JP2022145657A - Resin composition, adhesive member, and display device including the adhesive member - Google Patents

Abstract

To provide a resin composition having high adhesion at high temperature, and an adhesive member manufactured from the same.SOLUTION: A resin composition contains a (meth)acrylate oligomer, and an oxygen inhibition preventing agent containing at least one of a phosphite compound having a boiling point of 150°C or higher and a phosphine compound having a boiling point of 150°C or higher, wherein the oxygen inhibition preventing agent is contained in an amount of 0.1 wt.% or more and less than 1 wt.% with respect to the total amount of (meth)acrylate. An adhesive member Ap formed by photocuring the resin composition exhibits excellent adhesion at high temperature, and exhibits excellent reliability characteristics when used for a flexible display device.SELECTED DRAWING: Figure 7

Description

The present invention relates to a resin composition, an adhesive member comprising the resin composition, and a display device including the adhesive member.

A wide variety of display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation, game consoles, and the like. In particular, recently, developments have been made on a foldable, foldable or rollable display device that is easy to carry and has a flexible display member that can be folded to improve user convenience.

In the case of such a flexible display device, each member used must ensure reliability in folding and folding operations. In addition, the adhesive resin used to form the adhesive layer applied to the display devices of various shapes should have excellent coating properties for members of the display devices of various shapes.

One of the objects of the present invention is to provide a resin composition having high adhesion at high temperatures and an adhesive member produced therefrom.

Another object of the present invention is to provide a highly reliable display device.

The resin composition of the present invention comprises a (meth)acrylate oligomer, a phosphite compound having a boiling point of 150° C. or higher, and a phosphine compound having a boiling point of 150° C. or higher. and an oxygen inhibition preventing agent containing at least one, wherein the oxygen inhibition preventing agent is contained in an amount of 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate.

In one embodiment, the oxygen inhibition inhibitor is at least one of triphenyl phosphite, tricresyl phosphite, triethyl phosphite, and triphenyl phosphine. may contain one.

In one embodiment, the resin composition may further include a (meth)acrylate monomer.

In one embodiment, the resin composition may further include a monofunctional (meth)acrylate monomer.

In one embodiment, if the content of the monofunctional (meth)acrylate monomer is 80 wt % or more based on the total amount of (meth)acrylate, the resin composition may further include a multifunctional (meth)acrylate monomer.

In one embodiment, the content of the oxygen inhibition inhibitor may be less than 0.5 wt% with respect to the total amount of (meth)acrylate.

In one embodiment, the resin composition may further include a thiol compound or an amine compound.

In one embodiment, the (meth)acrylate may be a urethane (meth)acrylate.

An adhesive member according to an embodiment of the present invention comprises a (meth)acrylate oligomer and an oxygen inhibition inhibitor containing at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher. The resin composition may contain a polymer derived from a resin composition containing 0.1 wt% or more and less than 1 wt% of the oxygen inhibition inhibitor with respect to the total amount of (meth)acrylate.

In one embodiment, the oxygen inhibition inhibitor may include at least one of triphenylphosphite, tricresylphosphite, triethylphosphite, and triphenylphosphine.

In one embodiment, the resin composition may further include a (meth)acrylate monomer.

In one embodiment, the resin composition may further include a monofunctional (meth)acrylate monomer.

In one embodiment, if the content of the monofunctional (meth)acrylate monomer is 80 wt % or more based on the total amount of (meth)acrylate, the resin composition may further include a multifunctional (meth)acrylate monomer.

A display device according to an embodiment of the present invention includes a display panel, a window arranged on the display panel, and an adhesive member arranged between the display panel and the window, the adhesive member is a (meth)acrylate oligomer, and an oxygen inhibition inhibitor containing at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher. and the resin composition may contain the oxygen inhibition inhibitor in an amount of 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate.

In one embodiment, the adhesive member may have a thickness of 50 μm to 200 μm.

In one embodiment, an input sensing unit may be disposed on the display panel, and the adhesive member may be disposed between the display panel and the input sensing unit or between the input sensing unit and the window. may be placed in between.

In one embodiment, the display panel may include a display element layer and an encapsulation layer disposed on the display element layer, wherein the input sensing unit is directly disposed on the encapsulation layer and the An adhesive member may be disposed on the input sensing portion.

In one embodiment, the adhesive member may be formed by directly providing the resin composition on one side of the window or one side of the display panel and curing the provided resin composition with ultraviolet rays.

In one embodiment, the display device may include at least one folding area, and the folding area may have a radius of curvature of 5 mm or less.

In one embodiment, further comprising: a light control layer disposed between the adhesive member and the window; and an optical adhesive layer disposed between the light control layer and the window. The adhesive layer may contain a polymer derived from the resin composition.

The resin composition of one embodiment has improved polymerization properties.

The adhesive member of one embodiment has excellent adhesion at high temperatures.

The display device of one embodiment exhibits excellent reliability.

1 is a perspective view of a display device of one embodiment; FIG. 2 is a diagram showing a folded state of the display device shown in FIG. 1; FIG. 1 is a perspective view of a display device of one embodiment; FIG. 4 is a view showing a folded state of the display device shown in FIG. 3; FIG. 1 is a perspective view of a display device of one embodiment; FIG. 1 is an exploded perspective view of a display device of one embodiment; FIG. 1 is a cross-sectional view of a display device according to an example; FIG. FIG. 4 illustrates a method of manufacturing an adhesive member according to one embodiment; FIG. 4 illustrates a method of manufacturing an adhesive member according to one embodiment; FIG. 4 illustrates a method of manufacturing an adhesive member according to one embodiment; FIG. 4 illustrates a method of manufacturing an adhesive member according to one embodiment; FIG. 4 illustrates a method of manufacturing an adhesive member according to one embodiment; 1 is a cross-sectional view of a display device according to an example; FIG. 1 is a cross-sectional view of a display device according to an example; FIG.

Since the present invention is capable of various modifications and may have various forms, specific embodiments thereof are illustrated in the drawings and will be described in detail in the text. However, it is not intended to limit the invention to the particular disclosed form, but should be understood to include all modifications, equivalents or alternatives falling within the spirit and scope of the invention.

