JP2022527142A - Ink container chips and ink containers - Google Patents

Abstract

An ink container chip (100) and an ink container (300), the chip (100) is electrically connected to a contact pin of a holding portion (200) in an inkjet printer, and the chip (100) is a substrate (10). And at least one conductive sheet (20) attached to the substrate (10), the substrate (10) positions at least one substrate terminal and at least one conductive sheet (20) in contact with the contact pins of the inkjet printer. The positioning portion (11) is included, the conductive sheet (20) includes an electric core connecting portion (22) provided at one end of the main body (21) and the main body (21), and the electric core connecting portion (22) is connected to a contact pin. The main body (21) is provided with at least one positioning mounting portion (23), the positioning mounting portion (23) is fitted with the positioning portion (11), and the main body (21) is of the substrate (10). It is parallel to the surface and is mounted on the positioning portion (11) via the positioning mounting portion (23). It increases the contact area between the conductive sheet and the substrate, making assembly more stable and easier, as well as increasing the stability of the electrical connection between the electrical core connection and the contact pins. [Selection diagram] FIG. 6

Description

The present invention relates to the technical field of an inkjet printer, and more particularly to ink container chips and ink containers.

The existing inkjet printer is provided with a holding portion for storing the ink container, and at least one ink container is detachably attached to the holding portion. The ink container includes a chip, and the chip and the inkjet are included. The contact pins of the printer are electrically connected to provide signal transmission between the ink fountain and the inkjet printer.

Chips typically include circuit boards, fixed bases and multiple contact elements, which are used to be electrically connected to the contact pins of an inkjet printer, and the fixed base is provided with multiple positioning insertion holes. Moreover, one contact element is inserted in each positioning insertion hole, and the contact element is provided with a contact portion for electrically connecting to the contact pin, and the contact portion is provided from the surface of the fixed base through the fixed base. It protrudes and connects the contact part to the contact pin of the inkjet printer. As shown in the contents described in the Chinese patent CN201510264696.3 and FIG. 6 of the CN201510264696.3 patent, the chip 1 includes a circuit board 11, a contact element 12, and a fixed base 13. The number of contact elements 12 is plurality, and each contact element 12 is provided with a contact portion 120 for electrically contacting a printer device (inkjet printer). The fixed base 13 is provided with a plurality of positioning insertion holes and corresponds to the contact element 12. Each contact element 12 passes through a positioning insertion hole on the fixed base 13 to expose the contact portion 120 to facilitate contact with the printer device.

However, since the volume of the contact element and the fixed base is small and a plurality of parts are arranged on the chip, when mounting the contact element and the fixed base, the operation space left for mounting the contact element and the fixed base is small. Therefore, it becomes difficult to assemble and the production efficiency of the ink container is lowered.

In the embodiment of the present invention, the conductive sheet is attached to the substrate via the positioning mounting portion, and the chip and the inkjet printer realize signal transmission via the electric core connection portion of the conductive sheet to improve the production efficiency of the ink container. Ink container chips and ink containers are provided.

In order to achieve the above object, the embodiments of the present invention employ the following technical solutions.

One embodiment of the present invention provides a chip of an ink container that is electrically connected to a contact pin of a holding portion in an inkjet printer, wherein the chip is a substrate and at least one conductor attached to the substrate. The substrate includes a sheet, the substrate has at least one substrate terminal in contact with a contact pin of the inkjet printer, and a positioning portion for positioning the at least one conductive sheet, wherein the conductive sheet is a main body and one end of the main body. The electric core connection portion is in contact with the contact pin, the main body is provided with at least one positioning mounting portion, and the positioning mounting portion is fitted with the positioning portion. The main body is parallel to the surface of the substrate and is attached to the positioning portion via the positioning attachment portion.

Further, in the X-axis direction, the substrate terminal is located on the + X-axis side of the chip substrate, and the electric core connection portion protrudes from the surface where the substrate terminal is located in the + X-axis direction, and the electric core connection portion is formed. Has a conductive sheet contact area for contacting the contact pin, and the conductive sheet contact area is located at the + X-axis end of the electric core connection portion, where the ink container is attached to the holding portion. The mounting direction is the Z-axis direction, the position on the mounted tip side is the -Z-axis direction, which is perpendicular to the Z-axis direction, and the direction parallel to the surface where the board terminal is located is the Y-axis direction. Yes, the direction perpendicular to the Z-axis direction and the Y-axis direction is the X-axis direction, and the direction pointing to the chip inside the ink container is the + X-axis direction, observed along the + X-axis direction, and the + Z-axis. Is on the YZ plane, the + Y axis direction is on the left side.

Further, the positioning mounting portion is located on the + X-axis side or the −X-axis side of the main body.

Further, the substrate is provided with a plurality of the positioning holes, and the plurality of the positioning holes are distributed in a row and are divided into a first positioning hole group and a second positioning hole group parallel to each other. Here, the positioning holes in the first positioning hole group are installed facing the positioning holes of the second positioning hole group, or are installed in a staggered manner.

Further, when the number of the conductive sheets is a plurality and the number of the conductive sheets is an even number, the conductive sheets are symmetrically distributed on the chip substrate along the center line L1, and the center line L1 is here. It passes through the center point of the chip in the Y-axis direction and is parallel to the Z-axis direction.

Further, in the X-axis direction, the electric core connecting portion and the positioning mounting portion are respectively located on the same side of the main body.

Further, the plurality of board terminals are provided with board terminal contact portions that come into contact with the corresponding contact pins.
The electric core connection portion of the conductive sheet is located in the + Z axis direction of the substrate terminal contact portion.

Further, the conductive sheet is located in the + Z axis direction of the substrate terminal.

Further, the plurality of board terminals are provided with board terminal contact portions that come into contact with the corresponding contact pins, and the board terminal contact portions are arranged in a plurality of rows in the Z-axis direction, and the conductive sheet is said to have a plurality of rows. The electric core connection portion is located between the board terminal contact portions of the plurality of rows.

Further, the board terminals are arranged in a plurality of rows in the Z-axis direction, the electric core connection portions are located between the board terminals in the plurality of rows, and the electric core connection portions and the mounting positioning are located in the Z-axis direction. The portions are located on both sides of the main body.

Further, the size of the electric core connection portion in the Y-axis direction is larger than the size in the Z-axis direction.

Further, the substrate is provided with a substrate terminal electrically connected to the contact pin, and an additional terminal is provided between the substrate terminal and the electric core connection portion of the conductive sheet. The additional terminal is electrically connected to at least one wafer terminal connected to a wafer that stores chip data.

Further, the two conductive sheets of the chip are a first conductive sheet and a second conductive sheet, respectively, and the first conductive sheet and the second conductive sheet are symmetrical along the chip. It is distributed in.

Another embodiment of the present invention provides an ink container, comprising a chip of the ink container, the chip is provided with a plurality of limit grooves, and the ink container is fitted with the limit groove. A plurality of limit blocks are provided, and the chip is detachably attached to the ink container by the limit groove and the limit block.

Further, the ink container includes a box for storing jet ink and a chip holder attached to the box, and the plurality of limit blocks are located on the surface of the chip holder close to the contact pin. ..

Further, the box body is provided with a mounting chamber for storing the chip holder, and the chip holder is for fixing a first connection portion for connecting to the box body and the chip. A first fixing portion is provided, first limit bosses are provided on both sides of the first connecting portion, and the side wall of the mounting chamber is fitted with the first positioning boss. A second limit boss is provided at an end of the first connection portion away from the first fixing portion, and the second limit boss is provided with an elastic element. And the elastic element abuts on the inner wall of the mounting chamber.

Further, an inclined surface is provided at an end of the first connecting portion away from the first fixed portion, the second limit boss is located on the inclined surface, and the tip and the tip holder are attached. It is rotatable in the room, and when the ink container comes into contact with the holding portion of the inkjet printer, there is a gap between the chip and the side wall member of the holding portion of the inkjet printer.

Compared with the prior art, the ink container chip and the ink container provided in the embodiment of the present invention have the following advantages.

In the ink container chip and the ink container provided in the embodiment of the present invention, the chip includes a substrate and a conductive sheet provided on the substrate, and the conductive sheet includes a main body, an electric core connection portion, and a positioning mounting portion, and the electric core. The connection part is located at one end of the main body, the positioning mounting part is located on one side of the main body, the board is provided with a positioning part that fits with the positioning mounting part, and the conductive sheet is inserted into the positioning part by the positioning mounting part. , The main body and the substrate are brought into close contact with each other, and the electric core connection part is used to be electrically connected to the contact pin of the inkjet printer to complete the information transmission between the chip and the inkjet printer.

Compared to the prior art, in the ink container chips and ink containers provided in the embodiments of the present invention, the conductive sheet is inserted into the substrate by the positioning mounting portion, the main body is maintained parallel to the surface of the substrate, and the conductive sheet and the conductive sheet are maintained. The contact area of the substrate is increased, making assembly more stable and easier. In addition, the electrical core connection of the conductive sheet is located at one end of the main body, preventing the problem that the electrical core connection is easily deformed by the mounting process, and the stability of the electrical connection between the electrical core connection and the contact pin of the inkjet printer. In the electric core connection part, the length in the Y-axis direction is larger than the length in the Z-axis direction, and the length in the Y-axis direction is relatively large, so that the ink container is misaligned in the Y-axis direction. Even if an offset occurs, the chip will not become unrecognizable, the contact between the conductive sheet and the contact pin will be more stable, and the positional relationship between the electric core connection part and the board terminal and board terminal contact part will be the conductive sheet. Prevents the contact pin from entering the groove, avoiding the situation where the contact pin is pressed excessively and the electrical connection is broken.

In addition to the above-mentioned technical problems solved by the present invention, the technical features constituting the technical solutions, and the beneficial effects of the technical features of these technical solutions, the ink container provided by the present invention. Other technical problems solved by the chips and ink containers, other technical features included in the technical solutions, and the beneficial effects of these technical features are described in more detail in the specific embodiments. The technique.

In order to more clearly explain the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required in the embodiments or prior art description of the present invention, and clearly the following. The drawings in the above description are only examples of a part of the present invention, and other drawings can be obtained based on these drawings on the premise that those skilled in the art do not perform creative labor.

It is a schematic diagram which attaches the ink container provided by the Example of this invention to a holding part. FIG. 1 is a schematic structure diagram 1 of an ink container provided by an embodiment of the present invention. It is a structural schematic diagram of the holding part provided by the Example of this invention. It is a structural schematic diagram of the contact pin holder provided by the Example of this invention. It is a structural schematic diagram of the contact pin shown in FIG. It is an exploded schematic view of the chip provided by the Example of this invention. It is the front structure schematic diagram of the substrate of FIG. It is a schematic diagram of the back surface structure of the substrate of FIG. It is the front structure schematic diagram of the conductive sheet of FIG. It is a schematic diagram of the back surface structure of the conductive sheet of FIG. FIG. 1 is a schematic view of a connection method 1 between a conductive sheet and a substrate of FIG. FIG. 2 is a schematic view of a connection method 1 between a conductive sheet and a substrate of FIG. FIG. 1 is a schematic view of a connection method 2 between a conductive sheet and a substrate of FIG. It is a schematic diagram of the connection method 2 of a conductive sheet and a substrate of FIG. It is a connection schematic of the tip and the contact pin holder provided by the Example of this invention. It is a schematic diagram of the chip in Example 2. It is a schematic diagram of the left conductive sheet of Example 2. It is a schematic diagram of the electrical connection between the tip of Example 2 and a contact pin holder. FIG. 1 is a schematic connection diagram 1 of a connection between a chip and an ink container provided by an embodiment of the present invention. FIG. 1 is a schematic arrangement of additional terminals provided by an embodiment of the present invention on a substrate. FIG. 1 is a schematic diagram of the arrangement of the left terminal and the right terminal provided by the embodiment of the present invention on the substrate. FIG. 2 is a schematic arrangement diagram 2 of the left terminal and the right terminal provided by the embodiment of the present invention on the substrate. It is a 2nd arrangement schematic diagram in the substrate of the substrate terminal provided in the Example of this invention. It is a 3rd arrangement schematic diagram in the substrate of the substrate terminal provided in the Example of this invention. It is a structural schematic diagram of the ink container provided by another embodiment of this invention. It is a structural schematic diagram of the holding part provided by another embodiment of this invention. It is a schematic diagram of the chip of Example 3. It is a schematic diagram of the chip of Example 4. FIG. 3 is a schematic connection diagram of a chip holder and a chip provided by another embodiment of the present invention. It is a structural schematic diagram of the chip holder provided by the Example of this invention. It is a schematic connection diagram of the chip holder and the box body provided by the Example of this invention. FIG. 1 is a schematic connection diagram 1 of a connection between a chip holder and a contact pin provided by an embodiment of the present invention. FIG. 2 is a schematic connection diagram 2 of a connection between a chip holder and a contact pin provided by an embodiment of the present invention. It is a schematic diagram of the chip of Example 5. It is a schematic diagram of the chip of Example 6.

