JP2023000610A - Processing device - Google Patents

Abstract

To suppress adhesion of a processed waste to an exposed holding surface.SOLUTION: In a first grinding device 1 including a first chuck table 21 for sucking and holding a workpiece on a suction surface 610, and a grinding mechanism 3 for grinding the workpiece sucked and held on the suction surface 610, the suction surface 610 has at least a first suction surface 611 for sucking and holding a lower surface 112 of a first workpiece 11 and a second suction surface 612 for sucking and holding a lower surface 122 of a second workpiece 12. When the first suction surface 611 is made to communicate with a suction source 7 and the first workpiece 11 sucked and held on the first suction surface 611 is ground, a fluid is jetted from the second suction surface 612 by a fluid jet mechanism 101. Thereby, adhesion of the processing waste to the exposed second suction surface 612 can be suppressed.SELECTED DRAWING: Figure 1

Description

The present invention relates to processing equipment.

As disclosed in Patent Document 1, a grinding apparatus includes a chuck table capable of sucking and holding at least two different sizes of workpieces, and grinds the workpieces sucked and held by the chuck table with a grinding wheel. ing.

The chuck table exposes a holding surface for holding a large-area workpiece while holding a small-area workpiece.

JP 2013-226607 A

As a result, there is a problem that when a workpiece having a small area is held on the holding surface and ground, the machining waste generated adheres to the holding surface exposed around the workpiece.
Therefore, when grinding a small workpiece, there is a problem that it is desirable to suppress the adhesion of processing waste to the exposed holding surface.

A first processing apparatus of the present invention is a processing apparatus comprising a chuck table that sucks and holds a workpiece on a suction surface, and a machining mechanism that processes the workpiece sucked and held on the suction surface, The suction surface includes a first suction surface for sucking and holding at least the lower surface of the first workpiece, and a second suction surface for sucking and holding the lower surface of the second workpiece, wherein the first suction surface sucks and holds the lower surface of the second workpiece. When processing the first workpiece, the fluid is ejected from a portion of the second suction surface where the first workpiece is not suctioned and held, and the second suction surface sucks and holds the first workpiece. A fluid ejecting mechanism is provided for ejecting fluid from a portion of the first suction surface that does not hold the second workpiece by suction when machining the second workpiece.
A second machining apparatus of the present invention includes a chuck table having at least two third suction surfaces for sucking and holding at least two workpieces, and machining the workpiece sucked and held on the third suction surfaces. and a machining mechanism, wherein when machining a workpiece suction-held with a suction source communicated with only one of the at least two third suction surfaces, a fluid is discharged from the other suction surface. A fluid ejection mechanism for ejecting is provided.
In the first or second processing apparatus described above, the fluid ejected by the fluid ejection mechanism is a mixed fluid of water and air, and the processing mechanism includes a grinding wheel for grinding the workpiece on its lower surface. The lower surface of the grinding wheel which is not in contact with the workpiece during grinding may be washed with the mixed fluid ejected by the fluid ejecting mechanism.

In the first machining apparatus, when the first workpiece sucked and held by the first suction surface is ground by the machining mechanism, the fluid is ejected from the second suction surface by the fluid ejection mechanism. This fluid can thus clean the underside of the grinding wheel. As a result, it is possible to suppress the attachment of processing waste generated during processing of the first workpiece to the second suction surface exposed during processing of the first workpiece.
In the second machining apparatus, when the machining mechanism grinds the workpiece sucked and held by the third suction surface, the fluid ejection mechanism ejects the fluid from the fourth suction surface. This fluid can thus clean the underside of the grinding wheel. As a result, it is possible to suppress the attachment of processing waste generated during processing of the workpiece to the fourth suction surface exposed during processing of the workpiece.

It is a perspective view of a first grinding device. It is a sectional view of a 1st chuck table, a 1st workpiece, and a grinding mechanism. 4 is a top view of the first chuck table 21; FIG. FIG. 4 is a top view of a second chuck table; FIG. 11 is a top view of a third chuck table; FIG. 11 is a top view of a fourth chuck table; (a) is a top view of a fifth chuck table on which a first workpiece is held by suction, and (b) is a top view of a fifth chuck table on which a second workpiece is held by suction. FIG. 11 is a top view of a sixth chuck table; FIG. 11 is a top view of a seventh chuck table; It is explanatory drawing of a 2nd grinding apparatus.

A first grinding device 1 shown in FIG. 1 is a device that grinds workpieces including a rectangular parallelepiped first workpiece 11 and a disk-shaped second workpiece 12 by a grinding mechanism 3 . The first grinding device 1 includes a base 10 extending in the Y-axis direction and a column 100 standing on the +Y direction side of the base 10 .