In this specification, when a component (or region, layer, portion, etc.) is referred to as being “over” or “coupled to” another component, it is directly on top of the other component. It means that they can be arranged, connected or coupled, or that a third component can be arranged therebetween.

On the other hand, in the present application, "directly disposed" means that there are no additional layers, films, regions, plates, etc. between a portion such as a layer, film, region, plate, etc. have a nature. For example, "directly disposed" can mean disposed without the use of an additional member, such as an adhesive member, between two layers or two members.

The same reference numerals refer to the same components. Also, in the drawings, the thicknesses, proportions, and dimensions of components are exaggerated for effective description of technical content.

"and/or" includes all combinations of one or more defined by the associated construct.

The terms first, second, etc. are used to describe various components, but the components are not limited to the terms. The terms are only used to distinguish one component from another. For example, the first component may be named the second component, and similarly the second component may also be named the first component, without departing from the scope of rights of the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

Also, terms such as "below", "below", "above", "above" are used to describe the relationship of the features shown in the figures. The terms are relative concepts and will be described based on the directions shown in the drawings. In the present specification, "arranged on" indicates not only the upper part of any one member but also the lower part.

Unless defined otherwise, all terms (including technical and scientific terms) used herein are the same as commonly understood by one of ordinary skill in the art to which this invention belongs. have meaning. Also, terms such as those defined in commonly used dictionaries should be construed to have a meaning consistent with their meaning in the context of the relevant art, and should not be considered ideal or overly formal. shall be construed as explicitly defined herein unless otherwise construed in a different sense.

Terms such as "including" or "having" specify the presence of any feature, number, step, act, component, part, or combination thereof described in the specification, It is to be understood that it does not preclude the presence or addition of additional features, figures, steps, acts, components, parts or combinations thereof.

Hereinafter, a resin composition, an adhesive member, and a display device according to one embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a display device according to one embodiment. 2 is a diagram showing a folded state of the display device shown in FIG. 1. FIG.

Referring to FIG. 1, the display device DD of the embodiment has a rectangular shape with long sides extending in a first direction DR1 and short sides extending in a second direction DR2 intersecting the first direction DR1. have. However, embodiments are not limited to this, and the display device DD may have various shapes such as a circle and a polygon on a plane. The display device DD is a flexible display device.

In the display device DD according to one embodiment, the display surface DS on which the image IM is displayed is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DS, that is, the thickness direction of the display device DD is indicated by the third direction DR3. A front surface (or top surface) and a back surface (or bottom surface) of each member are defined by a third direction DR3. However, the directions indicated by the first to third directions DR1, DR2, and DR3 are relative concepts, and may be changed to other directions. Hereinafter, the first to third directions refer to the same reference numerals as the directions indicated by the first to third directions DR1, DR2, and DR3, respectively.

The display device DD of one embodiment includes at least one folding area FA. 1 and 2, the display device DD includes a folding area FA and a plurality of non-folding areas NFA. The folding region FA is located between the non-folding regions NFA, and the folding region FA and the non-folding region NFA are arranged side by side in the first direction DR1.

The folding area FA is a portion that can be transformed into a shape that is folded based on a folding axis FX extending in a second direction DR2, which is one direction. The radius of curvature RD of the folding area FA is 5 mm or less.

Although one folding area FA and two non-folding areas NFA are illustrated in FIGS. 1 and 2, the number of folding areas FA and non-folding areas NFA is not limited to this. For example, the display device DD may include a plurality of non-folding areas NFA greater than two and a plurality of folding areas FA arranged between the non-folding areas NFA.

In the display device DD of one embodiment, the non-folding areas NFA are arranged symmetrically with respect to the folding area FA. However, the embodiment is not limited to this, and the folding area FA may be arranged between the non-folding areas NFA so that the areas of the two non-folding areas NFA facing each other with respect to the folding area FA are different from each other.

A display surface DS of the display device DD includes a display area DA and a non-display area NDA around the display area DA. The display area DA displays an image, and the non-display area NDA does not display an image. The emergency area NDA surrounds the display area DA and defines the frame of the display device DD.

Referring to FIG. 2, the display device DD is a foldable (foldable) display device DD, folded or unfolded. For example, the folding area FA is bent with respect to the folding axis FX parallel to the second direction DR2, and the display device DD is folded. The folding axis FX is defined as the short axis parallel to the short side of the display device DD.

When the display device DD is folded, the non-folding areas NFA face each other, and the display device DD is in-folded so that the display surface DS is not exposed to the outside. However, embodiments are not limited to this, and unlike the illustration, the display device DD may be out-folded so that the display surface DS is exposed to the outside.

FIG. 3 is a perspective view of a display device according to one embodiment. 4 is a diagram showing a folded state of the display device shown in FIG. 3. FIG.

Except for the folding action, the display device DD-a shown in FIG. 3 has substantially the same configuration as the display device DD shown in FIG. Therefore, in the following description of the display device DD-a shown in FIGS. 3 and 4, the folding operation will be mainly described.

3 and 4, the display device DD-a includes a folding area FA-a and a plurality of non-folding areas NFA-a. The folding region FA-a is located between the non-folding region NFA-a, and the folding region FA-a and the non-folding region NFA-a are arranged side by side in the second direction DR2.

The folding area FA-a is bent with respect to the folding axis FX-a parallel to the first direction DR1, and the display device DD-a is folded. Fold axis FX-a is defined as the long axis parallel to the long side of display device DD-a. Unlike the display device DD shown in FIG. 1, which is folded along the short axis, the display device DD-a shown in FIG. 3 is folded along the long axis. FIG. 4 shows an example in which the display device DD-a is folded inward so that the display surface DS is not exposed to the outside. It may be folded with the display surface DS facing outward.

FIG. 5 is a perspective view of a display device according to one embodiment. The display device DD-b of one embodiment includes folding areas BA1, BA2 and a non-folding area NBA, wherein the folding areas BA1, BA2 are folded from one side of the non-folding area NBA.

Referring to FIG. 5, the display device DD-b of the embodiment has a non-folding area NBA in which the image IM is displayed on the front, and a first folding area BA1 and a second folding area BA2 in which the image IM is displayed on the side. ,including. The first folding area BA1 and the second folding area BA2 are each folded from both sides of the non-folding area NBA.

