JP2022506489A - 水素化反応用触媒及びこれの製造方法 - Google Patents
水素化反応用触媒及びこれの製造方法 Download PDFInfo
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- JP2022506489A JP2022506489A JP2021523886A JP2021523886A JP2022506489A JP 2022506489 A JP2022506489 A JP 2022506489A JP 2021523886 A JP2021523886 A JP 2021523886A JP 2021523886 A JP2021523886 A JP 2021523886A JP 2022506489 A JP2022506489 A JP 2022506489A
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- catalyst
- nickel
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- hydrogenation reaction
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- 238000005984 hydrogenation reaction Methods 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000007809 chemical reaction catalyst Substances 0.000 title claims description 3
- 239000003054 catalyst Substances 0.000 claims abstract description 151
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 145
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 72
- 239000002245 particle Substances 0.000 claims abstract description 46
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 45
- 238000000034 method Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 230000009467 reduction Effects 0.000 claims abstract description 21
- 239000013078 crystal Substances 0.000 claims abstract description 20
- 239000001257 hydrogen Substances 0.000 claims abstract description 20
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 20
- 238000001914 filtration Methods 0.000 claims abstract description 13
- 239000011347 resin Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 46
- 239000003208 petroleum Substances 0.000 claims description 45
- 238000001556 precipitation Methods 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
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- 239000002243 precursor Substances 0.000 claims description 8
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- 230000003213 activating effect Effects 0.000 claims description 2
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- 238000001354 calcination Methods 0.000 claims description 2
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- 230000000694 effects Effects 0.000 abstract description 43
- 238000009826 distribution Methods 0.000 abstract description 15
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 14
- 239000000843 powder Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
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- 238000012360 testing method Methods 0.000 description 8
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- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
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- 230000007423 decrease Effects 0.000 description 4
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- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
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- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
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- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000012018 catalyst precursor Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- -1 ethylene, propylene, butylene Chemical group 0.000 description 2
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- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000002816 nickel compounds Chemical class 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 239000003209 petroleum derivative Substances 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical group C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
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- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 1
- UPIXZLGONUBZLK-UHFFFAOYSA-N platinum Chemical compound [Pt].[Pt] UPIXZLGONUBZLK-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
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- 229910052703 rhodium Inorganic materials 0.000 description 1
