JP2022509471A - Antenna device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an antenna device capable of improving an assembly manufacturing method and maximizing heat dissipation performance.
An antenna device is separated from a filter unit unit arranged so as to form at least one or more layers and a filter unit unit so as to form a layer different from the filter unit unit. A filter unit that is coupled to the electrical unit unit that incorporates various electrical equipment and the filter unit that is coupled to the opposite surface of the surface to which the electrical unit is coupled, and dissipates heat generated from the filter unit to the outside. The heat generated from the heat dissipation module and the first heat generating element, which is coupled to the opposite surface of the electrical unit unit to which the filter unit is bonded and is centrally arranged on one side of the filter unit, is radiated to the outside. A second electrical component unit that is provided side by side with the first electrical component heat dissipation module and the first electrical component heat dissipation module and dissipates heat generated from the second heat generation element centrally arranged on the other side of the filter unit section. Includes the electrical component heat dissipation module including the heat dissipation module.
[Selection diagram] Fig. 1

Description

The present invention relates to an antenna device (ANTENNA APPARATUS), and more particularly to an antenna device for wireless communication.

Wireless communication technology, for example, MIMO (Multiple Input Multiple Output) technology, is a technology that dramatically increases the data transmission capacity by using a plurality of antennas, and in a transmitter, data different from each other via each transmission antenna. This is a physical multiplexing method in which transmission data is divided by appropriate signal processing in the receiver.

Therefore, by increasing the number of transmit / receive antennas at the same time, the channel capacity is increased and more data can be transmitted. For example, increasing the number of antennas to 10 secures about 10 times the channel capacity using the same frequency band as compared to the current single antenna system.

4G LTE-advanced uses up to 8 antennas, and products with 64 or 128 antennas are currently being developed at the pre-5G stage, and 5G is equipped with a base station with a much larger number of antennas. Is expected to be used, and this is called Massive MIMO technology. While the current Cell operation is 2-Dimension, 3D-Beamforming becomes possible when Massive MIMO technology is introduced, so it is also called FD-MIMO (Full Dimension).

In Massive MIMO technology, as the number of ANT increases, the number of transceiver and Filter also increases, but due to the lease cost of the installation location and space restrictions, RF parts (Antenna / Filter / Power Amplifier /) It is desired to make Transceiver etc.) small, light, and inexpensive. Massive MIMO requires high power for Coverage expansion, and the power consumption and calorific value of such high power act as negative factors in reducing weight and size.

In particular, when a MIMO antenna in which an RF element and a module in which a digital element is realized is connected in a laminated structure is provided in a limited space, a plurality of MIMO antennas constituting the MIMO antenna in order to maximize installation ease and space utilization. The need for compactness and miniaturization design for layers has emerged, and in this case, a design for a new heat dissipation structure against heat generated by communication components mounted on a plurality of layers is required.

An object of the present invention is to provide an antenna device having improved heat dissipation performance.

Another object of the present invention is to provide an antenna device in which independent heat radiating units corresponding to a group of heat generating elements having the same specifications and specifications are matchedly arranged and have a simpler arrangement structure.

Still another object of the present invention is to provide an antenna device provided with a power connector (first interface block connector) and an RF connector (second interface block connector) having excellent compatibility and applicability. ..

The technical subject matter of the present invention is not limited to the technical subject matter described above, and further technical subject matter not described above will be clearly understood by those skilled in the art from the following description.

In one embodiment of the antenna device according to the present invention, a filter unit unit arranged so as to form at least one or more layers and the filter so as to form a layer different from the filter unit unit. It was separated from the unit unit and coupled to the electrical unit unit in which various electrical devices are built, and to the opposite surface of the filter unit section to which the electrical unit section is bonded, and generated from the filter unit section. A first filter unit that dissipates heat to the outside and is coupled to the opposite surface of the electrical unit unit to which the filter unit unit is bonded, and is centrally arranged on one side of the filter unit unit. A second heat-generating element that is provided side by side with the first electrical component heat-dissipating module that dissipates heat generated from the heat-generating element to the outside and the first electrical component heat-dissipating module, and is centrally arranged on the other side of the filter unit. Includes a second electrical component heat dissipation module that dissipates heat generated from the engine to the outside.

Here, the filter unit portion and the electrical equipment unit portion can be separated by a predetermined distance by a plurality of air supporters, one end of which is coupled to the filter unit portion and the other end of which is coupled to the electrical equipment unit portion.

Further, the filter unit unit is arranged in a filter unit main body having a predetermined installation space on one side and an installation space of the filter unit main body, and has a plurality of signal amplification elements (Main TR for Power Amplifier) on one surface. The signal amplifier printing circuit board (Power Amplifier PCB) mounted on the above and the signal amplifier printing circuit board are stacked and arranged at a predetermined distance from each other, and a plurality of LPFs (Low Pass Filters) are arranged and installed on one surface. The filter printing circuit board (Filter PCB) is included, and two layers can be formed via the signal amplifier printing circuit board and the filter printing circuit board.

Further, the filter unit heat dissipation module is coupled to the outside of the filter unit main body, and is provided so as to discharge heat generated from the plurality of signal amplification elements through a heat transfer path penetrating the filter unit main body.

