JP2023006113A - Optical connector and module with the same - Google Patents

Abstract

To provide a compact, thin optical connector which offers high optical coupling efficiency and can be used in optical/electrical hybrid devices.SOLUTION: An optical connector provided herein comprises an engaging member 100 having a cavity and an optical waveguide chip 200 inserted to the cavity of the engaging member, the optical waveguide chip comprising a base plate and one or more tapered optical waveguides formed on the base plate.SELECTED DRAWING: Figure 2

Description

The present invention relates to an optical connector and a module with an optical connector.

2. Description of the Related Art Conventionally, an opto-electric hybrid device having an optical transmission/reception function has a configuration in which an optical fiber for inputting/outputting an optical signal is directly connected to the device (see FIG. 8c of Patent Document 1, for example).

WO2014/156962

In order to reduce the size of an opto-electric hybrid device, it is required to mount a compact, thin optical connector with high optical coupling efficiency on the device.

In order to solve the above-described problems, one aspect of the present invention is an optical connector comprising a fitting member having a cavity and an optical waveguide chip inserted into the cavity of the fitting member, The optical waveguide chip is an optical connector comprising a base plate and one or more tapered optical waveguides formed on the base plate.

According to another aspect of the present invention, in the aspect described above, the optical waveguide chip includes an array of the tapered optical waveguides.

Further, according to another aspect of the present invention, in the above aspect, the array of tapered optical waveguides is a first group of tapers in which the cross-sectional area of the waveguides increases from one end to the other end of the base plate. an optical waveguide and a second group of tapered optical waveguides in which the cross-sectional area of the waveguide decreases from the one end of the base plate to the other end of the base plate.

Further, according to another aspect of the present invention, in the above aspect, the one or more tapered optical waveguides have a height of the waveguide in the thickness direction of the base plate along the longitudinal direction of the optical waveguide. configured to change.

Further, according to another aspect of the present invention, in the above aspect, the one or more tapered optical waveguides have a width in a direction perpendicular to the thickness direction of the base plate, which is the longitudinal direction of the optical waveguides. is configured to vary along

Further, according to another aspect of the present invention, in the aspect described above, the one or more tapered optical waveguides have a reflecting structure for bending the optical path at the end opposite to the fitting member.

According to another aspect of the present invention, in the aspect described above, the reflection structure is an inclined end surface of the optical waveguide.

According to another aspect of the present invention, in the aspect described above, the inclined end surface of the optical waveguide is a spherical or aspherical condensing mirror.

According to another aspect of the present invention, in the aspect described above, the one or more tapered optical waveguides are configured using grooves formed on the base plate. According to another aspect of the present invention, in the aspect described above, the one or more tapered optical waveguides are made of resin embedded in the grooves.

Further, according to another aspect of the present invention, in the aspect described above, a reflective coating is formed on the groove on the base plate.

Further, according to another aspect of the present invention, in the aspect described above, the optical waveguide chip has a first groove in a portion to be inserted into the fitting member, and the fitting member has the first groove in the cavity. A second groove corresponding to the groove is provided, and when the optical waveguide chip is inserted into the fitting member, the first groove and the second groove connect the optical connector to another optical connector. Alignment holes are formed.

Another aspect of the present invention is a module with an optical connector including an opto-electric hybrid device having an optical transmission/reception function, and the optical connector according to the above aspect mounted on the opto-electric hybrid device. According to another aspect of the present invention, in the aspect described above, the optical connector has an alignment marker on the optical waveguide chip for aligning the optical connector and the opto-electric hybrid device.

According to the present invention, miniaturization of an opto-electric hybrid device can be realized.

