JP2023028162A - Substrate and substrate manufacturing method - Google Patents

Abstract

To improve the strength of a substrate and to provide a manufacturing method for the substrate.SOLUTION: A rolled metal layer includes a rolled metal circuit made of a rolled conductor, a reinforcing structure made of the rolled conductor, and an insulator made of an insulating resin, and the rolled metal circuit and the reinforcing structure are provided in the same plane, and the reinforcing structure includes a rolled metal layer that reinforces the mechanical strength of the substrate and is placed around the rolled metal circuit and separated by the insulator. According to the present invention, the rolled metal circuit made of the rolled conductor and the reinforcing structure made of the rolled conductor are provided on the same plane and separated by the insulating resin, thereby increasing the rigidity, which is the mechanical strength of the substrate.SELECTED DRAWING: Figure 1

Description

The present invention increases the strength of the circuit layers that make up the substrate, and increases the mechanical strength of the entire substrate.

In Patent Document 1, a conductor (copper foil) is half-etched from one side, the half-etched portion is filled with insulating resin, and then the conductor is half-etched from the other side and filled with insulating resin. A substrate is described.

JP 2010-278379 A

In the substrate described in Patent Document 1, the recesses of the conductors provided by half-etching are filled with an insulating resin. Therefore, unlike conventional printed boards, it does not have a base material consisting of a sheet body made of glass fiber and an insulating resin. There is a possibility that a disconnection of the circuit may occur due to the bending of the wire.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve the mechanical strength of a substrate and to provide a method for manufacturing the substrate.

As a result of intensive studies on the above problem, the inventors of the present invention provided a rolled metal circuit made of a rolled conductor and a reinforcing structure made of a rolled conductor on the same plane, and separated them with an insulating resin. The inventors have found that the mechanical strength of the substrate can be improved, and completed the present invention.

A substrate of the present invention for solving the above problems has a rolled metal layer comprising a rolled metal circuit made of a rolled conductor, a reinforcing structure made of a rolled conductor, and an insulator made of an insulating resin. The rolled metal circuit and the reinforcing structure are provided in the same plane, and the reinforcing structure reinforces the mechanical strength of the substrate and is surrounded by an insulator so as to surround the rolled metal circuit. and having rolled metal layers spaced apart by .
According to the substrate of the present invention, since the reinforcing structure is provided on the same plane as the rolled metal circuit, there is an effect that the mechanical strength of the substrate can be improved.

Furthermore, as one embodiment of the substrate of the present invention, the reinforcing structure is characterized in that it has a mesh shape extending in a planar direction.
According to this substrate, since the reinforcing structure has a mesh shape extending in the plane direction, it is possible to suppress the expansion and contraction of the dimension in the plane direction, thereby suppressing the warping of the entire substrate.

Furthermore, as one embodiment of the substrate of the present invention, the reinforcing structure is characterized by being a plate-like continuous body (also referred to as a solid shape in this specification) extending in a plane direction. .
According to this substrate, since the reinforcing structure is a plate-like continuous body extending in the planar direction, it is possible to further improve the rigidity of the entire substrate.

Further, as an embodiment of the substrate of the present invention, the rolled metal circuit comprises a rolled metal circuit extending in the plane direction and a rolled metal circuit provided at one end of the rolled metal circuit and extending in the plate thickness direction. The flat circuit of the rolled metal body and the circuit between the rolled metal bodies are formed from the same rolled metal body, and are formed of a conductor having no connection surface.
According to this substrate, since there is no connecting surface between the flat circuit of the rolled metal and the inter-layer circuit of the rolled metal, there is no electrical resistance due to the presence of the connecting surface. Therefore, even if electricity flows, there is an effect that heat generation due to the presence of the connection surface can be suppressed.
In addition, since there is no connecting surface between the flat circuit of the rolled metal and the inter-layer circuit of the rolled metal, even if heat is repeatedly applied and thermal expansion is repeated, the circuit will not separate from the connecting surface. .

Further, as one embodiment of the substrate of the present invention, the rolled metal body circuit is connected to a laminated circuit, and the laminated circuit comprises an electrolytic metal body planar circuit extending in a plane direction and one end of the electrolytic metal body planar circuit. The electrolytic metal body planar circuit and the electrolytic metal body interlayer circuit are formed from the same electrolytic metal body, and are formed of a conductor having no connection surface. characterized by being
According to this substrate, since there is no connection surface between the electrolytic metal body planar circuit and the electrolytic metal body interlayer circuit, there is no electrical resistance due to the existence of the connection surface. Therefore, there is an effect that even if electricity flows, heat generation can be suppressed.
In addition, since there is no connecting surface between the electrolytic metal planar circuit and the electrolytic metal interlayer circuit, even if heat is repeatedly applied and thermal expansion is repeated, the circuit will not separate from the connecting surface. .

Furthermore, an embodiment of an electronic device having a substrate according to the present invention is characterized in that a rolled metal circuit and an electronic component are connected so that electricity can flow.
According to the electronic device having this substrate, the rigidity of the substrate can be improved by providing the reinforcing structure on the same plane as the rolled metal circuit.

Further, an embodiment of an electronic device having a substrate according to the present invention is characterized in that a rolled metal circuit and an electronic component are connected so as to allow heat to flow.
According to an electronic device having this substrate, the rigidity of the substrate as a whole can be improved, and heat generated when the electronic component operates is transferred to the rolled metal circuit, thereby reducing the temperature of the electronic component. There is an effect that can be kept low.

Furthermore, one embodiment of the electronic device having the substrate of the present invention is characterized in that the electronic component, the electrolytic metal layer and the rolled metal circuit are connected so as to allow heat to flow.
According to an electronic device having this substrate, the rigidity of the substrate as a whole can be improved. There is an effect that the temperature of the electronic parts can be kept low.

Further, in one embodiment of the electronic device having the substrate of the present invention, the electrolytic metal layer is exposed on the surface of the substrate and is characterized by releasing heat to the opposite side of the rolled metal circuit.
According to an electronic device having this substrate, the rigidity of the substrate as a whole can be improved, and heat generated when the electronic component operates is transferred from the electrolytic metal layer exposed on the surface of the substrate to the rolled metal circuit. Since heat is radiated to the opposite side, there is an effect that the temperature of the electronic parts can be kept low.

