JP2023031888A - Wrapping material, wrapping body, and article with wrapping body - Google Patents

Abstract

To provide a wrapping material, a wrapping body, and an article with the wrapping body that include an antenna to enable wireless communication and can make the antenna hardly visible from the outside.SOLUTION: In an article 10 with a wrapping body configured so that a film-like wrapping body 2 is wrapped around a body of a bottle 50 filled with a beverage 600 such as a liquid drink and sealed with a cap 52; the wrapping body 2 covering at least part of the article 10 has a base material 6, an antenna 30, a first underlayer 4, and a second underlayer 5 laminated together. The antenna 30, the first underlayer 4, and the second underlayer 5 are all arranged on one surface side of the base material 6.SELECTED DRAWING: Figure 1

Description

The present invention relates to a packaging material, a packaging body, and an article with a packaging body that can be used for covering at least a part of an article and for wireless communication.

2. Description of the Related Art In recent years, IC tags using RFID technology have been used for non-contact short-range communication using radio waves. For example, in a state in which an IC tag is attached to various articles or packaging members of articles, the articles are used for distribution such as transportation and sales. In this case, by holding the article against an external device (reader/writer) as necessary, the article information recorded in the IC chip of the IC tag can be read out by contactless communication, or various information can be written to the IC chip. can be done. This enables efficient physical distribution management.

An IC tag attached to an article is mainly composed of an IC chip and an antenna electrically connected to the IC chip. Predetermined information generated by the IC chip is transmitted to the antenna as a voltage change pattern, and the pattern is converted into radio waves or magnetic fields of a predetermined frequency by the antenna and transmitted to an external device. A radio wave or magnetic field of a predetermined frequency transmitted from an external device is received by an antenna, converted into a voltage change pattern, and then input to the IC chip as predetermined information. As a result, the IC tag attached to the article can directly wirelessly communicate with the external device.

As a method of attaching an IC tag to an article, for example, an antenna is formed on a substrate, and an IC chip is mounted on the antenna to form a label-like IC tag, which is then attached to an article or container. There is a way to attach Alternatively, there is a method in which only the antenna portion is printed in advance on the container of the article before assembly, and the IC chip is mounted at a predetermined position of the antenna after assembly. Patent Literature 1 describes a bottle container in which an IC tag is fixed to the outer surface of the bottle container via an adhesive layer, and a shrink film is wrapped around the IC tag. The IC tag includes an inlet portion composed of a base material, an antenna formed on the base material, and an IC chip connected to the antenna, and is arranged on upper and lower surfaces of the inlet part to protect the inlet part. It consists of a protective material for

Further, Patent Document 2 describes a package with an IC tag that is assembled with a plurality of bent portions and stores an article. That is, the package is composed of a packaging board comprising at least two layers, one layer containing the printed antenna pattern, the other layer containing the RFIC element to which it is adhered, one layer and the other layer. and a laminated body. This laminate has an RFIC device in which an RFIC element and an antenna pattern are sandwiched between one layer and the other layer, and the RFIC element and the antenna pattern are electrically connected.

JP 2010-49410 A International publication WO2018/216686

When placing an IC tag on a container of an article, as a method, for example, an antenna is formed in advance on the outer surface of the container by printing or the like. A method of electrically and mechanically connecting IC modules can be mentioned. By doing so, if a problem should occur in the container during the process of storing the article, the IC chip or the like does not have to be attached to the antenna, and the loss of the expensive IC chip can be suppressed, thereby reducing the cost. However, if the antenna is easily visible from the outside, the design of the container is degraded, and the position of the IC tag is easily identified, thereby degrading security. For this reason, it is preferable that a printed layer that conceals the antenna is provided on the outside of the container so that the antenna is difficult to see.

The present disclosure has been made in view of such circumstances, and provides a packaging material, a packaging body, and an article with a packaging body that includes an antenna that enables wireless communication and that makes it difficult to visually recognize the antenna from the outside. The challenge is to

According to the present embodiment, a package covering at least a portion of an article includes a base material, an antenna and a first base layer, and a second base layer, and the antenna and the first base layer are laminated. and the second underlayer are arranged on one side of the base material, respectively.

Moreover, in the package according to another aspect of the present embodiment, a print layer may be further laminated on the surface of the second base layer opposite to the antenna or the first base layer.

In the package according to another aspect of the present invention, the antenna is electrically connected to an IC chip, and the antenna and the IC chip constitute a communication circuit capable of wireless communication with an external device. good too.

Moreover, in the package according to another aspect of the present embodiment, the second base layer may overlap the entire area of the antenna in plan view.

Moreover, in the package according to another aspect of the present embodiment, a color difference ΔE ^* ab between the antenna and the first underlayer may be 25 or less.

Further, in the package according to another aspect of the present embodiment, the color difference ΔE ^* ab between the second base layer overlapping the antenna and the second base layer not overlapping the antenna in plan view is 13. It may be below.

Further, in the package according to another aspect of the present embodiment, the surface resistivity values of the first underlayer and the second underlayer may be 100 times or more the surface resistivity value of the antenna. good.

In addition, in the article with a package according to the present embodiment, any one of the packages described above covers at least part of the article.

According to the present embodiment, a packaging material capable of assembling a packaging body equipped with an antenna that covers at least a part of an article includes a base material, a conductive pattern and a first base layer that constitute the antenna, a first 2 underlayers are laminated, and the conductive pattern, the first underlayer, and the second underlayer are arranged on one surface side of the base material, respectively.

According to the present embodiment, it is possible to provide a packaging material, a packaging body, and an article with a packaging body, which has an antenna that enables wireless communication and that makes it difficult to visually recognize the antenna from the outside.

BRIEF DESCRIPTION OF THE DRAWINGS It is the schematic explaining the structure of the packaging material of 1st Embodiment, a package, and an article with a package. It is a schematic diagram explaining the structure of an IC tag. It is explanatory drawing of the packaging material of 1st Embodiment, and the manufacturing method of a package. It is a sectional view explaining the structure of the packaging material concerning the modification of a 1st embodiment, and a package. It is a sectional view explaining the structure of the packaging material concerning the modification of a 1st embodiment, and a package. It is the schematic explaining the structure of the packaging material of 2nd Embodiment, a package, and an article with a package. FIG. 5 is a cross-sectional view for explaining the structure of a packaging material according to a second embodiment and modifications thereof; It is the schematic explaining the structure of the packaging material, package, and goods with a package which concerns on the modification of 2nd Embodiment.

Hereinafter, examples of the packaging material, the packaging body, and the article with the packaging body of the present disclosure will be described with reference to the drawings and the like. However, the packaging material and the like of the present disclosure are not limited to the embodiments and examples described below.

In addition, each figure shown below is shown typically. Therefore, the size and shape of each part are appropriately exaggerated for easy understanding. In each figure, hatching indicating cross sections of members is omitted as appropriate. Numerical values such as dimensions and material names of each member described in this specification are examples as an embodiment, and are not limited to these, and can be appropriately selected and used. In this specification, terms specifying shapes and geometrical conditions, such as parallel, orthogonal, and perpendicular terms, not only have strict meanings but also include substantially the same states.

1. First Embodiment A first embodiment of a packaging material, a package, and an article with a package according to the present disclosure will be described. FIG. 1( a ) shows an article 10 with a package in which a film-like package 2 is wrapped around the body of a bottle 50 filled with a beverage 600 such as a liquid beverage, and an article before the package 2 is wrapped around the bottle 50 . 1 is a perspective view for explaining a packaging material 100 in a state; FIG. FIG. 1(b) is a cross-sectional view of the packaging material 100 of FIG. 1(a) taken along line AA parallel to the Z-axis direction and viewed from the +X direction side. The packaging body is a member for protecting the article or improving the design of the article, which is assembled so as to cover at least a part of the article, in which an antenna for functioning as an IC tag is formed, and includes an IC chip. It refers to both the state without IC chips and the state including IC chips. Moreover, the packaging material refers to a member obtained by planarly unfolding the package before covering the article.

In the present disclosure, "assemble" means to form a packaging material as a packaging body that covers at least a part of an article, and is not limited to folding the packaging material into a box shape, as in the present embodiment. Also includes wrapping a strip of film around a bottle of beverage or the like. In addition, a package refers to both an item with and without an item inside, and is sometimes referred to as an item with a package to emphasize that the package includes an item.

Here, for convenience of explanation, an XYZ orthogonal coordinate system is set for the package 2 . As shown in FIG. 1(a), the vertical direction of the paper along the upright direction of the bottle 50 is taken as the Z axis, and the direction connecting the front side and the back side is taken as the Y axis. Also, the X-axis is taken in the left-right direction orthogonal to the Z-axis and the Y-axis. The upward direction along the Z axis is the +Z direction, and the opposite direction is the -Z direction. The direction along the Z-axis is also simply referred to as the vertical direction. The direction along the Y-axis from the near side to the far side is the +Y direction, and the opposite direction is the -Y direction. The direction along the Y-axis is also simply referred to as the depth direction. Further, the direction from the left side to the right side along the X axis is the +X direction, and the opposite direction is the -X direction. The direction along the X-axis is also simply referred to as the left-right direction. Hereinafter, configurations of a packaging material 100, a packaging body 2, and an article with a packaging body 10 according to the first embodiment will be described with reference to FIGS. 1 to 3. FIG.

1. First Embodiment (a) Configuration of Package A first embodiment of a packaging material, a package, and an article with a package according to the present disclosure will be described. As shown in FIG. 1(a), the packaging body 2 is formed with an antenna 30 for functioning as an IC tag 20, and is wound to cover at least a portion of the bottle 50, that is, assembled. It is a member whose purpose is one of protecting it or improving the design of an article. The bottle 50 has a bottle body 51 filled with a liquid beverage 600 and sealed with a cap 52 . Bottle 50 filled with beverage 600 is an article. As described above, the package 2 refers to both the state in which the IC chip is not included and the state in which the IC chip is included, and may also refer to the packaged article 10 including the bottle 50 containing the beverage 600 .

