JP2022147715A - Electrode embedded member and substrate holding member - Google Patents

Abstract

To provide an electrode embedded member, a method for manufacturing the same, and a substrate holding member capable of simultaneously solving pressure uniformity and ease of manufacture.SOLUTION: An electrode embedded member includes a flat plate-shaped substrate made of a ceramic sintered body and having a mounting surface on one main surface, and an electrode embedded in the substrate. The substrate includes inside a gas groove formed in at least two layers parallel to the mounting surface, a communication hole that communicates with the gas grooves of adjacent layers, a plurality of discharge holes for discharging gas to the outside from a first layer gas groove closest to the mounting surface, and a supply hole for supplying gas from the outside to a second layer gas groove farthest from the mounting surface, and in the first layer gas groove, the shortest distance passing through the gas groove from each of the discharge holes to the nearest communication hole along the first layer gas groove has an approximately identical transit shape.SELECTED DRAWING: Figure 1

Description

The present invention relates to an electrode-embedded member and a substrate holding member.

In a film forming process such as CVD used in a semiconductor manufacturing process, purging with an inert gas is performed in order to prevent deposition due to corrosive gases on the outer edge of the substrate and to suppress corrosion of the mounting table that supports the substrate. In particular, since the gas tends to stay in the gap between the substrate and the substrate mounting table, a purge gas is flowed to the periphery of the substrate. There, a plurality of through holes are provided in the purge grooves and the purge grooves at positions corresponding to the outer edge of the substrate on the substrate mounting surface. The plurality of through holes are distributed by distribution grooves provided inside the base body, and are connected to the distribution grooves via through holes provided in a shaft joined to the base body.

When the purge gas is blown out from the periphery of the substrate (wafer) into the chamber, especially in the case of a heater with a shaft that supports the heater plate with a shaft, there is a centralized gas supply path (inside the shaft) up to the heater plate. In the heater plate, a layer was provided in which grooves branching off to the outer periphery were formed. Then, a purge gas is flowed from the outer peripheral portion of the layer in which the grooves are formed (see Patent Document 1).

In Patent Document 2, a ring-shaped gap is formed by the inner peripheral projection and the outer peripheral projection between the susceptor and the flat plate portion, and the clearance serves as a gas supply passage for flowing the backside gas or the purge gas. , a method of manufacturing a support member is disclosed which includes the step of solid state bonding to the back surface of a susceptor.

JP 2009-256789 A Japanese Patent No. 4386606

It was thought that the gas flow rate of the gas outlets provided on the periphery of the heater would be uniform due to the symmetrical design of the gas grooves on one plane. However, even if the heater is designed as in Patent Document 1, there are actually scattered areas that need to be avoided, such as lift pins, various electrode terminals, and thermocouples. There were restrictions on placement in

Also, even if it can be arranged symmetrically, the purge gas flow rate at each gas outlet will vary due to variations in the groove dimensions during manufacture and the positional relationship between the electrodes and the grooves inside the heater plate, resulting in non-uniformity in the process. was occurring.

In addition, by providing a wide space inside as in Patent Document 2, it is thought that the gas pressure is uniformed and the gas flow rate is stabilized. Impedes heat transfer. In addition, since the space is large, it is difficult to bond, and the structure tends to cause poor bonding.

In addition, in the case of a heater with a shaft, it is often difficult to provide the gas inlet of the heater plate at the center, such as by providing the gas pipe on the inner wall of the shaft. Therefore, there has been a demand for a shaft-equipped heater that suppresses fluctuations in purge gas flow rate even when the gas inlet and outlet provided on the shaft cannot be completely symmetrically arranged.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electrode-embedded member, a method for manufacturing the same, and a substrate-holding member, which are capable of solving both pressure uniformity and ease of manufacture at the same time. and

(1) In order to achieve the above object, an electrode-embedded member of the present invention is an electrode-embedded member, comprising a ceramic sintered body, a flat substrate having a mounting surface on one principal surface, and an electrode embedded in a substrate, wherein the substrate includes gas grooves formed in at least two layers parallel to the mounting surface; communication holes communicating with the gas grooves of adjacent layers; having a plurality of discharge holes for discharging gas from the first layer gas groove closest to the mounting surface to the outside, and a supply hole for supplying gas from the outside to the second layer gas groove furthest from the mounting surface, Each of the first layer gas grooves has a transit shape of the shortest distance passing through the gas groove from each of the discharge holes to the nearest communication hole along the first layer gas groove. It is characterized by being formed identically.