The first grinding device 1 has a first chuck table 21 on the base 10 that sucks and holds the workpiece with a suction surface 610 . The first chuck table 21 includes a disk-shaped suction portion 60 having a porous member and a frame 69 that supports the suction portion 60 .

The suction unit 60 includes a substantially rectangular parallelepiped first suction unit 61 and four arc columnar (having an arcuate cross section surrounded by a circular arc and a straight line) disposed outside the first suction unit 61 . 2 suction part 62 .

As shown in FIG. 2, the first suction portion 61 and the second suction portion 62 are formed by four partition plates 698 (two of them are shown in FIG. 2) erected on the frame 69. ).

A suction surface 610 that is the upper surface of the suction portion 60 is formed flush with the upper surface 690 of the frame 69 . The suction surface 610 is formed in a conical shape with its center 200 as its apex. As shown in FIG. 3, the suction surface 610 includes at least a substantially rectangular first suction surface 611 for sucking and holding the lower surface 112 (see FIG. 1) of the first workpiece 11, It is provided with four generally arcuate second suction surfaces 612 that suction and hold the lower surface 122 (see FIG. 1). The second suction surface 612 is arranged along the four sides of the first suction surface 611 . The first suction surface 611 is the upper surface of the first suction portion 61 , and each second suction surface 612 is the upper surface of each second suction portion 62 . The first chuck table 21 sucks and holds the lower surface 122 of the second workpiece 12 with a first suction surface 611 and a second suction surface 612 (suction surface 610).

The first chuck table 21 includes a base 699 that supports the frame 69, as shown in FIG. A plurality of screw through holes 697 are formed in the outer periphery of the frame 69 , and screw holes 695 are formed in the base 699 at positions corresponding to the screw through holes 697 of the frame 69 . In the first chuck table 21 , screws 696 are screwed into screw through holes 697 and screw holes 695 of the frame 69 , and the frame 69 is screwed to the base 699 .

As shown in FIG. 1, around the first chuck table 21, a cover 108 and a bellows 109 connected to the cover 108 so as to extend and contract are provided. When the first chuck table 21 is moved in the Y-axis direction by a horizontal movement mechanism (not shown), the cover 108 moves in the Y-axis direction together with the first chuck table 21, and the bellows 109 expands and contracts.

The first grinding device 1 includes a control section 19 that controls various mechanisms of the first grinding device 1 .

The 1st grinding device 1 is provided with the fluid ejection mechanism 101, as shown in FIG. The fluid ejection mechanism 101 is a mechanism for ejecting fluid from the first suction surface 611 and the second suction surface 612 . The fluid ejection mechanism 101 includes a suction source 7 , an air supply source 8 and a water supply source 9 .

The fluid ejection mechanism 101 also includes a first flow path 51 . The first flow path 51 extends through the frame 69 and the base 699 and is connected to the first suction portion 61 through a circular first recess 691 formed in the frame 69 .

The fluid ejection mechanism 101 has a first pipe 510 connected to the first flow path 51 . The first pipe 510 is arranged outside the base 699 and branches into a first suction pipe 571 , a first air pipe 581 and a first water pipe 591 . The first suction pipe 571, the first air pipe 581, and the first water pipe 591 are connected to the suction source 7, the air supply source 8, and the water supply source 9, respectively.

The fluid ejection mechanism 101 includes a first suction valve 71 provided between the suction source 7 and the first flow path 51 in the first suction pipe 571 . When the first suction valve 71 is opened, the first suction surface 611 communicates with the suction source 7 , and the suction force of the suction source 7 is applied to the first suction portion 61 through the first pipe 510 and the first flow path 51 . It is transmitted to surface 611 . By opening the first suction valve 71 while the first workpiece 11 is placed on the first suction surface 611 , the first chuck table 21 moves the first workpiece 11 on the first suction surface 611 . to hold the suction.

The fluid ejection mechanism 101 includes a first air valve 81 provided between the air supply source 8 and the first flow path 51 in the first air pipe 581 . When the first air valve 81 is opened, the first suction surface 611 is communicated with the air supply source 8, and the air supplied from the air supply source 8 passes through the first pipe 510 and the first flow path 51 to the first suction surface 611. It is ejected from the first suction surface 611 of the portion 61 .

The fluid ejection mechanism 101 includes a first water valve 91 provided between the water supply source 9 and the first flow path 51 in the first water pipe 591 . When the first water valve 91 is opened, the first suction surface 611 is communicated with the water supply source 9, and the water supplied from the water supply source 9 passes through the first pipe 510 and the first flow path 51 to the first It is ejected from the first suction surface 611 of the suction portion 61 .