Furthermore, one embodiment of an electronic device having a substrate according to the present invention is characterized in that heat flows from the rolled metal circuit through the insulator to the reinforcing structure.
According to an electronic device having this substrate, the rigidity of the substrate as a whole can be improved, and heat generated when the electronic component operates is transferred from the rolled metal circuit to the reinforcing structure via the insulator. By moving, there is an effect that the temperature of the electronic parts can be kept low.

A substrate manufacturing method for solving the above problems includes a rolled conductor preparation step, a first resist forming step, a first etching step, a first insulating resin filling step, a second resist forming step, a second and an etching step.
According to the substrate manufacturing method of the present invention, since the reinforcing structure is provided on the same plane as the rolled metal circuit, the substrate manufacturing method can improve the rigidity of the substrate.

According to the present invention, a rolled metal circuit made of a rolled conductor and a reinforcing structure made of a rolled conductor are provided on the same plane and separated by an insulating resin, thereby improving the rigidity of the substrate. He found the headline and completed the present invention.

FIG. (A) is a schematic diagram showing a state in which the substrate of the first embodiment of the present invention is cut in the thickness direction. (B) is a schematic diagram showing a cross section taken along line AA in FIG. (A). FIG. 4 is a diagram showing a manufacturing process of the substrate according to the first embodiment of the present invention; FIG. 4 is a diagram showing a manufacturing process of the substrate according to the first embodiment of the present invention; FIG. 4 is a diagram showing a manufacturing process of the substrate according to the first embodiment of the present invention; FIG. 4 is a diagram showing a manufacturing process of the substrate according to the first embodiment of the present invention; (A) is a schematic diagram showing a state in which a substrate of a modification of the first embodiment of the present invention is cut in the thickness direction. (B) is a schematic diagram showing a cross section taken along line AA in FIG. (A). (A) is a schematic diagram showing a state in which a substrate according to a second embodiment of the present invention is cut in the thickness direction. (B) is a schematic diagram showing a cross section taken along line AA in FIG. (A). It is a schematic diagram which shows the state which cut|disconnected the board|substrate of the 3rd embodiment of this invention in the board|plate thickness direction. It is a figure which shows the manufacturing process of the board|substrate of the 3rd embodiment of this invention. It is a schematic diagram which shows the state which cut|disconnected the board|substrate of the 4th embodiment of this invention in the board|plate thickness direction. It is a schematic diagram which shows the state which cut|disconnected the board|substrate of the 4th embodiment of this invention in the board|plate thickness direction. It is a schematic diagram which shows the state which cut|disconnected the board|substrate of the modification of the 1st embodiment of this invention in the plane direction. It is a schematic diagram which shows the state which cut|disconnected the board|substrate of the modification of the 2nd embodiment of this invention in the plane direction. FIG. 2 is a schematic diagram showing a state in which electronic components are installed on a substrate according to the first embodiment of the present invention; FIG. 11 is a perspective view showing a substrate of a modification of the fourth embodiment of the present invention; FIG. 16 is a schematic view showing an AA cross section cut in the thickness direction of FIG. 15;

DETAILED DESCRIPTION OF THE INVENTION Embodiments of a substrate and a method for manufacturing the same according to the present invention will be described in detail below with reference to the drawings.
It should be noted that the substrate and the method for manufacturing the substrate described in the embodiments are merely exemplified for explaining the substrate and the method for manufacturing the substrate according to the present invention, and the present invention is not limited to this.

The substrate of the present invention has a conductor and an insulator, and the conductor, which is the circuit of the substrate, and the electronic component are connected so as to allow electricity to flow to constitute an electronic device.
The substrate of the present invention can be an electronic device with improved rigidity of the substrate by providing the reinforcing structure on the same plane as the rolled metal circuit.
The conductor, which is the circuit of the substrate of the present invention, consists of a rolled conductor and a conductor prepared by plating. The conductor is not particularly limited as long as it can conduct electricity better than the insulator. In addition, hereinafter, the rolled conductor may be referred to as a rolled conductor. A conductor produced by plating is sometimes called an electrolytic conductor. Further, in this specification, a layer including a circuit formed of an electrolytic conductor is referred to as an electrolytic metal layer.

Rolled conductors are manufactured by inserting an ingot of conductor, which is the raw material, between two rotating rolls, stretching the ingot while crushing it, and thinning it to the desired thickness. It is a good conductor. Specifically, a rolled copper plate or a rolled aluminum plate corresponds. Note that the present invention is not limited to the rolled plate, and it is also possible to use a rolled copper ingot or a rolled aluminum ingot.

The electrolytic conductor is not particularly limited as long as it is a conductor produced by plating, but a specific example thereof is copper plating.

A rolled conductor has a layered metal structure extending in the direction of rolling (when a plate-shaped conductor is used, the plane (XY axis) direction of the substrate). Also, due to the heat treatment in the process of manufacturing the substrate, the crystal grains are almost equiaxed.
On the other hand, an electrolytic conductor formed by plating is characterized by a columnar metal structure in the thickness direction (Z-axis direction).
A rolled conductor and an electrolytic conductor have these differences in characteristics. Therefore, even if the materials are the same, the rolled conductor has the effect of improving the rigidity of the substrate more than the electrolytic conductor due to the difference in these characteristics.

[First embodiment]
<substrate>
With reference to FIG. 1, the structure of the substrate according to the mode for carrying out the invention will be described. The substrate 1 of the present invention has a circuit layer containing conductors and insulators.
The substrate 1 of the present invention is provided with a plurality of stacked circuit layers, and the circuit layers correspond to the rolled metal layer 2 and the electrolytic metal layers 3 and 4 .
Electrolytic metal layers 3 and 4 are provided on the surface of the rolled metal layer 2 to form the substrate 1 of the present invention.

≪Rolled metal layer≫
The rolled metal layer 2 has a rolled metal circuit 21 made of a rolled conductor, a reinforcing structure 22 made of a rolled conductor, and an insulator 23 made of insulating resin. In this specification, the rolled metal layer 2 is also expressed as an insole.
The rolled metal circuit 21 plays a role through which electricity flows, and is connected to electronic components via the electrolytic metal layer 3 . The rolled metal circuit 21 and the reinforcing structure 22 are provided on the same plane (XY axis direction in FIG. 1), and the reinforcing structure 22 continuously surrounds the rolled metal circuit 21. are separated by an insulator 23 as shown in FIG. Also, the rolled metal circuit 21 and the reinforcing structure 22 are manufactured from the same rolled conductor.