The package 2 is wrapped around the cylindrical portion of the bottle 50 in a ring shape. Based on FIG. 1(b), the packaging material 100 in which the packaging body 2 has been peeled off from the bottle 50 will be described. The IC tag 20, the first base layer 4, the adhesive layer 7 and the protective layer 8 are laminated in this order. In FIG. 1(a), in order to show the layer structure of the packaging material 100 in an easy-to-understand manner, the second base layer 5, the first base layer 4, the adhesive layer 7, and the protective layer 8 are partially omitted. Of course, the packaging body 2 in which the packaging material 100 is wrapped around the bottle 50 also has the same layer structure. The IC tag 20 and the first underlayer 4 are arranged complementary to each other so as to close the area between the second underlayer 5 and the protective layer 8 . That is, the first underlayer 4 is arranged so as to surround the IC tag 20 in plan view along the Y axis.

The IC tag 20 has a substantially rectangular antenna 30 as an example, and is surrounded by the first base layer 4 so as to be in contact with the outline of the outer periphery of the antenna 30 or with a very small gap. It has become. However, the first base layer 4 does not need to be provided over the entire area so as to match the contours of the outer peripheries of the base material 6 and the second base layer 5, and the contours of the outer peripheries of the base material 6 and the second base layer 5 do not need to be provided. It may be provided only in a part of the included area. Further, the first underlayer 4 does not need to be provided to completely surround the contour of the outer circumference of the antenna 30 of the IC tag 20, and may be arranged so as to be adjacent to part of the contour of the outer circumference. Moreover, the first underlayer 4 is preferably formed in a color similar to that of the antenna 30 .

Thus, the packaging body 2 of this embodiment covers at least a portion of the bottle 50 as an article. The package 2 has a configuration in which a base material 6, an antenna 30, a first base layer 4, and a second base layer 5 are laminated. The antenna 30 , the first base layer, and the second base layer are each arranged on the inner surface side, which is one surface side of the base material 6 .

That is, the packaging body 2 is assembled so as to be wrapped around the body of the bottle 50 in a ring shape, and is configured so that the outer surface thereof serves as the base material 6 . As a result, the second base layer 5 for imparting a design to the package 2 and the antenna 30 for non-contact communication with an external device as the IC tag 20 are arranged inside the base material 6 . As a result, it is possible to prevent the printed layer from rubbing off and the antenna 30 and the IC chip from being damaged by an external force, so that the package 2 with high quality and reliability can be obtained. However, when the base material 6 is a member having opacity such as paper, the second base layer 5 for imparting design to the package 2 is arranged on the outer surface side of the base material 6, and the antenna 30 is arranged. It may be arranged inside the base material 6 .

In addition, the first base layer 4 is configured to surround the periphery of the first base layer 4 so as to be in contact with the contour of the outer periphery of the antenna 30 constituting the IC tag 20, or with a very small gap, or the outer periphery of the antenna 30 may be positioned adjacent to or overlapping a portion of the contour of the The second underlayer 5 is formed on the same surface side of the substrate 6 as the antenna 30 and the first underlayer 4 . Therefore, compared with the case where the first underlayer 4 is not formed, the following points are advantageous. First, when the package 2 is wrapped around the bottle 50 , the unevenness caused by the thickness of the antenna 30 is suppressed from appearing on the base material 6 that is the outermost surface of the package 2 . Moreover, even if the base material 6 and the second base layer 5 have a certain degree of transparency to visible light, the presence of the antenna 30 can be made inconspicuous. Therefore, these actions can prevent the antenna 30 from being easily seen in the package 2 .

(b) Configuration of Packaging Material Next, the configuration of the packaging material 100 assembled with the package 2 described above will be described. The packaging material 100 has a layer structure as described above. The base material 6 is a member that supports the conductive pattern 30 formed by printing or the like, has appropriate flexibility, and can suppress damage or disconnection of the conductive pattern 30, that is, the antenna 30, due to deformation due to external force or the like. is preferably It should be noted that the conductive pattern 30 has a function of forming the IC tag 20 together with the IC chip as the antenna 30 in the package 2 after assembly. However, although common to other embodiments and modifications to be described later, the present disclosure does not prevent other conductive patterns that satisfy the same relationship as the conductive pattern 30 from being additionally arranged.

The film-like base material 6 used to cover at least a part of the bottle 50 is required to have printability, durability, etc. to impart distinctiveness and design to the article and to maintain this over a long period of time. . Furthermore, some are thermally shrunk in order to fit the shape of the article. In addition, the base material 6 is a portion constituting the outer surface of the package 2 wound around the bottle 50, and is transparent enough to allow the pattern of the second base layer 5 formed by printing or the like inside the base material 6 to be visually recognized. It is preferable to have Since the second base layer 5 having a pattern that imparts a design to the article is formed inside the base material 6, even if the article with the package is subjected to an external force such as rubbing, the base material 6 provides the second base layer 5 with a second base layer 5. 2. This is because the base layer 5 is protected, and deterioration of the design property such as peeling of the print can be suppressed.

The transparency of the base material 6 is sufficient if the pattern of the second underlayer 5 formed inside can be seen through the base material 6, and it does not matter whether it is colorless or colored. . For example, as the transparency of the substrate 6, it is preferable that the transmittance of visible light in the wavelength range of 380 nm or more and 780 nm or less is 50% or more. Within this range, the pattern of the second underlayer 5 can be clearly seen even when the base material 6 is transmitted through, and high designability can be ensured. However, the second base layer 5 may be provided so as to constitute the outer surface of the package 2 wrapped around the bottle 50 . That is, the second underlayer 5 may be arranged outside the base material 6 . In this case, an opaque member can be used as the base material 6, and the material selection range for the base material 6 can be expanded.

Examples of such a substrate 6 include polyester films, polystyrene films, polyolefin films, polylactic acid films, foamed polyolefin films, polyester-polystyrene coextruded films, and foamed polystyrene films. . Moreover, you may use the laminated|multilayer film of a nonwoven fabric and the said film. Furthermore, paper materials such as woodfree paper, coated paper, and art paper, synthetic paper, cloth materials, and the like can be used.

In particular, when heat shrink is required, stretched polyester film, stretched polystyrene film, stretched polyolefin film, polylactic acid film, expanded polyolefin film, expanded polystyrene film, laminated film of nonwoven fabric and shrink film, stretched One or more films selected from the group consisting of polyester-polystyrene coextruded films are preferred.

The thickness of the base material 6 is not particularly limited, but can be appropriately selected within a range that does not impair the heat resistance, rigidity, mechanical properties, appearance, and the like. The thickness of the base material 6 can be, for example, 10 μm or more and 500 μm or less, preferably 20 μm or more and 200 μm or less. This is because within this range, appropriate rigidity, flexibility and heat resistance can be ensured, and adhesion to the bottle 50 can be obtained.

The stretched film may be uniaxially stretched or biaxially stretched, and in the case of a uniaxially stretched film, it may be longitudinally uniaxially stretched or transversely uniaxially stretched. Longitudinal uniaxial stretching refers to the stretching of a long film, which is the original member from which a large number of substrates 6 are taken, in the machine direction of the long film. In this case, the longitudinal direction of the substrate 6 usually corresponds to the width direction of the long film, that is, the direction perpendicular to the machine direction. On the other hand, lateral uniaxial stretching refers to stretching in the width direction of a long film. Therefore, the base material 6 heat-shrinks along the widthwise direction when longitudinally uniaxially stretched, and heat-shrinks along the longitudinal direction when horizontally uniaxially stretched.

In the case where the substrate 6 is formed into a cylindrical shape in advance and attached to the bottle 50 and then thermally shrunk, it is preferable to use a laterally uniaxially stretched film. In this case, the base material 6 shrinks along the outer peripheral direction of the bottle 50, so that the base material 6 can be brought into close contact with the bottle 50 with a good appearance.

The second underlayer 5 can be formed by offset printing, letterpress printing, gravure printing, silk printing, ink jet printing, or the like, using known inks, or by positively or negatively charging the substrate and the toner to electrically adhere and fix the toner to the substrate. It may be provided by electrostatic printing, selective thermal transfer from a colored ink ribbon, or the like. The film thickness of the second underlayer 5 depends on the type of printing, ink viscosity, printing speed, and the like. When formed, the thickness is about 10 μm or more and 500 μm or less.

In this embodiment, the second underlayer 5 is laminated on the side opposite to the conductive pattern 30 or the antenna 30 or the first underlayer 4, that is, on the outer surface. With such a configuration, the second underlayer 5 can be first formed on the base material 6 by printing or the like, and can be formed with high quality without being affected by the conductive pattern 30 or the first underlayer 4. can. In addition, the second underlayer 5 overlaps substantially the entire area of the antenna 30 in plan view along the Y axis. As a result, the second base layer 5 can reliably hide the antenna 30, making the existence of the antenna 30 difficult to visually recognize.

The conductive pattern 30 is a portion formed of a conductive member with a predetermined pattern for transmitting and receiving radio waves, etc., as the antenna 30 of the IC tag 20 . In this embodiment, the antenna 30 constitutes a pair of left and right dipole antennas so that radio waves can be transmitted and received in the UHF band such as 920 MHz. However, the shape of the antenna is not limited to a dipole antenna, and may be, for example, a monopole antenna, or a loop antenna or the like depending on communication specifications. Further, the shape of the dipole antenna or monopole antenna is not limited to a linear shape or a rectangular shape, and may be any shape such as a spiral shape or a meandering shape.

The conductive pattern 30 constituting such an antenna 30 can be formed by printing conductive ink or conductive paste on one surface of the substrate 6, for example. The conductive ink or conductive paste can be obtained, for example, by dispersing silver-based conductive particles in a binder resin or solvent. Although the conductive particles are preferably silver-based, they are not limited to this, and metal powders such as nickel, gold, copper, and platinum, conductive carbon, composites thereof, alloys, and the like may also be used. Screen printing, flexographic printing, gravure printing, offset printing, etc. using a mesh plate can be used for printing the conductive ink or conductive paste, and ink-jet printing is also possible depending on the viscosity. When the antenna is formed by printing, the film thickness depends on the type of printing, ink viscosity, printing speed, and the like. When formed by screen printing, the thickness is about 10 μm or more and 500 μm or less.

