JP2022137821A - Resin composition and molded article of the same - Google Patents
Resin composition and molded article of the same Download PDFInfo
- Publication number
- JP2022137821A JP2022137821A JP2021037502A JP2021037502A JP2022137821A JP 2022137821 A JP2022137821 A JP 2022137821A JP 2021037502 A JP2021037502 A JP 2021037502A JP 2021037502 A JP2021037502 A JP 2021037502A JP 2022137821 A JP2022137821 A JP 2022137821A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- methyl methacrylate
- resin
- weight
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011342 resin composition Substances 0.000 title claims abstract description 89
- 229920001577 copolymer Polymers 0.000 claims abstract description 42
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 41
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 41
- 239000003822 epoxy resin Substances 0.000 claims abstract description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 21
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 21
- 238000000465 moulding Methods 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000001424 substituent group Chemical group 0.000 claims abstract description 4
- -1 aliphatic diol compound Chemical class 0.000 claims description 54
- 150000001875 compounds Chemical class 0.000 claims description 19
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- 125000005587 carbonate group Chemical group 0.000 claims description 15
- 238000012360 testing method Methods 0.000 claims description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 7
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 3
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 238000002845 discoloration Methods 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 25
- 239000012760 heat stabilizer Substances 0.000 description 23
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 21
- 238000004519 manufacturing process Methods 0.000 description 21
- 239000003063 flame retardant Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000000203 mixture Substances 0.000 description 18
- 229920000642 polymer Polymers 0.000 description 17
- 238000011156 evaluation Methods 0.000 description 16
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000004609 Impact Modifier Substances 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 14
- 239000000178 monomer Substances 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 11
- 239000004925 Acrylic resin Substances 0.000 description 9
- 229920000178 Acrylic resin Polymers 0.000 description 9
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 239000006096 absorbing agent Substances 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000003505 polymerization initiator Substances 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 150000003839 salts Chemical class 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000004816 latex Substances 0.000 description 7
- 229920000126 latex Polymers 0.000 description 7
- 239000004611 light stabiliser Substances 0.000 description 7
- 239000008188 pellet Substances 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 6
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000011593 sulfur Substances 0.000 description 6
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 238000004381 surface treatment Methods 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- KLDXJTOLSGUMSJ-JGWLITMVSA-N Isosorbide Chemical compound O[C@@H]1CO[C@@H]2[C@@H](O)CO[C@@H]21 KLDXJTOLSGUMSJ-JGWLITMVSA-N 0.000 description 5
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 5
- 229960002479 isosorbide Drugs 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- 235000021355 Stearic acid Nutrition 0.000 description 4
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 4
- 229910052783 alkali metal Inorganic materials 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 4
- 239000012964 benzotriazole Substances 0.000 description 4
- FQUNFJULCYSSOP-UHFFFAOYSA-N bisoctrizole Chemical compound N1=C2C=CC=CC2=NN1C1=CC(C(C)(C)CC(C)(C)C)=CC(CC=2C(=C(C=C(C=2)C(C)(C)CC(C)(C)C)N2N=C3C=CC=CC3=N2)O)=C1O FQUNFJULCYSSOP-UHFFFAOYSA-N 0.000 description 4
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 4
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 4
- 238000007720 emulsion polymerization reaction Methods 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 4
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 4
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 239000010452 phosphate Substances 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000002685 polymerization catalyst Substances 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000007717 redox polymerization reaction Methods 0.000 description 4
- 125000003003 spiro group Chemical group 0.000 description 4
- 239000008117 stearic acid Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 4
- 238000004383 yellowing Methods 0.000 description 4
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical class CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 3
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- BPZIYBJCZRUDEG-UHFFFAOYSA-N 2-[3-(1-hydroxy-2-methylpropan-2-yl)-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropan-1-ol Chemical compound C1OC(C(C)(CO)C)OCC21COC(C(C)(C)CO)OC2 BPZIYBJCZRUDEG-UHFFFAOYSA-N 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical class OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001339 alkali metal compounds Chemical class 0.000 description 3
- 150000001341 alkaline earth metal compounds Chemical class 0.000 description 3
- AGXUVMPSUKZYDT-UHFFFAOYSA-L barium(2+);octadecanoate Chemical compound [Ba+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O AGXUVMPSUKZYDT-UHFFFAOYSA-L 0.000 description 3
- 150000004650 carbonic acid diesters Chemical class 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000010559 graft polymerization reaction Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 235000003441 saturated fatty acids Nutrition 0.000 description 3
- 150000004671 saturated fatty acids Chemical class 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 3
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 2
- PZRWFKGUFWPFID-UHFFFAOYSA-N 3,9-dioctadecoxy-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound C1OP(OCCCCCCCCCCCCCCCCCC)OCC21COP(OCCCCCCCCCCCCCCCCCC)OC2 PZRWFKGUFWPFID-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920005497 Acrypet® Polymers 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 235000021357 Behenic acid Nutrition 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 2
- GWFGDXZQZYMSMJ-UHFFFAOYSA-N Octadecansaeure-heptadecylester Natural products CCCCCCCCCCCCCCCCCOC(=O)CCCCCCCCCCCCCCCCC GWFGDXZQZYMSMJ-UHFFFAOYSA-N 0.000 description 2
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- VSVVZZQIUJXYQA-UHFFFAOYSA-N [3-(3-dodecylsulfanylpropanoyloxy)-2,2-bis(3-dodecylsulfanylpropanoyloxymethyl)propyl] 3-dodecylsulfanylpropanoate Chemical compound CCCCCCCCCCCCSCCC(=O)OCC(COC(=O)CCSCCCCCCCCCCCC)(COC(=O)CCSCCCCCCCCCCCC)COC(=O)CCSCCCCCCCCCCCC VSVVZZQIUJXYQA-UHFFFAOYSA-N 0.000 description 2
- OCKWAZCWKSMKNC-UHFFFAOYSA-N [3-octadecanoyloxy-2,2-bis(octadecanoyloxymethyl)propyl] octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(COC(=O)CCCCCCCCCCCCCCCCC)(COC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC OCKWAZCWKSMKNC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000005250 alkyl acrylate group Chemical group 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 229940116226 behenic acid Drugs 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- ZFVMWEVVKGLCIJ-UHFFFAOYSA-N bisphenol AF Chemical compound C1=CC(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C=C1 ZFVMWEVVKGLCIJ-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 2
- 235000011092 calcium acetate Nutrition 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 230000015271 coagulation Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 239000011258 core-shell material Substances 0.000 description 2
- PFURGBBHAOXLIO-UHFFFAOYSA-N cyclohexane-1,2-diol Chemical compound OC1CCCCC1O PFURGBBHAOXLIO-UHFFFAOYSA-N 0.000 description 2
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000003995 emulsifying agent Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
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- KCIDZIIHRGYJAE-YGFYJFDDSA-L dipotassium;[(2r,3r,4s,5r,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl] phosphate Chemical class [K+].[K+].OC[C@H]1O[C@H](OP([O-])([O-])=O)[C@H](O)[C@@H](O)[C@H]1O KCIDZIIHRGYJAE-YGFYJFDDSA-L 0.000 description 1
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- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
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- 239000002609 medium Substances 0.000 description 1
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- CZXGXYBOQYQXQD-UHFFFAOYSA-N methyl benzenesulfonate Chemical compound COS(=O)(=O)C1=CC=CC=C1 CZXGXYBOQYQXQD-UHFFFAOYSA-N 0.000 description 1
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- UOUSQUORIIRPFW-UHFFFAOYSA-N o-[2-tert-butyl-4-(5-tert-butyl-2-methyl-4-pentadecanethioyloxyphenyl)sulfanyl-5-methylphenyl] pentadecanethioate Chemical compound C1=C(C(C)(C)C)C(OC(=S)CCCCCCCCCCCCCC)=CC(C)=C1SC1=CC(C(C)(C)C)=C(OC(=S)CCCCCCCCCCCCCC)C=C1C UOUSQUORIIRPFW-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- LYQJBZLAANNIER-UHFFFAOYSA-N octyl 4-methylbenzenesulfonate Chemical compound CCCCCCCCOS(=O)(=O)C1=CC=C(C)C=C1 LYQJBZLAANNIER-UHFFFAOYSA-N 0.000 description 1
- GVMDZMPQYYHMSV-UHFFFAOYSA-N octyl benzenesulfonate Chemical compound CCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVMDZMPQYYHMSV-UHFFFAOYSA-N 0.000 description 1
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- QUPCNWFFTANZPX-UHFFFAOYSA-M paramenthane hydroperoxide Chemical compound [O-]O.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-M 0.000 description 1
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- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
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- KZQFPRKQBWRRHQ-UHFFFAOYSA-N phenyl 4-methylbenzenesulfonate Chemical compound C1=CC(C)=CC=C1S(=O)(=O)OC1=CC=CC=C1 KZQFPRKQBWRRHQ-UHFFFAOYSA-N 0.000 description 1
- CGEXUOTXYSGBLV-UHFFFAOYSA-N phenyl benzenesulfonate Chemical compound C=1C=CC=CC=1S(=O)(=O)OC1=CC=CC=C1 CGEXUOTXYSGBLV-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical class [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 125000005936 piperidyl group Chemical group 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 239000004300 potassium benzoate Substances 0.000 description 1
- 235000010235 potassium benzoate Nutrition 0.000 description 1
- 229940103091 potassium benzoate Drugs 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 229940114930 potassium stearate Drugs 0.000 description 1
- ANBFRLKBEIFNQU-UHFFFAOYSA-M potassium;octadecanoate Chemical compound [K+].CCCCCCCCCCCCCCCCCC([O-])=O ANBFRLKBEIFNQU-UHFFFAOYSA-M 0.000 description 1
- XRVCFZPJAHWYTB-UHFFFAOYSA-N prenderol Chemical compound CCC(CC)(CO)CO XRVCFZPJAHWYTB-UHFFFAOYSA-N 0.000 description 1
- 229950006800 prenderol Drugs 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940093625 propylene glycol monostearate Drugs 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- XWGJFPHUCFXLBL-UHFFFAOYSA-M rongalite Chemical compound [Na+].OCS([O-])=O XWGJFPHUCFXLBL-UHFFFAOYSA-M 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000012279 sodium borohydride Substances 0.000 description 1
- 229910000033 sodium borohydride Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- 229940048086 sodium pyrophosphate Drugs 0.000 description 1
- LJFWQNJLLOFIJK-UHFFFAOYSA-N solvent violet 13 Chemical compound C1=CC(C)=CC=C1NC1=CC=C(O)C2=C1C(=O)C1=CC=CC=C1C2=O LJFWQNJLLOFIJK-UHFFFAOYSA-N 0.000 description 1
- 239000001587 sorbitan monostearate Substances 0.000 description 1
- 235000011076 sorbitan monostearate Nutrition 0.000 description 1
- 229940035048 sorbitan monostearate Drugs 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 125000005402 stannate group Chemical group 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000018 strontium carbonate Inorganic materials 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- RXSHXLOMRZJCLB-UHFFFAOYSA-L strontium;diacetate Chemical compound [Sr+2].CC([O-])=O.CC([O-])=O RXSHXLOMRZJCLB-UHFFFAOYSA-L 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 150000003459 sulfonic acid esters Chemical class 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 235000019818 tetrasodium diphosphate Nutrition 0.000 description 1
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- CNUJLMSKURPSHE-UHFFFAOYSA-N trioctadecyl phosphite Chemical compound CCCCCCCCCCCCCCCCCCOP(OCCCCCCCCCCCCCCCCCC)OCCCCCCCCCCCCCCCCCC CNUJLMSKURPSHE-UHFFFAOYSA-N 0.000 description 1
- QOQNJVLFFRMJTQ-UHFFFAOYSA-N trioctyl phosphite Chemical compound CCCCCCCCOP(OCCCCCCCC)OCCCCCCCC QOQNJVLFFRMJTQ-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- DCAFJGSRSBLEPX-UHFFFAOYSA-N tris(2,3-dibutylphenyl) phosphite Chemical compound CCCCC1=CC=CC(OP(OC=2C(=C(CCCC)C=CC=2)CCCC)OC=2C(=C(CCCC)C=CC=2)CCCC)=C1CCCC DCAFJGSRSBLEPX-UHFFFAOYSA-N 0.000 description 1
- OOZKMYBQDPXENQ-UHFFFAOYSA-N tris(2,3-diethylphenyl) phosphite Chemical compound CCC1=CC=CC(OP(OC=2C(=C(CC)C=CC=2)CC)OC=2C(=C(CC)C=CC=2)CC)=C1CC OOZKMYBQDPXENQ-UHFFFAOYSA-N 0.000 description 1
- AJHKJOCIGPIJFZ-UHFFFAOYSA-N tris(2,6-ditert-butylphenyl) phosphite Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1OP(OC=1C(=CC=CC=1C(C)(C)C)C(C)(C)C)OC1=C(C(C)(C)C)C=CC=C1C(C)(C)C AJHKJOCIGPIJFZ-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- QQBLOZGVRHAYGT-UHFFFAOYSA-N tris-decyl phosphite Chemical compound CCCCCCCCCCOP(OCCCCCCCCCC)OCCCCCCCCCC QQBLOZGVRHAYGT-UHFFFAOYSA-N 0.000 description 1
- QFGXDXGDZKTYFD-UHFFFAOYSA-N tris[2,3-di(propan-2-yl)phenyl] phosphite Chemical compound CC(C)C1=CC=CC(OP(OC=2C(=C(C(C)C)C=CC=2)C(C)C)OC=2C(=C(C(C)C)C=CC=2)C(C)C)=C1C(C)C QFGXDXGDZKTYFD-UHFFFAOYSA-N 0.000 description 1
- NSBGJRFJIJFMGW-UHFFFAOYSA-N trisodium;stiborate Chemical compound [Na+].[Na+].[Na+].[O-][Sb]([O-])([O-])=O NSBGJRFJIJFMGW-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- BOXSVZNGTQTENJ-UHFFFAOYSA-L zinc dibutyldithiocarbamate Chemical compound [Zn+2].CCCCN(C([S-])=S)CCCC.CCCCN(C([S-])=S)CCCC BOXSVZNGTQTENJ-UHFFFAOYSA-L 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
本発明は、特定のポリカーボネート樹脂、メタクリル酸メチル-アクリル酸メチル共重合体、メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体およびエポキシ樹脂を含有する樹脂組成物およびその成形品に関するものである。 The present invention relates to a resin composition containing a specific polycarbonate resin, a methyl methacrylate-methyl acrylate copolymer, a methyl methacrylate-alkyl acrylate-styrene copolymer and an epoxy resin, and a molded article thereof.
従来、透明樹脂としてはメタクリル樹脂、ポリカーボネート樹脂(以下、PCと称することがある)などが知られており、成形品、フィルムやシートなどの形態で電気電子部品、光学部品、自動車部品、機械部品などの広い分野で用いられている。 Conventionally, methacrylic resins, polycarbonate resins (hereinafter sometimes referred to as PC) and the like are known as transparent resins, and are used in the form of molded articles, films, sheets, and the like for electrical and electronic parts, optical parts, automobile parts, and mechanical parts. It is used in a wide range of fields such as
ポリメチルメタクリレート(以下、PMMAと称することがある)などのメタクリル酸樹脂は、高い透明性と硬い表面硬度(鉛筆硬度H~3H)を持ち、レンズや光ファイバーなどの光学材料として多く用いられている。しかし、ガラス転移温度が100℃程度と低く、耐熱性に劣るために耐熱性を有する分野での用途が制限されている。さらに耐衝撃性が低いという問題がある。 Methacrylic acid resins such as polymethyl methacrylate (hereinafter sometimes referred to as PMMA) have high transparency and hard surface hardness (pencil hardness H to 3H), and are widely used as optical materials such as lenses and optical fibers. . However, its glass transition temperature is as low as about 100° C. and its heat resistance is poor, so its use in fields requiring heat resistance is limited. Furthermore, there is a problem that impact resistance is low.
ビスフェノールAからなるポリカーボネート樹脂は、耐熱性、耐衝撃性、難燃性、透明性に優れることから車両用途や建築用資材など広く用いられている。これらの用途の中で特に屋外で使用するものについては高い耐候性が求められるが、一般にポリカーボネート樹脂の耐候性はアクリル系樹脂等の他の透明材料と比較して優れておらず、屋外暴露によって黄変や失透が発生する。また、表面が非常にやわらかく(鉛筆硬度 4B~2B)、傷つきやすいという問題がある。 Polycarbonate resins composed of bisphenol A are widely used for vehicles and construction materials because of their excellent heat resistance, impact resistance, flame retardancy and transparency. Among these applications, high weather resistance is required, especially for those used outdoors, but polycarbonate resin generally does not have excellent weather resistance compared to other transparent materials such as acrylic resins. Yellowing and devitrification occur. In addition, there is a problem that the surface is very soft (pencil hardness 4B to 2B) and easily scratched.
PCとPMMAの混和物は本質的に非相溶であり不透明な材料を生じることが知られている。例えば、特許文献1には、PC及びPMMAの混和物が不透明で、両方のポリマーが有する物性が発現しないことが示されている。 Blends of PC and PMMA are known to be essentially incompatible and yield opaque materials. For example, Patent Document 1 discloses that a blend of PC and PMMA is opaque and does not exhibit the physical properties of both polymers.