In order to make the above object, feature and advantage of the present invention clearer and easier to understand, the technical means in the embodiment of the present invention will be clearly and completely described below by combining the drawings in the embodiment of the present invention. Obviously, the examples described are not all examples, but only a part of the embodiments of the present invention. Based on the examples in the present invention, all other examples obtained by those skilled in the art on the premise of not doing creative labor belong to the scope of protection of the present invention.

Example 1
As shown in FIGS. 1 to 3, the inkjet printer has a holding unit 200, and the holding unit 200 is used for storing an ink container, and a plurality or one ink container 300 can be mounted. The ink container 300 is detachably attached to the holding portion 200, and when the ink container 300 is used up, it is necessary to replace a new ink container. The ink container 300 includes a chip 100, a handle 330, an ink discharge port 311 and a box body 310, and a holding unit 200 includes a contact pin holder 201, an ink supply unit 202, a fixing unit 204 and an opening 205, and the box body 310. The ink is stored in the ink, the ink reaches the ink supply unit 202 through the ink ejection port 311, and the ink supply unit 202 can supply the ink to the print head, whereby the ink executes the printing operation. Can be used to The chip 100 is electrically connected to the contact pin in the contact pin holder 201 and can be used for mutual transmission between electrical signals. The handle 330 is used to fix the ink container 300 to the holding portion 200, and the handle 330 fits with the fixing portion 204 to prevent the ink container 300 from coming off the holding portion 200.

As shown in FIG. 2, when the three-dimensional Cartesian coordinate system of the holding portion, that is, the XYZ axis coordinate system is set and the direction in which the ink container 300 is attached to the holding portion 200 is the −Z axis direction, the ink container 300 is the holding portion. The direction away from the + Z axis is the + Z axis direction, the opening 205 is located in the + Z axis direction, and the bottom wall 200a is located in the −Z axis direction. Normally, the inkjet printer is placed flat on a desktop or a printing table surface, the opening 205 of the holding portion 200 is above the direction of gravity, and the bottom wall 200a is below the direction of gravity, so that the user can attach the ink container 300. , Convenient to remove.

Further, the holding unit 200 can mount a plurality or one ink container 300, has a plurality or one mounting position 203, and has four different colors, for example, black and yellow, in the four ink containers. , Blue, red ink is stored. As shown in FIG. 3, the holding portion 200 can mount four ink containers 300, has four mounting positions 203, and the holding portion 200 is a member having an opening 205, which is rectangular or close to a square. The inner side wall and the bottom wall 200a of the holding portion 200 constitute the mounting position 203. The contact pin holder 201 is attached to the first side wall 200c of the holding portion 200, the attachment positions 203 are sequentially arranged in the Y-axis direction, and the four attachment positions 203 are sequentially arranged in the Y-axis direction. The direction perpendicular to the Y-axis and the Z-axis at the same time is the X-axis direction, and here, the direction from the mounting position 203 toward the contact pin holder 201 is the + X-axis direction. The + X axis is perpendicular to the first side wall 200c, and when observed along the + X axis direction, the + Y axis direction is on the left side when the + Z axis is on the YZ plane. Further, the three-dimensional Cartesian coordinate system of the ink container 300 installed in this embodiment coincides with the three-dimensional Cartesian coordinate system of the holding portion 200.

As shown in FIG. 4, the contact pin holder 201 includes a base 210 and a plurality of contact pins attached to the base 210, and the plurality of contact pins are the first contact pin 211 to the ninth contact pin 219, respectively. .. The contact pin is a flaky metal sheet that has an electrical conduction effect and is not easily worn. The base 210 includes a plurality of slits, each of which is a first gap 221 to a ninth gap 229, the plurality of slits 221 to 229 correspond to a plurality of contact pins 211 to 219, and the plurality of slits 221 to 229. It is U-shaped and has slit openings in the + Z axis direction, and the plurality of contact pins 211 to 219 are attached to the plurality of slits 221 to 229 via the slit openings along the −Z axis direction. For example, the first contact pin 211 is attached to the first slit 221 along the −Z axis direction via the slit opening, and the attachment method of the second contact pin 212 to the ninth contact pin 219 is this. Same, not repeated here.

One side of each contact pin in the first contact pin 211 to the ninth contact pin 219 is connected to the main circuit of the inkjet printer via a circuit inside the holding portion 200, and the other side is electrically connected to the chip 100. Connected to. Here, the structures of the first contact pins 211 to the ninth contact pins 219 are the same as shown in FIG. The structure of each contact pin will be introduced by taking the first contact pin 211 as an example. The first contact pin 211 is divided into a first portion 211a, a second portion 211b, and a third portion 211c. The first portion 211a or the third portion 211c is used to contact the chip 100, and the second portion 211b is used to connect to the inkjet printer internal circuit, for example, via the holding chip 100. And connect to the main circuit in the inkjet printer. The third portion 211c is connected to the first portion 211a and the second portion 211b.

With reference to FIG. 2 in combination with FIG. 6, the substrate 10 may have at least one substrate terminal 30, and the substrate 10 may have seven substrate terminals 31 to 37 arranged. Here, in the contact pin, the first portion 211a comes into contact with the first substrate terminal 201 to form a contact region, and the second portion 211b is connected to the circuit in the inkjet printer. The third portion 211c connects the first portion 211a and the second portion 211b. The third portion is in the + Z axis direction of the first contact pin 211, and the first contact pin 211 is a part of the third portion 211c or the third portion 211c (for example, the horizontal portion of the third portion 211c). It is fixed to the first slit 221 via 211f). By providing the first portion 211a and the second portion 211b at the ends of the first contact pin 211 in the −Z axis direction, the first portion 211a and the second portion 211b can be elastically deformed. Moreover, it is easy to return to the original state after being deformed. The first portion 211a of the first contact pin 211 is provided in the −X axis direction, and the second portion 211b is provided in the + X axis direction. The first portion 211a and the second portion 211b protrude from the base 210, and the third portion 211c does not protrude from the base 210.

Further, the first portion 211a and the second portion 211b project from the base 210 in the X-axis direction, and the base 210 is located between the first portion 211a and the second portion 211b. The first portion 211a is closer to the mounting position 203 than the second portion 211b. The third portion 211c is divided into a first vertical portion 211d perpendicular to the X-axis direction, a second vertical portion 211e, and a horizontal portion 211f parallel to the X-axis direction, and the horizontal portion 211f is a first vertical portion. The portion 211d and the vertical portion 211e of 2 are connected. The first vertical portion 211d and the second vertical portion 211e extend along the Z-axis direction. The first vertical portion 211d is closer to the mounting position 203 than the second vertical portion 211e. The end of the first vertical portion 211d is connected to the first portion 211a, the end of the second vertical portion 211e is connected to the second portion 211b, the horizontal portion 211f or the first vertical portion 211d, first. When fixed to the first slit 221 in the + Z axis direction of the vertical portion 211e of 2, such a structure of the first contact pin 211 is such that the first portion 211a, the second portion 211a of the first contact pin 211. The portion 211b is made elastic to avoid wear of the internal circuit of the inkjet printer, the first terminal 31 due to hard contact with the chip 100, and the first contact pin 211. The second contact pin 212 to the seventh contact pin 217 have the same arrangement and structure as the first contact pin 211, and detailed illustration and description thereof are not provided here. The eighth contact pin 218 and the ninth contact pin 219 are electrically connected to the conductive sheet 30 via the first vertical portions 219d and 219d, respectively, and the rest have the same arrangement and structure as the first contact pin 211. And here we do not provide detailed illustrations and explanations thereof.

In the ink container chip 100 provided by the embodiment of the present invention in combination with FIGS. 6 and 7, the chip 100 is electrically connected to the contact pin of the holding portion 200 in the inkjet printer. , Chip 100 includes a substrate 10 and at least one conductive sheet 20 attached to the substrate 10, where the substrate 10 has at least one substrate terminal and at least one conductive sheet 20 in contact with the contact pins of an inkjet printer. The conductive sheet 20 includes an electric core connecting portion 22 provided at one end of the main body 21 and the main body 21, the electric core connecting portion 22 abuts on a contact pin, and the main body 21 has at least one. Two positioning mounting portions 23 are provided, the main body 21 is parallel to the surface of the substrate 10, and the main body 21 is mounted so as to be in close contact with the substrate 10 and is attached to the positioning portion 11 via the positioning mounting portion 23. It is attached.

Specifically, the ink container usually includes the chip 100, and the chip 100 is electrically connected to the contact pin of the inkjet printer so that the ink container information stored in the chip 100 of the ink container is transmitted to the inkjet printer. The chip 100 includes a substrate 10, the substrate 10 is generally rectangular, and the substrate has a front surface 10a, a back surface 10b, a left side surface 10c, a right side surface 10d, an upper surface 10f, and a lower surface 10e, where the front surface is 10a. The 10a is arranged parallel to and facing the back surface 10b, the left side surface 10c and the right side surface 10d are located on the −Y axis side and the + Y axis side of the chip 100, respectively, and the upper surface 10f is arranged parallel to and facing the lower surface 10e. Will be done. The board terminal is located on the front surface 10a. One or more conductive sheets 20 are provided at one end of the substrate 10, and the conductive sheets 20 are in contact with contact pins of an inkjet printer. When the ink container is attached to an inkjet printer, the chip 100 is electrically connected to a contact pin, the surface of the substrate 10 facing the contact pin is the front surface 10a of the substrate 10, and the surface facing the front surface 10a of the substrate 10 is. The back surface 10b of the substrate 10.

Further, seven board terminals may be arranged on the board 10, each of which is the first board terminal 31 to the seventh board terminal 37, and the board terminals 201 to 207 are chip boards in the X-axis direction. It is on the + X-axis side of 10. The first substrate terminal 31 is in contact with the first portion 211a of the first contact pin 211, and the region in contact with the first contact pin 211 is the first substrate contact region. The first substrate terminal 31 to the seventh substrate terminal 37 each have a first substrate contact region to a seventh substrate contact region, and are collectively referred to as a substrate contact region. The plurality of substrate contact regions are arranged in a plurality of rows in the Z-axis direction. The first board terminals 31 to the seventh board terminals 37 are arranged in two rows in the Z-axis direction, and the first board terminals 31 to the fourth board terminals 34 are the first along the −Z axis direction. The fifth board terminal 35 to the seventh board terminal 37 are in the second row, and the first board contact region to the fourth board contact region are in the second row along the −Z axis direction. It is in the first row, and the fifth substrate contact region to the seventh substrate contact region are in the second row.

Preferably, in the present embodiment, the substrate is provided with two conductive sheets 20, and the two conductive sheets 20 are a first conductive sheet 20a and a second conductive sheet 20b, and the first conductive sheet 20a and the first conductive sheet 20a. The conductive sheet 20b of 2 is provided on the front surface 10a of the substrate, and the center line L1 passes through the center point of the chip 100 in the Y-axis direction and is parallel to the Z-axis direction, and is parallel to the first conductive sheet 20a and the second. The conductive sheet 20b is symmetrically distributed on the substrate 10 with the center line L1 as the center of symmetry, and the center line L1 passes through the sixth substrate terminal 206. Further, the chip 100 is symmetrical with the center line L1 as the center of symmetry. The conductive sheet 20 is positioned with the chip substrate 10 via the positioning portion 11. The positioning form may be a fixed form such as pasting, welding, or locking.