By forming the gas grooves in a plurality of layers in this manner, the first layer gas grooves can be placed at positions where various constituent elements (lift pins, electrode terminals, thermocouples, etc.) of the electrode-embedded member need not be considered. It is possible to make the passing shape of the gas groove for each discharge hole substantially the same. As a result, the gas pressure can be made uniform, and the gas can be uniformly discharged from the respective discharge holes. As a result, for example, in a film forming process using an electrode-embedded member, it is possible to improve film forming distribution and the like.

(2) Further, in the electrode-embedded member of the present invention, the second layer gas groove is characterized in that a plurality of the communication holes are formed, and the second layer gas groove is formed in a line-symmetrical shape. .

As a result, the gas pressure is adjusted to be uniform even in the second layer, so that the gas can be more uniformly discharged from the respective discharge holes.

(3) Further, in the electrode-embedded member of the present invention, gas outlets of the discharge holes are provided on the mounting surface.

As a result, gas remaining between the mounting surface and the back surface of the substrate can be efficiently purged, and adhesion of particles to the back surface of the substrate can be suppressed.

(4) In the electrode-embedded member of the present invention, the first layer gas groove or the second layer gas groove includes a circumferential groove.

As a result, the gas pressure in the layer in which the circumferential gas grooves are formed is adjusted to be more uniform, so that the gas can be more uniformly discharged from the respective discharge holes. Both the first layer gas groove and the second layer gas groove may include circumferential gas grooves.

(5) Further, a substrate holding member of the present invention comprises the electrode-embedded member according to any one of the above (1) to (4) and a ceramic sintered body, a support member for supporting the electrode-embedded member, wherein the support member has a through hole penetrating from one end surface to the other end surface, and the through hole communicates with the supply hole.

As a result, even in the substrate holding member with the shaft, the gas pressure can be made uniform, and the gas can be uniformly discharged from the respective discharge holes. As a result, for example, in a film forming process using a substrate holding member, it is possible to improve film forming distribution and the like.

According to the electrode-embedded member and the substrate holding member of the present invention, pressure uniformity and ease of manufacture can be solved at the same time.

1 is a schematic cross-sectional view showing an example of an electrode-embedded member according to an embodiment of the present invention; FIG. 4(a) and 4(b) are schematic diagrams each showing an example of the shape of the first layer gas groove and the second layer gas groove of the electrode-embedded member according to the embodiment of the present invention. FIG. FIG. 5 is a schematic cross-sectional view showing a modification of the electrode-embedded member according to the embodiment of the present invention; FIG. 5 is a schematic plan view showing a modification of the electrode-embedded member according to the embodiment of the present invention; 4(a) and 4(b) are schematic diagrams showing modifications of the shapes of the first layer gas groove and the second layer gas groove of the electrode-embedded member according to the embodiment of the present invention, respectively. FIG. 5 is a schematic diagram showing a modification of the shape of the first layer gas groove of the electrode-embedded member according to the embodiment of the present invention; 1 is a schematic cross-sectional view showing an example of a substrate holding member according to an embodiment of the invention; FIG. FIG. 5 is a schematic cross-sectional view showing a modification of the substrate holding member according to the embodiment of the invention; 4 is a flow chart showing an example of a method for manufacturing an electrode-embedded member according to an embodiment of the present invention; FIG. 4 is a cross-sectional view schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention; FIG. 4 is a cross-sectional view schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention; FIG. 4 is a cross-sectional view schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention; 3(a) and 3(d) are schematic plan views of a plurality of ceramic sintered bodies used for manufacturing an electrode-embedded member according to an embodiment of the present invention. FIG. 4(a) to 4(c) are cross-sectional views schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention, respectively. 4 is a flow chart showing an example of a method for manufacturing a substrate holding member according to an embodiment of the present invention; 4(a) to 4(c) are cross-sectional views schematically showing one stage of the manufacturing process of the substrate holding member according to the embodiment of the present invention. FIG. 4 is a schematic diagram showing a gas groove of a comparative example;

Next, embodiments of the present invention will be described with reference to the drawings. In order to facilitate understanding of the description, the same reference numerals are given to the same components in each drawing, and overlapping descriptions are omitted. In addition, in the configuration diagram, the size of each component is conceptually represented, and does not necessarily represent the actual size ratio.

[Embodiment]
[Structure of Electrode-Embedded Member]
First, the configuration of the electrode-embedded member according to the embodiment of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an example of an electrode-embedded member according to an embodiment of the present invention. 2(a) and 2(b) are schematic diagrams showing examples of the shapes of the first layer gas groove and the second layer gas groove of the electrode-embedded member according to the embodiment of the present invention, respectively. An electrode-embedded member 100 according to an embodiment of the present invention includes a substrate 110 and electrodes 130 . The electrode-embedded member 100 is applied to heaters, electrostatic chucks, and the like.

