JP2023031232A - Imprint device and manufacturing method for article - Google Patents

Abstract

To provide an imprint device capable of adjusting the position of a light irradiation area irradiated on a substrate while suppressing the reduction in throughput.SOLUTION: The imprint device is for forming a pattern by curing a resin in a state where a pattern area of a mold is brought in contact with a resin on a shot area of a substrate. The imprint device includes an element for adjusting an irradiation area of light from a light source irradiated on a substrate, a measurement unit for measuring the position of a mark formed on the mold, and a control unit for controlling the position of the irradiation area relative to the position of the mark within a surface parallel to the surface of the substrate on the basis of the measurement result of the position of the mark by the measurement unit.SELECTED DRAWING: Figure 4

Description

The present invention relates to an imprint apparatus.

Conventionally, as one of the lithography apparatuses for manufacturing articles such as semiconductor devices and liquid crystal display devices, the pattern formed on the mold is cured while the resin on the substrate is brought into contact with the pattern. An imprinting apparatus for transferring is known.
In such an imprint apparatus, when the pattern area on the mold on which the pattern is formed and the shot area on the substrate to which the pattern is transferred have different shapes, the transfer accuracy of the pattern decreases. It is known that

In order to suppress such a decrease in pattern transfer accuracy, the shape of each of the pattern region on the mold and the shot region on the substrate is changed by irradiating the shot region on the substrate with light and heating it so as to deform it. are known to match each other.
However, when the shot area is irradiated with light, if the light irradiation area is not formed at the target position because the coordinate system related to the light deviates from the coordinate system related to the substrate and the mold, the shot area on the substrate may be properly adjusted. It becomes difficult to transform into

In Patent Document 1, after curing part of the resin on the shot area of the substrate corresponding to the light irradiation area, the position of each of the cured part of the resin and the mark formed on the mold is measured. An imprinting apparatus is disclosed that adjusts the position of the irradiation region by doing so.

JP 2019-009226 A

In the imprint apparatus disclosed in Patent Document 1, after curing a part of the resin, the positions of the cured part of the resin and the marks formed on the mold are measured. throughput is reduced by the amount of time required for
In addition, in the case where the shot region on the substrate is deformed by irradiating it with light and heating it before curing the resin as described above, the position of the cured resin is measured as in the imprint apparatus of Patent Document 1. It is difficult to use the method of adjusting the position of the light irradiation area by doing so.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an imprint apparatus capable of adjusting the position of an irradiation area of light irradiated onto a substrate while suppressing a decrease in throughput.

An imprinting apparatus according to the present invention is an imprinting apparatus that forms a pattern by curing a resin in a state in which a pattern area of a mold is in contact with a resin on a shot area of a substrate. an element that adjusts the irradiation area of the light, a measurement unit that measures the position of the mark formed on the mold, and a mark in a plane parallel to the surface of the substrate based on the measurement result of the mark position by the measurement unit. and a control unit that controls the position of the irradiation region with respect to the position of the.

ADVANTAGE OF THE INVENTION According to this invention, the imprint apparatus which can adjust the position of the irradiation area|region of the light irradiated to a board|substrate can be provided, suppressing the fall of a throughput.

1A and 1B are a schematic cross-sectional view and a partially enlarged schematic cross-sectional view of an imprint apparatus according to a first embodiment; FIG. FIG. 2 is a top view of a substrate used in the imprint apparatus according to the first embodiment; 4 is a diagram showing alignment marks detected by the imprint apparatus according to the first embodiment; FIG. 4 is a flowchart showing imprint processing by the imprint apparatus according to the first embodiment; FIG. 4 is a diagram showing each coordinate system in the imprint apparatus according to the first embodiment; 9 is a flowchart showing imprint processing by the imprint apparatus according to the second embodiment;

The imprint apparatus according to the present embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings shown below are drawn on a scale different from the actual scale in order to facilitate understanding of the present embodiment.
In the following description, the direction parallel to the optical axis of the illumination system that irradiates the resin on the substrate with curing light is referred to as the Z direction, and the two directions perpendicular to each other in the plane perpendicular to the Z direction are referred to as the X direction and the Y direction. do.

[First embodiment]
FIG. 1A shows a schematic cross-sectional view of an imprint apparatus 100 according to the first embodiment.
Also, FIG. 1B shows a schematic cross-sectional view of the light supply unit 190 provided in the imprint apparatus 100 according to the first embodiment.

As an example of the imprint apparatus 100 according to the present embodiment, an imprint apparatus using a photo-curing method, specifically an ultraviolet curing imprint apparatus that cures an uncured imprint material on a substrate by irradiating ultraviolet rays. using the device.
However, the imprint apparatus 100 according to the present embodiment is not limited to this, and uses electromagnetic waves in a wavelength band other than ultraviolet rays, or uses energy other than electromagnetic waves, such as heat, to cure the uncured imprint material on the substrate. may

The imprint apparatus 100 according to this embodiment includes a curing unit 110, a half mirror 115, a mold holding unit 120, a mold deformation unit 130, a dispenser 140, a substrate holding unit 150, a measuring unit 160, a control unit 170, a scope 180, and a light supply unit. Includes section 190 .
The imprint apparatus 100 according to this embodiment forms patterns in a plurality of shot areas S on the substrate W by repeating the imprint cycle in the above configuration.

