface 111s.

Further, in the above-described embodiment, the bent portion 131 has been described as bent by 90 degrees or a total of 180 degrees, but the present invention is not limited to this. It may be bent at any angle other than these. Accordingly, the arrangement and shape of the fins may be appropriately adjusted. Also, the curvature radius R of the bent portion 131 may not be constant. The curvature radius R(θ) may vary according to the angle θ within the range of curvature radii equal to or larger than the reference minimum diameter.

Further, in the above-described embodiment, a pair of protrusions 1111 are positioned on both sides of the heat pipe 13, but one protrusion 1111 may be provided on only one side of the heat pipe 13. FIG.

Further, in the above embodiment, the linear portion 132 is made shorter than the conventional one, and at least a part of one end of the bent portion 131 (the linear portion 133) is within the range or on the boundary line of the heat receiving portion 11 in plan view. Illustrated, but not limited to. By physically/thermally connecting the bent portion 131 and the upper surface 111s of the heat receiving portion 11 without shortening the straight portion 132, the amount of heat transport related to heat dissipation can be increased. Alternatively, the planar view area of the upper surface 111s may be slightly reduced, and the planar view position of the linear portion 133 may be outside the planar view range of the upper surface 111s while the size is reduced compared to the conventional art.

Further, in the above embodiment, the electronic device 100 is described as an example of a projection device, but the electronic device 100 is not limited to this. The electronic device 100 may be an electronic device 100 that can use the heat dissipation device 1 for heat dissipation of each part such as a CPU, a graphic board, a light emitting part (including infrared rays and UV), a motor, an internal support structure and a substrate.
In addition, the specific configurations, contents and procedures of processing operations, etc. shown in the above embodiments can be changed as appropriate without departing from the scope of the present invention.

Although several embodiments of the present invention have been described, the scope of the present invention is not limited to the embodiments described above, but includes the scope of the invention described in the claims and equivalents thereof.
The invention described in the scope of claims originally attached to the application form of this application is additionally described below. The claim numbers in the appendix are as in the claims originally attached to the filing of this application.

[Appendix]
<Claim 1>
a heat-receiving part in contact with a heat-dissipating target;
a heat radiating part that dissipates heat into the air;
a heat pipe that conducts heat from the heat receiving portion to the heat radiating portion;
with
The heat pipe has a bent portion that bends in a direction away from the target of heat dissipation,
The heat radiation device, wherein the heat receiving portion has a portion that follows at least a portion of the bent portion and is in contact with the bent portion.
<Claim 2>
The heat receiving section has a base member and a joining member that joins the base member and the heat pipe,
The heat dissipation device according to claim 1, wherein the joint member is in contact with the at least part of the bent portion.
<Claim 3>
The heat receiving section has a base member and a joining member that joins the base member and the heat pipe,
3. The base member according to claim 1, wherein the base member has a curved surface portion that at least partially follows the at least one portion of the bent portion, and at least a portion of the curved surface portion is in contact with the heat pipe. Heat dissipation device.
<Claim 4>
4. The heat dissipation device according to claim 2, wherein the joint member is positioned in a gap between the at least part of the bent portion and the base member and is in contact with the bent portion and the base member.
<Claim 5>
The heat dissipation device according to any one of claims 2 to 4, wherein the joining member is solder, brazing material or conductive adhesive.
<Claim 6>
The heat pipe has a straight portion connected to one end of the bent portion,
The heat dissipation device according to any one of claims 2 to 5, wherein the straight portion is positioned on the base member.
<Claim 7>
The heat dissipation device according to any one of claims 1 to 6, wherein the heat receiving portion has guide portions that cover both side surfaces of the heat pipe along the extending direction of the heat pipe.
<Claim 8>
At least a portion of the bent portion is within the range of the heat receiving portion in a plan view viewed from a direction perpendicular to the contact surface of the base member with the heat-dissipating target, and at least one of the at least a portion of the bent portion The heat dissipation device according to any one of claims 1 to 7, wherein a portion is in contact with the heat receiving portion.
<Claim 9>
The heat dissipation device according to any one of claims 1 to 8, wherein the bent portion has a bending angle of 90 degrees.
<Claim 10>
one end of the bent portion of the heat pipe is oriented in a direction perpendicular to a contact surface of the base member with the target of heat dissipation;
10. The heat sink according to any one of claims 1 to 9, wherein at least part of said one end is positioned on or inside a boundary line of said base member in a plan view seen in a direction perpendicular to said contact surface. Device.
<Claim 11>
The heat dissipation according to any one of claims 1 to 10, wherein the heat pipe has bent portions on both end sides, and the heat receiving portion follows each of the bent portions and is in contact with at least a portion thereof. Device.
<Claim 12>
a heat dissipation device according to any one of claims 1 to 11;
a heat dissipating target in contact with the heat receiving part;
electronic equipment.