Further, the filter unit heat dissipation module is arranged so as to be in contact with a heat trapping plate that is adhered to the heat generating surface of each of the plurality of signal amplification elements to collect heat and the outer surface of the heat trapping plate, and is arranged on the outside. The first heat radiation fin portion in which a plurality of heat radiation fins are formed and the first heat radiation fin portion are arranged so as to be separated from each other in the horizontal direction, and heat is transferred from the first heat radiation fin portion to dissipate heat over a long distance. A second heat radiation fin portion in which a plurality of heat radiation fins are formed on the outside, a heat transfer mediation block in which heat is supplied from the heat trapping plate and transmitted to the first heat radiation fin portion, and the first heat radiation fin portion. One end is inserted between the heat transfer mediation block and the second heat radiation fin portion, and the other end is connected to the second heat radiation fin portion to transfer the heat supplied from the heat transfer mediation block to the second heat radiation fin portion. Can include multiple heat pipes.

Further, the heat trapping plate and the heat transfer mediation block are provided with a copper material.

Further, the electrical unit portion is open to the filter unit portion side and is provided with at least two partitioned installation spaces, and any one of the at least two partitioned installation spaces (hereinafter, "first installation"). It is referred to as "space", and the remaining installation space is a portion corresponding to "second installation space"), and the filter unit portion is located on a surface opposite to the adjacent surface (hereinafter referred to as "outer surface"). The first electrical equipment is provided in the first installation space of the electrical unit main body and the electrical unit main body is integrally provided with the heat radiation fins, and a plurality of FPGAs (Field Programmable Gate Arrays) are mounted on one surface facing the outer surface. The printed circuit board for electrical equipment includes a printed circuit board for electrical equipment and a second printed circuit board for electrical equipment provided in the second installation space of the main body of the electrical equipment unit and on which a plurality of DC power supply modules for PSU are mounted on one surface facing the outer surface. The 1st electrical equipment printed circuit board and the 2nd electrical equipment printed circuit board are partitioned and arranged at the same height by the first installation space and the second installation space so as to form one layer. ..

Further, the electrical component heat dissipation module is arranged so as to be in thermal contact with the plurality of FPGAs through a plurality of heat transfer holes formed by opening in the electrical component unit main body, and the electrical component unit main body is formed. The heat dissipation portion on the first electrical component side, which is further separated from the plurality of heat dissipation fins, is coupled to the outer surface of the electrical component unit main body so as to close the opening formed by opening in the electrical unit main body. It is possible to include a second electrical component side heat dissipation unit provided so as to be in contact with the plurality of PSU DC power supply modules of the first electrical component printing circuit board.

Further, the first electrical component side heat radiating portion is arranged so as to be in contact with a heat trapping plate that is adhered to the heat generating surface of each of the plurality of FPGAs to collect heat and the outer surface of the heat trapping plate, and a plurality of heat collecting portions are provided on the outside. The first heat radiation fin portion on which the heat radiation fins are formed and the first heat radiation fin portion are arranged so as to be separated from each other in the horizontal direction, and heat is transferred from the first heat radiation fin portion to dissipate heat over a long distance. A second heat radiation fin portion in which a plurality of heat radiation fins are formed on the outside, a heat transfer mediation block in which heat is supplied from the heat trapping plate and transmitted to the first heat radiation fin portion, and the first heat radiation fin portion. One end is inserted between the heat transfer mediation block and the other end is connected to the second heat radiation fin portion to transfer the heat supplied from the heat transfer mediation block to the second heat radiation fin portion. Can include multiple heat pipes.

Further, the heat trapping plate and the heat transfer mediation block are provided with a copper material.

Further, in the second electrical component side heat radiation unit, a plurality of radiation fins having the same height as the plurality of radiation fins formed on the outer surface of the electrical unit main body can be integrally formed.

Further, the filter unit unit is provided with at least one filter-side power connection terminal and at least one filter-side signal connection terminal, and the electrical equipment unit unit has at least one electrical component-side power connection terminal and at least one electrical component-side signal. A first interface block connector, which is provided with a connection terminal and is coupled while forming a thickness portion on one side so as to interconnect the at least one filter side power connection terminal and the at least one electrical component side power connection terminal. It can further include a second interface block connector that is coupled while forming a thickness portion on the other side so as to interconnect the at least one filter side signal connection terminal and the at least one electrical component side signal connection terminal.

According to one embodiment of the antenna device according to the present invention, the following various effects can be achieved.

First, the present invention has the effect of improving heat dissipation performance.

Secondly, the present invention not only improves the assembling property but also has a heat dissipation design by matching and arranging independent heat radiating parts corresponding to the heat generating element group having the same specifications and specifications and having a simpler arranging structure. Is very effective.

Third, the present invention can improve compatibility and applicability.

It is a perspective view which shows one Example of the antenna device by this invention. It is an exploded perspective view of FIG. It is an exploded perspective view which shows the filter unit part in the structure of FIG. It is an exploded perspective view which shows the filter unit part in the structure of FIG. It is an exploded perspective view which shows the LPF element provided in the printing circuit board for a filter in the filter unit part of FIG. It is an exploded perspective view which shows the printed circuit board for a signal amplifier in the filter unit part of FIG. It is an exploded perspective view which shows the printed circuit board for a signal amplifier in the filter unit part of FIG. It is an exploded perspective view which shows the filter unit heat dissipation module in the filter unit part of FIG. It is a rear view which shows the filter unit part of FIG. It is sectional drawing which follows the AA line of FIG. It is sectional drawing along the line BB of FIG. It is an exploded perspective view which shows the electrical unit part in the structure of FIG. It is an exploded perspective view which shows the electrical unit part in the structure of FIG. It is a front view which shows the electrical unit part of FIGS. 10A and 10B. 11 is a cross-sectional view taken along the line CC, DD and EE of FIG. It is an exploded perspective view which shows the coupling relationship of the air supporter which separates a filter unit part and an electrical equipment unit part in the structure of FIG.

