JP2023003539A - holding member - Google Patents

Abstract

To provide a technique to suppress arcing relating to a connection terminal built in a holding member.SOLUTION: A holding member comprises: a plate-like member having a first principal surface on which an object is placed and a second principal surface which is a rear face of the first principal surface; a base member which has a third principal surface bonded to the second principal surface of the plate-like member, and which has a hole part opened on the third principal surface; and an insulation terminal part which is bonded to the second principal surface of the plate-like member, and at least part of which is disposed inside the hole part of the base member. The insulation terminal part has: a terminal whose central axis is bonded substantially perpendicular to the second principal surface of the plate-like member; a first insulation member in a hollow tubular shape which is disposed on the outer periphery of the terminal; and a second insulation member which covers at least part of the outer peripheral edge of a bonding surface between the first insulation member and the plate-like member.SELECTED DRAWING: Figure 2

Description

The present invention relates to a holding member that holds an object.

2. Description of the Related Art For example, an electrostatic chuck is used as a holding member that holds an object such as a wafer when manufacturing semiconductors. A known electrostatic chuck device includes a metal base member and a ceramic substrate (also referred to as a “placement substrate” on which an object is placed) provided on the base member. Among such electrostatic chucks, conventionally, there is a metal base member in which connection terminals for electrical connection with an external device are arranged (see, for example, Patent Documents 1 and 2).

JP 2010-103321 A JP 2015-207765 A

If the connection terminals are arranged inside the metal base member, arcing may occur between the metal base member and the connection terminals. Even if the base member is not made of metal, for example, if the joint between the mounting substrate and the base member is made of metal, arcing may occur between the joint and the connection terminal.

SUMMARY OF THE INVENTION An object of the present invention is to provide a technique for suppressing arcing related to connection terminals built in a holding member.

The present invention has been made to solve the above problems, and can be implemented as the following modes.

(1) According to one aspect of the present invention, a holding member is provided. The holding member includes a plate-like member having a first main surface on which the object is placed and a second main surface that is the back surface of the first main surface, and the second main surface of the plate-like member. a base member having a third main surface joined to the surface and having a hole opening in the third main surface; an insulating terminal part at least part of which is arranged in the hole, wherein the insulating terminal part is a terminal whose central axis is substantially perpendicularly joined to the second main surface of the plate-shaped member. and a hollow tubular first insulating member arranged on the outer periphery of the terminal, formed over a part of the outer peripheral surface of the first insulating member and a part of the second main surface of the plate-like member, a second insulating member that covers at least a part of an outer peripheral edge of a joint surface between the first insulating member and the plate-like member; A first line indicating the surface of the member is defined by a first point at which the second line indicating the outer peripheral surface of the first insulating member and the first line meet, and the first line of the plate member. A curve recessed on the side of the second line and the third line from an imaginary straight line connecting a third line indicating the second principal surface and a second point at which the first line is in contact. is.

According to this configuration, since the joint between the first insulating member and the plate member is covered with the second insulating member, it is possible to enhance the insulation. Therefore, it is possible to suppress arcing related to the terminals, such as arcing between the base member and the terminal, arcing between the joining member of the plate member and the base member and the terminal. As a result, the second insulating member can maintain the joint strength between the first insulating member and the plate-like member and suppress arcing.

Further, in the cross section of the holding member including the central axis of the terminal, the first line indicating the surface of the second insulating member is the point where the second line indicating the outer peripheral surface of the first insulating member and the first line meet. and a second point where the first line and the third line representing the second principal surface of the plate-shaped member are in contact with each other, the second line and It is a curved line recessed on the third line side. That is, since the first line indicating the surface of the second insulating member is recessed from the imaginary straight line, interference with the base member is reduced compared to the case where the first line indicating the surface of the second insulating member coincides with the imaginary straight line. can be suppressed. In addition, since the second insulating member is thinner than when the first line indicating its own surface coincides with the imaginary straight line, when the second insulating member is formed of a material with relatively low thermal conductivity, It is possible to suppress deterioration in heat transfer between the plate member and the base member.