As shown in FIGS. 9 and 10, the conductive sheet 20 provided by the present embodiment includes a rectangular main body 21, an electric core connecting portion 22 is provided at one end of the main body 21, and the electric core connecting portion 22 is provided. The main body 21 may be formed by bending one end of the main body 21 outward, and the main body 21 is provided with at least one positioning mounting portion 23 in the direction from the electric core connecting portion 22 to the other end, and the positioning mounting portion 23 is provided. , Located on one edge of the body 21. When the ink container is attached to an inkjet printer, the chip 100 is electrically connected to the contact pin, and the surface of the main body 21 toward the contact pin is the first surface 20e of the conductive sheet 20 and faces the first surface 20e. The surface is a second surface of 20 g. Here, the electric core connecting portion 22 and the positioning mounting portion 23 may be located on the first surface 20e, respectively, or the electric core connecting portion 22 is located on the first surface 20e, and the positioning mounting portion 23 is on the first surface. It may be located on the surface 20 g of 2. As can be understood, the electric core connecting portion 22 and the positioning mounting portion 23 can have a sheet-like structure and a columnar structure, and in this embodiment, the shapes of the electric core connecting portion 22 and the positioning mounting portion 23 are limited. Instead, preferably, the electric core connecting portion 22 and the positioning mounting portion 23 may be installed in a sheet-like structure.

The substrate 10 is provided with a positioning portion 11 for inserting the positioning mounting portion 23, the number of the positioning portions 11 matches the number of the positioning mounting portions 23, and the positioning portion includes a positioning hole. Preferably, the positioning unit 11 is a positioning hole. In this embodiment, in order to enhance the connection strength or stability between the conductive sheet 20 and the substrate 10, the conductive sheet 20 may be provided with a plurality of positioning mounting portions 23, and each of the plurality of positioning mounting portions 23 may be provided. The positioning mounting portions 23 may be provided on both sides of the main body 21 and may be provided along the edge of the main body 21. For example, two positioning mounting portions 23 are provided on both sides of the main body 21 and each side thereof. The positioning mounting portions 23 located at the above may be installed facing each other or may be installed in a staggered manner.

When it is necessary to connect the conductive sheet 20 to the substrate 10, the selected conductive sheet 20 may have its positioning mounting portion 23 and the electric core connecting portion 22 located on the first surface 20e of the main body 21. At this time, the conductive sheet 20 is attached from the back surface 10b of the substrate 10, the positioning attachment portion 23 is inserted into the positioning hole 11 located in the substrate 10, and the main body 21 is brought into close contact with the back surface 10b of the substrate 10, and the electric core connection portion is provided. 22 projects from the front surface 10a of the substrate 10. In the selected conductive sheet 20, the positioning mounting portion 23 is located on the first surface 20e of the main body 21, and the electric core connecting portion 22 is located on the second surface 20g of the main body 21, at this time, the conductive sheet 20. The positioning mounting portion 23 is mounted from the front surface 10a of the board 10 and inserted into the positioning hole 11 of the board 10, the main body 21 is made parallel to the front surface 10a of the board 10 and further brought into close contact, and the electric core connecting portion 22 is the board 10. It protrudes from the front surface 10a of.

A guide angle may be provided at the end of the positioning mounting portion 23 away from the main body 21 so that the positioning mounting portion 23 of the conductive sheet 20 can be easily inserted into the positioning hole 11. For example, the positioning mounting portion having a sheet-like structure. The tapered portion 23a can be formed by chamfering the end of the 23 from the main body 21, which is convenient for inserting the positioning mounting portion 23 into the positioning hole 11, and which is a columnar structure of the positioning mounting portion 23. A fillet can be set at the end away from the main body 21 to form an arc surface, which is convenient for inserting the positioning mounting portion 23 into the positioning hole 11.

In the ink container chip provided by this embodiment, the chip is provided with a conductive sheet 20, and the conductive sheet 20 is inserted into the positioning hole 11 of the substrate 10 via the positioning mounting portion 23, and is conductive. The main body 21 of the sheet 20 is brought into close contact with the substrate 10, the electric core connecting portion 22 is provided so as to project from the main body 21, and the main body 21 is brought into close contact with the board 10 because the contact area between the two can be increased and the assembly is performed. Will be easier. Further, the electric core connecting portion 22 of the conductive sheet 20 is located at one end of the main body 21, and the electric core connecting portion 22 is not easily deformed during the mounting process of the conductive sheet 20, so that the electric core connecting portion and the contact pin of the inkjet printer The stability of the electrical connection of the can be improved.

Further, the electric core connecting portion 22 may be provided vertically to the main body 21, which is convenient for electrically connecting to the contact pin, and the positioning mounting portion 23 may also be mounted vertically to the main body 21 for positioning mounting. It is convenient to insert the portion 23 into the positioning hole 11 of the substrate 10, and at the same time, the axis of the positioning hole 11 of the substrate 10 may be perpendicular to the surface of the substrate 10, and the positioning hole 11 is provided in the substrate 10. Is easy. As can be understood, the positioning mounting portion 23 and the chip 100 connecting portion may be provided at an angle to the main body 21, and in this embodiment, the electric core connecting portion 22 and the positioning mounting portion 23 are provided vertically to the main body 21. Is preferable.

In order to detachably connect the conductive sheet 20 to the substrate 10, the conductive sheet 20 can be inserted into the positioning hole 11 in the substrate 10 via the positioning mounting portion 23 thereof. Further, in this embodiment, the main body 21 of the conductive sheet 20 is brought into close contact with the substrate 10, and the conductive sheet 20 may be adhered or welded to the substrate 10 via the main body 21, and the connection strength between the conductive sheet 20 and the substrate 10 may be strong. Can be enhanced. The electric core connecting portion 22 is provided at one end of the main body 21, and the mounting direction of the electric core connecting portion 22 is different from the close direction of the main body 21, and the electric core connecting portion 22 is preferably provided vertically to the main body 21. In the process of fixing the conductive sheet 20 to the substrate 10 by using a process such as welding or bonding of the main body 21, the electric core connecting portion 22 does not deform even if the main body 21 is deformed, and the electric core connecting portion 22 and the contact pin are formed. The stability of the electrical connection can be ensured.

Further, the conductive sheet 20 may be inserted into the positioning hole 11 by using the positioning mounting portion 23 independently, may be welded or adhered to the substrate 10 by using the main body 21 independently, or may be conductive. The sheet 20 can be inserted into the substrate 10 by using the positioning mounting portion 23, and then the main body 21 and the substrate 10 are welded to increase the connection strength between the conductive sheet 20 and the substrate 10, and the positioning mounting portion is preferable. The conductive sheet 20 is inserted into the positioning hole 11 using the 23. In this embodiment, the conductive sheet 20 is inserted into the positioning hole 11 via the positioning mounting portion 23, a plurality of conductive sheets 20 are provided on the substrate 10, and the plurality of conductive sheets 20 are distributed in an array on the substrate 10. The two conductive sheets 20 are the first conductive sheet 20a and the second conductive sheet 20b, respectively, and the first conductive sheet 20a and the first conductive sheet 20a, respectively. The positioning hole 11 provided in the substrate 10 will be described based on the second conductive sheet 20b.

For example, in this embodiment, two symmetrical first conductive sheets 20a and two second conductive sheets 20b are provided on the chip 100 substrate, where the first conductive sheet 20a is the second conductive sheet 20b. The structure of the conductive sheet, which is arranged on the Y side and is arranged on the Y side, will be described in detail by taking the first conductive sheet 20a as an example.

The first conductive sheet 20a provided in this embodiment includes an electric core connecting portion 22 that contacts the eighth contact pin 218, a positioning mounting portion 23 that is fixed to the substrate 10, and an electric core connecting portion 22 and a positioning mounting portion. A main body 21 for connecting the 23 is provided. The positioning mounting portion 23 is fitted with the positioning hole 11 and is used for positioning the first conductive sheet 20a. The first conductive sheet 20a has a conductive sheet contact region 22a that contacts the first vertical portion 218d of the eighth contact pin 218, and the conductive sheet contact region 22a is an electric core connection of the first conductive sheet 20a. It is located at the + X-axis end of the portion 22, and further, the conductive sheet contact region 22a is located at the + X-axis end of the first conductive sheet 20a. The electric core connecting portion 22 is perpendicular to the main body 21, the positioning mounting portion 23 is perpendicular to the main body 21, and the main body 21 is provided parallel to the front surface 10a where the board terminals 201 to 207 are located. The first conductive sheet 20a includes a first surface 20e, a second surface 20g, a third surface 20c, a fourth surface 20d, and a fifth surface 20f. The first surface 20e and the second surface 20g are parallel and provided opposite to each other, and both are parallel to the front surface 10a. The third surface 20c and the fourth surface 20d are parallel to each other and are provided opposite to each other. The third surface 20c and the fourth surface 20d are located on the −Y axis side and the + Y axis side of the first conductive sheet 20a, respectively. The first surface 20e and the second surface 20g are also two surfaces of the main body 21. The third surface 20c and the fifth surface 20f are two surfaces of the electric core connection portion 22, both of which are parallel to each other and are provided opposite to each other. The third surface 20c and the fifth surface 20f are located on the −Y axis side and the + Y axis side of the electric core connection portion 22, respectively.

The electric core connection portion 22 is perpendicular to the main body 21, and the positioning mounting portion 23 is perpendicular to the main body 21. In this structure, the chip reduces the number of parts, the structure is simple, and the production efficiency is high. At the same time, the contact area between the conductive sheet and the substrate is increased, the position where the conductive sheet is positioned with the substrate is increased, the design of the positioning mounting portion is simplified, the operation is facilitated, and the conductive sheet and the substrate 10 are assembled. Will be easier. In addition, it prevents deformation due to the influence on the electric core connection part due to processes such as welding and pasting.

If the electric core connection portion 22 is deformed, it cannot make accurate contact with the eighth contact pin 218. Since the main body 21 is provided parallel to the front surface 10a where the board terminals are located, the work of mounting, positioning, and welding the conductive sheet can be completed only on the front surface 10a of the board 10 in the reproduction process, and the board 10 can be completed. There is no need to move to the back surface 10b, facilitating production and improving production efficiency. The positioning mounting portion 23 is four protrusions protruding from the main body 21, and the four protrusions are perpendicular to the front surface 10a of the substrate and are fitted with the positioning mounting portion 23 using the positioning hole 11, and the four protrusions are positioned. By inserting it into the hole 11, the conductive sheet can be attached more easily and conveniently.

As shown in FIG. 15, when the ink container 300 is attached to the holding portion 200, in the first vertical portion 218d of the first conductive sheet 20a and the eighth contact pin 218, the first conductive sheet 20a is made of a metal material. And because it is welded to the substrate 10, it does not have elasticity. When the ink container 300 is attached to the holding portion 200, the first conductive sheet 20a presses the first vertical portion 218d of the eighth contact pin 218, so that the first vertical portion 218d moves in the + X axis direction. Further, the contact region 22a of the first conductive sheet 20a is inserted into the eighth slit 228, the + X-axis side of the first conductive sheet 20a is inserted into the eighth slit 288, and the third surface 20c and the fifth surface 20c. Since a part of the surface 20f is also inserted into the eighth slit 228, it plays a role of positioning to the chip and enhances the contact accuracy between the chip and the contact pin. The second conductive sheet 20b has the same contact form and function as the first conductive sheet 20a, and a detailed description thereof is not provided here.

Further, the substrate 10 is provided with a plurality of positioning holes 11, the plurality of positioning holes 11 are divided into a plurality of parallel positioning hole groups in a row distribution, and the inter-column distance between adjacent positioning hole groups is conductive. Adjusted by the seat positioning mount. Positioning holes between adjacent groups of holes may be installed facing each other or in a staggered pattern. For example, in this embodiment, the substrate 10 is provided with a symmetrical first conductive sheet 20a and a second conductive sheet 20b, where each conductive sheet includes four positioning mounting portions 23, and accordingly. Therefore, the substrate 10 needs to be provided with four positioning holes 11 for mounting the conductive sheet 20.