Referring to FIG. 5, the non-folding area NBA provides an image IM in a third direction DR3, which is the front surface of the display device DD-b, the first folding area BA1 in a fifth direction DR5, the second folding area BA2 in a fourth direction. Provide an image in direction DR4. The fourth direction DR4 and the fifth direction DR5 are directions crossing the first to third directions DR1, DR2, and DR3. However, the directions indicated by the first to fifth directions DR1 to DR5 are relative concepts, and are not limited to the illustrated directional relationships.

The display device DD-b of one embodiment is a bending display device including a non-bending area NBA and bending areas BA1 and BA2 respectively arranged on both sides of the non-bending area NBA. On the other hand, although not shown, the display in one embodiment may be a folded display including one non-folded area and one folded area. At this time, the folding area is provided by folding only one side of the non-folding area.

Although a foldable display device and a foldable display device have been described with reference to FIGS. 1 to 5, the embodiments are not limited thereto. An example display may be a rollable display, a flat rigid display, or a curved rigid display.

In the following description of the display device of one embodiment, the display device DD that can be folded with respect to the short axis will be described. It can be applied not only to the DD-a and the display device DD-b including the folding area, but also to various forms of display devices.

FIG. 6 is an exploded perspective view of the display device DD of one embodiment. FIG. 7 is a cross-sectional view of the display device DD of one embodiment. FIG. 7 is a cross-sectional view of a portion corresponding to line I-I' in FIG.

The display device DD of one embodiment includes a display module DM and a window WP arranged over the display module DM. In one embodiment of the display device DD, the display module DM includes a display panel DP including display element layers DP-EL, and an input sensing part TP arranged on the display panel DP. The display device DD of one embodiment includes a connection member AP arranged between the display panel DP and the window WP. For example, in one embodiment of the display device DD, the adhesive member AP is arranged between the input sensing part TP and the window WP. The adhesive member AP is an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR).

The adhesive member AP is made of the resin composition of one example. The adhesive member AP includes a polymer derived from the resin composition of one embodiment.

An example resin composition includes a (meth)acrylate oligomer. As used herein, (meth)acrylate refers to acrylate or methacrylate. For example, the resin composition contains a urethane (meth)acrylate oligomer. In one embodiment, the urethane (meth)acrylate oligomer includes a photocurable compound containing at least one (meth)acryloyl group having a urethane bond. The urethane (meth)acrylate oligomer includes at least one of an acrylate having a urethane bond, a urethane acrylate having a polycarbonate skeleton, and a urethane acrylate having a polyether skeleton. For example, the resin composition of one example includes UF-C051 (KYOEISHA CHEMICAL CO., LTD.), UN-6305 (NEGAMI CHEMICAL INDUSTRIAL CO., LTD.), and SUA008 (ASIA INDUSTRY CO., Ltd.) as urethane acrylate oligomers. Ltd.).

A resin composition containing a (meth)acrylate oligomer exhibits low-viscosity characteristics when applied by a method such as an inkjet printing method or a dispensing coating method. In addition, the (meth)acrylate oligomer is included in the resin composition in the form of an oligomer having a relatively high degree of polymerization, and maintains the high degree of polymerization even after photocuring, thereby exhibiting high peel strength.

Since the resin composition of one embodiment contains a (meth)acrylate oligomer, it exhibits high adhesion after photocuring, so that the adhesive member made of the resin composition of one embodiment can be applied to a foldable display device. This will improve the folding properties of the display.

In one embodiment, the resin composition includes an oxygen inhibition inhibitor including at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher.

As used herein, an oxygen inhibition inhibitor means a substance that prevents oxygen inhibition, and oxygen inhibition means that the polymerization reaction is inhibited by oxygen. For example, oxygen inhibition is that the polymerization reaction is inhibited by peroxide radicals produced by the reaction of radicals and oxygen.

Specifically, the resin composition of one embodiment contains the oxygen inhibition inhibitor in an amount of 0.1 wt % or more and less than 1 wt % with respect to the total amount of (meth)acrylate. For example, the resin composition contains 0.1 wt % or more and 0.4 wt % or less of the oxygen inhibition inhibitor with respect to the total amount of (meth)acrylate. If the resin composition of one embodiment does not contain an oxygen inhibition inhibitor or contains a very small amount, the ability to prevent oxygen inhibition may be impaired. Moreover, when the resin composition contains 1 wt % or more of the oxygen inhibition inhibitor, the peel strength after curing of the resin composition may decrease. In this specification, the total amount of (meth)acrylates is understood to be the sum of the total amounts of (meth)acrylate oligomers contained in the resin composition and (meth)acrylate monomers described later.

The resin composition of the present invention contains the oxygen inhibition inhibitor described above, and the monomer is polymerized in the atmosphere. For example, the resin composition of one embodiment is photocured by light irradiation in the air, and the polymerization degree of the polymerization reaction is improved in the presence of oxygen.

The boiling point of the oxygen inhibition inhibitor according to one embodiment of the present invention is 150° C. or higher, and may be, for example, 160° C. or higher. Specifically, the oxygen inhibition inhibitor includes a phosphite compound having a boiling point of 150° C. or higher, such as triphenylphosphite (TPP), tricresylphosphite (TCP), and triethylphosphite (TEP). including one.

Specifically, oxygen inhibition inhibitors include phosphine compounds with a boiling point of 150° C. or higher, such as triphenylphosphine.

The resin composition of one embodiment may further contain a known oxygen inhibition inhibitor in addition to the oxygen inhibition inhibitor described above. For example, the resin composition may further contain a thiol compound or an amine compound. The resin composition of the present invention may further contain a thiol compound or an amine compound to produce the small molecules required in the polymerization reaction.

An example resin composition further includes at least one of a (meth)acrylate monomer and a photoinitiator.

For example, one example resin composition includes a monofunctional (meth)acrylate monomer. In one example resin composition, the monofunctional (meth)acrylate monomer comprises a plurality of different monomers. For example, in one example resin composition, the monofunctional (meth)acrylate monomers include at least one monofunctional acrylate monomer and at least one monofunctional methacrylate monomer.

