JP2023045716A - Method for manufacturing electronic component with metal terminal - Google Patents

Abstract

To provide a method for manufacturing an electronic component with a metal terminal capable of reducing defective fitting of the electronic component relative to an arm unit of the metal terminal.SOLUTION: A method for manufacturing an electronic component with a metal terminal includes the step of holding the electronic component 2 in a predetermined direction by a pair of arm units 34, 35 provided on the metal terminal 12. The holding step has an abutment process for bringing the electronic component 2 into contact with the metal terminal 12 in a state in which the pair of arm units 34, 35 are opened larger than a dimension of the electronic component 2 in a predetermined direction, and a closing process for closing the pair of arm units 34, 35 to a side of the electronic component 2 in a state in which the electronic component 2 is brought into contact with the metal terminal 12.SELECTED DRAWING: Figure 7

Description

The present disclosure relates to a method of manufacturing an electronic component with metal terminals.

As a conventional method for manufacturing an electronic component with metal terminals, for example, there is a method for manufacturing an electronic component described in Patent Document 1. This conventional manufacturing method includes a step of interposing a connecting member between an end surface of an external electrode and an inner surface of a metal terminal in an electronic component, and a step of bringing a pressing head into contact with the outer surface of the metal terminal to pressurize and heat the metal terminal. and joining the metal terminal and the external electrode with a connecting member. The metal terminal is provided with a leg that protrudes from the electronic component. An electronic component is mounted on a member to be connected, such as a circuit board, by soldering a leg portion to the mounting surface of the member to be connected, such as a circuit board.

JP 2019-50309 A

In the electronic component disclosed in Patent Document 1 described above, a pair of upper and lower arm portions are provided at the electrode-facing portion of the metal terminal. By fitting the electronic component to the arm when joining the electronic component to the metal terminal, it is possible to stably hold the electronic component on the metal terminal. When fitting an electronic component to the arm portion, a method of inserting the electronic component between the arm portions using elastic deformation of the arm portion can be considered. However, with this method, it is necessary to devise ways to reduce fitting failures caused by variations in the dimensions of electronic components and misalignment when electronic components are inserted between the arms.

The present disclosure has been made to solve the above problems, and an object of the present disclosure is to provide a method for manufacturing an electronic component with a metal terminal that can reduce fitting failure of the electronic component to the arm portion of the metal terminal.

A method for manufacturing an electronic component with a metal terminal according to one aspect of the present disclosure includes a clamping step of clamping the electronic component in a predetermined direction between a pair of arm portions provided on the metal terminal. a contacting step of contacting the electronic component with the metal terminal in a state in which the electronic component is opened larger than the dimension of the electronic component in the direction; and a closing step.

In this method of manufacturing a component with a metal terminal, the pair of arm portions of the metal terminal are opened in advance to be larger than the dimensions of the electronic component, and after the electronic component is brought into contact with the metal terminal, the pair of arm portions are moved to the side of the electronic component. Close to According to this method, the electronic component can be sandwiched between the arms without considering variations in the dimensions of the electronic component and positional deviation when the electronic component is inserted between the arms. Therefore, it is possible to reduce the fitting failure of the electronic component to the arm portion of the metal terminal.

In the clamping step, a metal terminal may be prepared that has a leg that protrudes in a predetermined direction from the electronic component and a bent portion that bends from the tip of the leg toward the electronic component. By providing such a bent portion in the metal terminal, solder joint between the leg portion and the mounting surface of the member to be connected can be easily performed. In addition, the manufacturing process can be simplified by providing the metal terminal with the bent portion in advance.

The metal terminal has a leg provided so as to protrude from the electronic component in a predetermined direction. You may have a process. By performing the bending step of bending the legs after the clamping step is completed, it is possible to prevent the bent portions of the legs from interfering with the operation when closing the arms. Therefore, the workability of the closing process can be improved.

In the clamping step, the metal terminal may be prepared in a state in which both of the pair of arm portions are open. In this case, since the arm portions open wide, the electronic component can be clamped by the arm portions without further consideration of variations in the dimensions of the electronic component and misalignment when inserting the electronic component between the arm portions. Therefore, it is possible to more reliably reduce the fitting failure of the electronic component to the arm portion of the metal terminal.