Here, the imprint cycle means that the imprint material R is cured while the pattern area of the mold M is in contact with the imprint material R on the predetermined shot area S formed on the substrate surface (surface) of the substrate W. This is a cycle in which a pattern is formed in a predetermined shot area S by allowing
As the imprint material R, an ultraviolet curable resin is used in the imprint apparatus 100 according to the present embodiment.

The curing unit 110 includes, for example, a light source 111, an optical system 112, a setting unit 113, and a half mirror 114, and irradiates the imprint material R on the predetermined shot area S of the substrate W with light through the mold M. , the imprint material R is cured.
The light source 111 includes a light source such as a halogen lamp that generates irradiation light that is ultraviolet light such as i-line and g-line, and an elliptical mirror that collects the irradiation light emitted from the light source.

The optical system 112 includes a lens for irradiating a predetermined shot region S (pattern formation region) on the substrate W with irradiation light for curing the imprint material R. FIG.
Note that the optical system 112 may include an optical integrator for uniformly illuminating the substrate W (and mold M).

The setting unit 113 includes, for example, an aperture, a variable field stop, and the like, which are used for angle-of-view control and peripheral light shielding control.
Specifically, the setting unit 113 performs angle-of-view control so that only a predetermined shot area S can be illuminated, and outer peripheral light shielding control is performed so that the irradiation light exceeds the predetermined shot area S and is shot in other areas. Irradiation of the shot area S can be restricted.
That is, the curing section 110 can illuminate a desired shot area S on the substrate W by using the setting section 113 .

The half mirror 114 changes the optical path of the irradiation light from the setting unit 113 to the direction toward the substrate W. FIG.
As a result, light whose energy (i.e., irradiation light) irradiation region is defined by the setting unit 113 passes through an imaging system (not shown) and the mold M onto the imprint material R on the predetermined shot region S of the substrate W. incident on

The mold holding part 120 includes, for example, a mold chuck 121 , a driving part 122 , and a base 123 supporting the driving part 122 .
The mold chuck 121 holds the mold M by sucking it with, for example, a vacuum suction force, an electrostatic force, or the like.

By driving the mold chuck 121 to move the mold M, the driving unit 122 controls the position of the mold M with respect to the six axes and moves the mold M to the imprint material R on the predetermined shot area S of the substrate W. , or the mold M is peeled off (released) from the cured imprint material R.
Here, the six axes include the X-, Y-, and Z-axes in the XYZ coordinate system, and rotation axes around the X-, Y-, and Z-axes.

The mold M has, for example, a rectangular outer peripheral portion, and a predetermined uneven pattern MP (pattern) is three-dimensionally formed on the pattern surface facing the substrate W, and is made of a material that transmits ultraviolet rays, such as quartz. Configured.
Further, the mold M is formed with alignment marks AMM (marks) as will be described later, and the mold M can be transported by a mold transport device (not shown).
The mold transfer device includes a transfer robot having a chuck such as a vacuum chuck.

The mold deformation unit 130 is mounted on the mold chuck 121, for example, and can deform the mold M by applying pressure to the mold M from the outer peripheral direction using a cylinder (actuator) that operates with a fluid such as air or oil. can.
The mold M may be deformed by controlling the temperature of the mold M by providing a temperature control unit for controlling the temperature of the mold M in the mold deformation unit 130 .
Since the substrate W can be deformed (typically expanded or contracted) through a process such as heat treatment, the mold deforming section 130 is designed to allow the substrate W and the mold M to move in accordance with such deformation of the substrate W. Correct the shape of the mold M so that the respective positions match each other.

Further, by further providing a temperature control unit for controlling the temperature of the substrate W in the imprint apparatus 100 according to the present embodiment, the substrate W may be intentionally deformed by temperature control.

The dispenser 140 includes, for example, a tank 141 containing the imprint material R, and a nozzle 142 (ejection port) for ejecting the imprint material R supplied from the tank 141 through the supply path onto the substrate W.
The dispenser 140 also includes a valve (not shown) provided in the supply path of the imprint material R and a supply amount control unit (not shown).

Note that the dispenser 140 may collectively apply (supply) the imprint material R to a plurality of shot areas S on the substrate W before performing the imprint cycle, or may apply (supply) the imprint material R to a predetermined shot area S before performing the imprint cycle. The imprint material R may be applied during the cycle.
Further, the imprint material R may be applied to the entire surface of the substrate W by an external device (applying device) without providing the dispenser 140 in the imprinting apparatus 100 according to the present embodiment.
Further, in the dispenser 140, the supply amount of the imprint material R to the substrate W is controlled by controlling the valve by the supply amount control unit.

As described above, as the imprint material R, a curable composition that cures when energy for curing is applied is used.
Here, as the energy for curing, electromagnetic waves, heat, etc. are used, and as the electromagnetic waves, light such as infrared rays, visible rays, and ultraviolet rays selected from a range of wavelengths of 10 nm to 1 mm, for example, is used.
In particular, when a resin is used for the imprint material R, an ultraviolet ray having a wavelength of 100 nm to 400 nm is often used as an electromagnetic wave for curing the resin.