Therefore, the substrate 10 is provided with two rows of positioning holes including a first positioning hole group and a second positioning hole group, and the first positioning hole group and the second hole group are arranged at row intervals. The first positioning hole group provided in 10 includes four first positioning holes 11a located in the same row, and the second positioning hole group includes four second positioning holes 11b located in the same row. The first positioning hole group is arranged on the second positioning hole group, and the first positioning hole 11a and the second positioning hole 11b are installed facing each other or in a staggered manner. The positioning mounting portions 23 located on both sides of the conductive sheet 20 may be installed facing each other or may be installed in a staggered manner accordingly.

Based on the above embodiment, a bent portion is provided at an end of the positioning mounting portion 23 away from the main body 21, the bent portion is connected to the positioning mounting portion 23, the bent portion is locked to the substrate 10, and the main body 21 is provided. It is located on the surface of the substrate 10 on the opposite side of the substrate 10. Specifically, one end of the positioning mounting portion 23 is connected to the main body 21, and the other end is inserted into the positioning portion 11 of the substrate 10 and protrudes from the front surface (back surface 10b or front surface 10a) of the substrate 10. With reference to FIGS. 11 and 12, in this embodiment, an example in which the conductive sheet 20 is attached to the front surface 10a of the substrate 10 will be described, and the positioning attachment portion 23 is inserted from the front surface 10a of the substrate 10 into the positioning portion 11. The inserted end of the positioning mounting portion 23 away from the main body 21 protrudes from the back surface 10b of the substrate 10 and is bent to form a bent portion, and the bent portion can be brought into close contact with the back surface 10b of the substrate 10. Prevents the positioning mounting portion 23 from falling out of the insertion hole. Similarly, as shown in FIGS. 13 and 14, the positioning mounting portion 23 is inserted into the positioning portion 11 from the back surface 10b of the substrate 10, and the end of the positioning mounting portion 23 away from the main body 21 is the front surface 10a of the substrate 10. It is bent so as to protrude from the substrate 10 to form a bent portion, and the bent portion can be brought into close contact with the front surface 10a of the substrate 10 to prevent the positioning mounting portion 23 from falling out of the insertion hole.

The number of conductive sheets may be one or more, and when the number of conductive sheets is an even number, the conductive sheets are symmetrically distributed on the chip substrate 10 along the center line L1.

The number of holes in the second portion of the conductive sheet and the chip substrate 10 may be one or more, and any of them can achieve the purpose of positioning.

Further, in order to improve efficiency and operability in the production process, the first conductive sheet 20a and the second conductive sheet 20b may be two parts provided on the same metal sheet in the production process. After the metal sheet is positioned on the chip substrate 10 and welded, the metal sheet is punched into the first conductive sheet 20a and the second conductive sheet 20b using a punch. This production method enhances the operability of the producer, optimizes the production process, and improves the production efficiency.

FIG. 15 is a schematic view of combining the contact pin holder 201 and the tip 100 according to the first embodiment. FIG. 15 is a schematic view of the tip 100 and the contact pin holder 201 when the ink container 300 is attached to the holding portion 200. The first conductive sheet 20a is in contact with the first vertical portion 218d of the eighth contact pin 218, and the first conductive sheet 20a is made of a metal material and is welded to the chip substrate 10, so that it has elasticity. do not have. When the ink container 300 is attached to the holding portion 200, the first conductive sheet 20a presses the first vertical portion 218d of the eighth contact pin 218 so that the first vertical portion 218k is oriented in the + X axis direction. After moving, the contact region 2082 of the first conductive sheet 20a enters the eighth gap 228, the + X-axis side of the first conductive sheet 20a is inserted into the eighth gap 228, and the third surface 20c, the third A part of the surface 20f of 5 is also inserted into the eighth gap 228 to play a role of positioning to the chip 100 and improve the contact accuracy between the chip 100 and the contact pin. The second conductive sheet 20b has the same contact form and function as the first conductive sheet 20a, and a detailed description thereof is not provided here.

As shown in FIGS. 6 and 15, the tip 100 has a set of a first limit groove 12, a set of a second limit groove 13, and a set of a third limit groove 14. Preferably, the set of the first limit groove 12, the set of the second limit groove 13, and the set of the third limit groove 14 are through grooves penetrating the thickness direction (that is, the X-axis direction) of the chip substrate 10. be. The third limit groove 14 is provided on the −Y axis, −Z axis side, + Y axis, and −Z axis side of the chip 100. The third limit groove 14 has a first limit groove surface 14a on the + Y-axis side. When the ink container 300 is attached to the holding portion 200, the first portion 218a of the eighth contact pin 218 is located in the first limit groove 14 of the chip 100, and the third limit groove surface 14a is the eighth. It plays a role of positioning with respect to the contact pin 218 and the ninth contact pin 219, and enhances the accuracy of contact between the tip 100 and the contact pin. The second limit groove 13 is provided on the −Y axis side and the + Y axis side of the chip 100. The first limit groove 12 is provided on the −Y axis, + Z axis side, + Y axis, and + Z axis side of the chip 100.

On the other hand, inside the inkjet printer, a high voltage (for example, a 42V square wave) is applied to the eighth contact pin 218 and the ninth contact pin 219 to detect the ink capacity of the ink container 300 or the ink container 300 holds the ink container 300. It is used to detect whether or not it is attached to the unit 200. Since the operating voltage of the wafer 40 is low, the inkjet printer applies a low voltage (2.7V to 3.3V) to the first contact pins 211 to the seventh contact pins 217 and the wafer 40. The positions of the first limit groove 12 and the second limit groove 13 are set, and particularly when the ink container 300 is attached to the holding portion 200, the eighth contact pin 218 and the ninth contact pin 219 are the third limit. Located in the groove 14, the third limit groove surface 14a has a blocking and isolating action on the eighth contact pin 218 and the ninth contact pin 219, and the eighth contact pin 218 and the ninth contact pin 218. It prevents the contact pin 219 from coming into contact with the substrate terminals, enhances the safety of the chip 100, and avoids damage to the chip 100 and the circuit in the inkjet printer.

The chip 100 can be fixed to the ink container 300 in a form in which the second limit groove 13 or the first limit groove 12 is fitted to the corresponding protrusion on the ink container 300, and is attached to the ink container. It can also be fixed at 300.

With reference to FIGS. 7 and 8, in another embodiment, the first conductive sheet 20a and the second conductive sheet 20b are of the tip 100 via the first positioning hole 11a and the second positioning hole 11b. Positioned on the substrate 10, the conductive sheet is welded to the substrate 10 of the chip 100 in the form of welding. Specifically, the substrate 10 is provided with a left terminal 38a, a right terminal 38b, a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components. The left terminal 38a corresponds to the first conductive sheet 20a, and the right terminal 38b corresponds to the second conductive sheet 20b. In the production process, first, the left terminal 38a is attached with heated tin (for welding), and the first conductive sheet 20a is placed on the substrate 10 through the first positioning hole 11a, and the tin is first conductive. The sheet 20a is welded to the substrate 10. The left rear terminal 38a is connected to the left rear terminal 39a provided on the back surface 10b of the substrate 10 by the wiring in the substrate 10, and the left rear terminal 39a is connected to the wafer 40 or the electronic component by the wiring in the substrate 10. The first conductive sheet 20a exerts the function of performing the function. The second conductive sheet 20b has the same production process and arrangement as the first conductive sheet 20a. In the production process, the right terminal 38b is first attached with heated tin (for welding), and then the second conductive sheet 20b is attached. The sheet 208 is placed on the chip 100 substrate 10 through the second positioning hole 11b, and tin welds the second conductive sheet 20b to the substrate 10. The right terminal 38b is connected to the right rear terminal 39b provided on the back surface 10b of the substrate 10 by the wiring in the substrate 10, and the right rear terminal 39b is connected to the wafer 40 or the electronic component by the wiring in the substrate 10. The conductive sheet 20b of 2 enables the corresponding function to be exhibited.

Further, this implementation is to increase the connection strength between the conductive sheet and the substrate, and as shown in FIG. 22, a left terminal 38a and a right terminal 38b are provided at an end near the upper surface 10f of the substrate 10, and the left terminal 38a, The right terminals 38b are both located on the front surface 10a of the substrate, and in this embodiment, the left terminal 38a is extended to the upper side and the left side of the substrate to extend to the edge of the substrate to increase the surface area of the left terminal 38b, and further to the left conductive sheet. The welding area and welding point can be increased, the connection strength between the left conductive sheet and the substrate can be strengthened, and the substrate can be prevented from falling off. Similarly, the upper and right sides of the right terminal 38b can be extended to the edge of the substrate to increase the surface area of the right terminal, further increase the welding area and welding point with the left conductive sheet, and connect the left conductive sheet and the substrate. The strength can be strengthened and it can be prevented from falling off from the substrate. As can be understood, there is a gap between the right side of the left terminal 38a and the left side of the right terminal 38b, and in order to further reduce the gap between the two, the surface areas of the left terminal 38a and the right terminal 38b are further increased, and FIG. 23 shows. As shown, the left side of the left terminal 38a can be extended to wrap the left positioning hole to keep a gap with the right terminal, and the right side of the right terminal 38b can be extended to wrap the right positioning hole to wrap the left terminal. A gap can be maintained with 38a.

In this embodiment, the substrate 10 is provided with a substrate terminal 30 electrically connected to a contact pin, an additional terminal is also provided between the substrate terminal 30 and the conductive sheet 20, and the additional terminal is a chip 100. It is connected to at least one wafer 40 that stores the data of. Specifically, the substrate 10 may be provided with one or more substrate terminals 30, the number of which may match the number of contact pins. Of course, the number of contact pins does not have to match the number of board terminals 30. For example, the board 10 has only five board terminals, the contact pins have nine contact pins, one of which is an empty, empty contact pin, and the empty contact pin is an inkjet printer. Circuits that are not connected to or are connected to the internal circuit do not affect the use of the ink container. In another embodiment, the substrate 10 has only four substrate terminals, the contact pins have nine contact pins, and in addition to the empty contact pins described above, two contact pins are simultaneously connected to one substrate terminal. Used for mounting detection. Specifically, as shown in FIG. 24, the substrate 10 has only five substrate terminals. The first substrate terminal 31 on the substrate 10 has an extended portion that comes into contact with the first contact pin 211 and the second contact pin 212 at the same time, and the first substrate terminal 31 has two contact regions. Using this technique, it is possible to detect whether the ink container 300 is correctly mounted in the holding portion 200. When the ink container 300 is correctly mounted in the holding portion 200, the first contact pin 211, the second contact pin 212 simultaneously contact the first board terminal 31, and the first contact pin 211, the first contact pin 211, The second contact pin 212 is connected by the first board terminal 31, the voltages of the first contact pin 211 and the second contact pin 212 are the same, and finally the first contact pin 211 and the second contact pin 212 and the second contact pin 212. Only by detecting whether or not the voltages of the contact pins 212 match, it is possible to know whether or not they are in contact with the first board terminal 31 at the same time, and further, the assembly detection is completed. The substrate 10 does not have a terminal at a position corresponding to the fourth contact pin 214 (that is, the position of the fourth substrate terminal 34 on the substrate 10), and the substrate 10 has a fourth contact pin 214. Does not have a contact area in contact with. The fourth contact pin 214 is an empty contact pin that is not connected to the internal circuit of the inkjet printer. The remaining substrate terminals, the conductive sheet, and the chip 100 all match with reference to the connection form in which the seven substrate terminals are provided on the substrate.

Further, FIG. 25 is a schematic view of another chip 100 of the first embodiment. The substrate 10 has seven substrate terminals 31 to 37, and the seven substrate terminals 31 to 37 are rectangular and sequentially arranged in a row. However, its contact area still coincides with the chip 100 shown in FIG. Changing the shape of the substrate terminals on the substrate 10 can still achieve the beneficial effects of this embodiment.

