JP2022149437A - Manufacturing method of conductive structure - Google Patents

Abstract

To provide a manufacturing method of a conductive structure which has a conductive linear body, can be manufactured with high production efficiency and can form the conductive linear body with high pattern accuracy even in a fine shape.SOLUTION: A manufacturing method of a conductive structure includes a step (1) of preparing a laminate 110, and a step (2) of forming a conductive linear body 120 on the surface of an adhesive layer 112 by injecting a conductive material 120a from a nozzle 20 onto the surface of the adhesive layer 112. The nozzle 20 has an injection hole 22 and an air ejection hole 23, and the nozzle 20 is arranged at a predetermined distance L from the transported laminate 110. In the step (2), the conductive linear body 120 is formed on the surface of the adhesive layer 112 by injecting the conductive material 120a from the injection hole 22 toward the laminate 110 and blowing air from the air ejection hole 23.SELECTED DRAWING: Figure 3

Description

The present invention relates to a method for manufacturing an electrically conductive structure.

A conductive structure in which a plurality of conductive linear bodies are arranged at intervals can be used for various products such as heating elements for heating devices, materials for textiles that generate heat, and protective films for displays (anti-pulverization films). There is Such a conductive structure is used, for example, as a conductive sheet or a sheet-like conductive member in which a conductive linear body is arranged on a laminate composed of a substrate and an adhesive layer. Alternatively, it can also be used as a sheet heater or the like using a conductive linear body as a heating element.

Regarding such a conductive structure, for example, Patent Document 1 discloses a pseudo-sheet structure in which a plurality of conductive linear bodies extending in one direction are arranged at intervals, wherein the conductive linear bodies is a wavy first portion having a wavelength λ1 and an amplitude A1, and a wavy second portion having a wavelength λ2 and an amplitude A2 different from at least one of the wavelength λ1 and the amplitude A1 of the first portion. A conductive sheet for three-dimensional molding is disclosed that has a pseudo-sheet structure that is a body and a resin protective layer provided on one surface of the pseudo-sheet structure.

WO2018/097323

As a method for producing the conductive structure described above, a long laminate (sheet) composed of the base material and the adhesive layer described above is prepared, and while conveying this at high speed, the conductive line is attached to the surface of the adhesive layer. A method of injecting a conductive material that becomes a shaped body from a nozzle is employed (for example, see FIGS. 7 and 8 described later). Such a manufacturing method is expected to increase the manufacturing efficiency because the conductive linear body can be formed while the laminate is conveyed at high speed.

However, such a manufacturing method has a problem that it is difficult to precisely arrange the fine conductive linear bodies on the laminate.

The present invention has been made in view of such circumstances, and a conductive structure having a conductive linear body can be manufactured with high production efficiency and with high pattern accuracy even if it has a fine shape. A main object of the present invention is to provide a method for manufacturing a conductive structure capable of forming a conductive linear body.

As a result of intensive studies to achieve the above object, the inventors of the present invention have found that a base material, an adhesive layer laminated on the surface of the base material, and a conductive linear body disposed on the surface of the adhesive layer. A method for producing a conductive structure, comprising: (1) a step of preparing a laminate including a base material and an adhesive layer; and (2) the surface of the adhesive layer of the laminate while conveying the laminate and forming the conductive linear bodies on the surface of the adhesive layer by injecting a conductive material that becomes the conductive linear bodies from a nozzle, wherein the nozzle injects the conductive material. An injection hole and an air ejection hole arranged near the injection hole for ejecting air are provided, and the nozzle is arranged at a predetermined distance from the conveyed laminated body. Manufacture of a conductive structure in which a conductive linear body is formed on the surface of an adhesive layer by injecting a conductive material from an injection hole toward the laminated body and blowing air from an air ejection hole. The present invention has been completed after finding out about the method.

That is, the present invention is as follows.

<1>
A method for producing a conductive structure comprising a substrate, an adhesive layer laminated on the surface of the substrate, and conductive linear bodies arranged on the surface of the adhesive layer,
(1) a step of preparing a laminate including the base material and the adhesive layer; and forming the conductive linear body on the surface of the adhesive layer by injecting a conductive material as a body from a nozzle, wherein the nozzle is an injection hole for injecting the conductive material. and an air ejection hole arranged near the injection hole for ejecting air, wherein the nozzle is arranged at a predetermined distance from the conveyed laminated body, and the step (2) comprises: The conductive linear body is formed on the surface of the adhesive layer by injecting the conductive material from the injection hole toward the laminated body being conveyed and by blowing air from the air injection hole. It is a method of manufacturing a conductive structure that allows
<2>
The step (2) is performed by injecting the conductive material from the injection hole toward the surface of the adhesive layer of the laminate while moving the nozzle along the width direction of the laminate. 1. The method for producing a conductive structure according to <1>, wherein the step of forming the wave-shaped conductive linear body on the surface of the adhesive layer.
<3>
<1> or <2>.
<4>
The method for producing a conductive structure according to any one of <1> to <3>, wherein the adhesive layer has an elastic modulus of 0.001 MPa or more and 10 MPa or less.
<5>
<1>- A method for producing a conductive structure according to any one of <4>.
<6>
The method for manufacturing a conductive structure according to any one of <1> to <5>, wherein the nozzle is arranged at a distance of 0.01 mm or more and 20 mm or less from the surface of the laminated body being conveyed. .
<7>
The method for manufacturing a conductive structure according to any one of <1> to <6>, wherein the diameter of the tip of the nozzle is 1.5 times or more and 10 times or less than the diameter of the conductive linear body when viewed in cross section. is.
<8>
The method for manufacturing a conductive structure according to any one of <1> to <7>, wherein the ejection pressure of the air ejected from the air ejection holes is 0.1 MPa or more and 10 MPa or less.
<9>
The method for producing a conductive structure according to any one of <1> to <8>, wherein the conductive structure is at least one selected from the group consisting of a conductive member, a heater, and a sensor.

According to the present invention, for a conductive structure having conductive linear bodies, it is possible to form conductive linear bodies with high pattern accuracy even in fine shapes while maintaining high production efficiency. A method for manufacturing a conductive structure can be provided.

FIG. 1 is a perspective view showing an example of a conductive structure according to this embodiment. FIG. 2 is a cross-sectional view taken along line AA of FIG. FIG. 3 is a schematic diagram showing an example of the manufacturing method in this embodiment. FIG. 4 is a partial top view showing an example of the manufacturing method according to this embodiment. FIG. 5 is a cross-sectional view showing an example of the vicinity of the nozzle in the manufacturing method according to this embodiment. FIG. 6 is a perspective view showing an example of a heater using a conductive structure according to this embodiment. FIG. 7 is a schematic diagram showing an example of a conventional manufacturing method. FIG. 8 is a cross-sectional view showing an example of the vicinity of a nozzle in a conventional manufacturing method.