The curable composition used as the imprint material R as described above is a composition that is cured by light irradiation or heating.
Among such curable compositions, the photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and optionally contains a non-polymerizable compound or a solvent. good too.
The non-polymerizable compound referred to herein is at least one selected from the group consisting of sensitizers, hydrogen donors, internal release agents, surfactants, antioxidants and polymer components.
Further, the viscosity of the imprint material R (specifically, the viscosity at 25° C.) is, for example, 1 mPa·s or more and 100 mPa·s or less.

The substrate holder 150 includes a substrate chuck 151, a substrate stage 152, and a driving mechanism (not shown).
The substrate chuck 151 holds the substrate W by sucking it with, for example, a vacuum suction pad.
The substrate stage 152 aligns the substrate W and the mold M by moving the substrate W about six axes while holding the substrate chuck 151 and driving it using a driving mechanism (not shown).

Glass, ceramics, metal, semiconductor, resin, or the like is used as the material of the substrate W, and the substrate W can be transported by a substrate transport device (not shown).
A member made of a material different from that of the substrate W may be formed on the surface of the substrate W as needed.
Specifically, as the substrate W, for example, a silicon wafer, a compound semiconductor wafer, quartz glass, or the like is used.

The measuring section 160 includes an alignment scope 161 and an alignment stage 162 .
The alignment scope 161 includes an automatic adjustment scope (AAS) used to align the mold M and a predetermined shot area S on the substrate W with each other.
Specifically, the alignment scope 161 detects the alignment mark AMM formed on the mold M and the alignment mark AMW formed in the predetermined shot area S on the substrate W through the mold M. FIG.
The alignment stage 162 positions the alignment scope 161 for measurement.

The control unit 170 includes a CPU, a memory (storage unit), and the like, and can control the entire imprint apparatus 100 according to the present embodiment, that is, each component connected by wires (not shown).
The scope 180 is an imaging unit that observes the entire predetermined shot area S on the substrate W, and confirms the state of imprinting and the progress of filling of the stamping die and the imprinting material R. FIG.

The light supply unit 190 includes, for example, the configuration shown in FIG.
That is, the light supply unit 190 uses an optical system including the spatial light modulation element 191 to modulate the irradiation light from the light source 192 into an arbitrary shape, that is, to form a light irradiation region L described below. Become.

A digital micromirror device (DMD) is often used as the spatial light modulation element 191 here.
However, the present invention is not limited to this, and an element other than the DMD, such as a liquid crystal display (LCD), may be used as long as it can irradiate the imprint area with light that forms an illuminance distribution (light irradiation area L). may
The shape of the spatial light modulator 191 can be freely changed within the range of resolution.

The light source controller 193 is configured to control the light source 192 and is controlled by the controller 170 .
The actuator 194 is configured to control the position of the spatial light modulation element 191, and the control axes of the actuator 194 are preferably three or more, but may be two or less.

The light emitted from the light supply unit 190 is reflected by the half mirror 115 and then passes through the mold M so that a predetermined shot area S on the substrate W is irradiated with the light.

The imprint apparatus 100 according to the present embodiment also includes a surface plate and a damper (not shown) for holding the mold holding unit 120 .
The surface plate supports the entire imprint apparatus 100 according to the present embodiment, and forms a reference plane when the substrate stage 152 moves.
The vibration isolator supports the surface plate by removing vibrations from the floor.

FIG. 2 is a top view showing an example of the substrate W used in the imprint apparatus 100 according to this embodiment.

The substrate W includes, for example, a single crystal silicon substrate, an SOI (Silicon on Insulator) substrate, or the like, and the uneven pattern MP formed on the mold M is transferred.
Specifically, as shown in FIG. 2, a plurality of shot regions S are formed on the substrate W, and a plurality of alignment marks AMW are formed in each shot region S. A concave-convex pattern MP is transferred to each shot region S.
In the following description, it is assumed that at least one layer of patterns has already been formed in each shot area S on the substrate W. FIG.

FIG. 3 is a diagram showing an example of alignment marks AMM and AMW detected by the measurement unit 160 in the imprint apparatus 100 according to this embodiment.

As shown in FIG. 3, the alignment marks AMM on the mold M and the alignment marks AMW on the predetermined shot area S of the substrate W are arranged so as not to overlap each other when alignment is performed, which will be described later. formed respectively.
Then, the alignment scope 161 provided in the measurement unit 160 detects the alignment mark AMW on the predetermined shot area S of the substrate W through the alignment mark AMM on the mold M. FIG.
Thereby, the relative position between the alignment mark AMM and the alignment mark AMW can be measured.

In the imprint apparatus 100 according to this embodiment, alignment between the alignment mark AMM and the alignment mark AMW is performed by the die-by-die alignment method.
The measurement unit 160 can also independently measure the positions of the alignment mark AMW and the alignment mark AMM.

FIG. 4A is a flowchart showing imprint processing by the imprint apparatus 100 according to this embodiment.
FIG. 4B is a flow chart showing processing in step S450, which is one step of the imprint processing.
Note that the imprint processing is mainly executed by control of each unit by the control unit 170 .

First, in step S<b>410 , the mold M is carried into the mold chuck 121 by a mold conveying device (not shown) and positioned, and then the positioned mold M is held by the mold chuck 121 .
Next, in step S420, the substrate W is held by the substrate chuck 151 after being loaded into the substrate chuck 151 by a substrate transfer device (not shown).

