JP2022191406A - Optimized low-energy/high-productivity deposition system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce, in a total time each substrate remains in a process module, the time occupied by a delay time associated with rotating and transferring the substrate with a mechanical indexer.

SOLUTION: In a substrate processing tool, a process module 200 includes a mechanical indexer 204 for a substrate processing tool, the mechanical indexer including first and second arms each having first and second end effectors. The first arm 208 is configured to rotate on a first spindle and to selectively position the first end effector 216 of the first arm at a plurality of processing stations of the substrate processing tool. The second arm 212 is configured to rotate on a second spindle and to selectively position the first end effector 224 of the second arm at the plurality of processing stations 1 to 4 of the substrate processing tool. The first arm 208 is configured to rotate independently of the second arm 212.

SELECTED DRAWING: Figure 2A

COPYRIGHT: (C)2023,JPO&INPIT

Description

CROSS REFERENCE TO RELATED APPLICATIONS This application claims the benefit of US Provisional Application No. 62/449,325, filed January 23, 2017. The entire disclosure of the above application is incorporated herein by reference.

The present disclosure relates to transferring substrates within a substrate processing system processing module.

The background description provided herein is for the purpose of generally presenting the background of the present disclosure. The work of the inventors named herein, to the extent described in this background, is expressly or impliedly with respect to this disclosure, together with aspects of the description that are not generally considered prior art at the time of filing. Not recognized as prior art.

Substrate processing systems may be utilized to perform deposition, etching, and/or other processing of substrates such as semiconductor wafers. During processing, a substrate is placed on a substrate support within a processing chamber of a substrate processing system. A gas mixture containing one or more precursors can be introduced into the processing chamber and a plasma can be ignited to activate chemical reactions. A substrate processing system may include a plurality of substrate processing tools arranged within a fabrication chamber. Each of the substrate processing tools may comprise multiple processing modules.

Referring now to FIG. 1, a top view of an example substrate processing tool 100 is shown. The substrate processing tool 100 may comprise multiple processing modules 104 . Each of the processing modules 104 may be configured to perform one or more respective processes on the substrate. Substrates to be processed are loaded into the substrate processing tool 100 through the load station port of the equipment front end module (EFEM) 108 and then transferred to one or more of the processing modules 104 . For example, substrates may be transferred from EFEM 108 to loadlock 112 via one or more EFEM robots 116 . A vacuum transfer module (VTM) 120 includes one or more VTM robots 124 configured to move substrates into and out of the processing module 104 . For example, substrates can be sequentially loaded into each of the processing modules 104 .

In one example, the processing module 104 corresponds to a quad station process module (QSM). A QSM may include four processing stations 128 within a single chamber (ie, within processing chamber 132 of processing module 104). Substrate 136 is loaded into processing module 104 via load station 140 . For example, substrates 136 are transferred between VTM 120 and load station 140 via respective slots 144 between VTM 120 and processing module 104 . A mechanical indexer 148 (ie, an indexing mechanism) sequentially rotates the substrate 136 between multiple processing stations 128 . As shown, the mechanical indexer 148 corresponds to a cruciform spindle. For example, substrate 136 is transferred from VTM 120 to processing station 128 corresponding to load station 140 (labeled "1") and rotated sequentially between processing stations 140 labeled "2", "3", and "4". and then returned to load station 140 for removal from processing module 104 . A system controller 152 may control various movements of the tool including, but not limited to, movement of robots 116 and 124, rotation of indexer 148, and the like.

A mechanical indexer for a substrate processing tool includes first and second arms each having first and second end effectors. The first arm selectively positions the first end effector of the first arm at the plurality of processing stations of the substrate processing tool and selectively positions the second end effector of the first arm at the plurality of processing stations of the substrate processing tool. It is configured to rotate on the first spindle for placement in the . The second arm selectively positions the first end effector of the second arm at the plurality of processing stations of the substrate processing tool and selectively positions the second end effector of the second arm at the plurality of processing stations of the substrate processing tool. is configured to rotate on a second spindle for positioning in the At least one of the plurality of processing stations corresponds to a load station of the substrate processing tool. The first arm is positioned such that the first end effector or second end effector of the first arm is positioned at the load station at the same time as the first end effector or second end effector of the second arm is positioned at the load station. , is configured to rotate independently of the second arm.

In another feature, the first spindle and the second spindle are coaxial. Each of the first arm and the second arm is configured to be raised and lowered with respect to a plurality of processing stations of the substrate processing tool. A second spindle is positioned within the first spindle.

In another feature, the first arm and the second arm are rotatable to the first configuration. In a first configuration, a first end effector and a second end effector of the first arm are positioned at a first processing station and a third one of the plurality of processing stations, respectively, and the first end effector of the second arm and the A second end effector is positioned at each of the second and fourth processing stations of the plurality of processing stations. The first arm and the second arm are rotatable to the second configuration. In a second configuration, a first end effector and a second end effector of the first arm are positioned at a first processing station and a third one of the plurality of processing stations, respectively, and the first end effector of the second arm and the A second end effector is positioned at each of the third and first processing stations of the plurality of processing stations.