特殊な構造を有するポリカーボネート樹脂を用いたアクリル系樹脂との樹脂組成物が報告されており(特許文献2)、優れた透明性、耐候性および表面硬度が達成されている。しかしながら、本発明者らの検討によれば、特許文献2に記載されている樹脂組成物は耐衝撃性に課題があり、シャルピー衝撃強度が低いことがわかっている。さらに、特許文献2に記載されている樹脂組成物は耐湿熱性や耐光性が顕著に劣化することがわかってきた。したがって、ポリカーボネート樹脂とアクリル系樹脂の樹脂組成物において、成形時の黄変を抑制し、透明性、表面硬度、耐衝撃性、耐湿熱性および耐光性が良好な樹脂組成物はこれまでに報告されていなかった。 A resin composition using a polycarbonate resin having a special structure and an acrylic resin has been reported (Patent Document 2), and excellent transparency, weather resistance and surface hardness have been achieved. However, according to the studies of the present inventors, it has been found that the resin composition described in Patent Document 2 has a problem in impact resistance and has a low Charpy impact strength. Furthermore, it has been found that the resin composition described in Patent Document 2 is remarkably deteriorated in wet heat resistance and light resistance. Therefore, in the resin composition of a polycarbonate resin and an acrylic resin, a resin composition that suppresses yellowing during molding and has good transparency, surface hardness, impact resistance, moist heat resistance and light resistance has been reported so far. was not
本発明の目的は、成形時の熱履歴による黄変を抑制し、透明性、表面硬度、耐衝撃性、耐湿熱性および耐光性に優れた特性を有する樹脂組成物を提供することである。 An object of the present invention is to provide a resin composition that suppresses yellowing due to heat history during molding and has excellent properties such as transparency, surface hardness, impact resistance, moist heat resistance and light resistance.
本発明者らは、鋭意研究を重ねた結果、特定のスピロ環構造を含有するポリカーボネート樹脂に、メタクリル酸メチル-アクリル酸メチル共重合体、メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体およびエポキシ樹脂を含有することで、成形時の熱履歴による黄変抑制、透明性、表面硬度、耐衝撃性、耐湿熱性および耐光性に優れた特性を有する樹脂組成物となることを究明し、本発明を完成するに至った。 As a result of extensive research, the present inventors have found that polycarbonate resins containing a specific spiro ring structure include methyl methacrylate-methyl acrylate copolymer, methyl methacrylate-alkyl acrylate-styrene copolymer and epoxy resin. By containing a resin, it was found that a resin composition having excellent properties such as suppression of yellowing due to heat history during molding, transparency, surface hardness, impact resistance, moist heat resistance and light resistance, and the present invention. was completed.
すなわち、本発明によれば、発明の課題は、下記により達成される。 That is, according to the present invention, the objects of the invention are achieved by the following.
1.繰り返し単位が下記式(1)で表される単位(a)を全繰り返し単位中5~85モル%含むポリカーボネート樹脂(A)とメタクリル酸メチル-アクリル酸メチル共重合体(B)の合計100重量部に対して、10~30重量部のメタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)および1~30重量部のエポキシ樹脂(D)を含有し、前記メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)の屈折率が1.485以上1.495以下であることを特徴とする樹脂組成物。 1. A total of 100 weights of a polycarbonate resin (A) containing 5 to 85 mol% of units (a) whose repeating units are represented by the following formula (1) and a methyl methacrylate-methyl acrylate copolymer (B) 10 to 30 parts by weight of methyl methacrylate-alkyl acrylate-styrene copolymer (C) and 1 to 30 parts by weight of epoxy resin (D), and the methyl methacrylate-alkyl acrylate - A resin composition, wherein the styrene copolymer (C) has a refractive index of 1.485 or more and 1.495 or less.
(式中、Wは炭素数1~20のアルキレン基または炭素数6~20のシクロアルキレン基を表し、Rは炭素数1~20の分岐または直鎖のアルキル基、もしくは置換基を有してもよい炭素数6~20のシクロアルキル基を表し、mは0~10の整数を示す。) (Wherein, W represents an alkylene group having 1 to 20 carbon atoms or a cycloalkylene group having 6 to 20 carbon atoms, and R is a branched or linear alkyl group having 1 to 20 carbon atoms, or having a substituent represents a cycloalkyl group having 6 to 20 carbon atoms, and m is an integer of 0 to 10.)
2.ポリカーボネート樹脂(A)は、繰り返し単位が前記式(1)で表されるカーボネート単位(a)と他のカーボネート単位(b)とからなり、カーボネート単位(b)は、脂肪族ジオール化合物、脂環族ジオール化合物および芳香族ジヒドロキシ化合物からなる群より選ばれる少なくとも1種の化合物より誘導されるカーボネート単位(b)である前項1記載の樹脂組成物。 2. The polycarbonate resin (A) consists of a carbonate unit (a) whose repeating unit is represented by the formula (1) and another carbonate unit (b), and the carbonate unit (b) is an aliphatic diol compound, an alicyclic 2. The resin composition according to the preceding item 1, wherein the carbonate unit (b) is derived from at least one compound selected from the group consisting of diol compounds and aromatic dihydroxy compounds.
3.ポリカーボネート樹脂(A)とメタクリル酸メチル-アクリル酸メチル共重合体(B)との重量比が50:50~99:1である前項1または2に記載の樹脂組成物。 3. 3. The resin composition according to item 1 or 2, wherein the weight ratio of the polycarbonate resin (A) and the methyl methacrylate-methyl acrylate copolymer (B) is 50:50 to 99:1.
4.メタクリル酸メチル-アクリル酸メチル共重合体(B)がメタクリル酸メチルから誘導された繰り返し単位を40~100モル%含む前項1~3のいずれかに記載の樹脂組成物。 4. 4. The resin composition according to any one of 1 to 3 above, wherein the methyl methacrylate-methyl acrylate copolymer (B) contains 40 to 100 mol % of repeating units derived from methyl methacrylate.
5.エポキシ樹脂(D)の分子量が3000~20000である、前項1~4のいずれかに記載の樹脂組成物。 5. 5. The resin composition according to any one of 1 to 4 above, wherein the epoxy resin (D) has a molecular weight of 3,000 to 20,000.
6.2mm厚の試験片のヘイズが10%以下である前項1~5のいずれかに記載の樹脂組成物。 6. The resin composition according to any one of 1 to 5 above, wherein a test piece having a thickness of 6.2 mm has a haze of 10% or less.
7.前項1~6のいずれかに記載の樹脂組成物を成形して得られる成形品。 7. A molded article obtained by molding the resin composition according to any one of 1 to 6 above.
8.前項1~6のいずれかに記載の樹脂組成物から形成されるフィルムまたはシート。 8. A film or sheet formed from the resin composition according to any one of the preceding Items 1 to 6.
本発明は、特定のスピロ環構造を含有するポリカーボネート樹脂とメタクリル酸メチル-アクリル酸メチル共重合体との組成物に、メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)およびエポキシ樹脂(D)を含有することで、透明性、表面硬度、耐衝撃性、耐湿熱性および耐光性に優れた特性を有する樹脂組成物を提供することが可能となった。そのため、その奏する工業的効果は格別である。 The present invention provides a composition of a polycarbonate resin containing a specific spiro ring structure and a methyl methacrylate-methyl acrylate copolymer, a methyl methacrylate-alkyl acrylate-styrene copolymer (C) and an epoxy resin ( By including D), it has become possible to provide a resin composition having excellent properties such as transparency, surface hardness, impact resistance, moist heat resistance and light resistance. Therefore, its industrial effect is exceptional.
以下、本発明を詳細に説明する。 The present invention will be described in detail below.
(ポリカーボネート樹脂)
本発明の樹脂組成物に使用されるポリカーボネート樹脂は、繰り返し単位が下記式(1)で表されるカーボネート単位(a)を全繰り返し単位中5~85モル%含むポリカーボネート樹脂(A)である。
(polycarbonate resin)
The polycarbonate resin used in the resin composition of the present invention is a polycarbonate resin (A) containing 5 to 85 mol % of carbonate units (a) whose repeating units are represented by the following formula (1) in all repeating units.
(式中、Wは炭素数1~20のアルキレン基または炭素数6~20のシクロアルキレン基を表し、Rは炭素数1~20の分岐または直鎖のアルキル基、もしくは置換基を有してもよい炭素数6~20のシクロアルキル基を表し、mは0~10の整数を示す。) (Wherein, W represents an alkylene group having 1 to 20 carbon atoms or a cycloalkylene group having 6 to 20 carbon atoms, and R is a branched or linear alkyl group having 1 to 20 carbon atoms, or having a substituent represents a cycloalkyl group having 6 to 20 carbon atoms, and m is an integer of 0 to 10.)
上記式(1)で表される単位(a)は、スピロ環構造を有するジオールから誘導されるものである。かかるスピロ環構造を有するジオール化合物として、3,9―ビス(2ーヒドロキシエチル)-2,4,8,10-テトラオキサスピロ(5.5)ウンデカン、3,9-ビス(2-ヒドロキシ-1,1-ジメチルエチル)-2,4,8,10-テトラオキサスピロ(5.5)ウンデカン、3,9-ビス(2-ヒドロキシ-1,1-ジエチルエチル)-2,4,8,10-テトラオキサスピロ(5.5)ウンデカン、3,9-ビス(2-ヒドロキシ-1,1-ジプロピルエチル)-2,4,8,10-テトラオキサスピロ(5.5)ウンデカンなどの脂環式ジオール化合物が挙げられる。 The unit (a) represented by formula (1) above is derived from a diol having a spiro ring structure. Examples of diol compounds having such a spiro ring structure include 3,9-bis(2-hydroxyethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, 3,9-bis(2-hydroxy- 1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, 3,9-bis(2-hydroxy-1,1-diethylethyl)-2,4,8, 10-tetraoxaspiro(5.5)undecane, 3,9-bis(2-hydroxy-1,1-dipropylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane, etc. Alicyclic diol compounds are mentioned.
好ましくは、3,9-ビス(2-ヒドロキシ-1,1-ジメチルエチル)-2,4,8,10-テトラオキサスピロ(5.5)ウンデカンが用いられる。 Preferably, 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5.5)undecane is used.
本発明の樹脂組成物に使用されるポリカーボネート樹脂は、繰り返し単位が上記式(1)で表される単位(a)を全繰り返し単位中5~85モル%含み、10~80モル%含むことが好ましく、15~75モル%含むことがより好ましく、20~70モル%含むことがさらに好ましい。単位(a)が上記範囲内であると、アクリル系樹脂との樹脂組成物における押出時や成形時に相分離して樹脂組成物が白濁することがなく、また、ポリカーボネート樹脂の重合時に結晶化することなく重合が容易であり好ましい。 The polycarbonate resin used in the resin composition of the present invention contains 5 to 85 mol% of the repeating unit (a) represented by the above formula (1) in the total repeating units, and may contain 10 to 80 mol%. Preferably, it is contained in an amount of 15 to 75 mol%, more preferably 20 to 70 mol%. When the unit (a) is within the above range, the resin composition does not become cloudy due to phase separation during extrusion or molding of the resin composition with the acrylic resin, and crystallizes during polymerization of the polycarbonate resin. It is preferable because polymerization is easy without
本発明の樹脂組成物に使用されるポリカーボネート樹脂は、上記式(1)で表される単位(a)を含み、他のカーボネート単位(b)との共重合体として使用される。 The polycarbonate resin used in the resin composition of the present invention contains units (a) represented by the above formula (1) and is used as a copolymer with other carbonate units (b).
カーボネート単位(b)は、脂肪族ジオール化合物、脂環族ジオール化合物および芳香族ジヒドロキシ化合物からなる群より選ばれる少なくとも1種の化合物より誘導されるカーボネート単位(b)であることが好ましい。また、カーボネート単位(b)は、表面硬度や耐候性の面から脂肪族ジオール化合物および脂環族ジオール化合物からなる群より選ばれる少なくとも1種の化合物より誘導されるカーボネート単位(b)であることが好ましい。 The carbonate unit (b) is preferably a carbonate unit (b) derived from at least one compound selected from the group consisting of aliphatic diol compounds, alicyclic diol compounds and aromatic dihydroxy compounds. Further, the carbonate unit (b) is a carbonate unit (b) derived from at least one compound selected from the group consisting of aliphatic diol compounds and alicyclic diol compounds in terms of surface hardness and weather resistance. is preferred.
脂肪族ジオール化合物としては、1,3-プロパンジオール、1,4-ブタンジオール、1,5-ペンタンジオール、1,6-ヘキサンジオール、1,8-オクタンジオール、1.9-ノナンジオール、1,10-デカンジオール、1,12-ドデカンジオール、2-メチル-1,3-プロパンジオール、ネオペンチルグリコール、3-メチル-1,5-ペンタンジオール、2-n-ブチル-2-エチル-1,3-プロパンジオール、2,2-ジエチル-1,3-プロパンジオール、2,4-ジエチル-1,5-ペンタンジオール、1,2-ヘキサングリコール、1,2-オクチルグリコール、2-エチル-1,3-ヘキサンジオール、2,3-ジイソブチル-1,3-プロパンジオール、2,2-ジイソアミル-1,3-プロパンジオール、2-メチル-2-プロピル-1,3-プロパンジオールなどが挙げられ、1,8-オクタンジオール、1.9-ノナンジオール、1,10-デカンジオール、1,12-ドデカンジオールが好ましく使用される。 Aliphatic diol compounds include 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1.9-nonanediol, 1 , 10-decanediol, 1,12-dodecanediol, 2-methyl-1,3-propanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-n-butyl-2-ethyl-1 ,3-propanediol, 2,2-diethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexane glycol, 1,2-octyl glycol, 2-ethyl- 1,3-hexanediol, 2,3-diisobutyl-1,3-propanediol, 2,2-diisoamyl-1,3-propanediol, 2-methyl-2-propyl-1,3-propanediol, etc. 1,8-octanediol, 1.9-nonanediol, 1,10-decanediol and 1,12-dodecanediol are preferably used.
脂環式ジオール化合物としては、1,2-シクロヘキサンジオール、1,3-シクロヘキサンジオール、1,4-シクロヘキサンジオール、2-メチル-1,4-シクロヘキサンジオールなどのシクロヘキサンジオール類、1,2-シクロヘキサンジメタノール、1,3-シクロヘキサンジメタノール、1,4-シクロヘキサンジメタノールなどのシクロヘキサンジメタノール類、2,3-ノルボルナンジメタノール、2,5-ノルボルナンジメタノールなどのノルボルナンジメタノール類、トリシクロデカンジメタノール、ペンタシクロペンタデカンジメタノール、1,3-アダマンタンジオール、2,2-アダマンタンジオール、デカリンジメタノール、2,2,4,4-テトラメチル-1,3-シクロブタンジオール、イソソルビドなどが挙げられ、シクロヘキサンジメタノール類、イソソルビドが好ましく使用される。 Alicyclic diol compounds include cyclohexanediols such as 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, 2-methyl-1,4-cyclohexanediol, and 1,2-cyclohexane cyclohexanedimethanols such as dimethanol, 1,3-cyclohexanedimethanol and 1,4-cyclohexanedimethanol; norbornanedimethanols such as 2,3-norbornanedimethanol and 2,5-norbornanedimethanol; candimethanol, pentacyclopentadecanedimethanol, 1,3-adamantanediol, 2,2-adamantanediol, decalindimethanol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, isosorbide and the like. , cyclohexanedimethanols and isosorbide are preferably used.
芳香族ジヒドロキシ化合物としては、α,α’-ビス(4-ヒドロキシフェニル)-m-ジイソプロピルベンゼン(ビスフェノールM)、9,9-ビス(4-ヒドロキシ-3-メチルフェニル)フルオレン、1,1-ビス(4-ヒドロキシフェニル)シクロヘキサン、1,1-ビス(4-ヒドロキシフェニル)-3,3,5-トリメチルシクロヘキサン、4,4’-ジヒドロキシ-3,3’-ジメチルジフェニルスルフィド、ビスフェノールA、2,2-ビス(4-ヒドロキシ-3-メチルフェニル)プロパン(ビスフェノールC)、2,2-ビス(4-ヒドロキシフェニル)-1,1,1,3,3,3-ヘキサフルオロプロパン(ビスフェノールAF)、および1,1-ビス(4-ヒドロキシフェニル)デカンなどが挙げられ、ビスフェノールAが好ましく使用される。 Examples of aromatic dihydroxy compounds include α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene (bisphenol M), 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 1,1- bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfide, bisphenol A, 2 , 2-bis(4-hydroxy-3-methylphenyl)propane (bisphenol C), 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane (bisphenol AF ), and 1,1-bis(4-hydroxyphenyl)decane, and bisphenol A is preferably used.
カーボネート単位(b)は、全繰り返し単位中15~95モル%含むことが好ましく、20~90モル%含むことがより好ましく、25~85モル%含むことがさらに好ましく、30~80モル%含むことが特に好ましい。単位(b)が上記範囲内であると、より透明性、表面硬度および耐衝撃性のバランスに優れた樹脂組成物が得られる。 Carbonate unit (b) preferably contains 15 to 95 mol% of all repeating units, more preferably 20 to 90 mol%, more preferably 25 to 85 mol%, and 30 to 80 mol%. is particularly preferred. When the unit (b) is within the above range, a resin composition having a more excellent balance of transparency, surface hardness and impact resistance can be obtained.