(2) In the holding member of the above aspect, the second insulating member may cover the entire outer peripheral edge of the joint surface between the first insulating member and the plate member. By doing so, the insulation can be further enhanced, and arcing can be further suppressed. Moreover, the bonding strength between the first insulating member and the plate-shaped member by the second member can be further improved.

(3) In the holding member of the above aspect, the insulating member is disposed between the second main surface of the plate-like member and the first insulating member, and joins the plate-like member and the first insulating member. A joint portion may be further provided, and the second insulating member may be integrally formed so as to be connected to the joint portion. This is preferable because the strength is improved compared to the case where there is a boundary between the joint and the second insulating member. Moreover, the number of man-hours for manufacturing the holding member can be reduced as compared with the case where the joint portion and the second insulating member are separately formed.

(4) In the holding member of the above aspect, the coefficient of thermal expansion of the material forming the plate member is different from the coefficient of thermal expansion of the material forming the base member, and the base member It may be arranged with a gap from the member. In this way, when the plate-shaped member and the base member expand and contract with the temperature change of the holding member, it is possible to prevent the second insulating member and the base member from coming into contact with each other and exerting force on each other. can.

It should be noted that the present invention can be implemented in various forms, for example, in the form of a semiconductor manufacturing apparatus including a holding member, a method of manufacturing a holding member, and the like.

1 is a perspective view schematically showing the external configuration of an electrostatic chuck of an embodiment; FIG. It is an explanatory view showing roughly the XZ section composition of an electrostatic chuck. It is explanatory drawing which shows roughly the XZ cross-sectional structure of an insulated terminal part. FIG. 4 is an explanatory view schematically showing the AA cross section shown in FIG. 3; It is explanatory drawing which expands and shows the P section shown in FIG. It is explanatory drawing of the formation method of an insulated terminal part. It is an explanatory view showing roughly a section composition of some electrostatic chucks of a comparative example.

FIG. 1 is a perspective view schematically showing the external configuration of an electrostatic chuck 10 according to one embodiment of the invention. FIG. 2 is an explanatory view schematically showing the XZ cross-sectional configuration of the electrostatic chuck 10. As shown in FIG. In FIG. 2, the Y-axis positive direction is the direction toward the back side of the paper. The drawing shows mutually orthogonal XYZ axes for orientation. In this specification, for the sake of convenience, the positive direction of the Z-axis is referred to as the upward direction, and the negative direction of the Z-axis is referred to as the downward direction. may be

The electrostatic chuck 10 is a device that attracts and holds an object (for example, a wafer W) by electrostatic attraction, and is used, for example, to fix the wafer W within a vacuum chamber of a semiconductor manufacturing apparatus. The electrostatic chuck 10 includes a plate-like member 100 and a base member 200 arranged side by side in the vertical direction (Z-axis direction). The electrostatic chuck 10 in this embodiment is also called a "holding member".

The plate-like member 100 is a plate-like member having a first main surface S1 that is a substantially circular planar mounting surface and a second main surface S2 that is the rear surface of the first main surface S1, and is made of ceramic (for example, , ceramic whose main component is alumina, aluminum nitride, or the like). A recess 102 is formed on the second main surface S2 of the plate-like member 100 (FIG. 2) to which an insulating terminal portion 300, which will be described later, is joined.

Inside the plate member 100, an attraction electrode 120 (FIG. 2) made of a conductive material (for example, a material containing tungsten, molybdenum, etc. as a main component) is arranged. The shape of the attraction electrode 120 as viewed in the Z-axis direction is, for example, a substantially circular shape. When a voltage is applied to the attraction electrode 120 from a power source (not shown), electrostatic attraction is generated, and the wafer W is attracted and fixed to the first main surface S1 of the plate member 100 by this electrostatic attraction.

