JP2011155049A - Structure for cooling of casing, and base station - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a casing cooling structure, along with a base station, capable of protecting a heat protector by maximally reducing thermal effects from heat generators. <P>SOLUTION: A cooling structure for a casing 2 stores heat generators 5(5a, 5b), 6(6a, 6b) and a heat protector TB and dissipates heat of the heat generators 5, 6 via a wall. Between each heat generator 5, 6 and the heat protector TB, each first heat-transfer plate 14a, 14b is arranged on the side of each heat generator 5, 6 while each first heat-shielding plate 16a, 16b is arranged on the side of the heat protector TB, thereby partitioning each storage space S1 storing each heat generator 5, 6 and a storage space S2 storing the heat protector TB. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a casing having a cooling structure for radiating heat to the outside, and a base station having the casing.

  Conventionally, base stations that relay radio waves of wireless communication devices have been used. The base station has been downsized in recent years, and is often installed outdoors (outer walls of buildings, utility poles, etc.).

For this reason, the casing of the base station has a sealed structure in order to protect electronic devices and the like provided therein from wind and rain. In addition, the base station is provided with a heat generating device such as a power transistor which generates heat up to about 80 ° C. to 100 ° C., for example, with operation.
If the temperature in the housing increases due to the heat generated from the heat generating device, malfunction may occur in the electronic device or the like, which may hinder normal operation of the base station.

  As a method of preventing malfunction of electronic devices due to the heat generated in the base station, a fan is installed inside the base station and the internal air is diffused to form a circulation path inside. A technique is known in which the signal is made uniform and transmitted to the housing (see Patent Document 1).

In the above technique, a fan is mounted inside the base station to diffuse the internal air, thereby efficiently transferring the heat rising in temperature to the casing. The air from the fan is diffused inside the base station, and heat that has reached a substantially uniform temperature is transmitted from the inside to the casing as a whole.
As a result, the heat transferred to the housing is dissipated by coming into contact with external air. This heat conduction is repeated to prevent the internal temperature from rising above a specified level.

Japanese Patent Laid-Open No. 10-002696

As in the conventional case, when the method of diffusing by a fan and transferring the internal heat to the housing as a whole is used, the temperature inside the base station (housing) increases as a whole. is there.
That is, since the heat generating component (heating element) and the other device (thermal protector) are arranged in the same space, as another device, an expensive device that can withstand the temperature rise due to the heat generating component is used. It is necessary to adopt.
For this reason, there has been a demand for a cooling structure for a casing in which other devices (thermal protectors) are not affected by the temperature rise caused by the heat generating components (heat generating elements).

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a casing cooling structure and a base station that can protect the thermal protector by reducing the thermal influence from the heat generator as much as possible.

  The housing cooling structure according to the present invention is a housing cooling structure that houses a heat generator and a heat protector and dissipates heat from the heat generator through a wall, wherein the heat generator and the heat Between the protective bodies, a first heat transfer plate is disposed on the heating element side, and a first heat shield is disposed on the thermal protection body side to accommodate a housing space for housing the heating element and the thermal protection body. It is characterized by partitioning the accommodation space.

  Further, the first heat transfer plate and the first heat shield plate are in close contact with each other.

  In addition, a second heat transfer plate is disposed between the first heat shield plate and the heat protector.

  Further, a second heat shield plate is disposed between the first heat shield plate and the second heat transfer plate.

  Further, the second heat transfer plate and the second heat shield plate are brought into close contact with each other.

  Further, a gas layer is formed between the first heat shield plate and the second heat shield plate.

  In addition, an inert gas is sealed in the gas layer.

  The base station which concerns on this invention is a base station which has a housing | casing which accommodates a heat-emitting device, Comprising: The said cooling structure is used as a cooling structure of a housing | casing, It is characterized by the above-mentioned.

  According to the present invention, the heat generating body and the heat protection body inside the housing are partitioned by the heat transfer plate or the heat shielding plate, and the heat generation body and the heat protection body are stored in the respective separate storage spaces. Can be easily protected by reducing the heat effect from the heating element as much as possible.

It is a schematic sectional drawing of the cooling structure of the housing | casing which concerns on 1st embodiment of this invention, and a base station. It is a schematic sectional drawing of the cooling structure of the housing | casing which concerns on 2nd embodiment of this invention, and a base station. It is a schematic sectional drawing of the cooling structure of the housing | casing which concerns on 3rd embodiment of this invention, and a base station. It is a schematic sectional drawing of the cooling structure of the housing | casing which concerns on 4th embodiment of this invention, and a base station.

