CN218917926U - Chip, consumable box and image forming device - Google Patents

Abstract

The chip for the consumable box comprises a first installation area, a second installation area and a connection area, wherein the first installation area and the second installation area are connected through the connection area, and an opening is formed between the first installation area and the second installation area; the consumable box comprises a first circuit board, the first circuit board comprises a first part and a second part, the first circuit board can be arranged in an overlapping mode with the chip through the opening, the first mounting area at least partially covers the front surface of the first part of the first circuit board, and the second part of the first circuit board at least partially covers the front surface of the second mounting area. According to the utility model, through the mounting mode that the chip and the first circuit board are overlapped through the opening, the chip and the first circuit board can be tightly attached, the flatness and the stability of the mounting surface are improved, and the corresponding electric contact between the chip and the first circuit board can form good electric contact.

Description

Chip, consumable box and image forming device

Technical Field

The present utility model relates to an image forming apparatus, and more particularly, to a consumable cartridge and a chip.

Background

Printers and copiers are widely used imaging devices, the printers or copiers generally use carbon powder or ink as imaging consumables, the imaging consumables are accommodated in corresponding imaging boxes (powder boxes or ink boxes), the ink boxes are taken as examples, chips with information storage and other functions are arranged on the ink boxes, and when the ink boxes are installed in the printers, the chips can exchange information with a printer main body, so that the printers can monitor the use condition of the consumables conveniently.

The chip is provided with various electronic components, because partial electronic components have larger thickness, the matching relationship between the chip and the ink box is not clear, and when the chip and the ink box are installed, the problems that the flatness of the installation surface of the chip is poor, the surface of the chip is warped, the electronic components are easy to collide with and the like exist, and in addition, the chip is poor in size design, and the problem of difficult positioning during the installation of the chip can be caused.

Disclosure of Invention

According to one aspect of the present utility model, there is provided a chip for a consumable cartridge, including a first mounting region, a second mounting region, and a connection region, the first mounting region and the second mounting region being connected by the connection region, an opening being further formed between the first mounting region and the second mounting region; the consumable box comprises a first circuit board, the first circuit board comprises a first part and a second part, the first circuit board can be arranged in an overlapping mode with the chip through the opening, the first mounting area at least partially covers the front surface of the first part of the first circuit board, and the second part of the first circuit board at least partially covers the front surface of the second mounting area.

According to the utility model, through the mounting mode that the chip and the first circuit board are overlapped through the opening, the chip and the first circuit board can be tightly attached, the flatness and the stability of the mounting surface are improved, and the corresponding electric contact between the chip and the first circuit board can form good electric contact.

In some embodiments, a second electrical contact is provided on the first mounting region; the second mounting area is provided with a memory, and the memory is electrically connected with the second electric contact through a wire on the connecting area; and the first installation area is provided with a hollowed-out part.

In some embodiments, the connection region is disposed on one side of the first and second mounting regions, and one end of the opening near the connection region is a closed end, and the other end is an open end.

In some embodiments, the second mounting region has a free end that is not connected to the first mounting region, and the free end has an outwardly narrowing guide formed thereon.

The utility model also provides a consumable box, which comprises a chip and a first circuit board, wherein the chip comprises a first installation area, a second installation area and a connection area, the first installation area and the second installation area are connected through the connection area, and an opening is formed between the first installation area and the second installation area; the first circuit board comprises a first part and a second part, the first circuit board passes through the opening and is overlapped with the chip, the first mounting area at least partially covers the front surface of the first part of the first circuit board, and the second part of the first circuit board at least partially covers the front surface of the second mounting area.

In some embodiments, the first mounting region is provided with a hollowed-out portion, the first circuit board is provided with a third electrical contact, and the hollowed-out portion at least partially exposes the third electrical contact.

In some embodiments, the first circuit board is provided with a first electrical contact, and the first mounting area of the chip is provided with a second electrical contact, and the first electrical contact and the second electrical contact are electrically connected.