Hereinafter, an embodiment of the antenna device according to the present invention will be described in detail with reference to the attached drawings. In assigning reference numerals to the components of each drawing, it should be noted that the same components have the same reference numerals as much as possible even if they are displayed on other drawings. Further, in explaining the embodiment of the present invention, if it is determined that the specific description of the known configuration or function hinders the understanding of the embodiment of the present invention, the detailed description thereof will be omitted.

In describing the components of the embodiments of the present invention, terms such as first, second, A, B, (a), and (b) can be used. Such terms are merely to distinguish one component from other components, and the term does not limit the essence, order or order of the component. Also, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by those with ordinary knowledge in the art to which the invention belongs. Have. Terms such as those defined in commonly used dictionaries must be construed to have a meaning consistent with the context of the relevant technology and are ideal or excessive unless expressly defined in this application. Is not interpreted in a formal sense.

FIG. 1 is a perspective view showing an embodiment of the antenna device according to the present invention, and FIG. 2 is an exploded perspective view of FIG.

In one embodiment of the antenna device 1 according to the present invention, as shown in FIGS. 1 and 2, a filter unit unit 100 in which an antenna assembly or a filter element is built and an electrical unit unit 200 in which various electrical devices are built are provided. include.

Although not shown, the filter unit unit 100 is a portion to which an antenna assembly including an RF element and a digital element and an LPF (Low Pass Filter) 105 are mounted or coupled. The RF element, the digital element, and the LPF 105 are separately provided on the printed circuit board 107a for a filter or the printed circuit board 107b for a signal amplifier in which an RF feeding network (feeding network) is realized.

3A and 3B are exploded perspective views showing the filter unit 100 in the configuration of FIG. 1, and FIG. 4 is an LPF element provided on the filter printing circuit board 107a of the filter unit 100 of FIG. 105 is an exploded perspective view, FIGS. 5A and 5B are exploded perspective views showing a signal amplifier printing circuit board 107b of the filter unit unit 100 of FIG. 3, and FIG. 6 is an exploded perspective view of the filter unit unit of FIG. 100 is an exploded perspective view showing the filter unit heat dissipation module 110, FIG. 7 is a rear view showing the filter unit unit 100 of FIG. 3, and FIG. 8 is a cross-sectional view taken along the line AA of FIG. 9 is a cross-sectional view taken along the line BB of FIG. 7.

As shown in FIGS. 3A and 3B, the filter printing circuit board 107a and the signal amplifier printing circuit board 107b are laminated in a predetermined installation space formed in the filter unit main body 100a forming the skeleton of the filter unit portion 100. Be placed. The filter unit main body 100a is formed by opening on the side to which the electrical unit portion 200 described later is connected, and has the above-mentioned installation space inside the filter unit main body 100a, and the filter printing circuit board 107a and the signal amplifier printing are provided in the installation space. The circuit boards 107b are laminated and arranged while forming a predetermined thickness.

At the same time, a plurality of heat dissipation installation ports 100b opened to the outside are provided on the closed inner side surface of the filter unit main body 100a. The filter unit heat dissipation module 110, which will be described later, can be coupled through the plurality of heat dissipation installation ports 100b so as to be in direct thermal contact with any one of the plurality of signal amplification elements 108a or RF elements.

The left and right end portions of the filter unit main body 100a are provided with terminal insertion ports 100c for connecting terminals of the first interface block connector 310 and the second interface block connector 320, which will be described later.

More specifically, as shown in FIGS. 3A and 3B, the filter unit unit 100 forms at least one or more layers and is arranged in the installation space of the filter unit main body 100a for a plurality of signal amplification. A printed circuit board for a signal amplifier (Power Amplifier PCB) 107b on which an element (Main TR for Power Amplifier) 108a is mounted on one surface and a printed circuit board 107b for a signal amplifier are laminated and arranged at a predetermined distance on one surface. A printed circuit board for a filter (Filter PCB) 107a in which a plurality of air strip lines 106 are arranged and installed so as to form an LPF (Low Pass Filter) 105 can be included, and a printed circuit board 107b for a signal amplifier and printing for a filter can be included. Two layers can be formed via the circuit board 107a.

That is, as shown in FIG. 3A, a plurality of PA (Power Amplifier) signal amplification elements (Main TR) 108a can be mounted on one surface of the signal amplifier printed circuit board 107b. The signal amplification element (Main TR) 108a is a centralized heat generation element, and the heat generated by the filter unit heat dissipation module 110 described later can be dissipated to the outside.

On the other hand, as shown in FIG. 4, the air strip line 106 provided with eight transmission / reception (TRX) ports is arranged on the filter printing circuit board 107a so that the air strip line 106 can be accommodated. A plurality of boxes 102 are provided. As described above, the air strip line 106 has four long-formed and four short-formed connecting ports 102a transmitted and received from the antenna, and has a form in which they are arranged repeatedly.