EMBODIMENT OF THE INVENTION Hereinafter, the form (only henceforth "this embodiment") for implementing this invention is demonstrated in detail. The following embodiments are examples for explaining the present invention, and are not intended to limit the present invention to the following contents. The present invention can be appropriately modified and implemented within the scope of the gist thereof.

In the drawings, the same elements are denoted by the same reference numerals, and overlapping descriptions are omitted. In addition, unless otherwise specified, positional relationships such as up, down, left, and right are based on the positional relationships shown in the drawings. Furthermore, the dimensional ratios of the drawings are not limited to the illustrated ratios.

Moreover, in this specification, unless otherwise specified, "(meth)acryl" includes methacryl and acryl. For example, (meth)acrylic means methacrylic, acrylic, or both. The same applies to other synonyms such as "(meth)acrylate".

<Conductive structure>

First, the conductive structure obtained by the manufacturing method according to this embodiment will be described.

FIG. 1 is a perspective view showing an example of a conductive structure according to this embodiment, and FIG. 2 is a cross-sectional view taken along line AA of FIG.

Conductive structure 100 includes substrate 111 , adhesive layer 112 laminated on the surface of substrate 111 , and conductive linear body 120 arranged on the surface of adhesive layer 112 . In conductive structure 100 , conductive linear bodies 120 are arranged on the surface of laminate 110 composed of substrate 111 and adhesive layer 112 .

The conductive structure 100 can have a structure in which a plurality of conductive linear bodies 120 are arranged with a predetermined arrangement interval P from each other. FIG. 1 illustrates a case where four conductive linear bodies 120 are arranged. The conductive linear bodies 120 are arranged along the longitudinal direction Y of the conductive structure 100 (that is, the transport direction described later). A plurality of conductive linear bodies 120 are arranged at a predetermined arrangement interval P in the width direction X of the conductive structure 100 (that is, the direction orthogonal to the longitudinal direction Y) (see FIG. 2).

Also, the arrangement shape (patterning) of the conductive linear bodies 120 is not particularly limited, and may be a curved line or a straight line. For example, as shown in FIG. 1, it may have a wavy shape when viewed from above. The manufacturing method according to the present embodiment can arrange (pattern) even the wave-shaped conductive linear bodies 120 having complicated curved portions with high dimensional accuracy.

(Laminate)

The laminate 110 includes a substrate 111 and an adhesive layer 112, and can be in the form of a long sheet. Since the sheet-like laminate 110 is used, it is easy to dispose the conductive structure 100 while conveying it on a conveying device, as will be described later.

The layer structure of the laminate 110 is not limited to two layers, as long as at least the outermost surface is the adhesive layer 112 from the viewpoint of arranging the conductive linear bodies 120 on the surface of the adhesive layer 112 . For example, it may be three or more layers. For example, the base material 111 may consist of multiple layers, and various functional layers may be provided as intermediate layers between the base material 111 and the adhesive layer 112 .

(Base material)

Examples of the base material 111 include synthetic resin film, paper, metal foil, nonwoven fabric, cloth, and glass film. The base material 111 can directly or indirectly support the conductive structure 100 . Also, the base material 111 is preferably a stretchable base material. Note that the "film" may also be called a "sheet" or the like.

A synthetic resin film, paper, nonwoven fabric, cloth, or the like can be used as the stretchable base material. Among these stretchable substrates, synthetic resin films or cloth are preferred, and synthetic resin films are more preferred.

Examples of synthetic resin films include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, and polybutylene terephthalate film. , polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film, and polyimide film etc. In addition, stretchable substrates include these crosslinked films and laminated films.

Examples of paper include woodfree paper, recycled paper, and kraft paper.

Nonwoven fabrics include, for example, spunbond nonwoven fabrics, needle-punched nonwoven fabrics, meltblown nonwoven fabrics, and spunlaced nonwoven fabrics.

Cloths include, for example, woven fabrics, knitted fabrics, and the like.

Nonwoven fabrics and fabrics as stretchable substrates are not limited to these.

(adhesive layer)
The adhesive layer 112 is a layer having adhesiveness and may be any layer as long as it can adhere the conductive linear body 120 to be described later. For example, the adhesive layer 112 is a layer containing resin. The adhesive layer 112 can directly or indirectly support the conductive structure 100 .

The adhesive layer 112 is preferably a layer containing an adhesive. Since adhesive layer 112 contains an adhesive, conductive linear body 120 can be attached to adhesive layer 112, and conductive linear body 120 can be more firmly fixed. In addition, since adhesive layer 112 contains an adhesive, substrate 111 and conductive linear body 120 can be easily attached via adhesive layer 112 .

The adhesive layer 112 may be a layer made of a resin that can be dried or cured. Moreover, the adhesive layer 112 after curing or drying has impact resistance, and can suppress deformation of the base material 111 due to impact.

From the viewpoint that the adhesive layer 112 can be easily cured in a short time, it is preferable that the adhesive layer 112 has energy ray-curable properties such as ultraviolet rays, visible energy rays, infrared rays, and electron rays. The term "energy ray curing" includes heat curing by heating using energy rays.

Examples of the adhesive for the adhesive layer 112 include a thermosetting adhesive that hardens with heat, a so-called heat seal type that adheres with heat, and an adhesive that develops sticking properties when wetted. However, from the viewpoint of ease of application, the adhesive layer 112 is preferably energy ray-curable. Examples of energy ray-curable resins include compounds having at least one polymerizable double bond in the molecule, and (meth)acrylate compounds having a (meth)acryloyl group are preferred.

Examples of acrylate compounds include chain aliphatic skeleton-containing (meth)acrylates (trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ) acrylate, dipentaerythritol monohydroxy penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate), Cycloaliphatic skeleton-containing (meth)acrylates (dicyclopentanyl di(meth)acrylate, dicyclopentadiene di(meth)acrylate, etc.), polyalkylene glycol (meth)acrylates (polyethylene glycol di(meth)acrylate, etc.), Examples include oligoester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy-modified (meth)acrylates, polyether (meth)acrylates other than polyalkylene glycol (meth)acrylates, and itaconic acid oligomers.

The weight average molecular weight (M _w ) of the energy ray-curable resin is preferably 100-30,000, more preferably 300-10,000.

The energy ray-curable resin contained in the adhesive composition may be of one type or two or more types, and when two or more types are used, the combination and ratio thereof can be arbitrarily selected. Furthermore, it may be combined with a thermoplastic resin, which will be described later, and the combination and ratio can be arbitrarily selected.