Further, as shown in FIG. 21, the substrate 10 has a first substrate terminal 31, a second substrate terminal, a third substrate terminal 33, a fourth substrate terminal 34, a fifth substrate terminal 35, and a sixth substrate terminal. The substrate terminal 36 and the seventh substrate terminal 37 are provided, and a first conductive sheet 20a and a second conductive sheet 20b are provided at one end of the substrate, and the substrate terminal is a first conductive sheet 20a. A first additional terminal 51a is provided between the and, and a second additional terminal 51b is provided between the second and the conductive sheet, where the second substrate terminal 32, the third substrate terminal 33, and the like are provided. The fifth substrate terminal 35 and the seventh substrate terminal 37 (hereinafter collectively referred to as wafer 40 terminals) are connected to the wafer 40.

The first additional terminal 51a is connected to the second board terminal 32 (for example, is connected by a wire provided on the board 10), and the second additional terminal 51b is connected to the seventh board terminal 37. Has been done. That is, the first additional terminal 51a and the second additional terminal 51b can correspond to the stretched portion of the substrate terminal connected to the wafer 40. Due to the presence of the first additional terminal 51a and the second additional terminal 51b, the conductive sheet is cut off from the first substrate terminal 30 and the second substrate terminal 30, and in this structure, the conductive sheet 20 is the first. It reduces the possibility of being connected in series with the board terminal 31 of 1 and the second board terminal 32 in a short circuit. Further, the wafer terminal is usually provided with an ESD protection circuit, and the ESD protection circuit can withstand an electric shock voltage of several hundred volts to several thousand volts to the first substrate terminal, so that the wafer 40 terminal and the conductive sheet 20 / first Even if a short circuit occurs between the substrate terminal 31 and the second substrate terminal 32, there is a low risk that the inkjet printer / ink container will be damaged. By providing the wafer terminals between the two board terminals 32, the possibility of short-circuit series between them is reduced, and the risk of damage is reduced.

FIG. 20 is a schematic view in which the chip 100 is attached to the ink container 300. The adapter 340 is part of the ink container 300, and generally the adapter 340 mates with the box 310 to form one complete ink container 300. When the ink in the box 310 runs out, it is only necessary to replace the box 310 and the adapter can continue to be used, reducing costs and saving resources. The adapter 340 has a notch 343 for inserting the ink ejection port 311, a chip mounting surface 340c, two facing first protrusion columns 341 and two facing second protrusions. There is a pillar 342.

The chip 100 is arranged on the chip mounting surface 340c. The two facing first limit grooves 11 and the two facing second limit grooves 13 on the chip 100 are for fixing the chip 100 to the ink container 300. The two first protruding columns 341 in the adapter 340 are each fitted with the two second limit grooves 13, and the two second protruding columns 342 are each fitted with the first limit groove 11 to form a tip 100. Can be fixed to the ink container 300. The first protruding column 341 matches the shape of the second limit groove 13, and when the tip 100 is attached to the adapter 340, the first protruding column 341 abuts on the third limit groove 11 and the tip 100 Does not move to the adapter 340. The second protruding column 342 matches the fitting form of the first limit groove 11, and a detailed description thereof is not provided here.

As shown in FIGS. 26, 27, 30 to 34, the present embodiment also provides another ink container including the chip 100 of the ink container, in which the chip 100 is provided with a plurality of limit grooves and ink. The container is provided with a plurality of limit blocks that fit into the limit groove, and the chip 100 is detachably attached to the ink container via the limit groove and the limit block.

Specifically, FIG. 26 shows another ink container provided by this embodiment, which includes a chip holder 320, and the chip holder 320 is detachably attached to the ink container, and FIG. 27 shows the ink. A holding portion 200 that fits into the container, and is used to attach an ink container having such a chip holder 320 to the holding portion 200.

The ink container 300 includes a box body 310, an ink discharge port 311 provided in the box body 310, and a locking portion 312, and the locking portion 312 is used for connecting the box body 310 to the holding portion 200 of the inkjet printer. A mounting surface for mounting the chip 100 is provided on the side of the box 310 away from the ink ejection port 311, and a plurality of limit blocks are provided on both sides of the mounting surface. The substrate 10 of the chip 100 is provided with a plurality of limit blocks. A plurality of limit grooves may be provided, and the limit grooves may be provided on both the left and right sides of the substrate 10, and the position of the limit block on the box body and the position of the limit groove on the substrate 10 are not limited, and the chip 100 is provided. It suffices to connect to the box body so that it can be attached and detached. The holding portion 200 includes a bottom wall 200a. The ink is stored in the box 310, the ink reaches the ink supply unit 202 via the ink discharge unit 311, and the ink supply unit 202 can supply the ink to the print head, whereby the ink is printed. It can be used to perform an operation. The first side wall 200c in the holding portion 200 is not perpendicular to the bottom wall 200a but is inclined with respect to the bottom wall 200a. The chip 100 is attached to the chip holder 320, and the combination of the chip holder 320 and the chip 100 is attached to an inclined portion on the ink container 300 via the first locking hole 313. The chip 100 may be electrically connected to a contact pin on the contact pin holder 201 and used for mutual transmission between electrical signals. The locking portion 312 is used to fix the ink container 300 to the holding portion 200, and the locking portion 312 is fitted with the fixing portion 204 to prevent the ink container 300 from being detached from the holding portion 200.

Further, the box body 310 also includes a tip holder 320, the tip holder 320 is used for fixing the tip 100, and the tip 100 is detachably connected to the tip holder 320 and is placed on the box body 310 at the tip mounting position. be. By providing a mounting chamber for mounting the chip holder 320 in the box body 310, the chip holder 320 is inserted and mounted in the mounting chamber, and the limit block provided in the box body 310 is located on the chip holder 320. Moreover, it may be provided near the surface of the chip 100 mounting surface. The chip 100 is provided with a plurality of limit grooves that fit with the limit block, so that the chip 100 can be detachably connected to the chip holder 320, and the chip holder 320 can be further fixed to the box body 310. Is realized to be attached to the ink container.

The box body 310 is provided with at least one first locking hole 313 on each side of the mounting chamber, and accordingly, the tip holder 320 includes a first connecting portion 325 and a first fixing portion 321. The fixing portion 321 of 1 is provided with a mounting surface for mounting the chip 100, and the first connecting portion 325 is used for fixing the chip holder 320 to the box body 310, and both sides of the first connecting portion 325. Each is provided with a first positioning boss 326 that fits into the first locking hole 313, and when the tip holder 320 is inserted into the mounting chamber, the first positioning boss 326 is inside the first positioning hole 11a. The tip holder 320 can be fixed to the box body 310.

As shown in FIGS. 30, 31 and 32, the first connecting portion 325 may be generated by stretching the first fixing portion 321, that is, one end of the first connecting portion 325 is the first fixing. A second limit boss 327 is provided at the other end of the first connection portion 325, and an elastic element 328 is laid on the second limit boss 327. One end of the elastic element 328 is connected to the portion 321. It abuts on the contact surface formed between the second limit boss 327 and the first connection portion 325, and the other end of the elastic element 328 abuts on the inner wall of the mounting chamber. The elastic element 328 provided by this embodiment may be manufactured using silica gel or rubber, and the second limit boss 327 may be a cylinder, between the cylinder and the first connection portion 325. An abutting surface is formed, the elastic element 328 is mounted on a cylinder, one end of which abuts on the abutting surface, the other end of which abuts on the inner wall of the mounting chamber, and the chip holder 320 is placed in the mounting chamber of the box body 310. Elasticly attach.

Further, as shown in FIGS. 33 and 34, an inclined surface 329 is provided at an end of the first connecting portion 325 separated from the first fixing portion 321, and the inclination angle of the inclined surface 329 is the rotation of the tip holder 320. It is inclined in the direction, and the end portion of the first connecting portion 325 has a certain gap from the chamber wall of the mounting chamber, so that the tip holder 320 tends to be rotatable in the mounting chamber. When the ink container 300 having the chip holder 320 is attached to the holding portion 200 of the printer, first positioning bosses 326 are provided on both sides of the chip holder 320, and the box body of the ink container 300 has a first locking hole. A 313 is provided and a first positioning boss 326 is provided in the first locking hole 313 so that the first positioning boss 326 can rotate in the first locking hole 313. When the chip 100 holder 320 is inserted into the ink container 300 of the inkjet printer, the first positioning boss 326 is locked in the first locking hole 313 to rotate the box body, and the chip holder 320 is a holding portion. The tip 100 can rotate and adjust the mounting position with respect to the contact pin holder 210 with respect to the 200, and the conductive sheet 20 is brought into contact with the contact pin 211. In the present embodiment, the inclined surface 329 provided on the first connection portion 325 has a tip holder 320 having a constant rotatable angle in the mounting chamber, and the rotation angle is 10 ° to 15 °, preferably 12 Can be .4 °. When the ink container comes into contact with the holding portion 200, there is a gap between the chip 100 and the side wall member of the holding portion 200 of the inkjet printer, and when the ink container is attached to the holding portion 200, the holding portion 200 is attached to the conductive sheet 20. Prevents touching and prevents the conductive sheet 20 from being scratched or falling off the substrate 10.

Example 2
The chip 100 of this embodiment includes at least one conductive sheet, and the case of two conductive sheets will be described as an example. 16 and 17 are schematic views of the chip in the second embodiment. As shown in FIGS. 16 and 17, the chip 100 includes a chip substrate 10, a first conductive sheet 20a, and a second conductive sheet 20b. The seven substrate terminals 31 to 37 on the chip substrate 10 are arranged in two rows in the Z-axis direction, and are in the first row R1 and the second row R2 in order along the −Z axis direction. The tip 100 includes a first recess 151, a second recess 152, a third recess 153, a fourth recess 154, a fifth recess 155, a sixth recess 156, and a seventh recess 157. Here, the third recess 153, the fourth recess 154, and the seventh recess 157 can fix the chip 100 to the adapter 340 or the ink container 300 as positioning recesses, and specifically, the third recess. The 153, the fourth recess 154, and the seventh recess 157 coincide with the protrusions on the chip holder 320 or the adapter 340 or the ink container 300 to secure the chip 100 to the chip holder 320 or the adapter 340 or the ink container 300. used. Here, the third recess 153 and the fourth recess 154 are on the + Z axis direction side of the chip 100 and have a circular hole shape, and the seventh recess 157 is on the −Z axis direction side of the chip 100 and are a semicircle. It is a shape. Those skilled in the art can understand that the third recess 153, the fourth recess 154, and the seventh recess 157 may have other shapes, and it is sufficient to guarantee that the chip 100 can be fixed.

The positioning portion 11 of the positioning conductive sheet 20 is two through holes penetrating the thickness direction of the chip 100. Preferably, the positioning unit 11 may be a plurality of positioning holes, and specifically, in this embodiment, the positioning unit 11 is a first positioning hole 11a and a second positioning hole 11b. The positioning mounting portion 23 of the conductive sheet 20 positions the conductive sheet 20 through the positioning portion 11. Further, the positioning mounting portion 23 is a protrusion protruding from the main body 21, and the positioning mounting portion 23 is inserted into the corresponding positioning portion 11. Depending on the form of welding or adhesion, the conductive sheet 20 can fix the conductive sheet 20 via fixing the positioning mounting portion 23, the main body 21 and the corresponding portion of the chip substrate.

The board terminals 31 to 37 are provided on the front surface 10a of the chip 100, the board terminals 31 to 37 are in contact with the corresponding contact pins on the contact pin holder 201, and each board terminal is in contact with the corresponding contact pin. It has a terminal contact portion, and as can be understood here, the front surface 10a of the chip 100 is the front surface 10a of the chip substrate, and the back surface 10b of the chip 100 is the back surface 10b of the chip substrate. The main body 21 of the conductive sheets 20a and 20b is provided on the back surface side of the chip 100, and the electric core connecting portion 22 of the conductive sheets 20a and 20b passes through the fifth recess 155 and the sixth recess 156 of the chip 100 from the back surface 10b side. , Protruding to the front surface 10a. With such a structure, the main body 21 of the conductive sheets 20a and 20b is provided on the back surface 10b side of the chip 100, and the electric core connection portion 22 of the conductive sheets 20a and 20b is directed from the main body 21 toward the + X axis side of the chip substrate. The extending electric core connection portion 22 projects toward the front surface side of the chip substrate through the fifth recess 155 and the sixth recess 156 as avoidance recesses, and comes into contact with the corresponding contact pins. The rational arrangement of the board terminal and the conductive sheet is better realized, and the miniaturization of the chip 100 becomes easier.