In some embodiments, a first reference electrical contact is disposed on the first circuit board with the first electrical contact, a distance from the first reference electrical contact to an edge of the first circuit board near a connection region of the chip is a first distance L1, a second reference electrical contact is disposed on the chip with a second electrical contact corresponding to the first reference electrical contact, a distance from the second reference electrical contact to a closed end of the opening is a second distance L2, and the second distance L2 is greater than or equal to the first distance L1.

In some embodiments, the consumable cartridge is provided with a recess in which at least part of the electronic components of the second mounting region of the chip are disposed.

The present utility model also provides an image forming apparatus including the consumable cartridge according to any one of the above.

Drawings

Fig. 1 is a schematic structural view of an ink cartridge in a state where a chip is not mounted in the ink cartridge according to an embodiment of the present application;

fig. 2 is a schematic front view of an ink cartridge in a state where a chip is not mounted according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a chip structure according to an embodiment of the present application;

fig. 4 is a schematic front view of an assembled chip state of the ink cartridge according to the embodiment of the present application;

FIG. 5 is a schematic view of a structure of still another ink cartridge according to an embodiment of the present disclosure in a state where the ink cartridge is not mounted with a chip;

FIG. 6 is a schematic front view of still another ink cartridge according to an embodiment of the present disclosure in an unassembled state;

FIG. 7 is a schematic diagram of a chip structure according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a chip structure according to an embodiment of the present application;

FIG. 9 is a schematic diagram showing a front structure of an ink cartridge in a chip-mounted state according to another embodiment of the present application;

in the drawings, the drawings are not necessarily to scale.

Reference numerals in the specific embodiments are as follows:

10-box body, 11-groove and 40-printing head;

20-a first circuit board, 21-a first portion, 211-a first electrical contact, 213-a first positioning hole, 22-a second portion, L1-a first distance, L3-a third distance;

30-chip, 31-first mounting area, 311-second electrical contact, 312-hollowed-out portion, 313-second positioning hole, 32-second mounting area, 321-electronic element, 322-guiding portion, 33-electrical connection area, 34-wire, L2-second distance, L4-fourth distance.

Detailed Description

The utility model is described in further detail below with reference to the accompanying drawings.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and include, for example, either fixedly attached, detachably attached, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

The image forming apparatus of the present utility model includes a main assembly, and a consumable cartridge detachably mounted on the main assembly, which may be an ink cartridge or a powder cartridge.

The consumable box can be a recycling consumable box or a brand new consumable box, and comprises a box body 10, a first circuit board 20, a chip 30 and a printing head 40. The cartridge 10 is used for containing ink, and the printhead 40 is disposed on the bottom surface of the cartridge 10 for ejecting ink. The consumable cartridge is mountable in a main assembly of an image forming apparatus, and a face of the consumable cartridge facing a stylus of the main assembly of the image forming apparatus is a front face, and an XY two-dimensional rectangular coordinate system is established with reference to the front face of the cartridge body 10, with a horizontal direction being an X axis, and a direction perpendicular to the X axis being a Y axis.

At least a portion of at least one of the first circuit board 20 and the chip 30 is a flexible structure. In this embodiment, the first circuit board 20 is a flexible circuit board, or at least a portion thereof. The first circuit board 20 includes a first end disposed on a front surface of the case 10 and a second end disposed on a bottom surface of the case 10, wherein the second end of the first circuit board 20 is electrically connected with the print head 40, the first end of the first circuit board 20 is provided with electrical contacts for communicating with a main assembly of the image forming apparatus, the main assembly of the image forming apparatus inputs control signals through a plurality of electrical contacts, the control signals are applied to the print head 40 via wires on the first circuit board 20, and the print head 40 is controlled to perform inkjet printing as required.