The adhesive layer 112 may be an adhesive layer formed from an adhesive (such as a pressure sensitive adhesive). The adhesive for the adhesive layer 112 is not particularly limited. Examples of adhesives include acrylic adhesives, urethane adhesives, rubber adhesives, polyester adhesives, silicone adhesives, and polyvinyl ether adhesives. Among these, the adhesive is preferably at least one selected from the group consisting of an acrylic adhesive, a urethane adhesive, and a rubber adhesive, and more preferably an acrylic adhesive.

Examples of acrylic pressure-sensitive adhesives include polymers containing structural units derived from alkyl (meth)acrylates having straight-chain alkyl groups or branched-chain alkyl groups (that is, polymers obtained by polymerizing at least alkyl (meth)acrylates ), an acrylic polymer containing structural units derived from a (meth)acrylate having a cyclic structure (that is, a polymer obtained by polymerizing at least a (meth)acrylate having a cyclic structure), and the like.

When the acrylic polymer is a copolymer, the form of copolymerization is not particularly limited. The acrylic copolymer may be block copolymer, random copolymer or graft copolymer.

The acrylic copolymer may be crosslinked with a crosslinking agent. Examples of cross-linking agents include known epoxy-based cross-linking agents, isocyanate-based cross-linking agents, aziridine-based cross-linking agents, and metal chelate-based cross-linking agents. When cross-linking an acrylic copolymer, a hydroxyl group, a carboxyl group, or the like that reacts with these cross-linking agents should be introduced into the acrylic copolymer as a functional group derived from the monomer component of the acrylic polymer. can be done.

When the adhesive layer 112 is formed from an adhesive, the adhesive layer 112 may contain the energy ray-curable resin described above in addition to the adhesive. Further, when an acrylic pressure-sensitive adhesive is applied as the pressure-sensitive adhesive, the energy-ray-curable components include a functional group that reacts with a functional group derived from a monomer component in the acrylic copolymer, and an energy-ray-polymerizable functional group. A compound having both groups in one molecule may be used. The reaction between the functional group of the compound and the functional group derived from the monomer component in the acrylic copolymer enables the side chains of the acrylic copolymer to polymerize by irradiation with energy rays. Even when the pressure-sensitive adhesive is not an acrylic pressure-sensitive adhesive, a component having an energy ray-polymerizable side chain may be used as a polymer component other than the acrylic polymer.

The thermosetting resin used for the adhesive layer 112 is not particularly limited, and specific examples include acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polycarbonate resins, and ester resins. , phenol-based resins, melamine-based resins, urea-based resins, benzoxazine-based resins, phenoxy-based resins, amine-based compounds, and acid anhydride-based compounds. Examples of acrylic resins include polymers containing structural units derived from (meth)acrylate, such as (meth)acrylate polymers and (meth)acrylate copolymers. These may be used individually by 1 type, and may use 2 or more types together.

The moisture-curable resin used for the adhesive layer 112 is not particularly limited, and examples thereof include urethane-based resins, modified silicone-based resins, etc., which are resins in which isocyanate groups are generated by moisture.

When using an energy ray-curable resin or a thermosetting resin, it is preferable to use a photopolymerization initiator, a thermal polymerization initiator, or the like. By using a photopolymerization initiator, a thermal polymerization initiator, or the like, a crosslinked structure is formed, and the conductive structure 100 can be more strongly protected.

Photopolymerization initiators include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1 -hydroxycyclohexylphenyl ketone, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,6) -trimethylbenzoyl)-phenyl-phosphine oxide and the like.

Thermal polymerization initiators include hydrogen peroxide, peroxodisulfates (e.g., ammonium peroxodisulfate, sodium peroxodisulfate, potassium peroxodisulfate, etc.), azo compounds (e.g., 2,2′-azobis(2- amidinopropane) dihydrochloride, 4,4′-azobis(4-cyanovaleric acid), 2,2′-azobisisobutyronitrile, and 2,2′-azobis(4-methoxy-2,4-dimethylvalero) nitrile), etc.), and organic peroxides (e.g., benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, and cumene hydroperoxide, etc.) etc.

These polymerization initiators may be used individually by 1 type, and may use 2 or more types together.

When forming a crosslinked structure using these polymerization initiators, the amount used is 0.1 parts by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the energy ray-curable resin or thermosetting resin. , more preferably 1 part by mass or more and 100 parts by mass or less, and even more preferably 1 part by mass or more and 10 parts by mass or less.

The adhesive layer 112 may not be curable and may be a layer made of, for example, a thermoplastic resin composition. By including a solvent in the thermoplastic resin composition, the thermoplastic resin layer can be softened. This facilitates attachment of the conductive linear bodies 120 to the adhesive layer 112 when the conductive linear bodies 120 are formed on the surface of the adhesive layer 112 . On the other hand, by volatilizing the solvent in the thermoplastic resin composition, the thermoplastic resin layer can be dried and solidified.

Examples of thermoplastic resins include polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyethersulfone, polyimide, and acrylic resins. Examples of acrylic resins include polymers containing structural units derived from (meth)acrylate, such as (meth)acrylate polymers and (meth)acrylate copolymers.

Examples of solvents include alcohol-based solvents, ketone-based solvents, ester-based solvents, ether-based solvents, hydrocarbon-based solvents, halogenated alkyl-based solvents, and water.

The adhesive layer 112 may contain an inorganic filler. By including the inorganic filler, the hardness of the adhesive layer 112 after curing can be further improved. Also, the thermal conductivity of the adhesive layer 112 is improved.

Examples of inorganic fillers include inorganic powders (for example, powders of silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride), beads obtained by spheroidizing inorganic powders, single crystal fibers, and glass fiber. Among these, silica fillers and alumina fillers are preferred as inorganic fillers. An inorganic filler may be used individually by 1 type, and may use 2 or more types together.

As the material of the adhesive layer 112, various materials described above can be used depending on the application. It preferably contains at least one selected from the group consisting of epoxy-based resins, polycarbonate-based resins, and ester-based resins. By using such a material, a layer having a desired thickness can be formed more uniformly.

The adhesive layer 112 may contain other components. Other components include, for example, organic solvents, flame retardants, tackifiers, ultraviolet absorbers, antioxidants, preservatives, antifungal agents, plasticizers, antifoaming agents, and well-known additives such as wettability modifiers. agents.

The adhesive layer 112 is applied by a known coating method such as die coating, spray coating, comma coating, gravure coating, etc., and heated if necessary. It can be formed by drying.

The thickness of the adhesive layer 112 is appropriately determined according to the application of the conductive structure 100 . For example, from the viewpoint of adhesiveness, the thickness of the adhesive layer 112 is preferably 3 μm or more and 150 μm or less, and more preferably 5 μm or more and 100 μm or less.