The fifth recess 155 and the sixth recess 156 are located on the −Y axis side and the + Y axis side of the chip 100, respectively. The seven board terminal contact portions are arranged in two rows in the Z-axis direction, and are in the first row and the second row in order along the −Z axis direction. It is located between the first and second rows. Further, the electric core connecting portions 22 of the conductive sheets 20a and 20b are located between the first row R1 and the second row R2 in which the substrate terminals 31 to 37 are spaced apart in the Z-axis direction.

Further, the substrate terminal contact portions are arranged in a plurality of rows in the Z-axis direction, and the electric core connection portion 22 of the conductive sheet 20 is located between the plurality of rows composed of the substrate terminal contact portions.

Further, the substrate terminals 30 may be arranged in a plurality of rows (for example, 3 rows and 4 rows) in the Z-axis direction, and the electric core connection portion 22 of the conductive sheet 20 is located between the plurality of rows composed of the substrate terminals. is doing.

In this way, when the conductive sheet 20 comes into contact with the contact pin, it comes into contact with the first portion 218a of the eighth contact pin 218 and the first portion 219a of the ninth contact pin 219, and the first embodiment. The conductive sheet 20 in the content does not come into contact with the first vertical portion 218d of the eighth contact pin 218 and the first vertical portion 219d of the ninth contact pin 219. At least a part of the electric core connection portion 22 of the conductive sheet 20 in the content of the first embodiment penetrates deeply into the contact pin groove, and the first vertical portion 218d of the eighth contact pin 218 and the ninth contact pin 219. It is necessary to press the first vertical portion 219d of the contact pin, because the first vertical portion 218d and the first vertical portion 219d of the ninth contact pin 219 are close to the fixing portion of the contact pin (horizontal portion 218f, 219f). , Contact pins 218 and 219 are likely to be pressed excessively, which may cause damage to the contact pins and a decrease in elastic deformation ability. The conductive sheets 20a and 20b in this embodiment are in contact with the first portion 218a of the eighth contact pin 218 and the first portion 219a of the ninth contact pin 219, and the conductive sheet is in the contact pin groove. It does not enter, making contact with the contact pin easier and avoiding situations where excessive pressing on the contact pin causes impaired electrical connection.

FIG. 18 is a schematic view of the first conductive sheet 20a. The electric core connection portion 22 of the first conductive sheet 20a is perpendicular to the main body 21, the positioning mounting portion 23 is perpendicular to the main body 21, and the main body 21 is parallel to the surface 10a where the board terminals are located, and the chip 100. The electric core connecting portion 22 is provided on the back surface 10b side of the above, and the length D1 in the Y-axis direction is larger than the length D2 in the Z-axis direction. Since the length in the Y-axis direction is relatively large, even if the ink container is misaligned or offset in the Y-axis direction, the chip will not become unrecognizable and the contact between the conductive sheet and the contact pin will be more stable. .. The arrangement method and structure of the second conductive sheet 20b are symmetrically arranged along the center line L1 with the first conductive sheet 20a.

Further, as shown in FIG. 19, when the ink container is mounted in the holding portion, the conductive sheets 20a and 20b are in contact with the first portion of the contact pin, and the conductive sheet contact region 22a is the first portion of the contact pin. Since the contact pins 218 and 219 have a larger compression amount than the other contact pins 211 to 217 that come into contact with the substrate terminals, the contact pins 218 and 219 are more than the contact pins 211 to 217. Also close to the + X axis direction, and the contact pins 218 and 219 do not enter the third recess 14.

The chip substrate 10 is provided with a left rear terminal 39a, a right rear terminal 39b, a wafer 40, and electronic components. The left rear terminal 39a corresponds to the first conductive sheet 20a, and the right rear terminal 39b corresponds to the second conductive sheet 20b. The left rear terminal 39a and the chip substrate 10 are fixed to the first conductive sheet 20a in the form of welding or adhesion, and the first conductive sheet 20a is attached to the wafer 230 or the electronic component 231 via the left rear terminal 39a. It is electrically connected. The second conductive sheet 20b is fixed to the right rear terminal 39b and the chip substrate 10 in the form of welding or adhesion, and the second conductive sheet 20b is electrically connected to the wafer 40 or electronic components via the right rear terminal 39b. Is connected.

The positioning mounting portion 23 of the first conductive sheet 20a is in the −Z axis direction of the electric core connecting portion 22, and the substrate terminals 31 to 34 of the first row R1 are the positioning mounting portions of the first conductive sheet 20a. It is located between the 23 and the electric core connection portion 22, and the chip can be further miniaturized and the size of the chip can be reduced. In the embodiment of the present application, the electric core connecting portion 22 and the positioning mounting portion 23 of the first conductive sheet 20a may be located on both sides of the main body 21 in the Z-axis direction, respectively. However, in the X-axis direction, the electric core connecting portion 22 and the positioning mounting portion 23 may be located on the same side of the main body 21, respectively.

Further, an additional terminal may be provided on the front surface 10a of the chip board, and the additional terminal is cut off between the electric core connection portion of the conductive sheet and the corresponding adjacent board terminal, that is, with the board terminal 30. An additional terminal is further provided between the conductive sheet 20 and the conductive sheet to avoid a short circuit between the substrate terminal adjacent to the conductive sheet, the additional terminal may extend from the inner substrate terminal in the Y-axis direction, and the additional terminal may extend. , Is connected to at least one wafer 40 that stores the data of the chip 100.

For example, as shown in FIG. 16, the second substrate terminal 32 of the chip 100 has an additional terminal 32a, and the third substrate terminal 33 has an additional terminal 33a. The additional terminal 32a is provided between the first substrate terminal 31 and the first conductive sheet 20a, and the additional terminal 33a is provided between the fourth substrate terminal 34 and the second conductive sheet 20b. The additional terminals are consistent with the technical effects of Example 1, and detailed description thereof is not provided here.

The chip 100 is arranged on the chip mounting surface 340c of the ink container. The third recess 153, the fourth recess 154, and the seventh recess 157 on the chip 100 are portions for fixing the chip 100 to the adapter 340. The protrusion on the adapter 340 fits into the third recess 153, the fourth recess 154, and the seventh recess 157 so that the tip 100 can be fixed to the adapter 340.

The chip 100 of the second embodiment is attached to the adapter 340, and the chip holder 320 is the same as that of the first embodiment. No detailed description is provided here. There are three protrusions on the chip mounting surface of the chip holder 320. These three protrusions abut on the seventh recess 157, the third recess 153, and the fourth recess 154 on the tip 100, respectively, to fix the tip 100 to the tip holder 320. Further, the tip holder 320 may be provided with protrusions to prevent the first conductive sheet 20a and the second conductive sheet 20b from being displaced when subjected to an external force action, and specifically, the first conductive sheet. Protrusions may be provided on the −Y-axis side of 20a and on the + Y-axis side of the second conductive sheet 20b to block the movement of the first conductive sheet 20a and the second conductive sheet 20b in the Y-axis direction, and to chip. Improves accuracy when 100 contacts the contact pin.

The method of attaching the ink container 300 to the holding portion 200 is the same as that of the first embodiment, and detailed description thereof is not provided here.
The rest is consistent with Example 1.

Example 3
As shown in FIG. 28, the chip substrate 10'has only five substrate terminals 31', 33', 35', 36', 37'. The first board terminal 31'on the chip board 10'has a longer length in the Y-axis direction than the other terminals, and is in contact with the first contact pin 211 and the second contact pin 212 at the same time. The board terminal 31'has two contact areas. Using this technique, it is possible to detect whether the ink container 300 is correctly mounted in the holding portion 200. When the ink container 300 is correctly mounted in the holding portion 200, the first contact pin 211 and the second contact pin 212 simultaneously contact the first board terminal 31', and the first contact pin 211 and the second contact pin 212 are in contact with each other. The second contact pin 212 is connected by the first board terminal 31', the voltages of the first contact pin 211 and the second contact pin 212 match, and finally the first contact pin 211 and the second contact pin 211 and the second contact pin 212. Only by detecting whether or not the voltages of the contact pins 212 of the above are in agreement, it is possible to know whether or not they are in contact with the first board terminal 31'at the same time, and further, the assembly detection can be completed. The chip substrate 10'has no terminal at a position corresponding to the fourth contact pin 214 (that is, the position of the fourth substrate terminal 34 on the chip 100), and the chip substrate 10'has a fourth contact. It does not have a contact area in contact with the pin 214. The fourth contact pin 214 is not connected to the internal circuit of the inkjet printer and is an empty contact pin. The remaining substrate terminals, conductive sheets 20a to 20b, coincide with the chip 100. The chip 100'has only eight contact areas.
The rest is consistent with Example 2.

Example 4
FIG. 29 is a schematic view of the chip of the fourth embodiment. The chip substrate 10 ″ of the chip 100 ″ has substrate terminals 31 ″ to 37 ″. The board terminals 31'' to 37'' are rectangular and arranged in a row in order. However, its contact area still coincides with the chip shown in FIG. Only the shape of the terminals on the chip substrate of the chip is modified and the beneficial effects of the present application can still be achieved.

The seven board terminal contact portions are arranged in two rows in the Z-axis direction, and are in the first row and the second row in order along the −Z axis direction. It is located between the first and second rows.

Further, the substrate terminal contact portions are arranged in a plurality of rows in the Z-axis direction, and the electric core connection portions of the conductive sheets 20a and 20b are located between the plurality of rows composed of the substrate terminal contact portions.
The features such as the board terminals and the recesses are the same as those described in the first embodiment.

Example 5
FIG. 35 is a schematic view of the chip of the fifth embodiment.

Unlike the second embodiment, a part of the substrate terminals is provided on the lower surface of the chip. As shown in FIG. 35, the fifth board terminal 35 to the seventh board terminal 37 are provided on the lower surface 10e of the board 10 of the chip 100. Preferably, the fifth board terminal 35, the sixth board terminal 36, and the seventh board terminal 37 are provided not only on the lower surface 10e but also on the front surface 10a and the back surface 10b. With such a structure, the fifth board terminal 35, the sixth board terminal 36, and the seventh board terminal 37 can be brought into contact with the inclined portion of the first portion of the corresponding contact pin. Specifically, the fifth substrate terminal 35 comes into contact with the inclined portion of the first portion 215a of the fifth contact pin 215. In this way, the force exerted by the contact pin on the tip can be reduced and damage to the tip can be better avoided.

The third recess 153, the fourth recess 154, and the eighth recess 158 are semicircular and are for fixing the chip to the ink cartridge.

The board terminal is substantially on the front surface 10a. In the X-axis direction, most of the substrate terminals 31 to 37 are on the + X-axis side of the chip substrate 10. It may be considered that the substrate terminals 31 to 37 are on the + X-axis side of the chip substrate 10 in the X-axis direction. The technical effect of Example 2 can also be achieved.

Example 6
FIG. 36 is a schematic view of the chip of the sixth embodiment.

Unlike the first embodiment, a part of the substrate terminals is provided on the lower surface of the chip. As shown in FIG. 35, the fifth board terminal 35 to the seventh board terminal 37 are provided on the lower surface 10e of the board 10 of the chip 100. Preferably, the fifth board terminal 35, the sixth board terminal 36, and the seventh board terminal 37 are provided not only on the lower surface 100e but also on the front surface 10a and the back surface 10b. With such a structure, the fifth board terminal 35, the sixth board terminal 36, and the seventh board terminal 37 can be brought into contact with the inclined portion of the first portion of the corresponding contact pin. Specifically, the fifth substrate terminal 35 comes into contact with the inclined portion of the first portion 215a of the fifth contact pin 215. In this way, the force exerted by the contact pin on the tip can be reduced and damage to the tip can be better avoided.