1 is a perspective view showing the configuration of an optical connector according to one embodiment of the present invention; FIG. 1 is an exploded perspective view of an optical module to which an optical connector according to an embodiment of the invention is applied; FIG. 1 is a cross-sectional view showing a configuration example of an opto-electric hybrid device; FIG. 1 is a cross-sectional view showing a configuration example of an opto-electric hybrid device; FIG. 3 is a diagram showing the detailed configuration of an optical waveguide chip that constitutes the optical connector according to the embodiment; FIG. FIG. 2 is a perspective view showing the arrangement of an optical waveguide provided in an optical waveguide chip and a second optical waveguide provided in an opto-electric hybrid device; FIG. 3 is a cross-sectional view showing a configuration near an end of an optical waveguide; 4A to 4C are diagrams showing a manufacturing process of an optical waveguide chip that constitutes the optical connector according to the present embodiment; 4A to 4C are diagrams showing a manufacturing process of an optical waveguide chip that constitutes the optical connector according to the present embodiment; 4A to 4C are diagrams showing a manufacturing process of an optical waveguide chip that constitutes the optical connector according to the present embodiment;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing the configuration of an optical connector according to one embodiment of the present invention. The optical connector 10 has a fitting member 100 and an optical waveguide chip 200 . The fitting member 100 has a cavity 103 penetrating between a first surface 101 and a second surface 102 opposite to the first surface 101, and a portion of the optical waveguide chip 200 is inserted into this cavity 103. ing. A first surface 101 of the fitting member 100 is a surface that comes into contact with another optical connector when the optical connector 10 is connected to another optical connector (see FIG. 2). The end surface 201 of the optical waveguide chip 200 on the side inserted into the cavity 103 of the fitting member 100 is aligned with the first surface 101 of the fitting member 100 . That is, the optical waveguide chip 200 is inserted into the cavity 103 of the fitting member 100 so that the end surface 201 thereof and the first surface 101 of the fitting member 100 are flush with each other. As another example, the end surface 201 of the optical waveguide chip 200 may not be flush with the first surface 101 of the fitting member 100, and when the optical connector 10 is connected to another optical connector, the end surface 201 is in contact with the optical waveguide of the other optical connector. The shape of the optical waveguide chip 200 is a flat plate, and the cavity 103 has a wide shape so as to accommodate the optical waveguide chip 200 .

The optical waveguide chip 200 has an optical waveguide 203 on its upper surface 202 . Optical waveguide 203 is formed on base plate 210 . The number of optical waveguides 203 may be arbitrary. In the optical connector 10 of FIG. 1, the optical waveguide 203 is configured as an array of optical waveguides in which a plurality of optical waveguides are arranged in close proximity in parallel. In another example, optical waveguide 203 may be a single optical waveguide. The optical waveguide 203 extends from the end surface 201 of the optical waveguide chip 200 (that is, the surface flush with the first surface 101 of the fitting member 100) toward the opposite end surface 204. As shown in FIG. One end (end face) 205 of the optical waveguide 203 is positioned on the end face 201 of the optical waveguide chip 200, and light passes through this end 205, i.e., through the end face 201 of the optical waveguide chip 200, to the optical connector. 10 and other optical connectors. The other end 206 of the optical waveguide 203 is located outside the fitting member 100 and near the end surface 204 of the optical waveguide chip 200 . An end portion 206 of the optical waveguide 203 is provided with a reflecting mirror (described later). The reflecting mirror reflects light emitted from the end portion 206 of the optical waveguide 203 and light incident on the end portion 206 of the optical waveguide 203 (the emitted light and the incident light are collectively indicated by reference numeral 207) to the upper surface of the optical waveguide chip 200. It reflects light so that it is at or near a perpendicular angle to 202 .

A semi-cylindrical groove 208 leading to the end surface 201 is formed in a portion of the upper surface 202 of the optical waveguide chip 200 that is inserted into the fitting member 100 . Similarly, a semi-cylindrical groove 104 communicating with the first surface 101 is also formed in the ceiling portion of the cavity 103 of the fitting member 100 at a position facing the groove 208 of the optical waveguide chip 200 . Groove 208 and groove 104 combine to form a cylindrical bore 105 that opens into first surface 101 of fitting member 100 .

FIG. 2 is an exploded perspective view of an optical module to which an optical connector according to an embodiment of the invention is applied. The optical module 20 is configured by mounting the optical connector 10 described with reference to FIG. 1 on the opto-electric hybrid device 300 . The opto-electric hybrid device 300 has at least an optical transmitter 300A, an optical receiver 300B, and a driver IC 308, the detailed configuration of which will be described later with reference to FIGS. The optical transmitter 300A and the optical receiver 300B are configured to have an optical signal input/output portion 306a (an end surface of the optical waveguide) on the upper surface 301 of the device 300 . The optical transmission section 300A emits an optical signal from an emission section 306a to the upper surface 301 of the device 300 at a vertical or near-perpendicular angle. An optical signal at an angle perpendicular or nearly perpendicular to the upper surface 301 of the device 300 is incident on the optical receiving section 300B from an incident section 306a.