Since the reinforcing structure 22 is arranged so as to continuously surround the rolled metal circuit 21, the rigidity of the rolled metal layer 2 is improved compared to the case where the reinforcing structure 22 is not provided. Therefore, there is an effect of improving the rigidity of the entire substrate 1 having the rolled metal layer 2 . This effect is achieved by the fact that the rolled metal circuit 21 and the reinforcing structure 22 are rolled conductors and are provided in the same layer.
Furthermore, since the reinforcing structure 22 is arranged so as to surround the rolled metal circuit 21, the reinforcing structure arranged so as to surround the rolled metal circuit 21 when electricity is supplied to the rolled metal circuit 21 and heat is generated. Conducting heat to the body 22 also has the effect of dissipating the heat generated in the rolled metal body circuit 21 . Note that the heat includes heat generated from electronic components to which electricity is supplied, and heat generated from resistance due to connection surfaces with the electrolytic metal layers 3 and 4 connected to the rolled metal circuit 21 .

[Rolled metal circuit]
The rolled metal circuit 21 has a rolled metal planar circuit 211 , a rolled metal interlayer circuit 212 , and a rolled metal interlayer circuit 213 .

The rolled metal circuit 21 includes a rolled metal flat circuit 211 extending in the plane direction (XY axis direction in FIG. 1) and a plate thickness direction (in FIG. 1) provided at one end of the rolled metal flat circuit 211. and a rolled metal interlayer circuit 212 extending in the Z-axis direction). The rolled metal planar circuit 211 and the rolled metal interlayer circuit 212 are formed from the same rolled metal, and are formed of conductors without connecting surfaces.
In other words, the rolled metal plane circuit 211 and the rolled metal interlayer circuit 212 are formed of a single conductor without connecting surfaces.
Between the rolled metal plane circuit 211 and the rolled metal interlayer circuit 212, there is no connecting surface in the planar direction and the plate thickness direction. Therefore, there is no electrical resistance due to the presence of the connection surface, and even if electricity flows, heat generation due to the presence of the connection surface can be suppressed. In addition, there is also an effect that it is possible to suppress poor connection by peeling off from the connection surface.

Further, the rolled metal circuit 21 has a rolled metal flat circuit 211 extending in the plane direction, and a rolled metal interlayer circuit 213 provided on the other end side of the rolled metal flat circuit 211 and extending in the plate thickness direction. . The rolled metal plane circuit 211 and the rolled metal interlayer circuit 213 are formed from the same rolled metal, and are formed of conductors having no connecting surfaces.
In other words, the rolled metal plane circuit 211 and the rolled metal layer-to-layer circuit 213 are formed of a single conductor without connecting surfaces.
Between the rolled metal plane circuit 211 and the rolled metal interlayer circuit 213, there is no connecting surface in the planar direction and the plate thickness direction. Therefore, there is no electrical resistance due to the presence of the connection surface, and even if electricity flows, heat generation due to the presence of the connection surface can be suppressed. In addition, there is also an effect that it is possible to suppress poor connection by peeling off from the connection surface.

[Reinforcing structure]
The reinforcement structure 22 has the function of improving the rigidity of the rolled metal layer 2 by being provided on the same plane as the rolled metal circuit 21 .
The reinforcing structure 22 reinforces the mechanical strength of the substrate. Note that the mechanical strength refers to the rigidity of the substrate. Furthermore, by having the reinforcing structure 22, there is also an effect of suppressing warping of the substrate or suppressing a change in dimension in the plane direction due to thermal expansion. Further, the reinforcing structure 22 also serves to dissipate heat from the rolled metal circuit 21 by receiving heat generated when electricity is applied to the rolled metal circuit 21 .

By providing the reinforcing structure 22 on the same plane as the rolled metal circuit 21, there is an effect that the rigidity of the rolled metal layer 2 is improved as compared with the case where the reinforcing structure 22 is not provided. The shape of the reinforcing structure 22 is not particularly limited, but if it has the same thickness (height) as the rolled metal circuit 21, it is preferable in terms of strength improvement.

The reinforcing structure 22 has a plurality of first structure portions 221 , a plurality of second structure portions 222 and a plurality of crossing portions 223 . In other words, the reinforcing structure 22 is a net-like structure extending in the plane direction.
The first structure portion 221 is a rolled conductor extending in one direction (the X-axis direction in FIG. 1) on a plane.
The second structure portion 222 is a rolled conductor extending in a direction intersecting one direction (Y-axis direction in FIG. 1).
The intersection portion 223 is the intersection point between the first structure portion 221 and the second structure portion 222 . The intersecting portion 223 is made of a single rolled conductor with no connection surface, and between the first structure portion 221 and the second structure portion 222, there is no connection surface in the planar direction and the plate thickness direction. .
Insulators 23 are filled in gaps surrounded by the plurality of first structure portions 221 and the plurality of second structure portions 222 . In other words, the reinforcing structure 22 is formed in a mesh shape, and the gaps in the mesh are filled with the insulator 23 .

When the reinforcing structure 22 has a net-like structure extending in the plane direction, the coefficient of thermal expansion of the rolled conductor of the substrate 1 and the coefficient of thermal expansion of the insulator are higher than that of the rolled conductor. However, the coefficient of thermal expansion of the insulator is larger than that of the insulator. Therefore, when heat is applied to the entire substrate 1, by forming the reinforcing structure 22 into a net-like structure, expansion and contraction of the dimensions in the plane direction are suppressed compared to the case where the reinforcing structure 22 is not provided. can do. Therefore, there is an effect that the warpage of the entire substrate 1 can be suppressed.
Further, by forming the reinforcing structure 22 in a mesh shape, the weight of the substrate can be reduced as compared with the case where the reinforcing structure 22 is formed in a plate-like continuous body (solid shape) so as to extend in the plane direction.

Although the reinforcing structure 22 has a net-like structure extending in the plane direction, as shown in FIG. A structure 301 may be used.
The reinforcement structure 301 having this structure has the effect of increasing the rigidity of the entire substrate having the rolled metal layer 2 . In addition, since the dimensional change due to the difference between the coefficient of thermal expansion of the rolled metal body and the coefficient of thermal expansion of the insulator can be reduced, there is an effect that the dimensional accuracy of the substrate can be increased. The dimensional accuracy of the substrate is defined as the substrate dimension in the plane direction when the temperature of the substrate rises or falls, and the substrate dimension in the plane direction when the temperature of the substrate is normal temperature (25° C.), and the difference between them is small. This is called a large substrate size. When the dimensional accuracy of the substrate is high, even if the temperature of the substrate changes, the expansion and contraction in the planar direction is small, which is effective in suppressing disconnection of the circuit and warping of the substrate.
Note that the mesh-like reinforcing structure 22 may be combined with the reinforcing structure 301, which is a plate-like continuous body extending in the plane direction.

