JP2022142723A - 基板処理装置、及び基板処理方法 - Google Patents

基板処理装置、及び基板処理方法 Download PDF

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Publication number
JP2022142723A
JP2022142723A JP2021196119A JP2021196119A JP2022142723A JP 2022142723 A JP2022142723 A JP 2022142723A JP 2021196119 A JP2021196119 A JP 2021196119A JP 2021196119 A JP2021196119 A JP 2021196119A JP 2022142723 A JP2022142723 A JP 2022142723A
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Japan
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density
substrate
drying
mixed fluid
detection unit
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JP2021196119A
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Japanese (ja)
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JP2022142723A5 (enrdf_load_stackoverflow
Inventor
眞高 御所
Sanetaka Gosho
励二郎 山中
Reijiro Yamanaka
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to KR1020220027988A priority Critical patent/KR20220129467A/ko
Priority to CN202210220366.4A priority patent/CN115083953A/zh
Priority to US17/689,199 priority patent/US11901197B2/en
Priority to TW111108303A priority patent/TW202242983A/zh
Publication of JP2022142723A publication Critical patent/JP2022142723A/ja
Priority to US18/392,552 priority patent/US12237178B2/en
Publication of JP2022142723A5 publication Critical patent/JP2022142723A5/ja
Pending legal-status Critical Current

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/54—Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids

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  • Cleaning Or Drying Semiconductors (AREA)
JP2021196119A 2021-03-16 2021-12-02 基板処理装置、及び基板処理方法 Pending JP2022142723A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020220027988A KR20220129467A (ko) 2021-03-16 2022-03-04 기판 처리 장치 및 기판 처리 방법
CN202210220366.4A CN115083953A (zh) 2021-03-16 2022-03-08 基板处理装置和基板处理方法
US17/689,199 US11901197B2 (en) 2021-03-16 2022-03-08 Substrate processing apparatus and substrate processing method
TW111108303A TW202242983A (zh) 2021-03-16 2022-03-08 基板處理裝置及基板處理方法
US18/392,552 US12237178B2 (en) 2021-03-16 2023-12-21 Substrate processing apparatus and substrate processing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021042031 2021-03-16
JP2021042031 2021-03-16

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JP2022142723A true JP2022142723A (ja) 2022-09-30
JP2022142723A5 JP2022142723A5 (enrdf_load_stackoverflow) 2024-09-20

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JP2021196119A Pending JP2022142723A (ja) 2021-03-16 2021-12-02 基板処理装置、及び基板処理方法

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JP (1) JP2022142723A (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243776A (ja) * 2011-05-13 2012-12-10 Tokyo Electron Ltd 基板処理装置、基板処理方法および記憶媒体
KR20180039458A (ko) * 2016-10-10 2018-04-18 세메스 주식회사 기판 처리 장치, 그리고 이의 공정 유체 모니터링 장치 및 모니터링 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012243776A (ja) * 2011-05-13 2012-12-10 Tokyo Electron Ltd 基板処理装置、基板処理方法および記憶媒体
KR20180039458A (ko) * 2016-10-10 2018-04-18 세메스 주식회사 기판 처리 장치, 그리고 이의 공정 유체 모니터링 장치 및 모니터링 방법

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