As shown in FIG. 2, the optical connector 10 is mounted on the upper surface 301 of the opto-electric hybrid device 300 with the interface surface 202 (the upper surface 202 in FIG. 1) of the optical waveguide chip 200 facing the opto-electric hybrid device 300 side. be. On the top surface 301 of the device 300, the end 206 (see FIG. 1) of the optical waveguide 203 in the optical connector 10 is aligned with the input/output portions 306a of the optical transmitter 300A and the optical receiver 300B. As a result, the optical signal emitted from the emission portion 306a of the optical transmission section 300A is optically transmitted to the optical waveguide 203 of the optical connector 10 via the reflection mirror 211 (see FIG. 6) provided at the end portion 206 of the optical waveguide 203. Optically coupled optical signals output from the optical waveguide 203 of the optical connector 10 via the reflecting mirror 211 of the end portion 206 are optically coupled to the incident portion 306a of the optical receiving portion 300B. The alignment between the optical connector 10 and the input/output portion 306a can be performed by passive alignment using the alignment marker 209 (see FIG. 1) on the optical waveguide chip 200, for example.

Optical connector 10 is further mechanically connected to another optical connector 400 using mating pins 450 . Another optical connector 400 comprises an optical fiber 402 . The fitting pin 450 is inserted into the hole 105 (see FIG. 1) provided in the first surface 101 of the fitting member 100 on the optical connector 10 side and the hole similarly provided on the other optical connector 400 side. Thereby, the optical connector 10 and the other optical connector 400 are aligned. By connecting the optical connector 10 and another optical connector 400 in this way, the optical transmitter 300A and the optical receiver 300B of the optical module 20 can transmit and receive optical signals through the optical fiber 402 .

FIG. 3 is a cross-sectional view showing a configuration example of an opto-electric hybrid device 300 in the optical module 20 of FIG. FIG. 3 shows a cross section including the optical transmitter 300A. The opto-electric hybrid device 300 includes a substrate 302 , a semiconductor laser 303 , an optical modulator 304 , a first optical waveguide 305 , a second optical waveguide 306 , a grating coupler 307 , a driver IC 308 and electrical wiring 309 . The electrical wiring 309 includes vias 309a for conducting the upper surface 301 of the opto-electric hybrid device 300 and the surface of the substrate 302, and electrical wiring 309b formed on the surface of the substrate 302. FIG. Since FIG. 3 is a cross-sectional view of the opto-electric hybrid device 300, a set of a semiconductor laser 303, an optical modulator 304, a first optical waveguide 305, a second optical waveguide 306, a grating coupler 307, and electrical wiring are shown. Although only 309 is drawn, a plurality of sets of semiconductor lasers 303, optical modulators 304, first optical waveguides 305, second optical waveguides 306, grating couplers 307, and electrical wiring 309 are arranged in a direction perpendicular to the cross section in FIG. may be arranged in Also, the opto-electric hybrid device 300 may include a plurality of driver ICs 308 .

The substrate 302 is a Si (silicon) substrate or an SOI (Silicon on Insulator) substrate, and an optical modulator 304, a first optical waveguide 305, a grating coupler 307, and electrical wiring 309b are formed on its surface. Optical modulator 304 is optically connected to grating coupler 307 via first optical waveguide 305 . Optical modulator 304, first optical waveguide 305 (eg, Si waveguide), and grating coupler 307 can be formed on the surface of substrate 302 using silicon photonics technology.

A semiconductor laser 303 and a driver IC 308 are further mounted on the surface of the substrate 302 . The semiconductor laser 303 is arranged close to one end of the first optical waveguide 305 so that the emitted light is incident on the first optical waveguide 305 . The driver IC 308 is mounted on the substrate 302 using connection electrodes 315 (for example, ball grid array (BGA), etc.) that electrically connect electrical terminals (not shown) on the driver IC 308 side and electrical wiring 309b on the substrate 302 side. Implemented. The driver IC 308 is connected to the semiconductor laser 303, the optical modulator 304, and the via 309a via electrical wiring 309b, and drives the semiconductor laser 303 and the optical modulator 304 based on the electrical signal input from the via 309a. configured as

A second optical waveguide 306 is formed on the substrate 302 so as to stand vertically or obliquely with respect to the substrate 302 . The inclination angle of the second optical waveguide 306 with respect to the substrate 302 is in the range of 0 to 10 degrees, for example. The end of the second optical waveguide 306 on the side of the substrate 302 is located directly above the grating coupler 307 , and the end 306 a of the second optical waveguide 306 on the side opposite to the substrate 302 is located on the upper surface 301 of the opto-electric hybrid device 300 . are doing.