Further, when both the first air valve 81 and the first water valve 91 are opened, the first suction surface 611 is communicated with the air supply source 8 and the water supply source 9, and the air and water supplied from the air supply source 8 are supplied. The water supplied from the source 9 is mixed in the first pipe 510 , and a mixed fluid of water and air is ejected from the first suction surface 611 of the first suction portion 61 .

Furthermore, the fluid ejection mechanism 101 has a second flow path 52 . The second flow path 52 extends so as to pass through the frame 69 and the base 699 , and passes through an annular second recess 692 formed in the frame 69 so as to surround the first recess 691 . 62.

The fluid ejection mechanism 101 includes a second pipe 520 arranged outside the base 699 and connected to the second flow path 52 . The second pipe 520 branches into a second suction pipe 572 , a second air pipe 582 and a second water pipe 592 . The second suction pipe 572, the second air pipe 582, and the second water pipe 592 are connected to the suction source 7, the air supply source 8, and the water supply source 9, respectively.

The fluid ejection mechanism 101 includes a second suction valve 72 provided in the second suction pipe 572, a second air valve 82 provided in the second air pipe 582, and a second water valve 92 provided in the second water pipe 592. It has

When the second suction valve 72 is opened, the second suction surface 612 communicates with the suction source 7 , and the suction force of the suction source 7 is applied to the second suction portion 62 through the second pipe 520 and the second flow path 52 . transmitted to surface 612 . By opening the first suction valve 71 and the second suction valve 72 while the second workpiece 12 is placed on the first suction surface 611 and the second suction surface 612 (suction surface 610), the first The chuck table 21 sucks and holds the second workpiece 12 with a first suction surface 611 and a second suction surface 612 (suction surface 610).

When the second air valve 82 is opened, the second suction surface 612 communicates with the air supply source 8, and the air supplied from the air supply source 8 passes through the second pipe 520 and the second flow path 52 to the second suction surface 612. It is ejected from the second suction surface 612 of the portion 62 .

When the second water valve 92 is opened, the second suction surface 612 communicates with the water supply source 9, and the water supplied from the water supply source 9 passes through the second pipe 520 and the second flow path 52 to the second It is ejected from the second suction surface 612 of the suction portion 62 .

When both the second air valve 82 and the second water valve 92 are opened, the second suction surface 612 communicates with the air supply source 8 and the water supply source 9, and the air supplied from the air supply source 8 and the water supply source 9 The supplied water is mixed in the second pipe 520 , and a mixed fluid of water and air is ejected from the second suction surface 612 of the second suction portion 62 .

Each valve provided in the fluid ejection mechanism 101 is, for example, an electromagnetic valve, and is controlled to be opened/closed by the controller 19 . Each valve may be a flow controller that controls the amount of opening between fully closed and fully open so that the flow rate can be adjusted.

The first pipe 510 and the second pipe 520 are provided with pressure gauges 53 for measuring the pressure applied inside the pipes.

As shown in FIG. 1, the first grinding device 1 includes a grinding mechanism 3 that grinds a workpiece suction-held on a suction surface 610 . The grinding mechanism 3 corresponds to an example of a processing mechanism. The grinding mechanism 3 is supported by an elevating mechanism 36 arranged on the side surface of the column 100 on the -Y direction side so as to be able to move up and down.

The grinding mechanism 3 includes a spindle 30 having a rotating shaft 35 in the Z-axis direction, a housing 31 that rotatably supports the spindle 30, a spindle motor 32 that is connected to the upper end of the spindle 30 and drives the spindle 30 to rotate, the spindle 30 It has a mount 33 fixed to its lower end and a grinding wheel 34 attached to the lower surface of the mount 33 . The grinding wheel 34 includes a base 341 and a plurality of substantially rectangular parallelepiped first grinding wheels 340 annularly arranged on the lower surface of the base 341 . A lower surface 342 of the first grinding wheel 340 is a grinding surface that contacts the upper surface 110 of the first workpiece 11 and the upper surface 120 of the second workpiece 12 . That is, the first grinding wheel 340 grinds the first workpiece 11 and the second workpiece 12 with its lower surface 342 .

The lifting mechanism 36 includes a ball screw 360 having a rotating shaft 45 in the Z-axis direction, a pair of guide rails 361 arranged parallel to the ball screw 360, and a Z-axis for rotating the ball screw 360 around the rotating shaft 45. It comprises a motor 362 , an elevating plate 363 having an internal nut screwed onto the ball screw 360 and having a side portion in sliding contact with the guide rail 361 , and a holder 364 connected to the elevating plate 363 and supporting the grinding mechanism 3 .