In the clamping step, the metal terminal may be prepared in a state in which only one of the pair of arm portions located on the side opposite to the leg portion is open. In this case, the workability of the closing process can be improved regardless of whether or not the bent portion is formed on the leg.

Of the pair of arm portions, the arm portion located on the leg side may be formed by bending a notch provided in a portion of the contact portion of the metal terminal with which the electronic component contacts. In this case, the arm portion can be provided on the metal terminal without increasing the number of parts. Also, the through-hole formed by bending the cut can be used as a window for confirming the bonding state between the electronic component and the metal terminal and the holding state of the electronic component by the arm portion.

In the sandwiching step, a contact portion between the metal terminal and the electronic component is brought into contact with a pressing head, and the metal terminal is pressed toward the electronic component and heated to form a bonding member. A joining step of joining the metal terminal and the electronic component using a contacting step may be provided between the contacting step and the closing step. In this case, the contact portion between the metal terminal and the electronic component can be suitably joined by the pressing head. In addition, since the contacting step is performed before the heat from the pressing head is applied to the metal terminals, it is possible to prevent the metal terminals from warping due to heat from affecting insertion of the electronic component between the arm portions.

At least a pair of arm portions of the metal terminal may be made of a shape memory alloy. In this case, the closing process can be performed without mechanical deformation such as caulking. Therefore, simplification of the process is achieved.

According to the present disclosure, it is possible to reduce poor fitting of the electronic component to the arm portion of the metal terminal.

1 is a perspective view showing an example of an electronic component with metal terminals according to one aspect of the present disclosure; FIG. 2 is a side view of FIG. 1; FIG. FIG. 2 is a plan view of FIG. 1; FIG. 3 is a sectional view taken along line IV-IV in FIG. 2; It is a flowchart which shows an example of the manufacturing process of an electronic component with a metal terminal. (a) is a side view showing a preparation process, and (b) is a side view showing a state of a contacting process. (a) is a side view showing a joining process, and (b) is a side view showing a closing process. It is a side view which shows a bending process. (a) And (b) is a side view which shows the metal terminal which concerns on a modification. (a) is a side view showing a preparation process using a metal terminal according to another modification, and (b) is a side view showing a process subsequent to (a). (a) is a side view showing a step subsequent to FIG. 10(b), and (b) is a side view showing a step subsequent to (a).

Hereinafter, a preferred embodiment of a method for manufacturing an electronic component with metal terminals according to one aspect of the present disclosure will be described in detail with reference to the drawings.
[Configuration of electronic component with metal terminal]

FIG. 1 is a perspective view showing an example of an electronic component with metal terminals according to one aspect of the present disclosure. 2 is a side view of FIG. 1, and FIG. 3 is a plan view of FIG. The electronic component 1 with metal terminals shown in FIGS. 1 to 3 has a mode in which one or a plurality of electronic components 2 are held by a pair of plate-like metal terminals 12 , 12 . In this embodiment, the electronic component 1 with metal terminals has an array 13 including two electronic components 2 .

A pair of metal terminals 12 , 12 are arranged to face each other in a direction orthogonal to the arrangement direction of the electronic components 2 in the arrangement 13 . The array 13 has electronic components 2, 2 adjacent in the Y direction, and an insulating member 14 (see FIGS. 1 and 3) arranged between the electronic components 2, 2. As shown in FIG. The electronic component 2 is, for example, a chip-type electronic component such as a laminated ceramic capacitor. A connected member (not shown) on which the electronic component 2 is mounted is, for example, another electronic component, a circuit member, a printed circuit board, or the like. In the following description, the facing direction of the pair of metal terminals 12, 12 is the X direction, the arrangement direction of the electronic components 2 in the array 13 is the Y direction, and the extending direction of the metal terminals 12 is the Z direction. Also, for convenience of explanation, the top and bottom may be referred to based on the top and bottom of the paper surface of FIGS. 1 to 3. FIG.

