JP2023012423A - Cleaning brush, substrate processing apparatus, and substrate processing method - Google Patents

Abstract

To provide a technique for enhancing the removal efficiency of particles with a cleaning brush.SOLUTION: A cleaning brush cleans a chucking surface of a chuck. The cleaning brush includes a brush base linearly extending radially to an outside in a radial direction from a rotation center line of the chuck, and a plurality of contact portions which protrudes from the brush base and contacts the suction surface. When viewed in a direction orthogonal to the suction surface, a plurality of rows each including the plurality of contact portions arranged at intervals in a first direction, is provided at intervals in a second direction intersecting the first direction. The second direction is a longitudinal direction of the brush base. In each of the rows, at least two contact portions are of different types.SELECTED DRAWING: Figure 6

Description

TECHNICAL FIELD The present disclosure relates to a cleaning brush, a substrate processing apparatus, and a substrate processing method.

A cleaning brush described in Patent Document 1 is provided in a machine tool for cleaning a surface on which a workpiece is placed. The cleaning brush has a brush base and a plurality of brush rows. The brush platform is rotated about an axis substantially perpendicular to the cleaning surface. A plurality of brush rows are arranged on the surface of the brush base facing the cleaning surface. Each of the brush arrays is arranged along an inclined line extending at an angle with respect to the radial line extending from the middle of the radial line extending about the axis.

JP-A-2003-59881

One aspect of the present disclosure provides a technique for improving particle removal efficiency with a cleaning brush.

A cleaning brush according to an aspect of the present disclosure cleans a chucking surface of a chuck. The cleaning brush includes a brush base linearly extending radially outward from the rotation center line of the chuck, and a plurality of contact portions protruding from the brush base and contacting the suction surface. When viewed from a direction orthogonal to the attraction surface, a plurality of rows of the contact portions arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction. The second direction is the longitudinal direction of the brush base. In each said row, at least two said contact portions are of different types.

According to one aspect of the present disclosure, it is possible to improve the efficiency of removing particles with a cleaning brush.

FIG. 1 is a plan view showing a substrate processing apparatus according to one embodiment. FIG. 2 is a side view showing an example of a chuck and a tool driving section. FIG. 3 is a plan view showing a cleaning brush according to one embodiment. 4 is a plan view showing an enlarged part of FIG. 3. FIG. FIG. 5 is a plan view showing an example of the flow of cleaning liquid near the cleaning brush in FIG. FIG. 6 is a side view showing an example of types of contact portions. FIG. 7 is a plan view showing an example of the oscillating portion. FIG. 8 is a plan view showing an example of the swing range of the brush base. 9 is a plan view showing an example of the flow of cleaning liquid near the cleaning brush in FIG. 8. FIG. FIG. 10 is a plan view showing an example of a plurality of contact portions arranged on a virtual circle. FIG. 11 is a plan view showing a modification of the swing range of the brush base. FIG. 12 is a cross-sectional view showing a cleaning brush according to a modification. 13 is a cross-sectional view showing an example of movement of the pin of FIG. 12. FIG.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In addition, in each drawing, the same reference numerals are given to the same or corresponding configurations, and explanations thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are directions perpendicular to each other. The X-axis direction and Y-axis direction are horizontal directions, and the Z-axis direction is vertical direction. The U-axis direction, the V-axis direction, and the Z-axis direction are directions perpendicular to each other. The U-axis direction and the V-axis direction are horizontal directions, the U-axis direction is the longitudinal direction of the brush base 51 , and the V-axis direction is the width direction of the brush base 51 .

A substrate processing apparatus 1 according to one embodiment will be described with reference to FIG. The substrate processing apparatus 1 is a grinding apparatus for grinding the substrate W in this embodiment, but may be a polishing apparatus, a cutting apparatus, a trimming apparatus, or the like. The substrate processing apparatus 1 may be any apparatus as long as it processes the substrate W attracted to the attraction surface of the chuck 20 . The substrate W includes a semiconductor substrate or a glass substrate. The semiconductor substrate is a silicon wafer or a compound semiconductor wafer.

The substrate processing apparatus 1 includes, for example, a rotary table 10, four chucks 20, and three drive units 30. As shown in FIG. The rotary table 10 holds the four chucks 20 around the rotation center line R1, and rotates around the rotation center line R1 to rotate the four chucks 20. As shown in FIG. When viewed from above, the rotating direction of the rotary table 10 may be switched between clockwise and counterclockwise directions.

The four chucks 20 are arranged around the rotation center line R1 of the rotary table 10 at regular intervals. Each chuck 20 rotates together with the rotary table 10, and moves to, for example, a first loading/unloading position A0, a first grinding position A1, a second grinding position A2, a third grinding position A3, and a first loading/unloading position A0. Move in this order. The first loading/unloading position A0 serves both as a loading position where the transport device 2 transfers the substrate W to the chuck 20 and as a loading position where the transport device 2 receives the substrate W from the chuck 20 . In this embodiment, the carry-in position and the carry-out position are the same position, but the carry-in position and the carry-out position may be different positions. The first grinding position A1 is a position where the substrate W is primarily ground. The second grinding position A2 is a position where secondary grinding of the substrate W is performed. The third grinding position A3 is a position where the substrate W is subjected to tertiary grinding.