The front surface of the case 10 is further provided with a groove 11, and a portion of the first circuit board 20 is covered on the groove 11. The groove 11 can be the original structure on the recycling consumable box or the structure which is re-opened later because of assembly requirement. The first circuit board 20 is provided with electrical contacts which are divided into a first electrical contact 211 and a third electrical contact according to the connection relationship with the chip 30.

The chip 30 includes a first mounting region 31, a second mounting region 32, and a connection region 33, the first mounting region 31 and the second mounting region 32 being connected by the connection region 33, and an opening being formed between the first mounting region 31 and the second mounting region 32. The first circuit board 20 is divided into a first portion 21 and a second portion 22 according to mounting requirements, the first circuit board 20 being capable of passing through an opening in the chip 30 and being disposed overlapping the chip such that the first mounting area 31 at least partially covers the front surface of the first portion 21 of the first circuit board and the second portion 22 of the first circuit board at least partially covers the front surface of the second mounting area 32. By the mounting mode, the chip 30 and the first circuit board 20 can be closely attached, flatness and stability of a mounting surface are improved, and good electrical contact is formed between the chip 30 and corresponding electrical contacts of the first circuit board 20.

It should be noted that at least a portion of at least one of the first circuit board 20 and the chip 30 is of a flexible structure such that the two may be disposed in an overlapping manner, that is, overlapping in a crossing manner, through an opening in the chip 30. In this embodiment, the first circuit board 20 is a flexible circuit board as a whole, the chip 30 is a hard circuit board as a whole or a flexible circuit board as a whole, and in other embodiments, it may be that the first circuit board 20 is a hard circuit board, the chip 30 is a flexible circuit board, or at least a part of at least one of the two is a flexible structure, that is, at least a part of the first circuit board 20 is a flexible structure, and/or at least a part of the chip 30 is a flexible structure, which is used for bending and overlapping at the opening.

In the present embodiment, the first mounting area 31 includes a contact area for communicating with the main assembly of the image forming apparatus, and the second mounting area 32 is for disposing the electronic component 321 mainly for data storage.

A plurality of second electrical contacts 311 and hollowed-out parts 312 are arranged on the first mounting area 31, the second electrical contacts 311 are used for being electrically connected with the first electrical contacts 211 on the first circuit board 20, in addition, the second electrical contacts 311 are also used for being electrically connected with the electronic components 321 of the second mounting area 32, conducting wires 34 are arranged on the first mounting area 31, the second mounting area 32 and the connecting area 33, and the second electrical contacts 311 are electrically connected with the electronic components 321 on the second mounting area 32 through the conducting wires 34.

The first electrical contact 211 and the second electrical contact 311 are disposed in correspondence with each other in an electrical connection manner, and the actual physical positions of the first electrical contact 211 and the second electrical contact 311 are not limited, for example, the physical positions of the first electrical contact 211 and the second electrical contact 311 may be staggered, and the electrical connection may be achieved by other intermediaries such as a wire or a connector, and the physical positions of the first electrical contact 211 and the second electrical contact 311 may be partially or completely overlapped to achieve the electrical connection. In operation, contact pins on the main assembly of the image forming apparatus first contact the second electrical contacts 311, and then transfer electrical signals to the first electrical contacts 211 through the second electrical contacts 311, completing a communication function with the first circuit board 20.

The hollowed-out portion 312 is a window structure penetrating through the chip 30, and the hollowed-out portion 311 is used for exposing the third electrical contact on the first circuit board 20. The size of the hollowed-out portion 311 may be greater than or equal to or less than the size of the third electrical contact, and the hollowed-out portion 311 may completely expose the third electrical contact, or may partially expose the third electrical contact, so that a contact pin on the main assembly of the image forming apparatus passes through the hollowed-out portion 311 to contact and communicate with the third electrical contact.

In some embodiments, referring to fig. 8, the first mounting area 31 of the chip 30 may not be provided with the hollowed-out portion 312, and accordingly, all the electrical contacts on the first circuit board 20 are the first electrical contacts 211 corresponding to the second electrical contacts 311, and there is no third electrical contact corresponding to the hollowed-out portion 312.