(ポリカーボネート樹脂の製造方法)
ポリカーボネート樹脂は、通常のポリカーボネート樹脂を製造するそれ自体公知の反応手段、例えばジオール成分に炭酸ジエステルなどのカーボネート前駆物質を反応させる方法により製造される。次にこれらの製造方法について基本的な手段を簡単に説明する。
(Method for producing polycarbonate resin)
The polycarbonate resin is produced by a reaction means known per se for producing ordinary polycarbonate resins, for example, a method of reacting a diol component with a carbonate precursor such as a diester carbonate. Next, the basic means of these manufacturing methods will be briefly described.
カーボネート前駆物質として炭酸ジエステルを用いるエステル交換反応は、不活性ガス雰囲気下所定割合のジオール成分を炭酸ジエステルと加熱しながら撹拌して、生成するアルコールまたはフェノール類を留出させる方法により行われる。反応温度は生成するアルコールまたはフェノール類の沸点などにより異なるが、通常120~300℃の範囲である。反応はその初期から減圧にして生成するアルコールまたはフェノール類を留出させながら反応を完結させる。また、必要に応じて末端停止剤、酸化防止剤等を加えてもよい。 The transesterification reaction using a carbonic acid diester as a carbonate precursor is carried out by a method in which a predetermined proportion of the diol component and the carbonic acid diester are heated and stirred under an inert gas atmosphere to distill off the resulting alcohol or phenol. Although the reaction temperature varies depending on the boiling point of the alcohol or phenol to be produced, it is usually in the range of 120 to 300°C. The reaction is completed under reduced pressure from the initial stage while the alcohol or phenols produced are distilled off. Moreover, you may add a terminal terminator, an antioxidant, etc. as needed.
前記エステル交換反応に使用される炭酸ジエステルとしては、置換されてもよい炭素数6~12のアリール基、アラルキル基等のエステルが挙げられる。具体的には、ジフェニルカーボネート、ジトリールカーボネート、ビス(クロロフェニル)カーボネートおよびm-クレジルカーボネート等が例示される。なかでもジフェニルカーボネートが特に好ましい。ジフェニルカーボネートの使用量は、ジヒドロキシ化合物の合計1モルに対して、好ましくは0.97~1.10モル、より好ましくは1.00~1.06モルである。 Carbonic acid diesters used in the transesterification reaction include esters such as optionally substituted aryl groups and aralkyl groups having 6 to 12 carbon atoms. Specific examples include diphenyl carbonate, ditolyl carbonate, bis(chlorophenyl) carbonate and m-cresyl carbonate. Among them, diphenyl carbonate is particularly preferred. The amount of diphenyl carbonate to be used is preferably 0.97-1.10 mol, more preferably 1.00-1.06 mol, per 1 mol of the total dihydroxy compound.
また溶融重合法においては重合速度を速めるために、重合触媒を用いることができ、かかる重合触媒としては、アルカリ金属化合物、アルカリ土類金属化合物、含窒素化合物、金属化合物等が挙げられる。 In the melt polymerization method, a polymerization catalyst can be used in order to increase the polymerization rate, and examples of such polymerization catalysts include alkali metal compounds, alkaline earth metal compounds, nitrogen-containing compounds, and metal compounds.
このような化合物としては、アルカリ金属やアルカリ土類金属の、有機酸塩、無機塩、酸化物、水酸化物、水素化物、アルコキシド、4級アンモニウムヒドロキシド等が好ましく用いられ、これらの化合物は単独もしくは組み合わせて用いることができる。 As such compounds, organic acid salts, inorganic salts, oxides, hydroxides, hydrides, alkoxides, quaternary ammonium hydroxides, etc. of alkali metals and alkaline earth metals are preferably used. They can be used singly or in combination.
アルカリ金属化合物としては、水酸化ナトリウム、水酸化カリウム、水酸化セシウム、水酸化リチウム、炭酸水素ナトリウム、炭酸ナトリウム、炭酸カリウム、炭酸セシウム、炭酸リチウム、酢酸ナトリウム、酢酸カリウム、酢酸セシウム、酢酸リチウム、ステアリン酸ナトリウム、ステアリン酸カリウム、ステアリン酸セシウム、ステアリン酸リチウム、水素化ホウ素ナトリウム、安息香酸ナトリウム、安息香酸カリウム、安息香酸セシウム、安息香酸リチウム、リン酸水素2ナトリウム、リン酸水素2カリウム、リン酸水素2リチウム、フェニルリン酸2ナトリウム、ビスフェノールAの2ナトリウム塩、2カリウム塩、2セシウム塩、2リチウム塩、フェノールのナトリウム塩、カリウム塩、セシウム塩、リチウム塩等が例示される。 Alkali metal compounds include sodium hydroxide, potassium hydroxide, cesium hydroxide, lithium hydroxide, sodium hydrogen carbonate, sodium carbonate, potassium carbonate, cesium carbonate, lithium carbonate, sodium acetate, potassium acetate, cesium acetate, lithium acetate, Sodium Stearate, Potassium Stearate, Cesium Stearate, Lithium Stearate, Sodium Borohydride, Sodium Benzoate, Potassium Benzoate, Cesium Benzoate, Lithium Benzoate, Disodium Hydrogen Phosphate, Dipotassium Hydrogen Phosphate, Phosphorus Dilithium oxyhydrogen, disodium phenylphosphate, disodium salt, dipotassium salt, dicesium salt, dilithium salt of bisphenol A, sodium salt, potassium salt, cesium salt, lithium salt of phenol and the like are exemplified.
アルカリ土類金属化合物としては、水酸化マグネシウム、水酸化カルシウム、水酸化ストロンチウム、水酸化バリウム、炭酸マグネシウム、炭酸カルシウム、炭酸ストロンチウム、炭酸バリウム、二酢酸マグネシウム、二酢酸カルシウム、二酢酸ストロンチウム、二酢酸バリウム、ステアリン酸バリウム等が例示される。 Alkaline earth metal compounds include magnesium hydroxide, calcium hydroxide, strontium hydroxide, barium hydroxide, magnesium carbonate, calcium carbonate, strontium carbonate, barium carbonate, magnesium diacetate, calcium diacetate, strontium diacetate, diacetic acid. Barium, barium stearate and the like are exemplified.
含窒素化合物としては、テトラメチルアンモニウムヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラプロピルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、トリメチルベンジルアンモニウムヒドロキシド等のアルキル、アリール基等を有する4級アンモニウムヒドロキシド類が挙げられる。また、トリエチルアミン、ジメチルベンジルアミン、トリフェニルアミン等の3級アミン類、2-メチルイミダゾール、2-フェニルイミダゾール、ベンゾイミダゾール等のイミダゾール類が挙げられる。また、アンモニア、テトラメチルアンモニウムボロハイドライド、テトラブチルアンモニウムボロハイドライド、テトラブチルアンモニウムテトラフェニルボレート、テトラフェニルアンモニウムテトラフェニルボレート等の塩基あるいは塩基性塩等が例示される。 Examples of nitrogen-containing compounds include quaternary ammonium hydroxides having an alkyl or aryl group such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrapropylammonium hydroxide, tetrabutylammonium hydroxide, and trimethylbenzylammonium hydroxide. mentioned. Also included are tertiary amines such as triethylamine, dimethylbenzylamine and triphenylamine, and imidazoles such as 2-methylimidazole, 2-phenylimidazole and benzimidazole. Further examples include bases or basic salts such as ammonia, tetramethylammonium borohydride, tetrabutylammonium borohydride, tetrabutylammonium tetraphenylborate, tetraphenylammonium tetraphenylborate and the like.
金属化合物としては亜鉛アルミニウム化合物、ゲルマニウム化合物、有機スズ化合物、アンチモン化合物、マンガン化合物、チタン化合物、ジルコニウム化合物等が例示される
。これらの化合物は1種または2種以上併用してもよい。
Examples of metal compounds include zinc aluminum compounds, germanium compounds, organic tin compounds, antimony compounds, manganese compounds, titanium compounds, zirconium compounds and the like. These compounds may be used alone or in combination of two or more.
これらの重合触媒の使用量は、ジオール成分1モルに対し好ましくは1×10-9~1×10-2当量、好ましくは1×10-8~1×10-5当量、より好ましくは1×10-7~1×10-3当量の範囲で選ばれる。 The amount of these polymerization catalysts used is preferably 1×10 −9 to 1×10 −2 equivalents, preferably 1×10 −8 to 1×10 −5 equivalents, more preferably 1×10 −9 equivalents, per 1 mol of the diol component. It is selected in the range of 10 −7 to 1×10 −3 equivalents.
また、反応後期に触媒失活剤を添加することもできる。使用する触媒失活剤としては、公知の触媒失活剤が有効に使用されるが、この中でもスルホン酸のアンモニウム塩、ホスホニウム塩が好ましい。更にドデシルベンゼンスルホン酸テトラブチルホスホニウム塩等のドデシルベンゼンスルホン酸の塩類、パラトルエンスルホン酸テトラブチルアンモニウム塩等のパラトルエンスルホン酸の塩類が好ましい。 Also, a catalyst deactivator can be added in the latter stage of the reaction. As the catalyst deactivator to be used, known catalyst deactivators are effectively used, and among these, ammonium salts and phosphonium salts of sulfonic acid are preferable. Further preferred are salts of dodecylbenzenesulfonic acid such as tetrabutylphosphonium dodecylbenzenesulfonate and salts of p-toluenesulfonic acid such as tetrabutylammonium p-toluenesulfonate.
またスルホン酸のエステルとして、ベンゼンスルホン酸メチル、ベンゼンスルホン酸エチル、ベンゼンスルホン酸ブチル、ベンゼンスルホン酸オクチル、ベンゼンスルホン酸フェニル、パラトルエンスルホン酸メチル、パラトルエンスルホン酸エチル、パラトルエンスルホン酸ブチル、パラトルエンスルホン酸オクチル、パラトルエンスルホン酸フェニル等が好ましく用いられる。なかでも、ドデシルベンゼンスルホン酸テトラブチルホスホニウム塩が最も好ましく使用される。 Examples of sulfonic acid esters include methyl benzenesulfonate, ethyl benzenesulfonate, butyl benzenesulfonate, octyl benzenesulfonate, phenyl benzenesulfonate, methyl p-toluenesulfonate, ethyl p-toluenesulfonate, butyl p-toluenesulfonate, Octyl p-toluenesulfonate, phenyl p-toluenesulfonate and the like are preferably used. Among them, dodecylbenzenesulfonic acid tetrabutylphosphonium salt is most preferably used.
これらの触媒失活剤の使用量はアルカリ金属化合物および/またはアルカリ土類金属化合物より選ばれた少なくとも1種の重合触媒を用いた場合、その触媒1モル当たり好ましくは0.5~50モルの割合で、より好ましくは0.5~10モルの割合で、更に好ましくは0.8~5モルの割合で使用することができる。 When at least one polymerization catalyst selected from alkali metal compounds and/or alkaline earth metal compounds is used, the amount of these catalyst deactivators used is preferably 0.5 to 50 mol per 1 mol of the catalyst. It can be used in a proportion, more preferably in a proportion of 0.5 to 10 mol, still more preferably in a proportion of 0.8 to 5 mol.
(比粘度:ηSP)
本発明の樹脂組成物に使用されるポリカーボネート樹脂の比粘度(ηSP)は、0.2~1.5が好ましい。比粘度が0.2~1.5の範囲では成形品の強度及び成形加工性がより良好となる。より好ましくは0.25~1.0であり、さらに好ましくは0.3~0.7であり、特に好ましくは0.3~0.5である。
(Specific viscosity: η SP )
The specific viscosity (η SP ) of the polycarbonate resin used in the resin composition of the present invention is preferably 0.2 to 1.5. When the specific viscosity is in the range of 0.2 to 1.5, the strength and moldability of the molded product are improved. It is more preferably 0.25 to 1.0, still more preferably 0.3 to 0.7, and particularly preferably 0.3 to 0.5.
本発明でいう比粘度は、20℃で塩化メチレン100mlにポリカーボネート樹脂0.7gを溶解した溶液からオストワルド粘度計を用いて求めたものである。
比粘度(ηSP)=(t-t0)/t0
[t0は塩化メチレンの落下秒数、tは試料溶液の落下秒数]
The specific viscosity referred to in the present invention is obtained by using an Ostwald viscometer from a solution of 0.7 g of a polycarbonate resin dissolved in 100 ml of methylene chloride at 20°C.
Specific viscosity (η SP ) = (tt 0 )/t 0
[t 0 is the number of seconds the methylene chloride falls, t is the number of seconds the sample solution falls]
なお、具体的な比粘度の測定としては、例えば次の要領で行うことができる。まず、ポリカーボネート樹脂をその20~30倍重量の塩化メチレンに溶解し、可溶分をセライト濾過により採取した後、溶液を除去して十分に乾燥し、塩化メチレン可溶分の固体を得る。かかる固体0.7gを塩化メチレン100mlに溶解した溶液から20℃における比粘度を、オストワルド粘度計を用いて求める。 In addition, as a specific measurement of specific viscosity, for example, it can be performed in the following manner. First, the polycarbonate resin is dissolved in 20 to 30 times its weight of methylene chloride, and the soluble matter is collected by celite filtration, then the solution is removed and sufficiently dried to obtain a methylene chloride soluble solid matter. The specific viscosity at 20° C. of a solution obtained by dissolving 0.7 g of this solid in 100 ml of methylene chloride is determined using an Ostwald viscometer.
(メタクリル酸メチル-アクリル酸メチル共重合体)
本発明の樹脂組成物に使用されるアクリル系樹脂としては、熱可塑性樹脂としてのアクリル系樹脂であるメタクリル酸メチル-アクリル酸メチル共重合体(B)が使用される。
(Methyl methacrylate-methyl acrylate copolymer)
As the acrylic resin used in the resin composition of the present invention, a methyl methacrylate-methyl acrylate copolymer (B), which is an acrylic resin as a thermoplastic resin, is used.
また、メタクリル酸メチル、アクリル酸メチル以外の単量体も使用することができ、共重合に使用される単量体として以下の化合物が挙げられる。例えば、メタクリル酸、アクリル酸、ベンジル(メタ)アクリレート、n-ブチル(メタ)アクリレート、i-ブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、ラウリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ステ
アリル(メタ)アクリレート、グリシジル(メタ)アクリレート、ヒドロキシプロピル(メタ)アクリレート、2-メトキシエチル(メタ)アクリレート、2-エトキシエチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ノルボルニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニルオキシエチル(メタ)アクリレート、テトラヒドロフルフリル(メタ)アクリレート、アクリル(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、コハク酸2-(メタ)アクロイルオキシエチル、マレイン酸2-(メタ)アクロイルオキシエチル、フタル酸2-(メタ)アクロイルオキシエチル、ヘキサヒドロフタル酸2-(メタ)アクリオイルオキシエチル、ペンタメチルピペリジル(メタ)アクリレート、テトラメチルピペリジル(メタ)アクリレート、ジメチルアミノエチル(メタ)アクリレート、ジエチルアミノエチル(メタ)アクリレート、シクロペンチルメタクリレート、シクロペンチルアクリレート、シクロヘキシルメタクリレート、シクロヘキシルアクリレート、シクロヘプチルメタクリレート、シクロヘプチルアクリレート、シクロオクチルメタクリレート、シクロオクチルアクリレート、シクロドデシルメタクリレート、シクロドデシルアクリレート等が例示される。また、これらのアクリル系単量体と重合されうる他の単量体、例えばポリオレフィン系単量体、ビニル系単量体等(ただし、スチレンは除く)を併用してもよい。これらは、2種類以上を重合して使用してもよい。
Monomers other than methyl methacrylate and methyl acrylate can also be used, and examples of monomers used for copolymerization include the following compounds. For example, methacrylic acid, acrylic acid, benzyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate Acrylate, tridecyl (meth)acrylate, stearyl (meth)acrylate, glycidyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, cyclohexyl (meth)acrylate , isobornyl (meth)acrylate, norbornyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, acrylic ( meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, 2-(meth)acryloyloxyethyl maleate, 2-(meth)acryloyloxyethyl phthalate, hexa 2-(meth)acryloyloxyethyl hydrophthalate, pentamethylpiperidyl (meth)acrylate, tetramethylpiperidyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, cyclopentyl methacrylate, cyclopentyl acrylate, Examples include cyclohexyl methacrylate, cyclohexyl acrylate, cycloheptyl methacrylate, cycloheptyl acrylate, cyclooctyl methacrylate, cyclooctyl acrylate, cyclododecyl methacrylate, cyclododecyl acrylate and the like. In addition, other monomers that can be polymerized with these acrylic monomers, such as polyolefin monomers and vinyl monomers (excluding styrene), may be used in combination. These may be used by polymerizing two or more kinds.
メタクリル酸メチル-アクリル酸メチル共重合体(B)は、モノマー成分として、メタクリル酸メチルを40~100mol%含むことが好ましく、50~100mol%含むことがより好ましく、60~99mol%含むことがさらに好ましい。モノマー成分としてメタクリル酸メチルの割合が上記範囲内の場合、耐熱分解性に優れ、成形時にシルバー等の成形不良が発生し難くなり、且つ熱変形温度が良好となる。 The methyl methacrylate-methyl acrylate copolymer (B) preferably contains 40 to 100 mol%, more preferably 50 to 100 mol%, more preferably 60 to 99 mol% of methyl methacrylate as a monomer component. preferable. When the ratio of methyl methacrylate as a monomer component is within the above range, the heat decomposition resistance is excellent, molding defects such as silver are less likely to occur during molding, and the heat distortion temperature is favorable.
