JP2022517570A - Radiation enhancer for radio equipment, radiation system and radio equipment - Google Patents

Abstract

The present invention discloses a radiation enhancer, a radiation system and a radio device of a radio device. The radiation enhancer is installed on the dielectric substrate, the first conductive element installed on the first surface of the dielectric substrate, and the second surface facing the first surface of the dielectric substrate. The first conductive element and the second conductive element are not in contact with each other between the first side surface and the second side surface of the dielectric substrate. There is a thickness that can be connected by electromagnetic coupling. The radiation enhancer is simple in configuration, easy to process and manufacture, satisfies radiation efficiency, and effectively reduces costs. [Selection diagram] Fig. 2

Description

(Mutual reference of related applications)
The invention of the present application is submitted to the National Intellectual Property Office of China on January 04, 2019, the application number is 201920013046.5, and the invention name is "radiation enhancer, radiation system and radio device of radio device". Claim priority based on Chinese patent application. Here, all the contents thereof are incorporated into the present invention by reference.
The present invention relates to the field of wireless communication technology, and particularly to radiation enhancers, radiation systems and wireless devices of wireless devices.

The radiation enhancer of the radio device plays a very important role in the operating performance of the radio device. As shown in FIG. 1, in the prior art, the conventional radiation enhancer 10'has a dielectric substrate 11', an upper layer conductive element 12', a lower layer conductive element 13', and a metallized through hole 14'. The metallized through hole 14'electrically connects the upper layer conductive element 12'and the lower layer conductive element 13'and penetrates the dielectric substrate 11'.

According to the radiation enhancer 10'with such a configuration, a metallized through hole 14'is provided on the dielectric substrate 11', and the upper conductive element 12'and the lower conductive element 13' are electrically connected to each other. It needs to be secured, the processing process is difficult, the production is complicated, and the cost is high.

As a result, it is a technical problem to be solved immediately for those skilled in the art to provide a radiation enhancer having a simple structure, a compact size, easy processing and manufacturing, and sufficient radiation efficiency.

The present invention provides a radiation enhancer for a wireless device. The radiation enhancer is simple in configuration, easy to process and manufacture, satisfies radiation efficiency, and effectively reduces costs. The present invention further provides a radiation system and a radio device to which the radiation enhancer is applied.

An embodiment of the present invention is a radiation enhancer for a wireless device.
Dielectric substrate and
A first conductive element installed on the first surface of the dielectric substrate, and
A second conductive element installed on a second surface facing the first surface of the dielectric substrate is provided.
A thickness configured such that the first conductive element and the second conductive element can be connected in a non-contact, electromagnetically coupled manner between the first side surface and the second side surface. Provides a radiation enhancer.

Two internal connection terminals may be installed in the first conductive element or the second conductive element.

The two internal connection terminals may be installed symmetrically with respect to the center line of the first conductive element or the second conductive element.

The first conductive element and the second conductive element cover the corresponding side surfaces of the dielectric substrate, and the two internal connection terminals are the first conductive element or the second conductive element. It may be installed at the end of the conductive element.

One of the internal connection terminals may be used to electrically connect the RF module of the wireless device, and the other internal connection terminal may be used to fix and connect to the motherboard of the wireless device. ..

The distance between the first side surface and the second side surface of the dielectric substrate is 20 minutes of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the radiation enhancer of the radio device. It may be 1 or less.

The dielectric substrate is installed in a cubic shape, and the length of the maximum side of the dielectric substrate is 1/20 of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the radiation enhancer of the radio device. It may be as follows.

The lowest resonance frequency may be in the operating frequency band of 698 MHz to 960 MHz.

The present invention is a radiation system of a radio apparatus, comprising a radiation structure, an RF module, and an external terminal, wherein the radiation structure includes the radiation enhancer, the radiation enhancer, and the external terminal. Further provide a radiation system, each of which electrically connects the RF modules.

The radiation structure may further include a ground plane layer that electrically connects the radiation enhancer and the RF module.

The present invention comprises a radiation system, a matching system, and a transmission line, the radiation structure in the radiation system includes the radiation enhancer described above, and the transmission line includes the matching system and the RF module of the radiation system. Further provides a wireless device that electrically connects to.

