KR20220131494A - Resin composition, adhesive meber, and display device including the same - Google Patents

Abstract

A resin composition of one embodiment of the present invention comprises: a (meth)acrylate oligomer; and an oxygen inhibition suppressor including at least one of a phosphite compound having a boiling point of 150 ℃ or higher and a phosphine compound having a boiling point of 150 ℃ or higher, wherein with respect to 100 wt% of (meth)acrylate, the proportion of the oxygen inhibition suppressor is greater than or equal to 0.1 wt% and less than or equal to 1 wt%. An adhesive member of one embodiment of the present invention, which is formed by photocuring the resin composition of one embodiment of the present invention, exhibits excellent adhesion at high temperatures, and thus may exhibit excellent reliability characteristics when used in a flexible display device.

Description

A resin composition, an adhesive member, and a display device including the adhesive member TECHNICAL FIELD

The present invention relates to a resin composition, an adhesive member formed of the resin composition, and a display device including the adhesive member.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. In particular, in recent years, development of a display device capable of folding, bending, or rolling by providing a flexible display member that can be bent to facilitate portability and improve user convenience is being developed.

In the case of such a flexible display device, it is necessary to secure reliability of each member used in a folding or bending operation. In addition, an adhesive resin used to form an adhesive layer applied to various types of display devices needs to have excellent coating properties on members of various types of display devices.

An object of the present invention is to provide a resin composition capable of having high adhesion at high temperature and an adhesive member prepared therefrom.

Another object of the present invention is to provide a display device having excellent reliability.

The resin composition of the present invention is a (meth)acrylate oligomer; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher; Including, the oxygen inhibitory agent is included in an amount of 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate.

In one embodiment, the oxygen inhibitory agent may include at least one of triphenyl phosphite, tricresyl phosphite, triethyl phosphite, and triphenyl phosphine.

In one embodiment, the resin composition may further include a (meth)acrylate monomer.

In one embodiment, the resin composition may further include a monofunctional (meth)acrylate monomer.

In one embodiment, when the content of the monofunctional (meth)acrylate monomer is 80 wt% or more with respect to the total amount of (meth)acrylate, the resin composition may further include a polyfunctional (meth)acrylate monomer.

In one embodiment, the content of the oxygen inhibitory agent may be less than 0.5wt% based on the total amount of (meth)acrylate.

In one embodiment, the resin composition may further include a thiol compound and an amine compound.

In one embodiment, the (meth)acrylate may be urethane (meth)acrylate.

The adhesive member according to an embodiment of the present invention includes a (meth)acrylate oligomer; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150°C or higher and a phosphine compound having a boiling point of 150°C or higher; It is included in 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate.

In one embodiment, the oxygen inhibitory agent may include at least one of triphenyl phosphite, tricresyl phosphite, triethyl phosphite, and triphenyl phosphine.

In one embodiment, the resin composition may further include a (meth)acrylate monomer.

In one embodiment, the resin composition may further include a monofunctional (meth)acrylate monomer.

In one embodiment, when the content of the monofunctional (meth)acrylate monomer is 80 wt% or more with respect to the total amount of (meth)acrylate, the resin composition may further include a polyfunctional (meth)acrylate monomer.

A display device according to an embodiment of the present invention includes a display panel; a window disposed on the display panel; and an adhesive member disposed between the display panel and the window. Including, wherein the adhesive member is a (meth) acrylate oligomer; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150°C or higher and a phosphine compound having a boiling point of 150°C or higher; It is included in 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate.

In an embodiment, the thickness of the adhesive member may be 50 μm or more and 200 μm or less.

In an embodiment, the display device may further include an input sensing unit disposed on the display panel, and the adhesive member may be disposed between the display panel and the input sensing unit or between the input sensing unit and the window.

In an embodiment, the display panel includes a display element layer and an encapsulation layer disposed on the display element layer, the input sensing unit is disposed directly on the encapsulation layer, and the adhesive member is disposed on the input sensing unit can be

In an embodiment, the adhesive member may be formed by directly providing the resin composition on one surface of the window or on one surface of the display panel, and UV curing the provided resin composition.

In one embodiment, at least one folding area may be included, and a radius of curvature of the folding area may be 5 mm or less.

In one embodiment, further comprising a light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window, wherein the optical adhesive layer comprises a polymer derived from the resin composition. may include

The resin composition of one embodiment may have improved polymerization properties.

The adhesive member according to an embodiment may have excellent adhesion at a high temperature.

A display device according to an exemplary embodiment may exhibit excellent reliability.

1 is a perspective view of a display device according to an exemplary embodiment;
FIG. 2 is a view illustrating a folded state of the display device shown in FIG. 1 .
3 is a perspective view of a display device according to an exemplary embodiment;
FIG. 4 is a view illustrating a folded state of the display device shown in FIG. 3 .
5 is a perspective view of a display device according to an exemplary embodiment.
6 is an exploded perspective view of a display device according to an exemplary embodiment.
7 is a cross-sectional view of a display device according to an exemplary embodiment.
8A to 8C are views illustrating a method of manufacturing an adhesive member according to an exemplary embodiment.
9A and 9B are views illustrating a method of manufacturing an adhesive member according to an exemplary embodiment.
10 is a cross-sectional view of a display device according to an exemplary embodiment.
11 is a cross-sectional view of a display device according to an exemplary embodiment.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In this specification, when an element (or region, layer, portion, etc.) is referred to as being “on,” “connected to,” or “coupled to” another element, it is placed/directly placed on the other element. It means that it can be connected/coupled or a third component can be placed between them.

Meanwhile, in the present application, “directly disposed” may mean that there is no layer, film, region, plate, etc. added between portions of a layer, film, region, plate, etc. and another portion. For example, “directly disposed” may mean disposing between two layers or two members without using an additional member such as an adhesive member.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content.

“and/or” includes any combination of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as "below", "below", "above", "upper" and the like are used to describe the relationship of the components shown in the drawings. The above terms are relative concepts, and are described with reference to directions indicated in the drawings. In the present specification, "disposed on" may refer to a case of being disposed not only on the upper part of any one member but also on the lower part.

Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Also, terms such as terms defined in commonly used dictionaries should be construed as having a meaning consistent with their meaning in the context of the relevant art, and unless they are interpreted in an ideal or overly formal sense, they are explicitly defined herein interpreted as being

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, and includes one or more other features, number, or step. , it should be understood that it does not preclude the possibility of the existence or addition of , operation, components, parts or combinations thereof.

Hereinafter, a resin composition, an adhesive member, and a display device according to an embodiment will be described with reference to the drawings.

1 is a perspective view of a display device according to an exemplary embodiment; FIG. 2 is a view illustrating a folded state of the display device shown in FIG. 1 .