The electronic component 2 includes a base body 21 and a pair of external electrodes 22, 22 arranged on the outer surface of the base body 21, as shown in FIGS. The element body 21 has a rectangular parallelepiped shape. The cuboid shape may include a shape with chamfered corners and edges, and a shape with rounded corners and edges. The element body 21 has a pair of longitudinal end faces 21a, 21a (see FIGS. 2 and 3), a pair of heightwise end faces 21b, 21b, and a pair of widthwise end faces 21c, 21c. there is The opposing direction of the end faces 21a, 21a coincides with the X direction. The opposing direction of the end faces 21b, 21b coincides with the Z direction. The facing direction of the end faces 21c, 21c is orthogonal to the first direction and the second direction and coincides with the Y direction.

The element body 21 is constructed by laminating a plurality of dielectric layers in a predetermined direction. In the element body 21, the stacking direction of the plurality of dielectric layers coincides with the Y direction. Each dielectric layer is composed of a sintered ceramic green sheet containing a dielectric material. Examples of dielectric materials include dielectric ceramics such as BaTiO ₃ system, Ba(Ti, Zr)O ₃ system, or (Ba, Ca) TiO ₃ system. In the actual element body 21, each dielectric layer is integrated to such an extent that the boundary between each dielectric layer cannot be visually recognized.

Inside the element body 21, as shown in FIG. 4, a plurality of internal electrodes 23A and 23B are arranged. The internal electrodes 23A and 23B are made of a conductive material that is commonly used as internal electrodes of laminated electric elements. The internal electrodes 23A and 23B are made of a sintered conductive paste containing a conductive material. Examples of conductive materials include base metals such as Ni and Cu. In this embodiment, Ni is used as the conductive material.

The internal electrodes 23A and 23B have electrical polarities different from each other. In the element body 21, they are alternately arranged at regular intervals in the Y direction. The internal electrodes 23A and 23B have opposing portions that face each other in the Z direction. The internal electrode 23A is pulled out to the one end surface 21a side and exposed to the one end surface 21a. The internal electrode 23B is pulled out to the other end face a side and exposed to the other end face 21a.

The pair of external electrodes 22, 22 have electrical polarities different from each other. One of the external electrodes 22, 22 is a positive electrode and the other is a negative electrode. The external electrode 22 is provided so as to cover the end surface 21a of the element body 21, as shown in FIGS. The external electrode 22 has electrode portions protruding from the end faces 21b, 21b and the end faces 21c, 21c. That is, the external electrode 5 is formed over five surfaces including the end surfaces 21b, 21b and the end surfaces 21c, 21c centering on the end surface 3a. These electrode portions are connected to each other at the edge of the element body 21 and are electrically connected.

The electrode portion of the external electrode 22 that covers the one end surface 21a is arranged to cover the exposed portion of the internal electrode 23 on the one end surface 21a. Similarly, the electrode portion of the external electrode 22 that covers the other end surface 21a is arranged to cover the exposed portion of the internal electrode 23 on the other end surface 21a. Thereby, each of the internal electrodes 23A and 23B is electrically connected to the corresponding external electrode 5 .

The external electrode 22 may include a first electrode layer on the element body 21 side and a second electrode layer on the opposite side (outer surface side) of the element body 21 . The first electrode layer can be formed, for example, by baking a conductive paste applied to the surface of the element body 21 . The first electrode layer is a sintered metal layer formed by sintering the metal component (metal powder) contained in the conductive paste. The first electrode layer may be a sintered metal layer made of Cu or a sintered metal layer made of Ni. As the conductive paste, a mixture of Cu or Ni powder, a glass component, an organic binder, and an organic solvent can be used. The second electrode layer can be formed on the first electrode layer by plating, for example. The second electrode layer may include, for example, a Ni plating layer formed on the first electrode layer and a Sn plating layer formed on the Ni plating layer.

In array 13, electronic components 2, 2 are arranged in the Y direction such that one end surface 21c of one electronic component 2 and the other end surface 21c of the other electronic component 2 face each other with insulating member 14 interposed therebetween. arrayed. In addition, the electronic components 2 are arranged so that both end positions in the X direction and both end positions in the Z direction are aligned with each other.