前記メタクリル酸メチル-アクリル酸メチル共重合体の分子量は特に限定されるものではないが、重量平均分子量で3万以上、30万以下の範囲であれば、組成物として成形する際に流れムラ等の外観不良を生じることがなく、機械特性、耐熱性に優れた組成物を提供することができる。 The molecular weight of the methyl methacrylate-methyl acrylate copolymer is not particularly limited. It is possible to provide a composition excellent in mechanical properties and heat resistance without causing poor appearance.
本発明の樹脂組成物に使用されるアクリル系樹脂は、比粘度が0.12~0.55の範囲にあることが好ましい。比粘度が0.12未満では成形品が脆くなることがある。比粘度が0.55より高くなると、樹脂の溶融粘度が高くなり成形性に劣ることがある。 The acrylic resin used in the resin composition of the present invention preferably has a specific viscosity in the range of 0.12 to 0.55. If the specific viscosity is less than 0.12, the molded product may become brittle. When the specific viscosity is higher than 0.55, the melt viscosity of the resin becomes high and the moldability may deteriorate.
(メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体)
本発明の樹脂組成物はメタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)を衝撃改質剤として含有する。メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体は、ゴム状重合体であるコアと、ゴム状重合体へグラフト重合することにより得られるシェルからなるコアシェル型であることが好ましい。メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体のコアシェル型の衝撃改質剤を用いることで、ポリカーボネートへの分散性が良好となり、高い衝撃強度や良好な耐光性が得られる傾向にある。
(Methyl methacrylate-alkyl acrylate-styrene copolymer)
The resin composition of the present invention contains a methyl methacrylate-alkyl acrylate-styrene copolymer (C) as an impact modifier. The methyl methacrylate-alkyl acrylate-styrene copolymer is preferably of a core-shell type consisting of a core that is a rubber-like polymer and a shell obtained by graft polymerization to the rubber-like polymer. By using a core-shell type impact modifier of methyl methacrylate-alkyl acrylate-styrene copolymer, dispersibility in polycarbonate is improved, and high impact strength and good light resistance tend to be obtained.
衝撃改質剤の平均粒子径は、5~500nmであることが好ましい。より好ましくは7~300nmであり、さらに好ましくは9~200nm、最も好ましくは10~180nmである。平均粒子径が5nm以上になるとより十分な衝撃強度が得られる。また、平均粒子径が500nm以下であると得られる樹脂組成物の透明性により優れる。なお、平均粒子径はゴム状重合体、およびグラフト共重合体のラテックス状態で測定する。測定装置として、日機装株式会製のMICROTRAC UPA150を用いて体積平均粒子径を測定できる。 The average particle size of the impact modifier is preferably 5-500 nm. It is more preferably 7 to 300 nm, still more preferably 9 to 200 nm, and most preferably 10 to 180 nm. When the average particle size is 5 nm or more, sufficient impact strength can be obtained. Moreover, when the average particle size is 500 nm or less, the obtained resin composition is more excellent in transparency. Incidentally, the average particle size is measured in the latex state of the rubber-like polymer and the graft copolymer. As a measuring device, MICROTRAC UPA150 manufactured by Nikkiso Co., Ltd. can be used to measure the volume average particle size.
衝撃改質剤のコアに相当するゴム状重合体としては、メタクリル酸メチル-アクリル酸アルキル共重合体を含むことが、本発明の樹脂組成物の透明性および耐衝撃強度を両立できること、さらには原料コストの観点から好ましい。 The rubber-like polymer corresponding to the core of the impact modifier contains a methyl methacrylate-alkyl acrylate copolymer, so that both transparency and impact resistance of the resin composition of the present invention can be achieved. It is preferable from the viewpoint of raw material cost.
アクリル酸アルキル具体例としては、アクリル酸エチル、アクリル酸ブチル、アクリル酸2-エチルヘキシル等が挙げられる。 Specific examples of alkyl acrylates include ethyl acrylate, butyl acrylate and 2-ethylhexyl acrylate.
また、メタクリル酸メチル、アクリル酸アルキル以外の単量体も使用することができ、共重合に使用される単量体として、例えば、アクリル酸、メタクリル酸、メタクリル酸エチル、メタクリル酸ブチル、メタクリル酸2-ヒドロキシエチル、メタクリル酸グリシジル等が挙げられる。 Monomers other than methyl methacrylate and alkyl acrylate can also be used, and examples of monomers used for copolymerization include acrylic acid, methacrylic acid, ethyl methacrylate, butyl methacrylate, methacrylic acid 2-hydroxyethyl, glycidyl methacrylate and the like.
ゴム状重合体のガラス転移温度(Tg)は0℃以下であることが耐衝撃改良の点から好ましい。より好ましくは-20℃以下であり、さらに好ましくは-40℃以下である。 The glass transition temperature (Tg) of the rubber-like polymer is preferably 0° C. or lower from the viewpoint of impact resistance improvement. It is more preferably -20°C or lower, still more preferably -40°C or lower.
メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)のシェル部は、スチレン重合体を含むことが好ましい。スチレン以外の単量体も使用することができ、α-メチルスチレンなどの芳香族ビニル化合物、アクリロニトリル、メタクリロニトリルなどのシアン化ビニル化合物、が好ましく、アクリル酸、メタクリル酸、炭素数1~12のアルキルエステルを有するアクリル酸エステルおよびメタクリル酸エステルなどの不飽和カルボン酸や不飽和カルボン酸エステル等が挙げられる。シェル部は、上述した単量体でグラフト重合することにより形成することができる。 The shell portion of the methyl methacrylate-alkyl acrylate-styrene copolymer (C) preferably contains a styrene polymer. Monomers other than styrene can also be used, and aromatic vinyl compounds such as α-methylstyrene, vinyl cyanide compounds such as acrylonitrile and methacrylonitrile, are preferred. unsaturated carboxylic acids such as acrylic acid esters and methacrylic acid esters having alkyl esters of , unsaturated carboxylic acid esters, and the like. The shell portion can be formed by graft polymerizing the monomers described above.
さらに衝撃改質剤には、グラフト部にエポキシ基、ヒドロキシ基、カルボキシ基、アルコキシ基、イソシアナート基、酸無水物基、酸塩化物基から選ばれる1種または2種以上の反応性基を導入することができる。これにより、反応性基を含まないゴムグラフト共重合体を用いた場合に比べ、分散性や耐衝撃性を向上させられることがある。 Furthermore, the impact modifier has one or more reactive groups selected from an epoxy group, a hydroxyl group, a carboxyl group, an alkoxy group, an isocyanate group, an acid anhydride group, and an acid chloride group in the graft portion. can be introduced. As a result, dispersibility and impact resistance may be improved as compared with the case of using a rubber graft copolymer containing no reactive group.
本発明で使用される衝撃改質剤の屈折率は1.485以上1.495以下であり、好ましくは1.487以上1.494以下であり、より好ましくは1.490以上1.493以下である。メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体の屈折率が上記範囲内であると、樹脂組成物の透明性および耐衝撃性に優れる。 The impact modifier used in the present invention has a refractive index of 1.485 or more and 1.495 or less, preferably 1.487 or more and 1.494 or less, more preferably 1.490 or more and 1.493 or less. be. When the refractive index of the methyl methacrylate-alkyl acrylate-styrene copolymer is within the above range, the resin composition is excellent in transparency and impact resistance.
メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体の製造方法としては、塊状重合、溶液重合、懸濁重合、乳化重合のいずれを採用してもよいが、乳化重合、すなわち、乳化グラフト重合が好ましい。具体的には、攪拌機を備えた反応容器に、ラテックスを加え、さらに単量体、重合開始剤、水を加え、必要に応じて連鎖移動剤や酸化還元剤を仕込み、加熱攪拌すればよい。 As a method for producing the methyl methacrylate-alkyl acrylate-styrene copolymer, any of bulk polymerization, solution polymerization, suspension polymerization and emulsion polymerization may be employed, but emulsion polymerization, that is, emulsion graft polymerization is preferred. . Specifically, latex is added to a reaction vessel equipped with a stirrer, monomers, a polymerization initiator, and water are added, and if necessary, a chain transfer agent and a redox agent are added, and the mixture is heated and stirred.
ここで使用する重合開始剤、連鎖移動剤、酸化還元剤の種類には特に制限がなく、公知のものが使用できる。また、各原料の反応容器への添加方法についても特に制限がなく、重合開始前の一括添加の他、分割添加してもよい。また、グラフト重合は、一段または二段以上で行われ、各段の単量体組成が同一であっても異なっていてもよく、また、単量体を一括添加しても、連続的に添加しても、あるいはこれらを組み合わせてもよい。 There are no particular restrictions on the types of the polymerization initiator, chain transfer agent, and redox agent used here, and known ones can be used. Also, the method of adding each raw material to the reaction vessel is not particularly limited. In addition, the graft polymerization is carried out in one stage or two or more stages, and the monomer composition in each stage may be the same or different. or a combination of these.
乳化重合法を採用する場合には、公知の重合開始剤、すなわち2,2’-アゾビスイソブチロニトリル、過酸化水素、過硫酸カリウム、過硫酸アンモニウム等の熱分解型重合開始剤を用いることができる。また、t-ブチルパーオキシイソプロピルカーボネート、パラメンタンハイドロパーオキサイド、クメンハイドロパーオキサイド、ジクミルパーオキサイド、t-ブチルハイドロパーオキサイド、ジ-t-ブチルパーオキサイド、t-ヘキ
シルパーオキサイド等の有機過酸化物、もしくは過酸化水素、過硫酸カリウム、過硫酸アンモニウム等の無機過酸化物といった過酸化物と、必要に応じてナトリウムホルムアルデヒドスルホキシレート、グルコース等の還元剤、および必要に応じて硫酸鉄(II)等の遷移金属塩、更に必要に応じてエチレンジアミン四酢酸二ナトリウム等のキレート剤、さらに必要に応じてピロリン酸ナトリウム等のリン系難燃剤等を併用したレドックス型重合開始剤として使用することもできる。
When an emulsion polymerization method is employed, a known polymerization initiator, that is, a thermal decomposition type polymerization initiator such as 2,2'-azobisisobutyronitrile, hydrogen peroxide, potassium persulfate, and ammonium persulfate should be used. can be done. In addition, organic peroxides such as t-butylperoxyisopropyl carbonate, paramenthane hydroperoxide, cumene hydroperoxide, dicumyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, t-hexyl peroxide, etc. oxides, or peroxides such as inorganic peroxides such as hydrogen peroxide, potassium persulfate, and ammonium persulfate, and optionally sodium formaldehyde sulfoxylate, a reducing agent such as glucose, and optionally iron sulfate ( II), a chelating agent such as disodium ethylenediaminetetraacetate as necessary, and a phosphorus-based flame retardant such as sodium pyrophosphate as necessary as a redox polymerization initiator. can also
レドックス型重合開始剤系を用いた場合には、前記過酸化物が実質的に熱分解しない低い温度でも重合を行うことができることから、重合温度を広い範囲で設定できるようになり好ましい。中でもクメンハイドロパーオキサイド、ジクミルパーオキサイド等の芳香族環含有過酸化物をレドックス型重合開始剤として用いることが好ましい。前記重合開始剤の使用量、またレドックス型重合開始剤を用いる場合の前記還元剤・遷移金属塩・キレート剤等の使用量は、公知の範囲で用いることができる。 When a redox polymerization initiator system is used, the polymerization can be carried out even at a low temperature at which the peroxide is not substantially thermally decomposed. Among them, aromatic ring-containing peroxides such as cumene hydroperoxide and dicumyl peroxide are preferably used as redox polymerization initiators. The amount of the polymerization initiator used, and the amount of the reducing agent, transition metal salt, chelating agent, etc. used when a redox polymerization initiator is used, can be used within a known range.
衝撃改質剤を乳化重合により合成する際、重合乳化剤としては、不均化ロジン酸、オレイン酸、ステアリン酸などの高級脂肪酸のアルカリ金属塩等、あるいはリン酸系化合物のアルカリ金属塩、さらにはスルホン酸や硫酸系化合物のアルカリ金属塩など、従来公知の重合乳化剤を使用することができる。 When synthesizing the impact modifier by emulsion polymerization, the polymerization emulsifier may be an alkali metal salt of a higher fatty acid such as disproportionated rosin acid, oleic acid or stearic acid, or an alkali metal salt of a phosphoric acid compound. Conventionally known polymerization emulsifiers such as sulfonic acid and alkali metal salts of sulfuric acid compounds can be used.
乳化重合により衝撃改質剤を得た場合には、例えば、衝撃改質剤のラテックスと塩酸等の酸、あるいは塩化カルシウム、塩化マグネシウム、硫酸マグネシウム、塩化アルミニウム、酢酸カルシウムなどの二価以上の金属塩を混合することにより凝固した後に、公知の方法に従って、熱処理・脱水・洗浄・乾燥することにより、衝撃改質剤を水性媒体から分離することができる(凝固法ともいう)。または、メタノール、エタノール、プロパノール等のアルコール、アセトン等の水溶性有機溶剤をラテックスに添加して衝撃改質剤を析出させ、遠心、または濾過等により溶剤と分離した後、乾燥させ、単離することもできる。別の方法として、本発明に用いる衝撃改質剤を含むラテックスにメチルエチルケトン等の若干の水溶性を有する有機溶剤を加えてラテックス中の衝撃改質剤成分を有機溶剤層に抽出し、有機溶剤層を分離した後、水などと混合して衝撃改質剤成分を析出させる方法等を挙げることができる。また、ラテックスを噴霧乾燥法により直接粉体化することもできる。 When the impact modifier is obtained by emulsion polymerization, for example, a latex of the impact modifier and an acid such as hydrochloric acid, or a divalent or higher metal such as calcium chloride, magnesium chloride, magnesium sulfate, aluminum chloride, calcium acetate, etc. After coagulation by mixing the salt, the impact modifier can be separated from the aqueous medium by heat treatment, dehydration, washing and drying according to known methods (also referred to as coagulation method). Alternatively, an alcohol such as methanol, ethanol, or propanol, or a water-soluble organic solvent such as acetone is added to the latex to precipitate the impact modifier, which is separated from the solvent by centrifugation or filtration, and then dried and isolated. can also Alternatively, a slightly water-soluble organic solvent such as methyl ethyl ketone is added to the latex containing the impact modifier used in the present invention to extract the impact modifier component in the latex into the organic solvent layer. is separated, and then mixed with water or the like to precipitate the impact modifier component. Alternatively, the latex can be directly pulverized by a spray drying method.
(エポキシ樹脂)
本発明の樹脂組成物に使用されるエポキシ樹脂(D)は、「エポキシ基」構造を有する化合物であれば、特に限定されない。エポキシ化合物としては、エポキシ基含有ポリマー、多官能エポキシ化合物等が挙げられ、一般に広く知られており、それらはいずれも使用することができる。エポキシ化合物は、例えば、特許第6146989号明細書等に記載されたものが挙げられる。
(Epoxy resin)
The epoxy resin (D) used in the resin composition of the present invention is not particularly limited as long as it is a compound having an "epoxy group" structure. Epoxy compounds include epoxy group-containing polymers, polyfunctional epoxy compounds, and the like, which are generally widely known, and any of them can be used. Examples of epoxy compounds include those described in Japanese Patent No. 6146989 and the like.
エポキシ樹脂の分子量は、好ましくは300~20000、より好ましくは500~15000、更に好ましくは1000~13000、最も好ましくは2000~12000である。このような範囲であれば、ポリカーボネート樹脂との相溶性により優れ、成形体としたときの透明性により優れ、成形時のエポキシ樹脂自体の分解による色相悪化をより抑えられ、より優れた耐湿熱性および耐光性が得られる。 The epoxy resin preferably has a molecular weight of 300 to 20,000, more preferably 500 to 15,000, even more preferably 1,000 to 13,000, and most preferably 2,000 to 12,000. Within such a range, the compatibility with the polycarbonate resin is excellent, the transparency of the molded product is excellent, the deterioration of the hue due to the decomposition of the epoxy resin itself during molding is suppressed, and the moisture resistance and heat resistance are excellent. Provides light resistance.
なお、本明細書において、エポキシ樹脂がポリマーである場合、エポキシ樹脂の分子量とは、「重量平均分子量」を意味するものとする。ここで、エポキシ樹脂の重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)法により測定されるポリスチレン換算の重量平均分子量であり、具体的には、エポキシ樹脂のポリスチレン換算の重量質量平均分子量は、測定装置として(株)島津製作所製LC-9A/RID-6Aを、カ
ラムとして昭和電工株式会社製Shodex K-800P/K-804L/K-804Lを、移動相としてクロロホルム等を用いて、カラム温度40℃にて測定し、標準ポリスチレンの検量線を用いて算出することができる。
In this specification, when the epoxy resin is a polymer, the molecular weight of the epoxy resin means "weight average molecular weight". Here, the weight average molecular weight of the epoxy resin is the polystyrene equivalent weight average molecular weight measured by gel permeation chromatography (GPC). Specifically, the polystyrene equivalent weight mass average molecular weight of the epoxy resin is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, Shodex K-800P / K-804L / K-804L manufactured by Showa Denko Co., Ltd. as a column, chloroform etc. as a mobile phase, column temperature It can be measured at 40° C. and calculated using a standard polystyrene calibration curve.