In step S430, the imprint material R is applied to the entire substrate surface of the substrate W by the dispenser 140. As shown in FIG.
As described above, when the imprint material R is applied onto the substrate W by an external device without using the dispenser 140 provided in the imprint apparatus 100 according to the present embodiment, step S430 is omitted. be.

In step S440, the alignment stage 162 moves the alignment scope 161 to a position where the alignment mark AMM on the mold M is measured.
That is, the alignment stage 162 positions the alignment scope 161 so as to fix it to an absolute coordinate system ACS (Absolute Coordinate System) in the imprint apparatus 100 according to this embodiment.

In step S450, the position of the light irradiation area L from the spatial light modulator 191 in the light supply section 190 is corrected with respect to the position of the mold M. FIG.
Specifically, in step S450, based on the measurement result of the position of the alignment mark AMM by the alignment scope 161, the light irradiation area L from the spatial light modulator 191 in the light supply section 190 is controlled.

More specifically, in step S450, the deviation between the coordinate system LCS (Light Coordinate System) for the light irradiation area L in the spatial light modulator 191 and the coordinate system MCS (Mask Coordinate System) for the mold M is corrected.
That is, in step S450, at least one of the coordinate system LCS and the coordinate system MCS is corrected in a predetermined manner, thereby correcting the deviation between both coordinate systems.

Light irradiation from the light supply unit 190 controls the viscosity of the imprint material R when the mold M and the substrate W are brought into contact with each other, and controls other shots of the imprint material R on the predetermined shot area S, for example. Diffusion to the region S can be suppressed and the like.
Further, by heating the substrate W by light irradiation from the light supply unit 190, the substrate W can be deformed into a desired shape and size.

Therefore, the light supplied from the light supply unit 190 preferably has a wavelength that does not sensitize (harden) the resin as the imprint material R, for example, light in a wavelength band of 400 to 2000 nm.
In particular, the light supplied from the light supply unit 190 is more preferably light in a wavelength band of 500 to 800 nm from the viewpoint of heating efficiency.
In addition, the light supplied from the light supply unit 190 is not limited to the above wavelength band. may be

When the substrate W is irradiated with irradiation light, if the mold M has an installation error or the like, the imprint material R on the shot region S to be irradiated may not be cured.
The above influences range from impediment of filling of the imprinting material R, poor diffusion of the imprinting material R, poor heat input to the substrate W, and the like.

As shown in FIG. 4(b), step S450 includes steps S451 to S456.

In step S451, 1 is substituted for the variable i indicating the number of loops in step S450.
In step S452, the measurement unit 160 measures the position of the alignment mark AMM.
In step S453, relative deviation between the coordinate system MCS and the coordinate system LCS is calculated based on the measurement result of the position of the alignment mark AMM in step S452.

Then, in step S454, the relative deviation between the coordinate system MCS and the coordinate system LCS calculated in step S453 is corrected.
Note that in the imprint apparatus 100 according to the present embodiment, the correction method in step S454 can be selected from the following three methods A, B, and C.
A: Adjustment of the position of the spatial light modulation element 191 B: Adjustment of the light irradiation area L by the spatial light modulation element 191 C: Adjustment of the position of the mold M However, other methods are not limited to the above methods A to C. may

FIG. 5A shows the arrangement of each coordinate system in the ideal state of the imprint apparatus 100 according to this embodiment.

Specifically, in FIG. 5A, the absolute coordinate system ACS of the imprint apparatus 100 according to the present embodiment is used as a reference, and the alignment mark AMM and the light irradiation area L are represented as representative points of the coordinate system MCS and the coordinate system LCS, respectively. It is shown.
That is, in the ideal state of the imprint apparatus 100 according to the present embodiment, the origins of the alignment mark AMM and the light irradiation area L coincide with the zero point of the absolute coordinate system ACS, and the alignment mark AMM and the light irradiation area L has no slope.

FIGS. 5(b)-(d) show the correction using methods A, B and C in step S454.
As shown in FIGS. 5B to 5D, in the initial state of the imprint apparatus 100 according to this embodiment, the absolute coordinate system ACS and the coordinate system LCS match each other. Suppose MCS is deviated from absolute coordinate system ACS and coordinate system LCS.

When performing correction by method A, as shown in FIG. 5B, the position of spatial light modulator 191 is adjusted by actuator 194 based on the measurement result of alignment mark AMM in step S451. done. That is, in method A, the actuator 194 functions as an adjusting means.
As a result, the coordinate system LCS moves closer to the coordinate system MCS due to the movement of the light irradiation area L, that is, the coordinate system LCS, thereby correcting the relative deviation between the coordinate system MCS and the coordinate system LCS.
The number of control axes of the actuator 194 when correcting the position of the spatial light modulation element 191 in method A is preferably three or more, but may be two or less.

Further, when performing correction by method B, as shown in FIG. do
Specifically, in method B, by correcting the control signal from the control unit 170 controlling the spatial light modulation element 191, which is the DMD, the surface direction of each micromirror element forming the DMD can be adjusted individually. adjust. That is, in method B, the control unit 170 functions as an adjusting means.
As a result, the coordinate system LCS moves closer to the coordinate system MCS due to the movement of the light irradiation area L, that is, the coordinate system LCS, thereby correcting the relative deviation between the coordinate system MCS and the coordinate system LCS.
Unlike Method A, Method B can be said to be the simplest method because it is not a correction that adjusts the position of the spatial light modulator 191 by driving the actuator 194, that is, it is not a correction related to a physical system.