Further, the reinforcing structure 22 is arranged so as to surround the rolled metal circuit 21 while being separated by an insulator 23 . By arranging the reinforcing structure 22 so as to surround the rolled metal circuit 21, the heat generated when electricity is applied to the rolled metal circuit 21 is evenly distributed toward the reinforcing structure 22 in the plane direction. , and the heat is transferred to the reinforcing structure 22 . Therefore, there is an effect of uniformly dissipating heat from the rolled metal circuit 21 . Therefore, unevenness of the thermal expansion of the rolled metal circuit 21 in the planar direction can be suppressed, and warpage of the substrate 1 can be suppressed.

Incidentally, as shown in FIG. 1B, the distance 224 in one direction is the distance in one direction (X-axis direction in FIG. 1) on the plane between the reinforcing structure 22 and the rolled metal circuit 21. be.
In other words, the distance 224 in one direction is the distance between the rolled metal circuit 21 and the second structure portion 222 .
The distance 225 in the other direction is the distance in the direction (Y-axis direction in FIG. 1) intersecting the one direction on the plane between the reinforcing structure 22 and the rolled metal circuit 21 .
In other words, the distance 225 in the other direction is the distance between the rolled metal circuit 21 and the first structure portion 221 .
The distance between the distance 224 in one direction and the distance 225 in the other direction is not particularly limited. However, it is preferable that the distance be such that insulation from the reinforcing structure 22 can be ensured when electricity is applied to the rolled metal circuit 21 and that heat is transferred to the reinforcing structure 22 via the insulator 23 .

From the viewpoint of ensuring insulation between the rolled metal circuit 21 and the reinforcing structure 22, the distance 224 in one direction and/or the distance 225 in the other direction is 15 μm or more.
Also, from the viewpoint of ease of heat transfer between the rolled metal circuit 21 and the reinforcing structure 22, the distance 224 in one direction and/or the distance 225 in the other direction can be 300 μm or less.
Note that from the viewpoint of both ensuring insulation between the rolled metal circuit 21 and the reinforcing structure 22 and from the viewpoint of heat transfer, the distance 224 in one direction and/or the distance 225 in the other direction is The value is preferably 25 μm or more, more preferably 40 μm or more, most preferably 50 μm or more, and the upper limit is preferably 200 μm or less, more preferably 170 μm or less, and most preferably 150 μm or less.

Also, the ratio of the distance 224 in one direction to the distance 225 in the other direction is not particularly limited. :1 to 1:2 are applicable.
The ratio of the distance 224 in one direction and the distance 225 in the other direction is preferably 1.5:1 to 1:1.5, more preferably 1.3:1 to 1:1.3. and most preferably from 1.1:1 to 1:1.1 or more.
The ratio of the distance 224 in one direction to the distance 225 in the other direction is the same or similar so that heat is evenly transferred from the rolled metal circuit 21 to the reinforcement structure 22 in the planar direction. Therefore, there is an effect that the rolled metal circuit 21 facilitates uniform heat dissipation in the planar direction.

Moreover, the volume of the reinforcing structure 22 is preferably equal to or greater than the volume of the rolled metal circuit 21 . The reinforcing structure 22 can receive much heat generated in the rolled metal circuit 21, and the heat radiation effect of the rolled metal circuit 21 can be increased.
Furthermore, it is more preferable that the volume of the reinforcing structure 22 is larger than the sum of the volume of the rolled metal circuit 21 and the volume of the conductors of the electrolytic metal layers 3 and 4, which will be described later. It is more preferable because the reinforcing structure 22 can receive a large amount of heat generated in the entire circuit by the electricity flowing through the entire circuit of the substrate 1 .

〔Insulator〕
The insulator 23 has a function of insulating electricity flowing through the conductor.
Ink or powder thermosetting resin can be used for the insulator 23 . The ink-like or powder-like thermosetting resin preferably contains a filler. The filler is a filler that does not have electrical conductivity, and it is preferable to use a filler that has a higher thermal conductivity than the ink-like thermosetting resin.

The insulator 23 has an insulating resin 231, an insulating resin 232, an insulating resin 233, and an insulating resin 234, as shown in FIG. 4C. In the present invention, the insulator 23 of the rolled metal layer 2 does not have a sheet-shaped reinforcing member that is woven with glass fibers and spreads in the plane direction for reinforcing the substrate 1 . An additive called a filler that is added for the purpose of improving the strength of the insulating resin may be contained.
The insulating resin 231 is an insulating resin that fills the concave portion 51 provided in the rolled conductor from one side in the plate thickness direction (the Z-axis direction in FIG. 1). The insulating resin 232 is an insulating resin that fills the concave portion 52 provided in the rolled conductor from the other side in the plate thickness direction.
The insulating resin 231 and the insulating resin 232 have a connecting surface 235 extending in the plane direction. Moreover, the connecting surface 235 is provided at the central portion of the reinforcing structure 22 in the plate thickness direction.
The insulating resin 233 is the insulating resin that fills the recessed portion 53 provided on one side surface (upper surface side) of the rolled metal planar circuit 211 and the recessed portion 55 provided on one side surface of the reinforcing structure 22 . is. The insulating resin 233 has a connecting surface 236 extending in the plate thickness direction with the insulating resin 231 .
The insulating resin 234 is the insulating resin that fills the recessed portion 54 provided on the other side surface (lower surface side) of the rolled metal planar circuit 211 and the recessed portion 56 provided on the other side surface of the reinforcing structure 22 . is. The insulating resin 234 has a connection surface 237 extending in the plate thickness direction with the insulating resin 232 .