The substrate 110 is made of a ceramic sintered body, formed in a flat plate shape, and has a mounting surface 112 on one main surface thereof for mounting a substrate thereon. Various materials can be used for the material of the substrate 110 depending on the application. For example, AlN, _{Al2O3 , Si3N4} , _SiC , etc. can be used. Moreover, the shape of the substrate 110 can be various shapes such as a disk shape, a polygonal plate shape, and an elliptical plate shape, but the disk shape is preferable.

The substrate 110 has therein gas grooves 120 formed in at least two layers parallel to the mounting surface 112 , communication holes 114 communicating the gas grooves 120 of adjacent layers, and a first layer closest to the mounting surface 112 . It has a plurality of discharge holes 116 for discharging gas from the gas grooves 121 to the outside, and supply holes 118 for supplying gas from the outside to the second layer gas grooves 122 furthest from the mounting surface 112 . The gas grooves 120 formed parallel to the mounting surface 112 may have three or more layers. The gas groove 120 farthest from is called a second layer gas groove 122 .

By forming the gas grooves 120 in a plurality of layers in this way, the first layer gas grooves 121 can be used for various components of the electrode-embedded member 100 (lift pins, electrode terminals, thermocouples, gas in the case of vacuum adsorption). flow path, etc.) can be arranged at a position that does not require much consideration. In addition, if one tries to avoid various constituent elements of the electrode-embedded member 100 with one layer of gas grooves, the length of the gas grooves formed in that layer becomes longer, and the bonding area with other layers becomes smaller. Poor bonding is more likely to occur. By arranging the gas grooves in a plurality of layers as in the present invention, the length of the gas grooves in each layer can be shortened, and poor bonding can be suppressed.

The gas groove 120 can have various cross-sectional shapes, but a circular, elliptical, rectangular, semi-circular, or semi-elliptical shape is preferable in consideration of the smooth flow of gas, and is easy to manufacture. Rectangular, semi-circular, or semi-elliptical shapes are more preferable in terms of flexibility. Moreover, the cross-sectional size of the gas groove 120 is preferably 1 mm or more and 10 mm or less in width. Moreover, it is preferable that the depth is 1 mm or more and 10 mm or less.

The first layer gas grooves 121 have a shortest route shape of the first layer gas grooves 121 passing through the gas grooves 120 from each discharge hole 116 to the nearest communication hole 114 along the first layer gas grooves 121 . They are preferably formed identically. In this way, by making the path shape of the gas groove 120 for each of the discharge holes 116 substantially the same, the gas pressure can be made uniform, and the gas can be uniformly discharged from each of the discharge holes 116. . As a result, for example, in a film forming process using the electrode-embedded member 100, the film forming distribution can be improved.

It should be noted that the passage shape of the gas grooves 120 being substantially the same means that when the path of the gas grooves 120 passing through the shortest distance from each discharge hole 116 to the nearest communication hole 114 is divided into parts, each part It means that the shapes, sizes, and connecting angles of the adjacent portions can be considered to be the same for each of the discharge holes 116 except for unavoidable errors that occur in the manufacturing process or the like.

As an example, the first layer gas groove 121 shown in FIG. emits gas from According to the example shown in FIG. 2(a), when the path of the gas groove 120 passing through the shortest distance from each discharge hole 116 to the nearest communication hole 114 is divided into parts, the shape and size of each part are , and the connecting angles of adjacent portions are the same for each discharge hole 116 . That is, the first layer gas groove 121 shown in FIG. The path shape of the layer gas grooves 121 is formed substantially the same. The first layer gas groove 121 may be formed line-symmetrically or point-symmetrically.

A plurality of communication holes 114 are formed in the second layer gas groove 122, and the second layer gas groove 122 is preferably formed in a line-symmetrical shape. As a result, the gas pressure is adjusted to be uniform even in the second layer, so that the gas can be more uniformly discharged from the respective discharge holes 116 .

As an example, the second layer gas groove 122 shown in FIG. 2B is provided with four communication holes 114 and formed in an axisymmetric shape including one supply hole 118 .

FIG. 3 is a schematic cross-sectional view showing a modification of the electrode-embedded member according to the embodiment of the present invention. Also, FIG. 4 is a schematic plan view showing a modification of the electrode-embedded member according to the embodiment of the present invention. 5(a) and 5(b) are schematic diagrams showing modifications of the shapes of the first layer gas groove and the second layer gas groove of the electrode-embedded member according to the embodiment of the present invention, respectively.

As shown in FIGS. 3 and 4 , the gas outlets of the exhaust holes 116 are preferably provided on the mounting surface 112 . As a result, the gas remaining between the mounting surface 112 and the back surface of the substrate can be efficiently purged, and adhesion of particles to the back surface of the substrate can be suppressed.