In the elevating mechanism 36, the ball screw 360 is driven by the Z-axis motor 362, and when the ball screw 360 rotates about the rotating shaft 45, the elevating plate 363 is guided by the guide rail 361 and moves in the Z-axis direction together with the holder 364. move up and down. Along with this, the grinding mechanism 3 held by the holder 364 moves up and down in the Z-axis direction.

The first grinding device 1 grinds the first workpiece 11 as follows. First, the operator places the first workpiece 11 on the first suction surface 611 of the first chuck table 21 while all the valves of the fluid ejection mechanism 101 shown in FIG. 2 are closed. Then, the controller 19 opens the first suction valve 71 to communicate the first suction surface 611 with the suction source 7 . As a result, the suction force of the suction source 7 is transmitted to the first suction surface 611 through the first pipe 510 and the first flow path 51 , and the first chuck table 21 moves the first workpiece 11 on the first suction surface 611 . The lower surface 112 of is held by suction.

Next, the controller 19 horizontally moves the first chuck table 21 by a horizontal movement mechanism (not shown) to position the first workpiece 11 sucked and held by the first suction surface 611 below the grinding mechanism 3 . . At this time, the positional relationship is such that the lower surface 342 of the first grinding wheel 340 overlaps the center 111 of the first workpiece 11 held by the first suction surface 611 .

Further, the control unit 19 rotates the first chuck table 21 by a rotation mechanism (not shown) to rotate the first workpiece 11 held on the first suction surface 611 of the first chuck table 21, and rotates the spindle motor. 32 rotates the first grinding wheel 340 about the rotation axis 35 .

Then, while the first workpiece 11 and the first grinding wheel 340 held on the first suction surface 611 are rotating, the control unit 19 moves the first grinding wheel 340 in the -Z direction using the lifting mechanism 36. lower. This brings the lower surface 342 of the first grinding wheel 340 into contact with the upper surface 110 of the first workpiece 11 . Further, the control unit 19 causes the first grinding wheel 340 to grind the first workpiece 11 by lowering the first grinding wheel 340 in the -Z direction.

Further, when the first workpiece 11 sucked and held by the first suction surface 611 is ground by the first grinding wheel 340, the control unit 19 ejects a mixed fluid of water and air from the second suction surface 612. Let Then, the mixed fluid ejected from the second suction surface 612 by the fluid ejection mechanism 101 is applied to the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 11 during grinding of the first workpiece 11 . to wash.

Specifically, the control unit 19 opens the second air valve 82 and the second water valve 92 of the fluid ejection mechanism 101 when the first grinding wheel 340 starts to descend. As a result, the second suction surface 612 is communicated with the air supply source 8 and the water supply source 9, and the mixed fluid of water and air is ejected from the second suction surface 612. FIG. Then, the mixed fluid ejected from the second suction surface 612 is sprayed onto the lower surface 342 of the first grinding wheel 340 . Thus, in the first grinding device 1, the mixed fluid ejected from the second suction surface 612 by the fluid ejection mechanism 101 during the grinding of the first workpiece 11 is applied to the first workpiece 11 during the grinding. The bottom surface 342 of the first grinding wheel 340 that is not in contact is cleaned.

As described above, in the first grinding device 1 , when the first workpiece 11 sucked and held by the first suction surface 611 is ground by the grinding mechanism 3 , the fluid ejection mechanism 101 mixes from the second suction surface 612 by the fluid ejection mechanism 101 . It is ejecting fluid. Therefore, the mixed fluid can clean the lower surface 342 of the first grinding wheel 340 . As a result, it is possible to suppress the adhesion of processing waste obtained by grinding the first workpiece 11 to the second suction surface 612 exposed during machining of the first workpiece 11 .
In addition, by ejecting the fluid from the second suction surface 612 , the abrasive grains and processing scraps dropped from the first grinding wheel 340 during machining of the first workpiece 11 can be prevented from colliding with the second suction surface 612 . is suppressed. Therefore, it is possible to prevent the second suction surface 612 from being dented due to the collision of the abrasive grains with the second suction surface 612 . Abrasive grains and processing waste collide with the second suction surface 612 due to the centrifugal force applied by the rotation of the first grinding wheel 340 . Therefore, when grinding the second workpiece 12, the second workpiece 12 is held by suction by the suction surface 610 including the second suction surface 612, and the second workpiece 12 can be ground with uniform thickness accuracy. can be

When the first workpiece 11 sucked and held by the first suction surface 611 is ground by the grinding mechanism 3, the fluid ejected from the second suction surface 612 to the first grinding wheel 340 by the fluid ejection mechanism 101 is , water or air may be used instead of the mixed fluid.

