JP2022148466A - Resin composition for cleaning - Google Patents

Resin composition for cleaning Download PDF

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JP2022148466A
JP2022148466A JP2021050165A JP2021050165A JP2022148466A JP 2022148466 A JP2022148466 A JP 2022148466A JP 2021050165 A JP2021050165 A JP 2021050165A JP 2021050165 A JP2021050165 A JP 2021050165A JP 2022148466 A JP2022148466 A JP 2022148466A
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mass
resin
component
cleaning
parts
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宏樹 正村
Hiroki Shomura
智朗 内川
Tomoaki Uchikawa
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Daicel Miraizu Ltd
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Daicel Miraizu Ltd
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Priority to JP2021050165A priority Critical patent/JP2022148466A/en
Priority to PCT/JP2022/012529 priority patent/WO2022202649A1/en
Priority to KR1020237032023A priority patent/KR20230159432A/en
Priority to CN202280023029.4A priority patent/CN117042943A/en
Publication of JP2022148466A publication Critical patent/JP2022148466A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25—Component parts, details or accessories; Auxiliary operations
    • B29C48/27—Cleaning; Purging; Avoiding contamination
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • C08K5/42—Sulfonic acids; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C08L25/12—Copolymers of styrene with unsaturated nitriles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L55/00—Compositions of homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C08L23/00 - C08L53/00
    • C08L55/02—ABS [Acrylonitrile-Butadiene-Styrene] polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide a resin composition for cleaning which is usable for cleaning resin-molding machines such as extrusion molding machines and injection molding machines.SOLUTION: A resin composition for cleaning comprises (A) a polycarbonate resin, (B) a styrene-based resin, and (C-1) a polyoxyethylene-polyoxypropylene glycol, wherein the content of the (C-1) component is 0.5-3.5 pts.mass per 100 pts.mass of the sum of the components (A) and (B).SELECTED DRAWING: None

Description

本開示は、樹脂の成形加工に使用する押出加工機や射出成形機の洗浄に使用できる洗浄用樹脂組成物に関する。 TECHNICAL FIELD The present disclosure relates to a cleaning resin composition that can be used for cleaning extrusion machines and injection molding machines used for resin molding.

樹脂の成形加工に使用する押出加工機や射出成形機を洗浄するための洗浄剤が知られている。
特許文献１（特許第５４０９５２２号公報）には、（ａ）熱可塑性樹脂３０～９０質量％と、（ｂ）平均長さが１００μｍ以下のガラス繊維７０～１０質量％とを含有し、引火温度が４００℃以上である成形機用洗浄剤の発明が記載されている（特許請求の範囲）。
（ａ）熱可塑性樹脂については、ポリスチレン、ポリアミド、スチレン－アクリロニトリル共重合体、ポリカーボネートの中でもポリカーボネートが好ましく、２種以上混合して用いてもよいと記載されている。（段落番号００３１、００３６４） Detergents for cleaning extruders and injection molding machines used for resin molding are known.
Patent Document 1 (Patent No. 5409522) contains (a) 30 to 90% by mass of thermoplastic resin and (b) 70 to 10% by mass of glass fiber having an average length of 100 μm or less, and has a flash temperature is 400° C. or higher (claim).
(a) Regarding the thermoplastic resin, it is described that among polystyrene, polyamide, styrene-acrylonitrile copolymer, and polycarbonate, polycarbonate is preferable, and two or more kinds may be mixed and used. (Paragraph numbers 0031, 00364)