The base member 200 is a plate-like member having a substantially circular planar third main surface S<b>3 with a diameter larger than that of the plate-like member 100 . As shown in FIG. 2, the third main surface S3 of the base member 200 is joined to the second main surface S2 of the plate-like member 100 via the joining member 500 so that the plate-like member 100 and the base member 200 are joined. there is The base member 200 is made of a metal material such as aluminum or an aluminum alloy. The joining member 500 is made of, for example, an adhesive such as silicone resin, acrylic resin, or epoxy resin, and is more preferably a silicone adhesive that is excellent in flexibility and heat resistance. In this embodiment, the material forming the plate member 100 and the material forming the base member 200 have different thermal expansion coefficients.

A coolant flow path (not shown) is formed inside the base member 200, and when a coolant (for example, fluorine-based inert liquid or water) flows through the coolant flow path, the base member 200 is cooled, and the joint member The heat transfer between the base member 200 and the plate-like member 100 through the plate-like member 100 cools the plate-like member 100 , thereby cooling the wafer W held on the first main surface S<b>1 of the plate-like member 100 . Thereby, the temperature control of the wafer W is realized.

Further, as shown in FIG. 2, the base member 200 is formed with a hole portion 210, which is a through hole that opens to the third main surface S3. An insulating terminal portion 300 is arranged inside the hole portion 210 .

FIG. 3 is an explanatory view schematically showing the XZ cross-sectional configuration of the insulating terminal portion 300. As shown in FIG. FIG. 4 is an explanatory view schematically showing the AA cross section shown in FIG. FIG. 5 is an explanatory diagram showing an enlarged portion P shown in FIG.

As shown in FIG. 3 , the insulating terminal portion 300 includes a terminal 310 , a hollow cylindrical first insulating member 320 arranged around the terminal 310 , and a second insulating member 330 . In this embodiment, terminal 310 is a female terminal. The terminal 310 is joined to the concave portion 102 of the second main surface S2 of the plate-like member 100 so that its central axis LO is substantially perpendicular. The terminal 310 is joined to the plate member 100 by brazing, for example. The terminal 310 is electrically connected to the attraction electrode 120 by an electrode terminal (not shown). When a male terminal electrically connected to an external device is inserted into the hole 312 of the terminal 310 and electrically connected to the terminal 310, the electrostatic chuck 10 and the external device are electrically connected.

The first insulating member 320 is joined to the second main surface S2 of the plate member 100 via the joining portion 400 with one end of the first insulating member 320 in the recess 102 of the second main surface S2 of the plate member 100. there is As shown, the terminals 310 are arranged inside the first insulating member 320 . In this embodiment, the first insulating member 320 is mainly composed of polyimide (PI). In other embodiments, thermosetting resins with high heat resistance such as phenolic resins, melamine resins, epoxy resins, and silicone resins may be used as main components. Further, in the present embodiment, the bonding portion 400 is mainly composed of silicone resin. In another embodiment, the main component may be thermosetting insulating resin having high heat resistance such as epoxy resin or polyurethane.

The second insulating member 330 is formed over a portion of the outer peripheral surface 322 of the first insulating member 320 and a portion of the second main surface S2 of the plate member 100 (FIG. 3). It covers the entire outer peripheral edge 326 (FIG. 4) of the joint surface 324 with the shaped member 100 . In other words, the second insulating member 330 covers the entire outer peripheral edge of the joint portion 400 . As shown in FIG. 4, the XY cross-sectional shape of the second insulating member 330 is substantially annular. In this embodiment, the second insulating member 330 is mainly composed of silicone resin. In another embodiment, the main component may be thermosetting insulating resin having high heat resistance such as epoxy resin or polyurethane.

In this embodiment, the second insulating member 330 is made of the same material as the joint portion 400 and is integrally formed with the joint portion 400 .