As shown in FIG. 4, instead of the first chuck table 21, the first grinding apparatus 1 includes a second chuck table 22 having a suction surface 620 flush with the upper surface 690 of the frame 69. good too. A screw through hole 697 is formed in the outer periphery of the frame 69 so that a screw 696 is screwed when the frame 69 is attached to the base 699 (see FIG. 2).

The suction surface 620 has a circular first suction surface 621 that suction-holds the lower surface of the disk-shaped first workpiece 421 . The suction surface 620 also includes a second suction surface 622 that suction-holds the lower surface of a second rectangular parallelepiped workpiece (not shown). Furthermore, the suction surface 620 includes a third suction surface 623 that suction-holds the lower surface of a third disk-shaped workpiece (not shown).

The first suction surface 621, the second suction surface 622, and the third suction surface 623 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (see FIG. 2). reference). Valves (not shown) are arranged between the suction surfaces 621 to 623 and the suction source 7, air supply source 8, and water supply source 9, respectively. By controlling these valves, the state in which the suction source 7, the air supply source 8 and the water supply source 9 are in communication with the suction surfaces 621 to 623 and the state in which they are not in communication can be changed for each of the suction surfaces 621 to 623. can be switched to

In the first grinding device 1 having this configuration, when the first workpiece 421 sucked and held by the first suction surface 621 is ground by the grinding mechanism 3, the second suction surface 622 and the third suction surface 623 are ground by air. It communicates with the supply source 8 and the water supply source 9 , and jets a mixed fluid of water and air from the second suction surface 622 and the third suction surface 623 . Thus, in the first grinding device 1 , the mixed fluid ejected by the fluid ejection mechanism 101 cleans the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 421 .

Further, when the second workpiece is ground by suction and holding by the first suction surface 621 and the second suction surface 622, the third suction surface 623 is communicated with the air supply source 8 and the water supply source 9. Alternatively, a mixed fluid of water and air may be ejected from the third suction surface 623 to wash the lower surface 342 of the first grinding wheel 340 with this mixed fluid.

Instead of the first chuck table 21, the first grinding apparatus 1 includes a third chuck table 23 having a suction surface 630 flush with the upper surface 690 of the frame 69 as shown in FIG. may be provided.

The suction surface 630 includes a square first suction surface 631 that sucks and holds the lower surface of a square first workpiece 431 . The suction surface 630 also includes four second suction surfaces 632 that suction and hold the lower surface of the second workpiece (not shown). Here, the second workpiece is, for example, an orientation flat wafer. The four second suction surfaces 632 are arranged along the four sides of the first suction surface 631 and consist of three arcuate surfaces 638 and one trapezoidal surface 639 . The trapezoidal surface 639 has a substantially isosceles trapezoidal shape surrounded by two arcs and two substantially parallel straight lines of different lengths.
Furthermore, the suction surface 630 has a bow-shaped third suction surface 633 that suction-holds the lower surface of the third workpiece (not shown). The third workpiece is, for example, a notch wafer. The third suction surface 633 is arranged on the opposite side of the first suction surface 631 with the trapezoidal surface 639 interposed therebetween.

The first suction surface 631, the second suction surface 632, and the third suction surface 633 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (FIG. 2). reference). Valves (not shown) are arranged between the suction surfaces 631 to 633 and the suction source 7, air supply source 8, and water supply source 9, respectively. By controlling these valves, the state in which the suction source 7, the air supply source 8 and the water supply source 9 are in communication with the suction surfaces 631 to 633 and the state in which they are not in communication can be changed for each of the suction surfaces 631 to 633. can be switched to

In the first grinding device 1 having this configuration, when the first workpiece 431 sucked and held by the first suction surface 631 is ground, the fluid is mixed from the second suction surface 632 and the third suction surface 633 by the fluid ejection mechanism 101 . The fluid is ejected, and the ejected mixed fluid cleans the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 431 during the grinding process.

Further, when the second workpiece (orientation flat wafer) is sucked and held by the first suction surface 631 and the second suction surface 632 and ground, the third suction surface 633 is used for the air supply source 8 and water. A mixed fluid of water and air may be ejected from the third suction surface 633 by communicating with the supply source 9, and the lower surface 342 of the first grinding wheel 340 may be washed with this mixed fluid.

Instead of the first chuck table 21, the first grinding apparatus 1 has a fourth chuck table 24 having a suction surface 640 flush with the upper surface 690 of the frame 69 as shown in FIG. may

This suction surface 640 has a first suction surface 641 that suction-holds the lower surface of the first workpiece 441 (orientation flat wafer). In addition, the suction surface 640 includes a bow-shaped second suction surface 642 that suction-holds the lower surface of the second workpiece (notch wafer) (not shown).

