JP2022539161A - 改善された熱機械複合材料の付加製造 - Google Patents
改善された熱機械複合材料の付加製造 Download PDFInfo
- Publication number
- JP2022539161A JP2022539161A JP2021577452A JP2021577452A JP2022539161A JP 2022539161 A JP2022539161 A JP 2022539161A JP 2021577452 A JP2021577452 A JP 2021577452A JP 2021577452 A JP2021577452 A JP 2021577452A JP 2022539161 A JP2022539161 A JP 2022539161A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric ink
- ink composition
- dielectric
- layer
- printhead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000930 thermomechanical effect Effects 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000002131 composite material Substances 0.000 title abstract description 49
- 230000001976 improved effect Effects 0.000 title abstract description 13
- 239000000654 additive Substances 0.000 title abstract description 9
- 230000000996 additive effect Effects 0.000 title abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 248
- 238000000034 method Methods 0.000 claims abstract description 92
- 238000007641 inkjet printing Methods 0.000 claims abstract description 33
- -1 polyethylene Polymers 0.000 claims description 70
- 238000007639 printing Methods 0.000 claims description 68
- 239000011159 matrix material Substances 0.000 claims description 61
- 239000000758 substrate Substances 0.000 claims description 45
- 238000004891 communication Methods 0.000 claims description 27
- 229920001577 copolymer Polymers 0.000 claims description 22
- 238000003860 storage Methods 0.000 claims description 22
- 239000000919 ceramic Substances 0.000 claims description 20
- 239000000178 monomer Substances 0.000 claims description 17
- 238000012800 visualization Methods 0.000 claims description 17
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 13
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 13
- 239000004698 Polyethylene Substances 0.000 claims description 12
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 12
- 229920000573 polyethylene Polymers 0.000 claims description 12
- 239000011118 polyvinyl acetate Substances 0.000 claims description 12
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 12
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 12
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 claims description 12
- 229920000642 polymer Polymers 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 9
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 9
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 8
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 8
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 7
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- 238000003491 array Methods 0.000 claims description 5
- 150000004760 silicates Chemical class 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 5
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 claims description 4
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 claims description 4
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 claims description 4