特許文献２（特許第５１７１５７３号公報）は、ポリカーボネート（Ａ）１００重量部、珪酸塩化合物（Ｂ）０．１～１００重量部並びに有機酸及び／又は有機酸誘導体（Ｃ）０．００１～１０重量部を含有し、珪酸塩化合物（Ｂ）並びに有機酸及び／又は有機酸誘導体（Ｃ）の混合物のｐＨ値が５～８である洗浄剤の発明が記載されている（特許請求の範囲）。
ポリカーボネートのほかにポリスチレン、ＨＩＰＳ、ＡＳ樹脂、ＡＢＳ樹脂などを含有しても良いことが記載されている。（段落番号００３９） Patent Document 2 (Patent No. 5171573) discloses a composition containing 100 parts by weight of polycarbonate (A), 0.1 to 100 parts by weight of silicate compound (B), and 0.001 to 10 parts by weight of organic acid and/or organic acid derivative (C). parts by weight, and the mixture of silicate compound (B) and organic acid and/or organic acid derivative (C) has a pH value of 5 to 8 (Claims) .
It is described that polystyrene, HIPS, AS resin, ABS resin, etc. may be contained in addition to polycarbonate. (Paragraph number 0039)

特許文献３（ＷＯ２０１９／０６９７９８ Ａ１）には、熱可塑性樹脂、及びＴＧＡの分解開始温度が２００℃以上かつ融点が１００℃未満の界面活性剤を含有する、射出成形機及び金型用洗浄剤樹脂組成物の発明が記載されており、前記界面活性剤はスルホン酸塩（アルファスルホ脂肪酸メチルエステル塩）が記載されている（特許請求の範囲）。
熱可塑性樹脂は多数列挙されており、ポリエチレンを含むことが特に好ましいと記載されている。（段落番号００２１） Patent Document 3 (WO2019/069798 A1) describes a detergent resin for injection molding machines and molds containing a thermoplastic resin and a surfactant having a TGA decomposition initiation temperature of 200°C or more and a melting point of less than 100°C. A composition invention is described, and the surfactant is described as a sulfonate (alpha sulfo fatty acid methyl ester salt) (claims).
A number of thermoplastic resins are listed, with polyethylene being particularly preferred. (Paragraph number 0021)

特許文献４（特開２０２１－７３４号公報）には、（Ａ）試験温度（θ）２２０℃、公称荷重（Ｍnom）１０kgの条件におけるメルトマスフローレート（ＭＦＲ）の値が１g／１０min乃至４０g／１０minであるスチレン－アクリロニトリル共重合樹脂３０質量部乃至９０質量部、及び（Ｂ）試験温度（θ）３００℃、公称荷重（Ｍnom）１．２kgの条件におけるメルトボリュームフローレート（ＭＶＲ）の値が３cm3／１０min乃至１３０cm3／１０minであるポリカーボネート樹脂質７０量部乃至１０質量部からなり、（Ａ）及び（Ｂ）成分の質量部の合計が１００質量部であることを特徴とする、洗浄用樹脂組成物の発明が記載されている（特許請求の範囲）。
ポリカーボネート樹脂の含有量（ＡＳ樹脂の含有量）については、本発明の洗浄用樹脂組成物において、ポリカーボネート樹脂の含有量は、（Ａ）及び（Ｂ）成分の合計１００質量部に対して、７０質量部乃至１０質量部であり、６０質量部乃至２０質量部であることが好ましく、５０質量部乃至３０質量部であることがより好ましい。（段落番号００２２） In Patent Document 4 (Japanese Patent Laid-Open No. 2021-734), (A) the value of the melt mass flow rate (MFR) under the conditions of a test temperature (θ) of 220 ° C. and a nominal load (Mnom) of 10 kg is 1 g / 10 min to 40 g / 30 parts by mass to 90 parts by mass of a styrene-acrylonitrile copolymer resin for 10 minutes, and (B) a test temperature (θ) of 300 ° C. and a nominal load (Mnom) of 1.2 kg. 3 cm 3 /10 min to 130 cm 3 /10 min consisting of 70 to 10 parts by mass of a polycarbonate resin, and the sum of the parts by mass of components (A) and (B) is 100 parts by mass. (Claims).
Regarding the content of the polycarbonate resin (content of the AS resin), in the cleaning resin composition of the present invention, the content of the polycarbonate resin is 70 parts per 100 parts by mass in total of the components (A) and (B). It is 10 parts by mass to 10 parts by mass, preferably 60 to 20 parts by mass, and more preferably 50 to 30 parts by mass. (Paragraph number 0022)

