JP2022145478A - ワーク加工装置 - Google Patents

ワーク加工装置 Download PDF

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Publication number
JP2022145478A
JP2022145478A JP2021204585A JP2021204585A JP2022145478A JP 2022145478 A JP2022145478 A JP 2022145478A JP 2021204585 A JP2021204585 A JP 2021204585A JP 2021204585 A JP2021204585 A JP 2021204585A JP 2022145478 A JP2022145478 A JP 2022145478A
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Japan
Prior art keywords
electrode
work
processing
plasma
slit portion
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Pending
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JP2021204585A
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English (en)
Japanese (ja)
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JP2022145478A5 (enrdf_load_stackoverflow
Inventor
英雄 會田
Hideo Aida
秀俊 武田
Hidetoshi Takeda
俊郎 土肥
Toshiro Doi
忠一 宮下
Chuichi Miyashita
惇 鍛冶倉
Atsushi Kajikura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Nagaoka University of Technology NUC
Original Assignee
Fujikoshi Machinery Corp
Nagaoka University of Technology NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Fujikoshi Machinery Corp, Nagaoka University of Technology NUC filed Critical Fujikoshi Machinery Corp
Priority to US17/696,361 priority Critical patent/US12257641B2/en
Priority to CN202210263158.2A priority patent/CN115116817A/zh
Publication of JP2022145478A publication Critical patent/JP2022145478A/ja
Publication of JP2022145478A5 publication Critical patent/JP2022145478A5/ja
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2021204585A 2021-03-18 2021-12-16 ワーク加工装置 Pending JP2022145478A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US17/696,361 US12257641B2 (en) 2021-03-18 2022-03-16 Work processing apparatus
CN202210263158.2A CN115116817A (zh) 2021-03-18 2022-03-17 工件加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021044350 2021-03-18
JP2021044350 2021-03-18

Publications (2)

Publication Number Publication Date
JP2022145478A true JP2022145478A (ja) 2022-10-04
JP2022145478A5 JP2022145478A5 (enrdf_load_stackoverflow) 2024-11-12

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ID=83460385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021204585A Pending JP2022145478A (ja) 2021-03-18 2021-12-16 ワーク加工装置

Country Status (1)

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JP (1) JP2022145478A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025074994A1 (ja) * 2023-10-02 2025-04-10 株式会社ジェイテックコーポレーション プラズマ援用研磨方法及びその装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226258A (ja) * 1992-02-13 1993-09-03 Applied Materials Japan Kk プラズマ発生装置
JPH065567A (ja) * 1992-02-27 1994-01-14 Hughes Aircraft Co プラズマエッチングによる半導体材料の表面下の損傷の除去方法および装置
JPH0794495A (ja) * 1993-05-14 1995-04-07 Hughes Aircraft Co プラズマ補助化学的エッチング処理に使用される電極
JP2000058521A (ja) * 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2002103207A (ja) * 2000-09-27 2002-04-09 Hitachi Ltd 乾式化学機械研磨方法
JP2011176243A (ja) * 2010-02-25 2011-09-08 Osaka Univ 難加工材料の精密加工方法及びその装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05226258A (ja) * 1992-02-13 1993-09-03 Applied Materials Japan Kk プラズマ発生装置
JPH065567A (ja) * 1992-02-27 1994-01-14 Hughes Aircraft Co プラズマエッチングによる半導体材料の表面下の損傷の除去方法および装置
JPH0794495A (ja) * 1993-05-14 1995-04-07 Hughes Aircraft Co プラズマ補助化学的エッチング処理に使用される電極
JP2000058521A (ja) * 1998-08-08 2000-02-25 Tokyo Electron Ltd プラズマ研磨装置
JP2002103207A (ja) * 2000-09-27 2002-04-09 Hitachi Ltd 乾式化学機械研磨方法
JP2011176243A (ja) * 2010-02-25 2011-09-08 Osaka Univ 難加工材料の精密加工方法及びその装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025074994A1 (ja) * 2023-10-02 2025-04-10 株式会社ジェイテックコーポレーション プラズマ援用研磨方法及びその装置
JP2025062269A (ja) * 2023-10-02 2025-04-14 株式会社ジェイテックコーポレーション プラズマ援用研磨方法及びその装置

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