In addition, such a second optical waveguide 306 erected on the substrate 302 is formed by, for example, irradiating a UV curable resin coated with a predetermined thickness on the substrate 302 with a thin UV light beam from above the substrate 302 to obtain a UV light beam. A curable resin can be made by curing in columns only where the UV light beam passes. In a mode in which the second optical waveguide 306 is formed to stand obliquely with respect to the substrate 302, the UV light beam is reflected obliquely on the surface of the substrate 302, and even an unintended portion of the UV curable resin is damaged. To avoid curing, the surface of the substrate 302 is preferably preformed with a UV absorbing film (not shown) to absorb the UV light beam and reduce its reflection.

In the opto-electric hybrid device 300 (optical transmitter 300A) configured as described above, an electrical signal for operating the driver IC 308 is input to the opto-electric hybrid device 300 through the via 309a. A driver IC 308 drives the semiconductor laser 303 and the optical modulator 304 based on this electrical signal. The light emitted from the semiconductor laser 303 is modulated by the optical modulator 304, diffracted by the grating coupler 307, and its optical path is converted in a direction substantially perpendicular to the substrate 302, and the light passes through the second optical waveguide 306. It is output from the end portion 306 a on the upper surface 301 of the electrical hybrid device 300 . The output light from this end portion 306a is input to the optical waveguide chip 200 of the optical connector 10 mounted on the opto-electric hybrid device 300, as described above.

FIG. 4 is another cross-sectional view showing a configuration example of the opto-electric hybrid device 300 in the optical module 20 of FIG. FIG. 4 shows a cross section including the optical receiver 300B. 3 and 4 show different cross sections of the same opto-electric hybrid device 300. FIG. In FIG. 4, the same reference numerals are given to the same components as those in FIG. 3 described above. As shown in FIG. 4, the opto-electric hybrid device 300 includes a light receiving element (photodiode) 310 below the second optical waveguide 306 on the substrate 302 .

The light receiving element 310 can be formed directly on the surface of the substrate 302 using, for example, silicon photonics technology, or a separately manufactured chip-type light receiving element 310 can be mounted on the substrate 302 . The light receiving element 310 is connected to the driver IC 308 via an electrical wiring 309b. The driver IC 308 may be a transimpedance amplifier (TIA) for IV (current voltage) conversion of the photoelectrically converted current signal output from the light receiving element 310 .

In the opto-electric hybrid device 300 (optical receiver 300B) configured in FIG. 4, an optical signal from the optical connector 10 mounted on the opto-electric hybrid device 300 is transmitted to the second optical waveguide 306 through its end 306a. It is input and made incident on the light receiving element 310 . The light receiving element 310 photoelectrically converts the optical signal to generate a current signal. The current signal is sent to the driver IC 308 via the electric wiring 309b, and the driver IC 308 IV-converts the current signal to generate and output a voltage signal. An electric signal from the driver IC 308 is output to the outside of the device 300 through the via 309a.

FIG. 5 is a diagram showing the detailed configuration of the optical waveguide chip 200 that constitutes the optical connector 10 according to this embodiment. 6 is a perspective view showing the arrangement of the optical waveguide 203 provided in the optical waveguide chip 200 and the second optical waveguide 306 provided in the opto-electric hybrid device 300 (for ease of understanding, however, the optical waveguide 203 is shown in FIG. 6). and the second optical waveguide 306 are omitted). The optical waveguides 203 formed on the optical waveguide chip 200 consist of a first group of optical waveguides 203A and a second group of optical waveguides 203B. The optical waveguides 203A in the first group are optical waveguides connected to the optical transmitter 300A when the optical connector 10 is mounted on the opto-electric hybrid device 300, and the optical waveguides 203B in the second group are optical receivers 300B. is an optical waveguide connected to The optical waveguides 203A of the first group and the optical waveguides 203B of the second group are formed in a tapered shape in which the cross-sectional area of the waveguides changes along the longitudinal direction of the waveguides.