Most of the board terminals are on the front surface 10a. In the X-axis direction, most of the substrate terminals 31 to 37 are on the + X-axis side of the chip substrate 10. It may be considered that the substrate terminals 31 to 37 are on the + X-axis side of the chip substrate 10 in the X-axis direction. The technical effect of Example 1 can also be achieved.

Further, referring to FIG. 12, in the present embodiment, the chip 100 is detachably connected to the chip holder 320, specifically, the chip 100 includes a substrate 10, and a conductive sheet 20 is attached to one end of the substrate 10. A first is provided on the substrate 10 along the direction from the end on which the conductive sheet 20 of the substrate 10 is provided to the opposite end thereof (along the X-axis direction of the substrate 10 as shown in FIG. 3). A set of the limit groove 12, a set of the second limit groove 13, and a set of the third limit groove 14 are sequentially provided, and the first limit groove 12, the second limit groove 13, and the third limit groove 14 are sequentially provided. Reference numeral 14 functions as an avoidance recess, and the limit groove of each set includes two limit grooves provided symmetrically on both sides of the chip 100. The first limit groove 12 is provided close to the conductive sheet 20, and the third limit groove 14 extends from the edge of the end of the substrate 10 away from the conductive sheet 20 to the vicinity of the middle portion. The length direction of the limit groove 14 is parallel to the X-axis direction, the second limit groove 13 is provided between the first limit groove 12 and the second limit groove 13, and the second limit groove 13 is It may be provided as an arc groove, and the first limit groove 12 and the third limit groove 14 may be notches in a rectangular shape. In the first fixing portion 321 on the chip holder 320, the first fixing portion 321 is fitted with the first limit block 322 that fits with the first limit groove 12, and the second limit groove 13 that fits with the second limit groove 13. A third limit block 324 that fits with the limit block 323 of 2 and the third limit groove 14 is provided. When the chip 100 is attached to the chip holder 320, the first limit block 322 is brought into contact with the first limit groove 12, and the second limit block 323 is brought into contact with the second limit groove 13. The limit block 324 of 3 can be brought into contact with the third limit groove 14, and the chip 100 can be detachably connected to the chip holder 320.

Further, in order to prevent deformation of the electric core connection portion 22, the height of the first limit block 322 may be projected from the front surface 10a of the substrate 10, and the first limit block 322 may be attached to the substrate 10 of the chip 100. By partially contacting and partially contacting the electric core connecting portion 22 of the conductive sheet 20, deformation of the electric core connecting portion 22 can be avoided, and electricity between the electric core connecting portion 22 and the contact pin can be avoided. The stability of the target connection can be improved.

Last but not least, each of the above embodiments has been used only to illustrate the technical means of the invention and is not a limitation thereof, although the invention has been described in detail with reference to each of the above embodiments. , The person skilled in the art may modify the technical means described in each of the above embodiments, or replace some or all of the technical features thereof equally, provided that these modifications or replacements are: It should be understood that the essence of the corresponding technical means does not deviate from the scope of the technical means of each embodiment of the invention.

The present invention was submitted to the China Patent Office on June 28, 2019, and the application number is 201921005051.8, and the title of the invention is "a chip for an ink container and an ink container using the chip". , 2019. A Chinese patented invention submitted to the Chinese Patent Office on December 09, with an application number of 20092218414.7 and the title of the invention being "ink container chip and ink container", the Chinese Patent Office on December 19, 2019. The application number submitted to is 201922297657. X, the invention is a Chinese patented invention whose name is "ink container chip and ink container using the chip", and the application number submitted to the Chinese Patent Office on March 13, 2020 is 20120311962. X, and the title of the invention is "ink container chip and ink container using the chip", claiming the priority of the Chinese patented invention, all of the contents thereof are combined with the present invention by reference.

Further, the substrate is provided with a plurality of positioning holes , and the plurality of positioning holes are distributed in a row and are divided into a first positioning hole group and a second positioning hole group parallel to each other. Here, the positioning holes in the first positioning hole group are installed facing the positioning holes of the second positioning hole group, or are installed in a staggered manner.

Further, the board terminals are arranged in a plurality of rows in the Z-axis direction, the electric core connection portions are located between the board terminals in the plurality of rows, and the electric core connection portions and the positioning mounting portions are arranged in the Z-axis direction. The portions are located on both sides of the main body.

It is a schematic diagram which attaches the ink container provided by the Example of this invention to a holding part. FIG. 1 is a schematic structure diagram 1 of an ink container provided by an embodiment of the present invention. It is a structural schematic diagram of the holding part provided by the Example of this invention. It is a structural schematic diagram of the contact pin holder provided by the Example of this invention. It is a structural schematic diagram of the contact pin shown in FIG. It is an exploded schematic view of the chip provided by the Example of this invention. It is the front structure schematic diagram of the substrate of FIG. It is a schematic diagram of the back surface structure of the substrate of FIG. It is the front structure schematic diagram of the conductive sheet of FIG. It is a schematic diagram of the back surface structure of the conductive sheet of FIG. FIG. 1 is a schematic view of a connection method 1 between a conductive sheet and a substrate of FIG. FIG. 2 is a schematic view of a connection method 1 between a conductive sheet and a substrate of FIG. FIG. 1 is a schematic view of a connection method 2 between a conductive sheet and a substrate of FIG. It is a schematic diagram of the connection method 2 of a conductive sheet and a substrate of FIG. It is a connection schematic of the tip and the contact pin holder provided by the Example of this invention. It is a schematic diagram of the chip in Example 2. It is a schematic diagram of the chip in Example 2. It is a schematic diagram of the left conductive sheet of Example 2. It is a schematic diagram of the electrical connection between the tip of Example 2 and a contact pin holder. FIG. 1 is a schematic connection diagram 1 of a connection between a chip and an ink container provided by an embodiment of the present invention. FIG. 1 is a schematic arrangement of additional terminals provided by an embodiment of the present invention on a substrate. FIG. 1 is a schematic diagram of the arrangement of the left terminal and the right terminal provided by the embodiment of the present invention on the substrate. FIG. 2 is a schematic arrangement diagram 2 of the left terminal and the right terminal provided by the embodiment of the present invention on the substrate. It is a 2nd arrangement schematic diagram in the substrate of the substrate terminal provided in the Example of this invention. It is a 3rd arrangement schematic diagram in the substrate of the substrate terminal provided in the Example of this invention. It is a structural schematic diagram of the ink container provided by another embodiment of this invention. It is a structural schematic diagram of the holding part provided by another embodiment of this invention. It is a schematic diagram of the chip of Example 3. It is a schematic diagram of the chip of Example 4. FIG. 3 is a schematic connection diagram of a chip holder and a chip provided by another embodiment of the present invention. It is a structural schematic diagram of the chip holder provided by the Example of this invention. It is a schematic connection diagram of the chip holder and the box body provided by the Example of this invention. FIG. 1 is a schematic connection diagram 1 of a connection between a chip holder and a contact pin provided by an embodiment of the present invention. FIG. 2 is a schematic connection diagram 2 of a connection between a chip holder and a contact pin provided by an embodiment of the present invention. It is a schematic diagram of the chip of Example 5. It is a schematic diagram of the chip of Example 6.

As shown in FIG. 4, the contact pin holder 201 includes a base 210 and a plurality of contact pins attached to the base 210, and the plurality of contact pins are the first contact pin 211 to the ninth contact pin 219, respectively. .. The contact pin is a flaky metal sheet that has an electrical conduction effect and is not easily worn. The base 210 includes a plurality of slits, each of which is a first slit 221 to a ninth slit 229, the plurality of slits 221 to 229 correspond to a plurality of contact pins 211 to 219, and the plurality of slits 221 to 229. It is U-shaped and has slit openings in the + Z axis direction, and the plurality of contact pins 211 to 219 are attached to the plurality of slits 221 to 229 via the slit openings along the −Z axis direction. For example, the first contact pin 211 is attached to the first slit 221 along the −Z axis direction via the slit opening, and the attachment method of the second contact pin 212 to the ninth contact pin 219 is this. Same, not repeated here.

Further, the first portion 211a and the second portion 211b project from the base 210 in the X-axis direction, and the base 210 is located between the first portion 211a and the second portion 211b. The first portion 211a is closer to the mounting position 203 than the second portion 211b. The third portion 211c is divided into a first vertical portion 211d perpendicular to the X-axis direction, a second vertical portion 211e, and a horizontal portion 211f parallel to the X-axis direction, and the horizontal portion 211f is a first vertical portion. The portion 211d and the second vertical portion 211e are connected. The first vertical portion 211d and the second vertical portion 211e extend along the Z-axis direction. The first vertical portion 211d is closer to the mounting position 203 than the second vertical portion 211e. The end of the first vertical portion 211d is connected to the first portion 211a, the end of the second vertical portion 211e is connected to the second portion 211b, the horizontal portion 211f or the first vertical portion 211d, first. When the vertical portion 211e of 2 is fixed to the first slit 221 in the + Z axis direction, such a structure of the first contact pin 211 is such that the first portion 211a of the first contact pin 211 is a second. The portion 211b is made elastic to avoid wear of the internal circuit of the inkjet printer, the first terminal 31 due to hard contact with the chip 100, and the first contact pin 211. The second contact pin 212 to the seventh contact pin 217 have the same arrangement and structure as the first contact pin 211, and detailed illustration and description thereof are not provided here. The eighth contact pin 218 and the ninth contact pin 219 are electrically connected to the conductive sheet 30 via the first vertical portions 219d and 219d, respectively, and the rest have the same arrangement and structure as the first contact pin 211. And here we do not provide detailed illustrations and explanations thereof.

Preferably, in the present embodiment , the substrate is provided with two conductive sheets 20, and the two conductive sheets 20 are a first conductive sheet 20a and a second conductive sheet 20b, and the first conductive sheet 20a and the second conductive sheet 20b. The second conductive sheet 20b is provided on the front surface 10a of the substrate, and the center line L1 passes through the center point of the chip 100 in the Y-axis direction and is parallel to the Z-axis direction, and is parallel to the first conductive sheet 20a. The conductive sheet 20b of 2 is symmetrically distributed on the substrate 10 with the center line L1 as the center of symmetry, and the center line L1 passes through the sixth substrate terminal 206. Further, the chip 100 is symmetrical with the center line L1 as the center of symmetry. The conductive sheet 20 is positioned with the chip substrate 10 via the positioning portion 11. The positioning form may be a fixed form such as pasting, welding, or locking.

The first conductive sheet 20a provided in this embodiment is positioned and mounted with the electric core connecting portion 22 in contact with the eighth contact pin 218, the positioning mounting portion 23 fixed to the substrate 10, and the electric core connecting portion 22. A main body 21 for connecting the unit 23 is provided. The positioning mounting portion 23 is fitted with the positioning hole 11 and is used for positioning the first conductive sheet 20a. The first conductive sheet 20a has a conductive sheet contact region 22a that contacts the first vertical portion 218d of the eighth contact pin 218, and the conductive sheet contact region 22a is an electric core connection of the first conductive sheet 20a. It is located at the + X-axis end of the portion 22, and further, the conductive sheet contact region 22a is located at the + X-axis end of the first conductive sheet 20a. The electric core connecting portion 22 is perpendicular to the main body 21, the positioning mounting portion 23 is perpendicular to the main body 21, and the main body 21 is provided parallel to the front surface 10a where the board terminals 201 to 207 are located. The first conductive sheet 20a includes a first surface 20e, a second surface 20g, a third surface 20c, a fourth surface 20d, and a fifth surface 20f. The first surface 20e and the second surface 20g are parallel and provided opposite to each other, and both are parallel to the front surface 10a. The third surface 20c and the fourth surface 20d are parallel to each other and are provided opposite to each other. The third surface 20c and the fourth surface 20d are located on the −Y axis side and the + Y axis side of the first conductive sheet 20a, respectively. The first surface 20e and the second surface 20g are also two surfaces of the main body 21. The third surface 20c and the fifth surface 20f are two surfaces of the electric core connection portion 22, both of which are parallel to each other and are provided opposite to each other. The third surface 20c and the fifth surface 20f are located on the −Y axis side and the + Y axis side of the electric core connection portion 22, respectively.