In addition, the first loading/unloading position A0, the first grinding position A1, the second grinding position A2, and the third grinding position A3 are arranged counterclockwise in this order around the rotation center line R1 of the rotary table 10. , but the techniques of this disclosure are not so limited. For example, instead of the third grinding position A3, a second loading/unloading position may be arranged. Like the first loading/unloading position A0, the second loading/unloading position doubles as the loading position where the transport device 2 transfers the substrate W to the chuck 20 and the loading position where the transport device 2 receives the substrate W from the chuck 20. FIG. In this case, for example, two substrates W are loaded into the first loading/unloading position A0 and the second loading/unloading position, and then ground at the first grinding position A1 and the second grinding position A2. It is unloaded at the unloading position A0 and the second loading/unloading position.

Next, an example of the chuck 20 and the driving section 30 will be described with reference to FIG. The chuck 20 has an attraction surface 21 that attracts the substrate W. As shown in FIG. The adsorption surface 21 adsorbs the substrate W from below. The attraction surface 21 is a horizontal plane in FIG. 2, but may be a conical surface symmetrical about the rotation center line R2 of the chuck 20. As shown in FIG. In the latter case, the rotation center line R2 is inclined with respect to the Z-axis direction, and the thickness distribution of the substrate W after grinding can be adjusted by the inclination angle.

The chuck 20 has, for example, a porous body 22 on its adsorption surface 21 . The porous body 22 is embedded in the concave portion of the upper surface of the base 23 . When the gas inside the porous body 22 is sucked and the atmospheric pressure of the porous body 22 becomes a negative pressure lower than the atmospheric pressure, the substrate W is adsorbed to the porous body 22 . On the other hand, when the gas suction is stopped and the air pressure of the porous body 22 is returned to the atmospheric pressure, the adsorption of the substrate W is released.

The chuck 20 is attached to the rotary table 10 so as to be rotatable around the rotation center line R2. A chuck motor 25 for rotating the chuck 20 is provided for each chuck 20 . The rotational driving force of the chuck motor 25 may be transmitted to the chuck 20 via a rotation transmission mechanism such as a timing belt or gears.

The drive unit 30 drives the grinding tool D. As shown in FIG. The drive unit 30 rotates the grinding tool D and moves it up and down. The grinding tool D grinds the substrate W attracted to the chuck 20 . The tool for processing the substrate W is not limited to the grinding tool D, and may be, for example, a polishing tool, a cutting tool, or a trimming tool.

The driving portion 30 includes a movable portion 31 to which the grinding tool D is attached. The grinding tool D is pressed against the substrate W and grinds the substrate W. As shown in FIG. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grindstones D2 arranged in a ring on the lower surface of the grinding wheel D1. In addition, the grindstone D2 may be fixed to the entire lower surface of the grinding wheel D1.

The movable portion 31 has a flange 32 to which the grinding tool D is attached, a spindle shaft 33 provided with the flange 32 at its lower end, and a spindle motor 34 for rotating the spindle shaft 33 . The flange 32 is horizontally arranged and a grinding tool D is mounted on its underside. The spindle shaft 33 is arranged vertically. The spindle motor 34 rotates the spindle shaft 33 to rotate the grinding tool D attached to the flange 32 . The rotation centerline R3 of the grinding tool D is the rotation centerline of the spindle shaft 33. As shown in FIG.

The drive unit 30 further has an elevating unit 35 that elevates the movable unit 31 . The lifting section 35 has, for example, a vertical Z-axis guide 36 , a Z-axis slider 37 that moves along the Z-axis guide 36 , and a Z-axis motor 38 that moves the Z-axis slider 37 . The movable portion 31 is fixed to the Z-axis slider 37 , and the movable portion 31 and the grinding tool D move up and down together with the Z-axis slider 37 . The lifting section 35 further has a position detector 39 for detecting the position of the grinding tool D. As shown in FIG. The position detector 39 detects the rotation of the Z-axis motor 38 and detects the position of the grinding tool D, for example.

The lifting section 35 lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, contacts the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. As shown in FIG. When the thickness of the substrate W reaches the set value, the lifting section 35 stops lowering the grinding tool D. As shown in FIG. After that, the lifting section 35 raises the grinding tool D to the standby position.

The substrate processing apparatus 1 processes a plurality of substrates W in order. When particles get caught between the chucking surface 21 of the chuck 20 and the substrate W, the substrate W is locally deformed. When the substrate W is ground in this state, local concave defects called dimples are formed on the surface of the substrate W. As shown in FIG. Particles that cause dimples are, for example, transferred matter transferred from the substrate W, processing debris generated by processing the substrate W, and fragments generated by breakage of the porous body 22 .