In another feature, the first processing station corresponds to the loading station of the substrate processing tool. The first and third processing stations are located at opposite corners of the substrate processing tool, and the second and fourth processing stations are located at opposite corners of the substrate processing tool.

In another feature, the first arm and the second arm are rotatable to the first configuration. In a first configuration, a first end effector and a second end effector of a first arm are positioned at a first processing station and a fourth one of the plurality of processing stations, respectively; A second end effector is positioned at each of the second and third processing stations of the plurality of processing stations. The first arm and the second arm are rotatable to the second configuration. In a second configuration, a first end effector and a second end effector of the first arm are positioned at a first processing station and a fourth one of the plurality of processing stations, respectively, and the first end effector of the second arm and the A second end effector is positioned at each of the fourth and first processing stations of the plurality of processing stations.

In another feature, the first processing station and the fourth processing station are located on a first side of the substrate processing tool, and the second processing station and the third processing station are on the opposite side of the substrate processing tool from the first side. It is arranged on the second side. The first processing station and the fourth processing station correspond to load stations of the substrate processing tool.

In another feature, a substrate processing tool includes a vacuum transfer module and a plurality of processing modules connected to the vacuum transfer module. At least one of the plurality of processing modules includes a mechanical indexer. The plurality of processing modules includes first and second processing modules connected to the first side of the vacuum transfer module and third and fourth processing modules connected to the second side of the vacuum transfer module.

In another feature, an adapter plate is positioned between the first side and the first and second processing modules. The adapter plate has a flat side configured to connect with the first side of the vacuum transfer module and an angled side configured to connect with the first and second process modules.

In another feature, the first side and the second side of the vacuum transfer module are chamfered. An adapter plate is positioned between the first side and the first and second processing modules. The adapter plate has an angled side configured to connect with the first side of the vacuum transfer module and a flat side configured to connect with the first and second process modules.

Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are for purposes of illustration only and are not intended to limit the scope of the disclosure.

The present disclosure can be more fully understood from the detailed description and accompanying drawings set forth below.

FIG. 1 shows an example of a substrate processing tool;

1 shows a first example of a processing module with a mechanical indexer in an X configuration; FIG.

FIG. 3 shows a first example of a processing module with a mechanical indexer in a second configuration;

The side view which shows the 1st example of a processing module.

FIG. 2 is a side view showing a mechanical indexer;

Fig. 2 shows a second example of a processing module with a mechanical indexer in an X configuration;

FIG. 4 shows a second example of a processing module with a mechanical indexer in a second configuration;

The side view which shows the 2nd example of a processing module.

Fig. 3 shows a mechanical indexer in an X configuration;

FIG. 4 shows a mechanical indexer in a second configuration;

1 shows a first example of a substrate processing tool; FIG.

FIG. 4 shows a second example of a substrate processing tool;

The figure which shows an example of a transfer robot.

FIG. 3 illustrates an example of an adapter plate for substrate processing tools;

FIG. 11 illustrates a third example of a substrate processing tool;

3A-3D illustrate the steps of a first example method for operating a mechanical indexer of a substrate processing tool;

4A-4D illustrate the steps of a second example method for operating a mechanical indexer of a substrate processing tool;

The same reference numerals may be used in the drawings to identify similar and/or identical elements.

Processing modules within a substrate processing tool may be operated in a multi-station serial processing mode. For example, only a portion of the overall processing may be performed on the substrate at each of the plurality of processing stations within the processing module. As the processing time at each of the stations decreased and/or the number of processes performed by each station on the substrate increased, the total time each substrate spent in the processing module was reduced by the mechanical indexer. delays associated with the rotation and translation of the . In one example, multiple substrates are sequentially transferred to a processing station corresponding to the load station. The indexer is rotated after each transfer until a substrate is positioned on each of the four processing stations on the indexer. Processing may then be performed on each of the substrates.

Substrate processing/transfer systems and methods according to the principles of the present disclosure implement transfer modules (eg, vacuum transfer modules or VTMs), processing modules, and mechanical indexers configured to reduce substrate transfer time. . For example, the VTM is configured to load two or more (eg, four) substrates into the processing module and retrieve two or more substrates from the processing module per transfer.

In one example, a mechanical indexer includes two independently rotatable arms, each arm having first and second ends (eg, end effectors). The indexers may optionally be arranged in an X-shaped first configuration. In the X-shaped configuration, each of the ends may be aligned with a respective processing station within the processing module. For example, the first and second ends of the first arm may be aligned with diagonally opposed processing stations 1 and 3 (or 2 and 4), and the first and second ends of the second arm , may be aligned with diagonally opposite processing stations 2 and 4 (or 1 and 3). In a second configuration, one of the arms is lifted and rotated so that the first and second arms are aligned. In a second configuration, the first and second ends of each of the arms are aligned with stations 1 and 3 or 2 and 4. In other words, in the second configuration, the respective ends of both arms may be vertically stacked at any one of the processing stations. In particular, each end of both arms may be aligned with the load station.

Thus, in this example, two substrates are transferred to and/or from the processing module (eg, using a VTM robot having vertically stacked end effectors configured to transfer two substrates simultaneously). you can Both arms may be rotated such that opposite ends of each of the arms are aligned with the load station to transfer two additional substrates to and/or from the processing module. The mechanical indexer may then be arranged in an X-shaped first configuration such that each of the four substrates is aligned with a different processing station.