On the second mounting area 32, an electronic component 321 is provided, the electronic component 321 including a memory, a resistor, a capacitor, a battery, and the like, and in one embodiment of the present application, only one electronic component is shown, which is a memory electrically connected to the second electrical contact 311 through a wire 34 for storing data of ink capacity, chip authentication, and the like, so that the main assembly of the image forming apparatus controls the consumable cartridge to eject ink.

It should be noted that, the electronic component 321 may include a component with a larger occupied volume, such as a memory, a battery, or the like, or may include a resistor, a capacitor, or the like with a smaller volume, and it may be preferable to dispose the electronic component 321 with a larger volume on the second mounting area 32, and dispose the electronic component with a smaller volume on the second mounting area 32, or on the first mounting area 31, or on the connection area 33, and may be set according to the number of electronic components, the volume, the shape, the area, or the composition of the chip, or other comprehensive factors.

Likewise, not only electrical contacts may be provided on the first mounting region 31, but also electrical contacts may be provided on the second mounting region 32, for example, test contacts may be provided around the memory and battery element (not shown) for testing the circuit characteristics of the second mounting region 32.

It should be noted that, the first mounting area 31 and the second mounting area 32 may be disposed on the same circuit board, as shown in fig. 3, the first mounting area 31, the second mounting area 32 and the electrical connection area 33 are disposed on the same circuit board, the conductive wires 34 are disposed inside the circuit board, and the electrical contacts and the electronic components on the first mounting area 31 and the second mounting area 32 are conducted to realize the communication of electrical characteristics, and the first mounting area 31, the second mounting area 32 and the connection area 33 may also be separate circuit boards that are disposed independently of each other and connected by wires or wirelessly, or may be one or two combined structures of the first mounting area 31, the second mounting area 32 and the connection area 33, which all belong to the protection scope of the present application.

In an embodiment, the circuit board carrying the first mounting area 31 and/or the second mounting area 32 and/or the connection area 33 may be a flexible circuit board, a hard circuit board or a circuit board with a combination of hardness and softness, wherein the connection area 33 may be formed by carrying the circuit board or not carrying the circuit board but only conducting wires.

In some embodiments, the second mounting region 32 may not be provided with electrical contacts, electronic components, and wires, and the connection region 33 may not be provided with electrical contacts, electronic components, and wires, so that the second mounting region 32 and the connection region 33 do not perform the functions of providing and conducting electrical contacts, electronic components, and wires, and the second mounting region 32 is used only as a fitting portion for overlapping with the first circuit board 20.

In this embodiment, the connection region 33 is disposed on one side (the side close to the +x direction or the side close to the-X direction) of the first mounting region 31 and the second mounting region 32, one end of the second mounting region 32 is connected to the first mounting region 31 through the connection region 33, the other end is a free end, and the free end is not connected to the first mounting region 31, then the end of the chip opening close to the connection region 33 is a closed end, the other end is an open end, and during mounting, the first circuit board 20 is inserted into the opening from the open end of the opening, so as to realize assembly.

In other embodiments, more than one connection area 33 may be provided, for example, two connection areas 33 are respectively disposed on two sides of the first mounting area 31 and the second mounting area 32, two ends of the second mounting area 32 are respectively connected with the first mounting area 31 through the connection areas 33, an opening on a chip is formed between the two connection areas 33, two ends of the opening are closed ends, and during mounting, the top end of the first circuit board 20 is inserted into the opening and stretched to realize assembly.

In this embodiment, the first portion 21 and the second portion 22 of the first circuit board 20 are disposed on the same surface of the case 10, which may be a front surface or other surfaces, and in other embodiments, may be disposed on different surfaces of the case 10.