Therefore, the substrate processing apparatus 1 includes a cleaning brush 50 as shown in FIG. The cleaning brush 50 cleans the chucking surface 21 of the rotating chuck 20 to remove particles adhering to the chucking surface 21 . The cleaning brush 50 cleans the attraction surface 21 after removing one substrate W from the attraction surface 21 and before attracting another substrate W to the attraction surface 21 . The cleaning brush 50 is provided, for example, at the first loading/unloading position A0. If the second loading/unloading position is arranged instead of the third grinding position A3, the cleaning brush 50 may be provided at both the first loading/unloading position A0 and the second loading/unloading position.

The substrate processing apparatus 1 also includes a nozzle 80 that supplies cleaning liquid to the suction surface 21 of the chuck 20 . The nozzle 80 is provided, for example, at the first loading/unloading position A0. When the second loading/unloading position is arranged instead of the third grinding position A3, the nozzles 80 may be provided at both the first loading/unloading position A0 and the second loading/unloading position. The nozzle 80 supplies cleaning liquid to the chucking surface 21 of the rotating chuck 20, for example. The cleaning liquid is supplied to the rotation center line R2 of the adsorption surface 21 or its vicinity, and spreads over the entire radial direction of the adsorption surface 21 by centrifugal force. For example, DIW (deionized water) is used as the cleaning liquid. The nozzle 80 may be a two-fluid nozzle that mixes and discharges cleaning liquid and gas.

The substrate processing apparatus 1 includes a control section 90 . The control unit 90 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs for controlling various processes executed in the substrate processing apparatus 1 . The control unit 90 controls the operation of the substrate processing apparatus 1 by causing the CPU 91 to execute programs stored in the storage medium 92 .

Next, a cleaning brush 50 according to one embodiment will be described with reference to FIGS. 3 to 5. FIG. 3, only the outline of the brush base 51 is shown in order to show the arrangement of the contact portions 52. As shown in FIG. The cleaning brush 50 has a brush base 51 and a plurality of contact portions 52 . The brush base 51 linearly extends radially outward from the rotation center line R<b>2 of the chuck 20 . The brush base 51 has, for example, a length approximately equal to the radius of the chucking surface of the chuck 20 and extends above the peripheral edge of the chucking surface 21 of the chuck 20 . The brush base 51 may be fixed during cleaning of the chuck 20, or may be swung as described later.

Each contact portion 52 protrudes from the lower surface of the brush base 51 and contacts the adsorption surface 21 . Each contact portion 52 scrapes out or separates particles adhering to the adsorption surface 21 . Each contact portion 52 is, for example, a hair bundle in which a plurality of hairs are bundled. A tuft of hair is planted in a hole provided on the lower surface of the brush base 51 .

Each contact portion 52 is a bundle of hair in this embodiment, but may be a sponge or a pin. Each contact portion 52 may remove particles adhering to the chucking surface 21 without roughening the chucking surface 21 of the chuck 20 . Each contact portion 52 is preferably made of resin so as not to damage the chucking surface 21 of the chuck 20 .

As shown in FIG. 3, when viewed from the direction (Z-axis direction) orthogonal to the attraction surface 21, a row 53 including a plurality of contact portions 52 arranged at intervals in the first direction intersects the first direction. A plurality of them are provided at intervals in the second direction. The second direction is the longitudinal direction (U-axis direction) of the brush base 51 . The longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20 in FIG. The number of rows 53 provided at intervals in the second direction is not particularly limited.

The first direction is the direction in which the row 53 extends. The first direction is, for example, a direction that obliquely crosses the second direction. For example, the first direction is a direction that inclines from the radially inner side to the radially outer side of the chuck 20 toward the rotational direction downstream side from the rotational direction upstream side of the chuck 20 . That is, the first direction is a direction that is inclined radially outward with respect to the rotation center line R2 of the chuck 20 as it goes from the upstream side in the rotation direction of the chuck 20 to the downstream side in the rotation direction. The first direction may be a direction that inclines in the opposite direction, or may be a direction perpendicular to the second direction.

A plurality of rows 54 each including a plurality of contact portions 52 arranged at intervals in the second direction (U-axis direction) when viewed from the Z-axis direction are provided in a fourth direction perpendicular to the second direction. The fourth direction is the width direction (V-axis direction) of the brush base 51 . The number of rows 54 is not limited to three, and may be two, four or more.

As shown in FIG. 5 , the cleaning liquid L is supplied to the upstream side of the chuck 20 in the rotation direction of the cleaning brush 50 . The cleaning liquid L rotates together with the chuck 20 and reaches the cleaning brush 50 . The cleaning brush 50 has a discharge path 55 for discharging the cleaning liquid L between two adjacent rows 53 .

The discharge path 55 extends in the first direction. If the first direction is a direction that inclines radially outward from the radially inner side of the chuck 20 as it goes from the upstream side in the rotational direction of the chuck 20 to the downstream side in the rotational direction, the cleaning liquid containing the particles discharged from the cleaning brush 50 is applied to the chuck. It flows from the radially inner side to the radially outer side of 20 and is discharged to the outside of the adsorption surface 21 in a short period of time. Therefore, it is possible to shorten the time that the cleaning liquid containing the particles discharged from the cleaning brush 50 stays on the adsorption surface 21 . Further, the area where the cleaning liquid containing the particles discharged from the cleaning brush 50 stays on the adsorption surface 21 can be narrowed.