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims description 4
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 claims description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical group C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 4
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 claims description 4
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 4
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 4
- 239000002202 Polyethylene glycol Substances 0.000 claims description 4
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims description 4
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 4
- 125000004386 diacrylate group Chemical group 0.000 claims description 4
- 230000009477 glass transition Effects 0.000 claims description 4
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 4
- 229920001223 polyethylene glycol Polymers 0.000 claims description 4
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical class C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 claims description 3
- PUNGSQUVTIDKNU-UHFFFAOYSA-N 2,4,6,8,10-pentamethyl-1,3,5,7,9,2$l^{3},4$l^{3},6$l^{3},8$l^{3},10$l^{3}-pentaoxapentasilecane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O[Si](C)O1 PUNGSQUVTIDKNU-UHFFFAOYSA-N 0.000 claims description 3
- ZFMOJHVRFMOIGF-UHFFFAOYSA-N 2,4,6-trimethoxy-1,3,5,2,4,6-trioxatriborinane Chemical compound COB1OB(OC)OB(OC)O1 ZFMOJHVRFMOIGF-UHFFFAOYSA-N 0.000 claims description 3
- XBIUWALDKXACEA-UHFFFAOYSA-N 3-[bis(2,4-dioxopentan-3-yl)alumanyl]pentane-2,4-dione Chemical compound CC(=O)C(C(C)=O)[Al](C(C(C)=O)C(C)=O)C(C(C)=O)C(C)=O XBIUWALDKXACEA-UHFFFAOYSA-N 0.000 claims description 3
- COLNCCOKNUZEPW-UHFFFAOYSA-N CC(C)(CO)C(O)=O.CC(C)(C)C(OC(=O)C=C)OC(=O)C=C Chemical compound CC(C)(CO)C(O)=O.CC(C)(C)C(OC(=O)C=C)OC(=O)C=C COLNCCOKNUZEPW-UHFFFAOYSA-N 0.000 claims description 3
- 229910003088 Ti−O−Ti Inorganic materials 0.000 claims description 3
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 claims description 3
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 claims description 3
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 claims description 3
- MNFGEHQPOWJJBH-UHFFFAOYSA-N diethoxy-methyl-phenylsilane Chemical compound CCO[Si](C)(OCC)C1=CC=CC=C1 MNFGEHQPOWJJBH-UHFFFAOYSA-N 0.000 claims description 3
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 claims description 3
- 229920001709 polysilazane Polymers 0.000 claims description 3
- XPGAWFIWCWKDDL-UHFFFAOYSA-N propan-1-olate;zirconium(4+) Chemical compound [Zr+4].CCC[O-].CCC[O-].CCC[O-].CCC[O-] XPGAWFIWCWKDDL-UHFFFAOYSA-N 0.000 claims description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims description 3
- WOZZOSDBXABUFO-UHFFFAOYSA-N tri(butan-2-yloxy)alumane Chemical compound [Al+3].CCC(C)[O-].CCC(C)[O-].CCC(C)[O-] WOZZOSDBXABUFO-UHFFFAOYSA-N 0.000 claims description 3
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 claims description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 claims description 3