From the above, based on the above embodiment, the present invention is a radiation enhancer for a wireless device, which includes a dielectric substrate, a first conductive element, and a second conductive element. I will provide a. The dielectric substrate has a first side surface and a second side surface facing each other, the first conductive element is installed on the first side surface, and the second conductive element is a second surface. It was installed on the second side. Between the surface on the first side and the surface on the second side, there is a thickness configured so that the first conductive element and the second conductive element can be connected in an electromagnetically coupled manner, and the first conductive element is provided. The sex element and the second conductive element are non-contact, that is, the first conductive element and the second conductive element are not electrically connected. By installing in this way, the complicated process of making metallized through holes in the dielectric substrate in the prior art was avoided, and the processing efficiency was improved. Then, as compared with the method of electrically connecting in the prior art, in the radiation enhancer provided in the embodiment of the present invention, the first conductive element and the second conductive element are electromagnetically coupled to each other, and an electromagnetic field is generated. The current path between the first conductive element and the second conductive element can be sufficiently extended while the size of the formed dielectric substrate is reduced, and the radiation efficiency of the wireless device can be ensured.

In order to more clearly explain the examples of the present invention and the technical proposal of the prior art, the drawings necessary for the examples and the prior art will be briefly described below, but of course, the drawings described below are simply the present invention. It is a part of the embodiment of the above, and a person skilled in the art can obtain other drawings based on these drawings without any creative work.

FIG. 1 is a schematic configuration diagram of a radiation enhancer in the prior art. FIG. 2 is a schematic configuration diagram of a radiation enhancer according to an embodiment of the present invention. FIG. 3 is a schematic configuration diagram of a wireless device according to an embodiment of the present invention. FIG. 4 is a passive performance-S parameter diagram of the antenna of the wireless device according to the embodiment of the present invention.

Hereinafter, in order to further clarify the purpose, the technical proposal, and the advantages of the embodiments of the present invention, examples of the present invention will be described in more detail with reference to the drawings. Of course, the examples described are only partial examples of the present invention, not all examples. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without the need for creative labor fall within the scope of the invention of the present application.

In order to explain in detail the configuration and principle of the radiation enhancer of the wireless device provided in the present invention, the radiation enhancer will be described in detail below with reference to the drawings.

As shown in FIGS. 2 and 3, FIG. 2 is a schematic diagram of the configuration of the radiation enhancer in the embodiment of the present invention, and FIG. 3 is a schematic diagram of the configuration of the radio device in the embodiment of the present invention.

In addition, "1st, 2nd, 3rd, 4th, 5th and 6th" described in the text is for clearly stating the technical proposal by distinguishing the same parts, and the priority and importance of the parts. It does not limit the sex and order, that is, it does not limit the technical proposal of the present invention.

As shown in FIG. 2, an embodiment of the present invention is a radiation enhancer 10 of a wireless device, which comprises a dielectric substrate 11, a first conductive element 12, and a second conductive element 13. Provided is a radiation enhancer 10. The dielectric substrate 11 has a surface 111 on the first side and a surface 112 on the second side facing each other, and the first conductive element 12 is installed on the surface 111 on the first side and has a second conductivity. The element 13 was installed on the surface 112 on the second side. There is a thickness between the surface 111 on the first side and the surface 112 on the second side so that the first conductive element 12 and the second conductive element 13 can be connected by electromagnetic coupling. Moreover, the first conductive element 12 and the second conductive element 13 are not in contact with each other, that is, the first conductive element 12 and the second conductive element 13 are not electrically connected to each other. By installing in this way, the complicated process of opening a metallized through hole on the dielectric substrate 11 in the prior art is avoided, and the processing efficiency is improved.

In one embodiment, the radiation enhancer 10 has a third side surface 113 and a fourth side surface 114 facing each other, and a fifth side surface 115 and a sixth side surface 116 facing each other. May have more.

As shown in FIG. 2, in the embodiment of the present invention, the dielectric substrate 11 is a solid dielectric. Of course, the dielectric substrate 11 is not limited to a solid dielectric, and may be hollow, or a through hole may be formed in the dielectric substrate 11. In the embodiment of the present invention, the first conductive element 12 and the second conductive element 13 do not come into contact with each other, and the first conductive element 12 and the second conductive element 13 are connected to each other. The configuration shape of the dielectric substrate 11 is not limited as long as it can be connected by electromagnetic coupling.