FIG. 6 is a schematic diagram showing a modification of the shape of the first layer gas groove of the electrode-embedded member according to the embodiment of the present invention. As shown in FIGS. 2(b), 5(b), and 6, the first layer gas groove 121 or the second layer gas groove 122 preferably includes a circumferential groove. As a result, the gas pressure in the layer in which the circumferential gas grooves are formed is adjusted to be more uniform, so that the gas can be more uniformly discharged from the respective discharge holes 116 . Both the gas grooves 120 of the first layer gas groove 121 and the second layer gas groove 122 may include circumferential grooves. 2(b) and 5(b) both show an example in which a circumferential groove is included in the second layer gas groove 122, but the second layer gas groove 122 is It is not limited to including circumferential grooves.

The plurality of discharge holes 116 are preferably evenly distributed on the substrate 110 . Also, the number of discharge holes 116 is preferably eight or more. This allows the gas to be evenly purged.

As for the first layer gas groove 121, it is preferable that the gas grooves that can be collected are collectively configured. That is, it is preferable that the number of communication holes 114 communicating between the first layer gas groove 121 and the gas groove 120 of the layer immediately below it is smaller than the number of discharge holes 116 . In other words, the first layer gas groove 121 preferably has branches. As a result, while avoiding various constituent elements of the electrode-embedded member 100, it becomes easier to configure the intermediate shape of the first layer gas groove 121 to be substantially the same. Moreover, the influence of the inhibition of heat conduction by the gas groove 120 can be reduced.

The electrode 130 is embedded inside the base 110 . The shape of the electrode 130 can be various shapes such as a mesh shape and a foil shape. Also, various materials such as molybdenum and tungsten can be used. Electrode 130 can be a heater electrode, an electrostatic attraction electrode, an RF electrode, and the like.

In FIG. 1, the electrode 130 is embedded above the first layer gas groove 121, but the embedding position of the electrode 130 is not limited to this. That is, the electrode 130 may be embedded in a layer between the first layer gas groove 121 and the second layer gas groove 122 or may be embedded below the second layer gas groove 122 . Also, if the shape of the electrode 130, the shape of the gas groove 120, and other conditions are met, it may be embedded in the same layer as the gas groove 120. FIG.

Substrate 110 may include a plurality of electrodes 130 . For example, the electrode-embedded member 100 can be used as an electrostatic chuck with a heater by providing a heater electrode and an electrostatic adsorption electrode. When the substrate 110 has a plurality of electrodes 130, the embedding positions of the electrodes 130 can also be varied depending on the design or the like.

The electrode embedding member 100 is provided with necessary terminals 140 and terminal holes 142 in addition to the above. Thereby, power can be supplied to the electrode 130 .

The electrode-embedded member of the present invention can solve pressure uniformity and manufacturability at the same time.

[Structure of Substrate Holding Member]
FIG. 7 is a schematic cross-sectional view showing an example of a substrate holding member according to an embodiment of the invention. A substrate holding member 200 according to an embodiment of the present invention includes an electrode embedding member 100 according to an embodiment of the present invention and a support member 210. As shown in FIG.

The support member 210 is joined to the lower surface of the substrate 110 facing the mounting surface 112 and supports the electrode-embedded member 100 . The support member 210 has a through hole 216 penetrating from one end surface 212 to the other end surface 214 , and the through hole 216 communicates with the supply hole 118 . Thereby, gas can be supplied to the supply hole 118 from the through hole 216 passing through the support member 210 . Preferably, the support member 210 is cylindrical.

FIG. 8 is a schematic cross-sectional view showing a modification of the substrate holding member according to the embodiment of the invention. The substrate holding member 200 may be provided with second layer gas grooves 122 above, below, or on both sides of the interface between the electrode embedded member 100 and the support member 210 . By doing so, the number of members in manufacturing the electrode-embedded member 100 can be reduced, and the manufacturing cost can be reduced. In this case, the support member 210 may have a bottomed open cylindrical shape and the second layer gas groove 122 may be provided between the bottom portion and the electrode-embedded member 100 , or a cylindrical shape between the bonding surface and the electrode-embedded member 100 . A second layer gas groove 122 may be provided in between.

It is preferable that the substrate holding member 200 has the second layer gas groove 122 inside the outer diameter of the supporting member 210 . Thereby, heat transfer between the electrode-embedded member 100 and the support member 210 can be suppressed.