The insulating member 14 is made of, for example, an insulating resin such as an epoxy resin. The insulating member 14 may be made of insulating plastic, ceramic, or glass. The insulating member 14 is, for example, an insulating film or an insulating sheet having a rectangular shape equivalent to the end face 21c. The insulating member 14 is sandwiched between the electronic components 2, 2 adjacent to each other in the arrangement direction, and is in contact with the electronic components 2, 2, respectively. The insulating member 14 may be adhered to at least one of the electronic components 2 , 2 .

Both of the pair of metal terminals 12, 12 are formed in a plate shape from a conductive metal material. Examples of metal materials include iron, nickel, copper, silver, and alloys containing these. The metal terminal 12 has a joint portion 31 that is joined to the external electrode 22 and a leg portion 32 that protrudes from the electronic component 2 in the Z direction.

The joint portion 31 has a rectangular shape that overlaps with one of the external electrodes 22, 22 of each of the electronic components 2, 2 when viewed from the X direction. A joining member 33 (see FIGS. 2 and 3) is used for joining the joint portion 31 and the external electrodes 22 , 22 . The joint member 33 has conductivity and electrically connects the joint portion 31 and the external electrodes 22 , 22 . As the joining member 33, for example, solder or a conductive adhesive can be used. As the conductive adhesive, for example, one composed of a resin such as a thermosetting resin and a conductive filler such as Ag can be used. As the thermosetting resin, for example, phenol resin, acrylic resin, silicone resin, epoxy resin, polyimide resin, or the like can be used.

The joint portion 31 is provided with a pair of upper and lower arm portions 34 and 35 that sandwich the electronic component 2 in the Z direction. The arm portions 34 and 35 protrude from the joint portion 31 toward the electronic component 2 along the X direction. The arm portion 34 on the lower side is the arm portion on the side of the leg portion 32 . The arm portion 34 is provided below the joint portion 31 so as to correspond to the lower end surface 21 b of the base body 21 of the electronic component 2 . The width of the lower arm portion 34 in the Y direction is smaller than the width of the electronic component 2 in the Y direction, for example. The lower arm portion 34 is formed by cutting a portion of the joint portion 31 into a rectangular shape, excluding the lower side, and bending the cut piece toward the electronic component 2 side. A rectangular through-hole 38 (see FIG. 1) is formed in the joint portion 31 by bending the cut piece. Through the through hole 38, the lower arm portion 34 and the lower portion of the external electrode 22 of the electronic component 2 can be visually recognized. Therefore, the through hole 38 can be used as a window for confirming the bonding state between the electronic component 2 and the metal terminal 12 and the holding state of the electronic component 2 by the lower arm portion 34 .

The upper arm portion 35 is the arm portion opposite to the leg portion 32 . The arm portion 35 is provided at the upper end of the joint portion 31 so as to correspond to the upper end surface 21 b of the base body 21 of the electronic component 2 . The width of the upper arm portion 35 in the Y direction is approximately the same as the width of the lower arm portion 35 in the Y direction. The electronic component 2 is held by the metal terminals 12 and 12 by the arm portions 34 and 35 sandwiching the electronic component 2 . Tip pieces 34a and 35a that are open in the Z direction with respect to the proximal side are provided at the tips of the arm portions 34 and 35, respectively. Tip pieces 34 a and 35 a function as guides when inserting electronic component 2 between arms 34 and 35 .

As shown in FIG. 1 , the joint 31 is provided with at least one through hole 36 in a region facing the external electrode 22 . The through hole 36 is used, for example, to inject the joining member 33 between the joining portion 31 and the external electrode 22 . The through-holes 36 are used to check the state of bonding between the bonding portion 31 and the external electrodes by the bonding member 33 .

As shown in FIG. 1, the joint portion 31 is provided with a plurality of protrusions 37 protruding toward the external electrode 22 side. These protrusions 37 reduce the contact area between the joint portion 31 and the external electrode 22, and the vibration generated in the electronic component 2 is transmitted to the metal terminal 12 (and the connected member connected via the metal terminal 12). suppress Moreover, according to these protrusions 37 , a gap corresponding to the amount of protrusion of the protrusions 37 can be provided between the joint portion 31 and the external electrode 22 . Thereby, the joint member 33 can be sufficiently filled between the joint portion 31 and the external electrode 22 .