The conductive pattern that constitutes the antenna may be produced by a method other than this, such as attaching a punched metal foil to the base material 6 via an adhesive, or applying an adhesive to a thin metal foil and then forming a hot plate of a predetermined shape. A method of thermally transferring to the substrate 6 by pressing a stamp may also be used. However, since the base material 6 as a packaging material is often wound after the second base layer 5 is printed at high speed by a gravure printer or the like, the conductive pattern can be formed by a printing method capable of forming the conductive pattern at high speed and at low cost. It is more preferable to form

In the case of forming a dipole antenna, the electrical length of one side portion when the antenna 30 is formed substantially bilaterally symmetrical about the IC chip is at least about 75 mm, which is 1/4 of the wavelength of the electromagnetic wave to be communicated. It is desirable to be above. For example, in the packaging material 100 of FIG. 1(a), the antenna 30 constituting the IC tag 20 has an outline of a substantially rectangular outer periphery having longitudinal directions on the left and right with the IC module 500 containing the IC chip at the center. The width of the contour along the vertical direction, that is, the Z-axis direction is ha, and the width along the horizontal direction, that is, the X-axis direction is wa. At this time, it is desirable that wa/2, which is half the length of the antenna 30 in the left-right direction centered on the IC chip, is about 75 mm or more.

This is because the antenna 30 as a whole can form a half-wave dipole antenna suitable for contactless communication. Also, the antennas 30 may be arranged on a straight line, but in this case, although the communication sensitivity in a specific direction is enhanced, the directivity tends to be narrow. Therefore, in order to suppress fluctuations in communication sensitivity due to the influence of the positional relationship with the external device when assembled in the package 2 and the influence of the electromagnetic wave shielding or electromagnetic wave absorbing properties of the items to be stored, the antenna should be installed in as many directions as possible. should be placed along.

Here, the antenna 30 formed on one surface side of the base material 6 via the second base layer 5 or the conductive pattern 30 constituting the antenna 30 is provided before the packaging material 100 is assembled to form the package 2, or After the packaging material 100 is assembled into the package 2, the IC module 500 is mounted. As a result, at least two pads, which are electrical connection terminals of the IC chip, are electrically connected to the opposed portions provided with the antenna 30, respectively. This enables the IC tag 20 to perform predetermined contactless communication with an external device. Incidentally, the open ends of the dipole antenna at this time are the first end 31a, which is the end on the +X direction side of the antenna 30, and the second end 31b, which is the end on the -X direction side.

The portion of the antenna 30 constitutes an IC tag together with the IC chip, and must have appropriate conductivity in order to exhibit good wireless communication characteristics. The surface resistivity of the antenna 30 excluding the insulating coating is preferably 10Ω/□ (ohms per square) or less, more preferably 2Ω/□ or less. When the surface resistivity of the antenna 30 is in the former range, it is possible to achieve both good wireless communication and an expansion of the selection range of materials. This is because Here, JIS K6911 shall be referred to for the definition of surface resistivity.

By the way, the following four methods are mainly conceivable for the method of mounting the IC module 500 across the opposing portions of the antenna 30, and the configuration around the IC module 500 at that time. 2(a) to 2(d) are schematic explanatory diagrams for schematically explaining this. The IC tag 20j shown in FIG. 2A is a simplified configuration of the IC tag 20 of the present embodiment for ease of explanation, and differs from the IC tag 20 in details such as the antenna configuration. be. The same applies to the IC tags 20m, 20k and 20n shown in FIG. 2(b) and thereafter.

The IC tag 20j is branched from two points of the antenna 30j formed on the base material 110, and a loop circuit 520 is provided so that each tip is electrically connected to the IC chip 510 to form a closed circuit as a whole. It is This intends that the closed circuit functions as a matching circuit that conjugately matches the impedance of the antenna structure composed of the IC chip 510, the antenna 30j and the loop circuit 520. FIG.

The IC module 500, which is the IC chip 510 itself, is mounted so as to straddle both ends of the loop circuit 520 which are spaced apart from each other and face each other. In this case, the first pad 510a and the second pad 510b, which are the electrical connection terminals of the IC chip 510, are directly electrically connected to the opposite ends 520a and 520b, which are the ends of the loop circuit 520 facing each other while being spaced apart. is spliced to As an electrical connection method, for example, gold or lead bumps are formed in advance on the first and second pads of the IC chip 510 . Then, it is conceivable to bond the IC chip 510 to the antenna by applying heat and pressure via ACF (anisotropic conductive film) or ACP (anisotropic conductive paste).

On the other hand, the IC tag 20m directly mounts the IC module 500, which is the IC chip 510 itself, over the first portion 30m formed on the base material 110 and the second portion 40m spaced apart and opposed to the first portion 30m. is. In this case, a first pad 510a and a second pad 510b, which are electrical connection terminals of the IC chip 510, are connected to a facing portion 30ma that is the end of the first portion 30m and a facing portion that is the end of the second portion 40m. 40ma and directly electrically connected. Similar to the IC tag 20j, the IC tag 20m is branched from each of the first portion 30m and the second portion 40m, and is provided with a loop circuit 520 so as to form a closed circuit. Its purpose is also the same as that of the loop circuit 520 of the IC tag 20j.

In the IC tag 20k, a first element 30k, which is an antenna continuously formed on the substrate 110, and a part of the loop circuit 520 formed on the substrate 120 and mounted with the IC chip 510 overlap each other. It is arranged to The loop circuit 520, the substrate 120 supporting it, and the IC chip 510 form a closed circuit, forming an IC module 500 that can be a small IC tag capable of predetermined non-contact communication with an external device.

The IC chip 510 is mounted across opposing portions 520a and 520b, which are opposite ends of the loop circuit 520 spaced apart from each other. The linear second element 30l that is part of the loop circuit 520 overlaps the first element 30k in plan view. As a result, the first element 30k and the second element 30l of the IC tag 20k are capacitively coupled, and the IC tag 20k can operate as an IC tag like the IC tag 20j. However, the first element 30k and the second element 30l do not have to overlap each other in plan view, and even in this case, a certain amount of capacitive coupling is possible by being close to each other.

In FIG. 2C, the base material 120 having the loop circuit 520 on which the IC module 500 is mounted is superimposed on the base material 110 having the first element 30k on the front side of the paper surface. Although positioned, the substrate 120 may be positioned on the back side of the paper with respect to the substrate 110 . In addition, the substrates 110 and 120 are arranged so that the substrates 110 and 120 are turned over so that the IC module 500 and the loop circuit 520 face the first element 30k, and the substrates 110 and 120 overlap each other. may

Furthermore, the IC tag 20n includes the IC chip 510 across the second element 30o that is part of the first portion 30m formed on the base material 120 and the second element 40o that is part of the second portion 40m. The directly mounted IC module 500 is prepared in advance. The loop circuit 520, the linear second element 30o and the second element 40o, the substrate 120 that supports them, and the IC chip 510 form a closed circuit, and are small enough to allow predetermined non-contact communication with an external device. An IC module 500 that can be used as an IC tag is formed.

At this time, the first pad 510a and the second pad 510b, which are electrical connection terminals of the IC chip 510, are connected to the facing portion 30oa of the second element 30o of the first portion 30m and the second element 40o of the second portion 40m, respectively. It is directly and electrically connected to the facing portion 40oa. Such an IC module 500 is formed on the substrate 110 by separating the ends of the first element 30n, which is part of the first part 30m, and the second part, which is part of the second part 40m, apart from each other by a certain distance. It is mounted so as to straddle the end of one element 40n. The role of the loop circuit 520 is similar to that of other IC tags.

Here, the ends of the second element 30o and the first element 30n of the first portion 30m of the IC module 500 overlap each other, and similarly, the ends of the second element 40o and the first element 40n of the second portion 40m of the IC module 500 overlap. The ends overlap. Therefore, the second element 30o and the first element 30n are capacitively coupled, the second element 40o and the first element 40n are also capacitively coupled, and the whole functions well as the IC tag 20n.

Since the IC chip 510 is the IC module 500 itself, the IC tags 20j and 20m have a simple structure, and can reduce the manufacturing load of packaging materials and packages. can reduce costs. On the other hand, the IC tags 20k and 20n are more complicated to manufacture than the former in that an IC module 500 composed of a substrate, an IC chip, and part of the antenna is prepared separately. However, compared with the small positional accuracy of the pads of the IC chip 510, the positional accuracy of the IC module 500 required for the capacitive coupling of the antenna can be set much looser. Yield and processing speed can be improved.

The first underlayer 4 may be provided by offset printing, letterpress printing, gravure printing, or silk printing using known inks, similar to the above-described second underlayer 5 . Other methods include inkjet printing, electrostatic printing in which the substrate and toner are charged positively and negatively to electrically adhere and fix the toner to the substrate, and selective thermal transfer from an ink ribbon coated with a coloring material. may When the first underlayer 4 is formed by the gravure printing method as in the case of the second underlayer 5, a well-known gravure ink containing pigments, resins, additives, etc., which serve as film-forming elements, is dispersed in a solvent. Any pigment can be used, and the pigment is a coloring agent, and an organic pigment or an inorganic pigment can be selected. Examples of organic pigments include azo pigments such as soluble azo (azo lake), insoluble azo, condensed azo, and polycyclic pigments such as phthalocyanine, dioxazine, isoindolinone, and threne. Examples of inorganic pigments include oxides, sulfates, carbonates, silicates, metal powders, carbon black, and pearl pigments.

Examples of resins that affect gravure printability, processability, and adhesion to substrates include chlorinated polypropylene, urethane, polyamide, vinyl chloride, and acrylic resins. . In particular, when the substrate 6 is made of paper, rosin-based, rubber-based, and petroleum-based resins can be used. Furthermore, additives for improving performance during gravure printing include low-molecular-weight polyethylene, fluorine-based waxes, fatty acid amides, etc. for the purpose of film reinforcement, and plasticizers for the purpose of film plasticization. In addition, surfactants and low-molecular-weight dispersants for the purpose of dispersing pigments, and antistatic agents, antifoaming agents, antioxidants, and the like for other purposes can be used.