特許第５４０９５２２号公報Japanese Patent No. 5409522 特許第５１７１５７３号公報Japanese Patent No. 5171573 ＷＯ２０１９／０６９７９８ Ａ１WO2019/069798 A1 特開２０２１－７３４号公報Japanese Patent Application Laid-Open No. 2021-734

本開示は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄性能が良い洗浄用樹脂組成物を提供することを課題とする。 An object of the present disclosure is to provide a cleaning resin composition having good cleaning performance for resin molding machines such as extruders and injection molding machines.

本開示は、（Ａ）ポリカーボネート樹脂、（Ｂ）スチレン系樹脂および（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを含有し、（Ｃ－１）成分の含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部である、洗浄用樹脂組成物を提供する。 The present disclosure contains (A) polycarbonate resin, (B) styrene resin and (C-1) polyoxyethylene polyoxypropylene glycol, and the content of component (C-1) is such that the content of component (A) and ( A cleaning resin composition is provided in an amount of 0.5 to 3.5 parts by weight per 100 parts by weight of component B).

また本開示は、（Ａ）ポリカーボネート樹脂、（Ｂ）スチレン系樹脂、（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムを含有し、（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中の（Ｃ－１）成分の含有割合が２０～８０質量％、（Ｃ－２）成分の含有割合が８０～２０質量％であり、（Ｃ－１）成分と（Ｃ－２）成分の合計含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１～５質量部である、洗浄用樹脂組成物を提供する。 The present disclosure also contains (A) polycarbonate resin, (B) styrenic resin, (C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzene sulfonate, The content ratio of component (C-1) in the total 100% by mass of component (C-1) and component (C-2) is 20 to 80% by mass, and the content ratio of component (C-2) is 80 to 20% by mass. %, and the total content of components (C-1) and (C-2) is 1 to 5 parts by mass per 100 parts by mass of components (A) and (B). A resin composition is provided.

本開示の洗浄用樹脂組成物は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄性能が優れている。 The cleaning resin composition of the present disclosure has excellent cleaning performance for resin molding machines such as extruders and injection molding machines.

（Ａ）成分のポリカーボネート樹脂は、例えば特開２０１９－１２７５１６号公報、特開２０２１－７３４号公報および特許第５１７１５７３号公報に記載されているものと同じものを使用することができる。 As the component (A) polycarbonate resin, for example, those described in JP-A-2019-127516, JP-A-2021-734 and JP-A-5171573 can be used.

（Ｂ）成分スチレン系樹脂は、ポリスチレン（ＰＳ）、ハイインパクトポリスチレン（ＨＩＰＳ）、アクリロニトリル－スチレン樹脂（ＡＳ樹脂）、アクリロニトリル－ブタジエン－スチレン樹脂（ＡＢＳ樹脂）、メチルメタクリレート－ブタジエン－スチレン樹脂（ＭＢＳ樹脂）、ブチルアクリレート－アクリロニトリル－スチレン樹脂（ＡＡＳ樹脂）などを挙げることができ、これらの中でもＡＳ樹脂が好ましい。 (B) Component styrene resins include polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin (MBS). resins), butyl acrylate-acrylonitrile-styrene resins (AAS resins), etc. Among these, AS resins are preferred.

（Ａ）成分と（Ｂ）成分の合計１００質量％中、
（Ａ）成分の含有割合は６０～９５質量％が好ましく、７０～９０質量％がより好ましく、７５～９０質量％がさらに好ましく、
（Ｂ）成分の含有割合は４０～５質量％が好ましく、３０～１０質量％がより好ましく、２５～１０質量％がさらに好ましい。 In the total 100% by mass of the component (A) and the component (B),
The content of component (A) is preferably 60 to 95% by mass, more preferably 70 to 90% by mass, even more preferably 75 to 90% by mass,
The content of component (B) is preferably 40 to 5% by mass, more preferably 30 to 10% by mass, even more preferably 25 to 10% by mass.