The substrate holding member of the present invention can solve pressure uniformity and manufacturability at the same time. In addition, since the substrate holding member is joined to the electrode-embedded member and the support member, heat transfer occurs between the electrode-embedded member and the support member. In the electrode-embedded member of the present invention, the position and shape of the gas groove can be designed more flexibly than before. The position, shape, etc., can also be set in consideration of heat.

[Manufacturing method of electrode embedded member]
Next, a method for manufacturing an electrode-embedded member according to an embodiment of the present invention will be described. FIG. 9 is a flow chart showing an example of a method for manufacturing an electrode-embedded member according to an embodiment of the present invention. As shown in FIG. 9, the method for manufacturing an electrode-embedded member according to an embodiment of the present invention includes a sintered compact preparation step STEP1, a gas groove processing step STEP2, and a sintered compact bonding step STEP3. In the following, a manufacturing method by a molded body hot press method in which molded bodies are laminated and manufactured as in Japanese Patent No. 6148845 will be described. However, the present invention may be replaced with any method as long as it can form gas grooves in two or more layers in an appropriate shape.

10, 11, and 12 are cross-sectional views schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention, respectively. 13(a) and 13(b) are schematic plan views of a plurality of ceramic sintered bodies 42 and 43 used for manufacturing an electrode-embedded member according to an embodiment of the present invention, respectively. 14(a) to 14(c) are cross-sectional views schematically showing one stage of the manufacturing process of the electrode-embedded member according to the embodiment of the present invention. 10 to 14 show the case of manufacturing the electrode-embedded member of FIG.

In the sintered body preparation step STEP1, a plurality of ceramic compacts 11, 12, 13, and 14 are formed from the ceramic raw material powder, and necessary processing such as degreasing and recess processing is performed. Although the ceramic molded body is divided into four members in FIG. 10, the number of members may be three or may be five or more depending on the design. For example, additives such as binders, plasticizers, and dispersants are appropriately added to the ceramic raw material powder and mixed to prepare a slurry. A plurality of ceramic compacts 11, 12, 13, and 14 can be formed. A powder serving as a sintering aid may be added to the ceramic raw material powder, if necessary.

The ceramic raw material powder preferably has a high purity, and the purity is preferably 96% or higher, more preferably 98% or higher. Also, the average particle size of the ceramic raw material powder is preferably 0.1 μm or more and 1.0 μm or less.

The mixing method may be either wet or dry, and mixers such as ball mills and vibrating mills may be used. Moreover, as a molding method, for example, a known method such as uniaxial pressure molding or a cold isostatic pressing (CIP) method may be used. The method of forming the ceramic molded body is not limited to pressure molding, and can be applied, for example, to lamination of green sheets or cast molding. A ceramic compact can be produced. After molding, the plurality of ceramic molded bodies 11, 12, 13, and 14 are machined so as to have the shape of the molded bodies, recesses for accommodating electrodes, recesses, grooves, and holes for accommodating connection terminals for connecting electrodes and terminals. may be prearranged.

In the degreasing process, a plurality of degreased ceramic bodies 21, 22, 23, and 24 are produced by degreasing the plurality of ceramic molded bodies 11, 12, 13, and 14 at a predetermined temperature or higher for a predetermined time or longer. The ceramic compacts 11, 12, 13, and 14 are heat-treated, for example, at a temperature of 400° C. or more and 800° C. or less to become ceramic degreased bodies 21, 22, 23, and 24, respectively. The degreasing time is preferably from 1 hour to 120 hours. An air furnace or a nitrogen atmosphere furnace can be used for degreasing, but an air furnace is preferred.

Next, an electrode 130 cut into a predetermined shape is prepared. The shape of the electrode 130 can be various shapes such as a mesh shape and a foil shape. Also, various materials such as molybdenum and tungsten can be used. Moreover, although not shown, one or a plurality of connection members to be embedded in the ceramic sintered body may be prepared as necessary. A connecting member processed into a shape corresponding to the design of the electrode-embedded member 100 is prepared.

Next, the prepared electrode 130 and a plurality of ceramic degreased bodies 21 and 22 are combined to form a flat plate-like ceramic sintered body precursor 30 . At this time, if necessary, a connection member for connecting the terminal 140 to the electrode 130 is also combined and embedded at the same time.

Then, the formed ceramic sintered body precursor 30 and the plurality of ceramic degreased bodies 23, 24 are uniaxially pressure-fired in the direction perpendicular to the main surface to obtain a plurality of ceramic sintered bodies 41, 43, and 44. . The pressure to be applied is preferably 1 MPa or more. Also, the firing temperature is preferably 1500° C. or higher and 2000° C. or lower. The firing time is preferably 1 hour or more and 12 hours or less. The firing atmosphere is, for example, a nitrogen or inert gas atmosphere, but may be a vacuum atmosphere. Thereby, the ceramics sintered body precursor 30 and the plurality of ceramics degreased bodies 23 and 24 are sintered to form the plurality of ceramics sintered bodies 41 , 43 and 44 . Firing may be performed by continuously raising the temperature.