- AJSTXXYNEIHPMD-UHFFFAOYSA-N triethyl borate Chemical compound CCOB(OCC)OCC AJSTXXYNEIHPMD-UHFFFAOYSA-N 0.000 claims description 3
- MCULRUJILOGHCJ-UHFFFAOYSA-N triisobutylaluminium Chemical compound CC(C)C[Al](CC(C)C)CC(C)C MCULRUJILOGHCJ-UHFFFAOYSA-N 0.000 claims description 3
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical group CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 2
- 210000001316 polygonal cell Anatomy 0.000 claims description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000000877 morphologic effect Effects 0.000 claims 1
- JTQPTNQXCUMDRK-UHFFFAOYSA-N propan-2-olate;titanium(2+) Chemical compound CC(C)O[Ti]OC(C)C JTQPTNQXCUMDRK-UHFFFAOYSA-N 0.000 claims 1
- 239000000976 ink Substances 0.000 description 242
- 239000010410 layer Substances 0.000 description 193
- 239000000463 material Substances 0.000 description 65
- 230000008569 process Effects 0.000 description 21
- 230000002787 reinforcement Effects 0.000 description 21
- 239000000843 powder Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000011347 resin Substances 0.000 description 19
- 238000000151 deposition Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 230000005855 radiation Effects 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 239000011165 3D composite Substances 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 6
- 238000004590 computer program Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 238000007781 pre-processing Methods 0.000 description 4
- 229920003048 styrene butadiene rubber Polymers 0.000 description 4
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 3
- 238000011960 computer-aided design Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 description 2
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- NOQJZCJOXLFFCH-UHFFFAOYSA-N 3-(2,3-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(C=2C(NC(=O)C=2)=O)=C1C NOQJZCJOXLFFCH-UHFFFAOYSA-N 0.000 description 2
- PPQRFOFHENJYMN-UHFFFAOYSA-N 3-(2,6-dimethylphenyl)pyrrole-2,5-dione Chemical compound CC1=CC=CC(C)=C1C1=CC(=O)NC1=O PPQRFOFHENJYMN-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 2
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 238000011022 operating instruction Methods 0.000 description 2
- 239000003208 petroleum Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- NAKOELLGRBLZOF-UHFFFAOYSA-N phenoxybenzene;pyrrole-2,5-dione Chemical compound O=C1NC(=O)C=C1.O=C1NC(=O)C=C1.C=1C=CC=CC=1OC1=CC=CC=C1 NAKOELLGRBLZOF-UHFFFAOYSA-N 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- XDOBJOBITOLMFI-UHFFFAOYSA-N pyrrole-2,5-dione;toluene Chemical compound CC1=CC=CC=C1.O=C1NC(=O)C=C1 XDOBJOBITOLMFI-UHFFFAOYSA-N 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- WXPWZZHELZEVPO-UHFFFAOYSA-N (4-methylphenyl)-phenylmethanone Chemical compound C1=CC(C)=CC=C1C(=O)C1=CC=CC=C1 WXPWZZHELZEVPO-UHFFFAOYSA-N 0.000 description 1
- OLRBYEHWZZSYQQ-VVDZMTNVSA-N (e)-4-hydroxypent-3-en-2-one;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O.C\C(O)=C/C(C)=O.C\C(O)=C/C(C)=O OLRBYEHWZZSYQQ-VVDZMTNVSA-N 0.000 description 1