The first suction surface 641 and the second suction surface 642 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (see FIG. 2). Between the first suction surface 641 and the second suction surface 642 and the suction source 7, the air supply source 8, and the water supply source 9, valves (not shown) are arranged. By controlling these valves, the suction source 7, the air supply source 8, and the water supply source 9 communicate with the first suction surface 641 and the second suction surface 642, and do not communicate with each other. The suction surfaces 641 and 642 can be switched individually.

In the first grinding apparatus 1 having this configuration, when grinding the first workpiece 441 sucked and held by the first suction surface 641, the fluid ejection mechanism 101 ejects the mixed fluid from the second suction surface 642, The ejected mixed fluid cleans the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 441 during grinding.

The first grinding apparatus 1 includes a fifth chuck table 25 having a suction surface 650 flush with the upper surface 690 of the frame 69 as shown in FIG. 7(a) instead of the first chuck table 21. may be provided.

The suction surface 650 includes two rectangular first suction surfaces 651 that suction and hold the lower surface of the rectangular first workpiece 451 . The first suction surface 651 is composed of a rectangular first surface 658 and two rectangular second surfaces 659 adjacent to each short side of the first surface 658 . Moreover, the suction surface 650 includes a second suction surface 652 that suction-holds the lower surface of a substantially square second workpiece 452 shown in FIG. 7(b). The second suction surface 652 includes a rectangular third surface 653 arranged between the two first surfaces 658 and two rectangular surfaces arranged on the opposite side of the third surface 653 with the first surface 658 interposed therebetween. It consists of a fourth surface 654 and two first surfaces 658 .

A first surface 658, a second surface 659, a third surface 653, and a fourth surface 654 that constitute the first suction surface 651 and the second suction surface 652 are the suction source 7, the air supply source 8, and the fluid ejection mechanism 101. and a water supply source 9 (see FIG. 2). Valves (not shown) are arranged between the first surface 658, the second surface 659, the third surface 653 and the fourth surface 654 and the suction source 7, the air supply source 8 and the water supply source 9. there is By controlling these valves, the suction source 7, the air supply source 8, and the water supply source 9 communicate with the first surface 658, the second surface 659, the third surface 653, and the fourth surface 654. , and non-communication states can be switched for each of the first surface 658 , the second surface 659 , the third surface 653 and the fourth surface 654 .
As shown in FIG. 7A, when the first workpiece 451 is sucked and held on the first suction surface 651 and ground, the first workpiece 451 is sucked from the second suction surface 652. Fluid is ejected from the third surface 653 and the fourth surface 654 that are not held. Further, as shown in FIG. 7(b), when the second suction surface 652 sucks and holds the second workpiece 452 for grinding, the second workpiece 452 is sucked from the first suction surface 651. Fluid is ejected from the second surface 659, which is the portion not held.
In this manner, the fluid is ejected from the exposed suction surface that does not hold the workpiece during the grinding process, thereby preventing the adherence of processing chips and the like to the suction surface.

Instead of the first chuck table 21, the first grinding apparatus 1 has a sixth chuck table 26 having a suction surface 660 flush with the upper surface 690 of the frame 69 as shown in FIG. may

The suction surface 660 includes a first rectangular suction surface 661 that suction-holds the lower surface of the first rectangular workpiece 461 . In addition, the suction surface 660 includes two second suction surfaces 662 for suctioning and holding the lower surface of a substantially square-shaped second workpiece (not shown). The two second suction surfaces 662 are arranged so as to sandwich the first suction surface 661 .

The first suction surface 661 and the second suction surface 662 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (see FIG. 2). Between the first suction surface 661 and the second suction surface 662 and the suction source 7, the air supply source 8 and the water supply source 9, valves (not shown) are arranged. By controlling these valves, the suction source 7, the air supply source 8, and the water supply source 9 communicate with the first suction surface 661 and the second suction surface 662, and do not communicate with each other. The suction surfaces 661 and 662 can be switched individually.

In the first grinding apparatus 1 having this configuration, when grinding the first workpiece 461 sucked and held by the first suction surface 661, the fluid ejection mechanism 101 ejects the mixed fluid from the second suction surface 662, The jetted mixed fluid cleans the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 461 during grinding.

Instead of the first chuck table 21, the first grinding apparatus 1 includes a seventh chuck table 27 having a suction surface 670 flush with the upper surface 690 of the frame 69 as shown in FIG. may

The suction surface 670 includes a substantially square first suction surface 671 that suction-holds the lower surface of a substantially square first workpiece 971 . In addition, the suction surface 670 includes a quadrangular ring-shaped second suction surface 672 that suction-holds the lower surface of a substantially square-shaped second workpiece (not shown).