The box 102 is provided with a box cover 103 that covers the air strip line 106 housed therein. Here, the box 102 and the box cover 103 are formed on the same surface as the air strip line 106, and are formed on the Pocket surface opposite to the surface provided with the connecting port 102a, and have a size thereof. Since it can be designed to the maximum, it has the advantage that RF performance can be greatly improved. Further, by arranging the air strip line 106 and the pocket surface on opposite surfaces, the degree of freedom can be improved when designing the configuration of the LPF 105 on the pocket surface.

On the other hand, as shown in FIG. 4, a plurality of RET ports 104 connected to the LPF 105 and remotely electronically tiltable to control the antenna are located at the end of the printed circuit board 107a for the filter. It is prepared to be aligned on the top, left, and right.

As shown in FIG. 5A, a PA Out port 108b connected to the filter input end of the LPF 105 is mounted and arranged on the printed circuit board 107b for a signal amplifier, and a plurality of PA Out ports 108b for protecting the circuit at the time of signal reception (Rx) are mounted. Circulator 108c is provided on one side of the PA Out port 108b. The printed circuit board 107a for the filter and the printed circuit board 107b for the signal amplifier are arranged at a predetermined distance in the thickness direction by at least the height of the circulator 108c, and the PA Out port 108b and the plurality of circulators 108c are separated from each other. Placed inside. Here, the height of the PA Out port 108b is formed to be larger than the above-mentioned separation distance, and can be inserted and fixed to the filter input end of the LPF 105.

On the other hand, as shown in FIGS. 5A and 5B, the filter unit main body 100a is a cover for both heat dissipation on the filter side, and can be coupled so as to cover the filter printing circuit board 107a and the signal amplifier printing circuit board 107b. A plurality of heat dissipation fins 100d are formed on the outside of the filter unit main body 100a provided as the filter side heat dissipation combined cover, and are inside the installation space of the filter main body 100a, and are the filter printing circuit board 107a and the signal amplifier printing. By arranging the PA Clamschel 109 between the circuit board 107b and the circuit board 107b, electromagnetic waves to the PA or the printed circuit board 107b for a signal amplifier can be shielded.

As shown in FIG. 6, a plurality of filter unit heat dissipation modules 110 can be coupled to the outside of the filter unit main body 100a. The filter unit heat dissipation module 110 serves to capture heat generated from the signal amplification element (Main TR) 108a, which is a centralized heat generation element, and dissipate the heat to the outside.

That is, the filter unit heat dissipation module 110 is coupled to the outside of the filter unit main body 100a, and the plurality of signal amplification elements are passed through a heat transfer path via a heat dissipation installation port 100b provided so as to penetrate the filter unit main body 100a. It is provided to release the heat generated from (Main TR) 108a.

As shown in FIGS. 6 to 9, the filter unit heat dissipation module 110 includes a heat trapping plate 111 that is adhered to the heat generating surface of each of the plurality of signal amplification elements (Main TR) 108a to collect heat, and a heat trapping plate. The first heat radiating fin portion 113, which is arranged so as to be in contact with the outer surface of the 111 and has a plurality of heat radiating fins formed on the outside, and the first heat radiating fin portion 113 are arranged so as to be laterally separated from each other in the horizontal direction. The second heat radiating fin portion 115 in which a plurality of heat radiating fins are formed on the outside so that heat is transferred from the heat radiating fin portion 113 to dissipate heat over a long distance, and the first heat radiating fin portion 113 in which heat is supplied from the heat trapping plate 111. One end is inserted between the heat transfer mediation block 112 and the first heat radiation fin portion 113 and the heat transfer mediation block 112, and the other end is connected to the second heat radiation fin portion 115 to mediate the heat transfer. It can include a plurality of heat pipes 114 that transfer the heat supplied from the block 112 to the second heat radiation fin portion 115.

Here, the heat trapping plate 111 and the heat transfer mediation block 112 are provided with a copper plate (Cu plate) made of a copper material. However, the heat trapping plate 111 does not necessarily have to be a pure copper material, and may be provided with an alloy material containing copper. This can effectively dissipate the heat generated from the signal amplification element (Main TR), which is a centralized heat generating element, to the outside through the heat trapping plate 111 made of copper material having higher thermal conductivity and the heat transfer mediation block 112. To make it.

The heat trapping plate 111 is provided so as to be inserted into a heat radiation installation port 100b formed so as to open corresponding to a position where a signal amplification element (Main TR) is mounted on the filter unit main body 100a.

In one embodiment of the antenna device 1 according to the present invention, as described above, the signal amplification element (Main TR), which is a centralized heat generation element, effectively uses the filter unit heat dissipation module 110 provided in another module. In addition to radiating heat to the outside, the heat generated inside the filter unit body 100a is prepared to be radiated to the outside through a plurality of heat radiating fins 100d provided on the outside of the filter unit body 100a, although it is not a centralized heat generating element. This has the advantage that active heat dissipation design for each of the same heat generating elements is easy.
For example, when the centralized heat generation element mounted on the signal amplifier printing circuit board 107b is provided with other specifications or specifications other than the signal amplification element (Main TR), the degree of heat generation of the centralized heat generation element is determined in advance. It is possible to calculate and design a dedicated heat dissipation module with optimum heat dissipation performance.