Referring to FIG. 1 , a display device DD according to an exemplary embodiment is a rectangle having long sides extending in a first direction DR1 and short sides extending in a second direction DR2 crossing the first direction DR1 . It may have a shape. However, the exemplary embodiment is not limited thereto, and the display device DD may have various shapes such as a circle and a polygon on a plane. The display device DD may be a flexible display device.

In the display device DD according to an exemplary embodiment, the display surface DS on which the image IM is displayed may be parallel to a surface defined by the first direction DR1 and the second direction DR2 . The third direction DR3 indicates the normal direction of the display surface DS, that is, the thickness direction of the display device DD. The front surface (or upper surface) and the rear surface (or lower surface) of each member are divided by the third direction DR3 . However, the directions indicated by the first to third directions DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third directions DR1 , DR2 , and DR3 , respectively.

The display device DD according to an exemplary embodiment may include at least one folding area FA. 1 and 2 , the display device DD may include a folding area FA and a plurality of non-folding areas NFA. The folding area FA is disposed between the non-folding areas NFA, and the folding area FA and the non-folding areas NFA may be arranged adjacent to each other in the first direction DR1 .

The folding area FA may be a deformable portion in a folded form based on the folding axis FX extending in the second direction DR2, which is one direction. A radius of curvature RD of the folding area FA may be 5 mm or less.

1 and 2 exemplarily show one folding area FA and two non-folding areas NFA, but the number of folding area FA and non-folding areas NFA is not limited thereto. does not For example, the display device DD may include more than two non-folding areas NFA and a plurality of folding areas FA disposed between the non-folding areas NFA.

In the display device DD according to an exemplary embodiment, the non-folding areas NFA may be disposed to be symmetrical to each other with respect to the folding area FA. However, the embodiment is not limited thereto, and the folding area FA is disposed between the non-folding areas NFA, and the areas of the two non-folding areas NFA facing each other with respect to the folding area FA are may be different from each other.

The display surface DS of the display device DD may include a display area DA and a non-display area NDA around the display area DA. The display area DA may display an image, and the non-display area NDA may not display an image. The non-display area NDA may surround the display area DA and may define an edge of the display device DD.

Referring to FIG. 2 , the display device DD may be a foldable (foldable) display device DD that can be folded or unfolded. For example, the folding area FA may be bent based on the folding axis FX parallel to the second direction DR2 , so that the display device DD may be folded. The folding axis FX may be defined as a short axis parallel to a short side of the display device DD.

When the display device DD is folded, the non-folding areas NFA may face each other, and the display device DD may be in-folded such that the display surface DS is not exposed to the outside. However, the exemplary embodiment is not limited thereto, and unlike the drawings, the display device DD may be out-folded so that the display surface DS is exposed to the outside.

3 is a perspective view of a display device according to an exemplary embodiment. FIG. 4 is a view illustrating a folded state of the display device shown in FIG. 3 .

Except for the folding operation, the display device DD-a shown in FIG. 3 may have substantially the same configuration as the display device DD shown in FIG. 1 . Accordingly, in the description of the display device DD-a illustrated in FIGS. 3 and 4 , the folding operation will be mainly described below.

3 and 4 , the display device DD-a may include a folding area FA-a and a plurality of non-folding areas NFA-a. The folding area FA-a is disposed between the non-folding areas NFA-a, and the folding area FA-a and the non-folding areas NFA-a are arranged adjacent to each other in the second direction DR2 . can be

The folding area FA-a may be bent based on the folding axis FX-a parallel to the first direction DR1 , so that the display device DD-a may be folded. The folding axis FX-a may be defined as a long axis parallel to a long side of the display device DD-a. The display device DD shown in FIG. 1 may be folded based on the short axis, whereas the display device DD-a shown in FIG. 3 may be folded based on the long axis. In FIG. 4 , the display device DD-a is illustrated as being in-folded so that the display surface DS is not exposed to the outside, but the embodiment is not limited thereto. It may be folded and out-folded.

5 is a perspective view of a display device according to an exemplary embodiment. The display device DD-b according to an exemplary embodiment may include bending areas BA1 and BA2 and a non-bending area NBA, and the bending areas BA1 and BA2 may be bent from one side of the non-bending area NBA. have.

Referring to FIG. 5 , the display device DD-b according to an exemplary embodiment includes a non-bending area NBA in which an image IM is displayed on the front side, a first bending area BA1 in which an image IM is displayed on a side surface, and A second bending area BA2 may be included. The first bending area BA1 and the second bending area BA2 may be bent from both sides of the non-bending area NBA.

Referring to FIG. 5 , in the non-bending area NBA, the image IM is provided in the third direction DR3 which is the front surface of the display device DD-b, and the first bending area BA1 is provided in the fifth direction ( As DR5 , the second bending area BA2 may provide an image in the fourth direction DR4 . The fourth direction DR4 and the fifth direction DR5 may be directions crossing the first to third directions DR1 , DR2 , and DR3 . However, the directions indicated by the first to fifth directions DR1 to DR5 are relative concepts and are not limited to the direction relationship illustrated in the drawings.

The display device DD-b according to an exemplary embodiment may be a bending display device including a non-bending area NBA and bending areas BA1 and BA2 disposed on both sides of the non-bending area NBA, respectively. Also, although not shown, the display device according to an exemplary embodiment may be a bending display device including one non-bending area and one bending area. In this case, the bending area may be provided by being bent only at one side of the non-bending area.

Although the foldable display device and the bending display device have been illustrated and described with reference to FIGS. 1 to 5 , the embodiment is not limited thereto. The display device according to an exemplary embodiment may be a rollable display device, a flat rigid display device, or a curved rigid display device.

Hereinafter, the description of the display device according to the exemplary embodiment will be described with reference to the display device DD that is folded based on the short axis, but the exemplary embodiment is not limited thereto. DD-a) and the display device DD-b including the bending region may be applied to various types of display devices.

6 is an exploded perspective view of a display device DD according to an exemplary embodiment. 7 is a cross-sectional view of a display device DD according to an exemplary embodiment. FIG. 7 may be a cross-sectional view of a portion corresponding to line II′ of FIG. 1 .

The display device DD according to an embodiment may include a display module DM and a window WP disposed on the display module DM. In the display device DD according to an exemplary embodiment, the display module DM may include a display panel DP including a display element layer DP-EL and an input sensing unit TP disposed on the display panel DP. can The display device DD according to an exemplary embodiment may include an adhesive member AP disposed between the display panel DP and the window WP. For example, in the display device DD according to an exemplary embodiment, the adhesive member AP may be disposed between the input sensing unit TP and the window WP. The adhesive member AP may be an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR).