The leg portion 32 is a portion that is soldered to a member to be connected. The leg portion 32 has an extension portion 41 that continues to the joint portion 31 and a bent portion 42 that bends from the tip of the extension portion 41 toward the electronic component 2 . The extending portion 41 extends from the lower end of the joint portion 31 in the Z direction with the same width as the joint portion 31 . Although the length of the extending portion 41 in the Z direction is not particularly limited, it is longer than the length of the arm portions 34 and 35 in the X direction in this embodiment.

At least one slit 45 is provided near the boundary between the joint portion 31 and the extension portion 41, as shown in FIG. The slit 45 extends in the Y direction corresponding to each of the electronic components 2,2. The width of the slit 45 in the Y direction is, for example, about the same as the width of the arm portions 34 and 35 in the Y direction, or slightly larger. The position of the slit 45 in the Z direction is below the position of the lower arm portion 34 . The slits 45 prevent the solder used for joining with the member to be connected from creeping up from the leg 32 to the joint 31 . Since the slits 45 suppress the solder from creeping up, it is possible to suppress the formation of bridges due to the solder between the leg portion 32 and the lower arm portion 34 .

The bent portion 42 is a portion for securing a sufficient bonding area by soldering in mounting to a member to be connected. In this embodiment, as shown in FIGS. 1 and 2 , the bent portion 42 is bent from the tip of the extended portion 41 toward the electronic component 2 at a right angle with respect to the extended portion 41 . Therefore, the extended portion 41 and the bent portion 42 form an L shape when viewed in the Y direction. The bent portion 42 extends longer in the X direction than the arms 34 and 35, and the tip of the bent portion 42 is located closer to the center of the electronic component 2 in the X direction than the tips of the arms 34 and 35. (See Figure 2).
[Method for producing electronic component with metal terminal]

Next, a method for manufacturing the above-described electronic component with metal terminals will be described. A method for manufacturing an electronic component with metal terminals includes a clamping step of clamping an electronic component 2 in a predetermined direction between a pair of arm portions 34 and 35 provided on a metal terminal 12 . FIG. 5 is a flow chart showing an example of a manufacturing process for an electronic component with metal terminals. As shown in the figure, the manufacturing process of the electronic component with metal terminals includes a preparation process (step S01), a contact process (step S02), a bonding process (step S03), a closing process (step S04), and a bending step (step S05). The preparation process, the contact process, the bonding process, and the closing process are processes that constitute the clamping process of the present disclosure.

The preparation step is a step of preparing the electronic component 2 and the metal terminals 12 described above. In this embodiment, as shown in FIG. 6A, in the metal terminal 12 prepared in the preparation step, the pair of arm portions 34 and 35 are in a state in which they are opened wider than the dimension of the electronic component 2 in the Z direction (predetermined direction). It has become. Here, the dimension of the electronic component 2 in the Z direction is the distance between one end face 21b and the other end face 21b. This is the distance from the electrode portion of the external electrode 22 projecting to the other end face 21b.

In this embodiment, in the metal terminal 12 prepared in the preparation step, the bent portion 42 of the leg portion 32 is not yet formed, and the plate-like portion 43 corresponding to the bent portion 42 extends toward the distal end side of the extension portion 41 . It is in a state of In the joint portion 31 , solder paste 33</b>A as the joint member 33 described above is applied in advance to a predetermined region between the arm portions 34 and 35 .

The opening angle θ1 of the arm portion 34 and the opening angle θ2 of the arm portion 35 with respect to the extension direction (Z direction) of the joint portion 31 are not particularly limited as long as they are open compared to the state in which the electronic component 2 is sandwiched. Considering ease of inserting the electronic component 2 between the portions 34 and 35, θ1 and θ2 may be, for example, 90° or more, or may be 180°. Considering how easily the arm portions 34 and 35 are deformed from the open state to the closed state, θ1 and θ2 may be less than 90°, for example. θ1 and θ2 may be equal to each other or may be different from each other.