≪Electrolytic metal layer≫
The electrolytic metal layer 3 and the electrolytic metal layer 4 are circuits laminated on the surface of the rolled metal layer 2 .
The electrolytic metal layers 3 and 4 are electrolytic conductors, which are conductors created by plating. The type of conductor is not particularly limited as long as it is an electrolytic conductor, but copper plating can be preferably used.
The electrolytic conductor of the electrolytic metal layer 3 is electrically connected to the rolled metal interlayer circuit 212 . Also, the electrolytic conductor of the electrolytic metal layer 4 is electrically connected to the rolled metal interlayer circuit 213 .
The electrolytic metal layer 3 comprises an electrolytic metal body planar circuit 31 extending in the planar direction. The electrolytic metal layer 4 also includes an electrolytic metal body planar circuit 41 extending in the planar direction.
Electrolytic metal body planar circuit 31 is located on the outermost side of substrate 1 in the plate thickness direction, and is in contact with and connected to electronic components so that electricity can flow. The electrolytic metal body planar circuit 41 on the side opposite to the electrolytic metal body planar circuit 31 is located on the outermost side in the plate thickness direction of the substrate 1 and is electrically connected to electronic components.
The rolled metal circuit 21 and the electronic component are connected to each other through the electrolytic metal planar circuit 31 or the electrolytic metal planar circuit 41 so that electricity can flow.

[Substrate manufacturing method]
Next, referring to FIG. 2, a method for manufacturing the substrate 1 of the present invention will be described.
First, a rolled conductor 5 is prepared. This step is referred to as a rolling conductor preparation step.

Next, as shown in FIG. 2A, the surface of the rolled conductor 5 is provided with an etching resist. A step of covering the part to be the reinforcing structure 22 and the part to be the rolled metal circuit 21 with an etching resist 57 is performed on one side surface of the rolled conductor 5 . This step is referred to as a first resist forming step.
In addition, in the first resist forming step, the entire surface of the rolled conductor 5 on the other side is also protected by the etching resist 57 .

Next, the rolled conductor 5 is etched while covered with the etching resist 57 of the first resist forming step. This step is referred to as a first etching step. By this step, a recess 51 is formed in one side surface of the rolled conductor 5 . Then, the etching resist 57 provided in the first resist step is removed, resulting in the state shown in FIG. 2(B).

Next, as shown in FIG. 2C, a step of filling the recessed portion 51 on one side with an insulating resin 231 is performed. This step is referred to as a first insulating resin filling step.
After the step of filling the first insulating resin, one surface is smoothed so that the insulating resin 231 and the rolled conductor 5 are flat. This step is referred to as a first surface leveling step.

As shown in FIG. 3A, on the other surface of the rolled conductor 5, a step of covering the portion to be the reinforcing structure 22 and the portion to be the rolled metal circuit 21 with an etching resist 58 is performed. . This step is referred to as a second resist forming step.
In addition, in the second resist forming step, the entire surface of one side of the rolled conductor 5 is also protected by the etching resist 58 .

Next, the rolled conductor 5 is etched while covered with the etching resist 58 of the second resist forming step. This step is referred to as a second etching step. By this step, a recessed portion 52 is formed on the surface of the rolled conductor 5 on the other side. Then, the etching resist 58 provided in the second resist step is removed, resulting in the state shown in FIG. 3(B). The recessed portion 52 is etched so that the insulating resin 231 is exposed. Also, by this process, the rolled metal circuit intermediate 214 and the net-like reinforcing structure intermediate 226 are formed.

Next, as shown in FIG. 3C, a step of filling the recessed portion 52 on the other side with an insulating resin 232 is performed. This step is referred to as a second insulating resin filling step. Through this step, the rolled metal layer intermediate 24 is obtained.
After the second insulating resin filling step, the surface on the other side is smoothed so that the insulating resin 232 and the rolled conductor 5 are flat. This step is referred to as a second surface leveling step.

Next, as shown in FIG. 4(A), the portion to be the rolled metal interlayer circuit 212 on one side surface of the rolled metal circuit intermediate 214 is covered with an etching resist 59 . Also, the part to be the rolled metal interlayer circuit 213 on the other side surface of the rolled metal circuit intermediate 214 is covered with the etching resist 59 . This process is referred to as a third resist forming process.

Next, the rolled conductor 5 is half-etched while covered with the etching resist 59 of the third resist forming step. This step is referred to as a third etching step.
By this step, as shown in FIG. 4B, the rolled metal circuit intermediate 214 is provided with the recesses 53 and 54, and the rolled metal circuit 21 is formed. Further, the reinforcing structure intermediate body 226 is provided with the recessed portion 55 and the recessed portion 56 to form the reinforcing structure 22 .

Next, a step of filling the recesses 53 and 55 with the insulating resin 233 and filling the recesses 54 and 56 with the insulating resin 234 is performed. This step is referred to as a third insulating resin filling step. By this process, the rolled metal layer 2 is formed, and the state shown in FIG. 4(C) is obtained.
After the third insulating resin filling step, the surface on one side is smoothed so that the insulating resin 233 on the one side and the rolled metal interlayer circuit 212 are flat. In addition, the surface on the other side is smoothed so that the insulating resin 234 on the other side and the rolled metal interlayer circuit 213 are flat. This process is referred to as a third surface leveling process.

Next, as shown in FIG. 5A, an electrolytic conductor 6 is provided on the surface of the rolled metal layer 2 by plating. This process is referred to as the outermost layer plating process.

Next, as shown in FIG. 5B, the outermost circuit portion of the electrolytic conductor is covered with an etching resist 65 . This step is referred to as the outermost layer resist forming step.
Then, the electrolytic conductor 6 is etched while covered with the etching resist 65 in the outermost layer resist forming step. An electrolytic metal planar circuit 31 as the outermost layer is formed on one side surface to form the electrolytic metal layer 3 . On the other side, an electrolytic metal body planar circuit 34 as the outermost layer is formed to form the electrolytic metal layer 4 . After that, the etching resist 65 is removed, and the substrate 1 shown in FIG. 1(A) is obtained.
After that, a solder resist is applied to form the substrate 1 with its surface protected.

[Second embodiment]
<substrate>
With reference to FIG. 7, the structure of the substrate according to the mode for carrying out the invention will be described. The same reference numerals are assigned to the same structures as those of the substrate 1 of the first embodiment, and the description thereof is omitted. The substrate 12 of the present invention differs from the substrate 1 of the first embodiment in the shape of the reinforcing structure.
In this embodiment, the reinforcement structure 25 is arranged so as to continuously surround the rolled metal circuit 21, and is a net-like reinforcement structure extending in the plane direction like the reinforcement structure 22 of the first embodiment. It is not.
Even in the present embodiment, since the rolled metal layer 2 has the reinforcing structure 25, there is an effect of improving the rigidity of the rolled metal layer 2 compared to the case where the reinforcing structure 25 is not provided. . In addition, it has the heat dissipation property of the rolled metal circuit 21 as in the first embodiment.
[Substrate manufacturing]
Regarding the manufacturing method of the substrate, in the first resist forming process and the second resist forming process, etching resists are provided so as to form the shape of the reinforcing structure 25, so that the substrate is manufactured in the same manner as in the first manufacturing method. can be done.