- UERLHASVVYLVKI-UHFFFAOYSA-N 1-propan-2-yl-9h-thioxanthene Chemical compound S1C2=CC=CC=C2CC2=C1C=CC=C2C(C)C UERLHASVVYLVKI-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- FDUFQLNPPGRIKX-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CC(C)(CO)CO FDUFQLNPPGRIKX-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- NUMHVCSBYOMRSH-UHFFFAOYSA-N C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(O)CCC Chemical compound C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(C=C)(=O)O.C(O)CCC NUMHVCSBYOMRSH-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920005682 EO-PO block copolymer Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 206010073306 Exposure to radiation Diseases 0.000 description 1
- ORBDXZZIWYAZSO-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.CC(C)(C)C(O)O.OCC(C)(C)C(O)=O Chemical compound OC(=O)C=C.OC(=O)C=C.CC(C)(C)C(O)O.OCC(C)(C)C(O)=O ORBDXZZIWYAZSO-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000012952 cationic photoinitiator Substances 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- MLCHBQKMVKNBOV-UHFFFAOYSA-M dioxido(phenyl)phosphanium Chemical compound [O-]P(=O)C1=CC=CC=C1 MLCHBQKMVKNBOV-UHFFFAOYSA-M 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000012949 free radical photoinitiator Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- KVIKMJYUMZPZFU-UHFFFAOYSA-N propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)O KVIKMJYUMZPZFU-UHFFFAOYSA-N 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- CLSGKGBEANVAAF-UHFFFAOYSA-N tetraethyl silicate;tetramethyl silicate Chemical group CO[Si](OC)(OC)OC.CCO[Si](OCC)(OCC)OCC CLSGKGBEANVAAF-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
- B22F12/50—Means for feeding of material, e.g. heads
- B22F12/53—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/40—Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2309/00—Use of inorganic materials not provided for in groups B29K2303/00 - B29K2307/00, as reinforcement
- B29K2309/02—Ceramics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
Abstract
Description
熱機械的特性の改善を実証するために、開示されたシステム、方法、および組成を使用して3つのボックスが印刷された。ファースボックスは、硬化プロセス中に化学線に曝露されなかったマトリックス(ビルド)材料101iのみから製作される。第2のボックスは、マトリックス(ビルド)材料101iのみから製作され、硬化プロセス中に化学線に曝露された。第3のボックスは、マトリックス(ビルド)材料101iと有機セラミック材料102j(複合ボックス)の交互層から製作され、硬化中に化学線に曝露された。硬化プロセス中に照射に曝露されると、印刷中の構成要素の温度が上昇し、熱機械的特性が低下する可能性がある。
Claims (15)
- インクジェットプリンタを使用して、付加的に製造された電子機器(AME)の強化された三次元(3D)誘電体セクションを製作する方法であって、
a.インクジェット印刷システムを提供することであって、前記インクジェット印刷システムが、
i.第1の誘電体インク組成物を分注するように動作可能な第1のプリントヘッドと、
ii.第2の誘電体インク組成物を分注するように動作可能な第2のプリントヘッドであって、前記第2の誘電体インク組成物が、前記第1の誘電体インク組成物とは異なる熱機械的特性パラメータを有する、第2のプリントヘッドと、
iii.前記第1のプリントヘッドおよび前記第2のプリントヘッドの各々に基材を搬送するように動作可能な、前記第1のプリントヘッドおよび前記第2のプリントヘッドに結合されたコンベヤと、
iv.少なくとも前記コンベヤならびに前記第1のプリントヘッドおよび前記第2のプリントヘッドの各々と通信する中央処理モジュール(CPM)を含む、コンピュータ支援製造(「CAM」)モジュールであって、前記CPMが、実行可能命令のセットを内部に記憶する非一時的プロセッサ可読記憶媒体と通信する少なくとも1つのプロセッサをさらに備え、前記命令が、前記少なくとも1つのプロセッサによって実行されると、
1.前記AMEを表す3D視覚化ファイルを受信するステップと、