The first underlayer 4 has the same material composition as the conductive pattern 30 constituting the antenna 30 of the IC tag 20 described above, and only the ratio of the conductive particles contained therein is reduced to such an extent that the operation of the IC tag 20 is not hindered. It can be a thing.

The first underlayer 4 must minimize the influence on the operation of the IC tag 20 due to unintended capacitive coupling with the adjacent antenna 30 . On the other hand, if the gap between the first base layer 4 and the adjacent antenna 30 becomes large, it becomes easier to visually recognize and identify the antenna 30 when viewed from the outside, so it is advantageous to make the gap as small as possible. is.

Therefore, the surface resistivity of the first underlayer 4 is preferably 1 KΩ/□ or more, more preferably 10 KΩ/□ or more. Since the surface resistivity of the first underlayer 4 is within the former range, unintended capacitive coupling with the adjacent antenna 30 can be reduced, and good wireless communication of the IC tag 20 can be achieved. Further, since the surface resistivity of the first underlayer 4 is within the latter range, even if part of the first underlayer 4 overlaps the antenna 30 due to positional deviation of the first underlayer 4 or the like, The influence of unintended capacitive coupling by the stratum 4 can be suppressed. Furthermore, the flexibility of the layout of the first base layer 4 is enhanced, and the allowable positional accuracy can be relaxed.

The surface resistivity conditions of the first underlayer 4 and the second underlayer 5 may be correlated with the surface resistivity of the antenna 30 . For example, the first underlayer 4 and the second underlayer 5 preferably have higher surface resistivity values than the antenna 30, and the surface resistivity values of the first underlayer 4 and the second underlayer 5 are More preferably, it is at least 100 times the surface resistivity of the antenna. The former condition makes the first base layer 4 and the second base layer 5 more conductive than the antenna 30 , and suppresses adverse effects on wireless communication as part of the circuit of the IC tag 20 . Moreover, the latter condition makes it possible to provide a clear difference in the degree of conductivity between the first base layer 4 or the second base layer 5 and the antenna 30, regardless of the degree of conductivity of the antenna 30. It is possible to easily determine the specifications of the first underlayer 4 and the second underlayer 5 according to the electrical characteristics of the tag 20 .

On the other hand, since the first base layer 4 has the purpose of camouflaging the existence of the antenna 30 of the IC tag 20 and the like, it is preferable that the appearance color of the first base layer 4 is similar to the color of the antenna 30 . That is, it is necessary to select the pigment of the printing ink used for the first base layer 4 so as to approximate the color of the antenna 30 . In general, when the antenna 30 contains copper particles as a pigment component, or conductive particles obtained by coating metal particles or resin particles with copper as a pigment component, the color of the ink after drying becomes dark brown. When the antenna 30 contains silver particles as a pigment component, or conductive particles obtained by coating metal particles or resin particles with silver as a pigment component, the color of the ink after drying is silver.

Based on these considerations, it is preferable to select a coloring pigment that approximates the color of the antenna 30 for the first underlayer 4. For example, a dark brown pigment or a gray pigment can be used. Furthermore, in order to approximate the color including glossiness of the antenna 30, for example, an appropriate amount of aluminum powder or pearl pigment may be mixed. In this manner, the color difference ΔE ^* ab between the first underlayer 4 and the antenna 30 is preferably 25 or less, more preferably 13 or ^less .

Furthermore, in a plan view along the Y axis, the color difference ΔE ^* ab between the surface of the second underlayer 5 overlapping the antenna 30 and the surface of the second underlayer 5 not overlapping the antenna 30 is 13 or less. It is more preferable to set the color difference ΔE ^* ab to 6.5 or less. In the present embodiment, since the second underlayer 5 is visible through the base material 6 , the color difference may be measured under the condition of being viewed from the outside of the base material 6 . These color differences can be, for example, color differences ΔE ^* ab in the L ^* a ^* b ^* color system defined in 7.1.1 of JIS Z8730 (2009).

Since the color difference on the surface of the second base layer 5 is within the former range, the possibility of recognizing the first base layer 4 and the antenna 30 as having the same color range increases, and the antenna 30 is camouflaged by the first base layer 4. effect is obtained. Further, since the color difference on the surface of the second underlayer 5 is within the latter range, even if there is some gap between the first underlayer 4 and the antenna 30, there is a high possibility that the two will be regarded as the same. . Therefore, while maintaining the camouflage effect of the antenna 30 by the first base layer 4, the flexibility of the layout of the first base layer 4 is enhanced, and the allowable position accuracy can be relaxed. The same applies to the former and latter conditions of the color difference between the first underlayer 4 and the antenna 30 .

The color of the second underlayer 5 may be selected to be different from the color of the first underlayer 4 on purpose. For example, by selecting the second underlayer 5 so that the total visible light transmittance including interface reflection is 10% or less, the hiding effect can be further enhanced. In particular, it is also preferable to use, for the second underlayer 5, glossy ink such as silver or gold containing aluminum powder, pearl pigment, or the like as a part of the pigment. By forming the second underlayer 5 in such a manner, the possibility that the first underlayer 4 and the antenna 30 are seen through can be further reduced. In addition, on the outer surface of the second base layer 5, a printed layer having a color such as white or yellow that allows the inner surface to be easily transparent can be easily provided.

Further, when the first underlayer 4 overlaps the antenna 30, even if the color difference between the first underlayer 4 and the antenna 30 when not overlapping each other does not satisfy the above conditions, the following conditions as long as it satisfies That is, the color difference ΔE ^* ab of the first underlayer 4 in the region overlapping with the antenna 30 and the first underlayer 4 in the region not overlapping with the antenna 30 should be 25 or less, and the color difference ΔE ^* ab is 13 or less. is more preferable. When the first base layer 4 overlaps the antenna 30 so as to cover the entire area of the antenna 30, the distinguishability of the antenna 30 when viewed from the outside is the first base layer 4 in the area overlapping the antenna 30 and the This is because it is related to the distinguishability of the first underlayer 4 in the area that does not overlap the antenna 30 .

Since the color difference is in the former range, the possibility of recognizing the first base layer 4 in the region that does not overlap with the antenna 30 and the first base layer 4 in the region that overlaps with the antenna 30 as being in the same color range increases. 1 The camouflage effect of the antenna 30 by the base layer 4 is obtained. Further, even if the relative positions of the antenna 30 and the first base layer 4 are shifted, the visual effect is not affected, and the layout flexibility and allowable position accuracy of the first base layer 4 can be expanded. If the color difference is in the latter range, the above effects can be further enhanced.

On the other hand, as shown in FIG. 1A, the vertical width of the contour of the outer periphery of the antenna 30 is ha, and the vertical gap between the first base layer 4 and the antenna 30 adjacent to each other is dha. do. At this time, the value of dha is preferably 10% or less of the value of ha, more preferably 5% or less. When the value of dha is within the former range, even if there is some positional displacement of the first underlayer 4, the first underlayer 4 is suppressed from overlapping with the antenna 30, and the superimposition of the two results in a glossy appearance. The flexibility of the layout of the first base layer 4 and the extension of the allowable positional accuracy can be achieved while suppressing deterioration of the design property such as the difference in . Further, since the value of dha is in the latter range, the possibility that the first base layer 4 and the antenna 30 are visible as one unit is increased, and high designability can be secured.

The same applies when the lateral width of the outline of the outer periphery of the antenna 30 is wa, and the lateral gap between the first base layer 4 and the antenna 30 adjacent to each other is dwa. That is, the value of dwa is preferably 10% or less of the value of wa, more preferably 5% or less. The reason is as described above. The film thickness of the first underlayer 4 depends on the type of printing, ink viscosity, printing speed, and the like. When formed, the thickness is about 10 μm or more and 500 μm or less.

The thickness of the first underlayer 4 is preferably approximated to the thickness of the antenna 30. For example, the value of the thickness of the first underlayer 4 is 50% or more of the thickness of the antenna 30, 150% or less is preferable. By setting this range, the mutual thickness difference between the first base layer 4 and the antenna 30 is within a certain range, and the appearance of both, including the difference in glossiness when the package 2 is obliquely observed from the outside. is difficult to identify, and the effect of effectively camouflaging the presence of the antenna 30 and the like by the first underlayer 4 can be obtained.

In this embodiment, when viewed from above along the Y axis, the antenna 30 and the first underlayer 4 do not overlap each other, and the first underlayer 4 is in contact with the outline of the outer circumference of the antenna 30. adjacent to or surrounding the antenna 30 with a small gap therebetween. As a result, it is possible to suppress deterioration in design properties such as change in gloss caused by an increase in film thickness due to overlapping of the antenna 30 and the first underlayer 4, that is, a step. In addition, it is possible to prevent the presence or position of the antenna 30 from being identified due to a change in gloss caused by such a step.

However, the present disclosure is not limited to this, and the antenna 30 and the first base layer 4 may partially overlap each other. Underlying layer 4 may be arranged over the entire area including antenna 30 . As a result, the pattern design of the first base layer 4 can be simplified, and the alignment with the antenna 30 can be relaxed, thereby facilitating the design and manufacture of the package.

Next, the adhesive layer 7 has a role of bonding the IC tag 20 formed via the second underlayer 5 to the substrate 6, the first underlayer 4, and the protective layer 8. . Along with this, it also has a role of absorbing unevenness of the surface formed by the IC tag 20 and the first underlayer 4 to ensure the smoothness of the base material 6 and the protective layer 8 . For the adhesive layer 7, various liquid adhesives or the like that are flexible before hardening and that have both appropriate adhesive strength and irregularity absorbability can be used. Examples of the adhesive layer 7 include various types of adhesives and fillers, such as urethane, acrylic, silicon, rubber, epoxy, etc., having properties such as thermosetting, ultraviolet curing, and moisture curing. can be done.