[Third Embodiment]
Referring to FIG. 8, the structure of the substrate 13 according to the mode for carrying out the invention will be described. The same reference numerals are given to the same structures as those of the substrate 1 of the first embodiment, and the description thereof is omitted. The substrate 13 of the present invention has a rolled metal circuit 26 instead of the rolled metal circuit 21 of the substrate 1 of the first embodiment.
Moreover, it differs from the first embodiment in that an electrolytic metal layer 7 and an electrolytic metal layer 8 are provided.
Also, the electrolytic metal layer 3 and the electrolytic metal layer 4 are arranged on the outermost side of the substrate 13 .

[Rolled metal circuit]
The rolled metal circuit 26 has a rolled metal interlayer circuit 261 extending in the plate thickness direction. In other words, the rolled metal circuit 26 does not have a structure corresponding to the rolled metal planar circuit 211 of the rolled metal circuit 21 of the first embodiment.

[Electrolytic metal layer]
The electrolytic metal layer 7 has an electrolytic metal interlayer circuit 72 made of an electrolytic conductor 71 and an insulator 73 . The insulator 73 is an insulating resin 76, and the same insulating resin as in the first embodiment can be used.
Electrolytic metal layer 7 is arranged between rolled metal layer 2 and electrolytic metal layer 3 . The electrolytic metal interlayer circuit 72 is electrically connected across the rolled metal circuit 26 and the electrolytic metal planar circuit 31 of the electrolytic metal layer 3 .
Further, the connection surface between the electrolytic metal layer-to-layer circuit 72 and the rolled metal circuit 26 has a connection surface in the planar direction, but does not have a connection surface in the plate thickness direction. The electrolytic metal interlayer circuit 72 and the electrolytic metal planar circuit 31 have connection surfaces in the planar direction, but do not have connection surfaces in the plate thickness direction.

The electrolytic metal layer 8 has an electrolytic metal interlayer circuit 82 made of an electrolytic conductor 81 and an insulator 83 . The insulator 83 is an insulating resin 86, and the same insulating resin as in the first embodiment can be used.
Electrolytic metal layer 8 is arranged between rolled metal layer 2 and electrolytic metal layer 4 . The electrolytic metal interlayer circuit 82 is electrically connected across the rolled metal circuit 26 and the electrolytic metal planar circuit 41 of the electrolytic metal layer 4 .
Further, the connection surface between the electrolytic metal layer-to-layer circuit 82 and the rolled metal circuit 26 has a connection surface in the planar direction, but does not have a connection surface in the plate thickness direction. The electrolytic metal interlayer circuit 82 and the electrolytic metal planar circuit 41 have connection surfaces in the planar direction, but do not have connection surfaces in the plate thickness direction.
[Substrate manufacturing method]
A method for manufacturing the substrate 13 of this embodiment will be described with reference to FIG. In the method of manufacturing the substrate 13 of this embodiment, the same steps from the rolling conductor preparation step to the second surface leveling step are performed in the same manner as in the method of manufacturing the substrate 1 of the first embodiment.
In this embodiment, the state of the rolled metal layer intermediate 24 of the first embodiment corresponds to the rolled metal layer 2 . In other words, the rolled metal circuit 26 is formed after the second surface leveling step.
As shown in FIG. 9A, electrolytic conductors 71 and 81 are provided on the surface of the rolled metal layer 2 by plating. This process is called an internal plating process.
Next, an etching resist 74 is provided on the electrolytic conductors 71 and 81 so as to cover the rolled metal circuit 26 . This step is referred to as a fourth resist forming step.
Next, the electrolytic conductors 71 and 81 are etched while covered with the etching resist 74 of the fourth resist forming step. This step is referred to as a fourth etching step.
By this step, as shown in FIG. 9B, the electrolytic conductors 71 and 81 are provided with recesses 75 and 85 to form the electrolytic metal interlayer circuits 72 and 82 .

Next, a step of filling the recessed portion 75 with the insulating resin 76 and filling the recessed portion 85 with the insulating resin 86 is performed. This step is referred to as a fourth insulating resin filling step. By this process, the electrolytic metal layer 7 and the electrolytic metal layer 8 are formed, resulting in the state shown in FIG. 9(C).
After the fourth insulating resin filling step, one surface is smoothed so that the insulating resin 76 on the one surface and the electrolytic metal interlayer circuit 72 are flat. In addition, the surface on the other side is smoothed so that the insulating resin 86 and the electrolytic metal interlayer circuit 82 on the other side are flat surfaces. This step is referred to as a fourth surface leveling step.
After that, the outermost layer plating step of the first embodiment is performed, and the electrolytic conductor 6 is provided on the surface of the electrolytic metal layer 7 and the electrolytic metal layer 8 . Subsequently, the outermost layer resist forming process is carried out from the outermost layer resist forming process, the electrolytic metal body planar circuit 31 and the electrolytic metal body planar circuit 34 are formed, the electrolytic metal layer 3 and the electrolytic metal layer 4 are formed, and the substrate 13 is manufactured. be done.

[Fourth embodiment]
Referring to FIG. 10, the structure of substrate 14 according to aspects for carrying out the invention will be described. The same reference numerals are given to the same structures as those of the substrate 1 of the first embodiment, and the description thereof is omitted. The substrate 14 of the present invention has an electrolytic metal layer 9;10. Also, the electrolytic metal layers 3; 4 are arranged on the outermost side.