エポキシ樹脂としては、市販品を用いても良く、例えば、エポキシ基含有ポリマー(日油製「G-0150M」、東亜合成製「UG-4010」、エポキシ基含有アクリル-スチレンポリマー(東亜合成製「UG-4035」)などが挙げられる。 As the epoxy resin, a commercially available product may be used, for example, an epoxy group-containing polymer ("G-0150M" manufactured by NOF, "UG-4010" manufactured by Toa Gosei, an epoxy group-containing acrylic-styrene polymer (manufactured by Toa Gosei " UG-4035”) and the like.
(樹脂組成物の製造方法)
本発明の樹脂組成物はポリカーボネート樹脂、メタクリル酸メチル-アクリル酸メチル共重合体、メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体およびエポキシ樹脂を溶融状態でブレンドすることが好ましい。溶融状態でブレンドする方法として、押出機が一般的に用いられ、溶融樹脂温度200~320℃、好ましくは220~300℃、より好ましくは、230~290℃で混練し、ペレタイズする。これにより、両樹脂が均一にブレンドされた樹脂組成物のペレットが得られる。押出機の構成、スクリューの構成等は特に限定されない。押出機中の溶融樹脂温度が320℃を超えると樹脂が着色したり、熱分解することがある。一方、樹脂温度が200℃を下回ると、樹脂粘度が高過ぎて押出機に過負荷がかかることがある。
(Method for producing resin composition)
The resin composition of the present invention is preferably a blend of a polycarbonate resin, a methyl methacrylate-methyl acrylate copolymer, a methyl methacrylate-alkyl acrylate-styrene copolymer and an epoxy resin in a molten state. As a method for blending in a molten state, an extruder is generally used, and kneading and pelletizing are carried out at a molten resin temperature of 200 to 320°C, preferably 220 to 300°C, more preferably 230 to 290°C. As a result, pellets of a resin composition in which both resins are uniformly blended are obtained. The structure of the extruder, the structure of the screw, etc. are not particularly limited. If the molten resin temperature in the extruder exceeds 320°C, the resin may be colored or thermally decomposed. On the other hand, if the resin temperature is lower than 200°C, the resin viscosity is too high and the extruder may be overloaded.
(重量比)
上記ポリカーボネート樹脂とメタクリル酸メチル-アクリル酸メチル共重合体との重量比は好ましくは50:50~99:1の範囲で混合される。より好ましくは52:48~95:5の範囲であり、さらに好ましくは54:46~93:7の範囲であり、特に好ましくは56:35~90:10の範囲であり、もっとも好ましくは60:40~88:12の範囲である。上記範囲とすることにより表面硬度、耐衝撃性により優れた樹脂組成物を得ることができる。
(weight ratio)
The weight ratio of the polycarbonate resin and the methyl methacrylate-methyl acrylate copolymer is preferably in the range of 50:50 to 99:1. It is more preferably in the range of 52:48 to 95:5, still more preferably in the range of 54:46 to 93:7, particularly preferably in the range of 56:35 to 90:10, most preferably 60: It ranges from 40 to 88:12. By setting the amount in the above range, a resin composition having excellent surface hardness and impact resistance can be obtained.
上記メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体は、ポリカーボネート樹脂とメタクリル酸メチル-アクリル酸メチル共重合体の合計100重量部に対して、10~30重量部の範囲で混合される。好ましくは11~28重量部の範囲であり、より好ましくは12~26重量部の範囲であり、さらに好ましくは13~23重量部の範囲であり、特に好ましくは14~20重量部の範囲である。上記範囲とすることにより透明性、表面硬度、耐衝撃性に優れた樹脂組成物を得ることができる。 The methyl methacrylate-alkyl acrylate-styrene copolymer is mixed in the range of 10 to 30 parts by weight with respect to a total of 100 parts by weight of the polycarbonate resin and the methyl methacrylate-methyl acrylate copolymer. It is preferably in the range of 11 to 28 parts by weight, more preferably in the range of 12 to 26 parts by weight, still more preferably in the range of 13 to 23 parts by weight, and particularly preferably in the range of 14 to 20 parts by weight. . A resin composition having excellent transparency, surface hardness, and impact resistance can be obtained by setting the amount within the above range.
上記エポキシ樹脂は、ポリカーボネート樹脂とメタクリル酸メチル-アクリル酸メチル共重合体の合計100重量部に対して、1~30重量部の範囲で混合される。好ましくは2~25重量部の範囲であり、より好ましくは3~20重量部の範囲であり、さらに好ましく4~15重量部の範囲であり、もっとも好ましくは5~10重量部の範囲である。上記範囲とすることにより、透明性、耐衝撃性、耐湿熱性および耐乾熱性に優れた樹脂組成物を得ることができる。 The epoxy resin is mixed in an amount of 1 to 30 parts by weight with respect to a total of 100 parts by weight of the polycarbonate resin and the methyl methacrylate-methyl acrylate copolymer. It is preferably in the range of 2 to 25 parts by weight, more preferably in the range of 3 to 20 parts by weight, still more preferably in the range of 4 to 15 parts by weight, and most preferably in the range of 5 to 10 parts by weight. By setting it as the said range, the resin composition excellent in transparency, impact resistance, wet heat resistance, and dry heat resistance can be obtained.
(添加剤)
本発明で使用される樹脂組成物は、用途や必要に応じて熱安定剤、可塑剤、光安定剤、重合金属不活性化剤、難燃剤、滑剤、帯電防止剤、界面活性剤、抗菌剤、紫外線吸収剤、離型剤、着色剤等の添加剤を配合することができる。
(Additive)
The resin composition used in the present invention contains a heat stabilizer, a plasticizer, a light stabilizer, a polymerized metal deactivator, a flame retardant, a lubricant, an antistatic agent, a surfactant, and an antibacterial agent, depending on the application and need. , UV absorbers, release agents, colorants, and other additives may be added.
(熱安定剤)
本発明で使用される樹脂組成物は、押出・成形時の分子量低下や色相の悪化を抑制するために、とくに熱安定剤を含有することが好ましい。熱安定剤としてはリン系熱安定剤、フェノール系熱安定剤、イオウ系熱安定剤が挙げられ、これらの1種を単独で、又は2種
以上を併用して用いることができる。リン系安定剤としてはホスファイト化合物を配合することが好ましい。ホスファイト化合物としては、ペンタエリスリトール型ホスファイト化合物、二価フェノール類と反応し環状構造を有するホスファイト化合物、その他の構造を有するホスファイト化合物が挙げられる。
(Heat stabilizer)
The resin composition used in the present invention preferably contains a heat stabilizer in order to suppress molecular weight reduction and color deterioration during extrusion and molding. Examples of heat stabilizers include phosphorus-based heat stabilizers, phenol-based heat stabilizers, and sulfur-based heat stabilizers, and these may be used alone or in combination of two or more. A phosphite compound is preferably blended as the phosphorus stabilizer. Phosphite compounds include pentaerythritol-type phosphite compounds, phosphite compounds having a cyclic structure that have reacted with dihydric phenols, and phosphite compounds having other structures.
上記のペンタエリスリトール型ホスファイト化合物としては、具体的には、例えば、ジステアリルペンタエリスリトールジホスファイト、ビス(2,4-ジ-tert-ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6-ジ-tert-ブチル-4-メチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6-ジ-tert-ブチル-4-エチルフェニル)ペンタエリスリトールジホスファイト、フェニルビスフェノールAペンタエリスリトールジホスファイト、ビス(ノニルフェニル)ペンタエリスリトールジホスファイト、ジシクロヘキシルペンタエリスリトールジホスファイトなどが挙げられ、中でも好適には、ジステアリルペンタエリスリトールジホスファイト、およびビス(2,4-ジ-tert-ブチルフェニル)ペンタエリスリトールジホスファイトが挙げられる。 Specific examples of the pentaerythritol-type phosphite compound include, for example, distearylpentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6 -di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-ethylphenyl)pentaerythritol diphosphite, phenylbisphenol A pentaerythritol diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dicyclohexylpentaerythritol diphosphite and the like, among which distearylpentaerythritol diphosphite and bis(2,4-di-tert-butylphenyl)penta Erythritol diphosphite may be mentioned.
上記の二価フェノール類と反応し環状構造を有するホスファイト化合物としては、例えば、2,2’-メチレンビス(4,6-ジ-tert-ブチルフェニル)(2,4-ジ-tert-ブチルフェニル)ホスファイト、2,2’-メチレンビス(4,6-ジ-tert-ブチルフェニル)(2-tert-ブチル-4-メチルフェニル)ホスファイト、2,2’-メチレンビス(4-メチル-6-tert-ブチルフェニル)(2-tert-ブチル-4-メチルフェニル)ホスファイト、2,2’-エチリデンビス(4-メチル-6-tert-ブチルフェニル)(2-tert-ブチル-4-メチルフェニル)ホスファイト、2,2’-メチレン-ビス-(4,6-ジ-t-ブチルフェニル)オクチルホスファイト、6-tert-ブチル-4-[3-[(2,4,8,10)-テトラ-tert-ブチルジベンゾ[d,f][1,3,2]ジオキサホスフェピン-6-イル)オキシ]プロピル]-2-メチルフェノールなどを挙げることができる。 Examples of the phosphite compound having a cyclic structure that reacts with the above dihydric phenols include 2,2′-methylenebis(4,6-di-tert-butylphenyl)(2,4-di-tert-butylphenyl ) phosphite, 2,2′-methylenebis(4,6-di-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2′-methylenebis(4-methyl-6- tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2′-ethylidenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl) ) phosphite, 2,2′-methylene-bis-(4,6-di-t-butylphenyl)octyl phosphite, 6-tert-butyl-4-[3-[(2,4,8,10) -tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-6-yl)oxy]propyl]-2-methylphenol and the like.
上記のその他の構造を有するホスファイト系化合物としては、例えば、トリフェニルホスファイト、トリス(ノニルフェニル)ホスファイト、トリデシルホスファイト、トリオクチルホスファイト、トリオクタデシルホスファイト、ジデシルモノフェニルホスファイト、ジオクチルモノフェニルホスファイト、ジイソプロピルモノフェニルホスファイト、モノブチルジフェニルホスファイト、モノデシルジフェニルホスファイト、モノオクチルジフェニルホスファイト、2,2-メチレンビス(4,6-ジ-tert-ブチルフェニル)オクチルホスファイト、トリス(ジエチルフェニル)ホスファイト、トリス(ジ-iso-プロピルフェニル)ホスファイト、トリス(ジ-n-ブチルフェニル)ホスファイト、トリス(2,4-ジ-tert-ブチルフェニル)ホスファイト、およびトリス(2,6-ジ-tert-ブチルフェニル)ホスファイトなどが挙げられる。 Examples of phosphite compounds having other structures above include triphenylphosphite, tris(nonylphenyl)phosphite, tridecylphosphite, trioctylphosphite, trioctadecylphosphite and didecylmonophenylphosphite. , dioctylmonophenylphosphite, diisopropylmonophenylphosphite, monobutyldiphenylphosphite, monodecyldiphenylphosphite, monooctyldiphenylphosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octylphosphite phyte, tris(diethylphenyl)phosphite, tris(di-iso-propylphenyl)phosphite, tris(di-n-butylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, and tris(2,6-di-tert-butylphenyl)phosphite.
各種ホスファイト化合物以外には、例えば、ホスフェート化合物、ホスホナイト化合物、ホスホネイト化合物が挙げられる。 Other than various phosphite compounds, for example, phosphate compounds, phosphonite compounds, and phosphonate compounds can be used.
ホスフェート化合物としては、トリブチルホスフェート、トリメチルホスフェート、トリクレジルホスフェート、トリフェニルホスフェート、トリクロルフェニルホスフェート、トリエチルホスフェート、ジフェニルクレジルホスフェート、ジフェニルモノオルソキセニルホスフェート、トリブトキシエチルホスフェート、ジブチルホスフェート、ジオクチルホスフェート、ジイソプロピルホスフェートなどを挙げることができ、好ましくはトリフェニルホスフェート、トリメチルホスフェートである。 Phosphate compounds include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, Diisopropyl phosphate and the like can be mentioned, and triphenyl phosphate and trimethyl phosphate are preferred.
ホスホナイト化合物としては、テトラキス(2,4-ジ-tert-ブチルフェニル)
-4,4’-ビフェニレンジホスホナイト、テトラキス(2,4-ジ-tert-ブチルフェニル)-4,3’-ビフェニレンジホスホナイト、テトラキス(2,4-ジ-tert-ブチルフェニル)-3,3’-ビフェニレンジホスホナイト、テトラキス(2,6-ジ-tert-ブチルフェニル)-4,4’-ビフェニレンジホスホナイト、テトラキス(2,6-ジ-tert-ブチルフェニル)-4,3’-ビフェニレンジホスホナイト、テトラキス(2,6-ジ-tert-ブチルフェニル)-3,3’-ビフェニレンジホスホナイト、ビス(2,4-ジ-tert-ブチルフェニル)-4-フェニル-フェニルホスホナイト、ビス(2,4-ジ-tert-ブチルフェニル)-3-フェニル-フェニルホスホナイト、ビス(2,6-ジ-n-ブチルフェニル)-3-フェニル-フェニルホスホナイト、ビス(2,6-ジ-tert-ブチルフェニル)-4-フェニル-フェニルホスホナイト、ビス(2,6-ジ-tert-ブチルフェニル)-3-フェニル-フェニルホスホナイト等があげられ、テトラキス(ジ-tert-ブチルフェニル)-ビフェニレンジホスホナイト、ビス(ジ-tert-ブチルフェニル)-フェニル-フェニルホスホナイトが好ましく、テトラキス(2,4-ジ-tert-ブチルフェニル)-ビフェニレンジホスホナイト、ビス(2,4-ジ-tert-ブチルフェニル)-フェニル-フェニルホスホナイトがより好ましい。かかるホスホナイト化合物は上記アルキル基が2以上置換したアリール基を有するホスファイト化合物との併用可能であり好ましい。
Phosphonite compounds include tetrakis(2,4-di-tert-butylphenyl)
-4,4'-biphenylenediphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,3'-biphenylenediphosphonite, tetrakis(2,4-di-tert-butylphenyl)-3 ,3′-biphenylenediphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,4′-biphenylenediphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,3 '-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, bis(2,4-di-tert-butylphenyl)-4-phenyl-phenyl phosphonite, bis(2,4-di-tert-butylphenyl)-3-phenyl-phenylphosphonite, bis(2,6-di-n-butylphenyl)-3-phenyl-phenylphosphonite, bis(2 ,6-di-tert-butylphenyl)-4-phenyl-phenylphosphonite, bis(2,6-di-tert-butylphenyl)-3-phenyl-phenylphosphonite, tetrakis(di-tert -butylphenyl)-biphenylenediphosphonite, bis(di-tert-butylphenyl)-phenyl-phenylphosphonite are preferred, tetrakis(2,4-di-tert-butylphenyl)-biphenylenediphosphonite, bis(2 ,4-di-tert-butylphenyl)-phenyl-phenylphosphonite is more preferred. Such a phosphonite compound can be used in combination with a phosphite compound having an aryl group substituted with two or more alkyl groups, and is therefore preferable.
ホスホネイト化合物としては、ベンゼンホスホン酸ジメチル、ベンゼンホスホン酸ジエチル、およびベンゼンホスホン酸ジプロピル等が挙げられる。 Phosphonate compounds include dimethyl benzenephosphonate, diethyl benzenephosphonate, dipropyl benzenephosphonate, and the like.
上記のリン系熱安定剤の中でも、トリスノニルフェニルホスファイト、トリメチルホスフェート、トリス(2,4-ジ-tert-ブチルフェニル)ホスファイト、ビス(2,4-ジ-tert-ブチルフェニル)ペンタエリスリトールジホスファイト、ビス(2,6-ジ-tert-ブチル-4-メチルフェニル)ペンタエリスリトールジホスファイトが好ましく使用される。 Among the above phosphorus heat stabilizers, trisnonylphenyl phosphite, trimethyl phosphate, tris(2,4-di-tert-butylphenyl)phosphite, bis(2,4-di-tert-butylphenyl)pentaerythritol The diphosphite bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite is preferably used.
上記のリン系熱安定剤は、単独でまたは2種以上を併用して使用することができる。リン系熱安定剤は樹脂組成物100重量部当たり、好ましくは0.001~1重量部、より好ましくは0.01~0.5重量部、さらに好ましくは0.01~0.3重量部配合される。 The above phosphorus-based heat stabilizers may be used alone or in combination of two or more. Phosphorus-based heat stabilizer is blended in an amount of preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 part by weight, and even more preferably 0.01 to 0.3 part by weight per 100 parts by weight of the resin composition. be done.
本発明で使用される樹脂組成物は、押出・成形時の分子量低下や色相の悪化を抑制することを目的に、熱安定剤として、ヒンダードフェノール系熱安定剤またはイオウ系熱安定剤を、リン系熱安定剤と組み合わせて添加することもできる。 The resin composition used in the present invention contains a hindered phenol-based heat stabilizer or a sulfur-based heat stabilizer as a heat stabilizer for the purpose of suppressing a decrease in molecular weight and a deterioration in color during extrusion and molding. It can also be added in combination with a phosphorus heat stabilizer.