The heat generated from the signal amplification element (Main TR) is captured by the heat trapping plate 111, and then a part of the heat is directly transferred to the first heat radiation fin portion 113 via the heat transfer mediation block 112, and the rest. A part of the heat is transmitted to a plurality of heat pipes 114, dissipates heat in close proximity through the first heat radiating fin portion 113, and radiates heat over a long distance through the second heat radiating fin portion 115. Here, the outer end portions of the first heat radiating fin portion 113 and the second heat radiating fin portion 115 are provided at least outside the tips of the plurality of heat radiating fins 100d directly provided on the outer surface of the filter unit main body 100a. Therefore, the heat generated in the installation space of the filter unit main body 100a and the heat generated from the signal amplification element (Main TR) can be mutually separated and dissipated.

10A and 10B are exploded perspective views showing the electrical unit unit 200 in the configuration of FIG. 1, FIG. 11 is a front view showing the electrical unit unit 200 of FIGS. 10A and 10B, and FIG. 12 is a front view. 11 is a cross-sectional view taken along the line CC, DD and EE of FIG.

As shown in FIGS. 10A and 10B, the electrical unit unit 200 is open to the filter unit unit 100 side and is provided with at least two partitioned installation spaces 201a and 201b, and at least two partitioned installation spaces 201a, A portion corresponding to any one of 201b (hereinafter referred to as "first installation space 201a" and the remaining installation space is referred to as "second installation space 201b"), and a surface adjacent to the filter unit unit 100. One surface facing the front surface, which is provided in the first installation space 201a of the electrical unit main body 200a and the electrical unit main body 200a in which a plurality of heat radiation fins 200d are integrally provided on the opposite surface (hereinafter referred to as "front surface"). A printed circuit board 206a for first electrical equipment on which a plurality of FPGA 207 (Field Program Gate Array) is mounted, and a plurality of DC power supplies for PSU on one side facing the front surface, which are provided in the second installation space 201b of the main body 200a of the electrical equipment unit. Includes a second electrical printed circuit board 206b on which the module 203 is mounted.

Here, the first electrical equipment printing circuit board 206a and the second electrical equipment printing circuit board 206b are formed by the first installation space 201a and the second installation space 201b at the same height so as to form one layer. It is partitioned and placed.

More specifically, as shown in FIGS. 10A and 10B, the electrical unit main body 200a opens in the direction in which the filter unit portion 100 is provided, is formed in a rectangular parallelepiped shape having a predetermined thickness, and is formed in two spaces. The partition is formed so that the first installation space 201a is formed on one side and the second installation space 201b is formed on the other side. In particular, the second installation space 201b in which the plurality of DC power supply modules 203 for PSU are provided is formed in such a form that both sides in the thickness direction are open.

A plurality of heat radiation fins 200d can be integrally formed on the front surface of the electrical unit main body 200a corresponding to the first installation space 201a so as to immediately release the heat inside the first installation space 201a to the outside. At the same time, between the plurality of heat radiating fins 200d, the number of heat radiating holes 200b provided so as to penetrate the electrical unit main body 200a so that the heat generating surfaces of the plurality of FPGA 207 are exposed to the outside is increased to the number of the plurality of FPGA 207. It is formed by the corresponding number.
A plurality of FPGAs 207 can be mounted on the first electrical equipment printing circuit board 206a coupled to the first installation space 201a of the electrical equipment unit main body 200a. The plurality of FPGAs 207 are a kind of programmed gate array (Field Program Gate Array) semiconductor, and are one of the centralized heat generating elements like the above-mentioned signal amplification element (Main TR) 108a.

On the other hand, as shown in FIGS. 10A and 11, the electrical component heat dissipation module 210 is arranged so as to be in thermal contact with a plurality of FPGAs 207 via a plurality of heat dissipation holes 200b formed by opening in the electrical unit main body 200a. , The first electrical component side heat dissipation section 220 arranged further in front of the plurality of heat dissipation fins 200d formed in the electrical component unit main body 200a, and the opening 201a formed by opening in the electrical component main body 200a are closed. A second electrical component side heat dissipation unit 230, which is coupled to the outer surface of the electrical component unit main body 200a so as to be in contact with the plurality of PSU DC power supply modules 203 of the first electrical component printing circuit board 206a, is included. be able to.

Hereinafter, for convenience of explanation, a plurality of FPGAs 207 centrally arranged on one side of the electrical unit main body 200a are defined as "first heat generating elements", and a plurality of FPGAs 207 centrally arranged on the other side of the electrical unit main body 200a are defined. The DC power supply module 203 for PSU will be described by defining it as a "second heat generating element".

