JP2022168588A - Base material with resin molding, and method for manufacturing base material with resin molding - Google Patents

Abstract

To manufacture a base material with suppressed warpage while reducing the number of times of heating treatment.SOLUTION: A base material 1 with resin molding comprises: a plate-like base material 10 containing a fiber and a first thermoplastic resin, and having a first surface 10A and a second surface 10B opposite to the first surface; and a first runner portion 23A provided on the second surface 10B of the base material 10, and extending in a first direction. The first surface 10A of the base material 10 is provided with grooves 12A and 12B extending in the first direction, and the grooves 12A and 12B are provided with warpage suppression portions 24A and 24B in which a second thermoplastic resin is filled.SELECTED DRAWING: Figure 1

Description

The technology disclosed in the present specification relates to a base material with a resin molded body and a method for manufacturing the base material with a resin molded body.

BACKGROUND ART Conventionally, base materials containing plant fibers and resins have been used as base materials for vehicle interiors. For example, in Patent Document 1, a flat plate-shaped preboard is prepared in advance by blending plant fibers and resin fibers and heat molding, and at the necessary timing, this preboard is reheated and cold press molded. It is disclosed that the desired shape is imparted by It also describes that a resin molding is provided integrally with the base material by subsequently performing injection molding on the cold-press-molded base material.

JP 2020-157603 A

In the base material manufacturing method of Patent Document 1, the heat treatment is performed twice during the preparation of the preboard and when the base material is molded. I have a problem. Moreover, in cold press molding, in addition to the press molding machine, it is necessary to have a means for reheating the preboard, and this has caused restrictions in terms of manufacturing equipment.

In order to solve such problems, it is conceivable to carry out cold press molding without heating. Here, when the preboard is reheated and cold press molded, the resin in the preboard is in a softened state. can be done. However, when cold press molding is performed without reheating the preboard, when the injection-molded resin molding shrinks on the surface of the base material, compressive stress is generated along the surface of the base material, causing the base material to warp. A new problem arises.

The technique disclosed herein has been perfected based on the above circumstances, and aims to reduce the number of heat treatments and suppress warping to produce a base material with a resin molded body. It is.

A substrate with a resin molded body according to the technology disclosed herein includes a plate-like substrate containing fibers and a first thermoplastic resin and having a first surface and a second surface opposite to the first surface. and a resin molded body provided on the second surface of the base material and extending along the first direction, wherein the first surface of the base material includes grooves extending along the first direction. The groove is provided with a warpage suppressing portion filled with a second thermoplastic resin.

The thermoplastic resin that forms the resin molding generally undergoes thermal contraction when transformed from a molten state to a solidified state, and the thermal shrinkage rate is greater than that of a base material in which fibers are bound with a thermoplastic resin binder. Therefore, when the resin molded body is formed integrally with the base material, if the base material is also heated to integrally form the resin molded body, warping of the base material caused by the difference in thermal shrinkage can be alleviated. On the other hand, if the resin molding is integrally formed without heating the base material, the warp of the base material due to the difference in the thermal shrinkage rate will be conspicuous. Therefore, according to the above configuration, the resin molded body is provided on one surface of the substrate, and the warpage suppressing portion is provided on the other surface along the resin molded body. Thereby, on the front and back plate surfaces of the base material, the compressive stress caused by the heat shrinkage of the resin molded body and the compressive stress caused by the warp suppressing portion are balanced, and the warp of the base material is suppressed.

In a preferred aspect of the present technology, the warpage suppressing portion is provided at a position overlapping the resin molded body. According to the above configuration, the compressive stress acting on the first surface of the base material due to the resin molding is effectively offset by the compressive stress acting on the second surface of the base material due to the warpage suppressing portion. be able to.

In a preferred aspect of the present technology, the groove includes a first groove and a second groove provided so as to sandwich the resin molded body in a second direction that intersects with the first direction, and the warpage suppressing portion is and a first warp suppressing portion and a second warp suppressing portion formed by filling the first groove and the second groove with the second thermoplastic resin. According to the above configuration, it is possible to suppress the compressive stress caused by thermal contraction of the thermoplastic resin from acting locally on the substrate.

In a preferred aspect of the present technology, the cross-sectional area S1 of the warpage suppressing portion in the second direction intersecting the first direction satisfies the following relationship with respect to the cross-sectional area S2 of the resin molded body in the second direction: 0. 5×S2≦S1≦1.5×S2; is satisfied. According to the above configuration, the compressive stress acting on the second surface of the base due to the resin molding and the compressive stress acting on the first surface of the base due to the warp suppressing portion are effectively balanced. can be made

In a preferred aspect of the present technology, the dimension W1 of the warpage suppressing portion along the second direction intersecting the first direction satisfies the following relationship with respect to the dimension W2 of the resin molded body along the second direction: 0.0. 8×W2≦W1≦1.2×W2; is satisfied. According to the above configuration, when the height of the resin molded body from the plate surface of the base material is high, the compressive stress acting on the second surface of the base material due to the resin molded body and the warp suppressing portion Compressive stress acting on the first surface of the substrate can be effectively balanced.

In a preferred aspect of the present technology, the dimension of the warpage suppressing portion along the thickness direction of the base material is 50% or less of the thickness of the base material. According to the above configuration, it is possible to suppress the warp while avoiding a reduction in the strength of the base material due to the provision of the warp suppressing portion.

In a preferred aspect of the present technology, a through hole that penetrates the base material is provided, and a continuous portion filled with the second thermoplastic resin is provided inside the through hole, and the resin The molded article and the warp suppressing portion are continuous through the continuous portion. According to the above configuration, the base material can be easily manufactured, and can be provided as a low-cost base material, for example.

In a preferred aspect of the present technology, the first surface has a bent portion that is bent so as to protrude, the bent portion is continuous with the groove, and the first surface of the bent portion A corner portion that is continuous with the corner portion is provided with a filling portion that is filled with the second thermoplastic resin. If the base material is folded without heating, the base material will be bent, so the base material will tear at the outer surface of the bent portion, and the surface smoothness will be lost and the base material will be thin. It is conceivable that the strength will decrease as a result. According to the above configuration, since the bent portion is provided with the resin portion continuously to the warpage suppressing portion, the surface of the base material can be smoothed and the plate thickness can be made uniform by the resin portion. This makes it possible to provide substrates in various forms.

In another aspect, a method for manufacturing a base material with a resin molded body according to the technique disclosed herein includes fibers and a first thermoplastic resin, and a first surface and a first surface opposite to the first surface. A plate-shaped substrate having two surfaces, the groove extending along the first direction on the first surface so as to extend along the resin molded body to be provided on the second surface and extending in the first direction and supplying a second thermoplastic resin for forming the resin molded body on the second surface of the base material at a temperature at which the first thermoplastic resin does not melt. At the same time, by supplying a third thermoplastic resin to the grooves on the first surface, the resin molded body is provided on the second surface and the third thermoplastic resin is filled in the grooves on the first surface. and a resin supply step of obtaining a base material with a resin molded body having a warp suppressing portion filled with.