2.各ファイルが前記AMEの前記強化された三次元(3D)誘電体セクションを印刷するための実質的に2Dの層を表す複数のファイル、および少なくとも印刷順序を表すメタファイルを含むファイルライブラリを生成するステップと、を含むステップを実行することによって、前記CPMにインクジェット印刷システムを制御させる、CAMモジュールと、を備える、提供することと、
b.前記第1の誘電体インク組成物および前記第2の誘電体インク組成物を提供することと、
c.前記CAMモジュールを使用して、前記AMEの前記強化された三次元(3D)誘電体セクションを印刷するための前記第1の層を表す第1のファイルを前記ライブラリから取得することであって、前記第1のファイルが、前記第1の誘電体インクに対応するパターンの印刷命令と、前記第2の誘電体インクに対応するパターンの印刷命令と、を含む、取得することと、
d.前記第1のプリントヘッドを使用して、前記第1の誘電体インクに対応する前記パターンを形成することと、
e.前記第1の層の前記第1の誘電体インク表現に対応する前記パターンを硬化させることと、
f.前記第2のプリントヘッドを使用して、前記第2の誘電体インクに対応する前記パターンを形成することと、
g.前記第1の層の前記第2の誘電体インクに対表現応する前記パターンを硬化させることと、
h.前記CAMモジュールを使用して、前記AMEの前記強化された三次元(3D)誘電体セクションを印刷するための後続の層を表す後続のファイルを前記ライブラリから取得することであって、前記後続のファイルが、各後続の層の前記第1の誘電体インクに対応するパターンの印刷命令と、前記第2の誘電体インクに対応するパターンの印刷命令と、を含む、取得することと、
i.前記CAMモジュールを使用して、前記2Dファイルライブラリから前記後続の実質的に2Dの層を取得するするステップまで、前記第1のプリントヘッドを使用して、前記第1の誘電体インクに対応する前記パターンを形成するステップと、その上で、最終層の前記第2のインク組成物に対応する前記パターンを硬化させるステップと、を繰り返すことであって、前記AMEの前記強化された三次元(3D)誘電体セクションが、前記第1の誘電体インク組成物の連続マトリックス内の前記第2の誘電体インク組成物の複数の強化された形態のアレイと、前記第1の誘電体インク組成物と前記第2の誘電体インク組成物の交互層、のうちの少なくとも1つを含む、繰り返すことと、
j.前記基材を除去することと、を含む、方法。 - 前記熱機械的特性パラメータが、各々、前記硬化層で測定されるような、熱膨張係数(α)、引張強度、ヤング率(E)、ガラス転移温度(Tg)、脆性-延性転移温度(Tβ)、[Tβ/Tg]比、および誘電強度、のうちの少なくとも1つである、請求項1に記載の方法。
- 前記第1の誘電体インク組成物が、ポリエステル(PES)、ポリエチレン(PE)、ポリビニルアルコール(PVOH)、ポリ(酢酸ビニル)(PVA)、ポリ(メチルメタクリレート)(PMMA)、ポリ(ビニルピロリドン)、多官能性アクリレート、または前述のもののうちの1つ以上の混合物、モノマー、オリゴマー、およびコポリマーを含む組み合わせを含む、請求項1に記載の方法。
- 前記第2のインク組成物が、セラミック成分を有する、有機的に修飾されたケイ酸塩ベースのセラミック(ORMODS)コモノマーを含む、請求項1に記載の方法。
- 前記セラミック成分が、テトラエチルオルトシリケート、テトラメチルオルトシリケート、テトライソプロピルチタネート、トリメトキシシラン(TMOS)、トリエトキシシラン、トリメトキシシラン、フェニルトリエトキシシラン、フェニルメチルジエトキシシラン、メチルジエトキシシラン、ビニルメチルジエトキシシラン、ポリジメトキシシラン、ポリジエトキシシラン、ビニルメトキシシロキサン、ポリシラザン、チタンイソプロポキシド、アルミニウムイソプロポキシド、ジルコニウムプロポキシド、ホウ酸トリエチル、トリメトキシボロキシンジエトキシシロキサン-エチルチタネート、チタンジイソプロポキシドビス(アセチルアセトネート)、シラノールポス、アルミニウムトリセクブトキシド、トリイソブチルアルミニウム、アルミニウムアセチルアセトネート、1、3、5、7、9-ペンタメチルシクロペンタシロキサン、シロキサンのポリ(ジブチルチタネート)オリゴマー、およびAl-O-Alのオリゴマー、Ti-O-Tiのオリゴマー、Zn-O-Znのオリゴマー、または前述のものを含む組成物、のモノマーおよび/もしくはオリゴマーを含む、請求項4に記載の方法。
- 前記多官能性アクリレートが、1,2-エタンジオールジアクリレート、1,3-プロパンジオールジアクリレート、1,4-ブタンジオールジアクリレート、1,6-ヘキサンジオールジアクリレート、ジプロピレングリコールジアクリレート、ネオペンチルグリコールジアクリレート、エトキシル化ネオペンチルグリコールジアクリレート、プロポキシル化ネオペンチルグリコールジアクリレート、トリプロピレングリコールジアクリレート、ビスフェノール-A-ジグリシジルエーテルジアクリレート、ヒドロキシピバル酸ネオペンタンジオールジアクリレート、エトキシル化ビスフェノール-A-ジグリシジルエーテルジアクリレート、ポリエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、エトキシル化トリメチロールプロパントリアクリレート、プロポキシル化トリメチロールプロパントリアクリレート、プロポキシル化グリセリントリアクリレート、トリス(2-アクリロイルオキシエチル)イソシアヌレート、ペンタエリスリトールトリアクリレート、エトキシル化ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、エトキシル化ペンタエリスリトールテトラアクリレート、ジトリメチロールプロパンテトラアクリレート、ジペンタエリスリトールペンタアクリレートおよびジペンタエリスリトールヘキサアクリレートのうちの少なくとも1つのモノマー、オリゴマー、ポリマー、およびコポリマー、または前述もののうちの1つ以上を含む多官能アクリレート組成物、の、うちの少なくとも1つである、請求項5に記載の方法。
- 前記第1の誘電体インク組成物と前記第2の誘電体インク組成物との前記交互層における前記第1の誘電体インク組成物に対応する層が、約2μm~50μmの厚さを有するように構成されている、請求項1に記載の方法。
- 前記第1の誘電体インク組成物と前記第2の誘電体インク組成物との前記交互層における前記第2の誘電体インク組成物に対応する層が、約7μm~120μmの厚さを有するように構成されている、請求項7に記載の方法。
- 前記第2の誘電体インク組成物に対応する前記層と前記第1の誘電体インク組成物に対応する前記層との間の比が、1:2~1:5である、請求項8に記載の方法。
- 前記第1の誘電体インク組成物の前記連続マトリックス内の前記第2の誘電体インク組成物の前記複数の強化された形態物体の前記アレイ内の前記形態物体が、ロッド、ペグ、多角形の断面を有する細長い部材、および前述を含む形態の組み合わせ、のうちの少なくとも1つである、請求項1に記載の方法。