さらに界面活性剤として、
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを単独で含有するか、または
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムの両方を含有することができる。
（Ｃ－２）成分のアルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムのアルキル基は、直鎖アルキル基と分岐鎖アルキル基のいずれでもよいが、直鎖アルキル基が好ましく、アルキル基の炭素数は１０～１３が好ましい。 Furthermore, as a surfactant,
(C-1) contains polyoxyethylene polyoxypropylene glycol alone, or both (C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzenesulfonate can contain
The alkyl group of the component (C-2) alkyl (C10-16) sodium benzenesulfonate may be either a straight-chain alkyl group or a branched-chain alkyl group, but a straight-chain alkyl group is preferred, and the number of carbon atoms in the alkyl group is 10 to 13 are preferred.

（Ｃ－１）成分を単独で含有するときの含有割合は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部が好ましく、１～３．５質量部がより好ましく、１．５～３質量部がさらに好ましい。
（Ｃ－１）成分と（Ｃ－２）成分の両方を含有するときの含有割合は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して合計で１～５質量部が好ましく、１．５～４重量部がより好ましく、２～４質量部がさらに好ましい。
（Ｃ－１）成分と（Ｃ－２）成分の両方を含有するときのそれぞれの含有割合は、（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中、（Ｃ－１）成分の含有割合は２０～８０質量％が好ましく、３０～７０質量％がより好ましく、（Ｃ－２）成分の含有割合は８０～２０質量％が好ましく、７０～３０質量％がより好ましい。 When the component (C-1) is contained alone, the content ratio is preferably 0.5 to 3.5 parts by mass, and 1 to 3.5 parts by mass per 100 parts by mass of the components (A) and (B). 5 parts by mass is more preferable, and 1.5 to 3 parts by mass is even more preferable.
When both components (C-1) and (C-2) are contained, the content ratio is preferably 1 to 5 parts by mass in total with respect to 100 parts by mass of components (A) and (B). , more preferably 1.5 to 4 parts by weight, more preferably 2 to 4 parts by weight.
When both the (C-1) component and the (C-2) component are contained, the content ratio of each is, in the total 100% by mass of the (C-1) component and the (C-2) component, (C-1 The content of component (C-2) is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and the content of component (C-2) is preferably 80 to 20% by mass, more preferably 70 to 30% by mass.

上記した（Ｃ－１）成分と（Ｃ－２）成分に加えて、他の界面活性剤（陰イオン界面活性剤、非イオン界面活性剤など）を含有することができるが、前記他の界面活性剤の含有割合は、界面活性剤全量中１０質量％以下が好ましく、５質量％以下がより好ましく、２質量％以下がさらに好ましい。 In addition to the above components (C-1) and (C-2), other surfactants (anionic surfactants, nonionic surfactants, etc.) can be contained, but the other surfactants The content of the active agent is preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 2% by mass or less, based on the total amount of the surfactant.

さらに（Ｅ）成分としてガラス繊維を含有することができる。
（Ｅ）成分のガラス繊維は、公知のＥガラス、Ｃガラス、Ｓガラス、Ｄガラスからなるものを使用することができるが、Ｅガラスからなるガラス繊維が好ましい。
（Ｅ）成分の含有量は、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１０～１００質量部が好ましい。 Furthermore, glass fiber can be contained as the (E) component.
As the glass fiber of component (E), known E-glass, C-glass, S-glass, and D-glass can be used, but glass fiber of E-glass is preferable.
The content of component (E) is preferably 10 to 100 parts by mass per 100 parts by mass of components (A) and (B) combined.