Of the configurations of the electrical component heat dissipation module 210, the first electrical component side heat dissipation section 220 has the same configuration and specifications as the filter unit heat dissipation module 110 of the filter unit section 100.
More specifically, as shown in FIGS. 12 (a) and 12 (b), the first electrical component side heat radiating unit 220 includes a heat trapping plate 211 that contacts the heat generating surfaces of each of the plurality of FPGA 207s and collects heat. The first heat radiating fin portion 213, which is arranged so as to be in contact with the outer surface of the heat trapping plate 211 and has a plurality of heat radiating fins formed on the outside, and the first heat radiating fin portion 213 are arranged so as to be separated from each other in the horizontal direction. , The first heat radiation is supplied from the second heat radiation fin portion 215 in which a plurality of heat radiation fins are formed on the outside so that heat is transferred from the first heat radiation fin portion 213 and heat is dissipated over a long distance, and the heat trap plate 211. One end is inserted between the heat transfer mediation block 212 that transfers heat to the fin portion 213, the first heat dissipation fin portion 213, and the heat transfer mediation block 212, and the other end is connected to the second heat dissipation fin portion 215. It can include a plurality of heat pipes 214 for transferring the heat supplied from the heat transfer mediation block 212 to the second heat radiation fin portion 215. In the antenna device according to the embodiment of the present invention, the FPGA 207 is provided so that two are provided on the front surface of the printed circuit board 206a for electrical equipment and prevent heat from concentrating in the first installation space 201a. One can be mounted so as to be relatively located on the upper side of the drawing, and the other one may be mounted so as to be relatively located on the upper and lower sides of the drawing.

Therefore, it is possible to design so that the lengths of the second heat radiating fin portion 215 and the plurality of heat pipes 214 are different in the configuration of the first electrical component side heat radiating portion 220 involved in each FPGA 207.
As shown in FIGS. 10A and 10B, the second electrical component side radiating section 230 is integrally formed with a plurality of radiating fins 230d having the same height as the plurality of radiating fins 200d formed on the outer surface of the electrical unit main body 200a. It is possible. Such a second electrical equipment side heat dissipation unit 230 is coupled to one side of the second installation space 201b of the electrical equipment unit main body 200a whose both sides are all open to close one side of the second installation space 201b, and the electrical equipment unit main body 200a is closed. It is provided so as to form an outer shape having a sense of unity together with a plurality of heat radiating fins 200d formed on the outer surface of the above.

As shown in FIG. 12 (c), a part of the inner surface of the second electrical component side heat radiating unit 230 is in direct contact with the heat generating surface of the plurality of PSU DC power supply modules 203, and a plurality of PSU DC power supplies are externally contacted. The heat generated by the module 203 can be immediately dissipated to the outside. Further, the second electrical component side heat dissipation unit 230 can also dissipate the heat inside the second installation space 201b to the outside through the plurality of heat dissipation fins 200d.

A plurality of PSU DC power supply modules 203 mounted inside the second installation space 201b can be adopted for 5V, 12V, and 30V depending on the magnitude of the rectified voltage. However, it goes without saying that various voltage DC power supply modules 203 are provided depending on the embodiment.

As described above, in one embodiment of the antenna device according to the present invention, since various DC power supply modules for voltage 203 can be adopted depending on the embodiment, the second installation space 201b is a filter unit so that switching and assembly thereof can be facilitated. The second electrical equipment printing circuit board 206b is also provided so as to open in the opposite direction to the side on which the portion 100 is provided, and is separately provided from the first electrical equipment printing circuit board 206a. It is provided so that independent heat radiation is performed via the heat radiation unit 220 and the heat radiation unit 230 on the second electrical component side.

As shown in FIG. 12 (c), a surge protection line filter (Surge Protector Line Filter) 208 is provided on one side of a plurality of PSU DC power supply modules 203 of the second electrical circuit board 206b. .. At the same time, a power input connector 253 is provided at the front end of the second electrical circuit board 206b, and external power can be supplied. The front end of the second electrical component printing circuit board 206b is provided with a pressure adjusting function for preventing the internal pressure of the first installation space 201a or the second installation space 201b from rising due to the heat generated by the operation of the electrical components. Gore-Tex® 251 to perform is provided.

On the other hand, as shown in FIGS. 10A and 10B, the electrical unit heat dissipation cover 250 can be coupled to the outer surface of the electrical unit main body 200a on the opposite surface on which the plurality of heat radiation fins 200d are not formed. A plurality of heat dissipation fins 250d are also provided on the outer surface of the electrical unit heat dissipation cover 250, and the heat of the first installation space 201a and the second installation space 201b of the electrical unit main body 200a can be dissipated to the outside.

FIG. 13 is an exploded perspective view showing the coupling relationship of the air supporter 400 that separates the filter unit unit 100 and the electrical equipment unit 200 from the configuration of FIG. 1.

As shown in FIG. 13, the filter unit unit 100 and the electrical unit unit 200 are arranged so that their surfaces facing each other are separated from each other by a plurality of air supporters 400. The air supporter 400 not only plays a role of interconnecting the filter unit 100 and the electrical unit 200, but also has a plurality of heat radiation fins 250d formed on the surfaces where the filter unit 100 and the electrical unit 200 face each other. The heat dissipation performance can be greatly improved by separating the space by a predetermined distance so as to form a space through which the heat is dissipated.

On the other hand, as shown in FIGS. 5A and 5B, FIGS. 10A and 10B, and FIG. 13, at least one filter-side power connection terminal 140 and one filter-side power connection terminal 140 on one side of the signal amplifier printed circuit board 107b in the filter unit unit 100 At least one filter-side signal connection terminal 145 is provided, and the first electrical component printing circuit board 206a of the electrical component unit 200 is provided with at least one electrical component-side power connection terminal 240, and the electrical component unit 200 is the first. The printed circuit board 206b for two electrical components is provided with at least one electrical component side signal connection terminal 245.