The first suction surface 671 and the second suction surface 672 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (see FIG. 2). Between the first suction surface 671 and the second suction surface 672 and the suction source 7, the air supply source 8, and the water supply source 9, valves (not shown) are arranged. By controlling these valves, the suction source 7, the air supply source 8, and the water supply source 9 communicate with the first suction surface 671 and the second suction surface 672, and do not communicate with each other. The suction surfaces 671 and 672 can be switched individually.

In the first grinding apparatus 1 having this configuration, when grinding the first workpiece 971 sucked and held by the first suction surface 671, the fluid ejection mechanism 101 ejects the mixed fluid from the second suction surface 672, The jetted mixed fluid cleans the lower surface 342 of the first grinding wheel 340 that is not in contact with the first workpiece 971 during grinding.

FIG. 10 shows the second grinding device 2 for creep-feed grinding the workpiece 17 . The second grinding device 2 includes an eighth chuck table 28 instead of the first chuck table 21 in the configuration of the first grinding device 1 shown in FIG. The grinding mechanism 3 provided in the second grinding device 2 includes a second grinding wheel 370 for creep feed grinding instead of the first grinding wheel 340 . Further, the second grinding device 2 includes a creep feed grinding feed mechanism 104 that horizontally moves the eighth chuck table 28 in the Y-axis direction.
Note that the second grinding device 2 may perform infeed grinding of the workpiece 17 .

The eighth chuck table 28 includes a disk-shaped base 40, a rectangular first suction surface 401, a second suction surface 402, a third suction surface 403, and a rectangular parallelepiped workpiece 17. It has a fourth suction surface 404 .

The suction surfaces 401 to 404 are arranged in the Y-axis direction at equal intervals on the upper surface 400 of the base 40, and arranged so that the long sides of the suction surfaces 401 to 404 are parallel to the X-axis direction. ing. In the eighth chuck table 28, at least two workpieces 17 can be sucked and held by any two of the suction surfaces 401 to 404. FIG.

Also, the suction surfaces 401 to 404 are configured to communicate with the suction source 7, the air supply source 8, and the water supply source 9 of the fluid ejection mechanism 101 (see FIG. 2). Valves (not shown) are arranged between the suction surfaces 401 to 404 and the suction source 7, air supply source 8, and water supply source 9, respectively. By controlling these valves, the state in which the suction source 7, the air supply source 8 and the water supply source 9 are in communication with the suction surfaces 401 to 404 and the state in which they are not in communication can be changed for each of the suction surfaces 401 to 404. can be switched to

As an example, the second grinding device 2 grinds the workpiece 17 as follows. First, in a state where the workpiece 17 is placed on the third suction surface 403 which is one of the suction surfaces, the control unit 19 opens the valve between the third suction surface 403 and the suction source 7 to 3 Connect the suction surface 403 to the suction source 7 . Thereby, the eighth chuck table 28 sucks and holds the workpiece 17 on the third suction surface 403 .
Furthermore, the control unit 19 positions the lower surface 372 of the second grinding wheel 370 of the grinding mechanism 3 at a height lower than the upper surface 170 of the workpiece 17 and rotates the second grinding wheel 370 .
Then, the control unit 19 causes the creep feed grinding feed mechanism 104 to horizontally move the eighth chuck table 28 holding the workpiece 17 on the third suction surface 403 with respect to the rotating second grinding wheel 370 . , the second grinding wheel 370 is brought into contact with the workpiece 17 . Thus, in the second grinding device 2, the grinding mechanism 3 creep-feed grinds the workpiece 17 sucked and held by the third suction surface 403. As shown in FIG.

Here, when creep feed grinding is performed on the workpiece 17 sucked and held by the third suction surface 403, the control unit 19 causes the first suction surface 401 and the second suction surface 401, which are the other surfaces, to be ground by the fluid ejection mechanism 101. The surface 402 and the fourth suction surface 404 communicate with the air supply source 8 and the water supply source 9 of the fluid ejection mechanism 101 . Thereby, the control unit 19 causes the fluid ejection mechanism 101 to eject the mixed fluid from the first suction surface 401 , the second suction surface 402 , and the fourth suction surface 404 . Then, the control unit 19 cleans the lower surface 372 of the second grinding wheel 370, which is not in contact with the workpiece 17 during the creep feed grinding of the workpiece 17, with the mixed fluid ejected by the fluid ejection mechanism 101. .