The resin composition of one example contains isodecyl acrylate, 2-methyl-2-ethyl-1,3 dioxolan-4-ylmethyl acrylate (2-methyl-2- at least one of ethyl-1,3-dioxolan-4-ylmethyl acrylate, 4-hydroxy butyl acrylate, 2-ethylhexyl acrylate, and butyl acrylate include.

In one embodiment, the resin composition further includes multi-functional (meth)acrylate monomers if it contains 80 wt % or more of mono-functional (meth)acrylate monomers based on the total amount of (meth)acrylates. For example, one example resin composition includes a bifunctional (meth)acrylate monomer. In one example resin composition, the difunctional (meth)acrylate monomer comprises a plurality of different monomers. For example, in one example resin composition, the difunctional (meth)acrylate monomers include at least one difunctional acrylate monomer and at least one difunctional methacrylate monomer.

The resin composition of one example contains 1,4-butanediol di(meth)acrylate, 1,3-butylene glycol di(meth)acrylate as bifunctional (meth)acrylate monomers. ) acrylate (1,3-butylene glycol di(meth)acrylate), 1,6-hexanediol di(meth)acrylate (1,6-hexanediol di(meth)acrylate), 1,8-octanediol di(meth) Acrylate (1,8-octane diol di(meth)acrylate), 1,9-octanediol diacrylate (1,9-octane diol diacrylate), 1,12-dodecanediol di(meth)acrylate (1,12-dodecane diol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dicyclopentanyl di(meth)acrylate, cyclohexane-1,4- Dimethanol di(meth)acrylate (cyclohexane-1,4-dimethylol di(meth)acrylate), tricyclodecane di methanol di(meth)acrylate, dicyclopentanedimethylol di(meth) Acrylate (dicyclopentane dimethylol di(meth)acrylate), neopentyl glycol modified trimethylpyropane di(meth)acrylate (neopentyl glycol modified trimethylpropane di(meth)acrylate), adamantane di(meth)acrylate, adamantane di(tri) trimethylolpropane tri(meth)acrylate, or mixtures thereof. An example resin composition includes at least one photoinitiator. If multiple photoinitiators are included, different photoinitiators are activated by ultraviolet light of different center wavelengths.

Photoinitiators include 2,2-dimethoxy-1,2-diphenyl-1-ethanone (2,2-dimethoxy-1,2-diphenyl-1-ethanone), 1-hydroxy-cyclohexyl-phenyl-ketone (1- hydroxy-cyclohexyl-phenyl-ketone), 2-hydroxy-2-methyl-1-phenyl-1-propanone (2-hydroxy-2-methyl-1-phenyl-1-propanone), 2-hydroxy-1-[4 -(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone (2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone), and 2-hydroxy-1 -{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one (2-hydroxy-1-{4-[4-(2-hydroxy- 2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one).

Also, the photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1 -one), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone), 2-dimethyl Amino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one (2-dimethylamino-2-(4-methyl-benzyl)-1-(4 -morpholin-4-yl-phenyl)-butan-1-one), 2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide), 2,4,6-trimethylbenzoyl -diphenylphosphinate (2,4,6-trimethylbenzoyl-diphenyl phosphinate), bis (2,4,6-trimethylbenzoyl)-phenylphosphine oxide (bis (2,4,6-trimethylbenzoyl)-phenylphosphineoxide), [1- (4-phenylsulfanylbenzoyl) heptylideneamino]benzoate ([1-(4-phenylsulfanylbenzoyl) heptylideneamino]benzoate), [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl] ethylideneamino]acetate ([1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate) and bis(2,4-cyclopentadienyl)bis[2,6-difluoro -3-(1-pyryl)phenyl]titanium(IV) (bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV)) is one of

The resin composition of one example has a viscosity of 150 mPa·s or less. The resin composition of one example has a viscosity of 1.0 mPa·s or more and 150 mPa·s or less at 20° C. or more and 50° C. or less. For example, the resin composition has a viscosity at 25° C. of 1.0 mPa·s to 100 mPa·s, preferably 1.0 mPa·s to 50 mPa·s. The viscosity of the resin composition was measured by the JIS K2283 method.

In one embodiment, when the viscosity of the resin composition is less than 1.0 mPa·s, the resin composition liquid provided for forming the adhesive member drips due to the low viscosity, thereby using the resin composition. It becomes difficult to form a coating film with a uniform thickness. In addition, when the viscosity of the resin composition of one example exceeds 150 mPa·s, it becomes difficult to discharge an appropriate amount of the resin composition from a coating device used for coating the resin composition.

The display panel DP includes a base substrate BS, a circuit layer DP-CL arranged on the base substrate BS, a display element layer DP-EL arranged on the circuit layer DP-CL, and a display element layer DP- and an encapsulation layer TFE covering the EL. For example, the display panel DP includes a plurality of organic light emitting elements or a plurality of quantum dot light emitting elements in the display element layer DP-EL.

On the other hand, the configuration of the display panel DP shown in FIG. 7 and the like is an example, and the configuration of the display panel DP is not limited to that shown in FIG. 7 and the like. For example, the display panel DP may include a liquid crystal display element, and in this case the sealing layer TFE may be omitted.

The input sensing part TP is arranged on the display panel DP. For example, the input sensing part TP is directly arranged on the sealing layer TFE of the display panel DP. The input sensing part TP senses an external input, converts it into a predetermined input signal, and provides the input signal to the display panel DP. For example, in the display device DD of one embodiment, the input sensing part TP is a touch sensing part that senses a touch. The input sensing part TP recognizes direct user touch, indirect user touch, direct object touch, or indirect object touch. Meanwhile, the input sensing part TP senses at least one of a touch position and a touch intensity (pressure) applied from the outside. The input sensing part TP according to one embodiment of the present invention has various structures or is made of various materials, and is not limited to any one embodiment. The input sensing part TP may include a plurality of sensing electrodes (not shown) for sensing external inputs. A sensing electrode (not shown) senses an external input in a capacitive manner. The display panel DP receives an input signal from the input sensor TP and generates an image corresponding to the input signal.