More specifically, the first group of optical waveguides 203A is formed in a tapered shape such that the cross-sectional area of the waveguide increases from the end face 201 side of the optical waveguide chip 200 toward the end face 204 side. Preferably, the cross-sectional area of the end portion 206 of the first group of optical waveguides 203A is equal to the cross-sectional area of the output portion (end portion of the second optical waveguide 306) 306a of the optical transmission section 300A connected to the first group of optical waveguides 203A. The cross-sectional area is larger than the area. As a result, the light emitted from the light emitting portion 306a of the optical transmission section 300A can be made incident on the ends 206 of the optical waveguides 203A of the first group with high coupling efficiency. of light loss can be reduced.

On the other hand, the second group of optical waveguides 203B is tapered such that the cross-sectional area of the waveguides decreases from the end face 201 side of the optical waveguide chip 200 toward the end face 204 side. Preferably, the cross-sectional area at the end 206 of the second group of optical waveguides 203B is the cross section of the incident portion (the end of the second optical waveguide 306) 306a of the optical receiver 300B connected to the second group of optical waveguides 203B. The cross-sectional area is smaller than the area. As a result, the light emitted from the ends 206 of the optical waveguides 203B of the second group can be made incident on the incident portion 306a of the optical receiver 300B with high coupling efficiency. of light loss can be reduced.

As shown in FIG. 5, the change in the cross-sectional area of the optical waveguide 203 is the width W of the optical waveguide 203 (that is, the dimension in the direction parallel to the upper surface 202 of the optical waveguide chip 200 and perpendicular to the longitudinal direction of the waveguide). ) and/or by changing the height H of the optical waveguide 203 (that is, the dimension of the optical waveguide chip 200 in the thickness direction).

FIG. 7 is a cross-sectional view showing the configuration near the end 206 of the optical waveguide 203. As shown in FIG. As described above, at the end 206 of the optical waveguide 203, there is a reflection mirror 211 (see FIG. 6) for bending light between the optical waveguide 203 of the optical connector 10 and the second optical waveguide 306 of the opto-electric hybrid device 300. ) is provided. Reflecting mirror 211 can be a total reflecting mirror made by forming end 206 of optical waveguide 203 obliquely with respect to its optical axis. As shown in FIG. 7, the reflective surface of total reflection mirror 211 can be either planar 211a or spherical or aspherical 211b. When the reflecting surface of the total reflection mirror 211 is spherical or aspherical 211b, this mirror 211 functions as a condensing mirror, and between the optical waveguide 203 of the optical connector 10 and the second optical waveguide 306 of the opto-electric hybrid device 300, It is preferred because the light is concentrated and coupled with high efficiency.

8A to 8C are diagrams showing the manufacturing process of the optical waveguide chip 200 constituting the optical connector 10 according to this embodiment. This figure shows the state of the optical waveguide chip 200 viewed from the direction of arrow C shown in FIG. First, resin 212 is molded to a uniform thickness on base plate 210 (FIG. 8A). Next, a mold 213 having a shape corresponding to the optical waveguide 203 and the semi-cylindrical groove 208 to be fabricated is pressed onto the resin 212 to transfer the shapes of the optical waveguide 203 and the groove 208 to the resin 212 (FIG. 8B). ). Next, a transparent resin 214 having a predetermined refractive index is poured into grooves formed by embossing in the portion that will become the optical waveguide 203, and cured (FIG. 8C). By making the shape of the mold 213 into the shape of an optical waveguide whose width and height change in the longitudinal direction, the tapered optical waveguide 203 as shown in FIGS. 5 and 6 is completed. By using the mold 213, the optical waveguide 203 whose height changes in the longitudinal direction can be manufactured by a simple process. Moreover, by using the mold 213, the reflecting mirror 211 at the end 206 of the optical waveguide 203 and the groove 208 forming part of the alignment hole 105 can be formed simultaneously with the optical waveguide 203 at once.

Note that the base plate 210 may be made of any material such as resin, glass, or metal. If the base plate 210 is made of clear resin or glass, the stamped resin 212 may also be clear. In this case, the refractive index of the transparent resin 214 embedded in the embossed grooves is selected to be greater than the refractive index of the resin 212 . As a result, an optical waveguide having the transparent resin 214 in the groove as a core and the resin 212 as a clad is formed. A reflective coating film (for example, a metal film) may be formed in advance on the surface of the groove in which the transparent resin 214 is embedded. In this case, resin 212 and base plate 210 may be opaque. Further, if the base plate 210 is made of metal (for example, aluminum), the base plate 210 itself is precision pressed to form grooves instead of stamping the resin 212 (without using the resin 212) as described above. An optical waveguide may be formed by pouring a transparent resin 214 into the . When a reflective coating film is formed on the surface of the groove in the portion that will become the optical waveguide 203, or when the base plate 210 is made of metal, the groove is not filled with the transparent resin 214, but is left as an air layer so that the light is guided by the air layer. A wave path 203 may be configured.