The adhesive member AP may be formed from the resin composition of an exemplary embodiment. The adhesive member AP may include a polymer derived from the resin composition of an exemplary embodiment.

The resin composition of one embodiment includes a (meth)acrylate oligomer. In the present specification, (meth)acrylate refers to acrylate or methacrylate. For example, the resin composition may include a urethane (meth)acrylate oligomer. In one embodiment, the urethane (meth)acrylate oligomer may include a photocurable compound including at least one (meth)acryloyl group having a urethane bond. The urethane (meth)acrylate oligomer may include at least one of an acrylate having a urethane bond, a urethane acrylate having a polycarbonate skeleton, and a urethane acrylate having a polyether skeleton. For example, the resin composition of an embodiment includes at least one of UF-C051 (manufactured by Kyoeisha Chemical), UN-6305 (manufactured by Negami Kogyo), and SUA008 (manufactured by Asia Kogyo) as a urethane acrylate oligomer. may be doing

The resin composition including the (meth)acrylate oligomer may exhibit low-viscosity properties that can be applied by a method such as an inkjet printing method or a dispensing coating method. In addition, the (meth)acrylate oligomer is included in the resin composition as an oligomer having a relatively high degree of polymerization to maintain a high degree of polymerization even after light curing, thereby exhibiting high peel strength.

The resin composition of an embodiment includes a (meth)acrylate oligomer, and exhibits high adhesion after light curing. Accordingly, when the adhesive member formed of the resin composition of the embodiment is applied to a foldable display device, the display device is folded properties can be improved.

The resin composition of an embodiment includes an oxygen inhibitory agent including at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher.

In the present specification, the oxygen inhibitory agent means a material that prevents oxygen inhibition, and oxygen inhibition means that the polymerization reaction is inhibited by oxygen. For example, oxygen inhibition may be that a peroxy radical generated by a reaction of a radical and oxygen inhibits a polymerization reaction.

Specifically, the resin composition of one embodiment contains the oxygen inhibitory agent in an amount of 0.1 wt% or more and less than 1 wt% with respect to the total amount of (meth)acrylate. For example, the resin composition may contain 0.1 wt% or more and 0.4 wt% or less of the oxygen inhibitory agent based on the total amount of (meth)acrylate. When the resin composition of one embodiment does not contain the oxygen inhibitory agent or contains a very small amount, the ability to prevent oxygen inhibition may be impaired. In addition, when the resin composition contains 1 wt% or more of the oxygen inhibitory agent, the peel strength may decrease after curing of the resin composition. In the present specification, the total amount of (meth)acrylate may be understood as the sum of the total amount of the (meth)acrylate oligomer and the (meth)acrylate monomer to be described later included in the resin composition.

The resin composition of the present invention may include the above-described oxygen inhibitory agent, so that the high molecular weight of the monomer may proceed under the atmosphere. For example, the resin composition of one embodiment may be photocured through light irradiation under the atmosphere, and the polymerization degree of the polymerization reaction may be improved under oxygen.

The boiling point of the oxygen inhibitory agent according to an embodiment of the present invention may be 150 °C or higher, for example, 160 °C or higher. Specifically, the oxygen inhibitory agent may include a phosphite compound having a boiling point of 150° C. or higher, for example, triphenyl phosphite (TPP), tri-cresyl phosphite (TCP) and tri-cresyl phosphite (TCP). It may include at least one of ethyl phosphite (Triethyl Phosphite, TEP).

Specifically, the oxygen inhibitory agent may include a phosphine compound having a boiling point of 150° C. or higher, and may include, for example, triphenyl phosphine.

The resin composition of an embodiment may further include a known oxygen inhibitory agent in addition to the above-described oxygen inhibitory agent. For example, the resin composition may further include a thiol compound or an amine compound. The resin composition of the present invention may further include a thiol compound or an amine compound to generate a low molecular weight required in the polymerization reaction.

The resin composition of an embodiment may further include at least one of a (meth)acrylate monomer and a photoinitiator.

For example, the resin composition of one embodiment may include a monofunctional (meth)acrylate monomer. In the resin composition of an embodiment, the monofunctional (meth)acrylate monomer may include a plurality of different monomers. For example, in the resin composition of an embodiment, the monofunctional (meth)acrylate monomer may include at least one monofunctional acrylate monomer and at least one monofunctional methacrylate monomer.

The resin composition of one embodiment is monofunctional (meth) acrylate, isodecyl acrylate, 2-methyl-2-ethyl-1,3-dioxolan-4-ylmethyl acrylate, 4-hydroxy butyl acrylate, 2 It may include at least one of -ethylhexyl acrylate, and butyl acrylate.

The resin composition of an embodiment may further include a polyfunctional (meth)acrylate monomer when it contains 80 wt% or more of a monofunctional (meth)acrylate monomer based on the total amount of (meth)acrylate. For example, the resin composition of one embodiment may include a bifunctional (meth)acrylate monomer. In the resin composition of an embodiment, the bifunctional (meth)acrylate monomer may include a plurality of different monomers. For example, in the resin composition of an embodiment, the difunctional (meth)acrylate monomer may include at least one difunctional acrylate monomer and at least one difunctional methacrylate monomer.

The resin composition of an embodiment includes 1,4-butanediol di (meth) acrylate, 1,3-butylene glycol di (meth) acrylate, and 1,6-hexanediol di (meth) as a difunctional (meth) acrylate monomer. ) acrylate, 1,8-octanediol di (meth) acrylate, 1,9-octanediol diacrylate, 1,12-dodecanediol di (meth) acrylate, neopentyl glycol di (meth) ) acrylate, dicyclopentanyl di (meth) acrylate, cyclohexane-1,4-dimethanol di (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, dicyclopentane dimethylol di(meth)acrylate, neopentylglycol-modified trimethylpropane di(meth)acrylate, adamantane di(meth)acrylate, trimethylolpropane tri(meth)acrylate, or a mixture thereof. Yes. The resin composition according to an embodiment may include at least one photoinitiator. In the case of including a plurality of photoinitiators, different photoinitiators may be activated by ultraviolet light of different central wavelengths.

Photoinitiator is 2,2-dimethoxy-1,2-diphenyletha-1-one (2,2-dimethoxy-1,2-diphenyl-1-ethanone, 1-hydroxy-cyclohexyl-phenyl-ketone) (1-hydroxy-cyclohexyl-phenyl-ketone), 2-hydroxy-2-methyl-1-phenyl-1-propanone (2-hydroxy-2-methyl-1-phenyl-1-propanone), 2-hydroxy Roxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone (2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1- propanone), and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropa-1-one (2-hydroxy -1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]-phenyl}-2-methylpropan-1-one).