According to the above configuration, in accordance with the formation of the resin molded body on one surface of the base material, the warpage suppressing portion is provided on the other surface of the base material so as to follow the resin molded body, thereby heating the base material. It is possible to manufacture a base material with a resin molded body without carrying out. As a result, the compressive stress caused by the heat shrinkage of the thermoplastic resin and the compressive stress caused by the warp suppressing portion can be balanced on the front and back plate surfaces of the base material, and the non-heating process can be performed without greatly increasing the number of processes. Thus, a base material with a resin molded body in which warping is suppressed can be produced.

In a preferred aspect of the present technology, the preparing step comprises forming a plate-shaped sheet containing the fibers and the first thermoplastic resin, having the first surface and the second surface, but not having the grooves. a preboard preparation step of preparing a grooveless preboard; and a groove forming step of providing the grooves in the second surface of the grooveless preboard. The substrate in the present technology may be obtained with grooves formed in advance, or may be used by preparing a preboard without grooves and forming grooves on it. Here, the base material having the grooves formed in advance has the disadvantage that the applications are limited and it is difficult to respond to design changes in a short period of time. According to the above configuration, for example, the substrate disclosed herein can be manufactured using a preboard that is not limited in use.

In a preferred aspect of the present technology, the second thermoplastic resin and the third thermoplastic resin are the same, the preparing step includes the fibers and the first thermoplastic resin, and A preboard preparation step of preparing a plate-shaped non-grooved preboard having a first surface and a second surface but not having the groove, providing a through hole penetrating the preboard, and forming the through hole and the groove. and a communicating step of making a notch that communicates with the through hole, and in the resin supplying step, the second thermoplastic resin for forming the resin molded body is supplied to the second surface of the preboard, and the through hole to feed the second thermoplastic resin to the first surface via and into the grooves. According to the above configuration, since the preboard is provided with the through-hole, by supplying the second thermoplastic resin to one surface, the second thermoplastic resin is supplied to the other surface through the through-hole. can send. As a result, the base material can be produced by simplifying the base material manufacturing apparatus.

In a preferred aspect of the present technology, the preparing step comprises forming a plate-shaped sheet containing the fibers and the first thermoplastic resin, having the first surface and the second surface, but not having the grooves. A preboard preparation step of preparing a preboard without grooves, a cutting step of making a cut at a predetermined location on the first surface of the preboard, and a temperature at which the first thermoplastic resin does not melt, cutting the preboard along the cut and A press molding step of forming the cutout portion by opening the notch by pressing with the molding surface of the mold so that the first surface is bent so as to protrude, and in the resin supply step and filling the notch with the second thermoplastic resin. According to the above configuration, the base material is press-molded at the same time, and the defective shape of the base material caused by the non-heated press-molding is compensated by filling the thermoplastic resin in the resin supply step. As a result, it is possible to efficiently produce substrates of various forms without heating.

According to the technology disclosed in the present specification, it is possible to reduce the number of heat treatments and suppress warping to produce a base material with a resin molded body.

1 is a perspective view of a seat backboard according to an embodiment viewed from the front side; FIG. A plan view of the seat back board in FIG. 1 as seen from the back side Cross-sectional view showing a state in which a grooveless preboard is being pressed by a press die. Perspective view of the pre-board seen from the front side Cross-sectional view of the preboard set in the mold (open state) Cross-sectional view of the main parts with the preboard set in the mold (open state) Cross-sectional view including the groove with the preboard set in the mold (open state) Cross-sectional view of the main parts when the preboard is pressed by the mold (closed state) Another cross-sectional view of the main part showing the state in which the preboard is set in the mold and the slide mold is in a protruded state (closed state) Cross-sectional view of the main parts including the grooves with the preboard set in the mold (closed state) Another cross-sectional view of the main part showing the state in which the preboard is set in the mold and the slide mold is moved to the retracted state (closed state) Cross-sectional view of main parts showing a state after resin is injected into the mold of FIG. 8 (closed state) Another main part cross-sectional view showing the state after resin is injected into the mold of FIG. 9 (closed state) Cross-sectional view of essential parts including grooves after resin is injected into the mold of FIG. 10 (closed state) FIG. 11 is a cross-sectional view showing a state where the seat backboard is completed by opening the molding device from the state shown in FIG. 11 (open state). FIG. 12 is a cross-sectional view of the main parts showing a state where the seat backboard is completed by opening the molding device from the state shown in FIG. 12 (open state). Cross-sectional view including grooves in a state where the seat backboard is completed by opening the molding device from the state shown in FIG. 13 (open state) Principal part cross-sectional view of a seat backboard according to another embodiment

<<Embodiment 1>>
An embodiment of the present technology will be described with reference to FIGS. 1 to 17. FIG. The base material with a resin molded body and the method for manufacturing the base material with a resin molded body of the present embodiment are preferable for the seat backboard 1 (an example of the base material with a resin molded body) constituting a seat for a vehicle such as an automobile and its manufacture. Applies. More specifically, a vehicle seat includes a seat cushion on which an occupant sits, and a seat back, which is a backrest portion. part. For example, when the seat back is reclined on the seat surface, the seat back board 1 becomes a flat and strong loading platform, floor, or the like, so that heavy luggage or the like can be placed thereon without hesitation.

A part of each drawing shows an X-axis, a Y-axis, and a Z-axis. 1 corresponds to the thickness direction. In this embodiment, the X-axis, Y-axis, and Z-axis are orthogonal to each other. In addition, the upper side in FIG. 1 is the front side, the lower side of the figure is the back side, the direction along the X axis corresponds to the first direction in the present technology, and the direction along the Y axis corresponds to the second direction in the present technology. do. With respect to a plurality of identical parts, one part may be given a code and the other parts may be omitted.

<Seat back board>
As shown in FIGS. 1 and 2, the seat back board 1 has a substantially rectangular shallow plate shape as a whole. The seat backboard 1 includes a base material 10 and a resin portion 20 provided at a predetermined portion of the base material 10 . The resin portion 20 includes a resin molded body 21 , a warp suppressing portion 24 , a filling portion 27 and a resin corner portion 28 . Each part will be described below.

