JP2022178214A - Metallic material, metal-resin composite material, and electroplating device - Google Patents

Abstract

To provide a metallic material capable of effectively suppressing generation of gloss unevenness of a surface of a coarse plating layer of a relatively low surface area ratio, a metal-resin composite material, and an electroplating device.SOLUTION: The metallic material includes a base material and a coarse plating layer disposed on the base material, with an in-plane mean value of S-ratio on a surface of the coarse plating layer being 1.3 or less, and an in-plane variation of S-ratio on the surface being 0.05 or less.SELECTED DRAWING: None

Description

This specification discloses a metallic material, a metal-resin composite material and an electroplating apparatus.

In recent years, with the increasing use of electrical equipment in automobiles, there has been a demand for further improvement in the adhesion between the metal and resin materials of the metal-resin composite materials used in automotive electronic parts, especially those around the engine compartment, which are particularly harsh. It is

In this regard, among semiconductor devices, there is a resin sealing type in which a semiconductor chip mounted on a lead frame is sealed with a resin material by insert molding. For this lead frame, a metal material subjected to roughening plating such as nickel can be used in order to improve the adhesion with the resin material (see Patent Documents 1 to 4, for example).

JP-A-6-29439 JP-A-10-27873 JP-A-2006-93559 JP 2005-235926 A

By the way, electroplating is sometimes carried out by feeding a material to be plated along its longitudinal direction in a plating solution containing metal ions and energizing it with an anode disposed on its side. In such electroplating, metal ions in the plating solution are reduced and deposited on the surface of the material to be plated, and the resulting metal material forms a plating layer on the base material as the material to be plated.

In such electroplating, in order to suppress the phenomenon in which the plating thickness varies due to the concentration of current at both ends of the material to be plated in the width direction (the so-called dog bone phenomenon), In some cases, mask members are arranged at both ends of the plating material in the width direction to block excessive concentration of current at the ends.

However, when the above-described mask member is used in manufacturing a metal material having a roughened plating layer with a relatively low surface area ratio and a not so rough surface, the surface of the roughened plating layer formed by electroplating has It has been found that gloss unevenness occurs, resulting in a poor appearance of the metal material.

This specification discloses a metal material, a metal-resin composite material, and an electroplating apparatus that can effectively suppress the occurrence of gloss unevenness on the surface of a roughened plating layer having a relatively low surface area ratio.

The metal material disclosed in this specification includes a base material and a roughened plating layer provided on the base material, and the in-plane average value of S-ratio on the surface of the roughened plating layer is 1.3 or less, and the in-plane variation of the S-ratio on the surface is 0.05 or less.

The metal-resin composite material disclosed in this specification comprises the metal material described above and a resin material bonded to the metal material by the roughening plating layer.

The electroplating apparatus disclosed in this specification provides a roughened plating layer on a material to be plated as a base material to produce a metal material. A plating passage passing along the longitudinal direction while allowing the plating passage, a liquid supply port for supplying a plating solution to the plating passage, and a position facing the surface of the material to be plated on the side of the plating passage, the material to be plated a cathode through which current flows; a mask member covering both ends in the width direction of the material to be plated; and a plating solution disposed between the solution supply port and the plating passage and supplied from the solution supply port. and a rectifying member for regulating the flow of the plating solution to flow the plating solution into the plating passage.

The metal material described above is a roughened plating layer having a relatively low surface area ratio, and effectively suppresses the occurrence of uneven gloss on the surface. Further, according to the above electroplating apparatus, it is possible to effectively suppress the occurrence of uneven gloss on the surface of the roughened plating layer having a relatively low surface area ratio.

1 is a cross-sectional view along the longitudinal direction of a material to be plated and a cross-sectional view along line bb thereof, showing the electroplating apparatus of one embodiment together with the material to be plated. 1 is a cross-sectional view along the longitudinal direction of a material to be plated and a cross-sectional view along line bb thereof, showing an electroplating apparatus of a reference example together with the material to be plated. FIG. It is a photograph showing a metal material of a comparative example. FIG. 10 is a diagram showing a simulation result of the plating solution flow in an electroplating apparatus of a comparative example; 5 is an enlarged view of the vicinity of the material to be plated in FIG. 4; FIG. 7 is a graph showing the flow velocity at each location in the width direction at each position in the feed direction of the material to be plated in the simulation results of the comparative example. FIG. 4 is a diagram showing a simulation result of the plating solution flow in the electroplating apparatus of the invention example. 8 is an enlarged view of the vicinity of the material to be plated in FIG. 7; FIG. It is a graph showing the flow velocity of each part of the width direction in each position of the feed direction of the to-be-plated material in the simulation result of an invention example.