In addition, the photoinitiator is 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one (2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan- 1-one), 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1 (2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone),

2-Dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one (2-dimethylamino-2-(4-methyl-benzyl)- 1-(4-morpholin-4-yl-phenyl)-butan-1-one),

2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide);

2,4,6-trimethylbenzoyl-diphenyl phosphinate (2,4,6-trimethylbenzoyl-diphenyl phosphinate);

Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (bis (2,4,6-trimethylbenzoyl) -phenylphosphineoxide),

[1- (4-phenylsulfanylbenzoyl) heptylideneamino] benzoate ([1- (4-phenylsulfanylbenzoyl) heptylideneamino] benzoate),

[1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate ([1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl] ethylideneamino] acetate), and

Bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV)(Bis(2,4-cyclopentadienyl)bis[2,6-difluoro It may be any one selected from -3-(1-pyrryl)phenyl]titanium(IV)).

The resin composition of one embodiment may have a viscosity of 150 mPa·s or less. The resin composition of an exemplary embodiment may have a viscosity of 1.0 mPa·s or more and 150 mPa·s or less at 20°C or higher and 50°C or lower. For example, the resin composition may have a viscosity at 25° C. of 1.0 mPa·s or more and 100 mPa·s or less, preferably, a viscosity of 1.0 mPa·s or more and 50 mPa·s or less. The viscosity of the resin composition was measured by the JIS K2283 method.

When the viscosity of the resin composition of one embodiment is less than 1.0 mPa·s, the viscosity is low and the flow of the resin composition solution provided for forming the adhesive member occurs, and accordingly, it may be difficult to form a coating film of a uniform thickness using the resin composition. In addition, when the viscosity of the resin composition of one embodiment is more than 150 mPa·s, it may be difficult to discharge the resin composition in an appropriate amount from the application device used to apply the resin composition.

The display panel DP includes a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and An encapsulation layer TFE covering the display element layer DP-EL may be included. For example, the display panel DP may include a plurality of organic light emitting devices or a plurality of quantum dot light emitting devices in the display device layer DP-EL.

Meanwhile, the configuration of the display panel DP illustrated in FIG. 7 and the like is exemplary and the configuration of the display panel DP is not limited to that illustrated in FIG. 7 or the like. For example, the display panel DP may include a liquid crystal display, and in this case, the encapsulation layer TFE may be omitted.

The input sensing unit TP may be disposed on the display panel DP. For example, the input sensing unit TP may be directly disposed on the encapsulation layer TFE of the display panel DP. The input sensing unit TP may sense an external input, change it into a predetermined input signal, and provide the input signal to the display panel DP. For example, in the display device DD according to an exemplary embodiment, the input sensing unit TP may be a touch sensing unit sensing a touch. The input sensing unit TP may recognize a direct touch of a user, an indirect touch of a user, a direct touch of an object, or an indirect touch of an object. Meanwhile, the input sensing unit TP may sense at least one of a position of an externally applied touch and an intensity (pressure) of the touch. The input sensing unit TP according to an embodiment of the present invention may have various structures or may be made of various materials, and is not limited to any one embodiment. The input sensing unit TP may include a plurality of sensing electrodes (not shown) for sensing an external input. The sensing electrodes (not shown) may sense an external input in a capacitive manner. The display panel DP may receive an input signal from the input sensing unit TP and generate an image corresponding to the input signal.

The window WP may protect the display panel DP and the input sensing unit TP. The image IM generated by the display panel DP may be provided to the user through the window WP. The window WP may provide a touch surface of the display device DD. In the display device DD including the folding area FA, the window WP may be a flexible window.

The window WP may include a base layer BL and a printed layer BM. The window WP may include a transmission area TA and a bezel area BZA. The front surface of the window WP including the transmission area TA and the bezel area BZA corresponds to the front surface of the display device DD.

The transmission area TA may be an optically transparent area. The bezel area BZA may be an area having relatively low light transmittance compared to the transmission area TA. The bezel area BZA may have a predetermined color. The bezel area BZA may be adjacent to the transmission area TA and may surround the transmission area TA. The bezel area BZA may define a shape of the transmission area TA. However, the exemplary embodiment is not limited thereto, and the bezel area BZA may be disposed adjacent to only one side of the transmission area TA, or a portion thereof may be omitted.

The base layer BL may be a glass or plastic substrate. For example, a tempered glass substrate may be used as the base layer BL. Alternatively, the base layer BL may be formed of a flexible polymer resin. For example, the base layer BL may include polyimide, polyacrylate, polymethylmethacrylate, polycarbonate, polyethylenenaphthalate, polyvinylidene chloride ( polyvinylidene chloride), polyvinylidene difluoride, polystyrene, ethylene-vinylalcohol copolymer, or a combination thereof. However, the embodiment is not limited thereto, and a general shape known as the base layer BL of the window WP in the related art may be used without limitation.

The printed layer BM may be disposed on one surface of the base layer BL. In an embodiment, the printed layer BM may be provided on a lower surface of the base layer BL adjacent to the display module DM. The printed layer BM may be disposed on an edge region of the base layer BL. The printing layer BM may be an ink printing layer. In addition, the printed layer BM may be a layer formed including a pigment or dye. In the window WP, the bezel area BZA may be a portion on which the printed layer BM is provided.

Meanwhile, the window WP may further include at least one functional layer (not shown) provided on the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, or the like, but the embodiment is not limited thereto.

There may be a step difference between the portion provided with the printed layer BM and the base layer BL not provided with the printed layer BM. The adhesive member AP according to an embodiment formed from the resin composition according to the embodiment described above has a low storage elastic modulus and a high adhesive strength value, so that it can be attached to the window WP without lifting at the step portion.

The adhesive member AP according to an embodiment may include a polymer derived from the resin composition of the embodiment described above. That is, the adhesive member AP according to an embodiment may include a (meth)acrylate oligomer; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150°C or higher and a phosphine compound having a boiling point of 150°C or higher; It may include a polymer derived from a resin composition containing less. The adhesive member AP according to an embodiment may include a polymer derived from a resin composition further including at least one of a monofunctional (meth)acrylate monomer, a bifunctional (meth)acrylate monomer, and a photoinitiator. For the monofunctional (meth)acrylate monomer, the bifunctional (meth)acrylate monomer, and the photoinitiator, the same contents as those described in the resin composition of the above-described embodiment may be applied.

As the resin composition of an embodiment includes the above-described oxygen inhibitory agent, the adhesive member AP of an embodiment may have excellent adhesion at a high temperature and may have improved peel strength. For example, the adhesive member AP may exhibit excellent peel strength at 60°C.