In the gas groove processing step STEP2, for example, as shown in FIG. 116 is formed, and a communication hole 114 is formed through the ceramic sintered body 43 . Further, as shown in FIG. 13B, a second layer gas groove 122 is formed on one side of the ceramics sintered body 44 (the joint surface with the ceramics sintered body 43) and penetrates the ceramics sintered body 44. A supply hole 118 is formed for By combining these, the joint surface of the other ceramic sintered body becomes a lid, and each gas groove 120 (the first layer gas groove 121 and the second layer gas groove 122) is inside the ceramic sintered body. It is formed.

The gas groove 120 may be formed on the surface of the other ceramic sintered body to be joined, or a part of the gas groove 120 may be formed in each of the two ceramic sintered bodies and combined to form the gas groove 120. It may be configured to be Machining of these gas grooves 120 and the like may be performed before and after degreasing of the molded body, but if it is performed after sintering, the dimensional accuracy will be greatly increased, and deformation of the gas grooves 120 and the like during bonding will be minimized. Since it can be suppressed, it is suitable to carry out after sintering.

In the sintered body joining step STEP3, ceramic sintered bodies prepared and optionally processed such as gas grooves are combined and heated while being pressurized in the direction perpendicular to the main surface (mounting surface). As a result, the plurality of ceramic sintered bodies 41, 43, and 44 are joined to obtain the electrode-embedded member 100 having at least two layers of gas grooves 120 therein. For joining, either a joining method using a joining material or a joining method not using a joining material can be used. This sintered body bonding step may include a step of adjusting the bonding surfaces of the ceramics sintered bodies 41, 43, and 44 before bonding to a predetermined surface roughness and flatness.

Depending on the position of the embedded electrode 130 of the joined electrode-embedded member 100, a terminal hole 142 is processed in the electrode-embedded member 100 to expose the electrode 130 or a portion of the connection member, and then the exposed electrode 130 or A step of connecting the terminal 140 to the connection member with brazing material or the like may be provided. Ni or the like can be used for the terminal 140 . Also, an Au-based or Ag-based brazing material can be used as the brazing material. An intermediate member 150 made of Kovar or the like may be placed between the electrode 130 or the connection member and the terminal 140 and brazed.

By doing so, it is possible to manufacture an electrode-embedded member that can solve pressure uniformity and ease of manufacture at the same time.

In the sintered body preparation step STEP1, a ceramic calcined body preparation step may be provided. When the ceramic calcined body producing step is provided, the ceramic degreased body is calcined at a temperature of 1200° C. or higher and 1700° C. or lower to produce the ceramic calcined body. The calcination time is preferably 0.5 hours or more and 12 hours or less. The calcining atmosphere is preferably a nitrogen or inert gas atmosphere, but may be a vacuum atmosphere. When a calcined body manufacturing process is provided, machining for forming gas grooves and the like may be performed after the calcined body manufacturing process. By performing processing at this stage, it is possible to improve the dimensional accuracy compared to processing the degreased body, and there is an advantage that processing is easier than performing processing after sintering.

[Manufacturing method of substrate holding member]
Next, a method for manufacturing a substrate holding member according to an embodiment of the present invention will be described. FIG. 15 is a flow chart showing an example of a method for manufacturing a substrate holding member according to an embodiment of the invention. As shown in FIG. 15, the method for manufacturing a substrate holding member according to the embodiment of the present invention comprises a sintered compact preparation step STEP1, a gas groove processing step STEP2, a sintered compact bonding step STEP3, a support member preparation step STEP4, and A joining step STEP5 is provided. Since STEP 1 to STEP 3 are the same as the manufacturing method of the electrode-embedded member 100 described above, description will be made from STEP 4.

16A to 16C are cross-sectional views schematically showing one stage of the manufacturing process of the substrate holding member according to the embodiment of the present invention. 16(a) to (c) show the case of manufacturing the substrate holding member of FIG.

In the support member preparation step STEP4, the second ceramic compact 15 is formed from the second ceramic raw material powder. It is preferable that the second ceramic raw material powder contains the same raw material as the ceramic raw material powder of the electrode-embedded member 100 as a main component and does not contain a sintering aid. Then, the second ceramic molded body 15 is degreased at a predetermined temperature or higher for a predetermined time or longer to produce a second ceramic degreased body 25 . The method for producing the second ceramic raw material powder, the method for forming the second ceramic compact 15, the numerical ranges of the degreasing conditions for the second ceramic compact, and the like may be the same as those in the sintered compact preparation step STEP1. The degreasing in the supporting member preparing step STEP4 may be performed simultaneously with the degreasing in the sintered body preparing step STEP1.