Each row 53 includes n contact portions 52 arranged in the first direction. n is a natural number of 2 or more, preferably a natural number of 3 or more. n is preferably a natural number of 7 or less. In each row 53, the contact portion 52 positioned m-th (m is a natural number from 1 to n inclusive) from the upstream side in the rotation direction of the chuck 20 toward the downstream side in the rotation direction is referred to as an m-th contact portion 52-m.

As shown in FIG. 4, when the direction perpendicular to the first direction is defined as the third direction when viewed from the Z-axis direction, the interval G1 in the third direction between two adjacent columns 53 is It is larger than the gap G2 in the first direction between two adjacent contact portions (for example, the first contact portion 52-1 and the second contact portion 52-2). The gap G1 is the width of the discharge passage 55. As shown in FIG. If the interval G1 is larger than the interval G2, the width of the discharge path 55 is wide and the cleaning liquid L easily passes through the discharge path 55 .

In each row 53, a first contact portion 52-1, a second contact portion 52-2, and a third contact portion 52-3 are arranged at regular intervals in the first direction. Discharge unevenness of the cleaning liquid L can be reduced. In each row 53, the distance between the first contact portion 52-1 and the second contact portion 52-2 in the first direction and the distance between the second contact portion 52-2 and the third contact portion 52-3 in the first direction intervals may be different. The interval G1 between two adjacent rows 53 in the third direction should be larger than the maximum value of the interval G2 between two adjacent contact portions 52 in each row 53 in the first direction.

The multiple rows 53 are arranged at equal intervals in the U-axis direction. Discharge unevenness of the cleaning liquid L can be reduced. Note that the plurality of rows 53 may be arranged at uneven intervals in the U-axis direction. In this case, the interval G1 between two adjacent rows 53 in the third direction, that is, the width of the discharge path 55, changes according to the combination of rows 53. As shown in FIG. The width of the discharge passage 55 should be larger than the maximum value of the interval G2 in the first direction between two adjacent contact portions in each of the two rows 53 sandwiching the discharge passage 55 .

When viewed from the V-axis direction, in two adjacent rows 53, the first contact portion 52-1 of one row 53 and the second contact portion 52-2 of another row 53 are the closest combination. However, they do not overlap in the U-axis direction and are separated in the U-axis direction. The interval G1 between the two adjacent rows 53 can be increased and the width of the discharge path 55 can be increased compared to the case where they overlap in the U-axis direction. Therefore, the cleaning liquid L easily passes through the discharge path 55 . The second contact portion of the present embodiment corresponds to the (n-1)th contact portion described in the claims.

When viewed from the V-axis direction, two adjacent rows 53 overlap in the U-axis direction, and the first contact portion 52-1 of one row 53 and the third contact portion 52-3 of another row are aligned. They overlap in the U-axis direction. Two adjacent rows 53 do not have a gap in the U-axis direction. When viewed from the V-axis direction, a plurality of contact portions 52 are continuously present in the U-axis direction, and there are no gaps between the plurality of contact portions 52 . Therefore, unwashed portions can be suppressed. The third contact portion of this embodiment corresponds to the n-th contact portion described in the claims.

When viewed from the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have the same size and shape. For example, when viewed from the Z-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have circular outer shapes with the same diameter. Although not shown, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have different dimensions or different shapes when viewed from the Z-axis direction. may have.

Next, with reference to FIG. 6, an example of the type of contact portion 52 will be described. In FIG. 6, a gap is shown between the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 in order to clarify the boundary between them. can be omitted. When viewed from the U-axis direction, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 overlap each other, and there may be no gap between them.

In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 are of different types. As described above, particles of various sizes and materials adhere to the adsorption surface 21 of the chuck 20 . In addition, the suction surface 21 of the chuck 20 has a large number of protrusions and recesses (suction holes), and the adhesion force of particles differs between the protrusions and the recesses. By using a plurality of types of contact portions 52, particles of various sizes, materials, and adhesive forces can be efficiently removed.

If at least two types of contact portions 52 are different in each row 53, multiple types of particles can be efficiently removed. For example, if the first contact portion 52-1 and the second contact portion 52-2 are of different types, the second contact portion 52-2 and the third contact portion 52-3 may be of the same type. Further, when the second contact portion 52-2 and the third contact portion 52-3 are of different types, the first contact portion 52-1 and the second contact portion 52-2 may be of the same type.

In each row 53, the first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 have bristles with different wire diameters, for example. The smaller the wire diameter of the bristles, the higher the flexibility of the bristles and the easier it is for fine particles that have entered the recesses of the adsorption surface 21 to be scraped out. Also, the larger the wire diameter of the bristles, the higher the rigidity of the bristles and the easier it is for particles adhered to the attraction surface 21 to be peeled off. If the wire diameters of the bristles are different, the material of the bristles may be the same.