In an embodiment, the chip 30 and the first circuit board 20 are disposed perpendicular to each other, so as to increase the mounting stability of the chip 30, as shown in fig. 3, in some embodiments of the present application, the opening on the chip 30 is implemented as a slit D1 with a single opening, where the first mounting area 31 and the second mounting area 32 are horizontally disposed along the X axis, the slit D1 is used to implement overlapping between the chip 30 and the first circuit board 20, the slit D1 is greater than or equal to 0, the first mounting area 31 and the second mounting area 32 are connected through the connection area 33, and a portion of the first circuit board 20 is inserted into the slit D1 to implement overlapping.

In order to make the mounting effect of the chip 30 with the first circuit board 20 better, the parameter of the gap D1 is preferably set to 0.1mm to 3mm, which is convenient for mounting and the mounting effect will be better.

As shown in fig. 4, in some embodiments of the present application, at least a portion of the second mounting region 32 may be disposed in the recess 11, the electronic component 321 having a larger volume on the second mounting region 32 may be disposed in the recess 11, the recess 11 may protect the electronic component 321 while avoiding the electronic component 321 from being bumped when operating or mounting the consumable cartridge to the main assembly of the image forming apparatus, in addition, an assembly problem between the consumable cartridge and the main assembly due to the larger volume of the electronic component 321 may be reduced, and when the area of the second mounting region 32 is smaller, the second mounting region 32 may also be entirely disposed in the recess 11 for adaptive mounting.

In one embodiment, the first circuit board 20 is fixed on the case 10, the first mounting area 31 of the chip 30 is fixed on the front surface of the first portion 21, the first mounting area 31 and the first portion 21 may be fixed by gluing, welding, and a combination of gluing and welding, when the first circuit board 20 and the first mounting area 31 are fixed by gluing, a layer of adhesive structure is disposed between the first circuit board 20 and the first mounting area 31, and the adhesive structure is discretely disposed in an area other than the first electrical contact 211 so as to ensure the electrical connection characteristic between the second electrical contact 311 on the chip 30 and the first electrical contact 211 on the first circuit board 20; when the chip 30 is fixed by soldering, the solder joint is arranged between the first electric contact 211 and the second electric contact 311, so that not only can the fixing effect of the chip 30 and the first circuit board 20 be realized, but also the electric connectivity of the first electric contact 211 and the second electric contact 311 can be enhanced, in addition, the fixing effect of the chip 30 and the first circuit board 20 can be further enhanced by means of gluing and soldering combination, and the electric connection characteristic of the first electric contact 211 and the second electric contact 311 can be improved.

It should be noted that the adhesive structures disposed discretely may be disposed on the rear surface of the first mounting region 31 of the chip 30, on the front surface of the first portion 21 of the first circuit board 20, or may be separate layer structures.

Based on the above embodiment, this application still provides a consumptive material box, and this consumptive material box includes the chip as described above, adopts the chip mounting surface of the consumptive material box of above-mentioned chip more level and smooth, and chip mounting stability is stronger, avoids electronic component 321 to be bumped or physical interference with box body 10 or first circuit board 20 production when installing, improves working property.

As shown in fig. 2 to 4, in some embodiments of the present application, a plurality of electrical contacts are disposed on the first circuit board 20, and as shown in fig. 2, one of the first electrical contacts 211 is used as a first reference electrical contact, and the length of the edge of the first reference electrical contact away from the side of the first circuit board 20 near the connection area of the chip (i.e., the side near the +x direction) is a first distance L1 (along the positive X direction). As shown in fig. 3, a second reference electrical contact is disposed on the first mounting area 31 of the chip 30 and corresponds to the second electrical contact 311, where the second reference electrical contact is disposed corresponding to the first reference electrical contact to implement electrical connection, and when the chip 30 is provided with the slit D1 with a single opening, the distance between the second reference electrical contact and the closed end of the slit D1 (i.e., the edge position of the slit D1 near the connection area 33) is a second distance L2 (along the positive X-axis direction), where L2 is greater than or equal to L1, and after a part of the first circuit board 20 is inserted into the slit D1, the second mounting area 32 of the chip 30 can be mounted on the box body 10 in an overlapping manner with the first circuit board 20.