- 前記強化された形態物体が、円筒状ロッドである、請求項10に記載の方法。
- 前記第1の誘電体インク組成物から形成された前記マトリックス中の前記第2の誘電体インク組成物から形成された前記円筒状ロッドの総体積が、約10%(v/v)~約30%(v/v)である、請求項11に記載の方法。
- 各円筒状ロッドの直径が、前記第1の誘電体インク組成物から形成される全マトリックス体積の約0.1%(v/v)~約1.0%(v/v)の体積を有するサイズのロッドを形成するように構成される、請求項12に記載の方法。
- 前記強化された形態物体が、前記第2の誘電体インク組成物によって形成された多角形ネットワークであり、前記第1の誘電体インク組成物で充填された独立気泡マトリックスを形成し、それによってハニカム構造を形成する、請求項1に記載の方法。
- 前記多角形の独立気泡を形成する前記ネットワークが、セラミック成分を有する有機修飾シリケート系セラミック(ORMODS)コモノマーを含む組成物から形成され、前記第1の誘電体インク組成物が、ポリエステル(PES)、ポリエチレン(PE)、ポリビニルアルコール(PVOH)、ポリ(酢酸ビニル)(PVA)、ポリ(メチルメタクリレート)(PMMA)、ポリ(ビニルピロリドン)、多官能性アクリレート、または混合物、モノマー、オリゴマー、および前述の1つ以上のコポリマーを含む組み合わせを含む、請求項14に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962866854P | 2019-06-26 | 2019-06-26 | |
US62/866,854 | 2019-06-26 | ||
PCT/US2020/039980 WO2020264419A1 (en) | 2019-06-26 | 2020-06-26 | Additive manufacturing of improved thermo-mechanical composite material |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022539161A true JP2022539161A (ja) | 2022-09-07 |
JP7502349B2 JP7502349B2 (ja) | 2024-06-18 |
Family
ID=74061355
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021577452A Active JP7502349B2 (ja) | 2019-06-26 | 2020-06-26 | 改善された熱機械複合材料の付加製造 |
Country Status (8)
Country | Link |
---|---|
US (1) | US11446858B2 (ja) |
EP (1) | EP3990247A4 (ja) |
JP (1) | JP7502349B2 (ja) |
KR (1) | KR102496306B1 (ja) |
CN (1) | CN114258342A (ja) |
CA (1) | CA3145565C (ja) |
TW (1) | TW202116532A (ja) |
WO (1) | WO2020264419A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11692049B2 (en) * | 2020-09-18 | 2023-07-04 | Ford Global Technologies, Llc | Additively manufactured thermoset polymers for metal plating and metal plated parts formed therefrom |
CN114745873B (zh) * | 2022-04-11 | 2024-02-02 | 青岛理工大学 | 一种多层柔性及可拉伸电子电路一体化3d打印方法 |
KR102649845B1 (ko) | 2023-11-29 | 2024-03-21 | 주식회사 나노시스 | 반도체 소자 테스터 지그 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005027879A1 (de) * | 2005-06-09 | 2006-12-14 | Deutsche Institute für Textil- und Faserforschung Stuttgart - Stiftung des öffentlichen Rechts | Stabförmiger Faserverbundwerkstoff, Verfahren und Vorrichtung zu seiner Herstellung |
TWI425899B (zh) * | 2007-02-23 | 2014-02-01 | Infermata Systems Ltd | 功能性印刷電路板快速製造方法及裝置 |
GB201111598D0 (en) * | 2011-07-07 | 2011-08-24 | Rolls Royce Plc | Layered composite component |
EP2843192B1 (fr) * | 2013-08-28 | 2021-03-24 | Safran Aero Boosters SA | Aube composite réalisée par fabrication additive et procédé de fabrication associé |
DE102013218492B9 (de) * | 2013-09-16 | 2014-10-16 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren und Vorrichtung zur Bestimmung mindestens eines stützpunktspezifischen vertikalen Gesamtelektroneninhalts |
US20150197062A1 (en) * | 2014-01-12 | 2015-07-16 | Zohar SHINAR | Method, device, and system of three-dimensional printing |
WO2015132766A1 (en) * | 2014-03-07 | 2015-09-11 | Bombardier Inc. | Composite rivet blank and installation thereof |
US10364341B2 (en) * | 2015-04-08 | 2019-07-30 | Arevo, Inc. | Method and apparatus for 3d printing of nano-filler/polymer composites |