The elastic modulus of the adhesive layer 112 is preferably 0.001 MPa or more and 10 MPa or less, more preferably 0.01 MPa or more and 2 MPa or less, and even more preferably 0.05 MPa or more and 1 MPa or less. With such an elastic modulus, the conductive linear body 120 arranged on the adhesive layer 112 can be firmly fixed in the manufacturing method described later.

(Conductive linear body)

The cross-sectional shape of the conductive linear body 120 (see FIG. 2) is not particularly limited, and may be, for example, circular, elliptical, polygonal, rectangular, or flat. It is preferably circular or elliptical, more preferably circular, because it is manufactured using

When conductive linear body 120 has a circular cross-sectional shape, diameter D (see FIG. 2) of conductive linear body 120 in a cross-sectional view is preferably 5 μm or more and 3 mm or less. From the viewpoint of suppressing an increase in the resistance of the conductive structure 100 and improving heat generation efficiency and dielectric breakdown resistance when this is used as a heating element, the diameter D is more preferably 8 μm or more and 60 μm or less. More preferably, it is 12 μm or more and 40 μm or less.

This diameter D is obtained by observing the conductive linear body 120 of the conductive structure 100 using a digital microscope, measuring the diameter of the conductive linear body 120 at five randomly selected locations, and calculating the arithmetic mean value can be adopted.

When the cross section of conductive linear body 120 is elliptical, it is preferable that the major axis be in the same range as diameter D described above.

The arrangement interval P (see FIG. 2) of the conductive linear bodies 120 is preferably 1 mm or more and 400 mm or less, more preferably 2 mm or more and 200 mm or less, and even more preferably 3 mm or more and 100 mm or less.

If the arrangement interval P is within the above range, the patterned shape is such that the conductive linear bodies 120 are densely packed to some extent. Therefore, when the conductive structural body 100 is used as a heating element, the distribution of the temperature rise is made uniform. Various functions such as (no bias in temperature rise) can be further improved.

For the arrangement interval P of the conductive linear bodies 120, the conductive linear bodies 120 of the conductive structure 100 are observed visually or using a digital microscope, and the distance between two adjacent conductive linear bodies 120 is measured. can be obtained by The arrangement interval P between two adjacent conductive linear bodies 120 is the length along the direction in which the conductive linear bodies 120 are arranged (the width direction X, see FIGS. 1 and 2). and is the length between opposing portions of two conductive linear bodies 120 (see FIG. 2). As the arrangement interval P, when the conductive linear bodies 120 are arranged at uneven intervals, an arithmetic average value of the intervals between all the adjacent conductive linear bodies 120 can be adopted.

Although the material and the like of conductive linear body 120 are not particularly limited, it is preferably a linear body containing a metal wire (sometimes called a “metal wire linear body” or the like). Metal wires have high thermal conductivity, high electrical conductivity, high handling properties, and versatility. Therefore, if a metal wire linear body is used as the conductive linear body 120, the resistance value of the conductive structure 100 can be reduced and the light transmittance can be easily improved. For example, the higher the conductivity of the conductive linear body 120, the thinner the wire (the smaller the diameter D) can be. As a result, the transmission area of the light passing through the sheet can be increased. , the light transmittance can be improved. In addition, when the conductive structure 100 is applied as a heating element or the like, rapid heat generation is likely to be realized. Furthermore, it is easy to obtain a thin linear body having a small diameter D.

In addition to the metal wire linear body, the conductive linear body 120 includes a linear body containing carbon nanotubes and a linear body in which a thread is coated with a conductive coating.

The metallic wire linear body may be a linear body made of one metal wire, or may be a linear body made by twisting a plurality of metal wires.

Metal wires include, for example, metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals (for example, steel such as stainless steel and carbon steel, brass , phosphor bronze, zirconium-copper alloys, beryllium-copper alloys, iron-nickel alloys, nichrome, nickel-titanium alloys, iron-chromium-aluminum alloys, nickel-molybdenum-chromium alloys, and rhenium-tungsten alloys, etc.) is mentioned. Further, the metal wire may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, solder, or the like, and the surface is coated with a carbon material or polymer, which will be described later. There may be.

In particular, from the viewpoint of making the conductive linear body 120 having a low volume resistivity, the wire preferably contains at least one metal selected from tungsten, molybdenum, and alloys containing these.

Metal wires also include metal wires coated with carbon materials. When the metal wire is coated with a carbon material, the metallic luster is reduced, making it easier to make the presence of the metal wire inconspicuous. Metal corrosion is also suppressed when the metal wire is coated with a carbon material.

Examples of the carbon material that coats the metal wire include amorphous carbon (e.g., carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, carbon fiber, etc.), graphite, fullerene, graphene, carbon nanotubes, and the like. .

A linear body containing carbon nanotubes is, for example, a carbon nanotube forest (a growing body in which a plurality of carbon nanotubes are grown on a substrate such that the carbon nanotubes are oriented in a vertical direction to the substrate, such as an "array"). It is obtained by pulling out carbon nanotubes in a sheet form from the end of the carbon nanotube, bundling the pulled out carbon nanotube sheet, and then twisting the bundle of carbon nanotubes.

In the manufacturing method described above, a ribbon-like carbon nanotube linear body is obtained when twisting is not applied during twisting, and a thread-like linear body is obtained when twisting is applied. A ribbon-shaped carbon nanotube linear body is a linear body that does not have a structure in which carbon nanotubes are twisted.

Alternatively, a carbon nanotube linear body can be obtained by spinning from a carbon nanotube dispersion. Production of carbon nanotube linear bodies by spinning can be carried out by a known method.

From the viewpoint of making the diameter of the carbon nanotube linear body more uniform, it is preferable to use a filamentous carbon nanotube linear body, and from the viewpoint of increasing the purity of the carbon nanotube linear body, the carbon nanotube sheet is twisted. It is preferable to obtain a filamentous carbon nanotube linear body by

The carbon nanotube linear body may be a linear body in which two or more carbon nanotube linear bodies are woven together. Also, the carbon nanotube linear body may be a linear body in which a carbon nanotube and another conductive material are combined (sometimes called a "composite linear body" or the like).

As a composite linear body, for example, (i) a carbon nanotube linear body in which carbon nanotubes are pulled out in a sheet form from the end of a carbon nanotube forest, the pulled out carbon nanotube sheets are bundled, and then the bundle of carbon nanotubes is twisted. In the process of obtaining a composite linear body in which a single metal or metal alloy is supported on the surface of a carbon nanotube forest, sheet or bundle, or twisted linear body by vapor deposition, ion plating, sputtering, wet plating, etc. , (ii) a composite linear body obtained by twisting a bundle of carbon nanotubes together with a linear body of a single metal or a linear body or a composite linear body of a metal alloy, (iii) a linear body of a single metal or a metal alloy Composite linear bodies obtained by weaving linear bodies or composite linear bodies and carbon nanotube linear bodies or composite linear bodies, and the like.

