JP2022503965A - マイクロ波回路用の信号コネクタ - Google Patents
マイクロ波回路用の信号コネクタ Download PDFInfo
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- JP2022503965A JP2022503965A JP2021517811A JP2021517811A JP2022503965A JP 2022503965 A JP2022503965 A JP 2022503965A JP 2021517811 A JP2021517811 A JP 2021517811A JP 2021517811 A JP2021517811 A JP 2021517811A JP 2022503965 A JP2022503965 A JP 2022503965A
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- 239000000203 mixture Substances 0.000 description 4
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- 239000004065 semiconductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
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- JDZUWXRNKHXZFE-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl JDZUWXRNKHXZFE-UHFFFAOYSA-N 0.000 description 2
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- 230000005281 excited state Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N10/00—Quantum computing, i.e. information processing based on quantum-mechanical phenomena
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/048—Superconductive coils
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/10—Junction-based devices
- H10N60/12—Josephson-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/805—Constructional details for Josephson-effect devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Analysis (AREA)
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- Containers, Films, And Cooling For Superconductive Devices (AREA)
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Abstract
Description
Claims (17)
- マイクロ波回路用の信号コネクタであって、
伝送線路の第1のセットを受け入れるように構成された、第1の希釈冷凍機ステージ内の第1の高密度インターフェースと、
伝送線路の第2のセットを受け入れるように構成された、第2の希釈冷凍機ステージ内の第2の高密度インターフェースと、
第1の希釈冷凍機ステージと前記第2の希釈冷凍機ステージとの間でマイクロ波信号を転送させるように構成されたプリント回路基板であって、前記第1の高密度インターフェースおよび前記第2の高密度インターフェースは、前記プリント回路基板に結合される、前記プリント回路基板と
を備える信号コネクタ。 - 前記第1の希釈冷凍機ステージと前記第2の希釈冷凍機ステージとの間でマイクロ波信号を転送させるように構成された第2のプリント回路基板
をさらに備える請求項1に記載の信号コネクタ。 - 前記第2のプリント回路基板は、前記プリント回路基板に結合される、請求項2に記載の信号コネクタ。
- 前記プリント回路基板は、
マイクロ波信号を運ぶように構成されたビアのセットであって、対応するマイクロ波信号の波長の約10分の1の長さを有する、前記ビアのセット
をさらに備える、請求項1に記載の信号コネクタ。 - 前記ビアのセットは、前記第1の高密度インターフェースと前記第2の高密度インターフェースとの間でマイクロ波信号を運ぶように構成される、請求項4に記載の信号コネクタ。
- 前記プリント回路基板は、
接地ビアのセットをさらに備え、前記接地ビアの各々は、前記プリント回路基板上で、各信号ビアから、およそ、対応するマイクロ波信号の波長の長さだけ間隔が空けられている、
請求項4に記載の信号コネクタ。 - 伝送線路の前記第1のセットは、20個の伝送線路である、請求項1に記載の信号コネクタ。
- 前記プリント回路基板は、交互の誘電体層と導電層とを備える、請求項1に記載の信号コネクタ。
- 前記プリント回路基板は、希釈冷凍機の見通し線ポート内に配置されるように構成される、請求項1に記載の信号コネクタ。
- 伝送線路の第1のセットを第1の高密度インターフェースに接続することであって、前記第1の高密度インターフェースは第1の希釈冷凍機ステージ内にあり、
伝送線路の第2のセットを第2の高密度インターフェースに接続することであって、前記第2の高密度インターフェースは第2の希釈冷凍機ステージ内にあり、
前記第1の高密度インターフェースおよび前記第2の高密度インターフェースは、プリント回路基板に結合されており、前記プリント回路基板上で、前記第1の希釈冷凍機ステージと前記第2の希釈冷凍機ステージとの間で、マイクロ波信号のセットを転送させること
を含む方法。 - 第2のプリント回路基板上で、前記第1の希釈冷凍機ステージと前記第2の希釈冷凍機ステージとの間で、マイクロ波信号の第2のセットを転送させること
をさらに含む、請求項10に記載の方法。 - 前記第2のプリント回路基板は、前記プリント回路基板に結合される、請求項11に記載の方法。
- 前記プリント回路基板は、
マイクロ波信号を運ぶように構成されたビアのセットをさらに備え、前記ビアのセットは、対応するマイクロ波信号の波長の約10分の1の長さを有する、請求項10に記載の方法。 - 前記ビアのセットは、前記第1の高密度インターフェースと前記第2の高密度インターフェースとの間でマイクロ波信号を運ぶように構成される、請求項13に記載の方法。
- 前記プリント回路基板は、
接地ビアのセットをさらに備え、前記接地ビアの各々は、前記プリント回路基板上で、各信号ビアから、およそ、対応するマイクロ波信号の波長の長さだけ間隔が空けられている、請求項13に記載の方法。 - 伝送線路の前記第1のセットは、20個の伝送線路である、請求項10に記載の方法。
- 請求項10ないし16のいずれかに記載の方法の各ステップを実行する回路組立システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/186,157 US10891251B2 (en) | 2018-11-09 | 2018-11-09 | Signal connector for microwave circuits |
US16/186,157 | 2018-11-09 | ||
PCT/EP2019/079643 WO2020094474A1 (en) | 2018-11-09 | 2019-10-30 | Signal connector for microwave circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022503965A true JP2022503965A (ja) | 2022-01-12 |
JP7315666B2 JP7315666B2 (ja) | 2023-07-26 |
Family
ID=68468677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021517811A Active JP7315666B2 (ja) | 2018-11-09 | 2019-10-30 | マイクロ波回路用の信号コネクタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US10891251B2 (ja) |