In an embodiment, the first reference electrical contact 211 and the second reference electrical contact 311 are disposed correspondingly, where the corresponding disposition refers to an electrical connection relationship between the first reference electrical contact 211 and the second reference electrical contact 311, and there is no limitation on the actual physical positions of the first electrical contact 211 and the second electrical contact 311, for example, the physical positions of the first electrical contact 211 and the second electrical contact 311 may be staggered, and the electrical connection may be implemented by wires or other transfer members such as connectors, where the physical positions of the first electrical contact 211 and the second electrical contact 311 may also be partially overlapped or completely overlapped.

The advantage of L2 being equal to or greater than L1 is explained herein. When the physical positions of the first reference electrical contact 2 and the second reference electrical contact are completely overlapped, that is, the first reference electrical contact and the second reference electrical contact are located at the same position with respect to the case 10, if L2 is smaller than L1, after the first mounting area 31 is fixed to the first portion 21 of the first circuit board 20 (at this time, the first reference electrical contact and the second reference electrical contact overlap one another up and down), the closed end of the slot D1 on the chip 30 may collide with and press the edge of the first circuit board 20 on the X-axis forward side, resulting in that the second mounting area 32 of the chip 30 cannot pass through the second portion 22 into the recess 11, or the second portion 22 and/or the second mounting area 32 may warp due to forced assembly, resulting in uneven mounting surface, being easily knocked, and affecting the use performance.

The number of the first electrical contacts 211 provided on the first circuit board 20 and the number of the corresponding second electrical contacts 311 provided on the first mounting region 31 may be one or more, when there are a plurality of the first electrical contacts 211, the length between any one of the first electrical contacts and the edge of the first circuit board 20 may be defined as a first distance L1, and similarly, the length between any one of the second electrical contacts provided corresponding to the first electrical contacts and the closed end of the slit D1 may be defined as a second distance L2 on the chip 30.

In some embodiments of the present application, stability and flatness of the mounting of the chip 30 may be ensured by setting the edge distance of the positioning hole to the first circuit board 20 and the dimensional parameter to the closed end of the slit D1 of the chip 30.

Referring to fig. 6 and 7, in an embodiment, a first positioning hole 213 is provided on the first circuit board 20, a second positioning hole 313 is provided on the first mounting region 31 of the chip 30, and the first positioning hole 213 and the second positioning hole 313 are disposed to overlap one another during the fixing of the chip 30 and the first circuit board 20, wherein the length of the first positioning hole 213 from the edge of the first circuit board 20 is a third distance L3 (along the positive X-axis direction), the length of the second positioning hole 313 from the closed end of the slot D1 (i.e., the edge position of the slot D1 near the connection region 33) is a fourth distance L4 (along the positive X-axis direction), and L4 is greater than or equal to L3, so that the second mounting region 32 of the chip 30 can be mounted on the case 10 overlapping the first circuit board 20, and the mounting stability of the chip 30 can be improved.

It should be noted that, the stability and flatness of the mounting of the chip 30 may also be ensured by setting the dimension parameters of the distance from the hollowed-out portion 312 to the closed end of the slot D1 of the chip 30 and the distance from the third electrical contact, which is disposed corresponding to the hollowed-out portion 312, to the edge of the first circuit board 20, and the detailed description is omitted herein in the same manner as in the above embodiment.

Referring to fig. 3, 7 and 8, in one embodiment, the second mounting region has a free end that is not connected to the first mounting region, and the free end of the second mounting region has an outwardly narrowing guide 322 formed thereon. The guide portion 322 has a tip-like structure, and the second mounting region 32 can be more smoothly mounted to the rear surface of the second portion 22 by the guiding action of the guide portion 322 when the chip 30 is mounted.

In an embodiment, a carrier having a certain rigidity may be further disposed on the guide portion 322 to enhance the strength and guiding effect of the guide portion 322.