It should be noted that the material of the bristles may be different. The first contact portion 52-1, the second contact portion 52-2, and the third contact portion 52-3 may have bristles of different materials. The lower the hardness of the bristles, the higher the flexibility of the bristles, and the fine particles that have entered the recesses of the adsorption surface 21 are easily scraped out. Also, the higher the hardness of the bristles, the higher the rigidity of the bristles, and the more easily the particles adhering to the adsorption surface 21 are peeled off. The hardness of the bristles is determined by the material of the bristles. When the bristles are made of resin, the hardness of the resin is represented by Shore hardness, for example. If the materials of the bristles are different, the wire diameter of the bristles may be the same. The bristles may be made of different materials and may have different wire diameters.

In each row 53, the contact portion 52 on the upstream side in the rotation direction of the chuck 20 has bristles with a larger wire diameter than the contact portion 52 on the downstream side in the rotation direction. For example, the first contact portion 52-1 has bristles with a larger wire diameter than the second contact portion 52-2. In addition, the second contact portion 52-2 has bristles with a larger wire diameter than the third contact portion 52-3. The wire diameter of the bristles of the contact portion 52 decreases from the upstream side in the rotation direction of the chuck 20 toward the downstream side in the rotation direction. After removing the adhered particles with the bristles of high rigidity, the fine particles that have entered the concave portion can be scraped out, and the efficiency of removing the particles can be improved.

In addition, as described above, the material of the bristles may be different. The contact portion 52 on the upstream side in the rotational direction of the chuck 20 has bristles made of a harder material than the contact portion 52 on the downstream side in the rotational direction. For example, the first contact portion 52-1 has bristles that are harder than the second contact portion 52-2. Also, the second contact portion 52-2 has a diameter made of a material harder than that of the third contact portion 52-3. The hardness of the bristles of the contact portion 52 decreases from the upstream side in the rotational direction of the chuck 20 to the downstream side in the rotational direction. After removing the adhered particles with the bristles of high rigidity, the fine particles that have entered the concave portion can be scraped out, and the efficiency of removing the particles can be improved.

Note that, as described above, each contact portion 52 is not limited to a hair bundle formed by bundling a plurality of hairs, and may be a sponge or a pin. When each contact portion 52 is a sponge or pin, if the diameter of the sponge or pin is different or the material of the sponge or pin is different, multiple types of particles can be efficiently removed.

In each row 54, all contact portions 52 are of the same type, but at least two contact portions 52 may be of different types. For example, all first contact portions 52-1 are of the same type, but at least two first contact portions 52-1 may be of different types. However, it is preferable that the types of contact portions 52 and the number of each type be the same between one row 53 and another row 53 .

Next, an example of the swinging portion 60 will be described with reference to FIG. The cleaning brush 50 has a swinging portion 60 for swinging the brush base 51 . The swing unit 60 swings the brush base 51 around, for example, a swing center line R4 perpendicular to the chucking surface 21 of the chuck 20 . The swivel centerline R4 of the brush base 51 is provided outside the chucking surface 21 of the chuck 20, for example.

The swinging portion 60 includes, for example, a first drive source 61, a pivot shaft 62, and a connecting bar 63. As shown in FIG. The first drive source 61 rotates the turning shaft 62 . The first drive source 61 is, for example, an electric motor. A pneumatic actuator may be used as the first drive source 61, but if an electric motor is used, the turning speed and turning range can be controlled with high accuracy. The swivel shaft 62 is provided vertically. The connecting bar 63 linearly extends radially outward of the pivot shaft 62 from the lower end of the pivot shaft 62 . The tip of the connecting bar 63 is connected with the brush base 51 so as to be able to move up and down.

The brush base 51 is provided below the connecting bar 63 . The brush base 51 is pressed against the adsorption surface 21 of the chuck 20 by the elastic restoring force of the spring 64, for example. A spring 64 is provided between the brush base 51 and the connecting bar 63 . The type of spring 64 is not particularly limited. The spring 64 is a coil spring, leaf spring, disc spring, bamboo shoot spring, ring spring, or the like. Note that the brush base 51 may be pressed against the adsorption surface 21 of the chuck 20 by its own weight. A weight may be provided on the brush base 51 . You can adjust the pressure by adjusting the weight of the weight.

The oscillating portion 60 may include a second drive source 65 . The second drive source 65 raises and lowers the brush base 51 by raising and lowering the first drive source 61 . The second drive source 65 is, for example, an electric motor. An electric motor is used in combination with a ball screw. A pneumatic actuator may be used as the second drive source 65, but if an electric motor is used, the impact can be reduced.