EP (1) | EP3878252A1 (ja) |
JP (1) | JP7315666B2 (ja) |
CN (1) | CN112997594A (ja) |
WO (1) | WO2020094474A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04363079A (ja) * | 1991-02-06 | 1992-12-15 | Fujitsu Ltd | 多層フィルムケーブル及びこれを用いた超伝導素子搭載装置 |
JPH07122788A (ja) * | 1993-10-22 | 1995-05-12 | Sumitomo Electric Ind Ltd | 低温に冷却する素子の接続方法 |
US20180102470A1 (en) * | 2016-10-11 | 2018-04-12 | Massachusetts Institute Of Technology | Cryogenic electronic packages and assemblies |
US20190006572A1 (en) * | 2017-06-29 | 2019-01-03 | Intel Corporation | Shielded interconnects |
JP2021532579A (ja) * | 2018-07-27 | 2021-11-25 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 統合型マイクロ波減衰器を有する多数の伝送ラインを備えた極低温デバイス |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0105923D0 (en) | 2001-03-09 | 2001-04-25 | Oxford Instr Superconductivity | Dilution refrigerator |
EP1474822B1 (en) | 2002-01-17 | 2016-12-07 | Ardent Concepts, Inc. | Compliant electrical contact |
US20040238213A1 (en) * | 2003-05-28 | 2004-12-02 | Pitio Walter Michael | Uniform impedance printed circuit board |
KR100854267B1 (ko) | 2006-08-08 | 2008-08-26 | 정운영 | 포고핀의 제조방법과, 이를 이용한 테스트 소켓 |
US8441329B2 (en) | 2007-01-18 | 2013-05-14 | D-Wave Systems Inc. | Input/output system and devices for use with superconducting devices |
US8464542B2 (en) * | 2007-12-28 | 2013-06-18 | D-Wave Systems Inc. | Systems, methods, and apparatus for cryogenic refrigeration |
US8279022B2 (en) | 2008-07-15 | 2012-10-02 | D-Wave Systems Inc. | Input/output systems and devices for use with superconducting devices |
US20140137571A1 (en) * | 2012-11-21 | 2014-05-22 | D-Wave Systems Inc. | Systems and methods for cryogenic refrigeration |
WO2014204447A1 (en) * | 2013-06-18 | 2014-12-24 | Intel Corporation | Integrated thermoelectric cooling |
ES2703115T3 (es) * | 2014-02-06 | 2019-03-07 | Orolia Switzerland Sa | Dispositivo para un reloj atómico |
US9892365B2 (en) | 2014-02-28 | 2018-02-13 | Rigetti & Co., Inc. | Operating a multi-dimensional array of qubit devices |
EP3120460B1 (en) | 2014-03-21 | 2020-10-14 | Google LLC | Chips including classical and quantum computing processors |
US10242968B2 (en) * | 2015-11-05 | 2019-03-26 | Massachusetts Institute Of Technology | Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages |
WO2017111949A1 (en) | 2015-12-22 | 2017-06-29 | Rigetti & Co., Inc. | Operating a coupler device to perform quantum logic gates |
US10565515B2 (en) * | 2018-06-20 | 2020-02-18 | Intel Corporation | Quantum circuit assemblies with triaxial cables |
-
2018
- 2018-11-09 US US16/186,157 patent/US10891251B2/en active Active
-
2019
- 2019-10-30 CN CN201980072373.0A patent/CN112997594A/zh active Pending
- 2019-10-30 WO PCT/EP2019/079643 patent/WO2020094474A1/en unknown
- 2019-10-30 EP EP19798213.5A patent/EP3878252A1/en active Pending
- 2019-10-30 JP JP2021517811A patent/JP7315666B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04363079A (ja) * | 1991-02-06 | 1992-12-15 | Fujitsu Ltd | 多層フィルムケーブル及びこれを用いた超伝導素子搭載装置 |
JPH07122788A (ja) * | 1993-10-22 | 1995-05-12 | Sumitomo Electric Ind Ltd | 低温に冷却する素子の接続方法 |
US20180102470A1 (en) * | 2016-10-11 | 2018-04-12 | Massachusetts Institute Of Technology | Cryogenic electronic packages and assemblies |
US20190006572A1 (en) * | 2017-06-29 | 2019-01-03 | Intel Corporation | Shielded interconnects |
JP2021532579A (ja) * | 2018-07-27 | 2021-11-25 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 統合型マイクロ波減衰器を有する多数の伝送ラインを備えた極低温デバイス |
Also Published As
Publication number | Publication date |
---|---|
JP7315666B2 (ja) | 2023-07-26 |
WO2020094474A1 (en) | 2020-05-14 |
US20200151133A1 (en) | 2020-05-14 |
CN112997594A (zh) | 2021-06-18 |
US10891251B2 (en) | 2021-01-12 |
EP3878252A1 (en) | 2021-09-15 |
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