Embodiments of the metal material and the electroplating apparatus described above will be described in detail below.
A metal material of one embodiment has a base material and a roughened plating layer provided on the base material. The roughened plating layer of the metal material has a relatively low surface area ratio of 1.3 or less in-plane average value of S-ratio that can be measured with a laser microscope for the surface, and the surface is It's not that rough. In such a roughened plating layer with a low surface area ratio, if the in-plane variation of S-ratio on the surface is 0.05 or less, the occurrence of uneven gloss on the surface is suppressed, and the appearance of the metal material is good. become a thing.

(base material)
The base material is not particularly limited, but may be composed of copper, aluminum, iron, or an alloy containing at least one of them. Although it depends on the use of the metal material, from the viewpoint of having high conductivity and strength, copper and copper alloys, more specifically phosphor bronze, brass, Corson copper, oxygen-free Copper, tough pitch copper, etc. are mentioned. In particular, C11000, C10200, C19400, C70250, C26000, C52100, etc. of the standards defined by the Copper Development Association (CDA) may be used as the material of the base material.

(roughened plating layer)
The roughening plating layer is provided on the base material so as to cover at least a portion of the base material. In many cases, the roughening plating layer is provided so as to cover almost the entire surface of the base material. Alternatively, it may be substantially non-existent.

By scanning the surface of the roughened plating layer with a laser using a laser microscope, the S-ratio of the surface can be measured. S-ratio means the surface area ratio obtained by dividing the surface area including surface irregularities by the area observed by a laser microscope (the area of the surface in plan view). When the S-ratio value is large, it means that the surface area ratio is large and the surface is rough due to the degree or size of unevenness on the surface.

In this embodiment, the in-plane average value of S-ratio on the surface of the roughened plating layer is 1.3 or less. For example, when the metal material is a metal strip, or when it is a metal plate or metal foil having a substantially rectangular shape in plan view, the above in-plane average value is It is the average value of S-ratio measured at 5 points (5 points that divide the width into 6 equal parts) equally spaced in the width direction of the metal material at the central position in the longitudinal direction of the metal material.
Alternatively, if the metal material has another shape, 5 points that are evenly spaced along the shortest line segment in the plane in plan view are taken as the S-ratio measurement points, and measurements are taken at those measurement points. Let the average value of the values be the above-mentioned in-plane average value. In this case, the average value of the five measurement points at the central position of the maximum dimension in the direction orthogonal to the shortest line segment in plan view should be the in-plane average value.

When the in-plane average value of the S-ratio exceeds 1.3, gloss unevenness hardly occurs in the first place even if the in-plane variation of the S-ratio, which will be described later, occurs to some extent due to the roughness of the surface. Here, the target is a roughened plating layer having an in-plane average value of S-ratio of 1.3 or less, which may cause gloss unevenness. The in-plane average value of S-ratio may typically be 1.1 to 1.3.

As described above, when the in-plane average value of the S-ratio is relatively small, in-plane variations in the S-ratio are likely to occur, which may cause gloss unevenness. In contrast, in the metal material of this embodiment, the in-plane variation of the S-ratio on the surface of the roughening plating layer is 0.05 or less. By suppressing the in-plane variation of the S-ratio to a small value in this way, it is possible to effectively suppress uneven gloss on the surface. From this point of view, the in-plane variation of S-ratio is preferably 0.04 or less. Since it is desirable that the in-plane variation of the S-ratio is as small as possible in terms of suppressing gloss unevenness, there is no particular preferable lower limit, but it may be, for example, 0.02 or more.

In order to obtain the in-plane variation of the S-ratio, in the same way as the measurement point of the in-plane average value, on the surface of the roughened plating layer, at the center position in the longitudinal direction of the metal material, in the width direction or in the plane The S-ratio is measured at five equally spaced points along the shortest line segment and the difference between the maximum and minimum values of those five measurements is calculated. The difference between the maximum value and the minimum value is the in-plane variation of the S-ratio.

For measurement of the S-ratio, a shape analysis laser microscope VK-X150 manufactured by Keyence Corporation can be used as a laser microscope. In this case, the observation magnification can be 2000 times, the spot diameter can be φ0.8 mm, and the measurement area can be 100 μm×140 μm. The S-ratio is measured five times per measuring point, and the average value is used as the measured value. When measuring the S-ratio, the tilt or warp of a metal material sample placed on a laser microscope should be 1 degree or less.