Next, an example of the swing range of the brush base 51 will be described with reference to FIGS. 8 and 9. FIG. During cleaning of the chuck 20, the brush base 51 is repeatedly swung, for example, between a first cleaning position indicated by a two-dot chain line in FIG. 8 and a second cleaning position indicated by a solid line in FIG. When the brush base 51 is positioned at the second cleaning position, the longitudinal direction (U-axis direction) of the brush base 51 is inclined with respect to the radial direction of the chuck 20 as shown in FIG. Note that the brush base 51 may be raised so that the contact portion 52 does not come into contact with the adsorption surface 21 while the brush base 51 returns from the second cleaning position to the first cleaning position. The contact portion 52 may contact the adsorption surface 21 only while the brush base 51 moves from the first cleaning position to the second cleaning position. Swinging of the brush base 51 is performed under the control of the controller 90 .

Note that the first cleaning position is a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, but may be a position where it does not coincide. In the latter case, the brush base 51 may pass through a position where the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20 during the swing. When the tip of the brush base 51 coincides with the rotation center line R2 of the chuck 20, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20. As shown in FIG.

As shown in FIG. 9 , even when the brush base 51 is positioned at the second cleaning position, the first direction, which is the extending direction of the discharge path 55 , increases with the diameter of the chuck 20 toward the downstream side in the rotation direction of the chuck 20 . direction is slanted outward. The same applies when the brush base 51 is at the first cleaning position (see FIG. 5).

While the brush base 51 is swung between the first cleaning position and the second cleaning position, the first direction, which is the extending direction of the discharge path 55 , always moves toward the downstream side in the rotation direction of the chuck 20 . 20 is inclined radially outward. As a result, the cleaning liquid containing particles discharged from the cleaning brush 50 always flows from the radially inner side to the radially outer side of the chuck 20 and is discharged to the outside of the adsorption surface 21 in a short period of time. Therefore, it is possible to shorten the time that the cleaning liquid containing the particles discharged from the cleaning brush 50 stays on the adsorption surface 21 . Further, the area where the cleaning liquid containing the particles discharged from the cleaning brush 50 stays on the adsorption surface 21 can be narrowed.

As shown in FIG. 8, while the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is rotated. The first contact portion 52-1A in the second row 53 from the turning center line R4 of the brush base 51 moves in the radial direction of the chuck 20 from the dashed line L1 to the dashed line L2. The movement distance MD is equal to or greater than the interval G3 (MD=G3 in FIG. 8). The interval G3 is the interval between two adjacent rows 53 in the second direction (longitudinal direction of the brush base), for example, the interval between the first contact portions in the second direction.

The swinging portion 60 swings the brush base 51 so that the movement distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3. The same portion of the adsorption surface 21 can be cleaned by the plurality of contact portions 52, and the uniformity of cleaning can be improved. It is particularly effective when at least two contact portions 52 in each row 53 are of different types.

As described above, the swinging part 60 swings the brush base 51 around the swing center line R4 perpendicular to the chucking surface 21 of the chuck 20 . As a result, the distance between the brush base 51 and the attracting surface 21 can be kept constant while the brush base 51 is rotated, and the contact portion 52 can be pressed against the attracting surface 21 with a constant pressure.

While the cleaning brush 50 cleans the suction surface 21 of the chuck 20, the chuck 20 is rotated and the brush base 51 is rotated. The peripheral speed of the chuck 20 increases as the contact position between the chuck 20 and the contact portion 52 is farther from the rotation center line R2 of the chuck 20 . The farther the contact position between the chuck 20 and the contact portion 52 is from the turning center line R4 of the brush base 51, the faster the peripheral speed of the brush base 51 is.

At the contact position between the chuck 20 and the contact portion 52 , the greater the relative speed difference between the chuck 20 and the brush base 51 , the greater the impact force when the particles adhering to the chuck 20 collide with the contact portion 52 . Therefore, the turning center line R4 of the brush base 51 is provided outside the chucking surface 21 of the chuck 20 so that the impact force is uniform over the entire radial direction of the chucking surface 21 . In this case, the farther the contact position between the chuck 20 and the contact portion 52 is from the rotation center line R2 of the chuck 20, the faster the peripheral speed of the chuck 20 is, but the slower the peripheral speed of the brush base 51 is.

As shown in FIG. 10 , a plurality of contact portions 52 may be provided on a virtual circle 56 centered on the rotation center line R4 of the brush base 51 and passing through the rotation center line R2 of the chuck 20 . A brush base 51 turns, and a plurality of contact portions 52 pass through the center of the attraction surface 21 . The center of the adsorption surface 21 can be cleaned by the plurality of contact portions 52, and the uniformity of cleaning can be improved.

The types of the at least two contact portions 52 arranged on the virtual circle 56 may be different. By using a plurality of types of contact portions 52, it is possible to efficiently remove a plurality of types of particles from the center of the attraction surface 21. FIG. At least two contact portions 52 arranged on the virtual circle 56 may have different materials or bristles with different wire diameters.

Next, a modification of the swing range of the brush base 51 will be described with reference to FIG. During cleaning of the chuck 20, the brush base 51 may be linearly moved repeatedly between, for example, a first cleaning position indicated by a two-dot chain line in FIG. 11 and a second cleaning position indicated by a solid line in FIG. good.