The base material 10 constitutes the main body of the seat backboard 1 and includes a binder made of fibers and a first thermoplastic resin. It is configured by being transformed into Kenaf fibers can be used as the fibers contained in the base material 10 . The type of fiber is not limited to this, and may be, for example, wood fiber, thermoplastic resin fiber, glass fiber, carbon fiber, or the like. Any one of these may be used, or two or more may be used in combination. The first thermoplastic resin as the binder preferably has a higher softening point or melting point than the later-described second thermoplastic resin. Also, if the fibers are thermoplastic resin fibers, the thermoplastic resin fibers may have a higher softening point or melting point than the first thermoplastic resin and the second thermoplastic resin. Such a first thermoplastic resin may be, for example, a polyester-based resin such as polyethylene or polypropylene. Part or all of the first thermoplastic resin may be fibrous. The ratio of the fibers to the first thermoplastic resin as the binder can be, for example, about 20:80 to 90:10, 50:50 to 80:20 in terms of fiber:binder mass ratio.

The base material 10 has roughly the same outer shape as the seat backboard 1 . The substrate 10 has a front surface 10A (an example of a first surface) arranged on the front side and a back surface 10B (an example of a second surface) arranged on the back side. As will be described later in detail, the base material 10 is formed by bending the side wall portions 13P provided on the four peripheral edges toward the back side of a flat preboard 10P having a shape as shown in FIG. 4 when unfolded. It is The base material 10 includes a flat main surface portion 11 constituting a design surface (front surface) arranged on the front side, grooves 12 provided in the main surface portion 11, and extending from the peripheral edge of the main surface portion 11 toward the back side. It includes a side wall portion 13 , a bent portion 14 connecting the main surface portion 11 and the side wall portion 13 , and a through hole 16 . The through hole 16 is an element additionally provided in this embodiment.

The main surface portion 11 has a substantially rectangular flat plate shape with rounded corners. The side wall portion 13 has a plate piece shape, and is provided so as to extend toward the back side at four ends of the main surface portion 11 excluding rounded corner portions (hereinafter referred to as “rounded corner portions”). Although not limited to this, the side wall portion 13 in this example is arranged so as to be substantially perpendicular to the main surface portion 11. The bent portion 14 extends between the main surface portion 11 and the side wall portion 13. It is a curved surface portion that smoothly connects the main surface portion 11 and the side wall portion 13. The bent portion 14 is a notch portion 15P provided on the surface 10A of the preboard 10P, which will be described later. It includes an open cutout portion 15. The cutout portion 15 is thinner than the main surface portion 11 and the side wall portion 13. As shown in FIG.

The groove 12 is a concave groove provided on the surface of the main surface portion 11 . The groove 12 of this example has a U-shaped cross section. The groove 12 is a mold for forming and accommodating the warpage suppressing portion 24 . The grooves 12 extend substantially along the arrangement direction of the resin moldings 21 provided on the back surface of the main surface portion 11 . In this example, the grooves 12 are two grooves, a first groove 12A and a second groove 12B, separated in parallel along the first direction so as to sandwich the resin molded body 21 extending along the first direction in the second direction. is provided. Further, in this example, the grooves 12 are formed by two grooves, a third groove 12C and a fourth groove 12D, parallel to each other in the second direction so as to sandwich the resin molded body 21 extending in the second direction in the first direction. are spaced apart.

The through-hole 16 is a hole that penetrates the base material 10 and communicates the front surface 10A and the rear surface 10B. The through-hole 16 is located at a position overlapping at least one of the warp suppressing portion 24 and the compensating portion 27 so as to connect the resin molded body 21 provided on the back surface 10B and the warp suppressing portion 24 and the compensating portion 27 provided on the front surface 10A. provided in In this example, the through hole 16 is provided at the point where the resin molding 21 and the filling portion 27 overlap. More specifically, the through holes 16 are located at both end portions of the two first runner portions 23A and 23B (resin molded body 21) described later, and at points overlapping with the four filling portions 27 (each filling portion 27 central portion in the longitudinal direction).

Therefore, the preboard 10P has a shape in which the main surface portion 11, the side wall portion 13, and the bent portion 14 are developed into a single flat plate. The preboard 10P has a front surface 10AP (an example of a first surface) arranged on the front side and a back surface 10BP (an example of a second surface) arranged on the back side. The preboard 10P includes a main surface portion 11P corresponding to the main surface portion 11, a side wall portion 13P corresponding to the side wall portion 13, and a bent portion 14P corresponding to the bent portion 14 provided between the main surface portion 11P and the side wall portion 13P. ,including. A notch portion 15P corresponding to the notch portion 15 is provided in the bent portion 14P. The notch portion 15P is formed as a V-groove having a V-shaped cross section on the surface 10A of the bent portion 14P. Through-holes 16P corresponding to the through-holes 16 are provided in central portions along the longitudinal direction of the four notches 15P. Further, grooves 12P (first groove 12AP to fourth groove 12DP) corresponding to the grooves 12 (first groove 12A to fourth groove 12D) are provided on the main surface portion 11P of the preboard 10P. The preboard 10P is formed by forming rounded corners of the main surface portion 11P and the side wall portions 13P at the four corners of a substantially rectangular flat plate-like preboard that is slightly larger than the main surface portion 11P, while removing the remaining portions (for example, die-cutting). It is formed by doing). Since the preboard 10P of this example is a stampable sheet before being subjected to three-dimensional molding, the dimension in the thickness direction of each part is larger than that of the base material 10 by the compression rate, and the density of each part is , can be smaller than the substrate 10 by the compressibility.

The resin portion 20 is formed integrally with the base material 10 . A part of the resin part 20 may be impregnated with the base material 10 . As described above, the resin portion 20 includes the resin molded body 21 provided on the back surface of the base material 10, the warp suppressing portion 24 and the filling portion 27 provided on the front surface of the base material 10, and the four side wall portions 13. and a resin corner portion 28 smoothly connecting the main surface portion 11 and the main surface portion 11 . The resin molding 21 includes a clip seat 22, first runner portions 23A and 23B, second runner portions 23C, and rib portions 23D. These resin moldings 21 are made of, for example, a thermoplastic resin (second thermoplastic resin) such as polypropylene.

The clip seat 22 is formed so as to protrude from the back surface 10B of the main surface portion 11 of the base material 10 . In this example, one clip seat 22 is provided at the center of the main surface portion 11 to simplify the explanation, but two or more clip seats 22 may be provided. The clip seat 22 has a substantially cylindrical shape with a lid, and a clip (not shown) can be fitted into a hole provided in the lid so as to protrude toward the back side. The clip seat 22 is formed by cooling and hardening molten resin filled in a clip seat forming cavity C2 provided in a mold 50 (lower mold 61) described later.

The rib portion 23</b>D is a plurality of plate piece-like members connected to the main surface portion 11 and the side wall portion 13 . The rib portion 23</b>D is an element that binds the side wall portion 13 to the main surface portion 11 and supports the posture of the side wall portion 13 with respect to the main surface portion 11 . The rib portion 23D can be an element that assists the bondability so that the side wall portion 13 is bonded to the main surface portion 11 with a predetermined strength. The rib portion 23D is formed by cooling and hardening molten resin filled in a cavity C3 for rib portion formation provided in a mold 50 (lower mold 61) described later.