Here, in one embodiment of the antenna device 1 according to the present invention, as shown in FIG. 13, the above-mentioned at least one filter-side power connection terminal 140 and at least one electrical equipment-side power connection terminal 240 are interconnected. The thickness of the other side so as to interconnect the first interface block connector 310, which is coupled while forming the thickness portion on the side, and at least one filter side signal connection terminal 145 and at least one electrical side signal connection terminal 245. It can further include a second interface block connector 320 that is coupled while forming a portion.

The first interface block connector 310 and the second interface block connector 320 are individual interfaces for transmitting and receiving power supplies or data signals, respectively, and conventional power supply connection lines and the like are internally wired together with electrical components or heat generating elements. By arranging the object outside the filter unit main body 100a and the electrical unit main body 200a, it plays a role of reducing the heat generation of the filter unit main body 100a and the electrical unit main body 200a. Further, by arranging the conventional power supply connecting line or the like externally, the space utilization of each unit (filter unit unit 100 or electrical unit unit 200) can be maximized, and of course, they are connected by the socket coupling method. This can create the further advantage of facilitating the assembly process.

The first interface block connector 310 can serve as a power supply and data signal coupling port for electrical drive configurations such as power supply units (PSUs) and PAs (Power Amplifiers). At the same time, the second interface block connector 320 can serve as a port for transmitting and receiving RF signals via various electrical components provided in the first printed circuit board for electrical equipment 206a and the printed circuit board for second electrical equipment 206b. can.

Here, as described later, the arrangement of the signal lines for power supply and data signal transmission by the first interface block connector 310 and the second interface block connector 320 is the switching of parts and failure / repair due to later design changes. It is preferable to standardize so that A / S correspondence such as can be easily performed.

As shown in FIG. 2, an embodiment of the antenna device according to the present invention configured as described above is a heat generating element having the same specifications and specifications (that is, a Main TR of the filter unit unit 100, an electrical unit unit 200). The FPGA 207 provided in the first installation space 201a and the DC power supply module 203 for PSU provided in the second installation space 201b) can be assembled into a subassembly (sub-assembury) together with the filter unit heat dissipation module and the electrical unit heat dissipation module. By being prepared for the above, it is possible to provide an advantage that a platform structure that facilitates A / S correspondence such as switching of parts and failure / repair due to a later design change can be provided. The subassembly of each component as described above can maximize the utilization of the space between the filter unit 100 and the electrical unit 200, and other units added by the design change, as well as the existing assembly process. It can have the advantage that the binding site can be generalized and designed.

This is a first interface block connector 310 and a second interface block that serve as a connection port for power supply and data signals between the filter unit unit 100 and the electrical equipment unit unit 200 provided separately from each other by the air supporter 400. This is possible by applying the common line design with the connector 320.

On the other hand, as shown in FIG. 13, a pair is connected to any one of the filter unit unit 100 and the electrical equipment unit unit 200 so as to facilitate manual transfer by the operator of the antenna device according to the embodiment of the present invention. The handle portion 500 can be connected.

As described above, an embodiment of the antenna device according to the present invention has been described in detail with reference to the attached drawings. However, the examples of the present invention are not necessarily limited to the above-mentioned examples, and various modifications and implementation within an equal range are possible by a person having ordinary knowledge in the technical field to which the present invention belongs. Is natural. Therefore, the true scope of rights of the present invention is determined by the scope of claims described later.

The present invention provides an antenna device in which independent heat radiating units corresponding to a group of heat generating elements having the same specifications and specifications are arranged in a matching manner and have a simpler arrangement structure.

1: Antenna device 100: Filter unit 100a: Filter unit body 107a: Filter printed circuit board 102: Box
103: Box cover 104: RET port 110: Filter unit heat dissipation module 111: Heat trapping plate 112: Heat transfer mediation block 113: First heat dissipation fin portion 114: Heat pipe 115: Second heat dissipation fin portion 200: Electrical unit unit 200a : Electrical unit main body 210: Electrical unit heat dissipation module 220: 1st electrical side heat dissipation unit 230: 2nd electrical equipment side heat dissipation unit 310: 1st interface block connector 320: 2nd interface block connector 400: Air supporter

Claims (12)

