JP2022176967A5

JP2022176967A5 -

Info

Publication number: JP2022176967A5
Application number: JP2022130274A
Authority: JP
Filing date: 2022-08-17
Publication date: 2023-01-23

Claims

An anisotropic conductive film having an insulating resin layer and conductive particles arranged in the insulating resin layer,
An anisotropic conductive film having a plurality of regions in which at least one of the number density, particle diameter and hardness of conductive particles is different from each other and which is spaced apart .

2. The anisotropic conductive film according to claim 1, wherein a plurality of regions are formed in one insulating resin layer.

3. The anisotropic conductive film according to claim 1, wherein the conductive particles are arranged regularly.

The anisotropic anisotropic film according to any one of claims 1 to 3, wherein a plurality of regions in which at least one of the number density, particle diameter and hardness of the conductive particles is different is arranged in the lateral direction or the longitudinal direction of the anisotropic conductive film. conductive film.

The positions of the conductive particles in the thickness direction of the insulating resin layer are aligned on one surface of the insulating resin layer or its vicinity, on one surface or its vicinity, and on the other surface or its vicinity. The anisotropic conductive film according to any one of claims 1 to 4 , which has aligned regions.

The anisotropic conductive film according to claim 5 , which has a region in which conductive particle units in which two conductive particles are overlapped in a plan view of the anisotropic conductive film are regularly arranged and a region in which single conductive particles are regularly arranged. the film.

7. The anisotropic conductive film according to claim 1 , wherein the insulating resin layer is laminated with a second insulating resin layer having a lower minimum melt viscosity than the insulating resin layer.

The anisotropy according to any one of claims 1 to 7 , wherein the surface of the insulating resin layer near the conductive particles has an inclination or undulations with respect to the tangential plane of the insulating resin layer in the central portion between adjacent conductive particles. conductive film.

In the inclination, the surface of the insulating resin layer in the vicinity of the conductive particles is chipped with respect to the tangential plane, and in the undulation, the resin amount of the insulating resin layer directly above the conductive particles is 9. The anisotropic conductive film according to claim 8 , wherein the surface of the insulating resin layer is less than the surface of the insulating resin layer of (1) on the tangential plane.

a first pressing step of attaching conductive particles to one surface of the insulating resin layer and pressing the conductive particles into the insulating resin layer;
In a plan view, a region that is part of the region where the conductive particles are pushed in the first pushing step, or a region that includes the entire region where the conductive particles are pushed in the first pushing step, or the conductive particles in the first pushing step A second pressing step of attaching conductive particles to a region that partially overlaps the region where the is pressed, and pressing the conductive particles into the insulating resin layer;
A method for producing an anisotropic conductive film having
A method for producing an anisotropic conductive film, wherein at least one of the number density, particle diameter and hardness of conductive particles is different from each other and a plurality of regions are formed apart from each other.

11. The method for producing an anisotropic conductive film according to claim 10, wherein a plurality of regions are formed in one insulating resin layer.

12. Anisotropic according to claim 10 or 11 , wherein the conductive particles pressed into the insulating resin layer in the first pressing step and the conductive particles pressed into the insulating resin layer in the second pressing step have the same particle size and hardness. A method for producing a conductive film.

The anisotropic conductive film according to claim 10 or 11 , wherein the conductive particles pressed into the insulating resin layer in the first pressing step and the conductive particles pressed into the insulating resin layer in the second pressing step have different particle sizes or hardness. manufacturing method.

Any one of claims 10 to 13 , wherein the arrangement or number density of the conductive particles pressed into the insulating resin layer in the first pressing step is different from the arrangement or number density of the conductive particles pressed into the insulating resin layer in the second pressing step. The method for producing the anisotropic conductive film according to 1.

wherein in the first pressing step, a transfer mold is used to adhere the conductive particles to the insulating resin layer, and in the second pressing step, the transfer mold is used to adhere the conductive particles to the insulating resin layer ; 13. The method for producing an anisotropic conductive film according to any one of 12 .

16. The method for producing an anisotropic conductive film according to any one of claims 10 to 15 , wherein in the second pressing step, conductive particles are attached to the one surface or the other surface of the insulating resin layer.

The method for producing an anisotropic conductive film according to any one of claims 10 to 16 , wherein the insulating resin layer into which the conductive particles are pushed is slit after the second pushing step.

A first electronic component having a first terminal pattern, and a second electronic component having a second terminal pattern having terminals different in size and pitch from the first terminal pattern, the first terminal pattern and the second terminal pattern. A connection structure anisotropically conductively connected to a third electronic component having terminal patterns corresponding to each of the terminal patterns and an anisotropic conductive film,
A connection structure, wherein the anisotropic conductive film is the anisotropic conductive film according to claim 1 or 2.

The anisotropic conductive film has conductive particles arranged regularly, and the number density of the conductive particles is 35000/mm ²² 19. The connection structure of claim 18, having an area of less than .

19. The connection structure according to claim 18, wherein the anisotropic conductive film has a plurality of regions in which the conductive particles are regularly arranged and at least one of the number density, particle diameter and hardness of the conductive particles is different.

The connection structure according to any one of claims 18 to 20, wherein a plurality of first electronic components or a plurality of second electronic components are connected in at least one region of the anisotropic conductive film.

A first electronic component having a first terminal pattern and a second electronic component having a second terminal pattern having terminals different in size and pitch from the first terminal pattern are combined into A method for manufacturing a connection structure that anisotropically conductively connects a third electronic component having terminal patterns corresponding to each of the terminal patterns and an anisotropic conductive film, the method comprising:
A method for producing a connected structure, using the anisotropic conductive film according to claim 1 or 2 as an anisotropic conductive film .

The first electronic component and the second electronic component placed on the third electronic component via the anisotropic conductive film are crimped from the side of the first electronic component and the second electronic component with a pressure tool. 23. The manufacturing method of the connection structure according to 22.

24. The manufacturing method of the connection structure according to claim 23 , wherein the first electronic component and the second electronic component are crimped simultaneously.

The method for producing a connected structure according to any one of claims 22 to 24, wherein a plurality of first electronic components or a plurality of second electronic components are connected in at least one of the regions of the anisotropic conductive film. .