本開示の洗浄用樹脂組成物は、上記各成分を、ヘンシェルミキサー、タンブラーブレンダー、ニーダー等の混合機で予備混合した後、押出機で混練したり、加熱ロール、バンバリーミキサーで溶融混練したりすることによって製造することができる。 The cleaning resin composition of the present disclosure is prepared by pre-mixing the above components with a mixer such as a Henschel mixer, a tumbler blender, or a kneader, followed by kneading with an extruder, or melt-kneading with a heating roll or a Banbury mixer. It can be manufactured by

本明細書に開示された各々の態様は、本明細書に開示された他のいかなる特徴とも組み合わせることができる。
各実施形態における各構成およびそれらの組み合わせなどは一例であって、本発明の開示の主旨から逸脱しない範囲内で、適宜、構成の付加、省略、置換およびその他の変更が可能である。本開示は、実施形態によって限定されることはなく、特許請求の範囲によってのみ限定される。 Each aspect disclosed in this specification may be combined with any other feature disclosed in this specification.
Each configuration and combination thereof in each embodiment is an example, and addition, omission, replacement, and other changes of configuration are possible as appropriate without departing from the gist of the disclosure of the present invention. This disclosure is not limited by the embodiments, but only by the claims.

（Ａ）成分
ポリカーボネート樹脂：カリバー300-4(住化スタイロンポリカーボネート株式会社)
（Ｂ）成分
スチレン系樹脂：SAN-A 100LS(テクノＵＭＧ株式会社)
（Ｃ－１）成分
ポリオキシエチレンポリオキシプロピレングリコール：アデカプルロニック（登録商標）F-108(株式会社ADEKA)
（Ｃ－２）成分
直鎖アルキル（Ｃ１０－１３）ベンゼンスルホン酸ナトリウム：ニューレックスソフト 60-N(日油株式会社)（Ｃ１０：８質量％、Ｃ１１：３２質量％、Ｃ１２：３４質量％、Ｃ１３：２６質量％）
比較（Ｃ）成分
アルカンスルホン酸ナトリウム：WeylClean SAS 93(クラリアントジャパン株式会社)
エチレングリコールジステアレート：エマノーン 3201M-V(花王株式会社)
（Ｅ）成分
ガラス繊維：ECS03 T-571(日本電気硝子株式会社) (A) Component Polycarbonate resin: Caliber 300-4 (Sumika Styron Polycarbonate Co., Ltd.)
(B) Component Styrene-based resin: SAN-A 100LS (Techno UMG Co., Ltd.)
(C-1) Component Polyoxyethylene polyoxypropylene glycol: ADEKA Pluronic (registered trademark) F-108 (ADEKA Corporation)
(C-2) Component Linear alkyl (C10-13) sodium benzenesulfonate: Nurex Soft 60-N (NOF Corporation) (C10: 8% by mass, C11: 32% by mass, C12: 34% by mass, C13: 26% by mass)
Comparative (C) component Sodium alkanesulfonate: WeylClean SAS 93 (Clariant Japan Co., Ltd.)
Ethylene glycol distearate: Emanone 3201M-V (Kao Corporation)
(E) Component Glass fiber: ECS03 T-571 (Nippon Electric Glass Co., Ltd.)

実施例１～４、比較例１～７
表１に示す各成分をタンブラーブレンダーで混合(混合時間：120秒混合速度：120r/min)後、押出機にて溶融混練して、洗浄用樹脂組成物を得た。
得られた洗浄用樹脂組成物を使用して、下記の洗浄試験１、２を実施した。結果を表１に示す。表中の各成分の量は質量部である。
なお、洗浄試験１、２で使用した射出成形機と前材は、以下のとおりである。 Examples 1-4, Comparative Examples 1-7
After mixing each component shown in Table 1 with a tumbler blender (mixing time: 120 seconds, mixing speed: 120 r/min), the mixture was melt-kneaded with an extruder to obtain a cleaning resin composition.
Using the obtained cleaning resin composition, cleaning tests 1 and 2 below were carried out. Table 1 shows the results. The amount of each component in the table is parts by weight.
The injection molding machines and pre-materials used in cleaning tests 1 and 2 are as follows.