The window WP protects the display panel DP and the input sensing part TP. An image IM generated on the display panel DP is provided to the user through the window WP. The window WP provides the touch surface of the display device DD. In the display device DD containing the folding area FA, the window WP is a flexible window.

The window WP includes a base layer BL and a print layer BM. The window WP includes a transmissive area TA and a bezel area BZA. The front surface of the window WP, including the transmissive area TA and the bezel area BZA, hits the front surface of the display device DD.

The transmissive area TA is an optically transparent area. The bezel area BZA is an area having relatively low light transmittance compared to the transmissive area TA. The bezel area BZA has a predetermined color. A bezel area BZA surrounds the transmissive area TA adjacent to it. The bezel area BZA defines the shape of the transmissive area TA. However, embodiments are not limited to this, and the bezel area BZA may be arranged adjacent to only one side of the transmissive area TA, or may be partially omitted.

The base layer BL is a glass or plastic substrate. For example, tempered glass is used for the base layer BL. Alternatively, the base layer BL is made of a flexible polymer resin. For example, the base layer BL consists of polyimide, polyacrylate, polymethacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or combinations thereof. However, the embodiment is not limited to this, and any general form known as the base layer BL of the window WP in the relevant technical field can be used without limitation.

The printed layer BM is arranged on one side of the base layer BL. In one embodiment, the printed layer BM is provided on the lower surface of the base layer BL adjacent to the display module DM. The print layer BM is arranged in the edge region of the base layer BL. The print layer BM is an ink print layer. Also, the print layer BM is a layer formed containing pigments or dyes. In the window WP, the bezel area BZA is the part where the printed layer BM is provided.

Meanwhile, the window WP further includes at least one functional layer (not shown) provided on the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but embodiments are not limited thereto.

There is a step between the portion provided with the printed layer BM and the base layer BL not provided with the printed layer BM. The adhesive member AP of one embodiment made of the resin composition of one embodiment described above has a low storage modulus and a high adhesive strength value, so that it can be attached to the window WP without lifting the stepped portion.

An adhesive member AP according to one embodiment includes a polymer derived from the resin composition of one embodiment described above. That is, the adhesive member AP of one embodiment includes a (meth)acrylate oligomer and an oxygen inhibition inhibitor containing at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher. including a polymer derived from a resin composition containing 0.1 wt% or more and less than 1 wt% of an oxygen inhibition inhibitor with respect to the total amount of (meth)acrylates. The adhesive member AP of one embodiment includes a polymer derived from a resin composition that further includes at least one of a monofunctional (meth)acrylate monomer, a difunctional (meth)acrylate monomer, and a photoinitiator. Regarding the monofunctional (meth)acrylate monomer, the difunctional (meth)acrylate monomer, and the photoinitiator, the same contents as those described in the resin composition of the above example are applied.

Since the resin composition of one embodiment contains the oxygen inhibition inhibitor described above, the adhesive member AP of one embodiment has excellent adhesion at high temperatures and improved peeling strength. For example, the adhesive member AP exhibits excellent peel strength at 60°C.

The adhesive member AP included in the display device DD of one embodiment is provided in the form of a liquid resin composition on one surface of the window WP or one surface of the display module DM, and is provided between the window WP and the display module DP. It is formed by UV-curing the liquid resin composition. On the other hand, in a separate process, the adhesive member AP is formed by curing a liquid resin composition with ultraviolet light, and one surface of the adhesive member AP in a state of being cured in the form of an adhesive film is used as one surface of the window WP or the other surface of the window WP. An adhesive member AP is provided by laminating on one surface of the display module DM and attaching one surface of the window WP not attached to the remaining surface of the adhesive member AP or one surface of the display module DM.

The thickness of the adhesive member AP is 50 μm or more and 200 μm or less. For example, the adhesive member AP has a thickness of 100 μm or more and 150 μm or less.

Figures 8a-8c schematically illustrate the steps of fabricating an adhesive member AP according to one embodiment. FIG. 8a shows the step of providing a resin composition RC for forming the adhesive member AP, FIG. 8b shows the step of irradiating ultraviolet light, and FIG. 8c shows the step of removing the carrier film CF.

Referring to Figures 8a to 8c, an example resin composition RC is provided on a carrier film CF. As the carrier film CF, for example, a polyethylene terephthalate (PET) film or the like is used, but the examples are not limited to this. The carrier film CF serves as a base material for coating the liquid resin composition RC, and any carrier film CF can be used as long as it can be easily removed from the adhesive member AP after UV curing. For example, one surface of the carrier film CF provided for the resin composition RC is subjected to a release treatment.

The resin composition RC is provided by a method such as an inkjet printing method or a dispensing method. The resin composition RC of one example has a viscosity value of 1.0 mPa s or more and 150 mPa s or less at 20° C. or more and 50° C. or less. provided as provided. Specifically, the resin composition RC of one example has a viscosity value of 1.0 mPa·s or more and 50 mPa·s or less at 25°C.

A pre-adhesive member P-AP provided by coating the resin composition RC with a constant thickness is irradiated with ultraviolet light UV. Although FIG. 8b shows that the coated pre-adhesive member P-AP is directly irradiated with ultraviolet light UV, the embodiment is not limited to this. An auxiliary carrier film (not shown) may be further arranged on the pre-adhesive member P-AP. Cover the pre-adhesive member P-AP.

After UV curing, an adhesive member AP is formed. The adhesive member AP finally provided by removing the carrier film CF used during the process exhibits excellent adhesive strength at high temperatures.

The adhesive member AP manufactured in the steps of FIGS. 8a to 8c is applied to the display device DD described above. For example, one surface of the adhesive member AP is attached on the display module DM, and then the window WP is sequentially attached on the other surface of the adhesive member AP facing the one surface of the adhesive member AP attached to the display module DM. Also, unlike this, one surface of the adhesive member AP is attached on one surface of the window WP facing the display module DM, and then one surface of the adhesive member AP attached to the window WP and the other surface of the adhesive member AP facing the window WP. An adhesive member AP may be provided on the display device DD so that the display modules DM are attached in sequence.