In the composite linear body (ii), when twisting the bundle of carbon nanotubes, the carbon nanotubes may be made to carry a metal, as in the composite linear body (i).

In addition, the composite linear body of (iii) is a composite linear body obtained by knitting two linear bodies, but at least one linear body of a single metal, a linear body of a metal alloy, or a composite linear body As long as linear bodies are included, three or more carbon nanotube linear bodies, linear bodies made of a single metal, linear bodies made of a metal alloy, or composite linear bodies may be woven together.

Examples of the metal of the composite linear body include single metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, and alloys containing at least one of these single metals (copper-nickel - Phosphorus alloys, and copper-iron-phosphorus-zinc alloys, etc.).

Conductive linear body 120 may be a linear body in which a thread is coated with a conductive coating. Examples of the yarn include yarns spun from resins such as nylon and polyester. Examples of conductive coatings include coatings of metals, conductive polymers, carbon materials, and the like. The conductive coating can be formed by plating, vapor deposition, or the like. A linear body in which a thread is coated with a conductive coating can improve the conductivity of the linear body while maintaining the flexibility of the thread. That is, it becomes easy to reduce the resistance of the conductive structure 100 .

As the material of the conductive linear body 120, various materials described above can be used depending on the application. , silver, gold, and an alloy containing two or more metals. Alloys include, for example, stainless steel, carbon steel, brass, phosphor bronze, zirconium-copper alloy, beryllium-copper alloy, iron-nickel alloy, nickel-chromium alloy, nickel-titanium alloy, iron-chromium-aluminum alloy. , nickel-chromium-molybdenum alloys, and rhenium-tungsten alloys. By using such a material, heat can be efficiently generated when electricity is applied.

<Method for manufacturing conductive structure>

Conventionally, attempts have been made to manufacture the above-described conductive structure by, for example, the following manufacturing method.

FIG. 7 is a schematic diagram showing an example of a conventional manufacturing method. FIG. 8 is a cross-sectional view showing an example of the vicinity of a nozzle in a conventional manufacturing method.

While conveying the laminate 110 having the base material 111 and the adhesive layer 112 over the upstream guide roller 11, the pressing roller 10, and the downstream guide roller 12 (see arrow F1), the adhesive layer 112 Conductive linear bodies 130 are formed on the surface of adhesive layer 112 by injecting conductive material 130 a to become conductive linear bodies 130 from nozzle 40 toward the surface. Then, as shown in FIG. 8, the nozzle 40 has an injection hole 42 for injecting the conductive material 130a that becomes the conductive linear body 130. As shown in FIG.

When the conductive material 130a is injected from the nozzle 40 toward the adhesive layer 112, if the nozzle 40 is not in contact with the adhesive layer 112, the conductive material 130a is not injected from the tip 41 of the nozzle, causing clogging. Therefore, when the conductive material 130a is injected from the nozzle 40, the tip 41 of the nozzle 40 is in contact with the surface of the laminate 110. (See FIG. 8).

However, when the behavior near the nozzle 40 in the conventional manufacturing method was examined in detail, the tip 41 of the nozzle 40 was in contact with the adhesive layer 112 via the conductive filaments 130, so the nozzle 40 was The movement speed of the nozzle 40 when reciprocating or sliding left and right is often restricted due to the relationship with the transport speed of the laminate 110 . As a result, the conventional manufacturing method cannot form a fine shape, and there is a problem that the pattern accuracy of the conductive linear body 130 is restricted.

For example, when the conductive structure is used for various conductive members, heaters, etc., it is necessary to further miniaturize the wiring pattern due to the demand for miniaturization of products and parts. For example, in addition to reducing the diameter D of one conductive linear body 130, it is also possible to reduce the arrangement interval P when arranging a plurality of conductive linear bodies 130. be. At that time, conventional manufacturing methods cannot sufficiently meet the demand for such fine and small-pitch wiring.

However, according to the manufacturing method according to the present embodiment, the above problem does not occur, and the conductive structure 100 can be manufactured with high pattern accuracy even if the shape of the conductive linear body 130 is fine. can do.

FIG. 3 is a schematic diagram showing an example of the manufacturing method according to the present embodiment, FIG. 4 is a partial top view showing an example of the manufacturing method according to the present embodiment, and FIG. It is a sectional view showing an example near a nozzle.

The method for manufacturing the conductive structure 100 according to the present embodiment includes a substrate 111, an adhesive layer 112 laminated on the surface of the substrate 111, and a conductive linear body 120 arranged on the surface of the adhesive layer 112. A method for manufacturing a conductive structure 100, comprising
(1) a step of preparing a laminate 110 including a substrate 111 and an adhesive layer 112;
(2) While transporting the laminate 110, the conductive linear body 120 is injected from the nozzle 20 onto the surface of the adhesive layer 112 of the laminate 110 to form the conductive linear body 120. on the surface of the adhesive layer 112;
including
The nozzle 20 includes an injection hole 22 for injecting the conductive material 120a, and an air injection hole 23 arranged near the injection hole 22 for injecting air,
The nozzle 20 is arranged at a predetermined distance L from the transported laminate 110,
In the step (2), the conductive material 120a is injected from the injection hole 22 toward the laminated body 110 being conveyed, and air is blown from the air injection hole 23, thereby forming the conductive linear body 120 into the adhesive layer. formed on the surface of 112,
It is a manufacturing method of the conductive structure 100 .

(1) A process of preparing the laminate 110 will be described.

For example, the adhesive layer 112 can be formed by applying an adhesive layer-forming composition to the surface of the substrate 111 . After applying the composition for forming an adhesive layer, a step of drying the coating film may be performed as necessary. Moreover, as the sheet having the adhesive layer 112 formed on the surface of the substrate 111, a commercially available product may be used.

The adhesive layer-forming composition can be a solution containing the above-described components that can be used as the adhesive layer 112 and a solvent. Examples of solvents that can be used here include alcohol-based solvents, ketone-based solvents, ester-based solvents, ether-based solvents, glycol-based solvents, glycol ester-based solvents, hydrocarbon-based solvents, halogenated alkyl-based solvents, and water. is mentioned.

Examples of alcohol solvents include ethanol, butanol, isobutanol, isopropyl alcohol, n-propyl alcohol, t-butanol, 1,3-butanediol, and 1,4-butanediol.

Ketone solvents include, for example, acetone, methyl ethyl ketone, methyl propyl ketone, methyl isobutyl ketone, diisobutyl ketone, cyclohexanone, and the like.

Examples of ester solvents include ethyl acetate, methyl acetate, butyl acetate, n-propyl acetate, and methoxybutyl acetate.