Further, when performing correction by method C, as shown in FIG. An adjustment of the position of M is made. That is, in method C, the actuator that moves the mold M functions as the adjustment means.
As a result, the alignment mark AMM, that is, the coordinate system MCS moves to bring the coordinate system MCS closer to the coordinate system LCS, thereby correcting the relative deviation between the coordinate system MCS and the coordinate system LCS.
The number of control axes of the actuator when correcting the position of the mold M in method C is preferably three or more, but may be two or less.

Further, correction can be performed by combining the methods A to C and moving both the coordinate system MCS and the coordinate system LCS.
For example, as shown in FIG. 5(d), the coordinate system MCS is rotationally moved (that is, uniaxial control), while the coordinate system LCS is translated (that is, biaxially controlled). Systems can be matched to each other.

In this case, it is possible to reduce the number of drive shafts for each of the actuators 194 and actuators (not shown) for moving the respective coordinate systems, thereby improving the throughput when moving both coordinate systems.
In addition, since the number of control axes can be assigned to each actuator, the degree of freedom for constructing a mechanism for moving each coordinate system can be improved.

Then, in step S455, a determination is made regarding the end of the correction of the coordinate system in step S450.
Specifically, in step S455, it is determined whether or not the series of processes consisting of steps S452 to S454 has been performed the target number of times N.

If the loop count i is smaller than the target count N (Yes in step S455), the loop count i is incremented by 1 (step S456), and then the process returns to step S452 to perform a series of processes consisting of steps S452 to S454. to continue.
On the other hand, if the loop count i is greater than or equal to the target count N (No in step S455), the series of processes from steps S452 to S454 has been performed for the target count N, so step S450 ends.
Note that the target number of times N for performing the series of processes consisting of steps S452 to S454 may be set in real time, or may be set from an initial set value by the control unit 170. FIG.

As noted above, step S450 uses at least one of methods A, B, and C to determine the relative relationship between the coordinate system MCS and the coordinate system LCS such that the coordinate system MCS and the coordinate system LCS coincide with each other. Correction of the misalignment is performed.
In other words, at least one of the positions of the alignment mark AMM and the light irradiation area L in the XY plane parallel to the substrate surface is adjusted based on the measurement result of the position of the alignment mark AMM by the measurement unit 160 .

Therefore, in the imprint apparatus 100 according to the present embodiment, it is not necessary to measure the position of the light irradiation area L to obtain the deviation amount between the light irradiation area L and the alignment mark AMM.
That is, it is possible to irradiate the light at the optimum position on the predetermined shot area S of the substrate W only by measuring the position of the alignment mark AMM using the measurement unit 160 .

In other words, the imprint apparatus 100 according to the present embodiment does not need to measure the position of the light irradiation area L using other measuring means or the like. Therefore, it is possible to perform the processing for correcting the relative deviation between the coordinate system MCS and the coordinate system LCS in a short time, and to perform the processing for correcting the deviation at a more desired timing.
As a result, the light irradiation region L formed by the light supply unit 190 can be controlled with high accuracy with respect to the mold M and the imprint material R on the predetermined shot region S of the substrate W. FIG.

In the example shown above, each time imprint processing is continuously performed on each of the plurality of shot areas S, the amount of deviation between the coordinate system LCS and the coordinate system MCS is calculated.
However, for the second and subsequent imprint processes, the amount of deviation between the coordinate system MCS ₀ measured in the previous imprint process and the coordinate system MCS ₁ measured in the current imprint process is calculated, The above correction may be performed based on the amount.
In that case, the measurement position of the coordinate system MCS _n when the imprint processing for each shot area S is completed may be stored in the storage unit or the like of the control unit 170 .

Returning to FIG. 4A, in step S460, the control unit 170 controls the driving unit 122 to bring the mold M into contact with the imprint material R. As shown in FIG.
In step S460, the control unit 170 may control the drive mechanism (not shown) of the substrate stage 152 to raise the substrate W, thereby bringing the imprint material R into contact with the mold M.
At this time, the load applied to the contact may be controlled using, for example, a load sensor built in the driving section 122, or may be controlled by referring to the operation amount of the actuator of the driving section 122. FIG.

In step S470, after imprint material R is filled in the pattern formed in the pattern area of mold M, alignment is performed according to the die-by-die alignment method, in other words, the pattern area of mold M and shot area S of substrate W are aligned. align with each other.
Specifically, in the alignment, the alignment scope 161 detects the alignment mark AMM of the type M and the alignment mark AMW on the predetermined shot area S of the substrate W, and then images them.
Then, an image processing device (not shown) measures the relative position between the alignment mark AMM and the alignment mark AMW from the image acquired by the imaging.
After that, the control unit 170 calculates errors (specifically, coordinates, rotation, magnification, trapezoidal components, etc.) of the shot shapes of the mold M and the substrate W based on the measurement results of the relative positions, and The mold M and the substrate W are each aligned so as to reduce errors.