A filter unit unit arranged so as to form at least one or more layers, and
An electrical unit unit that is separated and coupled to the filter unit portion so as to form a layer different from that of the filter unit unit and contains various electrical devices.
A filter unit heat dissipation module that is coupled to the opposite surface of the filter unit portion to which the electrical unit portion is coupled and dissipates heat generated from the filter unit portion to the outside.
The heat generated from the first heat generating element, which is coupled to the opposite surface of the electrical unit unit to which the filter unit is bonded and is centrally arranged on one side of the filter unit, is radiated to the outside. A second electrical component that is provided side by side with the 1 electrical component heat dissipation module and the 1st electrical component heat dissipation module and dissipates heat generated from a second heat generation element centrally arranged on the other side of the filter unit section. An antenna device including an electrical component heat-dissipating module including a heat-dissipating module. The first aspect of claim 1, wherein one end of the filter unit and the electrical unit is coupled to the filter unit, and the other end is separated by a plurality of air supporters coupled to the electrical unit. Antenna device. The filter unit unit
A filter unit body with a predetermined installation space on one side,
A signal amplifier printed circuit board (Power Amplifier PCB), which is arranged in the installation space of the filter unit main body and has a plurality of signal amplification elements (Main TR for Power Amplifier) mounted on one surface, and
It includes a printed circuit board for a filter (Filter PCB) which is laminated and arranged at a predetermined distance from the printed circuit board for a signal amplifier and has a plurality of LPFs (Low Pass Filters) arranged in an array on one surface.
The antenna device according to claim 1, wherein two layers are formed via the signal amplifier printed circuit board and the filter printed circuit board. A claim that the filter unit heat dissipation module is coupled to the outside of the filter unit body and is provided to dissipate heat generated from the plurality of signal amplification elements through a heat transfer path penetrating the filter unit body. 3. The antenna device according to 3. The filter unit heat dissipation module is
A heat trapping plate that is adhered to the heat generating surface of each of the plurality of signal amplification elements to collect heat,
A first heat radiating fin portion arranged so as to be in contact with the outer surface of the heat trapping plate and having a plurality of heat radiating fins formed on the outside.
A second heat dissipation fin is arranged so as to be separated from the first heat dissipation fin portion on the outside in the horizontal direction, and a plurality of heat dissipation fins are formed on the outside so that heat is transferred from the first heat dissipation fin portion to dissipate heat over a long distance. With the fins
A heat transfer mediation block to which heat is supplied from the heat trapping plate and transferred to the first heat radiation fin portion,
One end is inserted between the first heat radiation fin portion and the heat transfer mediation block, the other end is connected to the second heat radiation fin portion, and the heat supplied from the heat transfer mediation block is transferred to the first heat transfer mediation block. 2. The antenna device according to claim 4, further comprising a plurality of heat pipes that transmit heat to the heat radiation fin portion. The antenna device according to claim 5, wherein the heat trapping plate and the heat transfer mediation block are made of a copper material. The electrical unit unit
An opening is provided on the filter unit side, and at least two partitioned installation spaces are provided, and any one of the at least two partitioned installation spaces (hereinafter referred to as "first installation space", the remaining installation space). The space is a portion corresponding to a "second installation space"), and a plurality of heat radiation fins are integrally provided on a surface opposite to the surface adjacent to the filter unit portion (hereinafter referred to as "outer surface"). With the main body of the electrical equipment unit
A printed circuit board for first electrical equipment, which is provided in the first installation space of the main body of the electrical equipment unit and has a plurality of FPGAs (Field Programmable Gate Arrays) mounted on one surface facing the outer surface.
A printed circuit board for a second electrical component, which is provided in the second installation space of the main body of the electrical component and has a plurality of DC power supply modules for PSU mounted on one surface facing the outer surface, is included.
The printed circuit board for the first electrical equipment and the printed circuit board for the second electrical equipment are arranged at the same height so as to form one layer (layer), partitioned by the first installation space and the second installation space. The antenna device according to claim 1. The electrical component heat dissipation module is
It is arranged so as to make thermal contact with the plurality of FPGAs through a plurality of heat transfer holes formed by opening in the electrical unit main body, and further outward from the plurality of heat radiation fins formed in the electrical unit main body. The heat dissipation part on the first electrical equipment side, which is arranged apart from each other,
It is coupled to the outer surface of the electrical unit main body so as to close the opening formed by opening the electrical unit main body, and comes into contact with the plurality of PSU DC power supply modules of the first electrical equipment printing circuit board. The antenna device according to claim 7, further comprising a second electrical component side heat radiating unit provided in the above. The first electrical component side heat dissipation unit is
A heat trapping plate that is adhered to the heat generating surface of each of the plurality of FPGAs to collect heat,
A first heat radiating fin portion arranged so as to be in contact with the outer surface of the heat trapping plate and having a plurality of heat radiating fins formed on the outside.
A second heat dissipation fin is arranged so as to be separated from the first heat dissipation fin portion on the outside in the horizontal direction, and a plurality of heat dissipation fins are formed on the outside so that heat is transferred from the first heat dissipation fin portion to dissipate heat over a long distance. With the fins
A heat transfer mediation block to which heat is supplied from the heat trapping plate and transferred to the first heat radiation fin portion,
One end is inserted between the first heat radiation fin portion and the heat transfer mediation block, the other end is connected to the second heat radiation fin portion, and the heat supplied from the heat transfer mediation block is transferred to the first heat transfer mediation block. 2. The antenna device according to claim 8, further comprising a plurality of heat pipes that transmit heat to the heat radiation fin portion. The antenna device according to claim 9, wherein the heat trapping plate and the heat transfer mediation block are made of a copper material. The antenna device according to claim 8, wherein the second electrical component side heat radiating portion is integrally formed with a plurality of radiating fins having the same height as the plurality of radiating fins formed on the outer surface of the electrical unit main body. .. The filter unit unit is provided with at least one filter-side power connection terminal and at least one filter-side signal connection terminal, and the electrical equipment unit unit has at least one electrical component-side power connection terminal and at least one electrical component-side signal connection terminal. Is provided,
The first interface block connector to be coupled while forming a thickness portion on one side so as to interconnect the at least one filter side power connection terminal and the at least one electrical component side power connection terminal.
1. The first aspect of the present invention further includes a second interface block connector that is coupled while forming a thickness portion on the other side so as to interconnect the at least one filter-side signal connection terminal and the at least one electrical component-side signal connection terminal. The antenna device described in.

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