  Hereinafter, it attaches to the cooling structure of the housing | casing which concerns on this invention, and a base station, and demonstrates with reference to drawings.

(First embodiment)
The structure of the casing cooling structure and the base station according to the first embodiment of the present invention will be described with reference to FIG. The vertical direction in FIG. 1 is the vertical direction in the base station 1.

  The base station 1 is a device that relays radio waves from a wireless communication device, and is installed outdoors, for example, on an outer wall of a building structure or a utility pole. Connected to the base station 1 are an antenna used for transmission and reception of radio waves, a communication cable used for communication with a central system, a power cable for supplying power to the base station 1 (antenna and cable are not shown). ing.

The casing 2 is a box-shaped member that constitutes the exterior of the base station 1 and is configured to be divided when an electronic device is installed therein. In order to protect the electronic device from wind and rain, a lid is provided. The structure is hermetically sealed (not shown).
The housing | casing 2 and a cover body are shape | molded using metal materials, such as a stainless steel plate which has high heat conductivity, etc. so that the heat | fever inside the housing | casing 2 may be thermally radiated efficiently.

  A plurality of heat radiating fins F1 and F2 are provided on the outer upper and lower surfaces of the housing 2 in order to improve heat dissipation. These radiating fins F1 and F2 are made of the same material as that of the housing 2 and are integrally formed using a casting method such as die casting.

Two electric circuit boards 3 and 4 are attached to the upper and lower wall surfaces inside the housing 2, and a heating device 5 (5 a) that generates heat during operation is attached to the wall surfaces of these electric circuit boards 3 and 4. , 5b) and 6 (6a, 6b) are respectively mounted.
That is, the heat generating devices 5 and 6 are disposed as heat generating elements on the upper and lower portions of the housing 2.

One surface (upper surface) of the heat generating devices 5 and 6 is tightly bonded to the inner wall surface of the housing 2. Thereby, the heat generated in the heat generating devices 5 and 6 is directly conducted to the housing 2 and is radiated (released) to the outside through the heat radiation fins F1 and F2.
The two electric circuit boards 3 and 4 are accommodated, for example, in a state where both ends are supported by a pair of brackets (not shown) protruding inward from the inner side wall of the housing 2.

A thermal protector TB such as a digital unit is disposed between the electric circuit boards 3 and 4 disposed on the upper and lower wall surfaces of the housing 2 (that is, the center of the housing 2). The thermal protector TB includes an electric circuit board 8 and electronic components 10 and 12 that are mounted on the electric circuit board 8 and transmit / receive radio waves to / from a wireless communication device.
The electric circuit board 8 is also supported by a bracket (not shown) protruding inward from the inner wall of the housing 2.

The thermal protection body TB arranged at the center of the housing 2 is an internal space partitioned by the first heat transfer plates 14a and 14b with respect to the heating elements (heating devices 5 and 6) arranged above and below the housing 2. It is accommodated in (accommodating space S2).
That is, the first heat transfer plate 14a is disposed between the electric circuit board 3 on which the heat generating device 5 is mounted and the heat protector TB, and between the electric circuit board 4 on which the heat generating device 6 is mounted and the heat protector TB. The 1st heat exchanger plate 14b is arrange | positioned.

  The outer peripheral ends of the first heat transfer plates 14 a and 14 b are connected to the inner wall of the housing 2 without a gap. In addition, the first heat transfer plates 14a and 14b are arranged in close contact with the first heat shield plates 16a and 16b on the side of the heat protector TB facing each other. The first heat shield plates 16 a and 16 b are arranged with the outer peripheral ends connected to the housing 2.

The material of the first heat transfer plates 14a and 14b is preferably a material (metal) having high thermal conductivity, and for example, copper, brass, aluminum, silver, brass, and the like are preferable.
The material of the first heat shield plates 16a and 16b may be any material having heat insulation properties, and for example, a polystyrene foam or a resin material is preferable. Further, as a material having a low thermal conductivity, for example, fine ceramics, silicon nitride, lead or the like may be used.

  In FIG. 1, the first heat transfer plate 14a and the first heat shield plate 16a, and the first heat shield plate 16b and the first heat shield plate 16b are shown in close contact with each other. However, a slight gap (for example, about 1 mm) may be formed between the first heat transfer plate 14a, the first heat shield plate 16a, and the first heat shield plate 16b and the first heat shield plate 16b.

  As described above, the housing space S2 for housing the thermal protection body TB and the housing space S1 for housing the heating devices 5, 6 and the like, which are heating elements, include the first heat transfer plate 14a, the first heat shield plate 16a, and the first It is partitioned by the heat transfer plate 14b and the first heat shield plate 16b.