The first runner portions 23A, 23B and the second runner portion 23C are formed by cooling and hardening the molten resin filled in the first runner 64 and the second runner 65 provided in the mold 50 (lower mold 61). It is formed. Here, the first runner 64 and the second runner 65 are passages for feeding molten resin to the cavities C2 and C3 for forming the clip seat 22 and the rib portion 23D. The first runners 23A and 23B are in the form of standing walls erected with respect to the main surface 11 and extend in four directions from the clip seat 22 to the side wall 13 in the first direction and the second direction. In this example, the first runner portion 23A represents the portion extending along the first direction, and the first runner portion 23B represents the portion extending along the second direction. The second runners are arranged along respective joints of the main surface portion 11 and the four side wall portions 13, are connected to both the main surface portion 11 and the side wall portions 13, and are connected to the first runner portions 23A and 23B. is also connected to the rib portion 23D. The first runner portions 23A, 23B and the second runner portion 23C are formed so as to cross the main surface portion 11 along the first direction or the second direction.

The warp suppressing portion 24 is an element for reducing the compressive stress acting on the surface of the main surface portion 11 due to the production of the resin molded body 21 and suppressing the warp of the base material 10 . In this example, the warp suppressing portion 24 is provided to suppress warping caused by the first runner portions 23</b>A and 23</b>B having a large dimension along the surface direction of the main surface portion 11 in the resin molded body 21 . The warp suppressing portion 24 is formed by cooling and hardening the molten resin filled in the first to fourth grooves 12A to 12D. The warpage suppressing portion 24 is formed so that the surface of the main surface portion 11 recessed by the first grooves 12A to the fourth grooves 12D is flush. In this example, the warp suppressing portion 24 includes a first warp suppressing portion 24A and a second warp suppressing portion 24B so as to sandwich the first runner portion 23A extending along the first direction in the second direction. They are spaced apart in parallel along the direction. Further, in this example, the warp suppressing portion 24 is composed of the third warp suppressing portion 24C and the fourth warp suppressing portion 24D so as to sandwich the first runner portion 23B extending along the second direction in the first direction. They are spaced apart in parallel along the second direction. The warpage suppressing portion 24 is preferably provided over the range in which the first runner portions 23A and 23B extend.

Regarding the shape of the warp suppressing portion 24, for example, the cross-sectional area S1 (total value) along the second direction of the first warp suppressing portion 24A and the second warp suppressing portion 24B is the same as that of the first runner portion 23A in the second direction. and the following relationship: 0.5×S2≦S1≦1.5×S2; In addition, independently, the cross-sectional area S1 (total value) along the first direction of the third warp suppressing portion 24C and the fourth warp suppressing portion 24D is the cross-sectional area S2 along the first direction of the first runner portion 23B, The following relationship should be satisfied: 0.5*S2≤S1≤1.5*S2. Thereby, the warp of the base material 10 caused by the first runner portions 23A, 23B can be suitably balanced with the warp suppressing force of the warp suppressing portions 24A, 24B, 24C, 24D. These cross-sectional areas S1 and S2 preferably independently satisfy 0.7×S2≦S1≦1.3×S2, and more preferably satisfy 0.9×S2≦S1≦1.1×S2.

Regarding the shape of the warp suppressing portion 24, for example, the dimension W1 of the warp suppressing portion along the second direction intersecting the first direction is as follows with respect to the dimension W2 of the resin molding along the second direction: Relationship: 0.8×W2≦W1≦1.2×W2; In addition, independently, the dimension W1 along the first direction of the third warp suppressing portion 24C and the fourth warp suppressing portion 24D (total value) is equal to the dimension W2 along the first direction of the first runner portion 23B and the following Relationship: 0.8×W2≦W1≦1.2×W2; With such a configuration as well, the warp of the base material 10 caused by the first runner portions 23A, 23B can be suitably balanced with the warp suppressing force of the warp suppressing portions 24A, 24B, 24C, 24D. Note that the dimensions L1 and L2 of the first runner portions 23A and 23B and the warpage suppressing portion 24 are preferably the dimensions of the portions in contact with the base material. Moreover, the dimension of the warp suppressing portion 24 along the thickness direction of the base material 10 is 50% or less (about 20% here) of the thickness of the base material 10 .

The filling portion 27 is provided on the surface 10A side of the notch portion 15 . The filling portion 27 fills the notch portion 15 thinner than the main surface portion 11 and the side wall portion 13 in the bent portion 14 to smoothly connect the surface 10A of the main surface portion 11 and the surface 10A of the side wall portion 13. It is an element to let The filling portion 27 is also an element that increases the rigidity of the base material 10 and the bonding strength between the main surface portion 11 and the side wall portion 13 . The filling portion 27 of this example is formed to have a fan-shaped cross section. The filling portion 27 is formed by cooling and hardening the molten resin filled in a portion (cavity C4) corresponding to the filling portion in the molding space C1 provided in the mold 50, which will be described later. In addition, in this example, a through hole 16 is provided at a point (overlapping point) where the warp suppressing portion 24 and the filling portion 27 of the base material 10 are joined. The filling portion 27 includes a portion (continuous portion) where the molten resin filled in the through hole 16 is cooled and hardened.

The resin corner portion 28 is an element that smoothly connects between the four side wall portions 13 and the main surface portion 11 . The resin corner portion 28 connects the adjacent side wall portions 13 with a curved surface that is substantially perpendicular to the main surface portion 11, and the peripheral edge of the round corner portion of the main surface portion 11 and between the adjacent bent portions 14 has a cross section. It is formed so as to form a fan shape and continue smoothly. The resin corner portion 28 is formed by cooling and hardening the molten resin plastically filled in a portion (cavity C5) corresponding to the resin corner portion of the molding space C1 provided in the mold 50 described later. .

The above-described warp suppressing portion 24, filling portion 27, and resin corner portion 28 are formed of thermoplastic resin (third thermoplastic resin) such as polypropylene, for example. In the present embodiment, the thermoplastic resin (second thermoplastic resin) forming the resin molded body 21 and the thermoplastic resin (third thermoplastic resin). In addition, when the second thermoplastic resin and the third thermoplastic resin are different, they should be compatible with each other. Also, the second thermoplastic resin and the third thermoplastic resin are preferably compatible with the first thermoplastic resin.

