JP2022500877A - 電子アセンブリ - Google Patents
電子アセンブリ Download PDFInfo
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- JP2022500877A JP2022500877A JP2021515018A JP2021515018A JP2022500877A JP 2022500877 A JP2022500877 A JP 2022500877A JP 2021515018 A JP2021515018 A JP 2021515018A JP 2021515018 A JP2021515018 A JP 2021515018A JP 2022500877 A JP2022500877 A JP 2022500877A
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- 239000000758 substrate Substances 0.000 claims abstract description 198
- 239000004065 semiconductor Substances 0.000 claims abstract description 122
- 239000003351 stiffener Substances 0.000 claims abstract description 9
- 238000003491 array Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 9
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/188—Mounting of power supply units
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- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
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Abstract
Description
Claims (24)
- 電子アセンブリであって、
第1の表面、および前記第1の表面とは反対側の第2の表面を備える基板であって、前記基板は、複数の基板インターコネクトをさらに含む、基板と、
前記基板の前記第1の表面上へ実装される複数の半導体ダイであって、前記複数の半導体ダイは、前記複数の基板インターコネクトを介して互いに電気接続される、複数の半導体ダイと、
前記基板の前記第2の表面上へ実装される複数の電源モジュールであって、前記各電源モジュールは、個々の半導体ダイとは反対側へ配置される、複数の電源モジュールと、
前記基板へ結合される複数の補剛部材と、
を備える、電子アセンブリ。 - 前記各補剛部材は、
前記基板の前記第1の表面上へ配置される第1の補剛部分と、
前記基板の前記第2の表面上へ配置される第2の補剛部分と、を備える、請求項1に記載の電子アセンブリ。 - 前記各補剛部材は、前記補剛部材の長手方向軸を通り抜ける貫通穴を備える中空の円筒形状を有する、請求項1に記載の電子アセンブリ。
- 前記各補剛部材は、さらに、前記補剛部材の内部を通り抜けるボルトまたはねじを備える、請求項1に記載の電子アセンブリ。
- 前記補剛部材は、ボルトであり、かつ該ボルトは、ナットで所定位置に維持される、請求項4に記載の電子アセンブリ。
- 前記基板の前記第1の表面上へ配置される複数の第1のインターコネクトをさらに備え、前記複数の第1のインターコネクトは、個々の半導体ダイを前記基板へ電気接続する、請求項1に記載の電子アセンブリ。
- 前記基板の前記第2の表面上へ実装される複数の電気コネクタをさらに備え、前記各電気コネクタは、個々の電源モジュールを前記基板へ着脱式に接続する、請求項1に記載の電子アセンブリ。
- 前記基板の前記第2の表面上へ配置される複数の第2のインターコネクトをさらに備え、前記複数の第2のインターコネクトは、個々の電気コネクタを前記基板へ電気接続する、請求項7に記載の電子アセンブリ。
- 前記複数の第2のインターコネクトは、ボール・グリッド・アレイである、請求項8に記載の電子アセンブリ。
- 前記各電気コネクタは、
前記複数の第2のインターコネクトへ電気接続されるインターポーザと、
前記個々の電源モジュールへ着脱式に接続されるソケットと、を備える、請求項8に記載の電子アセンブリ。 - 前記複数の第1のインターコネクトは、バンプである、請求項1に記載の電子アセンブリ。
- 前記基板を別の基板へ電気接続する外部インターコネクトをさらに備える、請求項1に記載の電子アセンブリ。
- 前記各補剛部材は、
前記基板の前記第1の表面上へ配置される第1の補剛部分と、
前記基板の前記第2の表面上へ配置される第2の補剛部分と、を備える、請求項1に記載の電子アセンブリ。 - 前記各補剛部材は、前記基板へ締結具アセンブリによって結合される、請求項1に記載の電子アセンブリ。
- 電子アセンブリであって、
第1の表面、および前記第1の表面とは反対側の第2の表面を備える基板であって、前記基板は、複数の基板インターコネクトをさらに備える、基板と、
前記基板の前記第1の表面上へ実装される複数の半導体ダイであって、前記複数の半導体ダイは、前記複数の基板インターコネクトを介して互いに電気接続される、複数の半導体ダイと、
前記基板の前記第2の表面上へ実装される複数の電気コネクタであって、前記各電気コネクタは、個々の半導体ダイとは反対側へ配置される、複数の電気コネクタと、
前記複数の半導体ダイに対応する複数の電源モジュールであって、前記各電源モジュールは、個々の電気コネクタへ着脱式に接続される、複数の電源モジュールと、
前記基板へ結合される複数の補剛部材と、
を備える、電子アセンブリ。 - 前記基板の前記第1の表面上へ配置される複数の第1のインターコネクトをさらに備え、前記複数の第1のインターコネクトは、個々の半導体ダイを前記基板へ電気接続する、請求項15に記載の電子アセンブリ。
- 前記基板の前記第2の表面上へ配置される複数の第2のインターコネクトをさらに備え、前記複数の第2のインターコネクトは、個々の電気コネクタを前記基板へ電気接続する、請求項15に記載の電子アセンブリ。
- 前記各電気コネクタは、
前記複数の第2のインターコネクトへ電気接続されるインターポーザと、
個々の電源モジュールへ着脱式に接続されるソケットと、を備える、請求項17に記載の電子アセンブリ。 - 前記基板を別の基板へ電気接続する外部インターコネクトをさらに備える、請求項15に記載の電子アセンブリ。
- 前記各補剛部材は、
前記基板の前記第1の表面上へ配置される第1の補剛部分と、
前記基板の前記第2の表面上へ配置される第2の補剛部分と、を備える、請求項15に記載の電子アセンブリ。 - 電子アセンブリであって、
第1の表面、および前記第1の表面とは反対側の第2の表面を備える基板であって、前記基板は、複数の基板インターコネクトをさらに備える、基板と、
前記基板の前記第1の表面上へ実装される複数の半導体ダイであって、前記複数の半導体ダイは、前記複数の基板インターコネクトを介して互いに電気接続される、複数の半導体ダイと、
前記基板の前記第2の表面上へ実装される複数の電気コネクタであって、前記各電気コネクタは、個々の半導体ダイとは反対側へ配置される、複数の電気コネクタと、
前記複数の半導体ダイに対応する複数の電源モジュールであって、前記各電源モジュールは、個々の電気コネクタへ着脱式に接続される、複数の電源モジュールと、
前記基板へ結合される複数の補剛部材であって、前記各補剛部材は、前記基板の前記第1の表面上へ配置される第1の補剛部分と、前記基板の前記第2の表面上へ配置される第2の補剛部分とを備える、複数の補剛部材と、
を備える、電子アセンブリ。 - 前記基板の前記第2の表面上へ配置される複数の第2のインターコネクトをさらに備え、前記複数の第2のインターコネクトは、個々の電気コネクタを前記基板へ電気接続する、請求項21に記載の電子アセンブリ。
- 前記各電気コネクタは、
前記複数の第2のインターコネクトへ電気接続されるインターポーザと、
個々の電源モジュールへ着脱式に接続されるソケットと、を備える、請求項22に記載の電子アセンブリ。 - 前記基板を別の基板へ電気接続する外部インターコネクトをさらに備える、請求項21に記載の電子アセンブリ。
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