Examples of ether-based solvents include diisopropyl ether, methyl cellosolve, ethyl cellosolve, butyl cellosolve, and 1,4-dioxane.

Examples of glycol-based solvents include ethylene glycol, diethylene glycol, triethylene glycol, and propylene glycol.

Examples of glycol ester solvents include ethylene glycol monoethyl ether acetate and propylene glycol monomethyl ether acetate.

Hydrocarbon solvents include, for example, benzene, toluene, xylene, n-hexane, isohexane, and cyclohexane.

Halogenated alkyl solvents include, for example, methylene chloride, trichlorethylene, perchlorethylene, and chloroform.

These solvents may be used individually by 1 type, and may use 2 or more types together.

When drying is performed, the drying conditions are preferably 60° C. or higher and 200° C. or lower for 5 seconds or longer and 120 seconds or shorter. The drying temperature is more preferably 80° C. or higher and 150° C. or lower, and even more preferably 90° C. or higher and 130° C. or lower. The drying time is more preferably 10 seconds or more and 100 seconds or less, and even more preferably 20 seconds or more and 80 seconds or less. A method for drying is not particularly limited, and for example, a heating device such as a heater or a dryer can be used.

The laminate 110 prepared by such a method is transported using a transporting device equipped with rollers or the like, and the step (2) is carried out, thereby forming the conductive linear bodies 120 on the surface of the adhesive layer 112. can be formed.

In this embodiment, as shown in FIGS. 3 and 4, the case of using the pressing roller 10 is exemplified. A configuration in which the conductive material 120 a is injected from the nozzle 20 onto the body 110 may be employed.

Although the roller diameter (diameter) of the guide rollers 11 and 12 is not particularly limited, it is preferably 4 cm or more and 15 cm or less, more preferably 5 cm or more and 12 cm or less, and 8 cm or more and 10 cm or less.

The roller diameter (diameter) of the pressing roller 10 is not particularly limited, but is preferably 10 cm or more and 100 cm or less, more preferably 15 cm or more and 80 cm or less, and even more preferably 20 cm or more and 50 cm or less.

The conveying speed is not particularly limited, but is preferably 0.5 m/min or more and 10 m/min or less, more preferably 1 m/min or more and 8 m/min or less, and 2 m/min or more and 5 m/min or less. is more preferred. According to the present embodiment, the conductive linear bodies 120 can be formed on the surface of the adhesive layer 112 with high pattern accuracy even at such a relatively high transport speed and even with fine shapes. can be done.

In addition, the tension during transportation (conveyance tension) is preferably 10 N/m or more and 300 N/m or less, more preferably 20 N/m or more and 200 N/m or less, and 30 N/m or more and 150 N/m or less. It is even more preferable to have

Subsequently, (2) the step of forming the conductive linear body 120 on the surface of the adhesive layer 112 will be described.

In the step (2), a nozzle 20 having an injection hole 22 for injecting the conductive material 120a and an air ejection hole 23 arranged near the injection hole 22 for ejecting air is used. Then, the tip 21 of the nozzle 20 is separated from the surface of the laminate 110 by a predetermined distance L, that is, the tip 21 of the nozzle 20 is not in contact with the surface of the laminate 110, and the conductive material 120a is injected. A conductive linear body 120 is formed on the surface of the adhesive layer 112 by injecting it from the holes 22 .

As shown in FIG. 5, the nozzle 20 is formed with an injection hole 22 through which the conductive material 120a is delivered, from which the conductive material 120a is delivered toward the surface of the adhesive layer 112 (see arrow F3). The nozzle 20 is provided with an air ejection hole 23 in the vicinity of the injection hole 22, from which air is ejected (see arrow F3). As a result, even though the conductive material 120a is injected in a non-contact state with the surface of the laminate 110, it is possible to firmly adhere to the adhesive layer 112 by the injection force. Even the linear body 120 can be firmly adhered to the adhesive layer 112 .

The air ejection hole 23 may be provided in the vicinity of the injection hole 22, but when the nozzle 20 is viewed from the bottom, it is preferably provided in a range of 100 μm or more and 2 mm or less from the injection hole 22, more preferably 200 μm or more and 1 mm or less. It is more preferable to provide it in the range, and it is even more preferable to provide it in the range of 300 μm or more and 600 μm or less.

The shape of the air ejection hole 23 is not particularly limited, but the air ejection hole 23 is arranged in one place on the upstream side (this side) of the injection hole 22 in the line direction, and is located downstream of the injection hole 22. It is preferable to arrange them in one place on the side (see FIG. 5). In this way, by arranging the air ejection holes 23 independently on the upstream side and the downstream side, it is possible to independently control the respective ejection pressures, so that the pattern accuracy can be further improved. Of course, the air ejection holes 23 may be arranged in a substantially circular shape so as to surround the outer periphery of the injection hole 22 when the nozzle 20 is viewed from the bottom.

The diameter of the injection hole 22 is preferably a dimensional value corresponding to the diameter D of the conductive linear body 120, for example, preferably 5 μm or more and 3 mm or less, more preferably 8 μm or more and 200 μm or less. More preferably, it is 12 μm or more and 100 μm or less.

Furthermore, in this embodiment, the nozzle 20 is separated from the surface of the laminate 110 by a predetermined distance L to inject the conductive material 120a. As a result, restrictions on the movement of the nozzle 20 are relaxed, and even the conductive linear bodies 120 with finer and finer pattern accuracy can be shaped accurately. For example, when the wave-shaped conductive linear body 120 is used, the waveform, amplitude, and wavelength can be set more finely than in the conventional manufacturing method.

From this point of view, the distance L between the nozzle 20 and the surface of the laminate 110 is preferably 0.01 mm or more and 20 mm or less, more preferably 0.02 mm or more and 10 mm or less, and 0.05 mm or more and 5 mm. More preferably: Moreover, the distance L is preferably larger than the diameter D of the conductive filament 120 from the viewpoint of ensuring a non-contact state. By arranging the nozzle 20 away from the surface of the transported laminate 110 by the distance described above, even the conductive linear bodies 120 with finer and finer pattern accuracy can be accurately shaped. For example, when the wave-shaped conductive linear body 120 is used, the waveform, amplitude, and wavelength can be set more finely than in the conventional manufacturing method.

The tip diameter of the nozzle 20 is preferably 1.5 times or more and 10 times or less, more preferably 1.2 times or more and 10 times or less, as large as the diameter D of the conductive linear body when viewed in cross section. It is more preferably 3 times or more and 8 times or less, and even more preferably 1.4 times or more and 6 times or less. The tip diameter of the nozzle 20 here means the maximum outer diameter of the tip of the nozzle 20 .