The plating thickness of the roughened plating layer can be, for example, 0.3 μm to 7.0 μm, typically 0.3 μm to 1.5 μm. If the roughening plated layer is thin to some extent, the surface will not be so rough, and uneven gloss will become particularly noticeable. Therefore, it is effective to apply the technique described here to the formation of such a relatively thin roughened plating layer. If the roughened plating layer is too thin, there is a concern that the effect of providing the roughened plating layer, such as improved adhesion to the resin material, may not be sufficiently obtained.

For example, when a metal material, which is a metal strip, is produced by an electroplating apparatus described later, if a mask member that covers the width direction end of the plating material is not used, the plating thickness of the roughening plating layer is the same as that of the metal material It may be thicker at both ends than at the center in the width direction. Therefore, by using a mask member to suppress the concentration of the current at the end portions of the metal material in the width direction, the plating thickness of the roughening plating layer can be made uniform in the width direction of the metal material. More specifically, when the difference between the plating thickness of the roughened plating layer at the center in the width direction of the metal material and the thickness of the roughening plating layer at both ends in the width direction of the metal material is less than 0.5 μm. There is Here, the end of the metal material in the width direction means a position 0.5 mm away from the end surface in the width direction.

Typically, the roughening plated layer may be nickel plated and may include nickel. A nickel plating layer that is not roughening plating may be included between the base material and the roughening plating layer. Also, the metal material may include a palladium plating layer formed on the roughening plating layer and a gold plating layer formed on the palladium plating layer. Specific examples of the metal material include a substrate, a nickel plating layer, a roughened nickel plating layer, a palladium plating layer and a gold plating layer provided in this order, a substrate, a roughening nickel plating layer, a palladium plating layer and There are those in which a gold plating layer is provided in this order, and those in which a base material, a roughened nickel plating layer and a gold plating layer are provided in this order. When a palladium plating layer and a gold plating layer are included, the plating thickness of the palladium plating layer may be 0.01 μm to 0.05 μm, and the plating thickness of the gold plating layer may be 0.003 μm to 0.03 μm. In a metal material in which only a gold plating layer is formed on a roughening plating layer, the plating thickness of the gold plating layer may be 0.03 μm to 0.3 μm.

(Metal material)
The metal material can have various shapes, for example, a long metal strip, or a metal plate or metal foil having a polygonal shape such as a rectangular shape such as a substantially rectangular shape or a square shape when viewed from above, or other shapes. There are times when

A metal strip or a metal material such as a rectangular planar metal plate or metal foil may have a width of 20 mm or more. If the width of the metal material is wide, normally, when roughening plating is applied to the material to be plated by an electroplating apparatus, a difference in flow velocity of the plating solution occurs around the material to be plated, which is similarly wide, as will be described later. As a result, in-plane variations in the S-ratio of the surface of the roughened plating layer increase, and gloss unevenness may become apparent. On the other hand, according to the embodiments disclosed herein, uneven gloss can be effectively suppressed even with such a wide metal material. The width of the metal material may be, for example, 20 mm to 80 mm. Note that the thickness of the metal material may be 0.1 mm to 1.5 mm.

The above-mentioned metal materials can form a metal-resin composite material by joining a resin material with a roughened plating layer by insert molding, for example. A metal-resin composite material includes a metal material and a resin material, and the metal material and the resin material are effectively adhered by the roughened plating layer.
Such a metal material can be particularly suitably used for a lead frame on which a semiconductor chip is mounted and to which a resin material that seals the semiconductor chip is bonded.

(electroplating equipment)
The metal material as described above can be manufactured by applying roughening plating to the material to be plated 21 constituting the base material using the electroplating apparatus 1 shown in FIG. 1, for example. Here, the material 21 to be plated is in the form of a long strip or strip, but the shape of the material to be plated can be changed.

An electroplating apparatus 1 illustrated in FIG. 1 includes a plating bath 2 that stores a plating solution Sp inside. It has a side opening 2b and a bottom wall 2c sealing the lower side of the side wall 2a.