The abutting step is a step of abutting the electronic component 2 on the metal terminal 12 . Specifically, in the abutting step, as shown in FIG. 6B, the electronic component 2 is inserted between the pair of arm portions 34 and 35 which are opened in the Z direction larger than the dimension of the electronic component 2. . As a result, one external electrode 22 of the electronic component 2 is brought into contact with the inner surface 31a side of the joint portion 31 of the metal terminal 12 via the solder paste 33A.

The bonding step is a step of soldering the abutment portions between the metal terminals 12 and the electronic component 2 . Here, as shown in FIG. 7A, a pressure head 50 is used for solder joint. In the example of FIG. 7( a ), the pressure head 50 is brought into contact with the outer surface 31 b side of the joint 31 , and the metal terminal 12 is pressed toward the electronic component 2 and heated, whereby the solder paste is applied through the joint 31 . Heat 33A. The press head 50 is, for example, a resistance heating portion, and the press head 50 itself generates heat to instantaneously heat the solder paste 33A. After being heated and pressurized by the pressing head 50 , the solder paste 33 A is cooled and solidified, whereby the joints 31 and the external electrodes 22 are electrically connected by the joint member 33 .

The heating temperature of the pressing head 50 is not particularly limited, and may be any temperature that can melt the solder paste 33A. Moreover, it is preferable to continue the pressurization by the press head 50 for a certain period even after the heating is stopped. Although the pressure applied by the pressing head 50 is not particularly limited, it can be set to a pressure of about 0.01 MPa to 5 MPa, for example.

The closing step is a step of closing the pair of arms 34 and 35 toward the electronic component 2 while the electronic component 2 is in contact with the metal terminal 12 . In this embodiment, the closing process is performed after soldering the joints 31 and the external electrodes 22 . In the closing process, for example, a pair of jigs 51, 51 are used as shown in FIG. 7(b). One jig 51 is arranged on the lower arm portion 34 side, and the other jig 51 is arranged on the upper arm portion 35 side. When the jigs 51 and 51 press the electronic component 2 and the arm portions 34 and 35 so as to sandwich them, the arm portions 34 and 35 are closed to the electronic component 2 side, and the electronic component 2 is moved by the arm portions 34 and 35 in the Z direction. sandwiched between.

The bending step is a step of bending the tip of the leg portion 32 toward the electronic component 2 to form the bent portion 42 . In this embodiment, the bending process is performed as a process subsequent to the clamping process. In the bending step, a jig (not shown) is used to bend the plate-like portion 43 on the distal end side of the extending portion 41 of the leg portion 32 at a right angle from the extending portion 41 as shown in FIG. Thereby, a bent portion 42 is formed at the tip of the extended portion 41 . 6 to 8 illustrate the steps for one metal terminal 12, but by performing the above-described preparation steps to bending steps for the other metal terminal 12, the electronic component with metal terminals shown in FIG. 1 is obtained.
[Effect]

As described above, in this method of manufacturing a component with metal terminals, the pair of arm portions 34 and 35 of the metal terminal 12 are opened in advance to be larger than the dimensions of the electronic component 2 , and the electronic component 2 is attached to the metal terminals 12 . After contacting, the pair of arm portions 34 and 35 are closed toward the electronic component 2 side. According to this technique, the electronic component 2 can be sandwiched between the arm portions 34 and 35 without considering variations in the dimensions of the electronic component 2 and positional deviation when inserting the electronic component 2 between the arm portions 34 and 35. can be done. Therefore, the fitting failure of the electronic component 2 to the arm portions 34 and 35 of the metal terminal 12 can be reduced.

In this embodiment, the metal terminal 12 having the legs 32 protruding from the electronic component 2 in the Z direction is prepared in the preparatory step constituting the sandwiching step. Then, as a step subsequent to the clamping step, there is a bending step of bending the plate-like portion 43 at the tip of the leg portion 32 toward the electronic component 2 to form the bent portion 42 . In this way, by performing the bending step of bending the leg portion 32 after the clamping step is completed, it is possible to prevent the bent portion 42 of the leg portion 32 from interfering with the work when the arm portions 34 and 35 are closed. Therefore, the workability of the closing process can be improved.