In the base station 1 (housing 2) configured as described above, the heat generating devices 5 and 6 mounted on the electric circuit boards 3 and 4 generate heat during operation.
Most of the heat is transmitted directly to the housing 2 and radiated to the outside through the plurality of heat radiation fins F1 and F2.
Moreover, a part of heat generation raises the air temperature in each accommodation space S1. And the heat | fever of the heated air is transmitted (heat transfer) to the side wall of the housing | casing 2 which is in contact with air, or the 1st heat exchanger plates 14a and 14b, and externally passes through several radiation fins F1 and F2. Heat is dissipated.

Furthermore, since the accommodation space S2 in which the thermal protector TB is accommodated is partitioned by the heat shield plates 16a and 16b, the heat transmitted to the first heat transfer plates 14a and 14b is radiated to the accommodation space S2. There is almost no.
Thus, the accommodation space S2 in which the thermal protector TB is accommodated can be kept at normal temperature without being substantially affected by the heat generated by the operation of the heat generating devices 5 and 6.

  Thus, according to the first embodiment, the heat generated from the heat generating devices 5 and 6 is dissipated from the first heat transfer plates 14a and 14b that define the accommodation space S2 in which the thermal protector TB is accommodated, and Similarly, the first heat shield plates 16a and 16b partition the accommodation space S2 in which the thermal protector TB is accommodated. Therefore, the thermal protector TB is protected without being affected by the heat generated from the heat generating devices 5 and 6.

(Second embodiment)
Next, a second embodiment will be described with reference to FIG.
Since the case or base station shown in FIG. 2 has a symmetrical structure in the upper and lower portions, as in the case or base station shown in FIG.
In addition, the following description is abbreviate | omitted about the same part as the component mentioned above.

As shown in FIG. 2, in the base station 20 shown in the second embodiment, as in the first embodiment, the first heat transfer plate 14a (14b) is interposed between the heat generating device 5 (6) and the heat protector TB. ) And the first heat shield plate 16a (16b).
Furthermore, the base station 20 has a configuration in which the second heat transfer plate 22a (22b) is disposed between the first heat transfer plate 14a (14b) and the first heat shield plate 16a (16b) and the heat protector TB. (Only the second heat transfer plate 22a is shown in FIG. 2).

More specifically, the second heat transfer plate 22a (22b) is disposed closer to the heat protector TB than the first heat shield plate 16a (16b), and the outer peripheral end thereof is the inner wall (side wall) of the housing 2. Connected without gaps.
A minute space (about 1 mm) is formed between the second heat transfer plate 22a (22b) and the first heat shield plate 16a (16b). As the second heat transfer plate 22a (22b), the same material as that of the first heat transfer plate 14a (14b) can be used.

  As described above, the housing space S2 for housing the thermal protection body TB and the housing space S1 for housing the heat generating device 5 (6), which is a heat generating body, include the first heat transfer plate 14a (14b), the first heat shield plate It is completely partitioned by 16a (16b) and the second heat transfer plate 22a (22b).

In the base station 20 (housing 2) configured as described above, the heat generating device 5 (6) mounted on the electric circuit board 3 (4) generates heat during operation.
Most of the heat is directly transmitted to the housing 2 and radiated to the outside through the plurality of heat radiation fins F1 (F2).
Part of the heat generation raises the air temperature in the respective accommodation spaces S1. And the heat | fever of the heated air is transmitted (heat transfer) to the side wall of the housing | casing 2 and the 1st heat exchanger plate 14a (14b) which are in contact with air, and via several radiation fin F1 (F2). To dissipate heat.

  Since the accommodation space S2 in which the thermal protector TB is accommodated is partitioned by the heat shield plate 16a (16b), the heat transmitted to the first heat transfer plate 14a (14b) is radiated to the accommodation space S2. There is almost nothing to do.

  Further, even when the heat protector TB (electronic components 10 and 12) generates heat, the second heat transfer plate 22a (22b) is disposed closer to the heat protector TB than the first heat shield plate 16a (16b). Therefore, the heat from the heat protector TB is transmitted to the outside through the second heat transfer plate 22a (22b) and from the housing 2 through the plurality of heat radiation fins F1 (F2).

Thus, the accommodation space S2 in which the thermal protector TB is accommodated can be kept at normal temperature without being substantially affected by the heat generated by the operation of the heat generating device 5 (6).
In addition, since the heat from the heat protector TB is reliably radiated to the outside, the accommodation space S2 in which the heat protector TB is accommodated can continue to maintain a normal temperature.