Although the tip diameter of the nozzle 20 is not particularly limited, it is preferably a dimension value corresponding to the diameter D of the conductive linear body 120, for example, preferably 5 μm or more and 3 mm or less, and 8 μm or more and 200 μm or less. is more preferably 12 μm or more and 100 μm or less.

By controlling the lower limit of the tip diameter of the nozzle 20 within the range described above with respect to the diameter D of the conductive linear body 120 in a cross-sectional view, a sufficient amount of air ejected from the air ejection holes 23 can be ensured. Even if the conductive linear body 120 has a smaller diameter, the conductive material 120a can be accurately injected from the injection hole 22, and the ejection is sufficient to allow the conductive material 120a to be firmly adhered to the adhesive layer 112. power can be demonstrated. Further, by controlling the upper limit of the tip diameter of the nozzle 20 within the range described above with respect to the diameter D of the conductive linear body 120 in a cross-sectional view, the turbulence of the air jetted from the air jetting holes 23 can be reduced. Since it can be effectively suppressed, the conductive linear bodies 120 injected onto the adhesive layer 112 can be shaped with high accuracy without being deformed.

The ejection pressure of the air ejected from the air ejection holes 23 is preferably 0.1 MPa or more and 10 MPa or less, more preferably 0.1 MPa or more and 6 MPa or less, and further preferably 0.1 MPa or more and 5 or less. It is preferably 0.2 MPa or more and 1.5 MPa or less, and even more preferably 0.3 MPa or more and 1 MPa or less. By setting the air ejection pressure within such a range, a sufficient amount of air ejection from the air ejection holes 23 can be ensured. can be accurately injected from the injection hole 22, and a sufficient ejection force can be exerted to the extent that the adhesive layer 112 can be firmly adhered. Furthermore, even if the nozzle 20 injects the conductive material 120a in a non-contact state with the adhesive layer 112, the conductive material 120a is smoothly and continuously applied to the adhesive layer 112 without clogging or dripping. can be brought out. As a result, even when conveyed at high speed, the yield is good, and even the conductive linear bodies 120 with finer and finer pattern accuracy can be accurately shaped.

By appropriately selecting the rotation speed of the pressing roller 10, the conveying speed of the conductive linear body 120, and the moving speed and moving distance of the wiring portion 30, the conductive linear body having a desired waveform, amplitude and wavelength can be obtained. A body 120 can be formed on the surface of the adhesive layer 112 .

Therefore, in the step (2), the conductive material 120a is injected from the injection hole 22 toward the surface of the adhesive layer 112 of the laminate 110 while moving the nozzle 20 along the width direction X of the laminate 110. Accordingly, it is preferable to form the corrugated conductive linear body 120 on the surface of the adhesive layer 112 (see FIGS. 3 and 4). By reciprocating or sliding the nozzle 20 in the width direction X of the laminate 110 , the wave-shaped conductive linear body 120 can be formed on the surface of the adhesive layer 112 . According to the present embodiment, even with such a complicated shape, the conductive linear body can be formed with high manufacturing efficiency and with high pattern accuracy even with a fine shape. preferred.

In the step (2), for example, the laminated body 110 is arranged on the outer peripheral surface of the pressing roller 10 so that the base material 111 is on the inside and the adhesive layer 112 is on the outside, and the pressing roller 10 is rotated while the adhesive is adhered. Conductive strands 120 are formed by unrolling conductive material 120 a onto layer 112 . At this time, while repeating a small reciprocating motion of the wiring portion 30 in a direction (see the width direction X) intersecting with the longitudinal direction Y of the laminate 110 (direction of wave propagation, transport direction in transport), a large movement as a whole is performed. It is moved to the desired shape so that it becomes a reciprocating motion. Thereby, the conductive linear body 120 having a compound wave shape can also be obtained.

At that time, the cycle of reciprocation or sliding may be made irregular or reduced. Such a reciprocating motion or sliding motion makes the shape of the conductive linear body 120 more complicated. can be maintained.

When the conductive linear body 120 has a wavy shape, the wiring part 30 having the nozzle 20 is formed by, for example, reciprocating or sliding the nozzle 20 left and right in accordance with the wavy shape of the conductive linear body 120 to be formed. , it is preferable to inject the conductive linear body 120 . At this time, it is preferable to move the nozzle amplitude and conveying speed so as to correspond to the waveform amplitude and wavelength, respectively.

A suitable shape of the conductive linear body 120 shaped in this manner can be, for example, a sine wave or a shape similar thereto. A more preferable shape can be a compound wave shape having a small wave shape in a large sine wave, as illustrated in FIG. As described above, according to the present embodiment, high pattern accuracy can be maintained even with a fine wave shape.

Then, although not shown, after the above-described steps (1) and (2), a cutting device arranged downstream cuts the conductive structure 100 to a predetermined length, thereby obtaining a desired length. It may be a conductive structure 100 of length in direction Y. FIG.

As described above, according to the manufacturing method according to the present embodiment, the conductive structure 100 having the conductive linear bodies 120 can be manufactured with high manufacturing efficiency, and even with a fine shape, a high pattern can be obtained. The conductive linear body 120 can be formed with precision.

From such a point of view, as a preferred specific example of the conductive structure 100, it is preferable to use at least one selected from the group consisting of a conductive member, a heater, and a sensor. For example, since the conductive structure 100 has the conductive linear bodies 120 with low surface resistance, it is suitable for application as a heater. When used as a heater, the conductive linear body 120 can be used as a heating element.

A case where the conductive structure 100 described above is used as the heater 200 will be exemplified below.

FIG. 6 is a perspective view showing an example of a heater using a conductive structure according to this embodiment.

The heater 200 has electrodes 210 attached to opposite ends of the conductive structure 100 described above. Therefore, the electrode 210 will be mainly described below. Although the dimensions and shape of the heater 200 are not particularly limited, it can be suitably used as a sheet heater, for example.

Electrode 210 is used to supply current to conductive linear body 120 . Electrode 210 can be formed using known electrode materials. Examples of electrode materials include conductive paste (silver paste, etc.), metal foil (copper foil, etc.), metal wire, and the like. Electrodes 210 are arranged to be electrically connected to both ends of conductive linear body 120 .

Metal foils or metal wires include metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals (for example, stainless steel, carbon steel, etc.). steel, brass, phosphor bronze, zirconium copper alloy, beryllium copper, iron nickel, nichrome, nickel titanium, kanthal, hastelloy, and rhenium tungsten, etc.). Also, the metal foil or metal wire may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloy, solder, or the like.