In this embodiment, the metal terminal 12 is prepared in a state in which both of the pair of arm portions 34 and 35 are open in the preparatory step constituting the clamping step. In this case, since the arm portions 34 and 35 are widely opened in the Z direction, the electronic component 2 can be inserted without further consideration of variations in the dimensions of the electronic component 2 and misalignment when the electronic component 2 is inserted between the arm portions 34 and 35 . 2 can be held between the arm portions 34 and 35 . Therefore, the fitting failure of the electronic component 2 to the arm portions 34 and 35 of the metal terminal 12 can be more reliably reduced.

In this embodiment, of the pair of arm portions 34 and 35, the arm portion 34 located on the side of the leg portion 32 is provided at a part of the contact portion (joint portion 31) of the electronic component 2 in the metal terminal 12. It is formed by bending the notch. According to this configuration, the arm portions 34 and 35 can be provided on the metal terminal 12 without increasing the number of parts. Further, the through hole 38 formed by bending the cut can be used as a window for confirming the joint state between the electronic component 2 and the metal terminal 12 and the holding state of the electronic component 2 by the arms 34 and 35 .

In this embodiment, in the clamping step, the contact portion between the metal terminal 12 and the electronic component 2 is brought into contact with the pressing head 50, and the metal terminal 12 is pressed toward the electronic component 2 and heated, thereby forming the bonding member 33. A joining step of joining the metal terminal 12 and the electronic component 2 using a contacting step is provided between the contacting step and the closing step. In this case, the pressing head 50 can suitably join the contact portions between the metal terminal 12 and the electronic component 2 . In addition, since the contacting step is performed before the heat from the pressing head 50 is applied to the metal terminals 12, it is possible to prevent the warping of the metal terminals 12 from affecting the insertion of the electronic component 2 between the arms 34 and 35. can.
[Modification]

The present disclosure is not limited to the above embodiments. For example, in the above-described embodiment, the metal terminal 12 in which both of the pair of arm portions 34 and 35 are open is used, but the metal terminal 12 in which only one of the arm portions 34 and 35 is open may be used. . In this case, as shown in FIG. 9A, the metal terminal 12 may be used in which only the arm portion 35 of the arm portions 34 and 35 located on the side opposite to the leg portion 32 is open. In this case, since it is not necessary to close the arm portion 34, the workability of the closing process can be improved regardless of whether or not the bent portion 42 is formed in the leg portion 32.

Further, in the above-described embodiment, the bending step of bending the leg portion 32 is performed as a step subsequent to the clamping step. A metal terminal 12 having a leg portion 32 provided so as to protrude further than the electronic component 2 in a direction and a bent portion 42 bending from the tip of the leg portion 32 toward the electronic component 2 may be prepared. Also in this case, by providing the bent portion 42 to the metal terminal 12, the leg portion 32 and the mounting surface of the member to be connected can be easily soldered. In addition, by providing the bent portion 42 in the leg portion 32 in advance, the bending process can be omitted, thereby simplifying the manufacturing process.

Moreover, at least the pair of arm portions 34 and 35 of the metal terminal 12 may be made of a shape memory alloy. The entire metal terminal 12 may be made of a shape memory alloy. In this case, the closing process can be performed without mechanical deformation such as caulking. Therefore, simplification of the process is achieved. Materials for the shape memory alloy include, for example, titanium, nickel alloys, iron-manganese-silicon alloys, and the like.

When using a metal terminal 12 made of a shape memory alloy, for example, in a preparation step, as shown in FIG. A heat treatment is carried out. Here, an example in which the entire metal terminal 12 is made of a shape memory alloy is exemplified, and the entire metal terminal 12 is subjected to heat treatment. As a result, the shape in which the arm portions 34 and 35 are closed is stored in the shape memory alloy. Next, as shown in FIG. 10B, each of the arm portions 34 and 35 is opened larger than the dimension of the electronic component 2 in the Z direction, and solder paste 33A is applied to the inner surface 31a side of the joint portion 31. Next, as shown in FIG.