On the other hand, the protective layer 8 sandwiches the IC tag 20 together with the base material 6 from both sides to prevent damage to the IC tag 20 and to ensure security against misuse of the separated IC tag 20. It is provided for the purpose of protection. As the protective layer 8, a film-like material equivalent to the substrate 6 can be used. Moreover, the base material 6 and the protective layer 8 may be made of the same material, or may be made of different materials.

(c) Assembling (wrapping) the packaging material onto the packaging body
A method for manufacturing the packaging material 100 described above and a method for manufacturing an article 10 with a package by winding the packaging material 2 around the outer circumference of the body of the bottle 50 and assembling the package 2 will be described below. 3(a) to 3(e) are cross-sectional views similar to FIG. 1(b) and illustrate the process of manufacturing the packaging material 100 or package 2. FIG. First, as shown in FIG. 3A, the second base layer 5 is formed on one surface of the base material 6, which is the surface on the -Y direction side. As described above, the formation of the second underlayer 5 is performed by printing a pattern including a predetermined design using various known printing methods.

Next, as shown in FIG. 3B, an IC tag 20 is formed on the surface of the second base layer 5 opposite to the substrate 6 . That is, the antenna 30 is formed by a printing method or the like, and the IC module 500 is mounted on the surface of the antenna 30 opposite to the second base layer 5 and the base material 6, and the IC chip 510 and the antenna 30 are mounted. electrically connected. Thereby, the IC tag 20 acquires a predetermined wireless communication function. As described above, the IC module 500 may be the IC chip 510 itself, or may be a member obtained by modularizing the IC chip 510 and a base material or wiring.

Subsequently, as shown in FIG. 3C, on the surface of the second base layer 5 opposite to the base material 6, the first base layer 4 is printed in a region surrounding the IC tag 20. etc. However, the IC module 500 may not be mounted when the antenna 30 is formed, and the IC module 500 may be mounted on the surface of the antenna 30 after the first base layer 4 is formed. By changing the order of steps in this manner, the risk of accidentally damaging the IC chip 510 during printing of the first base layer 4 can be reduced.

Furthermore, as shown in FIG. 3(d), an adhesive layer 7 is formed in advance on one surface of the protective layer 8, which is the surface on the +Y direction side. Specifically, the surface of the protective layer 8 is coated or coated with a liquid adhesive as described above. As a result, the adhesive layer 7 having a substantially uniform thickness is formed on the surface of the protective layer 8 on the +Y direction side. Next, as shown in FIG. 3(e), the surface of the protective layer 8 on which the adhesive layer 7 is formed is attached to the IC tag 20 and the first lower portion of the substrate 6 on which the aforementioned IC tag 20 and the like are formed. They are placed facing each other so as to face the surface on which the stratum 4 is formed, and a predetermined pressure or heat pressure is applied along the Y-axis direction to bring them into contact with each other.

As a result, the uncured adhesive layer 7 absorbs the uneven surfaces of the IC tag 20 and the first base layer 4, and the substrate 6 and the protective layer 8 are laminated and adhered to each other while ensuring smoothness. As a result, the packaging material 100 in which the second base layer 5, the IC tag 20 and the first base layer 4 are sandwiched between the base material 6 and the protective layer 8 is completed.

Next, the process of winding the packaging material 100 around the body of the bottle 50 to form the package 2 will be described. The packaging material 100 described above is manufactured as a long film member. The packaging material 100 is cut into approximately rectangular strips so that each IC tag 20 is included. Further, as shown by the solid line in FIG. 1(a), the packaging material 100 is set and wound around the body of the bottle 50 so that the long side of the packaging material 100 extends in the horizontal direction. At this time, a hot-melt adhesive is applied to one of the short sides of the packaging material 100 . A portion of the short side portion of the packaging material 100 is overlapped, and the overlapped portion is cooled, whereby the packaging material 100 is fixed to the bottle 50 as the ring-shaped packaging body 2 . A hot-melt adhesive may also be applied to a portion of the packaging material 100 that contacts the bottle 50 so that the package 2 is fixed to the bottle 50 via the adhesive.

If the packaging material 100 has heat-shrinkability and the package 2 is to be fitted to the outer shape of the bottle 50 as much as possible, the article 10 with the package is passed through a predetermined drying oven. As a result, the shrink treatment for thermally shrinking the package 2 is further performed, and the article 10 with the package having a good appearance can be obtained.

(d) Packaging material and packaging body of the first embodiment To summarize the above, the packaging body 2 that covers at least a part of the article of the first embodiment includes the base material 6, the antenna 30, and the first base layer 4. , and the second underlayer 5 are laminated. The antenna 30 , the first base layer 4 , and the second base layer 5 are arranged on one side of the base material 6 .

Moreover, this also applies to the packaging material 100 before being wrapped around the bottle 50 . That is, the packaging material 100 which covers at least a part of the article and which is capable of assembling the packaging body 2 provided with the antenna 30 is configured as follows. The packaging material 100 is formed by laminating the base material 6 , the conductive pattern 30 and the first base layer 4 constituting the antenna 30 , and the second base layer 5 .

As described above, the packaging material 100 and the packaging body 2 of the present embodiment are assembled so as to be wrapped around the body of the bottle 50 in a ring shape, and the outer surface thereof is configured to be the base material 6. be. As a result, the second base layer 5 for imparting a design to the package 2 and the antenna 30 for non-contact communication with an external device as the IC tag 20 are arranged inside the base material 6 . As a result, it is possible to prevent the printed layer from rubbing off and the antenna 30 and the IC chip 510 from being damaged by an external force, so that the package 2 with high quality and reliability can be obtained.

Further, even if there is a slight difference between the appearance color of the antenna 30 and the appearance color of the first base layer 4, the second base layer 5 is further provided to cover them, so that both Color differences can be difficult to discern. Therefore, the second base layer 5 can be a design-printed layer provided on the inner surface of the base material 6 of the packaging body 2 with a design, and the degree of freedom in design selection can be increased.

In addition, the second base layer 5 is used only for concealing the antenna 30 and the first base layer 4, and a design layer is provided between the second base layer 5 and the base material 6 to improve the design of different colors. Additional printing layers, such as printing, may be provided. With such a configuration, the design of the additional printed layer on the outermost surface can be selected without being affected by the colors of the antenna 30 and the first underlayer 4, and the degree of design freedom can be further increased. For example, FIG. 1(c) is a cross-sectional view of the packaging material 100h or the packaging body 2h showing the same cross-section as FIG. 1(b). The packaging material 100h or packaging body 2h further comprises an additional printed layer 230 between the second base layer 5 and the base material 6. As shown in FIG.

Moreover, the package 2 is formed by laminating the base material 6 , the antenna 30 and the first base layer 4 , and the second base layer 5 . The antenna 30 , the first base layer 4 , and the second base layer 5 are arranged inside the package 2 , which is one side of the base material 6 . As a result, compared to the case where the first base layer is not formed, when the packaging body 2 is wrapped around the bottle 50, the unevenness caused by the thickness of the antenna 30 is reduced to the outermost surface of the packaging body 2. The material 6 is suppressed from manifesting. Moreover, even if the base material 6 and the second base layer 5 have a certain degree of transparency to visible light, the presence of the antenna 30 can be made inconspicuous. Therefore, these actions can prevent the antenna 30 from being easily seen in the package 2 .

As described above, in the present embodiment, it is possible to provide the packaging material 100, the package 2, and the package-equipped article 10 that have an antenna that enables wireless communication and that make it difficult to visually recognize the antenna from the outside.

2. Modified Example of First Embodiment Next, a modified example of the packaging material, the package, and the article with the package according to the first embodiment of the present disclosure will be described. FIGS. 4(a) to 4(c) and FIGS. 5(a) and 5(b) are cross-sectional views of packaging materials and packaging bodies according to modifications corresponding to FIG. 1(b), respectively. It is a figure explaining. Each modification will be described below.

(a) Modification 1
FIG. 4(a) is a cross-sectional view for explaining the configuration of the packaging material 100a according to Modification 1 and the package 2a wound around the bottle 50. FIG. The packaging material 100a has a configuration in which a base material 6, a second base layer 5, an adhesive layer 7, an IC tag 20 and a first base layer 4, and a protective layer 8 are laminated in this order when viewed from the +Y direction side. Prepare. That is, the antenna 30 and the first base layer 4 are both arranged on the side of the protective layer 8 facing the base material 6, and the base material 6 and the protective layer 8 are separated from each other by the antenna 30, the first base layer 4, and the second base layer. 5 are adhered via an adhesive layer 7 . The packaging material 100a of Modification 1 differs from the packaging material 100 of the above-described first embodiment in that the arrangement of the IC tag 20, the first base layer 4, and the adhesive layer 7 is changed.

In addition, in this modified example, the first underlayer 4 is arranged in a region surrounding the antenna 30 when viewed from above along the Y-axis. However, the first underlayer 4 is not limited to the area surrounding the antenna 30, and should be arranged at least in the area adjacent to the antenna, as in the description of the first embodiment. This point also applies to other modifications described below.

Further, when viewed in plan along the Y-axis, the antenna 30 and the first underlayer 4 do not overlap each other, and the first underlayer 4 is in contact with the contour of the outer circumference of the antenna 30 or slightly. are arranged adjacent to or surrounding the antenna 30 with a sufficient gap therebetween. However, this modification is not limited to this, and the antenna 30 and the first underlayer 4 may partially overlap each other. This point also applies to modified examples 2 and 3 described below.

Since the packaging material 100a has such a layer structure, when the package 2a is wrapped around the bottle 50, the IC tag 20 and the first base layer 4 are the base material 6 and the second base layer 4 when viewed from the outer surface side. 2. Visible through the adhesive layer 7 in addition to the underlying layer 5 . That is, the more opaque the adhesive layer 7 is, the more difficult it is for the IC tag 20 to be visually recognized from the outside, and the more difficult it is to specify the existence and arrangement of the IC tag 20 from the outside. and security can be further improved.

In addition, even if some external force is applied to the package 2, such as when the bottle 50 is dropped, the adhesive layer 7 functions as a cushion layer and protects the IC tag 20 inside, thereby suppressing damage to the IC tag 20. , making it easier to perform its function.