In step S480, the control unit 170 controls the curing unit 110 to irradiate the imprint material R with irradiation light through the mold M, thereby curing the imprint material R. FIG.
In step S490, the control unit 170 controls the mold holding unit 120 or the substrate holding unit 150 to separate the mold M from the cured imprint material R, thereby forming a cured film on the substrate W. FIG.

In step S500, it is determined whether imprint processing has been completed for all shot areas S on the substrate W. FIG.
If the imprint process has not been completed for all the shot areas S on the substrate W (No in step S500), the process returns to step S440 to continue the imprint process.
On the other hand, if the imprint processing has been completed for all the shot areas S on the substrate W (Yes in step S500), the process proceeds to step S510, and the controller 170 controls the transport device (not shown). After the substrate W is unloaded in this manner, the process is terminated.

As described above, the imprint apparatus 100 according to the present embodiment controls at least one of the positions of the alignment mark AMM and the light irradiation area L in the XY plane based on the measurement result of the alignment mark AMM of the mold M.
As a result, the deviation of the coordinate system LCS regarding the light irradiation region L from the coordinate system MCS regarding the mold M can be corrected with high accuracy.

In the imprint apparatus 100 according to the present embodiment, correction of the deviation between the coordinate system LCS regarding the light irradiation region L in the spatial light modulator 191 and the coordinate system MCS regarding the mold M has been described, but the present invention is not limited to this. do not have.
That is, the above-described processing in the imprint apparatus 100 according to the present embodiment is a coordinate system related to the light irradiation area of the irradiation light for curing the imprint material R by the curing unit 110 and the coordinate system MCS related to the mold M. The same can be applied to correction of deviation.

In that case, by adjusting the position of the masking blade for adjusting the light irradiation region by the curing unit 110 and adjusting the position of the mold M, the coordinate system for the light irradiation region by the curing unit 110 and the coordinate system MCS for the mold M misalignment can be corrected.
In addition, the above-described processing is based on the coordinate system and the type M of the light irradiation area of the light emitted from the light source capable of selectively emitting either the light for curing the imprint material R or the light for heating and deforming the substrate W. can be similarly applied to the correction of the deviation from the coordinate system MCS of .

Further, in the imprint apparatus 100 according to the present embodiment, alignment in imprint processing is performed using the measurement unit 160, but the scope 180 may be used instead.
In this case, since the scope 180 can observe all the alignment marks AMW within the predetermined shot area S at once, there is no need to drive the scope 180 for alignment.

[Second embodiment]
FIG. 6A is a flowchart showing imprint processing by the imprint apparatus according to the second embodiment.
Since the imprint apparatus according to this embodiment has the same configuration as the imprint apparatus 100 according to the first embodiment, the same reference numerals are assigned to the same members, and the description thereof is omitted.

In the imprint apparatus 100 according to the first embodiment, after correcting the deviation between the coordinate system LCS for the light irradiation region L and the coordinate system MCS for the mold M in step S450, imprint operations are performed in steps S460 to S480. was
On the other hand, in the imprint apparatus 100 according to the first embodiment, the mold M held by the mold chuck 121 is imprinted during the imprint operation, particularly when the mold M is brought into contact with the imprint material R in step S460. Displacement may occur.

In that case, since the light irradiation area L cannot follow the displacement, there is a possibility that a deviation may occur again between the two coordinate systems.
Therefore, the imprint apparatus according to the present embodiment is configured to perform imprint processing in consideration of reoccurrence of such misalignment, as described below.

In imprint processing by the imprint apparatus according to the present embodiment, steps S410 to S440 are first performed in the same manner as the imprint apparatus 100 according to the first embodiment.

Unlike the imprint apparatus 100 according to the first embodiment, the imprint apparatus according to the present embodiment performs step S550 for correcting the coordinate system and curing of the imprint material R including steps S460 to S480. A series of steps for and are performed in parallel with each other.

FIG. 6B is a flow chart showing the processing in step S550.

As shown in FIG. 6(b), step S550 includes steps S551 to S554.

In step S551, the alignment scope 161 measures the position of the alignment mark AMM.
In step S552, relative deviation between the coordinate system MCS and the coordinate system LCS is calculated based on the measurement result of the position of the alignment mark AMM in step S551.

Then, in step S553, the relative deviation between the coordinate system MCS and the coordinate system LCS calculated in step S552 is corrected.
Note that the specific processing in step S553 is the same as the processing in step S454 in the imprint apparatus 100 according to the first embodiment, so description thereof will be omitted.

Then, in step S554, a determination is made regarding the end of the correction of the coordinate system in step S550.
Specifically, in step S554, it is determined whether the curing of the imprint material R in step S480 is completed.

If the process in step S480 is not completed (No in step S554), the process returns to step S551 to continue the series of processes from steps S551 to S553.
On the other hand, if the process in step S480 has ended (Yes in step S554), step S550 ends.

When correcting the relative deviation between the coordinate system MCS and the coordinate system LCS in step S553, it is necessary to consider that the imprint material R is filled and aligned in step S470. be.
That is, in step S553, it is not preferable to perform the method C of driving the coordinate system MCS, that is, driving the mold M.

In this case, the measurement of the alignment mark AMM by the alignment scope 161 in step S470 and the measurement of the alignment mark AMM by the alignment scope 161 in step S551 are performed in parallel.
Therefore, the above measurements in steps S470 and S551 may be performed independently of each other, or may be performed in one measurement.