As shown in FIG. 5, in a cross section including the central axis LO of the terminal 310 of the electrostatic chuck 10, a first line L1 indicating the surface of the second insulating member 330 indicates the outer peripheral surface 322 of the first insulating member 320. A first point P1 where the second line L2 and the first line L1 meet, and a third line L3 indicating the second main surface S2 of the plate member 100 and the first line L1 meet. It is a curved line recessed toward the second line L2 and the third line L3 from the imaginary straight line VL connecting the second point P2, which is a point. In other words, the area of the cross section of the second insulating member 330 including the central axis LO of the terminal 310 is smaller than the area of the triangle formed by the first line L1, the second line L2 and the imaginary straight line VL. That is, the second insulating member 330 is thinner and has a smaller volume than when the first line L1 indicating its surface coincides with the imaginary straight line VL. In the present embodiment, the second insulating member 330 is mainly composed of silicone resin, and silicone resin has low thermal conductivity. Further, by making the cross-sectional shape of the second insulating member 330 as described above, interference with the base member 200 can be suppressed.

6A and 6B are explanatory diagrams of a method of forming the insulating terminal portion 300. FIG. FIG. 6 shows a cross section corresponding to FIG. First, as shown in FIG. 6A, a plate-shaped member 100 having a terminal 310 joined to a concave portion 102 of the second main surface S2 by brazing is prepared. Next, as shown in FIG. 6B, an adhesive G containing silicone resin as a main component is injected into the gap between the recess 102 of the second main surface S2 of the plate member 100 and the terminal 310 . Further, the same adhesive G containing silicone resin as a main component is applied to the outer peripheral surface 314 of the terminal 310 . Then, the terminal 310 is covered with the first insulating member 320 so that the terminal 310 enters the inner cavity of the first insulating member 320 . As shown in FIG. 6C, when one end of the first insulating member 320 is pushed into the recess 102 of the second main surface S2 of the plate member 100, the adhesive G injected into the recess 102 is extruded. and hardened to form the second insulating member 330 .

FIG. 7 is an explanatory view schematically showing a partial cross-sectional configuration of an electrostatic chuck 10P of a comparative example. FIG. 7 is a diagram corresponding to FIG. The electrostatic chuck 10P of the comparative example differs from the electrostatic chuck 10 of the above embodiment in the configuration of the insulating terminal portion 300P and the surface SC of the hole portion 210P of the base member 200P. The same components as those of the electrostatic chuck 10 of the embodiment are denoted by the same reference numerals, and the preceding description is referred to.

In the electrostatic chuck 10P of the comparative example, the insulating terminal portion 300P includes the terminals 310 and the first insulating member 320, and does not include the second insulating member 330 of the above embodiment. That is, in the electrostatic chuck 10P of the comparative example, the outer peripheral edge 326 of the joint surface 324 of the first insulating member 320 with the plate member 100 is not covered with the insulating member. Further, in the base member 200P, the C-chamfered surface SCP of the opening of the hole portion 210P on the third main surface S3 side is smaller than the surface SC of the above embodiment. That is, the base member 200P of the comparative example has a C-chamfer depth shallower than that of the base member 200 of the above-described embodiment. Therefore, the distance between the terminal 310 and the base member 200P is shorter than that of the electrostatic chuck 10 of the above embodiment, and the insulation of the joint portion between the plate member 100 and the first insulating member 320 is also the same as that of the electrostatic chuck 10 of the embodiment. , arcing is likely to occur between the terminal 310 and the base member 200P.

In contrast, according to the electrostatic chuck 10 of the present embodiment, the second insulating member 330 covers the entire outer peripheral edge 326 ( FIG. 4 ) of the joint surface 324 between the first insulating member 320 and the plate member 100 . Therefore, it is possible to strengthen the insulation. Therefore, arcing between the terminal 310 and the base member 200 can be suppressed as compared with the electrostatic chuck 10P of the comparative example.

In the plate-shaped member 100 of the present embodiment, the corners of the opening of the hole portion 210 of the base member 200 on the third main surface S3 side are chamfered (45° chamfered), and the chamfered surface SC and the second insulating member 330 are formed large enough not to interfere with each other. Therefore, the base member 200 and the second insulating member 330 are arranged with a gap therebetween. Arcing between the terminal 310 and the base member 200 can also be suppressed by this.