Referring to FIG. 1, in order to make the wireless device function as an antenna, the radiation enhancer 10'in the prior art is electrically connected to the upper layer conductive element 12'and the lower layer conductive element 13'. It is necessary to make additional through holes, and further metallize the surface of the hole wall of the through holes, which makes the process difficult and costly. On the other hand, as compared with the case where the first conductive element 12 and the second conductive element 13 are electrically connected by the metallized through hole, referring to FIG. 2, the radiation enhancer according to the embodiment of the present invention is referred to. The dielectric substrate 11 of 10 has a thickness that makes the first conductive element 12 and the second conductive element 13 non-contact, and the first conductive element 12 and the second conductive element 13 are combined. Since they can be connected by electromagnetic coupling, by forming an electromagnetic field by electromagnetic coupling, the current path between the first conductive element 12 and the second conductive element 13 can be sufficiently extended, and the wireless device can be connected. Radiation efficiency can be ensured.

In one embodiment, the first conductive element 12 or the second conductive element 13 is provided with two internal connection terminals 14, that is, the two internal connection terminals 14 are installed in the same conductive element. .. Referring to FIG. 2, in the embodiment of the present invention, the second conductive element 13 is provided with two internal connection terminals 14, and the two internal connection terminals 14 are the second conductive element 13. It may be installed symmetrically with respect to the center line.

The internal connection terminal 14 is used to connect the first conductive element 12 or the second conductive element 13 to another element, and for example, the internal connection terminal 14 may be a pad.

In one embodiment, the two internal connection terminals 14 may be installed in the first conductive element 12, in which case the two internal connection terminals 14 are located at the center line of the first conductive element 12. On the other hand, it is installed symmetrically.

In one embodiment, the first conductive element 12 and the second conductive element 13 are configured to cover the surface on the side corresponding to the dielectric substrate 11, that is, the first conductive element 12 is. The surface 111 on the first side may be covered, and the second conductive element may cover the surface 112 on the second side.

In one embodiment, when two internal connection terminals 14 are installed in the second conductive element 13, the two internal connection terminals 14 may be installed at the end of the second conductive element 13.

In one embodiment, when two internal connection terminals 14 are installed in the first conductive element 12, the two internal connection terminals 14 may be installed at the end of the first conductive element 12.

In one embodiment, one internal connection terminal 14 is used to electrically connect the RF module of the wireless device, and the other internal connection terminal 14 is used to fix and connect the motherboard of the wireless device. For example, one internal connection terminal 14 electrically connects the TX (Transmit, transmit) / RX (Receive) terminal of the RF module, and the other internal connection terminal 14 welds and fixes the radiation enhancer 10 to the motherboard. It's okay.

In one embodiment, the two internal connection terminals 14 may be installed in a square shape.

In one embodiment, the distance between the first side surface 111 and the second side surface 112 of the dielectric substrate 11, that is, the surface on which the first conductive element 12 is located and the second conductive element in FIG. The dimension of the radiation enhancer 10 is effective because the distance to the surface on which 13 is located is less than one-twentieth of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the radiation enhancer 10. Further, the size of the wireless device including the radiation enhancer 10 can be reduced, and the demand for compactness of the wireless device can be satisfied.

In one embodiment, the dielectric substrate 11 may be installed in a cubic shape, for example, the dielectric substrate 11 may be a rectangular parallelepiped, or the dielectric substrate 11 may be a hexahedron, and the present invention is limited thereto. Not done.

In one embodiment, the dielectric substrate 11 may have side lengths in three directions of length, width and height, and is between the first side surface 111 and the second side surface 112. It is considered that the distances of are the same in the length of the sides of the dielectric substrate 11 in the height direction. For the dielectric substrate 11 installed in a cubic shape, the length of the maximum side of the dielectric substrate 11, that is, the length of the maximum side in the three directions of length, width, and height is determined by the radiation enhancer 10 of the radio device. The size of the radiation enhancer 10 is reduced by being less than 1/20 of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the above, and the size of the radio device including the radiation enhancer 10 is further reduced. Further, it is possible to meet the demand for compactness of the wireless device.