A plating passage 3 through which a material 21 to be plated passes while being immersed in the plating solution Sp is provided on the upper side inside the plating bath 2 (see FIG. 1(b)). In the plating passage 3, the material 21 to be plated passes through the plating bath 2 in the longitudinal direction that coincides with the longitudinal direction of the material 21 to be plated, as indicated by the white arrow in FIG. 1(a). Side wall portions 2a located at respective ends in the longitudinal direction of the plating tank 2 are provided with slits 3a and 3b that allow the plating passage 3 to communicate with the outside of the plating tank 2 so that the material to be plated 21 passes. On the other hand, on the bottom wall portion 2c on the lower side of the plating bath 2, the plating solution Sp is directed upward as indicated by the black arrow in FIG. A liquid supply port 4 for supplying liquid to the passage 3 is formed.

Inside the plating bath 2, anodes 5 extending in the longitudinal direction of the plating bath 2 are arranged on the sides of the plating passage 3 and between the plating passage 3 and the side wall portion 2a. When roughening plating is applied to the material 21 to be plated, the material 21 to be plated is used as a cathode, current is passed through the cathode and the anode 5, and a voltage is applied between them. At this time, the plating solution Sp is always supplied from the solution supply port 4 to the plating passage 3, and the plating solution Sp exceeding the storable amount in the plating tank 2 overflows from the plating tank 2 through the slits 3a and 3b. and flow out.

When electroplating is performed as described above, metal ions such as nickel ions contained in the plating solution Sp are deposited on both surfaces of the material to be plated 21 as a cathode located between the anodes 5 to form a roughened plating layer. to form When the roughened plating layers are formed on both sides of the material to be plated 21, the anodes 5 are arranged on both sides of the material to be plated 21 in the plating bath 2 as shown in the figure. When the roughened plating layer is formed only on one surface of the material 21, it may be arranged only on the surface side of the material to be plated 21 on which the roughened plating layer is to be formed.

Here, it is also conceivable to use an electroplating apparatus 11 of a reference example as shown in FIG. The electroplating apparatus 11 shown in FIG. 2 includes a plating bath 12, a plating passage 13, a liquid supply port 14 and an anode 15, which are substantially the same as the electroplating apparatus 1 shown in FIG. However, in the electroplating apparatus 11 of FIG. 2, a tubular liquid ejecting member extending upward from the liquid supply port 14 and extending in the longitudinal direction of the plating tank 12 is provided in the liquid supply port 14 formed in the bottom wall portion 12c. 16 is attached.

In the electroplating apparatus 11 of FIG. 2, the plating solution Sp supplied to the plating passage 13 of the plating bath 12 passes through the solution jetting member 16 from the solution supply port 14 . A large number of small openings (not shown) are provided on the obliquely downward side of the liquid jetting member 16, and the plating liquid Sp is jetted obliquely downward from these openings toward the bottom wall portion 12c. The plating solution Sp ejected from the solution ejecting member 16 on the bottom wall portion 12c side of the plating bath 12 flows toward the plating passage 13 side from the bottom wall portion 12c side and circulates in the plating bath 12 . After that, the plating solution Sp flows out from the slits 13 a and 13 b of the plating bath 12 .

By the way, when the material to be plated 21 is immersed in the plating solution Sp in a state where both ends 22 and 23 in the width direction thereof are exposed and a current is applied thereto, the current concentrates on the both ends 22 and 23 due to the dog-bone phenomenon. However, the plating thickness of the roughening plating layer formed on the material to be plated 21 is increased on both end portions 22 and 23, and the plating thickness of the roughening plating layer varies. In order to suppress this, in the illustrated example, mask members 17a and 17b are provided to cover both widthwise end portions 22 and 23 of the material to be plated 21, respectively. Each of the mask members 17a and 17b has a rod shape extending in the longitudinal direction of the plating tank 12, and as shown in FIG. It has a recess to do.

However, as described above, in the case of manufacturing a metal material having a roughened plating layer whose surface is not so rough such that the in-plane average value of S-ratio is 1.3 or less, the mask members 17a and 17b are used. It has been found that when the roughening plating layer is formed, uneven gloss occurs on the surface of the roughening plating layer due to variations in the surface area ratio of the roughening plating layer. The reason for this is that in the electroplating apparatus 11 of FIG. It is presumed that this is due to the turbulence around 21 and the difference in flow velocity. If gloss unevenness occurs on the surface of the roughening plating layer, there is a concern that the adhesion strength of the resin material may decrease there.