Meanwhile, a liquid resin composition provided between the display module DM and the window WP is cured to form the adhesive member AP. FIGS. 9a and 9b show manufacturing steps of an adhesive member AP included in the display device DD which is manufactured by a method different from the manufacturing method of the adhesive member AP described with reference to FIGS. 8a to 8c.

Figure 9a shows the step of providing a resin composition RC over the display module DM. FIG. 9b also shows the step of irradiating the pre-adhesive member P-AP formed from the resin composition RC with ultraviolet light.

The resin composition RC is provided by a method such as an inkjet printing method or a dispensing method. The resin composition RC of one example has a viscosity value of 1.0 mPa·s or more and 50 mPa·s or less at 25° C., so that it is easily discharged from the nozzle NZ or the like, and a thin but constant coating thickness is maintained. provided as Further, the resin composition has a viscosity value of 1.0 mPa·s or more and 50 mPa·s or less, so that it is provided while covering the bending of the stepped portion SP-a of the display module DM. That is, by having a low viscosity value of 50 mPa·s or less, the resin composition RC can be filled without forming an empty space in a bent portion such as the stepped portion SP-a. Also, the resin composition RC provided through the nozzle NZ has a viscosity value of 1.0 mPa·s or more, so that it is uniformly coated with a predetermined thickness without dripping beyond the display module DM.

A window WP is provided on the pre-adhesive member P-AP provided by coating the resin composition RC with a uniform thickness. Ultraviolet light UV for curing the resin composition RC is provided through the window WP. When the window WP is provided on the pre-adhesive member P-AP, the resin composition RC is filled without forming an empty space at the stepped portion SP-b. In other words, since the resin composition RC has a low viscosity value of 50 mPa·s or less, the curved shape can be covered at a curved portion such as the stepped portion SP-b between the base layer BL and the print layer BM. While a pre-adhesive member P-AP is provided. The pre-adhesive member P-AP is polymerized by the provided ultraviolet light UV and then cured to form an adhesive member AP.

On the other hand, unlike the drawings such as FIG. 9b, ultraviolet light UV is provided to the pre-adhesive member P-AP before the window WP is provided on the pre-adhesive member P-AP, and the resin composition RC undergoes a polymerization reaction. may be performed. The amount of ultraviolet light UV to be irradiated is such that the resin composition RC is completely cured. However, unlike this, a part of the polymerization reaction of the resin composition RC is performed in the state of the pre-adhesive member P-AP, and then the window SP is covered and then the unreacted resin composition RC is additionally reacted. , and finally an adhesive member AP may be formed.

The display devices DD, DD-a, and DD-b according to one embodiment shown in FIGS. The bonding state between the window WP and the display module DM is maintained by using the bonding member AP without causing the floating phenomenon of the bonding member AP even in the state or the bending area.

FIG. 10 is a cross-sectional view showing a display device according to one embodiment. In the following description of the display device of the embodiment shown in FIG. 10, details that are the same as those described with reference to FIGS.

Compared to the display device DD described with reference to FIGS. 6 and 7, the display device DD-1 of the example shown in FIG. 10 further includes a light control layer PP and an optical adhesive layer AP-a. . The display device DD-1 of one embodiment includes a light control layer PP arranged between the adhesive member AP and the window WP, and an optical adhesive layer AP-a arranged between the light control layer PP and the window WP. and further including.

The light control layer PP is arranged on the display panel DP via an adhesive member AP, and controls reflected light on the display panel DP due to external light. The light control layer PP includes, for example, a polarizing layer or a color filter layer. Although the light control layer PP is arranged on the display module DM in FIG. 10, the display module DM includes the display panel DP and the input sensing part TP as shown in FIG.

The optical adhesive layer AP-a is an optically transparent adhesive film (OCA) or an optically transparent adhesive resin layer (OCR). The optical adhesive layer AP-a is made of the resin composition of one example, like the adhesive member AP (FIG. 7) of one example described above. That is, the optical adhesive layer AP-a contains a (meth)acrylate oligomer and an oxygen inhibition inhibitor containing at least one of a phosphite compound with a boiling point of 150° C. or higher and a phosphine compound with a boiling point of 150° C. or higher. , including a polymer derived from a resin composition containing 0.1 wt% or more and less than 1 wt% of an oxygen inhibition inhibitor with respect to the total amount of (meth)acrylates.

The resin composition before the reaction with the photoinitiator has a viscosity of 1.0 mPa·s or more and 150 mPa·s or less at 20° C. or more and 50° C. or less measured by the JIS K2283 method.

The optical adhesive layer AP-a of one example exhibits high adhesive strength.

A display device DD-1 of one example includes an optical adhesive layer AP-a made of the resin composition of one example and an adhesive member AP, and the optical adhesive layer AP-a and the adhesive member AP have high adhesion. , the floating phenomenon does not occur at the interface between the optical adhesive layer AP-a and the adhesive member AP even when the display device DD-1 is folded or bent, thereby exhibiting excellent reliability characteristics.

FIG. 11 is a cross-sectional view showing a display device according to one embodiment. In the following description of the display device of the embodiment shown in FIG. 11, details that are the same as those described with reference to FIGS.

Compared with the display device DD described with reference to FIGS. 6 and 7, the display device DD-2 of the example shown in FIG. and PIB. The display device DD-2 of the example includes, like the display device DD-1 of the example shown in FIG. and an optical adhesive layer AP-a disposed between the layer PP and the window WP.

In one embodiment of the display device DD-2, an adhesive member AP is provided between the display panel DP and the input sensing part TP. That is, the input sensing part TP is not directly disposed on the display panel DP, and the display panel DP and the input sensing part TP are coupled to each other by the adhesive member AP. For example, the adhesive member AP is arranged between the sealing layer TFE (FIG. 7) of the display panel DP and the input sensing part TP.

An interlayer adhesion layer PIB is provided under the light control layer PP. The interlayer adhesive layer PIB is arranged between the input sensing part TP and the light control layer PP, and is made of an adhesive material having excellent moisture permeation resistance. For example, the interlayer adhesion layer PIB is formed containing polyisobutylene. An interlayer adhesion layer PIB is disposed on the input sensing part TP to prevent corrosion of the sensing electrodes of the input sensing part TP.