Next, the second ceramic degreased body 25 is sintered to sinter the support member 210 that supports the electrode-embedded member 100 . Firing of the support member 210 is preferably normal pressure firing. Also, the firing temperature is preferably 1500° C. or higher and 2000° C. or lower. The firing time is preferably 1 hour or more and 12 hours or less. The firing atmosphere is, for example, a nitrogen or inert gas atmosphere, but may be a vacuum atmosphere.

A through hole 216 is formed through the support member 210 from one end face 212 to the other end face 214 at a position communicating with the supply hole 118 of the electrode embedding member 100 . Formation of the through holes 216 may be performed after degreasing.

In the joining step STEP5, the support member 210 is joined to the joining position of the electrode embedded member 100 on the lower surface of the substrate 110 . For joining, either a joining method using a joining material or a joining method not using a joining material can be used. This bonding step may include a step of adjusting the lower surface before bonding and the bonding surface of the support member 210 to a predetermined surface roughness and flatness. When the support member 210 is bonded to the electrode-embedded member 100 to form the substrate holding member 200, the terminal holes 142 of the electrode-embedded member 100 and the brazing of the terminals 140 may be performed after bonding.

By doing so, it is possible to manufacture the substrate holding member 200 that can solve pressure uniformity and ease of manufacture at the same time.

[Examples and Comparative Examples]
(Example 1)
First, each ceramic sintered body was produced. Four compacts were formed using a ceramic raw material powder containing AlN as a main component to which 5 wt % Y ₂ O ₃ was added. A concave portion for accommodating the electrode and a concave portion for accommodating a connection terminal for connecting the electrode and the terminal were processed at predetermined positions. By degreasing and sintering them, a first ceramic sintered body with a diameter of 340 mm and a thickness of 2 mm, a second ceramic sintered body with a diameter of 340 mm and a thickness of 10 mm, and a third ceramic sintered body with a diameter of 340 mm and a thickness of 10 mm A ceramic sintered body was produced. Also, one ceramic molded body was formed using the second ceramic raw material powder containing AlN as a main component without adding a sintering aid. By degreasing and sintering it, a support member having an inner diameter of 50 mm, an outer diameter of 70 mm, a length of 150 mm, and enlarged diameter portions of 90 mm in outer diameter and 15 mm in thickness at the upper and lower ends was produced.

Each compact was degreased at 550° C. for 12 hours in an air atmosphere. The firing of the first to third ceramic sintered bodies was performed by uniaxial hot press firing at 1800° C. for 2 hours under a pressure of 1 MPa in a nitrogen atmosphere. The support member was fired at 1850° C. for 2 hours under normal pressure in a nitrogen atmosphere. In the first ceramic sintered body, a molybdenum mesh made of molybdenum with a diameter of 290 mm (wire diameter: 0.1 mm, mesh size: 50 mesh) cut into a predetermined shape was embedded as an electrode and sintered.

Next, processing such as grooves and communication holes was performed. The first ceramic sintered body had a PCD of 280 mm and was provided with discharge holes of Φ5 mm at 8 equidistant positions. The second ceramic sintered body had PCD of 120 mm, and communication holes of φ5 mm were provided at 4 equidistant positions. In addition, as shown in FIG. 5(a), a first layer gas groove was formed in a symmetrical shape with a groove width of 5 mm and a groove depth of 5 mm toward the outer peripheral portion with the communicating hole as an end. . The other end of the first layer gas groove was located at an outer circumference PCD of 280 mm, and at 8 equidistant positions, coinciding with the position of the discharge hole of the first ceramic sintered body. The third ceramic sintered body was provided with a circumferential groove having a groove width of 5 mm and a groove depth of 5 mm with a center line of Φ120 mm. Further, a groove having a groove width of 5 mm and a groove depth of 5 mm was provided from the circumferential groove to a position communicating with the through hole of the support member. Also, a supply hole of Φ5 mm was provided at a position communicating with the through hole of the support member. The support member was provided with a through hole of Φ5 mm penetrating from one end surface of the support member to the other end surface at a position 60 mm from the center of the cylindrical portion within the wall of the cylindrical portion of the support member.

Next, the first to third ceramic sintered bodies are adjusted so that the grooves and holes are accurately communicated and superimposed, and the force is applied in a direction perpendicular to the mounting surface at 1850° C. for 2 hours while applying a force of 10 MPa. , uniaxial hot-press fired. Thus, the electrode-embedded member was fired.