In one embodiment, the lowest resonance frequency of the radiation enhancer 10 may be in the operating frequency band of 698 MHz to 960 MHz.

According to the radiation enhancer 10 according to the present invention, the first conductive element 12 and the second conductive element 13 are installed so as to be connected by electromagnetic coupling, and the size of the radiation enhancer 10 is reduced. Further, the dimensions of the wireless device including the radiation enhancer 10 can be sufficiently reduced, the structural dimensions of the wireless device can be further optimized, and the demands for compactness and weight reduction can be satisfied.

In addition to the radiation enhancer 10 of the radio device, further, as shown in FIG. 3, embodiments of the present invention further provide a radiation system comprising a radiation structure, an RF module 20, and an external terminal.

The radiation structure includes the radiation enhancer 10 in each of the above embodiments, and the radiation enhancer 10 and the external terminal each electrically connect the RF module 20.

In one embodiment, the ground plane layer 30 in the radiation structure electrically connects the radiation enhancer 10 and the RF module 20.

The earth plane layer 30 may be a single-layer conductor for connecting the radiation enhancer 10 and the RF module 20.

In one embodiment, one end of the ground plane layer 30 may electrically connect one internal connection terminal 14 of the radiation enhancer 10, and the other end of the ground plane layer 30 electrically connects the RF module 20. do. It may be understood that the external terminal of the radiation system is one end of the ground plane layer 30 that electrically connects the RF module 20.

The present invention further provides a radio device including a radiation system, a matching system 40, and a transmission line. As shown in FIG. 3, the radiation structure of the radiation system includes the radiation enhancer 10 described above, and the transmission line electrically connects the matching system 40 and the RF module 20 of the radiation system.

The matching system 40 may include several circuits, which are used to tune the signal from the RF module 20 to a preset frequency band.

In one embodiment, the radiation system of the radio device may include the radiation structure of the above embodiment, an RF module 20, and an external terminal.

One end of the transmission line may be electrically connected to the RF module 20 of the radiation system, and the other end of the transmission line may be electrically connected to the matching system 40.

According to the radiation enhancer 10, the radio device connects the first conductive element 12 and the second conductive element 13 in an electromagnetically coupled manner, and the transmission line and the matching system 40 are ground planes. By exciting the radiated current of layer 30, the signal from the RF module 20 can be tuned based on the matching system 40 to complete single-band, dual-band and multi-band electromagnetic energy radiation, radio equipment. Effectively improved the radiation efficiency of.

Referring to FIG. 4, FIG. 4 is a passive performance-S-parameter diagram of the antenna of the wireless device according to the embodiment of the present invention.

In FIG. 4, the abscissa represents the frequency of the signal from the wireless device, and the ordinates represent the return loss. In FIG. 4, M1 (824 MHz, −8.13 dB), M2 (960 MHz, −7.61 dB), M3 (1710 MHz, −7.45 dB), M4 (2170 MHz, −7.35 dB), M5 (2300 MHz, −10). .37 dB), M6 (2700 MHz, -15.42 dB), among which the frequency bands corresponding to M1 to M2, that is, 824 MHz to 960 MHz can represent low frequency bands in 2G communication. The frequency band corresponding to M3 to M4, that is, 1710 MHz to 2170 MHz can represent a frequency band in 3G communication. The frequency band corresponding to M5 to M6, that is, 2300 MHz to 2700 MHz can represent a high frequency band in 4G communication. These three frequency bands are GSM (registered trademark) (Global System for Mobile Communications) 850, GSM (registered trademark) 900, GSM (registered trademark) 1800, GSM (registered trademark) 1900, and WCDMA (registered). Trademarks) (Broadband Code Division Multiple Access, Wideband Code Division Multiple Access) 1900, WCDMA® 2100, TD-SCDMA (Time Division Multiple Access Code Division Multiple Access, Time Division-Synchronous Code Division Multiple Access) Multiple current normals such as Division Multiple Access, Code Division Multiple Access), LTE (Long Term Evolution) 1, LTE3, LTE5, LTE8, LTE38, LTE39, LTE40, LTE41, WIFI 2.4-2.5G. And the return loss of all three frequency bands is -5 dB or less, that is, within the frequency bands of 2G, 3G and 4G communication, in the embodiment of the present invention. Based on the radiation enhancer, the operating performance of the wireless device can be effectively improved.