The brush base 51 is linearly moved in the longitudinal direction (U-axis direction) of the brush base 51 . Meanwhile, the longitudinal direction of the brush base 51 coincides with the radial direction of the chuck 20 . The brush base 51 is swung so that the moving distance MD of each contact portion 52 in the radial direction of the chuck 20 is equal to or greater than the interval G3 between two adjacent rows 53 in the second direction (longitudinal direction of the brush base). .

Next, a modified example of the cleaning brush 50 will be described with reference to FIGS. 12 and 13. FIG. Differences from FIG. 6 will be mainly described below. The cleaning brush 50 includes, for example, a brush base 51, a first contact portion 52-1, a second contact portion 52-2, and a third contact portion 52-3. The first contact portion 52-1 includes a pin 521. As shown in FIG. The second contact portion 52-2 includes a hair bundle 523. As shown in FIG. The third contact portion 52-3 includes a hair bundle 524. As shown in FIG.

12 and 13, PL is the length of the portion of the pin 521 protruding from the brush base 51 (hereinafter referred to as the protruding length of the pin 521). The pin 521 protrudes downward from the bottom surface of the brush base 51 . The longitudinal direction of the pin 521 is, for example, the Z-axis direction. A part of the pin 521 is housed inside the brush base 51 and the remaining part protrudes outside the brush base 51 .

The brush base 51 movably holds the pin 521 so that the projecting length PL of the pin 521 can be changed. The pin 521 is movable in the longitudinal direction of the pin 521, for example. Even if the pin 521 is worn out and the overall length L0 of the pin 521 is shortened, the pin 521 can be used continuously by adjusting the projecting length PL of the pin 521 to a desired length.

The brush base 51 has, for example, a first hole 511 and a second hole 512 having a larger diameter than the first hole 511 . A pin 521 is movably inserted through the first hole 511 . One end (for example, the lower end) of the pin 521 protrudes outside the brush base 51 . On the other hand, the other end (for example, upper end) of the pin 521 is housed inside the brush base 51 . A stopper 522 is provided at the upper end of the pin 521 . The stopper 522 is movably arranged in the second hole 512 .

The stopper 522 is disk-shaped, for example. Stopper 522 has a smaller diameter than second hole 512 and a larger diameter than first hole 511 . The stopper 522 prevents the pin 521 from detaching from the brush base 51 by coming into contact with the step surface between the second hole 512 and the first hole 511 as shown in FIG. In addition, the stopper 522 may be provided in the shape of a collar in the middle of the pin 521 .

The brush base 51 may have a base 513 , a lid 514 and a connector 515 . A first hole 511 and a second hole 512 are formed through the base 513 . The lid 514 closes the second hole 512 from the side opposite to the first hole 511 . The connector 515 separably connects the base 513 and the lid 514 . The connector 515 is, but not limited to, a bolt, for example. By connecting the base 513 and the lid 514 in a separable manner, the pin 521 can be replaced. Only the pin 521 can be replaced without replacing the entire cleaning brush 50.例文帳に追加

The pin 521 is made of a material softer than the chucking surface 21 of the chuck 20 so as not to damage the chucking surface 21 of the chuck 20 . This is because if the suction surface 21 of the chuck 20 is scratched, the thickness unevenness of the substrate W after grinding increases. The chuck 20 has, for example, a porous body 22 on its adsorption surface 21 . When the porous body 22 is made of ceramic such as aluminum oxide, the pins 521 are made of resin such as PEEK (Poly Ether Ether Ketone).

Since the pin 521 is made of a relatively soft material as described above, it is easily worn. Therefore, being able to adjust the protrusion length PL of the pin 521 is important. This is because even if the pin 521 wears and the overall length L0 of the pin 521 becomes short, the pin 521 can be used continuously by adjusting the projecting length PL of the pin 521 .

The pin 521 has a larger diameter and greater rigidity than the individual bristles that make up the tufts 523 and 524 . Unlike the bristle bundles 523 and 524, the pins 521 can crush the particles P that are stuck in the concave portions of the chucking surface 21 of the chuck 20, for example, and flatten the particles P. As shown in FIG.

As shown in FIG. 13, the pin 521 is preferably arranged on the most upstream side in the rotation direction of the chuck in each row 53 . The pin 521 comes into contact with the particles P before the hair bundles 523 and 524 and breaks the particles P. Therefore, abrasion of the tufts 523 and 524 can be suppressed.

As the pin 521 crushes the particles P, new dust may be generated. The bristle bundles 523 and 524 may be arranged downstream of the pin 521 in the rotation direction of the chuck 20 so that newly generated dust is immediately swept out by the bristle bundles 523 and 524 . Newly generated dust can be efficiently removed.

The cleaning brush 50 may have an elastic body, and may have a spring 57 as an example. The spring 57 urges the pin 521 in the direction of protruding outside the brush base 51 with its elastic restoring force. The spring 57 is, for example, a coil spring, and is arranged in a compressed state between the stopper 522 and the lid 514 . Note that the spring 57 may be a leaf spring or the like, and is not limited to a coil spring.