Then, the electrode-embedded member and the supporting member were joined by heating at 1700° C. for 1 hour while applying a force of 1 MPa in the direction perpendicular to the mounting surface. Further, necessary terminal holes were bored and Ni terminals were brazed with Au brazing. Thus, the substrate holding member of Example 1 was produced.

(Example 2)
In Example 2, the conditions and conditions were the same as in Example 1, except that the first layer gas groove provided in the second ceramic sintered body was shaped to include a circumferential groove as shown in FIG. A substrate holding member was produced in the size.

(Comparative example)
As a comparative example, a first ceramic sintered body with a diameter of 340 mm and a thickness of 12 mm and a second ceramic sintered body with a diameter of 340 mm and a thickness of 10 mm were produced. The first ceramic sintered body was provided with φ5 mm discharge holes at 8 equidistant positions with a PCD of 280 mm. The second ceramic sintered body was provided with gas grooves having a groove width of 5 mm and a groove depth of 5 mm as shown in FIG. 17 on one surface. Also, a supply hole of Φ5 mm was provided at a position communicating with the through hole of the support member. This was joined to produce an electrode-embedded member of Comparative Example 1. Then, the same support member as in Example 1 was joined to this, and a substrate holding member of Comparative Example 1 was produced. FIG. 17 is a schematic diagram showing a gas groove of a comparative example.

That is, the comparative example is a substrate holding member having one layer of gas grooves. Note that the gas groove in FIG. 17 has a shape that is assumed to avoid various components of the electrode-embedded member, but does not conform to the actual positions and shapes of the components.

(Measurement of film formation distribution)
Using the substrate holding members of Examples and Comparative Examples, they were used in a plasma CVD film forming process of a SiO ₂ film using a TEOS material at 400°C. The film formation distribution over the entire substrate at that time was measured using a spectroscopic film thickness meter.

The substrate holding member of Example 1 had a film formation distribution of 10000±500 nm. Further, the substrate holding member of Example 2 had a film formation distribution of 10000±400 nm. On the other hand, the film formation distribution of the substrate holding member of the comparative example was 10000±900 nm. As a result, it was confirmed that the substrate holding member according to the present invention has an improved film formation distribution compared to the conventional product because the purge gas is evenly ejected from the discharge holes.

From the above, it was confirmed that the electrode-embedded member and the substrate-holding member of the present invention are capable of solving pressure uniformity and ease of manufacture at the same time. Moreover, it was confirmed that the manufacturing method of the present invention can manufacture such an electrode-embedded member.

It goes without saying that the present invention is not limited to the above-described embodiments, but extends to various modifications and equivalents within the spirit and scope of the present invention. Also, the structure, shape, number, position, size, etc. of the constituent elements shown in each drawing are for convenience of explanation, and may be changed as appropriate.

11, 12, 13, 14 ceramic molded bodies 21, 22, 23, 24 ceramic degreased body 30 ceramic sintered body precursor 30
41, 43, 44 ceramic sintered body 100 electrode embedded member 110 substrate 112 mounting surface 114 communication hole 116 discharge hole 118 supply hole 120 gas groove 121 first layer gas groove 122 second layer gas groove 130 electrode 140 terminal 142 terminal hole 200 substrate holding member 210 support member 212 one end face 214 the other end face 216 through hole

Claims (5)

An electrode-embedded member,
a flat plate-shaped substrate made of a ceramic sintered body and having a mounting surface on one main surface;
an electrode embedded in the base,
The substrate includes gas grooves formed therein in at least two layers parallel to the mounting surface, communication holes communicating with the gas grooves of adjacent layers, and a first layer gas groove closest to the mounting surface. a plurality of discharge holes for discharging gas from the second layer gas groove to the outside, and a supply hole for supplying gas from the outside to the second layer gas groove farthest from the mounting surface,
Each of the first layer gas grooves has a transit shape of the shortest distance passing through the gas groove from each of the discharge holes to the nearest communication hole along the first layer gas groove. An electrode-embedded member, characterized in that they are formed identically. The second layer gas groove is formed with a plurality of the communication holes,
2. The electrode-embedded member according to claim 1, wherein said second layer gas groove is formed in a line-symmetrical shape. 3. The electrode-embedded member according to claim 1, wherein a gas outlet of said exhaust hole is provided on said mounting surface. 4. The electrode-embedded member according to claim 1, wherein said first layer gas groove or said second layer gas groove includes a circumferential groove. an electrode-embedded member according to any one of claims 1 to 4;
a support member made of a ceramic sintered body and supporting the electrode-embedded member;
A substrate holding member, wherein the support member has a through hole penetrating from one end surface to the other end surface, and the through hole communicates with the supply hole.

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