The adhesive member AP included in the display device DD according to an embodiment is provided on one surface of the window WP or one surface of the display module DM in a liquid resin composition state, and the window WP and the display module ( DM) may be formed by UV curing the liquid resin composition provided between them. On the other hand, in a separate process, an adhesive member (AP) is formed by UV curing the liquid resin composition in a separate process, and one side of the adhesive member (AP) in a cured state in the form of an adhesive film is applied to one side of the window (WP) or a display module. The adhesive member AP is formed by lamination on one side of the DM, and attaching one side of the window WP or one side of the display module DM that is not attached to the other side of the adhesive member AP. can be provided.

The thickness of the adhesive member AP may be 50 μm or more and 200 μm or less. For example, the adhesive member AP may have a thickness of 100 μm or more and 150 μm or less.

8A to 8C are views schematically illustrating steps of manufacturing the adhesive member AP according to an exemplary embodiment. Figure 8a shows the step of providing a resin composition (RC) for forming the adhesive member (AP), Figure 8b shows the step of irradiating ultraviolet light, Figure 8c shows the step of removing the carrier film (CF) it has been shown

8A to 8C , the resin composition RC according to an exemplary embodiment may be provided on the carrier film CF. As the carrier film (CF), for example, a polyethylene terephthalate (PET) film may be used, but the embodiment is not limited thereto. The carrier film CF serves as a base material for coating the liquid resin composition RC, and may be used without limitation as long as it can be easily detached from the adhesive member AP after UV curing. For example, one surface of the carrier film CF on which the resin composition RC is provided may be subjected to a release treatment.

The resin composition RC may be provided by an inkjet printing method or a dispensing method. The resin composition (RC) of one embodiment can be easily discharged from the nozzle (NZ) and the like by having a viscosity value of 1.0 mPa·s or more and 150 mPa·s or less at 20°C or more and 50°C or less, and a constant coating thickness is maintained. may be provided. Specifically, the resin composition (RC) of an embodiment may have a viscosity value of 1.0 mPa·s or more and 50 mPa·s or less at 25°C.

Ultraviolet light (UV) may be irradiated to the pre-adhesive member (P-AP) provided by coating the resin composition (RC) to a predetermined thickness. In FIG. 8B , it is illustrated that ultraviolet light (UV) is directly irradiated to the coated pre-adhesive member (P-AP), but the embodiment is not limited thereto. An auxiliary carrier film (not shown) may be further disposed on the pre-adhesive member (P-AP), and the auxiliary carrier film (not shown) transmits UV light. It could be to cover.

After UV curing, the adhesive member AP may be formed. The adhesive member AP finally provided by removing the carrier film CF used during the process may exhibit excellent adhesion at a high temperature.

The adhesive member AP manufactured in the steps of FIGS. 8A to 8C may be applied to the above-described display device DD. For example, one surface of the adhesive member AP is attached to the display module DM, and then on the other surface of the adhesive member AP facing the one surface of the adhesive member AP attached to the display module DM. The windows WP may be sequentially attached. In addition, unlike this, one side of the adhesive member AP is attached to one side of the window WP to face the display module DM, and then the adhesive facing the one side of the adhesive member AP attached to the window WP. The adhesive member AP may be provided to the display device DD by attaching the other surface of the member AP to the display module DM.

Meanwhile, the resin composition provided between the display module DM and the window WP in liquid form may be cured to form the adhesive member AP. 9A and 9B illustrate manufacturing steps of the adhesive member AP included in the display device DD by being manufactured by a method different from the method for manufacturing the adhesive member AP described with reference to FIGS. 8A to 8C .

9A shows the step of providing the resin composition RC on the display module DM. In addition, FIG. 9b shows the step of irradiating ultraviolet light to the pre-adhesive member (P-AP) formed from the resin composition (RC).

The resin composition RC may be provided by an inkjet printing method or a dispensing method. The resin composition (RC) of one embodiment can be easily discharged from the nozzle (NZ), etc. by having a viscosity value of 1.0 mPa · s or more and 50 mPa · s or less at 25 ° C. can In addition, the resin composition may have a viscosity value of 1.0 mPa·s or more and 50 mPa·s or less to cover the curvature of the step portion SP-a of the display module DM. That is, since it has a low viscosity value of 50 mPa·s or less, the resin composition RC may be filled without an empty space in a curved portion such as the step portion SP-a. In addition, since the resin composition RC provided through the nozzle NZ has a viscosity value of 1.0 mPa·s or more, it may be uniformly coated to a predetermined thickness without flowing out of the display module DM.

The window WP may be provided on the pre-adhesive member P-AP provided by coating the resin composition RC to a predetermined thickness. Ultraviolet light (UV) for curing the resin composition RC may be provided through the window WP. When the window WP is provided on the preliminary adhesive member P-AP, the resin composition RC may be filled without an empty space in the step portion SP-b. That is, since the resin composition (RC) has a low viscosity value of 50 mPa·s or less, the shape of the curvature in the curved portion, such as the step portion (SP-b) between the base layer (BL) and the printed layer (BM), is reduced. A preliminary adhesive member (P-AP) may be provided while covering. The pre-adhesive member P-AP may be cured after polymerization by the provided ultraviolet light (UV) to form the adhesive member AP.

On the other hand, unlike shown in FIG. 9b and the like, ultraviolet light (UV) is provided to the pre-adhesive member P-AP before the window WP is provided on the pre-adhesive member P-AP to obtain the resin composition RC. The polymerization reaction may proceed. The amount of irradiated ultraviolet light (UV) may be sufficient to completely cure the resin composition (RC). However, unlike this, the polymerization reaction of the resin composition (RC) is partially carried out in the state of the preliminary adhesive member (P-AP), and then the unreacted resin composition (RC) is additionally reacted after covering the window (WP) to obtain a final result. An adhesive member AP may be formed.

The display devices DD, DD-a, and DD-b according to the exemplary embodiment shown in FIGS. 1 to 5 include an adhesive member AP including a polymer derived from the above-described exemplary resin composition, Even in the folded state or the bending area, the adhesive state between the window WP and the display module DM may be maintained by using the adhesive member AP without lifting of the adhesive member AP.

10 is a cross-sectional view illustrating a display device according to an exemplary embodiment. Hereinafter, in the description of the display device according to the exemplary embodiment shown in FIG. 10 , the content overlapping with the content described with reference to FIGS. 1 to 9B will not be described again, and differences will be mainly described.

Compared to the display device DD described with reference to FIGS. 6 and 7 , the display device DD-1 illustrated in FIG. 10 further includes a light control layer PP and an optical adhesive layer AP-a. may be doing In the display device DD-1 according to the exemplary embodiment, a light control layer PP disposed between the adhesive member AP and the window WP, and an optical adhesive layer disposed between the light control layer PP and the window WP (AP-a) may be further included.

