JP2023036080A - Bonding method of tile - Google Patents

Abstract

To provide a bonding method of tiles allowing central air to be easily extruded to an end part by simply forming a concave groove in a horizontal direction in an adhesive layer.SOLUTION: A bonding method comprises: bonding a plurality of removable tapes 1, 1a parallel to each other in specific intervals so as to reach one edge of two edges facing each other in a bonding area A of a wall substrate W from the other edge so as to form an adhesive layer 3 in which a plurality of grooves 2, 2a are formed in the bonding area A; forming a plurality of air leaking grooves 4, 4a in the adhesive layer 3 by peeling the tapes 1, 1a and removing the adhesive of the section; bonding tiles T on the adhesive layer 3; and pressing the tiles T to the wall substrate W side while the air leaking grooves 4, 4a are left as it is so as to crush the concave grooves 2, 2a to force air in the concave grooves 2, 2a leak into the air leaking grooves 4, 4a, to make no air left in the central part between the tiles T and the adhesive layer 3 which allows creation of bubbles between the tiles T and the adhesive layer 3 to be reduced as much as possible.SELECTED DRAWING: Figure 5

Description

The present invention particularly relates to a bonding method for improving the bonding rate of large-sized tiles.

Conventionally, the step (a) of forming an adhesive layer by applying an adhesive to the wall substrate so as to form a plurality of grooves using a comb-shaped trowel and vibrating the tile while pressing it against the adhesive layer with a vibrating tool. a step (b) of repeating the work of moving the tool in a predetermined repeating direction; On the other hand, there is a method of adhering tiles in which the tiles are moved toward the outside in a direction inclined backward from the repeating direction (see, for example, Patent Document 1).

This bonding method was developed because if the surface of the adhesive layer is smoothed, when the tiles are attached, air cannot escape from the back side of the tiles and large air bubbles remain, resulting in poor adhesion. According to this method, since the adhesive is crushed in the direction in which the grooves are buried, in order to release the air in the grooves to the outside of the tiles, the tiles are pressed against the adhesive layer by the vibrating section and vibrated. By moving the tool along the extending direction of the groove to the end in the extending direction, the air in the groove is forced out of the tile, thereby forming a concave portion of the vibrating tool at least at the end in the extending direction of the adhesive. By moving in a direction inclined with respect to the extension direction of the groove and retreating backward in the above repeating direction, the amount of air remaining in the groove can be reduced, the adhesion rate can be improved, and the construction quality can be improved.

Japanese Patent Application Laid-Open No. 2021-1471

However, in the above conventional technology, since the air near the center of the groove must be pushed out to the end, there is a high possibility that the air will remain, and the tile will peel off due to the reduced adhesion rate. There was a problem that had to be solved, such as the danger that it could not be denied.

In view of the problem that it is difficult to push out the air near the center to the end only with the horizontal concave grooves based on the above-described prior art, the present invention provides a tile attachment area on the surface of the wall base. A step of attaching a plurality of peelable tapes from one side to the other of two opposing sides in parallel at predetermined intervals; is horizontally pulled to form an adhesive layer with a plurality of grooves formed on the surface; a step of forming escape grooves; a step of attaching the tiles to the adhesive layer by bringing the tiles into contact with the adhesive layer in order from below; a step of pressing the tile against the wall foundation side so as to crush the groove, thereby completely adhering the tile to the adhesive layer. The above problem is solved by further reducing the generation of air bubbles between the adhesive layer and the tile by being able to extrude the adhesive not only through the air but also into the air escape grooves.

In short, the present invention is a process of attaching a plurality of peelable tapes in parallel at predetermined intervals to a tile attachment area on the surface of a wall substrate, extending from one to the other of two opposite sides of the attachment area. a step of applying an adhesive to the pasting region to which the tape is pasted and then horizontally pulling a combed trowel to form an adhesive layer having a plurality of grooves formed on the surface; a step of forming a plurality of air escape grooves in the adhesive layer by peeling off the tape and removing the adhesive from the relevant portion; a step of attaching the tile to the adhesive layer, and pressing the attached tile against the wall base side while leaving the air escape groove so as to crush the concave groove, thereby completely adhering the tile to the adhesive layer. air between the tile and the adhesive layer, which tends to remain in the center of the tile, can be pushed out to the air escape groove, thereby preventing the generation of air bubbles between the adhesive layer and the tile. It can be suppressed as much as possible, and the construction quality can be further improved.

Since the tape is inclined with respect to the horizontal direction and is attached so as to extend from one side to the other side of the attachment area, the air release groove formed by peeling the tape intersects and communicates with the concave groove. Therefore, the air in the concave groove can be pushed out not only from the edge but also to the air escape groove, so that the generation of residual air bubbles can be further reduced.

Since the degree of water infiltration from the surface of the wall base differs depending on the type of wall base, the tape is attached so as to cover the seal base layer formed by coating the surface of the wall base with a belt-shaped base treatment material. Therefore, even if the tape is peeled off, it is possible to reliably prevent the infiltration of moisture from the relevant portion.