Then, in the imprint apparatus according to the present embodiment, steps S490 to S510 are performed in the same manner as in the imprint apparatus 100 according to the first embodiment after step S480 and step S550 are completed.

As described above, in the imprinting apparatus according to the present embodiment, while performing the imprinting operation, the positions of the alignment marks AMM and the light irradiation area L in the XY plane are determined based on the measurement results of the alignment marks AMM of the mold M. Control at least one.
As a result, it is possible to highly accurately correct the deviation of the coordinate system LCS regarding the light irradiation area L from the coordinate system MCS regarding the mold M while considering the deviation that may occur during the execution of the imprint operation. .
In addition, by performing step S550 for correcting the coordinate system and the imprinting operation including steps S460 to S480 in parallel, it is possible to improve the throughput of the imprinting process.

[Product manufacturing method]
A method for manufacturing a device including, for example, a semiconductor integrated circuit element, a liquid crystal display element, or the like as an article forms a pattern on a substrate such as a wafer, a glass plate, or a film-like substrate using the imprint apparatus according to the present embodiment described above. Including process.
Further, the manufacturing method includes etching the patterned substrate.

Note that when manufacturing other articles such as patterned media (recording media) and optical elements, the manufacturing method may include other processes for processing the patterned substrate instead of etching.
The method for manufacturing an article according to the present embodiment is advantageous in at least one of performance, quality, productivity, and production cost of the article compared to conventional methods.

Although preferred embodiments have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist thereof.

The disclosure of this embodiment includes the following configurations and methods.
(Arrangement 1) An imprinting apparatus that forms a pattern by curing a resin in a state in which a pattern area of a mold is in contact with a resin on a shot area of a substrate, wherein the substrate is irradiated with light from a light source. a measuring unit for measuring the position of the mark formed on the mold; and an irradiation area for the position of the mark in a plane parallel to the surface of the substrate based on the measurement result of the mark position by the measuring unit. and a control unit that controls the position of the imprint apparatus.
(Arrangement 2) The imprint apparatus according to Arrangement 1, wherein the control unit controls the position of the irradiation area with respect to the position of the mark without using the position of the irradiation area.
(Arrangement 3) The imprint apparatus according to Arrangement 1 or 2, wherein the element is a spatial modulation element that adjusts an irradiation area of light from a light source.
(Structure 4) The imprint apparatus according to any one of structures 1 to 3, wherein the control unit controls the position of the irradiation region with respect to the position of the mark by adjusting the position of the element.
(Structure 5) The device is a digital micromirror device composed of a plurality of micromirror devices, and the controller adjusts the plane direction of at least one micromirror device to change the irradiation area with respect to the position of the mark. 5. The imprinting apparatus according to any one of configurations 1 to 4, wherein the position is controlled.
(Structure 6) The imprint apparatus according to any one of structures 1 to 5, wherein the control unit controls the position of the irradiation region with respect to the position of the mark by adjusting the position of the mold.
(Structure 7) Any one of structures 1 to 6, wherein the control unit controls the position of the irradiation region with respect to the position of the mark, and then controls the pattern region to come into contact with the resin on the shot region. 1. The imprinting apparatus according to item 1.
(Arrangement 8) The control unit controls the position of the irradiation region with respect to the position of the mark, and controls the pattern region to come into contact with the resin on the shot region, or controls the positions of the pattern region and the shot region to align with each other. 7. The imprinting apparatus according to any one of configurations 1 to 6, wherein:
(Arrangement 9) The imprint apparatus according to any one of Arrangements 1 to 8, wherein the light emitted from the light source heats the substrate without curing the resin, thereby deforming the shot region.
(Arrangement 10) The imprint apparatus according to any one of Arrangements 1 to 8, wherein the light emitted from the light source cures a resin.
(Structure 11) Any one of structures 1 to 8, wherein the light source selectively emits either light that deforms the shot region by heating it without curing the resin or light that cures the resin. 1. The imprinting apparatus according to item 1.
(Method 1) Using the imprint apparatus according to any one of Structures 1 to 11, a step of curing the resin to form a pattern while the pattern region of the mold is in contact with the resin on the shot region of the substrate. and processing a patterned substrate, wherein the article is manufactured from the processed substrate.
(Method 2) An imprinting apparatus that forms a pattern by curing resin in a state in which the pattern area of the mold is in contact with the resin on the shot area of the substrate, wherein the substrate is irradiated with light from a light source. A method for aligning an imprint apparatus having an element that adjusts the position of a mark formed on a mold, the method comprising: measuring the position of a mark formed on a mold; and controlling the position of the illuminated area with respect to the position of the mark in parallel planes.
(Method 3) The alignment method according to Method 2, wherein the step of controlling includes a step of controlling the position of the irradiated area with respect to the position of the mark without using the position of the irradiated area.
(Method 4) The alignment method according to Method 2 or 3, wherein the element is a spatial modulation element that adjusts an irradiation area of light from a light source.
(Method 5) The alignment according to any one of Methods 2 to 4, wherein the step of controlling includes a step of controlling the position of the irradiation region with respect to the position of the mark by adjusting the position of the element. Method.
(Method 6) The element is a digital micromirror device composed of a plurality of micromirror elements, and the step of controlling is to adjust the plane direction of at least one micromirror element so that the irradiation area with respect to the position of the mark 6. A method of alignment according to any one of methods 2 to 5, comprising the step of controlling the position of the .
(Method 7) The alignment according to any one of Methods 2 to 6, wherein the step of controlling includes a step of controlling the position of the irradiation region with respect to the position of the mark by adjusting the position of the mold. Method.
(Method 8) The alignment method according to any one of Methods 2 to 7, wherein the step of bringing the pattern region into contact with the resin on the shot region is performed after the step of controlling.
(Method 9) The alignment method according to any one of Methods 2 to 7, wherein the step of bringing the pattern area into contact with the resin on the shot area is performed while performing the step of controlling.
(Method 10) The alignment method according to any one of Methods 2 to 9, wherein the light emitted from the light source heats the substrate without curing the resin, thereby deforming the shot region.
(Method 11) The alignment method according to any one of Methods 2 to 9, wherein the light emitted from the light source cures the resin.
(Method 12) Any one of methods 2 to 9, wherein the light source selectively emits either light that deforms the shot region by heating it without curing the resin or light that cures the resin. The alignment method according to item 1.