The light control layer PP may be disposed on the display panel DP to control light reflected from the display panel DP by external light. The light control layer PP may include, for example, a polarizing layer or a color filter layer.

The optical adhesive layer AP-a may be an optically clear adhesive film (OCA) or an optically clear adhesive resin layer (OCR). The optical adhesive layer AP-a may be formed from the resin composition of the embodiment in the same manner as the adhesive member AP of the embodiment described above ( FIG. 7 ). That is, the optical adhesive layer (AP-a) is a (meth) acrylate oligomer; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher, wherein the oxygen inhibitor is 0.1 wt% or more and less than 1 wt% based on the total amount of (meth)acrylate It may include a polymer derived from a resin composition comprising

The resin composition before the reaction with the photoinitiator may have a viscosity of 1.0 mPa·s or more and 150 mPa·s or less at 20°C or higher and 50°C or lower measured by the JIS K2283 method.

The optical adhesive layer AP-a according to an exemplary embodiment may exhibit high adhesive strength.

The display device DD-1 of an embodiment includes an optical adhesive layer AP-a and an adhesive member AP formed from the resin composition of the embodiment, and the optical adhesive layer AP-a and the adhesive member AP have a high By having the adhesive force, no lifting phenomenon occurs at the interface between the optical adhesive layer AP-a and the adhesive member AP even when the display device DD-1 is folded or bent, thereby exhibiting excellent reliability characteristics.

11 is a cross-sectional view illustrating a display device according to an exemplary embodiment. Hereinafter, in the description of the display device of the exemplary embodiment illustrated in FIG. 11 , the content overlapping with the content described with reference to FIGS. 1 to 10 will not be described again, and differences will be mainly described.

Compared to the display device DD described with reference to FIGS. 6 and 7 , the display device DD-2 according to the exemplary embodiment illustrated in FIG. 11 includes the light control layer PP, the optical adhesive layer AP-a, and the interlayer structure. It may further include an adhesive layer (PIB). The display device DD-2 according to the exemplary embodiment includes a light control layer PP disposed between the adhesive member AP and the window WP, like the display device DD-1 according to the exemplary embodiment shown in FIG. 10 , and It may further include an optical adhesive layer AP-a disposed between the light control layer PP and the window WP.

In the display device DD - 2 according to an exemplary embodiment, the adhesive member AP may be provided between the display panel DP and the input sensing unit TP. That is, the display panel DP and the input sensing unit TP may be coupled to each other by the adhesive member AP instead of the input sensing unit TP being directly disposed on the display panel DP. For example, the adhesive member AP may be disposed between the encapsulation layer TFE ( FIG. 7 ) of the display panel DP and the input sensing unit TP. Meanwhile, in FIG. 10 , the light control layer PP is illustrated as being disposed on the display module DM, but referring to FIG. 7 together, the display module DM includes the display panel DP and the input sensing unit TP. include

An interlayer adhesive layer PIB may be provided under the light control layer PP. The interlayer adhesive layer PIB is disposed between the input sensing unit TP and the light control layer PP and may be formed of an adhesive material having excellent moisture permeability prevention properties. For example, the interlayer adhesive layer (PIB) may be formed to include polyisobutylene. The interlayer adhesive layer PIB may be disposed on the input sensing unit TP to prevent corrosion of sensing electrodes of the input sensing unit TP.

The display device DD-2 of an embodiment includes an optical adhesive layer AP-a and an adhesive member AP formed from the resin composition of the embodiment, and the optical adhesive layer AP-a and the adhesive member AP have a high By exhibiting adhesion, no lifting phenomenon occurs at the interface between the optical adhesive layer AP-a and the adhesive member AP even when the display device DD-2 is folded or bent, thereby exhibiting excellent reliability characteristics.

Hereinafter, a resin composition according to an embodiment of the present invention, an adhesive member, and a display device according to an embodiment will be described in detail with reference to Examples and Comparative Examples. In addition, the examples shown below are examples for helping understanding of the present invention, and the scope of the present invention is not limited thereto.

One. Curable liquid resin composition preparation

The resin compositions of Examples 1 to 8 were prepared according to the compounding ratios shown in Table 1. The resin compositions of Comparative Examples 1 to 8 were prepared according to the compounding ratios shown in Table 2. After providing the constituent materials of Examples and Comparative Examples to the heat-resistant light-shielding container in the weight ratios shown in Tables 1 and 2, Omnirad TPO-H (2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2) ,4,6-trimethylbenzoyl-diphenylphosphine oxide) was provided in an amount of 2 wt% Then, the provided materials were stirred at 25° C. to prepare a curable liquid resin composition.

The numerical values shown in Tables 1 and 2 represent the mixing ratio (wt%), and are expressed based on the total amount of (meth)acrylate. That is, the numerical values shown in Tables 1 and 2 are the weight (wt%) expressed based on 100% of the sum of the total amount of oligomers and the total amount of monomers.

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 oligomer UFC-051 10 10 10 10 12 - - - UN6305 - - - - - 7 7 7 SUA008 - - - - - 5 5 5 monomer MEDOL-10 60 60 60 60 15 - - - IDAA 30 30 30 30 58 - - - 4-HBA - - - - 15 32 32 32 2-EHA - - - - - 42 42 42 BA - - - - - 14 14 14 initiator TPO-H 2 2 2 2 2 2 2 2 Oxygen
inhibition
inhibitor TPP 0.1 0.2 - - 0.1 0.2 - - TCP - - 0.2 - - - 0.2 - TEP - - - 0.2 - - - 0.2 Do-T - - - - - - - - Di-T - - - - - - - - viscosity
(mPa s) 25 25 25 - 28 29 29 29 Peel
burglar
(N/mm) 25℃ 1.6 1.7 1.6 1.6 1.1 0.9 0.9 0.9 60℃ 0.9 1.0 0.9 0.8 0.6 0.5 0.5 0.5

Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 Comparative Example 7 Comparative Example 8 oligomer UFC-051 10 10 10 10 12 - - - UN6305 - - - - - 7 - - SUA008 - - - - - 5 - - monomer MEDOL-10 60 60 60 60 15 - 100 - IDAA 30 30 30 30 58 - - - 4-HBA - - - - 15 32 - - 2-EHA - - - - - 42 - 100 BA - - - - - 14 - - initiator TPO-H 2 2 2 2 2 2 2 2 Oxygen
inhibition
inhibitor TPP - 3.8 - - - - - - TCP - - - - - - - - Do-T - - 0.2 - - - - - Di-T - - 0.2 - - - - viscosity
(mPa s)
25 25 25 25 28 29 6 6 Peel
burglar
(N/mm) 25℃ 1.5 1.2 1.1 1.0 1.0 0.8 0.5 0.1 60℃ 0.7 0.6 0.3 0.3 0.4 0.4 0.1 measurement
impossible

(Material of the resin composition)

Data for each component used in Examples and Comparative Examples disclosed in Tables 1 and 2 are as follows.