Since the cleaning brush 50 has the spring 57, the projecting length PL of the pin 521 can be automatically adjusted to a desired length. The pin 521 hits the adsorption surface 21 of the chuck 20 before the bristle bundles 523 and 524 do. Then, the pin 521 moves into the brush base 51 against the elastic restoring force of the spring 57 until it reaches the same height as the tufts 523 and 524 .

The bristle bundles 523 and 524 are fixed to the brush base 51 . The pin 521 has a position where the tip (for example, the lower end) of the pin 521 protrudes from the tips (for example, the lower end) of the hair bundles 523 and 524 (see FIG. 12), and the tip of the pin 521 is at the same position as the tips of the hair bundles 523 and 524. It moves between the height position (see FIG. 13). Both the pin 521 and the bristle bundles 523 and 524 can be brought into contact with the adsorption surface 21 of the chuck 20 .

Although the cleaning brush, the substrate processing apparatus, and the substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These also naturally belong to the technical scope of the present disclosure.

20 chuck 21 adsorption surface 50 cleaning brush 51 brush base 52 contact portion 53 row W substrate

Claims (16)

A cleaning brush for cleaning the chucking surface of the chuck,
a brush base linearly extending radially outward from the rotation center line of the chuck; and a plurality of contact portions projecting from the brush base and contacting the suction surface,
When viewed from a direction orthogonal to the attraction surface, a plurality of rows of the contact portions arranged at intervals in a first direction are provided at intervals in a second direction intersecting the first direction, the second direction is the longitudinal direction of the brush base;
The cleaning brush, wherein in each said row, at least two said contact portions are of different types. The cleaning brush according to claim 1, wherein in each row, at least two of the contact portions have different materials or bristles with different wire diameters. 3. In each of said rows, said contact portion on the upstream side in the rotation direction of said chuck has a harder material or has bristles with a larger wire diameter than said contact portion on the downstream side in the rotation direction of said chuck. A cleaning brush as described in . The first direction is a direction that obliquely intersects with the second direction, and is a direction that inclines from the radially inner side to the radially outer side of the chuck toward the rotational direction downstream side from the rotational direction upstream side of the chuck. A cleaning brush according to claim 1. Assuming that a direction that intersects perpendicularly with the first direction when viewed from a direction perpendicular to the attraction surface is a third direction,
5. The cleaning brush according to claim 4, wherein the interval in the third direction between two adjacent rows is larger than the interval in the first direction between two adjacent contact portions in each row. The cleaning brush according to claim 4, wherein the plurality of rows are arranged at equal intervals in the second direction. 5. The cleaning brush according to claim 4, wherein in each said row, three or more said contact portions are arranged at regular intervals in said first direction. each of the rows includes n (n is a natural number of 3 or more) contact portions arranged in the first direction;
In each row, if the contact portion positioned m-th (m is a natural number between 1 and n inclusive) from the upstream side in the rotation direction of the chuck toward the downstream side in the rotation direction is defined as the m-th contact portion,
5. The cleaning method according to claim 4, wherein in two adjacent rows, the first contact portion of one row and the (n−1)th contact portion of another row do not overlap in the second direction. brush. each of the rows includes n (n is a natural number of 3 or more) contact portions arranged in the first direction;
In each row, if the contact portion positioned m-th (m is a natural number between 1 and n inclusive) from the upstream side in the rotation direction of the chuck toward the downstream side in the rotation direction is defined as the m-th contact portion,
5. The method according to claim 4, wherein two adjacent rows overlap in the second direction, and the first contact portion of one row and the nth contact portion of another row overlap in the second direction. cleaning brush. The cleaning brush according to claim 1, wherein the contact portion includes a tuft of bristles, a sponge, or a pin. the contact portion includes a pin;
2. The cleaning brush according to claim 1, wherein the brush base movably holds the pin such that the length of the portion of the pin protruding from the brush base can be changed. 12. The cleaning brush according to claim 11, wherein said pin is arranged on the most upstream side in the rotation direction of said chuck in each said row. 12. The cleaning brush according to claim 11, further comprising an elastic body that biases the pin in a direction of protruding outside the brush base. The contact portion includes a bristle bundle fixed to the brush base,
12. The pin according to claim 11, wherein the pin moves between a position where the tip of the pin protrudes from the tip of the hair bundle and a position where the tip of the pin is at the same height as the tip of the hair bundle. cleaning brush. a cleaning brush according to any one of claims 1 to 14;
the chuck;
a nozzle that supplies cleaning liquid to the chuck surface of the chuck;
a driving unit that drives a tool for processing the substrate that is attracted to the attraction surface of the chuck;
A substrate processing apparatus comprising: sequentially processing a plurality of substrates using the substrate processing apparatus according to claim 15;
cleaning the attraction surface with the cleaning brush after removing one of the substrates from the attraction surface and before attracting another substrate to the attraction surface;
A substrate processing method, comprising:

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