The optical waveguide chip 200 can also be produced by a method other than the method of pressing the mold 213 onto the resin 212 as described above. For example, the transparent base plate 210 and the mold 213 are arranged with a gap therebetween, an ultraviolet curable resin is injected into the gap, and ultraviolet rays are irradiated from the transparent base plate 210 side to cure the resin. It is also possible to form grooves (grooves 208 and grooves in the optical waveguide 203 portion) of the same shape as 8B.

Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications can be made without departing from the scope of the invention.

10 Optical connector 20 Optical module 100 Fitting member 101 First surface 102 Second surface 103 Cavity 104 Groove 105 Hole 200 Optical waveguide chip 201 End surface 202 Upper surface (interface surface)
203 Optical waveguide 203A First group of optical waveguides 203B Second group of optical waveguides 204 End surface 205 Optical waveguide end 206 Optical waveguide end 207 Incident/emitted light 208 Groove 209 Alignment marker 210 Base plate 211 Reflecting mirror 213 Mold 300 Opto-electric mixed mounting Device 300A Optical transmitter 300B Optical receiver 301 Upper surface 302 Substrate 303 Semiconductor laser 304 Optical modulator 305 First optical waveguide 306 Second optical waveguide 306a Second optical waveguide end 307 Grating coupler 308 Driver IC
309 electric wiring 310 light receiving element 315 connection electrode 400 other optical connector 402 optical fiber 450 fitting pin

Claims (14)

a fitting member having a cavity;
an optical waveguide chip inserted into the cavity of the fitting member;
An optical connector comprising
The optical waveguide chip is
a base plate;
one or more tapered optical waveguides formed on the base plate;
an optical connector. 2. The optical connector of claim 1, wherein said optical waveguide chip comprises said array of tapered optical waveguides. The array of tapered optical waveguides comprises:
a first group of tapered optical waveguides in which the cross-sectional area of the waveguide increases from one end to the other end of the base plate;
a second group of tapered optical waveguides whose cross-sectional area decreases from the one end of the base plate to the other end;
3. The optical connector of claim 2, comprising: 4. The one or more tapered optical waveguides according to any one of claims 1 to 3, wherein the height of the waveguides in the thickness direction of the base plate varies along the longitudinal direction of the optical waveguides. or the optical connector according to item 1. The one or more tapered optical waveguides are configured such that the width of the waveguide in a direction perpendicular to the thickness direction of the base plate varies along the longitudinal direction of the optical waveguide. 5. The optical connector according to any one of 4. 6. The optical connector according to any one of claims 1 to 5, wherein said one or more tapered optical waveguides have a reflecting structure for bending the optical path at the end opposite to said fitting member. 7. The optical connector according to claim 6, wherein said reflective structure is an inclined end surface of said optical waveguide. 8. The optical connector of claim 7, wherein the slanted end face of the optical waveguide is a spherical or aspherical condensing mirror. 9. The optical connector according to claim 1, wherein said one or more tapered optical waveguides are constructed using grooves formed on said base plate. 10. The optical connector according to claim 9, wherein said one or more tapered optical waveguides are composed of resin embedded in said grooves. 11. The optical connector according to claim 9 or 10, wherein a reflective coating is formed on said groove on said base plate. The optical waveguide chip has a first groove in a portion to be inserted into the fitting member,
the fitting member has a second groove corresponding to the first groove in the cavity;
When the optical waveguide chip is inserted into the fitting member, the first groove and the second groove form alignment holes for connecting the optical connector to another optical connector,
An optical connector according to any one of claims 1 to 11. an opto-electric hybrid device having an optical transmission/reception function;
The optical connector according to any one of claims 1 to 12, mounted on the opto-electric hybrid device;
module with optical connector. 14. The module with an optical connector according to claim 13, wherein said optical connector has an alignment marker on said optical waveguide chip for aligning said optical connector and said opto-electric hybrid device.

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