In the method of manufacturing the packaging material 100a, first, the second base layer 5 is formed on one surface of the base material 6 by printing or the like. On the other hand, the antenna 30 and the first base layer 4 are formed on the protective layer 8 by printing or the like, and the IC module 500 is mounted on the surface of the antenna 30 . Next, an adhesive is applied on the surface of the base material 6 on which the second base layer 5 is formed, or on the surface of the protective layer 8 on which the IC tag 20 and the first base layer 4 are formed. to form the adhesive layer 7 . Then, the base material 6 and the protective layer 8 are bonded so that the surface of the second base layer 5 of the base material 6 and the surface of the IC tag 20 and the first base layer 4 of the protective layer 8 face each other through the adhesive layer 7 . are joined to obtain a packaging material 100a in which these layers are integrally laminated. Further, by winding and fixing the packaging material 100a thus obtained around the bottle 50 according to the method described above, the package 2a and the article with the package can be obtained. This point also applies to the following modified examples.

(b) Modification 2
FIG. 4(b) is a cross-sectional view illustrating the configuration of the packaging material 100b according to Modification 2 and the package 2b wound around the bottle 50. As shown in FIG. The packaging material 100b has a configuration in which a substrate 6, a second base layer 5, an IC tag 20, an adhesive layer 7, a first base layer 4, and a protective layer 8 are laminated in this order when viewed from the +Y direction side. Prepare. That is, the first base layer 4 is arranged on the side of the protective layer 8 facing the base material 6, and the antenna 30 is arranged on the side of the second base layer 5 opposite to the base material 6. 1 base layer 4 is adhered via adhesive layer 7 . The packaging material 100b of Modification 2 differs from the packaging material 100 of the first embodiment in that the IC tag 20 and the first base layer 4 are arranged in different layers, and the arrangement of the first base layer 4 is different. is different from

Since the packaging material 100b has such a layer structure, the IC tag 20 and the first base layer 4 are separated from each other by the adhesive layer 7, which is an insulating material, when the package 2b is wrapped around the bottle 50. FIG. Therefore, even if the first underlayer 4 ink is made of bright metal particles as a pigment, the metal component of the first underlayer 4 may adversely affect the characteristics of the IC tag 20 . can be reduced.

In the method of manufacturing the packaging material 100b, first, the second base layer 5 is formed on one surface of the base material 6 by printing or the like, and the antenna 30 is formed on the upper surface of the second base layer 5 by printing or the like. Further, an IC module 500 is mounted on the surface of the antenna 30. FIG. On the other hand, the first base layer 4 is formed on the protective layer 8 by printing or the like. Next, an adhesive is applied on the surface of the base material 6 on which the second base layer 5 and the antenna 30 are formed, or on the surface of the protective layer 8 on which the first base layer 4 is formed. , forming the adhesive layer 7 . Then, the base material 6 and the protective layer 8 are placed so that the surface of the second base layer 5 and the antenna 30 of the base material 6 and the surface of the first base layer 4 of the protective layer 8 face each other through the adhesive layer 7. These layers are joined to obtain a packaging material 100b in which these layers are integrally laminated.

(c) Modification 3
FIG. 4(c) is a cross-sectional view for explaining the structure of the packaging material 100c according to Modification 3 and the package 2c wound around the bottle 50. As shown in FIG. The packaging material 100c has a structure in which a substrate 6, a second base layer 5, a first base layer 4, an adhesive layer 7, an IC tag 20, and a protective layer 8 are laminated in this order when viewed from the +Y direction side. Prepare. That is, the antenna 30 is arranged on the side of the protective layer 8 facing the base material 6, the first underlayer 4 is arranged on the side of the second underlayer 5 opposite to the base material 6, and the first underlayer 4 and protective layer 8 are adhered via adhesive layer 7 . The packaging material 100c of Modification 3 is different from the packaging material 100 of the above-described first embodiment in that the IC tags 20 and the first base layer 4 are arranged in different layers, and the arrangement of the IC tags 20 is different. different.

Since the packaging material 100c has such a layer structure, the IC tag 20 and the first base layer 4 are separated from each other by the adhesive layer 7, which is an insulating material, when wrapped around the bottle 50 as the package 2c. Therefore, even if the first underlayer 4 ink is made of bright metal particles as a pigment, the metal component of the first underlayer 4 may adversely affect the characteristics of the IC tag 20 . can be reduced. Furthermore, when the bottle 50 is viewed from the outside, the IC tag 20 of the packaging body 2c is arranged inside the adhesive layer 7, making it even more difficult to see the antenna 30 of the IC tag 20 visually. Therefore, even if the color of the first underlayer 4 is not strictly similar to the color of the antenna 30, a sufficient camouflage effect can be obtained to make it difficult to identify the IC tag 20, and the degree of freedom in selecting the color of the first underlayer 4 is increased. can be enhanced.

In the method of manufacturing the packaging material 100c, first, the second base layer 5 is formed on one surface of the base material 6 by printing or the like, and the first base layer 4 is formed on the upper surface of the second base layer 5 by printing or the like. . On the other hand, the antenna 30 is formed on the protective layer 8 by printing or the like, and the IC module 500 is mounted on the surface of the antenna 30 . Next, an adhesive layer 7 is formed by applying an adhesive on the surface of the base material 6 on which the first base layer 4 is formed or on the surface of the protective layer 8 on which the antenna 30 is formed. do. Then, the substrate 6 and the protective layer 8 are joined so that the surface of the first base layer 4 of the substrate 6 and the surface of the antenna 30 of the protective layer 8 face each other through the adhesive layer 7, and these layers are integrally laminated to obtain a packaging material 100c.

(d) Modification 4
FIG. 5(a) is a cross-sectional view illustrating the configuration of a packaging material 100d according to Modification 4 and a packaging body 2d in which the packaging material is wrapped around a bottle 50. FIG. The packaging material 100d has a configuration in which a substrate 6, a second base layer 5, a first base layer 4, an adhesive layer 7, an IC tag 20, and a protective layer 8 are laminated in this order when viewed from the +Y direction side. Prepare. That is, the arrangement of the layer structure is the same as that of Modification 3 described above. However, when viewed in plan along the Y-axis, the first underlayer 4 overlaps the entire antenna 30 so as to encompass the entire area of the antenna 30 .

Since the packaging material 100d has such a layer structure, the IC tag 20 is hidden not only by the adhesive layer 7 but also by the first base layer 4 when the package 2d is wrapped around the bottle 50. It becomes more difficult to visually recognize the antenna 30 of . Therefore, by making the color of the first base layer 4 moderately dark enough to hide the antenna 30, the IC tag 20 is difficult to identify even if the color is not strictly similar to the color of the antenna 30. Sufficient camouflage effect can be obtained. Therefore, it is possible to further increase the degree of freedom in selecting the color of the first underlayer 4 . In addition, the design of the pattern of the first base layer 4 can be simplified, and the alignment with the antenna 30 can be relaxed, which facilitates the design and manufacture of the package. Since the method of manufacturing the packaging material 100d conforms to Modified Example 3, the description is omitted.

(e) Modification 5
FIG. 5(b) is a cross-sectional view illustrating the configuration of a packaging material 100e according to Modification 5 and a package 2e wound around the bottle 50. As shown in FIG. The packaging material 100e has a configuration in which a substrate 6, a second base layer 5, an IC tag 20, an adhesive layer 7, a first base layer 4, and a protective layer 8 are laminated in this order when viewed from the +Y direction side. Prepare. That is, the arrangement of the layer structure is the same as that of Modification 2 described above. However, when viewed in plan along the Y-axis, the first underlayer 4 overlaps the entire antenna 30 so as to encompass the entire area of the antenna 30 .

Since the packaging material 100e has such a layer structure, when the package 2e is wrapped around the bottle 50, the IC tag 20 is separated from the inner first base layer 4 by the adhesive layer 7. there is Therefore, even if the ink of the first underlayer 4 contains bright metal particles as a pigment, the metal component of the first underlayer 4 does not adversely affect the characteristics of the IC tag 20. can. Furthermore, in a plan view along the Y-axis direction, there is no gap between the IC tag 20 and the first base layer 4, and the boundary of the outer periphery of the IC tag 20 is difficult to visually recognize. Sufficient camouflage effect can be obtained to make it difficult to identify. Therefore, it is possible to further increase the degree of freedom in selecting the color of the first underlayer 4 . In addition, the design of the pattern of the first base layer 4 can be simplified, and the alignment with the antenna 30 can be relaxed, which facilitates the design and manufacture of the package. Since the method of manufacturing the packaging material 100e conforms to Modified Example 2, description thereof is omitted.

3. Second Embodiment Next, a second embodiment of the packaging material, the package, and the article with the package according to the present disclosure will be described. FIG. 6(a) is a schematic perspective view showing a packaging body 2f and an article 10a with a packaging body having a substantially rectangular parallelepiped shape. Also, FIG. 6(b) is a developed view showing a packaging material 100f in which the package 2f of FIG. 6(a) is developed on a plane.

Here, an XYZ orthogonal coordinate system is also set for the package 2f. As shown in FIG. 6A, the Z-axis is taken in the vertical direction of the paper surface of the package 2f, and the Y-axis is taken in the direction connecting the front side and the back side. In addition, the horizontal direction perpendicular to the Z-axis and the Y-axis is taken as the X-axis. The upward direction along the Z axis is the +Z direction, and the opposite direction is the -Z direction. The direction along the Z-axis is also simply referred to as the vertical direction. The direction along the Y-axis from the near side to the far side is the +Y direction, and the opposite direction is the -Y direction. The direction along the Y-axis is also simply referred to as the depth direction. Further, the direction from the left side to the right side along the X axis is the +X direction, and the opposite direction is the -X direction. The direction along the X-axis is also simply referred to as the left-right direction. Hereinafter, configurations of a packaging material 100f, a packaging body 2f, and an article with a packaging body 10a according to the second embodiment will be described with reference to FIGS. 6 and 7. FIG.