In the subsequent abutment step, as shown in FIG. 11A, the electronic component 2 is inserted between the pair of arm portions 34 and 35 which are opened in the Z direction larger than the dimension of the electronic component 2 . As a result, one external electrode 22 of the electronic component 2 is brought into contact with the inner surface 31a side of the joint portion 31 of the metal terminal 12 via the solder paste 33A. After inserting the electronic component 2 between the arm portions 34 and 35, as shown in FIG. 11(b), the pressure head 50 is pressed against the outer surface 31b side of the joint portion 31 to heat the solder paste 33A together with the metal terminal 12. . The arm portions 34 and 35 are closed toward the electronic component 2 by shape memory, and the electronic component 2 is held between the arm portions 34 and 35 in the Z direction. After heating and pressurization by the pressing head 50, the solder paste 33A is cooled and solidified, so that the joint portion 31 and the external electrode 22 are electrically connected by the joint member 33. FIG.

With the method using the shape memory alloy as described above, the closing process can be performed without using mechanical deformation such as caulking. Further, according to the embodiment shown in FIGS. 10(a) to 11(b), it is possible to simultaneously perform the joining process and the closing process, thereby simplifying the process. Note that FIG. 11B illustrates a mode in which the closing process and the bonding process are simultaneously performed, but the electronic component is first soldered to the bonding portion 31, and then the arm portion 34 is subjected to another heat treatment. , 35 may be closed. Further, even when the metal terminal 12 made of a shape memory alloy is used, each modified example as shown in FIGS. 9A and 9B can be applied.

In the above-described embodiment, the multilayer capacitor was exemplified as the electronic component 2, but the electronic component to which the present disclosure can be applied is not limited to the multilayer capacitor. For example, the present disclosure can be applied to laminated electronic components such as laminated inductors, laminated varistors, laminated piezoelectric actuators, laminated thermistors, laminated composite components, and electronic components other than laminated electronic components.

DESCRIPTION OF SYMBOLS 1... Electronic component with a metal terminal, 2... Electronic component, 12... Metal terminal, 32... Leg part, 33... Joining member, 34, 35... Arm part, 42... Bending part, 50... Pressing head.

Claims (8)

A sandwiching step of sandwiching the electronic component in a predetermined direction with a pair of arms provided on the metal terminal,
The sandwiching step includes
a contacting step of bringing the electronic component into contact with the metal terminal in a state in which the pair of arm portions are opened larger than the dimension of the electronic component in the predetermined direction;
a closing step of closing the pair of arms toward the electronic component while the electronic component is in contact with the metal terminals. In the clamping step, the metal terminal is prepared, which has a leg provided so as to protrude in the predetermined direction from the electronic component, and a bent portion that bends from the tip of the leg toward the electronic component. Item 1. A method for manufacturing an electronic component with metal terminals according to item 1. the metal terminal has a leg provided to protrude from the electronic component in the predetermined direction;
2. The method of manufacturing an electronic component with metal terminals according to claim 1, further comprising, as a step subsequent to said clamping step, a bending step of bending tip ends of said legs toward said electronic component to form bent portions. 4. The method for manufacturing an electronic component with metal terminals according to claim 2, wherein in said clamping step, said metal terminals are prepared in a state in which both said pair of arm portions are open. 4. The electronic component with metal terminals according to claim 2 or 3, wherein in said sandwiching step, said metal terminals are prepared in a state in which only one of said pair of arm portions located on the opposite side of said leg portion is opened. manufacturing method. 3. The arm portion positioned closer to the leg portion of the pair of arm portions is formed by bending a notch provided in a part of the contact portion of the metal terminal with which the electronic component abuts. 6. A method for manufacturing an electronic component with metal terminals according to any one of 2 to 5. In the sandwiching step, a pressing head is brought into contact with a contact portion between the metal terminal and the electronic component, and the metal terminal is pressed toward the electronic component and heated, thereby contacting the metal terminal with a bonding member. 7. The method for manufacturing an electronic component with metal terminals according to claim 1, further comprising a joining step of joining the electronic component between the contacting step and the closing step. 8. The method for manufacturing an electronic component with metal terminals according to claim 1, wherein at least the pair of arm portions of the metal terminals are made of a shape memory alloy.

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