JP2022136029A5 - - Google Patents

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Publication number
JP2022136029A5
JP2022136029A5 JP2022032627A JP2022032627A JP2022136029A5 JP 2022136029 A5 JP2022136029 A5 JP 2022136029A5 JP 2022032627 A JP2022032627 A JP 2022032627A JP 2022032627 A JP2022032627 A JP 2022032627A JP 2022136029 A5 JP2022136029 A5 JP 2022136029A5
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JP
Japan
Prior art keywords
heat exchanger
mandrel
electroforming
conductive surface
component
Prior art date
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Application number
JP2022032627A
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English (en)
Japanese (ja)
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JP7673005B2 (ja
JP2022136029A (ja
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Priority claimed from US17/192,027 external-priority patent/US20220282391A1/en
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Publication of JP2022136029A publication Critical patent/JP2022136029A/ja
Publication of JP2022136029A5 publication Critical patent/JP2022136029A5/ja
Application granted granted Critical
Publication of JP7673005B2 publication Critical patent/JP7673005B2/ja
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Anticipated expiration legal-status Critical

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JP2022032627A 2021-03-04 2022-03-03 積層型熱交換器および形成方法 Active JP7673005B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17/192,027 US20220282391A1 (en) 2021-03-04 2021-03-04 Additive heat exchanger and method of forming
US17/192,027 2021-03-04

Publications (3)

Publication Number Publication Date
JP2022136029A JP2022136029A (ja) 2022-09-15
JP2022136029A5 true JP2022136029A5 (enExample) 2025-02-07
JP7673005B2 JP7673005B2 (ja) 2025-05-08

Family

ID=81075532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022032627A Active JP7673005B2 (ja) 2021-03-04 2022-03-03 積層型熱交換器および形成方法

Country Status (5)

Country Link
US (1) US20220282391A1 (enExample)
JP (1) JP7673005B2 (enExample)
CN (1) CN115012004A (enExample)
FR (1) FR3120432B1 (enExample)
GB (1) GB2607388A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230341190A1 (en) * 2022-04-21 2023-10-26 Raytheon Company Electroformed heat exchanger with embedded pulsating heat pipe
CN116123905B (zh) * 2023-02-21 2025-12-12 杭州电子科技大学 一种异形截面微通道换热器
EP4571231A1 (en) * 2023-12-13 2025-06-18 Vito NV A tubular heat exchanger, and a method of arranging thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4147597A (en) * 1978-02-21 1979-04-03 The International Nickel Company, Inc. Method for producing electrolytic nickel in particulate forms under condition of high and variable internal stress
US6346030B1 (en) * 2000-05-09 2002-02-12 Sandia Corporation Microdevice having interior cavity with high aspect ratio surface features and associated methods of manufacture and use
EP1692327A2 (en) 2003-11-25 2006-08-23 Media Lario S.r.L. Fabrication of cooling and heat transfer systems by electroforming
CN101230472B (zh) * 2007-01-26 2010-05-26 富准精密工业(深圳)有限公司 气密性腔体结构的制造方法
GB0715979D0 (en) * 2007-08-15 2007-09-26 Rolls Royce Plc Heat exchanger
US10190227B2 (en) * 2013-03-14 2019-01-29 Xtalic Corporation Articles comprising an electrodeposited aluminum alloys
GB201711472D0 (en) * 2017-07-17 2017-08-30 Univ London Queen Mary Electrodeposition from multiple electrolytes
US20190033020A1 (en) * 2017-07-27 2019-01-31 United Technologies Corporation Thin-walled heat exchanger with improved thermal transfer features
US12297553B2 (en) * 2017-10-26 2025-05-13 Unison Industries, Llc Device and method for forming electroformed component
EP3699326A1 (en) * 2019-02-25 2020-08-26 Valenzuela Technologies Srl Method of manufacturing a mirror and mirror comprising a reflecting layer, a bonding layer and a structural layer

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