(a) Configuration of Package First, the package 2f will be described. The packaging body 2f of the present embodiment is a substantially rectangular parallelepiped paperboard packaging box for packaging the entire solid article 610 such as food, and the article 10a with the packaging body constitutes the product as a whole. Here, FIG. 6(b) shows a packaging material 100f in which the circumference is developed on the XY plane while the second surface 12 of the package 2f of FIG. is viewed from the floor side, that is, from the -Z direction side. FIG. 7(a) is a cross-sectional view of the packaging material 100f cut along line BB along the Y axis in FIG. 6(b), viewed from the -X direction side.

As shown in FIG. 6(a), the packaging body 2f is a box-like container that houses an article 610. As shown in FIG. The package 2f has a first surface 11, which is the front surface, on the -Y direction side, and a third surface 13, which is the rear surface, on the +Y direction side opposite to the first surface 11, as surfaces corresponding to the surfaces of the rectangular parallelepiped. . In addition, the package 2f has a fifth surface 15 which is a left side adjacent to the first surface 11 in the -X direction, and a sixth surface 16 which is a right side in the +X direction facing the fifth surface 15. Prepare. Furthermore, the package 2f has a fourth surface 14 that is a top surface adjacent to the first surface 11 on the +Z direction side, and a second surface 12 that is a bottom surface on the −Z direction side opposite to the fourth surface 14. . However, the arrangement of the package 2f is for convenience, and may be arranged such that the first surface 11 is the rear surface, the left side surface, the right side surface, the top surface, or the bottom surface.

An antenna 30a constituting the IC tag 20a is formed on the outer surface of the fourth surface 14 of the package 2f. The antenna 30a extends along the Y-axis, and the IC module 500 is arranged substantially in the center thereof. The antenna 30 forms a dipole antenna, the open end on the -Y direction side is the first end 31a, and the open end on the +Y direction side is the second end 31b. The fact that the antenna 30a does not have to be a dipole antenna and that the shape of the antenna can be any shape is common to the description of the antenna 30 of the first embodiment.

In this embodiment, the antenna 30a is formed only on the fourth surface 14 to simplify the explanation, but the arrangement of the antenna 30a is not limited to this. It may be arranged across the 4th surface 14 and the first surface 11, or may be arranged across other surfaces. Moreover, the shape of the antenna may be one in which a plurality of linear antennas intersect, or one in which the antennas are spirally formed on the surface of the box-shaped container. The IC module 500 and the antenna 30a are electrically connected to the IC chip of the IC module 500 and the opposing portions of the antenna 30a that face each other. As a result, the IC tag 20a is formed, enabling non-contact communication with an external device using radio waves or electromagnetic induction.

In addition, the outer surface of the package 2f is printed so as to have a design as a product. Here, on the fourth surface 14 of the packaging body 2f on which the IC tag 20a is arranged, a first lower A stratum 4a is provided. That is, the first base layer 4a is arranged so as to cover substantially the entire area of the fourth surface 14 of the package 2f except for the arrangement area of the IC tag 20a.

Further, on the outermost surface of the fourth surface 14 on which the antenna 30a and the first underlayer 4a are provided, a second underlayer 220 is provided over the entire surface so as to cover the antenna 30a and the first underlayer 4a. It is Since the second base layer 220 is formed on the fourth surface 14, the antenna 30a and the first base layer 4a arranged therebelow are difficult to visually recognize when the package 2f is viewed from the outside. It has become. However, in FIGS. 6A and 6B, in consideration of clarifying the arrangement of the antenna 30a and the first underlayer 4a, the display of the second underlayer 220 is limited to a part thereof. Omits most displays.

In addition, each surface other than the fourth surface 14 is provided with a printed layer 210 for imparting designability as necessary. In addition, in FIG. 6A and the like, the display of the printed layer 210 is omitted except for a part.

Also, in this embodiment. Although the antenna 30a and the first base layer 4a are formed on the outer surface side of the package 2f, the antenna 30a may be formed on the inner surface side of the package 2f in consideration of design. may be formed on both the outer surface side and the inner surface side of the package 2f. Further, another printed layer may be formed on the outer surface side of the second base layer 220 formed on the outer surface side of the package 2f.

In this way, the second base layer 5 is used as a second base layer only for concealing the antenna 30a and the first base layer 4a, and the outermost surface side of the second base layer 220 is further provided with a different color to improve the design. Additional printed layers may be provided, such as design printing for. With such a configuration, the design of the additional printed layer on the outermost surface can be selected without being affected by the colors of the antenna 30a and the first underlayer 4a, and the degree of design freedom can be increased. For example, FIG. 7(c) is a cross-sectional view of the packaging material 100i showing the same cross-section as FIG. 7(a). The packaging material 100i further includes an additional printed layer 240 on the outermost surface of the second base layer 220 on the -Z direction side.

(b) Configuration of Packaging Material Next, in order to facilitate understanding of the configuration of the packaging body 2f described above, the configuration of a packaging material 100f, which is a member obtained by unfolding the packaging body 2f on a plane, will be described. As shown in FIGS. 6(b) and 7(a), the packaging material 100f has conductive patterns 30a formed on one side of the substrate 110 in the −Z direction. The first underlayer 4a is formed so as to be adjacent to, overlap with, or surround the outline of the outer periphery. Furthermore, a second base layer 220 is formed on the outermost surface of the fourth surface 14 so as to cover the conductive pattern 30a and the first base layer 4a. A printed layer 210 is formed on the surface of the base material 110 on which the conductive pattern 30a and the first base layer 4a are not arranged. The printed layer 210 and the second base layer 220 may be printed layers with a uniform design, or may be printed layers with different designs.

The conductive pattern 30a has a function of forming the IC tag 20a together with the IC chip as an antenna 30a in the package 2f after assembly. However, the present disclosure does not prevent other conductive patterns that satisfy the same relationship as the conductive pattern 30a from being additionally arranged.

The packaging material 100f is a board made of paper such as high-quality paper, coated paper, or art paper, or a plastic material, or a member in which these materials are mixed or laminated. In addition, depending on the article, the inner surface of the member may be resin-coated, or an aluminum foil or an aluminum vapor-deposited film may be further laminated in order to impart gas barrier properties.

The packaging material 100f is arranged so that the first surface 11 is adjacent to the second surface 12 in the −Y direction and the third surface 13 is adjacent to the +Y direction so that the packaging material 2f can be assembled into a substantially rectangular parallelepiped package. be done. Further, the fifth surface 15 is adjacent to the second surface 12 in the −X direction, and the sixth surface 16 is adjacent to the +X direction. Furthermore, the fourth surface 14 is arranged adjacent to the +Y direction side of the third surface 13 .

At the boundary between the second surface 12 and the first surface 11, there is a folding line 12q that will be mountain-folded in a post-process. Similarly, the boundary between the second surface 12 and the third surface 13, the boundary between the second surface 12 and the fifth surface 15, the boundary between the second surface 12 and the sixth surface 16, and the boundary between the third surface 13 and the fourth surface Bending lines 12s, 12p, 12r and 13r are present at the boundaries with the surface 14, respectively. On the −Y direction side, −X direction side and +X direction side of the first surface 11, approximately trapezoidal glue strips 11b, 11a and 11c bounded by folding lines 11q, 11p and 11r extend respectively. are provided.

On the other hand, on the −X direction side and the +X direction side of the third surface 13, approximately trapezoidal glue margins 13a and 13b are provided extending, bounded by the folding lines 13p and 13q, respectively. On the -X direction side of the fifth surface 15 and on the +X direction side of the sixth surface 16, approximately trapezoidal glue strips 15a and 16a are provided extending from the folding lines 15p and 16p, respectively. there is As shown in FIG. 6(a), the paste margin 11b is assembled so as to overlap the +Y direction side end of the fourth surface 14 shown in FIG. 6(b).

Further, the margins 11a, 11c, 13a and 13b are respectively the -Y direction end of the fifth surface 15, the -Y direction end of the sixth surface 16, and the fifth It is assembled so as to overlap the end of the surface 15 on the +Y direction side and the end of the sixth surface 16 on the +Y direction side. Furthermore, the glue strips 15a and 16a are assembled so as to overlap the −X direction end of the fourth surface 14 and the +X direction end of the fourth surface 14 shown in FIG. 6B, respectively. be done.

Here, the folding line portion merely indicates a line that is scheduled to be folded in a post-process, and is specifically subjected to printing of a line that serves as a mark in advance, folding processing, or the like. No need. However, in order to facilitate bending, the substrate 110 may be perforated with intermittent through-slits, or half-cut with continuous cuts to the middle of one surface. good. Alternatively, a mark line may be displayed by printing or the like, or a crease may be formed in advance so that the folding line can be visually recognized. Further, the overlapping portions may be adhered by actually applying an adhesive or the like to the adhesive margin, or no adhesive or the like may be applied to the adhesive margin.

A linear conductive pattern 30a along the Y-axis is arranged on the fourth surface 14 of the packaging material 100f. The conductive pattern 30a is formed on the surface of the substrate 110 on the −Z direction side. However, the conductive pattern may be formed on the surface of the substrate 110 on the +Z direction side, or may be formed on both the −Z direction side and the +Z direction side of the substrate 110 . Furthermore, other conductive patterns as described above may additionally be arranged. The conductive pattern 30a is a portion formed of a conductive member with a predetermined pattern for transmitting and receiving radio waves, etc., as the antenna 30a of the IC tag 20a. Detailed specifications of the conductive pattern 30a, the antenna 30a, and the IC tag 20a are the same as those described as the specifications of the conductive pattern 30, the antenna 30, and the IC tag 20 of the first embodiment, so detailed description thereof will be omitted.

The surface resistivity conditions of the first underlayer 4a, the second underlayer 220, and the antenna 30a, the surface resistivity difference conditions, and the color difference conditions are the same as those in the first embodiment. The conditions are the same as those described for the first underlayer 4 , the second underlayer 5 and the antenna 30 . Further, the conditions for the value of dha, which is the gap along the vertical direction between the first base layer 4a and the antenna 30a, the conditions for the value of dwa, which is the gap between the two along the horizontal direction, The same applies to the condition of the relationship between the film thickness value of the stratum 4a and the film thickness value of the antenna 30. FIG. The package 2f of the second embodiment differs from the package 2 of the first embodiment only in part of the layer structure and form of the package. This is because the effects of the relationship with are common to the effects of the relationship with the IC tag 20 and the first base layer 4 .