A display device DD-2 of one example includes an optical adhesive layer AP-a made of the resin composition of one example and an adhesive member AP, and the optical adhesive layer AP-a and the adhesive member AP have high adhesion. , no floating phenomenon occurs at the interface between the optical adhesive layer AP-a and the adhesive member AP even when the display device DD-2 is folded or bent, thereby exhibiting excellent reliability characteristics.

Hereinafter, the resin composition, the adhesive member, and the display device of one example according to one embodiment of the present invention will be described in detail with reference to examples and comparative examples. Moreover, the examples shown below are examples for helping understanding of the present invention, and the scope of the present invention is not limited thereto.

1. Preparation of Curable Liquid Resin Composition The resin compositions of Examples 1 to 8 were prepared according to the compounding ratios shown in Table 1. The resin compositions of Comparative Examples 1 to 8 were prepared according to the compounding ratios shown in Table 2. After providing the constituent materials of the Examples and Comparative Examples in the weight proportions disclosed in Tables 1 and 2 in heat-resistant, light-shielding containers, Omnirad TPO-H (2,4,6-trimethylbenzoyl-diphenylphosphine oxide) was added as a photoinitiator. 2,4,6-trimethylbenzoyl-diphenylphosphine oxide)) was provided at only 2 wt%. Thereafter, the provided materials were stirred at 25° C. to prepare a curable liquid resin composition.

The numerical values disclosed in Tables 1 and 2 indicate the compounding ratio (wt%) and are based on the total amount of (meth)acrylate. That is, the numerical values shown in Tables 1 and 2 are the weight (wt%) of the sum of the total amount of the oligomer and the total amount of the monomer based on 100%.

(Material of resin composition)
Materials for each component used in Examples and Comparative Examples disclosed in Tables 1 and 2 are as follows.

[monomer]
IDAA: isodecyl acrylate
MEDOL-10: 2-methyl-2-ethyl-1,3-dioxolan-4-ylmethyl acrylate (2-methyl-2-ethyl-1,3-dioxolan-4-yl-methyl acrylate)
4-HBA: 4-hydroxy butyl acrylate
2-EHA: 2-ethylhexyl acrylate
BA: butyl acrylate

[Oligomer]
UFC-051: urethane acrylate (KYOEISHA CHEMICAL CO., LTD.)
UN-6305: Urethane acrylate (NEGAMI CHEMICAL INDUSTRIAL CO., LTD.)
SUA008: Urethane acrylate (ASIA INDUSTRY CO., LTD.)

[Photoinitiator]
Omnirad TPO-H: self-cleavage type radical polymerization initiator

[Oxygen inhibition inhibitor]
TPP: triphenyl phosphite, b. p. 360°C
TCP: tri-cresyl phosphite, b. p. 255°C
TEP: triethyl phosphite, b. p. 156°C
Do-T: dodecanethiol
Di-T: dithiol

1. Physical Property Evaluation of Resin Composition and Adhesive Member Consisting of Resin Composition (Measurement Method)
The viscosities and peeling strengths of the resin compositions of Examples and Comparative Examples were evaluated and shown in Tables 1 and 2 above. The viscosity and peel strength of the resin composition were measured by the following methods.

[Method for measuring viscosity]
The viscosity of the resin composition described herein is measured at 25° C. using the JIS K2283 method, using a viscometer TVE-25L (TOKI SANGYO CO., LTD.) at a speed of 10 rpm. It was measured.

[Preparation of cured product test piece]
Using the resin compositions of Examples 1 to 8 and Comparative Examples 1 to 8, the thickness of the resin composition is 100 μm on a slide glass (MATSUNAMI GLASS IND., LTD., product name S1112). was applied as follows. Next, the resin composition was temporarily cured by irradiation with a 365 nm LED (100 mW/200 mJ) in the atmosphere. Next, a polyethylene terephthalate film (TOYOBO CO., LTD., product name COSMOSHINE 4100, width 20 mm, length 150 mm, thickness 100 μm) was attached. In the bonded state, a 395 nm LED was irradiated (500 mW/4000 mJ) from the side of the polyethylene terephthalate film to fully cure the resin composition to obtain a cured product.

[180° peeling strength]
The cured products of the resin compositions of Examples 1 to 8 and Comparative Examples 1 to 8 were subjected to a 180° peeling test using a tensile tester (INSTRON CORP., product name INSTRON 5965). Measurements were made at 25°C and 60°C at a tensile speed of 300 mm/min.

(Evaluation content)
Referring to the results in Tables 1 and 2, it can be seen that the resin compositions of Examples and Comparative Examples have low viscosities of 50 mPa·s or less in the composition state. Accordingly, the resin compositions of Examples and Comparative Examples have low-viscosity properties and form thin and uniform coating films.

Examples and comparative examples containing the same oligomers and monomers were compared with each other in the peel strength evaluation below.

The resin compositions of Examples 1 to 4 had improved peel strength at 25° C. and 60° C. after curing compared to the resin compositions of Comparative Examples 1 to 4. It is believed that this is because the resin compositions of Examples contain 0.1 wt % or more and less than 1 wt % of the phosphite compound. Referring to Comparative Examples 1 and 2, the peel strength decreased when the phosphite compound was not included or when the phosphite compound was included at 1 wt % or more. Referring to Comparative Examples 3 and 4, peel strength decreased when a thiol dicompound such as Do-T or Di-T was included without a phosphite compound as an oxygen inhibition inhibitor. It is considered that this is because the thiol compound causes a chain transfer reaction to inhibit the polymerization of the resin composition.

The resin composition of Example 5 had improved peel strength at 25° C. and 60° C. after curing as compared with the resin composition of Comparative Example 5. This is probably because the resin composition of Example 5 contains 0.1 wt % or more and less than 1 wt % of the phosphite compound.

The resin compositions of Examples 6 to 8 had improved peel strength at 25° C. and 60° C. after curing as compared with the resin composition of Comparative Example 6. It is believed that this is because the resin compositions of Examples 6 to 8 contain the phosphite compound in an amount of 0.1 wt % or more and less than 1 wt %.