(Third embodiment)
Next, a third embodiment will be described with reference to FIG.
As shown in FIG. 3, in the base station 30 shown in the third embodiment, the first heat transfer plate 14a (14b) is interposed between the heat generating device 5 (6) and the heat protector TB as in the second embodiment. ), A first heat shield plate 16a (16b) and a second heat transfer plate 22a (22b).
Furthermore, the base station 30 includes the second heat shield plate 14a (14b), the first heat shield plate 16a (16b), the second heat transfer plate 22a (22b) and the second heat shield plate TB. The plate 32a (32b) is arranged (only the second heat shield plate 32a is shown in FIG. 3).

More specifically, the second heat shield plate 32a (32b) is closer to the heat protector TB side than the first heat shield plate 16a (16b), and more heat generating device 5 (6 than the second heat transfer plate 22a (22b). ) Side.
The outer peripheral end of the second heat shield plate 32a (32b) is connected to the inner wall (side wall) of the housing 2 without a gap.

The second heat shield plate 32a (32b) and the second heat transfer plate 22a (22b) may be in close contact with each other, or may be arranged so as to form a minute space (about 1 mm).
As the second heat shield plate 32a (32b), the same material as the first heat shield plate 16a (16b) can be used.

  As described above, the housing space S2 for housing the thermal protection body TB and the housing space S1 for housing the heat generating device 5 (6), which is a heat generating body, include the first heat transfer plate 14a (14b) and the first heat shield plate. It is completely partitioned by 16a (16b), the second heat transfer plate 22a (22b) and the second heat shield plate 32a (32b).

In the base station 30 (housing 2) configured as described above, the heat generating device 5 (6) mounted on the electric circuit board 3 (4) generates heat during operation.
Most of the heat is directly transmitted to the housing 2 and radiated to the outside through the plurality of heat radiation fins F1 (F2).
Part of the heat generation raises the air temperature in the respective accommodation spaces S1. And the heat | fever of the heated air is transmitted (heat transfer) to the side wall of the housing | casing 2 and the 1st heat exchanger plate 14a (14b) which are in contact with air, and via several radiation fin F1 (F2). To dissipate heat.

  Since the accommodation space S2 in which the thermal protector TB is accommodated is partitioned by the heat shield plate 16a (16b), the heat transmitted to the first heat transfer plate 14a (14b) is radiated to the accommodation space S2. There is almost nothing to do.

  Further, even when the heat protector TB (electronic components 10 and 12) generates heat, the second heat transfer plate 22a (22b) is disposed closer to the heat protector TB than the first heat shield plate 16a (16b). Therefore, the heat from the heat protector TB is transmitted to the outside through the second heat transfer plate 22a (22b) and from the housing 2 through the plurality of heat radiation fins F1 (F2).

  Further, since the second heat shield plate 32a (32b) is disposed closer to the heat generating device 5 (6) than the second heat transfer plate 22a (22b), the heat transferred to the second heat transfer plate 22a (22b) is accommodated. Little heat is radiated to the space S1. Similarly, the heat transmitted to the first heat transfer plate 14a (14b) is hardly radiated to the accommodation space S2.

Thus, the accommodation space S2 in which the thermal protector TB is accommodated can be kept at normal temperature without being substantially affected by the heat generated by the operation of the heat generating device 5 (6).
In addition, since the heat from the heat protector TB is reliably radiated to the outside, the accommodation space S2 in which the heat protector TB is accommodated can continue to maintain a normal temperature.
Furthermore, the accommodation space S2 of the thermal protection body TB and the accommodation space S1 of the heat generating device 5 (6) are hardly affected by heat.

(Fourth embodiment)
Next, a fourth embodiment will be described with reference to FIG.
As shown in FIG. 4, the base station 40 shown in the fourth embodiment has the same configuration as that of the third embodiment.
That is, the accommodation space S2 that accommodates the thermal protector TB and the accommodation space S1 that accommodates the heat generating devices 5, 6 and the like include the first heat transfer plates 14a and 14b, the first heat shield plates 16a and 16b, and the second heat transfer plate. Each of the plates 22a and 22b and the second heat shield plates 32a and 32b is completely partitioned.

In the base station 40, the first heat transfer plates 14a, 14b and the first heat shield plates 16a, 16b are in close contact with each other, and the second heat transfer plates 22a, 22b and the second heat shield plates 32a, 32b are in close contact with each other. Yes.
Furthermore, gas layer spaces 42a and 42b are provided between the first heat transfer plates 14a and 14b, the first heat shield plates 16a and 16b, the second heat transfer plates 22a and 22b, and the second heat shield plates 32a and 32b. Forming.