In another example, the processing module may comprise two load stations. For example, a load station may correspond to a processing station adjacent to a VTM. In this example, the mechanical indexer comprises first and second V-arms. The indexers may be arranged in a first X-shaped configuration. In the X-shaped configuration, the first and second ends of the first V-arm may be aligned with processing stations 1 and 4 (or processing stations 2 and 1, 3 and 2, or 4 and 3); The first and second ends of the two V-arms may be aligned with processing stations 2 and 3 (or processing stations 3 and 4, 4 and 1, or 1 and 2). In a second configuration, one of the arms is lifted and rotated so that the first and second arms are aligned. In a second configuration, the first and second ends of each of the arms are aligned, for example, with stations 1 and 4, which stations may correspond to load stations. In other words, in the second configuration, the respective ends of both arms may be vertically stacked within the load station.

Thus, in this example, four substrates (eg, using two VTM robots each having a vertically stacked end effector configured to transfer two substrates at the same time) are transferred to and/or from the processing module. may be transferred from The mechanical indexer may then be arranged in an X-shaped first configuration such that each of the four substrates is aligned with a different processing station.

As detailed below, substrate processing/transfer systems and methods according to the present disclosure reduce energy consumption, reduce overhead time associated with substrate processing, improve processing throughput, It is possible to increase the number of processing modules per unit. Although described with respect to a processing module having four processing stations, the principles of the disclosure may be practiced with processing modules having other numbers of processing stations (eg, 2, 3, 5, 6, 7, 8, etc.). may

2A, 2B, 2C and 2D, an example processing module 200 with a mechanical indexer 204 in accordance with the principles of the present disclosure is shown. In this example, mechanical indexer 204 includes two independently rotatable arms 208 and 212, each arm having first and second ends (e.g., end effectors 216, 220, 224, and , 228). Indexers 204 are arranged in a first X-shaped configuration in FIG. 2A and a second configuration in FIG. 2B. In the X configuration, end effectors 216 and 220 of first arm 208 are positioned over process stations 1 and 3, respectively, and end effectors 224 and 228 are positioned over process stations 2 and 4, respectively. Processing station 1 may correspond to or communicate with load station 232 accessible via slot 236 .

In a second configuration, second arm 212 may be lifted and rotated such that first arm 208 and second arm 212 are aligned. For example, first arm 208 may be coupled to first spindle 240 and second arm 212 may be coupled to second spindle 244, as shown in FIG. 2D. A second spindle 244 is received within the first spindle 240 and is configured to be selectively raised and lowered within the first spindle 240 . Thus, raising the second spindle 244 lifts the second arm 212 relative to the first arm 208 , allowing the second arm 212 to rotate independently of the first arm 208 . In this manner, end effectors 216, 220, 224, and 228 and respective substrates 248 may be positioned above/below one another in load station 232 or in any one of processing stations 1-4. can be placed in

For example, second arm 212 may be rotated such that first arm 208 and second arm 212 are arranged in the second configuration shown in FIG. 2B. In a second configuration, end effectors 216 and 228 are each positioned within load station 232 . In other words, in the second configuration, end effectors 216 and 228 are vertically stacked within load station 232 . At this time, substrates 248 positioned on end effectors 216 and 228 may be retrieved from processing module 200 and/or new (i.e., unprocessed) substrates may be transferred to end effectors 216 and 228 via slot 236 . H.228.

In one example transfer sequence, each of first arm 208 and second arm 212 is raised to a first height to lift substrate 248 from respective processing stations 1-4. For example, end effectors 216, 220, 224, and 228 may be located at processing stations 1, 2, 3, and 4, respectively. The second arm 212 may be further raised to a second height that is higher than the first height. The second arm 212 may then be rotated (eg, approximately 90 degrees clockwise as shown in FIG. 2B) so that the end effector 228 is positioned at processing station 1 (ie, load station 332). A VTM robot external to processing module 200 may then retrieve substrate 248 positioned on each of end effectors 216 and 228 . In some examples, the VTM robot exchanges processed substrates 248 with unprocessed substrates.

Following unloading of substrate 248 and/or loading of unprocessed substrates onto end effectors 216 and 228, the indexer is operated while maintaining the first and second heights of first arm 208 and second arm 212, respectively. The entire 204 (ie, both the first arm 208 and the second arm 212) may be rotated approximately 180°. Accordingly, indexer 204 is rotated such that end effectors 220 and 224 are positioned at load station 232 . The VTM robot may then retrieve processed substrates 248 from end effectors 220 and 224 and/or load unprocessed substrates onto end effectors 220 and 224 . Second arm 212 is then moved relative to arm 208 ( For example, it may be rotated approximately 90° in a clockwise direction. Each of the first arm 208 and the second arm 212 may then be lowered to deposit unprocessed substrates at respective processing stations 1-4. Other transfer sequence examples may be implemented.

3A, 3B, 3C, 3D, and 3E, another example processing module 300 with a mechanical indexer 304 in accordance with the principles of the present disclosure is shown. In one example, processing module 300 includes two load stations 308 and 312 and corresponding slots 316 and 320 . Indexer 304 includes first and second V-shaped arms 324 and 328, each arm having first and second ends (eg, end effectors 332, 336, 340, and 344). Indexers 304 are arranged in a first X-shaped configuration of FIGS. 3A and 3D and a second configuration of FIGS. 3B and 3E. In the X configuration, end effectors 332 and 336 are positioned above processing stations 1 and 4, respectively, and end effectors 340 and 344 are positioned above processing stations 2 and 3, respectively. Processing stations 1 and 4 correspond to or communicate with load stations 308 and 320, respectively.

In the second configuration, second arm 328 may be lifted and rotated such that first arm 324 and second arm 328 are aligned. For example, first arm 324 and second arm 328 are independently rotatable spindles 348 and 352 configured to operate similarly to first and second spindles 240 and 244, as described in FIG. 2D. may be coupled to Accordingly, second arm 328 may be rotated such that first arm 324 and second arm 328 are positioned in the second configuration shown in FIG. 3B. In a second configuration, end effectors 332 and 344 are each located at load station 308 and end effectors 336 and 340 are each located at load station 312 . For example, end effectors 332 and 344 and corresponding substrates 356 positioned thereon are vertically stacked within load station 308 . Conversely, end effectors 336 and 340 and corresponding substrates 356 positioned thereon are vertically stacked within load station 312 . Accordingly, substrate 356 may be retrieved from processing module 300 and/or new (i.e., unprocessed) substrates may be delivered to end effectors 332, 344 and 336, 340 via slots 316 and 320, respectively. may be loaded on.

In one example transfer sequence, each of first arm 324 and second arm 328 is raised to a first height to lift substrate 356 from respective processing stations 1-4. For example, end effectors 332, 340, 344, and 336 may be located at processing stations 1, 2, 3, and 4, respectively. The second arm 328 may be further raised to a second height that is higher than the first height. Second arm 328 may then be rotated (eg, about 180° as shown in FIG. 3B) so that end effectors 344 and 340 are positioned at processing stations 1 and 2 (i.e., load stations 308 and 312), respectively. ). A VTM robot external to processing module 300 may then retrieve substrate 356 positioned on each of end effectors 332 , 340 , 344 , and 336 . In some examples, the VTM robot exchanges processed substrates 356 with unprocessed substrates.

Following unloading of substrate 356 and/or loading of unprocessed substrates onto end effectors 332, 340, 344, and 336, first and second heights of first arm 324 and second arm 328, respectively. , the second arm 328 is rotated approximately 180° to return the indexer 304 to the X configuration. Accordingly, end effectors 332, 340, 344, and 336 are located at stations 1, 2, 3, and 4, respectively. First arm 324 and second arm 328 may then be lowered onto respective processing stations 1-4. Other transfer sequence examples may be implemented.

4A, 4B, and 4C, a substrate processing tool having example transfer robots 408-1, 408-2, and 408-3 (collectively referred to as transfer robots 408). A top view of examples 400 and 404 is shown. Processing tools 400 and 404 are shown without mechanical indexers for illustrative purposes. For example, each respective processing module 412 of tools 400 and 404 may comprise either mechanical indexer 204 or mechanical indexer 304, as described above.

A vacuum transfer module (VTM) 416 and an equipment front end module (EFEM) 420 may each comprise one of the transfer robots 408 . Transfer robots 408-1 and 408-2 may have the same configuration or different configurations. By way of example only, transfer robot 408-1 comprises a single arm with two vertically stacked end effectors. Conversely, transfer robot 408-2 is shown having two arms, each arm having two vertically stacked end effectors, as shown in FIG. 4C. Robot 408 of VTM 416 selectively transfers substrates to and from loadlock 424 and between processing modules 412 . Robot 408 - 3 of EFEM 420 transfers substrates in and out of EFEM 420 and to and from loadlock 424 . By way of example only, robot 408-3 may comprise two arms each having a single end effector or two vertically stacked end effectors.

Tool 400 is configured, for example, to interact with four processing modules 412 each having a single load station accessible via respective slots 428 . Conversely, tool 404 is configured to interact with three processing modules 412 each having two load stations via respective slots 432 and 436 . As shown, the sides 440 of the VTM 416 may be angled (e.g., chamfered) to facilitate coupling with processing modules 412 of different configurations (e.g., different number, spacing, etc.). ).

For example, as shown in FIG. 4A, a VTM is coupled to two processing modules 412 per side 440 . Conversely, the shape of VTM 416 also allows connection of processing modules 412 having two load stations. For example, an adapter plate 444 with two slots 432 and 436 may be provided to accommodate a single processing module 412 with two load stations, as shown in FIG. 4B. As shown, the adapter plate 444 includes an angled first side configured to connect with the angled side 440 of the VTM 416 and a non-angled side configured to connect with the processing module 412 . a second side (ie, straight or flat); VTM 416 thus provides the flexibility to allow connection of a greater number of processing modules 412 with a single load station (i.e., to increase the number of processing stations per unit area of tool 400). At the same time, it also provides the flexibility of using a processing module 412 with only one load station as shown in FIG. 4A or two load stations as shown in FIG. 4B. In other examples, the sides of VTM 416 may be non-angled (ie, straight or flat). In these examples, the tool 400 may include an adapter plate 446 as shown in Figure 4D configured to connect with two processing modules 412 each having a single load station. In other words, instead of converting the angled side 440 of the VTM 416 to a non-angled side, the adapter plate 446 converts the non-angled side of the VTM 416 to an angled side.

Robot 408 - 2 of VTM 416 comprises two arms 448 and 452 each comprising two vertically stacked end effectors 456 out of a total of four end effectors 456 . Accordingly, each of arms 448 and 452 is configured to simultaneously transfer two substrates to and/or from a respective one of processing modules 412, such as load lock 424. FIG. In the example shown in FIG. 4A, robot 408-1 may retrieve two substrates from processing module 412 and load two substrates into processing module 412 in a given transfer. Conversely, robot 408-2 may retrieve four substrates from processing module 412 and load four substrates into processing module 412 in a given transfer.

The system controller 460 controls the substrate processing tool 400 including, but not limited to, motion of the robot 408, rotation of the indexers of each of the processing modules 412 (e.g., corresponding to the indexers 204 and 304 of FIGS. 2 and 3), etc. and 404 may control various operations.

In another example shown in FIG. 4E, substrate processing tool 464 includes transfer robots 468-1 and 468-2 (collectively referred to as transfer robots 468). Processing tool 464 is shown without a mechanical indexer for illustrative purposes. For example, each processing module 472 of tool 464 may comprise either mechanical indexer 204 or mechanical indexer 304, as described above.

VTM 476 and EFEM 480 may each include one of transfer robots 408 . Transfer robots 468-1 and 468-2 may have the same configuration or different configurations. By way of example only, transfer robot 468-1 is shown having two arms, each arm having two vertically stacked end effectors, as shown in FIG. 4C. Robot 468 - 1 of VTM 476 selectively transfers substrates to and from EFEM 480 and between processing modules 472 . Robot 468 - 2 of EFEM 480 transfers substrates into and out of EFEM 480 . By way of example only, robot 468-2 may comprise two arms each having a single end effector or two vertically stacked end effectors.

Tool 464 is configured, for example, to interface with four processing modules 472 each having a single load station accessible via respective slots 484 . In this example, side 488 of VTM 476 is non-angled (ie, side 488 is substantially straight or planar). Thus, two of the processing modules 472 each having a single load station may be coupled to each side 488 of the VTM 476 . Accordingly, EFEM 480 may be positioned at least partially between two of processing modules 472 to reduce the footprint of tool 464 .

Referring now to FIG. 5, a first example method 500 for operating a mechanical indexer of a substrate processing tool begins at step 504 (see, eg, FIGS. 2A, 2B, 2C, and 2D). The shown mechanical indexer 204). Merely by way of example, operation of a mechanical indexer may be controlled by a controller such as system controller 460 . At step 508, the mechanical indexer is arranged in a first X configuration, where the first and second ends of the first arm are arranged at the first and third processing stations and the first arm of the second arm is arranged at the first and second processing stations. and second ends are placed in second and fourth processing stations (eg, as shown in FIG. 2A). Each end of the first and second arms may be arranged to retrieve a respective processed substrate. At step 512, the first arm and the second arm are raised over their respective spindles to lift the substrate from the processing station. At step 516, the second arm is rotated such that the second end of the second arm is positioned at the first processing station, which may correspond to or communicate with the load station (eg, as shown in FIG. 2B). 90° clockwise). At step 520, the robot retrieves the processed substrate from the first end of the first arm and the second end of the second arm located at the first processing station.

At step 524, the robot transfers the unprocessed substrate to the first end of the first arm and the second end of the second arm located at the first processing station. At step 528, the first arm and the second arm are rotated (e.g., 180) such that each of the first arm second end and the second arm first end is positioned at the first processing station. °). At step 532, the robot retrieves the processed substrate from the first end of the first arm and the second end of the second arm. At step 536, the robot transfers the unprocessed substrate to the second end of the first arm and the first end of the second arm located at the first processing station. At step 540, the second arm is rotated such that the first and second ends of the second arm are positioned at the second and fourth processing stations (i.e., the mechanical indexer is returned to the first X configuration). (eg, 90° clockwise). At step 544, the first and second arms are lowered to place unprocessed substrates onto their respective processing stations. Method 500 ends at step 548 .

6, a second example method 600 for operating a mechanical indexer of a substrate processing tool begins at step 604 (e.g., FIGS. 3A, 3B, 3C, 3D, and Mechanical indexer 304) shown in FIG. 3E. Merely by way of example, operation of a mechanical indexer may be controlled by a controller such as system controller 460 . At step 608, the mechanical indexer is arranged in a first X-shaped configuration, where the first and second ends of the first arm are arranged at the first and fourth processing stations and the first arm of the second arm and second ends are placed in second and third processing stations (eg, as shown in FIG. 3A). Each end of the first and second arms may be arranged to retrieve a respective processed substrate. At step 612, the first arm and the second arm are raised over their respective spindles to lift the substrate from the processing station. At step 616, the second arm is rotated such that the first and second ends of the second arm are positioned at fourth and first processing stations, each of which may correspond or communicate with a load station ( 180° in a clockwise direction, for example, as shown in FIG. 3B). At step 620, one or more robots remove processed substrates from first and second ends of a first arm and first and second ends of a second arm located at first and fourth processing stations. to recover.

At step 624, the robot transfers unprocessed substrates to the first and second ends of the first arm and the first and second ends of the second arm located at the first and fourth processing stations. At step 628, the second arm is rotated such that the first and second ends of the second arm are positioned at the second and third processing stations (i.e., the mechanical indexer is returned to the first X configuration). (eg, 180°). At step 632, the first and second arms are lowered to place unprocessed substrates onto their respective processing stations. Method 600 ends at step 636 .

The above description is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of this disclosure can be embodied in various forms. Thus, while the present disclosure includes certain examples, the true scope of the present disclosure should not be construed as other variations will become apparent upon study of the drawings, specification, and claims that follow. is not limited to the example of It should be understood that one or more steps included in a method may be performed in a different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described as having particular features, any one or more of the features described with respect to any embodiment of this disclosure may be used with other embodiments. It can be implemented in any and/or combined with features of any of the other embodiments, even if the combination is not explicitly stated. In other words, the above-described embodiments are not mutually exclusive and it is within the scope of this disclosure to replace one or more of the embodiments with each other.

Spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers) are "connected," "engaged," "coupled," Described using various terms such as “adjacent,” “adjacent,” “above,” “above,” “below,” and “located with.” When describing the relationship between the first and second elements in this disclosure, unless it is expressly stated that the relationship is "direct," the relationship assumes that other intervening elements are the first and second elements. It can be a direct relationship that does not exist between the elements, but it can also be an indirect relationship where one or more intervening elements exist (spatially or functionally) between the first and second elements. Possible. As used herein, the phrase "at least one of A, B, and C" is taken to mean logical (A or B or C), using a non-exclusive OR should not be construed to mean "at least one of A, at least one of B, and at least one of C."

In some embodiments, the controller is part of the system, which may be part of the examples described above. Such systems may include semiconductor processing equipment, such as one or more processing tools, one or more chambers, one or more platforms for processing, and/or specific processing components (wafer pedestals, gas flow systems, etc.). can be provided. These systems may be integrated with electronics to control the operation of the system before, during, and after semiconductor wafer or substrate processing. The electronics may be referred to as "controllers" and may control various components or sub-components of the system. Depending on the process requirements and/or type of system, the controller provides process gas supply, temperature settings (e.g., heating and/or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF Such as matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position and motion settings, and wafer movement in and out of the tool and other moving tools and/or loadlocks connected or coupled with the particular system. It may be programmed to control any of the processes disclosed herein.

Generally, the controller includes various integrated circuits, logic, memory, and/or , may be defined as an electronic device having software. An integrated circuit is defined as a chip in the form of firmware that stores program instructions, a digital signal processor (DSP), an application specific integrated circuit (ASIC), and/or that executes program instructions (e.g., software). It may include one or more microprocessors or microcontrollers. Program instructions are communicated to the controller in the form of various individual settings (or program files) to provide operating parameters to the system for performing specific processes on or for semiconductor wafers. may be an instruction that defines The operating parameter, in some embodiments, is one or more process steps during processing of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and/or dies of a wafer. may be part of a recipe defined by the process engineer to achieve

The controller, in some embodiments, is a computer integrated with the system, connected to the system, otherwise networked with the system, or any combination thereof. It may be part of or connected to such a computer. For example, the controller may be in the "cloud" or may be all or part of a fab host computer system that allows remote access for wafer processing. The computer allows remote access to the system to change the parameters of the current process, set the process steps according to the current process, or initiate a new process to monitor the current progress of the manufacturing operation. It may monitor, examine the history of past manufacturing operations, or examine trends or performance indicators from multiple manufacturing operations. In some examples, a remote computer (eg, server) may provide processing recipes to the system over a network (which may include a local network or the Internet). The remote computer may include a user interface that allows for the entry or programming of parameters and/or settings, which are communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data, the instructions specifying parameters for each of the processing steps to be performed during one or more operations. It should be appreciated that the parameters may be specific to the type of processing being performed as well as the type of tool that the controller is configured to interface with or control. Thus, as noted above, the controllers may be distributed, such as by having one or more separate controllers that are networked and operate toward a common purpose (such as the processing and control described herein). . An example of a distributed controller for such purposes is one or more remotely located (such as at the platform level or located as part of a remote computer) cooperating to control processing in the chamber. one or more integrated circuits on the chamber communicating with the integrated circuits of the chamber.

Non-limiting examples of systems include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD). Chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and semiconductor wafer processing and/or any other semiconductor processing system that may be associated with or utilized in manufacturing.

As noted above, depending on the one or more processing steps performed by the tool, the controller may select other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby Tools, tools located throughout the fab, main computer, separate controllers, or tools used for material transport that carry containers of wafers to and from tool locations and/or load ports within a semiconductor manufacturing fab may communicate with one or more of the .

Processing modules within a substrate processing tool may be operated in a multi-station serial processing mode. For example, only a portion of the overall processing may be performed on the substrate at each of the plurality of processing stations within the processing module. The shorter the processing time at each of the stations and/or the greater the number of processes the processing module performs on the substrate, the more substrates through the mechanical indexer within the total time each substrate spends in the processing module. delays associated with the rotation and translation of the . In one example, multiple substrates are sequentially transferred to a processing station corresponding to the load station. The indexer is rotated after each transfer until a substrate is positioned on each of the four processing stations on the indexer. Processing may then be performed on each of the substrates.

Tool 400 is configured, for example, to interact with four processing modules 412 each having a single load station accessible via respective slots 428 . Conversely, tool 404 is configured to interact with three processing modules 412 each having two load stations accessible via respective slots 432 and 436 . As shown, the sides 440 of the VTM 416 may be angled (e.g., chamfered) to facilitate coupling with processing modules 412 of different configurations (e.g., different number, spacing, etc.). ).

VTM 476 and EFEM 480 may each include one of transfer robots 468 . Transfer robots 468-1 and 468-2 may have the same configuration or different configurations. By way of example only, transfer robot 468-1 is shown having two arms, each arm having two vertically stacked end effectors, as shown in FIG. 4C. Robot 468 - 1 of VTM 476 selectively transfers substrates to and from EFEM 480 and between processing modules 472 . Robot 468 - 2 of EFEM 480 transfers substrates into and out of EFEM 480 . By way of example only, robot 468-2 may comprise two arms each having a single end effector or two vertically stacked end effectors.

As noted above, depending on the one or more processing steps performed by the tool, the controller may select other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby Tools, tools located throughout the fab, main computer, separate controllers, or tools used for material transport that carry containers of wafers to and from tool locations and/or load ports within a semiconductor manufacturing fab may communicate with one or more of the .
The present disclosure can also be configured as the following application examples.
<Application example 1>
A mechanical indexer for a substrate processing tool, comprising:
A first arm having a first end effector and a second end effector, wherein (i) selectively positioning the first end effector of the first arm at a plurality of processing stations of the substrate processing tool; ii) a first arm configured to rotate on a first spindle to selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool;
a second arm having a first end effector and a second end effector, wherein: (i) selectively positioning the first end effector of the second arm at the plurality of processing stations of the substrate processing tool; (ii) a second arm configured to rotate on a second spindle to selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool; ,
with
at least one of the plurality of processing stations corresponds to a load station of the substrate processing tool;
The first end effector of the first arm or the second end effector of the first arm is placed on the load station, and the first end effector or the second end effector of the second arm is A mechanical indexer configured to rotate independently of the second arm so as to be positioned at the load station.
<Application example 2>
The mechanical indexer according to Application 1, wherein the first spindle and the second spindle are coaxial.
<Application example 3>
2. The mechanical indexer of Application 1, wherein each of the first arm and the second arm is configured to be raised and lowered with respect to the plurality of processing stations of the substrate processing tool. indexer.
<Application example 4>
The mechanical indexer according to Application 1, wherein the second spindle is arranged within the first spindle.
<Application example 5>
The mechanical indexer according to Application Example 1,
said first arm and said second arm being rotatable to a first configuration;
In the first configuration, (i) the first end effector and the second end effector of the first arm are arranged at a first processing station and a third processing station among the plurality of processing stations, respectively; ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are positioned at a second and fourth one of said plurality of processing stations, respectively;
<Application example 6>
The mechanical indexer according to Application Example 5,
said first arm and said second arm being rotatable to a second configuration;
In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the third processing station among the plurality of processing stations, respectively; , (ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at said third processing station and said first one of said plurality of processing stations, respectively; .
<Application example 7>
7. The mechanical indexer of Application 6, wherein the first processing station corresponds to the load station of the substrate processing tool.
<Application example 8>
7. The mechanical indexer of Application 6, wherein (i) the first processing station and the third processing station are located at opposite corners of the substrate processing tool; and (ii) the second processing station. and a mechanical indexer, wherein the fourth processing station is located at an opposite corner of the substrate processing tool.
<Application example 9>
The mechanical indexer according to Application Example 1,
said first arm and said second arm being rotatable to a first configuration;
In the first configuration, (i) the first end effector and the second end effector of the first arm are arranged at a first processing station and a fourth processing station among the plurality of processing stations, respectively; ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at a second and third one of said plurality of processing stations, respectively;
<Application example 10>
The mechanical indexer according to Application Example 9,
said first arm and said second arm being rotatable to a second configuration;
In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the fourth processing station among the plurality of processing stations, respectively; , (ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at said fourth processing station and said first one of said plurality of processing stations, respectively; .
<Application example 11>
11. The mechanical indexer of Application 10, wherein (i) the first processing station and the fourth processing station are located on a first side of the substrate processing tool, and (ii) the second processing station and A mechanical indexer, wherein the third processing station is located on a second side of the substrate processing tool opposite the first side.
<Application example 12>
11. The mechanical indexer of Claim 10, wherein the first processing station and the fourth processing station correspond to load stations of the substrate processing tool.
<Application example 13>
A substrate processing tool comprising:
a vacuum transfer module;
a plurality of processing modules connected to the vacuum transfer module, wherein at least one of the plurality of processing modules comprises the mechanical indexer of Application 1;
A substrate processing tool, comprising:
<Application example 14>
14. The substrate processing tool of Application 13, wherein the plurality of processing modules comprises first and second processing modules connected to a first side of the vacuum transfer module and a second side of the vacuum transfer module. and connected third and fourth processing modules.
<Application example 15>
15. The substrate processing tool of application 14, further comprising an adapter plate positioned between (i) the first side and (ii) the first and second processing modules;
The adapter plate comprises a flat side configured to connect with the first side of the vacuum transfer module and an angled side configured to connect with the first and second process modules. , substrate processing tools.
<Application example 16>
15. The substrate processing tool of Application 14, wherein the first side and the second side of the vacuum transfer module are chamfered.
<Application example 17>
17. The substrate processing tool of application 16, further comprising an adapter plate positioned between (i) the first side and (ii) the first and second processing modules; a plate comprising an angled side configured to connect with said first side of said vacuum transfer module and a flat side configured to connect with said first and second processing modules; processing tools.