Moreover, since the XZ cross-sectional shape of the second insulating member 330 is the shape shown in FIG. 5 and is a recessed shape, interference with the base member 200 can be suppressed. In other words, it is possible to prevent the base member 200 from being carried by the second insulating member 330 . Moreover, since the second insulating member 330 is thin and has a small volume, it is possible to suppress deterioration in heat transfer between the plate member 100 and the base member 200 .

In this embodiment, the plate member 100 is made of ceramic, and the base member 200 is made of metal, and have different coefficients of thermal expansion. When the plate member 100 and the base member 200 expand and contract due to temperature changes during use of the electrostatic chuck 10, if there is no gap between the base member 200 and the second insulating member 330, the plate shape Due to the difference in coefficient of thermal expansion between the member 100 and the base member 200, the second insulating member 330 may hit the base member 200 and be damaged. In contrast, according to the plate-like member 100 of the present embodiment, the base member 200 and the second insulating member 330 are arranged with a gap therebetween. Interference between the member 200 and the second insulating member 330 can be suppressed, and damage to the second insulating member 330 can be suppressed.

Furthermore, in the present embodiment, since the second insulating member 330 is integrally formed by being connected to the joint portion 400, the electrostatic discharge is reduced compared to the case where the joint member 500 and the second insulating member 330 are separately formed. The manufacturing man-hours of the chuck 10 can be reduced.

<Modified example of the present embodiment>
The present invention is not limited to the above-described embodiments, and can be implemented in various aspects without departing from the scope of the invention. For example, the following modifications are possible.

- In the above-described embodiment, the second insulating member 330 covers the entire outer peripheral edge 326 of the joint surface 324 between the first insulating member 320 and the plate member 100. It may be configured to partially cover the outer peripheral edge 326 of the joint surface 324 between the member 320 and the plate member 100 . Even in this way, arcing can be suppressed as compared with a configuration without the second insulating member 330 (for example, the electrostatic chuck 10P of the comparative example).

- In the above-described embodiment, the second insulating member 330 is connected to the joint portion 400 and integrally formed, but the second insulating member 330 and the joint portion 400 may be configured separately. For example, after the second insulating member 330 is joined to the plate-like member 100 via the joining portion 400 , a thermosetting adhesive is applied so as to cover the outer peripheral edge 326 of the joint surface 324 of the first insulating member 320 to the plate-like member 100 . The second insulating member 330 may be formed by applying an adhesive mainly composed of an insulating resin and curing the adhesive. Alternatively, the second insulating member 330 formed in advance may be joined after the second insulating member 330 is joined to the plate member 100 via the joining portion 400 . When the second insulating member 330 and the joint portion 400 are configured separately, the second insulating member 330 and the joint portion 400 may be made of different materials.

- The formation method of the insulation terminal part 300 is not limited to the said embodiment.

- In the above-described embodiment, the configuration may be such that the joint portion 400 is not provided. For example, the first insulating member 320 may be joined to the plate-like member 100 by fitting, and the joint between the first insulating member 320 and the plate-like member 100 may be strengthened by the second insulating member 330 .

The coefficient of thermal expansion of the material forming the plate member 100 and the coefficient of thermal expansion of the material forming the base member 200 may be the same. Also, the coefficient of thermal expansion of the material forming the plate member 100 may be greater than the coefficient of thermal expansion of the material forming the base member 200 .

- Although the base member 200 and the second insulating member 330 are arranged with a gap in the above embodiment, the base member and the second insulating member may be arranged without a gap.

- Although the female terminal was illustrated as the terminal 310 in the said embodiment, you may use a male terminal. When a male terminal is used as the terminal of the insulated terminal portion, the first insulating member is arranged on the outer periphery of the male terminal so that it is arranged on the outer periphery of the female terminal in a state where the female terminal of the external device is connected to the male terminal. be done.