[monomer]

IDAA: isodecyl acrylate

MEDOL-10: 2-methyl-2-ethyl-1,3-dioxolan-4-ylmethylacrylate

4-HBA: 4-hydroxy butyl acrylate

2-EHA: 2-ethylhexyl acrylate

BA: butyl acrylate

[oligomer]

UF-C051: Urethane acrylate (manufactured by Kyoeisha Chemical)

UN-6305: Urethane acrylate (Negami Kogyo)

SUA008: Urethane acrylate (manufactured by Asia Industrial Company)

[Photoinitiator]

Omnirad TPO-H: Self-cleaving radical polymerization initiator

[Oxygen Inhibitors]

TPP: Triphenyl phosphite, b.p. 360℃

TCP: tri-cresyl phosphite, b.p.255° C.

TEP: Triethyl Phosphite, b.p.156 ℃

Do-T: Dodecanethiol

Di-T: Dithiol

1. Evaluation of physical properties of a resin composition and an adhesive member formed from the resin composition

(How to measure)

The viscosity and peel strength of the resin compositions of Examples and Comparative Examples were evaluated, and are shown in Tables 1 and 2 above. The viscosity and peel strength of the resin composition were measured by the following method.

[Method for measuring viscosity]

The viscosity of the resin composition described in this specification was measured at 25° C. using the JIS K2283 method, and was measured at a speed of 10 rpm using a viscometer TVE-25L (manufactured by TOKI).

[Preparation of cured product specimen]

Using the resin compositions of Examples 1 to 8 and Comparative Examples 1 to 8, the resin composition was applied to a slide glass (manufactured by Matsunami Glass Industries, Ltd., product name S1112) so that the resin composition had a thickness of 100 µm. Thereafter, the resin compositions were temporarily cured by irradiating a 365 nm LED under the atmosphere (100 mW/200 mJ). Thereafter, a polyethylene terephthalate film (manufactured by Toyo Spinning Co., Ltd., product name Cosmoshine 4100, width 20 mm, length 150 mm, thickness 100 µm) was bonded together. In the bonded state, 395 nm LED was irradiated (500 mW/4000 mJ) from the polyethylene terephthalate film side, the resin composition was main-cured, and the hardened|cured material was obtained.

[180° Peel Strength]

About the hardened|cured material of the resin composition of Examples 1-8 and Comparative Examples 1-8, the 180 degree peel test was implemented with the tensile tester (INSTRON 5965 type|mold manufactured by INSTRON). Measurements were made at a tensile rate of 300 mm/min at 25°C and 60°C.

(Evaluation contents)

Referring to the results of Tables 1 and 2, it can be seen that the resin compositions of Examples and Comparative Examples have a low viscosity of 50 mPa·s or less in the composition state. Accordingly, the resin compositions of Examples and Comparative Examples can form a uniform coating film having a thin thickness by having a low viscosity characteristic.

In the following peel strength evaluation, Examples and Comparative Examples including the same oligomer and monomer were compared with each other.

The resin compositions of Examples 1 to 4 had improved peel strength at 25° C. and 60° C. after curing compared to the resin compositions of Comparative Examples 1 to 4. This is considered to be because the resin composition of Examples contained 0.1 wt% or more and less than 1 wt% of the phosphite compound. Referring to Comparative Examples 1 and 2, the peel strength was reduced when the phosphite compound was not included, or when 1 wt% or more was included. Referring to Comparative Examples 3 and 4, when a thiol compound such as Do-T or Di-T was included without a phosphite compound as the oxygen inhibitory agent, the peel strength was decreased. This is considered to be because the polymerization of the resin composition was inhibited due to the chain transfer reaction of the thiol compound.

As for the resin composition of Example 5, the peeling strength improved at 25 degreeC and 60 degreeC after hardening compared with the resin composition of Comparative Example 5. This is considered to be because the resin composition of Example 5 contained 0.1 wt% or more and less than 1 wt% of the phosphite compound.

The resin compositions of Examples 6 to 8 had improved peel strength at 25°C and 60°C after curing compared to the resin composition of Comparative Example 6. This is considered to be because the resin compositions of Examples 6 to 8 contained 0.1 wt% or more and less than 1 wt% of the phosphite compound.

In the resin compositions of Comparative Examples 7 and 8, the peel strength was lowered compared to the resin composition of Comparative Example 1, or measurement was impossible. This is considered because the resin compositions of Comparative Examples 7 and 8 do not contain an oligomer.

The resin composition of one embodiment includes a (meth)acrylate oligomer, a (meth)acrylate monomer and an oxygen inhibitory agent, and contains an oxygen inhibitory agent in an amount of 0.1 wt% or more and less than 1 wt% based on the total amount of (meth)acrylate, The oxygen inhibitory agent may include at least one of a phosphine compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher, thereby exhibiting high peel strength after curing.

2. Characterization of Oxygen Inhibitors

Hereinafter, the oxygen inhibition preventing properties of the phosphite compound and the thiol compound were evaluated.

(Preparation of composition)

The compositions of Example A, Example B, Comparative Example A-1, Comparative Example A-2, Comparative Example B-1 and Comparative Example B-2 were prepared according to the compounding ratios shown in Table 3 below.

That is, Omnirad TPO-H (2,4,6-trimethylbenzoyl-diphenylphosphine oxide (2,4,6-trimethylbenzoyl-diphenylphosphine oxide) in an amount of 2 mol%, and triphenyl phosphite or dodecanethiol in an amount of 0.5 mol% each as an oxygen inhibitory agent.

(Preparation of cured product)

After coating the compositions of Examples and Comparative Examples on a slide glass, provisional curing (LED365 nm/100 mW/100 mJ) was performed in the presence of oxygen. Then, after bonding a polyethylene terephthalate film, main hardening (LED395 nm/500mW/4000mJ) was performed, and hardened|cured material was obtained.

The obtained hardened|cured material was melt|dissolved in THF (tetrahydrofuran), GPC(Gel Permeation Chromatography) measurement was performed, and polystyrene conversion molecular weight was obtained.