100 imprinting device 160 measurement unit 170 control unit 191 spatial light modulation element (element)
192 light source AMM alignment mark (mark)
L light irradiation area (irradiation area)
M type R imprint material (resin)
S shot region W substrate

Claims (20)

An imprinting apparatus for forming a pattern by curing a resin on a shot area of a substrate while the pattern area of the mold is in contact with the resin,
an element that adjusts an irradiation area of light from a light source that irradiates the substrate;
a measuring unit that measures the position of the mark formed on the mold;
a control unit that controls the position of the irradiation area with respect to the position of the mark in a plane parallel to the surface of the substrate, based on the measurement result of the position of the mark by the measurement unit;
An imprint apparatus comprising: 2. The imprint apparatus according to claim 1, wherein the control unit controls the position of the irradiation area with respect to the position of the mark without using the position of the irradiation area. 2. The imprinting apparatus according to claim 1, wherein the element is a spatial modulation element that adjusts the irradiation area of the light from the light source. 2. The imprinting apparatus according to claim 1, wherein the control unit controls the position of the irradiation area with respect to the position of the mark by adjusting the position of the element. the element is a digital micromirror device composed of a plurality of micromirror elements;
2. The imprinting apparatus according to claim 1, wherein the control unit controls the position of the irradiation area with respect to the position of the mark by adjusting the plane direction of at least one micromirror element. 2. The imprinting apparatus according to claim 1, wherein the controller controls the position of the irradiation area with respect to the position of the mark by adjusting the position of the mold. 2. The method according to claim 1, wherein after controlling the position of the irradiation region with respect to the position of the mark, the control unit controls the pattern region to come into contact with the resin on the shot region. imprint device. The control unit controls the position of the irradiation region with respect to the position of the mark while controlling the pattern region to come into contact with the resin on the shot region, or controls the positions of the pattern region and the shot region relative to each other. 2. The imprinting apparatus according to claim 1, wherein control for matching is performed. 2. The imprinting apparatus according to claim 1, wherein the light emitted from the light source heats the substrate without curing the resin, thereby deforming the shot region. 2. The imprinting apparatus according to claim 1, wherein the light emitted from the light source cures the resin. 2. The interior according to claim 1, wherein the light source selectively emits either light for deforming the shot region by heating without curing the resin or light for curing the resin. printing device. forming a pattern by curing the resin while the pattern region of the mold is in contact with the resin on the shot region of the substrate using the imprint apparatus according to any one of claims 1 to 11;
processing the substrate on which the pattern is formed;
and manufacturing an article from the processed substrate. An imprinting apparatus for forming a pattern by curing a resin on a shot area of a substrate while the pattern area of the mold is in contact with the resin on the shot area, wherein the irradiation area of the light emitted from the light source on the substrate is adjusted. An alignment method in an imprint apparatus comprising an element for
measuring the position of the mark formed on the mold;
a step of controlling the position of the irradiation region with respect to the position of the mark in a plane parallel to the surface of the substrate, based on the measurement result of the position of the mark in the measuring step;
A registration method, comprising: 14. The alignment method of claim 13, wherein the step of controlling comprises controlling the position of the illuminated area relative to the position of the mark without using the position of the illuminated area. 14. The alignment method according to claim 13, wherein the element is a spatial modulation element that adjusts the irradiation area of the light from the light source. 14. The alignment method according to claim 13, wherein the step of controlling comprises controlling the position of the illuminated area with respect to the position of the mark by adjusting the position of the element. the element is a digital micromirror device composed of a plurality of micromirror elements;
14. The alignment method according to claim 13, wherein the step of controlling includes the step of controlling the position of the irradiation area with respect to the position of the mark by adjusting a plane direction of at least one micromirror element. . 14. The alignment method according to claim 13, wherein the step of controlling comprises controlling the position of the irradiation area with respect to the position of the mark by adjusting the position of the mold. 19. The alignment method according to any one of claims 13 to 18, wherein a step of bringing said pattern region into contact with said resin on said shot region is performed after said step of controlling. 19. The alignment method according to claim 13, wherein the step of bringing the pattern area into contact with the resin on the shot area is performed while performing the step of controlling.

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