The rolled metal body circuit 21 of the substrate 14 is connected to the electrolytic metal layer 9, and the electrolytic metal layer 9 is provided on the side of one end of the electrolytic metal body planar circuit 91 extending in the plane direction and the electrolytic metal body planar circuit 91. The electrolytic metal body plane circuit 91 and the electrolytic metal body interlayer circuit 92 are formed from the same electrolytic metal body, and are formed of a conductor having no connecting surface. It is characterized by being

[Electrolytic metal layer]
The electrolytic metal layer 9 is provided between the rolled metal layer 2 and the electrolytic metal layer 3, and has an electrolytic metal planar circuit 91 extending in the plane direction, an electrolytic metal interlayer circuit 92 extending in the plate thickness direction, and an insulator 93. . Electrolytic metal interlayer circuit 92 is provided on one end side of electrolytic metal planar circuit 91 .
The electrolytic metal body plane circuit 91 and the electrolytic metal body interlayer circuit 92 are formed from the same electrolytic metal body, and are formed as conductors without connection surfaces. In other words, the electrolytic metal planar circuit 91 and the electrolytic metal interlayer circuit 92 are formed of an integral electrolytic conductor 94 without connecting surfaces.
Since the electrolytic metal body plane circuit 91 and the electrolytic metal body interlayer circuit 92 do not have a connecting surface, they have no electric resistance. Therefore, there is no electrical resistance due to the presence of the connection surface, and even if electricity flows, heat generation due to the presence of the connection surface can be suppressed. In addition, there is also an effect that it is possible to suppress poor connection by peeling off from the connection surface.
The other end of the electrolytic metal plane circuit 91 is electrically connected to the rolled metal circuit 26 . Further, the electrolytic metal interlayer circuit 92 is electrically connected to the electrolytic metal planar circuit 31 . The same insulating resin as used in the first embodiment can be used as the insulating resin for the insulator 93 .

The electrolytic metal layer 10 is provided between the rolled metal layer 2 and the electrolytic metal layer 4, and has an electrolytic metal planar circuit 101 extending in the plane direction, an electrolytic metal interlayer circuit 102 extending in the plate thickness direction, and an insulator 103. . The electrolytic metal interlayer circuit 102 is provided on one end side of the electrolytic metal planar circuit 101 .
The electrolytic metal body plane circuit 101 and the electrolytic metal body interlayer circuit 102 are formed from the same electrolytic metal body, and are formed as conductors without connection surfaces. In other words, the electrolytic metal plane circuit 101 and the electrolytic metal interlayer circuit 102 are formed of the integral electrolytic conductor 104 without connecting surfaces.
Since the electrolytic metal body planar circuit 101 and the electrolytic metal body interlayer circuit 102 do not have a connection surface, they have no electrical resistance. Therefore, there is no electrical resistance due to the presence of the connection surface, and even if electricity flows, heat generation due to the presence of the connection surface can be suppressed. In addition, there is also an effect that it is possible to suppress poor connection by peeling off from the connection surface.
The other end of the electrolytic metal plane circuit 101 is electrically connected to the rolled metal circuit 26 . Further, the electrolytic metal interlayer circuit 102 is electrically connected to the electrolytic metal planar circuit 41 . The same insulating resin as used in the first embodiment can be used as the insulating resin for the insulator 103 .

By forming the electrolytic metal layers 9 and/or 10, it is not necessary to provide a through hole penetrating in the thickness direction when connecting planar circuits extending in the thickness direction and extending in the planar direction. Therefore, there is an effect that the degree of freedom in circuit design is improved. In other words, there is no need to design through-holes to avoid circuits on other layers where no connection is desired.

In the present embodiment, the electrolytic metal layer 9 is provided between the rolled metal layer 2 and the electrolytic metal layer 3, and the electrolytic metal layer 10 is provided between the rolled metal layer 2 and the electrolytic metal layer 4. The substrate 14 in the case is exemplified. However, this embodiment and the third embodiment may be combined. Specifically, as shown in FIG. 11, electrolytic metal layer 9 is provided between electrolytic metal layer 7 and electrolytic metal layer 3, and electrolytic metal layer 10 is provided between electrolytic metal layer 8 and electrolytic metal layer 4. It may be the substrate 15 when provided between.

[Other Modifications]
The present invention can be applied by combining the first to fourth embodiments.
In the first to fourth embodiments, the reinforcing structures 22; 25 are arranged so as to continuously surround the rolled metal circuit 21; However, as shown in FIGS. 12 and 13, the reinforcement structures 22; 25 may be partially spaced apart and arranged to surround the perimeter of the rolled metal body circuit 21; Even in such a case, the rigidity of the substrates 1; 14 is improved, and the rolled metal circuit 21; 26 has the effect of dissipating heat.
However, if the reinforcing structures 22; 26 are partially separated, they are preferably arranged facing each other. When the reinforcing structures 22; 26 are partially separated, the volume of the partially separated reinforcing structures 22; 26 is equal to or larger than the volume of the rolled metal circuit 21; 26. is preferred. With this volume relationship, the heat dissipation effect of the rolled metal circuit 21; 26 can be improved.

In the first to fourth embodiments, the electrolytic metal layer 3; 7: 9 is provided on one surface and the electrolytic metal layer 4; 8; 10 is provided on the other surface. The number of electrolytic metal layers on one side and the other side may be the same or different.
In addition, in the fourth embodiment, the case where one electrolytic metal layer 9 is provided on one surface is exemplified. may be Moreover, although the case where one electrolytic metal layer 10 is provided on the other surface is illustrated, the electrolytic metal layer 10 may be provided in multiple layers such as two layers, three layers, four layers or more. 15 and 16 are diagrams showing a modification of the fourth embodiment, showing a substrate 16 in which two electrolytic metal layers 9 and 10 are provided. FIG. 16 shows a part of FIG. 15 from which the insulating resin has been removed, showing a part of the circuit made of rolled conductors and the circuit made of electrolytic conductors.

The present invention improves the rigidity of the entire substrate by providing a reinforcing structure in the rolled metal layer. Therefore, the technical scope of the present invention includes a substrate in which an electrolytic metal layer having a sheet-shaped reinforcing member that is woven with glass fibers and spreads in the plane direction is combined with a rolled metal layer.

In the first embodiment, the case where the rolled metal circuit 21 and the electronic component are connected so as to allow electricity to flow has been described. may be arranged on the substrate as follows.
In this case, electricity is supplied to the electronic component 302 from another circuit (not shown).
The electronic component 302 and the electrolytic metal layer 3 are placed in contact with each other, and the electronic component 302 is arranged such that heat 303 generated when the electronic component 302 operates moves to the rolled metal circuit 21 via the electrolytic metal layer 3. are placed. By allowing heat 304 to flow from the rolled metal circuit 21 to the reinforcing structure 22 via the insulator 23, the temperature of the electronic component 302 can be kept low.