Since the tiles are attached while the upper end is pulled forward and curved, the practical effects are great, such as being able to reliably attach the tiles so that no air remains between the tiles and the adhesive layer.

FIG. 4 is a front view showing a state in which an L-shaped metal fitting is fixed to a wall base and a tape is attached in the tile bonding method according to the present invention; FIG. 4 is a front view showing a state in which an adhesive layer having grooves is formed on the wall substrate in the tile bonding method according to the present invention, and then the tape is peeled off to form air escape grooves. FIG. 3 is a cross-sectional end view taken along the line AA of FIG. 2; FIG. 4 is a central longitudinal cross-sectional end view showing a state in which tiles are attached to an adhesive layer in the tile bonding method according to the present invention; FIG. 4 is an end view of a center longitudinal section showing a state in which the grooves of the adhesive layer are crushed and the tile is brought into close contact with the adhesive layer in the method of adhering the tiles according to the present invention.

In the method of adhering tiles according to the present invention, basically, one tile T on the surface of the wall substrate W is reached from one of two opposite sides of the adhering region A to the other. A step of attaching a plurality of peelable tapes 1, 1a in parallel at predetermined intervals, applying an adhesive to the attachment area A to which the tapes 1, 1a are attached, and then horizontally applying a combed trowel. By pulling to form an adhesive layer 3 having a plurality of grooves 2, 2a formed on its surface, and removing the tapes 1, 1a, etc. from the relevant portions, the adhesive layer 3 is removed. a step of forming a plurality of air escape grooves 4, 4a on the surface of the adhesive layer 3; a step of attaching the tiles T to the adhesive layer 3; The grooves 2, 2a are pressed against the substrate W so as to be crushed, and the air in the grooves 2, 2a is released into the air release grooves 4, 4a, so that the tile T is completely adhered to the adhesive layer 3. and a step of bringing them into close contact with each other.

1 to 5 are a front view and a cross-sectional view for explaining the method of adhering tiles according to the present invention. A layer 3 is formed on the surface of the wall substrate W and the tiles T are adhered to the adhesive layer 3 .

The wall base W is a concrete wall, or a base of a wooden wall made up of studs, furring strips, base boards, and the like.

The tiles T are large-sized tiles having a side of 600 mm or more, and are basically ceramic tiles, but tiles made of other materials may be used.

The tapes 1, 1a, .
The tapes 1, 1a, . , 4a, .

The seal base layers 5, 5a, .

The adhesive layer 3 is formed by applying an adhesive to the surface of the wall base W to a required thickness, forming a plurality of grooves 2, 2a, . . . Escape grooves 4, 4a, . . . are formed, and are wider than the grooves 2, 2a, . In this state and in a communicating state, the air in the recessed grooves 2, 2a, .

Next, the method of adhering tiles according to the present invention will be specifically described.
(1) The L-shaped bracket 6 is horizontally fixed to the lower part of the wall base W with nails, screws, etc., and then the attachment area A for one tile T on the surface of the wall base W is attached to the attachment area A. A plurality of peelable tapes 1, 1a, .
(2) Adhesive is evenly applied to the application area A where the tapes 1, 1a, . Then, the tapes 1, 1a, . , 3).
(3) The tiles T are placed on the L-shaped metal fittings 6 and brought into contact with the adhesive layer 3 in order from the bottom to adhere the tiles T to the adhesive layer 3 (see FIG. 4).
(4) The attached tiles T are pressed against the wall base W side while leaving the air escape grooves 4, 4a, so as to crush the grooves 2, 2a, etc., and the grooves 2, 2a, etc. Air is released into the air release grooves 4, 4a, .

1, 1a... Tape 2, 2a... Groove 3 Adhesive layer 4, 4a... Air escape groove 5, 5a... Seal base layer A Pasting area T Tile W Wall base

Claims (4)

a step of attaching a plurality of peelable tapes from one side to the other of two opposite sides of the attachment area in parallel at predetermined intervals to the attachment area for one tile on the surface of the wall substrate;
a step of applying an adhesive to the pasting region to which the tape is pasted and then horizontally pulling a combed trowel to form an adhesive layer having a plurality of grooves formed on the surface;
forming a plurality of air escape grooves in the adhesive layer by peeling off the tape and removing the adhesive from the relevant portion;
a step of attaching the tiles to the adhesive layer by bringing the tiles into contact with the adhesive layer in order from below;
a step of pressing the pasted tile against the wall base side while leaving the air escape groove so as to crush the recessed groove, thereby completely adhering the tile to the adhesive layer;
A method of adhering tiles, characterized by comprising: 2. The method of adhering tiles according to claim 1, wherein the tape is attached so as to extend from one side to the other side of the attachment area while being inclined with respect to the horizontal direction. 3. The method of adhering tiles according to claim 1, wherein the tape is attached so as to cover a seal base layer formed by applying a band-like base treatment material to the surface of the wall base. 4. The method of adhering tiles according to claim 1, wherein the tiles are attached while the upper end is pulled forward and curved.

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