WO2017029673A1 (en) * | 2015-08-19 | 2017-02-23 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd | 3d polymerizable ceramic inks |
CA3021432A1 (en) * | 2016-03-26 | 2017-10-05 | Nano-Dimension Technologies, Ltd. | Fabrication of pcb and fpc with shielded tracks and/or components using 3d inkjet printing |
US10254499B1 (en) | 2016-08-05 | 2019-04-09 | Southern Methodist University | Additive manufacturing of active devices using dielectric, conductive and magnetic materials |
WO2018031186A1 (en) * | 2016-08-08 | 2018-02-15 | Nano-Dimension Technologies, Ltd. | Printed circuit board fabrication methods programs and libraries |
EP3574422A4 (en) | 2017-01-26 | 2021-02-24 | Nano-Dimension Technologies, Ltd. | INTEGRATED CHIPS PRINTED CIRCUIT BOARDS AND MANUFACTURING PROCESSES |
CN108790144A (zh) * | 2018-06-15 | 2018-11-13 | 天津工业大学 | 一种纤维增强复合材料3d打印的层间增强技术 |
-
2020
- 2020-06-26 JP JP2021577452A patent/JP7502349B2/ja active Active
- 2020-06-26 WO PCT/US2020/039980 patent/WO2020264419A1/en unknown
- 2020-06-26 EP EP20831305.6A patent/EP3990247A4/en active Pending
- 2020-06-26 KR KR1020227003038A patent/KR102496306B1/ko active IP Right Grant
- 2020-06-26 CA CA3145565A patent/CA3145565C/en active Active
- 2020-06-26 CN CN202080058672.1A patent/CN114258342A/zh active Pending
- 2020-06-26 US US17/622,776 patent/US11446858B2/en active Active
- 2020-06-29 TW TW109121965A patent/TW202116532A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202116532A (zh) | 2021-05-01 |
US20220203606A1 (en) | 2022-06-30 |
KR20220031638A (ko) | 2022-03-11 |
CA3145565C (en) | 2023-01-24 |
KR102496306B1 (ko) | 2023-02-06 |
CA3145565A1 (en) | 2020-12-30 |
EP3990247A4 (en) | 2022-08-03 |
US11446858B2 (en) | 2022-09-20 |
EP3990247A1 (en) | 2022-05-04 |
CN114258342A (zh) | 2022-03-29 |
WO2020264419A1 (en) | 2020-12-30 |
JP7502349B2 (ja) | 2024-06-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7502349B2 (ja) | 改善された熱機械複合材料の付加製造 | |
US10905017B2 (en) | Fabrication of PCB and FPC with shielded tracks and/or components using 3D inkjet printing | |
US11351610B2 (en) | Composite component fabrication using inkjet printing | |
CA3105242C (en) | Inkjet printing of three-dimensional ceramic pattern | |
EP3939394A1 (en) | Method to electrically connect chip with top connectors using 3d printing | |
US11629261B2 (en) | Support ink compositions and methods of use thereof in additive manufacturing systems | |
JP2017183645A (ja) | 三次元造形物の製造方法 | |
TWI831987B (zh) | 支撐油墨組合物及其在增材製造電子產品中之使用方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230623 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20240425 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240501 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240515 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240531 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20240606 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7502349 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |