JP2022180604A5 - - Google Patents
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- Publication number
- JP2022180604A5 JP2022180604A5 JP2022159046A JP2022159046A JP2022180604A5 JP 2022180604 A5 JP2022180604 A5 JP 2022180604A5 JP 2022159046 A JP2022159046 A JP 2022159046A JP 2022159046 A JP2022159046 A JP 2022159046A JP 2022180604 A5 JP2022180604 A5 JP 2022180604A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- wiring pattern
- specific
- copper foil
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 18
- 238000005034 decoration Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022159046A JP7345234B2 (ja) | 2019-02-28 | 2022-09-30 | 遊技機 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019035383A JP2020137781A (ja) | 2019-02-28 | 2019-02-28 | 遊技機 |
JP2022159046A JP7345234B2 (ja) | 2019-02-28 | 2022-09-30 | 遊技機 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019035383A Division JP2020137781A (ja) | 2019-02-28 | 2019-02-28 | 遊技機 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2022180604A JP2022180604A (ja) | 2022-12-06 |
JP2022180604A5 true JP2022180604A5 (enrdf_load_stackoverflow) | 2023-05-16 |
JP7345234B2 JP7345234B2 (ja) | 2023-09-15 |
Family
ID=72279625
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019035383A Pending JP2020137781A (ja) | 2019-02-28 | 2019-02-28 | 遊技機 |
JP2022159046A Active JP7345234B2 (ja) | 2019-02-28 | 2022-09-30 | 遊技機 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019035383A Pending JP2020137781A (ja) | 2019-02-28 | 2019-02-28 | 遊技機 |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP2020137781A (enrdf_load_stackoverflow) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06125164A (ja) * | 1992-10-12 | 1994-05-06 | Omron Corp | スルーホールプリント配線基板 |
JPH06177518A (ja) * | 1992-12-01 | 1994-06-24 | Ibiden Co Ltd | プリント配線板 |
JP4869165B2 (ja) * | 2007-06-28 | 2012-02-08 | 昭和電工株式会社 | 発光装置の製造方法 |
JP5217652B2 (ja) * | 2008-06-09 | 2013-06-19 | 株式会社三洋物産 | 遊技機 |
JP2011003623A (ja) * | 2009-06-17 | 2011-01-06 | Nippon Seiki Co Ltd | プリント基板の実装構造 |
JP2013009774A (ja) * | 2011-06-29 | 2013-01-17 | Daito Giken:Kk | 遊技台 |
JP2014212202A (ja) * | 2013-04-18 | 2014-11-13 | シーシーエス株式会社 | 回路板 |
JP6316263B2 (ja) * | 2015-11-26 | 2018-04-25 | 株式会社藤商事 | 遊技機 |
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2019
- 2019-02-28 JP JP2019035383A patent/JP2020137781A/ja active Pending
-
2022
- 2022-09-30 JP JP2022159046A patent/JP7345234B2/ja active Active