In order to deal with this, in the electroplating apparatus 1 of the embodiment shown in FIG. By arranging the rectifying member 6 , the flow of the plating solution Sp supplied from the solution supply port 4 is regulated by the rectifying member 6 so that the plating solution Sp can flow in the plating passage 3 . As a result, even if the mask members 7a and 7b are provided, turbulence in the flow of the plating solution Sp around the material to be plated 21 is suppressed. As a result, in the metal material produced by the electroplating apparatus 1, variations in the surface area ratio of the roughened plating layer are suppressed, and the occurrence of gloss unevenness can be effectively prevented.

The straightening member 6 may have any form as long as it can regulate the flow of the plating solution Sp from the solution supply port 4 and allow the plating solution Sp to flow into the plating passage 3 . The straightening member 6 can be, for example, a member such as a plate-like or sheet-like punching metal or mesh in which through holes or the like are formed substantially uniformly. It is preferable that the size of the through holes of the rectifying member 6 is 3 mm to 7 mm, and the interval between the through holes is 10 mm to 15 mm. If the through-holes are too large or the spacing between the through-holes is too narrow, the plating solution will be strongly agitated and uneven gloss may easily occur. If the through-holes are too small or the spacing between the through-holes is too large and the agitation of the plating solution weakens, affecting the film formation of the plating. In addition, there is concern about the occurrence of plating burn. Between the liquid supply port 4 and the plating passage 3, the plate-like or sheet-like rectifying member 6 is inclined or perpendicular to the flow direction of the plating solution from the liquid supply port 4 to the plating passage 3, for example, in a horizontal direction. can be placed in close proximity to the anode 5.

In the electroplating apparatus 1 shown in FIG. 1, the liquid ejection member 16 as shown in FIG. 2 is omitted. Disturbance of the flow of the plating solution Sp around the material to be plated 21 can be suppressed if the rectifying member 6 is arranged.

By using such an electroplating apparatus 1, as described above, roughening plating of a surface having an in-plane average value of S-ratio of 1.3 or less and an in-plane variation of S-ratio of 0.05 or less Metallic materials with layers can be manufactured. However, there are cases where such a metal material can be manufactured by using an apparatus or method other than the electroplating apparatus 1 shown in the figure.

Next, an electroplating apparatus and a metal material as described above were experimentally produced, and the effects thereof were confirmed, which will be described below. However, the description herein is for illustrative purposes only and is not intended to be limiting.

As a comparative example, using the electroplating apparatus shown in FIG. 2, a metal material was manufactured by forming a roughened plating layer on a material to be plated (base material). The electroplating conditions were as follows: flow rate of plating solution supplied from solution supply port: 140 mL/min, target plating thickness: 0.7 μm, current density: 10 A/dm ² , plating solution temperature: 45° C., plating time: 30 seconds. (film thickness 0.7 μm). The composition of the above Ni metal is nickel sulfamate tetrahydrate and nickel chloride as Ni salts, nickel sulfamate tetrahydrate: Ni(NH ₂ SO ₃ ) ₂ 4H ₂ O = 294 g/L (about 300 g /L), the amount of Ni is 53.5 g/L, nickel chloride hexahydrate: NiCl ₂ .6H ₂ O=about 310 g/L, the amount of Ni is 76.5 g/L.

In the comparative example, the metal material shown in FIG. 3 was obtained. The S-ratio of this metal material was measured by the method described above at five points A to E which are substantially equally spaced in the width direction of the metal material. Table 1 shows the results. As shown in Table 1, the in-plane variation of the S-ratio on the surface of the roughened plating layer of this metal material was as large as 0.083, and surface gloss unevenness occurred.

In order to investigate the cause of the large in-plane variation in the S-ratio of the metal material produced by the electroplating apparatus of FIG. A simulation was performed. Here, ANSYS FLUENT manufactured by ANSYS Corporation was used as fluid analysis software, and the flow rate of the plating solution supplied from the solution supply port was set to 140 mL/min. The results are shown in FIGS. FIG. 4 corresponds to the cross-sectional view of FIG. 2(b), and arrows indicate the advancing direction of the plating solution. FIG. 5 is an enlarged view of the vicinity of the material to be plated in FIG.
From FIGS. 4 and 5, it can be seen that the plating solution collides particularly with the mask member, the flow is disturbed, and it moves very complicatedly around the material to be plated.