As described above, in the second grinding device 2 , when the grinding mechanism 3 grinds the workpiece 17 sucked and held by the third suction surface 403 , the fluid ejection mechanism 101 causes the first suction surface 401 and the second suction surface 401 to grind. The mixed fluid is ejected from the suction surface 402 and the fourth suction surface 404 . Therefore, the mixed fluid can clean the lower surface 372 of the second grinding wheel 370 . As a result, the chips generated during the machining of the first workpiece 11 adhere to the first suction surface 401, the second suction surface 402, and the fourth suction surface 404 exposed during machining of the workpiece 17. can be suppressed. In addition, by ejecting the fluid from the suction surfaces 401, 402, and 404, the abrasive grains dropped from the second grinding wheel 370 during machining of the workpiece 17 and the shavings discharged from the workpiece are sucked. Collision with surfaces 401, 402, and 404 can also be suppressed. Therefore, the workpiece 17 can be sucked and held by the first suction surface 401, the second suction surface 402, and the fourth suction surface 404 for creep feed grinding.

When the workpiece 17 sucked and held by the third suction surface 403 is ground by the grinding mechanism 3, the fluid ejecting mechanism 101 ejects fluid from the other suction surfaces 401, 402, and 404 onto the second grinding wheel 370. The fluid to be used is not limited to the mixed fluid, and may be only water or only air.

In addition, in the second grinding device 2, the workpiece 17 is held by suction on the first suction surface 401 and the third suction surface 403, and the fluid is ejected from the second suction surface 402 and the fourth suction surface 404 to grind the workpiece 17. Each workpiece 17 may also be creep-feed ground by the second grinding wheel 370 of mechanism 3 . That is, in the second grinding device 2 , the grinding mechanism 3 is used to creep-feed grind a plurality of workpieces 17 at once, while ejecting the mixed fluid from the exposed suction surface to grind the lower surface of the second grinding wheel 370 . 372 can be washed.
By not allowing the second suction surface 402 to suck and hold the workpiece 17, the lower surface 372 of the second grinding wheel 370 when the workpiece 17 sucked and held by the first suction surface 401 is subjected to creep-feed grinding. The height and the height of the lower surface 372 of the second grinding wheel 370 when creep-feed grinding the workpiece 17 sucked and held by the third suction surface 403 can be changed. That is, when the workpiece 17 sucked and held by the first suction surface 401 is subjected to creep-feed grinding, the second grinding wheel 370 does not come into contact with the workpiece 17 sucked and held by the third suction surface 403. It is possible to change the height of the grinding wheel.

In addition, the 1st grinding device 1 and the 2nd grinding device 2 are equivalent to an example of a processing apparatus. The first grinding device 1 and the second grinding device 2 may be a CMP device (chemical mechanical polishing device), a dry polishing device, or a cutting tool.
Further, the fluid ejected from the suction surface may be used to clean the polishing pad of the CMP apparatus, the polishing pad of the dry polishing apparatus, and the cutting tool of the cutting tool.

1: First Grinding Device 2: Second Grinding Device 3: Grinding Mechanism 7: Suction Source 8: Air Supply Source 9: Water Supply Source 11: First Workpiece 110: Upper Surface 111: Center 112: Lower Surface 12: Second Surface Workpiece 120: Upper surface 122: Lower surface 17: Workpiece 170: Upper surface 19: Control unit 21 to 28: Chuck table 69: Frame 610: Suction surface 611: First suction surface 612: Second suction surface 401: Third 1 Suction Surface 402: Second Suction Surface 403: Third Suction Surface 404: Fourth Suction Surface 101: Fluid Ejection Mechanism

Claims (3)

A machining apparatus comprising: a chuck table for sucking and holding a workpiece on a suction surface; and a machining mechanism for machining the workpiece sucked and held on the suction surface,
The suction surface includes at least a first suction surface for sucking and holding the lower surface of the first workpiece, and a second suction surface for sucking and holding the lower surface of the second workpiece,
when machining the first workpiece sucked and held by the first suction surface, ejecting fluid from a portion of the second suction surface not holding the first workpiece by suction;
When processing the second workpiece sucked and held by the second suction surface, a portion of the first suction surface not sucking and holding the second workpiece ejects fluid;
A processing device comprising a fluid ejection mechanism. A machining apparatus comprising: a chuck table having at least two third suction surfaces for sucking and holding at least two workpieces; and a machining mechanism for machining the workpiece sucked and held on the third suction surfaces. hand,
A processing apparatus comprising a fluid ejecting mechanism for ejecting fluid from the other of the at least two third suction surfaces when machining a workpiece that is suction-held with a suction source connected to only one of the at least two third suction surfaces. The fluid jetted by the fluid jetting mechanism is a mixed fluid of water and air,
The processing mechanism includes a grinding wheel that grinds the workpiece on the lower surface,
3. The processing apparatus according to claim 1, wherein the mixed fluid ejected by said fluid ejecting mechanism cleans the lower surface of said grinding wheel that is not in contact with the workpiece during grinding.

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