Although the method for manufacturing such a seat backboard 1 is not particularly limited, a preferable method for manufacturing the seat backboard 1 will be described below. The manufacturing method of this seat backboard 1 generally includes the following steps. Each step will be described in order.
S1. Preparatory step for preparing preboard S1-1. Grooveless preboard preparation step S1-2. Groove forming step S1-3. Communicating process/cutting process S2. Resin supply step S2-1. Cold press process (an example of press forming process)
S2-2. Resin injection process

<S1. Preparatory process for preparing pre-board>
In step S1-1, a grooveless preboard is prepared. The non-grooved preboard is made by homogeneously mixing fibers (here, vegetable fibers) and thermoplastic resin fibers, which are the raw materials of the base material, by a wet method (paper making method) or a dry method (air lay method) to form a fleece. , It is a molding substrate for pressing called a so-called stampable sheet, in which fibers are entangled by repeatedly poking with needles that move up and down in the thickness direction, and then the fibers are bonded by heating. The heating in this step is performed up to a temperature equal to or higher than the melting point or softening point of the thermoplastic resin fibers made of the first thermoplastic resin as the binder.

At this time, as shown in FIG. 3, the grooveless preboard may be press-molded by a hot press platen. In the manufacturing method according to the present technology, cold pressing without heating is employed in the post-pressing process. A stampable sheet cannot be compressed to a desired plate thickness and substrate density by cold pressing without heating with a low mold clamping force in the post-process. Therefore, at the stage of this preparatory process for preparing the preboard, the board is formed so as to achieve the target thickness and base material density (that is, the base material density is higher than that of the conventional preboard).

In step S1-2, as shown in FIG. 4, grooves 12P are formed in the press molding substrate. In step S1-3, as shown in FIG. 4, a notch portion 15P and a through hole 16P are provided in the molding substrate for pressing. These steps S1-2 and S1-3 may be performed after step S1-1, or may be performed so as to overlap with step S1-1. Moreover, either step S1-2 or step S1-3 may be performed first, or the two may be performed in parallel. For example, the notch 15P can be formed by subjecting the fleece to a marking process (an example of a cutting process) or the like before heating in the above step S1-1. Further, the grooves 12P and the through-holes 16P are formed by die-cutting before or after the softened or melted first thermoplastic resin is cured after the fleece is integrated by heating in the above step S1-1. , cutting, laser processing, or the like. This prepares the preboard 10P.

<S2. Resin supply process>
In step S2-1, the prepared preboard 10P is bent along the notch 15P at a temperature at which the first thermoplastic resin does not melt, and the surface 10A protrudes by the molding surface of the molding die 50. Cold press. Thereby, the shape of the base material 10 of the seat backboard 1 is given to the preboard 10P. At this time, the notch 15P is opened and the bent portion 14 is formed.

For cold pressing, for example, as shown in FIG. 5, it is preferable to use a substrate manufacturing apparatus 40 having a molding die 50 capable of simultaneously performing cold pressing and resin injection molding. The base material manufacturing apparatus 40 may be installed in an environment not equipped with a heating device for heating the preboard 10P, which is the object to be molded, in the surrounding area. The base material manufacturing apparatus 40 includes an injection device 41 and a mold 50, as shown in FIG. Mold 50 includes a movable upper mold 51 and a fixed lower mold 61 . The injection device 41 is, for example, of a screw type, and is provided in the lower die 61 in this embodiment.

The upper die 51 is a movable die that can be moved with respect to the lower die 61 by a driving device (eg, electric motor, air cylinder, hydraulic cylinder, etc.) not shown. By moving the upper mold 51 toward and away from the lower mold 61, the upper mold 51 and the lower mold 61 can be closed and opened.

The lower mold 61 has a shape in which a mold surface 61A facing the upper mold 51 protrudes toward the upper mold 51 . Further, the upper mold 51 has a mold surface 51A that faces the lower mold 61 and has a concave shape corresponding to the shape of the lower mold 61 . In the closed state in which the upper mold 51 and the lower mold 61 are closed, a molding space C1 corresponding to the desired outer shape of the seat backboard 1 is formed between the upper mold 51 and the lower mold 61 . That is, in the closed state, the mold surfaces 51A and 61A are opposed to each other with a distance equal to the plate thickness of the base material 10 (see FIG. 8, etc.). Accordingly, when the preboard 10P is pressed by the upper mold 51 and the lower mold 61, the preboard 10P is compressed into a shape corresponding to the shape of the molding space C1, and the base material 10 is molded. The thickness of the base material 10, that is, the separation distance between the upper mold 51 and the lower mold 61 in the closed state is smaller than the thickness of the preboard 10P according to the compression rate.

Further, as shown in FIGS. 5 to 7, the upper mold 51 includes an upper main mold 53 that is the main body of the upper mold 51 and a slide mold 52 that can move up and down with respect to the upper main mold 53 . The slide mold 52 retracts from the upper main mold 53 so that its mold surface 52A projects downward from the mold surface 53A of the upper main mold 53 and is flush with the mold surface 53A of the upper main mold 53. state (see FIG. 11). The slide die 52 of this example is formed by combining a plurality of elongated plate pieces, and is provided at a position corresponding to the groove 12P of the preboard 10P in the projecting state. Positioning can be performed. The width of the slide mold 52 (thickness of the plate piece) is equal to or slightly smaller than the width of the groove 12P. In a state where the preboard 10P is placed on the lower die 61 and the slide die 52 is inserted into the groove 12P, the slide die 52 and the groove 12P are set so as not to form a large gap. On the other hand, when the slide mold 52 is inserted into the groove 12P in the projecting state and then the slide mold 52 is retracted, a cavity C6 ( 11, etc.) are formed.

Further, in the mold 50 in the closed state, a cavity C4 (see FIGS. 8 and 10) for forming the filling portion 27 and a cavity C5 (see FIG. 5) and are formed. The molding space C1 includes cavities C4 and C5 in advance.

A mold surface 61A of the lower mold 61 is recessed with a clip seat molding cavity C2 for molding the clip seat 22 so as to open to the mold surface 61A. The lower die 61 has a slide mechanism (not shown) for forming the clip seat 22 having an undercut structure.

Further, a rib portion forming cavity C3 (see FIG. 5) for molding the rib portion 23D is recessed in the mold surface 61A of the lower mold 61 so as to open to the mold surface 61A. Furthermore, on the mold surface 61A of the lower mold 61, a first runner 64 and a second runner 65 for forming the first runner portions 23A, 23B and the second runner portion 23C are formed in a groove shape opening to the mold surface 61A. recessed.

The second runner 65 is provided so as to circulate along the edge (corner) of the upwardly protruding portion of the lower die 61 . That is, the second runner 65 extends to a position corresponding to the bent portion 14 of the positioned preboard 10P. The first runner 64 extends in a direction crossing the extending direction of the second runner 65 so as to connect the clip seat molding recess and the second runner 65 . The injection device 41 includes a gate 42 which is an injection port for injecting resin so as to communicate with a position near the second runner 65 in the first runner 64 .