ヒンダードフェノール系熱安定剤としては、例えば、酸化防止機能を有するものであれば特に限定されないが、例えば、n-オクタデシル-3-(4’-ヒドロキシ-3’,5’-ジ-t-ブチルフェニル)プロピオネート、テトラキス{メチレン-3-(3’,5’-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}メタン、ジステアリル(4-ヒドロキシ-3-メチル-5-t-ブチルベンジル)マロネート、トリエチレグリコール-ビス{3-(3-t-ブチル-5-メチル-4-ヒドロキシフェニル)プロピオネート}、1,6-ヘキサンジオール-ビス{3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}、ペンタエリスリチル-テトラキス{3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}、2,2-チオジエチレンビス{3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}、2,2-チオビス(4-メチル-6-t-ブチルフェノール)、1,3,5-トリメチル-2,4,6-トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)ベンゼン、トリス(3,5-ジ-t-ブチル-4-ヒドロキシベンジル)-イソシアヌレート、2,4-ビス{(オクチルチオ)メチル}-o-クレゾール、イソオクチル-3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート、2,5,7,8-テトラメチル-2(4’,8’,12’-トリメチルトリデシル)クロマン-6-オール、3,3’,3”,5,5’,5”-ヘキサ-t-ブチル-a,a’,a”-(メシチレン-2,4,6-トリイル)トリ-p-クレゾール等が挙げられる。 The hindered phenol-based heat stabilizer is not particularly limited as long as it has an antioxidant function. butylphenyl)propionate, tetrakis{methylene-3-(3′,5′-di-t-butyl-4-hydroxyphenyl)propionate}methane, distearyl(4-hydroxy-3-methyl-5-t-butylbenzyl ) malonate, triethylene glycol-bis{3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate}, 1,6-hexanediol-bis{3-(3,5-di-t- butyl-4-hydroxyphenyl)propionate}, pentaerythrityl-tetrakis {3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiodiethylenebis{3-(3, 5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiobis(4-methyl-6-t-butylphenol), 1,3,5-trimethyl-2,4,6-tris(3 ,5-di-t-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-t-butyl-4-hydroxybenzyl)-isocyanurate, 2,4-bis{(octylthio)methyl}-o - cresol, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,5,7,8-tetramethyl-2(4',8',12'-trimethyltridecyl ) chroman-6-ol, 3,3′,3″,5,5′,5″-hexa-t-butyl-a,a′,a″-(mesitylene-2,4,6-triyl)tri- and p-cresol.
これらの中で、n-オクタデシル-3-(4’-ヒドロキシ-3’,5’-ジ-t-ブチルフェニル)プロピオネート、ペンタエリスリチル-テトラキス{3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}、3,3’,3”,5,5’,5”-ヘキサ-t-ブチル-a,a’,a’-(メシチレン-2,4,6-トリイル)トリ-p-クレゾール、2,2-チオジエチレンビス{3-(3,5-ジ-t-ブチル-4-ヒドロキシフェニル)プロピオネート}等が好ましい。 Among these, n-octadecyl-3-(4′-hydroxy-3′,5′-di-t-butylphenyl)propionate, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl -4-hydroxyphenyl)propionate}, 3,3′,3″,5,5′,5″-hexa-t-butyl-a,a′,a′-(mesitylene-2,4,6-triyl) Tri-p-cresol, 2,2-thiodiethylenebis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate} and the like are preferred.
これらのヒンダードフェノール系熱安定剤は1種を単独で用いても良く、2種以上を併用しても用いても良い。 These hindered phenol heat stabilizers may be used singly or in combination of two or more.
ヒンダードフェノール系熱安定剤は樹脂組成物100重量部当たり、好ましくは0.001~1重量部、より好ましくは0.01~0.5重量部、さらに好ましくは0.01~0.3重量部配合される。 The hindered phenol heat stabilizer is preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 part by weight, still more preferably 0.01 to 0.3 part by weight, per 100 parts by weight of the resin composition. Partially blended.
イオウ系熱安定剤としては、例えば、ジラウリル-3,3’-チオジプロピオン酸エステル、ジトリデシル-3,3’-チオジプロピオン酸エステル、ジミリスチル-3,3’-チオジプロピオン酸エステル、ジステアリル-3,3’-チオジプロピオン酸エステル、ラウリルステアリル-3,3’-チオジプロピオン酸エステル、ペンタエリスリトールテトラキス(3-ラウリルチオプロピオネート)、ビス[2-メチル-4-(3-ラウリルチオプロピオニルオキシ)-5-tert-ブチルフェニル]スルフィド、オクタデシルジスルフィド、メルカプトベンズイミダゾール、2-メルカプト-6-メチルベンズイミダゾール、1,1’-チオビス(2-ナフトール)などを挙げることができる。上記のうち、ペンタエリスリトールテトラキス(3-ラウリルチオプロピオネート)が好ましい。 Examples of sulfur-based heat stabilizers include dilauryl-3,3′-thiodipropionate, ditridecyl-3,3′-thiodipropionate, dimyristyl-3,3′-thiodipropionate, di Stearyl-3,3'-thiodipropionate, laurylstearyl-3,3'-thiodipropionate, pentaerythritol tetrakis(3-laurylthiopropionate), bis[2-methyl-4-(3 -laurylthiopropionyloxy)-5-tert-butylphenyl]sulfide, octadecyl disulfide, mercaptobenzimidazole, 2-mercapto-6-methylbenzimidazole, 1,1′-thiobis(2-naphthol), and the like. . Among the above, pentaerythritol tetrakis(3-laurylthiopropionate) is preferred.
これらのイオウ系熱安定剤は1種を単独で用いても良く、2種以上を併用しても用いても良い。 One of these sulfur-based heat stabilizers may be used alone, or two or more of them may be used in combination.
イオウ系熱安定剤は樹脂組成物100重量部当たり、好ましくは0.001~1重量部、より好ましくは0.01~0.5重量部、さらに好ましくは0.01~0.3重量部配合される。 The sulfur-based heat stabilizer is preferably 0.001 to 1 part by weight, more preferably 0.01 to 0.5 part by weight, and still more preferably 0.01 to 0.3 part by weight per 100 parts by weight of the resin composition. be done.
ホスファイト系熱安定剤、フェノール系熱安定剤、イオウ系熱安定剤を併用する場合、これらの合計で樹脂組成物100重量部に対し、好ましくは0.001~1重量部、より好ましくは0.01~0.3重量部配合される。 When a phosphite-based heat stabilizer, a phenol-based heat stabilizer, and a sulfur-based heat stabilizer are used in combination, the total amount of these is preferably 0.001 to 1 part by weight, more preferably 0, per 100 parts by weight of the resin composition. 0.01 to 0.3 parts by weight.
(離型剤)
本発明で使用される樹脂組成物は、溶融成形時の金型からの離型性をより向上させるために、本発明の目的を損なわない範囲で離型剤を配合することも可能である。
(Release agent)
The resin composition used in the present invention may contain a mold release agent within a range that does not impair the object of the present invention in order to further improve the releasability from the mold during melt molding.
かかる離型剤としては、一価または多価アルコールの高級脂肪酸エステル、高級脂肪酸、パラフィンワックス、蜜蝋、オレフィン系ワックス、カルボキシ基および/またはカルボン酸無水物基を含有するオレフィン系ワックス、シリコーンオイル、オルガノポリシロキサン等が挙げられる。 Examples of such release agents include higher fatty acid esters of monohydric or polyhydric alcohols, higher fatty acids, paraffin wax, beeswax, olefinic waxes, olefinic waxes containing carboxy groups and/or carboxylic acid anhydride groups, silicone oils, organopolysiloxane and the like.
高級脂肪酸エステルとしては、炭素原子数1~20の一価または多価アルコールと炭素原子数10~30の飽和脂肪酸との部分エステルまたは全エステルが好ましい。かかる一価または多価アルコールと飽和脂肪酸との部分エステルまたは全エステルとしては、例えば、ステアリン酸モノグリセリド、ステアリン酸ジグリセリド、ステアリン酸トリグリセリド、ステアリン酸モノソルビテート、ステアリン酸ステアリル、ベヘニン酸モノグリセリド、ベヘニン酸ベヘニル、ペンタエリスリトールモノステアレート、ペンタエリスリトールテトラステアレート、ペンタエリスリトールテトラペラルゴネート、プロピレングリコールモノステアレート、ステアリルステアレート、パルミチルパルミテート、ブチルステアレート、メチルラウレート、イソプロピルパルミテート、ビフェニルビフェネート、ソルビタンモノステアレート、2―エチルヘキシルステアレート等が挙げられる。 Preferred higher fatty acid esters are partial or full esters of monohydric or polyhydric alcohols having 1 to 20 carbon atoms and saturated fatty acids having 10 to 30 carbon atoms. Partial or full esters of monohydric or polyhydric alcohols with saturated fatty acids include, for example, stearic acid monoglyceride, stearic acid diglyceride, stearic acid triglyceride, stearic acid monosorbitate, stearyl stearate, behenic acid monoglyceride, and behenic acid. Behenyl, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol tetrapelargonate, propylene glycol monostearate, stearyl stearate, palmityl palmitate, butyl stearate, methyl laurate, isopropyl palmitate, biphenyl biphenate , sorbitan monostearate, 2-ethylhexyl stearate and the like.
なかでも、ステアリン酸モノグリセリド、ステアリン酸トリグリセリド、ペンタエリスリトールテトラステアレート、ベヘニン酸ベヘニルが好ましく用いられる。 Among them, stearic acid monoglyceride, stearic acid triglyceride, pentaerythritol tetrastearate, and behenyl behenate are preferably used.
高級脂肪酸としては、炭素原子数10~30の飽和脂肪酸が好ましい。かかる脂肪酸としては、ミリスチン酸、ラウリン酸、パルミチン酸、ステアリン酸、ベヘニン酸などが挙げられる。 As higher fatty acids, saturated fatty acids having 10 to 30 carbon atoms are preferred. Such fatty acids include myristic acid, lauric acid, palmitic acid, stearic acid, behenic acid and the like.
これらの離型剤は、1種を単独で用いても良く、2種以上を併用しても良い。かかる離型剤の配合量は、樹脂組成物100重量部に対して0.01~5重量部が好ましい。 One of these release agents may be used alone, or two or more thereof may be used in combination. The amount of the release agent to be added is preferably 0.01 to 5 parts by weight per 100 parts by weight of the resin composition.
(紫外線吸収剤)
本発明で使用される樹脂組成物は、紫外線吸収剤を含むことができる。紫外線吸収剤としてはベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤、トリアジン系紫外線吸収剤、環状イミノエステル系紫外線吸収剤、シアノアクリレート系紫外線吸収剤等が挙げられ、なかでもベンゾトリアゾール系紫外線吸収剤が好ましい。
(Ultraviolet absorber)
The resin composition used in the present invention can contain an ultraviolet absorber. Examples of ultraviolet absorbers include benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, triazine-based ultraviolet absorbers, cyclic iminoester-based ultraviolet absorbers, and cyanoacrylate-based ultraviolet absorbers. agents are preferred.
ベンゾトリアゾール系紫外線吸収剤としては、例えば2-(2’-ヒドロキシ-5’-メチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-5’-tert-ブチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-5’-tert-オクチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ジ-tert-アミルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-3’-ドデシル-5’-メチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ビス(α,α’-ジメチルベンジル)フェニルベンゾトリアゾール、2-[2’-ヒドロキシ-3’-(3”,4”,5”,6”-テトラフタルイミドメチル)-5’-メチルフェニル]ベンゾトリアゾール、2-(2’-ヒドロキシ-3’-tert-ブチル-5’-メチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)-5-クロロベンゾトリアゾール、2,2’メチレンビス[4-(1,1,3,3-テトラメチルブチル)-6-(2H-ベンゾトリアゾール-2-イル)フェノール]、メチル-3-[3-tert-ブチル-5-(2H-ベンゾトリアゾール-2-イル)-4-ヒドロキシフェニルプロピオネート-ポリエチレングリコールとの縮合物に代表されるベンゾトリアゾール系紫外線吸収剤を挙げることができる。 Examples of benzotriazole-based UV absorbers include 2-(2′-hydroxy-5′-methylphenyl)benzotriazole, 2-(2′-hydroxy-5′-tert-butylphenyl)benzotriazole, 2-(2 '-hydroxy-5'-tert-octylphenyl)benzotriazole, 2-(2'-hydroxy-3',5'-di-tert-butylphenyl)benzotriazole, 2-(2'-hydroxy-3', 5′-di-tert-amylphenyl)benzotriazole, 2-(2′-hydroxy-3′-dodecyl-5′-methylphenyl)benzotriazole, 2-(2′-hydroxy-3′,5′-bis (α,α'-dimethylbenzyl)phenylbenzotriazole, 2-[2'-hydroxy-3'-(3″,4″,5″,6″-tetraphthalimidomethyl)-5′-methylphenyl]benzotriazole , 2-(2′-hydroxy-3′-tert-butyl-5′-methylphenyl)-5-chlorobenzotriazole, 2-(2′-hydroxy-3′,5′-di-tert-butylphenyl) -5-chlorobenzotriazole, 2,2′methylenebis[4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol], methyl-3-[3 -tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenylpropionate-polyethylene glycol condensate, exemplified by benzotriazole-based UV absorbers.
かかる紫外線吸収剤の割合は、樹脂組成物100重量部に対して好ましくは0.01~2重量部、より好ましくは0.1~1重量部、さらに好ましくは0.2~0.5重量部である。 The proportion of such an ultraviolet absorber is preferably 0.01 to 2 parts by weight, more preferably 0.1 to 1 part by weight, and still more preferably 0.2 to 0.5 parts by weight with respect to 100 parts by weight of the resin composition. is.
(光安定剤)
本発明で使用される樹脂組成物は、光安定剤を含むことができる。光安定剤を含むと、耐候性の面で良好であり、成形品にクラックが入り難くなるという利点がある。
(light stabilizer)
The resin composition used in the present invention can contain a light stabilizer. When a light stabilizer is contained, there is an advantage that the weather resistance is good and the molded article is less likely to crack.
光安定剤としては、例えば1,2,2,6,6-ペンタメチル-4-ピペリジルメタクリレート、ジデカン酸ビス(2,2,6,6-テトラメチル-1-オクチルオキシ-4-ピペリジニル)エステル、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジニル)-[[3,5-ビス(1,1-ジメチルエチル)-4-ヒドロキシフェニル]メチル]ブチルマロネート、2,4-ビス[N-ブチル-N-(1-シクロヘキシルオキシ-2,2,6,6-テトラメチルピペリジン-2-イル)アミノ]-6-(2-ヒドロキシエチルアミン)-1,3,5-トリアジン、ビス(1,2,2,6,6-ペンタメチル-4-ピペリジニル)セバケート、メチル(1,2,2,6,6-ペンタメチル-4-ピペリジニル)セバケート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)カーボネート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)サクシネート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)セバケート、4-ベンゾイルオキシ-2,2,6,6-テトラメチルピペリジン、4-オクタノイルオキシ-2,2,6,6-テトラメチルピペリジン、ビス(2,2,6,6-テトラメチル-4-ピペリジル)ジフェニルメタン-p,p′-ジカーバメート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)ベンゼン-1,3-ジスルホネート、ビス(2,2,6,6-テトラメチル-4-ピペリジル)フェニルホスファイト等のヒンダードアミン類、ニッケルビス(オクチルフェニルサルファイド、ニッケルコンプレクス-3,5-ジ-t-ブチル-4-ヒドロキシベンジルリン酸モノエチラート、ニッケルジブチルジチオカーバメート等のニッケル錯体が挙げられる。これらの光安定剤は単独もしくは2種以上を併用してもよい。光安定剤の含有量は、樹脂組成物100重量部に対して好ましくは0.001~1重量部、より好ましくは0.01~0.5重量部である。 Examples of light stabilizers include 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate, didecanoic acid bis(2,2,6,6-tetramethyl-1-octyloxy-4-piperidinyl) ester, Bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, 2,4- bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-tetramethylpiperidin-2-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazine, bis (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, methyl (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, bis (2,2,6,6- tetramethyl-4-piperidyl) carbonate, bis (2,2,6,6-tetramethyl-4-piperidyl) succinate, bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate, 4-benzoyl Oxy-2,2,6,6-tetramethylpiperidine, 4-octanoyloxy-2,2,6,6-tetramethylpiperidine, bis(2,2,6,6-tetramethyl-4-piperidyl)diphenylmethane -p,p'-dicarbamate, bis(2,2,6,6-tetramethyl-4-piperidyl)benzene-1,3-disulfonate, bis(2,2,6,6-tetramethyl-4- Hindered amines such as piperidyl)phenyl phosphite, nickel complexes such as nickel bis(octylphenyl sulfide, nickel complex-3,5-di-t-butyl-4-hydroxybenzyl phosphate monoethylate, and nickel dibutyl dithiocarbamate. These light stabilizers may be used alone or in combination of two or more.The content of the light stabilizer is preferably 0.001 to 1 part by weight, more preferably 0.001 to 1 part by weight, based on 100 parts by weight of the resin composition. 01 to 0.5 parts by weight.