The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equal substitutions, improvements, etc. made within the gist and principles of the invention of the present application should be included within the scope of protection of the invention of the present application.

In FIG. 1,
10'Radiation enhancer,
11'dielectric substrate,
12'upper conductive element,
13'Lower conductive element,
14'metallized through hole.
In FIGS. 2 and 3,
10 Radiation enhancer,
11 Dielectric substrate,
111 First side surface,
112 Second side surface,
113 Third side surface,
114 Fourth side surface,
115 Fifth side surface,
116 6th side surface,
12 First conductive element,
13 Second conductive element,
14 Internal connection terminal,
20 RF module,
30 Earth plane layer,
40 Matching system,
50 motherboard.

The dielectric substrate 11 may be made of a low dielectric loss material, and may be, for example, a dielectric substrate of FR4 which is an epoxy glass fiber plate. As shown in FIG. 2, in the embodiment of the present invention, the dielectric substrate 11 is a solid dielectric. Of course, the dielectric substrate 11 is not limited to a solid dielectric, and may be hollow, or a through hole may be formed in the dielectric substrate 11. In the embodiment of the present invention, the first conductive element 12 and the second conductive element 13 do not come into contact with each other, and the first conductive element 12 and the second conductive element 13 are connected to each other. The configuration shape of the dielectric substrate 11 is not limited as long as it can be connected by electromagnetic coupling.

In one embodiment, the first conductive element 12 or the second conductive element 13 is provided with two internal connection terminals 14, that is, the two internal connection terminals 14 are installed in the same conductive element. .. Referring to FIG. 2, in the embodiment of the present invention, the second conductive element 13 is provided with two internal connection terminals 14, and the two internal connection terminals 14 are the second conductive element 13. It may be installed symmetrically with respect to the center line. As another embodiment, the two internal connection terminals 14 may be installed in the first conductive element 12.

Claims (11)

It is a radiation enhancer for wireless devices.
Dielectric board and
A first conductive element installed on the first surface of the dielectric substrate, and
A second conductive element installed on a second surface facing the first surface of the dielectric substrate.
The thickness between the first-side surface and the second-side surface is such that the first conductive element and the second conductive element can be electromagnetically coupled and connected in a non-contact manner. A radiation enhancer featuring. The radiation enhancer according to claim 1, wherein the first conductive element or the second conductive element is provided with two internal connection terminals. The radiation enhancer according to claim 2, wherein the two internal connection terminals are installed symmetrically with respect to the center line of the first conductive element or the second conductive element. The first conductive element and the second conductive element cover the corresponding side surfaces of the dielectric substrate, and the two internal connection terminals are the first conductive element or the second conductive element. The radiation enhancer according to claim 3, wherein the radiation enhancer is installed at an end of a conductive element. One of the internal connection terminals is used to electrically connect the RF module of the wireless device, and the other internal connection terminal is used to fix and connect the motherboard of the wireless device. The radiation enhancer according to claim 2, wherein the radiation enhancer is characterized. The distance between the first-side surface and the second-side surface is characterized by being less than one-twentieth of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the radiation enhancer. The radiation enhancer according to claim 1. The dielectric substrate is installed in a cubic shape, and the length of the maximum side of the dielectric substrate is 1/20 or less of the propagation wavelength in the air dielectric corresponding to the lowest resonance frequency of the radiation enhancer. The radiation enhancer according to claim 1, wherein the radiation enhancer is characterized in that. The radiation enhancer according to claim 6 or 7, wherein the lowest resonance frequency is in the frequency band of 698 MHz to 960 MHz. It is a radiation system of a wireless device.
It has a radiation structure, an RF module, and an external terminal.
The radiation structure comprises the radiation enhancer according to any one of claims 1-8.
A radiation system characterized in that the radiation enhancer and the external terminal are respectively electrically connected to the RF module. The radiation system according to claim 9, wherein the radiation structure includes an earth plane layer that electrically connects the radiation enhancer and the RF module. Equipped with a radiation system, a matching system, and a transmission line,
The radiation structure in the radiation system includes the radiation enhancer according to any one of claims 1 to 8.
The transmission line is a wireless device that electrically connects the matching system and the RF module of the radiation system.

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