The ratio of the resistance values of the electrode 210 and the conductive linear body 120 (the resistance value of the electrode 210/the resistance value of the conductive linear body 120) is preferably 0.0001 or more and 0.3 or less, and is preferably 0.0005. It is more preferable to be 0.1 or less. This resistance value ratio can be obtained from "the resistance value of the electrode 210/the resistance value of the conductive linear body 120". By setting the resistance value ratio within such a range, abnormal heat generation at the electrode portion can be effectively suppressed when used as a heating element. For example, the heater 200 having good heat generation efficiency can be obtained by causing only the conductive linear body 120 to generate heat.

The resistance value of electrode 210 and the resistance value of conductive linear body 120 can each be measured using a tester. First, the resistance value of the electrode 210 is measured, and the resistance value of the conductive structure 100 to which the electrode 210 is attached is measured. After that, by subtracting the measured value of the electrode 210 from the resistance value of the conductive structure 100 to which the electrode 210 is attached, the respective resistance values of the electrode 210 and the conductive structure 100 can be calculated.

The thickness of the electrode 210 can be appropriately set in consideration of the dimensions and shape of the conductive structure 100. For example, the thickness is preferably 2 μm or more and 200 μm or less, and 2 μm or more and 120 μm or less. is more preferable, and more preferably 10 μm or more and 100 μm or less. By setting the thickness of the electrode 210 within such a range, it is possible to achieve higher electrical conductivity and lower resistance. Moreover, sufficient strength can be imparted as an electrode.

The present invention will be described in more detail with reference to the following examples and comparative examples, but the present invention is in no way limited by the following examples.

<Example 1>

First, on a polyurethane film having a thickness of 100 μm and a width (length) of 1000 m as the base material 111, an acrylic adhesive (manufactured by Lintec, trade name “PK”) is applied to a thickness of 20 μm to form an adhesive layer 112 (elastic adhesive layer). 0.1 MPa) was formed, and a pressure-sensitive adhesive sheet was produced as the laminate 110 .
Next, a wire injection device (manufactured by Lintec Corporation) having the configuration shown in FIGS. 3 and 4 was prepared. The wiring section 30 has eight nozzles 20 shown in FIG. 5 (tip diameter of nozzle 20=0.4 mm, diameter of injection hole 22=0.1 mm).
Laminate 110 is set on this wire injection device, and while conveying this at a conveying speed of 3 m / min, wiring part 30 is stretched along the width direction of laminate 110 (see arrow F2). A metal wire (material: tungsten) is ejected while being moved at (conveyance tension) 100 N/m, and the eight metal wires as the conductive linear body 120 are arranged at equal intervals P (see FIG. 2) = 1 mm. arranged as At this time, the distance L from the tip 21 of the nozzle 20 to the laminate 110 was set to 0.5 mm. The ejection pressure of the air ejected from the air ejection holes 23 was 0.5 MPa.

Then, by moving all the nozzles 20 in a direction orthogonal to the conveying direction of the laminate 110 , a sheet-like conductive member was obtained as the conductive structure 100 . The metal wire as the conductive linear body 120 had a circular cross section and a diameter D of 80 μm. That is, the tip diameter of the nozzle 20 was five times the diameter D (diameter D=80 μm, tip diameter of the nozzle 20=0.4 mm).

The shape of the target pattern to be formed on the surface of the laminate 110 was set to have an amplitude of 10 mm and a wavelength of 20 mm. On the other hand, when the pattern shape of the actually obtained conductive linear body 120 was actually measured with a digital microscope, the amplitude was 9.5 mm and the wavelength was 19.9 mm. From the above, the pattern accuracy of Example 1 was 95% for the amplitude (measured value of amplitude/set value of amplitude) and 99.5% for the wavelength (measured value of wavelength/set value of wavelength). rice field.

As described above, according to the present embodiment, a conductive structure having conductive linear bodies can be formed with high pattern accuracy even in a fine shape while maintaining high production efficiency. At least it was confirmed that it is possible.

10: Pressing rollers 11, 12: Guide roller 20: Nozzle 21: Tip 22: Injection hole 23: Air ejection hole 30: Wiring part 40: Nozzle 41: Tip 42: Injection hole 100: Conductive structure 110: Laminate 111 : Base material 112: Adhesive layer 120: Conductive linear body 120a: Conductive material 130: Conductive linear body 130a: Conductive material 200: Heater 210: Electrode X: Width direction,
Y: longitudinal direction L: distance D: diameter P: arrangement intervals F1, F2, F3: arrows

Claims (9)

A method for producing a conductive structure comprising a substrate, an adhesive layer laminated on the surface of the substrate, and conductive linear bodies arranged on the surface of the adhesive layer,
(1) preparing a laminate including the substrate and the adhesive layer;
(2) While transporting the laminate, a conductive material to be the conductive linear bodies is ejected from a nozzle onto the surface of the adhesive layer of the laminate, thereby displacing the conductive linear bodies as described above. Forming on the surface of the adhesive layer;
including
The nozzle includes an injection hole for injecting the conductive material, and an air ejection hole disposed near the injection hole for ejecting air,
The nozzle is arranged at a predetermined distance from the transported laminate,
In the step (2), the conductive material is injected from the injection hole toward the laminated body being conveyed, and air is blown from the air injection hole, thereby removing the conductive linear body. formed on the surface of the adhesive layer,
A method for manufacturing an electrically conductive structure. The step (2) is performed by injecting the conductive material from the injection hole toward the surface of the adhesive layer of the laminate while moving the nozzle along the width direction of the laminate. , a step of forming the wave-shaped conductive linear body on the surface of the adhesive layer,
A method for manufacturing a conductive structure according to claim 1 . The adhesive layer contains at least one selected from the group consisting of acrylic resins, urethane resins, rubber resins, silicone resins, epoxy resins, polycarbonate resins, and ester resins.
3. A method for manufacturing a conductive structure according to claim 1 or 2. The elastic modulus of the adhesive layer is 0.001 MPa or more and 10 MPa or less.
A method for manufacturing a conductive structure according to any one of claims 1 to 3. The conductive linear body contains at least one selected from the group consisting of copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and alloys containing two or more metals.
A method for manufacturing a conductive structure according to any one of claims 1 to 4. The nozzle is arranged at a distance of 0.01 mm or more and 20 mm or less from the surface of the laminated body to be conveyed,
A method for manufacturing a conductive structure according to any one of claims 1 to 5. The tip diameter of the nozzle is 1.5 times or more and 10 times or less than the diameter of the conductive linear body in a cross-sectional view.
A method for manufacturing a conductive structure according to any one of claims 1 to 6. The ejection pressure of the air ejected from the air ejection hole is 0.1 MPa or more and 10 MPa or less.
A method for manufacturing a conductive structure according to any one of claims 1 to 7. The conductive structure is at least one selected from the group consisting of a conductive member, a heater, and a sensor.
A method for manufacturing a conductive structure according to any one of claims 1 to 8.

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