In such a base material manufacturing apparatus 40, as shown in FIGS. 8 to 10, the preboard 10P is positioned with the slide mold 52 protruded at a temperature (for example, normal temperature (25° C.)) at which the first thermoplastic resin does not melt. After that, the mold 50 is closed. By adopting the positioning process of aligning the slide mold 52 with the groove 12, the misalignment of the preboard 10P with respect to the lower mold 61 during molding can be more reliably suppressed. As a result, while pressing the main surface portion 11P of the preboard 10P, the side wall portion 13 can be bent toward the back side along the notch portion 15P and in such a manner that the front surface 10AP protrudes. At this time, the notch portion 15P of the preboard 10P is opened and the notch portion 15 is formed. In this example, this forms a grooved substrate 10 .

In step S2-2, a second thermoplastic resin is supplied to form the resin portion 20 on the front surface 10A and the back surface 10B of the base material 10. As shown in FIG. More specifically, as shown in FIG. 11, with the mold 50 in the closed state and the slide mold 52 in the retracted state, as shown in FIGS. A second thermoplastic resin in a molten state (hereinafter referred to as molten resin) is injected into the first runner 64 . Thereby, the molten resin can be supplied to the back surface 10B first. The molten resin injected into the first runner 64 is supplied to the cavity C2 for forming the clip seat, the cavity C3 for forming the rib portion, and the second runner 65 which are continuous with the first runner 64 . Then, the molten resin supplied to the second runner 65 passes through the through-hole 16 continuous to the second runner 65, the cavity C4 for forming the filling portion, the cavity C6 for forming the warpage suppressing portion, and the resin corner portion. Cavity C5 for forming. Thereby, the molten resin can be supplied also to the surface 10A.

The resin supplied to the first runner 64, the second runner 65, the through holes 16, and the cavities C2 to C6 is cooled and hardened, thereby forming the resin molding 21 (that is, the clip seat 22, the first runner portions 23A, 23B, second runner portion 23C and rib portion 23D), warp suppressing portion 24, filling portion 27 (including a continuous portion formed by curing the molten resin supplied to through-hole 16), and resin corner portion 28. , are integrally formed on the base material 10 . Thereafter, as shown in FIGS. 15 to 17, the mold 50 is opened to manufacture the seat backboard 1 having the resin molded body 21 on the back surface 10B and the warpage suppressing portion 24 on the front surface 10A.

Next, the effects of this embodiment will be described. In the above embodiment, the seat backboard 1 (base material with resin molded body) contains fibers and a first thermoplastic resin, and has a front surface 10A (first surface) and a back surface 10B opposite to the surface 10A (second surface). ), and a first runner portion 23A (resin molded body 21) provided on the back surface 10B of the substrate 10 and extending along the first direction, and the surface 10A of the substrate 10 are provided with grooves 12A and 12B extending along the first direction, and the grooves 12A and 12B are provided with warpage suppressing portions 24A and 24B filled with a second thermoplastic resin. Further, the back surface 10B of the base material 10 is provided with a first runner portion 23B (resin molded body 21) extending along the second direction, and the front surface 10A of the base material 10 is provided with a groove extending along the second direction. 12C and 12D are provided, and the grooves 12C and 12D are provided with warpage suppressing portions 24C and 24D filled with a second thermoplastic resin.

The thermoplastic resin forming the resin molding 21 generally undergoes thermal contraction when transformed from a molten state to a solidified state, and the thermal shrinkage rate is greater than that of the base material 10 . Therefore, when the resin molded body 21 is formed integrally with the base material 10, if the base material 10 is also heated to integrally form the resin molded body 21, the warpage of the base material 10 caused by the difference in the thermal shrinkage is alleviated. However, if the resin molded body 21 is integrally formed without heating the base material 10, the warp of the base material 10 due to the difference in the thermal shrinkage rate will be conspicuous. In particular, in the cooling and hardening process of the first runner portion 23A extending along the first direction, a compressive stress along the first direction is generated in the back surface 10B, and the first runner portion 23B extending along the second direction generates the compressive stress along the first direction. In the cooling hardening process, a compressive stress along the second direction is generated in the back surface 10B. According to the above configuration, the first runner portions 23A and 23B (resin molded body 21) are provided on one surface of the base material 10, and the other surface is provided along the first runner portions 23A and 23B. Warpage suppression portions 24A to 24D are provided extending along the first direction and the second direction, respectively. Thereby, on the front and back plate surfaces of the base material 10, the compressive stress caused by the heat shrinkage of the resin molded body 21 and the compressive stress caused by the warp suppressing portion 24 are balanced, and the warp of the base material 10 is suppressed. .

In the above-described embodiment, the groove 12 includes the first groove 12A and the second groove 12B provided so as to sandwich the first runner portion 23A (resin molded body 21) in the second direction intersecting the first direction. The suppressing portion 24 includes a first warp suppressing portion 24A and a second warp suppressing portion 24B formed by filling the first groove 12A and the second groove 12B with the second thermoplastic resin. Further, the groove 12 includes a third groove 12C and a fourth groove 12D provided so as to sandwich the first runner portion 23B (the resin molded body 21) in a first direction intersecting the second direction. includes a third warp suppressing portion 24C and a fourth warp suppressing portion 24D formed by filling the third groove 12C and the fourth groove 12D with the second thermoplastic resin. According to the above configuration, it is possible to suppress the compressive stress caused by thermal contraction of the thermoplastic resin from acting locally on the substrate.

In the above embodiment, the cross-sectional area S1 of the warp suppressing portions 24A and 24B in the second direction intersecting the first direction has the following relationship with respect to the cross-sectional area S2 of the first runner portion 23A (resin molded body 21) in the second direction. : 0.5×S2≦S1≦1.5×S2; Further, the cross-sectional area S1 of the warp suppressing portions 24C and 24D in the first direction intersecting the second direction has the following relationship with respect to the cross-sectional area S2 of the first runner portion 23B (resin molded body 21) in the first direction: 0. 5×S2≦S1≦1.5×S2; is satisfied. According to the above configuration, the compressive stress acting on the back surface 10B (second surface) of the base material due to the resin molding and the warpage suppressing portion 24 acting on the front surface 10A (first surface) of the base material. Compressive stress can be effectively balanced.

In the above embodiment, the dimension W1 of the warp suppressing portions 24A and 24B along the second direction intersecting the first direction has the following relationship with respect to the dimension W2 of the first runner portion 23A (resin molded body 21) along the second direction: : 0.8×W2≦W1≦1.2×W2; Also, independently, the dimension W1 of the warp suppressing portions 24C and 24D along the first direction intersecting the second direction has the following relationship with respect to the dimension W2 of the first runner portion 23B (resin molded body 21) along the first direction: : 0.8×W2≦W1≦1.2×W2; According to the above configuration, when the height of the first runner portions 23A and 23B from the plate surface of the substrate 10 is high, the first runner portions 23A and 23B cause the rear surface 10B (second surface) of the substrate 10 to ) and the compressive stress acting on the surface 10A (first surface) of the base material 10 due to the warp suppressing portion can be effectively balanced.