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- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
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- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
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Abstract
Description
300m2/gの表面積と21nmの気孔サイズ、4μmの平均粒子サイズを持つ多孔性シリカ粉末1gと塩化ニッケル(75g/L ニッケル)及び塩化銅(1.0g/L 銅)を蒸留水に溶解した溶液40mlを沈殿容器に入れて攪拌しながら80℃に昇温した。80℃到達後炭酸ナトリウム(144g/L)溶液40mLをsyringe pumpを利用して1時間以内全部注入した。沈殿完了後スラリーのpHは7.5であったし、これを約1.5Lの蒸留水で洗浄及び濾過した後乾燥オーブンを利用して120℃で8時間以上乾燥した。これを小分けした後水素雰囲気で400℃の温度で還元して活性化した。活性化された触媒は1%酸素が含まれた窒素混合ガスを利用して不動化して水素化触媒を製造した触媒製造原料中ニッケル対シリカ質量比は3.0であり、銅対シリカ質量比は0.04であった。
310m2/gの表面積と25nmの気孔サイズ、7μmの平均粒子サイズを持つ多孔性シリカ粉末37.5gと硫酸ニッケル(497.1g/L)及び硫酸銅(4.06g/L)を蒸留水に溶解した溶液1875mLを沈殿容器に入れて攪拌しながら80℃に昇温した。80℃到達後炭酸ナトリウム(174.6g/L)溶液1500mLをsyringe pumpを利用して1時間以内全部注入した。沈殿完了後スラリーのpHは7.5であったし、これを約5Lの蒸留水で洗浄及び濾過した後乾燥オーブンを利用して100℃で8時間以上乾燥した。これを小分けした後水素雰囲気で400℃の温度で還元して活性化した。活性化された触媒は1%酸素が含まれた窒素混合ガスを利用して不動化して水素化触媒を製造した。触媒製造原料中ニッケル対シリカ質量比は3.0であり、銅対シリカ質量比は0.04であった。
還元温度を420℃に変更したことを除いては実施例2と同一な方法で水素化触媒を製造した。
還元温度を440℃に変更したことを除いては実施例2と同一な方法で水素化触媒を製造した。
300m2/gの表面積と21nmの気孔サイズを持つ多孔性シリカ粉末1gと硝酸ニッケル(75g/Lニッケル)を蒸留水に溶解した溶液40mLを沈殿容器に入れて攪拌しながら80℃に昇温した。80℃到達後炭酸ナトリウム(144g/L)溶液40mLをsyringe pumpを利用して1時間以内全部注入した。沈殿完了後スラリーのpHは7.5であったし、これを約1.5Lの蒸留水で洗浄及び濾過した後乾燥オーブンを利用して120℃で8時間以上乾燥した。これを小分けした後水素雰囲気で400℃の温度で還元して活性化した。活性化された触媒は1%酸素が含まれた窒素混合ガスを利用して不動化して水素化触媒を製造した。触媒製造原料中ニッケル対シリカ質量比は3.0であった。
300m2/gの表面積と21nmの気孔サイズを持つ多孔性シリカ粉末1gと硝酸ニッケル(85g/L ニッケル)及び硝酸マグネシウム(2.1g/L マグネシウム)を蒸留水に溶解した溶液40mLを沈殿容器に入れて攪拌しながら80℃に昇温した。80℃到達後炭酸ナトリウム(144g/L)溶液40mLをsyringe pumpを利用して1時間以内全部注入した。沈殿完了後スラリーのpHは7.5であったし、これを約1.5Lの蒸留水で洗浄及び濾過した後乾燥オーブンを利用して120℃で8時間以上乾燥した。これを小分けした後水素雰囲気で400℃の温度で還元して活性化した。活性化された触媒は1%酸素が含まれた窒素混合ガスを利用して不動化して水素化触媒を製造した。触媒製造原料中ニッケル対シリカ質量比は3.4であり、マグネシウム対シリカ質量比は0.084であった。
硝酸ニッケル(75g/L ニッケル)及び珪酸ナトリウム(50g/L 珪素)を蒸留水に溶解した溶液40mLを沈殿容器に入れて攪拌しながら80℃に昇温した。80℃到達後炭酸ナトリウム(144g/L)溶液40mLをsyringe pumpを利用して1時間以内全部注入した。沈殿完了後スラリーを約1.5Lの蒸留水で洗浄及び濾過した後乾燥オーブンを利用して120℃で8時間以上乾燥した。これを小分けした後水素雰囲気で400℃の温度で還元して活性化した。活性化された触媒は1%酸素が含まれた窒素混合ガスを利用して不動化して水素化触媒を製造した。触媒製造原料中ニッケル対シリカ質量比は3.0である。
下記の[表1]では実施例1及び比較例1~4の触媒組成物内ニッケルの含量、促進剤種類と含量及び還元温度、ニッケル結晶サイズを表した。
Hollow shaft攪拌機を含めて1600rpmの攪拌速度を持つ300mLオートクレーブを利用した。
Hollow shaft攪拌機を含めて1600rpmの攪拌速度を持つ300mLオートクレーブを利用した。
Hollow shaft攪拌機を含めて1200rpmの攪拌速度を持つ300mLオートクレーブを利用した。
Hollow shaft攪拌機を含めて1200rpmの攪拌速度を持つ300mLオートクレーブを利用した。
下記の[表6]では実施例1~4の触媒組成物内ニッケルの含量、還元温度、比表面積、ニッケル結晶サイズ、不動化層除去の後、還元度及び平均粒子サイズを表した。
非水添石油樹脂をExxsol D40に60重量%で溶解した溶液30gに触媒を0.36gを入れて、homogenizerを利用して18,000rpmで1時間の間粉砕した。粉砕後溶液一部を小分けして触媒の粒子サイズを測定した。粒度分布測定結果は[図1]及び[表7]に表した。
ジョイント連結型solid suspension濾過装置に気孔サイズが0.5μmあるフィルターペーパーを入れて締結した後、真空ポンプを利用して濾過装置のフラスコ内圧力を100mbarに維持した。
Claims (12)
- 触媒全体100重量部に対して、触媒活性成分でニッケル40~80重量部、促進剤で銅0.01~5重量部及びシリカ担体10~30重量部を含む水素化反応用触媒。
- 前記ニッケルの結晶サイズは3~8nmである、請求項1に記載の水素化反応用触媒。
- 前記触媒は不動化層の除去の後、還元度が80%以上である、請求項1に記載の水素化反応用触媒。
- 前記触媒の平均粒子サイズ(d50)は3~10μmであり、粒子サイズが1μm以下である触媒の体積比率が10%以下である、請求項1に記載の水素化反応用触媒。
- 前記触媒は表面積が150~300m2/gである、請求項1に記載の水素化反応用触媒。
- 前記シリカ担体は比表面積が200~400m2/gであり、平均粒子サイズが3~10μmである、請求項1に記載の水素化反応用触媒。
- 溶液内ニッケルの重量濃度(g/L)が25~250になるようにニッケル前駆体を溶媒に溶解して第1溶液を製造する段階;
溶液内銅の重量濃度(g/L)が0.01~5になるように第1溶液に銅前駆体を添加して第2溶液を製造する段階;
溶液内シリカの重量濃度(g/L)が10~40になるように第2溶液にシリカ担体を入れて分散させて第3溶液を製造する段階;
第3溶液を沈殿容器に入れて攪拌しながら50~120℃に昇温する段階;
前記昇温された第3溶液にpH調節剤を添加して前記ニッケル及び銅前駆体は沈殿を形成して前記固体シリカ担体に沈積する段階;
前記担持触媒を洗浄及び濾過した後100~200℃で5~24時間乾燥する段階;
乾燥された触媒を空気中で200~500℃温度に焼成する段階;及び
前記焼成された触媒を水素雰囲気で200~500℃温度で還元して活性化する段階を含む水素化反応用触媒の製造方法。 - 前記活性化する段階以後触媒を不動化する段階を更に含む、請求項7に記載の水素化反応用触媒の製造方法。
- 前記不動化は0.1~20%酸素が含まれた窒素混合ガスで不動化することを特徴とする、請求項8に記載の水素化反応用触媒の製造方法。
- 前記活性化する段階以後石油樹脂が含まれた溶液に沈積して不動化する段階を更に含む、請求項7に記載の石油樹脂の水素化触媒の製造方法。
- 前記沈殿は7~9のpHで行われる、請求項7に記載の石油樹脂の水素化触媒の製造方法。
- 石油樹脂の水素化方法であって、石油樹脂を前記請求項7~11のいずれか一項に記載の製造方法で製造された触媒の存在下で水素と接触させる石油樹脂の水素化方法。
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