- The forming material of each member constituting the electrostatic chuck 10 is not limited to the above embodiment. For example, materials other than metal, such as ceramics (AlSi, Si, etc.), may be used as the material for forming the base member. When both the plate-like member and the base member are ceramic members, the plate-like member and the base member may be joined by a joining member made of metal, for example. Even in such a configuration, if the insulating terminal portion is configured as in the above embodiment, arcing between the terminal and the metal joint member can be suppressed.

In the electrostatic chuck 10 of the above-described embodiment, a plurality of resistive heating elements made of a conductive material (for example, a material containing tungsten or molybdenum as a main component) is further provided inside the plate member 100 . heater electrodes may be provided. In this way, the plate-like member 100 is warmed by the heat generated by the heater electrode, and the wafer W held on the first main surface S1 of the plate-like member 100 can be warmed. Thereby, the temperature control of the wafer W can be performed more accurately.

- In the above embodiment, the holding member is an electrostatic chuck, but the holding member is not limited to the electrostatic chuck, and can be configured as various holding members that hold an object on the surface of a plate member. can. For example, it can be configured as a heater device for vacuum devices such as CVD, PVD, PLD, etching, etc., a susceptor, and a mounting table.

- In the above-described embodiment, the plate-like member 100 that is a plate-like member having a substantially circular plane was exemplified, but the planar shape of the plate-like member 100 is not limited to the above-described embodiment. For example, it may be a plate-shaped member such as a rectangular plane or a polygonal plane.

Although the present invention has been described above based on the embodiments and modifications, the above-described embodiments are intended to facilitate understanding of the present invention, and do not limit the present invention. The present invention may be modified and modified without departing from the spirit and scope of the claims, and the present invention includes equivalents thereof. Also, if the technical features are not described as essential in this specification, they can be deleted as appropriate.

DESCRIPTION OF SYMBOLS 10, 10P... Electrostatic chuck 100... Plate-shaped member 102... Recessed part 120... Adsorption electrode 200, 200P... Base member 210, 210P, 312... Hole part 300, 300P... Insulated terminal part 310... Terminal 314... Outer peripheral surface 320... Third 1 insulating member 322 outer peripheral surface 324 joint surface 326 outer peripheral edge 330 second insulating member 400 joint 500 joint member G adhesive L1 first line L2 second line L3 third Line LO... Central axis line P1... First point P2... Second point S1... First main surface S2... Second main surface S3... Third main surface SC, SCP... Surface VL... Virtual straight line W... Wafer

Claims (4)

A holding member that holds an object,
a plate-shaped member having a first main surface on which the object is placed and a second main surface that is the back surface of the first main surface;
a base member having a third main surface that is joined to the second main surface of the plate-like member and having a hole that opens to the third main surface;
an insulating terminal portion that is joined to the second main surface of the plate-like member and at least a portion of which is arranged in the hole of the base member;
The insulated terminal portion is
a terminal whose central axis is substantially perpendicular to the second main surface of the plate-like member;
a hollow tubular first insulating member disposed around the terminal;
It is formed over part of the outer peripheral surface of the first insulating member and part of the second main surface of the plate-like member, and is at least the outer peripheral edge of the joint surface between the first insulating member and the plate-like member. a second insulating member covering a portion;
with
In a cross section including the central axis of the terminal of the holding member, the first line indicating the surface of the second insulating member is the second line indicating the outer peripheral surface of the first insulating member and the first line. and a second point where a third line indicating the second main surface of the plate member and the first line are in contact with each other, a virtual straight line connecting characterized by being a curve recessed on the side of the second line and the third line,
holding member. The holding member according to claim 1,
The second insulating member covers the entire outer peripheral edge of the joint surface between the first insulating member and the plate member,
holding member. The holding member according to any one of claims 1 and 2,
further comprising an insulating joint disposed between the second main surface of the plate-shaped member and the first insulating member and joining the plate-shaped member and the first insulating member;
The second insulating member is connected to the joint and integrally formed,
holding member. The holding member according to at least one of claims 1 to 3,
a coefficient of thermal expansion of a material forming the plate member and a coefficient of thermal expansion of a material forming the base member are different,
The base member is arranged with a gap from the second insulating member,
holding member.

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