（射出成形機）
三菱ファナック モデル：2000i-100B (スクリュー径32，型締力100t)
使用時の条件：射出速度 100mm/sec, 回転数100r/min，シリンダー温度：280℃～300℃，背圧：0.3MPa
ストローク：前材使用時50mm，洗浄時40mm
（前材）
ポリカーボネート樹脂: カリバー200-10 (住化スタイロンポリカーボネート株式会社)
黒マスター：PLASBLAK UN2014(Cabot Plastics Hong Kong Ltd.)
ポリカーボネート樹脂と黒マスターを100:0.5の比率でタンブラーブレンダーを用いて混合（混合時間：20秒混合速度：120r/min）した。 (Injection molding machine)
Mitsubishi Fanuc model: 2000i-100B (screw diameter 32, clamping force 100t)
Operating conditions: Injection speed 100 mm/sec, Rotation speed 100 r/min, Cylinder temperature: 280°C to 300°C, Back pressure: 0.3 MPa
Stroke: 50mm when using front material, 40mm when washing
(previous material)
Polycarbonate resin: Caliber 200-10 (Sumika Styron Polycarbonate Co., Ltd.)
Black master: PLASBLAK UN2014 (Cabot Plastics Hong Kong Ltd.)
Polycarbonate resin and black master were mixed at a ratio of 100:0.5 using a tumbler blender (mixing time: 20 seconds, mixing speed: 120 r/min).

＜滑り性の確認＞
射出成形機のホッパーに洗浄用樹脂組成物を投入した後に計量して、計量時間を評価した。計量は、射出成形機のシリンダー内のスクリューを回転させて後退させながら、ホッパーからシリンダー内に所定量の洗浄用樹脂組成物を充填することである。
「滑り性」とは、洗浄用樹脂組成物とスクリューまたはシリンダーとの滑りが激しくなるなどの理由で、計量時間が非常に長くなったり、計量できなくなったりすることである。
「滑り性」は、成形作業中の計量時間で判断した。滑りが発生せず、計量時間が５秒以内で完了する場合を〇と判定し、計量ができず、成形できない場合を×と判定した。 <Confirmation of slipperiness>
After the cleaning resin composition was charged into the hopper of the injection molding machine, it was weighed to evaluate the weighing time. Metering is filling a predetermined amount of the cleaning resin composition from a hopper into the cylinder while rotating and retracting the screw in the cylinder of the injection molding machine.
"Slipperiness" means that the measurement time becomes very long or the measurement becomes impossible because the resin composition for cleaning and the screw or cylinder slip violently.
"Slipperiness" was judged by the weighing time during the molding operation. If no slip occurred and the weighing was completed within 5 seconds, it was judged as ◯, and if it could not be measured and could not be molded, it was judged as x.