1, 1a to 1d, 2 heat dissipation device 11, 11a to 11d heat receiving portion 111, 111a to 111d heat transfer portion 1111, 1111c protrusion 111s upper surface 112s protrusion surface 112 protrusion 114 joining member 12, 12c heat dissipation portion 13, 13c, 13d heat Pipes 131, 134 Bending portions 132, 133 Straight portions 15, 15c Supporting plate 20 Heat dissipation object 40 Optical system 41 Output lens 50 Control circuit 60 Air blowing unit 100 Electronic device 101 Cover member 101a Lattice window 102 Supporting plate

Claims (12)

a heat-receiving part in contact with a heat-dissipating target;
a heat radiating part that dissipates heat into the air;
a heat pipe that conducts heat from the heat receiving portion to the heat radiating portion;
with
The heat pipe has a bent portion that bends in a direction away from the target of heat dissipation,
The heat radiation device, wherein the heat receiving portion has a portion that follows at least a portion of the bent portion and is in contact with the bent portion. The heat receiving section has a base member and a joining member that joins the base member and the heat pipe,
The heat dissipation device according to claim 1, wherein the joint member is in contact with the at least part of the bent portion. The heat receiving section has a base member and a joining member that joins the base member and the heat pipe,
3. The base member according to claim 1, wherein the base member has a curved surface portion that at least partially follows the at least one portion of the bent portion, and at least a portion of the curved surface portion is in contact with the heat pipe. Heat dissipation device. 4. The heat dissipation device according to claim 2, wherein the joint member is positioned in a gap between the at least part of the bent portion and the base member and is in contact with the bent portion and the base member. The heat dissipation device according to any one of claims 2 to 4, wherein the joining member is solder, brazing material or conductive adhesive. The heat pipe has a straight portion connected to one end of the bent portion,
The heat dissipation device according to any one of claims 2 to 5, wherein the straight portion is positioned on the base member. The heat dissipation device according to any one of claims 1 to 6, wherein the heat receiving portion has guide portions that cover both side surfaces of the heat pipe along the extending direction of the heat pipe. At least a portion of the bent portions is within the range of the heat receiving portion when viewed from above in a direction perpendicular to a contact surface of the heat receiving portion with the heat radiating target, and at least one of the at least a portion of the bent portions The heat dissipation device according to any one of claims 1 to 7, wherein a portion is in contact with the heat receiving portion. The heat dissipation device according to any one of claims 1 to 8, wherein the bent portion has a bending angle of 90 degrees. one end of the bent portion of the heat pipe is directed in a direction perpendicular to a contact surface of the heat receiving portion with the target of heat dissipation;
The heat sink according to any one of claims 1 to 9, wherein at least part of the one end is positioned on or inside the boundary line of the heat receiving portion in a plan view seen in a direction perpendicular to the contact surface. Device. The heat dissipation according to any one of claims 1 to 10, wherein the heat pipe has bent portions on both end sides, and the heat receiving portion follows each of the bent portions and is in contact with at least a portion thereof. Device. a heat dissipation device according to any one of claims 1 to 11;
a heat dissipating target in contact with the heat receiving part;
electronic equipment.

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