Example A Comparative Example A-1 Comparative Example A-2 Example B Comparative Example B-1 Comparative Example B-2 Monomer (addition amount mol%) MEDOL-10 (0.5) IDAA2 (0.5) Initiator (addition amount mol%) TPO-H(2) oxygen inhibition
inhibitor
(addition amount mol%) TPP 0.5 - - 0.5 - - Do-T - - 0.5 - - 0.5 Molecular Weight (Mn) 10.6 x 10 ⁴ 8.8 x 10 ⁴ 2.3 x 10 ⁴ 3.4 x 10 ⁴ 3.1 x 10 ⁴ 1.4 x 10 ⁴

In the results of Table 3, Example A, Comparative Example A-1, and Comparative Example A-2 were compared with each other, and Example B, Comparative Example B-1, and Comparative Example B-2 were compared with each other. Example A The cured product of Comparative Example A-1 had an increased molecular weight. The molecular weight of the cured product of Comparative Example A-2 was lower than that of Comparative Example A-1.

The cured product of Example B had an increased molecular weight compared to Comparative Example B-1. The molecular weight of the cured product of Comparative Example B-2 was lower than that of Comparative Example B-1.

Through this, the cured products of Examples A and B including TPP had higher molecular weight than the cured products of Comparative Examples A-1 and B-1 without adding an oxygen inhibitory agent, and Comparative Examples including Do-T It can be seen that the cured products of Examples A-2 and Comparative Examples B-2 have reduced molecular weight compared to Comparative Examples A-1 and Comparative Examples B-1 in which an oxygen inhibitory agent is not added.

This is thought to be because TPP and Do-T have different reactivity with respect to the reactive end formed by oxygen. In particular, it was confirmed that a thiol compound such as Do-T is difficult to achieve a high molecular weight under oxygen due to chain transfer reaction, but a phosphite compound such as TPP is effective for high molecular weight of a polymer under oxygen.

Through this, it can be confirmed that the resin composition of one embodiment contains the phosphite compound in an amount of 0.1 wt% or more and less than 1 wt%, thereby improving the degree of polymerization under oxygen.

The resin composition of one embodiment includes a (meth)acrylate oligomer, a (meth)acrylate monomer and an oxygen inhibitory agent, and contains an oxygen inhibitory agent in an amount of 0.1 wt% or more and less than 1 wt% based on the total amount of (meth)acrylate, When the oxygen inhibitory agent includes at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher, polymerization properties may be improved. In addition, the resin composition of an embodiment exhibits a low viscosity characteristic, and has advantageous properties for forming a uniform coating film of a thin thickness. In addition, excellent coating properties can be exhibited even on curved surfaces due to the low-viscosity characteristics.

The adhesive member of an embodiment formed from the resin composition of an embodiment may exhibit excellent peel strength at room temperature (25°C) and high temperature (60°C) ranges.

The display device according to the exemplary embodiment exhibits good reliability because there is no peeling or lifting of the adhesive member in the curved portion including the adhesive member formed through the resin composition of the exemplary embodiment, and the adhesive member and neighboring members even in the bending or folding operation state Since the peeling phenomenon between the liver does not occur, excellent reliability can be exhibited.

Although described above with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field do not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention may be made within the scope thereof.

Accordingly, the technical scope of the present invention should not be limited to the content described in the detailed description of the specification, but should be defined by the claims.

DD, DD-a, DD-b, DD-1: display device
RC: resin composition AP: adhesive member

Claims (20)

(meth)acrylate oligomers; and
An oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher;
The oxygen inhibitory agent is a resin composition included in an amount of 0.1 wt% or more and less than 1 wt% based on the total amount of (meth)acrylate. According to claim 1,
The oxygen inhibitory agent is a resin composition comprising at least one of triphenyl phosphite, tricresyl phosphite, triethyl phosphite, and triphenyl phosphine. According to claim 1,
The resin composition further comprises a (meth)acrylate monomer. According to claim 1,
The resin composition is a resin composition further comprising a monofunctional (meth) acrylate monomer. 5. The method of claim 4,
When the content of the monofunctional (meth) acrylate monomer is 80 wt % or more with respect to the total amount of (meth) acrylate, the resin composition further comprises a polyfunctional (meth) acrylate monomer. According to claim 1,
The content of the oxygen inhibitory agent is less than 0.5wt% based on the total amount of (meth)acrylate resin composition. According to claim 1,
The resin composition further comprises a thiol compound and an amine compound. According to claim 1,
The (meth)acrylate is a urethane (meth)acrylate resin composition. (meth)acrylate oligomers; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher; and a polymer derived from a resin composition comprising:
The resin composition is an adhesive member comprising 0.1 wt% or more and less than 1 wt% of the oxygen inhibitory agent based on the total amount of (meth)acrylate. 10. The method of claim 9,
The oxygen inhibitory agent includes at least one of triphenyl phosphite, tricresyl phosphite, triethyl phosphite, and triphenyl phosphine. 10. The method of claim 9,
The resin composition is an adhesive member further comprising a (meth) acrylate monomer. 10. The method of claim 9,
The resin composition is an adhesive member further comprising a monofunctional (meth) acrylate monomer. 13. The method of claim 12,
When the content of the monofunctional (meth)acrylate monomer is 80wt% or more with respect to the total amount of (meth)acrylate, the resin composition further comprises a polyfunctional (meth)acrylate monomer. display panel;
a window disposed on the display panel; and
an adhesive member disposed between the display panel and the window; including,
The adhesive member
(meth)acrylate oligomers; and an oxygen inhibitory agent comprising at least one of a phosphite compound having a boiling point of 150° C. or higher and a phosphine compound having a boiling point of 150° C. or higher; and a polymer derived from a resin composition comprising;
wherein the resin composition includes 0.1 wt% or more and less than 1 wt% of the oxygen inhibitory agent based on the total amount of (meth)acrylate. 15. The method of claim 14,
The thickness of the adhesive member is 50 μm or more and 200 μm or less. 15. The method of claim 14,
Further comprising an input sensing unit disposed on the display panel,
The adhesive member is disposed between the display panel and the input sensing unit or between the input sensing unit and the window. 17. The method of claim 16,
The display panel includes a display element layer and an encapsulation layer disposed on the display element layer,
The input sensing unit is disposed directly on the encapsulation layer,
The adhesive member is disposed on the input sensing unit. 15. The method of claim 14,
The adhesive member is formed by providing the resin composition directly on one surface of the window or on one surface of the display panel, and UV curing the provided resin composition. 15. The method of claim 14,
The display device further comprising at least one folding area, wherein a radius of curvature of the folding area is 5 mm or less. 15. The method of claim 14,
A light control layer disposed between the adhesive member and the window, and an optical adhesive layer disposed between the light control layer and the window,
and the optical adhesive layer includes the polymer derived from the resin composition.

Images