＜洗浄試験１＞
前材500gを上記射出成形機（シリンダー温度300℃）に投入して、上記の条件で排出した。
その後、シリンダー温度300℃において洗浄用樹脂組成物を置換し、目視で前材の黒が見えなくなった時点を洗浄完了とし、洗浄完了に必要な洗浄用樹脂組成物の質量（ｇ）を測定することで、洗浄用樹脂組成物の洗浄性能を評価した。
その後、シリンダー温度300℃で、透明PC樹脂（カリバー200-10）の置換を実施するとともに、前材に由来する樹脂の残留がないかを確認した。残留がない場合を〇、残留があった場合（透明PC樹脂が着色した場合）を×とした。
さらに洗浄用樹脂組成物で置換するときに、洗浄用樹脂組成物に由来するガスを含む白煙が発生するかどうかで、洗浄用樹脂組成物の熱安定性を評価した。ガスを含む白煙が発生しなかった（熱安定性が良い）場合を〇、ガスを含む白煙が発生した（熱安定性が悪い）場合を×とした。なお、前記白煙の有無は、目視により確認した。 <Washing test 1>
500 g of the previous material was put into the above injection molding machine (cylinder temperature: 300°C) and discharged under the above conditions.
After that, the cleaning resin composition is replaced at a cylinder temperature of 300°C, and the cleaning is completed when the black color of the previous material is no longer visible, and the mass (g) of the cleaning resin composition required for the completion of cleaning is measured. Thus, the cleaning performance of the cleaning resin composition was evaluated.
After that, transparent PC resin (Caliber 200-10) was replaced at a cylinder temperature of 300°C, and it was confirmed that there was no residual resin derived from the previous material. The case where there was no residue was rated as ◯, and the case where there was residue (when the transparent PC resin was colored) was rated as x.
Further, the thermal stability of the cleaning resin composition was evaluated based on whether or not white smoke containing gas originating from the cleaning resin composition was generated when replacing with the cleaning resin composition. A case where white smoke containing gas was not generated (good thermal stability) was evaluated as ◯, and a case where white smoke containing gas was generated (bad thermal stability) was evaluated as ×. The presence or absence of the white smoke was visually confirmed.

＜洗浄試験２＞
前材500gを上記射出成形機（シリンダー温度300℃）に投入して、上記の条件で排出した。
その後、シリンダー温度300℃において洗浄用樹脂組成物を置換し、目視で前材の黒が見えなくなった時点を洗浄完了とし、洗浄完了に必要な洗浄用樹脂組成物の質量（ｇ）を測定することで、洗浄用樹脂組成物の洗浄性能を評価した。
その後、シリンダー温度240℃で、透明AS樹脂（050SF ダイセルミライズ株式会社）の置換を実施するとともに、前材に由来する樹脂の残留がないかを確認した。残留がない場合を〇、残留があった場合（透明AS樹脂が着色した場合）を×とした。
さらに洗浄試験１と同様の滑りと熱安定性も試験した。 <Washing test 2>
500 g of the previous material was put into the above injection molding machine (cylinder temperature: 300°C) and discharged under the above conditions.
After that, the cleaning resin composition is replaced at a cylinder temperature of 300°C, and the cleaning is completed when the black color of the previous material is no longer visible, and the mass (g) of the cleaning resin composition required for the completion of cleaning is measured. Thus, the cleaning performance of the cleaning resin composition was evaluated.
After that, the transparent AS resin (050SF, Daicel Miraise Co., Ltd.) was replaced at a cylinder temperature of 240°C, and it was confirmed that there was no residual resin derived from the previous material. The case where there was no residue was rated as ◯, and the case where there was residue (when the transparent AS resin was colored) was rated as x.
In addition, sliding and thermal stability similar to wash test 1 were also tested.

Figure 2022148466000001
Figure 2022148466000001

実施例１～４と比較例１～７との対比から明らかなとおり、洗浄試験１、２の両方において良い結果が得られた。
比較例１、２、５は、洗浄作業中に洗浄用樹脂組成物に由来するガスが発生した。ガスの発生の有無は、作業環境を適正に維持し、作業員の健康を確保する上で重要である。
比較例３は、滑りが悪かった。
比較例４は、透明AS樹脂への置き換えにおいて洗浄用樹脂組成物が溶融しなかったため、置き換えができなかった。
比較例６は、透明AS樹脂,PC樹脂への置き換えにおいて界面活性剤が配合されていないことから、洗浄用樹脂組成物が排出され難くなり、置き換えができなかった。
比較例７は、高温のためAS樹脂の粘度が極端に下がり、計量時にAS樹脂がノズルから流れることで計量ができなかった。 As is clear from the comparison between Examples 1-4 and Comparative Examples 1-7, good results were obtained in both cleaning tests 1 and 2.
In Comparative Examples 1, 2 and 5, gas originating from the cleaning resin composition was generated during the cleaning work. The presence or absence of gas generation is important for properly maintaining the working environment and ensuring the health of workers.
Comparative Example 3 had poor slip.
In Comparative Example 4, the replacement with the transparent AS resin failed because the cleaning resin composition did not melt.
In Comparative Example 6, since the surfactant was not blended in the replacement with the transparent AS resin and the PC resin, it was difficult to discharge the cleaning resin composition, and the replacement was not possible.
In Comparative Example 7, the viscosity of the AS resin was extremely low due to the high temperature, and the AS resin flowed from the nozzle during measurement, making it impossible to measure.