The gas layer spaces 42a and 42b are formed as gas layers filled with gas having high heat insulation properties.
The gas is most preferably air with low thermal conductivity, and more preferably an inert gas. For example, krypton (Kr), xenon (Xe), argon (Ar), and freon are preferable.

The base station 40 has the same operations and effects as the base station 30. That is, in the base station 40, the heat generating devices 5 and 6 mounted on the electric circuit boards 3 and 4 generate heat during operation.
Most of the heat is transmitted directly to the housing 2 and radiated to the outside through the plurality of heat radiation fins F1 and F2.
Part of the heat generation raises the air temperature in the respective accommodation spaces S1. And the heat | fever of the heated air is transmitted (heat transfer) to the side wall of the housing | casing 2 which is in contact with air, or the 1st heat exchanger plates 14a and 14b, and externally passes through several radiation fins F1 and F2. Heat is dissipated.

  And since the accommodation space S2 in which the thermal protection body TB is accommodated is partitioned by the heat shield plates 16a and 16b, the heat transmitted to the first heat transfer plates 14a and 14b is radiated to the accommodation space S2. There is almost no.

  Further, even when the heat protector TB (electronic components 10 and 12) generates heat, the second heat transfer plates 22a and 22b are arranged closer to the heat protector TB than the first heat shield plates 16a and 16b. The heat from the heat protector TB is transferred to the outside through the second heat transfer plates 22a and 22b and from the housing 2 through the plurality of heat radiation fins F1 and F2.

  Further, since the second heat shield plates 32a and 32b are arranged on the heat generating devices 5 and 6 side of the second heat transfer plates 22a and 22b, the heat transmitted to the second heat transfer plates 22a and 22b is radiated to the accommodation space S1. There is little to be done. Similarly, the heat transmitted to the first heat transfer plates 14a and 14b is hardly radiated to the accommodation space S2.

  Furthermore, in the base station 40, heat insulation is provided between the first heat transfer plates 14a and 14b, the first heat shield plates 16a and 16b, the second heat transfer plates 22a and 22b, and the second heat shield plates 32a and 32b. Since the gas layer spaces 42a and 42b having a high height are formed, the accommodation space S1 and the accommodation space S2 are hardly affected by heat.

Thus, the accommodation space S2 in which the thermal protector TB is accommodated can be kept at normal temperature without being substantially affected by the heat generated by the operation of the heat generating devices 5 and 6.
In addition, since the heat from the heat protector TB is reliably radiated to the outside, the accommodation space S2 in which the heat protector TB is accommodated can continue to maintain a normal temperature.

  Note that the operation procedure shown in the above-described embodiment, various shapes and combinations of the constituent members, and the like are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, the heat generating device 5 and the electric circuit board 3 may be a power amplifier (heating element), and the heat generating device 6 and the electric circuit board 4 may be a power supply unit (heating element).

1, 20, 30, 40 ... base station
2 ... Case
3, 4, 8 ... Electric circuit board
5 (5a, 5b), 6 (6a, 6b) ... heating device (heating element)
14a, 14b ... first heat transfer plate
16a, 16b ... first heat shield
22a, 22b ... second heat transfer plate
32a, 32b ... second heat shield
42a, 42b ... gas layer space (gas layer)
TB ... Thermal protector
S1 ... Accommodating space (accommodating space for accommodating a heating element)
S2 ... Accommodating space (accommodating space for accommodating the thermal protector)

Claims (8)

A housing cooling structure that houses a heating element and a heat protection body and radiates heat of the heating element through a wall,
Between the heating element and the thermal protector, a first heat transfer plate is disposed on the heating element side and a first heat shield plate is disposed on the thermal protector side, and a housing space for housing the heating element, and A cooling structure for a housing, characterized by partitioning a housing space for housing a thermal protector.   The casing cooling structure according to claim 1, wherein the first heat transfer plate and the first heat shield plate are in close contact with each other.   The casing cooling structure according to claim 1, wherein a second heat transfer plate is disposed between the first heat shield plate and the thermal protector.   The cooling structure for a housing according to claim 3, wherein a second heat shield plate is disposed between the first heat shield plate and the second heat transfer plate.   The casing cooling structure according to claim 4, wherein the second heat transfer plate and the second heat shield plate are in close contact with each other.   The casing cooling structure according to claim 4, wherein a gas layer is formed between the first heat shield plate and the second heat shield plate.   The casing cooling structure according to claim 6, wherein an inert gas is sealed in the gas layer. A base station having a housing for accommodating a heat generating device,
A base station using the cooling structure according to claim 1 as the cooling structure of the casing.

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