The length of the second mounting region 32 of the chip 30 may be adjusted according to the mounting environment, as shown in fig. 4, the free end of the second mounting region 32 may be provided longer, extending through the second portion 22, or may be provided shorter, as shown in fig. 9, to be entirely covered by the second portion 22.

In an embodiment, the electronic component 321 is disposed at a position near the middle of the second mounting area 32 in the Y direction, so that physical interference generated between the electronic component 321 and the box 10 or the first circuit board 20 during mounting can be reduced, and meanwhile, the electronic component 321 can be protected.

Based on the above embodiment, the present application further provides an image forming apparatus, which includes the chip and/or the consumable cartridge as described above, and the image forming apparatus employing the chip and/or the consumable cartridge has a smoother chip mounting surface, and a stronger chip mounting stability, and avoids physical interference with the cartridge 10 or the first circuit board 20 when the electronic component 321 is bumped or mounted, thereby improving printing performance.

What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that several modifications and improvements can be made to the above-described embodiments, or the above-described embodiments can be freely combined, including the technical features of the different embodiments described above, without departing from the inventive concept of the present utility model.

Claims (10)

1. The chip for the consumable box is characterized by comprising a first installation area, a second installation area and a connecting area, wherein the first installation area and the second installation area are connected through the connecting area, and an opening is formed between the first installation area and the second installation area; the consumable box comprises a first circuit board, the first circuit board comprises a first part and a second part, the first circuit board passes through the opening and is overlapped with the chip, the first mounting area at least partially covers the front surface of the first part of the first circuit board, and the second part of the first circuit board at least partially covers the front surface of the second mounting area.

2. The chip of the consumable cartridge of claim 1, wherein the first mounting area is provided with a second electrical contact; the second mounting area is provided with a memory, and the memory is electrically connected with the second electric contact through a wire on the connecting area; and the first installation area is provided with a hollowed-out part.

3. The chip of a consumable cartridge according to claim 1 or 2, wherein the connection region is provided at one side of the first and second mounting regions, one end of the opening near the connection region is a closed end, and the other end is an open end.

4. A chip of a consumable cartridge according to claim 3, wherein the second mounting region has a free end which is not connected to the first mounting region, and the free end has an outwardly narrowing guide formed thereon.

5. The consumable box comprises a chip and a first circuit board, and is characterized in that the chip comprises a first installation area, a second installation area and a connection area, wherein the first installation area and the second installation area are connected through the connection area, and an opening is formed between the first installation area and the second installation area; the first circuit board comprises a first part and a second part, the first circuit board passes through the opening and is overlapped with the chip, the first mounting area at least partially covers the front surface of the first part of the first circuit board, and the second part of the first circuit board at least partially covers the front surface of the second mounting area.

6. The consumable cartridge of claim 5, wherein the first mounting region is provided with a hollowed-out portion, the first circuit board is provided with a third electrical contact, and the hollowed-out portion at least partially exposes the third electrical contact.

7. The consumable cartridge of claim 5, wherein the first circuit board has a first electrical contact and the first mounting area of the chip has a second electrical contact, the first and second electrical contacts being electrically connected.

8. The consumable cartridge according to claim 7, wherein a first reference electrical contact is provided on the first circuit board with the first electrical contact, a distance from the first reference electrical contact to an edge of the first circuit board on a side close to the connection region of the chip is a first distance L1, a second reference electrical contact is provided on the chip with a second electrical contact corresponding to the first reference electrical contact, a distance from the second reference electrical contact to the closed end of the opening is a second distance L2, and the second distance L2 is greater than or equal to the first distance L1.

9. The consumable cartridge of any one of claims 5 to 8, wherein the consumable cartridge is provided with a recess in which at least part of the electronic components of the second mounting area of the chip are disposed.

10. An image forming apparatus, characterized by comprising the consumable cartridge according to any one of claims 5 to 9.

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