In the above-described embodiment, the dimension (that is, the height) of the warpage suppressing portion 24 along the thickness direction of the base material 10 is about 20% (an example of 50% or less) of the thickness of the base material 10 . According to the above configuration, it is possible to suppress the warp while avoiding a reduction in the strength of the base material 10 due to the provision of the warp suppressing portion 24 .

In the above-described embodiment, the through hole 16 that penetrates the base material 10 is provided, and a continuous portion (a part of the filling portion 27) filled with the second thermoplastic resin is provided inside the through hole 16. The resin molded body 21 and the warp suppressing portion 24 are continuous through a continuous portion. According to the above configuration, by supplying the second thermoplastic resin to the back surface 10B of the base material, the warp suppressing portion 24 and the like on the front surface 10A can be formed, and the base material 10 can be manufactured easily. and can be provided, for example, as a low-cost substrate. Moreover, since gate traces and the like for forming the warp suppressing portion 24 and the like are not exposed on the surface 10A, the design of the surface 10A of the seat backboard 1 is enhanced.

In the above-described embodiment, the surface 10A (first surface) has a bent portion 14 (bent portion) that is bent so as to protrude, the bent portion 14 is continuous with the groove 12, and the first surface of the bent portion 14 A corner portion continuous to one surface is provided with a filling portion filled with the second thermoplastic resin. If the base material is folded without heating, the base material will be bent, so the base material will tear at the outer surface of the bent portion, and the surface smoothness will be lost and the base material will be thin. It is conceivable that the strength will decrease as a result. According to the above configuration, since the bent portion is provided with the resin portion continuously to the warpage suppressing portion, the surface of the base material can be smoothed and the plate thickness can be made uniform by the resin portion. This makes it possible to provide substrates in various forms.

In another aspect, a method for manufacturing a base material with a resin molded body according to the technique disclosed herein includes fibers and a first thermoplastic resin, and a first surface and a first surface opposite to the first surface. A plate-shaped substrate having two surfaces, the groove extending along the first direction on the first surface so as to extend along the resin molded body to be provided on the second surface and extending in the first direction and supplying a second thermoplastic resin for forming the resin molded body on the second surface of the base material at a temperature at which the first thermoplastic resin does not melt. At the same time, by supplying a third thermoplastic resin to the grooves on the first surface, the resin molded body is provided on the second surface and the third thermoplastic resin is filled in the grooves on the first surface. and a resin supply step of obtaining a base material with a resin molded body having a warp suppressing portion filled with.

According to the above configuration, in accordance with the formation of the resin molded body on one surface of the base material, the warpage suppressing portion is provided on the other surface of the base material so as to follow the resin molded body, thereby heating the base material. It is possible to manufacture a base material with a resin molded body without carrying out. As a result, the compressive stress caused by the heat shrinkage of the thermoplastic resin and the compressive stress caused by the warp suppressing portion can be balanced on the front and back plate surfaces of the base material, and the non-heating process can be performed without greatly increasing the number of processes. Thus, a base material with a resin molded body in which warping is suppressed can be produced.

In the above embodiment, the preparing step includes forming a plate-shaped grooveless preboard containing the fibers and the first thermoplastic resin, having the first surface and the second surface, but not having the grooves. It includes a preboard preparing step of preparing and a groove forming step of providing the grooves in the second surface of the grooveless preboard. The substrate in the present technology may be obtained with grooves formed in advance, or may be used by preparing a preboard without grooves and forming grooves on it. Here, the base material having the grooves formed in advance has the disadvantage that the applications are limited and it is difficult to respond to design changes in a short period of time. According to the above configuration, for example, the substrate disclosed herein can be manufactured using a preboard that is not limited in use.

In the above embodiment, the second thermoplastic resin and the third thermoplastic resin are the same, the preparing step includes the fibers and the first thermoplastic resin, and the first surface and A preboard preparation step of preparing a plate-shaped grooveless preboard having the second surface but not having the groove, and providing a through hole penetrating the preboard and making a cut for communicating the through hole and the groove. in the resin supplying step, supplying the second thermoplastic resin for forming the resin molded body on the second surface of the preboard, and supplying the second thermoplastic resin through the through hole A second thermoplastic is fed to the first surface and into the grooves. According to the above configuration, since the preboard is provided with the through-hole, by supplying the second thermoplastic resin to one surface, the second thermoplastic resin is supplied to the other surface through the through-hole. can send. As a result, the base material can be produced by simplifying the base material manufacturing apparatus.

In the above embodiment, the preparing step includes forming a plate-shaped grooveless preboard containing the fibers and the first thermoplastic resin, having the first surface and the second surface, but not having the grooves. a preboard preparation step of preparing; a cutting step of making a cut at a predetermined location on the first surface of the preboard; a press molding step of forming the notch portion by opening the notch by pressing with the molding surface of the mold so that the notch protrudes, and in the resin supplying step, the notch The part is filled with the second thermoplastic resin. According to the above configuration, the base material is press-molded at the same time, and the defective shape of the base material caused by the non-heated press-molding is compensated by filling the thermoplastic resin in the resin supply step. As a result, it is possible to efficiently produce substrates of various forms without heating.

<Other embodiments>
The technology disclosed in this specification is not limited to the embodiments described in the above description and drawings, and includes the following embodiments, for example.

(1) In the above embodiment, two warp suppressing portions 24A to 24B and 24C to 24D are provided for one first runner portion 23A and 23B. The number of warp suppressing portions 24 to be provided is not limited. For example, as shown in FIG. 18, one warpage suppressing portion may be provided for one runner portion. Also, three or more warpage suppressing portions may be provided for one runner portion. From the viewpoint of weight reduction by reducing the installation area of the warp suppressing portion and the amount of resin, it is preferable to provide about 1 to 3 warp suppressing portions parallel to the runner portion.

(2) In Embodiment 1, the second runner portion 23C is arranged along the joint portion between the main surface portion 11 and the side wall portion 13 on the back surface 10B. However, the position of the second runner portion 23C is not limited to this. may be connected to

(3) In the first embodiment, the preboard is produced by combining the papermaking method/air laying method, the needle punching method, and the thermal bonding method. However, the preboard manufacturing method is not limited to this, and for example, conventionally known various methods such as a spunbond method, a chemical bond method, a water jet bonding method, and a lamination method may be combined.