In addition, the flow velocity of the plating solution at each position in the feed direction of the material to be plated at each of five locations in the vicinity of the surface of the material to be plated that are equally spaced apart in the width direction of the material to be plated (the depth direction of the electrolytic bath) was calculated. The results are shown in FIG. In FIG. 6, from A to E, the flow velocity at deeper points in the depth direction of the electrolytic cell is shown, and those points A to E correspond to five points A to E in FIG. .

It can be seen from FIG. 6 that the flow velocity difference of the plating solution fluctuates greatly on the surface of the material to be plated. If the flow velocity difference becomes large, a difference may occur in the growth of the projections of the roughened plating layer. More specifically, convexities tend to grow at locations where the difference in flow velocity of the plating solution is high and the amount of supplied metal ions is large, but at locations where the difference in flow velocity is low, the amount of supplied metal ions decreases and the convexity grows. hard to do. The locations C to E in FIG. 6 where the flow velocity is low match the locations C to E in Table 1 where the S-ratio value is small.

According to the above simulation results, the arrangement of the mask member disturbs the flow of the plating solution around the material to be plated, and the difference in flow velocity fluctuates. ), and is presumed to be the cause of uneven gloss. Therefore, as in the electroplating apparatus shown in FIG. 1, a rectifying member is arranged between the solution supply port and the plating passage to regulate the flow of the plating solution supplied from the solution supply port so that the plating solution flows into the plating passage. It is thought that flushing is effective.

In order to verify the effect of arranging the rectifying members, a similar simulation was performed simulating the electroplating apparatus of FIG. The results are shown in FIGS. 7-9. From FIGS. 7 to 9, it can be seen that the flow of the plating solution in the plating tank is stabilized by disposing the rectifying member, and the difference in flow velocity near the material to be plated is eliminated.

Since the above simulation results were favorable, a metal material was experimentally manufactured using the electroplating apparatus of FIG. 1 as an invention example. The electroplating conditions were the same as in the above comparative example. The S-ratio of the metal material thus obtained was measured at the same five points. Table 2 shows the results.

As can be seen from Table 2, in the invention example, the in-plane variation of the S-ratio on the surface of the roughened plating layer of the metal material was 0.036, which is sufficiently small. In addition, this metal material had an improved uneven gloss on the surface.

From the above, it was found that the metal material and the electroplating apparatus described above can effectively suppress the occurrence of uneven gloss on the surface of a roughened plating layer having a relatively low surface area ratio.

Reference Signs List 1, 11 electroplating apparatus 2, 12 plating tank 2a, 12a side wall 2b, 12b opening 2c, 12c bottom wall 3, 13 plating passage 3a, 3b, 13a, 13b slit 4, 14 liquid supply port 5, 15 anode 6 rectifying member 16 liquid ejecting member 7a, 7b, 17a, 17b masking member 21 material to be plated 22, 23 ends in width direction Sp plating solution

Claims (9)

A metal material comprising a base material and a roughened plating layer provided on the base material,
A metal material having an in-plane average value of S-ratio on the surface of the roughening plating layer of 1.3 or less and an in-plane variation of S-ratio on the surface of the roughening plating layer of 0.05 or less. 2. The metal material according to claim 1, wherein the roughening plating layer has a plating thickness of 0.3 μm to 1.5 μm. 3. The metal material according to claim 1, wherein said metal material is a metal strip. 4. The method according to claim 3, wherein the difference between the plating thickness of the roughened plating layer at the central portion in the width direction of the metal material and the thickness of the roughening plating layer at the end portions in the width direction of the metal material is less than 0.5 μm. Metal material as described. 5. The metal material according to claim 3, wherein the width of the metal material is 20 mm or more. The metal material according to any one of claims 1 to 5, wherein the roughened plating layer contains nickel. The metal material according to any one of claims 1 to 6, which is used for lead frames. A metal-resin composite material comprising the metal material according to any one of claims 1 to 7 and a resin material bonded to the metal material by the roughening plating layer. An electroplating apparatus for producing a metal material by providing a roughened plating layer on a material to be plated as a base material,
a plating passage through which the material to be plated extending in the longitudinal direction passes along the longitudinal direction while being immersed in the plating solution;
a liquid supply port for supplying a plating liquid to the plating passage;
an anode provided at a position facing the surface of the material to be plated on the side of the plating passage and through which current flows using the material to be plated as a cathode;
a mask member covering both ends in the width direction of the material to be plated;
an electroplating apparatus comprising: a rectifying member disposed between the solution supply port and the plating passage, for regulating the flow of the plating solution supplied from the solution supply port and allowing the plating solution to flow into the plating passage.

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