Further, this implementation is to increase the connection strength between the conductive sheet and the substrate, and as shown in FIG. 22, a left terminal 38a and a right terminal 38b are provided at an end near the upper surface 10f of the substrate 10, and the left terminal 38a, Both the right terminals 38b are located on the front surface 10a of the substrate, and in this embodiment, the upper side and the left side of the left terminal 38a extend to the edge of the substrate to increase the surface area of the left terminal 38b, and further, the welding area with the left conductive sheet and the welding area. The welding point can be increased, the connection strength between the left conductive sheet and the substrate can be strengthened, and the substrate can be prevented from falling off. Similarly, the upper and right sides of the right terminal 38b can be extended to the edge of the substrate to increase the surface area of the right terminal, further increase the welding area and welding point with the left conductive sheet, and connect the left conductive sheet and the substrate. The strength can be strengthened and it can be prevented from falling off from the substrate. As can be understood, there is a gap between the right side of the left terminal 38a and the left side of the right terminal 38b, and in order to further reduce the gap between the two, the surface areas of the left terminal 38a and the right terminal 38b are further increased, and FIG. 23 shows. As shown, the left side of the left terminal 38a can be extended to wrap the left positioning hole to keep a gap with the right terminal, and the right side of the right terminal 38b can be extended to wrap the right positioning hole to wrap the left terminal. A gap can be maintained with 38a.

The chip 100 is arranged on the chip mounting surface 340c. The two facing first limit grooves 11 and the two facing second limit grooves 13 on the chip 100 are for fixing the chip 100 to the ink container 300. The two first protruding columns 341 in the adapter 340 are each fitted with the two second limit grooves 13, and the two second protruding columns 342 are each fitted with the first limit groove 11 to form a tip 100. Can be fixed to the ink container 300. The first protruding column 341 matches the shape of the second limit groove 13, and when the tip 100 is attached to the adapter 340, the first protruding column 341 abuts on the third limit groove 11, and the tip 100 abuts. Do not move to the adapter 340. The second protruding column 342 matches the fitting form of the first limit groove 11, and a detailed description thereof is not provided here.

The ink container 300 includes a box body 310, an ink discharge port 311 provided in the box body 310, and a locking portion 312, and the locking portion 312 is used for connecting the box body 310 to the holding portion 200 of the inkjet printer. A mounting surface for mounting the chip 100 is provided on the side of the box 310 away from the ink ejection port 311, and a plurality of limit blocks are provided on both sides of the mounting surface. The substrate 10 of the chip 100 is provided with a plurality of limit blocks. A plurality of limit grooves may be provided, and the limit grooves may be provided on both the left and right sides of the substrate 10, and the position of the limit block on the box body and the position of the limit groove on the substrate 10 are not limited, and the chip 100 is provided. It suffices to connect to the box body so that it can be attached and detached. The holding portion 200 includes a bottom wall 200a. The ink is stored in the box 310, the ink reaches the ink supply unit 202 through the ink ejection port 311, and the ink supply unit 202 can supply the ink to the print head, whereby the ink is printed. It can be used to perform an operation. The first side wall 200c in the holding portion 200 is not perpendicular to the bottom wall 200a but is inclined with respect to the bottom wall 200a. The chip 100 is attached to the chip holder 320, and the combination of the chip holder 320 and the chip 100 is attached to an inclined portion on the ink container 300 via the first locking hole 313. The chip 100 may be electrically connected to a contact pin on the contact pin holder 201 and used for mutual transmission between electrical signals. The locking portion 312 is used to fix the ink container 300 to the holding portion 200, and the locking portion 312 is fitted with the fixing portion 204 to prevent the ink container 300 from being detached from the holding portion 200.

Further, as shown in FIGS. 33 and 34, an inclined surface 329 is provided at an end of the first connecting portion 325 separated from the first fixing portion 321, and the inclination angle of the inclined surface 329 is the rotation of the tip holder 320. It is inclined in the direction, and the end portion of the first connecting portion 325 has a certain gap from the chamber wall of the mounting chamber, so that the tip holder 320 tends to be rotatable in the mounting chamber. When the ink container 300 having the chip holder 320 is attached to the holding portion 200 of the printer, first positioning bosses 326 are provided on both sides of the chip holder 320, and the box body of the ink container 300 has a first locking hole. A 313 is provided and a first positioning boss 326 is provided in the first locking hole 313 so that the first positioning boss 326 can rotate in the first locking hole 313. When the chip holder 320 is inserted into the ink container 300 of the inkjet printer, the first positioning boss 326 is locked in the first locking hole 313 to rotate the box body, and the chip holder 320 has the holding portion 200. On the other hand, the tip 100 can rotate and adjust the mounting position with respect to the contact pin holder 210, and the conductive sheet 20 is brought into contact with the contact pin 211. In the present embodiment, the inclined surface 329 provided on the first connection portion 325 has a tip holder 320 having a constant rotatable angle in the mounting chamber, and the rotation angle is 10 ° to 15 °, preferably 12 Can be .4 °. When the ink container comes into contact with the holding portion 200, there is a gap between the chip 100 and the side wall member of the holding portion 200 of the inkjet printer, and when the ink container is attached to the holding portion 200, the holding portion 200 is attached to the conductive sheet 20. Prevents touching and prevents the conductive sheet 20 from being scratched or falling off the substrate 10.

Further, referring to FIG. 12, in this embodiment, the chip 100 is detachably connected to the chip holder 320, specifically, the chip 100 includes a substrate 10, and a conductive sheet 20 is attached to one end of the substrate 10. A first is provided on the substrate 10 along the direction from the end on which the conductive sheet 20 of the substrate 10 is provided to the opposite end thereof (along the X-axis direction of the substrate 10 as shown in FIG. 3). A set of the limit groove 12, a set of the second limit groove 13, and a set of the third limit groove 14 are sequentially provided, and the first limit groove 12, the second limit groove 13, and the third limit groove 14 are sequentially provided. Reference numeral 14 functions as an avoidance recess, and the limit groove of each set includes two limit grooves provided symmetrically on both sides of the chip 100. The first limit groove 12 is provided close to the conductive sheet 20, and the third limit groove 14 extends from the edge of the end of the substrate 10 away from the conductive sheet 20 to the vicinity of the middle portion. The length direction of the limit groove 14 is parallel to the X-axis direction, the second limit groove 13 is provided between the first limit groove 12 and the second limit groove 13, and the second limit groove 13 is It may be provided as an arc groove, and the first limit groove 12 and the third limit groove 14 may be notches in a rectangular shape. The first fixing portion 321 on the chip holder 320 has a first limit block 322 that fits into the first limit groove 12, a second limit block 323 that fits into the second limit groove 13, and a third. A third limit block 324 that fits with the limit groove 14 of the above is provided. When the chip 100 is attached to the chip holder 320, the first limit block 322 is brought into contact with the first limit groove 12, and the second limit block 323 is brought into contact with the second limit groove 13. The limit block 324 of 3 can be brought into contact with the third limit groove 14, and the chip 100 can be detachably connected to the chip holder 320.

Claims (16)

A chip of an ink container that is electrically connected to a contact pin of a holding portion in an inkjet printer, said chip comprising a substrate and at least one conductive sheet attached to the substrate.
The substrate has at least one substrate terminal in contact with the contact pin of the inkjet printer, and a positioning unit for positioning the at least one conductive sheet.
The conductive sheet includes a main body and an electric core connection portion provided at one end of the main body, and the electric core connection portion abuts on the contact pin.
The main body is provided with at least one positioning mounting portion, and the positioning mounting portion is fitted with the positioning portion.
A chip of an ink container, wherein the main body is parallel to the surface of the substrate and is attached to the positioning portion via the positioning attachment portion. In the X-axis direction, the substrate terminal is located on the + X-axis side of the chip substrate, and the electric core connection portion projects from the surface where the substrate terminal is located in the + X-axis direction.
The electric core connection portion has a conductive sheet contact region for contacting the contact pin, and the conductive sheet contact region is located at the + X-axis end of the electric core connection portion.
The direction in which the ink container is attached to the holding portion is the Z-axis direction, the position on the tip side to which the ink container is attached is in the −Z-axis direction, perpendicular to the Z-axis direction, and the surface where the substrate terminal is located. The parallel direction is the Y-axis direction, the direction perpendicular to the Z-axis direction and the Y-axis direction is the X-axis direction, and the direction pointing to the chip inside the ink container is the + X-axis direction and the + X-axis direction. The chip of the ink container according to claim 1, wherein when the + Z axis is on the YZ plane, the + Y axis direction is on the left side. The chip of an ink container according to claim 2, wherein the positioning mounting portion is located on the + X-axis side or the-X-axis side of the main body. The positioning unit includes a plurality of positioning holes provided on the substrate.
The plurality of positioning holes are distributed in a row and are divided into a first positioning hole group and a second positioning hole group parallel to each other.
Claims 1 to claim that the positioning holes in the first positioning hole group are installed facing the positioning holes of the second positioning hole group, or are installed in a staggered manner. Item 3. The chip of the ink container according to any one of Items 3. When the number of the conductive sheets is a plurality and the number of the conductive sheets is an even number, the conductive sheets are symmetrically distributed on the chip substrate along the center line L1, and the center line L1 is the said of the chip. The chip of an ink container according to any one of claims 1 to 3, wherein the chip passes through a center point in the Y-axis direction and is parallel to the Z-axis direction. The chip of an ink container according to claim 2, wherein the electric core connecting portion and the positioning mounting portion are located on the same side of the main body in the X-axis direction. The plurality of board terminals are provided with board terminal contact portions that come into contact with the corresponding contact pins.
The chip of an ink container according to claim 2, wherein the electric core connection portion of the conductive sheet is located in the + Z axis direction of the substrate terminal contact portion. The chip of an ink container according to claim 7, wherein the conductive sheet is located in the + Z axis direction of the substrate terminal. The claims are characterized in that the substrate terminal contact portions are arranged in a plurality of rows in the Z-axis direction, and the electric core connection portions of the conductive sheet are located between the substrate terminal contact portions in the plurality of rows. Item 7. The chip of the ink container according to Item 7. The board terminals are arranged in a plurality of rows in the Z-axis direction, the electric core connection portions are located between the board terminals in the plurality of rows, and the electric core connection portions and the mounting positioning portions are arranged in the Z-axis direction. The chip of an ink container according to any one of claims 1 to 3, wherein each is located on both sides of the main body. The chip of an ink container according to any one of claims 1 to 3, wherein the electric core connection portion has a size in the Y-axis direction larger than a size in the Z-axis direction. .. An additional terminal is provided between the substrate terminal and the electric core connection portion of the conductive sheet.
The additional terminal according to any one of claims 1 to 3, wherein the additional terminal is electrically connected to at least one wafer terminal connected to a wafer for storing chip data. Ink container chip. An ink container comprising the chip of the ink container according to any one of claims 1 to 12.
The chip is provided with a plurality of limit grooves, and the ink container is provided with a plurality of limit blocks that are fitted with the limit grooves.
An ink container characterized in that the chip is detachably attached to the ink container by the limit groove and the limit block. The ink container includes a box for storing jet ink and a chip holder attached to the box.
13. The ink container according to claim 13, wherein the plurality of limit blocks are located on a surface of the chip holder close to the contact pin. The box body is provided with a mounting chamber for storing the chip holder.
The chip holder includes a first connecting portion for connecting to the box body and a first fixing portion for fixing the chip, and first limit bosses are provided on both sides of the first connecting portion. Is provided, and a first locking hole for mating with the first positioning boss is provided on the side wall of the mounting chamber, respectively.
A second limit boss is provided at an end of the first connection portion away from the first fixing portion, an elastic element is installed in the second limit boss, and the elastic element is provided. The ink container according to claim 14, wherein the ink container abuts on the inner wall of the mounting chamber. An inclined surface is provided at an end of the first connecting portion away from the first fixed portion, the second limit boss is located on the inclined surface, and the tip and the tip holder are housed in the mounting chamber. 15. The ink container is rotatable, and when the ink container comes into contact with the holding portion of the inkjet printer, there is a gap between the chip and the side wall member of the holding portion of the inkjet printer. Ink container described in.

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