(4) In the above embodiment, the through holes 16 are provided in the base material 10, and the molten resin is supplied only to the back surface 10B to form the front and back resin portions 20. However, the through holes 16 are not necessarily provided. , the molten resin may be supplied to both the front surface 10A and the rear surface 10B.

(5) In the above embodiment, the second thermoplastic resin and the third thermoplastic resin are the same thermoplastic resin, but they are composed of different types of thermoplastic resins. may

(6) In the above embodiment, one clip seat 22 is provided at the center of the seat backboard as one of the resin moldings, but a plurality of clip seats are provided along the periphery of the seat backboard. It may be provided, or the configuration may be such that the clip seat is not provided. Along with this, it is possible to arbitrarily change the shape and arrangement of the first runner portion and the second runner portion for feeding the molten resin to the clip seats, ribs, and the like.

(7) In the above embodiment, the planar shape of the slide mold 52 is designed to be the same as that of the groove 12 . However, the planar shape of the slide die 52 may be configured to press a part (for example, four places) of the groove 12 as long as the preboard can be positioned with respect to the lower die.

(8) In the above embodiment, the cut formed in the preboard is a V-groove having a V-shaped cross section. The shape of the notch provided in the preboard is not limited to this, and can be appropriately changed to a U shape, a U shape, or the like.

(9) The above embodiment discloses an example in which the shape of the warp suppressing portion is determined based on the cross-sectional area in the direction intersecting the extending direction of the resin molded body, the dimension along the extending direction, or both. rice field. However, the shape of the warpage suppressing portion may be considered based on the area of the joint portion between the extended resin molded body and the base material. For example, the area S11 of the joint portion between the extended resin molded body and the substrate is 0.5×S12≦S11≦1.5×S12 with respect to the area S12 of the joint portion between the warpage suppressing portion and the substrate. more preferably, 0.8×S12≦S11≦1.2×S12.

DESCRIPTION OF SYMBOLS 1... Seat back board 10... Base material 10A... Front surface 10B... Back surface 12, 12A, 12B, 12C, 12D... Groove 13... Side wall part 14... Bent part 15... Notch part 16... Penetration Hole 20... Resin part 23A, 23B... First runner part (resin molded body) 24, 24A, 24B, 24C, 24D... Warp suppression part 10P... Preboard 10AP... Front surface 10BP... Back surface 12P... Groove , 14P... bending part, 15P... notch part, 16P... through hole

Claims (12)

a plate-shaped substrate comprising fibers and a first thermoplastic resin and having a first surface and a second surface opposite to the first surface;
a resin molded body provided on the second surface of the base material and extending along a first direction;
with
Resin molding, wherein the first surface of the base material is provided with a groove extending along the first direction, and the groove is provided with a warp suppressing portion filled with a second thermoplastic resin. body base material. The base material with a resin molded body according to claim 1, wherein the warp suppressing portion is provided at a position overlapping with the resin molded body. The groove includes a first groove and a second groove provided so as to sandwich the resin molding in a second direction intersecting the first direction,
2. The warp suppressing portion according to claim 1, wherein the warp suppressing portion includes a first warp suppressing portion and a second warp suppressing portion formed by filling the first groove and the second groove with the second thermoplastic resin. Base material with resin molding. The cross-sectional area S1 of the warpage suppressing portion in the second direction intersecting the first direction has the following relationship with respect to the cross-sectional area S2 of the resin molded body in the second direction: 0.5×S2≦S1≦1.5 4. The substrate with a resin molding according to any one of claims 1 to 3, which satisfies xS2;. The dimension W1 of the warpage suppressing portion along the second direction that intersects the first direction has the following relationship with respect to the dimension W2 of the resin molding along the second direction: 0.8×W2≦W1≦1.2. The base material with a resin molding according to any one of claims 1 to 4, which satisfies xW2; 6. The substrate with a resin molded body according to claim 1, wherein a dimension along the thickness direction of the substrate of the warpage suppressing portion is 50% or less of the thickness of the substrate. A through hole penetrating the base material is provided, and a continuous portion filled with the second thermoplastic resin is provided inside the through hole,
The resin molded body and the warpage suppressing portion are continuous via the continuous portion,
The substrate with a resin molding according to any one of claims 1 to 6. Having a bent portion that is bent so that the first surface protrudes,
The bent portion is continuous with the groove,
8. The resin according to any one of claims 1 to 7, wherein a corner portion of the bent portion continuous with the first surface is provided with a filling portion filled with the second thermoplastic resin. Base material with molded body. A plate-shaped substrate containing fibers and a first thermoplastic resin and having a first surface and a second surface opposite to the first surface, wherein the second surface to be provided on the second surface A preparation step of preparing a base material provided with grooves extending along the first direction on the first surface so as to extend along the resin molded body extending in one direction;
A second thermoplastic resin for forming the resin molded body is supplied to the second surface of the base material at a temperature at which the first thermoplastic resin does not melt, and the second thermoplastic resin is supplied to the grooves of the first surface. By supplying a third thermoplastic resin, the warpage suppressing portion is formed by providing the resin molded body on the second surface and filling the groove of the first surface with the third thermoplastic resin. a resin supply step for obtaining a base material with a molded body;
A method for producing a base material with a resin molded body. The preparation step includes
a preboard preparing step of preparing a plate-shaped non-grooved preboard that includes the fibers and the first thermoplastic resin and has the first surface and the second surface but does not include the grooves;
a groove forming step of providing the groove on the second surface of the grooveless preboard;
The method for producing a substrate with a resin molded body according to claim 9, comprising The second thermoplastic resin and the third thermoplastic resin are the same,
The preparation step includes
a preboard preparing step of preparing a plate-shaped non-grooved preboard that includes the fibers and the first thermoplastic resin and has the first surface and the second surface but does not include the grooves;
A communicating step of providing a through-hole penetrating the preboard and making a cut for communicating the through-hole and the groove;
including
In the resin supplying step, the second thermoplastic resin for forming the resin molded body is supplied to the second surface of the preboard, and the second thermoplastic resin is supplied through the through holes to the second surface of the preboard. 11. The method for producing a base material with a resin molded body according to claim 9 or 10, wherein the base material is fed to one surface and supplied to the grooves. The preparation step includes
a preboard preparing step of preparing a plate-shaped non-grooved preboard that includes the fibers and the first thermoplastic resin and has the first surface and the second surface but does not include the grooves;
a cutting step of cutting a predetermined location on the first surface of the preboard;
At a temperature at which the first thermoplastic resin does not melt, the preboard is pressed by the molding surface of the mold so as to be bent along the cut and so that the first surface protrudes, and the cut is opened. a press molding step of forming the notch;
including
12. The method for producing a base material with a resin molded body according to claim 9, wherein in the resin supplying step, the notch is filled with the second thermoplastic resin.

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