(c) Assembling the packaging material into the packaging body By sequentially assembling the packaging materials 100f described above, the substantially rectangular parallelepiped packaging body 2f can be obtained. First, the packaging material 100f of FIG. 6(b) is folded into mountain folds along the folding lines. For example, folding lines 11p, 11q and 11r, which are boundaries between the first surface 11 and the margins 11a, 11b and 11c extending therefrom, are each subjected to mountain folding. Similarly, folding lines 15p and 16p, which are boundaries between the fifth and sixth surfaces 15 and 16 and the glue margins 15a and 16a extending therefrom, are subjected to mountain folding. Further, folding lines 13p and 13q, which are boundaries between the third surface 13 and the margins 13a and 13b extending therefrom, are each subjected to mountain folding.

After that, an adhesive or the like is applied to each paste margin as necessary, and furthermore, the second surface 12 and the adjacent first surface 11, fifth surface 15, sixth surface 16 and third surface 13 are formed. Folding lines 12q, 12p, 12r, and 12s, which are boundaries between and, are each subjected to mountain folding. Also, the folding line 13r, which is the boundary between the third surface 13 and the adjacent fourth surface 14, is subjected to mountain folding. As a result, a substantially rectangular parallelepiped package 2f shown in FIG. 6(a) is assembled.

Here, as described with reference to FIGS. 2(a) to 2(d), the IC module 500 is mounted and fixed at a predetermined position so as to straddle the opposing portions provided on the antenna 30a. Thus, the package 2f including the structure of the IC tag 20a is completed. That is, the first pad 510a and the second pad 510b, which are electrical connection terminals of the IC chip 510, are electrically connected to their respective facing portions. As a result, IC chip 510 and antenna 30a form a communication circuit that enables wireless communication with an external device.

(d) Packaging material and packaging body of the second embodiment To summarize the above, the packaging body 2f that covers at least a part of the article of the second embodiment includes the base material 110, the antenna 30a and the first base layer 4a. , and the second underlayer 220 are laminated. Further, the antenna 30a, the first base layer 4a, and the second base layer 220 are arranged on one side of the substrate 110, respectively.

Moreover, the packaging material 100f capable of assembling the package 2f having the antenna 30a covering at least a part of the article has the following configuration. The packaging material 100f is formed by laminating the base material 110, the conductive pattern 30a and the first base layer 4a that constitute the antenna 30a, and the second base layer 220. As shown in FIG. The conductive pattern 30a, the first underlayer 4a, and the second underlayer 220 are arranged on one side of the substrate 110, respectively.

In this manner, the packaging material 100f and the packaging body 2f of the present embodiment are assembled as a box-shaped container for storing articles, and are configured so that the IC tag 20a is arranged on the outer surface thereof. As a result, the IC tag 20a is attached only to the non-defective package 2f through quality inspection of the package 2f in the final form containing the articles. Therefore, waste such as disposal of the IC tag 20a attached to the defective package 2f and an increase in work load such as removal of the attached IC tag 20a are suppressed.

The first underlayer 4a is arranged so as to be in contact with the outline of the outer periphery of the antenna 30a constituting the IC tag 20a, or to surround the outline of the outer periphery with a very small gap. or adjacent to or overlapping a portion of the contour of the perimeter. Furthermore, a second base layer 220 is formed on the outermost surface of the package 2f so as to cover the antenna 30a and the first base layer 4a.

When the article with package 10a is viewed from the outside, the presence of the IC tag 20a on the package 2f is determined by the presence of the first base layer 4a adjacent to its periphery and the presence of the second base layer 220 covering the outermost surface. Camouflaged by presence. Therefore, compared with the case where the first underlayer 4a is not formed, the following points are advantageous. First, in the packaging material 100f, each part is formed on the base material 110 by first forming the antenna 30a and the first base layer 4a by printing or the like, and then covering the antenna 30a and the first base layer 4a. A second base layer 220 is formed by printing or the like.

Here, on the packaging material 100f, it is generally efficient to perform each printing at high speed by a gravure printing machine at the same time. 2 Underlayer 220 may not print correctly. That is, due to the unevenness of the printed surface caused by the steps of the antenna 30a, a non-printed portion (so-called print void) is likely to occur in the vicinity of the antenna 30a. On the other hand, in the present embodiment, since the first base layer 4a is also formed around the antenna 30a, even if the second base layer 220 is superimposed, it can be formed with good quality.

Further, even if there is a slight difference between the appearance color of the antenna 30a and the appearance color of the first base layer 4a, the second base layer 220 is further provided to cover them, so that both Color differences can be difficult to discern. Therefore, the second base layer 220 can be a design-printed layer on the outermost surface of the packaging body 2f, which has design properties, and the degree of freedom in design selection can be increased.

Furthermore, when the package 2f is viewed from the outside, unevenness caused by the thickness of the antenna 30a is less likely to be apparent on the outermost surface of the package 2f. Therefore, even if the package 2f is viewed obliquely, it is difficult to estimate the presence of the antenna 30a from the uneven shape due to the influence of light reflection and the like. As described above, in the present embodiment, it is possible to provide the packaging material 100f, the package 2f, and the package-attached article 10a that are equipped with an antenna that enables wireless communication and that make it difficult to visually recognize the antenna from the outside.

4. Modified Example of Second Embodiment Next, a modified example of the second embodiment of the packaging material, the package, and the article with the package according to the present disclosure will be described. Figures 8(a), 8(b) and 7(b) show the packaging bodies 2f and 2f of the second embodiment shown in Figures 6(a), 6(b) and 7(a), respectively. FIG. 10 is an explanatory diagram of a packaging body 2g and a packaging material 100g according to a modification corresponding to the packaging material 100f;

The package 2g according to the modification covers the front surface of the antenna 30a of the IC tag 20a formed on the fourth surface 14, that is, overlaps the entire area of the antenna 30a in plan view along the Z-axis direction. Thus, the second embodiment differs from the second embodiment in that the first underlayer 4b is provided. The same applies to the packaging material 100g before assembling the package 2g.

Since the packaging material 100g and the packaging body 2g have such a layer structure, when the packaging body 2g is visually recognized from the outside, the IC tag 20a is hidden by the first base layer 4b and further arranged on the outermost surface. , and the second base layer 220 covering the IC tag 20a and the first base layer 4b. Such a configuration makes it difficult to visually recognize the antenna 30a of the IC tag 20a in the package 2g. Therefore, by making the color of the first base layer 4b moderately dark enough to hide the antenna 30a, it is difficult to identify the IC tag 20a even if the color is not strictly similar to the color of the antenna 30a. You can get enough camouflage effect to do.

Therefore, it is possible to further increase the degree of freedom in selecting the color of the first underlayer 4b. In addition, the design of the pattern of the first base layer 4b can be simplified, and the alignment with the antenna 30a can be relaxed, which facilitates the design and manufacture of the package. Since the method for manufacturing the packaging material 100g and the packaging body 2g conforms to the second embodiment, the description is omitted.

It should be noted that all or part of the embodiments and modifications described above can be implemented in combination as long as they do not contradict each other, and the contents thereof are naturally included in the present disclosure.

2, 2a, 2b, 2c, 2d, 2e, 2f, 2g, 2h package 4, 4a, 4b first base layer 5, 220 second base layer 6 base material 7 adhesive layer 8 protective layer 10, 10a, 10b package Article with body 11 First surfaces 11a, 11b, 11c Paste margins 11p, 11q, 11r Folding line 12 Second surfaces 12p, 12q, 12r, 12s Folding line 13 Third surfaces 13a, 13b Paste margins 13p, 13q Folding line 14 4th surface 15 5th surface 15a Paste margin 15p Folding line 16 6th surface 16a Paste margin 16p Folding lines 20, 20a, 20j, 20k, 20m, 20n IC tags 30, 30a, 30j Antenna 30k, 30n, 40n First element 30l , 30o, 40o Second element 30m First portion 30ma, 30oa, 40ma, 40oa Opposed portion 31a First end 31b Second end 40m Second portion 50 Bottle 51 Bottle body 52 Cap 100, 100a, 100b, 100c, 100d , 100e, 100f, 100g, 100h, 100i Packaging materials 110, 120 Base materials 210, 230, 240 Printed layer 500 IC module 510 IC chip 510a First pad 510b Second pad 520 Loop circuits 520a, 520b Opposing part 600 Beverage 610 Article

Claims (9)

A package that covers at least a portion of an article,
a substrate;
an antenna and a first underlayer;
A second underlayer is laminated,
The package, wherein the antenna, the first base layer, and the second base layer are each arranged on one side of the base material. 2. The package according to claim 1, wherein a printed layer is further laminated on the surface of said second underlayer opposite to said antenna or said first underlayer. 3. The package according to claim 1, wherein an IC chip is electrically connected to said antenna, and said antenna and said IC chip constitute a communication circuit capable of wireless communication with an external device. The package according to any one of claims 1 to 3, wherein the second base layer overlaps the entire area of the antenna in plan view. The package according to any one of claims 1 to 4, wherein the antenna and the first underlayer have a color difference ΔE ^* ab of 25 or less. 6. The color difference ΔE ^* ab between the second underlayer that overlaps with the antenna and the second underlayer that does not overlap with the antenna in plan view is 13 or less. The package according to item 1. 7. The method according to any one of claims 1 to 6, wherein the surface resistivity values of the first underlayer and the second underlayer are 100 times or more the surface resistivity value of the antenna. packaging. An article with a package, wherein the package according to any one of claims 1 to 7 covers at least part of the article. A packaging material capable of assembling a package with an antenna covering at least a portion of an article, the package comprising:
a substrate;
a conductive pattern and a first underlayer that constitute the antenna;
A second underlayer is laminated,
The packaging material, wherein the conductive pattern, the first underlayer, and the second underlayer are each arranged on one side of the base material.

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