(ブルーイング剤)
本発明で使用される樹脂組成物は、重合体や紫外線吸収剤に基づくレンズの黄色味を打ち消すためにブルーイング剤を配合することができる。ブルーイング剤としては、ポリカーボネートに使用されるものであれば、特に支障なく使用することができる。一般的にはアンスラキノン系染料が入手容易であり好ましい。
(Bluing agent)
The resin composition used in the present invention can contain a bluing agent in order to cancel the yellowness of the lens due to the polymer or the ultraviolet absorber. As the bluing agent, any bluing agent that is used for polycarbonate can be used without any particular problem. In general, anthraquinone dyes are readily available and preferred.
具体的なブルーイング剤としては、例えば、一般名Solvent Violet13[CA.No(カラーインデックスNo)60725]、一般名Solvent Violet31[CA.No 68210、一般名Solvent Violet33[CA.No 60725]、一般名Solvent Blue94[CA.No 61500]、一般名Solvent Violet36[CA.No 68210]、一般名Solvent Blue97[バイエル製「マクロレックスバイオレットRR」]および一般名Solvent Blue45[CA.No61110]が代表例として挙げられる。 Specific bluing agents include, for example, general name Solvent Violet 13 [CA. No (color index No) 60725], general name Solvent Violet 31 [CA. No 68210, generic name Solvent Violet 33 [CA. No 60725], generic name Solvent Blue 94 [CA. No 61500], generic name Solvent Violet 36 [CA. No 68210], the generic name Solvent Blue 97 [Bayer "Macrolex Violet RR"] and the generic name Solvent Blue 45 [CA. No. 61110] is a typical example.
これらのブルーイング剤は、1種を単独で用いても良く、2種以上を併用しても良い。これらブルーイング剤は、樹脂組成物100重量部に対して好ましくは0.1×10-4~2×10-4重量部の割合で配合される。 These bluing agents may be used alone or in combination of two or more. These bluing agents are preferably blended in a proportion of 0.1×10 −4 to 2×10 −4 parts by weight per 100 parts by weight of the resin composition.
(難燃剤)
本発明で使用される樹脂組成物には、難燃剤を配合することもできる。難燃剤としては、臭素化エポキシ樹脂、臭素化ポリスチレン、臭素化ポリカーボネート、臭素化ポリアクリレート、および塩素化ポリエチレンなどのハロゲン系難燃剤、モノホスフェート化合物およびホスフェートオリゴマー化合物などのリン酸エステル系難燃剤、ホスフィネート化合物、ホスホネート化合物、ホスホニトリルオリゴマー化合物、ホスホン酸アミド化合物などのリン酸エステル系難燃剤以外の有機リン系難燃剤、有機スルホン酸アルカリ(土類)金属塩、ホウ酸金属塩系難燃剤、および錫酸金属塩系難燃剤などの有機金属塩系難燃剤、並びにシリコーン系難燃剤、ポリリン酸アンモニウム系難燃剤、トリアジン系難燃剤等が挙げられる。また別途、難燃助剤(例えば、アンチモン酸ナトリウム、三酸化アンチモン等)や滴下防止剤(フィブリル形成能を有するポリテトラフルオロエチレン等)等を配合し、難燃剤と併用してもよい。
(Flame retardants)
A flame retardant can also be added to the resin composition used in the present invention. Flame retardants include halogen flame retardants such as brominated epoxy resins, brominated polystyrene, brominated polycarbonate, brominated polyacrylate, and chlorinated polyethylene; phosphate ester flame retardants such as monophosphate compounds and phosphate oligomer compounds; Phosphinate compounds, phosphonate compounds, phosphonitrile oligomer compounds, organic phosphorus flame retardants other than phosphoric acid ester flame retardants such as phosphonic acid amide compounds, organic sulfonic acid alkali (earth) metal salts, borate metal salt flame retardants, and organic metal salt flame retardants such as metal stannate flame retardants, silicone flame retardants, ammonium polyphosphate flame retardants, and triazine flame retardants. Separately, a flame retardant auxiliary (for example, sodium antimonate, antimony trioxide, etc.) or an anti-dripping agent (polytetrafluoroethylene having fibril-forming ability, etc.) may be blended together with the flame retardant.
上述の難燃剤の中でも、塩素原子および臭素原子を含有しない化合物は、焼却廃棄やサーマルリサイクルを行う際に好ましくないとされる要因が低減されることから、環境負荷の低減をも1つの特徴とする本発明の成形品における難燃剤としてより好適である。 Among the above flame retardants, compounds that do not contain chlorine atoms or bromine atoms reduce the factors that are considered unfavorable when incinerated or thermally recycled. It is more suitable as a flame retardant in the molded article of the present invention.
難燃剤を配合する場合には、樹脂組成物100重量部当たり0.05~50重量部の範囲が好ましい。0.05重量部以上でより十分な難燃性が発現し易く、50重量部以下で成形品の強度や耐熱性などにより優れる。 When blending a flame retardant, it is preferably in the range of 0.05 to 50 parts by weight per 100 parts by weight of the resin composition. When the amount is 0.05 parts by weight or more, sufficient flame retardancy is easily exhibited, and when the amount is 50 parts by weight or less, the strength and heat resistance of the molded product are excellent.
(成形品)
本発明の樹脂組成物は、例えば射出成形法、圧縮成形法、射出圧縮成形法、溶融製膜法、キャスティング法など任意の方法により各種成形品(シート、フィルム含む)に成形、加工され、光学レンズ、光ディスク、光学フィルム、プラセル基板、光カード、液晶パネル、ヘッドランプレンズ、導光板、拡散板、保護フィルム、OPCバインダー、前面板、筐体、トレー、水槽、照明カバー、看板、樹脂窓等の成形品として使用することができる。特に、前面板、筐体、トレー、水槽、照明カバー、看板、樹脂窓等の高表面硬度が要求される部材として使用することができる。
(Molding)
The resin composition of the present invention can be molded and processed into various molded articles (including sheets and films) by any method such as injection molding, compression molding, injection compression molding, melt film-forming, and casting. Lenses, optical discs, optical films, plastic substrates, optical cards, liquid crystal panels, headlamp lenses, light guide plates, diffusion plates, protective films, OPC binders, front plates, housings, trays, water tanks, lighting covers, signboards, resin windows, etc. can be used as a molded product. In particular, it can be used as members requiring high surface hardness, such as front plates, housings, trays, water tanks, lighting covers, signboards, and resin windows.
(透明性)
本発明の樹脂組成物は、その2mm厚の成形片のヘイズは10%以下であることが好ましく、8%以下であるとより好ましく、5%以下であるとさらに好ましく、3%以下であると特に好ましい。ヘイズが上記範囲内であると光学部材としての使用範囲が限定されず好ましい。
(transparency)
The resin composition of the present invention preferably has a haze of 10% or less, more preferably 8% or less, even more preferably 5% or less, and 3% or less in a molded piece having a thickness of 2 mm. Especially preferred. When the haze is within the above range, the range of use as an optical member is not limited, which is preferable.
(YI)
本発明の樹脂組成物は、その2mm厚の成形片のYIは10以下であることが好ましく、9以下であるとより好ましく、8以下であると特に好ましい。YIが上記範囲内であると光学部材としての使用範囲が限定されず好ましい。
(YI)
The resin composition of the present invention preferably has a YI of 10 or less, more preferably 9 or less, and particularly preferably 8 or less for a molded piece having a thickness of 2 mm. When YI is within the above range, the range of use as an optical member is not limited, which is preferable.
(耐湿熱性)
本発明の樹脂組成物は、その2mm厚の成形片の80℃×95%RH条件にて500時間静置処理した湿熱試験前後の色相変化を示すΔYIが10以下であることが好ましく、9以下であるとより好ましく、8以下であると特に好ましい。ΔYIが上記範囲内であると光学部材としての使用範囲が限定されず好ましい。
(Damp heat resistance)
The resin composition of the present invention has a ΔYI of 10 or less, preferably 9 or less, which indicates a hue change before and after a wet heat test in which a 2 mm-thick molded piece is left for 500 hours under conditions of 80 ° C. and 95% RH. is more preferable, and 8 or less is particularly preferable. When ΔYI is within the above range, the range of use as an optical member is not limited, which is preferable.
(衝撃強度)
本発明の樹脂組成物は、ISO179に従って測定されたノッチ付シャルピー衝撃強度が6kJ/m2以上であることが好ましく、7kJ/m2以上であることがより好ましく、8kJ/m2以上であることがさらに好ましい。なお、ノッチ付シャルピー衝撃強度は100kJ/m2以下で十分な機能を有する。
(Impact strength)
The resin composition of the present invention preferably has a notched Charpy impact strength measured in accordance with ISO 179 of 6 kJ/m 2 or more, more preferably 7 kJ/m 2 or more, and 8 kJ/m 2 or more. is more preferred. A notched Charpy impact strength of 100 kJ/m 2 or less provides a sufficient function.
(耐光性)
本発明の樹脂組成物は、その2mm厚の成形片の63℃、150mW/cm2の条件にて200時間静置処理した耐光性試験前後の色相変化を示すΔYIが10以下であること
が好ましく、8以下であるとより好ましく、6以下であると特に好ましい。YIが上記範囲内であると光学部材としての使用範囲が限定されず好ましい。
(light resistance)
The resin composition of the present invention preferably has a ΔYI of 10 or less, which indicates a change in hue before and after a light resistance test in which a molded piece having a thickness of 2 mm is left to stand for 200 hours under the conditions of 63° C. and 150 mW/cm 2 . , is more preferably 8 or less, and particularly preferably 6 or less. When YI is within the above range, the range of use as an optical member is not limited, which is preferable.
(鉛筆硬度)
本発明の樹脂組成物は、鉛筆硬度がF以上であることが好ましく、H以上であることがより好ましい。耐傷性に優れるという点で、2H以上であることがさらに好ましい。なお、鉛筆硬度は4H以下で充分な機能を有する。鉛筆硬度はアクリル系樹脂の重量比率を増加させることで硬くすることができる。本発明において、鉛筆硬度とは、本発明の樹脂を特定の鉛筆硬度を有する鉛筆で樹脂を擦過した場合に擦過しても擦過痕が残らない硬さのことであり、JIS K-5600に従って測定できる塗膜の表面硬度試験に用いる鉛筆硬度を指標とすることが好ましい。鉛筆硬度は、9H、8H、7H、6H、5H、4H、3H、2H、H、F、HB、B、2B、3B、4B、5B、6Bの順で柔らかくなり、最も硬いものが9H、最も軟らかいものが6Bである。
(Pencil hardness)
The resin composition of the present invention preferably has a pencil hardness of F or higher, more preferably H or higher. From the viewpoint of excellent scratch resistance, it is more preferably 2H or more. A pencil hardness of 4H or less has sufficient functions. The pencil hardness can be increased by increasing the weight ratio of the acrylic resin. In the present invention, the pencil hardness is the hardness that does not leave a scratch even when the resin of the present invention is rubbed with a pencil having a specific pencil hardness, and is measured according to JIS K-5600. It is preferable to use the pencil hardness used for the surface hardness test of the coating film which can be formed as an index. Pencil hardness is 9H, 8H, 7H, 6H, 5H, 4H, 3H, 2H, H, F, HB, B, 2B, 3B, 4B, 5B, 6B in order of softness, with 9H being the hardest and 9H being the hardest. A soft one is 6B.
(表面処理)
本発明の樹脂組成物から形成された成形品には、各種の表面処理を行うことが可能である。ここでいう表面処理とは、蒸着(物理蒸着、化学蒸着など)、メッキ(電気メッキ、無電解メッキ、溶融メッキなど)、塗装、コーティング、印刷などの樹脂成形品の表層上に新たな層を形成させるものであり、通常用いられる方法が適用できる。表面処理としては、具体的には、ハードコート、撥水・撥油コート、紫外線吸収コート、赤外線吸収コート、並びにメタライジング(蒸着など)などの各種の表面処理が例示される。ハードコートは特に好ましくかつ必要とされる表面処理である。
(surface treatment)
A molded article formed from the resin composition of the present invention can be subjected to various surface treatments. Surface treatment here refers to deposition (physical vapor deposition, chemical vapor deposition, etc.), plating (electroplating, electroless plating, hot dipping, etc.), painting, coating, printing, etc. It is to be formed, and a commonly used method can be applied. Specific examples of the surface treatment include hard coating, water-repellent/oil-repellent coating, ultraviolet-absorbing coating, infrared-absorbing coating, and various surface treatments such as metallizing (vapor deposition, etc.). A hard coat is a particularly preferred and required surface treatment.
以下、実施例により本発明を詳細に説明するが、本発明はこれに限定されるものではない。なお、実施例中「部」とは「重量部」を意味する。実施例において使用した使用樹脂および評価方法は以下の通りである。 EXAMPLES The present invention will be described in detail below with reference to Examples, but the present invention is not limited thereto. In addition, "parts" in the examples means "parts by weight". The resins used in the examples and the evaluation methods are as follows.
1.ポリマー組成比(NMR)
日本電子製JNM-AL400のプロトンNMRにて各繰り返し単位を測定し、ポリマー組成比(モル比)を算出した。
1. Polymer composition ratio (NMR)
Each repeating unit was measured by proton NMR of JNM-AL400 manufactured by JEOL Ltd., and the polymer composition ratio (molar ratio) was calculated.
2.比粘度
20℃で塩化メチレン100mlにポリカーボネート樹脂0.7gを溶解した溶液からオストワルド粘度計を用いて求めた。
比粘度(ηSP)=(t-t0)/t0
[t0は塩化メチレンの落下秒数、tは試料溶液の落下秒数]
2. Specific Viscosity Determined from a solution of 0.7 g of polycarbonate resin dissolved in 100 ml of methylene chloride at 20° C. using an Ostwald viscometer.
Specific viscosity (η SP ) = (tt 0 )/t 0
[t 0 is the number of seconds the methylene chloride falls, t is the number of seconds the sample solution falls]
3.ヘイズ
下記の方法で得られた3段型プレートの厚み2mm部を日本電色工業(株)製ヘイズメーター300Aを使用して測定した。
3. Haze A 2-mm-thick portion of the three-stage plate obtained by the following method was measured using a haze meter 300A manufactured by Nippon Denshoku Industries Co., Ltd.
4.YI
下記の方法で得られた3段型プレートの2mm部分を縦45mm×横50mm×厚さ2mmtの大きさに切出し、日本電色工業製分光色差計SE-2000を用いてYIを測定した。YIが小さいほど、黄色味が小さいことを示している。
4. YI
A 2 mm portion of the three-stage plate obtained by the following method was cut into a size of 45 mm long×50 mm wide×2 mm thick, and YI was measured using a spectral color difference meter SE-2000 manufactured by Nippon Denshoku Industries. A smaller YI indicates a smaller yellowness.
5.耐湿熱性試験
下記の方法で得られた3段型プレートの2mm部分を縦45mm×横50mm×厚さ2mmtの大きさに切出し、この成形板について、エスペック(株)製 小型環境試験機S
H-241にて、80℃×95%RH条件にて500時間静置処理した。その試験前後の試験片に対して、日本電色工業製分光色差計SE-2000を用いてΔYIを測定した。ΔYIが小さいほど、変色が小さいことを示している。
5. Humidity and heat resistance test A 2 mm portion of the three-stage plate obtained by the following method was cut into a size of 45 mm long × 50 mm wide × 2 mm thick, and this molded plate was measured using a small environmental tester S manufactured by Espec Co., Ltd.
H-241 was left to stand for 500 hours under conditions of 80° C. and 95% RH. ΔYI was measured for the test pieces before and after the test using a spectral color difference meter SE-2000 manufactured by Nippon Denshoku Industries. A smaller ΔYI indicates a smaller discoloration.
6.ノッチ付シャルピー衝撃強度
下記の方法で得られたISO曲げ試験片を、ISO 179に従い、ノッチ付シャルピー衝撃強度を測定した。
6. Notched Charpy Impact Strength An ISO bending test piece obtained by the following method was measured for notched Charpy impact strength according to ISO 179.
7.耐光性試験
下記の方法で得られた3段型プレートの2mm部分を縦45mm×横50mm×厚さ2mmtの大きさに切出し、この成形板について、岩崎電機株式会社製 メタルハライドランプ試験機(アイ スーパーUVテスター SUV-W161)にて、63℃、150mW/cm2の条件にて200時間静置処理した。その試験前後の試験片に対して、日本電色工業製分光色差計SE-2000を用いてΔYIを測定した。ΔYIが小さいほど、変色が小さいことを示している。
7. Light resistance test A 2 mm portion of the three-stage plate obtained by the following method was cut into a size of 45 mm in length × 50 mm in width × 2 mm in thickness, and this molded plate was tested with a metal halide lamp tester (eye super) manufactured by Iwasaki Electric Co., Ltd. It was left to stand for 200 hours under conditions of 63° C. and 150 mW/cm 2 using a UV tester SUV-W161). ΔYI was measured for the test pieces before and after the test using a spectral color difference meter SE-2000 manufactured by Nippon Denshoku Industries. A smaller ΔYI indicates a smaller discoloration.