Claims (17)

A mechanical indexer for a substrate processing tool, comprising:
A first arm having a first end effector and a second end effector, wherein (i) selectively positioning the first end effector of the first arm at a plurality of processing stations of the substrate processing tool; ii) a first arm configured to rotate on a first spindle to selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool;
a second arm having a first end effector and a second end effector, wherein: (i) selectively positioning the first end effector of the second arm at the plurality of processing stations of the substrate processing tool; (ii) a second arm configured to rotate on a second spindle to selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool; ,
with
at least one of the plurality of processing stations corresponds to a load station of the substrate processing tool;
The first end effector of the first arm or the second end effector of the first arm is placed on the load station, and the first end effector or the second end effector of the second arm is A mechanical indexer configured to rotate independently of the second arm so as to be positioned at the load station. 2. The mechanical indexer of claim 1, wherein said first spindle and said second spindle are coaxial. 2. The mechanical indexer of claim 1, wherein each of the first arm and the second arm is configured to be raised and lowered with respect to the plurality of processing stations of the substrate processing tool. indexer. 2. The mechanical indexer of claim 1, wherein the second spindle is located within the first spindle. The mechanical indexer of claim 1, comprising:
said first arm and said second arm being rotatable to a first configuration;
In the first configuration, (i) the first end effector and the second end effector of the first arm are arranged at a first processing station and a third processing station among the plurality of processing stations, respectively; ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are positioned at a second and fourth one of said plurality of processing stations, respectively; A mechanical indexer according to claim 5, comprising:
said first arm and said second arm being rotatable to a second configuration;
In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the third processing station among the plurality of processing stations, respectively; , (ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at said third processing station and said first one of said plurality of processing stations, respectively; . 7. The mechanical indexer of Claim 6, wherein the first processing station corresponds to the load station of the substrate processing tool. 7. The mechanical indexer of claim 6, wherein (i) the first processing station and the third processing station are located at opposite corners of the substrate processing tool, and (ii) the second processing station. and a mechanical indexer, wherein the fourth processing station is located at an opposite corner of the substrate processing tool. The mechanical indexer of claim 1, comprising:
said first arm and said second arm being rotatable to a first configuration;
In the first configuration, (i) the first end effector and the second end effector of the first arm are arranged at a first processing station and a fourth processing station among the plurality of processing stations, respectively; ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at a second and third one of said plurality of processing stations, respectively; A mechanical indexer according to claim 9, comprising:
said first arm and said second arm being rotatable to a second configuration;
In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the fourth processing station among the plurality of processing stations, respectively; , (ii) a mechanical indexer, wherein said first end effector and said second end effector of said second arm are located at said fourth processing station and said first one of said plurality of processing stations, respectively; . 11. The mechanical indexer of claim 10, wherein (i) the first processing station and the fourth processing station are located on a first side of the substrate processing tool, and (ii) the second processing station and A mechanical indexer, wherein the third processing station is located on a second side of the substrate processing tool opposite the first side. 11. The mechanical indexer of claim 10, wherein the first processing station and the fourth processing station correspond to load stations of the substrate processing tool. A substrate processing tool comprising:
a vacuum transfer module;
a plurality of processing modules connected to said vacuum transfer module, wherein at least one of said plurality of processing modules comprises the mechanical indexer of claim 1;
A substrate processing tool, comprising: 14. The substrate processing tool of claim 13, wherein the plurality of processing modules comprises first and second processing modules connected to a first side of the vacuum transfer module and a second side of the vacuum transfer module. and connected third and fourth processing modules. 15. The substrate processing tool of claim 14, further comprising an adapter plate positioned between (i) the first side and (ii) the first and second processing modules;
The adapter plate comprises a flat side configured to connect with the first side of the vacuum transfer module and an angled side configured to connect with the first and second process modules. , substrate processing tools. 15. The substrate processing tool of claim 14, wherein the first side and the second side of the vacuum transfer module are chamfered. 17. The substrate processing tool of claim 16, further comprising an adapter plate positioned between (i) the first side and (ii) the first and second processing modules; a plate comprising an angled side configured to connect with said first side of said vacuum transfer module and a flat side configured to connect with said first and second processing modules; processing tools.

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