本開示の洗浄用樹脂組成物は、押出成形機、射出成形機などの樹脂の成形加工機の洗浄に利用することができる。 The cleaning resin composition of the present disclosure can be used for cleaning resin molding machines such as extruders and injection molding machines.

Claims (5)

（Ａ）ポリカーボネート樹脂、
（Ｂ）スチレン系樹脂および
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールを含有し、
（Ｃ－１）成分の含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して０．５～３．５質量部である、洗浄用樹脂組成物。 (A) polycarbonate resin,
(B) styrene resin and (C-1) containing polyoxyethylene polyoxypropylene glycol,
A cleaning resin composition in which the content of component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of components (A) and (B) combined. （Ａ）ポリカーボネート樹脂、
（Ｂ）スチレン系樹脂、
（Ｃ－１）ポリオキシエチレンポリオキシプロピレングリコールおよび
（Ｃ－２）アルキル（Ｃ１０－１６）ベンゼンスルホン酸ナトリウムを含有し、
（Ｃ－１）成分と（Ｃ－２）成分の合計１００質量％中の（Ｃ－１）成分の含有割合が２０～８０質量％、（Ｃ－２）成分の含有割合が８０～２０質量％であり、
（Ｃ－１）成分と（Ｃ－２）成分の合計含有割合が、（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１～５質量部である、洗浄用樹脂組成物。 (A) polycarbonate resin,
(B) styrenic resin,
(C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzenesulfonate,
The content ratio of component (C-1) in the total 100% by mass of component (C-1) and component (C-2) is 20 to 80% by mass, and the content ratio of component (C-2) is 80 to 20% by mass. % and
A resin composition for cleaning, wherein the total content of components (C-1) and (C-2) is 1 to 5 parts by mass per 100 parts by mass of components (A) and (B). さらに（Ｅ）ガラス繊維を（Ａ）成分と（Ｂ）成分の合計１００質量部に対して１０～１００質量部含有している、請求項１または２記載の洗浄用樹脂組成物。 3. The cleaning resin composition according to claim 1, further comprising (E) glass fiber in an amount of 10 to 100 parts by mass per 100 parts by mass of components (A) and (B) combined. （Ａ）成分と（Ｂ）成分の合計１００質量％中の（Ａ）成分の含有割合が７５～９５質量％、（Ｂ）成分の含有割合が２５～５質量％である、請求項１～３のいずれか１項記載の洗浄用樹脂組成物。 Claims 1 and 2, wherein the content of component (A) is 75 to 95% by mass and the content of component (B) is 25 to 5% by mass, based on a total of 100% by mass of components (A) and (B) 4. The cleaning resin composition according to any one of 3. （Ｂ）成分のスチレン系樹脂が、ポリスチレン（ＰＳ）、ハイインパクトポリスチレン（ＨＩＰＳ）、アクリロニトリル－スチレン樹脂（ＡＳ樹脂）、アクリロニトリル－ブタジエン－スチレン樹脂（ＡＢＳ樹脂）、メチルメタクリレート－ブタジエン－スチレン樹脂（ＭＢＳ樹脂）、ブチルアクリレート－アクリロニトリル－スチレン樹脂（ＡＡＳ樹脂）から選ばれるものを含んでいる、請求項１～４のいずれか１項記載の洗浄用樹脂組成物。 The styrene resin of component (B) includes polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin ( MBS resin), butyl acrylate-acrylonitrile-styrene resin (AAS resin).
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