The resin compositions of Comparative Examples 7 and 8 had lower peel strength than the resin composition of Comparative Example 1, or could not be measured. It is believed that this is because the resin compositions of Comparative Examples 7 and 8 do not contain oligomers.

A resin composition of one embodiment includes a (meth)acrylate oligomer, a (meth)acrylate monomer, and an oxygen inhibition inhibitor, wherein the oxygen inhibition inhibitor is 0.1 wt% based on the total amount of the (meth)acrylate. Although it is contained in less than 1 wt%, the oxygen inhibition inhibitor contains at least one of a phosphite compound with a boiling point of 150 ° C. or higher and a phosphine compound with a boiling point of 150 ° C. or higher, so that high peel strength after curing is exhibited.

2. Characterization of Oxygen Inhibition Prevention Agents The oxygen inhibition prevention properties of phosphite compounds and thiol compounds were evaluated below.

(Preparation of composition)
The compositions of Example A, Example B, Comparative Example A-1, Comparative Example A-2, Comparative Example B-1, and Comparative Example B-2 were prepared according to the compounding ratios shown in Table 3 below.

That is, MEDOL-10 or IDAA, which are monofunctional monomers without a cross-linking reaction, were provided with only 2 mol% of Omnirad TPO-H (2,4,6-trimethylbenzoyl-diphenylphosphine oxide) as a photoinitiator, resulting in oxygen inhibition. Only 0.5 mol % each of triphenylphosphite or dodecanethiol was provided as an inhibitor.

(Preparation after curing)
After applying the compositions of Examples and Comparative Examples onto a slide glass, temporary curing (LED 365 nm/100 mW/100 mJ) was performed in the presence of oxygen. Next, after laminating a polyethylene terephthalate film, main curing (LED 395 nm/500 mW/4000 mJ) was performed to obtain a cured product.

The obtained cured product was dissolved in THF (tetrahydrofuran), and GPC (gel permeation chromatography) measurement was performed to obtain a polystyrene equivalent molecular weight.

In the results of Table 3, Example A, Comparative Example A-1, and Comparative Example A-2 were compared with each other, and Example B, Comparative Example B-1, and Comparative Example B-2 were compared with each other.

The cured product of Example A had an increased molecular weight compared to Comparative Example A-1. The cured product of Comparative Example A-2 had a lower molecular weight than Comparative Example A-1.

The cured product of Example B had an increased molecular weight compared to Comparative Example B-1. The cured product of Comparative Example B-2 had a lower molecular weight than Comparative Example B-1.

As a result, the cured products of Examples A and B containing TPP have a higher molecular weight than the cured products of Comparative Examples A-1 and B-1 to which no oxygen inhibition inhibitor is added, and Do-T is reduced. It was found that the cured products of Comparative Examples A-2 and B-2 containing Oxygen-inhibition inhibitors had lower molecular weights than Comparative Examples A-1 and Comparative Examples B-1 containing no oxygen inhibition inhibitor.

This is believed to be due to the different reactivity of TPP and Do-T to the reaction stop terminal formed by oxygen. In particular, thiol compounds such as Do-T are accompanied by chain transfer reactions, making it difficult to increase the molecular weight of polymers in the presence of oxygen. Do you get it.

As a result, it was found that the resin composition of the example contained 0.1 wt % or more and less than 1 wt % of the phosphite compound, thereby improving the degree of polymerization under oxygen.

A resin composition of one embodiment includes a (meth)acrylate oligomer, a (meth)acrylate monomer, and an oxygen inhibition inhibitor, wherein the oxygen inhibition inhibitor is 0.1 wt% based on the total amount of the (meth)acrylate. In addition to containing less than 1 wt %, the oxygen inhibition inhibitor contains at least one of a phosphite compound with a boiling point of 150° C. or higher and a phosphine compound with a boiling point of 150° C. or higher, thereby improving polymerization characteristics. In addition, the resin composition of one example exhibits low viscosity characteristics, which is advantageous in forming a thin and uniform coating film. In addition, due to its low viscosity, it exhibits excellent coating properties even on curved surfaces.

An example adhesive member made of the example resin composition exhibits excellent peel strength at room temperature (25° C.) and high temperature (60° C.).

Since the display device of one example includes an adhesive member formed of the resin composition of one example, the adhesive member does not peel off or float at the bent portion, and exhibits good reliability and can be bent or folded. Even in this case, no peeling phenomenon occurs between the adhesive member and the adjacent member, thus exhibiting excellent reliability.

Although the present invention has been described above with reference to preferred embodiments of the invention, those skilled in the art or having ordinary skill in the art will readily appreciate the invention as set forth in the claims below. It should be understood that various modifications and alterations may be made without departing from the spirit and scope of the invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be determined by the claims.

DD, DD-a, DD-b, DD-1: display device RC: resin composition AP: adhesive member

Claims (10)

(meth)acrylate oligomer;
an oxygen inhibition inhibitor containing at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher;
The resin composition in which the oxygen inhibition inhibitor is contained in an amount of 0.1 wt % or more and less than 1 wt % with respect to the total amount of (meth)acrylate. 2. The resin composition of claim 1, wherein the oxygen inhibition inhibitor comprises at least one of triphenylphosphite, tricresylphosphite, triethylphosphite, and triphenylphosphine. 2. The resin composition according to claim 1, further comprising a (meth)acrylate monomer. The resin composition according to claim 1, further comprising a monofunctional (meth)acrylate monomer. 5. The resin composition of claim 4, wherein the resin composition further comprises a polyfunctional (meth)acrylate monomer when the content of the monofunctional (meth)acrylate monomer is 80 wt % or more based on the total amount of (meth)acrylate. thing. 2. The resin composition according to claim 1, wherein the content of the oxygen inhibition inhibitor is less than 0.5 wt% relative to the total amount of (meth)acrylate. The resin composition according to claim 1, further comprising a thiol compound or an amine compound. 2. The resin composition according to claim 1, wherein said (meth)acrylate is urethane (meth)acrylate. An adhesive member comprising a polymer derived from the resin composition according to any one of claims 1 to 8. a display panel;
a window positioned over the display panel;
an adhesive member disposed between the display panel and the window;
A display device, wherein the adhesive member is derived from the resin composition according to any one of claims 1 to 8.

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