In addition, when viewed from the plane direction of the electronic component 302 side of the substrate with the electronic component 302 attached, the electrolytic metal layer 3 preferably has a portion 305 exposed to the space outside the substrate. In other words, the exposed portion 305 of the electrolytic metal layer 3 is in a state of extending outward in the planar direction from the electronic component 302 .
Since the board on which the electronic component 302 is mounted has an exposed portion 305 of the electrolytic metal layer 3, the heat 303 generated by the electronic component 302 is dissipated in the thickness direction of the rolled metal circuit 21 as indicated by an arrow 306. is released on the opposite side of the Therefore, the heat radiation effect can be enhanced and the temperature of the electronic component 302 can be kept lower.
That is, the electrolytic metal layer 3 is exposed on the surface of the substrate and has the characteristic of releasing heat 303 to the opposite side of the rolled metal circuit 21 .

A heat dissipation member such as a heat sink may be provided in contact with the exposed portion 305 . Even in such a case, the heat 303 generated by the electronic component 302 has the effect of being released from the exposed portion 305 to the opposite side (arrow 306) of the rolled metal circuit 21 in the plate thickness direction.
Moreover, it can be similarly applied to the second to fourth embodiments.

In Embodiment 1, the substrate 1 has the rolled metal layer 2 and the electrolytic metal layer 3, but the rolled metal layer 2 without the electrolytic metal layer 3 may be used as the substrate, and the electronic component 302 and the rolled metal layer may be used as the substrate. The electronic device to which the body circuit 21 is connected is such that electricity flows between the electronic component 302 and the rolled metal body circuit 21, or heat generated in the electronic component 302 flows to the rolled metal body circuit 21. may

The electronic device of the present invention is an electronic device comprising the substrate of the present invention, and its use is not particularly limited, but examples include automobiles, aircraft, unmanned aircraft, mobile phones, smartphones, personal computers, LED modules, power semiconductor modules, and the like. is mentioned. According to this electronic device, the rigidity of the substrate can be improved. Furthermore, since the substrate can have a high heat radiation effect, warpage of the substrate can be suppressed, and poor connection between the conductors can be suppressed.

1 is a substrate, 2 is a rolled metal layer, 3 is an electrolytic metal layer, 4 is an electrolytic metal layer, 5 is a rolled conductor, 6 is an electrolytic conductor, 7 is an electrolytic metal layer, 8 is an electrolytic metal layer, and 9 is an electrolytic metal. Layers 10 electrolytic metal layer 12 substrate 13 substrate 14 substrate 15 substrate 16 substrate 21 rolled metal body circuit 22 reinforcing structure 23 insulator 24 rolled metal 25 is a reinforcing structure, 26 is a rolled metal circuit, 31 is an electrolytic metal circuit, 34 is an electrolytic metal circuit, 41 is an electrolytic metal circuit, 51 is a recess, and 52 is a recess. , 53 is a recess, 54 is a recess, 55 is a recess, 56 is a recess, 57 is an etching resist, 58 is an etching resist, 59 is an etching resist, 65 is an etching resist, 71 is an electrolytic conductor, and 72 is an electrolytic 75 is a recessed portion; 76 is an insulating resin; 81 is an electrolytic conductor; 91 is an electrolytic metal body plane circuit; 92 is an electrolytic metal body interlayer circuit; 93 is an insulator; 94 is an electrolytic conductor; 211 is a rolled metal planar circuit; 212 is a rolled metal interlayer circuit; 213 is a rolled metal interlayer circuit; 214 is a rolled metal circuit intermediate; is the second structure portion, 223 is the crossing portion, 224 is the distance, 225 is the distance, 226 is the reinforcing structure intermediate body, 231 is the insulating resin, 232 is the insulating resin, 233 is the insulating resin, 234 is the insulating resin, and 235 is the insulating resin. 236 is a connection surface, 237 is a connection surface, 261 is a rolled metal interlayer circuit, 301 is a reinforcing structure, 302 is an electronic component, 303 is heat, 304 is heat, 305 is an exposed portion, and 306 is an arrow.

Claims (11)

Having a rolled metal layer comprising a rolled metal circuit made of a rolled conductor, a reinforcing structure made of a rolled conductor, and an insulator made of an insulating resin,
The rolled metal circuit and the reinforcing structure are provided in the same plane,
The reinforcing structure reinforces the mechanical strength of the substrate, and includes the rolled metal layer arranged with an insulator surrounding the rolled metal circuit, substrate. 2. The substrate of claim 1, wherein the reinforcing structure is mesh-like so as to extend in a planar direction. 2. The substrate according to claim 1, wherein said reinforcing structure is a plate-like continuous body extending in a plane direction. The rolled metal circuit includes a rolled metal planar circuit extending in a plane direction,
a rolled metal interlayer circuit extending in a plate thickness direction provided on one end side of the rolled metal planar circuit;
4. The rolled metal planar circuit and the rolled metal interlayer circuit are formed from the same rolled metal, and are formed of conductors having no connecting surfaces, according to any one of claims 1 to 3. The substrate described in . The rolled metal body circuit is connected with an electrolytic metal layer,
The electrolytic metal layer includes an electrolytic metal body planar circuit extending in a planar direction, and
an electrolytic metal interlayer circuit extending in a plate thickness direction provided on one end side of the electrolytic metal planar circuit;
5. The electrolytic metal body planar circuit and the electrolytic metal body interlayer circuit are formed from the same electrolytic metal body, and are formed from a conductor having no connection surface, according to any one of claims 1 to 4. The substrate described in . 6. An electronic device having the substrate according to any one of claims 1 to 5, wherein the rolled metal circuit and the electronic component are electrically connected. An electronic device having the substrate according to any one of claims 1 to 6, wherein the rolled metal circuit and the electronic component are connected so as to allow heat to flow. 6. An electronic device having the substrate according to claim 5, wherein the electronic component, the electrolytic metal layer, and the rolled metal circuit are connected so as to allow heat to flow. 9. An electronic device having a substrate as claimed in claim 8, wherein the electrolytic metal layer is exposed on the surface of the substrate and dissipates heat to the opposite side of the rolled metal circuit. An electronic device having the substrate according to any one of claims 7 to 9, wherein the heat flows from the rolled metal circuit through the insulator to the reinforcing structure. a rolled conductor preparation step;
a first resist creating step;
a first etching step;
a first insulating resin filling step;
a second resist forming step;
a second etching step;
A method of manufacturing a substrate in which a rolled metal body circuit and a reinforcing structure are provided in the same plane, comprising:

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