8.鉛筆硬度
JIS K5400に基づき、雰囲気温度23℃の恒温室内で成形品の表面に対して、鉛筆を45度の角度を保ちつつ750gの荷重をかけた状態で線を引き、表面状態を目視にて評価した。
8. Pencil hardness Based on JIS K5400, a line is drawn on the surface of the molded product in a constant temperature room with an ambient temperature of 23 ° C. while a pencil is kept at an angle of 45 degrees and a load of 750 g is applied, and the surface condition is visually observed. evaluated.
[ポリカーボネート樹脂(A)]
A-1:イソソルビド(以下ISS)に由来する構造単位/3,9-ビス(2-ヒドロキシ-1,1-ジメチルエチル)-2,4,8,10-テトラオキサスピロ(5,5)ウンデカン(以下SPG)に由来する構造単位/1,9-ノナンジオール(以下ND)に由来する構造単位=58/38/4(モル%)、比粘度0.425
A-2:ISSに由来する構造単位/SPGに由来する構造単位/NDに由来する構造単位=72/21/7(モル%)、比粘度0.396
A-3:ISSに由来する構造単位/NDに由来する構造単位=96/4(モル%) デカノール末端変性樹脂、比粘度0.366
A-4:ISSに由来する構造単位/1,4-シクロヘキサンジメタノール(以下CHDM)に由来する構造単位=70/30(モル%)、比粘度0.378
[Polycarbonate resin (A)]
A-1: structural unit derived from isosorbide (hereinafter referred to as ISS)/3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane (hereinafter referred to as SPG) / structural unit derived from 1,9-nonanediol (hereinafter referred to as ND) = 58/38/4 (mol%), specific viscosity 0.425
A-2: structural unit derived from ISS/structural unit derived from SPG/structural unit derived from ND = 72/21/7 (mol%), specific viscosity 0.396
A-3: structural unit derived from ISS/structural unit derived from ND = 96/4 (mol%) decanol terminal modified resin, specific viscosity 0.366
A-4: Structural unit derived from ISS/structural unit derived from 1,4-cyclohexanedimethanol (CHDM) = 70/30 (mol%), specific viscosity 0.378
[メタクリル酸メチル-アクリル酸メチル共重合体(B)]
三菱ケミカル製アクリペットVH001(メタクリル酸メチル95モル%とアクリル酸メチル5モル%を共重合したアクリル樹脂)
[Methyl methacrylate-methyl acrylate copolymer (B)]
Mitsubishi Chemical ACRYPET VH001 (acrylic resin obtained by copolymerizing 95 mol% of methyl methacrylate and 5 mol% of methyl acrylate)
[メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体(C)]
カネカ製カネエースM-230(屈折率:1.492)
[Methyl methacrylate-alkyl acrylate-styrene copolymer (C)]
Kaneka Kaneace M-230 (refractive index: 1.492)
[エポキシ樹脂(D)]
D-1:日油株式会社製エポキシ基含有ポリマー マープルーフ G-0150M(分子量:10000、エポキシ等量:310)
D-2:東亜合成株式会社製エポキシ基含有ポリマー ARUFON UG-4010(分子量:2900、エポキシ等量:710)
D-3:東亜合成株式会社製エポキシ基含有アクリル-スチレンポリマー ARUFON UG-4035(分子量:11000、エポキシ等量:560)
[Epoxy resin (D)]
D-1: NOF Corporation epoxy group-containing polymer Marproof G-0150M (molecular weight: 10000, epoxy equivalent: 310)
D-2: Epoxy group-containing polymer ARUFON UG-4010 manufactured by Toagosei Co., Ltd. (molecular weight: 2900, epoxy equivalent: 710)
D-3: Toagosei Co., Ltd. epoxy group-containing acrylic-styrene polymer ARUFON UG-4035 (molecular weight: 11000, epoxy equivalent weight: 560)
[メタクリル酸メチル-アクリル酸メチル共重合体とブタジエン-アクリル酸アルキル-メタクリル酸アルキル共重合体との混合物(E)]
三菱ケミカル製アクリペットVRL40
[Mixture (E) of methyl methacrylate-methyl acrylate copolymer and butadiene-alkyl acrylate-alkyl methacrylate copolymer]
Mitsubishi Chemical ACRYPET VRL40
[実施例1]
<ポリカーボネート樹脂(A)の製造>
イソソルビド(以下ISSと略す)294部、3,9-ビス(2-ヒドロキシ-1,1-ジメチルエチル)-2,4,8,10-テトラオキサスピロ(5,5)ウンデカン(以下SPGと略す)400部、1,9-ノナンジオール(以下NDと略す)22部、ジフェニルカーボネート(以下DPCと略す)750部、および触媒としてテトラメチルアンモニウムヒドロキシド0.8×10-2部とステアリン酸バリウム0.6×10-4部を窒素雰囲気下200℃に加熱し溶融させた。その後、30分かけて220℃へ昇温および減圧度を20.0kPaに調整した。その後、さらに30分かけて240℃へ昇温および減圧度を10kPaに調整した。10分間その温度で保持した後、1時間かけて減圧度を133Pa以下とした。反応終了後、反応槽の底より窒素加圧下吐出し、水槽で冷却しながら、ペレタイザーでカットしてポリカーボネート樹脂(A-1)ペレットを得た。
[Example 1]
<Production of polycarbonate resin (A)>
294 parts of isosorbide (hereinafter abbreviated as ISS), 3,9-bis(2-hydroxy-1,1-dimethylethyl)-2,4,8,10-tetraoxaspiro(5,5)undecane (hereinafter abbreviated as SPG ) 400 parts, 1,9-nonanediol (hereinafter abbreviated as ND) 22 parts, diphenyl carbonate (hereinafter abbreviated as DPC) 750 parts, and 0.8×10 −2 parts of tetramethylammonium hydroxide and barium stearate as a catalyst A 0.6×10 −4 part was heated to 200° C. in a nitrogen atmosphere and melted. After that, the temperature was raised to 220° C. over 30 minutes and the degree of pressure reduction was adjusted to 20.0 kPa. After that, the temperature was raised to 240° C. over 30 minutes, and the degree of pressure reduction was adjusted to 10 kPa. After holding at that temperature for 10 minutes, the degree of pressure reduction was reduced to 133 Pa or less over 1 hour. After completion of the reaction, the reactor was discharged under pressure from the bottom of the reactor, and cooled in a water bath, cut with a pelletizer to obtain polycarbonate resin (A-1) pellets.
<樹脂組成物の製造>
ポリカーボネート樹脂A-1、メタクリル酸メチル-アクリル酸メチル共重合体B:三菱ケミカル製アクリルペットVH001、メタクリル酸メチル-アクリル酸アルキル-スチレン共重合体C:株式会社製カネカ製カネエースM230、エポキシ樹脂D-1:株式会社製日油製エポキシ末端アクリルG-0150Mを使用し、重量比が66.2:10:20:3.8となるように混合した後、押出機に供給した。押出は径30mmφのベント式二軸押出機[(株)神戸製鋼所KTX-30]を使用し、スクリュー回転数150rpm、吐出量20kg/hr、ベントの真空度3kPaで溶融混錬しペレットを得た。なお、押出温度については、供給口からダイス部分まで250℃で実施した。得られたペレットの一部を、90℃で6時間以上熱風循環式乾燥機にて乾燥した後、射出成形機を用いて、シリンダー温度250℃、金型温度85℃にて評価用の試験片(ISO曲げ試験片(ISO178、ISO179、ISO75-1及びISO75-2準拠)、3段プレート(1mmt、2mmt、3mmt))を成形した。評価結果を表1に示した。
<Production of resin composition>
Polycarbonate resin A-1, methyl methacrylate-methyl acrylate copolymer B: Mitsubishi Chemical Acrylpet VH001, methyl methacrylate-alkyl acrylate-styrene copolymer C: Kaneace M230 manufactured by Kaneka Corporation, epoxy resin D -1: Epoxy-terminated acrylic G-0150M manufactured by NOF CORPORATION was used, mixed in a weight ratio of 66.2:10:20:3.8, and fed to an extruder. Extrusion is carried out using a vented twin-screw extruder [Kobe Steel, Ltd. KTX-30] with a diameter of 30 mmφ, a screw rotation speed of 150 rpm, a discharge rate of 20 kg / hr, and a vent vacuum degree of 3 kPa to obtain pellets by melt kneading. rice field. The extrusion temperature was 250° C. from the supply port to the die. A part of the obtained pellets was dried at 90° C. for 6 hours or more in a hot air circulation dryer, and then using an injection molding machine, a cylinder temperature of 250° C. and a mold temperature of 85° C. Test pieces for evaluation. (ISO bending test piece (ISO178, ISO179, ISO75-1 and ISO75-2 compliant), 3-step plate (1 mmt, 2 mmt, 3 mmt)) was molded. The evaluation results are shown in Table 1.
〔実施例2〕
<樹脂組成物の製造>
ISS364部、SPG221部、ND39部、DPC750部を原料として用いてポリカーボネート樹脂(A-2)ペレットを得、ブレンド重量比A-2:B:C:D-1=66.2:18:12:3.8となるように押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 2]
<Production of resin composition>
Polycarbonate resin (A-2) pellets were obtained using 364 parts of ISS, 221 parts of SPG, 39 parts of ND, and 750 parts of DPC as raw materials, and the blend weight ratio A-2: B: C: D-1 = 66.2: 18: 12: The same operation as in Example 1 was performed except that the extrusion was performed so as to have a value of 3.8, and the same evaluation was performed. The results are shown in Table 1.
〔実施例3〕
<樹脂組成物の製造>
ブレンド重量比A-2:B:C:D-1=66.2:15:15:3.8となるように押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 3]
<Production of resin composition>
Except for extruding so that the blend weight ratio A-2: B: C: D-1 = 66.2: 15: 15: 3.8, the same operation as in Example 1 was performed, and the same evaluation was performed. gone. The results are shown in Table 1.
〔実施例4〕
<樹脂組成物の製造>
ブレンド重量比A-2:B:C:D-1=65.2:15:15:4.8となるように押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 4]
<Production of resin composition>
Except for extruding so that the blend weight ratio A-2: B: C: D-1 = 65.2: 15: 15: 4.8, the same operation as in Example 1 was performed, and the same evaluation was performed. gone. The results are shown in Table 1.
[実施例5]
<樹脂組成物の製造>
ブレンド重量比A-2:B:C:D-2:D-3=66.2:18:12:2.1:1.7として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 5]
<Production of resin composition>
The same operation as in Example 1 was performed except that the blend weight ratio was A-2:B:C:D-2:D-3 = 66.2:18:12:2.1:1.7. , made a similar evaluation. The results are shown in Table 1.
[実施例6]
<樹脂組成物の製造>
ブレンド重量比PC:B:C:D-2:D-3=63.2:18:12:4.5:2.3として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 6]
<Production of resin composition>
The same operation as in Example 1 was performed except that the blend weight ratio PC: B: C: D-2: D-3 = 63.2: 18: 12: 4.5: 2.3 was extruded. was evaluated. The results are shown in Table 1.
[実施例7]
<樹脂組成物の製造>
ブレンド重量比A-2:B:C:D-2:D-3=65.2:15:15:3.2:1.6として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 7]
<Production of resin composition>
The same operation as in Example 1 was performed except that the blend weight ratio was A-2:B:C:D-2:D-3 = 65.2:15:15:3.2:1.6. , made a similar evaluation. The results are shown in Table 1.
[実施例8]
<樹脂組成物の製造>
ブレンド重量比A-2:B:C:D-2:D-3=63.2:15:15:4.5:2.3として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Example 8]
<Production of resin composition>
The same operation as in Example 1 was performed except that the blend weight ratio was A-2:B:C:D-2:D-3 = 63.2:15:15:4.5:2.3. , made a similar evaluation. The results are shown in Table 1.
〔比較例1〕
<ポリカーボネート樹脂の製造>
イソソルビド(以下ISSと略す)478部、1,9-ノナンジオール(以下NDと略す)33.5部、デカノール27.6部、ジフェニルカーボネート(以下DPCと略す)750部、および触媒としてステアリン酸バリウム0.0025部を窒素雰囲気下120℃に加熱し溶融させた。その後、反応槽に送液し、コンデンサーの熱媒温度を40℃、樹脂内温を170℃に調整し、30分かけて減圧度を13.4kPaに調整した。その後、20分かけて減圧度を3.4kPaに調整し、10分間その温度で保持した。さらに30分かけて減圧度を0.9kPaとし、樹脂内温を180℃に調整し、10分間その温度で保持した後、真空度0.2kPaとし、樹脂温度を180℃から225℃へ30分かけて上昇し、規定の粘度に達した後に反応槽の底より窒素加圧下吐出し、水槽で冷却しながら、ペレタイザーでカットしてポリカーボネート樹脂(A-3)ペレットを得た。
[Comparative Example 1]
<Production of polycarbonate resin>
Isosorbide (hereinafter abbreviated as ISS) 478 parts, 1,9-nonanediol (hereinafter abbreviated as ND) 33.5 parts, decanol 27.6 parts, diphenyl carbonate (hereinafter abbreviated as DPC) 750 parts, and barium stearate as a catalyst A 0.0025 part portion was heated to 120° C. under a nitrogen atmosphere to melt. After that, the solution was sent to the reaction tank, the temperature of the heat medium in the condenser was adjusted to 40° C., the internal temperature of the resin was adjusted to 170° C., and the degree of pressure reduction was adjusted to 13.4 kPa over 30 minutes. After that, the degree of pressure reduction was adjusted to 3.4 kPa over 20 minutes, and the temperature was maintained for 10 minutes. Further, the degree of pressure reduction is reduced to 0.9 kPa over 30 minutes, the internal temperature of the resin is adjusted to 180 ° C., and after holding that temperature for 10 minutes, the degree of vacuum is reduced to 0.2 kPa, and the resin temperature is increased from 180 ° C. to 225 ° C. for 30 minutes. After reaching a specified viscosity, the solution was discharged from the bottom of the reaction tank under nitrogen pressure, and cut with a pelletizer while cooling in a water tank to obtain polycarbonate resin (A-3) pellets.
<樹脂組成物の製造>
ブレンド重量比をA-3:B:C:D-1=66.2:18:12:3.8として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
<Production of resin composition>
Except for extruding with a blend weight ratio of A-3:B:C:D-1=66.2:18:12:3.8, the same operation as in Example 1 was performed, and the same evaluation was performed. . The results are shown in Table 1.
〔比較例2〕
<樹脂組成物の製造>
ISS354部、CHDM150部、DPC750部を原料として用いて、ポリカーボネート樹脂(A-4)ペレットを得、ブレント重量比をA-4:B:C:D-1=66.2:18:12:3.8として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 2]
<Production of resin composition>
Using 354 parts of ISS, 150 parts of CHDM, and 750 parts of DPC as raw materials, polycarbonate resin (A-4) pellets were obtained, and the Brent weight ratio was A-4:B:C:D-1 = 66.2:18:12:3. The same operation as in Example 1 was carried out, except for extruding as .8, and the same evaluation was carried out. The results are shown in Table 1.
〔比較例3〕
<樹脂組成物の製造>
ブレント重量比をA-2:B:C=70:18:12として押出した他は、実施例1と
全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 3]
<Production of resin composition>
Except for extruding with a Brent weight ratio of A-2:B:C=70:18:12, the same operation as in Example 1 was performed and the same evaluation was performed. The results are shown in Table 1.
〔比較例4〕
<樹脂組成物の製造>
ブレント重量比をA-2:B:C:D-1=66.2:22:8:3.8として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 4]
<Production of resin composition>
Except for extruding with a Brent weight ratio of A-2:B:C:D-1=66.2:22:8:3.8, the same operation as in Example 1 was performed, and the same evaluation was performed. . The results are shown in Table 1.
〔比較例5〕
<樹脂組成物の製造>
ブレント重量比をA:E=70:30として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 5]
<Production of resin composition>
Except for extruding at a Brent weight ratio of A:E=70:30, the same operation as in Example 1 was performed, and the same evaluation was performed. The results are shown in Table 1.
〔比較例6〕
<樹脂組成物の製造>
ブレント重量比をA:D-1:E=66.2:3.8:30として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 6]
<Production of resin composition>
Except for extruding with a Brent weight ratio of A:D-1:E=66.2:3.8:30, the same operation as in Example 1 was performed and the same evaluation was performed. The results are shown in Table 1.
〔比較例7〕
<樹脂組成物の製造>
ブレント重量比をA:D-2、D-3:E=66.2:2.1:1.7:30として押出した他は、実施例1と全く同様の操作を行い、同様の評価を行った。その結果を表1に記載した。
[Comparative Example 7]
<Production of resin composition>
Except for extruding with a Brent weight ratio of A: D-2, D-3: E = 66.2: 2.1: 1.7: 30, the same operation as in Example 1 was performed, and the same evaluation was performed. gone. The results are shown in Table 1.
本発明の樹脂組成物は、光学レンズ、光ディスク、光学フィルム、プラセル基板、光カ
ード、液晶パネル、ヘッドランプレンズ、導光板、拡散板、保護フィルム、OPCバインダー、前面板、筐体、トレー、水槽、照明カバー、看板、樹脂窓等の部材として有用である。
The resin composition of the present invention can be used for optical lenses, optical discs, optical films, plastic substrates, optical cards, liquid crystal panels, headlamp lenses, light guide plates, diffusion plates, protective films, OPC binders, front plates, housings, trays, and water tanks. , lighting covers, signboards, and resin windows.
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